JP2018095411A - Transport device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transport device capable of efficiently transporting a tray containing a plurality of chips to a next step.SOLUTION: A transport device 200 includes: a tributary belt conveyor 202 for receiving and transporting a tray 146 unloaded from a processing device; and a mainstream belt conveyor 204 which receives the tray 146 from the tributary belt conveyor 202 and transports it to the next step. The tributary belt conveyor 202 and the mainstream belt conveyor 204 form a T-shaped path 206. Guide means 236, in which a curved guide member 238 is positioned across the mainstream belt conveyor 204, is disposed on the T-shaped path 206. The guide means 236 includes a drive section 240 for raising and lowering the guide member 238. When guiding the tray 146 from the tributary belt conveyor 202 to the mainstream belt conveyor 204, the guide member 238 is lowered, and when the tray 146 of the mainstream belt conveyor 204 passes through the T-shaped path 206, the guide member 238 is raised.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a transport device that transports a tray.

  A CSP (chip size package) substrate in which a plurality of devices are arranged in a region partitioned by a dividing line and sealed with resin is divided into individual chips by a dividing device, and each divided chip is carried by a portable device. Used for electrical equipment such as telephones and personal computers.

  A dividing apparatus for dividing a CSP substrate into individual chips generally comprises a cutting means for dividing the CSP substrate into individual chips and an accommodating means for accommodating the divided individual chips in a tray. Can be divided into individual chips with high accuracy and can be accommodated in a predetermined tray (see Patent Document 1).

JP 2001-23936 A

  However, trays containing a plurality of chips are stacked in the apparatus and transported to the next process by an operator, resulting in a problem of poor productivity.

  An object of the present invention made in view of the above-mentioned fact is to provide a transport device capable of efficiently transporting a tray containing a plurality of chips to the next process.

  In order to solve the above-mentioned problems, the present invention provides the following conveying device. That is, a transport device that transports a tray, and includes a tributary belt conveyor that receives and transports the tray carried out from the processing device, and a main belt conveyor that receives the tray from the tributary belt conveyor and transports it to the next process, The start point of the tributary belt conveyor is positioned on the processing apparatus side and the end point is positioned on the side of the mainstream belt conveyor to form a T-shaped path, from the tributary belt conveyor to the mainstream belt conveyor. Guide means is provided in which a curved guide member that guides the tray is positioned across the mainstream belt conveyor. The guide means includes a drive unit that moves the guide member up and down, and the tray is moved from the tributary belt conveyor to the mainstream belt. When guiding to the belt conveyor, the guide member is lowered, and the tray of the mainstream belt conveyor is moved to the belt conveyor. When passing through the shaped intersection is a conveying device for raising the guide member.

  Preferably, the tributary belt conveyor is provided with a tributary stopper for positioning a terminal at a stop position for preventing the tray from entering the T-shaped path and an allowable position for allowing the tray to enter the T-shaped path. The belt conveyor is provided with a mainstream stopper for positioning the terminal at a stop position for preventing the tray from entering the T-junction and an allowable position for allowing the tray to enter the T-junction, and the tray is moved from the tributary belt conveyor. When guiding to the mainstream belt conveyor, the terminal of the mainstream stopper is positioned at the stop position and the terminal of the tributary stopper is positioned at the allowable position, and when the tray of the mainstream belt conveyor passes through the T-junction, The terminal of the main flow stopper is positioned at the allowable position, and the terminal of the tributary stopper is positioned at the stop position. A tributary sensor that detects a tray is disposed at a position adjacent to the T-shaped path of the tributary belt conveyor, and a mainstream sensor that detects a tray is disposed at a position adjacent to the T-shaped path of the mainstream belt conveyor, Preferably, when the tributary sensor does not detect the tray, the terminal of the tributary stopper is positioned at the stop position, and when the mainstream sensor does not detect the tray, the terminal of the mainstream stopper is positioned at the stop position. Conveniently, the tributary belt conveyors are respectively arranged corresponding to two or more processing devices.

  A conveying device provided by the present invention includes a tributary belt conveyor that receives and conveys a tray carried out from a processing apparatus, and a mainstream belt conveyor that receives the tray from the tributary belt conveyor and conveys the tray to the next step, and the tributary belt conveyor. The starting point is positioned on the processing apparatus side and the end point is positioned on the side of the main belt conveyor to form a T-shaped path, and a tray is led from the tributary belt conveyor to the main belt conveyor. Guide means is provided in which a curved guide member is positioned across the mainstream belt conveyor. The guide means includes a drive unit for moving the guide member up and down, and a tray is moved from the tributary belt conveyor to the mainstream belt conveyor. When guiding, the guide member is lowered, and the tray of the mainstream belt conveyor passes through the T-junction. Is configured to raise the guide member, it can efficiently transport a tray containing a plurality of chips to the next process, and it is not necessary for the operator to transport the tray to the next process, improving productivity. To do.

The perspective view of a processing apparatus. The partial perspective view of the processing apparatus shown in FIG. (A) A perspective view showing the temporary placing means and the first moving means in a state where the fork of the temporary placing means shown in FIG. 1 is in the retracted position, and (b) the fork of the temporary placing means shown in FIG. The perspective view which shows the temporary placement means of a state, and a 1st moving means. (A) The perspective view which looked at the suction pad with which the back surface of the temporary placing means shown in FIG. 1 was mounted | worn from the downward direction, (b) The elements on larger scale of a suction pad. FIG. 2 is a perspective view of a workpiece detachment unit shown in FIG. 1. The perspective view of the cutting means shown in FIG. The perspective view which shows the conveying apparatus comprised according to this invention. The perspective view which shows the state in which the to-be-processed object is conveyed by the mainstream conveyor. The perspective view which shows the state in which the to-be-processed object is conveyed from the tributary conveyor to the mainstream conveyor.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an embodiment of a transport apparatus configured according to the present invention will be described with reference to the drawings.

  The processing apparatus 2 shown in FIG. 1 is disposed adjacent to the cassette table 4, the first base 6 disposed adjacent to the cassette table 4, and the first base 6 on the opposite side of the cassette table 4. The second base 7 is provided. On the cassette table 4, a cassette 8 that houses a plurality of plate-like workpieces at predetermined intervals in the vertical direction is placed. FIG. 2 shows a large rectangular substrate 10 (for example, 600 mm × 700 mm) called FOWLP as a workpiece to be accommodated in the cassette 8. The surface 10a of the substrate 10 shown partially enlarged in FIG. 2 is partitioned into a plurality of rectangular areas by grid-like division lines 12, and a device 14 is disposed in each of the plurality of rectangular areas and sealed with resin. It has been stopped.

  This will be described with reference to FIGS. 1, 3 and 4. As shown in FIG. 1, the base 6 has temporary placement means 16 capable of pulling out the workpiece from the cassette 8 placed on the cassette table 4 and temporarily placing the drawn workpiece, and an arrow R1 in FIG. A first moving means 18 for moving the temporary placing means 16 is arranged along the first route R1 shown in FIG. As shown in FIG. 3, the temporary placement means 16 includes a temporary placement table 20 on which a workpiece is temporarily placed, and a pair of forks 22 that are attached to the surface of the temporary placement table 20 so as to be movable forward and backward. A plurality of suction holes 22a are formed on the upper surface of the fork 22, and each suction hole 22a is connected to suction means (not shown) by a flow path. The drive mechanism (not shown) for moving the fork 22 back and forth may be constituted by, for example, a roller built in the temporary placement table 20, an endless belt wound around the roller, and a motor that rotates the roller. By this drive mechanism, the fork 22 is moved forward and backward in the direction of the first path R1 between a retracted position shown in FIG. 3A and an advanced position shown in FIG. In the temporary placement means 16, the fork 22 is positioned in the forward position in the vicinity of the cassette 8, and then a suction force is generated on the upper surface of the fork 22 by the suction means, whereby the lower surface of the workpiece accommodated in the cassette 8 is obtained. Can be adsorbed on the upper surface of the fork 22, and then the fork 22 is positioned in the retracted position, whereby the workpiece can be drawn from the cassette 8 to the first path R1 and temporarily placed on the temporary placement table 20. Further, on the back surface of the temporary placement table 20 of the temporary placement means 16, as shown in FIG. 4, a suction pad 24 for holding a workpiece divided into individual chips is disposed. A plurality of suction holes 24a are formed in the lower surface of the rectangular suction pad 24, and each suction hole 24a is connected to a suction means (not shown) by a flow path. In the illustrated embodiment, the arrangement and quantity of the plurality of suction holes 24 a correspond to the arrangement and quantity of the devices 14 formed on the substrate 10. For this reason, the suction pad 24 generates suction force on the lower surface of the suction pad 24 by suction means, so that the chip 10 is sucked and held while the shape of the substrate 10 before division is maintained after the substrate 10 is divided into chips. can do.

  This will be described with reference to FIGS. As shown in FIG. 1, the first moving means 18 for moving the temporary placing means 16 along the first route R <b> 1 is a gate type arranged across the first base 6 and the second base 7. The support frame 26 is included. Referring to FIG. 3, the support frame 26 has a pair of support pillars extending upward from the upper surface of the first base 6 and the upper surface of the second base 7 with an interval in the direction of the first path R <b> 1. 28 and a beam 30 spanned between the upper ends of the columns 28. A movable piece 32 is attached to the beam 30 so as to be movable back and forth in the direction of the first path R1, and a drive mechanism 34 for moving the movable piece 32 forward and backward in the direction of the first path R1 is attached. The movable piece 32 includes a rectangular supported portion 36 supported on the upper surface of the beam 30 so as to be movable forward and backward in the direction of the first path R1, and a rectangular mounting portion 38 that hangs from one end portion of the supported portion 36. Have The drive mechanism 34 includes a ball screw 40 that extends in the direction of the first path R <b> 1 on the upper surface of the beam 30, and a motor 42 that is coupled to one end of the ball screw 40. The ball screw 40 of the drive mechanism 34 is connected to the supported portion 36 of the movable piece 32. When the motor 42 of the drive mechanism 34 is driven, the movable piece 32 is advanced and retracted in the direction of the first path R1 along the guide rail 30a provided on the upper surface of the beam 30. A pair of guide rails 38a extending in the vertical direction with a predetermined interval are attached to one side surface (the front side surface in FIG. 3) of the mounting portion 38 of the movable piece 32, and the guide rail 38a is provided with the temporary placing means 16. The temporary placement table 20 is mounted so as to be movable up and down. In addition, a lifting mechanism 44 that lifts and lowers the temporary table 20 is mounted on the mounting portion 38 of the movable piece 32. The elevating mechanism 44 has a ball screw 46 extending in the vertical direction between the guide rails 38 a of the mounting portion 38, and a motor 48 connected to the upper end portion of the ball screw 46. The ball screw 46 of the lifting mechanism 44 is connected to the temporary placement table 20. Then, when the motor 48 of the lifting mechanism 44 is driven, the temporary placement table 20 is lifted and lowered along the guide rails 38a of the mounting portion 38. Further, since the temporary placement table 20 of the temporary placement means 16 is mounted on the mounting portion 38 of the movable piece 32, along the first path R1 as the movable piece 32 advances and retreats in the direction of the first path R1. The temporary placement means 16 is advanced and retracted.

  This will be described with reference to FIGS. As shown in FIG. 1, above the first base 6, the work piece pulled out by the fork 22 of the temporary placement means 16 and temporarily placed on the temporary placement table 20 of the temporary placement means 16 is held and raised. A workpiece detachment means 50 for detaching the workpiece from the temporary placement table 20 of the temporary placement means 16 is disposed. As shown in FIG. 5, the workpiece detachment means 50 includes a holding portion 52 that holds the workpiece and an air cylinder 54 that raises and lowers the holding portion 52. The holding part 52 includes a rectangular holding plate 56 connected to the lower end of the air cylinder 54 and a plurality of hollow suction pieces 58 attached to the periphery of the lower surface of the holding plate 56 at intervals. Each suction piece 58 having an opening (not shown) at the lower end is connected to suction means (not shown) by a flow path. In the workpiece detachment means 50, the suction force generated by the suction piece 58 by the suction means is pulled out by the fork 22 of the temporary placement means 16 and temporarily placed on the temporary placement table 20 of the temporary placement means 16. The workpiece can be held by the suction piece 58, and the workpiece 52 held by the suction piece 58 is raised by raising the holding portion 52 by the air cylinder 54, so that the workpiece can be held from the temporary placement table 20 of the temporary placement means 16. Can be withdrawn.

  This will be described with reference to FIG. The upper surface of the first base 6 is rotatable about an axis that is movable along a second path R2 (indicated by an arrow R2 in FIG. 2) orthogonal to the first path R1 and extending in the vertical direction. A rectangular chuck table 60 is arranged freely. On the upper surface of the chuck table 60 that holds the workpiece when the workpiece is subjected to cutting, an escape groove 62 that allows a cutting blade 100 of the cutting means 76 described later to escape is enlarged as shown in FIG. Are formed in a lattice shape, and suction holes 64 are formed in each of a plurality of rectangular regions defined by the escape grooves 62. Each suction hole 64 is connected to suction means (not shown) by a flow path. In the illustrated embodiment, the arrangement and quantity of the escape grooves 62 correspond to the arrangement and quantity of the division lines 12 of the substrate 10, and the arrangement and quantity of the suction holes 64 correspond to the arrangement and quantity of the devices 14 on the substrate 10. It corresponds. For this reason, when the chuck table 60 generates suction force on the upper surface of the chuck table 60 by the suction means and sucks the substrate 10, the chuck table 60 is cut along the scheduled division line 12 and the substrate 10 is divided into chips. In this case, each chip can be sucked and held while maintaining the shape of the substrate 10.

  As shown in FIG. 2, one side and the other side of the chuck table 60 in the second path R <b> 2 are covered with a stretchable bellows-like cover 66. Inside the bellows-like cover 66, a second moving means (not shown) for moving the chuck table 60 along the second path R2 is arranged. The second moving means may be configured to include, for example, a ball screw extending along the second path R2 inside the bellows-shaped cover 66 and a motor connected to one end of the ball screw. The ball screw of the second moving means is connected to the lower part of the chuck table 60, and the motor of the second moving means is driven to drive a guide rail (not shown) attached to the inside of the bellows-like cover 66. )), The chuck table 60 can be configured to advance and retract along the second path R2. The rotating means for rotating the chuck table 60 about the axis extending in the vertical direction can be constituted by a motor (not shown) arranged below the chuck table 60.

  This will be described with reference to FIGS. 1, 2, and 6. As shown in FIG. 1, the first base 6 is separated from the workpiece detachment means 50 in the direction of the second path R <b> 2 and is used for cutting the workpiece held on the chuck table 60. A cutting mechanism 68 is provided. As shown in FIG. 2, the cutting mechanism 68 includes a gate-shaped support frame 70 disposed across the second path R2. The support frame 70 includes a pair of support columns 72 extending upward from the upper surface of the first base 6 with an interval in the direction of the first path R <b> 1, and a beam 74 spanned between the upper ends of the support columns 72. . A pair of cutting means 76 is disposed on one side of the beam 74 (on the back side in FIG. 2). As shown in FIG. 6, the cutting means 76 includes a rectangular index feed piece 78 supported on one side surface of the beam 74 so as to be able to advance and retreat in the direction of the first path R1, and the index feed piece 78 through the first path R1. Index feed mechanism 80 that advances and retreats in the direction of R1, L-shaped cut feed piece 82 supported by index feed piece 78 so as to be raised and lowered, cut feed mechanism 84 that raises and lowers cut feed piece 82, and cut feed piece And a spindle unit 86 fixed to the lower end of 82.

  Continuing the description with reference to FIG. 6, on one side surface (front side surface in FIG. 6) of the index feed piece 78, a pair of objects extending in the direction of the first path R1 with a space in the vertical direction. A guide groove 78a is formed, and the guided groove 78a is slid onto a pair of guide rails (not shown) extending in the direction of the first path R1 with a space in the vertical direction on one side surface of the beam 74. It is connected freely. The index feeding mechanism 80 includes a ball screw 88 extending in the direction of the first path R <b> 1 on one side surface of the beam 74, and a motor 90 connected to one end of the ball screw 88. The ball screw 88 of the index feed mechanism 80 is connected to the index feed piece 78. Then, when the motor 90 of the index feed mechanism 80 is driven, the index feed piece 78 is advanced and retracted in the direction of the first path R1 along the guide rail attached to one side surface of the beam 74.

  The cutting feed piece 82 of the cutting means 76 includes a rectangular supported portion 92 that is supported by the other side surface (the side surface on the back side in FIG. 6) of the indexing feed piece 78 so as to be movable up and down, and a lower end of the supported portion 92. And a rectangular mounting portion 94 protruding in the direction of the second path R2. The cut feed mechanism 84 has a ball screw (not shown) extending in the vertical direction on the other side surface of the index feed piece 78 and a motor 96 connected to one end of the ball screw. The ball screw of the cutting feed mechanism 84 is connected to the supported portion 92 of the cutting feed piece 82. When the motor 96 of the cutting feed mechanism 84 is driven, the cutting feed piece 82 is moved up and down along a guide rail (not shown) attached to the other side surface of the index feed piece 78.

  The spindle unit 86 of the cutting means 76 is mounted on the spindle housing 98 so as to be rotatable about a spindle housing 98 mounted on the lower surface of the mounting portion 94 of the cutting feed piece 82 and an axis extending in the direction of the first path R1. A spindle (not shown), a motor (not shown) for rotating the spindle about an axis extending in the direction of the first path R1, and a cutting blade 100 fixed to one end of the spindle, And a cutting water supply nozzle 101 disposed on both sides of the cutting blade 100. A cutting blade 100 for dividing a workpiece is mounted on a spindle unit 86 so as to be rotatable together with the spindle. A supply nozzle 101 for supplying cutting water when the workpiece is divided (cut) by the cutting blade 100 is connected to a cutting water supply means (not shown) by a flow path. In the illustrated embodiment, as shown in FIG. 6, the pair of cutting means 76 is arranged such that the cutting blades 100 face each other.

  This will be described with reference to FIG. On the other side surface (front side in FIG. 2) of the beam 74 of the support frame 70 of the cutting mechanism 68, an imaging means 102 for imaging the workpiece held on the chuck table 60 is provided in the direction of the first path R1. A drive mechanism 104 is mounted that can be moved forward and backward, and that moves the imaging means 102 forward and backward in the direction of the first path R1. The drive mechanism 104 includes a ball screw 106 extending in the direction of the first path R <b> 1 on the other side surface of the beam 74, and a motor 108 connected to one end of the ball screw 106. The ball screw 106 of the driving mechanism 104 is connected to the imaging unit 102. When the motor 108 of the drive mechanism 104 is driven, the imaging unit 102 is advanced and retracted in the direction of the first path R1 along the guide rail 74a attached to the other side surface of the beam 74.

  As shown in FIG. 2, the support frame 70 of the cutting mechanism 68 has an upper surface cleaning unit 110 that removes and cleans cutting waste generated by cutting the workpiece held on the chuck table 60 from the upper surface of the workpiece. Is arranged. The upper surface cleaning means 110 extends from the up-down direction intermediate portion of the one support column 72 to the up-down direction intermediate portion of the other support column 72, and is disposed across the second path R2. The upper surface cleaning means 110 that can be formed from a hollow member has a plurality of injection holes (not shown) formed in the lower surface at intervals in the direction of the first path R1, and each injection hole is supplied with a cleaning liquid by a flow path. Connected to means (not shown). In the upper surface cleaning means 110, since the cleaning liquid supplied from the cleaning liquid supply means is sprayed from each injection hole, the cutting waste generated by cutting the workpiece held on the chuck table 60 is removed from the workpiece. It can be removed from the top surface and cleaned.

  As shown in FIGS. 1 and 2, the suction path 24 of the temporary placement means 16 holds the upper surface of the workpiece divided into individual chips in the first path R <b> 1 on the upper surface of the first base 6. On the other hand, when moving along the first path R1, a lower surface cleaning means 112 is disposed to remove and clean the cutting waste adhering to the lower surface of the workpiece. As shown in FIG. 2, the lower surface cleaning unit 112 includes a brush 114, an ejection unit 116, and a roller 118 that are sequentially arranged along the first path R1. The brush 114 is aligned along the direction of the second path R2. The injection means 116, which can be formed from a hollow member extending in the direction of the second path R2, has a plurality of injection holes 116a formed on the upper surface at intervals in the direction of the second path R2, and each of the injection holes 116a has a flow path. To the cleaning liquid supply means (not shown). In addition, the roller 118 configured to be rotatable about an axis extending in the direction of the second path R2 has at least an outer peripheral surface formed of a suitable synthetic resin material such as urethane. In the lower surface cleaning unit 112, the brush 114 is moved while moving on the first path R1 while the suction pad 24 of the temporary placement unit 16 holds the upper surface of the workpiece divided into individual chips. Since the cleaning liquid that is in contact with the lower surface of the workpiece and is supplied from the cleaning liquid supply means is sprayed from the respective injection holes 116a of the injection means 116 toward the lower surface of the workpiece, the cutting waste adhering to the lower surface of the workpiece And the roller 118 can contact the lower surface of the workpiece and remove the cleaning liquid from the lower surface of the workpiece. In the processing apparatus 2, as described above, the cutting waste generated by cutting the workpiece can be removed from the upper surface of the workpiece by the upper surface cleaning means 110 and cleaned. Since the workpiece is held by generating a suction force on the upper surface of the chuck table 60, the cutting waste generated during the cutting process is applied to the lower surface side of the workpiece by the suction force generated on the upper surface of the chuck table 60. In some cases, cutting scraps may adhere to the lower surface of the workpiece. However, in the processing apparatus 2, even when cutting waste remains on the lower surface of the workpiece whose upper surface has been cleaned by the upper surface cleaning means 110, the lower surface cleaning means 112 can remove the cutting waste remaining on the lower surface of the workpiece. .

  The processing apparatus 2 includes an unloading mechanism 120 that unloads a workpiece divided into individual chips to the outside. As shown in FIG. 1, the carry-out mechanism 120 disposed away from the workpiece detachment means 50 in the direction of the first path R1 receives the workpiece divided into individual chips from the suction pad 24. A table 122, a third moving means 124 for moving the receiving table 122 along a third path R3 (indicated by an arrow R3 in FIG. 1) parallel to the second path R2, and a divided workpiece. Tray transfer means 126 for transferring the chips sorted from the receiving table 122 to the tray 146, tray unloading means 128 for unloading the tray 146 loaded with chips, and tray supply means for supplying an empty tray 146 130.

  The receiving table 122 is disposed on the upper surface of the second base 7 and is configured to be movable along the third route R3. 2, a plurality of suction holes 122a are formed on the top surface of the rectangular receiving table 122, and each suction hole 122a is connected to suction means (not shown) by a flow path. Has been. In the illustrated embodiment, the arrangement and quantity of the plurality of suction holes 122a correspond to the arrangement and quantity of the devices 14 formed in the substrate 10. For this reason, the receiving table 122 generates a suction force on the upper surface of the receiving table 122 by suction means, and sucks and holds each chip while maintaining the shape of the substrate 10 before the division after the substrate 10 is divided into chips. can do. Moreover, the 3rd moving means 124 which moves the receiving table 122 along 3rd path | route R3 was formed along 3rd path | route R3 in the upper surface of the 2nd base 7, as shown in FIG. It is accommodated in the accommodation groove 7a. The third moving means 124 includes a ball screw 132 extending along the accommodation groove 7 a and a motor (not shown) connected to one end of the ball screw 132. The ball screw 132 of the third moving means 124 is connected to the lower part of the receiving table 122. When the motor of the third moving means 124 is driven, the receiving table 122 is advanced and retracted along the third path R3 along a guide rail (not shown) attached to the receiving groove 7a. .

  As shown in FIG. 2, the tray transfer means 126 includes an L-shaped support frame 134 disposed across the second base 7. The support frame 134 is separated from the first base 6 from the upper end of the support 136 and the support 136 extending upward from one end of the upper surface of the second base 7 (the end on the first base 6 side). A beam 138 extending in the direction, a suction member 140 mounted on the lower surface of the beam 138 movably along the beam 138, and a moving mechanism (not shown) for moving the suction member 140 along the beam 138. Have. The moving mechanism that moves the adsorption member 140 along the beam 138 includes, for example, a ball screw that extends in the direction of the first path R1 on the lower surface of the beam 138, and a motor that is connected to one end of the ball screw. It's okay. Then, the ball screw of the moving mechanism is connected to the upper portion of the adsorption member 140, and the motor of the movement mechanism is driven, so that the adsorption member 140 is along a guide rail (not shown) attached to the lower surface of the beam 138. Can be configured to move forward and backward. The suction member 140 includes an air cylinder 142 mounted on the lower surface of the beam 138 so as to be movable along the beam 138, and a rectangular suction plate 144 fixed to the lower end of the air cylinder 142. In the illustrated embodiment, the suction plate 144 is smaller than the size of the substrate 10 and has a size corresponding to the width of the transport tray 146 shown in FIGS. 1 and 2. A plurality of suction holes (not shown) are formed on the lower surface of the suction plate 144, and each suction hole of the suction plate 144 is connected to suction means (not shown) by a flow path. In the illustrated embodiment, the arrangement of the plurality of suction holes of the suction plate 144 corresponds to the arrangement of the devices 14 formed on the substrate 10. For this reason, the suction plate 144 generates a suction force on the lower surface of the suction plate 144 by suction means, so that the quantity corresponding to the width of the tray 146 among the divided workpieces held on the receiving table 122 is obtained. Can be adsorbed and held while being separated. Further, the tray transfer means 126 moves up the suction plate 144 that has sucked the workpiece by the air cylinder 142, then moves the suction member 140 by the moving mechanism, and then releases the suction force above the tray 146. Workpieces can be transferred to the tray 146. Note that a sheet having tack force (weak adhesive force) is attached to the storage portion into which the tray 146 is immersed. As the sheet having tack force, the product name “Separless” or “Hand Deco Tack” manufactured and sold by New Tack Kasei Co., Ltd. can be used. Since the sheet having the tack force is attached to the accommodating portion of the tray 146, the workpiece transferred to the accommodating portion of the tray 146 is prevented from being displaced in the tray 146 by the tack force.

  As shown in FIG. 2, the tray supply means 130 includes at least a pair of rectangular parallelepiped frames 148 disposed close to the second base 7 and having an open upper surface, and rotatably supported on the upper portions of the frames 148. , A pair of endless belts 152 wound around the pair of rollers 150, and a belt conveyor having a rotating mechanism (not shown) for rotating the rollers 150. A stopper 154 for stopping the tray 146 mounted on the endless belt 152 at a supply position for supplying the tray 146 to the tray carry-out means 128 is attached to one end in the longitudinal direction of the frame 148. In the tray supply unit 130, the endless belt 152 is rotated together with the roller 150 by the rotation mechanism, so that the empty tray 146 mounted on the endless belt 152 is moved toward the supply position by the operator and supplied by the stopper 154. Can be stopped in position.

  As shown in FIG. 1, the tray carry-out means 128 receives the first carry-out means 156 carrying out the empty tray 146 from the tray supply means 130 and the empty tray 146 carried out from the first carry-out means 156 and is empty. The second unloading means 158 for unloading the tray 146 and the empty tray 146 unloaded from the second unloading means 158 are stopped at the workpiece receiving position for receiving the workpiece, and the workpiece is accommodated. And a third unloading means 160 for unloading the tray 146.

  As shown in FIG. 2, the first carry-out means 156 includes a frame body 162 that is disposed near the supply position of the tray supply means 130 and extends upward, an arm 164 that is supported by the frame body 162 so as to be movable up and down, An elevating mechanism (not shown) that elevates and lowers 164 and a plurality of hollow suction pieces 166 attached to the lower surface of the distal end of the arm 164 at intervals. Each suction piece 166 having an opening (not shown) at the lower end is connected to suction means (not shown) by a flow path. Then, in the first carry-out means 156, the arm 164 is lowered, the suction piece 166 is brought into close contact with the upper surface of the tray 146 positioned at the supply position of the tray supply means 130, and then the suction force is applied to the suction piece 166 by the suction means. The tray 146 is adsorbed by the adsorbing piece 166 and then the arm 164 adsorbing the tray 146 by the adsorbing piece 166 is lifted by the lifting mechanism, so that the empty tray 146 can be carried out from the tray supply means 130. it can.

  The second carry-out means 158 is arranged at an interval in the vertical intermediate portion of the frame body 162 of the first carry-out means 156 and can be opened and closed between a close position close to each other and an open position spaced apart from each other. And the air cylinder 172 that opens and closes the one-side receiving member 168 and the other-side receiving member 170 between the closed position and the open position. The one-side receiving member 168 has an upstream portion 168a and a downstream portion 168b that are arranged at intervals that can be passed when the arm 164 of the first carry-out means 156 is raised. The lower end of the upstream portion 168a and the lower end of the downstream portion 168b of the one-side receiving member 168 protrude toward the other-side receiving member 170, and the lower end of the other-side receiving member 170 protrudes toward the one-side receiving member 168. When the member 168 and the other side receiving member 170 are positioned at the closed position, the tray 146 is received from the arm 164 of the first unloading means 156 by the protruding portion of the one side receiving member 168 and the protruding portion of the other side receiving member 170. Be able to. Each of the one-side receiving member 168 and the other-side receiving member 170 is equipped with a plurality of carry-out rollers 174 that are rotatably arranged on the inner surface side, and a rotation mechanism (not shown) that rotates the carry-out rollers 174. Has been. At least the outer peripheral surface of the carry-out roller 174 is formed of a material (for example, synthetic rubber) that generates a predetermined or higher frictional force with the outer surface of the tray 146. In the second unloading means 158, the tray 146 mounted on the one-side receiving member 168 and the other-side receiving member 170 can be unloaded by rotating the unloading roller 174 by the rotation mechanism. Further, the air cylinder 172 mounted on both the one-side receiving member 168 and the other-side receiving member 170 brings the one-side receiving member 168 and the other-side receiving member 170 closer to each other and moves the tray 146 from the arm 164 of the first carry-out means 156. , The one-side receiving member 168 and the other-side receiving member 170 are separated from each other, and the tray 146 can pass when the arm 164 of the first unloading means 156 adsorbing the tray 146 is raised. The one-side receiving member 168 and the other-side receiving member 170 are opened and closed between the open position.

  The third unloading means 160 connected to the one-side receiving member 168 and the other-side receiving member 170 of the second unloading means 158 includes a bottom wall 176 and a pair of side walls 178 protruding upward from both ends of the bottom wall 176. A plurality of carry-out rollers 180 rotatably arranged on the inner surface side of the side wall 178, a rotation mechanism (not shown) for rotating the carry-out roller 180, and a bottom wall 176 spaced in the longitudinal direction. And a plurality of tray sensors 182 that detect the tray 146. At least the outer peripheral surface of the carry-out roller 180 is formed of a material (for example, synthetic rubber) that generates a predetermined or higher frictional force with the outer surface of the tray 146. In the third unloading means 160, when the empty tray 146 is unloaded from the second unloading means 158, the tray sensor 182 detects the empty tray 146, thereby stopping the rotation of the unloading roller 180, The empty tray 146 unloaded from the second unloading means 158 can be stopped at a plurality of workpiece receiving positions along the conveying direction. Further, in the third unloading means 160, the rotation mechanism rotates the unloading roller 180, so that the tray 146 containing the workpiece can be unloaded.

  In the illustrated embodiment, as shown in FIG. 1, a transport device 200 for transporting the tray 146 containing workpieces to the next process is connected to the downstream side of the third transport means 160 of the tray transport means 128. Yes. Referring to FIG. 7 together with FIG. 1, the conveying device 200 receives and conveys the tray 146 unloaded from the processing device 2, and receives the tray 146 from the tributary belt conveyor 202 and conveys it to the next step. Mainstream belt conveyor 204. The starting point of the tributary belt conveyor 202 is positioned downstream of the third carry-out means 160 of the tray carry-out means 128. The end point of the tributary belt conveyor 202 is positioned on the side of the mainstream belt conveyor 204, and the tributary belt conveyor 202 and the mainstream belt conveyor 204 form a T-shaped path 206.

  The tributary belt conveyor 202 is wound around a pair of side walls 208 arranged at intervals corresponding to the width of the tray 146, at least a pair of rollers 210 rotatably supported on the side walls 208, and the pair of rollers 210. A pair of endless belts 212 and a rotation mechanism (not shown) for rotating the rollers 210. The pair of rollers 210, the pair of endless belts 212, and the rotation mechanism are used as a set of conveyor units, and by using a plurality of sets of conveyor units and sidewalls 208 having an appropriate length, the tributary belt conveyor 202 having an appropriate length is used. It can be. 7, the upper surface of the side wall 208 is positioned above the upper surface of the endless belt 212, and the side wall 208 prevents the tray 146 being conveyed from falling off from the tributary belt conveyor 202. Yes. However, as shown in the B-B cross section of FIG. 7, in the vicinity of the T-shaped path 206 (a portion where an inner guide member 242 described later is provided), the upper surface of the side wall 208 located on the downstream side of the mainstream belt conveyor 204. Is located flush with the upper surface of the endless belt 212 or below the upper surface of the endless belt 212, so that when the tray 146 is conveyed from the tributary belt conveyor 202 to the mainstream belt conveyor 204, The side wall 208 located on the downstream side does not prevent the tray 146 from being conveyed.

  As shown in FIGS. 1 and 7, a tributary stopper 214 and a tributary sensor 216 for detecting the tray 146 are disposed at a position adjacent to the T-shaped path 206 of the tributary belt conveyor 202. The tributary stopper 214 has a stop position (a position shown in FIG. 7) for preventing the tray 146 being conveyed by the tributary belt conveyor 202 from entering the T-shaped path 206 and a T-shaped path of the tray 146 being conveyed by the tributary belt conveyor 202. The terminal 218 is configured to be movable between a permissible position allowing entry into the 206 and an air cylinder 220 that moves the terminal 218 between the stop position and the permissible position. When the tributary sensor 216 does not detect the tray 146, the air cylinder 220 of the tributary stopper 214 positions the terminal 218 at the stop position. In addition, when the tributary sensor 216 detects the tray 146 and when the tray 146 is guided from the tributary belt conveyor 202 to the main belt conveyor 204, the air cylinder 220 of the tributary stopper 214 positions the terminal 218 at an allowable position.

  The main belt conveyor 204 is wound around a pair of side walls 222 arranged at an interval corresponding to the width of the tray 146, at least a pair of rollers 224 rotatably supported by the side walls 222, and the pair of rollers 224. A pair of endless belts 226 and a rotation mechanism (not shown) for rotating the rollers 224. The pair of rollers 224, the pair of endless belts 226, and the rotation mechanism constitute a set of conveyor units, and a plurality of sets of conveyor units and an appropriate length of the side wall 222 are used, whereby an appropriate length of the mainstream belt conveyor 204 is obtained. It can be. Similar to the side wall 208 of the tributary belt conveyor 202, the upper surface of the side wall 222 of the mainstream conveyor 204 is also located above the upper surface of the endless belt 226, and the dropout of the tray 146 being conveyed from the mainstream belt conveyor 204 is the side wall 222. Is prevented by. However, in the vicinity of the T-junction 206 (the portion where an inner guide member 242 described later is disposed), the upper surface of the side wall 222 of the mainstream belt conveyor 204 is also the endless belt 226, as is the side wall 208 of the tributary belt conveyor 202. When the tray 146 is transported from the tributary belt conveyor 202 to the mainstream belt conveyor 204 by being flush with the upper surface or below the upper surface of the endless belt 226, the side wall 222 of the mainstream belt conveyor 204 is placed on the tray 146. It is designed so as not to interfere with the transport.

  As shown in FIG. 1 and FIG. 7, a main stream stopper 228 and a main stream sensor 230 that detects the tray 146 are positioned adjacent to the T-shaped path 206 of the main-stream belt conveyor 204 and upstream of the T-shaped path 206. Are arranged. The mainstream stopper 228 includes a stop position (a position shown in FIG. 7) that prevents the tray 146 being conveyed by the mainstream belt conveyor 204 from entering the T-shaped path 206, and a T-shaped path of the tray 146 that is being conveyed by the mainstream belt conveyor 204. The terminal 232 is configured to be movable between a permissible position that allows entry to 206 and an air cylinder 234 that moves the terminal 232 between the stop position and the permissible position. When the main flow sensor 230 does not detect the tray 146, the air cylinder 234 of the main flow stopper 228 positions the terminal 232 at the stop position. When the main flow sensor 230 detects the tray 146 and the tray 146 being conveyed by the main flow belt conveyor 204 passes the T-shaped path 206, the air cylinder 234 of the main flow stopper 228 moves the terminal 232 to the allowable position. Position it.

  Guide means 236 is disposed on the T-junction 206, and the guide means 236 includes a curved outer guide member 238 that guides the tray 146 from the tributary belt conveyor 202 to the mainstream belt conveyor 204. The outer guide member 238 positioned across the main belt conveyor 204 is configured to be movable up and down, and the guide means 236 further includes a drive unit 240 that moves the outer guide member 238 up and down. When the tray 146 being conveyed by the tributary belt conveyor 202 is guided to the main belt conveyor 204, the driving unit 240, which can be configured by an appropriate actuator such as an air cylinder, lowers the outer guide member 238 to be positioned at the guide position. The outer guide member 238 is preferably formed of an appropriate low friction material such as PTFE, so that the tray 146 being conveyed by the tributary belt conveyor 202 can be smoothly transferred to the main belt conveyor 204 without being caught by the outer guide member 238. Guided. Further, when the tray 146 being conveyed by the main belt conveyor 204 passes through the T-shaped path 206, the driving unit 240 raises the outer guide member 238, and the T-shaped path 206 of the tray 146 being conveyed by the main-stream belt conveyor 204. It is positioned at an allowable position that allows entry into In the illustrated embodiment, the guide means 236 includes a curved inner guide member 242 that is fixed at a position facing the lowered position of the outer guide member 238. When the tray 146 moves from the tributary belt conveyor 202 to the mainstream belt conveyor 204, the inner guide member 242 prevents the tray 146 from falling.

  When processing the substrate 10 as a workpiece by the processing apparatus 2, first, the cassette 8 in which the plurality of substrates 10 are accommodated is placed on the cassette table 4. Next, the temporary placing means 16 is moved along the first path R <b> 1 by the drive mechanism 34 of the first moving means 18 together with the movable piece 32 until the temporary placing means 16 is adjacent to the cassette 8. Next, the temporary placement means 16 is moved up and down by the lifting mechanism 44 of the first moving means 18, and the temporary placement means 16 is positioned in the vicinity of the substrate 10 to be unloaded from the cassette 8. Next, the fork 22 is advanced to the advance position by the drive mechanism of the temporary placement means 16, and the upper surface of the fork 22 is positioned on the back surface of the substrate 10 to be unloaded from the cassette 8. Next, the suction means connected to the suction hole 22 a of the fork 22 is operated to generate a suction force on the upper surface of the fork 22, and the back surface of the substrate 10 to be unloaded from the cassette 8 is attracted to the upper surface of the fork 22. Next, the fork 22 that has attracted the substrate 10 is retracted to the retracted position by the drive mechanism of the temporary placement means 16, and the substrate 10 is pulled out to the first path R <b> 1 and the substrate 10 is temporarily placed on the temporary placement table 20 of the temporary placement means 16. To do.

  After the substrate 10 is temporarily placed on the temporary placement table 20, the holding portion 52 of the workpiece removal means 50 is lowered by the air cylinder 54 of the workpiece removal means 50, and the suction piece 58 of the holding portion 52 is placed on the temporary placement table 20. The substrate 10 is temporarily placed on the surface 10a. Next, the suction means connected to the suction piece 58 of the holding unit 52 is operated to generate suction force on the suction piece 58, and the surface 10 a of the substrate 10 is sucked to the suction piece 58. Next, the holding part 52 is lifted by the air cylinder 54 of the workpiece detaching means 50, whereby the substrate 10 held by the suction piece 58 of the holding part 52 is lifted and detached from the temporary placing table 20 of the temporary placing means 16. . Next, the temporary placing means 16 is moved along the first path R <b> 1 by the drive mechanism 34 of the first moving means 18, thereby separating the temporary placing means 16 from directly below the workpiece detaching means 50. The chuck table 60 is exposed below. Next, the chuck table 60 is moved along the second path R <b> 2 by the second moving means (not shown), and the chuck table is directly below the substrate 10 held by the suction piece 58 of the workpiece detaching means 50. Position 60. Next, the holding portion 52 is lowered by the air cylinder 54 of the workpiece detaching means 50, and the substrate 10 held by the suction piece 58 is placed on the upper surface of the chuck table 60. When the substrate 10 is placed on the upper surface of the chuck table 60, the suction force of the suction piece 58 of the workpiece removal means 50 is released and the suction means connected to the suction hole 64 of the chuck table 60 is operated. A suction force is generated on the upper surface of the chuck table 60, and the substrate 10 is attracted to the upper surface of the chuck table 60.

  After the substrate 10 is attracted to the upper surface of the chuck table 60, the chuck table 60 is moved along the second path R2 by the second moving means, and the chuck table 60 is positioned below the imaging means 102. Next, the image pickup means 102 is moved along the direction of the first path R1 by the drive mechanism 104, and the image pickup means 102 moves the chuck table 60 along the second path R2 by the second movement means. The substrate 10 is imaged. Next, based on the image picked up by the image pickup means 102, the division line 12 that is the region of the substrate 10 to be cut is detected. Next, the chuck table 60 is moved along the second path R <b> 2 by the second moving means, and the tip of the division line 12 in the direction of the second path R <b> 2 is positioned below the cutting blade 100 of the cutting means 76. .

  When the planned division line 12 of the substrate 10 is detected and the division planned line 12 and the escape groove 62 of the chuck table 60 do not coincide with each other, the division planned line 12 and the escape groove 62 are matched. Correct the misalignment. In the positional deviation correction, first, before the chuck table 60 is positioned below the cutting means 76, the chuck table 60 is moved below the workpiece detaching means 50 by the second moving means. If the planned dividing line 12 and the escape groove 62 do not coincide with each other in the direction of the second path R2, or if the relative angle between the planned split line 12 and the escape groove 62 is greater than the allowable angle when viewed from above, the angle shift Is generated, the substrate 10 is held and lifted by the suction piece 58 of the workpiece detaching means 50. Next, the chuck table 60 is moved and rotated by second moving means and rotating means (not shown) to adjust the position of the escape groove 62. As a result, the escape groove 62 can be aligned with the planned division line 12, and the positional deviation and the angular deviation in the direction of the second path R2 can be corrected. On the other hand, when the planned dividing line 12 and the escape groove 62 do not coincide with each other in the direction of R1 of the first path, the chuck table 60 is moved below the workpiece detaching means 50 by the second moving means. Thereafter, the temporary placement means 16 is moved along the first path R <b> 1 by the drive mechanism 34 of the first movement means 18, and the temporary placement means 16 is positioned above the chuck table 60. Next, the temporary placing means 16 is lowered by the lifting mechanism 44 of the first moving means 18, and the lower surface of the suction pad 24 of the temporary placing means 16 is brought into close contact with the surface 10 a of the substrate 10. Next, the suction force on the upper surface of the chuck table 60 is released, and the suction means connected to the suction hole 24 a of the suction pad 24 is operated to generate the suction force on the lower surface of the suction pad 24. The surface 10a of the substrate 10 is adsorbed. Next, the temporary placement means 16 is raised by the lifting mechanism 44 of the first moving means 18 to raise the substrate 10 held by the suction pad 24. Next, the temporary placement unit 16 is moved along the first path R1 by the drive mechanism 34 of the first moving unit 18 to adjust the position of the division line 12 on the substrate 10. As a result, it is possible to make the division planned line 12 coincide with the escape groove 62 and to correct the positional deviation in the direction of the first route R1. After correcting the positional deviation, the substrate 10 is attracted to the upper surface of the chuck table 60 again.

  After the leading end of the division line 12 in the direction of the second path R2 is positioned below the cutting blade 100 of the cutting means 76, a cutting process for dividing the substrate 10 into individual chips is performed. In the cutting process, first, each indexing feed mechanism 80 of the pair of cutting means 76 is operated, and one cutting blade 100 is placed above the planned division line 12 located at one end of the substrate 10 in the direction of the first path R1. At the same time, the other cutting blade 100 is positioned above the planned dividing line 12 located in the middle portion of the substrate 10 in the direction of the first path R1. Next, each cutting blade 100 is rotated by the motor of each spindle unit 86. Next, each spindle housing 98 is lowered by each cutting feed mechanism 84 until the outer peripheral edge of each cutting blade 100 reaches the escape groove 62 of the chuck table 60, and the cutting edge of each cutting blade 100 is placed on the division line 12 of the substrate 10. At the same time, the chuck table 60 is moved along the second path R2 by the second moving means at a predetermined processing feed rate, and a cutting blade is provided at the end of the division line 12 in the direction of the second path R2. When 100 is reached, cutting is performed to raise each spindle housing 98 by each cutting feed mechanism 84. In this cutting process, in addition to operating the cutting water supply means connected to the cutting water supply nozzle 101 and supplying the cutting water supplied from the cutting water supply means from the cutting water supply nozzle 101, the upper surface cleaning is performed. Cutting waste generated by operating the cleaning liquid supply means connected to each injection hole of the means 110 and spraying the cleaning liquid supplied from the cleaning liquid supply means from each injection hole of the upper surface cleaning means 110 to cut the substrate 10. Is removed from the surface 10a (upper surface) of the substrate 10 and cleaned. In the cutting process, the above-described cutting process and the indexing feed in which the cutting blade 100 is indexed and fed by the index feed mechanism 80 corresponding to the interval between the adjacent division lines 12 are alternately performed. As described above, one cutting blade 100 is positioned above the planned dividing line 12 positioned at one end of the substrate 10 in the direction of the first path R1, and at the intermediate portion of the substrate 10 in the direction of the first path R1. When the other cutting blade 100 is positioned above the planned division line 12, each cutting blade 100 is moved toward the other end portion of the substrate 10 in the direction of the first path R1 in the index feed. When starting the cutting process, one cutting blade 100 is positioned above the planned division line 12 located at one end of the substrate 10 in the direction of the first path R1, and in the direction of the first path R1. The other cutting blade 100 is positioned above the division line 12 positioned at the other end portion of the substrate 10, and each cutting blade 100 is moved toward the intermediate portion of the substrate 10 in the direction of the first path R1 in the index feed. It may be moved. Then, by alternately repeating the cutting process and the indexing feed, after cutting all the scheduled division lines 12 positioned along the second path R2, the chuck table 60 is rotated 90 degrees by the rotating means. After the rotation, all of the planned dividing lines 12 orthogonal to the planned dividing line 12 subjected to the cutting are also subjected to the cutting process by alternately repeating the cutting process and the index feed. Thereby, the substrate 10 can be divided into individual chips. As described above, the arrangement and quantity of the suction holes 64 of the chuck table 60 correspond to the arrangement and quantity of the devices 14 of the substrate 10, so that the chuck table 60 can be obtained even after the substrate 10 is divided into chips. Each chip can be adsorbed and held while maintaining the shape of the substrate 10. Further, the chuck table 60 can be appropriately replaced according to the size of the plate-like workpiece and the size of the device.

  After performing the cutting process of dividing the substrate 10 into individual chips, the chuck table 60 is moved along the second path R2 by the second moving means, and the chuck table 60 is placed below the workpiece detaching means 50. At the same time, the temporary placing means 16 is moved along the first path R1 by the drive mechanism 34 of the first moving means 18 to position the temporary placing means 16 above the chuck table 60. At this time, the position of each suction hole 24a of the suction pad 24 of the temporary placement means 16 and the position of each chip are aligned in the vertical direction. Next, the temporary placing means 16 is lowered by the lifting mechanism 44 of the first moving means 18 so that the lower surface of the suction pad 24 is brought into close contact with the upper surface of the chip. Next, the suction force on the upper surface of the chuck table 60 is released and a suction force is generated on the lower surface of the suction pad 24 so that each chip is adsorbed on the lower surface of the suction pad 24. As described above, since the arrangement and quantity of the suction holes 24a of the suction pad 24 correspond to the arrangement and quantity of the device 14 of the substrate 10, the shape of the substrate 10 also in the suction pad 24 as in the chuck table 60. Each chip can be adsorbed and held while maintaining. Further, like the chuck table 60, the suction pad 24 can be appropriately replaced according to the size of the plate-like workpiece and the size of the device.

  After each chip is adsorbed on the lower surface of the suction pad 24, the temporary placement means 16 is raised by the lifting mechanism 44 of the first moving means 18, so that the lower surface of each chip becomes the brush 114 and the roller 118 of the lower surface cleaning means 112. Each chip held by the suction pad 24 is raised to a height at which it comes into contact. Next, the temporary placing means 16 is moved toward the carry-out mechanism 120 along the first path R <b> 1 by the drive mechanism 34 of the first moving means 18, and each chip is passed over the lower surface cleaning means 112. When each chip passes over the lower surface cleaning means 112, the brush 114 comes into contact with the lower surface of each chip, and the cleaning liquid supplied from the cleaning liquid supply means is applied to the lower surface of each chip from each injection hole 116a of the injection means 116. Since the spray is directed toward the tip, it is possible to remove and clean the cutting waste adhering to the lower surface of each chip, and the roller 118 can contact the lower surface of each chip to remove the cleaning liquid from the lower surface of each chip.

  When the temporary placement means 16 passes above the lower surface cleaning means 112 and the suction pad 24 reaches above the receiving table 122 of the carry-out mechanism 120, the drive mechanism 34 of the first moving means 18 is stopped. At this time, the position of each suction hole 122a of the receiving table 122 and the position of each chip are aligned in the vertical direction. Next, the temporary placement means 16 is lowered by the lifting mechanism 44 of the first moving means 18, and the lower surface of each chip is brought into close contact with the upper surface of the receiving table 122. Next, the suction force of the suction pad 24 is released and the suction means connected to the suction hole 122a of the receiving table 122 is operated to generate a suction force on the upper surface of the receiving table 122. Adsorb the lower surface. As described above, since the arrangement and quantity of the suction holes 122a of the receiving table 122 correspond to the arrangement and quantity of the device 14 of the substrate 10, the receiving table 122 also has the same arrangement as the chuck table 60 and the suction pad 24. Each chip can be adsorbed and held while maintaining the shape of the substrate 10. Further, the receiving table 122 can be appropriately replaced according to the size of the plate-like workpiece and the size of the device, like the chuck table 60 and the suction pad 24.

  Next, an unloading process for unloading the chip to the outside of the processing apparatus 2 by the unloading mechanism 120 of the processing apparatus 2 will be described. After each chip is adsorbed on the upper surface of the receiving table 122, the receiving table 122 is moved along the third path R 3 by the third moving unit 124, and the receiving table 122 is positioned below the tray transfer unit 126. Next, the suction member 140 is lowered by the air cylinder 142 of the tray transfer means 126, and the lower surface of the suction plate 144 is brought into close contact with the upper surface of the chip. Next, the suction force on the upper surface of the receiving table 122 is released, and the suction means connected to the suction hole of the suction plate 144 is operated to generate the suction force on the lower surface of the suction plate 144, corresponding to the width of the tray 146. A quantity of chips is adsorbed on the lower surface of the adsorption plate 144. As described above, the size of the suction plate 144 corresponds to the width of the tray 146, and the arrangement of the suction holes of the suction plate 144 corresponds to the arrangement of the device 14 of the substrate 10, so that it is held on the receiving table 122. Of the chips, a number of chips corresponding to the width of the tray 146 can be adsorbed and held while being sorted. Further, the suction plate 144 can be appropriately replaced according to the size of the device. Next, the suction plate 144 is lifted by the air cylinder 142 of the tray transfer means 126, so that each chip held by the suction plate 144 is lifted. Next, the suction plate 144 is moved in the direction orthogonal to the direction of the third path R3 by the moving mechanism of the tray transfer means 126, and the empty tray 146 placed on the third carry-out means 160 of the tray carry-out means 128 is moved. The suction plate 144 is positioned above. Next, the suction plate 144 is lowered by the air cylinder 142 of the tray transfer means 126 to bring the lower surface of each chip into close contact with the upper surface of the accommodating portion into which the tray 146 is recessed, and the suction force of the suction plate 144 is released. As a result, the chips sorted from the receiving table 122 to the tray 146 can be transferred. Then, the third transfer means 160 of the tray transfer means 128 stops the tray 146 at each workpiece receiving position, and the transfer of the chips from the receiving table 122 to the tray 146 is performed a predetermined number of times by the tray transfer means 126 ( (E.g., three times), the carry-out roller 174 is rotated by the rotation mechanism of the third carry-out means 160, whereby the tray 146 can be carried out to the transfer device 200.

  Here, an operation of supplying the empty tray 146 from the tray supply means 130 to the third carry-out means 160 of the tray carry-out means 128 in the carry-out mechanism 120 will be described. First, an empty tray 146 is mounted on the endless belt 152 of the tray supply unit 130 by an operator, and the endless belt 152 is operated by the rotation mechanism of the tray supply unit 130. Then, the empty tray 146 is stopped by the stopper 154 at the supply position for supplying to the tray carry-out means 128. Further, in the second carry-out means 158, the one-side receiving member 168 and the other-side receiving member 170 are moved to the open position where the tray 146 can pass through the air cylinder 172. Next, the arm 164 is lowered by the lifting mechanism of the first carry-out means 156, and the lower surface of the suction piece 166 of the first carry-out means 156 is brought into close contact with the upper surface of the empty tray 146 positioned at the supply position of the tray supply means 130. Let Next, the suction means connected to the suction piece 166 is operated to generate a suction force on the lower surface of the suction piece 166, and the upper surface of the tray 146 is sucked to the lower surface of the suction piece 166. Next, the arm 164 is raised by the lifting mechanism of the first carry-out means 156, and the empty tray 146 sucked by the suction piece 166 is positioned above the second carry-out means 158. Next, the one-side receiving member 168 and the other-side receiving member 170 are moved to the closed position where the tray 146 can be received by the air cylinder 172 of the second carry-out means 158. Next, the arm 164 is lowered by the elevating mechanism of the first carry-out means 156, and an empty tray 146 is placed on the one-side receiving member 168 and the other-side receiving member 170 of the second carry-out means 158, and the first carry-out means 156. The suction force of the suction piece 166 is released. As a result, the second carry-out means 158 can receive the empty tray 146 from the first carry-out means 156. When the second carry-out means 158 receives the empty tray 146, the outer peripheral surface of the carry-out roller 174 of the second carry-out means 158 and the outer surface of the empty tray 146 are in contact. Next, the carry-out roller 174 is rotated by the rotation mechanism of the second carry-out means 158, whereby the empty tray 146 is carried out to the third carry-out means 160. In the third unloading means 160, when the empty tray 146 is unloaded from the second unloading means 158 and the tray sensor 182 detects the empty tray 146, the rotation of the unloading roller 174 stops. As a result, the third unloading means 160 can stop the empty tray 146 unloaded from the second unloading means 158 at the receiving position for receiving chips from the tray transfer means 126. As described above, in the processing apparatus 2, the large substrate 10 called FOWLP can be efficiently divided into individual chips, and the divided chips can be divided and accommodated in the transport tray 146.

  Next, the operation of carrying the tray 146 carried out from the third carry-out means 160 of the tray carry-out means 128 by the carrying device 200 will be described. By rotating the carry-out roller 180 by the rotation mechanism of the third carry-out means 160, the tray 146 carried out from the third carry-out means 160 of the tray carry-out means 128 is connected to the tributary belt connected to the third carry-out means 160. It is mounted on the belt 212 of the conveyor 202 and conveyed toward the mainstream belt conveyor 204. In the transport device 200, in the T-shaped path 206 between the tributary belt conveyor 202 and the mainstream belt conveyor 204, (1) the tray 146 being transported by the mainstream belt conveyor 204 is prioritized over the tray 146 being transported by the tributary belt conveyor 202. And (2) the tray 146 being transported by the tributary belt conveyor 202 is given priority over the tray 146 being transported by the main belt conveyor 204, and the T-path 206 is allowed to pass. is there. First, the case (1) will be described with reference to FIG. 8. The terminal 232 of the main flow stopper 228 is positioned at an allowable position by the air cylinder 234 of the main flow stopper 228, and the outer guide member is driven by the drive unit 240 of the guide means 236. 238 is positioned at the allowable position, and the terminal 218 of the branch stopper 214 is positioned at the stop position by the air cylinder 220 of the branch stopper 214. As a result, the tray 146 being transported by the tributary belt conveyor 202 can be stopped at the terminal 218 of the tributary stopper 214, and the tray 146 being transported by the main belt conveyor 204 rather than the tray 146 being transported by the tributary belt conveyor 202. The T-shaped path 206 can be preferentially passed. Next, the case (2) will be described with reference to FIG. 9. The terminal 218 of the branch stopper 214 is positioned at the allowable position by the air cylinder 220 of the branch stopper 214, and the outer guide is driven by the drive unit 240 of the guide means 236. The member 238 is positioned at the guide position, and the terminal 232 of the mainstream stopper 228 is positioned at the stop position by the air cylinder 234 of the mainstream stopper 228. As a result, the tray 146 being conveyed by the mainstream belt conveyor 204 can be stopped at the terminal 232 of the mainstream stopper 228, and the tray 146 being conveyed by the tributary belt conveyor 202 is guided by the outer guide member 238 to be mainstream belt conveyor. Therefore, the tray 146 being transported by the tributary belt conveyor 202 can be given priority over the tray 146 being transported by the mainstream belt conveyor 204 and can be passed through the T-junction 206.

  When the main flow sensor 230 does not detect the tray 146, the main flow stopper 228 is positioned at the stop position. When the main flow sensor 216 does not detect the tray 146, the main flow sensor 214 is positioned at the stop position. 146 and the tributary sensor 216 does not detect the tray 146 (that is, the tray 146 being conveyed by the main belt conveyor 204 is approaching the T-shaped path 206, while the tributary belt conveyor 202 is conveying the tray 146. The terminal 232 of the mainstream stopper 228 is moved to the allowable position, and the outer guide member 238 is moved to the allowable position. Terminal 21 of the tributary stopper 214 It is not moved while the stop position. Therefore, the tray 146 being conveyed by the mainstream belt conveyor 204 is conveyed without stopping at the T-shaped path 206. On the other hand, when the tributary sensor 216 detects the tray 146 and the mainstream sensor 230 does not detect the tray 146 (that is, the tray 146 being conveyed by the tributary belt conveyor 202 is approaching the T-shaped path 206, the mainstream belt conveyor 204, when the tray 146 is not transported or the tray 146 being transported does not reach the T-shaped path 206), the terminal 218 of the tributary stopper 214 is moved to the allowable position, and the outer guide member 238 is guided. While being moved to the position, the terminal 232 of the mainstream stopper 228 is not moved in the stop position. Therefore, the tray 146 being conveyed by the tributary belt conveyor 202 is guided by the outer guide member 238 and moved to the mainstream belt conveyor 204 without stopping at the T-shaped path 206. As described above, in the transport apparatus 200, the tray 146 unloaded from the processing apparatus 2 can be transported to the next process, so that it is not necessary for the operator to transport the tray 146 to the next process, thereby improving productivity. Figured. In the illustrated embodiment, the single tributary belt conveyor 202 that connects the processing apparatus 2 and the mainstream belt conveyor 204 has been described. However, in correspondence with the two or more processing apparatuses 2, A tributary belt conveyor 202 may be provided for each.

2: Processing device 4: Cassette table 8: Cassette 10: Substrate (workpiece)
16: Temporary placing means 18: First moving means 22: Fork 24: Suction pad 50: Work piece detaching means 60: Chuck table 76: Cutting means 100: Cutting blade 110: Upper surface cleaning means 112: Lower surface cleaning means 120: Unloading mechanism 122: Receiving table 124: Third moving means 126: Tray transfer means 128: Tray unloading means 130: Tray supply means 146: Tray 200: Conveying device 202: Tributary belt conveyor 204: Mainstream belt conveyor 206: T-shape Path 214: Tributary stopper 216: Tributary sensor 218: Tributary stopper terminal 228: Main stream stopper 230: Main stream sensor 232: Main stream stopper terminal 236: Guide means 238: Outer guide member 240: Drive unit 244: Tray stacking means R1: First One route R2: Second route R3: Third route

Claims (4)

A transport device for transporting a tray,
A tributary belt conveyor that receives and conveys the tray carried out from the processing apparatus, and a mainstream belt conveyor that receives the tray from the tributary belt conveyor and conveys it to the next process,
The starting point of the tributary belt conveyor is positioned on the processing apparatus side, and the end point is positioned on the side of the mainstream belt conveyor to form a T-junction,
The T-junction is provided with guide means in which a curved guide member for guiding a tray from the tributary belt conveyor to the mainstream belt conveyor is positioned across the mainstream belt conveyor,
The guide means includes a drive unit that raises and lowers the guide member, and when guiding the tray from the tributary belt conveyor to the mainstream belt conveyor, the guide member is lowered, and the tray of the mainstream belt conveyor passes the T-junction. A conveying device that raises the guide member when passing. The tributary belt conveyor is provided with a tributary stopper that positions the terminal at a stop position that prevents the tray from entering the T-shaped path and an allowable position that allows entry into the T-shaped path.
The mainstream belt conveyor is provided with a mainstream stopper for positioning the terminal at a stop position that prevents the tray from entering the T-shaped path and an allowable position that allows entry into the T-shaped path.
When guiding the tray from the tributary belt conveyor to the mainstream belt conveyor, the mainstream stopper terminal is positioned at the stop position and the tributary stopper terminal is positioned at the allowable position,
2. The conveying device according to claim 1, wherein when the tray of the mainstream belt conveyor passes through the T-shaped path, the terminal of the mainstream stopper is positioned at an allowable position and the terminal of the tributary stopper is positioned at a stop position. A tributary sensor for detecting a tray is disposed at a position adjacent to the T-shaped path of the tributary belt conveyor;
A mainstream sensor for detecting a tray is disposed at a position adjacent to the T-shaped path of the mainstream belt conveyor,
When the tributary sensor does not detect the tray, the terminal of the tributary stopper is positioned at the stop position,
The conveying apparatus according to claim 2, wherein when the main flow sensor does not detect the tray, the terminal of the main flow stopper is positioned at the stop position.   The conveying device according to claim 1, wherein the tributary belt conveyors are respectively disposed corresponding to two or more processing devices.