CN111799206A - Stripping device - Google Patents
Stripping device Download PDFInfo
- Publication number
- CN111799206A CN111799206A CN202010248733.2A CN202010248733A CN111799206A CN 111799206 A CN111799206 A CN 111799206A CN 202010248733 A CN202010248733 A CN 202010248733A CN 111799206 A CN111799206 A CN 111799206A
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- Prior art keywords
- plate
- protective member
- peeling
- recovery box
- unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Abstract
Provided is a peeling device, wherein when a protective member is peeled from a workpiece and discarded in a tape peeling device, an operator is not injured by a conveying mechanism for conveying the peeled protective member, and the tape peeling device continuously performs the operations of attaching a dicing tape or the like to the workpiece and peeling the protective member from the workpiece without stopping the device. A peeling device (1) comprises: a box (2) which is arranged in the stripping device, has an opening (20) for throwing the protection component stripped by the stripping unit (4) down, and recovers the protection component; a unit (5) which can move the box to an in-device input position for inputting the protection component and an out-device output position for outputting the protection component; and a slope (6) formed so that the protective member peeled and dropped by the peeling unit falls into the box when the box is positioned at the take-out position for taking out the recovered protective member, and the protective member can be recovered into the box regardless of which position the box is positioned at the put-in position or the take-out position.
Description
Technical Field
The present invention relates to a peeling apparatus for peeling off a protective member of a plate-like work.
Background
A tape sticking machine capable of tape peeling (for example, see patent document 1) is configured such that a dicing tape having a larger diameter than a plate-shaped workpiece is stuck to and integrated with a back surface of the plate-shaped workpiece and one surface of an annular frame after grinding, and then a protective member is peeled from a front surface of the plate-shaped workpiece.
Patent document 1: japanese patent laid-open publication No. 2016-201488
The peeled protective member is dropped into the collection box from an opening provided on the upper side of the collection box and stored in the collection box, and before the collection box is filled, the stored protective member is taken out from the collection box by an operator and discarded.
When an operator discards the protective member stored in the collection box, the apparatus needs to be stopped for the following reasons.
The first reason is that: the recovery box is taken out of the apparatus in order to discard the protective member stored in the recovery box, and a space is formed at a position where the recovery box is originally installed. Since the operator may erroneously put his or her hand into the space, a conveying mechanism for conveying the protective member to the collection box may operate to interfere with the space, thereby causing injury to the operator. Therefore, the apparatus needs to be stopped.
The second reason is that: in order to discard the protective member stored in the recovery box, the recovery box is taken out of the apparatus, and the protective member peeled off from the next plate-like workpiece is transported and thrown into the space where the recovery box is not provided, so that the apparatus needs to be stopped until the recovery box is provided again.
Thus, the following problems are provided: when the protective member is peeled from the plate-like workpiece and discarded in the peeling apparatus, the protective member can be continuously peeled from the plate-like workpiece and discarded without stopping the apparatus without causing an operator to be injured by a conveying mechanism that conveys the peeled protective member.
Disclosure of Invention
The invention aims to provide a stripping device for stripping a protective component of a plate-shaped workpiece.
The present invention for solving the above problems is a peeling apparatus including at least: a holding table that holds a lower surface of a plate-like workpiece whose upper surface is covered with a sheet-like protective member; and a peeling unit that peels the protective member from the plate-like workpiece held by the holding table, wherein the peeling device includes: a recovery box which is arranged in the stripping device, has an opening for the protective component stripped by the stripping unit to drop and recovers the protective component; a moving unit capable of moving the recovery box to a loading position inside the peeling device where the protective member is loaded and a removal position outside the peeling device where the protective member is removed; and a slope formed to allow the protective member peeled and dropped by the peeling unit to fall into the recovery box when the recovery box is positioned at the take-out position in order to take out the protective member recovered to the recovery box, the protective member being recoverable to the recovery box regardless of which position of the put-in position or the take-out position the recovery box is positioned.
Preferably, the slope is formed by at least two plates of an upper plate and a lower plate, and has: a plurality of through holes formed in the lower plate and extending in a longitudinal direction; a stringing blade formed at the lower end of the upper plate and inserted into the through hole; and a guide portion that guides the upper plate and the lower plate so that the upper plate and the lower plate can slide, wherein when the recovery box is positioned at the removal position, a lower end of the upper plate is connected to an upper end of the lower plate, and the lower plate extends so as to be continuous with the upper plate to form the slope, and when the recovery box is positioned at the input position, the upper plate and the lower plate are overlapped to form a side wall of the recovery box.
The peeling device of the present invention comprises: a recovery box which is arranged in the stripping device, has an opening for the protection component stripped by the stripping unit to drop and recovers the protection component; a moving unit which can move the recovery box to a loading position inside the peeling device for loading the protection component and a taking-out position outside the peeling device for taking out the protection component; and a slope formed so that the protective member peeled and dropped by the peeling unit falls into the collection box when the collection box is positioned at the take-out position in order to take out the protective member collected into the collection box, so that the protective member peeled and peeled off from the plate-like work can be thrown into the collection box through the slope even in the process of discarding the protective member stored in the collection box, and the peeling device can be continuously operated. In addition, when the peeling device functions as a taping machine that peels off the protective member stuck to the plate-like work after the dicing tape is stuck to the annular frame and the plate-like work, the protective member stored in the collection box can be discarded during the peeling operation of the protective member, and therefore the peeling device can also be continuously operated as a taping machine.
In the peeling apparatus of the present invention, the inclined surface is formed by at least two plates of an upper plate and a lower plate, and the inclined surface has: a plurality of through holes formed in the lower plate and extending in a longitudinal direction; a stringing blade formed at the lower end of the upper plate and inserted into the through hole; and a guide portion for guiding the upper plate and the lower plate in a manner that the upper plate and the lower plate can slide, wherein when the recovery box is positioned at the taking-out position, the lower end of the upper plate is connected with the upper end of the lower plate, and the lower plate extends in a manner of being continuous with the upper plate to form an inclined surface, when the recovery box is positioned at the putting-in position, the upper plate and the lower plate are overlapped to form a side wall of the recovery box, thereby efficiently forming the inclined surface for guiding the protection component peeled off by the peeling unit and put down to the recovery box or storing the inclined surface. Further, when the recovery box is moved from the removal position outside the peeling device, at which the protective member is removed, to the input position inside the peeling device, at which the protective member is input, the threading blade inserted into the through hole and the through hole contact the protective member and catch the protective member on the bottom of the recovery box, thereby preventing the protective member from being pinched between the upper plate and the lower plate.
Drawings
Fig. 1 is a perspective view showing an example of the peeling apparatus.
Fig. 2 is a cross-sectional view illustrating a state in which a peeling tape is attached to a protective member of a plate-shaped workpiece and the peeling tape is cut.
Fig. 3 is a cross-sectional view showing a state where the protective member is peeled from the plate-like workpiece by relatively moving the holding table and the holding unit holding the peeling tape stuck to the protective member.
Fig. 4 is a perspective view for explaining an internal structure of the recovery box positioned at the introduction position.
Fig. 5 is a perspective view for explaining the structure of the recovery tank and the moving unit positioned at the removal position.
Fig. 6 is a perspective view for explaining the structure of the collection box and the guide portion positioned at the removal position.
Fig. 7 is a perspective view for explaining a structure of the recovery tank positioned at the removal position and the formed slope.
W: a plate-like workpiece; wa: an upper surface; wb: a lower surface; s: dividing the predetermined line; d: a device; t1: scribing a tape; f: an annular frame; t2: a protective member; 1: a peeling device; 10: a base station; 13: a table moving unit; 130: a ball screw; 131: a guide rail; 132: an electric motor; 133: a movable member; 30: a holding table; 300: an adsorption part; 300 a: a holding surface; 301: a frame body; 31: a support table; 32: a frame fixing unit; 33: a piston mechanism; t3: a peeling tape; r: a coil of tape; 4: a peeling unit; 40: a tape cutting unit; 400: a mounting table; 401: a cutter; 402: a cutter moving unit; 403: a cutter lifting unit; 41: a clamping unit; 410: a support table; 411: a cylinder mechanism; 412: a clamping claw portion; 412 b: a fixed jaw; 412 a: a movable claw; 42: a peeling tape supply unit; 420: a reel; 421a, 421 b: a guide roller; 423a, 423 b: a delivery roller; 44: a belt pressing unit; 440: a support table; 441: a pressing plate lifting mechanism; 442: a pressing plate; 46: an X-axis direction moving unit; 460: a ball screw; 462: an electric motor; p1: taking out the position; p2: a drop position; 2: a recycling bin; 20: an opening; 21: a base plate; 219: a hinge; 22: a side wall; 220: a handle; 23: a side wall; 5: a mobile unit; 50: a guide rail; 51: a sliding part; 6: a bevel; 60: an upper plate; 61: a lower plate; 64: a through hole; 65: stringing edges; 63: a support plate; 630: a through hole; 66: a guide section; 660: a framework; 661: a guide plate; 661 a: a snap-fit pin; 662: a guide groove; 663: a limiting plate; 9: a housing; 91: a base plate; 94: a side plate; 93: a connecting plate; 74: 1 st optical sensor; 77: a 2 nd photosensor; 76: light sensor containing box.
Detailed Description
A peeling apparatus 1 of the present invention shown in fig. 1 is an example of a peeling apparatus for peeling a protective member T2 stuck to an upper surface Wa of a plate-like work W using a tape-like peeling tape T3, and the peeling apparatus 1 includes at least: a holding table 30 for holding a lower surface Wb of a plate-like workpiece W whose upper surface Wa is covered with a sheet-like protective member T2; and a peeling unit 4 that peels off the protective member T2 holding the plate-like work W held by the table 30.
A plate-like workpiece W shown in fig. 1 is a semiconductor wafer having a circular outer shape and made of, for example, silicon, and has an upper surface Wa divided into a lattice shape by a plurality of lines to divide S vertical to each other, and devices D such as ICs are formed in respective regions divided into the lattice shape.
The protective member T2 is attached so as to cover the entire upper surface Wa of the plate-like workpiece W, and the protective member T2 is, for example, a protective member made of a resin film and a circular sheet formed as follows: in a protective member forming apparatus not shown, an upper surface Wa of a plate-like work W is pressed against a liquid resin supplied onto a circular plate, the liquid resin is spread from the center of the plate-like work W toward the outer peripheral side, the liquid resin is spread over the entire upper surface Wa, and the liquid resin is irradiated with, for example, ultraviolet rays, to cure the liquid resin to form a resin film.
The plate-like workpiece W may be made of gallium arsenide, sapphire, gallium nitride, ceramic, silicon carbide, or the like, in addition to silicon, and the protective member is not limited to the example made of the resin film and the circular plate.
For example, a dicing tape T1 having a larger diameter than the plate-like work W is attached to the lower surface Wb of the plate-like work W. Further, the outer peripheral portion of the paste layer of the dicing tape T1 is also stuck to the annular frame F, and the plate-like work W is supported by the annular frame F via the dicing tape T1, and can be operated by the annular frame F.
The peeling apparatus 1 includes a rectangular parallelepiped base 10 extending in the X-axis direction. The devices of the peeling device 1, such as the base 10, the holding table 30, and the peeling unit 4, are housed in a rectangular parallelepiped case 11 shown by broken lines in fig. 1. In the present embodiment, the inside of the casing 11 is defined as the inside of the peeling apparatus 1, and the outside of the casing 11 is defined as the outside of the peeling apparatus 1.
A table moving means 13 for reciprocating the holding table 30 in the X-axis direction is disposed on the base 10. The table moving unit 13 includes: a ball screw 130 disposed on the base 10; a motor 132 connected to one end of the ball screw 130; a pair of guide rails 131 extending in parallel with the ball screw 130; and a movable member 133 movable in the X-axis direction. A holding table 30 is disposed on the upper surface of the movable member 133 via a support table 31. The pair of guide rails 131 slidably contact the lower surface of the movable member 133, and the ball screw 130 is screwed to a nut, not shown, disposed at the center of the lower surface of the movable member 133. The holding table 30 moves in the X-axis direction along the guide rail 131 together with the movable member 133 by rotating the ball screw 130 by driving the motor 132.
The holding table 30 includes: an adsorption part 300 which is made of a porous member or the like and adsorbs the plate-like work W; and a housing 301 that supports the suction unit 300. The suction unit 300 communicates with a suction source, not shown, such as a vacuum generator, and a suction force generated by the suction source is transmitted to a flat holding surface 300a, which is an exposed surface of the suction unit 300, so that the holding table 30 can suction and hold the plate-shaped workpiece W on the holding surface 300 a.
For example, the holding table 30 is surrounded by a frame fixing unit 32 that fixes the ring frame F. The frame fixing unit 32, which has an annular shape in plan view and on which the annular frame F is placed, is configured to suck and fix the annular frame F by a suction force generated by a suction source, not shown, and is movable up and down in the Z-axis direction by piston mechanisms 33 arranged uniformly in the circumferential direction. Instead of the frame fixing means 32, a plurality of mechanical jigs that are opened and closed by springs or the like may be disposed around the holding table 30.
A peeling unit 4 that peels off the protective member T2 of the plate-like work W held by the holding table 30 is disposed above the moving path of the holding table 30, and the peeling unit 4 includes, for example: a tape cutting unit 40 that cuts the peeling tape T3 by a predetermined length; a peeling tape supply unit 42 that pulls out a peeling tape T3 from a tape roll R around which the peeling tape T3 is wound in a roll shape and supplies the peeling tape to a protective member T2 to which an upper surface Wa of a plate-like work W is stuck; a clamping unit 41 that clamps one end of the peeling tape T3 pulled out from the tape roll R; a tape pressing unit 44 for pressing and attaching the separation tape T3 to an outer peripheral region of the protective member T2; and an X-axis direction moving unit 46 that moves the tape pressing unit 44 and the gripping unit 41 in the X-axis direction.
The X-axis direction moving unit 46 includes: a ball screw 460 having an axis in the X-axis direction; a pair of guide rails 461 disposed in parallel with the ball screw shaft 460; a motor 462 coupled to the ball screw 460 to rotate the ball screw 460; and a movable plate 463 having a nut screwed to the ball screw shaft 460 therein, a side portion of the movable plate 463 slidably contacting the guide rail 461, and the movable plate 463 is guided by the guide rail 461 to reciprocate in the X-axis direction when the ball screw shaft 460 is rotated by the motor 462, and the tape pressing unit 44 and the holding unit 41 attached to the movable plate 463 also reciprocate in the X-axis direction.
The peeling tape supply unit 42 includes: a reel 420 to which the tape roll R is mounted; guide rollers 421a and 421b that guide the peeling tape T3 drawn out from the tape roll R downward; and delivery rollers 423a and 423b disposed below the guide rollers 421a and 421 b. A back tension is applied to the spool 420 by a control mechanism not shown, and the tension is adjusted so that the peeling tape T3 pulled out from the tape roll R does not slacken. The guide rollers 421a and 421b can fold back while sandwiching the separation tape T3 to apply tension, and can guide the separation tape to the feed rollers 423a and 423 b. The feed rollers 423a and 423b can feed the separation tape T3 guided by the guide rollers 421a and 421b toward the nip unit 41.
The release tape T3 is, for example, a two-layer heat seal composed of an adhesive layer and a base material, which are bonded to each other by applying heat to the outer peripheral portion of the protective member T2. The material of the substrate is not particularly limited, and is made of a resin such as polyethylene terephthalate. The adhesive layer is preferably made of, for example, a thermosetting resin, for example, an epoxy resin. The adhesion of the peeling tape T3 to the protective member T2 is set to be stronger than the adhesion of the protective member T2 to the plate-like work W. The peeling tape T3 is wound with the adhesive layer on the inside (lower surface side in an extended state) to form a tape roll R. The peeling tape T3 is not limited to heat sealing.
The clamping unit 41 has: a support table 410 fixed to a side surface of the movable plate 463 of the X-axis direction moving unit 46; a cylinder mechanism 411 supported by the support base 410; and a clamping claw portion 412 which is movable up and down by the cylinder mechanism 411. The clamping claw portion 412 includes, for example: a fixing claw 412b having a substantially L-shaped side view; and a movable claw 412a that is disposed so as to face the fixed claw 412b in the Z-axis direction and can move toward and away from the fixed claw 412 b. In the clamping unit 41, the movable claw 412a is brought close to the fixed claw 412b, whereby one end of the separation tape T3 can be clamped. The gripping claw 412 gripping the peeling tape T3 can be positioned by the air cylinder mechanism 411 at a height position suitable for tape attachment on the protective member T2 holding the plate-shaped workpiece W held by the table 30. On the other hand, by separating the movable claw 412a from the fixed claw 412b, the clamped state of the one end of the separation tape T3 in the clamping unit 41 can be released.
The tape pressing unit 44 is disposed between the feeding rollers 423a and 423b and the nip unit 41. The belt pressing unit 44 has: a support table 440 fixed to a side surface of the movable plate 463 of the X-axis direction moving unit 46; a pressing plate lifting mechanism 441, which is composed of an air cylinder or the like, and is supported by the support base 440; and a pressing plate 442 that is vertically movable by a pressing plate lifting mechanism 441.
A heater, not shown, which generates heat by flowing current is attached to the pressing plate 442, and when the pressing plate 442 is lowered by the pressing plate lifting mechanism 441 and the peeling tape T3 is pressed against the outer peripheral portion of the protective member T2 and bonded thereto, the heater, not shown, heats the pressing plate 442, and the peeling tape T3 pressed against the protective member T2 can be partially heat-welded thereto. This enables the peeling tape T3 to be favorably stuck to the protective member T2.
The tape cutting unit 40 is disposed between the feeding rollers 423a and 423b and the tape pressing unit 44, for example. As shown in fig. 1, the tape cutting unit 40 includes: a mounting table 400 having a mounting surface 400a on which the adhesive layer side (lower side) of the peeling tape T3 is mounted, and a groove 400b intersecting the mounting surface 400a in the width direction (Y-axis direction) of the peeling tape T3; a cutter 401 that travels within the slot 400b along the extending direction of the slot 400 b; a cutter moving unit 402 that is a ball screw mechanism that supports the cutter 401 via a cutter lifting and lowering unit 403 and moves the cutter 401 in the extending direction (Y-axis direction) of the slot 400 b; and a cutter lifting unit 403 configured by an air cylinder or the like, which lifts and lowers the cutter 401 in the Z-axis direction with respect to the mounting surface 400 a.
The peeling apparatus 1 may be configured to function as a taping machine, and may be configured to apply a dicing tape T1 having a larger diameter than the plate-shaped workpiece W to the lower surface Wb of the plate-shaped workpiece W. In this case, for example, a bonding roller, a cutter for cutting the band-shaped dicing tape into a circular dicing tape T1 while rotating, and the like are arranged at the end portion on the-X direction side of the base 10.
Next, an operation example of cutting the peeling tape T3 in the peeling apparatus 1 and an operation example of peeling the protective member T2 from the plate-like workpiece W using the peeling tape T3 will be described.
First, the plate-like workpiece W integrated with the ring frame F is placed on the holding surface 300a of the holding table 30 with the protective member T2 facing upward, and the ring frame F is placed on the frame fixing unit 32 disposed on the outer peripheral side of the holding table 30. Next, the suction source, not shown, is operated to suck and hold the plate-shaped workpiece W by the holding surface 300a, and the ring-shaped frame F is sucked and fixed by the frame fixing unit 32.
The peeling tape T3 is fed from the tape roll R toward the nip unit 41 by the feeding rollers 423a and 423b shown in fig. 1. The adhesive layer side (inner side) of the peeling tape T3 is placed on the placement surface 400a of the placement table 400 of the tape cutting unit 40, and when one end of the peeling tape T3 is positioned on the upper surface of the fixed claw 412b of the gripping unit 41, the movable claw 412a is moved in a direction approaching the fixed claw 412b, and the gripping unit 41 grips one end of the peeling tape T3. Subsequently, the holding unit 41 is moved in the-X direction by the X-axis direction moving unit 46, and the held separation tape T3 is pulled in this direction. At this stage, the pressing plate 442 of the tape pressing unit 44 and the cutter 401 of the tape cutting unit 40 are in a standby state on the upper side of the peeling tape T3.
For example, the holding table 30 moves in the + X direction to position the outer peripheral portion of the protective member T2 directly below the tape pressing unit 44. Next, the pressing plate 442 shown in fig. 2 heated by a heater, not shown, provided therein is lowered in the-Z direction, and the peeling tape T3 is pressed from above to the outer peripheral portion of the protective member T2 by the lower end of the pressing plate 442, so that the adhesive layer of the peeling tape T3 is thermally fused to the protective member T2.
In this state, the cutter 401 is positioned at the-Y direction side (front side in the paper) start position by the cutter moving unit 402. That is, the cutter 401 is positioned at one end of the groove 400b of the mounting table 400 exposed from one side edge of the peeling tape T3. The cutter 401 is lowered by the cutter lifting and lowering unit 403 until the lowermost end of the cutter 401 reaches the inside of the slot 400 b. Further, the cutter 401 advances in the + Y direction along the extending direction of the slot 400b, and the peeling tape T3 is cut by the cutter 401. After the cutter 401 cuts the peeling tape T3, the cutter 401 and the pressing plate 442 rise in the + Z direction and retreat from the peeling tape T3.
Then, the holding unit 41 holding the peeling tape T3 is raised, and a part of the protective member T2 is peeled off from the upper surface Wa of the plate-like workpiece W. Next, as shown in fig. 3, the clamping unit 41 is moved in the-X direction by the X-axis direction moving unit 46, the holding table 30 is moved in the + X direction by the table moving unit 13 (see fig. 1), and the clamping unit 41 is relatively moved in the radial direction from the outer peripheral edge of the plate-shaped workpiece W toward the center, so that the protective member T2 is peeled off from the plate-shaped workpiece W. Further, a rotating roller, not shown, may be disposed above the moving path of the holding table 30, and the protective member T2 may be peeled off while being brought into contact with the rotating roller, thereby suppressing the occurrence of breakage of the protective member T2, which may occur when the protective member T2 is peeled off.
Further, for example, since the protective member T2 can be peeled off from the plate-like workpiece W by relatively moving the clamp unit 41 in the radial direction from the outer peripheral edge of the plate-like workpiece W toward the center, the protective member T2 may be peeled off by moving only the clamp unit 41 in the-X direction without moving the holding table 30 in the + X direction.
When the protective member T2 is completely peeled off from the upper surface Wa of the plate-like workpiece W, the holding unit 41 holding the peeling tape T3 stuck to the protective member T2 is moved to above the end portion on the + X direction side of the base 10 in the peeling apparatus 1 shown in fig. 1, that is, the region below the peeling tape supplying unit 42 (the rectangular parallelepiped region shown by the alternate long and short dash line in fig. 1). Then, the gripping unit 41 releases the grip of the peeling tape T3, and the protective member T2 and the peeling tape T3 are dropped into the recovery box 2 described below.
For example, at the end portion on the + X direction side of the base 10 in the peeling apparatus 1, that is, in a region below the peeling tape supplying unit 42 (a rectangular parallelepiped region shown by a one-dot chain line in fig. 1), there are arranged: a recovery box 2 having an opening 20 for recovering the protective member T2 shown in fig. 4, and into which the protective member T2 peeled by the peeling unit 4 is dropped; a moving unit 5 (see fig. 5) capable of moving the recovery box 2 to a loading position P2 inside the peeling apparatus 1 where the protective component T2 is loaded and a removal position P1 outside the peeling apparatus 1 where the protective component T2 is removed; and a slope 6 (see fig. 7) configured to drop the protective member T2 peeled and dropped by the peeling unit 4 into the collection box 2 when the collection box 2 is positioned at the removal position P1 in order to remove the protective member T2 recovered to the collection box 2.
The collection box 2 shown in fig. 4 and 5 is, for example, a box having a rectangular bottom plate 21 in a plan view and 3 side walls integrally erected in the + Z direction from the outer periphery of the bottom plate 21, and having a substantially rectangular parallelepiped outer shape. The protection member T2 can be stored in a space surrounded by the bottom plate 21 and the side walls, and a rectangular opening 20 into which the protection member T2 is inserted can be provided above the protection member T2. For example, the front side wall (+ X direction side) among the 3 side walls of the recovery tank 2 is defined as a side wall 22, and the two side walls on the Y axis direction side are defined as side walls 23. Fig. 4 shows a state in which the recovery box 2 is positioned at the input position P2 in the peeling apparatus 1, and fig. 5 to 7 show a state in which the recovery box 2 is positioned at the take-out position P1 outside the peeling apparatus 1 shown in fig. 1.
As shown in fig. 5 to 7, the collection box 2 is housed in a housing 9 fixed in the peeling apparatus 1 so as to be movable in the X-axis direction, for example. The casing 9 has, for example, a box-like shape having a substantially rectangular shape in plan view larger than the collection tank 2, and the casing 9 has: a bottom plate 91 on which the bottom plate 21 of the recovery tank 2 slides; two side plates 94 rising integrally from the outer periphery of the bottom plate 91 in the + Z direction and facing each other in the Y axis direction; and a connecting plate 93 connecting upper portions of the two side plates 94.
The moving means 5 shown in fig. 5 and 6 is capable of moving the recovery box 2 to a loading position P2 inside the peeling apparatus 1 where the protective member T2 is loaded and a removal position P1 outside the peeling apparatus 1 where the protective member T2 is removed, and the moving means 5 includes, for example: guide rails 50 arranged at lower portions of inner surfaces of the two side plates 94 of the housing 9 so as to extend in parallel to the X-axis direction; and sliding portions 51 which are disposed on the lower portions of the outer surfaces of the two side walls 23 on the Y-axis direction side of the recovery box 2, respectively, and loosely fitted into the guide rails 50 to allow the guide rails 50 to slidably contact. The driving force required for the movement of the recovery box 2 by the moving means 5 may be generated by an operator, or may be generated by a ball screw mechanism having an unillustrated motor or the like for moving the slide portion 51.
A handle 220 is formed, for example, on an upper portion of the side wall 22 of the collection box 2, and an operator can pull out (slide-move) the collection box 2 from the casing 11 of the peeling apparatus 1 shown in fig. 1 to an apparatus outer side on the + X direction side, that is, a take-out position P1 shown in fig. 5 by putting his or her hand on the handle 220 and pulling out the side wall 22 to the + X direction side by the moving means 5.
As shown in fig. 4 and 7, in the present embodiment, the inclined surface 6 is formed of at least two plates, for example, an upper plate 60 and a lower plate 61. The upper plate 60 has a rectangular outer shape in plan view, for example, and is connected to a lower end of a support plate 63 shown in fig. 7 by a hinge or the like, not shown, so that the upper plate can be rotated by a predetermined angle. For example, the inclined surface 6 may be formed of a flexible metal plate, a flexible resin plate, or the like, and in this case, the inclined surface is appropriately curved by the movement of the recovery box 2 between the loading position P2 and the unloading position P1.
The support plate 63 extending in the Z-axis direction is attached to the coupling plate 93 of the housing 9. The support plate 63 has, for example, 4 through holes 630 formed therein at equal intervals in the Y axis direction.
As shown in fig. 7, the lower plate 61 has, for example, a rectangular shape in plan view, and is connected at its lower end side to one end side (the (-X direction side) of the bottom plate 21 of the recovery tank 2 by a hinge 219, and its upper end side is in a state of being recessed by a predetermined length to a position below the lower surface of the upper plate 60.
The inclined surface 6 has, for example: a plurality of through holes 64 formed in the lower plate 61 and extending in the longitudinal direction of the lower plate 61; a chisel 65 formed at the lower end of the upper plate 60 and inserted into the through hole 64; and a guide portion 66 (see fig. 5 and 6) that guides the upper plate 60 and the lower plate 61 so that the upper plate 60 and the lower plate 61 can slide.
As shown in fig. 7, a total of 4 through holes 64 extend in the longitudinal direction of the lower plate 61 in a rectangular groove shape in accordance with the outer shape of the chisel 65, for example.
The chisel edge 65 has, for example, a rectangular plate-like shape smaller than the width of the through hole 64, is inserted into the through hole 64, and has a lower end side protruding from the lower surface of the lower plate 61 by a predetermined length. The length of the chisel edge 65 is set to a length not contacting the frame 660 shown in fig. 7 attached to the lower plate 61.
The guide portion 66 shown in fig. 5 to 7 includes, for example: a skeleton 660 attached to the lower surface of the lower plate 61 so as to extend in the width direction (Y-axis direction) of the lower plate 61; guide plates 661 installed at both ends of the frame 660, respectively; a guide groove 662 formed in the side plate 94 of the housing 9; and a regulating plate 663 that supports the guide plate 661 from the inner side surface side.
The bar-shaped skeletons 660 shown in fig. 7 are formed longer than the width of the lower plate 61, for example, and two skeletons 660 are attached to the lower surface of the lower plate 61, for example. The frame 660 is attached to the lower surface of the lower plate 61 so as to protrude with a predetermined gap from the lower surface of the lower plate 61. Therefore, the chisel 65 moving in the longitudinal direction of the lower plate 61 in the through-hole 64 does not collide with the frame 660.
The guide plate 661 shown in fig. 5 and 6 is formed in an arc-shaped plate shape in the illustrated example, and has an engagement pin 661a protruding toward the side plate 94 side of the housing 9 and inserted into the guide groove 662 at an upper end portion thereof.
For example, a linear groove extending in the X-axis direction slightly wider than the thickness of the guide plate 661 is formed in the upper surface of the guide rail 50 of the moving unit 5 shown in fig. 6, and the lower end side of the guide plate 661 slides in the linear groove.
The guide groove 662 as a moving path of the engaging pin 661a is formed to rise in a curved shape from the middle portion toward the upper portion of the side plate 94 of the housing 9, for example.
The regulating plate 663 shown in fig. 5 and 6 is disposed outside the side wall 23 of the recovery tank 2, for example, and supports the guide plate 661 from the inside with the outer side surface. The restricting plate 663 has its end in the-X direction fixed to the inner surface of the support plate 63. In the arrangement position, the side wall 23 of the recovery box 2 is positioned at the innermost side and is lined with the restricting plate 663, the guide plate 661, and the side plate 94 of the housing 9 toward the outside.
As shown in fig. 6, the lower end surface of the regulating plate 663 is formed as an inclined surface, the frame 660 shown in fig. 7 passes below the inclined lower end surface, and each end thereof is connected to the inner side surface of the guide plate 661. The regulating plate 663 has, for example, 5 through holes 663a formed therein at equal intervals in the X-axis direction. The reason why the guide plate 661 is formed in an arc shape on the upper side thereof is, for example, to prevent the through hole 663a of the regulating plate 663 from being closed by the guide plate 661 when the engaging pin 661a of the guide plate 661 moves along the guide groove 662.
An inclined plate 664 is disposed above and inside the restricting plate 663, and the inclined plate 664 guides the protective member T2 thrown toward the opening 20 of the recovery tank 2 to reliably drop into the recovery tank 2.
As shown in fig. 5, for example, 5 light emitting portions constituting the 1 st photosensor 74 are disposed on the side plates 94 of the housing 9.
A single, continuously extending, rectangular slit 230 is formed in the upper region of the side wall 23 on the Y-axis direction side of the recovery box 2, for example, and when the recovery box 2 is at the loading position P2, the slit 230 allows the detection light emitted from the light emitting portion of the 1 st photosensor 74 and passing through the through hole 663a of the restricting plate 663 to further pass to the-Y direction side, and is received by the light receiving portion, not shown, disposed on the outer surface of the side plate 94 on the-Y direction side of the housing 9. Before the detection light reaches the light receiving unit, the 1 st photosensor 74 detects that the recovery tank 2 is filled with the protective member T2 by being blocked by the protective member T2 stacked in the recovery tank 2.
As shown in fig. 7, the photosensor housing box 76 protruding in the + Y direction is provided above the inside of the collection box 2, and for example, 4 light receiving parts 770 constituting the 2 nd photosensor 77 are arranged at equal intervals in the Y axis direction in the photosensor housing box 76. The 2 nd photosensor 77 is a transmission type photosensor and has a light emitting section 771 that faces the light receiving section 770 on the same straight line in the X axis direction. The light emitting portion 771 is attached to, for example, the inner surface of the connecting plate 93 of the housing 9. As shown in fig. 4, the detection light emitted from the light emitting section 771 of the 2 nd photosensor 77 and having passed through the through hole 630 of the support plate 63 reaches the light receiving section 770, and is blocked by the protective member T2 stacked in the collection tank 2, so that the 2 nd photosensor 77 detects that the collection tank 2 in the input position P2 is filled with the protective member T2.
In addition, any one of the 1 st photosensor 74 and the 2 nd photosensor 77 may be disposed.
As described above, in the peeling apparatus 1 shown in fig. 1, in the process of peeling the protective member T2 from the upper surface Wa of the plate-like workpiece W by the peeling unit 4 using the peeling tape T3 and feeding the peeled protective member T2 into the recovery box 2, the protective member T2 can be taken out from the recovery box 2, that is, the protective member T2 can be recovered into the recovery box 2 regardless of the position of the recovery box 2 at which the feeding position P2 or the taking-out position P1 shown in fig. 4, which will be described below.
The holding unit 41 shown in fig. 1 releases the holding of the peeled separation tape T3, drops the protective member T2 and the separation tape T3, and drops the protective member T2 and the separation tape T3 into the collection box 2 from the opening 20 of the collection box 2 positioned at the input position P2 shown in fig. 4. The protective member T2 and the peeling tape T3 are stacked on the bottom plate 21 of the collection box 2. When the recovery tank 2 is positioned at the insertion position P2, the upper plate 60 is superimposed on the upper surface of the lower plate 61, and serves as a side wall on the-X direction side of the recovery tank 2.
As shown in fig. 4, in a state where the collection box 2 is positioned at the insertion position P2, a plurality of protective members T2 peeled off from the plate-like work W are stacked up to a predetermined height in the collection box 2, and the 1 st photosensor 74 or the 2 nd photosensor 77 detects that the collection box 2 is filled with the protective member T2 by being shielded by the stacked protective members T2 before the detection light of the 1 st photosensor 74 or the 2 nd photosensor 77 reaches the light receiving portions thereof.
The peeled protective member T2 may be bent or rolled into a roll and stacked. Therefore, the detection light may be blocked by a small number of protective members T2.
When the 1 st optical sensor 74 or the 2 nd optical sensor 77 detects that the inside of the recovery tank 2 is filled with the protective member T2, the separation device 1 shown in fig. 1 displays a warning character to take out the protective member T2 from the recovery tank 2 on a monitor not shown, or emits a warning sound to take out the protective member T2 from the recovery tank 2 from a speaker not shown, for example.
For example, the worker who received the warning pulls the side wall 22 in the + X direction by putting his hand on the pull handle 220 of the collection box 2 shown in fig. 4, positions the collection box 2 at the take-out position P1 outside the peeling apparatus 1 by the moving means 5 shown in fig. 5, and forms the rectangular protective member take-out port 27 beside the opening 20 with the optical sensor housing box 76 therebetween. When the 1 st optical sensor 74 or the 2 nd optical sensor 77 detects that the recovery box 2 is filled with the protective member T2, the moving means 5 automatically moves the side wall 22 of the recovery box 2 in the + X direction to position the recovery box 2 at the removal position P1 outside the peeling device 1, thereby forming the protective member removal port 27.
The worker puts his or her hand into the collection box 2 through the protective member outlet 27 shown in fig. 6 and 7, for example, and grasps the protective member T2 stored on the bottom plate 21 in the collection box 2. Then, the hand is pulled out from the protective member outlet 27 to take out the protective member T2 from the collection box 2. Since the holding unit 41 of the peeling unit 4 shown in fig. 1 does not move above the protective member outlet 27 each time, the hand of the operator does not come into contact with the holding unit 41 which is positioned above the opening 20 of the collection box 2 and drops the protective member T2.
When the recovery box 2 positioned at the input position P2 shown in fig. 4 is positioned at the take-out position P1 outside the peeling apparatus 1 by the moving unit 5 shown in fig. 5, the slope 6 is formed as shown in fig. 7. That is, the lower plate 61 connected to the bottom plate 21 of the recovery tank 2 via the hinge 219 is pulled out to the + X direction side from a state of being erected in the substantially vertical direction together with the upper plate 60 (a state of forming a side wall on the-X direction side of the recovery tank 2), and is inclined obliquely.
Further, the engaging pin 661a of the guide plate 661 shown in fig. 5 and 6 coupled to the lower plate 61 via the frame 660 shown in fig. 7 is lowered along the guide groove 662. In conjunction with this, the guide plate 661 sandwiched between the restricted plate 663 and the side plate 94 of the housing 9 from both sides in the Y-axis direction is also inclined downward from the standing state. Therefore, the lower plate 61 is gradually inclined obliquely together with the frame 660.
In parallel with the oblique inclination of the lower plate 61, the upper plate 60 shown in fig. 7 in which the chisel edge 65 is inserted into the through hole 64 of the lower plate 61 is inclined obliquely such that the lower end thereof slides on the upper surface of the lower plate 61 from a state in which it stands in the substantially vertical direction together with the lower plate 61 (a state in which the side wall on the-X direction side of the recovery tank 2 is formed). Further, the chisel edge 65 descends along the through hole 64.
Then, by positioning the collection box 2 at the take-out position P1 outside the peeling apparatus 1, as shown in fig. 7, the lower end of the upper plate 60 is connected to the upper end of the lower plate 61, and the lower plate 61 is extended so as to be continuous with the upper plate 60, thereby forming the slope 6.
In the process of the worker recovering the protective member T2 in the recovery box 2 shown in fig. 5 positioned at the removal position P1, the protective member T2 peeled off from the plate-like workpiece W by the peeling unit 4 shown in fig. 1 is still thrown from the opening 20 onto the slope 6 shown in fig. 7. The protective member T2 slides down the upper surface of the inclined surface 6 and is accumulated on the bottom plate 21 of the collection box 2.
For example, when the worker finishes collecting the protective member T2 from the collection box 2 through the protective member take-out port 27, the collection box 2 is pushed in the-X direction and returned to the drop-in position P2 shown in fig. 4.
As described above, the peeling apparatus 1 of the present invention includes: a recovery box 2 disposed in the peeling device 1, having an opening 20 through which the protective member T2 peeled by the peeling unit 4 is dropped, and recovering the protective member T2; a moving means 5 capable of moving the recovery box 2 to a loading position P2 inside the peeling apparatus 1 where the protective member T2 is loaded and a removal position P1 outside the peeling apparatus 1 where the protective member T2 is removed; and a slope 6 formed so that the protective member T2 peeled and dropped by the peeling unit 4 falls into the recovery box 2 when the recovery box 2 is positioned at the take-out position P1 in order to take out the protective member T2 recovered to the recovery box 2, so that the protective member T2 peeled by peeling the protective member T2 from the plate-like workpiece W can be thrown into the recovery box 2 through the slope 6 even in the process of discarding the protective member T2 stored in the recovery box 2, and thus the peeling apparatus 1 can be continuously operated. In addition, when the peeling apparatus 1 functions as a taping machine that peels off the protective member T2 stuck to the plate-shaped workpiece W after the dicing tape T1 is stuck to the annular frame F and the plate-shaped workpiece W, the protective member T2 stored in the collection box 2 can be discarded during the peeling operation of the protective member T2, and therefore the peeling apparatus 1 can also be continuously operated as a taping machine.
In the peeling apparatus 1 of the present invention, the slope 6 is formed by at least two plates of the upper plate 60 and the lower plate 61, and the slope 6 has: a plurality of through holes 64 formed in the lower plate 61 and extending in the longitudinal direction; a chisel 65 formed at the lower end of the upper plate 60 and inserted into the through hole 64; and a guide portion 66 that guides the upper plate 60 and the lower plate 61 so that the upper plate 60 and the lower plate 61 can slide, wherein when the recovery box 2 is positioned at the removal position P1, a lower end of the upper plate 60 is connected to an upper end of the lower plate 61, and the lower plate 61 extends so as to be continuous with the upper plate 60 to form a slope 6, and when the recovery box 2 is positioned at the insertion position P2, the upper plate 60 and the lower plate 61 are overlapped to form a side wall of the recovery box 2, whereby the slope 6 for introducing the protective member T2 peeled off and inserted from the peeling unit 4 into the recovery box 2 or storing the slope 6 (in a folded state) can be efficiently formed. Further, when the recovery box 2 is moved from the takeout position P1 outside the peeling device 1 where the protective member T2 is taken out to the input position P2 inside the peeling device 1 where the protective member T2 is input, in the case where the protective member T2 remains on the upper surface of the lower plate 61, the threading blade 65 and the protective member T2 are brought into contact with each other through the through hole 64 and the threading blade 65 inserted into the through hole 64, whereby the protective member T2 can be caught to the bottom plate 21 of the recovery box 2, and a state in which the protective member T2 is caught between the upper plate 60 and the lower plate 61 can be prevented.
The peeling apparatus 1 of the present invention is not limited to the above-described embodiment, and may be implemented in various different forms within the scope of the technical idea thereof. The shape and the like of each structure of the peeling apparatus 1 shown in the drawings are not limited to these, and may be appropriately changed within a range in which the effects of the present invention can be exhibited.
Claims (2)
1. A peeling apparatus having at least:
a holding table that holds a lower surface of a plate-like workpiece whose upper surface is covered with a sheet-like protective member; and
a peeling unit that peels the protective member from the plate-like work held by the holding table,
wherein the content of the first and second substances,
the peeling device comprises:
a recovery box which is arranged in the stripping device, has an opening for the protective component stripped by the stripping unit to drop and recovers the protective component;
a moving unit capable of moving the recovery box to a loading position inside the peeling device where the protective member is loaded and a removal position outside the peeling device where the protective member is removed; and
a slope formed to allow the protective member peeled and dropped by the peeling unit to fall into the recovery box when the recovery box is positioned at the take-out position in order to take out the protective member recovered to the recovery box,
the protection member can be recovered into the recovery box regardless of the position of the recovery box in the input position or the output position.
2. The peeling apparatus as claimed in claim 1,
the inclined surface is formed by at least two plates of an upper plate and a lower plate, and has:
a plurality of through holes formed in the lower plate and extending in a longitudinal direction;
a stringing blade formed at the lower end of the upper plate and inserted into the through hole; and
a guide portion that guides the upper plate and the lower plate so that the upper plate and the lower plate can slide,
when the recovery box is positioned at the taking-out position, the lower end of the upper plate is connected with the upper end of the lower plate, and the lower plate extends in a mode of being continuous with the upper plate to form the inclined surface,
when the recovery box is positioned at the input position, the upper plate and the lower plate are overlapped to form a side wall of the recovery box.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019074057A JP7252819B2 (en) | 2019-04-09 | 2019-04-09 | Peeling device |
| JP2019-074057 | 2019-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111799206A true CN111799206A (en) | 2020-10-20 |
Family
ID=72806672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010248733.2A Pending CN111799206A (en) | 2019-04-09 | 2020-04-01 | Stripping device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7252819B2 (en) |
| KR (1) | KR20200119195A (en) |
| CN (1) | CN111799206A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113513005B (en) | 2021-04-22 | 2022-08-26 | 杜同 | Offshore floating island |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327898A (en) | 2003-04-28 | 2004-11-18 | Matsushita Electric Ind Co Ltd | Device and method for collecting tape or the like for component supply, and device and method for mounting component |
| JP6450634B2 (en) | 2015-04-13 | 2019-01-09 | 株式会社ディスコ | Tape peeling device |
| JP6833542B2 (en) | 2017-02-08 | 2021-02-24 | 日東電工株式会社 | Tape collection method and tape collection device |
| JP6845087B2 (en) | 2017-05-25 | 2021-03-17 | 株式会社ディスコ | Peeling device |
| JP6770487B2 (en) | 2017-06-12 | 2020-10-14 | ヤマハ発動機株式会社 | Tape recovery device and component mounting device equipped with this device |
-
2019
- 2019-04-09 JP JP2019074057A patent/JP7252819B2/en active Active
-
2020
- 2020-03-27 KR KR1020200037770A patent/KR20200119195A/en active Search and Examination
- 2020-04-01 CN CN202010248733.2A patent/CN111799206A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7252819B2 (en) | 2023-04-05 |
| KR20200119195A (en) | 2020-10-19 |
| JP2020174082A (en) | 2020-10-22 |
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