CN102887636B - Dividing apparatus - Google Patents
Dividing apparatus Download PDFInfo
- Publication number
- CN102887636B CN102887636B CN201210153884.5A CN201210153884A CN102887636B CN 102887636 B CN102887636 B CN 102887636B CN 201210153884 A CN201210153884 A CN 201210153884A CN 102887636 B CN102887636 B CN 102887636B
- Authority
- CN
- China
- Prior art keywords
- rectangular substrate
- short rectangular
- substrate
- brisement
- short
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The invention relates to a dividing apparatus for a short rectangle substrate, saving equipment power and reducing operation time. The dividing apparatus comprises a scribe part which forms a scribe groove on the surface of the short rectangle substrate along a width direction of the substrate; a reverse part which reverses the scribed surface of the short rectangle substrate; a break part which divides the reversed short rectangle substrate along the scribe groove; a transport part which conveys the short rectangle substrate from the scribe part to the break part. The transport part is formed such that the short rectangle substrate can be conveyed while the length direction of the short rectangle substrate is maintained in the transport direction; and a cross beam of a scribe probe of the scribe part is formed along the length direction of the short rectangle substrate, so that a scribe groove can be made on the short rectangle substrate along the width direction by means of relative movement of either the scribe probe or the short rectangle substrate.
Description
Technical field
The present invention relates to the break-up device of the brittle substrates such as a kind of glass substrate, particularly relate to and on substrate, form scored groove and the break-up device carrying out disjunction along this scored groove.
Background technology
All the time, known many parallel scored groove along being formed in large-area mother substrate carry out disjunction to form multiple short rectangular substrate, afterwards, short rectangular substrate form many scored groove along width and from then on scored groove by substrate brisement, be divided into constituent parts product whereby, take out the method (such as with reference to patent documentation 1, patent documentation 2 etc.) of unit product.
Fig. 9 is the explanatory view of the existing known method for dividing of outline display.
From the short rectangular substrate W that mother substrate cuts out, as shown in Fig. 9 (a) and Fig. 9 (b), deliver to scoring device 31 with flat-hand position alongst, process multiple scored groove S at width.Form crossbeam (Beam) 31a of the long band of a part for the framework of scoring device 31, be configured in the direction orthogonal with the conveyance direction of short rectangular substrate W, be provided with at crossbeam 31a the engraving head 31b that scored groove such as possessing break bar forms tool, multiple scored groove S is sequentially processed in this engraving head 31b to-and-fro movement.Afterwards, as shown in Fig. 9 (c), make the short rectangular substrate W surface back side reverse and deliver to brisement device 32, as shown in Fig. 9 (d), by brisement bar 32a from scored groove S sequentially disjunction, take out the product W1 of unit key element.
But, in this method, engraving head must be made to move back and forth the number of times of scored groove S quantity at scoring device, therefore have the shortcoming that activity duration lifting that is elongated, productive rate is restricted, impacts product cost.
Therefore, as the method for the multiple scored groove S of time processing, motion has the method shown in Figure 10.
Crossbeam (Beam) 33a of scoring device 33 is configured in the direction orthogonal with the conveyance direction of short rectangular substrate W, is provided with and the scored groove S-phase to be processed engraving head 33b with quantity at this crossbeam 33a.This scoring device 33, as shown in Figure 10 (a) and Figure 10 (b), from the short rectangular substrate W that mother substrate cuts out, deliver to scoring device 33 with the flat-hand position that its length direction is orthogonal with conveyance direction, time processing is along multiple scored groove S of width.Then, as shown in Figure 10 (c) and Figure 10 (d), the short rectangular substrate W processing scored groove is under flat-hand position after 90-degree rotation, surface back side reverses and delivers to brisement device 34, as shown in Figure 10 (e), sequentially divide by brisement bar 34a from scored groove S and be broken into unit product W1.
Patent documentation 1: Japanese Unexamined Patent Publication 2003-292333 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2006-315901 publication
Summary of the invention
But the method for the latter shown in Figure 10, make short rectangular substrate W in the mechanism loading 90-degree rotation under the state that plane maintains flat-hand position owing to having, therefore cost of equipment uprises, and has the corresponding elongated shortcoming of production line.
Again, the crossbeam 33a of long band forming a part for the framework of scoring device 33 is the conveyance direction orthogonal collocation with short rectangular substrate W, and therefore the two end portions of crossbeam becomes and laterally exposing from a succession of production line.Therefore situation production line two consecutive or three consecutives be arranged in parallel, above-mentioned exposed portion becomes obstruction and produces meaningless space, has the problem points of the rationalization cannot seeking installation space.
Therefore, the present invention, in order to solve above-mentioned existing known problem, its object is to provide a kind of break-up device that can reach the short rectangular substrate of the novelty of the Labor-saving of equipment and the shortening of activity duration.
In order to reach above-mentioned purpose, the present invention seeks following technique means.That is break-up device of the present invention, possesses: delineation portion, form scored groove on the surface of short rectangular substrate along substrate width direction; Inversion portion, makes the short rectangular substrate surface back side reversion being formed with scored groove; Brisement portion, the short rectangular substrate disjunction after surface back side being reversed along scored groove; And conveying unit, by this short rectangular substrate from the conveyance of delineation portion to brisement portion; This conveying unit is formed as making the length direction of short rectangular substrate maintain towards the posture of conveyance direction and transport short rectangular substrate under the state maintaining conveyance direction; The crossbeam of the engraving head in this delineation portion is kept to be formed along the length direction of short rectangular substrate, by any one relative movement making engraving head or short rectangular substrate, in the scored groove of short rectangular substrate processing along width.
Break-up device of the present invention is as above-mentioned formation, therefore by the crossbeam in delineation portion, multiple engraving head is installed, can in the multiple scored groove of short rectangular substrate time processing, the cripetura of activity duration can be sought, and the short rectangular substrate after delineation processing, under the state of posture maintaining delineation portion, deliver to ensuing inversion portion by conveying unit, therefore need not make short rectangular substrate 90-degree rotation.Whereby, the rotating mechanism in order to 90-degree rotation or its installation space can be omitted, the miniaturization of device can be sought.Again, the crossbeam of the engraving head in delineation portion is kept to be along the length direction of short rectangular substrate that is to be formed along conveyance direction, therefore the crossbeam of long band can not expose from the production line of break-up device at transverse direction, from the production line of viewed in plan break-up device, the band shape that width is narrower and meticulous can be formed as.Whereby, there is following effect, can with the conveyance direction of short rectangular substrate abreast by two or three etc. multiple break-up device reasonable combination form, effective utilization of installation space can be sought.
Other are in order to solve means and the effect of problem
In the present invention, possess: the 1st, load short rectangular substrate in this delineation portion; 2nd, the short rectangular substrate after the reversion of inversion portion mounting also delivers to brisement portion; And transport mechanism, transport to inversion portion from this delineation portion by short rectangular substrate; Transport mechanism and the 2nd form in fact this conveying unit and also can.
Whereby, can, to after short rectangular substrate processing scored groove on the 1st platform, the length direction of short rectangular substrate be maintained towards the posture of conveyance direction and surface back side reversion, and by short rectangular substrate conveyance to brisement portion.
Again, in the present invention, this inversion portion be by accept from transport mechanism short rectangular substrate and mounting reversion platform and by this reversion platform reverse drive formed short rectangular substrate to be handover to the reversing device of the 2nd standby in below, reversion platform possess the adsorption function short rectangular substrate adsorbed removably.
Whereby, positively can carry out the surface back side reversion of short rectangular substrate, and really be handover to the 2nd that delivers to ensuing brisement portion.
Accompanying drawing explanation
Fig. 1 shows the stereographic map of an example of break-up device of the present invention.
Fig. 2 is the stereographic map in delineation portion in the break-up device of Fig. 1.
Fig. 3 is the stereographic map in inversion portion and brisement portion in the break-up device of Fig. 1.
Fig. 4 is the side-view of an example of transport mechanism in the break-up device of display Fig. 1.
Fig. 5 (a), (b) are the side-views of inversion portion in the break-up device of Fig. 1.
The figure that the outline entirety that Fig. 6 shows break-up device of the present invention is formed.
Fig. 7 (a)-(e) shows the figure of the action of the sequence of steps of break-up device of the present invention.
Fig. 8 shows the approximate vertical view of another embodiment of break-up device of the present invention.
The explanatory view of the existing known method for dividing of Fig. 9 (a)-(d) outline display.
The explanatory view of existing another method for dividing known of Figure 10 (a)-(e) outline display.
[main element nomenclature]
Embodiment
Below, the detailed of break-up device of the present invention is described in detail according to Fig. 1-Fig. 7.Fig. 1 is the stereographic map of break-up device of the present invention, Fig. 2 is the stereographic map in delineation portion, Fig. 3 is the stereographic map in inversion portion and brisement portion, Fig. 4 is the side-view of an example of display transport mechanism, Fig. 5 is the side-view of inversion portion, Fig. 6 is the figure that the outline entirety of display break-up device is formed, Fig. 7 is the figure of the action of step display order.
Break-up device of the present invention uses with the break-up device taking out multiple unit product along width (Y-direction of figure) disjunction as the mother substrate from glass being divided the short rectangular substrate W had no progeny.Therefore short rectangular substrate W used in the present invention refers to that the unit product one becoming the finished product arranges the rectangular substrate of multiple arrangement.
Break-up device 1 of the present invention, possesses: delineation portion A, forms the scored groove S that multiple, the present embodiment is 3 on the surface of short rectangular substrate W along substrate width direction; Inversion portion B, makes the short rectangular substrate W surface back side reversion be scored; Brisement portion C, along scored groove by the short rectangular substrate W disjunction after reversion; And conveying unit, short rectangular substrate W is transported to brisement portion C from delineation portion A.Conveying unit, is made up of aftermentioned transport mechanism 9 and the 2nd 18 in fact, makes the length direction of the substrate conveyance direction of conveying unit and short rectangular substrate (length direction that multiple unit product arranges) become equidirectional.That is, be formed as making the length direction of short rectangular substrate W to maintain towards the posture of conveyance direction and under maintaining the state that conveyance direction is certain orientation by short rectangular substrate W from delineation portion A in certain orientation conveyance to brisement portion C.This substrate conveyance direction is shown as X-direction in the drawings.
Delineation portion A possesses pair of right and left pillar 2,2, hanger at the crossbeam (Beam) 3 of these pillars 2,2, and crossbeam 3 configures along the X direction.Being separated by crossbeam 3, to be provided with multiple, the present embodiment be 3 engraving heads 4 to predetermined distance, is provided with the scored groove such as the break bar in order to process scored groove S to short rectangular substrate W forms tool 5 in the lower end of engraving head 4.Again, being configured with the horizontal plane loading short rectangular substrate W in the below of engraving head 4 is rectangular 1st 6.1st 6 is that the track 8 being formed as to extend along the Y-direction orthogonal in the plane with X-direction moves, and is loaded maintenance at these the 1st 6 short rectangular substrate W with its length direction towards the posture of X-direction.
At above-mentioned delineation portion A, scored groove is formed tool 5 and press on the surface of short rectangular substrate W and make the 1st 6 to be displaced into Y-direction by drive shaft 7 simultaneously, whereby 3 scored groove S are processed to short rectangular substrate W.The short rectangular substrate W being scored processing delivers to ensuing inversion portion B by the transport mechanism 9 of the conveying unit of following explanation.
Fig. 4 is an example of the above-mentioned transport mechanism 9 of display.This transport mechanism 9 is assembled in above-mentioned break-up device 1, but in order to avoid graphic complicated and omitted in Fig. 1-Fig. 3.
Transport mechanism 9 is formed in the following manner, at the pillar 10 of front and back along the X direction, the guide rail 11 of 10 installation levels, at the moving body 12 along this guide rail 11 movement, the adsorption plate 13 possessing air suction hole is below elevated by driving mechanism (not shown).Make this adsorption plate 13 be elevated to adsorb the short rectangular substrate W of maintenance, move in X-direction along guide rail 11, the short rectangular substrate W being scored portion A delineation processing can be delivered to ensuing inversion portion B under the state not changing its plane posture whereby.
Inversion portion B, as shown in Figure 5, possesses the lifting body 15 that moves up and down along pillar 14 and to be fulcrum at lifting body 15 with axle 16 be inverted to the reversion platform 17 of posture down from posture upward.Reversion platform 17 possesses the air suction hole of adsorbing short rectangular substrate W on surface, reverse by reversing device (not shown).In the below of reversing platform 17, also transport the 2nd of extremely ensuing brisement portion C just standby in order to accept the short rectangular substrate W after reversion.
Fig. 5 (a) is that the short rectangular substrate W of display is handover to the state reversion platform 17 from adsorption plate 13.As shown in Fig. 5 (b), what from then on state made lifting body 15 rise to reversion platform 17 can till reverse position, and by reversing device reversion, the short rectangular substrate W after being reversed by surface back side is handover to the 2nd 18.
2nd 18, form the part of the short rectangular substrate W conveyance after by reversion to the conveying unit of ensuing brisement portion C.At the present embodiment, movably microscope carrier 21 is installed at the track 19 being layed in X-direction towards brisement portion C, at this microscope carrier 21 so that the 2nd 18 can be provided with by drive shaft 23 along the mode of track 22 movement being layed in Y-direction.
Short rectangular substrate W after inversion portion B handing-over, under the state being placed in the 2nd 18, after microscope carrier 21 moves in the Y direction a little, delivers to brisement portion C together with microscope carrier 21.
Inversion portion B and brisement portion C, configures in the position of width (Y-direction of figure) with staggering.Therefore at break-up device 1, the mutual interference of inversion portion B and brisement portion C can be avoided and guarantee the maintenance space of both sides, and reducing the size of the inversion portion B that occupies break-up device 1 entirety and brisement portion C in length direction (X-direction of figure) simultaneously.
In addition, at the present embodiment, from the relation of the position of brisement portion C, microscope carrier 21 is moved in the Y direction a little, but do not move and directly deliver to brisement portion C by microscope carrier 21 and also can.
Brisement portion C possesses in order to allow microscope carrier 21 to pass through across track 19, and the gate framework 24 of 19 configurations, at the crossbeam 25 of this framework 24, the brisement bar 26 that front end attenuates can be arranged up and down by hoisting appliance (not shown).Be positioned in the 2nd 18 and deliver to the short rectangular substrate W of brisement portion C, pressing with brisement bar 26 from the face contrary with the face being provided with scored groove S, whereby from scored groove S sequentially disjunction, taking out unit product W1.Above-mentioned from a succession of processing sequence of delineation portion A through inversion portion B to brisement portion C, show at Fig. 6 and Fig. 7 (a)-Fig. 7 (e) outline.
At above-mentioned break-up device, can by the multiple scored groove S of multiple engraving heads 4 time processing of crossbeam 3 being arranged on delineation portion A, and keep the crossbeam 3 of long ribbon shape of the delineation portion A of engraving head 4 to be formed along the length direction of short rectangular substrate W that is X-direction, therefore the two end portions of crossbeam 3 can not be exposed from the production line of break-up device at transverse direction, from the production line of viewed in plan break-up device, the band shape that width is narrower and meticulous can be formed as.Whereby, such as, shown in Fig. 8, abreast two break-up devices 1,1 can be combined with the conveyance direction of short rectangular substrate W and form, or three groups, four groups etc. be organized not wasting space ground reasonable combination more and form, effective utilization of installation space can be sought.
Again, at the short rectangular substrate W that delineation portion A is scored, under the state maintaining its plane posture, deliver to inversion portion B by conveying unit, therefore need not existing known as make the step of short rectangular substrate W 90-degree rotation, equipment or its installation space of rotating mechanism can be omitted.
At above-described embodiment, move in the Y direction by making the 1st of delineation portion A the 6 and scored groove S is processed to short rectangular substrate W, but on the contrary, fix the 1st 6 in advance and make the crossbeam 5 of supporting engraving head 4 or pillar 2 move to carry out delineating also can.Again, the scored groove of short rectangular substrate W being processed to scored groove forms tool 31b, except the machine tools such as break bar, also can by laser beam processing.
Above, be described for the embodiment that represents of the present invention, but the present invention is not specific to above-mentioned example.Such as, the formation forming the transport mechanism 9 of a part for conveying unit can be undertaken carrying out alternative above-described embodiment by mechanical arm.In addition, in the present invention, in order to reach above-mentioned purpose, suitably can revise in the scope not departing from claim, changing.
Method for dividing of the present invention is the disjunction being used in the short rectangular substrate be made up of hard brittle materials such as glass substrates.
Claims (2)
1. a break-up device, is characterized in that possessing:
Delineation portion, forms scored groove on the surface of short rectangular substrate along substrate width direction;
Inversion portion, makes the short rectangular substrate surface back side reversion being formed with scored groove;
Brisement portion, the short rectangular substrate disjunction after surface back side being reversed along this scored groove;
Conveying unit, by this short rectangular substrate from the conveyance of delineation portion to brisement portion;
1st, load short rectangular substrate in this delineation portion;
2nd, load the short rectangular substrate after inversion portion reversion and deliver to brisement portion; And
Transport mechanism, transports to inversion portion from this delineation portion by short rectangular substrate;
This transport mechanism and the 2nd this conveying unit of formation;
This conveying unit is formed as making the length direction of short rectangular substrate maintain towards the posture of conveyance direction and transport short rectangular substrate under the state maintaining conveyance direction;
Keeping the crossbeam of the engraving head in this delineation portion, is formed along the length direction of short rectangular substrate, by any one relative movement making engraving head or short rectangular substrate, in the scored groove of short rectangular substrate processing along width;
This inversion portion, be by accept from transport mechanism short rectangular substrate and mounting reversion platform and by this reversion platform reverse drive formed short rectangular substrate to be handover to the reversing device of the 2nd standby in below, reversion platform possess the adsorption function short rectangular substrate adsorbed removably;
2nd, after the short rectangular substrate mounting of being reversed in the portion of being inverted, after width moves, be transported to brisement portion.
2. break-up device as claimed in claim 1, it is characterized in that its be configured to be arranged in parallel with conveyance direction multiple.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-158882 | 2011-07-20 | ||
| JP2011158882A JP2013023401A (en) | 2011-07-20 | 2011-07-20 | Splitting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102887636A CN102887636A (en) | 2013-01-23 |
| CN102887636B true CN102887636B (en) | 2015-07-15 |
Family
ID=47531341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210153884.5A Expired - Fee Related CN102887636B (en) | 2011-07-20 | 2012-05-11 | Dividing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013023401A (en) |
| KR (1) | KR101397487B1 (en) |
| CN (1) | CN102887636B (en) |
| TW (1) | TWI532088B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6126396B2 (en) * | 2013-02-07 | 2017-05-10 | 三星ダイヤモンド工業株式会社 | Substrate processing equipment |
| TWI492909B (en) * | 2013-03-31 | 2015-07-21 | 平田機工股份有限公司 | Glass dividing device and glass dividing method |
| JP5566511B2 (en) * | 2013-08-07 | 2014-08-06 | 三星ダイヤモンド工業株式会社 | Cutting device |
| TWI507371B (en) * | 2013-12-12 | 2015-11-11 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Cutting method and cutting apparatus |
| JP6716900B2 (en) * | 2015-12-04 | 2020-07-01 | 三星ダイヤモンド工業株式会社 | Cutting device |
| JP6973931B2 (en) * | 2017-12-25 | 2021-12-01 | 株式会社ディスコ | Cutting equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1890074A (en) * | 2003-12-04 | 2007-01-03 | 三星钻石工业股份有限公司 | Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11116260A (en) * | 1997-10-08 | 1999-04-27 | Mitsuboshi Diamond Kogyo Kk | Device for machining glass |
| JP4141805B2 (en) * | 2002-11-07 | 2008-08-27 | 住友化学株式会社 | Single wafer coating method |
| JP2006027795A (en) * | 2004-07-14 | 2006-02-02 | Toshiba Corp | Sucking device, method of carrying plate-like member, and method of manufacturing liquid crystal display |
| KR100924083B1 (en) * | 2008-03-05 | 2009-11-02 | 세메스 주식회사 | Scribing apparatus, apparatus and method for cutting substrate using the same |
| JP5167160B2 (en) | 2009-01-30 | 2013-03-21 | 三星ダイヤモンド工業株式会社 | Brittle material substrate transfer and cutting equipment |
-
2011
- 2011-07-20 JP JP2011158882A patent/JP2013023401A/en active Pending
-
2012
- 2012-04-05 TW TW101112022A patent/TWI532088B/en not_active IP Right Cessation
- 2012-05-08 KR KR1020120048453A patent/KR101397487B1/en not_active IP Right Cessation
- 2012-05-11 CN CN201210153884.5A patent/CN102887636B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1890074A (en) * | 2003-12-04 | 2007-01-03 | 三星钻石工业股份有限公司 | Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013023401A (en) | 2013-02-04 |
| KR101397487B1 (en) | 2014-05-20 |
| TWI532088B (en) | 2016-05-01 |
| TW201306102A (en) | 2013-02-01 |
| CN102887636A (en) | 2013-01-23 |
| KR20130011907A (en) | 2013-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102887636B (en) | Dividing apparatus | |
| JP4402883B2 (en) | Dividing device, dividing system and dividing method | |
| KR101606024B1 (en) | Glass dividing device and glass dividing method | |
| CN102794787B (en) | Guide correcting device of sponge cutting machine | |
| JPWO2013089125A1 (en) | Sheet glass breaking and separating method and sheet glass breaking and separating apparatus | |
| CN106956370A (en) | The transport mechanism of processing unit (plant) | |
| TWI480247B (en) | Splitting device | |
| JP2012171057A (en) | Cutting apparatus | |
| KR20150029518A (en) | Substrate inverting and conveying device | |
| CN102531369A (en) | Breaking method for bonding substrate | |
| CN105217310A (en) | Scoring device | |
| CN102975296B (en) | Breaking device | |
| CN103803787A (en) | Substrate dividing device | |
| KR20180069676A (en) | Substrate cutting apparatus | |
| CN103978564A (en) | Substrate processing device | |
| CN107151091B (en) | Scribing equipment | |
| KR20180069677A (en) | Substrate cutting apparatus | |
| TW201532989A (en) | Scribing device | |
| JP2014080336A (en) | Substrate dividing device | |
| JP5447992B2 (en) | Substrate cutting device | |
| JP2015164895A (en) | Parting device | |
| JP2014080334A (en) | Substrate dividing device | |
| JP3224931U (en) | LCD panel cutting equipment | |
| JP6435669B2 (en) | Substrate processing equipment | |
| JP2014019604A (en) | Fragile material substrate breaking device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 Termination date: 20180511 |