CN108687979A - Cutting apparatus - Google Patents
Cutting apparatus Download PDFInfo
- Publication number
- CN108687979A CN108687979A CN201810262192.1A CN201810262192A CN108687979A CN 108687979 A CN108687979 A CN 108687979A CN 201810262192 A CN201810262192 A CN 201810262192A CN 108687979 A CN108687979 A CN 108687979A
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- China
- Prior art keywords
- camera
- chuck table
- cutting
- base station
- axis
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
Cutting apparatus is provided, efficiently and qurer implements alignment.Cutting apparatus has:First, second chuck table, they are arranged adjacent to each other on the first direction parallel with retaining surface;First, second cutting unit, they are disposed in the top of the first, second chuck table, can carry out machining to the machined object kept in the respective retaining surface of the first, second chuck table;First, second camera, they are disposed in the top of the first, second chuck table, can be shot to the machined object kept in the respective retaining surface of the first, second chuck table;Camera base station supports the first, second camera;And camera base station mobile unit, it can be such that camera base station moves in a first direction, the first camera and the second camera according to the first chuck table center and the center of the second chuck table in a first direction at a distance from separate and be fixed on camera base station.
Description
Technical field
The present invention relates to cutting apparatus, which has two cuttings cut machined objects such as chips single
Member.
Background technology
The front for the chip being made of semiconductor is divided by a plurality of segmentation preset lines of clathrate arrangement, what is marked off
The devices such as IC are formed in each region.When the chip is finally divided along the segmentation preset lines, each device chip is formed.
In the segmentation of the chip, the cutting apparatus with cutting unit is used.Being equipped on the cutting unit has
The cutting tool of circular cutting edge.The cutting edge of the annular shape of the cutting tool is, for example, the combination to abrasive grain is distributed with
Material is sintered and is formed.
In machining, with the face of the front vertical of machined object in the cutting tool of rotation is located in regulation
Height, so that the cutter and the machined object is relatively moved on the cutting feed direction of the frontoparallel with machined object.
Then, machining is carried out to machined object.
The cutting apparatus has chuck table in the lower section of the cutting unit.The upper surface of the chuck table, which becomes, to be protected
Face is held, which is maintained in the retaining surface.The chuck table can move on the cutting feed direction, and
And it can be rotated around the axis vertical with the retaining surface.The cutting unit can be in the retaining surface with the chuck table
It is moved on parallel and vertical with cutting feed direction index feed direction.
Before carrying out machining to machined object, the relative position of the cutting tool and the machined object is adjusted
Whole (alignment) so as to as be suitable for processing relationship.That is, chuck table is made to be rotated around the axis vertical with the retaining surface
And the segmentation preset lines of machined object is made to be aligned with the cutting feed direction, so that the cutting unit is moved up in the index feed direction
Top dynamic and that the cutting tool is located in the extended line of the segmentation preset lines.Then, implement as described above to being processed
The machining of object.
The cutting apparatus also has in the camera or microscope for implementing to use when alignment, and the photograph is utilized when implementing to be aligned
Camera etc. captures the segmentation preset lines of machined object.
In the cutting apparatus, the machined object of various species can be cut, for example, it is also possible to package substrate
Machining is carried out, which has the frame by formation such as metals, equipped with device chip and passes through on the frame
Resin is sealed.The position of the segmentation preset lines of the package substrate changes with the flexible equal of resin sometimes, because
This comes the appropriate position for capturing segmentation preset lines and implements alignment to be especially important in machining according to each substrate.
But in recent years, the exploitation of the higher cutting apparatus of productivity is widely carried out.For example, developing such as
Under cutting apparatus (referring to patent document 1), which has:Two cutting units, they are respectively provided with cutting tool;
And two chuck tables, they respectively keep machined object.In the cutting apparatus, two cutting unit institutes
The cutting tool being respectively provided with is opposite one another.When using the cutting apparatus, due to can simultaneously implement to two machined objects
Machining, so the productivity of machining improves.
Patent document 1:Japanese Unexamined Patent Publication 2006-156809 bulletins
In the case where having there are two machining is implemented in the cutting apparatus of cutting unit and two chuck tables,
It is also critically important so that cutting tool and machined object is appropriately aligned.In order to accurately and efficiently implement in the cutting apparatus
Alignment, can install two cameras etc. on the cutting apparatus, wherein two cameras can be captured separately point
The machined object not being maintained on two chuck tables.
For example, when camera possessed by the cutting apparatus etc. is one, it can not be in two cutting units and chuck work
Make in platform while implementing to be aligned.Furthermore, it is desirable to make the camera etc. in the superjacent air space movement of two chuck tables, the movement
The time can be spent.On the other hand, when two cameras etc. are installed on the cutting apparatus, due to withouting waiting for camera etc.
Arrival, so precision and the higher machining of productivity can be implemented.
But if just setting is installed and is made each for two cameras etc. on the cutting apparatus only for implementing alignment
Camera etc. can movable independently mechanism, then the structure of the cutting apparatus become complicated, cost is got higher.
Invention content
The present invention is completed in view of the problem, it is intended that cutting apparatus is provided, it can be in tool there are two cutting
It cuts efficient and qurer in the cutting apparatus of unit and two machined objects and implements alignment.
According to one method of the present invention, cutting apparatus is provided, which is characterized in that the cutting apparatus has:First chuck
Workbench and the second chuck table, they are respectively provided with the retaining surface kept to machined object, and with the holding
It is arranged adjacent to each other on the parallel first direction in face;First cutting feed unit and the second cutting feed unit, they are arranged
In first chuck table and the respective lower section of the second chuck table, to first chuck table and can be somebody's turn to do respectively
Second chuck table carries out cutting feed in second direction parallel with the retaining surface and vertical with the first direction;First
Cutting unit and the second cutting unit, they are disposed in the top of first chuck table and second chuck table, energy
It is enough that the machined object kept on first chuck table and the respective retaining surface of second chuck table is cut
Cut processing;First camera and the second camera, they are disposed in first chuck table and second chuck table
Top, can be to the machined object that is kept on first chuck table and the respective retaining surface of second chuck table
It is shot;Camera base station supports first camera and second camera;And camera base station movement
Unit can be such that the camera base station moves in the first direction, and first camera and second camera are according to this
The center of first chuck table and the center of second chuck table in the first direction at a distance from separate and be fixed on
On the camera base station.
The cutting apparatus of one embodiment of the present invention has the first chuck table and the second chuck table, and has
The first cutting unit and the second cutting unit that the machined object kept to each chuck table is cut.Also,
The top of each chuck table has the first camera and the second camera.
When implementing the alignment of first chuck table and first cutting unit, first camera can be used.
Also, when implementing the alignment of second chuck table and second cutting unit, second camera can be used.At this
In cutting apparatus, the first camera and the second camera are supported on a camera base station.
First camera and the second camera according to first chuck table center and second chucking work
The position that the distance at the center of platform is separated is fixed on the camera base station.Therefore, it in the cutting apparatus, takes a picture by first
While machine is located in above the first chuck table, the second camera is located in the top of the second chuck table.Therefore,
It can implement the alignment for having used the alignment of the first camera and having used the second camera simultaneously.
In order to make the first camera and the second camera movement and on the cutting apparatus setting keep each camera only
In the case of founding mobile Liang Ge mobile mechanisms, the structure of cutting apparatus and action become complicated, and cost is got higher.Therefore, at this
In the cutting apparatus of embodiment, the first camera and the second camera are supported on a camera base station and changed jointly.
Thus, it is possible to omit a mobile unit for making camera movement.
Therefore, according to one method of the present invention, cutting apparatus is provided, it can be in cutting unit and two quilts there are two tools
Efficient and qurer implements alignment in the cutting apparatus of machining object.
Description of the drawings
Fig. 1 is the stereogram for schematically showing cutting apparatus.
Fig. 2 is the vertical view of cutting apparatus when schematically showing alignment.
Fig. 3 is the vertical view of cutting apparatus when schematically showing machining.
Label declaration
1a,1b:Machined object;2:Cutting apparatus;4:Device base station;6a,6b:X-axis moving table;8a,8b:X-axis is led
Rail;10a,10b:X-axis ball-screw;12a,12b:X-axis pulse motor;14a,14b:Chuck table;16a,16b:It keeps
Face;18a,18b:Cutting unit;20:Supporting construction;22a,22b:Y-axis moving plate;22c:Y-axis guide rail;24a,24b:Y-axis pulse
Motor;26a,26b:Z axis movable plate;26c,26d:Z axis guide rail;28a,28b:Z axis pulse motor;30:Box lifting platform;
32:Box;34:Cleaning unit;36:Camera base station mobile unit;38:Camera base station movement guide rail;40:Camera base station
Movement ball-screw;42:Camera base station movement pulse motor;44:Camera base station;46a,46b:Camera;
48a,48b:Camera movement mechanism;50a,50b:Lens.
Specific implementation mode
The embodiment of one embodiment of the present invention is illustrated with reference to attached drawing.First, using Fig. 1 to present embodiment
Cutting apparatus illustrate.Fig. 1 is the stereogram for schematically showing the cutting apparatus 2.As shown in Figure 1, the cutting apparatus 2
With the device base station 4 supported to each integral part.
The box lifting platform 30 that can be lifted is provided in the corner in the front of the device base station 4 of cutting apparatus 2.It is lifted in box
The upper surface of platform 30 is placed with the box 32 that can store multiple machined objects.Being provided near the box lifting platform 30 will be added
Transport unit (not shown) of the work object to (aftermentioned) conveyance of chuck table 14a, 14b.
It is equipped on device base station 4:Two X-axis moving tables 6a, 6b, they are adjacent along Y direction;And two pairs
X-axis guide rail 8a, 8b, they extend and support X-axis moving table 6a, 6b respectively as can be in X-axis side in the X-axis direction
Upward sliding.It is respectively arranged with nut portions (not shown), the nut portion in the lower face side of X-axis moving table 6a, 6b
It is not screwed togather with X-axis ball-screw 10a, the 10b for being parallel to X-axis guide rail 8a, 8b.
The one end of X-axis ball-screw 10a, 10b link with X-axis pulse motor 12a, 12b respectively.When utilization X-axis arteries and veins
When rushing motor 12a, 12b makes X-axis ball-screw 10a, 10b rotate respectively, X-axis moving table 6a, 6b is along X-axis guide rail
8a, 8b are moved in the X-axis direction.
The chucking work for being attracted machined object, being kept is separately provided in X-axis moving table 6a, 6b
Platform 14a, 14b.The rotary driving sources such as chuck table 14a, 14b and motor connection (not shown), around (vertical with Z-direction
Direction) substantially parallel rotary shaft rotated.Also, when making X-axis pulse motor 12a, 12b be acted, chuck work
Make platform 14a, 14b and is separately cut feeding (processing feeding) in the X-axis direction.
The front (upper surface) of chuck table 14a, 14b, which respectively becomes, to be attracted machined object 1a, 1b, is kept
Retaining surface 16a, 16b.Retaining surface 16a, 16b (is not schemed by being respectively formed in the flow path of the inside of chuck table 14a, 14b
Show) and connect with source (not shown) is attracted.
The machined object processed using cutting apparatus 2 is illustrated.The machined object 1a, 1b are, for example, package substrate,
The package substrate has the frame by formation such as metals, is sealed on the frame equipped with device chip and by resin.
The a plurality of segmentation preset lines that the front of the package substrate is arranged together in clathrate divide, and are drawn by a plurality of segmentation preset lines
It is formed with the devices such as IC in each region divided.By being finally split to the package substrate along segmentation preset lines, formed each
A device chip.
It is erect in a manner of across two pairs of X-axis guide rails 8a, 8b on the upper surface of device base station 4 and is provided with supporting construction
20.Supporting construction 20 supports cutting unit 18a, 18b (with reference to Fig. 2), and the cutting unit 18a, 18b are respectively to being processed
Object 1a, 1b are cut.A pair of of the Y-axis guide rail 22c parallel with Y direction is equipped on the rear surface top of supporting construction 20
(with reference to Fig. 2).Install in a manner of it can slide that there are two Y-axis moving plates 22a, 22b on Y-axis guide rail 22c.
The back side of Y-axis moving plate 22a is provided with nut portions (not shown), the nut portions and is parallel to Y-axis guide rail 22c
The first Y-axis ball-screw (not shown) screw togather.Also, the back side of Y-axis moving plate 22b is provided with nut portions (not scheme
Show), which screws togather with the second Y-axis ball-screw (not shown) for being parallel to Y-axis guide rail 22c.
The one end of the first Y-axis ball-screw links with Y-axis pulse motor 24a.The one of the second Y-axis ball-screw
End and Y-axis pulse motor 24b (with reference to Fig. 2) connection.When using Y-axis pulse motor 24a make the first Y-axis ball-screw into
When row rotation, Y-axis moving plate 22a is moved in the Y-axis direction along Y-axis guide rail 22c.Also, works as and utilize Y-axis pulse motor
When 24b makes the second Y-axis ball-screw be rotated, Y-axis moving plate 22b is moved in the Y-axis direction along Y-axis guide rail 22c.
It is respectively arranged with the two pair Z axis guide rails parallel with Z-direction on the respective front of Y-axis moving plate 22a, 22b
26c,26d.Z axis movable plate 26a, 26b are installed in a manner of it can slide respectively in Z axis guide rail 26c, 26d.
The back side of Z axis movable plate 26a is provided with nut portions (not shown), the nut portions and is parallel to Z axis guide rail 26c
The first Z axis ball-screw (not shown) screw togather.The one end of the first Z axis ball-screw connects with Z axis pulse motor 28a
Knot, when making the first Z axis ball-screw be rotated using Z axis pulse motor 28a, can make Z axis movable plate 26a along Z
Axis rail 26c is moved in the Z-axis direction.
It is provided with nut portions (not shown) in the back side of Z axis movable plate 26b, the nut portions and is parallel to Z axis guide rail
The second Z axis ball-screw (not shown) of 26d screws togather.The one end of the second Z axis ball-screw and Z axis pulse motor 28b
Connection, when making the second Z axis ball-screw be rotated using Z axis pulse motor 28b, can make Z axis movable plate 26b along
Z axis guide rail 26d is moved in the Z-axis direction.
In the lower part of the face side of Z axis movable plate 26a, 26b, it is respectively fixed with and machined object 1a, 1b is processed
Cutting unit 18a, 18b.If Y-axis moving plate 22a, 22b is made to move in the Y-axis direction, cutting unit 18a, 18b exist respectively
It is moved in Y direction, if Z axis movable plate 26a, 26b is made to move in the Z-axis direction, cutting unit 18a, 18b rise respectively
Drop.
Cutting unit 18a, 18b are respectively provided with circular cutting tool, which is mounted on composition and Y direction
The one end of the main shaft of parallel rotary shaft.The rotary driving sources such as motor are linked in the another side of main shaft, peace can be made
Cutting tool loaded on main shaft is rotated.Cutting tool has discoid base station.It is provided with this in the central portion of base station
The generally circular mounting hole of base station perforation.It is fixed in the peripheral part of base station and cricoid is cut for be cut into machined object
Cut sword.
It is on one side rotated the cutting tool for being installed on cutting unit 18a, is on one side cut into it and is held in chuck work
Make in the machined object 1a of platform 14a, so as to cut machined object 1a.Also, make to be installed on cutting unit on one side
The cutting tool of 18b is rotated, it is made to be cut into the machined object 1b for being held in chuck table 14b on one side, so as to
It is enough that machined object 1b is cut.Since the cutting apparatus 2 of present embodiment has, there are two cutting unit 18a, 18b, so
Can machining be implemented to two machined objects 1a, 1b simultaneously.
It is equipped on the front surface top of supporting construction 20:Camera base station 44, (shooting is single there are two camera for tool
Member) 46a, 46b;And camera base station mobile unit 36, so that the camera base station 44 is moved.The camera base station is moved
Unit 36 is described in detail.
The camera base station mobile unit 36 has parallel with Y direction one on the front surface top of the supporting construction 20
To camera base station movement guide rail 38.Photograph is installed in a manner of it can slide on the camera base station movement guide rail 38
Machine base station 44.The back side of camera base station 44 is provided with nut portions (not shown), the nut portions and is parallel to the camera
The camera base station movement ball-screw 40 of base station movement guide rail 38 screws togather.
The one end of camera base station movement ball-screw 40 links with camera base station movement pulse motor 42.
When making the movement of camera base station be rotated with ball-screw 40 with pulse motor 42 using the movement of camera base station, photograph
Machine base station 44 is moved with guide rail 38 along the camera base station and is moved in Y direction (index feed direction).The camera base
Platform mobile unit 36 is constituted as described above.In addition, the width of the Y direction of the camera base station 44 is than the chuck table
The center of 14a and the center of chuck table 14b in the Y-axis direction at a distance from it is big.
In the positive lower part of camera base station 44, camera 46a, 46b are equipped by Z axis mobile mechanism 48a, 48b.
Camera 46a and camera 46b is according to the center of chuck table 14a and the center of chuck table 14b in the Y
Distance in axis direction is separated and is fixed on the camera base station 44.Camera 46a and camera 46b are respectively in lower section
Side has lens 50a, 50b (with reference to Fig. 2).
When carrying out machining to machined object 1a, by the cutting tool of cutting unit 18a and it is held in chucking work
The relative position adjustment (being hereinafter referred to as aligned) of the machined object 1a of platform 14a is at the relationship for being suitable for processing.
In alignment, the face side of machined object 1a is shot by lens 50a using camera 46a, from
Shooting image determines the position of the segmentation preset lines of machined object 1a.It then, will along the segmentation preset lines of machined object 1a
Cutting tool is positioned to be split machined object 1a.Also the same cutting tool for implementing cutting unit 18b and holding
In the alignment of the machined object 1b of chuck table 14b.
Z axis mobile mechanism 48a, 48b make camera 46a, 46b move in the Z-axis direction respectively.Camera 46a to be made,
When focal length (focus) the alignment machined object of 46b, ShiZZhou mobile mechanisms 48a, 48b are acted.
In cutting apparatus 2, can implement simultaneously the cutting tool of cutting unit 18a and the alignment of machined object 1a and
The alignment of the cutting tool and machined object 1b of cutting unit 18b.It, can be by making camera base station move when implementing to be aligned
Unit 36 is acted and makes two cameras 46a, 46b while movement.
For example, when in order to implement that the when of being aligned keeps two cameras 46a, 46b to be used mobile and in cutting apparatus
In the case of two camera movement units are arranged, due to must individually control two camera movement units, so cutting dress
The action set becomes complicated.In contrast, in the cutting apparatus of present embodiment 2, by the way that two cameras are supported on one
On a camera base station, it can will inhibit cost for making mobile unit commonization of camera movement, and can simplify
The action of cutting apparatus 2.
Other corners in the front of device base station 4 are provided with cleaning unit 34.Cleaning unit 34 for example has in inside
Cleaning space.The machined object after machining is transported to from chuck table 14a, 14b by transport mechanism (not shown)
In the cleaning space.The cleaning unit 34 has the function of being cleaned to the machined object after machining.
It is configured with injection nozzle (not shown) in the inside of cleaning unit 34, the injection nozzle is clear towards machined object injection
The fluid washed (representative is two fluids mixed by water and air).When the fluid from injection nozzle jet cleaning
When, machined object can be cleaned.For example, being processed what cleaned unit 34 cleaned using transport mechanism (not shown)
Object is received into box 32.
Then, using Fig. 2, Fig. 3 to having used the machining of cutting apparatus 2 to illustrate.Fig. 2 is to schematically show
Implement the vertical view of the cutting apparatus 2 when alignment, Fig. 3 is bowing for the cutting apparatus 2 when schematically showing implementation machining
View.
First, the machined object 1a moved out from box 32 using transport mechanism (not shown) is positioned in chuck table 14a
Retaining surface 16a on, make chuck table 14a attracting holding machined objects 1a.Equally, the machined object 1b that will be moved out from box 32
It is positioned on the retaining surface 16b of chuck table 14b, makes chuck table 14b attracting holding machined objects 1b.
Then, implement alignment as shown in Figure 2.First, the movement of camera base station is made to be carried out with pulse motor 42
It acts and camera base station movement ball-screw 40 is made to rotate, to make camera base station 44 move.Then, by camera
The lens 50a of 46a is positioned in the top of the machined object 1a of chuck table 14a, and by the lens of camera 46b
50b is positioned in the top of the machined object 1b of chuck table 14b.
Later, make camera 46a pass through lens 50a to shoot machined object 1a, make chuck table 14a around with guarantor
It holds the vertical axis of face 16a to be rotated, the segmentation preset lines of machined object 1a is made to be aligned with X-direction (cutting feed direction).
Also, Y-axis pulse motor 24a is set to be acted and position cutting unit 18a, so that the cutting tool of cutting unit 18a
It is configured in the top of the extended line of segmentation preset lines.
Meanwhile so that camera 46b is passed through lens 50b and machined object 1b shot, make chuck table 14b around with guarantor
It holds the vertical axis of face 16b to be rotated, the segmentation preset lines of machined object 1b is made to be aligned with X-direction (cutting feed direction).
Also, make Y-axis pulse in the way of configuring the cutting tool of cutting unit 18b in the top of the extended line of segmentation preset lines
Motor 24b is acted and is positioned to cutting unit 18b.
Since the position of segmentation preset lines changes with the flexible equal of resin sometimes, thus to package substrate into
When row machining, come the appropriate position for capturing segmentation preset lines and implement alignment to be especially important according to each substrate.
After alignment is complete, implement machining.First, this rotated respectively of cutting unit 18a, 18b are respectively cut
Cutting knife tool is located in defined height.Then, cutting feed is carried out in the X-axis direction to chuck table 14a, 14b, makes cutting
Cutter is cut into along segmentation preset lines in machined object 1a, 1b.Along 1 segmentation preset lines implement machining it
Afterwards, index feed is carried out to cutting unit 18a, 18b respectively and implements machining along adjacent segmentation preset lines.
Cutting is being implemented respectively along the whole segmentation preset lines of machined object 1a, 1b extended in the X-axis direction
After processing, so that chuck table 14a, 14b is rotated around the axis vertical with retaining surface 16a, 16b respectively and switch and be cut into
To direction, and implement machining.When being cut machined object 1a, 1b respectively along whole segmentation preset lines, cut
It cuts and machines.
Machined object 1a, 1b for implementing machining are transported to cleaning unit 34 using transport mechanism (not shown)
In, implement cleaning respectively and removes the attachments such as processing bit.Machined object 1a, 1b of cleaning are completed by transport mechanism (not
Diagram) it is moved in box 32.
As described above, cutting apparatus 2 according to the present embodiment can utilize two cutting units to implement to be directed to simultaneously
The machining of two machined objects.In the cutting apparatus 2, camera 46a, 46b according to two chuck table 14a,
The position that the distance between centers of 14b is separated is fixed on camera base station 44.It therefore, can be real simultaneously in the cutting apparatus 2
Apply the alignment at two positions.
In order to keep two camera 46a, 46b mobile and on the cutting apparatus setting so that each camera independently is moved
Liang Ge mobile mechanisms in the case of, the structure of cutting apparatus and action become complicated, and cost is got higher.In contrast, in this reality
In the cutting apparatus 2 for applying mode, by the way that two cameras 46a, 46b are supported on a camera base station 44, for making photograph
The mobile unit of camera movement is one.Therefore, in the cutting apparatus of present embodiment, can qurer implement it is efficient
Alignment.
In addition, in the cutting apparatus of the above embodiment, between center of two cameras according to two chuck tables
Distance is separated and is fixed on camera base station, but it's not limited to that for one embodiment of the present invention.As long as being fixed on camera
The distance of two cameras of base station be two cameras can simultaneously to the machined object as respective reference object into
The distance of row shooting.
Also, in the cutting apparatus of the above embodiment, two cameras are fixed on a camera base station, but this
It's not limited to that for one mode of invention.Cutting apparatus can also have two camera bases for supporting two cameras respectively
Platform, nut portions possessed by each back side of two camera base stations are screwed togather with 1 ball-screw.In this case, work as profit
When so that the ball-screw is rotated with pulse motor, since two camera base stations can be made similarly to move, so
Ball-screw and pulse motor are 1 group, and cutting apparatus becomes at a low price.
Also, in one embodiment of the present invention, two cameras possessed by cutting apparatus can have both high power respectively
Rate lens and low range lens, it is possible to have the lens of a variable power.Also, in the resin-encapsulated base that will be stretched
For plate etc. as in the case of machined object, camera can also be set as making the flexible shooting for being included in camera of machined object to regard
In open country.
As long as in addition, the construction of the above embodiment, method etc. just can in the range of not departing from the purpose of the present invention
It suitably changes and implements.
Claims (1)
1. a kind of cutting apparatus, which is characterized in that
The cutting apparatus has:
First chuck table and the second chuck table, they are respectively provided with the retaining surface kept to machined object, and
And it is arranged adjacent to each other on the first direction parallel with the retaining surface;
First cutting feed unit and the second cutting feed unit, they are disposed in first chuck table and second chuck
The respective lower section of workbench, can be respectively to first chuck table and second chuck table parallel with the retaining surface
And cutting feed is carried out in the second direction vertical with the first direction;
First cutting unit and the second cutting unit, they are disposed in first chuck table and second chuck table
Top, can be to the machined object that is kept on first chuck table and the respective retaining surface of second chuck table
Carry out machining;
First camera and the second camera, they are disposed in the upper of first chuck table and second chuck table
Side, can to the machined object that is kept on first chuck table and the respective retaining surface of second chuck table into
Row shooting;
Camera base station supports first camera and second camera;And
Camera base station mobile unit can be such that the camera base station moves in the first direction,
The center and second chuck table of first camera and second camera according to first chuck table
The distance of center in the first direction is separated and is fixed on the camera base station.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017075149A JP2018181931A (en) | 2017-04-05 | 2017-04-05 | Cutting device |
| JP2017-075149 | 2017-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108687979A true CN108687979A (en) | 2018-10-23 |
Family
ID=63844645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810262192.1A Pending CN108687979A (en) | 2017-04-05 | 2018-03-28 | Cutting apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018181931A (en) |
| KR (1) | KR20180113165A (en) |
| CN (1) | CN108687979A (en) |
| TW (1) | TW201839834A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111497047A (en) * | 2019-01-30 | 2020-08-07 | 株式会社迪思科 | Origin position registration method for cutting device |
| CN112223501A (en) * | 2020-10-13 | 2021-01-15 | 沈阳汉为科技有限公司 | Novel honeycomb ceramic mould fluting device |
| US20220084857A1 (en) * | 2020-09-16 | 2022-03-17 | Globalwafers Co., Ltd. | Cleaved semiconductor wafer imaging system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114683423A (en) * | 2022-06-01 | 2022-07-01 | 沈阳和研科技有限公司 | Microscope structure of scribing machine |
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- 2017-04-05 JP JP2017075149A patent/JP2018181931A/en active Pending
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2018
- 2018-03-08 TW TW107107807A patent/TW201839834A/en unknown
- 2018-03-28 KR KR1020180035925A patent/KR20180113165A/en not_active Application Discontinuation
- 2018-03-28 CN CN201810262192.1A patent/CN108687979A/en active Pending
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| JPH10141932A (en) * | 1996-11-07 | 1998-05-29 | Fujitsu Ltd | Method and device for inspecting pattern |
| CN1582393A (en) * | 2001-11-05 | 2005-02-16 | 奥林巴斯株式会社 | Substrate inspecting device |
| CN1781684A (en) * | 2004-11-30 | 2006-06-07 | 株式会社迪斯科 | Cutting machine |
| CN1672855A (en) * | 2005-04-20 | 2005-09-28 | 艾逖恩机电(深圳)有限公司 | Ultrasonic wire welding method and apparatus |
| CN1931551A (en) * | 2005-09-12 | 2007-03-21 | 株式会社迪斯科 | Cutting apparatus and processing method |
| CN1943981A (en) * | 2005-10-06 | 2007-04-11 | 株式会社迪斯科 | Apparatus for exchanging cutting blade |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111497047A (en) * | 2019-01-30 | 2020-08-07 | 株式会社迪思科 | Origin position registration method for cutting device |
| CN111497047B (en) * | 2019-01-30 | 2024-03-15 | 株式会社迪思科 | Origin position registration method for cutting device |
| US20220084857A1 (en) * | 2020-09-16 | 2022-03-17 | Globalwafers Co., Ltd. | Cleaved semiconductor wafer imaging system |
| US11921054B2 (en) | 2020-09-16 | 2024-03-05 | Globalwafers Co., Ltd. | Cleaved semiconductor wafer camera system |
| CN112223501A (en) * | 2020-10-13 | 2021-01-15 | 沈阳汉为科技有限公司 | Novel honeycomb ceramic mould fluting device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201839834A (en) | 2018-11-01 |
| JP2018181931A (en) | 2018-11-15 |
| KR20180113165A (en) | 2018-10-15 |
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