JP5610123B2 - Dicing machine - Google Patents

Description

  The present invention relates to a dicing apparatus that divides a workpiece on which a semiconductor device or an electronic component is formed into individual chips.

  When dicing is performed using a dicing apparatus, an image of a kerf by a cutting blade (blade) is taken, and the pitch feed of the street is corrected based on the amount of deviation from the reference position of the kerf (kerf check). When heat is generated by dicing, the center of the kerf and the reference line of the microscope may deviate due to a difference in thermal expansion between the blade axis and the microscope. When such a shift occurs, there is a problem in that the shifted position is actually grooved even though the reference line of the microscope is aligned with the center of the street.

  In Patent Document 1, the dummy workpiece W is grooved with a blade, and the amount of deviation between the center of the kerf and the reference line of the microscope due to the difference in thermal expansion between the blade axis and the microscope is calculated and calculated. There is disclosed a dicing apparatus that corrects the Y-direction pitch feed amount of the next street based on the shift amount and cuts the next street (see FIGS. 6 and 7).

  Patent Document 2 discloses a dicing apparatus in which cutting means and optical means are respectively attached to a movable base and can be driven separately (see FIG. 8).

  Patent Document 3 discloses a dicing apparatus in which a spindle is disposed on the left side surface of a portal guide base and a microscope is disposed on the right side surface of the guide base (see FIG. 9).

Japanese Patent Laid-Open No. 11-260763 JP 2004-303931 A JP 2003-163178 A

  In the invention described in Patent Document 1, as shown in FIG. 6, the axis of the spindle 101 and the microscope 102 are arranged so as to be shifted by a distance X in the X direction via the connecting member 103. As shown by the dotted line in FIG. 6, the connecting member 103 is deformed so as to be warped by heat, so that the distance between the axis of the spindle 101 and the microscope 102 changes from the distance B to the distance B ′. The displacement B′-B of the arrangement position of the spindle 101 and the microscope 102 increases as the distance B increases.

  However, in the invention described in Patent Document 1, only the difference in thermal expansion between the axis of the blade (that is, the axis of the spindle 101) and the microscope is considered, and the reference line of the microscope generated by the deformation of the connecting member 103 and the cutting are considered. There is a problem that the deviation from the position is not considered.

  In the invention described in Patent Document 2, the cutting means 111 is directly disposed on the movable base 113, whereas the optical means 112 is disposed on the movable base 113 via the optical driving means 114. Similar to the invention described in Document 1, the optical drive unit 114 is not considered to be deformed by heat and the defects caused thereby.

  In the invention described in Patent Document 3, the spindle 121 and the microscope 122 are both disposed on the guide base 123. However, since the spindle 121 is disposed on the left side surface of the guide base, the microscope 122 is disposed on the right side surface of the guide base 123. Therefore, the X-direction misalignment between the spindle 121 and the microscope 122 is not possible. Is very big. Therefore, even if the deformation of the guide base 122 and the mounting member due to heat is small, there is a problem that the deviation between the reference line of the microscope and the cutting position due to the deformation becomes large.

  The present invention has been made in view of such circumstances, and reduces errors in changes due to heat of the spindle axis and the arrangement position of the microscope in the X direction, thereby reducing the error between the reference line and the actual cutting position. It aims at providing the dicing apparatus which can be made small.

In order to achieve the above object, according to the present invention, the invention described in claim 1 includes a work table movably arranged in a first direction, a spindle, and a blade attached to the tip of the spindle. A cutting means for cutting the work placed on the work table in accordance with preset processing conditions, and a photographing means for taking a magnified image of a part of the work placed on the work table with a microscope And an imaging means disposed so that an optical axis is parallel to a second direction orthogonal to the first direction, the cutting means and the imaging means are attached to the same member, The axis of the spindle and the optical axis of the photographing means are arranged in a substantially straight line along the second direction when viewed from a third direction orthogonal to the first direction and the second direction. It is specially To.

  According to the first aspect of the present invention, the spindle axis and the optical axis of the photographing means are arranged so as to be aligned substantially along the second direction when viewed from the third direction. Accordingly, it is possible to reduce errors in the amount of change in the position of the spindle axis in the first direction and the amount of change in the position in the first direction of the optical axis of the microscope due to heat. Therefore, the error between the reference line generated by heat and the actual cutting position can be reduced.

  According to the first aspect of the present invention, the spindle axis and the optical axis of the photographing means are arranged in a straight line along the second direction when viewed from the third direction. Therefore, the alignment area and the cutting area are the same. Thereby, a cutting process can be performed without moving the work table after alignment. Therefore, the error between the reference line due to the movement of the work table and the actual cutting position can be reduced. Moreover, the movement distance of the work table can be shortened to save space.

According to a second aspect of the present invention, in the dicing apparatus according to the first aspect, the cutting member and the photographing unit are attached to a predetermined plane parallel to the second direction, and are the same supporting member. A first attachment means for attaching the cutting means to the predetermined plane, the first attachment means being attached movably in the second direction and the third direction, and the photographing means being attached to the predetermined plane. Second mounting means for mounting on a plane, wherein the second mounting means is mounted so as to be movable in the third direction.

  According to the second aspect of the present invention, the cutting means and the photographing means are attached to a predetermined plane parallel to the second direction of the support member via the first attachment means and the second attachment means. Thereby, it is possible to prevent the arrangement positions of the cutting means and the photographing means from changing in the first direction due to thermal expansion or the like. Therefore, the error between the reference line generated by heat and the actual cutting position can be reduced.

The invention described in claim 3 is the dicing apparatus according to claim 2, wherein the second attachment means is characterized by attaching the imaging means to be movable in the second direction.

  According to the invention described in claim 3, the photographing means is arranged to be movable in the second direction. Thereby, the imaging means can be moved downward during alignment, and the imaging means can be moved upward after alignment. Therefore, it is possible to prevent the cutting water from being attached or affected by temperature changes due to the cutting water.

  According to the present invention, it is possible to reduce an error in change due to heat of the spindle axis and the arrangement position in the X direction of the microscope, and to reduce an error between the reference line and the actual cutting position.

It is a perspective view which shows the external appearance of the dicing apparatus 10 which concerns on this invention. 2 is a perspective view of a main part of a processing unit of the dicing apparatus 10. FIG. 3 is a plan view of a main part of a processing unit of the dicing apparatus 10. FIG. 2 is a side view of a main part of a processing part of the dicing apparatus 10. FIG. 2 is a side view of a main part of a processing part of the dicing apparatus 10. FIG. It is the schematic of the process part of the conventional dicing apparatus. It is the schematic of the process part of the conventional dicing apparatus. It is the schematic of the process part of the conventional dicing apparatus. It is the schematic of the process part of the conventional dicing apparatus.

  Hereinafter, preferred embodiments of a dicing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view showing an external configuration of a dicing apparatus to which the present invention is applied. As shown in the figure, the dicing apparatus 10 according to the present embodiment mainly includes a supply / collection unit 12 that supplies and collects a workpiece W to be processed, a processing unit 14 that processes the workpiece W, and a workpiece after processing. A cleaning unit 16 that cleans W, a transport unit 18 that transports the workpiece W, an operation panel 20 that performs various operations, and a control unit (not shown) that controls the overall operation.

  The supply / collection unit 12 that supplies and collects the workpiece W includes a load port 22, and a cassette (not shown) in which a number of workpieces W are stored is set in the load port 22. The workpiece W to be processed is stored in a cassette in a state where it is mounted on a predetermined frame F via a tape T.

  As shown in FIG. 2, the processing unit 14 that processes the work W mainly includes a work table 24 that sucks and holds the work W, and a pair of blades 26 </ b> A and 26 </ b> B that cut the work W held on the work table 24. The spindles 28A and 28B to which the blades 26A and 26B are attached, and the camera unit 50 that magnifies and photographs the surface of the work W held on the work table 24.

  The work table 24 is provided on the X-axis table 30 and the θ-axis table 38 that are installed horizontally, and is driven by the θ-axis table 38 to rotate around a central axis (θ-axis, not shown). .

  The X-axis table 30 is slidably provided on a pair of X-axis guides 34 and 34 that are horizontally disposed at a predetermined interval on an X-axis base 32 that is horizontally disposed. A linear motor 36 is disposed between the pair of X-axis guides 34, 34, and the X-axis table 30 is driven by the linear motor 36 so that the top of the X-axis guides 34, 34 is illustrated. Slide in the X direction. The X-axis table 30 slides on the X-axis guides 34, 34, whereby the work table 24 moves horizontally in the X direction in the figure.

  The blades 26A and 26B are electrodeposition blades obtained by electrodepositing diamond abrasive grains and CBN abrasive grains formed in a thin disk shape with nickel, resin blades bonded with resin, and the like. Do. The blades 26A and 26B are attached to the tips of the spindles 28A and 28B so that the cutting direction thereof is parallel to the moving direction (X direction in the drawing) of the work table 24, and are driven by the spindles 28A and 28B. Rotate. A cutting nozzle (not shown) is provided in the vicinity of the blades 26A and 26B, and cutting water is supplied from the nozzle to the processing point.

  The spindles 28 </ b> A and 28 </ b> B are arranged opposite to each other above the work table 24 so that the rotation axis is orthogonal to the moving direction of the work table 24, and are rotated at a high speed of 30,000 rpm to 80,000 rpm.

  The spindles 28A and 28B are attached to the Z-axis tables 40A and 40B for blades installed vertically. The blade Z-axis tables 40A and 40B are slidably provided on a pair of blade Z-axis guides 44 and 44 provided on the blade Y-axis tables 42A and 42B, respectively. The Z-axis tables for blades 40A and 40B are driven by driving means (for example, a feed screw mechanism) (not shown) provided on the Z-axis tables for blades 40A and 40B so as to move on the Z-axis guides for blades 44 and 44. Slide in the Z direction (direction perpendicular to the XY plane). As a result, the blades 26 </ b> A and 26 </ b> B move vertically in the Z direction and move forward and backward with respect to the work table 24.

  The blade Y-axis tables 42A and 42B provided with the blade Z-axis tables 40A and 40B are slidably provided on a pair of blade Y-axis guides 48 provided on the mounting surface 46a of the Y-axis base 46. ing. The Y-axis base 46 is formed in a portal shape, and is erected vertically across the X-axis base 32. The blade Y-axis tables 42A and 42B are driven by a driving means (not shown) provided on the Y-axis base 46 (for example, a feed screw mechanism) and slide on the blade Y-axis guide 48 in the Y direction. As a result, the blades 26A and 26B move horizontally in the Y direction, and their cutting positions change.

  The camera unit 50 includes a microscope 50a (see FIG. 3) that magnifies a subject image, and a camera (electronic camera) that captures an image magnified by the microscope 50a. The camera unit 50 is installed at a position above the work table 24 so that the optical axis of the microscope 50a is vertically downward, and photographs the work W held on the work table 24 so as to look down from directly above.

  The camera unit 50 is attached to a camera Z-axis table 52 installed vertically. The camera Z-axis table 52 is slidably provided on a pair of camera Z-axis guides 54 provided on the camera Y-axis table 56. The camera Z-axis table 52 is driven by driving means (for example, a feed screw mechanism) (not shown) provided on the camera Y-axis table 56 and slides on the camera Z-axis guide 54 in the Z direction. Thereby, the camera unit 50 moves vertically in the Z direction and moves forward and backward with respect to the work table 24.

  The camera Y-axis table 56 provided with the camera Z-axis table 52 is slidably provided on a pair of camera Y-axis guides 58 provided on the mounting surface 46 a of the Y-axis base 46. The camera Y-axis table 56 is driven by driving means (not shown) provided on the Y-axis base 46 (for example, a feed screw mechanism), and slides on the camera Y-axis guide 58 in the Y direction. As a result, the camera unit 50 moves horizontally in the Y direction, and the shooting position in the horizontal direction is changed.

  As shown in FIG. 3, when viewed from the Z direction, the camera unit 50 is on a straight line L in which the center of the microscope 50a and the centers of the blades 26A and 26B, that is, the rotation axes of the spindles 28A and 28B are parallel to the Y direction. It arrange | positions so that it may line up. That is, the arrangement positions of the microscope 50a and the spindles 28A and 28B in the X direction coincide with each other.

  In the conventional dicing apparatus, as shown in FIG. 7, the spindle 101 and the microscope 102 are separated by a distance B in the X direction via the connecting member 103. Therefore, the distance B in the X direction changes due to deformation of the connecting member due to heat, and an error occurs between the cutting position recognized by the control unit, that is, the reference line and the actual cutting position.

  On the other hand, in the dicing apparatus 10, the spindles 28 </ b> A and 28 </ b> B and the camera unit 50 are respectively attached to the attachment surface 46 a of the Y-axis base 46. Even if heat is generated, there is no change in the reference mounting surface 46a. Further, since the spindles 28A and 28B and the camera unit 50 are substantially in a straight line (straight line L), the distance between the mounting surface 46a and the spindles 28A and 28B and the distance between the mounting surface 46a and the camera unit 50 are substantially the same. It is. Therefore, even if heat is generated and thermal expansion occurs, the arrangement position of the camera unit 50 in the X direction and the arrangement position of the spindles 28A and 28B in the X direction do not change significantly. Therefore, it is possible to prevent the reference line of the microscope 50a from being displaced from the cutting position due to thermal expansion or deformation of the member.

  Further, in the conventional dicing apparatus, as shown in FIG. 7, since the spindle 101 and the microscope 102 are separated from each other by a distance B in the X direction, an alignment area B is required in addition to the processing area A. Therefore, the X-axis stroke of the work table is C, which is the sum of the machining area A and the alignment area B. Further, it is necessary to move the work table by B in the X direction after alignment, and an error occurs between the cutting position recognized by the control unit, that is, the reference line and the actual cutting position.

  On the other hand, in the dicing apparatus 10 of the present embodiment, the microscope 50a and the rotation axes of the spindles 28A and 28B are arranged on a straight line L parallel to the Y direction, that is, the processing area and the alignment area are substantially the same. Become. Accordingly, since the X-axis stroke of the work table 24 is shortened to the machining area A only, space can be saved. Moreover, since it is not necessary to move the work table 24 after alignment, it is possible to prevent an error from occurring between the reference line and the actual cutting position.

  The processing unit 14 configured as described above makes the rotating blades 26A and 26B contact the surface of the work W held on the work table 24 while moving the work table 24 holding the work W horizontally. Then, the work W is divided into a rhinoid shape.

  As shown in FIG. 1, the cleaning unit 16 includes a spin cleaning device 16A, and the processed workpiece W is spin cleaned by the spin cleaning device 16A.

  The transport unit 18 includes a handling robot 18A, and the handling robot 18A transports the workpiece W between the units. That is, the handling robot 18A takes out the workpiece W from the cassette of the supply / recovery unit 12 and transports it to the processing unit 14, and also collects the workpiece W processed by the processing unit 14 from the processing unit 14 to obtain a cleaning unit. 16 to transport. Further, the workpiece W after being cleaned by the cleaning unit 16 is recovered from the cleaning unit 16, transported to the supply / recovery unit 12, and stored in the cassette of the supply / recovery unit 12.

  The operation panel 20 includes a display 20A that displays predetermined information and a touch panel 20B disposed on the display screen of the display.

  Next, a dicing method using the dicing apparatus 10 will be described.

  When a cassette storing a large number of workpieces W is placed on the load port 22, the workpieces W are pulled out of the cassette by the transport unit 18 and placed on the work table 24. When the work W is placed on the work table 24, a suction means (not shown) is activated, and the work W is sucked and held on the work table 24.

  The work table 24 holding the work W in this way is moved to a position immediately below the camera unit 50 (see the dotted line in FIG. 3). When the work table 24 is positioned directly below the camera unit 50, the camera unit 50 is moved downward (-z direction) as shown in FIG.

  The control unit compares the image captured by the camera unit 50 with the image of the workpiece W stored in advance, and performs alignment using a pattern matching method. Thereby, the position where the workpiece W is to be cut is detected.

  When the alignment is completed, as shown in FIG. 5, the camera unit 50 is moved upward (+ Z direction) so as to be positioned above the blade Y-axis tables 42A and 42B (about 200 mm), and the camera unit 50 is moved to the blade. Disposed above the Y-axis tables 42A and 42B. As a result, the spindles 28A and 28B can move in the Y direction. In the dicing apparatus 10, the cutting positions of the microscope 50a and the blades 26A and 26B are substantially the same. Therefore, it is not necessary to move the work table 24 in the X direction after the alignment and before entering the cutting process.

  Next, a precise alignment operation between the street and the blades 26A and 26B is performed. That is, the blade Y-axis tables 42A and 42B slide on the blade Y-axis guide 48, and the blades 26A and 26B are moved in the Y direction until the positions of the blades 26A and 26B coincide with the positions (streets) to be cut. Moved horizontally.

  After the precision alignment operation, the blades 26A and 26B are cut and fed by a predetermined amount in the Z direction and rotated in a predetermined direction, and the work table 24 on which the workpiece W is sucked and held is moved in the X direction (blade 26A, The workpiece W held on the workpiece table 24 is cut along a predetermined street by the blades 26A and 26B by moving at a predetermined cutting feed speed in a direction orthogonal to the rotation axis of 26B (cutting process). .

  At the time of cutting, cutting water is supplied to the processing point from the cutting nozzle as necessary. However, since the camera unit 50 is disposed above the blade Y-axis tables 42A and 42B during the cutting process, the cutting water can be prevented from adhering to the camera unit 50. Further, it is possible to prevent the temperature change caused by the cutting water, that is, the change of the arrangement position of the camera unit 50 and the arrangement positions of the spindles 28A and 28B in the X direction.

  When the work W is cut along a predetermined street in this way, the work table 24 is indexed and fed by the street interval in the Y direction, and the cutting operation is performed again. When the cutting operation is performed along all the streets extending in the predetermined direction of the work W, the work table 24 is rotated by 90 degrees and along the street extending in the direction orthogonal to the predetermined direction of the work W. By executing the cutting operation, all the streets formed in a lattice shape on the work W are cut and divided into individual chips. The divided chips do not fall apart due to the action of the tape T, and the state of the workpiece W supported by the frame F is maintained.

  When the cutting operation is completed along the street of the workpiece W, the workpiece table 24 is returned to the position where the workpiece W is first sucked and held. Then, the suction holding of the workpiece W is released.

  Next, the workpiece W is transferred to the cleaning unit 16 by the transfer unit 18. The workpiece W conveyed to the cleaning unit 16 is cleaned and dried here. The workpiece W cleaned and dried in this manner is carried out to the temporary placement table 15 by the transport unit 18. The workpiece W is stored in a predetermined position of the cassette of the supply / collection unit 12 by the transport unit 18.

  As described above, according to the present embodiment, the optical axis of the microscope and the rotation axis of the spindle (blade cutting position) are arranged side by side on a straight line L parallel to the Y direction. Further, the spindle and the camera unit are attached to the same surface of the same member. Therefore, an error between the amount of change in the X-direction position of the optical axis of the microscope due to heat and the amount of change in the X-direction position of the spindle axis can be reduced. Therefore, the error between the reference line generated by heat and the actual cutting position can be reduced.

  In this embodiment, since the optical axis of the microscope and the rotation axis of the spindle are arranged side by side on a straight line L parallel to the Y direction, the cutting process is performed without moving the work table after alignment. It can be carried out. Therefore, the error between the reference line due to the movement of the work table and the actual cutting position can be reduced.

  Further, according to the present embodiment, since the camera unit and the rotation axis of the spindle are arranged side by side on the straight line L parallel to the Y direction, the X-axis stroke of the work table 24 is shortened, and space is saved. Can be

  In this embodiment, the camera unit 50 is moved in the −Z direction at the time of alignment, and the camera unit 50 is moved in the + Z direction after the alignment is completed. However, the alignment is performed without moving the camera unit 50 in the −Z direction. If possible, it is not necessary to move the camera unit 50 in the −Z direction during alignment. Conversely, if it does not interfere with the cutting process, it is not necessary to move the camera unit 50 in the + Z direction after the alignment is completed.

  In this embodiment, the camera unit 50 is moved in the + Z direction after alignment so as not to be affected by the cutting water. However, a mechanism for generating a downflow is provided adjacent to the camera unit 50 to provide a camera. In addition to moving the unit 50 in the + Z direction, by generating a downflow, it is also possible to prevent the influence of the adhesion of cutting water and the temperature change caused by the cutting water.

  In the present embodiment, the full auto dicing apparatus has been described as an example, but the present invention can also be applied to a manual dicing apparatus. In the present embodiment, one camera unit is provided, but a camera unit may be provided for each spindle.

  In the present embodiment, the dicing apparatus that cuts the workpiece using the blade disposed at the tip of the spindle has been described as an example. However, the workpiece can be made incident by entering a laser beam having a focused point inside the workpiece. You may make it use the laser dicing apparatus which cuts. In this case, the laser head for irradiating laser light and the microscope may be attached to the same surface of the same component and arranged so as to be aligned on the same straight line along the Y direction.

  W ... Work, T ... Tape, F ... Frame, 10 ... Dicing machine, 12 ... Supply / collection unit, 14 ... Processing unit, 16 ... Cleaning unit, 18 ... Conveying unit, 20 ... Operation panel, 22 ... Load port, 24 ... Work table, 26A, 26B ... Spindle, 28A, 28B ... Blade, 40A, 40B ... Z-axis table for blade, 42A, 42B ... Y-axis table for blade, 44 ... Z-axis guide for blade, 46 ... Y-axis base, 48 ... Y-axis guide for blade, 50 ... Camera unit, 52 ... Z-axis table for camera, 54 ... Z-axis guide, 56 ... Y-axis table for camera, 58 ... Y-axis guide for camera

Claims (3)

A work table arranged to be movable in a first direction;
A cutting means having a spindle and a blade attached to the tip of the spindle, and cutting a workpiece placed on the work table according to preset machining conditions;
An imaging means for enlarging and photographing a part of the work placed on the work table with a microscope, the optical axis being arranged so as to be parallel to a second direction orthogonal to the first direction. Photographing means,
With
The cutting means and the photographing means are attached to the same member,
The axis of the spindle and the optical axis of the photographing means are arranged in a substantially straight line along the second direction when viewed from a third direction orthogonal to the first direction and the second direction. 2. A dicing apparatus characterized by being disposed in A support member that is the same member, wherein the cutting means and the photographing means are attached to a predetermined plane parallel to the second direction;
First attaching means for attaching the cutting means to the predetermined plane, wherein the first attaching means is movably attached in the second direction and the third direction;
Second attachment means for attaching the photographing means to the predetermined plane, wherein the second attachment means is movably attached in the third direction;
The dicing apparatus according to claim 1, further comprising: The dicing apparatus according to claim 2 , wherein the second attaching unit attaches the photographing unit so as to be movable in the second direction.

Images