JP4916215B2 - Wafer cutting equipment - Google Patents

Wafer cutting equipment Download PDF

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JP4916215B2
JP4916215B2 JP2006126111A JP2006126111A JP4916215B2 JP 4916215 B2 JP4916215 B2 JP 4916215B2 JP 2006126111 A JP2006126111 A JP 2006126111A JP 2006126111 A JP2006126111 A JP 2006126111A JP 4916215 B2 JP4916215 B2 JP 4916215B2
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cutting
inspection
wafer
cutting blade
blade
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JP2007296604A (en
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大介 佐藤
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株式会社ディスコ
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Description

  The present invention relates to a wafer cutting apparatus suitable for use in wafer cutting such as cutting and dividing a semiconductor wafer with a cutting blade into individual semiconductor chips or forming cutting grooves in a semiconductor wafer.

  Semiconductor chips are divided into a large number of rectangular chip regions by forming lines to be divided on a surface of a wafer made of a semiconductor substrate material such as a silicon wafer in a lattice shape, and then on the surface of these chip regions, an electronic device such as an IC or LSI is formed. A circuit is formed, and then the back surface of the wafer is ground to thin the wafer to a target thickness. Thereafter, the wafer is cut and divided along a predetermined division line. In order to cut a wafer, a cutting device of a type in which a thin disk-shaped cutting blade is rotated at a high speed and cut into a wafer has been widely used. As a wafer cutting technique using a cutting blade, for example, Patent Documents 1 and 2 are known. As described in these documents, as a cutting blade for wafer cutting, a blade having a V-shaped cross section is often used.

  By the way, as the cutting blade is used, the cutting edge wears, and the cross-sectional shape of the cutting edge is rounded and deformed into an R shape. When the cutting edge is worn, the sharpness is naturally deteriorated so that it is replaced. However, it is necessary to determine the degree of wear and determine whether or not the blade can be replaced. Conventionally, for example, a cutting blade is cut to about half the thickness of a wafer for inspection of the same material as the wafer, and the cross-sectional shape of the cutting groove of the inspection wafer is observed with a microscope or the like to deform the cutting edge. From the state, it was judged whether or not the wear was within an allowable range.

JP-A-10-64854 JP 2003-124431 A

  However, in order to determine whether or not the cutting blade needs to be replaced by the above method, the process of setting the inspection wafer, cutting the inspection wafer, taking out the inspection wafer, and setting the inspection wafer to the microscope is performed. Therefore, there is a problem that it is complicated and a burden on the operator is large, and the interruption time of the cutting process during that time becomes long, leading to a decrease in productivity.

  Therefore, according to the present invention, it is possible to quickly and easily check the wear state of the cutting blade and determine whether or not it is necessary to replace the wafer, thereby reducing the burden on the operator and improving the productivity. The object is to provide a device.

The present invention provides a holding table that holds a wafer, a cutting means that is provided so as to be able to advance and retreat with respect to the wafer held on the holding table, and that cuts the wafer with a cutting blade, and the holding table and the cutting means. A moving means that moves relative to the direction, a test material that is disposed at a predetermined position within a moving range of the cutting blade that is moved by the moving means, and a cutting state of the test material by the cutting blade. Observation material for observation, and the inspection material is provided movably between a cutting position observed by the observation device and a retraction position retracted from the cutting position, and at least the inspection material at the retraction position the cutting blade moving is set so as not to interfere, the test material, that has a driving source for moving between a cutting position and a retracted position It is a symptom.

  According to the cutting device of the present invention, the wear state of the cutting blade is inspected as follows. After a predetermined amount of cutting (such as cutting or grooving) is performed on the wafer with the cutting blade, the cutting blade is moved to the inspection material to cut the inspection material. The cutting of the inspection material is preferably a cutting form in which a cutting groove or the like is formed so that the cutting edge shape of the cutting blade can be determined. Next, the shape of a cutting mark (for example, a cutting groove) by the cutting blade formed on the inspection material is observed by an observation means, and the wear state of the blade edge is known from the shape, that is, the cutting state, and the cutting blade is replaced. Judgment is necessary.

  According to the present invention, after a predetermined amount of cutting on the wafer is finished, the cutting blade is moved to the inspection material as it is to cut the inspection material, and then the shape of the cut trace of the inspection material is observed by the observation means. Thus, the wear state of the cutting blade can be inspected and the necessity of replacement can be determined. Therefore, the object can be achieved quickly and easily without requiring many processes for the inspection of the wear state as in the prior art. The predetermined amount of cutting for the wafer is a cycle for inspecting the wear state, which is determined by the material of the wafer to be cut and the cutting blade, for example, every wafer or every five wafers, Set variously.

Further, according to the present invention, the inspection material is arranged at a predetermined position within the moving range of the cutting blade, and is freely movable between a cutting position observed by the observation means and a retreat position retracted from the cutting position. The inspection material that is provided and at least in the retracted position is set so that the moving cutting blade does not interfere, and is moved between the cutting position and the retracted position by the drive source. For this reason, it is possible to smoothly cut the inspection material continuously after the wafer cutting. Further, it is possible to avoid that the cutting blade or a part that moves integrally with the cutting blade interferes with the inspection material and cannot perform cutting for inspection .

  The present invention includes a standard data storage unit in which standard data on a good cutting state by a cutting blade is stored, an inspection data input unit in which inspection data on a cutting state of a cutting blade inspection material observed by an observation unit is input, A control having a determination unit that compares the standard data stored in the standard data storage unit with the inspection data input to the inspection data input unit and determines whether the inspection data is within the allowable range of the standard data According to this embodiment including the embodiment provided with the means, it is possible to automate the process of observing the cutting state (cutting marks) of the inspection material by the cutting blade with the observation means and determining whether or not the replacement is necessary. This will further reduce the burden and speed up the work.

  Examples of the observation means of the present invention include imaging means such as a camera. Moreover, if it is a cutting device provided with the imaging means for detecting the cutting position of a wafer, the imaging means can be diverted as an observation means.

  According to the wafer cutting device of the present invention, an inspection material that is cut with a cutting blade and in which the wear state of the cutting blade is inspected according to the cutting state, and an observation means that observes the cutting state of the cutting blade transferred to the inspection material Therefore, the wear state of the cutting blade and the necessity of replacement can be determined quickly and easily, thereby reducing the burden on the operator and improving productivity. There is an effect that can be.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a wafer cutting apparatus 10 according to an embodiment, and FIG. 2 shows a disk-shaped semiconductor wafer 1 cut by the wafer cutting apparatus 10. A semiconductor wafer (hereinafter abbreviated as “wafer”) 1 is a silicon wafer or the like having a diameter of about 150 to 300 mm and a thickness of about 600 μm to 300 μm, for example. It is targeted for cutting. On the surface of the wafer 1, a plurality of rectangular semiconductor chips (devices) 3 are partitioned by grid-like division planned lines 2. An electronic circuit (not shown) such as an IC or an LSI is formed on the surface of the semiconductor chip 3. The wafer cutting device 10 cuts the division line 2 and divides the wafer into individual semiconductor chips 3.

  The cutting device 10 has a substantially rectangular parallelepiped base 11, and a positioning mechanism 12 is provided on a horizontal upper surface of the base 11, and a cassette 13 is clockwise around the positioning mechanism 12. A cutting mechanism 14 and a cleaning unit 15 are arranged. A plurality of wafers 1 are stacked and stored in the cassette 13. In this case, as shown in FIG. 3, the wafer 1 is held on a dicing tape 5 affixed to an annular dicing frame 6 with the back surface thereof being affixed and held with the front surface facing upward. 6 is stored in the cassette 13.

  A single dicing frame 6 (a dicing frame 6 with a wafer) holding the wafer 1 is taken out from the cassette 13 via a dicing tape 5 by a clamp 16, and the dicing frame 6 includes a pair of positioning mechanisms 12. After being sandwiched between the guide bars 12 a and held at a fixed position, the guide bar 12 a is moved to the cutting mechanism 14. Then, the wafer 1 is cut and divided along the planned dividing line 2 by the cutting mechanism 14 and separated into a large number of semiconductor chips 3.

  A large number of semiconductor chips 3 separated by the cutting mechanism 14 are in a state where the form of the wafer 1 is held while adhering to the dicing tape 5, and then the wafer 1 (separated into a large number of semiconductor chips 3 is separated. The dicing frame 6 that holds the wafer is transferred to the cleaning unit 15 via the positioning mechanism 12, and the wafer (many semiconductor chips 3) 1 is cleaned by the cleaning unit 15. Thereafter, the dicing frame 6 holding a large number of semiconductor chips 3 is returned again to the cassette 13 via the positioning mechanism 12. On the base 11, a transfer robot (not shown) for transferring the dicing frame 6 is provided.

The above is the schematic operation of the wafer cutting apparatus 10. Next, the cutting mechanism 14 will be described in detail.
As shown in FIG. 1, the cutting mechanism 14 includes a rectangular table base (moving means) 21, a disk-shaped chuck table (holding table) 22 rotatably provided on the table base 21, and the chuck. Two cutting units (cutting means) 30 having the same configuration arranged in parallel in the X direction above the table 22 and cameras (observation means, imaging means) disposed on the positioning mechanism 12 side of these cutting units 30. 40). The table base 21 is provided on the base 11 so as to be movable in the X direction via a guide rail (not shown), and can be reciprocated by a drive mechanism (not shown).

  The chuck table 22 has a horizontal upper surface and is supported on the table base 21 so as to be rotatable about the Z direction (vertical direction) as an axis, and is rotated clockwise or counterclockwise by a driving mechanism (not shown). The chuck table 22 is a well-known vacuum chuck type, and as shown in FIG. 4, a porous vacuum suction portion 30 a is formed on the upper portion, leaving a peripheral edge. When the chuck table 22 is operated in vacuum, the air on the upper surface side of the vacuum suction unit 30a is sucked and the work is adsorbed on the upper surface. As shown in FIG. 1, bellows-like covers 24 are provided at both ends in the movement direction of the table base 21 so as to cover the movement path of the table base 21 and prevent cutting chips and the like from falling on the movement path. It is provided so that it can be stretched. The chuck table 22 is provided with a clamp 25 that detachably holds the dicing frame 6 placed on the chuck table 22.

  The cutting unit 30 includes a cylindrical spindle housing 31 in which the axial direction is held parallel to the Y direction, and a cutting blade 32 attached to a spindle (not shown) provided in the spindle housing 31. Yes. The spindle housing 31 incorporates a motor that rotationally drives the spindle. In each cutting unit 30, the spindle housing 31 is held by a frame (not shown) provided on the base 11 at a constant interval in the X direction, and the axial direction is held parallel to the Y direction. In the state, each is independently supported so as to reciprocate in the Y direction and move up and down in the Z direction. The frame is provided with a drive mechanism (not shown) that moves the cutting unit 30 in those directions.

  A blade cover 33 is attached to the end of the spindle housing 31 on the side where the cutting blade 32 is mounted. The blade cover 33 is provided with cutting water nozzles 34 and 35 for supplying cutting water for lubrication, cooling, cleaning, and the like at the time of cutting to a processing point by the cutting blade 32.

  The camera 40 is attached to the frame that supports the cutting unit 30 such that the optical axis (photographing direction) is vertically downward and can be moved up and down for focus adjustment. The frame is provided with a drive mechanism (not shown) that moves the camera 40 in the vertical direction. This camera 40 photographs the surface of the wafer 1 held on the chuck table 22 and confirms the division line 2. The image data is input to the wafer image processing unit 51 of the controller (control means) 50. Is done. The controller 50 moves the table base 21 (X direction), rotates the chuck table 22, and rotates the cutting unit 30 so that the scheduled division line 2 is accurately cut based on the image data captured by the camera 40. The movement (X direction and Z direction) is controlled.

  In the wafer cutting apparatus 10 of this embodiment, an inspection block (inspection material) 60 for confirming the wear state of the cutting blade 32 of each cutting unit 30 and urging replacement as necessary is provided on the table base 21. It is attached. As shown in FIGS. 4 and 5, on the side surface of the table base 21 on the positioning mechanism 12 side (the right side in these drawings), a long and thin plate-like mounting jig 62 is provided in the direction of arrows AB through a hinge 61. A rectangular parallelepiped inspection block 60 is detachably attached to the attachment jig 62. The inspection block 60 is made of the same material as the wafer 1 such as silicon or made of another material. Another material is, for example, graphite.

Test block 60, the mounting jig 62 rotates, the cutting position location shown in FIG. 5, are arranged in two positions and a retracted position location shown in FIG. At the cutting position, the inspection block 60 is disposed on the mounting jig 62, and the upper surface is set to be horizontal. Further, it is arranged on the side surface of the mounting jig 62 at the retracted position. The attachment jig 62 is rotated between a cutting position and a retracted position by a drive source such as an air cylinder or a pulse motor. The inspection block 60 is inspected and cut by the cutting blade 32 of the cutting unit 30 at the cutting position. The inspection cutting is a groove processing whose depth is about half of the thickness of the inspection block 60. After the grooving, the inspection block 60 is positioned at the retracted position, and a cutting trace by the cutting blade 32 formed on the side surface facing upward, that is, a cross section of the cutting groove is photographed by the camera 40.

  The imaging data of the camera 40 at this time, that is, inspection data, is input to the inspection data input unit 52 of the controller 50. In the controller 50, a standard data storage unit 53 storing standard data indicating an image of a good cutting groove by the cutting blade 32 having no wear, and standard data and inspection data input stored in the standard data storage unit 53 are input. The cutting groove inspection data input to the unit 52 is compared by image processing to determine whether the inspection data is within the allowable range of the standard data. When the determination unit 54 determines that the inspection data deviates from the allowable range of the standard data, that is, the degree of wear of the cutting blade 32 is large and needs to be replaced, the controller 50 responds to an appropriate warning means such as a buzzer or a lamp. The output is ordered and the operator is informed of that. Further, when it is determined that the wear of the cutting blade 32 is within an allowable range and does not need to be replaced, that fact is also notified.

The above is the configuration of the wafer cutting device 10 of the present embodiment, and the operation of the wafer cutting device 10 will be described.
In the operation of cutting and dividing the wafer 1 into pieces into a large number of semiconductor chips 3, first, a single wafer dicing frame 6 is pulled out from the cassette 13 by the clamp 16, and the two guides of the positioning mechanism 12 are moved. It is placed between the bars 12a. Then, the two guide bars 12a are linked and moved in a direction approaching each other, and the movement is stopped when the dicing frame 6 is sandwiched. As a result, the dicing frame 6 is positioned at the transfer start position to the chuck table 22.

  Next, the dicing frame 6 with the wafer is moved and placed on the chuck table 22 that has been previously operated in vacuum by the transfer robot. The wafer 1 is attracted and held on the chuck table 22 via the dicing tape 5, and the dicing frame 6 is held on the chuck table 22 by a clamp 25. Further, the inspection block 60 is positioned at the retracted position.

  Next, the table base 21 is moved to the positioning mechanism 12 side, the wafer 1 is placed directly under the camera 40, and the surface of the wafer 1 is photographed by the camera 40. The imaging data of the camera 40 is input to the wafer image processing unit 51 of the controller 50, and the controller 50 confirms the planned division line 2 from the imaging data and obtains and determines the cutting pattern of the planned division line 2 by the cutting unit 30. To do. Next, the table base 21 moves below the cutting blades 32 of the cutting unit 30, and the division lines 2 of the wafer 1 are cut by the cutting blades 32 rotating at high speed of the two cutting units 30. The semiconductor chip 3 is singulated.

  The cutting pattern of the wafer 1 is arbitrary, but the reciprocating movement of the wafer 1 in the X direction by the movement of the table base 21, the cutting of the cutting blade 32 in the lower direction of the Z, and the change of the cutting line by the movement in the Y direction. Is a basic operation, and these operations are appropriately combined to cut all the division planned lines 2. While the wafer 1 is being cut, the inspection block 60 moves integrally with the table base 21, but the cutting blade 32 or the blade cover 33 and the nozzles 34 and 35 interfere with the inspection block 60 by being positioned at the retracted position. There will be no inconvenience.

  The cutting depth of the cutting blade 32 is adjusted so that the cutting edge 32 finally penetrates the wafer 1 and the cutting edge enters the dicing tape 5 by about half of the depth so that the cutting edge does not contact the chuck table 22. In this case, by providing two cutting units 30, for example, when the axial direction (Y direction) of the cutting blades 32 of these cutting units 30 is shifted by the interval of the division-scheduled line 2, The two division lines 2 can be cut by moving in the X direction. In addition, a pattern in which one division planned line 2 is sequentially cut by two cutting blades 32 with the positions in the Y direction aligned is also conceivable. In that case, a procedure in which the first cutting blade 32 cuts to about half the depth of the wafer 1 and the second cutting blade 32 penetrates the wafer 1 can be adopted.

  When all the division lines 2 are cut, the wafer 1 is divided into a large number of semiconductor chips 3. These semiconductor chips 3 are still attached to the dicing tape 5, and the form of the wafer 1 is maintained. Thereafter, the wafer 1 separated into a large number of semiconductor chips 3 is transferred to the cleaning unit 15 via the positioning mechanism 12 and cleaned by the cleaning unit 15. The cleaned wafer 1 is stored in the cassette 13 together with the dicing frame 6 through the positioning mechanism 12 once again.

  After the wafer 1 is cut and divided as described above and divided into a large number of semiconductor chips 3, the next cutting blade inspection process is performed. The cutting cycle of the wafer 1 leading to this cutting blade inspection process is determined by the material of the wafer 1 and the cutting blade 32 to be cut, and is set variously, for example, every wafer or every five wafers. The To perform the cutting blade inspection process, first, the vertical position of the cutting blade 32 is adjusted so that the inspection block 60 is positioned at the cutting position and only the cutting edge is cut into the inspection block 60. Then, from this state, the table base 21 is moved in a direction approaching the positioning mechanism 12, and as shown in FIG. 5, the surface of the inspection block 60 is inspected and cut by the cutting blade 32 that requires inspection.

  When the inspection cutting that crosses the width direction of the inspection block 60 is completed, the inspection block 60 is returned to the retracted position as shown in FIG. The cross section of the trace, that is, the cutting groove is photographed by the camera 40. Image data of inspection cutting, that is, inspection data is input to the inspection data input unit 52 of the controller 50. Then, the determination unit 54 compares the standard data stored in the standard data storage unit 53 with the inspection data of the cutting groove input to the inspection data input unit 52 by image processing, and the inspection data is within the allowable range of the standard data. It is judged whether it is in. When the determination unit 54 determines that the inspection data has deviated from the allowable range of the standard data, the degree of wear of the cutting blade 32 is large and needs to be replaced, and an appropriate warning means such as a buzzer or a lamp is used. This is notified and the device automatically stops. Further, when it is determined that the inspection data does not deviate from the allowable range of the standard data, it is notified that the cutting blade 32 does not need to be replaced.

  Comparison between the standard data and the inspection data is performed by an appropriate image processing method. For example, as shown in FIG. 7, the V-shaped cutting groove 70 shown in FIG. 7A is used as standard data, the width a of the opening of the cutting groove 70, the groove width b near one side at a predetermined depth, and the cutting groove. The width c half of 70 and the depth d of the cutting groove 70 are set as standard values, respectively, a to d on the standard value side, and each value a of the cutting groove 60a formed in the inspection block 60 shown in FIG. A method of comparing each of ˜d and determining whether or not the difference is within a predetermined allowable range. Further, as shown in FIG. 8, the cutting groove 70 of the standard data shown in (a) and the cutting groove 60a formed in the inspection block 60 shown in (b) are overlapped and overlapped as shown in (c). There is also a method in which a ratio (%) of line data is obtained and a determination is made based on whether or not the length of the overlapping line data is within a predetermined allowable range.

  According to the wafer cutting apparatus 10 of the present embodiment, after a predetermined number of cutting operations (dividing into semiconductor chips 3) on the wafer 1 are finished, the cutting blade 32 is moved to the inspection block 60 as it is to the inspection block 60. The cutting groove is formed, and then the shape of the cutting groove is photographed by the camera 40 and compared with the standard data, whereby the wear state of the cutting blade 32 and the necessity of replacement can be determined. Therefore, it is possible to quickly and easily determine whether to replace the cutting blade 32 without requiring many processes for the inspection of the wear state as in the prior art.

  In particular, in the present embodiment, the controller 50 automatically performs the determination and warning of whether or not the cutting blade 32 needs to be replaced after the cutting groove of the inspection block 60 is photographed by the camera 40. This will further reduce the burden of work and speed up the work. Further, by this automation, it is also possible to automate the dressing of the cutting blade 32 and the work for correcting the shape. In addition, since the camera 40 for photographing the surface of the wafer 1 and confirming the division line 2 is diverted for photographing the inspection block 60, labor saving and increase in the number of parts can be suppressed, and the inspection block 60 can be suppressed. In combination with the inverted type, the increase in size of the apparatus can be suppressed.

  In the above embodiment, photographing of the cutting groove formed in the inspection block 60 is performed by returning the inspection block 60 to the retracted position as shown in FIG. This is because the shooting direction of the camera 40 is downward and the side surface on which the shape of the cutting groove of the inspection block 60 is recognized needs to face the upper camera 40. Therefore, as shown in FIG. 9, if the camera 40 is arranged on the side of the inspection block 60 and the photographing direction is directed to the inspection block 60, the cutting groove is formed without forming the inspection block 60 in the retracted position. The cutting groove can be photographed with the camera 41. This configuration increases the number of cameras 41 for photographing the inspection block 60, but has an advantage that steps such as rotation of the inspection block 60 and correction of the position of the camera 40 are omitted.

1 is a perspective view of a wafer cutting device according to an embodiment of the present invention. It is a perspective view of the semiconductor wafer cut with the wafer cutting device of one embodiment, and an enlarged portion is a top view of a semiconductor chip. It is (a) perspective view and (b) sectional view showing a semiconductor wafer in the state supported by a dicing frame via a dicing tape. It is a side view which shows the state which is cutting the semiconductor wafer with the cutting blade of a cutting unit. It is a side view which shows the state which test-cuts the test | inspection block with the cutting blade. It is a side view which shows the state which image | photographed the shape of the cutting groove of the side surface of a test | inspection block with a camera. It is a figure explaining an example of the image processing method which compares the standard data and inspection data of a cutting groove. It is a figure explaining the other example of the image processing method which compares the standard data and inspection data of a cutting groove. It is a side view which shows the state currently image | photographed with the camera which has arrange | positioned the cutting groove of the test | inspection block to the side.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wafer 10 ... Wafer cutting device 21 ... Table base (moving means)
22 ... Chuck table (holding table)
30 ... Cutting unit (cutting means)
32 ... Cutting blade 40 ... Camera (observation means, imaging means)
50. Controller (control means)
52 ... Inspection data input unit 53 ... Standard data storage unit 54 ... Judgment unit 60 ... Inspection block (inspection material)

Claims (2)

  1. A holding table for holding the wafer;
    Cutting means provided so as to be movable forward and backward with respect to the wafer held by the holding table, and cutting the wafer with a cutting blade;
    Moving means for relatively moving the holding table and the cutting means in a cutting direction;
    An inspection material disposed at a predetermined position within a moving range of the cutting blade moved by the moving means and cut by the cutting blade;
    Observation means for observing the cutting state of the inspection material by the cutting blade ,
    The inspection material is provided movably between a cutting position observed by the observation means and a retreat position retracted from the cutting position, and at least the inspection material at the retreat position has a moving cutting blade. Set to avoid interference,
    A wafer cutting apparatus comprising a drive source for moving the inspection material between the cutting position and the retracted position .
  2. A standard data storage unit storing standard data of a good cutting state by the cutting blade;
    An inspection data input unit for inputting inspection data of the cutting state of the inspection material observed by the observation means;
    A determination unit that compares the standard data stored in the standard data storage unit with the inspection data input to the inspection data input unit and determines whether the inspection data is within an allowable range of the standard data. The wafer cutting device according to claim 1 , further comprising control means having
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JP5384174B2 (en) * 2009-04-06 2014-01-08 株式会社ディスコ Cutting blade tip shape detection method
JP2011249571A (en) * 2010-05-27 2011-12-08 Disco Abrasive Syst Ltd Cutting blade outer shape inspection method
JP5785069B2 (en) * 2011-12-05 2015-09-24 株式会社ディスコ Cutting equipment
JP6163916B2 (en) * 2013-06-28 2017-07-19 株式会社ジェイテクト Wheel wear measurement method
JP5686219B2 (en) * 2013-07-01 2015-03-18 富士ゼロックス株式会社 Method of designing tip shape of cutting member and method of manufacturing semiconductor piece
JP6219628B2 (en) * 2013-07-17 2017-10-25 株式会社ディスコ Cutting blade tip shape detection method
JP6139325B2 (en) * 2013-08-07 2017-05-31 株式会社ディスコ Cutting blade wear inspection method
JP6255285B2 (en) * 2014-03-18 2017-12-27 株式会社ディスコ Detection method
JP6562670B2 (en) * 2015-03-23 2019-08-21 株式会社ディスコ Workpiece cutting method
JP6478794B2 (en) * 2015-05-08 2019-03-06 株式会社ディスコ Manufacturing method of angled cutting blade
JP6552105B2 (en) * 2015-11-24 2019-07-31 株式会社東京精密 Dressing apparatus and dressing method

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JPS62102976A (en) * 1985-10-30 1987-05-13 Hitachi Ltd High precision grooving and cutting device
JPS62222806A (en) * 1986-03-26 1987-09-30 Toshiba Corp Grooving processing machinery
JP2628234B2 (en) * 1991-03-28 1997-07-09 株式会社ディスコ Blade height adjustment system for cutting equipment
JPH05253837A (en) * 1992-03-12 1993-10-05 Sony Corp Abrading condition examining method of grinding wheel
JPH0837168A (en) * 1994-07-25 1996-02-06 Sumitomo Electric Ind Ltd Method and apparatus for dicing semiconductor wafer
JP2003124152A (en) * 2001-10-18 2003-04-25 Tokyo Seimitsu Co Ltd Dicing device having mobile blade detector
JP2007096091A (en) * 2005-09-29 2007-04-12 Disco Abrasive Syst Ltd Wafer processing method

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