JP2011009652A - Position-detecting method of cutting blade in cutting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a position-detecting method of a cutting blade in a cutting apparatus capable of simultaneously performing the position detection and the dressing of the cutting blade without using a dummy wafer.SOLUTION: The cutting apparatus is equipped with a cutting means having a chuck table for holding an object to be machined with a movable configuration, and a cutting blade to cut the object to be machined; an imaging means 57 having an optical system for imaging the cutting region of the object to be machined with a reference line formed to specify a cutting position; and a dressing board supporting table disposed adjoining to the chuck table as movable together with the chuck table in the feeding direction. The position detecting method of the cutting blade in the cutting apparatus comprises a step for dressing the cutting blade by cutting the dressing board 37; and a discrepancy detecting means for imaging the dressing board with a cutting groove formed thereon by the imaging means, and for detecting the discrepancy between the imaged cutting groove and the reference line 571.

Description

  The present invention relates to a method for detecting a position of a cutting blade in a cutting apparatus for cutting a workpiece such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor devices.

  The above-described cutting along the street of the semiconductor wafer is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a wafer, a cutting means having a cutting blade for cutting the workpiece held on the chuck table, and a workpiece held on the chuck table. Imaging means having an optical system for detecting a cutting area of the workpiece.

  Since the rotary spindle equipped with the cutting blade of the above-described cutting apparatus thermally expands with time, the cutting blade and the hair line provided in the optical system of the imaging means each time a cutting operation is started or a predetermined number of wafers are cut The position of the cutting blade is detected by detecting an error from a so-called reference line, and this error is corrected to perform cutting. The cutting blade position detection operation is performed by holding a dummy wafer on a sub-table disposed adjacent to the chuck table, cutting the dummy wafer with the cutting blade, and then imaging the cutting groove with an imaging means. An error between the blade and the reference line is detected. (See Patent Document 1).

  Further, the cutting blade of the above-described cutting apparatus is crushed by continuing the cutting operation, and the cutting ability is reduced. In order to dress and sharpen the cutting blade with such clogging, a dressing board is disposed adjacent to the chuck table and the dressing board is cut periodically. It is disclosed in Document 2.

Japanese Patent No. 3472336 JP 2000-49129 A

  Thus, a dummy wafer and a dressing board are disposed adjacent to the chuck table, and the dummy wafer is periodically cut by a cutting blade, and a reference line called a hair line provided in the optical system of the cutting blade and the imaging means It takes time to perform both operations, and it is necessary to prepare a dummy wafer to perform the dressing of the cutting blade by detecting the error of the cutting and cutting the dressing board with the cutting blade. There is.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is cutting capable of performing cutting blade position detection and cutting blade dressing using a dressing board without using a dummy wafer. An object of the present invention is to provide a method for detecting the position of a cutting blade in an apparatus.

In order to solve the above main technical problem, according to the present invention, a chuck table which holds a workpiece and is arranged so as to be movable in a cutting feed direction, and a workpiece which is held by the chuck table are cut. A cutting means provided with a cutting blade, an imaging means provided with an optical system for imaging a cutting area of a workpiece held on the chuck table and defining a reference line for specifying a cutting position, and the chuck table A cutting blade position detection method in a cutting apparatus comprising: a dressing board support table that is disposed adjacent to the chuck table so as to be movable in a cutting feed direction and holds a dressing board;
A dressing step of dressing the cutting blade by positioning the dressing board held on the dressing board support table in the cutting work area of the cutting blade and cutting the dressing board with the cutting blade;
The dressing board on which the dressing process is performed and the cutting groove is formed is positioned in the imaging region by the imaging means, the cutting groove formed on the dressing board is imaged by the imaging means, and the deviation amount between the imaged cutting groove and the reference line is determined. A deviation amount detecting step to detect,
There is provided a method for detecting the position of a cutting blade in a cutting apparatus.

  In the cutting blade position detection method according to the present invention, the dressing board held on the dressing board support table is positioned in the cutting work area of the cutting blade, and the dressing board is cut by the cutting blade to dress the cutting blade. And positioning the dressing board on which the dressing process has been performed and the cutting groove is formed in the imaging region by the imaging means, imaging the cutting groove formed on the dressing board by the imaging means, and the gap between the imaged cutting groove and the reference line. And a deviation amount detecting step for detecting the amount, so that the amount of deviation between the cutting blade dressing and the cutting blade and the reference line of the imaging means can be detected, and the dummy wafer is cut to form the cutting groove and Dressing the amount of deviation from the reference line of the imaging means With the step of detecting the productivity is improved can be omitted by using the over-de, there is no need to use a dummy wafer.

The perspective view of the cutting device for enforcing the position detection method of the cutting blade by this invention. Explanatory drawing which shows the relationship between the cutting blade with which the cutting apparatus shown in FIG. 1 is equipped, and the reference line provided in the imaging means. The perspective view which shows the state by which the semiconductor wafer as a workpiece cut by the cutting apparatus shown in FIG. 1 was stuck on the surface of the dicing tape with which the cyclic | annular flame | frame was mounted | worn. Explanatory drawing of the dressing process in the position detection method of the cutting blade by this invention. Explanatory drawing which shows the state in which the center of the cutting groove formed in the dressing board corresponds with the reference line in the gap | deviation amount detection process in the position detection method of the cutting blade by this invention. Explanatory drawing of the cutting process implemented by the cutting device shown in FIG. Explanatory drawing which shows the state which the center of the cutting groove formed in the dressing board has shifted | deviated with the reference line in the deviation amount detection process in the position detection method of the cutting blade by this invention.

  Hereinafter, a preferred embodiment of a method for detecting the position of a cutting blade in a cutting apparatus constructed according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a cutting apparatus in which the cutting blade position detection method according to the present invention is implemented.
The cutting apparatus shown in FIG. 1 includes a stationary base 2 and a chuck table that is disposed on the stationary base 2 so as to be movable in a direction indicated by an arrow X that is a cutting feed direction (X-axis direction) and holds a workpiece. A mechanism 3; a spindle support mechanism 4 disposed on the stationary base 2 so as to be movable in a direction indicated by an arrow Y that is an index feed direction (Y-axis direction) orthogonal to the cutting feed direction (X-axis direction); A spindle unit 5 as a cutting means movably disposed in a direction indicated by an arrow Z which is a cutting feed direction (Z-axis direction) perpendicular to a workpiece holding surface of a chuck table, which will be described later, of the spindle support mechanism 4. Is arranged.

  The chuck table mechanism 3 includes a pair of guide rails 31, 31 disposed in parallel along the cutting feed direction (X-axis direction) indicated by an arrow X on the stationary base 2, and the pair of guide rails 31, A chuck table support base 32 movably disposed in a cutting feed direction indicated by an arrow X on 31, a cover table 34 supported on the chuck table support base 32 by a cylindrical member 33, and the cylindrical member 33 Is provided with a chuck table 35 as a workpiece holding means supported rotatably. The chuck table support base 32 is provided with a pair of guided grooves 321 and 321 that are fitted to the pair of guide rails 31 and 31. The pair of guided grooves 321 and 321 is a pair of guide rails 31 and 31. By being fitted to 31, the chuck table support base 32 is configured to be movable along the pair of guide rails 31 and 31 in the cutting feed direction (X-axis direction) indicated by the arrow X. The chuck table 35 includes a frame body 350 made of stainless steel, and an adsorption chuck 351 formed of a porous material fitted in a fitting recess formed on the upper surface of the frame body 350. . The upper surface of the frame 350 of the chuck table 35 configured as described above and the upper surface of the suction chuck 351 are formed flush with each other, and the upper surface of the suction chuck 351 serves as a holding surface for holding the workpiece. The chuck table 35 configured as described above holds, for example, a disk-shaped semiconductor wafer, which is a workpiece, on the suction chuck 351 by suction means (not shown). The chuck table 35 configured as described above is rotated by a pulse motor (not shown) disposed in the cylindrical member 33. The chuck table 35 is provided with a clamp 352 for fixing an annular frame described later.

  The chuck table mechanism 3 in the illustrated embodiment includes a dressing board support table 36 disposed adjacent to the chuck table 35 so as to be movable in the cutting feed direction (X-axis direction) together with the chuck table 35. The dressing board support table 36 includes a suction table 361 that holds a dressing board 37 and is disposed on the chuck table support base 32. The dressing board support table 36 configured as described above places the dressing board 37 on the upper surface of the suction table 361 and operates the suction means (not shown) to suck and hold the dressing board 37 on the suction table 361.

  The chuck table mechanism 3 in the illustrated embodiment includes a cutting feed means 38 that moves the chuck table 35 in a cutting feed direction indicated by an arrow X. The cutting feed means 38 includes a male screw rod 381 disposed in parallel between the pair of guide rails 31 and 31, and a drive source such as a servo motor 382 for rotationally driving the male screw rod 381. One end of the male screw rod 381 is rotatably supported by a bearing block 383 fixed to the stationary base 2, and the other end is connected to the output shaft of the servo motor 382. The male screw rod 381 is screwed into a female screw 382 formed at the center of the chuck table support base 33. Therefore, the chuck table support base 32 is moved along the guide rails 31 and 31 in the cutting feed direction indicated by the arrow X by driving the male screw rod 381 forward and backward by the servo motor 382.

  The spindle support mechanism 4 includes a pair of guide rails 41, 41 arranged in parallel on the stationary base 2 along the indexing feed direction (Y-axis direction) indicated by an arrow Y, and the pair of guide rails 41, A movable support base 42 is provided on 41 so as to be movable in the direction indicated by arrow Y. The movable support base 42 includes a pair of guide rails 41, a movable support portion 421 that is movably disposed on the guide rails 41, and a mounting portion 422 attached to the movable support portion 421. A pair of guided grooves 421a and 421a that are fitted to the pair of guide rails 41 and 41 are formed on the lower surface of the movement support portion 421. The pair of guided grooves 421a and 421a are connected to the pair of guide rails 41 and 41, respectively. By being fitted to 41, the movable support base 42 is configured to be movable along the pair of guide rails 41 and 41. In addition, the mounting portion 422 is provided with a pair of guide rails 423 and 423 extending in the cutting feed direction (Z-axis direction) perpendicular to the workpiece holding surface of the chuck table 35 indicated by an arrow Z on one side surface. ing. The spindle support mechanism 4 in the illustrated embodiment includes index feed means 43 for moving the movable support base 42 along the pair of guide rails 41 and 41 in the index feed direction (Y-axis direction) indicated by the arrow Y. is doing. The index feeding means 43 includes a male screw rod 431 arranged in parallel between the pair of guide rails 41, 41, and a drive source such as a pulse motor 432 for rotationally driving the male screw rod 431. One end of the male screw rod 431 is rotatably supported by a bearing block (not shown) fixed to the stationary base 2, and the other end is connected to the output shaft of the pulse motor 432. The male screw rod 431 is screwed into a female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the moving support portion 421 constituting the movable support base 42. Therefore, the movable support base 42 is moved along the guide rails 41 and 41 in the indexing feed direction (Y-axis direction) indicated by the arrow Y by driving the male screw rod 431 forward and backward by the pulse motor 432. .

  The spindle unit 5 as cutting means in the illustrated embodiment includes a unit holder 51, a spindle housing 52 attached to the unit holder 51, and a rotating spindle 53 rotatably supported by the spindle housing 52. Yes. The unit holder 51 is provided with a pair of guided grooves 511 and 511 that are slidably fitted to a pair of guide rails 423 and 423 provided in the mounting portion 422. By being fitted to the guide rails 423 and 423, the guide rails 423 and 423 are supported so as to be movable in the cutting feed direction (Z-axis direction). The rotary spindle 53 is disposed so as to protrude from the tip of the spindle housing 52, and a cutting blade 54 is attached to the tip of the rotary spindle 53. The cutting blade 54 is an electroformed blade in which diamond abrasive grains are hardened by nickel plating on a blade base formed in a disk shape with aluminum. The rotary spindle 53 equipped with the cutting blade 54 configured as described above is driven to rotate by a drive source such as a servo motor 55. A cutting water supply nozzle 56 is provided on both sides of the cutting blade 54 for supplying cutting water to a cutting portion by the cutting blade 54.

  An image pickup means 57 for picking up an image of the workpiece held on the chuck table 35 and specifying a position to be cut by the cutting blade 54 is provided at the tip of the spindle housing 52. The imaging means 57 is composed of optical means such as a microscope and a CCD camera, and sends the captured image signal to the control means 6. The image pickup means 57 is provided with a reference line 571 called a hairline formed at the center of the image taken as shown in FIG. 2, and the cutting blade 54 moves in the cutting feed direction (X (Axial direction) is adjusted so as to be located on the same line as the reference line 571. However, since the rotary spindle 53 to which the cutting blade 54 is attached thermally expands with time, a deviation occurs between the reference line 571 and the index feed direction (Y-axis direction). If cutting with the cutting blade 54 is performed in a state where this deviation occurs, the position of the workpiece to be cut cannot be cut. Accordingly, it is necessary to detect a deviation between the cutting blade 54 and the reference line 571 when starting the cutting work or periodically and perform the cutting work in consideration of this deviation. In the illustrated embodiment, an adjustment mechanism 572 is provided for moving and adjusting the imaging means 57 in the indexing feed direction (Y-axis direction) that is the axial direction of the rotary spindle 53. Further, the cutting blade 54 is crushed by continuing cutting, and the cutting ability is reduced. Therefore, it is necessary to dress the cutting blade 54 every time a predetermined number of wafers are cut.

  The spindle unit 5 in the illustrated embodiment includes a cutting feed means 58 for moving the unit holder 51 in the cutting feed direction (Z-axis direction) along the pair of guide rails 423 and 423. The cutting feed means 58 includes a male screw rod (not shown) disposed between the guide rails 423 and 423 similarly to the cutting feed means 38 and the index feed means 43, and a pulse for rotationally driving the male screw rod. A drive source such as a motor 582 is included, and a male screw rod (not shown) is driven to rotate forward and backward by a pulse motor 582, whereby the unit holder 51, the spindle housing 52, and the rotary spindle 53 are cut along the guide rails 423 and 423. Move in the feed direction (Z-axis direction).

The cutting apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
When performing the cutting operation, the chuck table 35 is positioned at the workpiece attachment / detachment position shown in FIG. Then, the semiconductor wafer 10 as the workpiece shown in FIG. 3 is transferred onto the chuck table 35 by a transfer device (not shown). The semiconductor wafer 10 has a lattice street 101 formed on the surface, and devices 102 such as ICs and LSIs are formed in a plurality of rectangular areas partitioned by the lattice street 101. The back surface of the semiconductor wafer 10 thus formed is adhered to the front surface of the dicing tape T mounted on the annular support frame F. When the semiconductor wafer 10 adhered to the surface of the dicing tape T mounted on the annular support frame F is placed on the chuck table 35, the semiconductor wafer 10 is operated by operating a suction means (not shown). Is sucked and held through the dicing tape T. The annular frame F that supports the semiconductor wafer 10 via the dicing tape T is fixed by a clamp 352.

  As described above, when the semiconductor wafer 10 is held on the chuck table 35, the cutting feed means 38 is operated and the dressing board support table 36 holding the dressing board 37 disposed adjacent to the chuck table 35 is moved to the cutting blade. The dressing process of dressing the cutting blade 54 is performed by positioning the dressing board 37 with the cutting blade 54 and positioning the cutting blade 54 in the cutting work area 54. That is, as shown in FIG. 4, when the dressing board 37 is positioned in the cutting work area of the cutting blade 54, the cutting blade 54 rotates in the direction indicated by the arrow 54a and is indicated by the arrow Z1 from the standby position indicated by the two-dot chain line. Cut and feed a predetermined amount in the feed direction. Then, the cutting blade 54 cuts the dressing board 37 by moving the dressing board support table 36 holding the dressing board 37 in the direction indicated by the arrow X1 to the position indicated by the two-dot chain line. As a result, a cutting groove 370 is formed in the dressing board 37, and the cutting blade 54 obtained by cutting the dressing board 37 is conspicuous.

  If the dressing process described above is performed, the dressing board 37 in which the dressing process is performed and the cutting groove 370 is formed is positioned in the imaging region by the imaging unit 57, and the cutting groove 370 formed in the dressing board 37 by the imaging unit 57 is formed. A shift amount detection step is performed in which the image is picked up and a shift amount between the picked-up cutting groove 370 and the reference line is detected. FIG. 5 shows a state in which the cutting groove 370 formed on the dressing board 37 is imaged by the imaging means 57. This image is displayed on the monitor 61 of the control means 6. In the example shown in FIG. 5, the center of the cutting groove 370 formed in the dressing board 37 coincides with the reference line 571. Accordingly, there is no deviation between the cutting groove 370 formed in the dressing board 37 and the reference line 571, and the deviation amount is zero (0). In such a case, the following cutting operation is performed without correcting the deviation between the cutting blade 54 and the reference line 571.

  In the cutting operation, first, the cutting feed means 38 is operated to move the chuck table 35 to the imaging area of the imaging means 57. When the chuck table 35 is positioned in the imaging region of the imaging unit 57, the imaging unit 57 and the control unit 6 execute an alignment operation for detecting a processing region to be cut of the semiconductor wafer 10. That is, the imaging unit 57 and the control unit (not shown) are images such as pattern matching for aligning the street 101 formed in a predetermined direction of the semiconductor wafer 10 with the cutting blade 54 that cuts along the street 101. The process is executed to perform alignment that substantially matches the street 101 and the reference line 571. Similarly, alignment of the machining area to be cut is performed on the street 101 formed in the semiconductor wafer 10 and extending in a direction orthogonal to the predetermined direction (alignment process).

  As described above, when the alignment process for detecting the machining area to be cut of the semiconductor wafer 10 is executed, the chuck table 35 is moved to the cutting work area, and a predetermined street as shown in FIG. One end of 101 is positioned slightly to the right in FIG. 6A from directly below the cutting blade 54. Then, while rotating the cutting blade 54 in the direction indicated by the arrow 54a, the cutting blade 54 is cut and fed by a predetermined amount in the direction indicated by the arrow Z1, and the machining feed means 38 is operated to move the chuck table 35 to the position shown in FIG. At a predetermined cutting feed rate in the direction indicated by arrow X1. The cutting feed amount is set at a position reaching the back surface (lower surface) of the semiconductor wafer 10. Then, when the other end of the predetermined street 101 of the semiconductor wafer 10 held on the chuck table 35 slightly reaches the left side from just below the cutting blade 54 as shown in FIG. 6B, the chuck table 35 is moved. While stopping, the cutting blade 54 is raised in the direction indicated by the arrow Z2, indexed to the street to be cut next, and cutting is repeated. As a result, the semiconductor wafer 10 is cut along a predetermined street 101 (cutting process).

  If the above-described cutting process is performed along all the streets 101 formed in the semiconductor wafer 10 in a predetermined direction, the chuck table 35 is rotated 90 degrees. Then, the above-described cutting process is performed along all the streets 101 formed on the semiconductor wafer 10 in a direction orthogonal to the predetermined direction. As a result, the semiconductor wafer 10 is cut along all the streets 101. In this way, the semiconductor wafer 10 is divided into individual devices 102 by cutting along all the streets 101 of the semiconductor wafer 10. In addition, since the device 102 divided | segmented separately is affixed on the dicing tape T with which the cyclic | annular flame | frame F was mounted | worn, it does not fall apart but the form of a wafer is maintained. The individual devices thus divided are transported to the next process in a state where they are adhered to the dicing tape T attached to the annular frame F.

  If the above-described cutting operation is continuously performed, the cutting blade 54 is crushed and the cutting ability is reduced. Further, by continuing the cutting operation, the rotary spindle 53 to which the cutting blade 54 is attached is thermally expanded, and a deviation from the reference line 571 is generated. Therefore, if the above-described cutting operation is performed on a predetermined number of semiconductor wafers 10, the above-described dressing board 37 is cut with the cutting blade 54, thereby performing a dressing process for dressing the cutting blade 54. In this dressing process, the dressing board 37 is cut in the indexing feed direction (Y-axis direction) from the cutting groove 370 in which the dressing board 37 was cut in the previous dressing process. Then, the dressing board 37 in which the dressing process is performed and the cutting groove is formed is positioned in the imaging region by the imaging unit 57, the cutting groove formed in the dressing board 37 is imaged by the imaging unit 57, and the captured cutting groove and the reference line are captured. A shift amount detection step for detecting a shift amount with respect to is performed. FIG. 7 shows a state where the cutting groove 371 formed on the dressing board 37 is imaged by the imaging means 57. This image is displayed on the monitor 61 of the control means 6. The example shown in FIG. 7 shows an example in which the center of the cutting groove 371 formed on the dressing board 37 is shifted by S μm from the reference line 571 in the indexing feed direction (Y-axis direction). In this way, when the center of the cutting groove 371 formed on the dressing board 37 is shifted from the reference line 571 by S μm, the cutting groove 371 formed on the dressing board 37 by using the adjustment mechanism 572 of the imaging means 57. The amount of deviation (S μm) is stored in the memory of the control means 6.

  As described above, the dressing step and the deviation amount detection step are performed, and the adjustment mechanism 572 adjusts the reference line 571 so as to coincide with the center of the cutting groove 371 formed in the dressing board 37, or the deviation amount (S μm). Is stored in the memory of the control means 6, the semiconductor wafer 10 before cutting is sucked and held on the chuck table 35, and the alignment process and the cutting process described above are performed. At this time, when the adjustment mechanism 572 adjusts the reference line 571 so as to coincide with the center of the cutting groove 371 formed in the dressing board 37, the cutting area detected by the alignment process (the position of the reference line 571). Since the cutting blade 54 exists on the extended line in the X-axis direction, the cutting process is performed in that state. On the other hand, when the amount of deviation (S μm) is stored in the memory of the control means 6, the amount of deviation (S μm) is indexed to the cutting area (position of the reference line 571) detected by the alignment step (Y). The cutting blade 54 is positioned with correction in the axial direction), and the cutting process is performed.

  As described above, in the cutting blade position detection method according to the present invention, the dressing board 37 held by the dressing board support table 36 is positioned in the cutting work area of the cutting blade 54, and the dressing board 37 is cut by the cutting blade 54. Thus, the dressing process for dressing the cutting blade 54, and the dressing board 37 in which the dressing process is performed and the cutting groove is formed are positioned in the imaging region by the imaging means 57, and the cutting formed on the dressing board 37 by the imaging means 57 is performed. Since it includes a shift amount detection step of imaging the groove and detecting a shift amount between the imaged cutting groove and the reference line, the dressing of the cutting blade 54 and the shift amount between the cutting blade 54 and the reference line of the imaging means 57 are included. Detection of the dummy With the step of detecting the productivity is improved can be omitted by using a dressing board 37 the deviation of the reference line of the cutting to the cutting grooves and the imaging unit 57 to Eha, it is not necessary to use a dummy wafer.

2: stationary base 3: chuck table mechanism 32: chuck table support base 35: chuck table 36: dressing board support table 37: dressing board 38: cutting feed means 4: spindle support mechanism 42: movable support base 43: indexing Feed means 5: Spindle unit 52: Spindle housing 53: Rotating spindle 54: Cutting blade 57: Imaging means 571: Reference line 58: Cutting feed means

Claims (1)

A chuck table arranged to hold the workpiece and movable in the cutting feed direction, a cutting means having a cutting blade for cutting the workpiece held on the chuck table, and held on the chuck table An image pickup means having an optical system in which a cutting line of a processed workpiece is imaged and a reference line for specifying a cutting position is formed, and is movable adjacent to the chuck table in the cutting feed direction together with the chuck table A cutting blade position detection method in a cutting apparatus comprising: a dressing board support table disposed and holding a dressing board;
A dressing step of dressing the cutting blade by positioning the dressing board held on the dressing board support table in the cutting work area of the cutting blade and cutting the dressing board with the cutting blade;
The dressing board on which the dressing process is performed and the cutting groove is formed is positioned in the imaging region by the imaging means, the cutting groove formed on the dressing board is imaged by the imaging means, and the deviation amount between the imaged cutting groove and the reference line is determined. A deviation amount detecting step to detect,
A method for detecting a position of a cutting blade in a cutting apparatus.

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