JP6558948B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus such as a cutting apparatus, a grinding apparatus, or a laser processing apparatus.

  In a manufacturing process of a semiconductor device, an electronic component, or the like, a plurality of grid-like division lines called streets are formed on the surface of a plate-like workpiece made of silicon, a compound semiconductor, a resin package substrate, ceramics, or the like.

  Then, a device such as an IC or LSI is formed in each region partitioned by the division lines. These plate-like workpieces are thinned to a desired thickness by a grinding device, and then divided into individual device chips by a cutting device or a laser processing device.

  Processing devices such as cutting devices, grinding devices, or laser processing devices have moving parts and places where liquids are used in many places in the equipment, so there is a risk of failure and liquid leakage, and regular maintenance is required. There are many sites (see, for example, JP2013-129008A).

JP 2013-129008 A

  However, some failures may occur during regular maintenance, but these occur inside the equipment covered with the exterior cover, and at first glance whether or not there is a problem. I do n’t know.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a processing apparatus that can easily check the state of a required portion without opening the exterior cover. .

According to the present invention, a chuck table for holding a workpiece, a processing means for processing the workpiece held on the chuck table, and the chuck table and the processing means are moved relative to each other for processing. comprising a feed means, and a processing device covered with the outer cover, a first imaging means for imaging the chuck table base of the machining apparatus covered by the outer instrumentation cover, covered on outer instrumentation cover second imaging means for imaging the Y-axis ball screw of the processing equipment, or a third imaging means for imaging a water case or X-axis ball screw of the machining apparatus covered by the outer instrumentation cover, said first And a display unit disposed on the exterior cover for displaying an image captured by the second imaging unit or the third imaging unit , and the processing apparatus covered by the exterior cover Inside The first imaging means, the processing apparatus characterized by monitoring by the imaging means and said display means of said second image pickup means or the third is provided with.

Preferably, the processing apparatus, the first image pickup means, storage means for storing the image of the normal captured by the second image pickup means or said third imaging means, in the normal stored in the storage means image and said first imaging means, newly compares the images captured by the second image pickup means or said third imaging unit, a determination unit configured to determine occurrence of abnormal, abnormality determination by said determining means And a notifying means for notifying abnormality information when it is performed. Preferably, the chuck table base is provided with a first test piece whose color changes when heated, and the first imaging means includes the chuck table base and the first test. Image a piece. Preferably, the water case is provided with the second test piece whose color changes when the liquid is applied thereto, and the third imaging means includes the water case and the second test piece. Image.

  According to the processing apparatus of the present invention, the imaging unit is installed at a required location inside the apparatus covered with the exterior cover, and the captured image captured by the imaging unit is displayed on the display unit at a desired timing. Since the state of a required part can be easily confirmed without opening the cover, the maintainability is improved.

  In addition, by providing a determination unit that determines the occurrence of an abnormality, it is possible to automatically detect a failure or the like that is not known from the outside without using an operator, and to notify the notification unit by means of an error. can do.

It is an appearance perspective view of a cutting device in the state where a part was seen through. It is a perspective view of a mechanism part of a cutting device in the state where an exterior cover was removed and a conveyance unit was omitted.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, an external perspective view of a state in which a part of a cutting device 2 which is a kind of processing device is seen through is shown. Although the cutting device 2 is covered with the exterior cover 14, in FIG. 1, for convenience of explanation, each component inside the second exterior cover 14B is seen through and indicated by a solid line.

  Although FIG. 1 shows a cutting device 2 as an example of a processing device, the processing device targeted by the present invention is not limited to the cutting device 2, and includes a grinding device, a polishing device, a laser processing device, and the like. Other processing devices are also included.

  A chuck table 6 is mounted on the base 4 of the cutting apparatus 2 so as to be able to reciprocate in the X-axis direction by a machining feed mechanism (X-axis feed mechanism) 82 shown in FIG. Further, the chuck table 6 can rotate around a vertical axis. The machining feed mechanism 82 of the chuck table 6 is closed by the bellows 8.

  Reference numeral 10 denotes a cassette elevator that can move up and down. On the cassette elevator 10, a cassette 12 containing a plurality of wafer units, each of which supports a wafer W supported by an annular frame F via a dicing tape T, is mounted.

  The exterior cover 14 of the cutting apparatus 2 includes a first exterior cover 14A and a second exterior cover 14B. An instruction (command) for the apparatus is input to the front surface 14a of the first exterior cover 14A, and the operation status of the apparatus is determined. A displayed touch panel display monitor 16 is provided.

  Further, a buzzer or speaker as a sound notification means is incorporated in the reference numeral 17 of the front surface 14a of the first exterior cover 14A. On the upper surface 14b of the first exterior cover 14A, a display lamp 19 is installed as light notification means.

  Adjacent to the cassette elevator 10, a pair of centering bars 18 on which the frame F of the wafer unit pulled out from the cassette 12 is mounted are disposed. When the centering bars 18 move in a direction approaching each other, the annular frame The wafer W supported by F is centered.

  An opening 20 is formed in the side surface 14c of the first exterior cover 14A. The workpiece attachment / detachment position (origin position) through which the chuck table 6 is illustrated, and a processing position for cutting the wafer W are shown in FIG. Are moved in the X-axis direction.

  In the first exterior cover 14A, the first cutting unit, the second cutting unit, the Y-axis feeding mechanism and the Z-axis feeding mechanism of the first and second cutting units are arranged, respectively. Will be described in detail later.

  Reference numeral 22 denotes an H-shaped first transfer unit on which four suction pads 24 for sucking the frame F of the wafer unit are mounted. A clamp unit 28 having a clamp 30 is attached to the connecting member 26 of the first transport unit 22.

  The first transport unit 22 is attached to a Y-axis moving block 34 so as to be movable in the Z-axis direction by a Z-axis moving mechanism 32 composed of a ball screw and a pulse motor. The Y-axis moving block 34 has a built-in nut, and this nut is screwed into the ball screw 36.

  Accordingly, the Y-axis moving block 34 is guided by the pair of guide rails 42 fixed to the side surface 14c of the first exterior panel 14A by the first Y-axis moving mechanism 40 including the ball screw 36 and the pulse motor 38. It is moved in the Y-axis direction.

  Reference numeral 44 denotes an H-shaped second transport unit, which is attached to the support member 48. The second transfer unit 44 has four suction pads 46 for sucking the annular frame F of the wafer unit, and the upper part thereof is covered with a transparent cover 50.

  The support member 48 is attached to the Y-axis moving block 52 by an air cylinder (not shown) so as to be movable in the Z-axis direction. The Z-axis moving block 52 has a built-in nut, and this nut is screwed into the ball screw 54.

  The Y-axis moving block 52 is guided by a pair of guide rails 60 fixed to the side surface 14c of the first exterior cover 14A by a second Y-axis moving mechanism 58 composed of a ball screw 54 and a pulse motor 56, and is Y-axis. Moved in the direction.

  Reference numeral 62 denotes a spinner cleaning unit for cleaning the wafer W after cutting. The annular frame F of the wafer unit after cutting is sucked by the suction pad 46 of the second transfer unit 44 and transferred to the spinner cleaning unit 62. The spinner cleaning unit 62 performs spin cleaning and spin drying of the wafer W.

  A first camera 64A is installed in an upper part inside the second exterior cover 14B. The first camera 64 </ b> A captures an image of the wafer W after the cutting process as a whole, displays a captured image on the touch-panel display monitor 16 according to a predetermined timing or an operator instruction, and controls the controller of the cutting apparatus 2. Whether or not the chip is scattered is determined by a determination unit 70 built in 66.

  The controller 66 has storage means 66 for storing a normal image captured by the first camera 64A, and the normal image stored by the storage means 66 and the captured image newly captured by the first camera 64A. In comparison, the determination means 70 determines the occurrence of an abnormality such as a chip jump.

  When an abnormality is determined by the determination means 70, the abnormality is notified by sound through a buzzer or a speaker built in the reference numeral 17. Preferably, in addition to notifying the abnormality by this sound, the display lamp 19 blinks in red, for example, to notify the operator of the abnormality. Alternatively, the abnormality content is displayed on the display monitor 16.

  Referring to FIG. 2, a perspective view of the cutting device 2 in a state where the outer cover 14 and the bellows 8 are removed and the first and second transport units 22 and 44 are omitted is shown. A pair of guide rails 74 extending in the X-axis direction are fixed to the mounting base 72.

  The X-axis moving block 76 is guided by a pair of guide rails 74 by a machining feed mechanism (X-axis moving mechanism) 82 including a ball screw 78 and a pulse motor 80, and is mounted so as to reciprocate in the X-axis direction.

  The chuck table 6 is mounted on the X-axis moving block 76 via a chuck table base 84 so as to be rotatable by a rotation mechanism housed in the chuck table base 84.

  A gate-shaped column 86 is erected on the rear side of the mounting base 72. A pair of guide rails 88 extending in the Y axis direction are fixed to the column 86. A first Y-axis moving block 90 is mounted on the column 86 so as to be movable in the Y-axis direction while being guided by a guide rail 88 by a first Y-axis moving mechanism 96 including a ball screw 92 and a pulse motor (not shown).

  A pair of guide rails 98 extending in the Z-axis direction are fixed to the first Y-axis moving block 90. A first Z-axis moving block 100 is mounted on the first Y-axis moving block 90 so that it can be moved in the Z-axis direction by being guided by a guide rail 98 by a first Z-axis moving mechanism 106 including a ball screw 102 and a pulse motor 104. Has been.

  A first cutting unit 108 and an imaging unit 110 are attached to the first Z-axis moving block 100. The first cutting unit 108 is configured by detachably attaching a first cutting blade to a tip portion of a spindle that is rotationally driven by a motor.

  Further, a second Y-axis moving block 90a is mounted on the portal column 86 so as to be movable in the Y-axis direction by being guided by the guide rail 88 by a second Y-axis moving mechanism 96a including a ball screw 92a and a pulse motor 94a. .

  A pair of guide rails 98a extending in the Z-axis direction are fixed to the second Y-axis moving block 90a. A second Z-axis moving block 100a is mounted on the second Y-axis moving block 90a so as to be movable in the Z-axis direction by being guided by a guide rail 98 by a second Z-axis moving mechanism 106a including a ball screw 102a and a pulse motor 104a. Has been.

  A second cutting unit 108a is attached to the second Z-axis moving block 100a. Similar to the first cutting unit 108, the second cutting unit 100a is configured such that a second cutting blade is detachably attached to the tip of a spindle that is rotationally driven by a motor.

  A second camera 64B for monitoring the chuck table base 84 is mounted on the X-axis moving block 76. The first Z-axis moving block 100 is equipped with a third camera 64C for Y-axis monitoring.

  Reference numeral 112 denotes a water case. The cutting water supplied at the time of cutting the wafer W is stored in the water case 112, and the cutting water containing cutting waste is discharged to a drain (not shown). A fourth camera 64D for monitoring leakage of cutting water from the water case 112 is attached to the mounting base 72. The fourth camera 64D can also be used for X-axis monitoring.

  Preferably, a test piece that changes color when water drops due to water leakage or when liquid is applied is placed at a position where the water cover 112 has an example of occurrence of water leakage, and the test piece is imaged by the fourth camera 64D. The color change is used as a criterion for determination by the determination unit 70.

  A test piece having a color or the like that changes depending on the temperature is placed at the imaging position of the second camera 64B for monitoring the chuck table base and / or the third camera 64C for monitoring the Y-axis, and the chuck table is obtained by imaging this. The heating of the base 84 or the heating of the ball screws 92 and 92a can be determined.

  In the above-described embodiment, the first to fourth cameras 64A to 64D are installed inside the exterior cover 14, and images captured by these cameras are displayed on the display panel 16 at a predetermined timing or an operator's instruction. Although it is possible to easily check the state of a required part without opening the exterior cover 14, the number of cameras is not limited to four, and another camera is installed at a necessary part to display on the display monitor 16. You may make it confirm the condition of the location where the camera was installed.

  Preferably, a normal captured image captured by the cameras 64A to 64D is stored in the storage unit 68 of the controller 66, and a normal captured image stored by the storage unit 68 and a new image captured by the cameras 64A to 64D. The determination unit 70 determines the occurrence of abnormality by comparing the image. When an abnormality is determined by the determination unit 70, the abnormality information is notified by a buzzer, a speaker, or a display lamp 19.

2 Cutting device 6 Chuck table 14 Exterior cover 14A First exterior cover 14B Second exterior cover 16 Display monitor 19 Display lamps 64A to 64D Camera 66 Controller 68 Storage means 70 Determination means 108 First cutting unit 108a Second cutting unit 112 Water case

Claims (4)

A chuck table for holding a workpiece, a processing means for processing the workpiece held on the chuck table, a processing feed means for moving and moving the chuck table and the processing means relative to each other, A processing device covered with an exterior cover,
First imaging means for imaging the chuck table base of the processing apparatus covered by the exterior cover, second imaging means for imaging the Y-axis ball screw of the processing apparatus covered by the exterior cover, or the Third imaging means for imaging a water case or an X-axis ball screw of the processing apparatus covered by an exterior cover ;
Further comprising said first imaging means, and display means imaging means of the second image pickup means or the third is arranged in the outer instrumentation cover for displaying an image captured, and
Processing apparatus characterized by monitoring the internal covered the processing apparatus to the external instrumentation cover situations the first imaging means, the imaging means and said display means of said second image pickup means or the third. Storage means for storing the image of the normal captured by the first imaging means, the second imaging means or said third imaging unit,
The image and the first image pickup means in the normal stored in the storage unit, compares the new image captured by the second image pickup means or said third imaging means, determining means for determining occurrence of abnormal When,
An informing means for informing abnormality information when an abnormality is determined by the determining means;
The processing apparatus according to claim 1, further comprising: The chuck table base is provided with a first test piece whose color changes when heated.
The processing apparatus according to claim 1, wherein the first imaging unit images the chuck table base and the first test piece. In the water case, the second test piece whose color is changed by applying a liquid is installed,
The processing apparatus according to any one of claims 1 to 3, wherein the third imaging unit images the water case and the second test piece.

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