JPS62102976A - High precision grooving and cutting device - Google Patents

High precision grooving and cutting device

Info

Publication number
JPS62102976A
JPS62102976A JP24142885A JP24142885A JPS62102976A JP S62102976 A JPS62102976 A JP S62102976A JP 24142885 A JP24142885 A JP 24142885A JP 24142885 A JP24142885 A JP 24142885A JP S62102976 A JPS62102976 A JP S62102976A
Authority
JP
Japan
Prior art keywords
electrode
groove
control unit
grindstone
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24142885A
Other languages
Japanese (ja)
Inventor
Minoru Yamasaka
山坂 稔
Tsuneo Oku
於久 常雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24142885A priority Critical patent/JPS62102976A/en
Publication of JPS62102976A publication Critical patent/JPS62102976A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/001Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PURPOSE:To allow correction of dimensional error in grooving and cutting by a conductive grindstone by providing a groove width measuring unit, a pulse generating source for electric discharge, an discharge shaping electrode, an electrode gap adjusting unit, and an arithmetic control unit. CONSTITUTION:A workpiece 2 is grooved by a shaped grindstone 1, and immediately thereafter, the machined groove 3 is observed by a machined groove microscope 9a and a machined groove telecamera 10a, and the observation data is sent through an edge processing unit 7 having the resolution of at least 0.2mum to an arithmetic control unit 8 to measure the dimension of the groove width. If the measured value is greater than a desired machining value stored in the arithmetic control unit 8, the control unit 8 calculates the difference between the measured value and the desired value and transmits a signal having the count of pulses corresponding to the difference to a pulse motor 5, so that the pulse motor 5 is driven under control by the amount corresponding to the difference to adjust the gap with respect to the discharge electrode 6, and the width of the grindstone 1 can be corrected by the adjusted electrode 6.

Description

【発明の詳細な説明】 〔発明の背景〕 金鵜及び特定の加工材料の44入れや切断などの加工に
、メタルボンド砥石のようなダイヤモンド、ボラゾンな
どの硬質砥粒を金属結合剤を用いて結合したいわゆる導
電性砥石が使用されている。
[Detailed Description of the Invention] [Background of the Invention] Hard abrasive grains such as diamond and borazone, such as metal bond grindstones, are used with a metal bonding agent for processing such as inserting and cutting of gold cormorant and specific processing materials. Bonded so-called conductive grinding wheels are used.

上記メタルボンド砥石の金形方法については、特開昭5
7−102753号発明があり、メタルボンド砥石を陽
極、整形用工具を陰極とし′電解液を介して通電するこ
とにより整形するものであるが、砥石の偏れ回りや、砥
石軸精度の低下などの原因により砥石の幅寸法と加工さ
れた溝幅寸法との間に(ハ、ミクロンオーダでの誤差が
あり、さらに高い寸法精度が要求される場合に社問題が
あった。
Regarding the molding method of the above-mentioned metal bond grindstone, please refer to
There is an invention No. 7-102753, in which a metal bond grindstone is used as an anode and a shaping tool is used as a cathode, and shaping is carried out by applying electricity through an electrolytic solution. Due to this, there was an error on the order of microns between the width of the grinding wheel and the width of the processed groove, which caused problems when even higher dimensional accuracy was required.

〔発明の目的〕[Purpose of the invention]

本発明は上記の問題点を解決するためになされたもので
、被加工物の溝幅の寸法誤差の少い、高精度導入切断装
置を提供することを目的とする0 〔発明の概要〕 本発明は上記の目的を達成するためになされたもので、
溝加工直後に、装置上において被加工物の溝幅の測定を
実施し、加工目標値との間の差を判定し演算制御装置に
よりv形修正電極の間隔を調整し、調整後導電性砥石の
再研削をおこなうことに特徴を肩する。
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a high-precision introduction cutting device with less dimensional error in the groove width of a workpiece. The invention was made to achieve the above objectives,
Immediately after groove machining, the groove width of the workpiece is measured on the device, the difference between it and the machining target value is determined, and the interval between the V-shaped correction electrodes is adjusted by the arithmetic and control device. It is characterized by its re-grinding.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第2図は本実施例の主要部の説明図で、1Vi砥石、2
は被加工物、3は被カロエ物2に対する加工溝、6は放
電整形電極、5は電極間調整を行なうパルスモータで、
パルス電源4は砥石11H’+を陽極、放電整形成極6
側を陰極として電圧を付加する。
Figure 2 is an explanatory diagram of the main parts of this example, including a 1Vi grindstone, a 2
is a workpiece, 3 is a machining groove for the workpiece 2, 6 is a discharge shaping electrode, 5 is a pulse motor for adjusting the electrode distance,
The pulse power source 4 uses the grinding wheel 11H'+ as an anode and the discharge shaping electrode 6
A voltage is applied using the side as a cathode.

9aは加工溝顕微鏡、 10aは加工溝テレビカメラで
、被那工物2の加工溝3を詳細に観測し、エツジ処理装
置7を経て演算制御器8に加工溝3の測定データを送る
よう曇こなっている。14はパルスモータ駆動電源であ
る。
9a is a machined groove microscope, and 10a is a machined groove television camera, which is used to observe the machined groove 3 of the workpiece 2 in detail, and transmits measurement data of the machined groove 3 to the arithmetic controller 8 via the edge treatment device 7. It's happening. 14 is a pulse motor drive power source.

一方放′亀整形電極6の上方をこけ、電極顕微鏡9b、
を極テレビカメラ10bがあり、放電整形電極6の間隔
を詳細に観測し、エツジ処理装置7を経て演算制御器8
に、放電整形電極6の間隔補正に必要なデータを送るよ
うになっている。
On the other hand, the electrode microscope 9b,
There is a polar television camera 10b that observes the interval between the discharge shaping electrodes 6 in detail, passes through the edge processing device 7, and then sends the data to the arithmetic controller 8.
The data necessary for correcting the spacing of the discharge shaping electrodes 6 is sent to the controller.

次に$1図に示す流れ図により、本実施例の加工手順を
説明する。
Next, the processing procedure of this embodiment will be explained with reference to the flowchart shown in Figure $1.

(イ)電圧、パルス幅、パルス間隔を可変に設定された
パルス電源4により、砥石5を陽極。
(a) The grinding wheel 5 is anodized by the pulse power source 4 whose voltage, pulse width, and pulse interval are set to be variable.

放電整形電極6を陰極としてパルス電圧を付加し、電極
間に水道水、または絶縁油等を供給すると共に砥石1を
回転させながら矢印H方向に移動17砥石1と放電整形
成極6との間で放電させることにより砥石1gの初期整
形を行なう。
A pulse voltage is applied using the discharge shaping electrode 6 as a cathode, tap water or insulating oil is supplied between the electrodes, and the grinding wheel 1 is rotated while moving in the direction of arrow H 17 between the grinding wheel 1 and the discharge shaping electrode 6 The initial shaping of the grinding wheel 1g is performed by discharging the grindstone.

(ロ)整形された砥石1を用いて仮別工物2に対し膚入
れを行なう。(ハ)加工溝顕微鏡9a、加工溝テレビカ
メラ10aにより加工#$5を観測し、少くとも分解能
0.2μmを有するエツジ処理装置7を経て観助jデー
タを演算制御器8に送り溝幅寸法を測定する0に)測定
値が演算制御器8に記憶されている加工目標値より小で
あれば、(ト)砥石1を1ピッチ送って、(す)次の溝
入加工を行なうが、に)で測定値が加工目標値より犬で
あれば、演算制御器8により測定値と加工目標値との差
を算出し、この差値に比例するパルス数の信Mをパルス
モータ5に送る。(へ)パルスモータ5が作物し、演算
制御器8が指令により放電整形電極6の間隔補正を行な
う。パルスモータ5を含む電極間調整部は、電極の分解
能が0.2μmパルスモータ5の精度0.5μmを保有
することが好ましい。(ト)砥石1を放′t!L整形電
極6に送り、前記(イ)と同様の操作により砥石1幅の
修正を行なう。
(b) Using the shaped grindstone 1, the temporary workpiece 2 is ground. (c) Observe the machining #$5 with the machining groove microscope 9a and the machining groove TV camera 10a, and send the observation data to the arithmetic controller 8 via the edge processing device 7 having a resolution of at least 0.2 μm to determine the groove width dimension. (0) If the measured value is smaller than the machining target value stored in the arithmetic controller 8, (g) the grinding wheel 1 is fed by one pitch, and (i) the next grooving process is performed. ), if the measured value is smaller than the machining target value, the arithmetic controller 8 calculates the difference between the measured value and the machining target value, and sends a signal M of the number of pulses proportional to this difference value to the pulse motor 5. . (f) The pulse motor 5 rotates, and the arithmetic controller 8 corrects the interval between the discharge shaping electrodes 6 according to a command. It is preferable that the electrode distance adjusting section including the pulse motor 5 has an electrode resolution of 0.2 μm and an accuracy of the pulse motor 5 of 0.5 μm. (g) Release grindstone 1! It is sent to the L-shaping electrode 6, and the width of the grindstone 1 is corrected by the same operation as in (a) above.

上述の手順において、(イ)の砥石1の初期整形時の編
幅が例えば270μm、加工目標値が250μmトスる
と、パルスモータ5により、放電整形電極6の両極を5
μm程度送り、−たん砥石1を放電整形し、上記溝幅と
加工目標値との差の1/2すなわち10μmに至るまで
繰返すことにより、加工目標値に達することができる。
In the above procedure, if the initial shaping width of the grinding wheel 1 in (a) is, for example, 270 μm and the machining target value is 250 μm, the pulse motor 5 rotates both poles of the discharge shaping electrode 6 to 5.
The machining target value can be reached by feeding the grindstone 1 by approximately μm and performing electrical discharge shaping on the grinding wheel 1, and repeating this until the difference between the groove width and the machining target value reaches 1/2, that is, 10 μm.

また上記放電整形番こより、砥石1の幅寸法減少だけで
なく、放電整形成極6の間隔も電極減耗によりわずかに
広くなるので補正が必要である。このため放電整形電極
6の上方に、電極顕微説9b、%極テレビカメラ10b
、エツジ処理装置7を設け、演算制御器8により、電極
間隔を補正する。
Further, based on the above-mentioned discharge shaping number, not only the width of the grinding wheel 1 is reduced, but also the interval between the discharge shaping electrodes 6 becomes slightly wider due to electrode wear, so correction is necessary. Therefore, above the discharge shaping electrode 6, an electrode microscope 9b and a polar television camera 10b are placed.
, an edge processing device 7 is provided, and an arithmetic controller 8 corrects the electrode spacing.

第4図は不実施例の全体を示す外観斜視図であって、1
1は本体制御部、12はモニタテレビ。
FIG. 4 is an overall external perspective view of the non-embodiment;
1 is a main body control unit, and 12 is a monitor TV.

13は操作盤である。13 is an operation panel.

また第3図は本発明の他の実施例を示す図で、放電整形
電極6と被加工物2とを互いに直角に配置したもので、
放電整形電極6を垂直に矢印V方向に移動させて、砥石
1の放電歪形を行なうものである。
FIG. 3 is a diagram showing another embodiment of the present invention, in which the discharge shaping electrode 6 and the workpiece 2 are arranged at right angles to each other.
Discharge shaping electrode 6 is moved vertically in the direction of arrow V to distort discharge shaping of grindstone 1.

上述のように装置上において加工直後に、加工溝幅の加
工誤差の補正と、放電整形電極の減耗による誤差を早期
に検出し補正することが可能となった。
As described above, immediately after machining on the apparatus, it has become possible to correct machining errors in the width of the machining groove and to detect and correct errors due to wear and tear on the discharge shaping electrodes at an early stage.

〔発明の効果〕〔Effect of the invention〕

本発明の実施により、導電性砥石による溝入れと切断加
工における寸法誤差を、装置上で修正することが可能な
高精度導入切断装置を提供することができる。
By implementing the present invention, it is possible to provide a high-precision introduction cutting device that can correct dimensional errors in grooving and cutting using a conductive grindstone on the device.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の高精度導入切断装置による一実施例の
加工流れ図、第2図は本発明の一実施例の主要部の説明
図、第6図は本発明の他の実施例の部分説明図、第4図
は第2図実施例の全体を示す斜視図である。 1・・・砥石      2・・・被加工物6・・・加
工溝     4・・・ノ(ルス電源5・・・パルスモ
ータ  6・・・放電整形電極7・・・エツジ処理装置
 8・・・演算制御器9a・・・加工溝顕微鏡 9b・
・・電極顕微鏡10a・・・加工溝テレビカメラ 10b・・・電極テレビカメラ 11・・・本体制御部   12・・・モニタテレビ1
5・・・操作盤 14・・・パルスモータ駆動電源 81 図 第 2 口 筒4 図
Fig. 1 is a processing flow chart of one embodiment of the high-precision introduction cutting device of the present invention, Fig. 2 is an explanatory diagram of the main part of one embodiment of the present invention, and Fig. 6 is a part of another embodiment of the present invention. The explanatory drawing, FIG. 4, is a perspective view showing the entire embodiment of FIG. 2. 1... Grinding wheel 2... Workpiece 6... Machining groove 4... No. (Russ power source 5... Pulse motor 6... Discharge shaping electrode 7... Edge treatment device 8... Arithmetic controller 9a... Machining groove microscope 9b.
...Electrode microscope 10a...Processed groove TV camera 10b...Electrode TV camera 11...Main body control section 12...Monitor TV 1
5...Operation panel 14...Pulse motor drive power source 81 Figure 2 Mouthpiece 4 Figure

Claims (1)

【特許請求の範囲】[Claims] 導電性砥石による溝入切断装置において、溝幅測定部と
、放電用パルス電源と、放電整形電極と、電極間調整部
及び演算制御装置から成ることを特徴とする高精度導入
切断装置。
A grooving cutting device using a conductive grindstone, which is characterized by comprising a groove width measuring section, a pulse power source for discharge, a discharge shaping electrode, an inter-electrode adjustment section, and an arithmetic control device.
JP24142885A 1985-10-30 1985-10-30 High precision grooving and cutting device Pending JPS62102976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24142885A JPS62102976A (en) 1985-10-30 1985-10-30 High precision grooving and cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24142885A JPS62102976A (en) 1985-10-30 1985-10-30 High precision grooving and cutting device

Publications (1)

Publication Number Publication Date
JPS62102976A true JPS62102976A (en) 1987-05-13

Family

ID=17074151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24142885A Pending JPS62102976A (en) 1985-10-30 1985-10-30 High precision grooving and cutting device

Country Status (1)

Country Link
JP (1) JPS62102976A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419759U (en) * 1990-06-05 1992-02-19
JPH0724939A (en) * 1993-05-19 1995-01-27 Komori Chambon Sa Rotational molding device
JP2007296604A (en) * 2006-04-28 2007-11-15 Disco Abrasive Syst Ltd Wafer cutting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419759U (en) * 1990-06-05 1992-02-19
JPH0724939A (en) * 1993-05-19 1995-01-27 Komori Chambon Sa Rotational molding device
JP2007296604A (en) * 2006-04-28 2007-11-15 Disco Abrasive Syst Ltd Wafer cutting device

Similar Documents

Publication Publication Date Title
DE4335980C2 (en) Method for positioning a workpiece holder
JPS6219986B2 (en)
JP2849387B2 (en) Method and apparatus for grinding a workpiece with a conductive grinding tool
US3301776A (en) Apparatus for electrochemical machining of metal
JPS62102976A (en) High precision grooving and cutting device
DE2939005A1 (en) METHOD AND DEVICE FOR WIRE CUTTING
JP3733538B2 (en) Positioning device and method for electric discharge machine
JPS5866662A (en) Correcting method and device for deflection of metal bond diamond grindstone by electrical discharge machining
JPH05277938A (en) Mounting type discharge truing and its device
JP2714789B2 (en) Electric discharge machine
JPS6312725B2 (en)
DE102017110196A1 (en) Method and grinding and EDM machine for machining a workpiece
JPH06114733A (en) Grinding wheel shaping method by on-machine discharge truing method
JPS6114859A (en) Molded grinding machine
JPH1043948A (en) Method of finish working by electrochemical machining
JP2686094B2 (en) Electric discharge machine
SU1653920A1 (en) Method of electrical abrasive cutting
SU854662A1 (en) Electrochemical working method
JP2886203B2 (en) Electrolytic grinding method and apparatus
JPS6171970A (en) Diamond grinder element forming method
JP3274592B2 (en) Electrolytic in-process dressing grinding method and apparatus
DE102021211670A1 (en) WAFER GRINDING PROCESS
JP2684624B2 (en) Grinding cutting device
JPS62120918A (en) Method and device for cutting difficult-to-cut material
SU1733210A1 (en) Method of disk grinding on electric drive bundle