JP5372429B2 - How to divide a plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of dividing a plate-like body in which the plate-like body is divided using two processing devices without lowering operation efficiency. <P>SOLUTION: The method of dividing the plate-like body having a plurality of division schedule lines using first and second processing devices includes: a division schedule line-detecting step of detecting at least one division schedule line by the first processing device; a processing groove-forming step of indexing all division schedule lines based upon the division schedule line detected in the division schedule line-detecting step and forming processing grooves by the first processing device along all the division schedule lines; a processing groove position information-recording step of recording positions of the formed processing grooves as processing groove position information; a processing groove position information transfer step of transferring the processing groove position information recorded in the processing groove position information recording step to the second processing device; and a dividing step of cutting the respective processing grooves by the second processing device based upon the processing groove position information transferred in the processing groove position information transfer step to divide the plate-like body. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a plate-like object dividing method for dividing a plate-like object having a plurality of division-scheduled lines using two processing apparatuses.

  Semiconductor wafers with multiple devices such as ICs and LSIs on silicon substrates, and various ceramic substrates, resin substrates, glass substrates, sapphire substrates, etc. used for electronic components are dicing equipment, laser equipment, water jets The chips are divided into individual chips by a processing device such as a device, and the divided chips are widely used in various electronic devices.

  The processing of the plate is performed along a plurality of division lines called streets formed in the plate. More specifically, after the processing means of the processing apparatus is positioned on the street, the processing means are sequentially positioned on the street by feeding the index (indexing) by a predetermined index amount (indexing amount) to form a plate shape. Divide objects into individual chips.

  However, in a wafer with poor pattern accuracy, when cutting is performed while feeding the cutting blade with a predetermined index value, the cutting blade may come off the street and process the device region.

  Therefore, in the dicing apparatus (cutting apparatus), all street positions are detected and stored by the alignment means before cutting (Japanese Patent Laid-Open No. 9-52227), or the cutting position is corrected during machining. A method has been proposed (Japanese Patent Laid-Open No. 11-283939).

  On the other hand, in processing of a semiconductor wafer having a low dielectric constant insulator film (low-k film) or a test element group (TEG) formed on the upper surface, a low-temperature sintered ceramic (LTCC), sapphire, or other difficult-to-cut materials, When it is difficult to divide with different types of processing devices, two different types of processing devices may be used.

For example, in a wafer on which a low-k film or a TEG is formed, if the cutting blade is used, clogging or clogging occurs in the cutting blade, resulting in cutting failure. Therefore, after removing the low-k film and TEG by laser irradiation using a laser processing device, a method of dividing into chips by using a dicing device to position the cutting blade in the laser processing groove and cutting it is widely adopted. (Japanese Patent Laid-Open No. 2006-190779).
Japanese Patent Laid-Open No. 9-52227 Japanese Patent Laid-Open No. 11-283939 JP 2006-190779 A

  In the case where the plate-like object is divided by using two different kinds of processing apparatuses in this manner, if the pattern accuracy of the workpiece is good, the second groove is formed after forming the processing groove with the first processing apparatus. In this machining apparatus, the machining means of the second machining apparatus can be positioned in the machining groove by index feeding the machining means with a predetermined index value.

  However, when the pattern accuracy is poor, in order to position the processing means of the second processing device in the processing groove formed by the first processing device, it is necessary to detect the processing groove by the second processing device, There is a problem that it is very inefficient.

  The present invention has been made in view of the above points, and the object of the present invention is to form a processing groove formed by the first processing apparatus when a plate-like object is divided using two processing apparatuses. It is not necessary to detect a workpiece with a second processing device, and a method for dividing a plate-like object can be provided in which the processing means of the second processing device can be easily positioned in the processing groove formed by the first processing device. It is.

According to the present invention , there is provided a plate-like object dividing method for dividing a plate-like object having a plurality of division lines using the first and second processing devices, and at least one division is performed by the first processing device. Scheduled line detection process for detecting planned lines, and all planned split lines are determined based on the planned split lines detected in the planned split line detection process, and processing is performed along all planned split lines by the first processing apparatus. A processed groove forming step for forming a groove, a processed groove position information recording step for recording the index feed position of the first processing device in the processed groove forming step as processed groove position information, and the processed groove position information recording step Based on the processing groove position information transferred in the processing groove position information transfer step and the processing groove position information transferred in the processing groove position information transfer step, Each processing groove Method of dividing a plate-like material, characterized by comprising a dividing step for cutting to divide the plate-like material, is provided.

According to the present invention, the position of the machining groove is recorded as machining groove position information while forming the machining groove along the planned division line by the first machining apparatus, and the recorded machining groove position information is transferred to the second machining apparatus. In the second processing apparatus, the processing groove of the second processing apparatus is formed by the first processing apparatus because the plate-like object is divided by cutting each processing groove based on the transferred processing groove position information. Therefore, it is possible to easily position in the processed groove, and the plate-like object can be divided with high work efficiency.

  Hereinafter, the method for dividing a plate-like object of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a schematic configuration diagram of a laser processing apparatus as a first processing apparatus suitable for use in the plate-shaped object dividing method of the present invention.

  The laser processing apparatus 2 includes a first slide block 6 mounted on a stationary base 4 so as to be movable in the X-axis direction. The first slide block 6 is moved along the pair of guide rails 14 in the machining feed direction, that is, the X-axis direction, by the machining feed means 12 including the ball screw 8 and the pulse motor 10.

  A second slide block 16 is mounted on the first slide block 6 so as to be movable in the Y-axis direction. That is, the second slide block 16 is moved in the indexing direction, that is, the Y-axis direction along the pair of guide rails 24 by the indexing feeding means 22 constituted by the ball screw 18 and the pulse motor 20.

  A chuck table 28 is mounted on the second slide block 16 via a cylindrical support member 26, and the chuck table 28 can be moved in the X-axis direction and the Y-axis direction by the processing feed means 12 and the index feed means 22. . The chuck table 28 is provided with a clamper 30 for clamping a work such as an LED wafer sucked and held by the chuck table 28.

  A column 32 is erected on the stationary base 4, and a casing 35 accommodating a laser beam oscillation means 34 is attached to the column 32. The processing laser beam oscillated from the laser beam oscillating means 34 is condensed by an objective lens of a condenser 36 attached to the tip of the casing 35 and irradiated onto a workpiece such as a semiconductor wafer held on the chuck table 28. Is done.

  At the tip of the casing 35, an image pickup means 38 for detecting a processing region to be laser processed by a laser beam oscillated from the processing laser beam oscillating means aligned with the condenser 36 in the X-axis direction is disposed. Yes.

  The image pickup means 38 includes, in addition to an image pickup device such as a normal CCD that picks up an image with visible light, an infrared irradiation means for irradiating the work with infrared rays, an optical system for capturing the infrared rays irradiated by the infrared irradiation means, and this optical system Infrared imaging means including an infrared imaging element such as an infrared CCD that outputs an electrical signal corresponding to the captured infrared light is included, and the captured image signal is transmitted to a controller (control means) 40 described later.

  The controller 40 includes a central processing unit (CPU) 42 that performs arithmetic processing according to a control program, a read-only memory (ROM) 44 that stores a control program, and a random read / write that stores arithmetic results. An access memory (RAM) 46, a counter 48, an input interface 50, and an output interface 52 are provided.

  Reference numeral 56 denotes a processing feed amount detection means comprising a linear scale 54 disposed along the guide rail 14 and a read head (not shown) disposed on the first slide block 6. Is input to the input interface 50 of the controller 40.

  Reference numeral 60 denotes index feed amount detection means comprising a linear scale 58 disposed along the guide rail 24 and a read head (not shown) disposed on the second slide block 16. The detection signal is input to the input interface 50 of the controller 40.

  An image signal picked up by the image pickup means 38 is also input to the input interface 50 of the controller 40. On the other hand, a control signal is output from the output interface 52 of the controller 40 to the pulse motor 10, the pulse motor 20, the laser beam oscillation means 34, and the like.

  As shown in FIG. 2, the first street S <b> 1 and the second street S <b> 2 are orthogonal to each other on the surface of the semiconductor wafer W on which the low-k film or TEG to be processed by the laser processing apparatus 2 is formed. A large number of devices D are formed in a region partitioned by the first street S1 and the second street S2.

  The wafer W is attached to a dicing tape T that is an adhesive tape, and the outer periphery of the dicing tape T is attached to an annular frame F. As a result, the wafer W is supported by the annular frame F via the dicing tape T, and is supported and fixed on the chuck table 28 by clamping the annular frame F by the clamper 30 shown in FIG.

  Hereinafter, a processing method (division method) of the semiconductor wafer W by the laser processing apparatus 2 configured as described above will be described. First, the imaging means 38 images the wafer W and detects at least one street (division planned line) S1. That is, at least one street S1 is aligned with respect to the condenser 36. The other streets S1 are determined based on patterning design data.

  As an alternative, the alignment may be executed for two streets S1 or three or more streets S1 that are flying apart, and the other streets S1 may be determined based on the patterning design data. For semiconductor wafers W with poor patterning accuracy, alignment may be executed for all streets S1.

  Next, the chuck table 28 is rotated 90 degrees to detect the street S2. That is, the street S2 is aligned with the condenser 36. Regarding the alignment of the street S2, as in the case of the street S1, the alignment may be executed on at least one street S2, a plurality of streets S2, or all the streets S2.

When the indexing for all the streets S1 is completed, the laser beam oscillating means 34 is driven to irradiate the wafer W from the condenser 36, and the processing grooves 62 are formed along the streets S1. As the laser beam oscillated from the laser beam oscillation means 34, for example, a laser beam having a wavelength of 355 nm, which is the third harmonic of a YAG laser, is used.

  The processing grooves 62 are formed along all the streets S1 while indexing and feeding the wafer W in the Y-axis direction. Next, the chuck table 28 is rotated 90 degrees, and the machining grooves 62 are formed along all the streets S2 while indexing and feeding the chuck table 28 in the Y-axis direction. FIG. 3 shows a state in which the machining grooves 62 are formed along all the streets S1 and S2. 4 is a partially enlarged sectional view of FIG.

  In the processing method of the first embodiment, the position of the formed processing groove 62 is written (recorded) in the RAM 46 of the controller 40 as processing groove position information. In the processing groove position information recording step of the processing method of the first embodiment, the index feed position of the laser processing apparatus 2 may be recorded, or the position is recorded by a kerf check (the processing groove 62 is actually detected by a camera). You may make it do.

  In the processing method of the second embodiment, all streets S1 and S2 are determined based on the detected streets S1 and S2, and before the wafer W is processed with the laser beam, the positions of all the streets S1 and S2 are set to the street positions. Information (scheduled line position information) is recorded in the RAM 46 of the controller 40. Next, based on the position information of the streets S1 and S2 recorded in the RAM 46, the processing grooves 62 are formed along the streets S1 and S2.

  When the processing grooves 62 are formed along all the streets S1 and S2 of the wafer W in this way, the processing using the laser processing device 2 that is the first processing device is completed. Next, cutting is performed along the processing groove 62 using a dicing device (cutting device) 64 as a second processing device as shown in FIG. FIG. 5 shows the appearance of the cutting device 2.

  On the front side of the cutting device 64, operating means 66 is provided for an operator to input instructions to the device such as machining conditions. In the upper part of the apparatus, there is provided a display means 68 such as a CRT on which a guide screen for an operator and an image taken by an imaging means described later are displayed.

  As shown in FIG. 3, the wafer in which the machining grooves 62 are formed along all the streets S1 and S2 is supported by the frame F via the dicing tape T, and the wafer is contained in the wafer cassette 70 shown in FIG. A plurality of sheets (for example, 25 sheets) are accommodated. The wafer cassette 70 is placed on a cassette elevator 71 that can move up and down.

  Behind the wafer cassette 70, a loading / unloading means 72 for unloading the wafer W before cutting from the wafer cassette 70 and loading the wafer after cutting into the wafer cassette 70 is disposed.

  Between the wafer cassette 70 and the carry-in / out means 72, a temporary placement area 74, which is an area on which a wafer to be carried in / out, is temporarily placed is provided. In the temporary placement area 74, a wafer W is placed. Positioning means 76 for positioning at a fixed position is provided.

  In the vicinity of the temporary placement region 74, a transport means 78 having a turning arm that sucks and transports the frame F integrated with the wafer W is disposed, and the wafer W carried out to the temporary placement region 74 is It is attracted by the transport means 78 and transported onto the chuck table 80 and is sucked by the chuck table 80, and the frame F is clamped by a plurality of clamps 81 and held on the chuck table 80.

  The chuck table 80 is configured to be rotatable and reciprocally movable in the X-axis direction. Above the movement path of the chuck table 80 in the X-axis direction, an alignment unit 82 that detects a street to be cut of the wafer W is provided. It is arranged.

  The alignment unit 82 includes an imaging unit 84 that images the surface of the wafer W, and can detect a street to be cut by processing such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 84 is displayed on the display unit 68.

  It should be noted that in the processing method of the present invention, the processing groove position information or street position information formed in the streets S1 and S2 to be cut by the cutting device 64 is the same as that of the laser processing device 2 that is the first processing device. Since this information is recorded in the RAM 46, alignment by the alignment means 82 is not necessary.

  On the left side of the alignment means 82, a cutting means 86 for cutting the wafer W held on the chuck table 80 is disposed. The cutting means 86 is configured integrally with the alignment means 82, and both move in conjunction with each other in the Y-axis direction and the Z-axis direction.

  The cutting means 86 is configured by mounting a cutting blade 90 on the tip of a rotatable spindle 88 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 90 is roughly located on the extension line of the imaging means 84 in the X-axis direction.

  According to the processing method of the first embodiment of the present invention, the processing groove position information recorded in the RAM 46 of the laser processing apparatus 2 is transferred to the cutting apparatus 64 by connecting the laser processing apparatus 2 and the cutting apparatus 64 with a LAN cable, for example. . The transferred machining groove position information is recorded in the memory of the controller of the cutting device 2.

  According to the processing method of the second embodiment of the present invention, street (division planned line) position information recorded in the RAM 46 of the laser processing apparatus 2 is transferred to the cutting apparatus 64. The transferred street position information is recorded in the memory of the controller of the cutting device 64.

  Transfer of machining groove position information or street position information from the laser processing device 2 to the cutting device 64 is not limited to a LAN cable, for example, data recorded in the laser processing device 2 is copied to a USB memory or the like, The USB memory may be inserted into a predetermined slit of the controller of the cutting device 64 to transfer data to the memory of the cutting device 64.

  The cutting device 64 divides the wafer W into individual devices (chips) by cutting each processed groove 62 based on the processed groove position information or street position information transferred from the laser processing apparatus 2.

  What should be noted here is the setting of the wafer W on which the processing groove 62 is formed on the chuck table 80, the origin position of the wafer W held on the chuck table 28 of the laser processing apparatus 2, and the cutting apparatus 64. That is, it is necessary to match the origin position of the wafer W held on the chuck table 80.

  In the cutting device 64, each processing groove 62 may be cut by the cutting blade 90 based on the processing groove position information or street position information transferred from the laser processing device 2, so that the alignment by the alignment means 82 of the cutting device 64 is performed. There is no need to implement.

  6 shows a perspective view of a state in which all the processing grooves 62 are cut by the cutting blade 90 and the wafer W is divided into individual devices D. FIG. 7 is a partially enlarged sectional view of FIG.

  According to the wafer dividing method of each embodiment described above, it is not necessary to detect the processing groove 62 formed by the laser processing apparatus 2 as the first processing apparatus with the cutting apparatus 64 as the second processing apparatus. The 64 cutting blades 90 can be easily positioned in the processing groove 62 formed by the laser processing apparatus 2, and the wafer W can be divided into the individual devices D without reducing the work efficiency.

  In the above-described embodiment, the example in which the laser processing apparatus is used as the first processing apparatus and the dicing apparatus is used as the second processing apparatus has been described, but the combination of the processing apparatuses in the present invention is not limited to this.

  For example, a dicing device may be used for both the first and second processing devices, or a laser processing device may be used. Alternatively, as the first and second processing devices, an appropriate combination may be selected from a laser processing device, a dicing device, and a water jet processing device.

  Moreover, the plate-like object as a workpiece is not limited to a semiconductor wafer, but can be applied to plate-like objects such as various ceramic substrates, resin substrates, glass substrates, sapphire substrates, and CPS substrates used for electronic components. it can.

It is a schematic block diagram of the laser processing apparatus which is a 1st processing apparatus. It is a perspective view which shows the wafer integrated with the flame | frame. It is a perspective view of the wafer supported by the flame | frame which shows the state in which the process groove | channel was formed along each street. It is a partially expanded sectional view of FIG. It is a schematic block diagram of the cutting device which is a 2nd processing apparatus. It is a perspective view of the wafer supported by the frame of the state where each processing groove was cut. It is a partially expanded sectional view of FIG.

Explanation of symbols

2 Laser processing device 28 Chuck table 34 Laser beam oscillation means 36 Condenser 38 Imaging means 40 Controller 62 Cutting groove 64 Cutting device 80 Chuck table 86 Cutting means 90 Cutting blade 96 Cutting groove

Claims (1)

A plate-like object dividing method for dividing a plate-like object having a plurality of division lines by using the first and second processing devices,
A division-scheduled line detection step of detecting at least one division-scheduled line with the first processing apparatus;
A machining groove forming step of determining all the division lines based on the division lines detected in the division line detection step, and forming machining grooves along all the division lines with the first machining apparatus;
A machining groove position information recording step for recording the index feed position of the first machining apparatus in the machining groove forming step as machining groove position information;
A machining groove position information transfer step of transferring the machining groove position information recorded in the machining groove position information recording step to a second machining apparatus;
Based on the machining groove position information transferred in the machining groove position information transfer step, a dividing step of cutting the machining grooves with a second machining device to divide the plate-like object,
A method for dividing a plate-like object, comprising:

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