JP5666876B2 - Method for dividing multilayer ceramic capacitor substrate - Google Patents

Description

  The present invention relates to a method for dividing a multilayer ceramic capacitor substrate in which the multilayer ceramic capacitor substrate is divided into individual chip capacitors.

  The multilayer ceramic capacitor substrate is formed by alternately laminating a ceramic layer and an electrode layer having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice pattern, and laminating the ceramic layer on the top layer. It is configured in shape. The structure of this multilayer ceramic capacitor substrate will be described with reference to FIGS. A multilayer ceramic capacitor substrate 10 shown in FIGS. 1 and 2 is formed on the surface of a glass substrate 11 with a tape 12 serving as a separation layer. That is, as shown in FIG. 2, a raw ceramic is applied on a tape 12 stuck on the surface of a glass substrate 11 to form a raw ceramic layer 110 having a thickness of about 5 μm. The electrode layer 120 having a thickness of about 1 μm is formed by screen printing of an electrode metal such as. As shown in FIG. 1, the electrode layer 120 is formed with a plurality of electrodes 121 partitioned in a lattice pattern. The raw ceramic layers 110 and the electrode layers 120 thus formed are alternately laminated by about 200 layers, and the raw ceramic layer 110 is formed as the uppermost layer as shown in FIG.

  In the multilayer ceramic capacitor substrate 10 configured as described above, the ceramic layer 110 is formed on the uppermost layer, and the position of the electrode cannot be confirmed from the surface. Therefore, when dividing into individual chip capacitors, The position of the electrode 121 cannot be confirmed. Therefore, by forming a V groove in a region adjacent to a pair of opposite sides of the multilayer ceramic capacitor substrate 10 using a V-shaped cutting blade, the electrode exposed on the wall surface of the V groove. To recognize. When dividing the raw multilayer ceramic capacitor substrate 10 before sintering thus configured into individual chip capacitors, the tape 12 on which the multilayer ceramic capacitor substrate 10 is laminated is peeled off from the glass substrate 11, and the tape 12 is removed. The laminated ceramic capacitor substrate 10 is mounted on an annular frame F as shown in FIG.

A method for dividing the multilayer ceramic capacitor substrate 10 described above into individual chip capacitors is disclosed in Patent Document 1 below.
The method for dividing a multilayer ceramic capacitor substrate disclosed in the following Patent Document 1 is divided into individual chip capacitors through the steps described below.
(1) A V-groove having a width of 1 to 2 mm is formed in a region adjacent to a pair of opposite sides of the multilayer ceramic capacitor substrate 10 by using a cutting blade having a V-shaped cross section on the outer periphery to display an electrode. Electrode exposure process to be taken out.
(2) An alignment process in which the electrode exposed in the electrode exposing process is imaged and detected by the imaging means, and the cutting area is set while relatively indexing and feeding the imaging means and the multilayer ceramic capacitor substrate 10.
(3) A dividing step in which the cutting blade is positioned in the cutting region set by the alignment step and the cutting blade and the multilayer ceramic capacitor substrate 10 are relatively cut and fed to divide into individual ceramic capacitors.

Patent No. 4509243

The method for dividing a multilayer ceramic capacitor substrate disclosed in Patent Document 1 is performed by a single cutting device equipped with a cutting means having a V-shaped cutting blade and a cutting means having a cutting blade for cutting. For this reason, the cutting means provided with the cutting blade is inactive while the alignment process for setting the cutting region by forming the V groove by the cutting means provided with the V-shaped cutting blade is inactive. Since the cutting means provided with the V-shaped cutting blade is suspended while the dividing step is performed by the cutting means provided with the cutting blade for cutting, there is a problem that productivity is poor.
Further, the time required for the electrode exposing process for forming the V groove by the cutting means provided with the V-shaped cutting blade is less than half of the time required for the dividing process for cutting by the cutting means provided with the cutting blade for cutting. Therefore, the cutting means provided with the V-shaped cutting blade is particularly inferior in productivity because it has been suspended for more than twice the operating time.

  The present invention has been made in view of the above facts, and its main technical problem is to provide a method for dividing a multilayer ceramic capacitor substrate that can efficiently divide the multilayer ceramic capacitor substrate into individual chip capacitors. is there.

In order to solve the main technical problem, according to the present invention, a ceramic layer and an electrode layer having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice pattern are alternately stacked, A division method of dividing a multilayer ceramic capacitor substrate having a rectangular shape by laminating ceramic layers on a layer into individual chip capacitors partitioned in a lattice pattern,
An ID mark setting step for setting an ID mark on the multilayer ceramic capacitor substrate;
An electrode exposing step of forming a pair of inclined grooves adjacent to a pair of opposite sides of the multilayer ceramic capacitor substrate using the first processing apparatus and exposing the electrode;
An image is picked up by an image pickup means for picking up the electrode exposed in the electrode exposing step, a cutting coordinate value relating to an intermediate position between the electrodes is detected, and cutting position information of the multilayer ceramic capacitor substrate in which the ID mark is set is obtained. Cutting position information creation process to create,
Using the second processing device, the cutting position information is obtained by reading the ID mark set on the multilayer ceramic capacitor substrate on which the cutting position information creating step has been performed, and the multilayer ceramic capacitor is obtained based on the cutting position information. and a cutting step of cutting the substrate, only including,
The second processing apparatus includes an angle detection step of detecting an angle of two inclined grooves formed on the multilayer ceramic capacitor substrate, and an angle of the two inclined grooves detected in the angle detection step. In the case of an angle (α) that is not 90 degrees, a cutting position information correction step for correcting the cutting position information is performed before the cutting step.
A method for dividing a multilayer ceramic capacitor substrate is provided.

Upper SL cutting position information correction step is corrected to a value of intervals between the cutting position by multiplying the sinα in the interval.

The method for dividing a multilayer ceramic capacitor substrate according to the present invention uses a first processing device and a second processing device, performs at least an electrode exposing step by the first processing device, and reduces the work time by the second processing device. Since the necessary cutting process is performed, a production line with high production efficiency can be constructed by setting the number of first processing devices and second processing devices in consideration of the working time.
Also, the ID mark setting step and the cutting position information creation step are performed using a dedicated ID mark setting device and cutting position information creation device, respectively, and the electrode exposing step by the first processing device and the cutting by the second processing device are performed. By setting the number of the first processing device 1, the ID mark setting device, the cutting position information creation device, and the second processing device in consideration of the time required for the process, a production line with high production efficiency can be constructed. it can.
Further, the ID mark setting process, the electrode exposing process, and the cutting position information creating process are performed by the first processing apparatus, and the cutting process requiring a lot of work time is performed by the second processing apparatus. The work time can be averaged, and productivity can be improved.
Further, the second processing apparatus includes an angle detection step of detecting an angle of two inclined grooves formed on the multilayer ceramic capacitor substrate and an angle of the two inclined grooves detected in the angle detection step. When the angle is not 90 degrees (α), the cutting position information correcting step for correcting the cutting position information is performed before the cutting step, so that distortion occurs when the raw multilayer ceramic capacitor substrate is conveyed. Can be cut at a predetermined cutting position.

The perspective view which fractures | ruptures and shows a part of multilayer ceramic capacitor board | substrate divided | segmented into each chip capacitor by the division | segmentation method of the multilayer ceramic capacitor board | substrate by this invention. The AA cross-section enlarged view of the multilayer ceramic capacitor substrate shown in FIG. The perspective view which shows the state which mounted | wore the cyclic | annular flame | frame with the tape on which the multilayer ceramic capacitor board | substrate shown in FIG. 1 was laminated | stacked. The perspective view which shows the 1st processing apparatus for enforcing the division | segmentation method of the multilayer ceramic capacitor board | substrate by this invention. The block diagram of the control means with which the 1st processing apparatus shown in FIG. 4 is equipped. The top view of the multilayer ceramic capacitor board | substrate in which the ID mark setting process in the division | segmentation method of the multilayer ceramic capacitor board | substrate by this invention was implemented. The top view of the multilayer ceramic capacitor board | substrate in which the electrode exposure process in the division | segmentation method of the multilayer ceramic capacitor board | substrate by this invention was implemented. The perspective view which shows the 2nd processing apparatus for enforcing the division | segmentation method of the multilayer ceramic capacitor board | substrate by this invention. The block diagram of the control means with which the 2nd processing apparatus shown in FIG. 8 is equipped. Explanatory drawing of the angle detection process in the division | segmentation method of the multilayer ceramic capacitor board | substrate by this invention.

  Hereinafter, preferred embodiments of a method for dividing a multilayer ceramic capacitor substrate according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 4 is a perspective view of a first processing apparatus used in the method for dividing a multilayer ceramic capacitor substrate according to the present invention.
The first processing apparatus 1 shown in FIG. 4 is provided with a stationary base 2 and a stationary base 2 movably disposed in a machining feed direction (X-axis direction) indicated by an arrow X to hold a workpiece. A chuck table mechanism 3, a spindle support mechanism 4 disposed on the stationary base 2 so as to be movable in an index feed direction (Y-axis direction) indicated by an arrow Y perpendicular to the machining feed direction (X-axis direction), A spindle unit 5 as a cutting means and a laser beam irradiation means 6 are arranged on the spindle support mechanism 4 so as to be movable in a cutting feed direction (Z-axis direction) indicated by an arrow Z perpendicular to the holding surface of the chuck table described later. It has.

  The chuck table mechanism 3 includes a pair of guide rails 31, 31 arranged on the stationary base 2 in parallel along the machining feed direction (X-axis direction) indicated by an arrow X, and the guide rails 31, 31. The first sliding block 32 is movably disposed in the machining feed direction (X-axis direction), and is disposed on the first sliding block 32 so as to be movable in the indexing feed direction (Y-axis direction). A second sliding block 33, a cover table 35 supported on the second sliding block 33 by a cylindrical member 34, and a chuck table 36 as a workpiece holding means are provided. The chuck table 36 includes a suction chuck 361 formed of a porous material, and holds, for example, a disk-shaped semiconductor wafer, which is a workpiece, on a holding surface which is the upper surface of the suction chuck 361 by suction means (not shown). It is supposed to be. The chuck table 36 configured as described above is rotated by a pulse motor 340 (M1) disposed in the cylindrical member 34. The chuck table 36 is provided with a clamp 362 for fixing the annular frame F.

  The first sliding block 32 has a pair of guided grooves 321 and 321 fitted to the pair of guide rails 31 and 31 on the lower surface thereof, and an index feed direction (Y-axis direction) on the upper surface thereof. A pair of guide rails 322 and 322 formed in parallel with each other are provided. The first sliding block 32 configured as described above is configured such that the guided grooves 321 and 321 are fitted into the pair of guide rails 31 and 31 so that the processing feed direction (X It is configured to be movable in the axial direction. The chuck table mechanism 3 in the illustrated embodiment includes a machining feed means 37 for moving the first sliding block 32 along the pair of guide rails 31 and 31 in the machining feed direction (X-axis direction). . The processing feed means 37 includes a male screw rod 371 disposed in parallel between the pair of guide rails 31 and 31, and a drive source such as a pulse motor 372 (M2) for rotationally driving the male screw rod 371. It is out. One end of the male screw rod 371 is rotatably supported by a bearing block 373 fixed to the stationary base 2, and the other end is connected to the output shaft of the pulse motor 372 (M2). The male screw rod 371 is screwed into a penetrating female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the first sliding block 32. Therefore, the first sliding block 32 is moved along the guide rails 31 and 31 in the machining feed direction (X-axis direction) by driving the male screw rod 371 forward and backward by the pulse motor 372 (M2).

  The chuck table mechanism 3 in the illustrated embodiment includes X-axis direction position detecting means 374 for detecting the position of the chuck table 36 in the X-axis direction. The X-axis direction position detecting means 374 moves along the linear scale 374a together with the linear scale 374a disposed along the guide rail 31 and the first sliding block 32 along the linear scale 374a. It consists of a read head 374b (LS1). In the illustrated embodiment, the reading head 374b (LS1) of the X-axis direction position detecting means 374 sends a pulse signal of one pulse every 1 μm to the control means described later.

  The second sliding block 33 is provided with a pair of guided grooves 331 and 331 which are fitted to a pair of guide rails 322 and 322 provided on the upper surface of the first sliding block 32 on the lower surface thereof. By fitting the guided grooves 331 and 331 to the pair of guide rails 322 and 322, the guided grooves 331 and 331 are configured to be movable in the indexing feed direction (Y-axis direction). The chuck table mechanism 3 in the illustrated embodiment moves the second slide block 33 in the indexing feed direction (Y-axis direction) along a pair of guide rails 322 and 322 provided on the upper surface of the first slide block 32. First index feeding means 38 is provided. The first index feed means 38 is driven by a male screw rod 381 disposed in parallel between the pair of guide rails 322 and 322, and a pulse motor 382 (M3) for rotationally driving the male screw rod 381. Contains sources. One end of the male screw rod 381 is rotatably supported by a bearing block 383 fixed to the upper surface of the first sliding block 32, and the other end is connected to the output shaft of the pulse motor 382 (M3). ing. The male screw rod 381 is screwed into a through female screw hole formed in a female screw block (not shown) provided on the lower surface of the center portion of the second sliding block 33. Accordingly, by driving the male screw rod 381 forward and backward by the pulse motor 382 (M3), the second sliding block 33 is moved along the guide rails 322 and 322 in the index feed direction (Y-axis direction).

  The chuck table mechanism 3 in the illustrated embodiment includes Y-axis direction position detecting means 384 for detecting the Y-axis direction position of the second sliding block 33 (chuck table 36). The Y-axis direction position detecting means 384 is a linear scale 384a disposed along the guide rail 322, and a reading which is disposed along the linear scale 384a together with the second sliding block 33 disposed along the second sliding block 33. It consists of a head 384b (LS2). In the illustrated embodiment, the reading head 384b (LS2) of the Y-axis direction position detecting means 384 sends a pulse signal of 1 pulse to the control means described later for every 1 μm.

  The spindle support mechanism 4 includes a pair of guide rails 41 and 41 disposed in parallel along the indexing feed direction (Y-axis direction) indicated by an arrow Y on the stationary base 2, and the guide rails 41 and 41 above. The movable support base 42 is provided so as to be movable in the index feed direction (Y-axis direction). The movable support base 42 includes a movement support portion 421 that is movably disposed on the guide rails 41, 41, and a mounting portion 422 that is attached to the movement support portion 421. The mounting portion 422 is provided on one side with a pair of guide rails 423 and 423 extending in the cutting feed direction (Z-axis direction) indicated by an arrow Z perpendicular to the workpiece holding surface of the chuck table 36. . The spindle support mechanism 4 in the illustrated embodiment includes second index feed means 43 for moving the movable support base 42 along the pair of guide rails 41, 41 in the index feed direction (Y-axis direction). ing. The second index feeding means 43 includes a male screw rod 431 arranged in parallel between the pair of guide rails 41, 41, and a drive of a pulse motor 432 (M4) or the like for rotationally driving the male screw rod 431. Contains sources. One end of the male screw rod 431 is rotatably supported by a bearing block (not shown) fixed to the stationary base 2, and the other end is connected to the output shaft of the pulse motor 432 (M4). The male screw rod 431 is screwed into a female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the moving support portion 421 constituting the movable support base 42. Therefore, the movable support base 42 is moved along the guide rails 41 and 41 in the indexing feed direction (Y-axis direction) by driving the male screw rod 431 forward and backward by the pulse motor 432 (M4).

  The spindle unit 5 in the illustrated embodiment includes a unit holder 51, a spindle housing 52 attached to the unit holder 51, and a rotating spindle 53 that is rotatably supported by the spindle housing 52. The unit holder 51 is provided with a pair of guided grooves 511 and 511 that are slidably fitted to a pair of guide rails 423 and 423 provided in the mounting portion 422. By being fitted to the guide rails 423 and 423, the guide rails 423 and 423 are supported so as to be movable in the cutting feed direction (Z-axis direction) perpendicular to the holding surface of the chuck table 36. The rotary spindle 53 is disposed so as to protrude from the tip of the spindle housing 52, and a V-groove forming cutting blade 54 for forming an inclined groove is attached to the tip of the rotary spindle 53. The V-groove forming cutting blade 54 includes a V-groove-forming cutting blade having a V-shaped cross-section at the outer periphery. The rotary spindle 53 on which the V-groove forming cutting blade 54 is mounted is driven to rotate by a drive source such as a servo motor 55 (M5).

  The spindle unit 5 in the illustrated embodiment includes a cutting feed means 56 for moving the unit holder 51 along the two guide rails 423 and 423 in the cutting feed direction (Z-axis direction). The notch feeding means 56 includes a male screw rod (not shown) disposed between the guide rails 423 and 423 in the same manner as the processing feeding means 37, the first index feeding means 38, and the second index feeding means 43. A drive source such as a pulse motor 562 (M6) for rotationally driving the male screw rod is included. By driving the male screw rod (not shown) forward and reverse by the pulse motor 562 (M6), the unit holder 51 and The spindle housing 52 and the rotary spindle 53 are moved along the guide rails 423 and 423 in the Z-axis direction.

  The spindle unit 5 in the illustrated embodiment includes Z-axis direction position detection means 57 for detecting the Z-axis direction position (cut feed position) of the V-groove forming cutting blade 54. The Z-axis direction position detecting means 57 includes a linear scale 57a disposed in parallel with the guide rails 423 and 423, and a reading head 57b (attached to the unit holder 51 and moved along the linear scale 57a together with the unit holder 51. LS3). In the illustrated embodiment, the reading head 57b (LS3) of the Z-axis direction position detecting means 57 sends a pulse signal of one pulse every 1 μm to the control means described later.

  The laser beam irradiation means 6 is attached to the unit holder 51 of the spindle unit 5 configured as described above. The laser beam application means 6 includes a cylindrical casing 61 arranged substantially horizontally. In the casing 61, there are disposed a pulsed laser beam oscillation means having a pulsed laser beam oscillator and a repetition frequency setting means (not shown) composed of a YAG laser oscillator or a YVO4 laser oscillator. A condenser 62 for condensing the pulse laser beam oscillated from the pulse laser beam oscillation means is attached to the tip of the casing 61.

  The first processing apparatus 1 in the illustrated embodiment includes an imaging means 7 (SD) disposed at the front end portion of the spindle housing 52. The image pickup means 7 (SD) includes an image pickup device (CCD) composed of a plurality of pixels, an optical system such as a microscope, and the like, and sends a picked-up image signal to a control means described later. The imaging means 7 (SD) configured in this way has the center of the imaging area disposed on the same line in the X-axis direction as the V-groove forming cutting blade 54 and the condenser 62.

  The first processing apparatus 1 in the illustrated embodiment includes a control means 20 as shown in FIG. The control means 20 is configured by a computer, and a central processing unit (CPU) 201 that performs arithmetic processing according to a control program, a read-only memory (ROM) 202 that stores control programs and the like, and a read / write that stores arithmetic results and the like. A random access memory (RAM) 203, an input interface 204, and an output interface 205 are provided. The input interface 204 of the control unit 20 configured as described above includes a read head 374b (LS1) of the X-axis direction position detection unit 374 and a read head 384b (LS2) of the Y-axis direction position detection unit 384 shown in FIG. Detection signals from the reading head 57b (LS3), the imaging means 7 (SD), the input means (IM), etc. of the Z-axis direction position detecting means 57 are inputted. From the output interface 205, the pulse motor 340 (M1), the pulse motor 372 (M2), the pulse motor 382 (M3), the pulse motor 432 (M4), the servo motor 55 (M5), the pulse motor 562 (M6), A control signal is output to the laser beam irradiation means 6 and the display means (DP), and a control signal is output to a transmission means (SM) that transmits to a second cutting apparatus described later.

The first processing device 1 in the illustrated embodiment is configured as described above, and the multilayer ceramic capacitor substrate 10 in the method for dividing the multilayer ceramic capacitor substrate according to the present invention, which is performed using the first processing device 1. An ID mark setting process for setting an ID mark will be described.
As shown in FIG. 3, the tape 12 side on which the ceramic capacitor substrate 10 mounted on the annular frame F is stacked is placed on the chuck table 36 of the first processing apparatus 1 shown in FIG. Then, by operating a suction means (not shown), the ceramic capacitor substrate 10 is sucked and held on the chuck table 36 via the tape 12 (wafer holding step). The annular frame F that supports the ceramic capacitor substrate 10 via the tape 12 is fixed by a clamp 362. The chuck table 36 that sucks and holds the ceramic capacitor substrate 10 in this way is moved to a position immediately below the image pickup means 7 (SD).

  If the chuck table 36 is positioned immediately below the image pickup means 7 (SD), the image pickup means 7 (SD) picks up an image of the ceramic capacitor substrate 10 held on the chuck table 36 and confirms the region for processing the ID mark. The ID mark processing area is positioned immediately below the condenser 62 of the laser beam irradiation means 6. Then, the laser beam irradiating means 6 is operated, and the processing feeding means 37 and the first indexing feeding means 38 are alternately operated to bring the ID mark processing region of the ceramic capacitor substrate 10 held on the chuck table 36 into FIG. As shown, an ID mark 100 made of a barcode is formed (ID mark setting step). The ID mark 100 is formed, for example, based on a control signal output from the control means 20 to the laser beam irradiation means 6 by the code number input by the operator from the input means (IM).

  When the ID mark setting step described above is performed, the chuck table 36 that sucks and holds the ceramic capacitor substrate 10 again is moved to a position immediately below the image pickup means 7 (SD), and the ceramic capacitor substrate 10 is moved by the image pickup means 7 (SD). One side is detected, and the chuck table 36 is rotated and adjusted so that the one side coincides with the machining feed direction indicated by the arrow X in FIG. Then, an alignment operation is performed between the V-groove forming cutting blade 54 and the cutting region inside a predetermined distance from one side of the ceramic capacitor substrate 10. Thereafter, while the V-groove forming cutting blade 54 is rotated in a predetermined direction, the chuck table 36 holding the ceramic capacitor substrate 10 by suction is moved in the machining feed direction indicated by the arrow X (perpendicular to the rotation axis of the V-groove forming cutting blade 54). The V-groove 130 having a width of 1 to 2 mm is formed on the surface of the ceramic capacitor substrate 10 as shown in FIG. By carrying out this V groove forming operation on a cutting region adjacent to a pair of sides facing each other as shown in FIG. 7, the electrodes 121 are exposed in each V groove 130 (electrode exposing step).

  Next, the chuck table 36 is positioned directly below the imaging means 7 (SD). Then, based on the electrode 121 exposed to the V-groove 130 by the electrode exposing process described above, the cut coordinate value regarding the intermediate position between the electrodes 121 is detected, and the multilayer ceramic capacitor substrate 10 on which the ID mark 100 is set. The cutting position information creating step for creating the cutting position information is executed. That is, the position where the preset first electrode 121 is formed immediately under the image pickup means 7 (SD) is positioned, and the image pickup means 7 (SD) picks up the image and confirms the coordinate value. Temporarily stored in random access memory (RAM) 203. If the coordinate values of the first electrode 121 are stored in the random access memory (RAM) 203 in this way, the imaging means 7 (SD) is set in correspondence with a predetermined interval of the area to be cut. Then, the index is fed in the direction indicated by the arrow Y, the next electrode 121 is imaged, and the coordinate value is detected. Then, the coordinate value detection operation of this electrode 121 is executed for all the electrodes 121 exposed in the V-groove 130. And the control means 20 calculates | requires the intermediate position of each electrode 121, and temporarily stores this intermediate position coordinate value in the random access memory (RAM) 203 as a cutting coordinate value. Further, the control means 20 detects whether or not the straight line connecting the opposing electrode 121 and the electrode 121 is inclined with respect to the X-axis direction, and temporarily stores the inclination angle (θ) in the random access memory (RAM) 203. .

When the cutting position information creation step is executed as described above, the control unit 20 transmits the ID mark 100 set together with the cutting coordinate value of the ceramic capacitor substrate 10 to a second processing apparatus described later (cutting position). Information transmission process).
In the above-described embodiment, an example in which the ID mark setting process is performed before the electrode exposing process is shown, but the ID mark setting process may be performed before or after the cutting position information creating process.

Next, the 2nd processing apparatus for implementing the cutting process in the division | segmentation method of the multilayer ceramic capacitor board | substrate by this invention is demonstrated with reference to FIG.
The second processing apparatus 1a shown in FIG. 8 is substantially the same as the first processing apparatus 1 except that it does not include the laser beam irradiation means 6 in the first processing apparatus 1 and includes a bar code reader described later. Therefore, the same members are denoted by the same reference numerals and description thereof is omitted. Note that the cutting blade 54a for cutting attached to the tip of the rotary spindle 53 in the second processing apparatus 1a shown in FIG. 8 has a thickness of, for example, about 30 μm.

  The second processing apparatus 1a shown in FIG. 8 includes the barcode reader 8 for reading the ID mark 100 made of the barcode set on the ceramic capacitor substrate 10 as described above. The barcode reader 8 is disposed adjacent to the image pickup means 7 (SD) in the X-axis direction.

  The second processing apparatus 1a shown in FIG. 8 includes a control means 20a as shown in FIG. The control means 20a is also constituted by a computer like the control means 20 shown in FIG. 5, and a central processing unit (CPU) 201 that performs arithmetic processing according to the control program, and a read only memory (ROM) 202 that stores the control program and the like. A random access memory (RAM) 203 for storing calculation results and the like, and an input interface 204 and an output interface 205. The input interface 204 of the control unit 20a configured as described above includes a reading head 374b (LS1) of the X-axis direction position detecting unit 374 and a reading head 384b (LS2) of the Y-axis direction position detecting unit 384 shown in FIG. The reading head 57b (LS3) of the Z-axis direction position detecting means 57, the imaging means 7 (SD), the barcode reader 8 (BR), the receiving means (RM) for receiving the data transmitted from the control means 20, etc. A detection signal is input. From the output interface 205, the pulse motor 340 (M1), the pulse motor 372 (M2), the pulse motor 382 (M3), the pulse motor 432 (M4), the servo motor 55 (M5), the pulse motor 562 (M6), and A control signal is output to the display means (DP).

The second processing apparatus 1a shown in FIG. 8 is configured as described above. Hereinafter, a cutting process in the method for dividing a multilayer ceramic capacitor substrate according to the present invention, which is performed using the second processing apparatus 1a, will be described.
As described above, the multilayer ceramic capacitor substrate 10 that has been subjected to the ID mark setting process, the electrode exposing process, and the cutting position information creating process by the first processing apparatus 1 is removed from the chuck table 36 of the first processing apparatus 1. The tape 12 side is placed on the chuck table 36 of the second processing apparatus 1a shown in FIG. Then, by actuating a suction means (not shown), the multilayer ceramic capacitor substrate 10 is sucked and held on the chuck table 36 via the tape 12 (wafer holding step). The annular frame F that supports the multilayer ceramic capacitor substrate 10 via the tape 12 is fixed by a clamp 362. The chuck table 36 that sucks and holds the multilayer ceramic capacitor substrate 10 in this way is moved to a position immediately below the barcode reader 8 (BR).

  If the chuck table 36 holding the multilayer ceramic capacitor substrate 10 by suction is moved to a position directly below the barcode reader 8 (BR), the barcode set on the ceramic capacitor substrate 10 by operating the barcode reader 8 (BR). The ID mark 100 is read and the read ID mark information is sent to the control means 20a (ID mark reading step). In this way, the control means 20a having input the ID mark information consisting of the barcode set on the multilayer ceramic capacitor substrate 10 held on the chuck table 36, the control means 20 of the first processing apparatus 1 and the ID mark 100. The cutting position information of the multilayer ceramic capacitor substrate 10 corresponding to the ID mark 100 transmitted from is collated, and the cutting process is performed as follows based on the cutting position information.

  When the ID mark reading step is performed, the chuck table 36 that sucks and holds the multilayer ceramic capacitor substrate 10 is moved directly below the imaging means 7 (SD). Then, the imaging means 7 (SD) and the control means 20a take two images of the V-groove 130 formed in the electrode exposing process and intersect each other formed on the multilayer ceramic capacitor substrate 10 as shown in FIG. The angle (α) of the V groove 130, that is, the angle (α) formed by the V groove 130 formed along the X axis street and the V groove 130 formed along the Y axis street is detected, and the detected angle ( α) is temporarily stored in a random access memory (RAM) 203. The angle (α) formed between the V-groove 130 formed along the X-axis street and the V-groove 130 formed along the Y-axis street in the multilayer ceramic capacitor substrate 10 was obtained by performing the electrode exposing step. Although it is a right angle (90 degrees) in the state, since it is the raw multilayer ceramic capacitor substrate 10, distortion occurs when it is conveyed. Therefore, in order to correct this distortion as will be described later, the angle (α) is detected (angle detection step). If the angle (α) is not a right angle (90 degrees) in this angle detection step, the control means 20a corrects the interval between the cutting positions in the cutting position information to a value obtained by multiplying the interval by sin α (cutting position). Information correction process).

  If the angle detection step and the cutting position information correction step are performed as described above, the chuck table 36 is set so that the V-groove 130 formed along the X-axis street matches the machining feed direction indicated by the arrow X in FIG. Adjust the rotation. Next, the processing feed means 37 and the first index feed means 38 are operated to cut based on the cutting position information obtained by reading the ID mark 100 on the multilayer ceramic capacitor substrate 10 held on the chuck table 36. The position is positioned directly below the cutting blade 54a for cutting. Then, the cutting blade 54a for cutting is cut and fed while rotating in a predetermined direction, and the chuck table 36 that sucks and holds the multilayer ceramic capacitor substrate 10 is processed and fed at a predetermined processing feed speed in the processing feed direction. As a result, the multilayer ceramic capacitor substrate 10 held on the chuck table 36 is cut along the X-axis street (cutting step).

  If the cutting process is performed along all the X-axis streets of the multilayer ceramic capacitor substrate 10 as described above, the chuck table 36 is placed on the multilayer ceramic capacitor substrate 10 detected by the angle detection process on the X-axis street. 8 is rotated by an angle (α) between the V-groove 130 formed along the Y-axis street and the V-groove 130 formed along the Y-axis street. Positioned in the machining feed direction indicated by X (correction process). Then, based on the cutting position information of the multilayer ceramic capacitor substrate 10 described above, the cutting process is performed along the Y-axis street.

As described above, the method of dividing the multilayer ceramic capacitor substrate in the illustrated embodiment uses the first processing device 1 and the second processing device 1a, and the first processing device 1 uses the ID mark setting process and the electrode exposing process. In addition, the cutting position information creation process is performed, and the cutting process requiring a lot of work time is performed by the second processing apparatus 1a. Therefore, the work time by both the processing apparatuses can be averaged, and the productivity is improved. Can do.
In the above-described embodiment, the example in which the ID mark setting process, the electrode exposing process, and the cutting position information creating process are performed by the first processing apparatus 1 is shown. However, the ID mark setting process and the cutting position information creating process are performed. Each may be implemented using a dedicated ID mark setting device and cutting position information creation device. Then, considering the time required for each process, the number of the first processing device 1, the ID mark setting device, the cutting position information creation device, and the second processing device 1a is set, so that a production line with high production efficiency can be obtained. Can be built.

1: 1st processing device 1a: 2nd processing device 2: Stationary base 3: Chuck table mechanism 36: Chuck table 37: Processing feed means 374: X-axis direction position detection means 38: First index feed means 384 : Y-axis direction position detecting means 4: Spindle support mechanism 43: Second index feed means 5: Spindle unit 51: Unit holder 52: Spindle housing 53: Rotating spindle 54: V-groove forming cutting blade 54a: Cutting blade for cutting 56: Cutting feed means 57: Z-axis direction position detecting means 6: Laser beam irradiation means 7: Imaging means (SD)
10: multilayer ceramic capacitor substrate 100: ID mark 110: raw ceramic layer 120: electrode layer 121: electrode 130: V groove 20: control means 20a: control means

Claims (2)

Laminated ceramics in which a ceramic layer and an electrode layer having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice pattern are alternately laminated, and the ceramic layer is laminated on the uppermost layer to form a rectangular shape A dividing method for dividing a capacitor substrate into individual chip capacitors partitioned in a lattice pattern,
An ID mark setting step for setting an ID mark on the multilayer ceramic capacitor substrate;
An electrode exposing step of forming a pair of inclined grooves adjacent to a pair of opposite sides of the multilayer ceramic capacitor substrate using the first processing apparatus and exposing the electrode;
An image is picked up by an image pickup means for picking up the electrode exposed in the electrode exposing step, a cutting coordinate value relating to an intermediate position between the electrodes is detected, and cutting position information of the multilayer ceramic capacitor substrate in which the ID mark is set is obtained. Cutting position information creation process to create,
Using the second processing device, the cutting position information is obtained by reading the ID mark set on the multilayer ceramic capacitor substrate on which the cutting position information creating step has been performed, and the multilayer ceramic capacitor is obtained based on the cutting position information. and a cutting step of cutting the substrate, only including,
The second processing apparatus includes an angle detection step of detecting an angle of two inclined grooves formed on the multilayer ceramic capacitor substrate, and an angle of the two inclined grooves detected in the angle detection step. In the case of an angle (α) that is not 90 degrees, a cutting position information correction step for correcting the cutting position information is performed before the cutting step.
A method for dividing a multilayer ceramic capacitor substrate. The cutting position information correction step, the distance between each cutting position is corrected to a value obtained by multiplying the sinα in the interval division method of a multilayer ceramic capacitor substrate according to claim 1, wherein.

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