JP5536534B2 - Glass plate division method - Google Patents

Description

  The present invention relates to a method for dividing a glass plate in which a glass plate having a reinforcing layer formed on the surface is divided along a predetermined division line.

  A portable electronic device such as a cellular phone or a digital camera is equipped with a liquid crystal display device. A glass substrate for protecting the liquid crystal substrate is disposed in the display unit of the liquid crystal display device. As described above, it is important that the glass substrate for protecting the liquid crystal substrate is not easily damaged. For this reason, at least the surface is subjected to heat treatment to form a reinforcing layer. (For example, refer to Patent Document 1.)

  The glass substrate described above is formed in a predetermined size by cutting a large glass plate on which a reinforcing layer is formed with a cutting blade.

JP 2008-111984

  Thus, when the glass plate on which the reinforcing layer is formed is cut by the cutting blade, there is a problem that the edge of the reinforcing layer is chipped and the quality of the glass substrate divided into a predetermined size is deteriorated.

  This invention is made | formed in view of the said fact, The main technical subject is the glass which can be divided | segmented along the division | segmentation scheduled line set without reducing the quality of the glass plate in which the reinforcement layer was formed. It is to provide a method for dividing a plate.

In order to solve the above-mentioned main technical problem, according to the present invention, there is provided a glass plate dividing method for cutting a glass plate having a reinforcing layer formed on a surface thereof by a cutting blade along a set division line,
The reinforcing layer formed on the surface of the glass plate is irradiated with a laser beam along the set division line, and the laser processing groove deeper than the thickness of the reinforcing layer in the region exceeding the thickness of the cutting blade along the division line. A reinforcing layer removing step of removing the reinforcing layer by forming
The cutting blade is positioned in a region where the reinforcing layer is removed from the glass plate on which the reinforcing layer removing step has been performed, the cutting blade and the glass plate are moved relative to each other while the cutting blade is rotated, and the planned dividing line from which the reinforcing layer is removed Cutting the glass plate along
There is provided a method for dividing a glass plate.

According to the present invention, the reinforcing layer formed on the surface of the glass plate is irradiated with a laser beam along the set division planned line, and the reinforcing layer is formed in a region exceeding the thickness of the cutting blade along the planned dividing line . After performing the reinforcing layer removing step of removing the reinforcing layer by forming a laser processing groove deeper than the thickness , the cutting blade is positioned in the region where the reinforcing layer of the glass plate is removed, and the cutting blade is rotated while rotating the cutting blade. A cutting process is performed in which the glass plate is cut along the division line from which the reinforcing layer has been removed by moving the glass plate relative to each other. Will not occur. Thus, since the glass plate divided | segmented into the predetermined magnitude | size does not generate | occur | produce a chip | tip in an edge, the fall of the quality by generation | occurrence | production of a chip | tip can be prevented.

The perspective view and principal part expanded sectional view of the glass plate divided | segmented into a predetermined | prescribed magnitude | size by the glass plate division | segmentation method by this invention. Explanatory drawing of the glass plate support process in the division | segmentation method of the glass plate by this invention. The principal part perspective view of the laser processing apparatus for implementing the reinforcement | strengthening layer removal process in the division | segmentation method of the glass plate by this invention. Explanatory drawing of the reinforcement | strengthening layer removal process in the division | segmentation method of the glass plate by this invention. The principal part expanded sectional view of the glass plate in which the reinforcement | strengthening layer removal process in the division | segmentation method of the glass plate by this invention was implemented. The principal part perspective view of the cutting device of the cutting layer for implementing the cutting process in the division | segmentation method of the glass plate by this invention. Explanatory drawing of the cutting process in the division | segmentation method of the glass plate by this invention. Explanatory drawing which shows the relationship between the glass plate and cutting blade at the time of implementing the cutting process shown in FIG. The principal part expanded sectional view of the glass plate in which the cutting process shown in FIG. 7 was implemented. The perspective view of the glass substrate by which the cutting process shown in FIG. 7 was implemented and divided | segmented into the predetermined magnitude | size. The principal part perspective view of the cutting device for implementing the cutting process in other embodiment of the division | segmentation method of the glass plate by this invention. Explanatory drawing of the cutting process in other embodiment of the division | segmentation method of the glass plate by this invention. The principal part expanded sectional view of the glass plate in which the cutting process shown in FIG. 12 was implemented. The perspective view of the glass substrate which the cutting process shown in FIG. 12 was implemented, and was divided | segmented separately. The principal part perspective view of the laser processing apparatus for implementing the chamfering process in the division | segmentation method of the glass plate by this invention. Explanatory drawing of the chamfering process in the division | segmentation method of the glass plate by this invention. The perspective view of the glass substrate in which the chamfering process shown in FIG. 15 was implemented.

  Hereinafter, a preferred embodiment of a method for dividing a glass plate according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view and an enlarged sectional view of a main part of a glass plate that is divided into a predetermined size by the glass plate dividing method according to the present invention. A glass plate 2 shown in FIG. 1 is formed in a rectangular shape having a thickness of 1 mm, and a heat treatment is performed on the surface to form a reinforcing layer 21. In the glass plate 2, a division line 22 is set in order to divide the glass plate 2 into a predetermined size. In addition, although the division | segmentation scheduled line 22 may be formed in the surface of the glass plate 2, it may not necessarily be visually recognized and may be set to the predetermined dimension position from the outer periphery side. In addition, although there exists a glass plate in which the reinforced layer 21 is formed also on the back surface, in the following description, the glass plate 2 in which the reinforced layer 21 is formed on the surface will be described.

  In order to divide the glass plate 2 along the set division line 22, a glass plate supporting step of sticking the glass plate 2 to the surface of a dicing tape attached to an annular frame is performed. That is, as shown in FIGS. 2A and 2B, the back surface 2b of the glass plate 2 is adhered to the surface of the dicing tape 4 mounted on the annular frame 3. Therefore, the surface 2a of the glass plate 2 adhered to the surface of the dicing tape 4 is on the upper side.

  Next, the laser beam is irradiated along the planned division line 22 set on the reinforcing layer 21 formed on the surface of the glass plate 2, and the region beyond the thickness of the cutting blade described later along the planned division line 22 is strengthened. A reinforcing layer removing step for removing the layer is performed. This reinforcing layer removal step is performed using a laser processing apparatus 5 shown in FIG. A laser processing apparatus 5 shown in FIG. 3 has a chuck table 51 that holds a workpiece, a laser beam irradiation means 52 that irradiates a workpiece held on the chuck table 51 with a laser beam, and a chuck table 51 that holds the workpiece. An image pickup means 53 for picking up an image of the processed workpiece is provided. The chuck table 51 is configured to suck and hold a workpiece. The chuck table 51 is moved in a processing feed direction indicated by an arrow X in FIG. 3 by a processing feed means (not shown) and is also shown in FIG. 3 by an index feed means (not shown). It can be moved in the index feed direction indicated by the arrow Y.

  The laser beam irradiation means 52 includes a cylindrical casing 521 disposed substantially horizontally. In the casing 521, a pulse laser beam oscillation means having a pulse laser beam oscillator and a repetition frequency setting means (not shown) are arranged. A condenser 522 having a condenser lens 522a for condensing the pulse laser beam oscillated from the pulse laser beam oscillating means is attached to the tip of the casing 521. The laser beam irradiation unit 52 includes a condensing point position adjusting unit (not shown) for adjusting the condensing point position of the pulse laser beam collected by the condenser 522.

  The imaging means 53 attached to the tip of the casing 521 constituting the laser beam irradiation means 52 includes an illumination means for illuminating the workpiece, an optical system for capturing an area illuminated by the illumination means, and the optical system. An image sensor (CCD) or the like that captures the captured image is provided, and the captured image signal is sent to a control unit (not shown). In addition, the coordinate value (design value) of the division | segmentation scheduled line 22 set to the glass plate 2 shown in the said FIG. 1 is stored in the memory of the control means which is not shown in figure.

  In order to perform the reinforcing layer removing process using the laser processing device 5 described above, first, the dicing tape 4 side on which the glass plate 2 is adhered is mounted on the chuck table 51 of the laser processing device 5 shown in FIG. Put. Then, by operating a suction means (not shown), the glass plate 2 is sucked and held on the chuck table 51 via the dicing tape 4 (glass plate holding step). Therefore, the surface 2a of the glass plate 2 held by the chuck table 51 is on the upper side. In FIG. 3, the annular frame 3 on which the dicing tape 4 is mounted is omitted, but the annular frame 3 is held by an appropriate frame holding unit disposed on the chuck table 51.

  As described above, the chuck table 51 that sucks and holds the glass plate 2 is moved directly below the imaging unit 53 by a processing feed unit (not shown). When the chuck table 51 is positioned immediately below the image pickup means 53, an alignment operation for detecting a processing region to be laser processed on the glass plate 2 is executed by the image pickup means 53 and a control means (not shown). In other words, when the scheduled division line 22 set on the glass plate 2 is formed, the imaging means 53 and the control means (not shown) are divided into the planned division line 22 formed in a predetermined direction of the glass plate 2 and the division. Image processing such as pattern matching for performing alignment with the condenser 522 of the laser beam irradiation means 52 that irradiates the laser beam along the planned line 22 is performed, and alignment of the laser beam irradiation position is performed (alignment process). In addition, alignment of the laser beam irradiation position is similarly performed on the division line 22 extending in a direction orthogonal to the predetermined direction set on the glass plate 2. In addition, when the division | segmentation scheduled line 22 set to the glass plate 2 is not formed, the imaging means 53 images the outer peripheral edge of the glass plate 2, and sends the image signal to the control means which is not shown in figure. Then, the control means (not shown) determines whether or not the outer peripheral edge of the glass plate 2 is located at a predetermined coordinate value based on the image signal sent from the imaging means 53, and the outer peripheral edge is set to the predetermined coordinate value. If not, the chuck table 51 is adjusted to be rotated and positioned at a predetermined coordinate value (alignment process).

  When the alignment operation for detecting the processing region to be laser processed of the glass plate 2 held on the chuck table 51 is executed as described above, the chuck table 51 is irradiated with a laser beam as shown in FIG. The laser beam irradiation means 52 to be irradiated moves to the laser beam irradiation region where the condenser 522 is located, and the predetermined predetermined division line 22 is positioned immediately below the condenser 522. At this time, as shown in FIG. 4A, the glass plate 2 is arranged such that one end (the left end in FIG. 4A) of the set predetermined division planned line 22 is located immediately below the condenser 522. Positioned on. Next, the chuck table 51 is moved at a predetermined processing feed rate in the direction indicated by the arrow X1 in FIG. 4A while irradiating a pulsed laser beam from the condenser 522 of the laser beam irradiation means 52. Then, when the other end of the predetermined division line 22 (the right end in FIG. 4A) reaches a position directly below the condenser 522, the irradiation of the pulse laser beam is stopped and the movement of the chuck table 51 is stopped. In this reinforcing layer removal step, the condensing point P of the pulse laser beam is matched with the vicinity of the surface (upper surface) of the division line 22.

  Next, the chuck table 51 is moved about 30 to 40 μm in a direction perpendicular to the paper surface (index feed direction). Then, while irradiating a pulse laser beam from the condenser 522 of the laser beam irradiation means 52, the chuck table 51 is moved in the direction indicated by the arrow X2 in FIG. When one end (the left end in FIG. 4B) reaches directly below the condenser 522, the irradiation of the pulse laser beam is stopped and the movement of the chuck table 51 is stopped.

  By performing the reinforcing layer removing step described above, two predetermined laser processing grooves deeper than the thickness of the reinforcing layer 21 are formed in the predetermined division line 22 set on the glass plate 2 as shown in FIG. 23 and 23 are formed, and the reinforcing layer 21 is removed by the laser processing grooves 23 and 23. In addition, the space | interval (B) between the both outer sides of the two laser processing grooves 23 and 23 formed along the division | segmentation planned line 22 is set larger than the thickness of the cutting blade mentioned later. Accordingly, the two laser-processed grooves 23 and 23 remove the reinforcing layer 21 in the region exceeding the thickness of the cutting blade described later along the division line 22. And the reinforcement | strengthening layer removal process mentioned above is implemented along all the division | segmentation schedule lines 22 formed in the glass plate 2. FIG.

In addition, the said reinforcement layer removal process is performed on the following process conditions, for example.
Laser light source: YVO4 laser or YAG laser Wavelength: 355 nm
Repetition frequency: 200 kHz to 1 MHz
Output: 0.8-4W
Pulse width: 10 ns or less Condensing lens: NA 0.06 (condensing spot diameter: φ6 μm)
Processing feed rate: 150 mm / sec

In order to remove the reinforcing layer remaining between the laser processing grooves 23 and 23, the reinforcing layer in the region is also irradiated with a laser beam to exceed the thickness of the cutting blade described later as shown in FIG. A laser processing groove 230 having a different width may be formed.
Moreover, in the glass plate in which the reinforcing layer 21 is also formed on the back surface, the above-described reinforcing layer removing step is also performed on the back surface of the glass plate.

  If the reinforcement layer removal process mentioned above was implemented along all the division | segmentation schedule lines 22 formed in the glass plate 2, the cutting process which cut | disconnects the glass plate 22 along the division | segmentation schedule lines 22 will be implemented. This cutting step is performed using a cutting device 6 shown in FIG. 6 includes a chuck table 61 that holds a workpiece, a cutting unit 62 that cuts the workpiece held on the chuck table 61, and a workpiece that is held on the chuck table 61. An image pickup means 63 for picking up images is provided. The chuck table 61 is configured to suck and hold a workpiece. The chuck table 61 is moved in a cutting feed direction indicated by an arrow X in FIG. 6 by a cutting feed means (not shown) and is indicated by an arrow Y by an index feed means (not shown). It can be moved in the index feed direction shown.

  The cutting means 62 includes a spindle housing 621 arranged substantially horizontally, a rotating spindle 622 rotatably supported by the spindle housing 621, and a cutting blade 623 attached to the tip of the rotating spindle 622. The rotating spindle 622 is rotated by a servo motor (not shown) disposed in the spindle housing 621. In the illustrated embodiment, the cutting blade 623 is an electroformed blade obtained by solidifying diamond abrasive grains having a particle diameter of 3 μm by nickel plating, and has a thickness of 30 μm. The imaging means 63 is mounted at the tip of the spindle housing 621, and illuminates the work piece, an optical system that captures the area illuminated by the illumination means, and an image captured by the optical system. An image pickup device (CCD) or the like for picking up images is provided, and the picked-up image signal is sent to a control means described later.

  In order to perform the cutting process using the cutting device 6 described above, as shown in FIG. 6, the dicing tape 4 side on which the glass plate 2 on which the above-described reinforcing layer removing process has been performed is attached on the chuck table 61 is used. Place. Then, by operating a suction means (not shown), the glass plate 2 is sucked and held on the chuck table 61 via the dicing tape 4 (glass plate holding step). Therefore, the surface 2a of the glass plate 2 held by the chuck table 61 is on the upper side. In FIG. 6, the annular frame 3 on which the dicing tape 4 is mounted is omitted, but the annular frame 3 is held by an appropriate frame holding unit disposed on the chuck table 61.

  As described above, the chuck table 61 that sucks and holds the glass plate 2 is moved directly below the imaging unit 63 by a cutting feed unit (not shown). When the chuck table 61 is positioned immediately below the image pickup means 63, an alignment operation for detecting an area to be cut of the glass plate 2 is executed by the image pickup means 63 and a control means (not shown). That is, the image pickup means 63 and the control means (not shown) align the intermediate position of the laser processing grooves 23 and 23 formed along the scheduled division line 22 set in a predetermined direction of the glass plate 2 and the cutting blade 623. Alignment is performed to perform (alignment process). Further, the alignment of the machining area is similarly performed on the scheduled division lines set on the glass plate 2 in the direction orthogonal to the predetermined direction.

  When the alignment for detecting the cutting region of the glass plate 2 held on the chuck table 61 is performed as described above, the chuck table 61 holding the glass plate 2 is moved to the cutting start position of the cutting region. . At this time, as shown in FIG. 7A, the glass plate 2 is cut at one end (left end in FIG. 7A) of the laser processing grooves 23 and 23 formed along the division line 22 to be cut. It is positioned so as to be located a predetermined amount to the right of the blade 623. At this time, since the two laser processing grooves 23 and 23 formed on the planned dividing line 22 in the alignment step described above are directly imaged and the cutting area is detected, as shown in FIG. The center position between the two laser processing grooves 23, 23 formed in 22 is surely positioned at a position facing the cutting blade 623.

  When the chuck table 61, that is, the glass plate 2 is positioned at the cutting start position in the cutting region in this manner, the cutting blade 623 is rotated in the direction indicated by the arrow 623a, and the two-dot chain line in FIG. It cuts and feeds downward from the waiting position shown, and is positioned at a predetermined cutting and feeding position as shown by the solid line in FIG. This cutting feed position is set to a position where the lower end of the cutting blade 623 reaches the dicing tape 4 adhered to the back surface of the glass plate 2 as shown in FIGS. 7 (a) and 9 (a). .

  Next, while the cutting blade 623 is rotated at a predetermined rotational speed in the direction indicated by the arrow 623a in FIG. 7A, the cutting feed means (not shown) is operated to move the chuck table 61 to the arrow in FIG. 7A. It is moved at a predetermined cutting feed rate in the direction indicated by X1. Then, as shown in FIG. 7B, the other ends of the laser processing grooves 23 and 23 formed in the planned dividing line 22 of the glass plate 2 held by the chuck table 61 (the right end in FIG. 7B). Moves to a position a predetermined amount to the left of just below the cutting blade 623, the movement of the chuck table 61 is stopped. By cutting and feeding the chuck table 61 in this way, as shown in FIG. 9B, the glass plate 2 has a cutting groove reaching the back surface between both sides of the laser processing grooves 23 and 23 formed on the division line 22. 24 is formed and cut (cutting step). At this time, in the cutting region where the cutting groove 24 is formed by the cutting blade 623, the reinforcing layer 21 is removed by the two laser processing grooves 23, 23, so the contact between the side surface of the cutting blade 623 and the reinforcing layer 21 Therefore, the edge of the cutting groove 24 is not chipped.

  Next, the cutting blade 623 is positioned at a standby position indicated by a two-dot chain line in FIG. 7B, and a cutting feed means (not shown) is operated to return the chuck table 61 to the position shown in FIG. Then, the chuck table 61 is indexed and fed in the direction perpendicular to the paper surface (index feed direction) by an amount corresponding to the interval between the scheduled division lines 22, and the laser processing groove 23 formed on the scheduled division line 22 to be cut next, A central position between the two blades 23 is positioned at a position corresponding to the cutting blade 623. In this way, when the center position between the laser processing grooves 23 and 23 formed in the scheduled division line 22 to be cut next is positioned at a position corresponding to the cutting blade 623, the above-described cutting process is performed.

In addition, the said cutting process is performed on the following process conditions, for example.
Cutting blade: outer diameter 52mm, thickness 40μm
Cutting blade rotation speed: 40000 rpm
Cutting feed rate: 50 mm / sec

  The above-described cutting process is performed on the laser processed grooves 23 and 23 formed on all the division lines 22 formed on the glass plate 2. As a result, the glass plate 2 is cut along the laser processing grooves 23 and 23 formed on the division line 22 and is divided into glass substrates 20 having a predetermined size as shown in FIG. As described above, the glass substrate 20 divided in this manner is free from chipping at the edge, so that deterioration in quality due to chipping can be prevented.

Next, another embodiment of the present invention will be described with reference to FIGS.
In this embodiment, first, as shown in FIGS. 2A and 2B, the glass plate 2 attached to the surface of the dicing tape 4 attached to the annular frame 3 is moved along the scheduled dividing line 22. The cutting process which divides | segments into the glass substrate of a predetermined | prescribed magnitude | size is implemented by cutting. This cutting step can be performed using the cutting device 6 shown in FIG.

  In order to carry out the cutting process using the cutting device 6 shown in FIG. 6, the dicing tape 4 side on which the glass plate 2 is adhered is placed on the chuck table 61 as shown in FIG. Then, by operating a suction means (not shown), the glass plate 2 is sucked and held on the chuck table 61 via the dicing tape 4 (glass plate holding step). Therefore, the surface 2a of the glass plate 2 held by the chuck table 61 is on the upper side. In FIG. 11, the annular frame 3 on which the dicing tape 4 is mounted is omitted, but the annular frame 3 is held by appropriate frame holding means provided on the chuck table 61.

  As described above, the chuck table 61 that sucks and holds the glass plate 2 is moved directly below the imaging unit 63 by a cutting feed unit (not shown). When the chuck table 61 is positioned immediately below the image pickup means 63, an alignment operation for detecting an area to be cut of the glass plate 2 is executed by the image pickup means 63 and a control means (not shown). That is, the imaging unit 63 and a control unit (not shown) perform alignment for aligning the division line 22 set in the predetermined direction of the glass plate 2 and the cutting blade 623 (alignment process). In addition, the alignment of the machining area is performed in the same manner for the planned division lines formed on the glass plate 2 in the direction orthogonal to the predetermined direction. In addition, when the division | segmentation scheduled line 22 set to the glass plate 2 is not formed, the imaging means 63 images the outer periphery side of the glass plate 2, and sends the image signal to the control means which is not shown in figure. Then, the control means (not shown) determines whether or not the outer peripheral edge of the glass plate 2 is located at a predetermined coordinate value based on the image signal sent from the imaging means 63, and the outer peripheral edge is set to the predetermined coordinate value. If not, the chuck table 61 is adjusted so as to be positioned at a predetermined coordinate value (alignment process).

  When the alignment for detecting the cutting region of the glass plate 2 held on the chuck table 61 is performed as described above, the chuck table 61 holding the glass plate 2 is moved to the cutting start position of the cutting region. . At this time, as shown in FIG. 12A, the glass plate 2 has one end of the scheduled dividing line 22 to be cut (the left end in FIG. 12A) positioned on the right side by a predetermined amount from just below the cutting blade 623. Positioned on. When the chuck table 61, that is, the glass plate 2 is positioned at the cutting start position in the cutting region in this manner, the cutting blade 623 is rotated in the direction indicated by the arrow 623a and is indicated by a two-dot chain line in FIG. It cuts and feeds downward from the standby position shown, and is positioned at a predetermined cutting and feeding position as shown by a solid line in FIG. This cutting feed position is set to a position where the lower end of the cutting blade 623 reaches the dicing tape 4 adhered to the back surface of the glass plate 2 as shown in FIGS. 12 (a) and 13 (a). .

  Next, while the cutting blade 623 is rotated at a predetermined rotational speed in the direction indicated by the arrow 623a in FIG. 12A, the cutting feed means (not shown) is operated to move the chuck table 61 to the arrow in FIG. It is moved at a predetermined cutting feed rate in the direction indicated by X1. Then, as shown in FIG. 12B, the other end (the right end in FIG. 12B) of the dividing line 22 of the glass plate 2 held on the chuck table 61 is a predetermined amount left from directly below the cutting blade 623. When reaching the position, the movement of the chuck table 61 is stopped. By cutting and feeding the chuck table 61 in this way, as shown in FIG. 13B, the glass plate 2 is cut by forming a cutting groove 25 that reaches the back surface along the scheduled division line 22 (cutting step). . At this time, since the cutting blade 623 comes into contact with the reinforcing layer 21 of the glass plate 2, a chip 25 a is generated at the edge of the cutting groove 25.

Next, the cutting blade 623 is positioned at a standby position indicated by a two-dot chain line in FIG. 12B, and a cutting feed means (not shown) is operated to return the chuck table 61 to the position shown in FIG. Then, the chuck table 61 is indexed and fed in the direction perpendicular to the paper surface (index feed direction) by an amount corresponding to the interval between the scheduled division lines 22, and the next scheduled division line 22 to be cut is placed at a position corresponding to the cutting blade 623. Position. Thus, if the division | segmentation scheduled line 22 which should be cut next is located in the position corresponding to the cutting blade 623, the cutting process mentioned above will be implemented.
In addition, the processing conditions of the said cutting process may be the same as embodiment shown in the said FIG.

  The above-described cutting process is performed on all the division lines 22 formed on the glass plate 2. As a result, the glass plate 2 is cut along the division line 22 and divided into glass substrates 20 having a predetermined size as shown in FIG. As described above, the glass plate 20 divided in this manner has a chip 25a on the edge.

  Next, a chamfering process is performed in which chamfering is performed by irradiating the peripheral edge of the reinforcing layer in the glass substrate 20 divided into a predetermined size with a laser beam. This chamfering step can be performed using the laser processing apparatus 5 shown in FIG. In order to perform the chamfering process using the laser processing apparatus 5, first, the above-mentioned cutting process is performed on the chuck table 51 as shown in FIG. Place the dicing tape 4 side. Then, by operating a suction means (not shown), the glass substrate 20 divided into a predetermined size is sucked and held on the chuck table 51 via the dicing tape 4 (glass substrate holding step). In FIG. 15, the annular frame 3 on which the dicing tape 4 is mounted is omitted, but the annular frame 3 is held by an appropriate frame holding means provided on the chuck table 51.

  As described above, the chuck table 51 that sucks and holds the glass substrate 20 divided into a predetermined size is moved directly below the imaging unit 53 by a processing feed unit (not shown). When the chuck table 51 is positioned immediately below the image pickup means 53, an alignment operation for detecting a processing region to be laser processed on each glass substrate 20 is executed by the image pickup means 53 and a control means (not shown). That is, image processing such as pattern matching for aligning the edge of the glass substrate 20 in a predetermined direction with the condenser 522 of the laser beam irradiation means 52 is performed, and alignment of the laser beam irradiation position is performed (alignment process). . Similarly, the alignment of the laser beam irradiation position is performed on the edge of the glass substrate 20 in the direction orthogonal to the predetermined direction.

  When the alignment operation for detecting the processing region to be laser-processed of the glass substrate 20 held on the chuck table 51 is performed as described above, the edge of the glass substrate 20 is moved as shown in FIG. It is positioned directly below the light collector 522 of the laser beam irradiation means 52. Then, the condensing point P of the pulse laser beam is matched with the vicinity of the edge of the glass substrate 20. Next, while irradiating a pulsed laser beam from the condenser 522 of the laser beam irradiating means 52, the chuck table 51 is moved at a predetermined processing feed rate in a direction perpendicular to the paper surface in FIG. As a result, as shown in FIG. 16B, the chip 25a generated on the edge of the glass substrate 20 is removed, and the edge of the glass substrate 20 is chamfered 25b.

In addition, the said chamfering process is performed on the following processing conditions, for example.
Laser light source: YVO4 laser or YAG laser Wavelength: 532 nm
Repetition frequency: 200 kHz to 1 MHz
Output: 0.8-4W
Pulse width: 500 ns or less Condensing lens: NA 0.06 (Condensing spot diameter: φ6 μm)
Processing feed rate: 150 mm / sec

By performing the chamfering process described above along all the edges of the glass substrate 20, the glass substrate 20 divided into a predetermined size as shown in FIG. 17 is chamfered on all the edges on the reinforcing layer 21 side. 25b is applied. In the glass substrate 20 thus obtained, the chipping generated at the edge is removed and the edge is chamfered 25b, so that deterioration in quality due to the occurrence of chipping can be prevented and the edge chamfer 25b Bending strength is improved.
In addition, in the glass plate in which the reinforcement layer 21 is formed also in the back surface, the chamfering process mentioned above is implemented also in all the edge parts by the side of the reinforcement layer of the back surface of each divided | segmented glass plate.

2: Glass plate 20: Glass substrate 21: Reinforcement layer 3: Ring frame 4: Dicing tape 5: Laser processing device 51: Chuck table 52 of laser processing device 52: Laser beam irradiation means 522: Concentrator 6: Cutting device 61: Cutting device chuck table 62: Cutting means 623: Cutting blade

Claims (1)

A glass plate dividing method in which a glass plate having a reinforcing layer formed on the surface is cut by a cutting blade along a predetermined division line,
The reinforcing layer formed on the surface of the glass plate is irradiated with a laser beam along the set division line, and the laser processing groove deeper than the thickness of the reinforcing layer in the region exceeding the thickness of the cutting blade along the division line. A reinforcing layer removing step of removing the reinforcing layer by forming
The cutting blade is positioned in a region where the reinforcing layer is removed from the glass plate on which the reinforcing layer removing step has been performed, the cutting blade and the glass plate are moved relative to each other while the cutting blade is rotated, and the planned dividing line from which the reinforcing layer is removed Cutting the glass plate along
A method for dividing a glass plate.

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