TWI492820B - Rigid brittle plate chamfering device - Google Patents

Description

Chamfering device for hard brittle board

The present invention relates to a chamfering device for processing the edges of rectangular glass substrates and other rigid brittle plates used in display panels and the like. More particularly, the present invention relates to such devices capable of measuring the size of a process to accurately set the angle of the table carrying the rigid brittle plate and the position of the processing tool.

The chamfering device of the glass substrate (hereinafter referred to as "substrate" or "workpiece") is a chamfering of sharp ridges and corners generated on the sides of the substrate cut by cutting or the like using a tool (generally a grinding wheel). And rounding machine. Generally, as shown in the eighth diagram, the chamfering device has a table 2 for adsorbing the substrate 1 by a negative pressure, and a tool 3 disposed on both sides of the table 2. The table 2 can be rotated by 90 degrees about the vertical axis by a rotating device (not shown). The table 2 and the tool 3 are relatively movable in the feeding direction (Y direction in the drawing). The substrate 1 is fixed to the table 2 with the side 8 to be processed parallel to the feeding direction.

The thickness of the substrate used as the display panel is being thinned and the weight is light, and high precision of about 30 μm (micrometer) is required for the processing precision. In order to achieve this accuracy, three positioning marks 4 are marked on the substrate 1 or a sheet attached to the substrate 1. The three positioning marks 4 are set at positions where the orthogonal sides are the vertices of the right triangle in the direction of the side of the substrate 1. Further, two cameras 5 and 5 disposed in the width direction of the table 2 (the X direction in the drawing orthogonal to the feed direction) are read, and two positions of the three positioning marks 4 arranged in the width direction are read. Mark and set the angle of the table 2 and the position of the tool 3.

After this setting, the table 2 or the tools 3, 3 are moved in the feeding direction, and the opposite sides 8, 8 of the substrate 1 are processed by the tools 3, 3. After the completion of the machining, the table 2 is rotated by 90 degrees, and the two positioning marks 4 and 4 arranged in the width direction are read again, and the positions in the width direction of the tools 3 and 3 are set to new positions. Then, the table 2 or the tools 3, 3 are moved in the feeding direction while the processing of the second opposite sides 9, 9 is performed.

Thus, the position of the table 2 around the vertical axis and the position of the tool 3 are set with the position of the positioning mark 4 marked on the substrate 1 as a reference, thereby performing accurate machining. However, for example, when there is an error in the positional relationship between the two cameras 5, 5, the tool 3 is worn, or there is an error in the height of the tool 3, an error in the machining size is generated.

Therefore, in the past, the tested substrate was taken out from the chamfering device and placed on the measuring device, and the operator measured the processing size using the microscope of the measuring device (generally from the positioning mark 4 shown in the seventh figure to the chamfering line). The distance a, b, the chamfer width c, d, the machining dimension e, f) of the angle, the correction value is input to the numerical control device for controlling the angle of the table 2, the width direction and the height position of the tool 3 according to the measured value In order to carry out accurate processing. Further, in order to correct the deterioration of the machining accuracy due to the change in the wear of the tool 3 or the like over time, the machined substrate is appropriately extracted, the machining size is measured by the same method as described above, and the necessary correction value is re-inputted to the numerical control device. .

However, in the method of measuring the processing size by a person, a measurement error due to carelessness and misreading, a calculation error of the correction value, an input error, and the like are generated. Therefore, the applicant of the present application has proposed the following technique. In Patent Document 1 below, automatic measurement on the chamfering device becomes measurement processing and sampling. The processed size of the sheet of the object to be inspected is corrected, and the position of the table 2 and the tool 3 of the chamfering device is corrected based on the measured value.

That is, on the upstream side of the tool 3 of the chamfering device (the side on which the workpiece is carried), two upper cameras 5 and 5 and lower cameras 6 and 6 (virtual lines in the eighth drawing) disposed below them are provided. Further, for the substrate to be measured and the substrate to be sampled, the two upper cameras 5, 5 are used to read the two positioning marks 4, 4 in the width direction marked on the workpiece 1, and the angle and tool of the table 2 are set. The position of 3 is then relatively moved in the feed direction (+Y direction) (hereinafter referred to as "feed movement"), and the first opposite sides 8, 8 are chamfered. After the end of the processing, the table 2 is relatively moved in the return direction (-Y direction) (hereinafter referred to as "return movement"), and at the same time, one camera in the upper camera 5 is used to read the two positions arranged in the feed direction. Mark 4 to detect the tilt of the workpiece. Then, the table 2 is again moved in the feed, and the upper and lower cameras 5 and 6 measure the upper and lower machining dimensions.

Then, the table 2 is rotated by 90 degrees, the table 2 is moved back, and the second opposite sides 9, 9 are chamfered, and the feed movement is performed again to detect the inclination of the workpiece 1. Then, the table 2 is again moved back while the measurement of the processing size of the second opposite side 9 is performed.

In the method proposed in Patent Document 1, in order to perform chamfering processing and measurement of the processing dimensions of the four sides of the substrate, it is necessary to reciprocate the table 2 three times (passing six times). In addition, regarding the machining of the workpiece when the machining size is not measured, the table 2 is fed and moved while the first opposite sides 8 and 8 are machined, the table 2 is rotated by 90 degrees, and the table 2 is moved back while moving. Two opposite sides 9, 9.

On the other hand, Patent Document 2 proposes a chamfering device which arranges an upper camera for observing the upper surface of the substrate and a side camera for observing the side surface on the left and right sides in the width direction of the table on the upstream side of the table in the feeding direction of the tool. . In the device, the upper camera is used to read the positioning mark marked on the workpiece, and the table angle and the position setting of the tool are performed, and the first opposite side is processed by the feed movement of the table, and the movement is performed by returning movement. The measurement of the machining dimension of the opposite side is performed by rotating the table 90 degrees at the position after the return, chamfering the second opposite side by the re-feeding movement, and measuring the processing of the second opposite side by the return movement again. size. In the method proposed in Patent Document 2, the table is reciprocated twice (passed four times) to perform four-sided chamfering and measurement of the machining size.

Further, Patent Document 3 listed below discloses a configuration in which a second camera with a second light source corresponding to the lower camera of Patent Document 1 is arranged side by side on the outer side of the first camera corresponding to the upper camera, and two of the left and right cameras are used. The mirror reflects the illumination of the second source to the lower surface of the glass sheet.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-223005

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-38327

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2004-99424

In the invention described in Patent Document 1, the workpiece for measuring the processing size is processed and measured by reciprocating three times, and the workpiece that is not measured is processed only once or twice. On the other hand, in the invention described in Patent Document 2, the processing and measurement of the workpiece are performed by reciprocating twice. In the invention of the patent document 1, since the tilt detection of the workpiece is an independent measurement item, the processing and the measurement need to be performed three times. However, if the tilt detection of the workpiece is not performed as in Patent Document 2, the round trip can be performed twice. Processing and measurement of workpieces.

The methods described in Patent Documents 1 and 2 are each processed and measured by relative movement of independent stages. Therefore, in order to perform the processing and measurement of the four sides, it is necessary to perform a minimum of four relative movements (through four times).

Depending on the construction of the tool, sometimes the table feed direction during machining is limited to one direction. In this case, two chamfering devices are arranged in the conveying direction of the workpiece, and a steering table for turning the workpiece by 90 degrees is provided therebetween, which is advantageous for accelerating the production tact of the machining. However, in this case, in the chamfering apparatus of the conventional structure, the measurement of the machining size cannot be performed on the chamfering apparatus.

On the other hand, in the chamfering device having a mechanism for rotating the workpiece by 90 degrees, as described in Patent Documents 1 and 2, by rotating the workpiece during the reciprocating relative movement of the table, one chamfer can be utilized. The device performs four-sided processing. Moreover, when the workpiece is machined only when moving in the relative direction in one direction, it is necessary to return the table to perform the next machining operation. Therefore, it is considered that if the machining size can be measured during the return movement, it will not be because The machining size is automatically measured on the chamfering device to produce an increase in production tempo.

However, in actuality, when the return movement is performed quickly, the image of the camera flashes and the measurement of the machining size cannot be performed. When using a grinding wheel that can be processed quickly, it is sometimes necessary to make the return speed at the time of measurement higher than the feed speed during machining. slow. That is, although the rapid return movement can be performed when the measurement is not performed, the return speed is slowed down during the measurement, and thus the production tact is prolonged.

Because of this, after each predetermined number of workpieces are processed, the measurement of the workpiece size is performed once, and the necessary correction value is set. In this case, it is necessary to set a margin to set a correction value so that the machining error does not exceed the allowable value in the plurality of workpiece machining in the period before the next measurement, and the defective product does not occur. That is, it is necessary to set the correction value with an accuracy higher than the allowable machining error. If a large margin can be obtained, the number of workpieces to be processed during the measurement operation can be increased accordingly, and productivity can be improved.

However, when the required machining accuracy is severe, it is difficult to obtain the edge, and finally it is necessary to measure the machining size of all the workpieces after machining, and change the correction value as needed, which is necessary in the chamfering device of the existing structure. Reduce productivity.

The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a chamfering apparatus capable of measuring a machining size of all workpieces after machining, and with or without substantially increasing the production tempo, thereby achieving higher machining accuracy without lowering the machining accuracy.

In the present invention, the above problem is solved by providing a chamfering device on both sides in the width direction of the upstream side of the table in the feeding direction of the tool, that is, the side on which the workpiece is initially fed to the device. On the both sides in the width direction, an upstream upper camera that views the upper surfaces of the both side edges of the workpiece is disposed, and a downstream camera on the downstream side of the upper surface of the both sides of the workpiece is disposed on the downstream side of the table feed direction of the tool, And a downstream side lower camera that views the lower surface of both side edges of the workpiece on the downstream side.

The interval between the tool and the feed direction of the downstream camera is fixed, which is smaller than the interval between the tool and the feed direction of the upstream upper camera, which is generally less than half. Further, it is possible to realize a configuration in which the camera and the tool are simultaneously moved in the width direction. Therefore, it is possible to adopt a configuration in which a camera is mounted on a moving table in the width direction in which the tool moves in the width direction in accordance with the size of the workpiece, and a tool that moves up and down is attached to the moving table in the width direction.

The chamfering of the substrate is performed on both the front and back sides, so four cameras are required to measure the upper and lower machining dimensions of the two sides. In the chamfering device of the present invention, the number of cameras is set to be two more than the minimum necessary. If you want to chamfer the workpiece in both directions of the feed movement of the table (relative movement in the positive feed direction) and the return movement (relative movement in the negative feed direction), you need to also advance the workpiece. A lower camera that observes the lower surface of the side portion of the workpiece is provided on the upstream side of the direction. Therefore, in this case, four cameras are added as compared with the conventional configuration.

The upstream side cameras and tools are set in the same positional relationship as the existing devices. The downstream side cameras are preferably arranged such that their distance from the feed direction between the tools is as close as possible. However, when the workpiece is machined, the cutting fluid (pure water) is supplied to the tool, so that the water droplets of the cutting fluid do not remain in the portion observed by the downstream camera. Therefore, it is usually necessary to provide an air curtain between the tool and the downstream side camera to cut the cutting fluid and remove water droplets attached to the workpiece.

In the chamfering apparatus of the present invention, the upstream side upper camera reads the positioning mark provided on the workpiece, and sets the angle of the table (when the angle is set by the width direction of the tool associated with the feed movement amount, Refers to the amount of movement in the width direction) and the position of the tool. Then, the table is moved by the feed, and chamfering is performed at the same time, and the measurement of the chamfer size is performed by the downstream camera immediately after the processing. Therefore, the machining of the workpiece and the measurement of the machining size can be performed by one-time relative feed (bypass and passage) of the workpiece.

The lower camera is a camera that observes the lower surface of the side portion of the workpiece, and is not necessarily disposed below the workpiece. For example, the downstream upper camera and the lower camera are disposed at positions above the side portions of the workpiece, and the lower camera is placed at a position outside the width direction of the workpiece and disposed downward, using the tilt disposed below the workpiece carrying surface of the table. The two mirrors of 45 degrees enable the optical axis of the lower camera to face the lower surface of the side portion of the workpiece. When the optical axis of the lower camera is inclined so as to face the inner side in the width direction, the optical axis can be directed toward the lower surface of the side portion of the workpiece by one mirror.

Further, in such a mounting structure, a half mirror for horizontally reflecting the inner side in the width direction of the optical axis table is disposed at a position where the optical axis of the lower camera passes the height of the upper surface of the table. The height of the upper surface of the table (work surface) can also be measured when the workbench is changed in accordance with the change in the size of the workpiece. In this case, whether the lower camera views the lower surface of the side portion of the workpiece or the side surface of the observation table can be selected by turning on and off the illumination lamps provided in the respective reading directions. That is, when the lamp on the lower surface of the side portion of the illumination workpiece is turned on, the lower camera reads the lower surface, and when the lamp on the side of the illumination table is turned on, the lower camera reads the height of the upper surface of the table.

In the chamfering device of the present invention, the chamfering and the measurement of the machining size are performed when the table is passed once with respect to the tool. Therefore, it is not necessary to perform the relative movement of the table for measuring the machining size, and even if the machining size is measured for all the workpieces to be processed, the production tact is not increased at all (the measurement speed is faster than the machining speed), or production is performed. The increase in the beat is small (the measurement speed is slower than the machining speed. In this case, the machining speed needs to be the same as the measurement speed), so there is no or almost no reduction in productivity, and it is possible to process the entire workpiece. According to the measurement, the necessary correction value can be set every time one workpiece is processed, and the effect of high-precision chamfering can be performed with high productivity.

Hereinafter, several preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 to 3 are views showing a first embodiment of a chamfering device of the present invention, the first drawing is a perspective view showing an outline of a main machine structure, and the second drawing is a schematic perspective view showing a mounting structure of a tool and a camera. The third diagram is a front view showing the positional relationship between the downstream camera and the workpiece.

In the figure, reference numeral 11 denotes a table base that moves along a guide rail in the y direction (not shown), and 2a denotes a rotary table that is mounted on the table base 11 by a rotating device that rotates about a vertical axis (not shown), and 2b indicates An elongated side table in the feeding direction mounted on both sides in the width direction (X direction in the drawing) of the truncated cone 2a, the side table being mounted to be freely approached or separated in the width direction with respect to the work pedestal 11. The side tables 2b on both sides are moved in the width direction according to the interval between the side edges 8, 9 of the workpiece 1, and the rotation and angle setting of the workpiece 1 are performed in such a manner that the table 2a rises and slightly rises above the side table 2b. Thereafter, the circular table 2a is rotated and descends after the rotation, and the workpiece 1 is supported by the side table 2b. The table 2 having such a truncated cone 2a and the side tables 2b on both sides thereof is disclosed in detail in Japanese Laid-Open Patent Publication No. 2005-329471.

In the second figure, 16 denotes a moving station in the width direction. The width direction moving table 16 is attached to a column (not shown) that is erected on both sides in the width direction of the table 2, and the both side portions can be independently moved in the width direction. Reference numeral 17 denotes a lifting platform that is mounted on the moving platform 16 in the width direction. The tool 3 is mounted on the lifting platform 17. The tool 3 in the drawing is a grinding wheel unit composed of a plurality of circular grinding wheels. 18 denotes a tool drive motor. The tool drive motor 18 is fixed to the lift table 17. 5a denotes an upstream side upper camera, 5b denotes a downstream side upper camera, and 6b denotes a downstream side lower camera. The cameras 5a, 5b, and 6b are mounted on the width direction moving table 16 and can finely adjust the up and down position.

As shown in the third figure, the downstream side cameras 5b, 6b are mounted such that when the width direction moving table 16 is moved to a position where the tool 3 processes the sides 8, 9 of the workpiece 1, the downstream side upper camera 5b is located at the workpiece. Above the side portion of the first side, the downstream side lower camera 6b is mounted on the outer side in the width direction of the workpiece 1 and above the position deviated from the side edges 8, 9 of the workpiece.

25 and 26 denote mirrors which sequentially bend the optical axis 19 of the downstream side lower camera 6b by 90 degrees so that the optical axis faces downward of the side portion of the workpiece 1, and 28 denotes a half mirror which is disposed downstream. The position of the optical axis 19 of the lower camera passes through the position of the upper surface of the table 2 for bending the optical axis 19 in the direction toward the side surface of the table 2. 29 denotes a lower lamp that illuminates the lower surface of the side portion of the workpiece 1, and 30 denotes a side lamp that illuminates the side surface of the table 2. The lamp that illuminates the upper surface of the side portion of the workpiece 1 uses a lamp built in the downstream side upper camera 5b. These mirrors 25, 26 and the half mirror 28 and the lamps 29, 30 are screw-fitted on the width direction moving table 16.

In the second drawing, 31 and 32 denote upper and lower air nozzles provided between the tool 3 and the downstream side cameras 5b, 6b. The air nozzles 31, 32 fix the outer end in the width direction to the width direction moving table 16, and extend inward in the width direction. The upper air nozzle 31 is located above the upper surface of the workpiece 1 fixed to the table 2, and the lower air nozzle 32 is located below the lower surface of the workpiece 1 fixed to the table 2. A slit-shaped nozzle hole that is long in the width direction is provided on the lower surface of the upper air nozzle 31 and the upper surface of the lower air nozzle 32. When the tool 3 processes the side of the workpiece 1, air is ejected from the nozzles 31, 32 in a film form, and an air curtain that cuts between the tool 3 and the downstream side cameras 5b, 6b and the mirrors 25, 26 is formed.

The servo motor controlled by the command value of the numerical control controller (not shown) drives the movement operation of the table base 11 in the feed direction, the rotation operation of the circular table 2a, the width direction movement of the side table 2b, and the width direction movement. The movement of the table 16 and the lifting operation of the lifting table 17. These command values can be corrected using the correction values set in the correction value memory of the numerical control controller, and supplied to the servo motors that drive the respective actions.

An image processing device is attached to the numerical control controller, and images of predetermined timings of the cameras 5a, 5b, and 6b are read into the image processing device, and the positioning mark 4 is recognized by image processing of the image processing device. The angle line (the line of intersection between the chamfered surface and the surface of the workpiece), the sides 8 and 9 of the workpiece, and the difference between the command value and the measured value are calculated based on the coordinates, and a correction value that matches the measured value with the command value is calculated. And set in the memory of the CNC controller.

Next, the processing and measurement operation of the workpiece of the first embodiment shown in the first to third drawings will be described.

(1) The two positioning marks 4, 4 arranged in the width direction are read by the upstream side upper camera 5a, and the angle of rotation of the table 2 about the vertical axis and the position of the width direction of the tool 3 are set according to the read mark position. .

(2) The table 2 is subjected to the feed movement while the chamfering of the first opposite sides 8, 8 is performed. After the processing portion of the workpiece reaches the position of the downstream side cameras 5b, 6b with the feed movement of the table 2, the image of the downstream side cameras 5b, 6b according to each predetermined predetermined position (if it is the substrate for the display) Since the mark indicating the measurement position is marked, the image is read at the position where the downstream camera detects the mark, and the processing size at the position is measured. At this time, the edge of the workpiece can be detected by the upstream camera 5a, and the cutting accuracy of the first opposing sides 8, 8 can be measured.

(3) After the end of the feed movement of (2), the circular table 2a is slightly raised and rotated by 90 degrees so that the positioning marks 4, 4 arranged in the feed direction in the state of (1) are moved back. The front side of the moving direction is arranged in the width direction.

(4) The two positioning marks 4, 4 arranged in the width direction are read by the downstream side upper camera 5b, and the angle of rotation of the table 2 about the vertical axis and the width direction of the tool 3 are set based on the read mark position data. position.

(5) Perform a quick return movement.

(6) The chamfering of the second opposing sides 9, 9 and the measurement of the machining size are performed by the same operation as (2). Similarly to (2), the cutting accuracy of the second opposing sides 9, 9 can also be measured.

(7) After the feed movement of (6) is completed, the workpiece is removed from the table 2, and a quick return movement is performed to return to the acceptance position of the next workpiece.

(8) The numerical control controller updates the correction value of the command value for the angle of the table 2 and the position of the width direction of the tool 3 and the position of the height direction when machining the next workpiece based on the machining size measured in (2) and (6). .

Further, in the above-described operation, reading of the positioning marks is performed twice in (1) and (4), but if the rotation accuracy of the table 2 (including the case where the workpiece is not offset on the upper surface of the table during rotation) ) It is sufficient to omit the reading of the positioning mark of (4). In this case, at the time of the feed movement of (2), the two upstream positioning marks 4, 4 arranged in the feeding direction are read by the upstream upper camera 5a, and the width direction position of the tool 3 is set based on the interval data of the two. .

Fig. 5 is a schematic perspective view (corresponding to the first diagram) showing a second embodiment of the present invention. The configuration of the second embodiment differs from the first embodiment in two points. One is that an upstream side lower camera 6a is provided at a position below the upstream side upper camera 5a for viewing the workpiece 1 on the upstream side of the tool 3. The lower side of the side portion, and the other is that the tool 3 can be chamfered during the movement of the feed and the return movement.

The chamfering tool 3 consisting of a plurality of circular grinding wheels mounted on the same grinding wheel shaft is arranged such that the tool penetrates deeply into the workpiece with the relative movement of the workpiece 1 in contact with the tool. Therefore, in order to be able to perform the same processing at the time of the feed movement and the return movement, it is generally necessary to separately provide two tools on the both sides of the table 2 in the opposite direction of the feed direction, or during the feed movement and the return movement. The operation of changing the inclination of the tool or the like is performed.

In the configuration of the second embodiment, the chamfering and the measurement of the machining size of the four sides of the workpiece 1 can be performed by the relative movement of the table 2 once and for all. which is,

(1) The same operation as (1) of the first embodiment. That is, the positioning marks 4 and 4 are read by the upstream upper camera 5a, and the angle of the table 2 and the position in the width direction of the tool 3 are set.

(2) The same operation as (2) of the first embodiment. That is, the table 2 is subjected to the feed movement, and the chamfering of the first opposing sides 8 and 8 is performed, and the processing size is measured by the downstream side cameras 5b and 6b. It is also possible to measure the cutting accuracy using the upstream side camera 5a or 6a.

(3) The same operation as (3) of the first embodiment. That is, the workpiece is rotated by 90 degrees by the truncated cone 2a.

(4) The same operation as (4) of the first embodiment. That is, the two positioning marks 4 and 4 arranged in the width direction are read by the downstream side upper camera 5b, and the angle of the table 2 and the position in the width direction of the tool 3 are set.

(5) The table 2 is moved back while the chamfering of the second opposite sides 9, 9 is performed. After the processing portion of the workpiece reaches the positions of the upstream cameras 5a and 6a with the feed movement of the table 2, the processing at the position is measured based on the images of the upstream cameras 5a and 6a at each predetermined predetermined position. size. At this time, the cutting accuracy can be measured by the downstream upper or lower cameras 5b and 6b.

(6) After the return movement of (5) is completed, the workpiece is removed from the table 2 and the next workpiece is accepted.

(7) The numerical control controller updates the correction of the angle of the table 2 and the position of the tool in the width direction and the position of the height direction when machining the next workpiece based on the machining dimensions measured in (2) and (5). value.

According to the above operation of the apparatus of the second embodiment, the production tact can be further shortened as compared with the first embodiment. However, there are disadvantages in that the upstream side cameras 5a, 6a and the tool 3 are separated by the moving mechanism in the width direction, and it is necessary to prepare two cameras, and the tool 3 must be used in both the forward and reverse directions. Processing tools.

As shown in the sixth figure, in the structure in which two chamfering devices are disposed along the conveying direction of the workpiece, and the rotary table 20 for rotating the workpiece by 90 degrees is disposed therebetween, if the chamfering device can use the chamfering of the present invention According to the device, it is possible to measure the machining size of all the workpieces to be processed, and it is possible to realize a highly productive machining operation. Regarding the chamfering device in this case, a configuration of the first embodiment in which only the upper camera 5a is provided on the upstream side, and a table having no rotating mechanism (there is no round table 2a in the example of the sixth figure) can be employed. Chamfering device.

1‧‧‧hard brittle board

2‧‧‧Workbench

2a‧‧‧ Round table

2b‧‧‧ side table

3‧‧‧Chamfering tool

4‧‧‧ mark

5a‧‧‧Upstream side upper camera

5b‧‧‧Downstream upper camera

6a‧‧‧Upstream side lower camera

6b‧‧‧ downstream camera

7‧‧‧Chamfer line

8‧‧‧ first opposite side

9‧‧‧ second opposite side

11‧‧‧Working pedestal

16‧‧‧width direction mobile station

17‧‧‧ Lifting table

18‧‧‧Tool drive motor

19‧‧‧ optical axis

20‧‧‧Rotating table

25, 26‧‧‧ mirror

28‧‧‧Semi-transparent mirror

29‧‧‧lower light

30‧‧‧ side lights

31‧‧‧Upper air nozzle

32‧‧‧low air nozzle

The first figure is a perspective view showing an outline of the main machine structure of the first embodiment.

The second diagram is a schematic perspective view showing the mounting structure of the tool and the camera.

The third diagram is a front view showing the positional relationship between the downstream camera and the workpiece.

The fourth figure is a front view showing another positional relationship between the downstream camera and the workpiece.

The fifth figure is a perspective view showing an outline of the main machine structure of the second embodiment.

The sixth drawing is a perspective view showing an outline of the main machine configuration of the third embodiment.

The seventh figure is a partially enlarged plan view of the workpiece showing the relationship between the positioning mark and the machining size.

The eighth diagram is a perspective view showing an overview of the main machine configuration of the conventional apparatus.

1‧‧‧hard brittle board

2‧‧‧Workbench

2a‧‧‧ Round table

2b‧‧‧ side table

3‧‧‧Chamfering tool

5a‧‧‧Upstream side upper camera

5b‧‧‧Downstream upper camera

6b‧‧‧ downstream camera

8‧‧‧ first opposite side

9‧‧‧ second opposite side

11‧‧‧Working pedestal

25, 26‧‧‧ mirror

Claims (2)

A chamfering device for a hard brittle plate, comprising: a work table fixed on the upper surface thereof to maintain a rigid brittle plate; a chamfering tool disposed on both sides in the width direction of the table; and a width direction moving table, which enables a chamfering tool moving in the width direction; a feeding device that causes the table to move relative to the tool in a direction orthogonal to the width direction, that is, a feeding direction; and a moving table on the width direction The upstream upper camera reads the positioning mark indicated on the side portion of the hard brittle plate, and the chamfering device sets the width direction position of the tool according to the mark reading data of the upstream upper camera, and then Moving the table relatively in the feeding direction, chamfering the side of the hard brittle plate, the chamfering device being characterized by being interposed in the feeding direction of the upstream upper camera The opposite side of the tool is provided with a downstream side upper camera and a downstream side lower camera, and the downstream side upper camera and the downstream side lower camera are mounted in the width direction a moving table, and reading an upper surface and a lower surface of a side portion of the hard brittle board processed by the tool, and moving the table relative to the chamfering processing according to an image pickup signal of the downstream side camera At the time of the processing, the processing size is measured. The chamfering device for a rigid brittle plate according to the first aspect of the invention, wherein a distance between the chamfering tool and the feeding direction of the downstream camera is smaller than a feeding direction of the chamfering tool and the upstream upper camera. The downstream side lower camera is disposed downward in the width direction outer side of the downstream side upper camera located above the upper surface of the table, and has an optical axis of the downstream lower camera facing the side of the hard brittle board of A mirror of a lower surface, wherein a half mirror having a horizontal reflection of the light axis toward the stage side is provided at a position where the optical axis passes through a height of an upper surface of the table.