WO2009081747A1

WO2009081747A1 - Dicing apparatus and dicing method

Info

Publication number: WO2009081747A1
Application number: PCT/JP2008/072515
Authority: WO
Inventors: Yoshitami Hojo
Original assignee: Tokyo Seimitsu Co., Ltd.
Priority date: 2007-12-21
Filing date: 2008-12-11
Publication date: 2009-07-02
Also published as: TWI450805B; TW200936341A

Abstract

A dicing apparatus in one mode of this invention is provided with a work table for placing a work; a machining means for machining the work; a moving means for relatively moving the work table with the machining means; an imaging means which can pick up the image of the work on the work table and the image of the machining means at the same time; an imaging means moving shaft for moving the imaging means; and a control means for controlling the machining means, the moving means, the imaging means and the imaging means moving shaft. The dicing apparatus makes it possible to adjust a blade with the work without machining a dummy work on the test basis, shorten an adjustment time, and improve an operation rate of the device as a whole by reducing cost required for adjustment.

Description

Dicing apparatus and dicing method

The present invention relates to a dicing apparatus and a dicing method for dividing a workpiece such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.

A dicing machine for cutting and grooving a workpiece such as a wafer on which a semiconductor device or an electronic component is formed is at least a rotating blade made of a thin grindstone called a blade rotated at high speed by a spindle, and a workpiece holding the workpiece. A table, and X, Y, Z, and θ movement axes that change the relative positions of the work table and the blade are provided. When machining a workpiece, cutting fluid for cooling and lubrication is supplied from the nozzle to a rotating blade or a machining point where the workpiece and the blade are in contact with each other. To be applied.

Fig. 9 shows a conventional example of a dicing apparatus. The dicing device 70 is disposed as opposed to each other as processing means, and includes

spindles

72 and 72 with a built-in high-frequency motor with a blade 71 and a wheel cover (not shown) attached to the tip, a work table 73 that holds the work W by suction, A processing unit 75 having an imaging unit 74 including a microscope, a CCD camera, or the like that images the workpiece W is provided. In addition to this, the dicing apparatus 70 includes a cleaning unit 76 that spin-cleans the processed workpiece W processed by the processing unit 75 and a load port 77 that mounts a cassette that stores a large number of workpieces W mounted on the frame F. And a conveying means 78 for conveying the workpiece W, a controller 79 for controlling the operation of each part, and the like.

As shown in FIG. 10, the structure of the processing section 75 is guided by

X guides

81 and 81 provided on the X base 80 and driven by a linear motor 82 in the X direction indicated by XX in the figure. The X table 83 is provided with a work table 85 via a rotary table 84 that rotates in the θ direction.

On the other hand, on the side surface of the Y base 86, there are provided Y tables 88 and 88 which are guided by

Y guides

87 and 87 and driven in the Y direction indicated by YY in the figure by a stepping motor and a ball screw (not shown). . Each Y table 88 is provided with a Z table 89 that is driven in the Z direction indicated by ZZ in the figure by driving means (not shown), and the Z table 89 has a built-in high-frequency motor with a blade 71 attached to the tip. The spindle 72 is fixed. Since the structure of the processing unit 74 is as described above, the blade 71 is index-fed in the Y direction and cut and fed in the Z direction, and the work table 73 is cut and fed in the X direction.

Both spindles 72 are rotated at a high speed of 1,000 rpm to 80,000 rpm, and a supply nozzle (not shown) for supplying a cutting fluid for immersing the workpiece W in the cutting fluid is provided in the vicinity.

As the blade 71, an electrodeposition blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel, a metal resin bond blade in which metal powder is mixed and a resin is used. The dimensions of the blade 71 are variously selected depending on the content of processing. When dicing a normal semiconductor wafer as a workpiece, a blade having a diameter of about 50 mm and a thickness of about 30 μm is used.

The controller that controls the operation of each part of the dicing apparatus 70 includes a CPU, a memory, an input / output circuit section, various control circuit sections, and the like, and is incorporated in the frame of the dicing apparatus 70. As such a dicing apparatus, for example, a dicing apparatus described in Patent Document 1 has been proposed.

Further, in recent years, instead of using such a blade 71, laser light having a focused point inside the work W is incident on the work W, and a plurality of modified regions by multiphoton absorption are formed inside the work W. A laser dicing apparatus that expands the work W and divides the work W into individual chips T is also used for processing the work W.

The laser dicing apparatus is provided with a load port, a conveying means, a work table and the like, similar to the dicing apparatus 70. As shown in FIG. ing.

The laser head 91 includes a laser oscillator 91A, a collimating lens 91B, a mirror 91C, a condensation lens 91D, and the like. The laser light L oscillated from the laser oscillator 91A is collimated in the horizontal direction by the collimating lens 91B. The light is reflected in the vertical direction and condensed by the condensation lens 91D (see, for example, Patent Document 2).

When the condensing point of the laser beam L is set inside the thickness direction of the workpiece W placed on the workpiece table 73, the laser beam L transmitted through the surface of the workpiece W is collected as shown in FIG. Energy is concentrated at the light spot, and a modified region P such as a crack region, a melted region, a refractive index changing region or the like due to multiphoton absorption is formed in the vicinity of the condensing point inside the workpiece.

As shown in FIG. 12 (b), a plurality of reformed regions P are formed side by side inside the workpiece W by moving the workpiece W in the horizontal direction. In this state, the workpiece W is naturally cleaved starting from the reforming region P, or is cleaved starting from the reforming region P by applying a slight external force. In this case, the workpiece W is easily divided into chips without causing chipping on the front and back surfaces.

In such a dicing apparatus 10 or laser dicing apparatus, the relative distance between the imaging position of the imaging means 74 and the processing position by the blade 71 or laser light is measured before dicing, and the imaging means 74, Adjustment of the focal position of the blade 71 or the laser beam is performed. Such adjustment is performed by performing dicing processing of the workpiece W on a trial basis and imaging the processing groove formed in the workpiece W by the imaging means 74.

When the workpiece W to be newly machined is placed on the workpiece table 73, the workpiece W is imaged by the imaging means 74 aligned in this way, and alignment is performed to adjust the position between the machining position and the machining means. The operation is performed. Further, during machining, the workpiece W is imaged by the imaging means 74 at any time as needed to check the machining status.
JP 2002-280328 A JP 2002-192367 A

However, in an apparatus such as the dicing apparatus 70, it is necessary to process the workpiece W on a trial basis every time the positions of the blade 71 and the imaging means 74 are adjusted, and a dummy workpiece for performing a trial machining is required. A large number of preparations are required, which increases the time and cost required for adjustment and greatly reduces the efficiency of the dicing apparatus.

The present invention has been made for such a problem, and an object of the present invention is to provide a dicing apparatus and a dicing method that can shorten the adjustment time of a blade and a workpiece and improve the operating rate of the entire apparatus. It is said.

In order to achieve the above object, the dicing apparatus according to the first aspect of the present invention provides a work table on which a work is placed, a processing means for processing the work, and a relative relationship between the work table and the processing means. Moving means for moving the imaging means, imaging means capable of simultaneously imaging the work on the work table and the processing means, imaging means moving axis for moving the imaging means, the processing means, the moving means, and the imaging And a control means for controlling the moving axis of the imaging means.

According to a second aspect of the present invention, in the first aspect, the imaging means moving axis positions the imaging means between the work table and the processing means, and the imaging means is the work table. And the processing means.

Furthermore, a third aspect of the present invention is the first or second aspect, wherein the imaging means is a first imaging unit that images the processing means and is provided in the direction of the processing means. 1, and a second imaging unit that images a workpiece on the work table and is provided in the direction of the work table.

In order to achieve the above object, a dicing method according to another aspect of the present invention relatively includes a work table on which a work is placed, a processing means for processing the work, and the work table and the processing means. Moving means for moving; Imaging means capable of simultaneously imaging the work on the work table and the processing means; Imaging means moving axis for moving the imaging means; Processing means; Moving means; Imaging means And a control means for controlling the imaging means moving axis, a dicing method used in a dicing apparatus comprising: the imaging means is positioned between the work table and the processing means by the imaging means moving axis; A first imaging unit that images the processing unit, the first imaging unit provided in the imaging unit toward the processing unit; A second imaging unit that images the workpiece on the table, and the second imaging unit provided in the imaging unit toward the work table, and simultaneously images the processing unit and the workpiece; A relative position coordinate between the processing means and the work is calculated by processing the captured image of the processing means and the image of the work with the control means, and the relative position coordinates are calculated based on the calculated relative position coordinates. The workpiece is machined by aligning the machining means and the workpiece.

According to the dicing apparatus and the dicing method of the present invention, a work table on which a work is placed and a processing means such as a blade or a laser rotated by a spindle are moved relative to each other in XYZθ directions by moving means controlled by the control means. The workpiece is diced and moved.

The dicing apparatus is provided with an imaging unit capable of simultaneously imaging the workpiece on the work table and the processing unit, and an imaging unit moving axis for moving the imaging unit. The imaging unit includes a first imaging unit that images the processing unit provided in the direction of the processing unit and a second imaging unit that images a workpiece on the work table provided in the direction of the work table. And is moved between the work table and the processing means by being moved by the imaging means moving axis.

In this state, the imaging unit images a position serving as a reference for the processing unit such as the tip of the blade by the first imaging unit, and images a position serving as a reference such as a street or an alignment mark on the workpiece by the second imaging unit. . The captured two images are processed by a known image processing method such as superposition by the control means, and the relative position coordinates between the processing means and the workpiece are calculated. The positions of the processing means and the workpiece are matched based on the calculated relative position coordinates.

When the imaging of the machining means and the workpiece is completed, the imaging means moves and retracts between the work table and the machining means by the imaging means moving axis, and does not hinder the machining of the workpiece on the work table by the machining means.

This makes it possible to adjust the blade and workpiece without experimentally processing the dummy workpiece, shortening the adjustment time, reducing the cost of the dummy workpiece, and improving the operating rate of the entire device. be able to.

Also, the imaging means can acquire information on the height direction of the blade by focusing on the tip of the blade. As a result, the outer shape of the blade can be known, and the wear amount of the blade can be measured without contact.

As described above, according to the dicing apparatus and the dicing method of the present invention, it is possible to adjust the blade and the workpiece without experimentally processing the dummy workpiece, shortening the adjustment time and necessary for the adjustment. It is possible to improve the operating rate of the entire apparatus by reducing the cost.

FIG. 1 is a perspective view showing the appearance of a dicing apparatus in which the dicing method of the invention is implemented; FIG. 2 is a perspective view showing a structure of a processing portion of the dicing apparatus shown in FIG. 1; FIG. 3 is a cross-sectional view showing the main structure of the processed part shown in FIG. 2; FIG. 4 is a plan view showing the structure of the processing part of the dicing apparatus; FIG. 5 is a side view showing the structure of the processing portion of the dicing apparatus; FIG. 6 is a plan view showing a state where one blade and a workpiece are imaged by the imaging device; FIG. 7 is a plan view showing a state in which the other blade and the workpiece are imaged by the imaging device; FIG. 8 is a plan view showing a state in which the imaging device is retracted; FIG. 9 is a perspective view showing the appearance of a conventional dicing apparatus; 10 is a perspective view showing a structure of a processing portion of the dicing apparatus shown in FIG. 8; FIG. 11 is a side view showing the configuration of a dicing apparatus that performs dicing with a laser; FIG. 12 is a side sectional view showing the principle of laser dicing.

Explanation of symbols

DESCRIPTION OF

SYMBOLS

1,70 ... Dicing apparatus, 2 ... Load port, 3 ... Adsorption part, 4 ... Conveyance means, 5 ... Processing part, 6 ... Spinner, 7 ... Controller (control means), 8 ... Blade, 9 ... Spindle, 10, 11 ... Work table, 12 ... Imaging means, 13 ... Imaging means Y guide, 14 ... Imaging means moving table, 16, 18 ... X table, 20 ... Oil pan, 22 ... Guide rail, 24 ... Ball screw, 26 ... Servo motor, 28 ... Ball nut, 30 ... Slider, 32 ... θ table, 33 ... Fixing jig, 34 ... Bellow, 36 ... Guide rail, 38 ... Ball screw, 40 ... Servo motor, 44 ... θ table, 46 ... Bellow, 48 ... Guide base 50 ... Spindle Y guide 52 ... Spindle Y table 54 ... Spindle Z table 56 ... Holder

Hereinafter, preferred embodiments of a dicing apparatus and a dicing method according to the present invention will be described in detail with reference to the accompanying drawings.

First, the configuration of the dicing apparatus according to the present invention will be described. FIG. 1 is an overall perspective view of the dicing apparatus.

The dicing apparatus 1 according to the embodiment shown in FIG. 1 includes a load port 2 for transferring a cassette storing a plurality of workpieces to and from an external device, and a suction unit 3, and a conveying unit that conveys the workpiece to each part of the device. 4, a processing unit 5, a spinner 6 that cleans and dries a workpiece after processing, and a controller 7 that serves as control means for controlling the operation of each part of the apparatus.

The processing unit 5 includes two

spindles

9 and 9 which are arranged opposite to each other as processing means and have a blade 8 attached to the tip, and two work tables 10 and 11 having the same shape on which the workpieces are sucked and placed. , 11 is provided with an imaging means 12 capable of imaging the workpiece and the blade 8 simultaneously.

Below the work tables 10 and 11, a box-shaped oil pan 20 is horizontally arranged so as to sufficiently surround the work tables 10 and 11 as shown in FIG. Two pairs of guide rails (guide mechanisms) 22 and 22 are arranged on the left side surface of the oil pan 20 along an arrow X direction in the figure, and between these

guide rails

22 and 22 are arranged. The ball screw 24 constituting the drive mechanism is disposed in parallel with the guide rails 22 and 22 and along the left side surface of the oil pan 20.

Further, a servo motor 26 that rotationally drives the ball screw 24 is disposed on the back side in the depth direction of the oil pan 20. Further, an X table 16 guided in the guide rails 22 and 22 and driven in the X direction by the rotation of the ball screw 24 by the servo motor 26 is arranged in the vertical direction. The drive mechanism of the present invention may be a drive mechanism using a linear motor in addition to the drive mechanism using the ball screw 24.

As shown in FIG. 3, the X table 16 is provided with a ball nut 28 screwed into the ball screw 24, and

sliders

30 and 30 slidably engaged with the guide rails 22 and 22, and in the Z direction (see FIG. 1) is mounted, and a work table 10 is attached to the θ table 32. The bottom surface of the rotation axis of the θ table 32 is fixed to an L-shaped fixing jig 33 attached to the X table 16 so that the work table 10 rotates in the θ direction on a horizontal plane.

A pair of bellows (bellows members) 34, 34 that are extended and contracted as the X table 16 moves in the X direction and covers the guide rails 22, 22 and the ball screw 24 are disposed on the left side surface of the oil pan 20. . One bellows 34 has one end fixed to the front side in the depth direction of the oil pan 20 and the other end fixed to the front side edge in the depth direction of the X table 16. One end of the other bellows 34 is fixed to the back side in the depth direction of the oil pan 20, and the other end is fixed to the back side edge in the depth direction of the X table 16. In FIG. 2, the other bellows 34 is omitted.

On the other hand, as shown in FIG. 2, a pair of guide rails (guide mechanisms) 36 and 36 are also provided on the right side surface of the oil pan 20 along the arrow X direction in FIG. Also between 36 and 36, a ball screw 38 constituting a drive mechanism is disposed in parallel with the guide rails 36 and 36 and along the right side surface of the oil pan 20.

Further, a servo motor 40 that rotationally drives the ball screw 38 is disposed on the deep side of the oil pan 20 in the depth direction. Further, an X table 18 guided by the guide rails 36 and 36 and driven in the X direction by the rotation of the ball screw 38 by the servo motor 40 is disposed.

The X table 18 is provided with a ball nut (not shown) that is screwed with the ball screw 38, and a slider (not shown) that is slidably engaged with the guide rails 36, 36, and in the Z direction (see FIG. 1). ) Is mounted on a θ table (θ rotation shaft) 44, and the work table 11 is attached to the θ table 44. The bottom surface of the rotation axis of the θ table 44 is fixed to an L-shaped fixing jig (not shown) attached to the X table 18 so that the work table 11 rotates in the θ direction on a horizontal plane.

A pair of bellows (bellows members) 46 and 46 that are extended and contracted as the X table 18 moves in the X direction and covers the guide rails 36 and 36 and the ball screw 38 are disposed on the right side surface of the oil pan 20. . One bellows 46 has one end fixed to the front side in the depth direction of the oil pan 20 and the other end fixed to the front side edge in the depth direction of the X table 18. One end of the other bellows 46 is fixed to the back side in the depth direction of the oil pan 20, and the other end is fixed to the back side edge in the depth direction of the X table 18. In FIG. 2, the other bellows 46 is omitted.

In addition, a gate-shaped guide base 48 is erected on the processing portion 5 as shown in FIG. A spindle Y guide 50 is mounted horizontally on the side surface of the guide base 48 in the direction of the arrow Y in the figure. The spindle Y guide 50 is guided by the spindle Y guide 50 and serves as a moving means that is indexed in the Y direction by a drive mechanism (not shown). Two spindle Y tables 52, 52 are provided. Each spindle Y table 52 is provided with a spindle Z table 54 as a moving means that is cut and fed in the direction of arrow Z in the figure by a guide rail and a driving mechanism (not shown). Each spindle Z table 54 has a holder 56. A spindle 9 is attached via The drive mechanism for the spindle Y table 52 and the spindle Z table 54 may be a linear motor, or may be a servo motor and a lead screw.

Spindles

9 and 9 are high-frequency motor built-in air bearing type or mechanical bearing type spindles, and are arranged to face each other. Each spindle 9 has a rotating blade 8 attached to the tip, and is rotated at high speed by the spindle 9.

The blade 8 is surrounded by a flange cover (not shown) opened on the front side and the lower side, and grinding water is supplied from a grinding nozzle provided on the flange cover toward a processing point. The flange cover is provided with a cleaning nozzle (not shown), and cleaning water is supplied from the cleaning nozzle toward the processing point.

The blade 8 is a thin disk-shaped grindstone, and an electrodeposition blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel, a metal resin bond blade in which a metal powder is mixed, and the like are used. The dimensions of the blade 8 are variously selected depending on the contents of processing. When dicing a normal semiconductor wafer as a workpiece, a blade having a diameter of about 50 mm and a thickness of about 30 μm is used.

By such a mechanism, the two

rotary blades

8 and 8 are independently indexed in the Y direction and cut in the Z direction in the drawing.

Also, imaging means Y guides 13 and 13 are provided on the bottom surface of the guide base 48 as imaging means moving axes. An imaging means moving table 14 to which the imaging means 12 is fixed is attached to the imaging means Y guides 13 and 13 so that the imaging means 12 is movable in the Y direction.

As shown in FIG. 5, the imaging means 12 is provided in the direction of the blade 8 and is provided in the direction of the first imaging unit 12A made of a microscope, a CCD camera, or the like, and the work tables 10 and 11, and the microscope. And a second imaging unit 12B composed of a CCD camera or the like.

The imaging unit 12 is positioned between the work table 11 (or the work table 10) and the blade 8 as the imaging unit moving table 14 moves on the imaging unit Y guides 13 and 13, and the first imaging unit 12A uses the blade. 8 is imaged, and the second imaging unit 12B images a reference position such as a street or an alignment mark on the work W on the work table 11.

The two images picked up by the first image pickup unit 12A and the second image pickup unit 12B are transmitted to the controller 7 and processed by a known image processing method such as superposition, whereby the blade 8 and the work W are processed. Relative position coordinates for adjusting the position are calculated. The blade 8 and the workpiece W are aligned based on the calculated relative position coordinates. As a result, the blade 8 and the workpiece W can be adjusted without processing the dummy workpiece experimentally.

Next, a dicing method according to the present invention performed by the dicing apparatus 1 configured as described above will be described.

In the dicing method of the present invention, first, one piece of work W attached to the frame via dicing tape accommodated in a cassette placed on the load port 2 of the dicing apparatus 1 is conveyed by the conveying means 4. It is pulled out from the cassette one by one and is attracted to the work table 11 (or work table 10).

Subsequently, the work W attracted to the work table 11 is positioned below the blade 8 attached to the tip of one spindle 9 as the work table 11 moves in the X direction as shown in FIG. After the workpiece W is positioned below the blade 8, the imaging means 12 is positioned between the workpiece table 11 and the blade 8, and the tip of the blade 8 is imaged by the first imaging unit 12A as shown in FIG. The second imaging unit 12B captures a reference position such as a street or an alignment mark on the work W on the work table 11.

The two images captured by the first imaging unit 12A and the second imaging unit 12B are transmitted to the controller 7. The two images transmitted to the controller 7 are processed by a known image processing technique such as superposition so that relative position coordinates for adjusting the positions of the blade 8 and the workpiece W are calculated. The blade 8 and the workpiece W are aligned based on the calculated relative position coordinate values.

Further, when the workpiece 8 on the work table 11 is diced by the blade 8 attached to the other spindle 9 provided oppositely, the other spindle 9 moves and moves on the work table 11 as shown in FIG. The blade 8 is positioned above the workpiece W, and the imaging means 12 is moved to be positioned between the blade 8 attached to the tip of the other spindle 9 and the work table 11. In this state, the tip of the blade 8 is imaged by the first imaging unit 12A in the same manner as the blade 8 attached to one spindle 9, and the workpiece W on the work table 11 is imaged by the second imaging unit 12B. By processing the two images transmitted to the controller 7 with the controller 7, relative position coordinates for adjusting the positions of the blade 8 and the workpiece W are calculated. The blade 8 and the workpiece W are aligned based on the calculated relative position coordinate values.

Subsequently, when all the alignment operations are completed and dicing of the workpiece W is started, the imaging unit 12 moves to a position where the

blades

8 and 8 do not prevent the workpiece W from being processed as shown in FIG. . While the work W on the work table 11 is being machined, a new work W is placed on the work table 10, and as soon as the work W on the work table 11 has been machined, the imaging unit 12 similarly uses the blade 8. , 8 and the work W on the work table 10 are aligned.

Thus, the blade 8 and the workpiece W can be adjusted without processing the dummy workpiece experimentally.

In addition, when the dicing of the work W initially placed on the work table 11 is finished and a new work W is placed, the blade 8 and the work W are simultaneously imaged by the imaging means 12 and alignment is performed. Is called. At this time, it is possible to measure the change in the height of the blade 8 in the Z direction from the change in the focal length when the first imaging unit 12A is focused on the tip of the blade 8, and the amount of wear of the blade 8 is measured. Etc. are measured without contact. When the amount of wear of the blade 8 is larger than a predetermined value, a warning for prompting the operator to replace the blade is issued from the dicing apparatus 1.

As described above, according to the dicing apparatus and the dicing method of the present invention, it is possible to adjust the blade and the workpiece without experimentally processing the dummy workpiece, shortening the adjustment time, and adjusting. It is possible to improve the operating rate of the entire apparatus by reducing the cost required for the system. Furthermore, it becomes possible to measure the amount of wear of the blade in a non-contact manner, and the operating rate of the apparatus is further improved.

In the present embodiment, the opposing

spindles

8 and 8 each having the blade 8 attached to the opposing tip are used as the processing means. However, the present invention is not limited to this, and known processing means such as a laser is used. Any dicing apparatus can be suitably implemented.

In the present embodiment, a plurality of processing means and work tables are provided. However, the present invention is not limited to this, and can be suitably implemented in a single work table or a dicing apparatus having a single processing means. Further, in the present embodiment, the dicing apparatus may include a plurality of imaging units.

Claims

A work table on which the work is placed;
Processing means for processing the workpiece;
Moving means for relatively moving the work table and the processing means;
Imaging means capable of simultaneously imaging the work on the work table and the processing means;
An imaging means moving axis for moving the imaging means;
Control means for controlling the processing means, the moving means, the imaging means, and the imaging means moving axis;
A dicing apparatus comprising:
The imaging means moving axis positions the imaging means between the work table and the processing means, and retracts the imaging means from between the work table and the processing means. Item 2. The dicing apparatus according to Item 1.
The imaging unit is a first imaging unit that images the processing unit, the first imaging unit provided in the direction of the processing unit, and a second imaging that images a workpiece on the work table. The dicing apparatus according to claim 1, further comprising: a second imaging unit that is provided in a direction toward the work table.
A work table on which a work is placed; a processing means for processing the work; a moving means for relatively moving the work table and the processing means; the work on the work table; and the processing means. A dicing apparatus comprising: an imaging unit capable of simultaneously imaging; an imaging unit moving axis that moves the imaging unit; and a processing unit, the moving unit, the imaging unit, and a control unit that controls the imaging unit moving axis. In the dicing method used in
The imaging means is positioned between the work table and the processing means by the imaging means moving axis,
A first imaging unit for imaging the processing unit, a first imaging unit provided in the imaging unit in the direction of the processing unit, and a second imaging unit for imaging a workpiece on the work table Then, the processing unit and the workpiece are simultaneously imaged by a second imaging unit provided in the imaging unit toward the work table,
Calculating the relative position coordinates of the processing means and the work by processing the captured image of the processing means and the image of the work by the control means;
A dicing method, wherein the workpiece is machined by aligning the machining means with the workpiece based on the calculated relative position coordinates.