CN111452238A - Cutting device and dressing method of cutting tool - Google Patents
Cutting device and dressing method of cutting tool Download PDFInfo
- Publication number
- CN111452238A CN111452238A CN202010004196.7A CN202010004196A CN111452238A CN 111452238 A CN111452238 A CN 111452238A CN 202010004196 A CN202010004196 A CN 202010004196A CN 111452238 A CN111452238 A CN 111452238A
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- cutting
- dressing
- unit
- cutting tool
- rotating shaft
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 claims abstract description 49
- 238000009966 trimming Methods 0.000 claims description 19
- 238000002360 preparation method Methods 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
- B24B53/14—Dressing tools equipped with rotary rollers or cutters; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
Abstract
Provided are a cutting device and a method of dressing a cutting tool. The cutting tool can be efficiently dressed in a short time. The cutting device performs cutting processing on a plate-shaped processed object, wherein the cutting device comprises: a holding table having a holding surface for holding a workpiece; a cutting unit having a rotating shaft to which a disk-shaped cutting tool having a cutting edge on an outer peripheral portion thereof is attached, the cutting unit rotating the cutting tool together with the rotating shaft to cut the workpiece held by the holding table; a cutting mechanism that moves the cutting unit in a direction perpendicular to the holding surface; and a dressing unit having a rotating shaft to which the disk-shaped dressing plate is attached, the dressing unit rotating the dressing plate together with the rotating shaft to dress the cutting tool, the rotating shaft of the dressing unit being disposed non-parallel to the rotating shaft of the cutting unit.
Description
Technical Field
The present invention relates to a cutting apparatus for cutting a plate-shaped workpiece, and a method of dressing a cutting tool applied to the cutting apparatus.
Background
A processing method called edge trimming is known, in which an outer peripheral portion of a disc-shaped workpiece represented by a semiconductor wafer is partially removed. In the edge trimming, an annular cutting tool in which abrasive grains such as diamond are fixed by a bonding material such as metal is rotated to cut into the outer peripheral portion of the workpiece.
At this time, only a part of the cutting insert (for example, a part around 2/3 in the thickness direction) contacts the outer peripheral portion of the workpiece. Therefore, in the process of trimming the edge, a part of the cutting tool in contact with the workpiece is worn, and a slight step and a tilt are generated on the outer peripheral surface of the cutting tool.
Since the step and the inclination of the outer peripheral surface cause a machining failure, when they occur, the cutting tool must be trimmed to flatten the outer peripheral surface again. As a trimming method for flattening the outer peripheral surface of the cutting tool, a method of cutting the cutting tool into a trimming plate in a vertically standing state has been proposed in recent years (for example, see patent document 1).
Patent document 1: japanese patent laid-open publication No. 2017-205810
However, in the above trimming method, the rotating cutting tool is moved to reciprocate in a direction parallel to the rotation axis to cut into the trimming plate. Specifically, the cutting tool is caused to cut into the dressing plate on the forward path (or the backward path), and the cutting tool is not caused to cut into the dressing plate on the backward path (or the forward path). Therefore, a long time may be required until finishing is completed.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a cutting apparatus and a method of dressing a cutting tool, which can efficiently and in a short time dress the cutting tool.
According to one aspect of the present invention, there is provided a cutting apparatus for cutting a plate-shaped workpiece, the cutting apparatus including: a holding table having a holding surface for holding the workpiece; a cutting unit having a rotating shaft to which a disk-shaped cutting tool having a cutting edge on an outer peripheral portion thereof is attached, the cutting unit rotating the cutting tool together with the rotating shaft to cut the workpiece held by the holding table; a cutting mechanism that moves the cutting unit in a direction perpendicular to the holding surface; and a dressing unit having a rotating shaft to which a disk-shaped dressing plate is attached, the dressing unit rotating the dressing plate together with the rotating shaft to dress the cutting tool, the rotating shaft of the dressing unit being disposed non-parallel to the rotating shaft of the cutting unit, and the cutting unit being moved toward the dressing unit by the cutting mechanism while bringing an outer peripheral surface of the rotating cutting tool into contact with an outer peripheral surface of the rotating dressing plate to dress the cutting tool.
According to another aspect of the present invention, there is provided a method of dressing a cutting insert, the method comprising dressing an outer peripheral surface of the cutting insert using a cutting apparatus, the cutting apparatus comprising: a holding table having a holding surface for holding a plate-shaped workpiece; a cutting unit having a rotating shaft to which a disk-shaped cutting tool having a cutting edge on an outer peripheral portion thereof is attached, the cutting unit rotating the cutting tool together with the rotating shaft to cut the workpiece held by the holding table; a cutting mechanism that moves the cutting unit in a direction perpendicular to the holding surface; and a dressing unit having a rotating shaft to which a disk-shaped dressing plate is attached, the dressing unit rotating the dressing plate together with the rotating shaft to dress the cutting tool, the rotating shaft of the dressing unit being disposed non-parallel to the rotating shaft of the cutting unit, characterized in that the dressing method for the cutting tool comprises the steps of: a rotating step of rotating the cutting tool and the trimming plate, respectively; a contact step of moving the cutting unit to the dressing unit side by the cutting mechanism to bring the outer peripheral surface of the cutting tool into contact with the outer peripheral surface of the dressing plate; and a dressing step of dressing the cutting tool by further moving the cutting unit toward the dressing unit side by the cutting mechanism while bringing the outer peripheral surface of the rotating cutting tool into contact with the outer peripheral surface of the rotating dressing plate, wherein in the dressing step, a dressing amount of the cutting tool is controlled in accordance with a movement amount of the cutting unit toward the dressing unit side.
A cutting device according to one embodiment of the present invention includes: a cutting unit having a rotating shaft to which a disk-shaped cutting tool is attached; and a dressing unit having a rotating shaft to which the disk-shaped dressing plate is attached, so that the cutting tool can be dressed only by moving the cutting unit toward the dressing unit while rotating the cutting tool and the dressing plate to bring the outer peripheral surface of the cutting tool into contact with the outer peripheral surface of the dressing plate.
That is, in the cutting device according to one aspect of the present invention, when dressing the cutting tool, it is not necessary to move the cutting tool in a manner of reciprocating relative to the dressing plate, and therefore, the dressing of the cutting tool can be efficiently performed in a short time. Similarly, in the method for truing a cutting insert according to another aspect of the present invention, since it is not necessary to move the cutting insert so as to reciprocate relative to the truing plate when truing the cutting insert, it is possible to efficiently tru the cutting insert in a short time.
Drawings
Fig. 1 is a perspective view showing a configuration example of a cutting device.
Fig. 2 is a front view showing the relationship of the positions of the cutting unit and the dressing unit.
Fig. 3 (a) is a perspective view for explaining the rotation step and the contact step, and fig. 3 (B) is a perspective view for explaining the dressing step.
Description of the reference symbols
2: a cutting device; 4: a base station; 4 a: an opening; 6: an X-axis moving mechanism (machining feed mechanism); 8: a table cover; 10: a corrugated cover; 12: a chuck table (holding table); 12 a: a holding surface; 14: a clamp; 16: a support structure; 18: a Y-axis and Z-axis moving mechanism (an indexing feed mechanism and a cutting mechanism); 20: a Y-axis guide rail; 22: moving the plate along the Y axis; 24: a Y-axis ball screw; 26: a Z-axis guide rail; 28: moving the plate along the Z axis; 30: a Z-axis ball screw; 32: a Z-axis pulse motor; 34: a cutting unit; 36: a main shaft; 38: a cutting tool; 38 a: an outer peripheral surface; 40: a camera (shooting unit); 42: a trimming unit; 44: a main shaft; 46: trimming the plate; 46 a: an outer peripheral surface; 11: a workpiece; 13: an adhesive tape (dicing tape); 15: a frame.
Detailed Description
An embodiment of one embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a cutting device 2 of the present embodiment. As shown in fig. 1, the cutting apparatus 2 includes a base 4 that supports each component. An opening 4a that is long in the X-axis direction (front-rear direction, machining feed direction) is formed in the upper surface of the base 4.
A ball screw type X-axis moving mechanism (machining feed mechanism) 6 is disposed in the opening 4 a. The X-axis movement mechanism 6 has an X-axis movement table (not shown), and moves the X-axis movement table in the X-axis direction. The X-axis movement mechanism 6 and the upper portion of the X-axis movement table are covered with a table cover 8 and a corrugated cover 10.
A chuck table (holding table) 12 for holding a plate-like workpiece 11 is disposed on the X-axis moving table so as to be exposed from the table cover 8. The chuck table 12 is connected to a rotation drive source (not shown) such as a motor, and rotates about a rotation axis substantially parallel to the Z-axis direction (vertical direction, cutting feed direction). Further, the chuck table 12 is moved (machining-fed) in the X-axis direction by the X-axis moving mechanism 6.
The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. The front side of the workpiece 11 is divided into a plurality of regions by a plurality of lines to be divided (streets) crossing each other, and devices such as ICs (Integrated circuits) are formed in each region.
For example, an adhesive tape (dicing tape) 13 having a larger diameter than the work 11 is attached to the back surface side of the work 11. The outer peripheral portion of the adhesive tape 13 is fixed to an annular frame 15. That is, the workpiece 11 is supported by the frame 15 via the adhesive tape 13.
In the present embodiment, a disc-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, but the material, shape, structure, size, and the like of the workpiece 11 are not limited. For example, a substrate made of other materials such as a semiconductor, a ceramic, a resin, and a metal may be used as the workpiece 11. Similarly, the kind, number, shape, configuration, size, arrangement, and the like of the device are not limited. The device may not be formed on the workpiece 11.
A disk-shaped plate made of, for example, a porous material is disposed on the upper surface side of the chuck table 12, and the upper surface of the plate serves as a holding surface 12a for holding the workpiece 11. The holding surface 12a is substantially parallel to the X-axis direction and the Y-axis direction (the left-right direction, the indexing direction), and is connected to a suction source (not shown) through a suction passage (not shown) or the like formed inside the chuck table 12. Further, four jigs 14 for fixing the frame 15 from four sides are provided around the chuck table 12.
A gate-shaped support structure 16 is disposed above the base 4 so as to extend over the opening 4 a. A Y-axis Z-axis moving mechanism (index feeding mechanism, cutting mechanism) 18 is provided on the front surface of the support structure 16. The Y-axis Z-axis moving mechanism 18 includes a pair of Y-axis rails 20 arranged on the front surface of the support structure 16 in parallel with the Y-axis direction. A Y-axis moving plate 22 constituting the Y-axis Z-axis moving mechanism 18 is slidably attached to the Y-axis guide rail 20.
A nut portion (not shown) is provided on the rear surface side of the Y-axis moving plate 22, and a Y-axis ball screw 24 parallel to the Y-axis guide rail 20 is rotatably connected to the nut portion. A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 24.
When the Y-axis ball screw 24 is rotated by the Y-axis pulse motor, the Y-axis moving plate 22 moves in the Y-axis direction along the Y-axis rail 20. A pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided on the front surface (front surface) of the Y-axis moving plate 22. The Z-axis moving plate 28 is slidably attached to the Z-axis guide rail 26.
A nut portion (not shown) is provided on the rear surface side of the Z-axis moving plate 28, and a Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is rotatably connected to the nut portion. A Z-axis pulse motor 32 is connected to one end of the Z-axis ball screw 30. When the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide rail 26.
A cutting unit 34 for cutting the workpiece 11 held by the chuck table 12 is provided at a lower portion of the Z-axis moving plate 28. The cutting unit 34 has a spindle 36 (see fig. 2) as a rotation axis substantially parallel to the Y-axis direction. A disk-shaped cutting tool 38 having a cutting edge on the outer peripheral portion is attached to one end side of the spindle 36. A rotation drive source (not shown) such as a motor is connected to the other end of the main shaft 36.
A camera (imaging means) 40 for imaging the workpiece 11 and the like is provided at a position adjacent to the cutting means 34. When the Y-axis moving plate 22 is moved in the Y-axis direction by the Y-axis Z-axis moving mechanism 18, the cutting unit 34 and the camera 40 are indexed, and when the Z-axis moving plate 28 is moved in the Z-axis direction by the Y-axis Z-axis moving mechanism 18, the cutting unit 34 and the camera 40 are raised and lowered. That is, the Y-axis Z-axis moving mechanism 18 moves the cutting unit 34 in the Y-axis direction parallel to the holding surface 12a and the Z-axis direction perpendicular to the holding surface 12 a.
A dressing unit 42 used for dressing for adjusting the shape of the cutting tool 38 is disposed on the X-axis moving table so as to be exposed from the table cover 8. That is, the dressing unit 42 is disposed adjacent to the chuck table 12 on the X-axis moving table. Fig. 2 is a front view showing the relationship of the positions of the cutting unit 34 and the dressing unit 42.
As shown in fig. 2, the dressing unit 42 has a spindle 44 as a rotation axis substantially parallel to the X-axis direction. That is, the spindle 44 of the truing unit 42 is disposed non-parallel to the spindle 36 of the cutting unit 34. A disc-shaped dressing plate 46 used for dressing the cutting tool 38 is attached to one end side of the spindle 44. A rotation drive source (not shown) such as a motor is connected to the other end of the main shaft 44.
The control unit 48 is connected to the components such as the X-axis movement mechanism 6, the Y-axis Z-axis movement mechanism 18, the cutting unit 34, the camera 40, and the trimming unit 42. The control Unit 48 is typically constituted by a computer including a Processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory, and controls the respective components in accordance with the Processing conditions of the workpiece 11. The function of the control unit 48 is realized by operating a processing device or the like in accordance with software stored in a storage device, for example.
When the workpiece 11 is cut by the cutting device 2, first, the adhesive tape 13 attached to the workpiece 11 is brought into contact with the holding surface 12a of the chuck table 12. Then, a negative pressure of the suction source is applied to the holding surface 12 a. The frame 15 is fixed by the jig 14. Thereby, the workpiece 11 is held by the chuck table 12 and the jig 14.
Next, the positional relationship between the chuck table 12 and the cutting unit 34 is adjusted so that the rotating cutting tool 38 cuts into a desired position of the workpiece 11. Then, the chuck table 12 is moved or rotated according to the processing method. That is, the position at which the cutting tool 38 cuts into the workpiece 11 is changed. For example, in the edge trimming, the cutting tool 38 may be cut into the outer peripheral portion of the workpiece 11, and then the chuck table 12 may be rotated. Thereby, the workpiece 11 is cut.
A method of dressing a cutting tool applied to the cutting apparatus 2 will be described. In the dressing method of the present embodiment, first, a rotation step of rotating the cutting tool 38 and the dressing plate 46, respectively, is performed, and then a contact step of contacting the outer peripheral surface 38a of the cutting tool 38 with the outer peripheral surface 46a of the dressing plate 46 is performed. Fig. 3 (a) is a perspective view for explaining the rotation step and the contact step.
In the rotation step, the rotation drive source of the cutting unit 34 and the rotation drive source of the truing unit 42 are operated to rotate the spindle 36 and the spindle 44. As a result, as shown in fig. 3 (a), the cutting tool 38 rotates together with the spindle 36, and the dressing plate 46 rotates together with the spindle 44. Thereafter, the cutting tool 38 and the truing plate 46 are continuously rotated until the truing of the cutting tool 38 is completed.
After the rotating step, a contacting step is performed. In the contact step, first, the positional relationship between the cutting unit 34 and the dressing unit 42 is adjusted using the X-axis moving mechanism 6 and the Y-axis Z-axis moving mechanism 18, and the cutting unit 34 is positioned directly above the dressing unit 42. Then, as shown in fig. 3 (a), the cutting unit 34 is lowered by the Y-axis Z-axis moving mechanism 18.
That is, the cutting unit 34 is moved toward the dressing unit 42 by the Y-axis Z-axis moving mechanism 18. This allows the outer peripheral surface 38a of the cutting insert 38 to contact the outer peripheral surface 46a of the dressing plate 46. When the outer peripheral surface 38a of the cutting tool 38 and the outer peripheral surface 46a of the dressing plate 46 are in contact, the contacting step ends. In the present embodiment, the contact step is performed after the rotation step, but the rotation step may be performed after the contact step.
After the rotating step and the contacting step, a dressing step of dressing the cutting tool 38 is performed. Fig. 3 (B) is a perspective view for explaining the trimming step. In this dressing step, as shown in fig. 3 (B), the cutting unit 34 is further lowered by the Y-axis Z-axis moving mechanism 18 while the outer peripheral surface 38a of the rotating cutting tool 38 is brought into contact with the outer peripheral surface 46a of the rotating dressing plate 46.
That is, the cutting unit 34 is further moved toward the truing unit 42 by the Y-axis Z-axis moving mechanism 18 so that the outer peripheral surface 38a of the cutting tool 38 is pressed against the outer peripheral surface 46a of the truing plate 46. This pushes the cutting insert 38 lower than the dressing plate 46 to wear the cutting insert 38, thereby flattening the outer peripheral surface 38a of the cutting insert 38. After the outer peripheral surface 38a is flattened, the lowering of the cutting unit 34 by the Y-axis Z-axis moving mechanism 18 is stopped, and the dressing step is ended.
In the dressing step, the dressing amount (wear amount) of the cutting tool 38 is controlled in accordance with the movement amount of the cutting unit 34 toward the dressing unit 42. For example, when the trimming amount needs to be increased, such as when the step and inclination of the outer peripheral surface 38a are large, the movement amount of the cutting unit 34 is also set large. If the trimming amount can be reduced as in the case where the step and inclination of the outer peripheral surface 38a are small, the amount of movement of the cutting unit 34 is also set small.
The cutting insert 38 having a thickness of, for example, 1mm is appropriately trimmed under the following conditions.
Rotation speed of cutting tool: 30000rpm
Moving speed (lowering speed) of cutting unit: 0.05 mm/s-0.1 mm/s
Amount of movement (amount of decrease) of cutting unit: 12 μm
Size of finishing plate: the thickness is 3mm and the diameter is 100mm
The rotating speed of the trimming plate is as follows: 100 rpm-300 rpm
As described above, the cutting apparatus 2 of the present embodiment includes: a cutting unit 34 having a rotary shaft (spindle 36) to which a disk-shaped cutting tool 38 is attached; and a dressing unit 42 having a rotating shaft (spindle 44) to which a disk-shaped dressing plate 46 is attached, and thus the cutting tool 38 can be dressed by moving the cutting unit 34 toward the dressing unit 42 only while rotating the cutting tool 38 and the dressing plate 46 to bring the outer peripheral surface 38a of the cutting tool 38 into contact with the outer peripheral surface 46a of the dressing plate 46.
That is, in the cutting apparatus 2 and the method of truing a cutting tool using the cutting apparatus 2 of the present embodiment, when truing the cutting tool 38, it is not necessary to move the cutting tool 38 so as to reciprocate relative to the truing plate 46, and therefore, the cutting tool 38 can be trued efficiently in a short time.
The present invention is not limited to the above embodiments, and various modifications can be made. For example, in the above-described embodiment, the cutting apparatus 2 in which the rotation axis of the cutting unit 34 is substantially parallel to the Y-axis direction and the rotation axis of the truing unit 42 is substantially parallel to the X-axis direction is exemplified, but the rotation axis of the truing unit 42 and the rotation axis of the cutting unit 34 may be non-parallel.
In the trimming step of the above embodiment, the cutting unit 34 is not moved in the direction other than the Z-axis direction, but the movement of the cutting unit 34 in other directions may be combined. For example, the flatness of the cutting tool 38 can be further improved by moving the cutting unit 34 in the Y-axis direction immediately before the finishing step is finished. Specific conditions such as the moving direction and the moving distance of the cutting unit 34 are set according to the rotating direction of the trimming plate 46, the thickness of the cutting tool 38, and the like.
In addition, the structure, method, and the like of the above embodiments may be modified and implemented as appropriate without departing from the scope of the object of the present invention.
Claims (2)
1. A cutting device for cutting a plate-like workpiece, characterized in that,
the cutting device comprises:
a holding table having a holding surface for holding the workpiece;
a cutting unit having a rotating shaft to which a disk-shaped cutting tool having a cutting edge on an outer peripheral portion thereof is attached, the cutting unit rotating the cutting tool together with the rotating shaft to cut the workpiece held by the holding table;
a cutting mechanism that moves the cutting unit in a direction perpendicular to the holding surface; and
a dressing unit having a rotating shaft to which a disc-shaped dressing plate is attached, the dressing unit rotating the dressing plate together with the rotating shaft to dress the cutting tool,
the rotating shaft of the dressing unit and the rotating shaft of the cutting unit are disposed non-parallel,
the cutting unit is moved toward the dressing unit by the cutting mechanism while the outer peripheral surface of the rotating cutting tool is brought into contact with the outer peripheral surface of the rotating dressing plate, thereby dressing the cutting tool.
2. A method of dressing a cutting tool by using a cutting apparatus for dressing an outer peripheral surface of the cutting tool, the cutting apparatus comprising:
a holding table having a holding surface for holding a plate-shaped workpiece;
a cutting unit having a rotating shaft to which a disk-shaped cutting tool having a cutting edge on an outer peripheral portion thereof is attached, the cutting unit rotating the cutting tool together with the rotating shaft to cut the workpiece held by the holding table;
a cutting mechanism that moves the cutting unit in a direction perpendicular to the holding surface; and
a dressing unit having a rotating shaft to which a disc-shaped dressing plate is attached, the dressing unit rotating the dressing plate together with the rotating shaft to dress the cutting tool,
the rotating shaft of the dressing unit and the rotating shaft of the cutting unit are disposed non-parallel,
it is characterized in that the preparation method is characterized in that,
the dressing method of the cutting tool comprises the following steps:
a rotating step of rotating the cutting tool and the trimming plate, respectively;
a contact step of moving the cutting unit to the dressing unit side by the cutting mechanism to bring the outer peripheral surface of the cutting tool into contact with the outer peripheral surface of the dressing plate; and
a dressing step of dressing the cutting tool by further moving the cutting unit toward the dressing unit by the cutting mechanism while bringing the outer peripheral surface of the rotating cutting tool into contact with the outer peripheral surface of the rotating dressing plate,
in the dressing step, the dressing amount of the cutting tool is controlled in accordance with the amount of movement of the cutting unit to the dressing unit side.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-007482 | 2019-01-21 | ||
| JP2019007482A JP7242129B2 (en) | 2019-01-21 | 2019-01-21 | Cutting device and cutting blade dressing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111452238A true CN111452238A (en) | 2020-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010004196.7A Pending CN111452238A (en) | 2019-01-21 | 2020-01-03 | Cutting device and dressing method of cutting tool |
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| Country | Link |
|---|---|
| JP (1) | JP7242129B2 (en) |
| CN (1) | CN111452238A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010042453A (en) * | 2008-08-08 | 2010-02-25 | Tokyo Seimitsu Co Ltd | Dicing device and blade distal end shape forming method |
| CN101941248A (en) * | 2009-07-07 | 2011-01-12 | 株式会社迪思科 | Topping machanism |
| JP2011212782A (en) * | 2010-03-31 | 2011-10-27 | Honda Motor Co Ltd | Diameter management method for dresser of grinding wheel |
| CN103029225A (en) * | 2011-10-06 | 2013-04-10 | 株式会社迪思科 | Cutting device |
| CN106903810A (en) * | 2015-10-21 | 2017-06-30 | 株式会社迪思科 | Topping machanism |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5718615A (en) * | 1995-10-20 | 1998-02-17 | Boucher; John N. | Semiconductor wafer dicing method |
-
2019
- 2019-01-21 JP JP2019007482A patent/JP7242129B2/en active Active
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2020
- 2020-01-03 CN CN202010004196.7A patent/CN111452238A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010042453A (en) * | 2008-08-08 | 2010-02-25 | Tokyo Seimitsu Co Ltd | Dicing device and blade distal end shape forming method |
| CN101941248A (en) * | 2009-07-07 | 2011-01-12 | 株式会社迪思科 | Topping machanism |
| JP2011212782A (en) * | 2010-03-31 | 2011-10-27 | Honda Motor Co Ltd | Diameter management method for dresser of grinding wheel |
| CN103029225A (en) * | 2011-10-06 | 2013-04-10 | 株式会社迪思科 | Cutting device |
| CN106903810A (en) * | 2015-10-21 | 2017-06-30 | 株式会社迪思科 | Topping machanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7242129B2 (en) | 2023-03-20 |
| JP2020116655A (en) | 2020-08-06 |
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