JPH06190620A - Printed board cutting device - Google Patents

Abstract

PURPOSE:To eliminate application of stress to a printed board to perform satisfactory cutting by basically moving either or both of a board supporting part and a rotary cutting blade in two directions orthogonally crossing each other in a horizontal plane and in the vertical direction to cut the printed board. CONSTITUTION:In order to cut a printed board with a printed board cutting device 10, first, a plurality of chuck parts 2 are lowered and the printed board on a conveyer 11 is held with a pair of opposing jaws 12a. Then, each of X and Y axis moving mechanism 20 and 21 of a moving mechanism 18 is driving by a controller, and a plurality of machining head parts 16 in a machining part 13 are moved to predetermined positions. Next, a Z-axis moving mechanism 22 is raised to a predetermined height, a plurality of rotating cutting blades 25 are projected by extending an air cylinder 23, and an air motor 24 is driven so as to rotate the rotary cutting blades 25 to cut the printed board. In the meantime, a vacuum mechanism 17 is driven at the same time so as to suck to eliminate chips due to cutting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board cutting apparatus suitable for forming a printed board by dividing it from a waste board or for dividing a plurality of printed boards into pieces.

[0002]

2. Description of the Related Art Generally, a printed circuit board for electronic circuits, on which chip parts and the like are mounted, has various shapes for incorporating the printed circuit board in a predetermined position. In order to form a printed circuit board having various shapes as shown in FIG.
, A plurality of printed boards 2, 2, ... Are arranged on a board material 1 having a predetermined size, the printed boards 2, 2, ... Are cut from the board material 1 and divided into a discarded board 3. There is.

From such a substrate material 1 to a printed circuit board 2,
In order to cut 2, 2, ... And divide it from the discarded board 3, first, in the preceding stage of mounting the chip parts etc. on each printed board 2, a separation slit for separating the printed board 2 to be formed and the discarded board 3 from each other. , 4, and bridges 5 for connecting the discarding board 3 and the printed circuit board 2 are provided between the adjacent separation slits 4, 4 in order to prevent the printed circuit board 2 from falling off from the substrate material 1. Leave and form. Then, after mounting a predetermined chip component or the like on the printed circuit board 2 and performing soldering, the bridge 5,
The printed circuit board 2 is formed by cutting 5, ...
Is divided.

Conventionally, in order to cut such a bridge 5, in addition to folding the bridge 5 by hand, as shown in FIG. 7, a die 6 is placed below the substrate material 1 using a press machine or the like. Is used to cut the bridge 5 by lowering the cutting blade 7 from above, or a method of cutting the bridge 5 by manually or automatically moving the saw blade 8 up and down as shown in FIG. Has been.

[0005]

However, the conventional substrate cutting method described above has the following problems. First, in the method of manually folding the bridge 5 or the method of cutting by cutting the cutting blade 7 with a press machine or the like, stress is applied to the peripheral portion of the bridge 5 at the time of cutting, so that the printed circuit board 2 is distorted. The chip parts and the soldered parts of the chip parts may be damaged. In addition, in the method of lowering the cutting blade 7 by a press machine or the like to perform cutting, in addition to the above, a mold 6 is required for each shape of the printed board 2 to be formed, which causes an increase in cost. There is. Further, in the method of cutting by moving the saw-shaped blade 8 up and down, the cuts generated when cutting the bridge 5 adhere to the printed circuit board 2,
May cause quality problems. The present invention has been made in consideration of the above points, and when cutting the bridge, it is possible to cut the bridge without causing distortion in the printed circuit board and without attaching Chirico to the printed circuit board. It is an object of the present invention to provide a substrate cutting device that can be used.

[0006]

The invention according to claim 1 is
A device for cutting at least a part of an outer peripheral portion of a printed circuit board, the substrate supporting part supporting the printed circuit board, a rotary cutting blade provided below the substrate supporting part and having a cutting blade on a side surface thereof, A rotary drive source that rotates a cutting blade, a moving mechanism that allows one or both of the substrate support portion and the rotary cutting blade to move in two directions orthogonal to each other in a horizontal plane and a vertical direction, and operation of the moving mechanism. It is characterized by comprising a control device for controlling the.

According to a second aspect of the present invention, in the substrate cutting apparatus according to the first aspect, a vacuum mechanism is attached to the rotary cutting blade or in the vicinity of the rotary cutting blade.

The invention according to claim 3 is the invention according to claim 1 or 2.
The described board cutting device is characterized in that a static electricity removing mechanism for removing static electricity is provided in the vicinity of the printed circuit board.

[0009]

According to the present invention, the printed circuit board is supported by the printed circuit board supporting portion, the rotary cutting blade having the cutting blade on the side surface is rotated by the rotary drive source, and the moving mechanism and the control device control the board supporting portion. Either or both of the rotary cutting blades are moved in two directions perpendicular to each other in the horizontal plane and in the vertical direction to cut the connection portion between the printed board and the discarded board.

In the invention according to claim 2, a rotary mechanism is attached to the rotary cutting blade or in the vicinity of the rotary cutting blade,
This vacuum mechanism sucks near the rotary cutting blade,
Aspirate the cuttings that occur during cutting.

According to the third aspect of the invention, a static electricity removing mechanism for removing static electricity is provided in the vicinity of the printed board, and the static electricity removing mechanism removes static electricity generated when the printed board is cut.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment shown in the drawings. 1 to 5 show a substrate cutting device 10 according to the present invention.
For example, each processing step is incorporated in an automatic production line of the printed circuit board 2 connected by a conveyor. As shown in FIG. 1, the board cutting apparatus 10 has a transfer conveyor 11 for transferring the board material 1 (FIG. 6) to be processed between the pre-processing step side 10a and the post-processing step side 10b. Above the transport conveyor 11, a chuck portion (substrate support portion) 12 that holds the printed circuit board 2 to be processed is provided.
Is provided, and the substrate material 1 is provided below the transport conveyor 11.
The processing unit 13 for cutting the bridge 5 (see FIG. 6) is provided in a schematic configuration.

The transfer conveyor 11 is horizontally installed on a frame 14 and supports both side parts of the substrate material 1 (FIG. 6) to be processed by transfer rails 15 and 15 extending in the transfer direction and parallel to each other. It is structured to carry.

The chuck section 12 is provided above the conveyor 11. In the chuck portion 12, the front end portion is inserted into the separation slit 4 of the substrate material 1 and the printed circuit board 2
Claw 12 having locking recesses 12b, 12b for gripping
a and 12a are provided so as to face each other. Further, the claw portions 12a, 12a have, for example, a cylinder (not shown), and are configured to open and close the claw portions 12a, 12a in the horizontal direction. Furthermore, the claw portions 12a, 12a have a cylinder or the like (not shown) extending in the vertical direction.
The entire structure of a and 12a is vertically movable. In the case of the present embodiment, the chuck portion 12 having the above-mentioned structure is provided with four sets having the same structure.

As shown in FIG. 1, the processing section 13 is provided below the transport conveyor 11 and is connected to the processing head section 16 for cutting the bridge 5 of the substrate material 1 and the bridge 5. A vacuum mechanism 17 for sucking the chips generated when cutting, a moving mechanism 18 for freely moving the machining head 16 in two directions orthogonal to each other in a horizontal plane and a vertical direction, and a control (not shown) for controlling the operation of the moving mechanism 18. And a device. In the case of this embodiment, the processing head portion 16 having the same configuration is provided on the support plate 19 of the processing portion 13.
And two vacuum mechanisms 17 are provided.

The moving mechanism 18 moves the processing head portion 16 horizontally along the carrying direction of the carrying conveyor 11, and moves it in a direction orthogonal to the X-axis moving mechanism 20 in the same plane. Flexible Y-axis movement mechanism 2
1, and a Z-axis moving mechanism 22 that is movable in the vertical direction
And a control device (not shown) that controls the operations of the X-axis moving mechanism 20, the Y-axis moving mechanism 21, and the Z-axis moving mechanism 22. The X-axis moving mechanism 20, the Y-axis moving mechanism 21, and the Z-axis moving mechanism 22 are the moving mechanism main body 20.
a, 21a, 22a and moving mechanism bodies 20a, 21a,
Movable plates 20b, 21b, 22b moving along 22a
It is composed of and.

The X-axis moving mechanism 20 has a moving mechanism main body 20a fixed to the frame 14 and is horizontally provided along the carrying direction of the carrying conveyor 11. The moving mechanism main body 21 a of the Y-axis moving mechanism 21 includes the movable plate 20 of the X-axis moving mechanism 20.
It is fixed to the upper surface of b. The moving mechanism body 22 a of the Z-axis moving mechanism 22 is fixed to the movable plate 21 b of the Y-axis moving mechanism 21. The movable plate 22b of the Z-axis moving mechanism 22
A support plate 19 having a vertical surface extending along the transfer direction of the transfer conveyor 11 is fixed to the support plate 19, and the processing head portions 16 and 16 are provided on the support plate 19. The X-axis moving mechanism 20, the Y-axis moving mechanism 21, and the Z-axis moving mechanism 22 are each provided with a control device (not shown), and the amount of movement can be changed according to the shape data of the printed circuit board 2 (FIG. 6) to be processed which is input in advance. The processing speed is controlled. With the moving mechanism 18 having the above-described structure, the processing head portions 16 and 16 provided on the support plate 19 have the X axis moving mechanism 20 and the Y axis moving mechanism 21.
The movable plates 20b and 21b are moved so as to be movable in a horizontal plane, and the processing heads 16 and 16 are moved according to the shape of the printed board 2 to be processed. Further, the processing head portion 16.16 is
The movable plate 22b of the shaft moving mechanism 22 is moved to move in the vertical direction.

The processing head portion 16 is shown in FIGS.
As shown in FIG. 3, an air cylinder 23 (FIG. 1) that is vertically expandable and contractible, an air motor (rotational drive source) 24 that is rotationally driven by compressed air, and a substrate material 1 (FIG. 6) to be processed are provided. A rotary cutting blade 25 for cutting the bridge 5 is provided and the schematic configuration is provided.

As shown in FIG. 1, the air cylinder 23 has a cylinder body 23a fixed to the support plate 19. The guide shafts 27, 2 are provided on both sides of the telescopic rod 23b of the air cylinder 23 in parallel with the telescopic rod 23b.
7 are provided.

As shown in FIG. 2, a clamp 31 is provided on the upper ends of the guide shafts 27, 27 via a bracket 30 having a substantially L shape. This clamp 31
An air motor 24 that rotates around the vertical direction is fixed to the. At the upper end of the air motor 24, a rotary shaft 24a that is rotatable by compressed air is provided, and a rotary cutting blade 25 having an axis in the vertical direction is attached to the rotary shaft 24a. Furthermore, the air motor 2
A nozzle 32 having a through hole in the center is attached to the upper end of the nozzle 4. From below the nozzle 32, the air motor 2
4 is inserted, and the rotary cutting blade 25 is inserted in the through hole of the nozzle 32.
Is penetrated, and the rotary cutting blade 25 is projected upward. Here, with the configuration using the air motor 24, the rotary cutting blade 25 can be rotated at a high speed.

As shown in FIG. 3, the rotary cutting blade 25 has a large number of cutting blades formed on the outer peripheral portion 25a, such as an end mill. The object to be processed is cut.
With the processing head portion 16 having the above configuration, the processing head portion 1
The rotary cutting blade 25 provided at the tip of the air motor 6
4 is rotated to cut the bridge 5 of the substrate material 1 (FIG. 6) to be processed. Further, the air cylinder 23 is expanded and contracted to vertically move the tip of the processing head 16.

Further, at the upper end of the air motor 24, as shown in FIG. 2, a cylindrical holder 33 is provided. In the holder 33, the nozzle 32 is attached to the tip portion as described above.
The air motor 24 having the rotary cutting blade 25 is inserted, and the rotary cutting blade 25 projects upward from the holder 33. The holder 33 is composed of a lower holder 34 and an upper holder 35.

The lower holder 34 has a notch 34a along the axis of the lower holder 34 as shown in FIG.
It has a substantially C-shape. A bolt (not shown) is screwed into a screw hole 34b in a direction orthogonal to the extending direction of the notch 34a, and as shown in FIG. 3, the air motor 24 inserted in the lower holder 34 is tightened and fixed. It is considered as a structure. In addition, the lower holder 3
4 has vacuum holes 34c, 34c, ... Opened at both ends along the axial direction of the lower holder 34. As shown in FIGS. 2 and 5, the upper holder 35 has a suction port 3 that is opened upward between the upper holder 35 and the nozzle 32.
5a, and a vacuum hole 35b continuous with the suction port 35a and opening at a position facing the vacuum hole 34c of the lower holder 34. The holder 33 having the above-described structure is composed of the lower holder 34 and the upper holder 3.
5 is fixed by a bolt, and a continuous vacuum passage 33a is formed in the holder by the vacuum hole 35b of the upper holder 35 and the vacuum hole 34c of the lower holder 34. Here, the cross-sectional view shown in FIG. 2 is a cross-sectional view of the lower holder 34 and the upper holder 35 shown in FIGS.

As shown in FIGS. 2 and 3, a cylindrical brush (static electricity removing mechanism) 36 is fitted on the upper portion 33b of the holder 33. The tip of the brush 36 is made slightly lower than the tip of the rotary cutting blade 25, that is, from the side of the brush 36, the tip of the brush 36 rotates to the rotary cutting blade 2.
5 is slightly projected. The brush 36 is made of a conductive material, and the brush 36 is formed on the printed circuit board 2
The static electricity of the portion that slides on the back surface of the is removed to prevent foreign matter such as the chips of the bridge 5 from adhering to the printed circuit board 2 (FIG. 6), and when suction is performed by the vacuum mechanism 17,
It is intended to prevent the suction pressure from decreasing by coming into contact with the lower surface of the substrate material 1 (FIG. 6).

As shown in FIG. 2, a cylindrical suction pipe 37 is provided below the holder 33. Suction pipe 37
Has an air motor 24 inserted therein, and a space 37a between the suction pipe 37 and the air motor 24 is connected to the vacuum passage 33a of the holder 33.
The suction pipe 37 has an opening 37b at the lower part thereof toward the outside. A duct hose 39 is connected to the outside of the opening 37b. At the other end of the duct hose 39,
For example, a vacuum source (not shown) such as a vacuum ejector and a filter (not shown) for collecting the sucked dust and the like are connected. With the above configuration, the holder 33 having the vacuum passage 33a, the suction pipe 37, the duct hose 39, the negative pressure source (not shown), and the filter (not shown) are attached to the substrate material 1 by the rotary cutting blade 25 of the processing head portion 16. The vacuum mechanism 17 for sucking and collecting the chips produced when the bridge 5 is cut.

In the case of the present embodiment, the processing head 16 and the vacuum mechanism 17 having the above-mentioned structure have the same structure as shown in FIG. Provided on the support plate 19 so as to face 12 and 12,
The processing unit 13 is configured to have processing head units 16 and 16 having two heads.

Next, the operation of the substrate cutting device 10 having the above structure will be described with reference to FIGS. 1 to 6. First, in the pre-processing step, the printed circuit board 2 shown in FIG.
The substrate material 1 on which electronic components and chip components are mounted, soldering, and other processes are carried from the pre-processing step side by the carrying conveyor 11 and stopped at a predetermined position of the board cutting device 10.

Next, the chuck portion 12 shown in FIG. 1 is lowered to insert the claw portions 12a, 12a into the separation slit 4 of the substrate material 1 (FIG. 6) to be processed, and then a cylinder (not shown). The opposing claw portions 12a, 12a are closed by and the printed board 2 of the board material 1 is gripped. In the case of the present embodiment, four printed circuit boards 2, 2, ... Are arranged on the substrate material 1, while the chuck portion 12 has the same structure.
Are provided as a set and are configured to hold the respective printed circuit boards 2, 2, ....

Next, the processing head portions 16 and 16 of the processing portion 13 below the substrate material 1 to be processed are moved by the control device (not shown) to the X-axis moving mechanism 20 and the Y-axis moving mechanism 21 of the moving mechanism 18. It is driven and moved to a predetermined position. At this time, since two processing head parts 16 are provided along the carrying direction of the carrying conveyor 11, first of the printed boards 2, 2, ... The two printed circuit boards 2 and 2 to be processed are simultaneously processed.

Next, the Z-axis moving mechanism 22 of the moving mechanism 18
The work head part 1 while raising the height to a predetermined height.
6 of the air cylinder 23 is extended to form each processing head unit 1.
The rotary cutting blade 25 of 6 is projected slightly upward from the separation slit 4 on the outer peripheral portion of the printed circuit board 2 (FIG. 6) to be processed (FIG. 2). At this time, the brush 36 is in a state of lightly contacting the lower surface of the substrate material 1.

Next, the air motor 24 is driven to rotate the rotary cutting blade 25. At the same time, a vacuum source (not shown) is driven, and suction is started by the vacuum mechanism 17. Then, the controller (not shown) drives the X-axis moving mechanism 20 and the Y-axis moving mechanism 21 of the moving mechanism 18 to move the machining head portion 16, and the rotary cutting blade 2
The bridge 5 is cut by 5. The cuts generated when the bridge 5 is cut off from the suction port 35a of the upper holder 35 below the rotary cutting blade 25 through the vacuum passage 33a.
It is sucked inside and is collected by being deposited on a filter (not shown).

The processing head portion 16 allows the printed circuit board 2
After cutting all the bridges 5, 5, ..., The air cylinder 23 of the machining head portion 16 is contracted to lower the machining head portion 16 and return it to the original position. As described above, of the printed boards 2, 2, ... Of the board material 1, the processing of the two printed boards 2, 2 serially arranged along the carrying direction of the carrying conveyor 11 is completed. The printed circuit boards 2 and 2 that have been processed are held by the chuck portions 12 and 12 and therefore do not drop.

Next, the moving heads 18 and 16 of the processing section 13 below the substrate material 1 to be processed are driven by a control device (not shown) to drive the printed board 2 and 2 of the substrate material 1. , Unprocessed printed circuit boards 2, 2
Move it to the specified position. Then, in the same manner as described above, the printed circuit boards 2 and 2 to be machined in series along the carrying direction are machined at the same time. In this manner, after the cutting of the bridges 5, 5, ... Of all the printed boards 2, 2, ... Of the substrate material 1 is completed, the moving mechanism 18 is driven by the control device (not shown), 16 and 16 are returned to the original positions.

Next, the printed boards 2, 2, ... Of the board material 1
And the substrate 3 is discarded. The printed circuit boards 2, 2, ...
When the cutting of the bridges 5, 5, ... Is completed, the printed boards 2, 2 ,.
It is gripped by. By a moving mechanism not shown,
The chuck parts 12, 12, ... Are lifted from above the conveyer 11, and the printed circuit boards 2, 2, ... Are transferred to a robot (not shown) on the post-process side. On the other hand, the discarded substrate 3 of the substrate material 1 left on the transport conveyor 11 is driven by the transport conveyor 11 to be transported to the post-processing step side, and the discarded substrate 3 is suction-held by a vacuum mechanism (not shown) and not shown. It is raised by the moving mechanism and collected from the top of the conveyor 11. As described above, the board cutting device 10 completes the division of the printed board 2 and the discarded board 3 of the board material 1.

As described above, in the board cutting device 10, the rotary cutting blade 25 is moved from below the board material 1 by the air motor while the printed board 2 of the board material 1 to be processed is held and fixed by the chuck portion 12. While rotating by 24, the moving mechanism 18 and a control device (not shown) move the rotary cutting blade 25 in the horizontal plane and in the vertical direction to bridge the bridge 5 on the outer peripheral portion of the printed board 2 to be processed.
Can be cut to divide the printed board 2 and the discarded board 3 of the board material 1. As a result, the stress at the time of cutting the bridge 5 is small, and the printed circuit board 2 is not distorted. Therefore, the chip component and the soldered portion of the chip component are not damaged. Further, the control device (not shown) can drive the moving mechanism 18 to move the rotary cutting blade 25 along the shape data of the printed circuit board 2 to be processed which is input in advance. As a result, when processing printed circuit boards of various shapes, the processing can be performed simply by inputting the shape data of the printed circuit board 2 into the control device (not shown) in advance, especially when processing printed circuit boards having complicated shapes. Can reduce the cost as compared with the case of using a conventional mold.

Further, since the vacuum mechanism 17 is provided below the rotary cutting blade 25 to suck the dust generated during the cutting of the rotary cutting blade 25, the attachment of the dust to the printed circuit board 2 can be prevented. Yes, the quality can be improved.

Further, since the conductive brush 36 is brought into contact with the lower surface of the printed circuit board 2 to be processed, it is possible to prevent the attachment of the dust to the lower surface of the printed circuit board 2 when the rotary cutting blade 25 is cut. In addition, it is possible to prevent damage to the IC and the like due to static electricity, and also from this point, the quality can be improved.

In the above embodiment, when the printed board 2 of the board material 1 and the discarded board 3 are divided, the printed board 2 is transferred from the chuck 12 to the robot (not shown). As long as the printed circuit board 2 can be held when the bridge portion 5 is cut, a suction pad or the like may be used for the chuck portion 12, and a function of transferring the printed circuit board 2 after the division in a post process. May be combined. Further, a structure is provided in which the printed circuit board 2 is gripped by the chuck portion 12 and the processing head 16 is movable below the printed circuit board 2 in two directions orthogonal to each other in a horizontal plane and in a vertical direction to process the printed circuit board 2. However, the present invention is not limited to this, and the processing head portion 16 may be fixed and the printed circuit board 2 may be movable in two directions orthogonal to each other in the horizontal plane and in the vertical direction. Further, the processing head portion 16 is movable in one direction within a horizontal plane, the printed circuit board 2 is movable in a direction orthogonal to the movement direction of the processing head portion 16, and either one or both of them is movable in the vertical direction. It goes without saying that the configuration is good.

[0039]

As described above, according to the apparatus of the first aspect, the rotary cutting blade is rotated by the rotary drive source while the printed circuit board 2 to be processed is supported by the substrate supporting portion, and the moving mechanism is moved. By the control device, one or both of the substrate support and the rotary cutting blade are moved in two directions perpendicular to each other in the horizontal plane and the vertical direction, and the connection between the printed board to be processed and the discarded board is cut. , A printed circuit board can be formed. As a result, a large stress is not applied to the printed circuit board during cutting, so that the chip component and the soldering portion of the chip component are not damaged. In addition, the control device can drive the moving mechanism to move the rotary cutting blade along the shape of the printed circuit board to be processed. Can be processed by inputting
Particularly when processing a printed circuit board having a complicated shape, the cost can be reduced as compared with the case where a conventional mold is used.

According to the apparatus of the second aspect, since the rotary cutting blade or a vacuum mechanism is provided in the vicinity of the rotary cutting blade to suck the chips produced during the cutting of the rotary cutting blade, It is possible to prevent the attachment of chips and improve the quality.

According to the apparatus of claim 3, a static electricity removing mechanism for removing static electricity is provided in the vicinity of the printed circuit board,
Since this static electricity removing mechanism has a structure for eliminating static electricity generated when the printed board is cut, it is possible to prevent dust and foreign matter from adhering to the printed board due to static electricity and improve the quality.

[Brief description of drawings]

FIG. 1 is a front view showing a substrate cutting device according to the present invention.

FIG. 2 is a sectional view showing a part of a substrate cutting device according to the present invention.

FIG. 3 is a perspective view showing a rotary cutting blade according to the present invention.

FIG. 4 is a plan view showing a lower holder of the substrate cutting device according to the present embodiment.

FIG. 5 is a bottom view showing an upper holder of the substrate cutting apparatus according to the present embodiment.

FIG. 6 is a plan view showing a substrate according to the present invention.

FIG. 7 is a perspective view of a substrate and a cutting tool showing an example of a conventional substrate cutting method.

FIG. 8 is a perspective view of a substrate and a cutting tool showing an example of a conventional substrate cutting method.

[Explanation of symbols]

 10 substrate cutting device 12 chuck part (substrate supporting part) 17 vacuum mechanism 18 moving mechanism 24 air motor (rotational drive source) 25 rotary cutting blade 36 brush (static electricity removing mechanism)

Claims (3)

[Claims] 1. An apparatus for cutting at least a part of an outer peripheral portion of a printed circuit board, the substrate supporting section supporting the printed circuit board, and a rotary cutting device provided below the substrate supporting section and having a cutting blade on a side surface. A blade, a rotary drive source for rotating the rotary cutting blade, and a moving mechanism capable of moving one or both of the substrate support portion and the rotary cutting blade in two directions orthogonal to each other in a horizontal plane and in a vertical direction, A substrate cutting device, comprising: a controller for controlling the operation of the moving mechanism. 2. The substrate cutting device according to claim 1, wherein a vacuum mechanism is attached to the rotary cutting blade or in the vicinity of the rotary cutting blade. 3. The board cutting device according to claim 1, wherein a static electricity removing mechanism for removing static electricity is provided near the printed board.