JP2004304194A - Sewing device for semiconductor package production process and its control method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sewing device for a semiconductor package production process that can improve productivity and its control method by making it possible to simultaneously achieve the loading of a strip and the unloading of a package when doing a sewing work to produce a semiconductor package. <P>SOLUTION: The sewing device for a semiconductor package production process includes a chuck table base 200, a chuck table 23 installed onto the chuck table base 200 such that it can be moved in a horizontal direction, two chuck plates 233a and 233b installed onto the upper part of the chuck table 23 in a rotatable way and onto whose upper part strips (S) are alternately loaded, a slicing machine 30 that slices a strip (S), loaded onto the chuck plate, into respective packages in a mutual motion with the chuck table 23, and a strip/package picker 22 that simultaneously performs an operation of loading the strip (S) onto the chuck plate and an operation of unloading the package (P). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a sawing apparatus for a semiconductor package manufacturing process and a method of controlling the same, and more particularly, to an improvement in productivity in a semiconductor sawing operation through an improvement in the structure of a chuck table and an improvement in the sawing process thereby. About.

  In general, in a semiconductor package, after a semiconductor chip made of silicon and a highly integrated circuit such as a transistor is formed on a semiconductor substrate made of silicon by a FAB (Fabrication) process, the semiconductor chip is formed into a lead frame or a printed circuit board. Attach and electrically connect the semiconductor chip and the lead frame or the printed circuit board with a wire or the like so that they are electrically connected to each other, and then mold the chip with an EMC (Epoxy Molding Compound) so as to protect the chip from the external environment. It is produced by

  On the other hand, the semiconductor package manufactured in this manner is usually packaged in a matrix type on a lead frame, so that a sawing that cuts and separates interconnected packages in a lead frame or a printed circuit board. The process is performed, and the packages cut by the sawing process are stacked on a tray based on a preset quality standard and transported for the next process.

  Usually, a lead frame or a printed circuit board has a rectangular band shape and is called a strip. A package obtained by cutting the strip at predetermined intervals in the width direction and the length direction is called a package.

  Meanwhile, an apparatus used for such a process is disclosed in detail in a handler system for cutting a semiconductor package device (Korean Patent Application No. 2000-79282, Publication No. 2002-49954) previously filed by the present applicant. ing.

  As shown in FIG. 1, the handler system for cutting a semiconductor package device is horizontally movable along a guide rail 24, and is loaded onto a chuck table 23 after adsorbing a carried-in strip, and is individually moved from the chuck table 23. A strip / package picker 22 for unloading a package, and a chuck table 23 installed on the chuck table base 200, which sucks the strip while the strip is loaded by the picker 22, and moves or rotates the strip horizontally. A cutting device 30 for cutting the strip conveyed by the chuck table 23 into respective packages; a cleaning device 40 for removing foreign matter generated when performing a sawing operation with the cutting device; It constructed including a drying device 50 for drying the separated packages,.

  Since the components of these handler systems are described in detail in the above-mentioned specification, the description of the parts not related to the present invention will be omitted.

FIG. 2 is a reference diagram showing the relationship between the strip / package picker and the chuck table in FIG.
As shown in FIG. 2, one chuck plate 233 is installed on the upper surface of the chuck table 23, and the strip / package picker 22 is located on the chuck plate 233 and can be moved up and down. 221 and a package picker head 222. Above the chuck plate 233, a suction unit 231 for suctioning a strip or a package is provided.

Here, P is a package that is fixed to the chuck plate 233 after being cut by the cutting device 30, and S is a strip that is newly loaded on the chuck plate 233 while being attracted to the strip picker head 221.
In the conventional handler system having the above-described configuration, the sewing process will be briefly described. First, when the strip (S) is carried into the system from the on-loader device 10 through the pusher 12, the strip / package picker 22 strips. After the picker head 221 sucks the strip (S), it moves along the guide rail 24 and loads the strip on the chuck plate 233.

Thereafter, the strip (S) is conveyed to the cutting device 30 while being sucked and fixed by the chuck plate 233 by a vacuum force, and the strip (S) is moved into each package ( P).
Meanwhile, while the chuck table 23 aligns the strip (S) and cuts the strip (S) by mutual movement with the cutting device 30, the strip picker head 221 of the strip / package picker 22 moves toward the on-loader device 10. After being moved and sucking a new strip carried into the system, it is again moved to a strip unloading position and a standby state is maintained so that a new strip (S) can be unloaded onto the chuck plate 233.

Next, when the strip (S) is cut into the respective packages (P) by the cutting device 30, the packages (P) are transported again to the original position by the chuck table 23, and are unloaded by the package picker head 222. .
Thereafter, the strip picker head 221 waiting at the unloading position loads a new strip onto the chuck plate 233, thereby completing the sewing process.

On the other hand, after completing the sewing process, the conventional handler system sequentially moves the package (P) unloaded to the package picker head 222 to the cleaning device 40 and the drying device 50, and performs cleaning and drying. I do.
However, in such a conventional technique, since only a single chuck plate 233 is provided on the chuck table 23, after each package (P) cut from the chuck plate 233 is unloaded onto the package picker head 222, In addition, the newly loaded strip (S) adsorbed on the strip picker head 221 has to be loaded on the chuck plate 233.

  That is, in the related art, the chuck plate 233 must be empty in order to load the new strip (S) that the strip picker head 221 is adsorbing onto the chuck plate 233. Prior to loading of S), it was necessary to transfer the package (P) placed on the chuck plate 233 to a cut state by a sewing operation.

Therefore, in the conventional sewing process of the handler system, the unloading of the package and the loading of the strip on the chuck table are not performed at the same time and proceed in a stepwise manner, so that it takes time to unload the package and load the strip. However, there is a problem that the work time is delayed.
Korean Patent Application No. 2000-79282

  Therefore, the present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to allow strip loading and package unloading to be performed simultaneously during a sawing operation for manufacturing a semiconductor package. Accordingly, it is an object of the present invention to provide a sawing apparatus for a semiconductor package manufacturing process and a control method therefor, in which productivity can be improved by doing so.

In order to achieve the above object, a sawing device for a semiconductor package manufacturing process based on the technical idea of the present invention includes a chuck table base, a chuck table which is mounted on the chuck table base so as to be movable in a horizontal direction, and Two chuck plates rotatably mounted on an upper portion of a chuck table and alternately loading strips on an upper surface, and the strip loaded on the chuck plate is cut into respective packages by mutual movement with the chuck table. It is characterized in that it comprises a cutting means and a strip / package picker for simultaneously performing the loading operation of the strip on the chuck plate and the unloading operation of the package.
On the other hand, the strip / package picker is installed movably in the X-axis direction to load the strip on the chuck plate, and is installed movably in the X-axis direction parallel to the strip picker. And the package picker for unloading the package, the strip picker and the package picker can be configured independently.

  In addition, a method for controlling a sawing device for a semiconductor package manufacturing process based on the technical idea of the present invention is a method for controlling a sawing device for a semiconductor package manufacturing process including two chuck plates. A first step of loading the strip on one of the chuck plates, a second step of aligning the strip loaded on the chuck plate, and a third step of cutting the aligned strip into respective packages; And a fourth step of unloading each package from the one chuck plate and loading a strip on the other chuck plate at the same time.

  The sawing apparatus for the semiconductor package manufacturing process and the control method thereof according to the present invention include two chuck plates so that the loading of the strip and the unloading of the package are performed simultaneously during the sawing operation for manufacturing the semiconductor package, This has the effect of improving productivity.

  In addition, the present invention prevents debris generated at the time of cutting the strip from being sent to the other chuck plate on which the strip is not loaded, thereby preventing contamination of the other chuck plate. it can.

Further, since the present invention can be used with the rotation angle of the chuck plate limited to a maximum of 180 °, there is an effect that a large rotation angle is not required for rotation of the chuck plate.
Further, the present invention is more effective by directly connecting the on-loader device to one side of the sewing device, and combining a strip picker dedicated to loading the strip and a package picker dedicated to unloading the package separately. In addition, strip loading and package unloading operations can be performed, and the arrangement of the system is simple and the work flow is simple, so that the system has an effect of increasing the output per unit time.

  Hereinafter, a first embodiment based on the technical idea of the present invention will be specifically described with reference to the accompanying drawings.

  FIG. 3 is a plan view showing a sawing apparatus for a semiconductor package manufacturing process according to an embodiment of the present invention, FIG. 4 is a perspective view showing a chuck table and a chuck plate of FIG. 3, and FIG. FIG. 4 is a plan view showing a strip / package picker.

  As shown in the drawing, the sewing apparatus of the present invention includes a chuck table 23 installed on a chuck table base 200 so as to be horizontally movable along the X-axis direction, and a rotatably installed upper part of the chuck table 23 and alternately arranged on the upper surface. And two chuck plates 233a and 233b on which a strip (S) is loaded.

  As shown in FIG. 4, the chuck table 23 includes a base plate 231 and a servomotor 232 mounted on the base plate 231. Here, the base plate 231 is installed on a guide rail 142 provided on the chuck table base 200, and a lower portion thereof is screw-coupled to a ball screw 141, and moves in a horizontal direction by the rotation of the ball screw 141. It is supposed to.

In addition, the chuck plates 233 a and 233 b are installed on the servo motor 232, and are rotated by driving the servo motor 232.
Here, strips (S) are alternately loaded on the upper surfaces of the two chuck plates 233a and 233b. That is, the strip (S) to be cut is alternately loaded on the left chuck plate 233a and the right chuck plate 233b.

  For this reason, the strip (S) may be alternately loaded on the upper surfaces of the two chuck plates 233a and 233b while the strip / package picker 22 is rotated by 180 °. , 233b are rotated by 180 ° to load the strip (S) alternately from the strip / package picker 22 and unload the package (P).

The strip (S) loaded as described above is sucked and fixed by the suction holes 235 formed in the chuck plate. A known air suction unit (not shown) is installed on the chuck table 23 to apply a suction force to the suction hole 235.
Meanwhile, the present invention includes the cutting device 30 for cutting the strip (S) loaded on the chuck plates 233a and 233b into respective packages (P). As shown in FIG. 3, the cutting device 30 is horizontally movable in the Y-axis direction, and is capable of vertically moving with respect to the chuck plates 233a and 233b. And a saw blade 33 attached to the end of the spindle 32 and cutting the strip (S) into respective packages (P) while rotating.

  With this configuration, the cutting device 30 cuts the strip (S) at predetermined intervals in the width direction and the length direction by mutual movement with the chuck table 23. At this time, in order to prevent contamination of the chuck plate on which the strip (S) is not seated, the rotation direction of the saw blade 33 is such that the debris generated at the time of cutting does not cause the chuck plate on which the strip (S) is not seated. Is controlled not to be sent to

  That is, the cutting device 30 cuts the strip (S) placed on the chuck plate at a predetermined interval by the saw blade 33 while moving horizontally in the Y-axis direction and moving up and down in the vertical direction of the ground, The chuck table 23 allows the strip (S) to be cut in the width direction and the length direction by rotating the strip (S) by 90 ° and moving horizontally in the X-axis direction.

  In the present embodiment, the cutting device 30 cuts the strip (S) while moving horizontally in the Y-axis direction, but only the saw blade 33 is rotated while the cutting device 30 is fixed, The strip (S) may be cut in the width direction and the length direction while horizontally moving and rotating the chuck table 23 in the Y-axis direction.

  On the other hand, in this embodiment, the cutting device 30 is provided with one saw blade, but may be configured to include a pair of saw blades 33 provided so as to face each other in the Y-axis direction. In addition, the cutting device 30 can perform a cutting operation using various methods such as laser and water.

  Further, the sewing apparatus of the present invention includes a strip / package picker 22 for simultaneously performing the loading operation of the strip (S) on the chuck plates 233a and 233b and the unloading operation of the package (P).

  As shown in FIG. 5, the strip / package picker 22 includes a strip picker head 221 for loading the strip (S) and a package picker head 222 for unloading the package (P). A picker head elevating unit 223 for raising and lowering the 221 and 222; a reciprocating transport unit 224 for horizontally reciprocating the picker heads 221 and 223 along the guide rail 24; and a lower surface of the picker heads 221 and 222, respectively. The suction unit 231 is configured to include the suction unit 231 that suctions the strip (S) and the package (P), and a vacuum port (not shown) that applies a vacuum to the suction unit 231.

  With such a configuration, the strip picker head 221 performs the loading operation of the strip (S) onto the chuck plate independently, and the package picker head 222 performs the unloading operation of the package (P) from the chuck plate alone. Do with.

  As described above, the strip picker head 221 and the package picker head 222 respectively perform the loading operation of the strip (S) onto the chuck plate and the unloading operation of the package (P), whereby the strip picker head 221 can be kept clean at all times without being affected by dirt, cooling water, etc., which are generated when the strip (S) is cut and adhered to the package (P).

  On the other hand, FIG. 6 is a reference view showing the relationship between the strip picker head 221 and the package picker head 222 and the two chuck plates 233a and 233b in FIG.

  As shown in FIG. 6, the strip picker head 221 and the package picker head 222 of the present invention are simultaneously moved down on the chuck plates 233a and 233b in the direction of the chuck plates 233a and 233b. Each package (P) adsorbed on the left chuck plate 233a is unloaded, and at the same time, the strip picker head 221 loads the strip (S) on the right chuck plate 233b.

Next, a control method of the sawing apparatus for a semiconductor package manufacturing process according to the first embodiment of the present invention configured as described above will be described in detail with reference to the accompanying drawings.
7 and 8 are reference diagrams illustrating a control method of a sawing apparatus for a semiconductor package manufacturing process according to a first embodiment of the present invention.

  Here, the chuck plate represented by black means the chuck plate on which the strip (S) is loaded, and the chuck plate represented by the lattice means the chuck plate on which the cut package (P) is seated. I do.

  The control method of the sawing apparatus for a semiconductor package manufacturing process according to the present embodiment is largely composed of a loading step of the strip (S), an alignment step of the strip (S), a cutting step of the strip (S), and an unloading step of the package. Is done. At these stages, the chuck table rotates in a predetermined direction and angle. After the cutting process, the chuck plates 233a and 233b for unloading the package (P) load the strip (S). If it satisfies the condition that it must be rotated 180 ° from its initial position, it should be clarified in advance that any combination of the rotation angle and the rotation direction is acceptable.

  First, a control method of the sawing apparatus for a semiconductor package manufacturing process according to the first embodiment of the present invention shown in FIG. 7 will be described.

  First, the strip (S) is loaded on the right one of the two chuck plates 233a and 233b. In other words, the strip picker head 221 (not shown in FIG. 7) waits in a state where the strip (S) carried into the apparatus of the present invention has been sucked in advance, and then the chuck table 23 causes the chuck plate 233b to move the strip picker head 223. When horizontally moved to the lower part of the lower part 221, the sucked strip (S) is loaded onto the right chuck plate 233 b while descending.

  Next, the strips (S) loaded on the chuck plate 233b are aligned. That is, after the strip (S) loaded on the chuck plate 233b is photographed by the vision inspection device, the X-axis and the Y-axis are aligned while being rotated twice by 90 ° in the counterclockwise direction. In this embodiment, the vision inspection device is attached to the cutting device, but may be located between the chuck table and the cutting device. This X-axis and Y-axis alignment is performed to cut the strip (S) loaded on the chuck plate 233b at an accurate position, and after a predetermined vision inspection device has photographed the position of the strip. The position information is sent to the control unit, and the cutting operation is performed by controlling the chuck table 232 and / or the saw blade 33 based on the sent position information of the strip (S). On the other hand, when the strip (S) is aligned, it is preferable that the rotation direction and the rotation angle of the chuck table are controlled within a range not exceeding 180 ° with respect to the initial position.

  Thereafter, a step of cutting the aligned strips (S) into respective packages (P) is performed. First, the aligned strips (S) are cut in the width direction at predetermined intervals in the length direction, and then the strips (S) are rotated clockwise by 90 °, and then the predetermined intervals in the width direction. And cut in the length direction.

  More specifically, the saw blade 33 provided in the cutting device 30 descends toward the strip (S) while rotating above the strip (S), and ) Is horizontally moved in the X-axis direction by the chuck table 23 to cut the strip (S) in the width direction and the length direction.

  At this time, the cutting device 30 moves the strip (S) at predetermined intervals in the vertical direction of the cutting direction by moving at predetermined intervals while leaving a time difference from front to back along the Y-axis direction. Become disconnected.

On the other hand, in order to prevent the saw blade 33 of the cutting device 30 from being overheated during the cutting operation, it is preferable to cool the saw blade 33 by injecting cooling water or cold air.
Further, in order to prevent dust generated in the cutting process from soiling the chuck plate 233a on which the strip (S) is not loaded, dust generated during the cutting is not loaded on the strip (S). It is preferable to be directed to a direction other than the direction of the chuck plate 233a on the other side (a waste direction in the drawing).

  That is, a cutting device for cutting the strip (S) such that the chuck plate 233b on which the strip (S) is loaded is positioned on the left side and above the chuck plate 233a on which the strip (S) is not loaded. It is preferable that the saw blade 33 of the 30 be rotated clockwise as viewed in the Y-axis direction (に し て) so that the waste generated when cutting the strip (S) is sent to the left side.

  Further, it is preferable that the debris generated in the cutting step be directed to the left direction (the debris direction) from the viewpoint of preventing the cleaning device 40 from being contaminated.

  Due to such an operation, the cooling water sprayed on the saw blade 33 of the cutting device 30 also generates the chuck plate 233a on which the strip (S) is not loaded, like the debris generated in the cutting process. The strip (S) is not conveyed in the direction other than the above direction, so that the chuck plate 233a on which the strip (S) is not loaded is prevented from being stained.

  Next, after the cut package (P) is rotated 90 ° in a counterclockwise direction, the package (P) is horizontally moved to the unloading position of the package (P), and each package (P) is moved from the chuck plate 233b on one side. At the same time, the strip (S) is loaded on the other chuck plate 233a.

  At this time, since the one-side chuck plate 233b is initially rotated by 180 ° from the loading position, each package (P) is unloaded from the one-side chuck plate 233b and at the same time, the other-side chuck plate 233a is unloaded. It is possible to load the strip (S). That is, each of the cut packages (P) is positioned below the package picker head 222, and the empty chuck plate 233 a on which no strip is loaded is positioned below the strip picker head 221. become. At this time, while the package picker head 222 and the strip picker head 221 are simultaneously lowered, the package picker head 222 unloads each package (P) from the chuck plate 233b, and at the same time, the strip picker head 221. Loads the new strip (S) that has been adsorbed onto the empty chuck plate 233a.

  When the cutting step is completed in the above steps, a new strip (S) is loaded and a new cutting step is performed. At this time, in order to prevent the cable or the vacuum line from being entangled, the operation is performed in a direction opposite to the rotation direction of the strip (S) in each step shown in FIG. That is, the strip (S) is controlled so that the cutting operation is performed while rotating forward and backward at a predetermined angle within a rotation range of 180 ° from the initial position. FIG. 8 shows such a cutting step.

  The control method of the sawing apparatus for a semiconductor package manufacturing process according to the first embodiment of the present invention will be described with reference to FIG.

  In FIG. 8, the chuck plate 233a loaded with the strip (S) becomes another chuck plate other than the chuck plate 233b loaded with the strip (S) in FIG. Thus, the strips (S) can be alternately loaded on the upper surfaces of the two chuck plates 233a and 233b of the present invention.

  On the other hand, all the steps shown in FIG. 8 are performed in the same manner as the steps shown in FIG. 7 except that the rotation direction of the strip (S) is opposite to the direction in FIG. The description is omitted.

  In this way, by making the rotation direction of the strip (S) shown in FIG. 8 and the rotation direction of the strip (S) shown in FIG. 7 opposite to each other, the rotation angle of the chuck plates 233a and 233b becomes 180 ° at the maximum. Limited. Therefore, it is possible to prevent the cables or vacuum lines from being entangled due to the rotation of the chuck plates 233a and 233b beyond the 180 ° range.

  However, unlike the present embodiment, if there is no problem such as entanglement of a cable or a vacuum line, the rotation range of the chuck plates 233a and 233b does not need to be limited to 180 °, and the rotation angle of the chuck plates 233a and 233b is 360 °. You can do it.

  FIG. 9 shows another control method of the sawing apparatus for a semiconductor package manufacturing process according to the first embodiment of the present invention.

  The control method shown in FIG. 9 is also large, similar to the control method shown in FIG. 7, and includes a loading step of the strip (S), an alignment step of the strip (S), a cutting step of the strip (S), and a package (P). It consists of an unloading stage.

  First, the strip (S) is loaded on one of the two chuck plates 233a and 233b.

  Thereafter, the strips (S) loaded on the chuck plate 233b are aligned. That is, the strip (S) loaded on the chuck plate 233b is horizontally moved to the vision inspection position to perform Y-axis alignment, and when the Y-axis alignment is completed, the strip (S) is rotated clockwise by 90 ° and X Perform axis alignment.

  Next, a step of cutting the aligned strips (S) into respective packages (P) is performed. First, the aligned strips (S) are cut in the length direction at predetermined intervals in the width direction, and then, the strips (S) are rotated counterclockwise by 90 °, and then cut in the length direction. Cut in the width direction while leaving an interval.

  In order to prevent dust generated at the time of the cutting from contaminating the chuck plate 233a on which the strip (S) is not loaded, the scrap is removed in the direction of the chuck plate 233a on the other side where the strip (S) is not loaded. It is preferable that the paper is sent in another direction (the direction of the waste). That is, unlike in FIGS. 7 and 8, the saw blade 33 of the cutting device 30 that cuts the strip (S) rotates counterclockwise as viewed in the Y-axis direction (↑) in the drawing. It is preferable to control the debris to be sent to the right side. At this time, it is necessary to design a structure that can prevent dust generated in the cutting process from contaminating a handler such as the cleaning device 40.

Next, after rotating the strip (S) clockwise by 180 °, the strip (S) is horizontally moved to an unloading position of the package (P), and each package (P) is unloaded from the chuck plate 233b on one side. At the same time, the strip (S) is loaded on the other chuck plate 233a. Although FIG. 9 shows an example in which clockwise rotation is 180 °, it may be rotated counterclockwise by 180 °.
As a result, as in the control method shown in FIG. 7, the one-side chuck plate 233b is rotated by 180 ° from the initial chuck plate position. At the same time as unloading (P), strip (S) can be loaded on chuck plate 233a on the other side.

  FIG. 10 shows a control method in which the loading position of the strip (S) is changed in the control method shown in FIG. That is, FIG. 10 shows a control method in which the strip (S) is loaded on the chuck plate indicated by reference numeral 233a, and this can be realized by changing the positions of the strip picker and the package picker.

  All steps shown in FIG. 10 are performed in the same manner as the steps shown in FIG. 9 except that the direction of rotation of the strip (S) is opposite to that in FIG. It shall be omitted.

  In the control method shown in FIG. 9, similarly to the control method shown in FIG. 10, by changing the loading position of the strip (S), the debris is moved in the left direction (the debris) without changing the rotation direction of the saw blade 33. Direction) to prevent contamination of the handler device.

  FIG. 11 shows still another control method of the sawing apparatus for a semiconductor package manufacturing process according to the first embodiment of the present invention.

  The control method shown in FIG. 11 is also large, similar to the control method shown in FIG. 7, and includes a loading step of the strip (S), an alignment step of the strip (S), a cutting step of the strip (S), and a package (P). It consists of an unloading stage. However, in the embodiment shown in FIG. 11, the strip (S) alignment step and the strip (S) cutting step are mixed.

  First, the strip (S) is loaded on the right chuck plate 233b of the two chuck plates 233a and 233b.

  Thereafter, the strip (S) loaded on the chuck plate 233b is horizontally moved to a vision prosecution position to perform Y-axis alignment, and is immediately cut in the width direction at predetermined intervals in the length direction.

  In order to prevent dust generated at this time from contaminating the chuck plate 233a on which the strip (S) is not loaded, the saw blade 33 of the cutting device 30 that cuts the strip (S) has a Y-axis direction. It is preferable to control so that the debris is sent to the right side (in the debris direction) by rotating counterclockwise as seen in (を). At this time, it is necessary to design a structure that can prevent dust generated in the cutting process from contaminating a handler such as the cleaning device 40.

Next, the strip (S) is rotated 90 ° counterclockwise to perform X-axis alignment, and then cut in the length direction at predetermined intervals in the width direction.
Thereafter, the chuck table 232 is rotated 90 ° in a counterclockwise direction, horizontally moved to an unloading position of the package (P), and then each package (P) is unloaded from the chuck plate 233b on one side. At the same time as loading, the strip (S) is loaded on the other side of the chuck plate 233a.

  At this time, similarly to the control method shown in FIG. 7, the one-side chuck plate 233b is in a state of being rotated by 180 ° from the initial chuck plate position. At the same time as unloading P), strip (S) can be loaded on chuck plate 233a on the other side.

  FIG. 12 shows a control method in which the loading position of the strip (S) is changed in the control method shown in FIG. That is, FIG. 12 shows a control method in which the strip (S) is loaded on the chuck plate indicated by reference numeral 233a, and this can be realized by changing the positions of the strip picker and the package picker.

  All steps shown in FIG. 12 are performed in the same manner as the steps shown in FIG. 11 except that the rotation direction of the strip (S) is opposite to the direction in FIG. It shall be omitted.

  In the control method shown in FIG. 11, similarly to the control method shown in FIG. 12, by changing the loading position of the strip (S), the debris is moved in the left direction (the debris) without changing the rotation direction of the saw blade 33. Direction) to prevent contamination of the handler device.

  FIG. 13 shows another control method of the sawing apparatus for a semiconductor package manufacturing process according to the first embodiment of the present invention.

In the control method shown in FIG. 13, the X-axis and the Y-axis are simultaneously aligned by the vision inspection without rotating the strip (S) loaded on the chuck plate 233b.
Next, the strip (S) is cut in the width direction at predetermined intervals in the length direction, and then rotated 90 ° counterclockwise, and cut in the length direction at predetermined intervals in the width direction.

  When the cutting process is completed, the package (P) is rotated 90 ° in a counterclockwise direction, and is horizontally moved to the unloading position of the package (P), and each package (P) is unloaded from the chuck plate 233b on one side. At the same time, the strip (S) is loaded on the other chuck plate 233a.

  As shown in FIG. 13, a special vision inspection device is required to simultaneously perform the X-axis and Y-axis alignment without rotating the strip (S). That is, there is a need for a vision inspection apparatus capable of simultaneously aligning the X-axis and the Y-axis by one vision inspection in one of the X-axis, the Y-axis, and the diagonal line.

  On the other hand, unlike the example shown in FIG. 13, the rotation direction of the strip (S) may be rotated clockwise by 90 °.

  The dual chuck table according to the present invention has been described above.

  Hereinafter, as another embodiment, an example will be described in which the dual chuck table of the present invention is applied to the system disclosed in Korean Patent Application No. 2003-35020 filed earlier by the present applicant. This prior application has the advantage that the components are arranged according to the process flow, but the single table allows the strip picker to load the strip onto the chuck table before the package picker picks up the package from the chuck table. However, it can be said that it has the problems of the conventional technology described above in this specification.

  FIG. 14 is a plan view showing a sawing apparatus for a semiconductor package manufacturing process according to a second embodiment of the present invention.

  As shown in FIG. 14, a sawing device for a semiconductor package manufacturing process according to the second embodiment includes a chuck table 23 having two chuck plates 233a and 233b, a cutting device 30, and a strip picker, as in the first embodiment. 22a and a package picker 22b.

  However, in the second embodiment, unlike the first embodiment, the on-loader device 10 is arranged so as to be coupled to one side of the sewing device. Further, a strip picker 22a for mounting the strip (S) on the chuck table 23 and a package picker 22b for moving the cut package (P) to the cleaning device are separately provided. Here, the package picker 22b may be configured to be located in front of the system as viewed from above the strip picker 22a, and after extending a ceiling member of the system to the front of the system as viewed from above. Alternatively, a guide rail may be provided below the ceiling member, and the strip picker 22a and the package picker 22b may be provided. The cutting chuck table 23 is installed so as to be horizontally movable in the Y-axis direction. The cutting device 30 includes a pair of saw blades 33 facing each other in the X-axis direction, and performs a cutting operation of the strip (S) while moving in the X-axis direction.

  Accordingly, in the sawing apparatus according to the present embodiment, the strip picker 22a and the package picker 22b are separately configured, and the loading of the strip (S) and the unloading of the package (P) are performed independently, so that the strip ( The loading of S) and the unloading of the package P can be performed. Also, because the on-loader device 10 is directly coupled to one side of the sawing device, the arrangement of the system is simple, the work flow is simplified, and as a result, the working speed of the system is further improved.

  Next, a control method of a sawing device for a semiconductor package manufacturing process according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIGS. 15 to 21 are reference diagrams illustrating a method of controlling a sawing apparatus for a semiconductor package manufacturing process according to a second embodiment of the present invention.

  As in the first embodiment, the control method of the sawing device for the semiconductor package manufacturing process according to the present embodiment is also large, and the strip (S) loading step, the strip (S) alignment step, and the strip (S) cutting step are performed. And a package unloading stage.

  Here, in view of the arrangement of the system, the strip (S) is loaded on the chuck table 23 in parallel with the X-axis direction, and the chuck plate 233a, which moves in the Y-axis direction while the cutting device 30 moves in the X-axis direction, Except that the strip (S) is cut by the relative movement with respect to the H.233b, and that the loading of the strip (S) and the unloading process of the package (P) are changed, a basic control method is adopted. Is the same as the control method of the first embodiment. That is, after the cutting process, the chuck plates 233a and 233b for unloading the package (P) must be rotated by 180 ° from the initial position for loading the strip (S). If so, the rotation angle and rotation direction may be combined in any combination.

  The control method shown in FIG. 15 is basically the same as that of FIG.

  First, the strip (S) is loaded on the upper chuck plate 233b of the two chuck plates 233a and 233b. That is, the strip picker 22a moves to a position above the chuck plate 233b while sucking the strip (S) carried into the apparatus of the present invention, and loads the strip (S) onto the upper chuck plate 233b.

  Thereafter, the strips (S) loaded on the chuck plate 233b are aligned. That is, the strip (S) loaded on the chuck plate 233b was horizontally moved in the Y-axis direction to the vision inspection device, rotated 90 ° counterclockwise, aligned with the Y-axis, and rotated 90 ° clockwise. Then, X-axis alignment is performed.

  Next, a step of cutting the aligned strips (S) into respective packages (P) is performed. First, the aligned strips (S) are cut in the width direction at predetermined intervals in the length direction, and then the strips (S) are rotated clockwise by 90 °, and thereafter, are cut in the width direction by a predetermined number. Cut in length direction at intervals.

  To describe this cutting step more specifically, the saw blade 33 provided in the cutting device 30 descends in the direction of the strip (S) while rotating above the strip (S), and removes the strip (S). The loaded chuck plate 233b is horizontally moved in the Y-axis direction by the chuck table 23 to cut the strip (S) in the width direction and the length direction. At this time, since the cutting device 30 moves at a predetermined interval with a time difference from front to back in the X-axis direction, the strip (S) is cut at a predetermined interval in the vertical direction of the cutting direction. So that

  In order to prevent the debris generated in such a cutting process from contaminating the chuck plate 233a on which the strip (S) is not loaded, the debris is removed from the chuck on the other side of the strip (S) that is not loaded. The sheet is sent in a direction other than the direction of the plate 233a (the direction of the waste). That is, the saw blade 33 of the cutting device 30 that cuts the strip (S) is controlled to rotate clockwise as viewed from the X-axis direction (→) in the drawing so that the chips are sent to the rear of the cutting equipment. I do.

  Thereafter, the cut package (P) is rotated 90 ° clockwise and then moved horizontally to the unloading position of the package (P), and the package picker 22b is moved from the lower chuck plate 233b to each package (P). ), The strip picker 22a loads the strip (S) onto the upper chuck plate 233a.

  At this time, since the upper chuck plate 233b is located on the lower side and is rotated by 180 °, each package (P) is unloaded from the one chuck plate 233b and the other chuck plate is simultaneously loaded. The strip (S) can be loaded on the 233a.

  On the other hand, the chuck plate 233a on which the strip (S) is loaded in FIG. 16 is another chuck plate other than the chuck plate 233b on which the strip (S) is loaded in FIG. Strips (S) are alternately loaded on the upper surfaces of the plates 233a and 233b.

  The step illustrated in FIG. 16 is performed in the same manner as the step illustrated in FIG. 15 except that the rotation direction of the chuck plates 233a and 233b is opposite to the direction in FIG. 15, and thus the detailed description is omitted. Shall be.

  In this way, by reversing the rotation direction of the strip (S) shown in FIG. 16 and the rotation direction of the strip (S) shown in FIG. 15, the rotation angle of the chuck plates 233a and 233b is limited to a maximum of 180 °. You. Therefore, it is possible to prevent a cable or a vacuum line from being entangled due to the chuck plates 233a and 233b rotating indefinitely. However, in the present embodiment, it is not necessary to limit the rotation range of the chuck plates 233a and 233b to 180 ° as long as there is no problem such as entanglement of a cable or a vacuum line as in the first embodiment.

  FIGS. 17 and 18 show control methods combining FIGS. 15 and 9 and FIGS. 16 and 10, respectively. FIGS. 19 and 20 show control methods of FIGS. 16 and FIG. 12 are shown in combination, and FIG. 21 shows a control method in which FIGS. 20 and 13 are combined.

  On the other hand, FIGS. 7 and 8, FIGS. 15 and 16 show an entire cycle (an entire cycle in which strips are alternately loaded on the dual chuck table) according to the present invention, whereas FIGS. 11 and 12, FIG. 13, FIG. 17, FIG. 17, FIG. 19, FIG. 20, and FIG. 21 show only the stage in which the strip is loaded on one chuck table instead of the entire cycle. Please note. The entire cycle in which strips are alternately loaded on the dual chuck table can be easily understood from FIGS.

  Since these can be easily understood by the combination of the control methods described above, detailed description will be omitted.

  Although the present invention has been described with reference to specific embodiments, it is needless to say that various changes and modifications can be made in the present invention without departing from the technical concept thereof. Therefore, the scope of the present invention should be defined by the appended claims and equivalents thereof.

It is a top view of a handler system for cutting a semiconductor package device according to a conventional technique. FIG. 2 is a reference view showing a relationship between a strip / package picker and a chuck table in FIG. 1. 1 is a plan view illustrating a sawing device for a semiconductor package manufacturing process according to a first embodiment of the present invention. FIG. 4 is a perspective view illustrating a chuck table and a chuck plate of FIG. 3. FIG. 4 is a plan view showing the strip / package picker of FIG. 3. FIG. 4 is a reference view showing a relationship between a strip picker head and a package picker head and two chuck plates in FIG. 3. FIG. 4 is a reference diagram illustrating a control method of the sawing device for a semiconductor package manufacturing process according to the first embodiment of the present invention. FIG. 4 is a reference diagram illustrating a control method of the sawing device for a semiconductor package manufacturing process according to the first embodiment of the present invention. FIG. 5 is a reference diagram showing another control method of the sawing device for a semiconductor package manufacturing process according to the first embodiment of the present invention. FIG. 5 is a reference diagram showing another control method of the sawing device for a semiconductor package manufacturing process according to the first embodiment of the present invention. FIG. 6 is a reference view showing still another control method of the sawing device for a semiconductor package manufacturing process according to the first embodiment of the present invention. FIG. 5 is a reference view showing still another control method of the sawing device for a semiconductor package manufacturing process according to the first embodiment of the present invention. FIG. 6 is a reference view showing still another control method of the sawing device for a semiconductor package manufacturing process according to the first embodiment of the present invention. FIG. 5 is a plan view illustrating a sawing device for a semiconductor package manufacturing process according to a second embodiment of the present invention. FIG. 7 is a reference diagram illustrating a control method of a sawing device for a semiconductor package manufacturing process according to a second embodiment of the present invention. FIG. 7 is a reference diagram illustrating a control method of a sawing device for a semiconductor package manufacturing process according to a second embodiment of the present invention. FIG. 9 is a reference diagram showing another control method of the sawing device for a semiconductor package manufacturing process according to the second embodiment of the present invention. FIG. 9 is a reference diagram showing another control method of the sawing device for a semiconductor package manufacturing process according to the second embodiment of the present invention. FIG. 9 is a reference diagram showing still another control method of the sawing device for a semiconductor package manufacturing process according to the second embodiment of the present invention. FIG. 9 is a reference diagram showing still another control method of the sawing device for a semiconductor package manufacturing process according to the second embodiment of the present invention. FIG. 9 is a reference diagram showing still another control method of the sawing device for a semiconductor package manufacturing process according to the second embodiment of the present invention.

Explanation of reference numerals

10 On-loader device 12 Pusher 22 Strip / Package picker 221 Strip picker head 222 Package picker head 22a Strip picker 22b Package picker 23 Chuck table 233 Chuck plate 233a Chuck plate 233b Chuck plate 24 Guide rail 30 Cutting device 31 Motor 32 Spindle 33 Saw blade 40 cleaning device 50 drying device

Claims (11)

Chuck table base,
A chuck table mounted on the chuck table base so as to be movable in a horizontal direction;
Two chuck plates, which are rotatably installed on the upper part of the chuck table, and on which strips are alternately loaded on the upper surface;
A cutting device for cutting a strip loaded on the chuck plate into respective packages by mutual movement with the chuck table;
A sawing apparatus for a semiconductor package manufacturing process, comprising: a strip / package dedicated picker for simultaneously performing the loading operation of the strip on the chuck plate and the unloading operation of the package. The package may be unloaded at the same time as the strip / package picker alternately loads the strip by rotating the chuck table by 180 degrees with respect to an initial position after the cutting process. 2. A sewing apparatus for a semiconductor manufacturing process according to 1. 3. The sawing apparatus for a semiconductor manufacturing process according to claim 2, wherein the rotation of the chuck table by 180 ° is alternately performed in forward and reverse directions to prevent a cable from being entangled. 4. 3. The sawing apparatus according to claim 2, wherein the rotation direction and the rotation angle of the chuck table are controlled within 180 degrees with respect to the initial position when the strips are aligned. Although the cutting device is configured to include a spindle rotatably installed by a predetermined power, and a saw blade installed at one end of the spindle to cut the strip into respective packages,
2. The semiconductor package manufacturing process according to claim 1, wherein a rotation direction of the spindle is controlled so that debris generated when the strip is cut is not sent to a chuck plate on which the strip is not loaded. 3. Sewing equipment. In a method of controlling a sawing device for a semiconductor package manufacturing process having two chuck plates,
A first step of loading a strip on one of the two chuck plates;
A second step of aligning the strip loaded on the chuck plate;
A third step of cutting the aligned strips into respective packages;
Rotating the one-side chuck plate by 180 ° from the first-stage chuck plate position to unload each package and simultaneously loading a strip on the other-side chuck plate; A method for controlling a sawing device for a semiconductor package manufacturing process. 7. The semiconductor package manufacturing process according to claim 6, wherein, in the second step, a rotation direction and a rotation angle of the chuck table are controlled within a range not exceeding 180 degrees with respect to an initial position. How to control the device. 8. The sawing apparatus according to claim 7, wherein the chips generated during the cutting are sent in a direction other than the direction of the chuck plate on the other side where the strip is not loaded. Control method. The method may further include, after performing the third step, horizontally moving each of the cut packages to an unloading position of the packages while the chuck table is rotated 180 degrees from the initial position. The method for controlling a sawing device for a semiconductor package manufacturing process according to claim 7. The method according to any one of claims 6 to 9, wherein, after performing the fourth step, the second to fourth steps are repeated, but the rotation direction of the strip in each step is reversed. Control method for a sawing device for a semiconductor package manufacturing process. Chuck table base,
A chuck table installed on the chuck table base so as to be horizontally movable in the Y-axis direction;
Two chuck plates, which are rotatably installed on the upper part of the chuck table, and on which strips are alternately loaded on the upper surface;
A cutting device for cutting a strip loaded on the chuck plate into respective packages by mutual movement with the chuck table;
A strip picker installed movably in the X-axis direction to load the strip on the chuck plate;
A package picker installed to be movable in the X-axis direction in parallel with the strip picker and performing an unloading operation of the package from the chuck table during the loading operation of the strip picker; Sewing equipment.

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