JP2009253058A - Cutting method for package substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting method of a package substrate for suppressing package failure by preventing the bending of a cutting line. <P>SOLUTION: This cutting method of a package substrate is used to cut a package substrate 2 with devices arranged in a plurality of regions divided by a plurality of first cutting schedule lines 8a extended in parallel on the surface and a plurality of second cutting schedule lines 8b extended to a direction orthogonal to the first cut schedule lines, and device regions 6a, 6b and 6c with the plurality of device thereon are arranged in a direction parallel to the first cutting schedule lines with a prescribed interval, and a non-device region 5a is arranged between the adjacent device regions. For this purpose, a cutting device includes a holding table for sucking and holding only a region corresponding to the device region of the package substrate and not sucking or holding the region corresponding to the non-device region and a cutting means having a cutting blade for cutting the package substrate held by the holding table. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for cutting a package substrate having a plurality of device regions composed of a plurality of devices partitioned by a planned cutting line and having non-device regions between adjacent device regions.

  A CSP (Chip Size Package) substrate having a plurality of device regions formed by arranging a plurality of semiconductor chips on which circuits such as IC and LSI are formed and further resin-sealing, and having a non-device region between adjacent device regions The package substrate such as is cut along a planned cutting line by a cutting device, and is formed as a package having substantially the same size as the semiconductor chip.

  In order to reduce the occurrence of warpage due to resin sealing, the package substrate has a device region (a region where a semiconductor chip exists and is resin-sealed) and a non-device region (a region where no semiconductor chip exists and is not resin-sealed). ) And are alternately adjacent.

  A cutting device for cutting a package substrate has a holding table for sucking and holding the package substrate, and a cutting means having a cutting blade for cutting the package substrate held by the holding table. A plurality of suction ports corresponding to each package are provided so that the packages are not scattered.

  In the conventional method for cutting a package substrate, first, cutting is performed along the planned cutting lines on the four sides of the outermost periphery of the device region in order to separate the outer peripheral surplus region and the non-device region. Since the outer peripheral surplus area and the non-device area are not sucked and held by the holding table, they are separated from the substrate during the cutting process and discharged together with the cutting water.

The holding table that sucks and holds the package substrate in the cutting process is generally used in the subsequent pick-up process, and the non-device area is removed from the holding table during the cutting process in order to increase the efficiency of the pick-up process. That is important.
JP 2006-261525 A

  However, when trying to cut the package substrate from which the non-device region has been removed, the following phenomenon occurs as the holding table is fed. That is, since the cutting blade digs in a width of about 5 to 10 mm in the cutting direction of the package substrate, a part of the cutting blade cuts the device area, and the other part is a space where nothing is removed from the non-device area. When cutting, it occurs.

  If the cutting feed of the holding table is continued in this state, the cutting blade starts cutting the next device region while simultaneously cutting the device region and the empty space from which the non-device region is removed.

  At this time, since the tip of the cutting blade enters the next device region in a state where only a part of the cutting blade is sandwiched in the device region, bending when the cutting blade contacts the next device region, There arises a problem that a chip size package to be cut moves.

  When the movement of the chip size package is small in the adsorption area of the package, for example, it is particularly noticeable in a chip size package of about 2 × 2 mm or less. If the cutting blade enters the device region in a bent state, or if the package moves during cutting, the cutting line is bent and the chip size package to be cut becomes defective.

  The present invention has been made in view of these points, and an object of the present invention is to provide a cutting method of a package substrate capable of preventing bending of a cutting blade and movement of a package during cutting.

  According to the present invention, a device is provided in each of a plurality of regions defined by a plurality of first scheduled cutting lines extending parallel to the surface and a plurality of second scheduled cutting lines extending in a direction orthogonal to the first scheduled cutting line. And a plurality of device regions in which a plurality of devices are arranged are arranged in a direction parallel to the first scheduled cutting line with a predetermined interval, and non-between the adjacent device regions and the device regions. A package substrate having a device region is sucked and held only in a region corresponding to the device region of the package substrate, and a region corresponding to the non-device region is not sucked and held, and a package substrate held on the holding table A package substrate cutting method for cutting using a cutting device having a cutting means having a cutting blade for cutting, wherein A first cutting step of cutting the package substrate along the plurality of first cutting scheduled lines extending in parallel with a direction in which the chair regions are arranged; and after performing the first cutting step, the plurality of second And a second cutting step of cutting the package substrate along a planned cutting line. A method for cutting a package substrate is provided.

  According to the present invention, after cutting one direction of the package substrate so that the divided pieces after cutting in the first cutting step include the device region and the non-device region, the cutting direction of the first cutting step is set in the second cutting step. Since cutting is performed in the orthogonal direction, the non-device area is not removed during the cutting in the first cutting process, and the non-device area is discharged together with the cutting water in the second cutting process divided into individual packages. Is possible. As a result, the defective rate of each cut package can be reduced.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a plan view of an example of a package substrate that is an object of the cutting method of the present invention. The package substrate 2 has, for example, a rectangular metal frame 4. In the example shown in the figure, there are three device regions 6 a and 6 b in the region surrounded by the outer peripheral excess region 5 and the non-device region 5 a of the metal frame 4. , 6c.

  In each device region 6a, 6b, 6c, a plurality of device forming portions 10 defined by first and second scheduled cutting lines 8a, 8b provided vertically and horizontally so as to be orthogonal to each other are defined, and individual devices are defined. A plurality of electrodes 12 are formed on the forming portion 10.

  The electrodes 12 are insulated from each other by a resin molded on the metal frame 4. By cutting the first scheduled cutting line 8a and the second scheduled cutting line 8b, the electrodes 12 of each device appear on both sides thereof.

  As shown in FIG. 2, devices 14 are formed on the back surfaces of the device forming portions 10 in the device regions 6 a, 6 b, 6 c, and the electrodes included in the devices 14 and the electrodes 12 are connected.

  The devices 14 in the device regions 6a, 6b, and 6c are sealed with resin, and a resin sealing portion 16 is formed on the back surface of the device regions 6a, 6b, and 6c. As shown in FIG. 1, round holes 18 are formed at the four corners of the metal frame 4.

  The package substrate 2 configured as described above is fixed to a fixing jig 20 as shown in FIG. 3, and is divided into individual packages (devices) by cutting the scheduled cutting lines 8a and 8b.

  The fixing jig 20 includes a plurality of relief grooves 22 for avoiding contact between the fixing jig 20 and the cutting blade when a cutting blade of a cutting apparatus, which will be described later, cuts into the scheduled cutting lines 8 a and 8 b of the package substrate 2. Are formed, and a plurality of suction ports 24 for sucking individual devices mounted on the package substrate 2 are formed for each device 14.

  Through holes 28 are formed at the four corners of the fixing jig 20, and two protrusions are formed adjacent to the through holes 28, respectively, for a total of eight protrusions 26. The package substrate 2 is positioned and mounted on the fixing jig 20 by abutting the vicinity of the four corners of the package substrate 2 with the two protrusions 26.

  The fixing jig 20 is placed on the suction table 32 of the cutting device 30 shown in FIG. 4 in a state where each through hole 28 is fitted to the protruding portion 34 of the suction table 32. The suction table 32 is movable in the X-axis direction and is rotatable, and a suction part 36 communicating with a suction source (not shown) is provided.

  When the fixing jig 20 on which the package substrate 2 is placed is placed on the suction table 32 and a suction force is applied from the suction portion 36, the suction force 24 is respectively applied to the suction port 24 of the fixing jig 20 shown in FIG. Acts, and the package substrate 2 is sucked and held.

  The cutting device 30 shown in FIG. 4 is provided with a cutting means (cutting unit) 42 configured by attaching a cutting blade 40 to the tip of a spindle 38. Furthermore, an alignment unit 44 that detects a scheduled cutting line of the package substrate 2 so as to be movable in the Y-axis direction and the Z-axis direction integrally with the cutting unit 42 is provided.

  The package substrate 2 held on the suction table 32 via the fixing jig 20 is positioned immediately below the alignment means 44 by moving in the + X-axis direction, and is captured by an imaging unit 46 such as a CCD camera constituting the alignment means 44. The surface is imaged and a planned cutting line 8a or 8b to be cut is detected. After completing the alignment, the cutting blade 38 is moved in the Y-axis direction to align the planned cutting line 8a or 8b with the cutting blade 38 in the Y-axis direction.

  Next, the cutting method of the package substrate of the present invention will be described with reference to FIG. In the cutting method of the present invention, the outermost first cutting line 8 a that extends in the longitudinal direction of the package substrate 2 is first cut as indicated by an arrow 48.

  Thereby, the outer periphery surplus area | region 5 extended | stretched to a longitudinal direction is cut away. Next, the package substrate 2 is cut along all the first scheduled cutting lines 8a that are cut along the adjacent first scheduled cutting lines 8a and extend in the longitudinal direction.

  When such a primary cutting process is completed, the package substrate 2 is separated into a plurality of very thin plate-like objects, but the plate-like objects are sucked and held by a large number of suction ports 24, and the non-device region 5a is a device. It remains connected to the regions 6a, 6b, 6c.

  In the first cutting process along the longitudinal direction of the package substrate 2, the package substrate 2 is cut while the non-device region 5a is connected to the device regions 6a, 6b, 6c, so the outer peripheral surplus region 5 and the non-device region 5a. The package substrate 2 can be smoothly cut without causing the problems seen in the conventional cutting method of cutting the device regions 6a, 6b, and 6c after removing all of them.

  After the first cutting process is completed, a second cutting process is performed in the direction of the second cutting line 8b perpendicular to the first cutting line 8a in the longitudinal direction, that is, in the direction of the arrow 50. In this secondary cutting process, the outer peripheral surplus region 5 in the longitudinal direction of the package substrate 2 has already been dropped, and the non-device region 5a is connected to the device regions 6a, 6b, 6c, so that the cutting blade 40 has nothing. The space which is not cut is not cut, and smooth cutting along the second scheduled cutting line 8b can be performed.

  In this secondary cutting process, the outer peripheral surplus region 5 and the non-device region 5a in the short direction of the package substrate 2 are washed away together with the cutting water, and are later broken into pieces that are sucked and held by the suction port 24 of the fixing jig 20. A large number of devices (packages) 14 remain.

  According to the cutting method of the above-described embodiment of the present invention, the non-device region 5a is not removed during the cutting in the first cutting step, and the second cutting step is divided into individual packages (devices) 14. Since the non-device region 5a can be discharged together with the cutting water, individual package defects that have been a problem with the conventional cutting method can be reduced as much as possible.

It is a top view of a package substrate. It is a side view which expands and shows a part of package substrate. It is a perspective view which shows a mode that a package board | substrate is mounted in a fixing jig. It is a partially broken perspective view of a cutting device. It is explanatory drawing explaining the cutting method of this invention embodiment.

Explanation of symbols

2 package substrate 4 metal frame 5 outer peripheral surplus area 5a non-device area 6a, 6b, 6c device area 8a, 8b planned cutting line 10 device forming part 12 electrode 14 device 16 resin sealing part 20 fixing jig 22 escape groove 24 suction port 30 Cutting device 32 Suction table 40 Cutting blade

Claims (1)

A plurality of first cutting lines extending parallel to the surface and a plurality of regions partitioned by a plurality of second cutting lines extending in a direction perpendicular to the first cutting lines; A plurality of device regions in which devices are arranged in a direction parallel to the first scheduled cutting line at a predetermined interval, and a package having a non-device region between the adjacent device region and the device region Board
A holding table that sucks and holds only an area corresponding to the device area of the package substrate and does not suck and hold an area corresponding to the non-device area;
A package substrate cutting method using a cutting device including a cutting means having a cutting blade for cutting the package substrate held on the holding table,
A first cutting step of cutting the package substrate along the plurality of first cutting scheduled lines extending in parallel with a direction in which the plurality of device regions are arranged;
A second cutting step of cutting the package substrate along the plurality of second scheduled cutting lines after performing the first cutting step;
A method for cutting a package substrate, comprising:

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