JP4763398B2 - Cutting equipment - Google Patents

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.

  For example, in the semiconductor device manufacturing process, circuits such as IC and LSI are formed in a number of regions partitioned by dividing lines called streets formed in a lattice shape on the surface of a semiconductor wafer having a substantially disk shape, Each semiconductor chip is manufactured by dividing each region in which the circuit is formed along a planned division line. As a dividing device for dividing a semiconductor wafer, a cutting device as a dicing device is generally used. This cutting apparatus includes a chuck table for holding a workpiece, a cutting means for cutting the workpiece held on the chuck table, and a cutting blade for cutting and feeding the chuck table in a cutting feed direction. A feeding means; and a cutting feed means for cutting and feeding the cutting means in a direction perpendicular to the workpiece holding surface of the chuck table.

In such a cutting apparatus, in order to improve the cutting efficiency, two chuck tables are provided, and are held on the other chuck table while the workpiece held on one chuck table is being cut. There has been proposed a cutting apparatus that can efficiently perform an alignment operation of a workpiece without cutting the cutting means. (For example, refer to Patent Document 1).
JP 2003-163178 A

  The above-described cutting apparatus includes a cutting feed unit that cuts and feeds the cutting unit in a direction perpendicular to the workpiece placement surface of the chuck table. However, when the workpiece held on the chuck table is cut by the cutting means, the cutting water is supplied to the cutting portion by the cutting blade, so that the cutting water is scattered due to the rotation of the cutting blade. There is a problem that the scattered cutting water contaminates the cutting and feeding means.

  The present invention has been made in view of the above-described facts, and a main technical problem thereof is to provide a cutting apparatus in which cutting water scattered by cutting by the cutting means is prevented from adhering to the cutting feed means.

In order to solve the above main technical problem, according to the present invention, a chuck table having a workpiece holding surface for holding a workpiece, and a cutting means for cutting the workpiece held on the chuck table; A cutting feed means having a cutting blade for cutting and feeding the chuck table in the cutting feed direction; and a cutting feed means for cutting and feeding the cutting means in a direction perpendicular to the workpiece holding surface of the chuck table; In a cutting apparatus comprising:
An exhaust means for sucking and discharging the atmosphere around the cutting feed means;
Spattered water guiding means for guiding cutting water scattered due to rotation of the cutting blade to the exhaust means ,
The exhaust means is disposed downstream of the chuck table in the cutting feed direction, and has a side wall on the cut feed means side and a suction opening between the side wall and the scattered water guide means. An exhaust port connected to the suction means at the top of the housing ,
A cutting device is provided.

Also, the cutting means comprises a first cutting means and the second cutting means, the cutting blade of the cutting blade and the second cutting means in the first cutting means are arranged to face each other, the Both cutting blades are rotated in the same direction.

  According to the cutting device according to the present invention, the cutting water scattered due to the rotation of the cutting blade is provided with the scattered water guiding means for guiding the cutting water scattered due to the rotation of the cutting blade to the exhaust means. Does not adhere to the cutting feed means, and the cutting feed means is not contaminated by the scattered cutting water.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view in which a part of a cutting apparatus constructed according to the present invention is broken.
The cutting device shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. The apparatus housing 2 is provided with a chuck table mechanism 3 that holds a workpiece such as a semiconductor wafer and moves it in a cutting feed direction indicated by an arrow X. The chuck table mechanism 3 will be described with reference to FIG.

  The chuck table mechanism 3 in the illustrated embodiment includes a first guide rail 31 a and a second guide rail 31 b disposed on the upper surface of the base 2. Each of the first guide rail 31a and the second guide rail 31b is composed of a pair of rail members 311 and 311 and extends in parallel with each other along the cutting feed direction indicated by an arrow X in FIG. Yes. On the first guide rail 31a and the second guide rail 31b, there are a first support base 32a and a second support base 32b along the first guide rail 31a and the second guide rail 31b, respectively. It is arranged to be movable. That is, guided grooves 321 and 321 are provided in the first support base 32a and the second support base 32b, respectively. The guided grooves 321 and 321 are connected to the first guide rail 31a and the second guide rail 31a. By fitting the pair of rail members 311 and 311 constituting the guide rail 31b, the first support base 32a and the second support base 32b are connected to the first guide rail 31a and the second guide rail 31b. It is configured to be movable along.

  A first cylindrical member 33a and a second cylindrical member 33b are disposed on the first support base 32a and the second support base 32b, respectively. The first cylindrical member 33a and the second cylindrical member are arranged. A first chuck table 34a and a second chuck table 34b are rotatably disposed at the upper end of 33b. The first chuck table 34a and the second chuck table 34b are made of an appropriate porous material such as porous ceramics, and are connected to suction means (not shown). Accordingly, the workpieces placed on the workpiece placement surfaces 341 and 341 by selectively communicating the first chuck table 34a and the second chuck table 34b to the suction source by suction means (not shown). Hold the suction. Further, the first chuck table 34a and the second chuck table 34b are appropriately rotated by a pulse motor (not shown) disposed in the first cylindrical member 33a and the second cylindrical member 33b, respectively. It is like that. Note that the upper ends of the first cylindrical member 33a and the second cylindrical member 33b have holes through which the first chuck table 34a and the second chuck table 34b are inserted, respectively. A first cover member 35a and a second cover member 35b that cover 32a and the second support base 32b are disposed. On the upper surfaces of the first cover member 35a and the second cover member 35b, first blade detection means 36a and second blade detection means 36b for detecting the position of a cutting blade described later are disposed, respectively. ing. Further, as shown in FIG. 3, waterproof covers 361a (361b) and 362a (362b) made of bellows are provided on the downstream end face and the upstream end face in the cutting feed direction X1 of the first cover member 35a and the second cover member 35b. ) Is attached to each end. The other end of one waterproof cover 361 is attached to the exhaust means 7 described later, and the other end of the other waterproof cover 362 is attached to a fixing portion (not shown). The waterproof covers 361a (361b) and 362a (362b) configured as described above are disposed so as to cover a first cutting feed means and a second cutting feed means described later, respectively.

  Returning to FIG. 2, the description will be continued. The chuck table mechanism 3 in the illustrated embodiment replaces the first chuck table 34a and the second chuck table 34b with the first guide rail 31a and the second guide rail 31b, respectively. 2 is provided with a first cutting feed means 37a and a second cutting feed means 37b for moving in the cutting feed direction indicated by the arrow X in FIG. The first cutting feed means 37a and the second cutting feed means 37b are arranged in parallel between a pair of rail members 311 and 311 constituting the first guide rail 31a and the second guide rail 31b, respectively. The male screw rod 371, a bearing 372 that rotatably supports one end of the male screw rod 371, and a pulse motor 373 that is connected to the other end of the male screw rod 371 and drives the male screw rod 371 to rotate forward or backward. The first cutting feed means 37a and the second cutting feed means 37b configured in this way are internally threaded with male screw rods 371 formed on the first support base 32a and the second support base 32b, respectively. 322 is screwed. Therefore, the first cutting feed means 37a and the second cutting feed means 37b respectively drive the pulse motor 373 to drive the male screw rod 371 in the normal direction or the reverse direction, thereby the first support base 32a and the second cutting feed means 37b. The first chuck table 34a and the second chuck table 34b disposed on the second support base 32b are cut along the first guide rail 31a and the second guide rail 31b, respectively, as indicated by an arrow X in FIG. It can move in the feed direction.

  The cutting apparatus in the illustrated embodiment includes a gate-type support frame 4 disposed across the first guide rail 31a and the second guide rail 31b. The gate-shaped support frame 4 includes a first pillar portion 41 disposed on the side of the first guide rail 31a and a second pillar portion disposed on the side of the second guide rail 31b. 42 and a support portion 43 arranged along an index feed direction indicated by an arrow Y perpendicular to a cutting feed direction indicated by an arrow X by connecting the upper ends of the first pillar portion 41 and the second pillar portion 42. Thus, an opening 44 that allows the movement of the first chuck table 34a and the second chuck table 34b is provided at the center. The upper end portions of the first column portion 41 and the second column portion 42 are formed to be wide, and openings 411 and 421 that allow the movement of the spindle unit of the cutting means to be described later are provided at the upper end portions, respectively. ing. A pair of guide rails 431 and 431 are provided on one surface of the support portion 43 along the index feed direction indicated by the arrow Y, and the other surface is in a direction perpendicular to the paper surface as shown in FIG. A pair of guide rails 432 and 432 are provided along the indexing feed direction indicated by arrow Y in FIG.

  The cutting apparatus in the illustrated embodiment includes a first alignment means 5a and a second alignment means movably disposed along a pair of guide rails 431 and 431 provided on the support portion 43 of the portal-type support frame 4. The alignment means 5b is provided. The first alignment means 5a and the second alignment means 5b are respectively a moving block 51, moving means 52, 52 for moving the moving block 51 along a pair of guide rails 431, 431, and a moving block 51. Imaging means 53 and 53 mounted on the. The moving blocks 51 and 51 are respectively provided with guided grooves 511 and 511 that are fitted to the pair of guide rails 431 and 431. The guided grooves 511 and 511 are fitted to the pair of guide rails 431 and 431. Accordingly, the moving blocks 51 and 51 are configured to be movable along the pair of guide rails 431 and 431.

  The moving means 52 and 52 include a male screw rod 521 disposed in parallel between the pair of guide rails 431 and 431, a bearing 522 that rotatably supports one end of the male screw rod 521, and the male screw rod 521. A pulse motor 523 is connected to the end and drives the male screw rod 521 to rotate forward or backward. In the moving means 52 and 52 configured as described above, the male screw rod 521 is screwed into the female screw 512 formed on the moving blocks 51 and 51, respectively. Accordingly, the moving means 52 and 52 drive the pulse motor 523 to drive the male screw rod 521 in the normal direction or the reverse direction, thereby moving the moving blocks 51 and 51 along the pair of guide rails 431 and 431 in FIG. It can move in the index feed direction indicated by Y.

  The image pickup means 53 and 53 mounted on the moving blocks 51 and 51 are respectively provided with image pickup elements (CCD), and send the picked-up image signals to a control means (not shown).

  On the other surface (the surface opposite to the surface on which the first alignment means 5a and the second alignment means 5b are provided) of the support portion 43 constituting the portal-shaped support frame 4 is the first surface. A cutting means 6a and a second cutting means 6b are provided. The 1st cutting means 6a and the 2nd cutting means 6b are demonstrated with reference to FIG. 4 and FIG. The first cutting means 6a and the second cutting means 6b include an indexing movement base 61, a cutting movement base 62, and a spindle unit 63, respectively. The indexing movement base 61 is provided with guided grooves 611 and 611 fitted to a pair of guide rails 432 and 432 provided on the other surface of the support portion 43 on one surface. By fitting 611 and 611 to the pair of guide rails 432 and 432, the indexing movement base 61 is configured to be movable along the pair of guide rails 432 and 432. Further, as shown in FIG. 5, the other surface of the index movement base 61 is provided with a cutting feed direction indicated by an arrow Z (on the workpiece placement surface 341 of the first chuck table 34a and the second chuck table 34b). A pair of guide rails 612 and 612 (only one guide rail is shown in FIG. 5) is provided along the vertical direction. In addition, clearance grooves 613 and 613 are provided on one surface of the index movement bases 61 and 61 so as to allow the insertion of a male screw rod of an index feeding means, which will be described later, with a step in the vertical direction.

  The incision moving base 62 includes a supported portion 621 extending in the vertical direction and a mounting portion 622 extending horizontally at right angles from the lower end of the supported portion 621. As shown in FIG. 4, guided grooves 623 and 623 that fit with a pair of guide rails 612 and 612 provided on the other surface of the indexing movement base 61 are provided on the surface of the supported portion 621 on the mounting portion 622 side. (Only one guided groove is shown in FIG. 5), and the notched moving base 62 is provided by fitting the guided grooves 623 and 623 to the pair of guide rails 612 and 612. Is configured to be movable along the pair of guide rails 612 and 612 in the cutting feed direction indicated by the arrow Z. As shown in FIG. 2, the notch moving base 62 mounted on the indexing movement base 61 in this way is the other surface of the support frame 4 on which the mounting portion 622 is mounted on the indexing movement base 61. The first alignment means 5a and the second alignment means 5b are arranged so as to protrude from the side through the opening 44 to one surface side where the first alignment means 5a and the second alignment means 5b are mounted.

  The spindle unit 63 is mounted on the lower surface of the mounting portion 622 that forms the cutting movement base 62 of the first cutting means 6a and the second cutting means 6b. As shown in FIG. 4, the spindle unit 63 includes a spindle housing 631, a rotary spindle 632 rotatably supported by the spindle housing 631, a cutting blade 633 attached to one end of the rotary spindle 632, and a cutting tool. A cutting water supply pipe 634 that supplies water, a blade cover 635 that covers the cutting blade 633, and a servomotor (not shown) that rotationally drives the rotary spindle 632 are provided, and an index feed in which the axial direction of the rotary spindle 632 is indicated by an arrow Y It is arranged along the direction. Note that the cutting blade 633 of the first cutting means 6a and the cutting blade 633 of the second cutting means 6b are disposed to face each other.

  In the illustrated embodiment, the first cutting means 6a and the second cutting means 6b are arranged so that the index moving bases 61 and 61 are moved along the pair of guide rails 432 and 432 in the index feed direction indicated by the arrow Y in FIG. Indexing feed means 64, 64 for moving are provided. The index feeding means 64 and 64 are formed of a male screw rod 641 disposed in parallel between the pair of guide rails 432 and 432, a bearing 642 that rotatably supports one end of the male screw rod 641, and a male screw rod 641. A pulse motor 643 is connected to the other end and drives the male screw rod 641 to rotate forward or backward. The male screw rods 641 and 641 are disposed at height positions corresponding to the escape grooves 613 and 613 provided in the indexing movement bases 61 and 61, respectively. In the index feeding means 64 and 64 configured as described above, male screw rods 641 and 641 are screwed into female screws 614 and 614 formed on the index moving bases 61 and 61, respectively. Accordingly, the index feeding means 64 and 64 drive the pulse motors 643 and 643 to drive the male screw rods 641 and 641 in the normal direction or the reverse direction, respectively, thereby causing the index moving bases 61 and 61 to be paired with the pair of guide rails 432 and 432. 2 can be moved in the index feed direction indicated by the arrow Y in FIG. When the index movement bases 61 and 61 move, the male threaded rods 641 and 641 pass through the clearance grooves 613 and 613 provided in the index movement bases 61 and 61, so that the index movement bases 61 and 61 are The movement is allowed.

  Further, the first cutting means 6a and the second cutting means 6b in the illustrated embodiment are configured such that the cutting moving bases 62 and 62 are moved along a pair of guide rails 612 and 612 as shown in FIGS. Cutting feed means 65, 65 for moving in the cutting feed direction indicated by the arrow Z are provided. The incision feeding means 65 and 65 include a male screw rod 651 disposed in parallel with the pair of guide rails 612 and 612, a bearing 652 that rotatably supports one end of the male screw rod 651, and the other end of the male screw rod 651 And a pulse motor 653 for driving the male screw rod 651 in the normal direction or the reverse direction. In the cutting feed means 65 and 65 configured as described above, the male screw rod 651 is screwed into a female screw 622 a formed on the supported portion 621 of the cutting movement base 62. Accordingly, the notch feed means 65 and 65 drive the pulse motor 653 to drive the male screw rod 651 in the normal direction or the reverse direction, thereby moving the notch moving base 62 along the pair of guide rails 622 and 622 as shown in FIG. In FIG. 5, it can move in the cutting feed direction indicated by the arrow Z.

  As shown in FIGS. 1 and 3, the cutting apparatus in the illustrated embodiment includes an exhaust unit 7 that sucks and discharges the atmosphere around the first cutting unit 6a and the second cutting unit 6b. The exhaust means 7 is disposed downstream of the first cutting means 6a and the second cutting means 6b in the cutting feed direction indicated by the arrow X1 in FIG. The exhaust means 7 includes a rectangular housing 71. As shown in FIG. 3, the housing 71 includes a suction opening 711a formed above the waterproof cover 361 on the side wall 711 on the first cutting means 6a and second cutting means 6b side. Further, the housing 71 includes an exhaust port 712a formed at the upper part of one end wall 712 as shown in FIG. One end of an exhaust duct 72 is connected to the exhaust port 712a, and the other end of the exhaust duct 72 is connected to suction means (not shown).

  If the description is continued with reference to FIG. 3 and FIG. 6, the cutting apparatus in the illustrated embodiment is scattered due to the rotation of the cutting blade 633 of the first cutting means 6a and the second cutting means 6b. Scattered water guiding means 8 for guiding cutting water to the exhaust means 7 is provided. As shown in FIG. 6, the scattered water guiding means 8 is composed of an upper wall 81 and side walls 82 and 83 formed by hanging from both side edges of the upper wall 81, and one end thereof is formed. It is attached to a blade cover 635 that covers the cutting blades 633 of the first cutting means 6a and the second cutting means 6b. The other end of the scattered water guiding means 8 is inserted into the housing 71 through a suction opening 711a formed in the side wall 711 of the housing 71 constituting the exhaust means 7 as shown in FIG. The blade cover 635 includes a first cover member 636 mounted on the spindle housing 631 and a second cover member 637 mounted on the first cover member 636 in the illustrated embodiment. Yes. Cutting water supply pipes 634 are disposed on the first cover member 636 and the second cover member 637, respectively. A female screw hole 636a and two positioning pins 636b are provided on the side surface of the first cover member 636, and an insertion hole 637a is provided in the second cover member 637 at a position corresponding to the female screw hole 636a. It has been. Further, on the surface of the second cover member 637 facing the first cover member 636, two recesses (not shown) into which the two positioning pins 636b are fitted are formed. The first cover member 636 and the second cover member 637 configured as described above are provided with two recesses (not shown) formed in the second cover member 637 provided in the first cover member 636. The positioning is performed by fitting to the positioning pin 636b. Then, the fastening bolt 638 is inserted into the insertion hole 637a of the first cover member 636, and is screwed into the female screw hole 636a provided in the second cover member 637, thereby making the second cover member 637 the first cover. The cover member 636 is attached.

  Returning to FIG. 2 and continuing the description, the cutting apparatus in the illustrated embodiment has a first cleaning means 9a and a first cleaning means 9a for cleaning the workpieces respectively held by the first chuck table 34a and the second chuck table 34b. Second cleaning means 9b is provided. The first cleaning means 9a includes a cleaning water supply means 91a disposed on the first column portion 41 of the gate-shaped support frame 4 and an injection nozzle 92a connected to the cleaning water supply means 91a. . The injection nozzle 92a includes a plurality of injection holes and is formed of a pipe material. The injection nozzle 92a extends in a direction orthogonal to the cutting feed direction X and is disposed on the moving path of the first chuck table 34a. The second cleaning means 9b includes a cleaning water supply means 91b disposed on the second column portion 42 of the gate-shaped support frame 4 and an injection nozzle 92b connected to the cleaning water supply means 91b. . Similarly to the injection nozzle 92a, the injection nozzle 92b has a plurality of injection holes and is formed of a pipe material. The injection nozzle 92b extends in a direction orthogonal to the cutting feed direction X and is arranged on the movement path of the second chuck table 34b. It is installed.

  Further, the cutting apparatus in the illustrated embodiment includes a drying unit 10 that dries the workpiece cleaned by the first cleaning unit 9a and the second cleaning unit 9b. The drying means 10 is a spinner drying means. The drying means 10 is disposed on an extension line in the index feed direction Y of the workpiece attaching / detaching position shown in FIG. 2 of the first chuck table 34a and the second chuck table 34b.

  Returning to FIG. 1 and continuing the description, the apparatus housing 2 includes a cassette mechanism 11 including a cassette 111 for stocking workpieces such as semiconductor wafers, and a temporary storage area for the workpieces stored in the cassette 111. The workpiece unloading / loading means 13 for unloading to the cassette 12 and loading the workpiece after the cutting operation into the cassette 111, the temporary storage area 12, the first chuck table 34a and the second chuck table 34b, and drying. Workpiece conveying means 14 for conveying the workpiece to and from the means 10 is provided. The cassette 111 is placed on a cassette table of lifting means (not shown) of the cassette mechanism 11. The cassette 111 accommodates a semiconductor wafer W adhered to the surface of the protective tape 16 attached to the annular frame 15. An operation panel 17 is disposed in the device housing 2. In the cutting apparatus in the illustrated embodiment, the operator's operation position is formed with the first alignment means 5a and the second alignment means 5b in front, and the operation panel 17 is disposed at a position facing the operator. Has been.

The cutting apparatus in the illustrated embodiment is configured as described above. Hereinafter, a processing method for cutting a semiconductor wafer as a workpiece will be mainly described with reference to FIGS. 1 and 2.
First, the raising / lowering means (not shown) of the cassette mechanism 11 is operated to position the cassette 111 at an appropriate height. When the cassette 111 is positioned at an appropriate height, the workpiece unloading / loading mechanism 13 is operated to unload the semiconductor wafer W accommodated in the cassette 111 to the temporary placement region 12. The semiconductor wafer W carried out to the temporary placement area 12 is center-aligned here. The semiconductor wafer W whose center has been aligned in the temporary placement region 12 is transferred onto the first chuck table 34a by the workpiece transfer means 14. At this time, the first chuck table 34a is positioned at the workpiece attaching / detaching position shown in FIG. The semiconductor wafer W placed on the first chuck table 34a is sucked and held on the first chuck table 34a by operating a suction means (not shown) (first workpiece holding step).

  As described above, the first chuck table 34a that sucks and holds the semiconductor wafer W is moved to the alignment region below the first alignment means 5a by the operation of the first cutting feed means 37a. Next, the moving means 52 of the first alignment means 5a is operated to position the imaging means 53 of the first alignment means 5a directly above the first chuck table 34a. If the image pickup means 53 is positioned immediately above the first chuck table 34a, the surface of the semiconductor wafer W held on the first chuck table 34a is picked up by the image pickup means 53 and formed on the surface of the semiconductor wafer W. A street which is a cut area is detected. Then, the index feeding means 64 of the first cutting means 6 a and the index feeding means 64 of the second cutting means 6 b are operated to align the respective cutting blades 633 with the streets detected by the imaging means 53. The alignment to be performed is performed (first alignment step).

  While the first alignment process is being performed on the semiconductor wafer W held on the first chuck table 34a, the workpiece carry-in / load-in mechanism 13 is operated to accommodate the semiconductor wafer W accommodated in the cassette 111. Are carried out to the temporary storage area 12. The semiconductor wafer W carried out to the temporary placement area 12 is center-aligned here. The semiconductor wafer W center-aligned in the temporary placement region 12 is transferred onto the second chuck table 34b positioned at the workpiece attachment / detachment position by the workpiece transfer means 14. The semiconductor wafer W placed on the second chuck table 34b is sucked and held on the second chuck table 34b by operating a suction means (not shown) (second workpiece holding step).

  If the semiconductor wafer W is sucked and held on the second chuck table 34b, the second chuck table 34b is moved to an alignment region below the second alignment means 5b by the operation of the second cutting feed means 37b. It is done. Then, a second alignment step of detecting a region to be cut of the semiconductor wafer W held on the second chuck table 34b by the second alignment means 5b is performed. The second alignment process is performed in the same manner as the first alignment process described above.

  On the other hand, when the first alignment step is completed, the first chuck table 34a is moved to the cutting region, and the index feeding means 64 of the first cutting means 6a is operated to perform the first as shown in FIG. The cutting blade 633 of the cutting means 6a is positioned at a position corresponding to the central street formed in the semiconductor wafer W held by the first chuck table 34a, and the cutting feed means 65 is further operated to lower the cutting blade 633. Then, it is positioned at a predetermined cutting feed position. Further, the index feed means 64 of the second cutting means 6b is operated to correspond the cutting blade 633 of the second cutting means 6b to the endmost street formed on the semiconductor wafer W held by the first chuck table 34a. Then, the cutting feed means 65 is actuated to lower the cutting blade 633 and position it at a predetermined cutting feed position. Then, the first cutting feed means 37a is operated while rotating the cutting blade 633 of the first cutting means 6a and the cutting blade 633 of the second cutting means 6b, and the first chuck table 34a is moved to the arrow X1 in FIG. The semiconductor wafer W held by the first chuck table 34a is moved at a high speed by the cutting blade 633 of the first cutting means 6a and the cutting blade 633 of the second cutting means 6b. Under the action, cutting is performed along the predetermined street (first cutting step). In the first cutting process, cutting water is supplied from the cutting water supply pipes 634 and 634 to the cutting portion.

  In the first cutting step, as shown in FIG. 6, the cutting blades 633 of the first cutting means 6a and the second cutting means 6b are both rotated as indicated by an arrow 639. As a result, the cutting water supplied from the cutting water supply pipes 634 and 634 scatters toward the scattered water guide means 8 due to the rotation of the cutting blade 633 as shown in FIG. The scattered cutting water is guided by the scattered water guide means 8 and guided into the housing 71 of the exhaust means 7. In this way, the scattered cutting water guided into the housing 71 and the atmosphere around the first cutting means 6a and the second cutting means 6b sucked from the suction opening 711a of the housing 71 and the exhaust ports 712a and 712a. It is discharged through the exhaust duct 73. Therefore, the cutting water scattered due to the rotation of the cutting blade 633 does not adhere to the cutting feed means 65 of the first cutting means 6a and the second cutting means 6b, and the cutting feed means 65 is scattered. It is not contaminated by cutting water.

  As described above, when the semiconductor wafer W held on the first chuck table 34a is cut along a predetermined street, the index feed means 64 of the first cutting means 6a and the index feed of the second cutting means 6b. By operating the means 64, the first cutting means 6a and the second cutting means 6b are moved in the index feed direction indicated by the arrow Y1 in FIG. 7 by the street interval (index feed process), and the first cutting process described above. To implement. In this manner, the semiconductor wafer W is cut along all the streets formed in a predetermined direction by repeatedly performing the index feeding process and the first cutting process. When the semiconductor wafer W is cut along all the streets formed in the predetermined direction, the first chuck table 34a holding the semiconductor wafer W is rotated by 90 degrees. Then, the semiconductor wafer W is cut along all the streets formed in a lattice shape by repeatedly performing the indexing feeding step and the first cutting step on the semiconductor wafer W held on the first chuck table 34a. And divided into individual chips. Even if the semiconductor wafer W is divided into individual chips, the semiconductor wafer W is stuck to the protective tape 16 attached to the annular frame 15, so that the form of the wafer is maintained without being separated.

  When the first cutting process described above is completed, the second chuck table 34b holding the semiconductor wafer W on which the second alignment process is performed is moved to the cutting area. Then, after the first cutting step, the semiconductor wafer W held on the second chuck table 34b by the first cutting means 6a and the second cutting means 6b as in the first cutting step described above is applied to the semiconductor wafer W held on the second chuck table 34b. On the other hand, the second cutting step is performed. In the second cutting step, as shown in FIG. 6, the cutting blades 633 of the first cutting means 6a and the second cutting means 6b are both rotated as indicated by an arrow 639. As a result, the cutting water supplied from the cutting water supply pipes 634 and 634 scatters toward the scattered water guide means 8 due to the rotation of the cutting blade 633 as shown in FIG. The scattered cutting water is guided by the scattered water guide means 8 and guided into the housing 71 of the exhaust means 7. In this way, the scattered cutting water guided into the housing 71 and the atmosphere around the first cutting means 6a and the second cutting means 6b sucked from the suction opening 711a of the housing 71 and the exhaust ports 712a and 712a. It is discharged through the exhaust duct 73. Therefore, the cutting water scattered due to the rotation of the cutting blade 633 does not adhere to the cutting feed means 65 of the first cutting means 6a and the second cutting means 6b, and the cutting feed means 65 is scattered. It is not contaminated by cutting water.

  While the second cutting process described above is being performed, the first chuck table 34a holding the semiconductor wafer W after the completion of the first cutting process is moved from the processing region toward the workpiece attachment / detachment position. . At this time, the 1st washing | cleaning means 9a is operated and washing water is injected from the injection nozzle 92a. As a result, the cleaning water is sprayed from the injection nozzle 92a onto the semiconductor wafer W on which the first cutting process has been performed, so that the cutting waste adhering to the semiconductor wafer W is cleaned and removed (first cleaning process). ).

  When the first cleaning step is performed, the workpiece transfer means 12 is operated to transfer the cleaned semiconductor wafer W held on the first chuck table 34 a to the drying means 10. The semiconductor wafer W conveyed to the drying means 10 is spinner dried here (first drying step). The semiconductor wafer W that has been subjected to the first drying step in this way is unloaded from the drying means by the workpiece transfer means 14 and transferred to the next process.

  If the semiconductor wafer W on the first chuck table 34a on which the first cleaning step has been performed is transferred to the drying means 10, the next semiconductor wafer W is held on the first chuck table 34a. A first workpiece holding step is performed. Then, the first alignment step, the first cutting step, the first cleaning step, and the first drying step are sequentially performed.

  On the other hand, the second chuck table 34b holding the semiconductor wafer W on which the above-described second cutting process has been performed has a second cutting process on the next semiconductor wafer W held on the first chuck table 34a. Is carried out from the machining area toward the workpiece attachment / detachment position. At this time, the second cleaning means 9b is activated to inject cleaning water from the injection nozzle 92b. As a result, the cleaning water is sprayed from the spray nozzle 92b onto the semiconductor wafer W on which the second cutting process has been performed, so that the cutting waste adhering to the semiconductor wafer W is cleaned and removed (second cleaning process). ).

  When the second cleaning step is performed, the workpiece transfer means 12 is operated to transfer the cleaned semiconductor wafer W held on the second chuck table 34 b to the drying means 8. The semiconductor wafer W transported to the drying means 10 performs the second drying step in the same manner as the first drying step described above. The semiconductor wafer W that has been subjected to the second drying process in this way is unloaded from the drying means by the workpiece transfer means 14 and transferred to the next process.

  If the semiconductor wafer W on the second chuck table 34b on which the second cleaning step has been performed is transported to the drying means 10, the next semiconductor wafer W is held on the second chuck table 34b. A second workpiece holding step is performed. Then, the second alignment process, the second cutting process, the second cleaning process, and the second drying process are sequentially performed.

  Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications are possible within the scope of the gist of the present invention. For example, in the illustrated embodiment, an example in which two chuck tables and two cutting means are provided is shown. However, the present invention is applied to a cutting apparatus having one chuck table and one cutting means. May be.

The perspective view which fractures | ruptures and shows a part of cutting device comprised according to this invention. The principal part perspective view of the cutting device shown in FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. The perspective view which shows the 1st cutting means and the 2nd cutting means of the cutting apparatus shown in FIG. BB sectional drawing in FIG. The perspective view of the splash water guide means with which the cutting apparatus shown in FIG. 1 is equipped. Explanatory drawing which shows the cutting position of the cutting blade of the 1st cutting means with which the cutting apparatus shown in FIG. 1 is equipped, and the cutting blade of the 2nd cutting means.

Explanation of symbols

2: device housing 3: chuck table mechanism 31a: first guide rail 31b: second guide rail 32a: first support base 32b: second support base 34a: first chuck table 34b: second Chuck table 36a: first blade detection means 36b: second blade detection means 37a: first cutting feed means 37b: second cutting feed means 4: portal support frame 5a: first alignment means 5a
5b: second alignment means 52: moving means 53: imaging means 6a: first cutting means 6b: second cutting means 61: indexing movement base 62: cutting movement base 63: spindle unit 632: rotating spindle 633 : Cutting blade 64: Index feed means 65: Cut feed means 7: Exhaust means 71: Exhaust means housing 72: Exhaust duct 8: Splash water guide means 9a: First cleaning means 91a: Wash water supply means 92a: Injection nozzle 9b: Second cleaning means 91b: Washing water supply means 92b: Injection nozzle 10: Drying means 11: Cassette mechanism 111: Cassette 12: Temporary storage area 13: Workpiece unloading / carrying means 14: Workpiece conveying means 15 : Workpiece conveying means 16: Protective tape 17: Operation panel

Claims (2)

A chuck table having a workpiece holding surface for holding the workpiece, a cutting means for cutting the workpiece held on the chuck table, and a cutting blade for cutting and feeding the chuck table in the cutting feed direction. A cutting apparatus comprising: a cutting feed means provided; and a cutting feed means for cutting and feeding the cutting means in a direction perpendicular to the workpiece holding surface of the chuck table.
An exhaust means for sucking and discharging the atmosphere around the cutting feed means;
Spattered water guiding means for guiding cutting water scattered due to rotation of the cutting blade to the exhaust means ,
The exhaust means is disposed downstream of the chuck table in the cutting feed direction, and has a side wall on the cut feed means side and a suction opening between the side wall and the scattered water guide means. An exhaust port connected to the suction means at the top of the housing ,
The cutting device characterized by the above. The cutting means includes a first cutting means and a second cutting means, and the cutting blade of the first cutting means and the cutting blade of the second cutting means are disposed so as to face each other. cutting blade is rotated in the same direction, according to claim 1 Symbol placement of the cutting device.

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