JPH0839429A - Cutting device - Google Patents

Abstract

PURPOSE:To provide a cutting device, which can efficiently drain the slurry (cutting liquid contaminated with cutting chips) regarded as a pollution source to a bonding pat at the time of cutting semiconductor or the like. CONSTITUTION:In a cutting device, in which the cutting liquid is supplied so as to cut a workpiece with a rotating blade, a blade cover for covering a rotating blade 9 is arranged, and a cutting liquid drain pipe 16 is fitted to the blade cover 10 at the side, in which the cutting liquid is dispersed with the rotation of the rotating blade 9. Fitting position and fitting angle of the cutting liquid drain pipe 16 can be adjusted. This cutting device is appropriate for cutting of semiconductor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device for cutting a semiconductor wafer or the like.

[0002]

2. Description of the Related Art A conventional cutting device is, for example, as shown in FIG. 4, an object to be processed such as a semiconductor wafer in a cassette mounting area 1 (a wafer W is fixed to a frame F by a resin tape T).
A cassette 2 accommodating a plurality of sheets is placed, the work piece of the cassette 2 is carried out to the standby area 4 by the carry-in / out means 3, and the work piece is carried to the chuck table 6 by the carrying means 5 having a swing arm. Then, the chuck table 6 is moved, aligned by the alignment means 7, and then cut by the cutting means 8. As shown in FIG. 5, the cutting means 8 has a rotary blade 9 attached to the tip of a spindle 8a, a blade cover 10 for protecting the rotary blade 9, and a pair of cutting water supply nozzles 11 provided on the blade cover 10.
And the blade monitoring means 12 (see FIG. 3).

[0003]

In the above cutting device, as shown in FIG. 6, cutting is performed while jetting the cutting fluid 13 from the cutting water supply nozzle 11. However, cutting debris (contamination) mixes into the muddy water 14. The resulting cutting fluid floats on the surface of the wafer W and adheres to it, thus contaminating the bonding pads and the like. There is also a problem that the muddy water 14 is rotated by the rotation of the blade 9 to contaminate the sensor portion 12a of the blade monitoring means 12 and reduce the monitoring ability. As a cutting device for solving such a conventional problem, for example, Japanese Patent Laid-Open No. 4-7
Although disclosed in Japanese Patent No. 4607, a plate-shaped or suction-type drainage guide member is provided on the side where the cutting fluid is scattered due to the rotation of the rotary blade, and the cutting fluid is guided to a drain trough and discharged. It is what makes me. The present invention is a further development of the above invention, which has a simple structure and is capable of efficiently discharging the cutting fluid that has become muddy water as a pollution source during cutting.
An object is to provide a cutting device.

[0004]

As a means for technically solving the above-mentioned problems, the present invention provides a cutting device for supplying a cutting fluid to cut a workpiece with a rotating blade. A gist is a cutting device in which a blade cover for covering the blade is provided, and a cutting fluid discharge pipe is provided on a side where the cutting fluid is scattered due to the rotation of the rotary blade. or,
The gist is that the position and angle of the cutting fluid discharge pipe can be adjusted, and that the workpiece is a semiconductor wafer.

[0005]

[Operation] A cutting fluid discharge pipe provided on the blade cover can properly discharge the cutting fluid that has become muddy water, which is a pollution source, from the wafer surface to the outside, and protects the bonding pads and the like on the wafer surface from contamination. Since the position and angle of the cutting fluid discharge pipe can be adjusted, it can be adapted to the size and cutting condition of the rotating blade. It is possible to prevent the muddy water from going around, protect the sensor part of the blade monitoring means from dirt, and prevent scattering of muddy water to narrow the contamination range.

[0006]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings (however, the same members as those in the conventional example have the same reference numerals). FIG.
In the figure, 10 is a blade cover for protecting the rotating blade 9, and in consideration of the rotating direction A of the rotating blade 9, the mounting piece 1 is placed on the left side when viewed from the front, that is, on the side where the cutting fluid is scattered.
5 is provided, and a horizontally long slot 15a is formed in the mounting piece 15.

Reference numeral 16 denotes a cutting water discharge pipe, which has a substantially rectangular tube-shaped cross section as shown in FIG. 2, and the end portion 16a on the blade 9 side is formed in an arc shape corresponding to the circular shape of the blade 9. In addition, a pair of overhanging pieces 16b are provided on the upper end so as to sandwich the blade 9, and the other end 16c is formed such that the upper part thereof is a slightly downward inclined surface 16d and the lower part is arcuate. Also, cutting water discharge pipe 1
A mounting piece 17 is fixed to the upper middle portion of 6, and a vertically long slot 17a is formed in the mounting piece 17. The overhanging piece 16b does not always need to be provided because it may hinder the blade replacement. Also, the blade cover 1
If it is provided at the end portion 10a of 0-1 it does not hinder the blade replacement, so it can be provided here freely.

The cutting water discharge pipe 16 has a mounting piece 17
And the mounting piece 15 of the blade cover 10 are put together, the set screw 18 is inserted into the long holes 17a and the long hole 15a, and the nut 19 is screwed to be attached to the blade cover 10.

At the time of this attachment, the position of the cutting water discharge pipe 16 can be adjusted in the X-axis direction by utilizing the elongated hole 15a of the attachment piece 15, and the elongated hole 17 of the attachment piece 17 can be adjusted.
It is also possible to adjust in the Z-axis direction by using a, and the angle can also be adjusted by turning the cutting water discharge pipe 16 with the set screw 18 as the central axis. Therefore, the mounting position and angle of the cutting water discharge pipe 16 can be properly set according to the size of the blade 9. Also, the size of the work piece,
It is also possible to appropriately replace the cutting water discharge pipe 16 corresponding to the amount of cutting fluid and the like.

The blade monitoring means 12 has a set screw 20.
Blade cover 10 including a cutting water supply nozzle 11 on one side, which is detachably attached to the blade cover 10 through
1 is also detachably attached to the blade cover 10 via a set screw 21. This is because these are arranged so as to straddle the blade 9 as shown in FIG. 3, and thus it is necessary to remove the blade 9 from the blade cover 10 when replacing the blade 9.

The cutting means 8'constructed in this way cuts the wafer W while jetting the cutting fluid 13 from the cutting water supply nozzle 11 as shown in FIG. 1, but cutting the muddy water 14 with contamination. The liquid can be introduced into the cutting water discharge pipe 16 by the rotation of the blade 9 and discharged from the other end 16c to the outside.

At this time, since the arcuate end 16a of the cutting water discharge pipe 16 is disposed close to the blade 9, almost all the muddy water blown off by the rotation of the blade 9 flows into the cutting water discharge pipe 16. Moreover, since the overhanging pieces 16b are located on both sides of the blade 9 so as to sandwich the blade 9, the muddy water caused by the entrainment is repelled and dropped into the cutting water discharge pipe 16. Therefore, the sensor part 12a of the blade monitoring means 12 is protected from contamination of muddy water and the monitoring ability is not deteriorated, and muddy water does not scatter around, so that the contamination range can be significantly narrowed.

The cutting water discharge pipe 16 has the nut 19 described above.
It can be easily removed from the blade cover 10 by loosening it and pulling out the setscrew 18, so cleaning, maintenance and replacement after use are easy, and the work of attaching it to the original position is easy, so that it is easy to use.

[0014]

As described above, according to the present invention, since the cutting fluid discharge pipe is provided on the side where the cutting fluid is scattered due to the rotating blade in the blade cover of the cutting device, the cutting fluid which becomes muddy water is removed. It can be efficiently discharged to the outside, and the bonding pads on the wafer surface can be protected from contamination. Further, since the position and angle of the cutting fluid discharge pipe can be adjusted, the size and cutting conditions of the rotating blade can be adjusted. Furthermore, it is possible to prevent the cutting fluid that has become muddy water from entraining in advance, protect the sensor part of the blade monitoring means from contamination, and prevent deterioration of the monitoring ability, and prevent the cutting fluid that has become muddy water from scattering. Therefore, it has an excellent effect that the contamination range can be restricted to a narrow range.

[Brief description of drawings]

FIG. 1 is a schematic front view of an essential part showing an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the same.

FIG. 3 is a schematic side view showing the vicinity of a blade.

FIG. 4 is a perspective view showing an example of a cutting device.

FIG. 5 is a perspective view of a main part showing a conventional example.

FIG. 6 is a schematic front view of the same during cutting.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Cassette mounting area 2 ... Cassette 3 ... Carrying in / out means 4 ... Standby area 5 ... Conveying means 6 ... Chuck table 7 ... Alignment means 8 ... Cutting means
8a ... spindle 9 ... blade 10 ... blade cover 11 ... cutting water supply nozzle 12 ... blade monitoring means 12a ... sensor part 13 ... cutting water 14 ... muddy water 15 ... mounting piece 15a ... long hole 16 ... cutting water discharge pipe 16b ... overhanging Piece 17 ... Mounting piece 17
a ... long hole 18 ... set screw 19 ... nut 20
… Set screw 21… Set screw

Claims (3)

[Claims] 1. A cutting device for supplying a cutting fluid to cut a workpiece by a rotating blade, wherein the cutting device is provided with a blade cover for covering the rotating blade. A cutting device with a cutting fluid discharge pipe on the side where the cutting fluid is scattered due to rotation. 2. The cutting device according to claim 1, wherein the position and angle of the cutting fluid discharge pipe can be adjusted. 3. The cutting device according to claim 1, wherein the workpiece is a semiconductor wafer.