KR20040085280A - A sawing apparatus and a control method for manufacturing processes of semiconductor package - Google Patents

Abstract

PURPOSE: A sawing apparatus for a semiconductor package process and a controlling method thereof are provided to perform simultaneously a loading process of a strip and an unloading process of a package by using two chuck plates. CONSTITUTION: A chuck table(23) is installed on a chuck table base. The chuck table is horizontally moved on the chuck table base. Two chuck plates(233a,233b) are rotatably installed on an upper part of the chuck table. A strip is alternately loaded on each upper surface of the chuck plates. A cutting unit(30) is moved according to an operation of the chuck table in order to cut the strip loaded on the chuck plates into individual packages. A strip/package picker is used for performing a process for loading the strip on the chuck plates and an unloading process of the packages.

Description

A sawing apparatus and a control method for manufacturing processes of semiconductor package

The present invention relates to a sawing apparatus for a semiconductor package manufacturing process and a control method thereof, and more particularly, to improve productivity during a semiconductor sawing operation by improving the structure of the chuck table and thus the sawing process.

In general, a semiconductor package manufactures a semiconductor chip in which a highly integrated circuit such as a transistor and a capacitor is formed on a semiconductor substrate made of silicon through a FAB (Fabrication) process, and then attaches the semiconductor chip to a lead frame or a printed circuit board. It is manufactured by electrically connecting the lead frame or the printed circuit board with wires so as to be energized with each other, and then molding them with an epoxy molding compound (EMC) to protect the chip from the external environment.

On the other hand, the semiconductor package manufactured as described above is usually packaged to form a matrix on a lead frame, so that the package is connected to each other in a lead frame or a printed circuit board to go through a sawing process to separate and separately, after the sawing process The cut packages are loaded into trays according to preset quality criteria and moved for the next process.

In addition, a lead frame or a printed circuit board is generally called a strip because it has a rectangular strip shape, and the strip is cut at predetermined intervals in the width direction and the length direction is called a package.

On the other hand, the device used in such a process is disclosed in detail in the handler system for cutting a semiconductor package device (Patent Application No. 10-2000-0079282, Publication No. 2002-0049954) filed by the applicant.

The handler system for cutting the semiconductor package device, as shown in FIG. 1, is capable of horizontally moving along the guide rails 32 and then loading the loaded strip onto the chuck table 23 or loading the chuck table 23. Strip / package picker 22 for unloading individual packages from the package and the chuck table base 200 and the strips are loaded by the picker 22 to move the strips horizontally. A chuck table 23 to be rotated, a cutter 30 for cutting the strip conveyed by the chuck table 23 into individual packages, and a cleaning device for removing foreign substances generated during sawing by the cutter ( 40), and a drying apparatus 50 for drying the packages individually separated by the cutter.

FIG. 2 is a reference diagram illustrating a relationship between a strip / package picker and a chuck table in FIG. 1.

According to this, one chuck plate 233 is installed on the upper surface of the chuck table 23, and the strip / package picker 22 is located on the upper portion of the chuck plate 233 and can be lifted and removed. 221 and package picker head 222.

Here, P is an individual package cut by a cutter fixed to the chuck plate 233, S is a strip to be loaded on the chuck plate 233 as a newly loaded strip adsorbed to the strip picker head 221. to be.

In the conventional handler system configured as described above, the sawing process is briefly described. First, when the strip S is brought into the system through a pusher not shown from the onloader device, the strip picker head of the strip / package picker 22 ( After the 221 adsorbs the strip S, the 221 moves along the guide rail 32 to load the strip onto the chuck plate 233.

Thereafter, the strip S is transferred to the cutter 30 in a state of being sucked and fixed by the vacuum force on the chuck plate 233, and the strip S is moved by the mutual movement of the chuck table 23 and the cutter 30. S is cut into individual packages P. As shown in FIG.

On the other hand, while the chuck table 23 aligns the strip S and cuts the strip S by mutual movement with the cutter 30, the strip picker head 221 of the strip / package picker 22 After moving to the on-loader side to adsorb the new strip brought into the system, it is moved back to the strip unloading position to maintain the standby state so that the new strip can be unloaded on the chuck plate 233.

Next, after the strip S is cut into the individual packages P in the cutter 30, the packages P are transferred back to their original positions by the chuck table 23 and are transferred to the package picker head 222. Unloaded by

Thereafter, the sawing process is terminated by the strip picker head 221 waiting at the unloading position by unloading a new strip into the chuck plate 233.

On the other hand, the conventional handler system after the sawing process as described above after moving the package (P) unloaded in the package picker head 222 to the cleaning device 40 and the dry device 50 in order to clean and To dry.

However, in the related art, only one chuck plate 233 is provided on the chuck table 23, and the individual packages P cut from the chuck plate 233 are unloaded by the package picker head 222. Afterwards, the newly loaded strip S adsorbed on the strip picker head 221 should be loaded onto the chuck plate 233.

That is, in the related art, in order to load the new strip S adsorbed by the strip picker head 221 onto the chuck plate 233, the chuck plate 233 must be empty, so that the loading of the new strip S is always performed. It is necessary to remove the package (P) placed on the chuck plate 233 in a separate state by the sawing operation previously.

Therefore, the sawing process in the handler system according to the prior art does not progress the loading of the package and the loading of the strip as the unloading of the package and the loading of the strip to the chuck table at the same time and proceeds sequentially. There was a problem of delayed time.

Therefore, the present invention has been proposed to solve the conventional problems as described above, and an object of the present invention is to improve the productivity by performing the loading of the strip and unloading of the package at the same time during the sawing operation for manufacturing a semiconductor package. The present invention provides a sawing apparatus for a semiconductor package manufacturing process and a control method thereof.

1 is a plan view of a handler system for cutting a semiconductor package device of the prior art.

FIG. 2 is a reference diagram illustrating a relationship between a strip / package picker and a chuck table in FIG. 1.

3 is a plan view showing a sawing apparatus for a semiconductor package manufacturing process according to the present invention.

4 is a perspective view illustrating the chuck table and the chuck plate of FIG. 3.

5 is a plan view of the strip / package picker of FIG.

FIG. 6 is a reference diagram illustrating a relationship between a strip picker head and a package picker head and two chuck plates in FIG. 3.

7 is a reference diagram showing a control method of a sawing apparatus for a semiconductor package manufacturing process according to the present invention.

Explanation of symbols on the main parts of the drawings

20: strip / package picker 23: chuck table

30: cutter 33: sawing blade

200: chuck table base 221: strip picker head

222: package picker head 233a, 233b: chuck plate

In order to achieve the above object, a sawing apparatus for a semiconductor package manufacturing process according to the spirit of the present invention includes a chuck table base, a chuck table installed on the chuck table base so as to be movable in a horizontal direction, and an upper portion of the chuck table. Two chuck plates rotatably mounted on the upper surface and alternately loaded with strips on the upper surface, cutting means for cutting the strips loaded on the chuck plates into individual packages by mutual movement with the chuck table, and on the chuck plates. Technical features of the present invention include a strip / package picker that simultaneously performs the loading operation of the strip and the unloading operation of the package.

In addition, the control method of the sawing device for a semiconductor package manufacturing process according to the technical idea of the present invention, in the control method of the sawing device for a semiconductor package manufacturing process provided with two chuck plates, one of the two chuck plate of the chuck plate A first step of loading a strip into the first step, a second step of aligning the strip loaded on the chuck plate, a third step of cutting the aligned strip into individual packages, and a chuck plate of the one side In the technical configuration characterized in that it comprises a fourth step of unloading the individual packages and at the same time loading the strip on the chuck plate of the other side.

Hereinafter, an embodiment according to the spirit of the present invention as described above will be described in detail with reference to the accompanying drawings.

Figure 3 is a plan view showing a sawing device for a semiconductor package manufacturing process according to the present invention, Figure 4 is a perspective view of the chuck table and the chuck plate of Figure 3, Figure 5 shows the strip / package picker of Figure 3 Top view.

As shown in the drawing, according to the present invention, the chuck table 23 is installed on the chuck table base 200 so as to be movable in a horizontal direction, and the strip is rotatably installed on the chuck table 23 and alternately disposed on an upper surface thereof. Two chuck plates 233a and 233b to which S) is loaded are provided.

To this end, as shown in FIG. 4, the chuck table 23 includes a base plate 231 and a servomotor 232 installed on the base plate 231. At this time, the base plate 231 is installed on the guide rail 142 installed in the chuck table base 200, the lower portion is screwed with the ball screw 141 is moved in the horizontal direction by the rotation of the ball screw 141. Done.

In addition, the chuck plates 233a and 233b are installed on the servo motor 232 and rotate according to the driving of the servomotor 232.

Here, the strips S are alternately loaded on the upper surfaces of the two chuck plates 233a and 233b. That is, the strip S to be cut is loaded alternately to the left chuck plate 233a and the right chuck plate 233b in the drawing.

To this end, while the strip / package picker 22 is rotated 180 °, the strips S may be alternately loaded on the upper surfaces of the two chuck plates 233a and 233b, but in the present invention, the chuck plates 233a and 233b are alternately loaded. Is rotated 180 ° so as to alternately load the strip S by the strip / package picker 22 and to unload the package P.

The strip S loaded as described above is adsorbed and fixed by the adsorption holes 235 formed in the chuck plate. In order to apply the suction force to the suction hole 235, the chuck table 23 is provided with air suction means (not shown).

On the other hand, in the present invention is provided with a cutter 30 for cutting the strip (S) loaded on the chuck plate into individual packages (P). The cutting machine 30 is movable in the front-rear direction on the drawing and the cutting motor 31 capable of moving up and down in the direction of the chuck plate, and mounted on the motor 31 to rotate the strips S as individual packages (P). It is comprised by the sawing blade 33 cut | disconnected by cutting.

However, the cutter 30 may perform a cutting operation using various forms, ie, laser or water.

By such a configuration, the cutter 30 cuts the strip S in the width direction and the length direction at predetermined intervals by mutual movement with the chuck table 23.

That is, the cutter 30 moves the strip S positioned on the chuck plate while cutting back and forth in a predetermined interval with the sawing blade 33 while moving forward and backward. The strip S is cut in the width direction and the length direction by rotating the strip S 90 degrees and the left and right directions.

Of course, unlike the present invention, the cutter 30 rotates only the sawing blade 33 while being fixed, while the chuck table 23 moves and rotates in the front, rear, left, and right directions, and the strip S in the width direction and the longitudinal direction. It can be configured to be cut into.

In addition, the present invention includes a strip / package picker 22 for simultaneously performing the loading operation of the strip (S) and the unloading of the package (P) on the chuck plates (233a, 233b).

As shown in FIG. 5, the strip / package picker 22 may include a strip picker head 221 for loading the strip S and a package picker for unloading the package P. A reciprocating head 222, a picker head lifting unit 223 for elevating the picker heads 221, 222, and a horizontal reciprocating movement of the picker heads 221, 223 along a guide rail 32; Although not shown, an adsorption part installed on the lower surfaces of the picker heads 221 and 222, respectively, and adsorbing the strips S and the package P, and a vacuum applying vacuum to the adsorption part. It is configured to include a port.

In this configuration, the strip picker head 221 is dedicated to loading the strip S to the chuck plate, and the package picker head 222 unloads the package P from the chuck plate. Do it exclusively.

As described above, the strip picker head 221 and the package picker head 222 are configured to perform the loading operation of the strip S and the unloading of the package P on the chuck plate, respectively. The head 221 is generated during the cutting of the strip (S) to be always kept clean without being affected by contaminants or cooling water on the package (P).

6 is a reference diagram illustrating a relationship between the strip picker head 221, the package picker head 222, and the two chuck plates 233a and 233b in FIG. 3.

As shown therein, the strip picker head 221 and the package picker head 222 of the present invention are simultaneously lowered in the direction of the chuck plates 233a and 233b on two chuck plates 233a and 233b. The package picker head 222 unloads the individual packages P adsorbed onto the chuck plate 233a on the left side of the drawing, and at the same time the strip picker head 221 is the chuck plate 233b on the right side of the drawing. The strip (S) is loaded on.

Referring to the accompanying drawings, a control method of a sawing device for a semiconductor package manufacturing process according to the present invention configured as described above is as follows.

7 is a reference diagram showing a control method of a sawing apparatus for a semiconductor package manufacturing process according to the present invention.

Here, the chuck plate 233b in which “o” is displayed and the chuck plate 233a in which “Δ” are displayed are the chuck plates on which the strip S to be loaded is loaded.

First, the control method of the sawing device for a semiconductor package manufacturing process of the present invention, in Figure 7a, one of the two chuck plates (233a, 233b) of the chuck plate of one side, that is, a strip on the chuck plate (233b) marked "o" (S) is loaded.

To this end, a strip picker head 221 (not shown) is waiting for the strip S loaded into the apparatus of the present invention to be adsorbed, and then the chuck plate 233b is removed by the chuck table 23. When moved horizontally to the lower portion of the head 221, the strip picker head 221 loads the strip S adsorbed while descending on the right chuck plate 233b.

Thereafter, in FIGS. 7B and 7C, the strip S loaded on the chuck plate 233b is aligned. To this end, the strip S loaded on the chuck plate 233b is moved horizontally to the cutting position and rotated twice in the counterclockwise direction to perform X and Y axis alignment. This X, Y-axis alignment is performed to cut the strip S loaded on the chuck plate 233b at the correct position.

Next, in FIGS. 7D and 7E, the aligned strips S are cut into individual packages P. Referring to FIG. That is, in FIG. 7D, the aligned strip S is cut in the width direction with a predetermined distance in the longitudinal direction, and then the strip S is rotated 90 ° clockwise in the drawing and the width in FIG. 7E. Cutting in the longitudinal direction with a predetermined interval in the direction.

Of course, as a modified embodiment of the present invention, as shown in the process 7e to 7e in Fig. 7b after performing both the X, Y axis alignment of the strip (S) in the width direction and the longitudinal direction of the cutting strip (S) Rather than performing the X axis alignment of the strip S (e.g., FIG. 7B), perform a longitudinal cut of the strip S (e.g., FIG. 7E) and then the strip S Rotate 90 degrees counterclockwise in the drawing to perform Y-axis alignment (eg, FIG. 7C), and then perform a widthwise cutting of the strip S (eg, 7d).

Meanwhile, for the cutting operation, the sawing blade 33 provided in the cutter 30 (not shown) is lowered in the direction of the strip S while rotating in the upper portion of the strip S, and the strip S is removed. The loaded chuck plate 233b is cut by the chuck table 23 in the width direction and the longitudinal direction by horizontally moving in the left and right directions in the drawing and rotating 90 ° in the clockwise direction.

At this time, the cutter 30 is moved at a predetermined interval with a time difference from the front to the rear in the drawing to cut the strip (S) having a predetermined interval in the vertical direction of the cutting direction.

On the other hand, when performing the cutting operation to spray the cooling water on the sawing blade 33 of the cutter 30 so that the heat generated during the cutting operation is cooled.

Here, the pieces generated during the cutting may be directed to a direction other than the direction of the chuck plate 233a of the other side where the strip S is not loaded.

That is, in FIGS. 7D and 7E, the chuck plate 233b in which the strip S is loaded is positioned on the left and upper sides of the chuck plate 233a in which the strip S is not loaded, and the strip ( The sawing blade 33 of the cutter 30 for cutting S) rotates clockwise when viewed from the rear to the front in the drawing so that the pieces generated during the cutting of the strip S go to the left in the drawing.

This cutting operation prevents pieces generated in the process of cutting the strip S into individual packages P to contaminate the chuck plate 233a in which the strip S is not loaded.

Of course, the present invention is operated in this way, the cooling water sprayed on the sawing blade 33 of the cutter 30, like the pieces generated in the cutting process, the strip (S) is not loaded chuck plate 233a Going in a direction other than the direction prevents the strip S from contaminating the unloaded chuck plate 233a.

Next, in FIG. 7F, the strip S is loaded onto the chuck plate 233a of the other side while the individual packages P are unloaded from the chuck plate 233b of the one side.

At this time, the chuck plate 233b of one side is rotated 180 ° from the position of the chuck plate of the first step.

To this end, first, the individual packages P cut in FIGS. 7D and 7E are rotated 90 ° counterclockwise in the drawing and then horizontally moved to the unloading position of the package P. FIG. Then, the cut individual packages P are positioned under the package picker head 222, and the empty chuck plate 233a not loaded with the strip is positioned under the strip picker head 221.

In this case, while the package picker head 222 and the strip picker head 221 are lowered at the same time, the package picker head 222 unloads individual packages P from the chuck plate 233b and simultaneously The strip picker head 221 loads the strip S onto the empty chuck plate 233a with a separate strip S adsorbed thereon.

When such a step is performed, the state of FIG. 7F 'is obtained, and the chuck plate loaded with the strip S in FIG. 7F', that is, the chuck plate 233a in which “Δ” is displayed is the strip S in FIGS. 7A to 7E. It becomes a chuck plate other than the chuck plate 233b loaded. Thus, the strips S are alternately loaded on the upper surfaces of the two chuck plates 233a and 233b of the present invention.

Meanwhile, the steps of FIG. 7G to 7K are repeated steps of FIG. 7F to FIG. 7F. However, the rotation direction of the strip S in the step of FIG. 7G to FIG. 7K is opposite to the rotation direction of the strip S in the step of FIG. 7B to FIG.

As described above, by rotating the strip S in the step S of FIG. 7K and the direction of the strip S in the step 7F of FIG. 7B, the rotation angle of the chuck plates 233a and 233b is maximized. It is limited to 180 degrees. This eliminates the need for a large rotation angle for rotation of the chuck plates 233a and 233b of the present invention.

On the other hand, when the strip (S) is loaded on the right chuck plate 233b in Figure 7k, the same as in Figure 7a, the present invention will be performed repeatedly in Figure 7a to Figure 7k.

Although the preferred embodiment of the present invention has been described above, the present invention may use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. Accordingly, the above description does not limit the scope of the invention as defined by the limitations of the following claims.

As described above, the sawing apparatus for a semiconductor package manufacturing process and a control method thereof according to the present invention includes two chuck plates so that the loading of the strip and the unloading of the package are simultaneously performed during the sawing operation for manufacturing the semiconductor package. There is an effect that can improve the productivity.

In addition, the present invention has the effect that the pieces generated during the cutting of the strip does not go in the direction of the chuck plate of the other side of the strip is not loaded so as not to contaminate the chuck plate of the other side.

Furthermore, the present invention can be used by limiting the rotation angle of the chuck plate to a maximum of 180 ° has the effect that a large rotation angle is not required for the rotation of the chuck plate.

Claims (9)

A chuck table base; A chuck table mounted on the chuck table base to be movable in a horizontal direction; Two chuck plates rotatably installed on the chuck table and alternately loaded with strips on an upper surface thereof; A cutter for cutting the strip loaded into the chuck plate into individual packages by mutual movement with the chuck table; And a strip / package picker configured to simultaneously load the strip and unload the package onto the chuck plate. The method of claim 1, And the chuck plate is rotated 180 ° so as to alternately load the strip by the strip / package picker and unload the package. The method according to claim 1 or 2, The strip / package picker may include a strip picker head which is dedicated to loading the strip, and a package picker head which is installed adjacent to the strip picker head and dedicated to unloading the package. Sawing device for semiconductor package manufacturing process. In the control method of a sawing device for a semiconductor package manufacturing process comprising two chuck plates, A first step of loading a strip into one of the two chuck plates; A second step of performing alignment of the strip loaded on the chuck plate; Cutting the aligned strips into individual packages; The semiconductor package manufacturing process comprising a fourth step of rotating the chuck plate of one side from the position of the chuck plate of the first step by unloading the individual packages and loading the strip on the other chuck plate at the same time Control method of the sawing device. The method of claim 4, wherein the second step, A method of controlling a sawing device for a semiconductor package manufacturing process comprising moving the strip loaded on the chuck plate horizontally to a cutting position and rotating X-Y axis while rotating it counterclockwise twice. The method of claim 5, wherein the third step, Cutting the aligned strip in the width direction with a predetermined distance in the longitudinal direction; And rotating the strip 90 ° in a clockwise direction and cutting the strip in a longitudinal direction with a predetermined interval in the width direction. The method of claim 6, The pieces generated during the cutting are to control the sawing device for a semiconductor package manufacturing process, characterized in that the strip is directed to a direction other than the direction of the chuck plate of the other side is not loaded. The method of claim 6, Sawing device for a semiconductor package manufacturing process characterized in that it further comprises the step of rotating the individual packages 90 ° counterclockwise after the third step and then horizontally moved to the unloading position of the package. Control method. The semiconductor according to any one of claims 4 to 8, wherein the second to fourth steps are repeatedly performed after the fourth step, and the rotation direction of the strip is reversed at each step. Control method of the sawing device for the package manufacturing process.