WO2008044840A3 - Machining apparatus and semiconductor strip machining system using the same - Google Patents

Machining apparatus and semiconductor strip machining system using the same Download PDF

Info

Publication number
WO2008044840A3
WO2008044840A3 PCT/KR2007/004871 KR2007004871W WO2008044840A3 WO 2008044840 A3 WO2008044840 A3 WO 2008044840A3 KR 2007004871 W KR2007004871 W KR 2007004871W WO 2008044840 A3 WO2008044840 A3 WO 2008044840A3
Authority
WO
WIPO (PCT)
Prior art keywords
machining
semiconductor strip
same
machining apparatus
axis direction
Prior art date
Application number
PCT/KR2007/004871
Other languages
French (fr)
Other versions
WO2008044840A2 (en
Inventor
Ik Kyun Na
Hyun Gyun Jung
Woong Hwan Youn
Original Assignee
Hanmi Semiconductor Co Ltd
Ik Kyun Na
Hyun Gyun Jung
Woong Hwan Youn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060098091A external-priority patent/KR20080032413A/en
Priority claimed from KR1020060128282A external-priority patent/KR100814890B1/en
Application filed by Hanmi Semiconductor Co Ltd, Ik Kyun Na, Hyun Gyun Jung, Woong Hwan Youn filed Critical Hanmi Semiconductor Co Ltd
Priority to JP2009532285A priority Critical patent/JP5502483B2/en
Priority to CN2007800378225A priority patent/CN101523556B/en
Publication of WO2008044840A2 publication Critical patent/WO2008044840A2/en
Publication of WO2008044840A3 publication Critical patent/WO2008044840A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/30—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor to form contours, i.e. curved surfaces, irrespective of the method of working used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A machining apparatus and a semiconductor strip machining system are disclosed. The machining apparatus includes a chuck table unit (302) including a pair of chuck tables (304) simultaneously movable in an X-axis direction while being individually movable in Y-axis direction, and a cutting unit (320) for machining articles respectively seated on the chuck tables (304).
PCT/KR2007/004871 2006-10-09 2007-10-05 Machining apparatus and semiconductor strip machining system using the same WO2008044840A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009532285A JP5502483B2 (en) 2006-10-09 2007-10-05 Processing apparatus and semiconductor strip processing system
CN2007800378225A CN101523556B (en) 2006-10-09 2007-10-05 Machining apparatus and semiconductor strip machining system using the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2006-0098091 2006-10-09
KR1020060098091A KR20080032413A (en) 2006-10-09 2006-10-09 A manufacturing device for semiconductor
KR1020060128282A KR100814890B1 (en) 2006-12-15 2006-12-15 A manufacturing device and a system for manufacturing the semiconductor strip thereof
KR10-2006-0128282 2006-12-15

Publications (2)

Publication Number Publication Date
WO2008044840A2 WO2008044840A2 (en) 2008-04-17
WO2008044840A3 true WO2008044840A3 (en) 2008-07-24

Family

ID=39283280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2007/004871 WO2008044840A2 (en) 2006-10-09 2007-10-05 Machining apparatus and semiconductor strip machining system using the same

Country Status (3)

Country Link
JP (1) JP5502483B2 (en)
TW (1) TWI364087B (en)
WO (1) WO2008044840A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5457660B2 (en) * 2008-11-07 2014-04-02 アピックヤマダ株式会社 Cutting method and cutting apparatus
JP5420226B2 (en) * 2008-11-07 2014-02-19 アピックヤマダ株式会社 Cutting device
JP5298157B2 (en) * 2011-04-21 2013-09-25 西進商事株式会社 Laser processing apparatus, laser processing method and laser processed product
KR101635113B1 (en) * 2014-11-20 2016-06-30 서우테크놀로지 주식회사 Semiconductor strip grinder
JP6388547B2 (en) * 2015-01-26 2018-09-12 株式会社ディスコ Cutting equipment
KR101757150B1 (en) * 2016-07-07 2017-07-12 주식회사 영진하이텍 SSD router cutting path correction system
KR101945039B1 (en) * 2017-07-11 2019-02-01 주식회사 영진하이텍 SSD router cutting path correction system with dust removing function and correction method thereof
JP7300846B2 (en) * 2019-02-19 2023-06-30 株式会社ディスコ Cutting equipment and semiconductor package manufacturing method
KR102027238B1 (en) * 2019-03-14 2019-11-04 인세미텍 주식회사 Aparatus of grinding for manufacturing division printed circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164304A (en) * 2000-11-22 2002-06-07 Nec Machinery Corp Substrate-cutting apparatus
KR20040085280A (en) * 2003-03-31 2004-10-08 한미반도체 주식회사 A sawing apparatus and a control method for manufacturing processes of semiconductor package
KR20040087524A (en) * 2003-04-08 2004-10-14 한미반도체 주식회사 Apparatus for Sawing Semiconductor Strip and Apparatus for Singulation of Semiconductor Package Having the Same
WO2006025622A1 (en) * 2004-08-31 2006-03-09 Hanmi Semiconductor Co., Ltd. A sawing apparatus and a control method for manufacturing processes of semiconductor package

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384949A (en) * 1989-08-29 1991-04-10 Nitto Denko Corp Pasting of adhesive tape on wafer
JP3930087B2 (en) * 1996-01-12 2007-06-13 株式会社東芝 Lid mounting apparatus and solid-state imaging device manufacturing method
JP3388697B2 (en) * 1996-10-31 2003-03-24 株式会社日平トヤマ Laser processing equipment
JP2001340986A (en) * 2000-05-31 2001-12-11 Nippei Toyama Corp Laser processing system and laser processing method
JP3898624B2 (en) * 2002-11-08 2007-03-28 株式会社日平トヤマ Laser processing machine work transfer device
JP4315788B2 (en) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 Semiconductor device manufacturing method and manufacturing apparatus
JP4527559B2 (en) * 2005-01-31 2010-08-18 株式会社ディスコ Exposure equipment
JP4676288B2 (en) * 2005-09-14 2011-04-27 株式会社ディスコ Cutting equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164304A (en) * 2000-11-22 2002-06-07 Nec Machinery Corp Substrate-cutting apparatus
KR20040085280A (en) * 2003-03-31 2004-10-08 한미반도체 주식회사 A sawing apparatus and a control method for manufacturing processes of semiconductor package
KR20040087524A (en) * 2003-04-08 2004-10-14 한미반도체 주식회사 Apparatus for Sawing Semiconductor Strip and Apparatus for Singulation of Semiconductor Package Having the Same
WO2006025622A1 (en) * 2004-08-31 2006-03-09 Hanmi Semiconductor Co., Ltd. A sawing apparatus and a control method for manufacturing processes of semiconductor package

Also Published As

Publication number Publication date
TW200822265A (en) 2008-05-16
JP2010506422A (en) 2010-02-25
WO2008044840A2 (en) 2008-04-17
TWI364087B (en) 2012-05-11
JP5502483B2 (en) 2014-05-28

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