TWI364087B - Machining apparatus and semiconductor strip machining system using the same - Google Patents

Description

1364087 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a semiconductor processing apparatus, and more particularly to a processing apparatus for cutting a semiconductor strip into a semiconductor package in a semiconductor dicing process and using the same. Semiconductor strip processing system for equipment. [Prior Art] In general, semiconductor processing includes processing (assembly) processing and assembly processing. In the processing of the towel, the threat---the crystal is superimposed on the integrated circuit, and the semiconductor wafer is formed by mistake. In the assembly process, a - lead _ is attached to the semiconductor wafer. In the case of shouting, the implementation of the transfer or soldering process and the modeling process 'by forming a semi-introduction, in which the transfer process or soldering is performed to form a solder ball, thereby using the semiconductor wafer and the lead frame For electrical connection, the molding process uses a resin material such as an epoxy resin. The semiconductor strip-through surface is picked up and then cut by a rotating blade into a separate semiconductor package. In order to perform the above processing, a semiconductor processing apparatus is provided. However, the practice of __ is still a bribe, and the system is a problem. #卜 , -. S- In the conventional semiconductor tape processing system, the cutting device contains only one blade. For this reason, in addition to cutting the semiconductor strip along a straight line, the ha L is followed by a + conductor. For this reason, f 1364087 different operating conditions. Further, in the prior art, when the semiconductor tape is not cut at the desired position on the chuck table and is cut by the cutting device, the residue may be generated because there is no automatic correction of the tape offset. • [Description of the Invention] "# 于的_, the present invention - the purpose of providing - a processing design and? The semi-conducting fresh-processing H of the processing equipment has the cutting device that can be cut and processed. ^---------------- Another object of the present invention is to provide a processing apparatus and a semiconductor tape processing secret using the processing, the processing equipment can be on the stage The position of the semiconductor τ is detected. The position of the check is adjusted to correct the position of the cut. In one aspect of the invention, a processing apparatus includes: a chuck table unit, the chuck table unit includes a pair of chuck tables, and the pair of chuck tables can be single in the γ-axis direction .: Move alone and move in the X-axis direction at the same time; and a cutting unit for processing the repairs fixed on the ¥ platform. In the aspect of the invention, the processing equipment comprises: a "clip table unit", the money unit comprises a four-dip table, which can be moved separately in the gamma direction and moved in the X-axis direction; And two cutting units are used to: add to the workpieces fixed on the first and third tray tables or the second and fourth chuck tables: 1364087 The processing equipment can further include: - sensing unit The sensing unit is configured to take the position of each workpiece and transmit the information to the associated cutting list it. The sensing system includes a video capture device (visicm) for obtaining information indicating the position of each workpiece. The 'and-video acquirer track is used to move the viewfinder along the way. The above chuck table S may include: a chuck table 'for a branch semiconductor strip, a first-feed member, a feed platform in the X-axis direction, and a second feed member for the γ-axis direction In the upper feeding chuck table, each chuck table can be rotated 360 degrees. The above-mentioned flaming table unit may also include: a chuck table for supporting the semiconductor strip, a vertical drive 'for vertically moving the chuck table, and a horizontal driver for leveling the chuck table Move on the ground. In another aspect of the invention, a semiconductor tape processing system includes: a load. P ' is used to identify the conductor strips by Wei complex number; the butterfly system includes the above-mentioned processing equipment 'unloading section' side to receive the generated semiconductor package after processing the semiconductor strip is completed; The semiconductor tape or semi-conductive package is picked up and fed to the loading portion, the cutting portion or the unloading portion. In another aspect of the invention, a semiconductor tape processing system includes: a first loading portion that receives a plurality of semiconductor strips; - a social force. a first cutting portion of the equipment; a first unloading portion for receiving the semiconductor tape after the processing in the cutting portion is completed; a feeding portion for picking up the semiconductor tape and feeding it to the first loading portion, a cutting portion, or a second loading portion of the semiconductor unloading portion unloading the first unloading portion for receiving the rotating portion from the semiconductor strip, the second portion is included in the semiconductor device, and is placed thereon as a semiconductor wafer. Yu Jia: L# conductor strip makes it a +-conductor package, whether a semiconductor package is detected as defective or not. == Cut-to-cut, the unloading part is used to receive the second unloading part after the detection and measurement. Clear 4 things. Qing 帛 unloading key ===_ tender for succession. The second cut 丄阿进-step includes a sensing unit for obtaining information on the position on the _semiconductor_disk. The first butterfly portion receives information from the sensor early, and the cutting portion of the 鄕-cutting portion calibrates the processing position of the semiconductor ribbon. The second cutting portion may include: a rotating table on which the semiconductor strip is placed, and the rotating table is movable in the γ-axis direction while rotating; and the - blade' is rotatable around the rotating table Move on. In still another aspect of the present invention, a semiconductor tape fastening system includes: a loading portion for receiving a plurality of semiconductor tapes; the above processing device; a cleaning and drying system for cleaning the New Semiconductor tape A semiconductor package produced after the addition of the domain; a detection unit for detecting the presence or absence of defects in the semiconductor package after cleaning and drying; - the unloading portion is used for receiving the semiconductor package for inspection and reading. ' is used to pick up a semiconductor tape or semiconductor package and feed the picked semiconductor tape or semiconductor to the loading unit, processing equipment, cleaning/money, inspection or unloading. The load carrying portion may include: - a loading cassette for stacking the semiconductor strips; - a transfer device for transporting the loading cassette; - a first steering lane for rotating the semiconductor strip fed through the transport device; and - a pusher Used to feed the half of the stack in the load box to the first-to-steer way. The unloading portion may include: - a second steering two for Wei and rotating the semiconductor strip that is cut and fed through the feeding portion. = Carrier - 'Secret stacking through the cut semiconductor strip; - Transfer 妓, using two pass 迗a p-cartridge; and a holder for conveying the _, over-cut semi-guided belt to the unloading box. BACKGROUND OF THE INVENTION Hereinafter, preferred embodiments of the additive belt processing system of the present invention will be described in detail with reference to the drawings. X + map The first embodiment of the semiconductor tape processing system is to receive (4) processed red parts, and is loaded with _ (8), the system part - loading the second material: the workpiece is on the second load ... - outside the cutting table ;-Saki m processing κ coffee processing system flat cutting part and unloading part 400. M Feeds the loaded workpiece to the loading unit _, 1364087 The loading unit 100 includes a plurality of loading cassettes 102. In each of the loading boxes 1 to 2, a plurality of swivel belts which are processed in accordance with the form of the cassettes are required. Of course, only one semiconductor strip SS can be placed in each of the loading cassettes 102. The loading unit 100 includes a first conveying device 104 ′ for feeding the loading box 102 one by one. The first conveying device 1-4 can apply various driving systems. In a preferred situation, the first conveying device can Apply a belt drive system.

A loader 1〇5 is disposed at one end of the first transfer shock 104. The loader contains - a propeller. The pusher chamber is configured to move the semiconductor strips placed in the loading cassette (10) sent through the first conveying device 1G4 one by one by pushing the semiconductor strips at one end, and to place the semiconductor strips ss one by one. On the first steering track 112, the first steering track 112 will be described in detail below. The loader 105 also includes a first drop _ no. The first-disarming device 110 is disposed at the end of the loading case 102 so as to be opposed to the above-described pusher 1〇6. Therefore, when the propeller 106 advances one side of the semiconductor strip ss toward the first steering track 112, the first side is obtained and learned, and the other side of the ss is capable of greenly feeding the semiconductor strip SS. The loader 105 also includes a first steering lane 112. The first steering lane (1) is disposed in a moving path between the thruster 1G6 and the first-disarming device 11G. The first steering track m includes a pair of steerable degrees. On the first steering track (1), the material _ ss can be placed and turned like a turn, and the moving direction of the casting scale % is changed. 1364087 The feeding portion 200 is disposed so as to be orthogonal to the seismic loading portion 1A. The feeding portion 2 is used to feed the semiconductor tape SS from the loading portion 1 to the unloading portion shed. The feed portion includes a feed track 2〇2. The first picker continent and the second picker 206 are disposed on the feed track 2〇2 such that they can be moved along the feed lane 2〇2. * In order to change the direction of the semiconductor in the m-shaped state on the first-turn* ruling η2, the first picker 204 and the second pick-up! | 206 is rotatable. Preferably, the first pick H 204 is disposed on the feed track 202 adjacent to the loading portion 1〇〇. In this case, the first pickup 2〇4 can easily pick up a semiconductor tape ss and feed the semiconductor tape ss to the clock stage 3() 4, which will be described later. Preferably, the second pick H 206 is disposed on the feed track 202 adjacent to the unloading portion 400. In this case, the second pick-up 2 〇 6 can easily pick up a _ semiconductor strip SS and feed the semiconductor strip ss to the unloading portion 4 〇〇. A cutting portion 3 for processing the semiconductor y SS is disposed below the core portion of the feed track 2. \ , 卞 割 · 〇 〇 〇 〇 〇 〇 〇 〇 系 〇 系 系 系 系 系 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹 夹One or more semiconductor strips to be processed are placed on the face of the chuck. The cutting portion is further provided with a single 疋 320. It is used for a semiconductor on the semiconductor strip SS to a semiconductor or u half ^ tSS - a straight line or a track-strip semiconductor strip ♦ - · ' · . 12 J〇4〇87 Into the lamp processing. The cutting unit 320 is capable of correcting the position of its own x-axis, Y-axis, and corner. The cutting-in step-by-step unit 33 is used to obtain the position information obtained by subtracting the amount of the semiconductor tape ss to be processed from the transmitting side to the cutting unit 320' to correct the processing position of the cutting unit 32G. * According to the above configuration, the cutting portion constitutes a semiconductor package processing apparatus. - It is true that the semiconductor sealing and reading can be used as a workpiece-adding device instead of a processing device of the semiconductor strip SS. For example, the semiconductor package processing apparatus can be used to form a certain mark on a workpiece. As shown in "Fig. 1", the stencil table unit 302 includes a chuck table 3〇4, and each of the slab stations 304 is sagged under the semiconductor sss, and a chuck table feed The device 310 is used to feed the chuck table 3〇4. When performing the machining operation through the cutting unit 32, each of the chuck stages 3〇4 is used to support it under a semiconductor tape SS. The machining operations performed on the cutting unit 32丨 are detailed below. Those skilled in the art will appreciate that the chuck table 3〇4 can have any configuration.

- a chuck table feeder 31 (M system includes: a first feeding member 312 for feeding the chuck table 3 in the X-axis direction; and a second feeding member 314 for feeding in the ¥ axis direction The chuck table 304. The second feeding member 314 is disposed to be orthogonal to the feeding lane 2〇2. The second feeding member 314 is for feeding the center disk table 3〇4 in the γ-axis direction, and as long as the member is movable The chuck table 304' may have any configuration. The second feed member 314 may comprise a number of feed members in a flat configuration. In the present embodiment, the second feed member is adapted to include four feed members. , that is, the fresh feed member, the second feed member 314b, the second feed member 314e, and the second feed member, the second feed member 314, in which the second feed member 314 is configurable The screws and the bolts so that all of the feed members constituting the second feed member 314 are configurable. The first feed member 312 is orthogonal to the second feed member 314. The first feed member is operative to feed the second in the X-axis direction The feedback component is called. Through the first feed member 312 ' Each of the feeding members of the second feeding member 3M can be simultaneously moved. The cutting unit 320 is disposed on one side of the second feeding member 314 and located above the second feeding member 3M. The cutting unit 32 is used for the semiconductor located above The processing is performed with ss. σ υ4 In terms of the cutting unit 320., various cutting devices can be applied. In the embodiment shown in the "Fig.", the cutting unit 32q includes -Na skin setting. For example, the cutting unit may comprise a knife. The laser cutting device comprises: a head mounted on the tip of the laser cutter (not shown in the drawing). The head is disposed to be transparently included The controller of the laser cutting device moves under the condition that the χΙ γ axis and the Μ position of the head are controlled. The _ _ is processed by the semi-band SS in the "9th picture". It can be cut along the line and straight line as shown in the "No." to "Twelfth" figure. Of course, the laser cut can be used to cut the semiconductor (4) into 1364087 to make it a separate semiconductor package sp. Various cutting devices can be used for the above operations. Moreover, the cutting unit 320 shown in the "figure map" includes two cutting units, that is, a first cutting unit, and a second cutting unit 320b. Setting the first--unit and the second unit Above the member 3U. As shown in the "Graphic!" diagram, the first cutting unit gamma and the second brother cutting unit 320b are placed on the second ninth member coffee tray No. 4, and the feeding member is over. It is true that the first __ unit and the second dicing table 320b may also be respectively disposed on the second feeding member coffee and the third feeding member 314c. The first feeding member 314 is disposed on the side of the second feeding member 314. The sensing unit 330 includes a video acquirer 332 for detecting the position of the semiconductor strip SS mounted on the chuck table, wherein the chuck port 3〇4 The first feed members are connected. The video acquirer states and controls the information to the controller of the laser cutting device (not shown in the drawing) to adjust the head of the laser cutting device in the direction of beam emission. A waste box 350 is disposed at a position where the cutting unit 320 is below the cutting portion. Through the gravity of the waste, the waste box 35 is used as a discharge passage for the waste during the processing operation. In the first, a video capturer track 334 is disposed above the feed member 314. The video 15 15/acquisition track 334 is orthogonal to the second feed member 3H. and parallel to the first feed member 312. And ' video acquirer 332 can move along video viewer track 334. An unloading portion gamma is provided on the opposite end of the feeding portion 2A from the loading portion 1A. The load contains a plurality of #载箱402. The processed semiconductor f SS is placed in each of the cassettes 4〇2. Of course, only one semiconductor ribbon % can be placed in each of the unloading boxes 4〇2. The unloading portion 400 further includes a second conveying device 4〇4 for feeding each of the seven boxes one by one, the second conveying device tearing can apply various driving systems, preferably, the first conveying device 4G4 is applicable-belt type Drive System. An unloader is disposed at one end of the second transmitting device. The unloader includes a to-steer track 412 disposed below the second picker moving track. The first steering handle 412 includes a pair of tracks that can be rotated 36 degrees. The second turn 'the semiconductor tape % can be placed on the trajectory 412, and the semiconductor tape SS is rotated to change its moving direction. The registration unloader 410 further includes a second holder 414. The second holder 4] 4 丨 · one end of the conductor strip ss is picked up, and fed 1 to one of the unloading boxes 4 〇 2 of the unloader 41 。. The purpose of the eight-way configuration is to remove the independent semiconductor package and feed the single-conductor package scale carrier when the semiconductor tape is used as an independent semiconductor package. The method of semiconductor ring processing according to the first preferred embodiment of the present invention is described in detail below. ', ^〇4U87 as shown in "Figure 2", when installed in the unloading box 4 () 2

In the case of SS, the first 楷, ., 壮 冰 卞 卞 菔 T transport device transmits the unloading box 402 to the propeller 1 〇 6. When the unloading box 402 coincides with the direction of movement of the pusher 1〇6, the propeller moves to start operation. As the pusher 1〇6 runs, the semiconductor strip is fed to the steering track 112. When the semiconductor device SS moves to the first steering lane 112, the first missing device n〇u picks up one end of the semiconductor strip SS opposite to the pusher 106, and advances the semiconductor strip to the first steering lane 112. SS. Thereby, the semiconductor tape SS is mounted on the first-steering track 112 by the cooperation of the pusher 1G6 and the first gripper 110. After the semiconductor strip ss is mounted on the first steering lane 112, the first steering track 112 rotates the conductor strip ss to align it with the chuck 纟3〇4 device, as shown in "Fig. 3" . This causes the semiconductor strip ss to be mounted on a chuck table. When the first steering track 112 is rotated, the first picker 2〇4 is placed along the feed to the semiconductor strip ss on a chuck table 304. Subsequently: the first picker 204 mounts the tantalum ribbon SS over the chuck table 3〇4, wherein the 'spindle stage 304 is located above the first feed member 3i4b or the fourth feed member 3414d. Then, the first picker 204 mounts the other semi-conducting band ss on the chuck table 304 in the same manner. Of course, the first picker 2 〇 4 mounts the semiconductor tape on the chuck table 304 on the first feed member 314a or the second feed member 314c. When the first picker 2〇4 mounts the semiconductor strip ss on the chuck table 304 coupled with the 17 1364087 first feed member 314b and the fourth feed member 314d, respectively, the chuck chamber 304 is along the second The associated feed feed member of the feed member 314 moves along the Y axis. While the chuck table 304 is moved along the second feed member 314 in the γ-axis direction, both pass through the sensing unit 330. At this time, the video acquirer 332 of the sensing unit 330 acquires information on the position where the semiconductor τρ* SS is located on each of the sewing sheets, and sends the information to the controller of the cutting unit 320. The position information is acquired by the video acquirer 332 of the sensing unit 33 detecting the position of a specific mark at a position on the semiconductor π S . Based on the above position information ', the position of the body with the SS can be swiveled. After receiving the above information, the controller calibrates the position of the head of the cutting unit 320 based on the information. In this case, as shown in "Fig. 4", the first cutting unit constituting the cutting table The η plus and the second cutting unit are respectively singularly identical; the first feeding member 3 丨 and the fourth feeding member 3 are, for example, transmitted, and the second feeding member 314b is The position of the second feeding member No. 4 and the semiconductor tape is detected. Meanwhile, as shown in "Thinking FIG. 5", when the semiconductor tape SS located above the second feeding member 314b and the second feeding member 31 is processed, the first feeding member 314a is numbered. A semiconductive body band SS is mounted over the third feed member 3Mc. " Thereafter, as shown in the "figure 6", the area under the first and second feeding members 314a and 314c of the third feeding member 314c is opposite to the video receiver of the sensing unit 33. motion. Thus, the 'video acquirer' detects that the second child carrying member 3Ua and the third feeding member No. 3 are placed on the chuck table 3〇4 and the position f′ of the semiconductor f SS is shocked so that the bit of the cutting unit is f Perform calibration. When the processing of the semiconductor strip ss on the upper second port member 314b and the fourth number second feed member 314d on the upper plate opening 3〇4 is completed, all of the second feeding members 314 are formed through the first feeding member 3i2. The feeding member moves in the direction of the x-axis. This causes the chuck table 304 of the squirrel 314a and the three-wire two-feeder to be placed under the first cutting unit and the second cutting unit 320b constituting the cutting unit 32(), respectively. Thus, the cutting of the semiconductor strip ss on the chuck table 3〇4 can be completed. After the cutting of the semiconductor ▼ SS is completed, the chuck table is returned to its original position by the chuck table feeder. After the Tianwang Department chuck 纟 304 was returned to its original position. The second picker 2 〇 then the second picker 206 picks up the semiconductor strip SS and mounts the picked semiconductor strip % on the first steering lane. As shown in Fig. 8, in order to pick up the semiconductor strip ss through the second pickup, the second steering track 412 is in a state of being parallel with the central table 304. When the semiconductor strip SS is mounted on the second steering track 412, the second gripper 414 picks up the semiconductor strip: SS and moves one side of the unloading box 402 of the unloaded 1364084 of the picked-up semiconductor strip . When the semiconductor strip % is mounted on the unloading unit 402, the second transfer device causes the transmitter to transfer the semiconductor (four) to the lower portion; At this point, the processing is complete. It is true that when the semiconductor strip ss is processed in the cutting section, the conductor package is shaped, and the unloading (10) can be performed in the semi-material certificate of the semiconductor. The second embodiment of the present semiconductor tape processing system will be described below. For example, the "figure u" shows that the word "word" is used to: receive the plurality of conductor strips ss, and - the first butterfly. The first incision portion 3000 includes a chuck table unit 3002 including a chuck table 3〇04 on which the semiconductor strips % are mounted one by one. The chuck table 3004 is movable in the X-axis and γ-face directions. The first cutting portion further includes a ^-the first cutting device for processing the curved line and the straight portion of the semiconductor strip ss on the chuck table 4. The semiconductor tape processing system further includes: a first unloading scale; a semiconductor processed in the S. The SS and the first feeding portion 2000 are used to take the semiconductor strip ss' one by one and feed the picked semiconductor one by one The belt is SS to the first cutting portion .3_ or the first unloading portion 4000. The semiconductor tape processing system further includes a second loading portion _ for use from the first _. The new job (four) is cast to ss. ―Second cutting portion 32 〇 0 ' The first cutting portion 32 〇〇 includes a rotating table 26, and the semiconductor strip ss will be mounted on the rotating table 3226 one by one, the rotating table 3226 being at 20 X In the direction of the axis, the county '··: the second step is 'small' can move in the x-axis direction to align the semiconductor strips one by one to make them into independent semiconductor packages SP; one test n, make a second cut _ 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工4_ and the second loading part of the Congzhi to send the semiconductor strip SS. The first cake 1_于··魏(四)__盒臓. A plurality of semiconductor strips ss can be placed in each of the first-loading cartridges. Of course, a semiconductor strip SS can only be placed in a first load box 1〇〇2. The first loading surface further includes: a first conveyor brain for feeding the first mounting bladder one by one. A variety of drive systems can be used for the first conveyor face. Preferably, the first conveyor - uses a belt drive system.

The first loader 1005 is disposed at one end of the first conveyor. The first loader package j: the pusher is used to move the semiconductor placed in the first loading box 1002 of the first pusher 1006 one by one by moving one side of each semiconductor strip SS one by one The strip ss is used to mount the semiconductor strips SS one by one on the first turning track 1008. • The first loader 1005 also includes a first gripper 1〇1〇. The first gripper 1010· is disposed opposite the first pusher 1006. Therefore, when the first pusher 1〇〇6 advances one side of the semiconductor strip §8 toward the first steering lane 1008, the first clamping 21 causes the semiconductor ribbon 1010 to pick up and pull the semiconductor strip ss. The other side of the SS is easy to feed. 7 is the first - advancement please - the movement of the strip - the steering track round package s: a pair of rotatable fresh. The township-steering surface can be placed with + conductor strip SS ’ and the material can be guided to ss _, and the money moves the semiconductor strip SS in other directions. The first feeding portion 2000 is disposed orthogonal to the first loading portion 1000. The first feeding portion 2000 is for feeding the semiconductor tape ss one by one from the first loading portion to the first cutting portion 3000 or the first unloading portion 4000. The first feeding portion 2000 includes: a first feeding track 2〇〇2, a first picker 2〇〇4' the picker is disposed at the end of the first feeding track, so that the picker can be along the first The feed track 2002 moves. Specifically, the first picker 2004 may be disposed above the first feed rail 2〇〇2 adjacent to the first load carrying portion 1〇〇〇. The first picker 2004 picks up a pair of semiconductor strips SS and feeds them to the chuck table 3〇〇4, which is described in detail later. The second picker 2006 may be disposed above the first feed lane 2002. The second picker 2006 picks up the pre-cut semiconductor strip SS one by one and feeds the picked semiconductor strip SS to the first load-bearing portion 4000. The first cutting portion 3000 is disposed opposite the central portion of the first feed track 2002 by 22 1364087. The first cutting portion 3 encloses a spot cutting device. And the cutting portion 3 (8) of the first cutting portion 3000 has the same configuration. Therefore, the constituent elements of the first cutting portion _ can be referred to the "i-th image" and will not be described again.

...but the first-cut portion 3_ is used to cut the semiconductor strip % along a straight line and a curve. That is, the first cutting portion 3_ should cut the portion of the mother-semiconductor strip ss that is difficult to process along a straight line and a curve, instead of completely cutting the semiconductor strip as shown in the "figure" . The first unloading portion 4_ is disposed on the side opposite to the first loading portion on the first-feeding guide. The first unloading _4_ plural repents carrying boxes. In each of the unloading boxes 4002, a plurality of pre-cut semi-conducting tapes ss are placed. Although, a semiconductor strip SS can only be placed in one unloading box 4〇〇2. - The first field portion 4_ further comprises: - a second conveyor 4" for feeding the unloading cassettes one by one. The second conveyor can take care of various drive systems. Preferably, the second conveyor can apply a belt drive system. The first unloader 401 is disposed at the end of the first unloading unit 4〇〇〇. The first carrier 4010 includes a second steering lane 4〇12, and the track is disposed below the moving path of the second picker 2006. The second steering track 4〇12 includes a 360 degree rotation: “The semiconductor track can be placed on the second steering track 4012, and the semiconductor tape SS. can be rotated” to change the semiconductor tape ss. The moving direction first unloader 4010 includes a second holder 4014. The second detentor 23 1364087 4014 picks up the semiconductor strip ss on the second steering track 4〇12 and mounts the picked semiconductor strip SS in the unloading box 4002. The take-up conveyor 32〇2 is disposed between the first unloading unit 4_ and the second splitting unit 3. The conveyor 32〇2 conveys the pre-cut =. semiconductor strip SS to the second cutting portion 3200 from the first cutting portion 3_. The second loading portion 3 is disposed at one end of the conveyor. 3204 includes: a plurality of second load boxes. In each second box. , a plurality of pre-cut semiconductor strips ss are placed. Of course, a semiconductor strip % can only be placed in a second loading box 3206. The second portion further includes: - a third conveyor 32G8, the side feeding the second loading cassette 3 one by one. The third conveyor 3 can be applied to various drive systems. Preferably, the third conveyor 3208 can apply a belt drive system. The f-loader 32G4 includes: - a second loader 3 class. The second loader includes: a second pusher pass. The second pusher 321 is configured to move the third transfer device 3 to the second pusher box 32〇6 of the second pusher. βίο by the pusher semi-conductor: the body belt SS. The semiconductor strip is placed so that the semiconductor strip SS is mounted one by one on a lead-in track 3218. The above-mentioned introduction track 321:8 contains a pair of tracks. The lead-in rail is for temporarily storing a semiconductor strip ss on the moving track of the third pick-up so that the third pick-up 3216 conveniently picks up the semiconductor strip ss. 3320. The holder 332 〇 the second loader 32 〇 9 further includes a third holder 24 丄 / έ and is placed in contact with the second pusher 321 . Therefore, when the second pusher 3210 advances one side of the semiconductor charge (four) ramp to the lead-in rail 3218, the third holder 3320 picks up and advances the other side of the semiconductor strip SS. The second feeding portion 3212 is provided in parallel with the second shovel loading portion 3204. The second feeding portion 3212 includes a second feeding track 3 ... 214. The third picker 3216 is disposed above the second feed ^ so as to be movable along the second feed track 3214. The third pickup picks up the semiconductor tape SS one by one and feeds the semiconductor tape SS to the rotary table 3226 which will be described later. The second cutting portion 3200 is disposed at a central portion of the second reading portion. And the first feed 4 3212 is disposed below the second cutting portion 32A. The second cutting portion side includes, in addition to the turntable, a blade unit. The blade unit 32 is equipped with a blade on its face to cut each of the semiconductor strips SS. The column unit 3224 can include a pair of blade subunits. The semiconductor strip SS is processed into a semiconductor package SP by cutting the semiconductor strip .ss into a zero size piece. The rotating table is disposed on one side of the second cutting portion 3200. The rotary table 3226 is rotatable through a motor. - The chuck table can be set above the rotary table. The chuck table 3230 is for cutting the semiconductor strip ss at the blade unit 3224. During operation, it is clamped and burded under the semi-guide strip SS. As will be appreciated by those skilled in the art, the chuck table 323 can have any configuration. . . . 25 1364087 A waste bin (not shown in the drawings) may be disposed at the second cutting portion to remove the waste material generated during the process of sputtering the feed conductor. Instead of the air nozzle (not shown in the drawings), the air nozzle can be disposed on the side of the second cutting portion so as to be purchased in a certain direction. The fourth picker is disposed on the side of the second feeding portion 3212, so that the crane can be carried along the second ship inspection 3214. For the purpose of welcoming the feed position on the rotating table (four) cut the cast scale to the second domain touch. The cleaning/drying device 3234 is disposed on the fourth picker to welcome the sports road. The clear/dry basket is cleaned and dried for storage in the semiconductor package of the processing and cutting section 3200. Brother-cutting, unloading, and unloading the four sides of the containing-drying zone (dylngbl°ek) seam, which is used to dry the bottom layer of the semiconductor package sp. Performing the detection of the gripper in the detector · 5020 ^ 乂, 干燥 The drying zone can completely remove the moisture remaining on the semiconductor package sp after cleaning the 117 dryer eight-order cleaning operation - the unloading 4 5000 contains: a third Feed the orbital mine. A fifth picker ^Jingqing Sancha W and side line movement. The ^ 15 5〇06甩 is placed on the semiconductor package filling zone 5〇08 which is completely dried in the drying zone .5002. The filling area 5_ temporarily holds the thousand-package SP before the detection. , 26 1364087 The loading area 5008 is disposed below the moving path of the fifth picker 5〇〇6 and at one end of the path. The loading area 5008 is disposed above the filling area feeding lane 5010 orthogonal to the third feeding track 5〇〇4, and is movable along the loading area feeding lane 5〇1〇. The sixth pick 5012 is disposed at one end of the third feed track, and the sixth picker 5012 is configured to feed the semiconductor package package detected by the detector 5〇2〇 to the receiver 5022, which will be performed on the receiver 5〇22 description. The second unloading portion 5000 further includes a semiconductor package feeding portion 5〇14 that is parallel to the third feeding lane 5〇〇4 and orthogonal to the loading region feeding rail 5010. The semiconductor package feed portion 5A 14 includes a semiconductor package feed path 5016, and a semiconductor package pickup 5's, which can be moved along the semiconductor package feed track 5?16. The semiconductor package picker 5018 picks up a semiconductor package that is placed in a loading area 5〇〇8 that moves along the loading area feed track 5010. Further, the semiconductor package pickup 5018 places the picked semiconductor package on the detector 5〇2〇 Within the area defined above. A plurality of semiconductor package feeding portions 5〇14 may be provided in accordance with the requirements of the user. In the present embodiment, two semiconductor package feed portions are provided. The detector 5〇2〇 is disposed at the end of the semiconductor package pick-up, and the detector is configured to detect the semi-conducting yoke picked up by the semi-conductor (four) package and form a second unloading unit 5000. The receiver 5〇22 includes: a receiving tray 5〇24's for receiving the semiconductor package of the feeding detector 5〇20; and a receiving 27 1364087 shelf feeding tilting, _ shouting Wei Dao moved. The receiving tray feed tracks 5 〇 26 are orthogonal to the third feed trajectory and the + conductor trajectory 5G16, respectively. Can Lai County dry health collection H 5022. Preferably, two or more receivers 5〇22 can be provided. One of the two or more receivers 5 〇 22 can be used as a semiconductor package package for receiving the semiconductor package ’. The semiconductor package SP is determined to be defective by the detector 5020. In addition, the rest of the (four) Cong as a space to receive genuine semiconductor packaging. Next, the operation of the second embodiment of the semiconductor processing system will be described in accordance with the present invention. In the second embodiment, the first loading portion of the semiconductor tape processing system, the operation of the first feeding portion and the first-side portion, and the operation mode in the first embodiment, and the operation mode of the first cutting portion The cutting portion 300 operates in the same manner in the first embodiment of the fish. However, the method of cutting the semiconductor strip is different from that of the first-implementing contact portion. The semiconductor tape 触 is fed to the first unloading portion side after being cut by the first cutting portion, and is transmitted through the first unloading portion 4_ to the second loading portion. Specifically, when the main feed is fed along the conveyor 32〇2, and then the semiconductor tape is placed in a first portion, and the cassette semiconductor tape is loaded in the second loading cassette 3206, the second transfer device transmits the first 2 • . . . - 28 1364087 Load box 3206 to first thruster 3210. The second pusher pushes the semiconductor strip of the second loading cassette 32〇6 toward the third picker when the second loading cassette reaches the second pusher pass. Next, the third lost grip 3220 picks up the side of the semiconductor strip ss and feeds the semiconductor strip SS to the introduction exe. 3218. • When the semiconductor strip % reaches the incoming pass, the third picker 3216 picks up the semiconductor strip ss placed in the lead way 3218 and greets the second feed track 3214 toward the chuck along the second feed. Then, the third picker Na places the semiconductor strip ss on the chuck table 323 of the rotary table 3226. Next, each blade unit 3224 operates. Each blade unit is movably moved in a direction parallel to the second ship 3214. Depending on the mode of operation of each blade unit 3224, the blade phantom 224 is rotated in a direction parallel to the second feed channel 3214 while cutting the semiconductor tape %. After cleaning and dry inspection, the semiconductor package sp is placed on the dry no-region 5002 of the second unloading portion, and then the semiconductor package is completely dried in the drying zone 5〇〇2. The fifth pick-up picks up the semi-guided rider sp of the green office to pick up, and then feeds the semiconductor seal sp to the loading area. Subsequently, the semiconductor package SP placed in the loading area is fed along the skirting area feed track culvert. The semiconductor package picker 5018 picks up the semiconductor package sp s which is fed along the loading area feeding channel 5 〇 1 拾 ' ' ' 半导体 半导体 半导体 半导体 半导体 半导体 至 至 至 至 至 至 至 至 至 至 至 , , , 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体The track is loaded along the semiconductor package. At the same time, the pick-up (four) racks are fed along the receiving tray feed track 5026. The tester lion is tested as a genuine swivel seal and placed in the receiving tray 5024 for receiving genuine products. At the same time, the semiconductor package detected as defective by the detector 5〇2〇 is placed for receiving times. The product is received in the tray 5024. Through the above process, the operation of the semiconductor tape processing system according to the second embodiment is completed. , ' ' κ Next, the operation of the third embodiment of the semiconductor processing system will be described in accordance with the present invention. • ' . ' * -. . . As shown in Fig. 14, the semiconductor tape processing system includes a loading unit 500 for receiving a plurality of semiconductor strips and a cutting portion 7〇〇. The cutting portion 30 1364087 700 comprises: - a chuck table unit 7 包含 2 comprising a chuck 纟 7 〇 4 on which the semiconductor strip SS will be placed one by one. The chuck table 704 is movable in the y-axis and y-axis directions. The material advancement step includes: - cutting, the cutting device can add two to the semiconductor strip ss placed on the chuck table 7〇4 during the movement to make it a separate semiconductor package SP. The semiconductor tape processing system further comprises: a cleaning/drying portion 8GG, for cleaning and drying the semiconductor package sp after the addition of X; a detecting portion 900 for detecting the presence or absence of the semiconductor package package for cleaning and drying a defect; an unloading portion 950' is for receiving the 'detected semiconductor package sp; and a feeding portion 600 for picking up the semiconductor strip ss and feeding it to the loading portion 500 or the cutting portion 700 to pick up the semiconductor The crucible is packaged and fed to the cleaning/drying portion 800' detecting portion 900 or the unloading portion 950. The loading unit 500 includes a plurality of loading cassettes 5〇2. At each of the loading cassettes 5〇2, a plurality of semiconductor strips to be cut can be placed. Of course, only one semiconductor strip SS can be placed in each of the loading cassettes 5〇2. The loading unit 500 also includes a transport unit 5〇4 for feeding the load cassette 502 one by one. The transport device 5〇4 can be applied to various drive systems. Preferably, the transfer is cumbersome to apply a belt drive system. The loading unit 5A includes a loader 505. The loader 505 includes a pusher • '· 506. The pusher 5〇6 is used to place the semiconductor strip SS moving through the transport device 504 into the loading box 502 by pushing one side of each of the semiconductor strips ss, and the semiconductor strips SS are placed one by one. Above the introduction track 510. 31 1364087 The tamper 505 also contains - gripping please. The gripper is set to push the cry 5〇6 =. Therefore, when the pusher 506 pushes one side of the semiconductor strip SS toward the lead-in rail (four), the gripper 5GS picks up and pulls the other side of the swivel belt %. The loading department has also entered the step-by-step. Specifically, the introduction lane 510 is disposed in the strip moving path, wherein the pusher 5() 6 and the gripper view are movable along the moving path #, or is disposed under the first picker. The side of the path, t is included in the first part of the feed section - the pick 4 can be moved along the above path. The first picker 6〇4 will be described in detail below. The attracting track is used to temporarily store the semiconductor strip SS before transferring the semiconductor strip SS to the cutting portion.

The J feeding unit 600 is disposed on one side of the loading unit 500. The feed portion 600 includes a -feed way 602. The first picker 6〇4 is disposed on the feed lane 6〇2 and is movable along the lane. The first picker 6〇4 picks up the semiconductor tape placed on the lead-in track 51() and places the semiconductor tape on the feed so that the semiconductor tape can be picked up to the recording unit 7G8, which will be The chuck material is detailed. • * 'At the same time, a second picker 606 is provided on the feed track 602. The second picker 606 is for feeding the semiconductor package sp from the cutting portion 700 to the cleaning/drying portion 8A. The cutting portion 7A and the washing/drying portion 800 will be described in detail below. A third picker 6 〇 8 is also provided on the feed lane 602. The third picker - . . . * 608 is for feeding the semiconductor package sp from the cleaning/drying surface to the detecting portion 9A. The cutting portion 7A for processing the 32 " conductor strip SS is disposed below the center of the feed portion_. The chuck table unit 7〇2 among the cut portions 700 is disposed to be movable flush with the shaft scale along the X axis. A plurality of semiconductor fSS to be processed are placed on the upper surface of the loss table unit 7〇2. The stencil table included in the cutting portion can be processed at a point on the semiconductor V SS or processed along a line or curve on the semiconductor strip SS. The cutting unit 720 can be calibrated on the X-axis, the Y-axis, and the θ angle, paired from a pure 4 。. The cutting unit 700 further includes a sensing unit 730 for acquiring a position of the semiconductor strip ss to be added, and sending the detected ray to the unit 72, so that the unit is , the processing position can be obtained. According to the above-mentioned hiding, the butterfly-silver-semiconductor package processing apparatus is shown in the "Fig. 14" as each of the chucks 704 included in the chuck table unit 7A2. The semiconductor strip ss is supported under the semiconductor strip ss. The lost table unit 702 also includes a lost table feeder 71 for feeding the chuck table 7〇4. The mother-and-pin stage 704 is for holding and supporting a semiconductor strip ss under the semiconductor strip ss when the semiconductor strip ss is processed by the dicing unit 720. The processing of the cutting unit 720 will be described below. Any familiar artisan will understand that the chuck table 704 can have any configuration. The chuck table feeder 710 includes: a first feeding member 712 for feeding the chuck table 704 in the X-axis direction; and a second feeding member 714 for feeding the chuck table at the γ axis 33 1364087 704. The second feed member 714 is configured to be orthogonal to the feed track 6〇2. This second feeding member 714 is for feeding the chuck table 7〇4 in the γ-axis direction. The first feeding member 712 is configured to be the father of the second feeding member 714. The first feeding member 712 is for feeding the second feeding member 714 in the *X-axis direction. The second feed member 714 can include a plurality of feed members that are parallel to each other. In the present embodiment, the second feeding member 714 includes four feeding members, that is, the first feeding member 714a, the second feeding member 714b, the second feeding member 7b, and the second and fourth Feed member 714d. The ancient knife cutting unit 720 is disposed above the second feeding member 714 and at the end of the second feeding member 714, and the cutting unit 72 unicorn processes the semiconductor tape SS placed on each chuck table. In the case of a cutting single it 720, various cutting devices can be applied, as shown in the "J-th drawing" wipe, which can include a laser cutting device. Also, as shown in Fig. 15, the cutting unit 72A may include a blade. The laser cutting device comprises - mounted on the head of the tip of the laser cutting device (Fig. t is unillustrated. The part is configurable to the head through the controller included in the thunder device) The X-axis, the 丫-axis, and the θ-angle position are moved under control. The laser cutting device is processed by the semiconductor book ss of the singular image. The processing can be as follows: "1G" to " The curve and the line shown in Fig. 12 are carried out. Of course, the laser cutting device can cut the material band %--- 34 1364087. to make it a separate semiconductor package sp. A laser cutter. Therefore, as shown in "1", the H cut 720 may include a __ unit, a unit hall, and a second cutting unit 720b. The young cutting 720a and the second cutting unit are preferably configured. Above the second feed 714. As shown in the "figure 14", the first cutting unit is slightly swayed by the slash, and the second member 71 is over the three == feeding member 714e, or They are respectively disposed on the second feed member 14b and the second feed member 71A. The sensing unit B0 is disposed above the second feeding member W and located at the second feeding== end, and the sensing unit 73〇 includes a video acquisition request, and the video is obtained and mounted on the position of the semiconductor strip SS on the chuck table for inspection. The μ/the chuck table is connected to the second feeding member 714. The video is obtained by detecting the position of the semiconductor strip SS and transmitting the detected position, the controller of the cutting device (in the drawing) : not shown), and then in the direction of beam emission, the laser_device is provided with a video capturer track 734. The video 7^2 # ^ 734 Orthogonal to the second feed member 714 and parallel to the first read companion and the video acquirer 732 can be moved along the video acquirer track 734. The object i can be "completely" a variety of cutting devices. In this implementation In the example, the cutting unit 72〇 includes only one laser cutting device. 35 丄 364〇87 The laser cutting device comprises - mounted on the head of the laser cutting tip. The second head: is configured to be permeable to the shooting. _The control in the device (4) The position of the head, the Y and the Θ The miscellaneous correction is used to process the semiconductor strip shown in "_". The processing T is performed along the curve and the line as shown in "Fig. 10" to "12". The waste box 750 can be disposed at the bottom of the cutting unit 72, and the waste box is

'The gravity of the scrap is removed, and the semiconductor strip % is processed at the cutting portion 7 to make it a stalk produced by the transvestite sp. The cleaning/drying portion is disposed on a side of the feeding portion (four) opposite to the loading portion 5''. The cleaning/drying section _ includes a first washer/drying and a second washer/dryer 811. The > scrubber/dryer 801 defines a cleaning/drying zone 8〇2. In this region, the diced semiconductor package sp is cleaned and dried. Dry _ 800 also contains a cleaning station. The cleaning station 8〇4 is assembled into a rock-washing read-reduction lane. The movement is carried out in a longitudinal extension of the cleaning/drying section. The cleaning station is used to move along the cleaning platform with the semiconductor seal = SP dry cleaning station 8〇4. An air shower head 806 is disposed on the filial hyperactive roadway for cleaning. The air jet nozzle ejects air onto the semiconductor package SP on the washstand 804, thereby removing impurities attached to the upper surface of the tantalum conductor package sp. Of course, the air jet _ can also blow hot air, privately riding the washed semiconductor package SP. 36 1364087 A nozzle head _ is also disposed in the moving path of the washing station 804. The water jet 808 is used to spray water onto the cleaning table 8G4 to remove impurities adhering to the upper surface of the semiconductor package SP. Further, a first brush is disposed in the moving path of the washing table 804. The first brush (10) is used to remove impurities attached to the upper surface of the semiconductor package sp called the cleaning station. A second washer/dryer is disposed on one side of the first washer/dryer, i.e., one side of the third picker_moving path of the feeder (4) and located below the second pick-to-08 moving path. The second washer/dryer 8 ιι is used to remove impurities attached to the lower surface of the semiconductor package SP. The second washer/dryer 811 includes a second brush 812. The second brush 812 is for removing impurities attached to the lower surface of the semiconductor package SP fed by the third pickup on the cleaning stage 804. The first washer/dryer 811 further includes an air nozzle 813, a water nozzle 814, and is placed on the surface of the semiconductor package. A drying zone (not shown in the drawing) is provided on the side of the cleaning/drying section, i.e., the drying zone is located on one side of the moving lane of the third picker_ of the feeding section. The drying zone is for thoroughly removing impurities remaining on the light body package sp and removed by the wire cleaning/drying section 800. A detection portion is provided on the side of the movement control of the third pickup_ of the feed portion_. The detecting part includes: a first detecting means, a gamma detecting cut 37 l364 〇 87 a surface of the semiconductor package SP after cutting, and a second detector 9 〇 6 for detecting a lower surface of the semiconductor package SP after cutting . The detecting portion 900 further includes a detecting stage feeding track 9A8 which is disposed below the feeding path 602 and extends in a direction orthogonal thereto. The detecting portion_further includes a detecting station 910 which is movable along the detecting table feeding track 9〇8. The detecting portion 900 can place the semiconductor package SP and feed the semiconductor package SP along the detecting stage feed track. The n-th detector feed path 912 is disposed on the test-bed feed track_, which extends in a direction orthogonal to the test-station feed track 9〇8. The first detector 914 is configured to move the first detector 914 on the monitor first detector feed track 912 for detecting the presence of a defect in the semiconductor package SP located on the test station '91'. The second detector 906 will be described in detail below. An unloading portion 950 is disposed on one side of the detecting portion 900. The unloading portion 950 includes a φ unloading feed path 952 that extends in a direction parallel to the first detector feed track 912. The unloading portion 950 is remotely comprised of a semiconductor package picker 954 and an unloader picker 956, both of which are movable along the unloader feed track 952. • ▼ . ' - , semiconductor package pick g 954 picks up the semiconductor package SP that has completed the inspection at the inspection station 910, and places the picked semiconductor package sp on the auxiliary stage 958. The auxiliary station 958 will be described in detail below. The unloading picker 956 picks up the semiconductor package sp detected by the second accommodator 9〇6, and places the picked-up half V-body package SP on the receiving unit 95. 38 The north 4U87 auxiliary station 958 is disposed on the semiconductor package pick-up (four) 954 and the unloading picker 956. The auxiliary table 958 is for temporarily storing the cast package SP that has been detected by the first detector 914. The °-detector 906 is disposed on one side of the auxiliary stage 958. The second detector 9 is used to detect whether or not a defect is present on the surface of the semiconductor package after the detection by the first detector 914.

The receiver 960 is disposed below the path of the unloading picker 956 and parallel to one of the limits of the auxiliary station receiving w 960 for receiving the semiconductor package SP detected by the detecting portion 9A. A number of receivers 690 can be supplied. Preferably, two receivers 69 are supplied. That is, the unloading unit 950 may include a receiver _ for receiving the semiconductor package sp that the detecting unit 9 confirms as a defective product, and a receiver _ for receiving the semiconductor that the detecting unit 900 confirms as authentic. Package Si>. At the same time, the unloading picker track 962 is used to feed the unloading picker 956 that moves along the unloading feed track. Specifically, the unloading picker track %2 is configured for each of the unloader tracks 952', and the unloading picker track %2 can be moved along the unloader feed track 952. The unloading picker 956 can be moved along the unloading picker track 962. That is to say, the unloading picker 956 can move both in the X-axis direction along the unloader feed track 952 and in the Y-axis direction along the unloading picker track 962. 39. In the second embodiment of the present invention, when the transfer device 504 is used to load the loading cassette into the 5 〇 2, the first and the moving H 5G6 are moved. a 5G6 moves. When the loading box 502 enters please ask for it. Accompanied by the pusher track 605. (4) The first pick-up of her first pick-up (10) When the semiconductor strip SS goes to the pick-up 508 picks up the semi-guided I# with π u & 杪郓吋, the younger one grips the state...takes the cow guide' SS on the propulsion and the opposite - The side device is advancing to advance the semiconductor strip ss. ° 穿.,. 〇〇 P + conductor strip SS through the pusher 506 in cooperation with a holder 508 is placed on the first picker to administer the milk. , . . When the semiconductor strip ss is placed on the first picker path 6〇5, the first pick-up 604/σ feed-side-feed track (10) moves the cut portion 7(8). When the first picker 6〇4 reaches the cutting portion, the chuck table of the cutting portion 700 is placed under the first picker 604. » . - ,.· · . Thereafter, the first picker 6〇4 places the semiconductor strip that it has picked up. § § on the chuck table 兀 702 ^ 台 〇 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上· - _ · 702 on the other chuck 7 〇 4. When the semiconductor tape is placed on the chuck unit 702 in the above manner, the associated setting tray 7 is moved along the second feeding member 714 on the x-axis. The disc table 704 passes through the sensing unit 730 when the disc stop 7 is moved over the gamma axis. At this time, the video acquirer 732 l 〇 4U87 of the sensing unit 730 acquires the information of the position of the semiconductor tape on each of the chuck stages 7 () 4 and transmits the information to the controller of the cutting unit 720. After receiving the above information, the controller performs a calibration on the position of the head of the cutting unit 72. In this case, the sensing unit? 3〇 Detecting the position of the semiconductor strip on the chuck table, as shown in “Fig. 14”, because the first cutting unit is located on the second feeding member 71 and the fourth Above the two feed members 714d, the chuck table 7〇4 is in direct contact with the second feed age number two and the second feed member 714d. The field is placed on the first feed member 714b of the first and the second feed member of the fourth. When the cutting process by the upper semiconductor tape ss is completed, the chuck table moves in the z-axis direction along the first feeding member 712. Then, the second feed member 714a #2 is the second feed member 714. The refreshing table is placed below the cutting unit 720. So far, the cutting of the semiconductor tape SS is completed on all the chuck tables 704. After the cutting process of the semiconductor strip ss is completed, the central disk tray 7〇4 is fed through the chuck table. The device returns to its initial position and is wide~... • · ^ · , . '· ^ All chuck tables 704 return to it In the initial position, the second picker 606 moves 'to the area above the chuck port 4' to feed the first washer, the dryer sol with the semiconductor ▼ ss, and the second picker picks up the cut semiconductor package, and The semiconductor package is placed on the cleaning station 804. When the semiconductor package is placed against the cleaning station, the cleaning is moved to the cleaning/drying area_2. First, the cleaning stage passes through the air nozzle 806 to remove the miscellaneous f attached to the semiconductor package sp. Thereafter, the cleaning station passes through the nozzle head 808 to clean the semiconductor package |sp through the water. At the same time, the impurities on the conductor package SP when the first brush 81 is moved along the upper surface of the semiconductor package. Moving along the upper surface of the cleaning table 804, that is, 'the first brush 810 is removed and attached to the half of the cleaning table m. · When the first brush _ passes, the cleaning table 8〇4 passes through the water nozzle again It is cleaned by listening to semiconductors. The cleaning station 8〇4 passes through the air nozzle _ again to clean and dry the semiconductor package. After the cleaning station 8〇4 passes through the first washer/dryer 8〇1, the washing station_ returns to its original position. At this time, the third pickup_ moves to the area above the cleaning table 8G4. At this time, the third pickup 608 is moved above the washing table 804. Subsequently, the third picker 608 picks up the semiconductor package and moves it to the second washer/dryer 811, which moves along the feed track 602. In this process, the second picker 608 sequentially passes through the second brush 812, the air, the mouth 813, and the water nozzle 814. ... at the same time, the moisture on the semiconductor package 31 > is completely removed through the second washer/dryer 811. Next, the third picker 608 places the semiconductor package on the inspection station 910. When the semiconductor package is placed on the inspection station 91, the inspection station 910 moves along the inspection station feed lane 908 to a region below the first detector 914. At the same time, 42.. 1364087 The first detector 914 determines whether there is a defect on the surface of the semiconductor package placed on the inspection station 910 and simultaneously moves along the first detector feed lane 912. After passing through the first detector 914, the cleaning station 8〇4 returns to its original position. Next, the semiconductor package picker 954 is placed to pick up the semiconductor package on the cleaning stage 8〇4, and is moved along the unloader feed while feeding the semiconductor package to the auxiliary stage 958. When the semiconductor auxiliary is placed on the auxiliary station 958, the unloading picker picks up the semiconductor package placed on the auxiliary stage 958 and moves along the unloading II feed 952. The unloading pick 956 along the unloading picker track 962 Move to detector 906. - The second detector 9〇6 detects the pickup onto the underlying surface of the semiconductor package via the unloading picker to determine if the surface under the semiconductor package is defective. The unloading picker 956 then moves along the unloader feed track 952 and sends the receiver 960 of the semiconductor package. • The second detector 9〇6 is placed to determine the semiconductor package with good quality. • In the receiver 960: in addition, it is good by the second detector! The semiconductor package is placed in the receiver for the defective product (10). The fourth embodiment of the semiconductor tape is processed. "15th" half of the _ belt processing system includes: - loading side, for 43

Ub4U87 receives the workpiece to be reinforced, 'listening stage _ reading; - _ part, used to add I to the installed guard; and... cleaning the 戦 (10) 〇 for cleaning and drying Workpiece after work. The loading unit 6100 includes a plurality of shoe boxes 61〇2. In each of the loading boxes, the ss is placed in the form of y, y, and yy. Of course, only one semiconductor strip ss can be placed in each of the loading cassettes 6102. The loading unit 6100 further includes a conveying unit 61〇4 for feeding the first loading cassette 61() 2 one by one. The conveyor (10) 4 can be used in a variety of drive systems. Preferably, the 'transport device _ uses a belt drive system. A loader 61〇5 is disposed at one end of the conveyor_4. The loader pack 61〇5 3 advances benefit 6106. The pusher 6106 is configured to move the semiconductor strip ss placed in the loading cassette 61〇2 sent via the transport device 61〇4 one by one by pushing the semiconductor strip ss at one end and causing the semiconductor strip ss to be ground-by-ground Placed on the introduction road 6112. The introduction rail 6112 will be described in detail below. The loader 6105 also includes a gripper 611〇. A holder 611 is disposed at one end of the loading case 6102 and opposite the pusher 6106. Therefore, when the pusher advances one end of the semiconductor strip SS toward the lead-in rail 6112, the gripper 611 picks up and pulls. · The other end of the semiconductor strip SS is made such that the semi-conducting strap can be easily The first feed. - The loader 6105 also includes an introduction lane 6112. The introduction rail 6112 is provided as a moving path of the pusher 6106 and the holder 6110. The introduction track 6112 includes a pair of tracks. A semiconductor strip ss can be placed over the lead-in track 6112.

1364087 The feeding portion 6200 is disposed to be orthogonal to the loading portion 6100. The feeding portion 62 is for feeding the semiconductor tape SS from the loading portion 6100 to the cleaning/drying portion 64A. The feeder 6200 includes a feed lane 62〇2. The first picker 62〇4 and the second picker 62〇6 are disposed above the feed track 6202 so that both can move along the way. Preferably, the first picker 6204 is disposed adjacent to the loading lane 62〇2 and adjacent to the loading "卩6100. In this case, the first picker 6204 can easily pick up the semiconductor strip SS and feed the semiconductor strip ss to the chuck table 6304 which will be described later in detail. The car owner, the second picker 62〇6 is disposed above the feeding lane 62〇2 and adjacent to the washing and drying section 6400. In this case, the second picker 62〇6 can easily pick up the semiconductor tape SS and feed the semiconductor tape% to the cleaning/drying section 6400. The cutting section 6300 for processing each semiconductor tape SS is set in Below the central portion of the feed track 6202. The cutting portion 6300 includes a chuck table unit 6302, which is capable of making a horizontal crane. The strip or strips SS to be added to the main body are set on the surface above the drought. The cutting part also contains all the group of coffee, _ to process the belt SS along a straight line on the semiconductor strip SS, the cutting unit 632, the cutting part 63GG into the step contains - pass 4 single it 633G, The information of the semiconductor f SS position to be processed is taken and the position obtained by the transmitting side is sent to the 45 1364087 clip unit 6302 and the cutting unit 632 〇 so that the processing position of the cutting unit 632 is corrected. In the above structure, the Qi Qing constitutes a semiconductor sealing device. It is true that the semiconductor package-assisting device can be used as a workpiece processing device and not as a semiconductor tape SS < For example, the processing device can be used to form a mark on the workpiece. As shown in Fig. 15, the chuck table unit 63〇2 includes the chuck table and the respective chuck table 6304, and the semiconductor tape carrier is used for the branch #, and the disk table feeder 63G6 is used for The platter _4 is fed. When the machining operation is performed by the cutting unit 6320, each chuck table 6304 is used to support under the semiconductor strip ss. The processing operations performed by the unit 632 下文 are detailed below. Those skilled in the art will appreciate that the lost station 6304 can have any configuration. The chuck table feed 63H) comprises: a first feeding member 6312 for feeding the sewing table (10) 4 in the yaw direction; and a second feeding member 63 ΐ 4 for feeding the chuck thin 4 in the squeezing direction; The member 6315 is rotated by a pain to rotate the chuck. Table 6304. The first, feed member 6314 is configured to be orthogonal to the feed chute 62()2. The second feeding member 6314 feeds the lost disk (4) 4 in the γ-axis direction, and the first feeding member 6312 is configured to be the parent to the second feeding member (3)*. The first feeding member & 祀 is for feeding the second feeding member 6314 on the yoke amount. 46 1364087 The second feed member 6314 can comprise a plurality of feed members disposed in parallel. In the present embodiment, the second feeding member 6314 includes four feeding members, that is, the first feeding member No. 6314a 'the second feeding member 63i4b, the second feeding member 6314c, and the second feeding member 6314d . - A rotating member 6315 is provided for each chuck table 6304, and the rotating member 6315 is used to rotate the chuck table 6304. Since the cutting unit 6320 is fixed, in the operation of the cutting > unit 6320, the per-rotation member 6315 rotates the refresher table 6304 associated therewith with the cutting unit 6320. In this way, the semiconductor tape can be processed into various shapes. The cutting unit 6320 is disposed above the second feeding member 6314. The cutting unit 6320 is used to process the semiconductor tape % located on the | chuck stage 63〇4. For the cutting unit 6320, various cutting devices can be applied. In the embodiment shown in "Fig. 15", the cutting unit 632 can include a blade. The blade is used to process the semiconductor strip SS in a straight line as shown in "Fig. u" and "Fig. 12". It is true that the semiconductor strip % can be processed into a half. Conductor package SP. In the embodiment shown in Fig. 15, a plurality of blades may be applied, wherein the two pairs of blades are applied to the first cutting unit 632a and the second cutting unit 632b. The first cutting element 6320a and the second cutting unit 6320b are disposed above the upper feeding member 6314. As shown in FIG. 15, the first cutting unit 2a and the second cutting unit 6320b may be respectively disposed at the -number second feeding member 6314a.

• I * . . . • • • • - 47 · 1364087 and the second feed member 6314c on the third, or respectively disposed above the second feed member 6314b and the second feed member 6314d. The sensing unit 6330 is not placed above the second feeding member 6314 and is located at one end of the second feeding member 6314. The sensing unit 6330 includes a video acquirer 6332 for detecting the position of the semiconductor strip ss mounted on the chuck table 6304, wherein the chuck table 6304 is associated with the second feeding member 6314. connection. The video acquirer 6332 detects the position of the semiconductor strip SS and transmits the detected position information to the control S of the field cutting device (the wealth is not displayed, so as to the Y-axis and the θ angle of the associated lost table 6304). The position is adjusted and the position of the axis of the associated blade is adjusted. A video acquirer track 6334 is disposed on the second feeding member 6314, and the video captures the bribe 63; Μ is orthogonal to the second feed 6314 and is parallel At the first viewing member 6312. And the 'video acquirer 6332 can perform the movement along the video acquirer 3, and the cleaning/drying portion 6400 is disposed on the moving path of the second picker 62〇6. On the self-cleaning/drying unicorn 绮 semi-conductive material plus Wang Wanqian, remove impurities from the semiconductor seal Pan SP. - Drying area 6500 is set on the side of the cleaning/drying section 6400, used in the cleaning/drying section After the operation of the 6400 is completed, the impurities located in the moisture of the semiconductor package are removed. . : The following is a description of the semiconductor tape 48 processing system having the above configuration according to the fourth embodiment of the present specification. The one shown A total of a field cattle conductor belt SS is located in the loading part 6100> when loading the box 6102, Chuan County strikes (10) μ (four). 丨6100 of 61〇6. Money continues to feed Wei box 6Η) 2 to propeller 61〇6=术_ _ Secret to the direction of the movement, the advancement! Start running. With the push of $ 丨 执 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 6112 advances 5 semiconductor f SS. That is, with the cooperation of the pusher 61〇6 and the holder 611〇, the semiconductor tape SS is placed in the correction path 6112. When the rich conductor strip ss is placed in the lead-in lane 6m (four), the first picker 6204 moves along the feed track 6202 and picks up the semiconductor f SS disposed in the lead-in rail 6112. The first picker 62 〇 4 places the picked semiconductor strip ss on the chuck table 6304. The trip unit 6304 is disposed on the second feed member 6314b or the fourth feed member 6314d. Then, the first pickup 6204 places another semiconductor tape SS on the other loss table 6304 in the same manner, and the other chuck table 6304-.* is also disposed on the second feed member 6314b. Or on the fourth feed member 6314d. It is true that the first pick-up 6204. may also place the picked semiconductor strip SS on the chuck table 6304 of the first feed member 0314a or the second feed member 6314c. 49 1364087 When the semiconductor strips ss are respectively disposed on the chuck table 63〇4 coupled to the second feed member 63 i 4b and the second feed member 6314d, the two chucks are respectively along the corresponding The feed member moves on the gamma axis. When the chuck table 63G4 moves in the Y-axis direction, the disk table passes through the sensing unit 7L 6330. At this time, the video acquirer 6332 of the sensing unit 633 obtains information on the position of the semiconductor strip SS on each of the chucks in motion, and sends the information to the controller of the cutting unit 6320. The positional interference is obtained by detecting the position of a specific mark at a certain position on the semiconductor strip SS through the video acquirer 6332 of the sensing unit 633. Based on the above position information ', the position of the semiconductor strip % can be determined. After receiving the above information, the controller corrects the position of the chucking table 6320 and the position of the blade based on the received information. In this case, as shown in FIG. 5, since the cutting unit 6320 is disposed on the second feeding member 6314b and the four-wire feeding member 6314d, the sensing is installed on the second το 6330 pair. The position of the second feeding member 6314b and the chuck table 63〇4 on the fourth feeding member 6314d is detected. Meanwhile, when the semiconductor tape ss located on the second feed member 6314b of the second and the second feed member 6314d of the fourth number are processed, the other semiconductor tape % is placed on the second feed member 6314a and the second feed member No. 3. 6314c.上. >> When the processing of the semiconductor tape ss on the second feeding member 6314b and the fourth feeding member 6314 is completed, the respective feeding members constituting the second feeding member 6314 50 1364087 are simultaneously transmitted through the first The feeding member 6312 is moved along the z-axis. Thus, the first-stage second feeding member 6314a and the third-stage feeding member 6314c are placed under the cutting unit 6320. Similarly, as shown in Fig. 15 It is shown that the semiconductor strip ss on the chucking stage 6304 is cut into a desired shape through the associated rotating member

In the above manner, the % of the semiconductor tape on the entire central disk mine is processed into a semiconductor city. After the red balance of the material conductor belt is completed, the center disk 6304 is returned to the initial position through the chuck table feeder 631. After all the chuck tables 6304 are returned to the initial position, the second picker 62〇6 is sent to the area above the crossover (four) 4 along the feeding lane (4), and the second picker 6 picks up the semiconductor package, and It is fed to the washing/drying section 6400. In the cleaning of the crotch portion 6_ towel, the conductor package is cleaned and dried. The moisture remaining on the semiconductor package is completely removed by being disposed on the side of the cleaning/drying portion 6400 to the drying zone 6500. The results of the semiconductor tape processing system of the fifth embodiment will be described in detail in accordance with the present invention. The figure "cannot be produced" The semiconductor tape processing system mainly includes: a loading of 4,7100, which is used to load a semi-conducting crucible, and a body strip cutting _ _ _ _ _ _ semi-guided ·, . 7_ is used to unload the semiconductor package and send it. p 72GG ' is used to assemble the genus and the cutting unit 7300 to the domain object G. 1^04087 The loading unit 7100 includes a plurality of loading boxes 7102. In each of the loading cassettes 7102, a plurality of semiconductor strips ss.e which need to be processed are placed in the form of a cassette, and of course, only one semiconductor strip s § can be placed in each of the loading cassettes 7102. The loading unit 7100 further includes a first conveying device 71〇4. It is used to feed the loading cassette 7102 one by one, and the first conveying device 71〇4 can apply various driving systems. Preferably, the first conveying unit 71〇4 can apply the belt driving system. A pusher 7106 is disposed on one side of the first conveyor 7104. The pusher 7106 is configured to move the semiconductor strips SS placed in the loading cassette 71〇2 sent through the first transfer device 7104 one by one by pushing the semiconductor strips SS at one end, and to place the semiconductor strips ss one by one. On the first picker path 7206, the first picker track 7206 will be described in detail below. A feeding portion 72 is provided at one end of the loading portion 7100. The feeding portion 72 includes a feeding track 7202 and a first pickup 7204 which is arranged to be movable along the feeding track 72〇2. The first pick-up 72 〇 4 picks up the conductor strips ss loaded in the loading portion 7100 one by one, and feeds the above-described semiconductor strips SS to the stencil table 7316, which will be described in detail below. The first picker 7204 includes a pick-up picker track 7206. The first picker track 7206 includes a pair of tracks. The first picker track 7206 is used to place the semiconductor tape when the first picker 72 is moved. The first picker 72〇4 further includes a first clamp || 72〇8. The first crying 7208 is placed opposite the pusher 7106. Therefore, when the pusher 7106 advances one side of the semiconductor strip % to the first pick-up 52 1364087 picker rail 7206, the first gripper (9) picks up and pulls the other side of the semiconductor strip SS. The first picker 7204 further includes a sensing unit 721A. The sensing unit 721 is used to acquire the information of the position of the semiconductor strip SS on the chuck table 7316 and transmit the detected position to the cutting portion 7300. The chuck table 7316 will be described in detail below. The cutting portion 7300 is disposed below the central portion of the feed rail 72〇2. The cutting portion 7300 includes a chuck table feed path .73〇2 that is disposed orthogonal to the feed track 7202. A chuck table unit 7304 is mounted on the chuck table feed track 7302 so that the chuck table unit 7304 can be moved along the track. The chuck table unit 73〇4 includes at least one chuck table 7316. The chuck table 7316 is fed through the chuck table unit 7304. The lost table unit 7304 also includes a drive body 7306. The drive system 7306 includes a horizontal driver 7308 and a vertical driver 7310. The horizontal drive 7308 includes a driver (e.g., a motor) for horizontally moving the chuck table 7316 along the chuck table feed track 7302. It is true that the horizontal drive 7308 can be configured to move the chuck table 7' 316 in both the X-axis and the Y-axis along the chuck table feed track 7302: - ' * ^ - . The vertical actuator 7310 includes a Vertical slip 7312. The vertical slip 7312 . - : is used to vertically move the chuck table 7316 thereon. Similarly, the horizontal drive 7308 • - - · · · also includes a vertical drive force of 1 〇. The vertical drive 7310 is used to move the chuck table 7316. 53 1364087 At least one support table 7314 is disposed at one end of the vertical slide 7312 so as to be orthogonal to the vertical slide 7312. The support table 7314 can be on which the chuck table 7316 is placed. The support table 7314 can receive the vertical drive 7310 and move vertically along the vertical slide 7312. - When performing a machining operation through the cutting unit 7318, each chuck table 7316 is used to • support it under a semiconductor strip SS. The processing of the cutting unit 7318 will be described in detail below. Those skilled in the art will appreciate that the chuck table 7316 can have any configuration. A plurality of trays 7316 can be supported by a support table 7314. In the illustrated embodiment of the invention, the two chuck stages 7316 are placed in parallel on the support table 7314 so that the number of cutting units 7318 can be matched, as will be described in more detail below. As shown in "Fig. 17", a pair of chuck table feeding lanes 73〇2 can be provided. In this case, a pair of chuck table units 73A can be provided so as to be movable along the two chuck table feed rails 7302, respectively. As described above, it is possible to prevent the chuck table unit 7304 from interfering with each other in the vertical movement of the chuck table. For convenience of description, only one cutting unit 7318 is given below. The cutting unit 7318 is disposed in the strip moving path above the chuck table unit, and in the path extending direction, the chuck table unit 73〇4 moves along the chuck table feeding track 73〇2. The cutting unit 7318 cuts the semiconductor strip over the chuck table 7316 to make it a semiconductor package. • ' : 54 1364087 ^ 73 B;T^ ^,〇^^^^. _, _ Jie Yuan plus also negotiated L Ding - laser cutting ^ knife" j early test of bribes. For the rib job, the money is included in: 7: Department. The X-axis, the Y-axis, and the corner position of the head are controlled by a controller included in the laser cutting device. The laser cutting device is used to process the semiconductor strip ss along a straight line and a curve as in "Fig. 1". A plurality of laser cutting devices can be applied. In the present embodiment, since the two chuck tables 7316 are disposed in parallel, two laser cutting devices are preferably applied. An unloading portion 7_ is provided on the opposite end of the feeding path 7202 from the loading portion 71. The unloading 7_ peak area is a box period. The processed semiconductor strip ss is placed in the object carrier. However, only one semiconductor strip SS can be placed in each domain box·2. The unloading portion 7400 further includes a second conveying device 74〇4 for feeding each unloading benefit 7402 one by one, the second transmitting device 7404 being applicable to various driving systems, preferably, the second transmitting device 7404 can be applied with a belt type Drive System. A second pickup is disposed above the feeding lane 7202 of the feeding portion 7200. The processed semiconductor package is picked up and fed. The second picker track 7214 includes a second picker track 7214. The second picker track 7214 includes a pair of tracks. The second picker track 7214 is used during the movement of the second picker 7212, and is called U87.

The conductor strips are described below. The second holder 7216 is disposed above the second pickup track 72i4. ===The semiconductor strip on the peak (4) (4) 4 is described below in accordance with the present invention. Operation of the cattle conductor π processing system The semiconductor tape SS is mounted on the loading box of the loading section 71 〇 2 _ 3 set: = turn, whereby the loading box 7102 is moved to the first thruster 1 =. When the carrier is fine, the first pusher is rotated to cause the load box 71G2 to move to the first pick-up track. When the semiconductor strip SS moves toward the first picker track 72〇6, the first clamping state 72〇8 picks up the opposite end of the semiconductor strip ss from the first pusher and proceeds to the first pick H. The semiconductor strip ss. That is, the semiconductor strip is placed on the first = picker track 7206 in cooperation with the 〇6〇6 and the first-disarmer. When the port 1 · · _ field semiconductor tSS. is placed on the first picker track 72〇6, the first picker 7204 moves along the feed channel 72〇2 of the feed portion 72〇〇 to the cutting portion. When the first pick H 7204 is close to the _ portion 7, the chuck table unit 7304 of the _ portion 73 (8) is placed under the first picker 72 〇 4 ^ Subsequently, the first pick-up 7204 places the semiconductor strip on the sizzling In the unit unit. When the semiconductor strip is placed in the chuck stage unit MM, the sensing unit 7210 of the first picker 56 1364087 7204 is placed below the chuck stage unit 7304. The sensing unit 7210 acquires the information 'the positional relationship between the semiconductor strip SS and the chuck table 7316' and transmits the information obtained thereto to the cutting portion 73A. Upon receiving the above information, the cutting portion 73 aligns the position of the head 7320 of the cutting unit 7318 based on the information. Thereafter, the chuck table unit 73〇4 moves along the chuck table feeding track 7301 to an area below the cutting unit 7318. When the chuck table unit 7304 is located in a region below the cutting unit 7318, the cutting unit 7318 cuts the semiconductor tape over the chuck table unit 7304. After the semiconductor tape is cut, the chuck table unit 73〇4 is clipped The table feed channel 73〇2 returns to its initial position. When the chuck table unit 7304 returns to its initial position, the second picker 7212 moves to an area above the lost table 7316. Subsequently, the second picker DU picks up the processed image to the semiconductor strip SS, and places the semiconductor strip ss on the second picker if 7214 ° when the semiconductor strip SS is placed on the second picker way 7214, second The clamping cry 4741 pushes the semiconductor strip SS into the "unloading box 7402. When the semiconductor & is placed in the unloading box 74A2, the second transfer device MO4 transfers the semiconductor. The SS is brought to the next stage. Thus, the operation of the semiconductor tape processing system according to the present invention is completed. '... * • * · Although the present invention has been disclosed above in the preferred embodiment of the foregoing, it is also known to the skilled artisan, The scope of the patent protection of the present invention is subject to the definition of the scope of the patent application attached to the brother's book. The semiconductor tape processing of the above chest is subject to the spirit and scope of the present invention. The pure system has the effect of the town: The cut is processed by the Lin semiconductor strip (10). It has a laser cutting device.

The semiconductor seal «to meet the needs of the households on the IM: the belt (four) system also contains the information used to detect the information according to the school through the sensor unit and then raise the number of calls to the details of the call, the outline of the simple description BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a first view of the semiconductor tape processing system of the present invention. FIG. 2 to FIG. 8 are diagrams showing the structure of the system shown in (3) for continuous operation. Guarding - the state of the swivel belt before processing = the slanting tape of the singer _ the first plan of the structure of the first embodiment of the scale 9 _ shows the second embodiment of the second embodiment of the structure 58 1364087 12 Fig. 13 is a view; Fig. 14 is intended; Fig. 14 is intended to be a third embodiment of the cutting structure of the semiconductor tape shown in Fig. 9, which is the structure of the invention The structure of the third embodiment of the semiconductor strip device of the invention is shown

FIG. 15 is a view showing the structure of the semiconductor strip of the present invention as shown in the fourth embodiment of the present invention. FIG. 4 is a fifth embodiment of the semiconductor strip plus 1 system of the present invention; FIG. A front view of the structure of the semiconductor strip plus 1 system. [Main component symbol description]

1〇〇, 6100, 7100: loading units 102, 502, 6102, 7102 loading boxes 104, 1004, 7104. · r first conveyor 105'6105 loaders '106, 6106, 7106 propellers 110, 1010, 7208 first gripper 112' 1008 first-turn rails 200, 600, 6200, 7200 feeds 202, 602, 6202, 7202 feed rails 59 1364087 204, 604, 6204, 7204 206, 606, 6206, 7212 300, 700 , 6300, 7300 302, 3002, 702, 6302, 7304 304, 704, 3230, 7316, 3004 310, 710, 6310 312, 712, 6312

314, 714, 6314 314a, 714a, 6314a 314b, 714b, 6314b 314c, 714c, 6314c 314d, 714d, 6314d 320, 720, 6320, 7318 320a, 720a, 6320a 320b, 720b, 6320b 330, 730, 6330, 7210 332 , 732, 6332 334 350 '750 400, 950, 7400 410 first pickup second pickup cutting portion chuck table unit chuck table chuck table feeder first feeding member second feeding member first number second feeding member Second No. 2 second feeding member No. 3 second feeding member. No. 4 second feeding member Cutting unit First cutting unit Second cutting unit Sensing unit Video acquirer Video acquirer Exercising. Waste box unloading section 'Unloader 60 1364087 402, 4002, 7402 404, 4004, 7404 412, 4012 414, 4014, 7216 500 504, 6104 505 506 508, 6110 510 SS SP 1000 1002 1005 1006 2000 2002 2004 2006 3000 . Unloading box second conveyor second steering Track second gripper loading section conveyor loader thruster gripper introduction track semiconductor strip semiconductor package first loading part first loading box first loader first thruster First feeding portion first feeding track 拾 a pickup... second pickup first cutting portion 61 1364087 3200 second cutting portion 3202 conveyor 3204 second loading portion 3206 second loading box 3208 third conveying device 3209 second loading 3212 second pusher 3212 second feed portion 3214 second feed way 3216, 608 third picker 3218' 6112 lead way 3220 third holder 3224 blade unit 3226 turntable 3232 fourth picker 3234 washer / dryer 4000 first unloading portion 4002 unloading box 4010 first unloader 5000 second unloading portion 5002 drying zone 62 1364087 5004 third feeding track 5006 fifth picker 5008 loading area 5010 loading area feeding track 5012 sixth picking 5014 Semiconductor package feed 5016 semiconductor package feed track 5018 semiconductor package picker 5020 detector 5022, 690, 960 receiver 5024 receive tray 5026 receive tray feed track 605, 7206 first picker track 734, 6334 video acquirer 800 ' 6400 cleaning/drying section 801 first washer/dryer 802 Cleaning/drying area 804 Washing station 805 Washing station feeding track 806 Air head '808 Water jet 63 1364087

810 first brush 811 second washer/dryer 812 second brush 813 air nozzle 814 water nozzle 900 detecting portion 906 second detector 908 detecting station feeding channel 910 detecting station 912 first detector feeding Lane 914 First Detector 952 Unloader Feed Track 954 Semiconductor Package Picker 956 Unload Picker 958 Auxiliary Stage 962 Unload Picker Road 6315 Rotating Member 6500 Drying Area 7214 Second Picking Path 7302 Chuck Table Feeding Road 7306 'Drive System•64 1364087 7308 Horizontal Drive 7310 Vertical Drive 7312 Vertical Slip 7320 Head

65

Claims (1)

X. The scope of application for patents: 1. A processing equipment comprising: a losing table unit comprising two chucking tables which can be moved separately along the γ axis and can be simultaneously moved to the 0 axis; and a cutting unit The ribbed ribs are fixed on the chuck table for processing. 〇2. A processing equipment, comprising: a sizzling table unit, the system comprising four can be moved separately along the γ axis and simultaneously /t»X a chuck table for moving the shaft; and two cutting units for processing the workpieces fixed to the first and third chuck tables or for processing the workpieces fixed to the second and fourth chuck tables. 3. The processing equipment according to item i or item 2 of the scope of the patent application further comprises: a detection unit for obtaining information on the position of each workpiece, and transmitting the relevant cutting unit of the asset 5 The unit system includes: a video acquirer, which is used to obtain the position information of each workpiece and a video acquirer to use the video to make the video (W) take the lion along the Wei Shi. 4. The processing equipment referred to in item 1 or 2 of the patent scope is required to be processed, wherein the loss of the platform is contained in: The above-mentioned records, the details of the word #鲜鲜; _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The processing apparatus described above, wherein each chuck stage can be rotated 360 degrees. 6. The processing apparatus of claim 1 or 2, wherein the chuck unit comprises: each of the chuck stages for supporting the semiconductor strip; - vertically driving H, for So that the chucks are "straight moving; and - horizontally driven to move the respective sewing stations horizontally. 7. A semiconductor tape processing system comprising: - a loading portion side to receive a plurality of turns of the conductor strip; - 切切, which contains the processing equipment as described in the first or second item of the patent application; : half of the == coffee receives the processing part of the semiconductor strip after processing, is used to pick up Each of the semi-bands or the body and feeds the thread to the conductor to the county to (four) ^; or the unloading section. Clothing trench, the cutting department. A semi-guided Zhao belt processing system, the system contains: VI The first loading portion is for receiving a plurality of semiconductor strips; the first portion is a processing device as described in item 67 of the tree; the first - unloading portion is for receiving the first butterfly Each of the semiconductor strips described; after the second half of the 2 yarns, the rib yarns are each cast, and they are picked up. + such as to the first loading portion, the first cutting portion or the first unloading portion. Each half carrier portion ' is for receiving the '#' shirt unloaded from the first unloading portion: ^ (4), The second semiconductor unit is placed on the miscellaneous turntable, and each of the semiconductor strips is added to make it into a riding (four) package; a detecting portion is used to detect processing in the second cutting portion. Whether the generated semiconductor package has a defect; 1) the unloading portion 'receives and receives the abundance conductor package after being detected by the detecting portion, and ' / transmits the rib at the first unloading portion without the second unloading portion 9. The semiconductor tape processing system of claim 8, wherein the cutting edge of the first cutting portion comprises - laser cutting and weaving and the second cutting unit comprises a blade. 10: The semiconductor tape processing secret described in the application __8, wherein: s knives. The step-by-step includes a sensing unit for acquiring the semi-conductor 68 1364087 body belts on each chuck table Location information; and _ the first - (four) _ bribes from the sensing unit Wei, and calibrating the reading of the η ΓΓ 卿 之 域 单 单 单 。 。 。 。 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体The rotating table can be moved in the γ-axis direction when rotating; and a blade can be moved around the rotating table in the γ-axis. 12. The semiconductor tape processing system includes: a loading portion, For receiving a plurality of semiconductor strips; as claimed in the first or second aspect of the patent application, a cleaning device, a cleaning unit, a semiconductor formed by processing the respective rotating belts Packaging; whether the semiconductor package is a detecting part for detecting defects after cleaning and drying; an unloading part for: collecting the tested semiconductor package; and: the feeding part is for picking up Each of the semiconductor strips or semiconductor packages '^ picked up a material strip or material_loading portion, the processing unit, the cleaning/drying portion, the detecting portion or the unloading portion. The material belt processing system of claim 7, wherein the 69 ^ 04087 loading box is used to stack the half bodies. A conveying device is used to convey the loading box; a first steering lane fed by the transmitting device for rotating through the semiconductor strips; and the stacked semiconductor-embedders for feeding the straps in the loading cassette to the first steering The unloading section includes: - a second transfer lane, the semiconductor strips received by the singular and cut through the feed section; the unloading box is used for stacking Cutting each of the semiconductor strips; a communicating device 'slim to transport the unloading cassette; and a holder'_ to transport the cut semiconductor strips stacked on the second steering track to the unloading box.