TWI373815B - - Google Patents

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Publication number
TWI373815B
TWI373815B TW097119135A TW97119135A TWI373815B TW I373815 B TWI373815 B TW I373815B TW 097119135 A TW097119135 A TW 097119135A TW 97119135 A TW97119135 A TW 97119135A TW I373815 B TWI373815 B TW I373815B
Authority
TW
Taiwan
Prior art keywords
unloading
video
semiconductor
detection
rail
Prior art date
Application number
TW097119135A
Other languages
Chinese (zh)
Other versions
TW200905772A (en
Inventor
Ssang-Gun Lim
Sang-Yun Lee
Ho-Keun Choi
Seung-Gyu Ko
Original Assignee
Intekplus Co Ltd
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Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200905772A publication Critical patent/TW200905772A/en
Application granted granted Critical
Publication of TWI373815B publication Critical patent/TWI373815B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
    • B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Multimedia (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Description

1373815 九、發明說明· 【發明所屬之技術領域】 本發明係有關於-種半導__㈣“ 種可於單—制，分㈣半導^ 裝之不同領，進行檢測，而提昇裝備活賴力，並增加檢 測良率之半導體封裝的檢測系統。 【先前技術】 通系、’半導體封裝之發展動向係朝儘可能減小封裝之 ^旦又兼顧到可保障動作之可靠性之方向發展。因此， 由現在最廣泛❹之引線框架之表面實裝㈣展至超小 $晶片尺寸半導體封裝（chiP scale se 二 conductor pack e )，最終則以倒 裝晶片半導體封裝為目標。 片夕巧裝晶片封裝係藉以凸塊（b ump)連鍵半導體晶 模座之電極與半導體封裝用基板之技術製造之半導體 ^ ’而取代習知技術之半導体封以金結半導體晶 片與弓I線框架之線結技術。 焊凸Γ為倒裝晶片半導體封裝之製造方法之〆，可使用錫 财半邋雕1!作為前述錫焊凸塊之製造方法之一例，則可於 用噴嘴之預定部分轉印助焊劑（f1u x)後’使 、.罝錫球，並經回填而全部熔接，而製造錫焊凸塊。 a b 1 f倒裝晶片封裴之外部連接係藉附著用於B GA( b g r i d array)之球形錫球而進行。 a 之倒裝晶片〜球栅陣列（f 1 i P c h i p -g r i d array;以下稱之為「F G — 6 ⑸ 3815 A」）域神在相上之佩時，由於料性能造成 f重之影響，故除内部之電性之問題檢測以外，亦須 密地進行使用C C D相機等之外觀檢測。 第十-圖係顯示習知之半導體封裝之外觀檢測裝置之 Γ貫施例之構造圖，其構造包含有：本體10Q;可供載 登容置有應檢测之半導體封裝之承载盤之裝載部2工〇 ; 用以檢測半導體封裝之檢測部300;用以臨時保管容置 有檢，後之半導體封裝之暫存承載盤之暫存部2 2 〇 ;用 =載疊容置有檢測後分類為瑕疲品之半導體封裝之承載 盤，但依瑕疵種類而分類進行載疊之第一 ’廢品部24 0及第三廢品部25〇，·用以載^1有 ，測後分類為正常品之半導體封裝之承載盤之卸載部2 6 2 ;分，與《部2 1 ◦、暫存部2 2 Q、第—廢品部2 β =、第二廢品部2 4◦、第三廢品部2 5◦及卸載部2 6 0連結’並可使承载盤朝本體工〇 〇之前後方向移動之 複數個承載盤移送部4 6 0 ;設於本體之上側而可朝水平 方向來回移送，以於裝載部21 0、暫存部2 2 〇、第一 ，品部2 30、第二廢品部24〇、第三廢品部25〇及 Ρ载。卩2 6 0之承載盤移送部間移送承載盤之搬送部5 〇 ^ ;設成可來回移送於暫存部2 2 〇、第一廢品部2 3 〇、 第二廢品部2 4 0、第三廢品部2 5 0及卸載部2 6 〇之 ^载f移送部之間，並可自移送至卸載部2 6 0之承載盤 夕送。P之承載盤所容置之半導體封裝中楝出瑕疵品，再依 瑕絲類對第一廢品部2 3 0、第二廢品部2 4 〇、第三1373815 IX. OBJECT DESCRIPTION OF THE INVENTION · TECHNICAL FIELD OF THE INVENTION The present invention relates to a kind of semi-conducting __(four) "species can be used in single-system, sub-four (four) semi-conducting, to detect, and to enhance equipment and live Force, and increase the detection rate of the detection system of the semiconductor package. [Prior Art] The development trend of the semiconductor system is to reduce the package as much as possible and to ensure the reliability of the operation. Therefore, the surface mounting of the most widely used lead frame (4) is extended to the ultra-small chip semiconductor package (chiP scale se), and finally the flip chip semiconductor package is targeted. The package is replaced by a semiconductor fabricated by the technique of bumping the electrode of the semiconductor crystal mold holder and the semiconductor package substrate, and replacing the semiconductor junction of the metal junction semiconductor wafer and the bow I-line frame. The solder bump is a manufacturing method of a flip chip semiconductor package, and can be used as an example of the manufacturing method of the solder bump. The predetermined portion of the nozzle transfers the flux (f1u x), and then the solder ball is completely fused to be soldered. The ab 1 f flip chip package is externally attached. In the B GA (bgrid array) spherical tin ball. a flip chip ~ ball grid array (f 1 i P chip - grid array; hereinafter referred to as "FG — 6 (5) 3815 A") domain in the phase In the case of the above, the influence of the weight of the material is affected by the weight of the material. Therefore, in addition to the detection of the internal electrical property, the appearance inspection using a CCD camera or the like must be performed in close proximity. The tenth-figure is a structural view showing a conventional embodiment of a semiconductor package of an appearance detecting device, and the structure includes: a body 10Q; and a loading portion for carrying a carrier of the semiconductor package to be mounted. 2 〇; a detecting unit 300 for detecting a semiconductor package; a temporary storage portion for temporarily storing a temporary storage carrier in which the semiconductor package is inspected; 2 〇; For the carrier package of the semiconductor package of the fatigue product, the first 'waste part 24 0 and the third waste part 25 载 are stacked according to the type of the product, and are used to carry the test, and are classified as normal after the test. The unloading portion of the carrier of the semiconductor package 2 2 2; and the "part 2 1 ◦, the temporary storage portion 2 2 Q, the first waste portion 2 β =, the second waste portion 2 4 ◦, the third waste portion 2 5◦ and the unloading unit 260 are connected to the plurality of carrier-distributing portions 460 that can move the carrier to the front and rear of the body, and are disposed on the upper side of the body and can be transferred back and forth in the horizontal direction. Loading unit 21 0, temporary storage unit 2 2 〇, first, product part 2 30, second waste part 24 〇, third waste product Ministry 25 and Ρ. The transfer unit 5 of the transfer tray transfer tray of the 卩260 is configured to be transferred back and forth to the temporary storage unit 2 2 〇, the first waste portion 2 3 〇, the second waste portion 2 4 0, the first The three waste parts 250 and the unloading unit 2 6 are transported between the transfer parts and can be transferred to the unloading unit 260. The semiconductor package contained in the P-bearing tray is out of the product, and then the first waste part 2 3 0, the second waste part 2 4 〇, the third according to the silk type

ΐίϋ2 5 Q中任—進行移送’並自容置於暫存承載盤I 紅封裝令揀出正常品，再進行予以置入於前述卸載部 7 1373815 2 6 0之瑕疵品揀出後之空間之分類處理之分類部已◦ 〃此之所謂檢測部3 0係由用以進行視訊檢測之第一及 =二視訊相機所構成，第—視訊相機3 i ◦可檢測載疊於 裝載部之承載盤所容置之半導體封裝之一面， ，瞻測該等半導體封裝之另一面，第；訊相機 與第—魏相機3 2 Q之間職而設有可使容置有 +導體封裝之承載盤倒轉之倒轉部7 〇 〇，以使業經第一 視訊相機310檢測過-面之半導體封裝之另一面^ 二視訊相機3 2 0進行檢測。 立未說明之標號2 7 0係、空盤部，4 1 ◦係裝載固定 #，4 2 0係可供置放空盤之進給部42〇，43〇、4 4 〇、4 5 0、4 6 0則分別代表設於第一、第二、 3 0、2 4 〇、2 5 〇及卸載部2 6 〇之進給部： 610則係用以分類半導體封裝之分類器。 造，由裝載部2 1 ◦供給而藉承載盤移送部 所容置之半導體封裝之一面將由第一視訊相 700加以S測’―面已檢測之半導體封裝則由倒轉部 在此隹1/轉部7 〇 〇將承載盤所容置之半導體 空盤以使半導體封裝露出另—面並 置==機32。檢心 膚』Γ ’：!上述之習知之半導體封裝外觀檢卿詈* ^類型，而僅使用第一視訊相機31〇拍if迫未考 使用第一視訊相機拍$ # ^ ,, 面，教 別有無贼。#攝另I而藉所拍攝之影像分析^ 因此，領域個別之反射度互異〇g—b 裝之檢Λ31 信—級低，即成問題。 里之封 換言之’岐半導體W與基板賴焊 4(C〇ntr〇"…C……卜： 用於外部連接之鍚球領域之個 :’：（I分個別領域而同時以相同照明進行照射：： 照明過度而使反射度過高，或局部之照明^足 之影像之可信度降低等問題。 足所付 因此’為依反射度之差別而將半導體封 二=得^別之影像，必須增加使用單= 渐轉數而進行半導體封裝之檢測，而有裝備活 用月b力及檢測良率降低之問題。 【發明内容】 種f乃有馨於上述實情而完成者。其目的在提供- 統設置種類互異之複數相機，以於單-檢 次之朗内’由各相機分別實施對半導體封 =互2域之檢測，而藉一次之旋轉進行全領域之分割 測，並提昇檢測可信度之半導體封裝的檢測系統。 人右為=上述目的，本發明之半導體封襄的檢測裝置包 二，展載部，設於前述本體前方，以將容置有應 測之丰導體封裝之承裁盤送至第-移送軌，.第-視訊檢 9 測部，設於前述第一移送軌，用以進行半導體封裝之第— 面之視訊檢測；第二移送軌，設於前述第一移送轨之一側； 第二視訊檢測部，設於前述第二移送轨上，可使用彩色相 機對半導體封裝之第二面進行2 d檢測；承載盤移送機 構，可使業經前述第二視訊檢測部之視訊檢測之承载盤移 動至前述第二移送執之一側之第三移送執；第三視訊檢測 部，設於前述第三移送轨上，可使用線性掃瞄相機對半導 體封裝進行2D檢測；卸載部，設於前述第三視訊檢測部 之一側，可供容置有良好之半導體元件之承載盤載疊；卸 載轨，設於前述卸載部之後方；暫魏，設於前述卸載執 之-側；第四視訊檢測部，分別設於前述卸載執與前述暫 存軌’可使⑽性掃則目機對半導體封裝之第—面進行 3測勤構，可使前述第一移送執上之承載盤朝第 載移送之，並可使前述第三移送軌上之承 Ϊ 述卸载執或暫存軌加以移送，·複數廢品 廢品部與卸载』：=類器：可移動於前述複數之 封裝。 同日守刀類已元成視訊檢測之半導體 在此，前述筮__、a ^ 可對半導體封襄之莖?一或檢測部可包含：3 D視訊檢測部， 測部，可使用彩色相=仃3 D檢測；及，2 D視訊檢 D檢測。 子則述半導體封裝之第一面進行2 又，前述第=获、、， 於前方設有空盤部卸载軌之間，可進而設有 又’刚4第—訊_及第^物之前段宜分 10 刷式淨化模 別設有清觀置，前述清潔 組，可與半導體封裝表面緊 」且包含有… 杈、，且，汉於别述刷式淨化模 q冻；及，風力淨化 空吸入。 則，可實施空氣喷射及真 在此，前述風力淨化模％ 去除靜電之離子化裝置。 遵而包含可藉離子供給而 另，前述清潔裝置可進而 供裝設前述刷式淨化模組與前 .清潔模組主體，可 可導引前述清潔模組主體之左^二力净化模組；導引部， 側固定於前述清潔模組主體上；*向移動；正時皮帶，一 之兩側，可驅動前述正時由册:輪，固定於前述導引部 移動；及昇降裝置，設於前：清潔模組主體左右 2真空吸附塾將已容置於承載盤部’可於 使其進行昇峰。 千導體封裝吸附後， 依據本發明，就單一檢測系 機，而於單-檢測系統旋轉一次之互異之複數相 對半導體縣之塑膠材質領域之機實施 球栅陣列面之30及2〇檢測，即 轉進行全領域之分割檢測，並提昇檢測可#、 j 備活用能力反檢測良率。 ^且&南裝Ϊ́ίϋ2 5 Q 任—transfer' and self-contained to the temporary storage tray I Red package to pick up the normal product, and then placed in the space of the unloading part 7 1373815 2 6 0 after the picking out The classification unit of the classification processing has been constructed by the first and second video cameras for performing video detection, and the first video camera 3 i can detect the carrier tray stacked on the loading unit. One side of the semiconductor package that is housed, and the other side of the semiconductor package, the first camera and the first camera are equipped with a carrier that can accommodate the + conductor package. The reversing portion 7 is configured to detect the other side of the semiconductor package that has been detected by the first video camera 310. The unillustrated number 2 7 0 system, the empty disk part, the 4 1 ◦ series loading fixed #, 4 2 0 is the feeding part 42 〇, 43 〇, 4 4 〇, 4 5 0, 4 60 represents the feed units located at the first, second, 30, 2 4 〇, 2 5 〇 and unloading portions 2 6 分别 respectively: 610 is a classifier for classifying semiconductor packages. One side of the semiconductor package that is supplied by the loading unit 2 1 而 and carried by the carrier disk transfer unit will be smeared by the first video phase 700. The semiconductor package that has been detected is turned by the inverted portion. The portion 7 〇〇 will carry the semiconductor empty disk accommodated in the disk to expose the semiconductor package to the other side and juxtapose == machine 32. Check the heart skin Γ ':! The above-mentioned conventional semiconductor package appearance inspection 詈 * ^ type, and only use the first video camera 31 if shot if forced not to use the first video camera to shoot $ # ^ ,, face, teach Don't have a thief. #摄其他I and use the image analysis of the shooting ^ Therefore, the individual reflections of the field are different from each other. g-b is installed in the letter 31. The letter is low, which is a problem. In other words, the seal of the 'W semiconductor W and the substrate solder 4 (C〇ntr〇 " ... C ... Bu: for the external connection of the field of the ball: ': (I divided into individual areas while simultaneously with the same lighting Irradiation:: If the illumination is too high, the reflectance is too high, or the reliability of the image of the local illumination is reduced. Therefore, the image is paid for the difference between the reflections and the semiconductor. It is necessary to increase the use of the single = gradual rotation number for the detection of the semiconductor package, and there is a problem that the equipment uses the monthly b force and the detection yield is lowered. [Summary of the Invention] The kind f is succinctly completed by the above facts. Providing - a system that sets up a variety of different types of cameras to perform the detection of the semiconductor seal = mutual 2 domain by each camera in a single-detection process, and the rotation of the whole field is performed by one rotation and is improved The detection system of the semiconductor package for detecting the reliability. The right side is the above purpose, the detection device of the semiconductor package of the present invention includes a second display portion, and the display portion is disposed in front of the body to accommodate the conductor to be tested. Packaged tray a first-to-first detection rail is disposed on the first transfer rail for performing video detection on a first surface of the semiconductor package, and a second transfer rail is disposed on one of the first transfer rails The second video detecting unit is disposed on the second transfer rail, and can detect the second surface of the semiconductor package by using a color camera for 2 days; and the carrier disc transfer mechanism can enable the video detection by the second video detecting unit. The carrier tray is moved to the third transfer holder on one side of the second transfer holder; the third video detection unit is disposed on the third transfer rail, and the semiconductor package can be 2D-detected using a linear scan camera; Provided on one side of the third video detecting unit, the carrier tray for accommodating a good semiconductor component is stacked; the unloading rail is disposed behind the unloading portion; and the temporary unloading is disposed on the side of the unloading side; The fourth video detecting unit is respectively disposed on the unloading and the temporary storage rails, so that the (10) scanning machine can perform the third measuring operation on the first surface of the semiconductor package, so that the first transfer carrier can be carried. Move to the first And, the unloading or temporary storage rails on the third transfer rail can be transferred, and the plurality of scrap waste parts and unloadings: = class: can be moved in the foregoing plurality of packages. In this case, the semiconductor 检测__, a ^ can be used for the semiconductor sealing stem or the detecting portion can include: a 3 D video detecting portion, and the measuring portion can be detected using a color phase = 仃 3 D; And 2D video detection D detection. The first side of the semiconductor package is performed 2, and the above-mentioned ==,,,,,,,,,,,,,,,,,,,,,, - News _ and the first part of the first object should be divided into 10 brush-type purification molds with Qingguan, the cleaning group can be tight with the surface of the semiconductor package and contain... 杈,,,, Mode q frozen; and, wind purification air intake. Then, it is possible to carry out air injection and, in fact, the above-mentioned wind purification mold % removes the electrostatic ionization device. The cleaning device may further comprise a brush cleaning module and a front cleaning module body, and may guide the left and right force cleaning modules of the cleaning module body; a guiding portion, the side is fixed on the cleaning module body; the * direction is moved; the timing belt, one side of the two sides, can drive the timing of the book: the wheel is fixed to the guiding portion to move; and the lifting device is disposed at Front: The left and right sides of the cleaning module body 2 vacuum adsorption 塾 will be placed in the carrier tray 'can be used to raise the peak. After the 1000-conductor package is adsorbed, according to the present invention, the single-detection system is used, and the single-detection system rotates once and the plural is different from the semiconductor material field of the semiconductor county to perform the 30- and 2-inch detection of the ball grid array surface. That is to turn to the whole area of the segmentation detection, and improve the detection can be #, j preparation capacity to reverse detection yield. ^And & Southern

f實施方式J 本發明可藉後述之參照附圖說明之較佳實施例而更為 清楚明瞭。以下，即藉實施例詳細說明之，以促使熟習本 技術領域之業者理解本發明。 … 第一圖係本發明第一實施例之半導體封裝檢測裝置之 概念圖，第二圖則係顯示第一圖之實施例之局部省^立雕 1373815 圖，第三圖係第二圖之平面圖。如該圖所示，本實施例之 半導體封裝檢測系統包含有：本體1、裝載部1 〇、第一 視訊k測部1 2、第一視訊檢測部1 4、承載盤移送機構 1 6、第三視訊檢測部1 7、卸載部2 〇、廢品部4 〇、 倒轉機構.5 0、弟四視訊檢測部2 2、分類器6 〇。 在此，裝載部1 0設於本體1之前方，可裝載容置有 應檢測之半導體封裝之承載盤而供給承載盤。The invention will be more apparent from the following description of the preferred embodiments of the invention. The following is a detailed description of the embodiments to facilitate the understanding of the present invention by those skilled in the art. The first figure is a conceptual diagram of a semiconductor package detecting device according to a first embodiment of the present invention, and the second drawing is a partial plan view showing the first embodiment of the first figure, 1373815, and the third drawing is a plan view of the second figure. . As shown in the figure, the semiconductor package detecting system of the present embodiment includes: a main body 1, a loading unit 1 , a first video k measuring unit 1 , a first video detecting unit 14 , a carrier disk transfer mechanism 16 , and a first The three video detection unit 17 , the unloading unit 2 , the waste unit 4 , the reverse mechanism . 50 , the fourth video detection unit 2 2 , and the classifier 6 . Here, the loading unit 10 is disposed in front of the main body 1 and can be loaded with a carrier tray containing the semiconductor package to be inspected and supplied to the carrier.

第一視訊檢測部1 2設於第一移送軌1 1上，可對自 裝載部1Q移人之半導體封裝之第—面進行視訊檢測。 此時，第一視訊檢測部1 2則包含可對半導體封裝之 第一面進行jLH沒測之3D視訊檢測部i 2 a、可使^彩 色相機對半導體封裝之第-面進行2 D檢測之2 〇檢 1 2 b ° 換§之，半導體晶片與基板藉錫焊凸塊而結合之C 4 (C〇ntrolled-collapse chlp c〇nnec t i οη)領域宜由3D視訊檢測部i2aThe first video detecting unit 12 is disposed on the first transfer rail 1 1 and can perform video detection on the first surface of the semiconductor package that has been transferred from the loading unit 1Q. At this time, the first video detecting unit 1 2 includes a 3D video detecting unit i 2 a capable of performing jLH undetected on the first surface of the semiconductor package, and enables the color camera to perform 2D detection on the first surface of the semiconductor package. 2 〇1 1 b ° § §, the semiconductor wafer and the substrate by solder bumps combined C 4 (C〇ntrolled-collapse chlp c〇nnec ti οη) field should be 3D video detection i2a

進行檢測’ C4周邊之由塑膠材質構成之大面積之檢測項 目與顏色之瑕疵檢測則宜使用彩色相機而由2 D檢 、 2 b進行檢測。 又 弟二視訊檢測部1 設於第一視訊檢測部工2 上’可使用彩色相機對半導體封裝之第二面進行2D檢測。 在此，第二視訊檢測部丄4係對半導體 面：亦即球平面朋（ball iand 進仃2D檢測。換言之，係使用彩色相機， 之檢測項目與顏色之瑕疵檢測。 丁大面積 12 承載盤移送機構（TRM:tray rail m ° V 1 n g m〇dule)係可使已於第二視訊檢測部 經視訊檢測之承載盤移至第三移送軌丄5者，為一可 令承載盤移動至各執間之移送機構。 另’弟二視訊檢測部1 7設於第三移送軌1 5上，可 使用線性掃晦相機對半導體封裝之第二面進行2 d檢測。 gP，係使用線性掃瞄相機就球平面領域（b a 1 1 1 a n d a r e a )之小檢測項目進行細部檢測。 又’本體1之前方設有可供容置正常半導體元件之承 載盤載疊之卸載部2 〇，卸載部2 〇之後方則設有正常品 承載盤將移至之卸載軌2 1，卸載執2 1之一側則設有暫 存承載盤將移至之暫存軌31。 在此，卸載軌21及暫存軌3 1分別設有可對半導體 封裂之第一面使用線性掃瞄相機進行2 D檢測之第四視訊 檢測部2 2。 在此’第四視訊檢測部2 2係使用線性掃瞄相機而進 行塑膠材質領域之2 D檢測者，而可就2 D檢測項目之領 域進行小檢測項目之檢測。 其次，倒轉機構5 〇設於本體]；之後方’可使第一移 送軌11上之承載盤倒轉而加以移送至第一視訊檢測部1 2上，並使第三移送執1 5上之承載盤倒轉而加以移送至 卸載軌21或暫存執31。 又’廢品部40可將視訊檢測後之半導體元件中之瑕 疵元件依瑕疵類蜇分類而加以容置，包含有複數之廢品部 4 O.a、4 0 b，各廢品部4 0 a、4 〇 b則設有廢品執 13 1373815 4 1。 二在此，第三移送執1 5與卸載軌21之間進而設有於 月|J方設有空盤部7〇之空盤供給軌7 1，而宜藉此對複數 之廢品軌41供給可供容置半導體元件之空盤。 另 刀類器6 0可移動於複數之廢品執41與卸載轨 訊檢測後之半導體封f分別分類至卸裁For the detection of a large area of the plastic material made up of C4, the detection of the color and the color should be detected by 2D and 2 b using a color camera. Further, the second video detecting unit 1 is provided on the first video detecting unit 2, and the second surface of the semiconductor package can be detected by the color camera using 2D. Here, the second video detecting unit 丄4 is a pair of semiconductor surfaces: that is, a ball plane (ball iand) 2D detection. In other words, a color camera is used to detect the detection items and colors. Ding large area 12 carrier tray The transfer mechanism (TRM: tray rail m ° V 1 ngm〇dule) is configured to move the carrier disk that has been visually detected by the second video detection unit to the third transfer track 5, so that the carrier disk can be moved to each The transfer mechanism of the hold. The other two video detection unit 17 is disposed on the third transfer rail 15 to perform a 2 d detection on the second side of the semiconductor package using a linear broom camera. gP is a linear scan. The camera performs detailed inspection on the small detection item of the spherical plane area (ba 1 1 1 andarea). Further, the unloading portion 2 〇, the unloading portion 2 of the carrier tray on which the normal semiconductor element can be accommodated is provided in front of the body 1. After that, there is an unloading rail 2 to which the normal product carrying tray will be moved, and one side of the unloading holding 2 1 is provided with a temporary storage tray 31 to which the temporary storage tray will be moved. Here, the unloading rail 21 and the temporary storage are temporarily stored. Tracks 3 1 are respectively provided with the first to seal the semiconductor The fourth video detecting unit 2 2 that performs 2D detection using a linear scan camera. Here, the 'fourth video detecting unit 2 2 performs a 2D detector in the plastic material field using a linear scanning camera, but can be 2 D In the field of the test item, the detection of the small test item is performed. Next, the reverse mechanism 5 is disposed on the main body]; the rear side can reverse the transfer tray on the first transfer rail 11 and transfer it to the first video detecting unit 1 2 And the carrier tray on the third transfer carrier 15 is reversed and transferred to the unloading rail 21 or the temporary storage 31. The waste portion 40 can classify the defective components in the semiconductor component after the video detection according to the class The housing contains a plurality of waste parts 4 Oa, 40 b, and each waste part 40 a, 4 〇 b is provided with waste 13 1373815 4 1 . Second, here, the third transfer 1 5 and the unloading rail 21 Further, there is an empty disk supply rail 7 1 which is provided with an empty disk portion 7 on the side of the J|J side, and it is preferable to supply the plurality of waste rails 41 with an empty disk for accommodating the semiconductor element. 6 0 can be moved to a plurality of scrap products 41 and the semiconductor seal after the unloading track detection Classification to unload cut

第四圖係本發明第二實施例之半導體封裝檢 =圖，第五圖係本發明第二實施例之半導體封紐測系 部已雀略之立體圖，第六圖係第五圖之平面圖，盥 上述本發明第—實施例姻之構成要素則省略料明/、 本發明第二實施例之半導體封裝檢測系統於第 檢測部1 2及第二視訊檢測部i 4之前段分別設有清潔裝 置 8 0。 、、 第七圖係本發明之半導體封襄檢測系統之清潔裝 前方立體圖，第A祕第七圖之背面圖。本發明第The fourth figure is a semiconductor package inspection diagram of the second embodiment of the present invention, and the fifth diagram is a perspective view of the semiconductor package measurement system of the second embodiment of the present invention, and the sixth diagram is a plan view of the fifth diagram. In the semiconductor package inspection system of the second embodiment of the present invention, the cleaning device is respectively disposed in the front portion of the detecting portion 12 and the second video detecting portion i 4 in the semiconductor package detecting system according to the second embodiment of the present invention. 8 0. The seventh drawing is a front perspective view of the cleaning device of the semiconductor sealing and detecting system of the present invention, and the rear view of the seventh drawing of the A secret. Invention

例之清潔裝置80包含有清潔模組主體8Qa :設於清、、^ 模組主體8 Q a之下端，可與半導體封裝表面緊貼而移 動，同時進行清潔之刷式淨化模組8丄；設於刷式淨 組8 1之兩側，可實施空氣噴射及真空吸人之風力淨化模 組 8 2 〇 . 、 另 八亚可導引、;月潔模組主體8 〇 a之左右方 移動之導引部8 0 b ; 一側固定於清潔模組主體8 〇 正時皮帶80C;固定於導引部8Qb之兩側，可 驅動而驅動正時皮帶8◦c ’以使清潔模組主體8 〇 a = 導引部8 0 b而左右移動之帶輪8 〇 d。 0 14 1373815 另，其並設有昇降裝置8 4，設於清$ a之下部，可於使用真空吸附塾8 3而=3主體8 〇 之半導體封裝後，進行昇降。 合置於承截槃 此外，雖未圖示，但本發明第二實施 風力淨化模組82宜進而包含可利用離子供认=裝置之 之離子化裝置（未圖示）’以藉靜電防止元件°除靜電 第九及第十圖係說明本發明之半暮雕 劣化。 清潔裝置之作用者，首先，-旦移送裝檢測系统之 承載盤，即使用設於昇降裝置84之真介d半導體封袈之 半導細，並將半導體封裝固定於真；，附 而後，使設有真空吸附塾83之昇 d上。 ，半導體封裝裝載至清潔高度，再藉馬達 ^， 〇 d旋轉’而驅動與帶輪8 Q d連結之正 ^輪8 藉此，清潔模組主體8 〇 a即可沿 二c。 右方向移動，刷式淨化模叙8 i b朝左 而滑動進行料:。 1、+導_裝表面緊貝占 吸入，二實，空氣噴射及真空 刷式淨化及風力淨化所造成之微:塵埃=:;空'除 依據本發明’就單—檢剛系統設置之 機，而於單一檢測系統旋轉一 ★ 、互，、之歿數相 體封裝之塑膠材質領域心4二與施 球柵陣列面之3D及2D檢剛二=輯、 轉進行全領域之分割檢測 9 Ί’4之一次旋 備活用能力及檢測良率。"# W可仏度’且提高巢 15 1373815 ,以上已參照附圖藉具體實施例說明本發明，但本發明 並不限於上述具體例，凡不逸脫本發明範圍之限度内可進 =各種#更貫施’自不待言。因此，本發明之範圍應可依 匕含前述各種變形例而記載之中請專·圍而分析之。 【圖式簡單說明】 係顯示本發明第—實施例之半導體封裝檢測系統之 概念圖。The cleaning device 80 includes a cleaning module body 8Qa: a brush cleaning module 8 that is disposed at the lower end of the module body 8 Q a and can be moved close to the surface of the semiconductor package while cleaning. It is installed on both sides of the brush type net group 81, and can be used for air jet and vacuum suction wind purification module 8 2 〇., another VIII can be guided; The guiding portion 8 0 b ; one side is fixed to the cleaning module body 8 〇 timing belt 80C; fixed to both sides of the guiding portion 8Qb, can drive and drive the timing belt 8 ◦ c ' to make the cleaning module body 8 〇a = the guide 8 0 b and the pulley 8 〇d moving left and right. 0 14 1373815 In addition, a lifting device 8 4 is provided, which is disposed under the lower portion of the device, and can be lifted and lowered after using the semiconductor package of the vacuum suction 塾 8 3 and the body 3 8. In addition, although not shown, the second embodiment of the wind purification module 82 of the present invention further includes an ionization device (not shown) that can use the ion supply device to prevent the component from being electrostatically trapped. The ninth and tenth drawings excluding static electricity illustrate the deterioration of the semi-carving of the present invention. The driver of the cleaning device firstly transfers the semi-conducting thinner of the real-time d-semiconductor package provided on the lifting device 84, and fixes the semiconductor package to the true one; There is a vacuum adsorption 塾 83 on the rise d. The semiconductor package is loaded to the cleaning height, and the motor is rotated by the motor ^, 〇 d to drive the positive wheel 8 connected to the pulley 8 Q d , whereby the cleaning module body 8 〇 a can be along the second c. Moving in the right direction, the brush-type cleaning module 8 i b slides to the left to feed: 1, + guide _ loading surface tight shell accounted for inhalation, two real, air jet and vacuum brush purification and wind purification caused by micro: dust =:; empty 'except according to the invention 'single-checking system setting machine In the single detection system, the rotation of a ★, mutual, and the number of phase-packed plastic material field 4 2 and the ball-arc array surface 3D and 2D inspection just two = series, turn the whole field segmentation detection 9 Ί '4's one-time rotation utilization ability and detection yield. "#W 仏度' and raise the nest 15 1373815, the invention has been described above by way of specific embodiments with reference to the accompanying drawings, but the invention is not limited to the specific examples described above, and the invention is not limited to the scope of the invention. Various #更贯施' is self-evident. Therefore, the scope of the present invention should be analyzed in accordance with the various modifications described above. BRIEF DESCRIPTION OF THE DRAWINGS A conceptual diagram of a semiconductor package inspection system of a first embodiment of the present invention is shown.

第第:==::施例之局部省略立體圖 【四圖係本發明第二實施例之半導體封裝檢測系統之構造 導體封裝檢測系統 第五圖係已省略本發明第二實施例之半 之局部之立體圖。 第六圖係第五圖之平面圖 # 系統之清潔裝置之前方 第七圖係本發明之半導體 立體圖。The fifth embodiment of the semiconductor package inspection system of the second embodiment of the present invention has been omitted. Stereo view. Figure 6 is a plan view of the fifth figure #前的清洁装置 The seventh figure is a perspective view of the semiconductor of the present invention.

第八圖係第七圖之背面圖。 第九圖及第十圖係說明本發明 潔裝置之作用者。 牛導體封裝檢測系統之清 第十一圖係顯示習知之半導體封 例之構造圖。 t卜蜆檢測裝置之一實施 【主要元件符號說明】 1…本體 10…裝載部 1 1…第一移送軌 16 1373815 1 2…第一視訊檢測部 1 2 a…3 D檢測部 1 2 b…2 D檢測部 1 3…第二移送執 1 4…第二視訊檢測部 1 5…第三移送執 1 6…承載盤移送機構 17…第三視訊檢測部 2 0…卸載部 21…卸載轨 2 2…第四視訊檢測部 3 0…暫存部 31…暫存執 4 0、4 0 a、4 0 b…廢品部 41…廢品轨 5 0…倒轉機構 6 0…分類器 7 0…空盤部 71…空盤供給軌 8 0…清潔裝置 8 0 a…清潔模組主體 8 0 b…導引部 8 0 c…正時皮帶 8 0 d…帶輪 17 1373815 81…刷式淨化模組 8 2…風力淨化模組 8 3…真空吸附墊 8 4…昇降裝置 1 0 0…本體 2 1 0…裝載部 2 2 0…暫存部 2 3 0…第一廢品部 2 4 0…第二廢品部 2 5 0…第三廢品部 2 6 0…卸載部 2 7 0空盤部… 3 0 0…檢測部 310…第一視訊相機 3 2 0…第二視訊相機 41 0裝載固定部… 420、430、440、450、460…進給部 4 6 0…承載盤移送部 5 0 0…搬送部 6 0 0…分類部 6 10…分類器 7 0 0…倒轉部 18The eighth figure is the rear view of the seventh figure. The ninth and tenth drawings illustrate the role of the cleaning device of the present invention. The description of the cattle conductor package inspection system is shown in Fig. 11 showing the construction of a conventional semiconductor package. One of the t-detection devices is implemented. [Main component symbol description] 1... Main body 10: Loading unit 1 1... First transfer rail 16 1373815 1 2... First video detecting unit 1 2 a... 3 D detecting unit 1 2 b... 2D detecting unit 1 3...second transfer command 1 4...second video detection unit 1 5...third transfer command 1 6...carrier disk transfer mechanism 17...third video detection unit 2 0...unloading unit 21...unloading track 2 2...fourth video detection unit 30... temporary storage unit 31... temporary storage 4 0, 4 0 a, 4 0 b... scrap unit 41... scrap rail 5 0... reversing mechanism 6 0... classifier 7 0... empty disc Section 71... empty disk supply rail 80 [...] cleaning device 8 0 a... cleaning module body 8 0 b... guiding portion 8 0 c... timing belt 8 0 d... pulley 17 1373815 81... brush cleaning module 8 2...wind purification module 8 3...vacuum adsorption pad 8 4...lifting device 1 0 0...body 2 1 0...loading unit 2 2 0...temporary part 2 3 0...first waste part 2 4 0...second waste Part 2 5 0...third scrap part 2 6 0...unloading unit 2 7 0 empty disc part... 3 0 0...detecting unit 310...first video camera 3 2 0...second video camera 41 0 loading fixed part...420 430, 440, 4 50, 460... Feeding unit 4 6 0... Carrying tray transfer unit 5 0 0... Transport unit 6 0 0...Classification unit 6 10... Classifier 7 0 0... Reverse unit 18

Claims (1)

1〇1 年 2 /tr »-» h ·. 穿換頁 1 厂 /"j q — 二i .工 么:’厂，， --------- 申請專利範圍 本體 裝載。卩，设於前述本體前方，用 半導體«之承载盤送至第-移送轨；d有應如則之 導姊^ 2檢’料’設於前述第1送執，用以進行半 W縣面之视訊檢測； 丁牛 第一移运執，設於前述第一移送執之一側； 色相之上，彩 訊二=::;ϊ=二視訊檢測部之視 執； 則述第一移迗轨之一側之第三移送 第三視訊檢測部，設於前述第三 性知目苗相機對半導體封料MD檢測；了使用線 卸載部，設於前述笛_ 有良好之半導體元件測部之-側，可供容置 卸載軌，設於前述卸载部之後方； 暫存轨，設於前述卸载軌之一側； 執，分別設於前述卸载執與前述暫存 檢測7使祕目機對半導體料之第_面進行^子 倒轉機構，可使前述望一 送執上倒轉而移送之，並：=上之承载盤朝第二移 倒轉而朝前述卸载執或暫存軌=ΐς移送執上之承載盤1〇1 year 2 /tr »-» h ·. Wear page change 1 Factory /"j q — II. Work: 'Factory,, --------- Patent application scope Loading.卩, located in front of the above-mentioned body, using the semiconductor «the carrier tray to send to the first-to-feed rail; d should be the same as the guide 姊 ^ 2 inspection 'material' is set in the first delivery, for semi-W county Video detection; Dingniu first transfer operation, set on one side of the first transfer holder; above the hue, color message two =::; ϊ = two video detection department's view; The third video transmission unit on the side of one of the rails is disposed on the third sealing device to detect the semiconductor sealing material MD; and the line unloading portion is used in the flute _ having a good semiconductor component measuring unit The side-side is adapted to receive the unloading rail, and is disposed behind the unloading portion; the temporary storage rail is disposed on one side of the unloading rail; and the holding is respectively disposed on the unloading and the temporary storage detecting 7 to make the secret machine Performing the sub-inverting mechanism on the _th surface of the semiconductor material, the above-mentioned hopping and sending can be reversed and transferred, and: = the upper carrying tray is reversed toward the second shifting and is transferred to the unloading or temporary rail = ΐς Carrying tray 複數廢品部，設於前述卸載部之一側k 導體元件之瑕疵種別加以分類容置丨及 分類1，可移動於前述魏之廢 同時分類已完成視崎狀半導體封裝/、卸载部之間， 2、如申請專利範圍第1項所述 系統’其中前述第—視訊檢測部包含有：—I的檢測 3 D視訊檢測部，可對半導體 檢測；及 裝之第—面進行3D 2D視訊檢測部’可制彩色 之第一面進行2 D檢測。 ·別乂半導體封裝 / 3、如申請專利範圍第i項所述 糸統’其中前述第三移送軌與前述_載$=封裳的檢測 於前方設有空盤部之m給執。 ’進而設有 4 '如申請專利範圍第1〜3項中枉TS 體封裝的檢測m切縣1中任1所述之半導 檢測部之前段分別設㈣gir視訊檢測部及第二視訊 5、 如申請專利範圍第4 糸統，其帽述清缝置包含有：状牛㈣龍的檢制 刷式淨化模組，可與丰導 潔；及 ^導體封裝表面緊貼而加以清 風力淨化模組，設於 空氣喷射及真空吸入。 净化棋組兩側，可實施 6、 如申請專利範圍第5 系統’其中前述風力淨化模組進 除靜電之離子化裝置。 阳匕3了错離子供給而去 1373815 • . 1 一 Ί1 m'22[a^ 正替換頁 Ίΐη yU 7、如申請專利範圍第6項所述之半導體封裝的檢測 系統，其中前述清潔裝置進而包含有： 清潔模組主體，可供裝設前述刷式淨化模組與前述風 力淨化模組； 導引部，可導引前述清潔模組主體之左右方向移動； 正時皮帶，一側固定於前述清潔模組主體上； 帶輪，固定於前述導引部之兩側，可驅動前述正時皮 帶而使前述清潔模組主體左右移動；及 昇降裝置，設於前述清潔模組主體之下部，可於使用 真空吸附墊將已容置於承載盤之半導體封裝吸附後，使其 進行昇降。 21The plurality of waste parts are disposed on the side of the unloading unit, and the types of the k-conductor elements are classified and accommodated, and the classification 1 is movable between the wastes of the Wei and the unloading sections. 2. The system of claim 1 wherein the video-detection unit includes: -I detection 3D video detection unit, which can detect semiconductor; and the 3D 2D video detection unit 'The first side of the color can be 2D detected. · Don't be a semiconductor package / 3. As described in the scope of the patent application, item ii, the third transfer rail and the aforementioned _ load $= seals are detected in front of the empty part. 'There is a 4', as in the first to third paragraphs of the patent application, the detection of the TS package is the first half of the semi-conductive detection unit described in 1 of the 1st section of the county. (4) The gir video detection unit and the second video 5 are respectively provided. For example, if the patent application scope is 4th, the cap and clearing seams include: the brush-type purification module of the beetle (four) dragon, which can be cleaned with the wind-cleaning mold. Group, set for air injection and vacuum suction. The sides of the chess set can be cleaned. 6. For example, in the fifth system of the patent application, the above-mentioned wind purification module is electrostatically ionized.匕 匕 了 13 738 738 738 738 738 738 738 738 738 738 738 738 738 738 13 13 13 13 13 13 13 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体There is: a cleaning module body, which can be equipped with the brush cleaning module and the wind purifying module; a guiding portion for guiding the left and right direction movement of the cleaning module body; a timing belt, one side fixed to the foregoing Cleaning the main body of the module; a pulley fixed to the two sides of the guiding portion to drive the timing belt to move the cleaning module body to the left and right; and a lifting device disposed at a lower portion of the cleaning module body After the semiconductor package that has been placed on the carrier is adsorbed by using a vacuum adsorption pad, it is lifted and lowered. twenty one
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