KR100811533B1 - Apparatus for vision inspection and packing of semiconductor - Google Patents

Abstract

The present invention relates to a semiconductor inspection and packaging device, and more particularly, to inspect the appearance of the semiconductor in one device, classify the defective semiconductors, and then discharge the good semiconductor in the form of a tray or package it in a reel form. A semiconductor inspection and packaging device.

Such a semiconductor inspection and packaging device includes an appearance inspection unit for inspecting the appearance of a semiconductor with a 3D vision camera on a transfer line of a tray on which a semiconductor is loaded, a marking inspection unit for inspecting a marking portion of a semiconductor with a 2D vision camera, and good / bad defects of a semiconductor. Inspection means for sorting according to whether or not; and a carrier tape having a plurality of seating grooves in the longitudinal direction, a transfer track for transporting the carrier tape, a cover tape for closing the upper side of the carrier tape, and the carrier tape; Packaging means for forming a sealing module for heating and pressing the cover tape; And a transport picker for adsorbing good semiconductors of the inspection means and seating the carriers on the carrier tape of the packaging means.

Semiconductor, visual inspection, marking inspection, sorting picker, transfer picker, carrier tape, cover tape,

Description

Apparatus for vision inspection and packing of semiconductor

Figure 1a, 1b is a perspective view of the semiconductor inspection and packaging device of the present invention,

Figure 2 is an excerpt perspective view of the inspection means of the semiconductor inspection and packaging device of the present invention,

3 is a side view of a rotator of the present invention semiconductor inspection and packaging device;

Figure 4 is an exploded perspective view of the transfer of the semiconductor inspection and packaging apparatus of the present invention,

5 is an exploded perspective view of the sorting part of the semiconductor inspection and packaging apparatus of the present invention,

Figure 6 is an excerpt perspective view of the sorting picker of the semiconductor inspection and packaging device of the present invention,

7A and 7B are front and side views of the transfer picker of the semiconductor inspection and packaging apparatus of the present invention;

8 is an exploded perspective view of the packaging means of the semiconductor inspection and packaging apparatus of the present invention,

9 is a plan view of the semiconductor inspection and packaging apparatus of the present invention;

10 is a left side view of the semiconductor inspection and packaging apparatus of the present invention;

11 is a functional diagram of the transfer of the semiconductor inspection and packaging apparatus of the present invention,

12 is a plan view of the sorting portion of the semiconductor inspection and packaging apparatus of the present invention,

Figure 13a, 13b is a functional diagram of the sorting picker of the semiconductor inspection and packaging device of the present invention,

14a, 14b is an operation of the transfer picker of the semiconductor inspection and packaging device of the present invention,

15A and 15B are a plan view and a side view showing the action of the packaging means of the semiconductor inspection and packaging apparatus of the present invention.

※ Explanation of code for main part of drawing

100: inspection means, 110: transfer line, 112, 114: first and second transfer truck, 120: external inspection unit,

130: rotator, 131, 132: upper, lower gripper, 140: transfer, 141: gripper,

150: marking inspection unit, 160: sorting unit, 161: fixed plate body,

164, 165: first and second bad tray loading section, 166: empty tray loading, 170: sorting picker,

173: elastic link member, 174: adsorber, 175: driving part, 176: lifting part, 200: feed picker,

201: link bar, 202: hinge, 203: elastic link member, 204: adsorber, 205: driving part,

206: lifting unit, 207: rotating unit, 208: slider, 300: packaging means,

301: carrier tape supply reel, 302: carrier tape, 303: transfer track,

304: cover tape supply reel, 305: cover tape, 306: sealing module,

307: Carrier tape winding reel

The present invention relates to a semiconductor inspection and packaging device in which the appearance of a semiconductor is inspected in one device, the bad semiconductors are classified, and the good semiconductor is packaged in a reel form.

In the general semiconductor production process, inspection equipment that checks the marking of the semiconductor and the stand off of leads or balls and discharges them to the tray, and prevents physical damage such as bending or breakage of the semiconductor due to external shocks, It consists of packaging equipment wrapped in reels to prevent electrical damage and to be suitable for the next process, the chip mounter process.

As a result, the operator has to move the semiconductor trays manually between the inspection device and the packaging device, and the process is not integrated into a single device. Is bringing.

In addition, when two pieces of equipment are combined into one piece, the number of pieces of equipment is reduced and the space occupied by the pieces of equipment is greatly improved in productivity. In addition, the number of people operating equipment can be reduced, resulting in higher productivity.

However, at present, the productivity of these two equipments requires as many as two packaging equipments per inspection equipment, and it is not effectively integrated, and device manufacturers are having difficulty in securing competitiveness.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and the semiconductor inspection and inspection of the appearance of the semiconductor in one device, classifying defective semiconductors, and then good semiconductors can be discharged in tray form or packaged in reel form. The purpose is to provide a packaging device.

A semiconductor inspection and packaging device of the present invention is to provide a semiconductor inspection and packaging device that improves the work efficiency by forming the packaging means in two rows.

The semiconductor inspection and packaging device of the present invention has a structure in which the adsorbers of the transfer picker are connected to each other by a link, so that even when the types of semiconductors are changed, the intervals of the adsorbers can be easily adjusted to the gaps of the new semiconductors, SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor inspection and packaging device that can be easily seated even when the gap between the pocket and the pocket of the carrier tape of the packaging means is different.

In addition, an object of the present invention is to provide a semiconductor inspection and packaging apparatus in which the work speed is improved by configuring the adsorber of the transfer picker in two rows and adsorbing a plurality of semiconductors in a tray in two rows to seat on a carrier tape of the packaging means composed of two rows.

The semiconductor inspection and packaging apparatus of the present invention has an effect of inspecting both sides of the semiconductor in one device by flipping the tray loaded with the semiconductor 180 'through the rotator, and closely adhering the plurality of trays through the pressing unit in the rotator. It is an object of the present invention to provide a semiconductor inspection and packaging device that prevents the semiconductor located in the tray from being separated or separated from the tray.

A semiconductor inspection and packaging apparatus according to the present invention is to provide a semiconductor inspection and packaging apparatus which improves work efficiency by classifying defective semiconductors by type and filling good semiconductors in empty positions of a tray on a transfer line in a buffer tray.

In addition, the adsorbers of the sorting picker are connected to each other by a link, so that even when the type of semiconductor is changed and the tray gap is changed, it provides a semiconductor inspection and packaging device that can easily adjust the gap of the adsorber to the gap of the new semiconductor. The purpose is.

The present invention is to provide a semiconductor inspection and packaging device for reducing the waste of working time due to the return of the transfer truck by providing a plurality of transport carts of the transfer line for transporting the tray.

The semiconductor inspection and packaging apparatus of the present invention for achieving the above object is a semiconductor inspection and packaging apparatus, the appearance inspection unit for inspecting the appearance of the semiconductor with a 3D vision camera on the transfer line of the tray loaded with a semiconductor, and a 2D vision camera A inspection means for forming a marking inspection portion for inspecting a marking portion of the semiconductor, a sorting portion classified according to whether the semiconductor is good or bad; a carrier tape having a large number of seating grooves in the longitudinal direction, a transfer track for conveying the carrier tape; Packing means for forming a cover tape for closing the upper side of the carrier tape, and a sealing module for heating and pressing the carrier tape and the cover tape; And a transfer picker for adsorbing good semiconductors of the inspection means and seating the carriers on the carrier tape of the packaging means.

Preferably, the carrier tape, the transfer track, the cover tape, and the sealing module of the packaging means are each provided with two or more lines to form two or more lines.

The transfer picker of the semiconductor inspection and packaging device of the present invention includes a stretchable link member hinged by crossing a plurality of link bars, a plurality of adsorbers fixed to the link bars of the link member by forming an adsorption plate at the tip, and the link member. It is fixed to one end of the drive unit for reciprocating to vary the length of the link member, the lifting unit for lifting the adsorber, and the rotating unit for rotating the adsorber 90 '.

Here, the transfer picker is preferably a plurality of adsorbers are arranged in at least two rows so as to adsorb the semiconductor on the tray to be seated on the plurality of carrier tapes.

Preferably, the inspection means of the semiconductor inspection and packaging device of the present invention includes a rotator for rotating the tray loaded with semiconductor 180 'between the appearance inspection portion and the marking inspection portion.

The rotator includes an upper gripper holding a ball tray, a lower gripper holding a semiconductor tray, a lifter for elevating the upper and lower grippers, and a rotating part for rotating the upper and lower grippers.

Here, the rotator preferably further includes a pressing unit for pressing the semiconductor tray to the upper and lower grippers.

The sorting portion of the semiconductor inspection and packaging apparatus of the present invention, a sorting picker, a fixed plate body on which a plurality of trays are seated, a ball tray stacking ball tray, a transfer line for transporting the fixed plate body and empty tray stacking unit, and It is preferably made of a defective tray loading portion formed at the end of the transfer line for loading the trays.

The sorting picker includes a flexible link member hinged by crossing a plurality of link bars, a plurality of adsorbers fixed to a link bar of the link member by forming an adsorption plate at a tip thereof, and fixed to one end of the link member. And a driving unit for reciprocating to vary the length of the member, and a lifting unit for lifting and lowering the adsorber.

The inspection means of the semiconductor inspection and packaging apparatus of the present invention includes a loading unit for loading the trays on which the semiconductor is loaded, a first transport cart which draws the tray from the loading unit and passes the lower portion of the external inspection unit to the rotator, and the tray from the rotator. Transfer to take out and transfer the transfer, the second transfer bogie to take the tray from the transfer to the marking inspection portion and the sorting portion and the lower portion of the transfer picker, and the unloading portion for loading the empty tray at the end of the second transfer bogie It is preferable to further provide.

Here, it is preferable that a plurality of first and second transfer trucks are provided.

Hereinafter, a preferred embodiment of the semiconductor inspection and packaging device of the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B are perspective views of the semiconductor inspection and packaging apparatus of the present invention, FIG. 2 is an exploded perspective view of the inspection means of the semiconductor inspection and packaging apparatus of the present invention, and FIG. 3 is a side view of the rotator of the semiconductor inspection and packaging apparatus of the present invention. 4 is an exploded perspective view of the transfer of the semiconductor inspection and packaging apparatus of the present invention, Figure 5 is an extractive perspective view of the sorting unit of the semiconductor inspection and packaging device of the present invention, Figure 6 is an excerpt perspective view of the sorting picker of the semiconductor inspection and packaging device of the present invention, Figure 7a, 7b is a front view and a side view of the transfer picker of the semiconductor inspection and packaging device of the present invention, Figure 8 is an exploded perspective view of the packaging means of the semiconductor inspection and packaging device of the present invention.

First, as shown in FIGS. 1A and 1B, the semiconductor inspection and packaging apparatus of the present invention absorbs the inspection means 100 for inspecting the appearance and the marking part while the tray on which the semiconductor is loaded is moved, and the good semiconductor that has been inspected from the tray. The transfer picker 200 to be moved, and the packaging means 300 to be carried by the transfer picker and the semiconductor seated on the carrier tape by heating and compression wrapped with a cover tape and then wound in a reel form.

The inspection means 100 is a transfer line 110 for transferring a tray loaded with a semiconductor, as shown in Figure 2, the appearance inspection unit 120 disposed on the upper side of the transfer line 110 to inspect the appearance of the semiconductor, A rotator 130 that rotates the tray 180 'to turn the semiconductor upside down on the empty tray, a transfer 140 that draws the tray on which the semiconductor is seated from the rotator 130, and transfers it back to the transfer line 110; Marking inspection unit 150 for inspecting the marking portion of the semiconductor on the upper side of the transfer line 110, and sorting unit 160 for classifying the defective semiconductors according to the inspection of the appearance inspection unit 120 and marking inspection unit 150 do.

Here, the transfer line 110 is a loading unit 111 in which a plurality of trays seated with the semiconductors turned upside down and a first tray which draws the trays from the loading unit 111 to the rotator 130. The transport cart 112, the pusher 113 for pushing the tray seated on the first transport cart 112 into the rotator 130, and the second transport cart for receiving and transporting the tray from the transfer 140 ( 114 and an unloading unit 115 on which an empty tray from which semiconductors are drawn by the transfer picker 200 at the end of the second transfer cart 114 is loaded.

In particular, the first and second transfer trucks 112 and 114 are provided in plural, respectively, to improve the work efficiency by continuously transferring the trays.

In addition, the appearance inspection unit 120 is made of a plurality of cameras and lighting for acquiring stereoscopic images by screening defects by image-forming the appearance of the semiconductor and the shapes of the leads, and the marking inspection unit 150 is a semiconductor. It consists of a camera and lighting for inspecting the marking portion printed on, the appearance inspection unit 120 and the marking inspection unit 150 is well known, so the detailed description thereof will be omitted.

The rotator 130 flips the semiconductors passed through the appearance inspection unit 120 in an inverted state so that the marking portion printed on the opposite side of the semiconductor can be inspected by the marking inspection unit 150, as shown in FIG. 3. The gripper upper gripper 131, the lower gripper 132 holding the semiconductor loaded tray, the elevating unit 133 for elevating the upper and lower grippers 131 and 132, and the upper and lower grippers 131 and 132. Rotating portion 134 for rotating the pressure, and pressing the two sides of the tray in close contact with each other on the inner side of the upper and lower grippers (131, 132) to prevent the semiconductor from being separated from the tray when flipping in the state holding the pair of trays It is made of a portion 135.

The transfer 140 includes a gripper 141 for holding a tray as shown in FIG. 4, an elevating unit 142 for elevating the gripper 141, and a transfer table 143 for transferring the gripper 141 from side to side. Is made of.

The sorting unit 160 is a sorting picker 170, a fixed plate body 161 on which a plurality of trays are seated, a ball tray loading box 166 loaded with empty trays, and the fixed plate body 161 as shown in FIG. And first and second transfer trays 162 and 163 for conveying the empty tray loading box 166 and first and second defective trays for loading trays formed at ends of the first and second transfer lines 162. It consists of parts 164 and 165.

Here, the sorting picker 170 as shown in FIG. 6 includes a stretchable link member 173 connected to a hinge 172 by crossing a plurality of link bars 171, and an adsorption plate formed at an end thereof to form the suction link member. A plurality of adsorbers 174 are fixed to the link bar 171 of (173), and the driving unit is fixed to one end of the expansion link member 173 to reciprocate to vary the length of the expansion link member 173 ( 175, and the lifting unit 176 for elevating the adsorber 174. In this embodiment, for example, the adsorber 174 is arranged in four rows.

7A and 7B, the transfer picker 200 includes a stretchable link member 203 connected to a hinge 202 by crossing a plurality of link bars 201, and an adsorption plate formed at an end thereof to form the suction link member 203. A plurality of adsorbers 204 fixed to the link bars 201 of the < RTI ID = 0.0 >) < / RTI > and a driving unit 205 fixed to one end of the elastic link member 203 to reciprocate to vary the length of the elastic link member 203. And a plurality of lifting units 206 for elevating the adsorber 204, a rotating unit 207 for rotating the adsorber 204 by 90 ', and a plurality of assembling units of the adsorber 204 and the driving unit 205. The slider is formed in the assembly unit of any one of the adsorber 204 and the driving unit 205, the slider 208 for adjusting the distance between the opposing side assembly unit, and the transfer table to which the transfer picker 200 ( 209).

Here, the adsorber 204 is to adsorb a plurality of semiconductors simultaneously on a tray in two rows so as to be seated on the carrier tape 302 of the packaging means 300 having two rows, and in this embodiment, the adsorber 204. For example, suppose that 5 is arranged in 2 rows.

As shown in FIG. 8, the packaging means 300 includes a carrier tape supply reel 301 in which a carrier tape 302 is wound, a transfer track 303 to which the carrier tape 302 is transported, and the transport track. A sealing module 306 for heating and compressing the cover tape supply reel 304 in which the cover tape 305 is wound on the upper side of the 303, and the cover tape 305 disposed above the carrier tape 302. The carrier tape 302 to which the cover tape 305 is attached is wound.

Hereinafter, the operation of the semiconductor inspection and packaging apparatus of the present invention will be described.

9 is a plan view of the semiconductor inspection and packaging apparatus of the present invention.

Looking at the overall operation of the present invention with reference to Figure 9, first the tray is moved along the transfer line 110 of the inspection means 100, disposed above the first transfer cart 112 of the transfer line 110 The external appearance inspecting unit 120 inspects the external appearance of the semiconductor, and when the inspection is completed, the pusher 113 positioned at the end of the first transport cart 112 pushes the tray into the rotator 130.

In the rotator 130, the semiconductor having the bottom surface inspected by the external inspection unit 120 is rotated 180 'to be seated on the tray to expose the upper surface, and the transfer 140 withdraws the tray on which the flipped semiconductors are seated from the rotator 130. To be seated on the second transport cart 114.

The marking inspection unit 150 inspects the marking portion printed on the upper surface of the semiconductor on the upper side of the tray moving along the transfer line of the second transfer cart 114.

In addition, the sorting unit 160 uses the sorting picker 170 to absorb the bad trays from the trays and transfers the defective trays to the trays on the fixed plate body 161 disposed on the side to classify the good / bad semiconductors.

Then, the good semiconductors seated on the tray moving along the second transport cart 114 are transferred to the packaging means 300 disposed on the side of the apparatus by the transport picker 200 to be seated on the carrier tape 302. The cover tape 305 is heat-compressed and sealed on the upper side of the carrier tape 302 through the sealing module 306.

Here, the carrier tape 302 is continuously supplied from the carrier tape supply reel 301, the cover tape 305 is continuously supplied from the cover tape supply reel 304, and the cover tape is inserted in the state in which the semiconductor is inserted. The carrier tape 302 to which the 305 is attached is wound on the carrier tape winding reel 307 at the end of the carrier tape 302 transfer track 303.

10 is a left side view of the semiconductor inspection and packaging apparatus of the present invention, which shows a process in which the tray is seated on the rotator 130 from the loading unit 111 of the transfer line 110.

First, when the first transport cart 112 pulls out the tray from the lower end of the loading unit 111 in which the semiconductors are seated so that the bottom surface thereof is exposed to the upper side, the appearance inspection unit 120 firstly moves. Acquire a three-dimensional image of the semiconductor by using a plurality of cameras on the upper side of the transport cart 112, and determine whether the stand-off of the semiconductor lead (LEAD) is defective or the appearance of the semiconductor body by a separate processing means In a separate memory, the position where the defective semiconductor is seated in the tray is stored.

The tray seated and moving on the first transport cart 112 is pushed by the pusher 113 formed on one side at the end of the transport line of the first transport cart 112 to move into the lower gripper 132 of the rotator 130. do.

Then, as shown in FIG. 3, the upper gripper 131 and the lower gripper 132 holding the empty tray while the lower gripper 132 of the rotator 130 grips the tray, respectively, through the lifting unit 133. It moves to abut, and by pressing the pressure portion 135 formed on the inner surface of the upper, lower grippers (131, 132) to press the pair of trays in close contact with each other.

Subsequently, the rotating unit 134 rotates the upper and lower grippers 131 and 132 by 180 'so that the semiconductors of the tray in the lower gripper 132 are transferred to the empty tray of the upper gripper 131. The action of the 135 is released, and the upper and lower grippers 131 and 132 are moved to the opposite sides through the lifting unit 133 so that the gap is widened.

When the semiconductor is turned upside down in the rotator 130 as described above, the upper surface of the semiconductor is exposed, and as shown in FIG. 11, the tray located in the lower gripper 132 is drawn out using the gripper 141 of the transfer 140.

The transfer 140 moves left and right along the transfer table 143 and vertically moves up and down along the lifting unit 142. First, the gripper 141 moves along the transfer table 143. When positioned as the lower gripper 132, the gripper 141 is lowered through the lifting unit 142 to grip the tray in the lower gripper 132. Then, the gripper 141 holding the tray is raised again through the lifting unit 142, and moved along the transfer table 143 to the position of the second transport cart 114, and then the lifting unit 142. The gripper 141 is lowered to seat the tray on the second transport cart 114.

The tray seated on the second transport cart 114 moves along the movement line of the second transport cart 114, and the upper surface of the marking inspection unit 150 disposed above the movement line of the second transport cart 114. The exposed marking portion of the semiconductor is photographed by a camera to acquire an image signal, and a separate processing means determines whether the semiconductor marking is good or bad, and stores the position of the defective semiconductor in the memory.

As described above, the good / bad semiconductors determined by the appearance inspecting unit 120 and the marking inspecting unit 150 are stored in a memory, and each defective semiconductor is drawn out from the tray in the sorting unit 160 described later.

As shown in FIG. 12, the fixing plate body 161 of the sorting unit 160 has a space in which a plurality of trays can be seated. The tray is first transported through the transfer 140, and then the second transfer is completed. The ball tray is pulled out from the trolley 114 and seated in the first area A of the fixed plate body 161, and the ball tray is pulled out from the empty tray loading box 166 moving on the second transfer line 163 to fix the plate body 161. It rests in the 2nd area of.

Then, each of the defective memories stored in the memory is absorbed by the sorting picker 170 from the tray moving through the second transport cart 114, and seated on the empty tray disposed in the second area B, and the inspection is performed. After that, good semiconductors are picked out from the buffer tray disposed in the first region A, and the empty space of the tray from which the bad memory is drawn out is filled.

By repeating this operation, the trays disposed in the first and second regions A and B are filled with defective semiconductors, and when the tray is filled, the fixed plate body 161 is moved along the first transfer line 162. The first and second defective trays 164 and 165 are placed and then loaded, and returned to their original positions through the first transfer line 162, and then the fixed plate body is used to use the first transported tray as a buffer tray. Located in the first area (A) of 161, the empty tray is taken out from the empty tray loading box 166 and located in the second area (B) to continuously classify the defective semiconductors.

On the other hand, when all of the empty tray loaded in the empty tray loading box 166 during the process of the above process is exhausted to be transported to the front along the second transfer line 163 to be refilled by the operator.

Subsequently, referring to the operation of the sorting picker 170 with reference to FIGS. 13A and 13B, four adsorbers 174 are fixed to a plurality of link bars 171 connected by hinges 172, respectively, between adsorbers 174. The spacing is kept constant, and the adsorber 174 is lifted by the lifter 176 to adsorb / desorb the semiconductors.

In particular, one end of the flexible link member 173 composed of a plurality of link bars 171 connected by the hinge 172 is fixed to the body and the other end is fixed to the driving unit 175 side so as to slide by the driving unit 175, the semiconductor When the tray is changed according to the type of the drive unit 175 to move the link bar 171 of the flexible link member 173 to adjust the spacing of the adsorber 174, thereby automatically depending on the type of semiconductor. It has a feature that can adjust the spacing of the adsorber (174).

As described above, the good / bad semiconductor is classified and transferred to the tray on the second transport cart 114 with only the good semiconductor seated thereon, and disposed on the transport line of the second transport cart 114 as shown in FIG. 14A. The transport picker 200 moves to the upper side of the carrier tape 302 of the packaging means 300 disposed at the side by rotating 90 'as shown in FIG. 14B while lifting and lifting the semiconductors on the tray as shown in FIG. 14B. To be seated on the carrier tape 302.

That is, the plurality of adsorbers 204 of the transport picker 200 are lowered by the lifting unit 206 to absorb the semiconductors on the tray and then rise again, and move along the transport table 209 toward the packing means 300. The adsorber 204 is rotated 90 'through the rotating unit 207, and then moved to the upper side of the carrier tape 302 of the packaging means 300. After lowering (see FIGS. 7A and 7B), the adsorption force of the adsorber 204 is released to allow the semiconductors to settle into the pocket 302a of the carrier tape 302.

Here, since the semiconductor arrangement sequence of the tray moving along the second transfer carriage 114 and the semiconductor insertion arrangement sequence of the carrier tape 302 are different from each other, the transfer picker 200 transfers along the transfer stage 209. It rotates 90 'through the rotation part 207, and changes the direction of a semiconductor with the pocket 302a of the carrier tape 302. FIG.

In particular, the transfer picker 200 of the packing means 300 consisting of a dual line in a state in which the adsorber 204 is arranged in five rows of two rows to adsorb the semiconductor seated on the tray rotated 90 'through the rotating unit 207 It is configured to be seated on the carrier tape 302. Therefore, the processing speed of the appearance inspection, the marking inspection and the classification process of the semiconductor, and the packaging processing speed for packaging the good semiconductors in the carrier tape can be made equal.

In addition, the transport picker 200 is moved in accordance with the action of the drive unit 205, the elastic link member 203 composed of a plurality of link bars 201 connected by the hinge 202 like the sorting picker 170. The spacing of the adsorbers 204 fixed to each link bar 201 is adjusted.

In addition, even when the gap between the tray where the semiconductors are seated and the pocket gap of the carrier tape 302 does not coincide, the gap between the adsorbers that absorb the semiconductors from the tray can be easily adjusted by the elastic link member 203. Has an advantage.

15A and 15B of the accompanying drawings are side and plan views showing packaging means of the semiconductor inspection and packaging apparatus of the present invention.

Referring to the drawings, when the transport picker 200 moves in a state rotated 90 'along the transport table 209 and placed on the carrier tape 302 of the packing means 300, the lift unit 206 The adsorber 204 is lowered by this, and then the adsorption force of the adsorber 204 is released to place the semiconductor into the pocket of the carrier tape 302.

As described above, the carrier tape 302 into which the semiconductor is inserted into the pocket 302a of the carrier tape 302 by the transfer picker 200 moves along the transfer track 303 while being continuously supplied from the carrier tape supply reel 301. The cover tape 305 which is unwound from the cover tape supply reel 304 disposed above the transfer track 303 is brought into close contact with the upper surface of the carrier tape 302 to move together along the transfer track 303. do.

At this time, the sealing module 306 disposed up and down with the carrier tape 302 and the cover tape 305 therebetween is heat-compressed so that the cover tape 305 is attached to the carrier tape 302, and The carrier tape 302 whose upper side is finished by the cover tape 305 is wound around the carrier tape winding reel 307 disposed at the end of the transfer track 303.

In particular, a cover tape supply for supplying a carrier tape supply reel 301 for supplying a carrier tape 302 constituting the packaging means 300, a transfer track 303, and a cover tape 305 as shown in FIG. 15B. A plurality of reel 304, a sealing module 306, and a carrier tape winding reel 307, each of which is covered with a carrier tape 302 to which a cover tape 305 is bonded at the end of the transfer track 303, are provided with a plurality of dual By constructing the line, the work efficiency is improved.

The present invention as described above has been devised to solve the above problems by inspecting the appearance of semiconductors in one device, classifying defective semiconductors, and then discharging the good semiconductors in tray form or packing them in reel form. The work space is reduced, and the number of equipment operators is reduced, thereby improving productivity.

In addition, the semiconductor inspection and packaging device of the present invention has the effect of improving the work efficiency by forming the packaging means in two rows.

The semiconductor inspection and packaging device of the present invention has a structure in which the adsorbers of the transfer picker are connected to each other by a link, so that even when the types of semiconductors are changed, the intervals of the adsorbers can be easily adjusted to the gaps of new semiconductors, There is an effect that can be easily seated even when the gap between the gap and the pocket of the carrier tape of the packaging means is different.

In addition, the adsorber of the transfer picker is configured in two rows, thereby adsorbing a plurality of semiconductors in two rows on the tray and seating on the carrier tape of the packaging means composed of two rows, thereby improving the working speed.

The semiconductor inspection and packaging apparatus of the present invention has an effect of inspecting both sides of the semiconductor in one device by flipping the tray loaded with the semiconductor 180 'through the rotator, and closely adhering the plurality of trays through the pressing unit in the rotator. It is also effective to prevent the semiconductor located in the tray from being separated or separated in the tray.

The semiconductor inspection and packaging apparatus of the present invention classifies defective semiconductors by type and fills good semiconductors with empty spaces of a tray on a transfer line in a buffer tray, thereby improving work efficiency.

In addition, since the adsorption units of the sorting picker are connected to each other by a link, even when the type of semiconductor is changed and the tray gap is changed, the adsorption gap of the sorting picker can be easily adjusted to the interval of the new semiconductor.

The semiconductor inspection and packaging apparatus of the present invention has the effect of reducing the waste of working time due to the return of the transport cart by providing a plurality of transport cart of the transport line for transporting the tray.

Claims (11)

In the semiconductor inspection and packaging apparatus, Appearance inspection unit for inspecting the appearance of the semiconductor with a 3D vision camera on the transfer line of the tray on which the semiconductor is loaded, marking inspection unit for inspecting the marking portion of the semiconductor with the 2D vision camera, and sorting unit classified according to whether the semiconductor is good or bad Formed inspection means; Packing means including a carrier tape having a plurality of seating grooves formed in a longitudinal direction, a transfer track for transporting the carrier tape, a cover tape closing the upper side of the carrier tape, and a sealing module for heating and pressing the carrier tape and the cover tape; And, A transport picker for adsorbing good semiconductors of the inspection means and seating on the carrier tape of the packaging means, The transfer picker includes a flexible link member hinged by crossing a plurality of link bars, a plurality of adsorbers fixed to a link bar of the link member by forming an adsorption plate at a tip thereof, and fixed to one end of the link member. And a driving unit for reciprocating to vary the length, an elevating unit for elevating the adsorber, and a rotating unit for rotating the adsorber 90 '. The method of claim 1, And at least two carrier tapes, a transfer track, a cover tape, and a sealing module of the packaging means, each of which constitutes two or more lines. delete The method of claim 2, The transfer picker is a semiconductor inspection and packaging device, characterized in that a plurality of adsorbers are arranged in at least two rows so as to adsorb the semiconductor on the tray to be seated on the plurality of carrier tapes. The method of claim 1, The inspection means is a semiconductor inspection and packaging device characterized in that it comprises a rotator for rotating the tray 180 is loaded with a semiconductor between the appearance inspection and marking inspection. The method of claim 5, The rotator includes an upper gripper gripping an empty tray, a lower gripper gripping a tray on which a semiconductor is loaded, an elevating part for elevating the upper and lower grippers, and a rotating part for rotating the upper and lower grippers. Semiconductor inspection and packaging equipment. The method of claim 6, The rotator further comprises a pressing unit for pressing the semiconductor tray on the upper and lower grippers. The method of claim 1, The sorting unit may include a sorting picker, a fixed plate body on which a plurality of trays are seated, a ball tray stacker on which empty trays are loaded, a transfer line for transferring the fixed plate body and a ball tray stacker, and a tray formed at an end of the transfer line. Semiconductor inspection and packaging device, characterized in that consisting of a bad tray loading portion for loading them. The method of claim 8, The sorting picker includes a stretchable link member hinged by crossing a plurality of link bars, a plurality of adsorbers fixed to a link bar of the link member by forming an adsorption plate at a tip thereof, and fixed to one end of the link member. And a driving unit for reciprocating to vary the length, and a lifting unit for lifting up and down the adsorber. The method of claim 5, The inspection means may include a loading unit for loading trays loaded with semiconductors, a first transport bogie which pulls out the tray from the loading unit and passes the lower portion of the appearance inspection unit to the rotator, and a transfer for extracting and transferring the tray from the rotator; And a second transport cart for receiving the tray from the transfer and transferring the marking inspection unit, the sorting unit to the lower part of the transport picker, and an unloading unit for loading an empty tray at the end of the second transport cart. Inspection and packaging device. The method of claim 10, And a plurality of first and second transport carts, respectively.

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