TWI503879B - Semiconductor strip sawing apparatus - Google Patents

Description

Semiconductor strip sawing equipment

The present invention relates to a semiconductor strip sawing apparatus, and more particularly to a method in which air pressure can be uniformly and efficiently applied to a drying apparatus, thereby enabling a ball up type and a ball down type process. A semiconductor strip sawing device that can operate under a variety of requirements.

A semiconductor strip sawing device means a device that saws a packaged semiconductor strip into a plurality of semiconductor packages.

The semiconductor strip sawing device not only has the function of simply sawing the semiconductor strip into a plurality of semiconductor packages, but also has a sawing, cleaning, and drying semiconductor package, and inspects the semiconductor package by capturing images of the top and bottom surfaces of the semiconductor package. Whether or not there is a defect, and the semiconductor package is classified into a normal semiconductor and a defective semiconductor according to the inspection result, and a function of unloading the semiconductor package by unloading the tray.

Generally, the semiconductor strip sawing device can be classified into an upper ball type device or a lower ball type device in accordance with the form in which the semiconductor package to be inspected and unloaded is stacked.

For semiconductor strip sawing equipment, according to the user's requirements or the type of strip, it is necessary to complete the inversion process for flipping the semiconductor package during the process.

In detail, when a semiconductor strip is provided to a semiconductor strip sawing device, a lead frame or a ball formed on the bottom surface of the semiconductor strip to be sawed is used. Face-up or face-down, and when the inspected semiconductor package is unloaded, it can be determined whether or not the inversion process is completed in accordance with the lead frame or the ball face formed on the bottom surface of the inspected semiconductor package face up or face down.

Therefore, there are various combinations of the method of providing a semiconductor strip and the method of unloading a semiconductor package. However, when a semiconductor strip sawing apparatus is separately manufactured or designed for each of various combinations, the utilization rate of the semiconductor strip sawing apparatus becomes low, and the cost of the sawing process for completing the semiconductor strip is high.

The industry has proposed that semiconductor strip sawing equipment can be used as an upper ball type device and a lower ball type device.

The Korean Patent Application No. 2012-0026745 discloses a semiconductor strip sawing apparatus which can be used as an upper ball type apparatus and a lower ball type apparatus. However, when the semiconductor strip sawing device is switched from the lower ball type to the upper ball type, the flipper or the flipper lifting device should be eliminated, thereby causing inconvenience to the user. When the semiconductor strip sawing device is operated as a lower ball type device, the transfer process of the semiconductor strip or the semiconductor package should be completed a plurality of times, resulting in various errors.

It is a technical object of the present invention to provide a semiconductor strip sawing apparatus in which air pressure can be uniformly and efficiently applied to a drying device, thereby enabling an upper ball forming process and a lower ball forming process, and operating under various requirements. .

In order to achieve these and other features of the present invention, the present invention is embodied and broadly described. A semiconductor strip sawing apparatus of the present invention includes: a loading portion for providing a semiconductor package in the semiconductor a state in which the package is placed in a card slot; a pusher or a puller for pulling the semiconductor package from the card slot to the outside of the loading portion; an inlet track from which the semiconductor package pulled from the pusher or the puller is placed a pick-up device for picking up the semiconductor package placed on the entrance rail, and transferring the semiconductor package to a worktable in a state in which a surface of the mold of the semiconductor package faces downward; a sawing device Receiving the semiconductor package from the strip pickup, sawing the semiconductor package into a plurality of semiconductor packages on the workbench, and cleaning the top surface of the semiconductor packages with cleaning water; a unit pickup for simultaneously Absorbing the semiconductor packages sawed by the sawing device and having the top surface cleaned, and transferring the absorbed semiconductor packages to a drying device via a cleaning device; the cleaning device for cleaning the semiconductor packages a bottom surface of the semiconductor package being sucked by the unit pickup; the drying device comprising a suction plate for sucking the cleaning device The semiconductor package that is cleaned and transported by the unit pickup, wherein the suction plate is movable in the XY plane along the X-axis direction or the Y-axis direction, and can be rotated about the Y-axis on the XY plane as needed; a vision unit disposed in a moving path of the suction plate of the drying device and configured to move in a predetermined direction perpendicular to a moving direction of the suction plate in the XY plane and inspect the semiconductor packages; a first alignment stage and a second alignment stage, wherein a loading slot and a non-groove portion are alternately formed along the X-axis direction and the Y-axis direction, and the semiconductor packages sucked by the pickup board are loaded in the loading slots, The non-slot portions are not loaded with the semiconductor packages, and the first alignment stage and the second alignment stage are used for transporting and loading the suction plates in the loading slots and are to be independently transported along the Y-axis direction. The semiconductor package; a second visual unit for inspecting the semiconductor packages mounted in the loading slots of the first alignment stage and the second alignment stage; and a sorting means for transmitting in the X direction Such a semiconductor package, according to test results and the classification of such a semiconductor package and the reservoir These semiconductor packages are stored.

In another aspect, a semiconductor strip sawing apparatus of the present invention comprises: a sawing device for providing a semiconductor strip, sawing the semiconductor strip as a plurality of semiconductor packages on a workbench, and cleaning Cleaning the top surface of the semiconductor packages with water; a unit pickup that simultaneously picks up the semiconductor packages that the sawing device saws and whose top surface is cleaned, and transfers the semiconductor packages that are drawn through a cleaning device a drying device for cleaning the bottom surface of the semiconductor package when the semiconductor package is in a state of being sucked by the unit pickup; the drying device includes a suction portion for cleaning The semiconductor package that is cleaned by the device and transported by the unit pickup, wherein the suction plate is movable in the XY plane along the X-axis direction or the Y-axis direction, and is rotatable about the Y-axis on the XY plane; a first vision unit Placed in a moving path of the suction plate of the drying device, and a predetermined direction perpendicular to a moving direction of the suction plate in the XY Moving in the face and inspecting the semiconductor packages; an array picker for picking up the semiconductor packages picked up on the pick-up plate and moving in the X or Y direction; and an alignment table movable in the Y direction The alignment stage includes: a first loading unit having a loading groove and a non-groove portion formed thereon to intersect each other in the X-axis direction and the Y-axis direction, wherein the semiconductor package is sucked by the suction plate in the device slot, The semiconductor package is not loaded in the non-groove portion; and a second loading unit is formed symmetrically about the first loading unit; a second visual unit is configured to check the loading in the loading slots in the alignment table a semiconductor package; and a sorting device for transporting the semiconductor packages in the X direction, and classifying and storing the semiconductors according to the inspection results of the semiconductor packages, wherein the drying of the drying device is completed according to a semiconductor package storage method Functionally flipping the semiconductor packages above, wherein when the rotation function of the drying device is completed, The semiconductor packages sucked and dried on the suction plate are moved relative to the Z-axis direction to be loaded into the loading slots in the alignment table, and the suction plate of the drying device is rotated 180 about the Y-axis on the XY plane. a state of °, and when the rotation function of the drying device is not completed, the semiconductor packages sucked and dried on the suction plate are picked up by the alignment table pickup and loaded into the loading slots in the alignment table .

The drying apparatus of the embodiment of the present invention can be simply used for drying purposes, rotated as needed, and used for visual inspection and flipping purposes.

According to an embodiment of the present invention, the upper ball type device and the lower ball type device can be changed by simply changing the constituent elements. Therefore, the present invention can operate as a device that is switched to various forms in accordance with the storage method of the semiconductor package or as the case requires.

When the drying apparatus of the embodiment of the present invention is simply used for drying purposes, the structure of the drying apparatus can be partially modified to provide air pressure uniformly, efficiently, and centrally by the air line. The flipping function can be completed to load the semiconductor package, so that the drying device in a state in which the semiconductor package is sucked on the top surface and the bottom surface of the suction plate of the drying device is rotated and then the semiconductor package is turned over, and the semiconductor package in the loading slot in the transfer table is transferred. The semiconductor package is turned upside down.

According to the embodiment of the present invention, by simply mounting the alignment stage pickup, the lower-spheroid type semiconductor strip sawing apparatus capable of receiving the semiconductor strip in the upper ball state and the semiconductor package in the unloading ball state can be switched to the upper ball type semiconductor strip Band sawing equipment.

In addition, in the semiconductor strip sawing apparatus of the embodiment of the invention, the suction plate driving unit can be rotated and linearly conveyed, and the suction plate driving unit is disposed at a position different from that of the alignment table pickup driving unit and the tray pickup driving unit. Positioning to avoid these drive orders Interference between the yuan.

In addition, since the drying device is installed to be movable, the drying device can be moved while drying the semiconductor package, and no additional time is required to complete the drying process, thereby reducing the process time.

In addition, the dried semiconductor package can be flipped upside down through the rotary suction plate and then loaded onto the alignment stage. Therefore, there is no need to complete an additional process to flip the semiconductor package up and down, and the semiconductor package can be controlled to be rotated during the movement, thereby saving the time required to flip the semiconductor package upside down.

In addition, the mold surface, the ball surface or the lead surface of the semiconductor package is completed and the tray alignment inspection is performed using the first vision unit. That is to say, only one visual unit is used for various inspections.

Further, in accordance with an embodiment of the present invention, a top inspection and a bottom inspection are performed on a semiconductor package.

In addition, since the inspection is completed using the first inspection unit while vertically moving the first inspection unit, the inspection can be performed by selectively moving the position of the first inspection unit in accordance with the specifications of the semiconductor package or the semiconductor strip. Therefore, the total package processing speed per hour of the equipment can be improved.

1000‧‧‧Semiconductor strip sawing equipment

M‧‧‧ card slot

S‧‧‧Semiconductor strip

100‧‧‧Loading Department

110‧‧‧ Pusher

200‧‧‧ sawing device

210‧‧‧ Entrance track

220‧‧‧ Puller

230‧‧‧With picker

240‧‧‧Guide frame

250‧‧‧Workbench

260‧‧‧Cutter

270‧‧‧unit picker

280‧‧‧cleaning device

281‧‧‧ nozzle

300‧‧‧Drying device

310‧‧‧ suction board

311‧‧‧Sucking components

313‧‧‧Distribution components

314‧‧‧ distribution channel

315‧‧‧Basic components

317, 317'‧‧‧ blocking components

320‧‧‧ moving box

330‧‧‧ board drive unit

331‧‧‧Rolling screw

333‧‧‧Ball screw nut

340‧‧‧Second transport track

350‧‧‧Rotary drive unit

360‧‧‧First transmission track

370‧‧‧Installation components

400‧‧‧Semiconductor package inspection unit

410‧‧‧First Vision Unit

415‧‧‧ drive unit

420‧‧‧Second Visual Unit

425‧‧ visual drive unit

430a, 430b‧‧‧

431a, 431b‧‧‧ loading slots

460‧‧‧ Alignment table picker

465‧‧‧ Alignment table pickup drive unit

500‧‧‧Classification device

510‧‧‧First unloading tray

530‧‧‧Second unloading tray

560, 580‧‧‧ sorting pickers

561, 581‧‧‧ drive pickup unit

570‧‧‧Tray pickup

575‧‧‧Tray pickup drive unit

610‧‧‧First Stage Drive Unit

620‧‧‧Second stage drive unit

650‧‧‧First Category Pickup Drive Unit

660‧‧‧Second sort picker drive unit

670‧‧‧Guide frame

311a, 311b‧‧‧ suction components

311s‧‧‧Drawing Department

311as, 311bs‧‧‧ suction department

312a, 312b‧‧‧ intake

313a, 313b‧‧‧ distribution components

314a, 314b‧‧‧ distribution channels

3151‧‧‧Handle hole

3153a, 3153b‧‧‧ air lines

3154‧‧‧Connected channel

3154b‧‧‧Connected channel

3155a‧‧‧Connected channel

3155b‧‧‧Connected channel

1 is a schematic plan view of a semiconductor strip sawing apparatus according to an embodiment of the present invention.

2 is a schematic view showing an assembly process of a drying device and a semiconductor package inspection unit of a semiconductor strip sawing apparatus according to an embodiment of the present invention.

Figure 3 is a view showing the drying device of the semiconductor strip sawing apparatus according to the embodiment of the present invention The state is installed in the semiconductor package inspection unit.

4 is a schematic plan view of a semiconductor strip sawing apparatus according to another embodiment of the present invention.

Fig. 5 is a view showing a drying device and an alignment table pickup included in a semiconductor package inspection unit of a semiconductor strip sawing apparatus according to an embodiment of the present invention.

Figure 6 is a plan view showing a semiconductor strip sawing apparatus according to another embodiment of the present invention.

7(a), 7(b) and 7(c) are suction plates of a semiconductor strip sawing apparatus according to an embodiment of the present invention.

8(a), 8(b), 8(c), and 8(d) are suction plates of a semiconductor strip sawing apparatus according to another embodiment of the present invention.

Preferred embodiments of the present invention will now be described in detail in conjunction with the drawings. The embodiments described below are used as examples to convey their spirit to those of ordinary skill in the art. Accordingly, the embodiments are embodied in different shapes and are not limited to the embodiments described herein. Moreover, the size and thickness of the device can be exaggerated for convenience of the drawings. The same reference numbers are used in the present disclosure and the drawings.

1 is a schematic plan view of a semiconductor strip sawing apparatus 1000 according to an embodiment of the present invention. Generally, in accordance with a form in which the inspected semiconductor package to be unloaded is loaded in a tray, the semiconductor strip sawing apparatus 1000 can be classified into a lower ball type or an upper ball type. Since the subsequent process or strip storage method can be changed in accordance with the semiconductor manufacturer, the semiconductor package is finally loaded into the tray in the above ball state or the lower ball state. Although the semiconductor strip can be provided in an upper ball state or a lower ball state, the embodiment of FIG. 1 assumes that a semiconductor strip to be sawed is provided. For the state of the ball.

The semiconductor strip sawing apparatus 1000 of the embodiment of the present invention includes an on-loading part 100 provided in a state in which the semiconductor strip S is loaded into the card slot M; the pusher 110 or the puller 220 For pulling the semiconductor strip S from the card slot M to the outside of the loading portion 100; the inlet rail 210 on which the semiconductor strip S pulled by the pusher 110 or the drag device 220 is placed; strip picking The device 230 is configured to suck the semiconductor strip S placed on the inlet rail 210 and transfer the semiconductor strip S to the chuck table 250 such that the mold surface of the semiconductor strip faces downward; the sawing device 200 is used for Receiving a semiconductor strip S from the strip picker 230, sawing the semiconductor strip S on the table 250 into a plurality of semiconductor packages, and cleaning the top surface of the semiconductor package with cleaning water; the unit pickup 270 for one time Absorbing all of the semiconductor packages sawed by the sawing device 200 from the semiconductor strip S and having the top surface cleaned, and transferring the aspirated semiconductor package to the drying device 300 via the cleaning device 280; the cleaning device 280 for cleaning the semiconductor The bottom surface of the package, the semiconductor package is in a state of being sucked by the unit pickup 270; the suction plate 310 for sucking the semiconductor package cleaned by the cleaning device 280 and transported via the unit pickup 270; the drying device 300, along the X axis The direction or the Y-axis direction moves in the XY plane, and can be rotated relative to the Y-axis in the XY plane according to a storage method of the semiconductor package or as needed; the first vision unit 410 is placed in the moving path of the suction plate 310 of the drying device 300. And moving in the XY plane for inspecting the semiconductor package while being perpendicular to a moving direction of the suction plate 310; the first aligning stage 430a and the second arranging stage 430b, wherein the loading is alternately formed along the X-axis direction and the Y-axis direction The semiconductor packaged loading grooves 431a and 431b and the unslotted portion of the unloaded semiconductor package are capable of independently transporting the semiconductors sucked and transferred by the suction plate 310 and loaded in the loading grooves 431a and 431b in the Y-axis direction. a second visual unit 420 for inspecting semiconductor packages loaded in the loading slots 431a and 431b of the first array stage 430a and the second array stage 430b; and a sorting device 500 for checking results of the semiconductor package, The semiconductor package is transported along the X-axis direction, and the semiconductor package is sorted and stored.

The loading portion 100 provides a semiconductor strip S to be sawed. The semiconductor strip S is a long quadrangular material in which a plurality of semiconductor packages are arranged in a matrix along the X-axis direction and the Y-axis direction, and can be supplied to the sawing device 200 such that the longitudinal direction of the semiconductor strip S is parallel to the X-axis.

A plurality of semiconductor strips to be sawed are supplied to the loading portion 100 in a state of being placed in the card slot M. When the pusher 110 of the loading portion 100 sequentially pushes the semiconductor strips toward the sawing device 200, the semiconductor strips that are pushed out in the X-axis direction are placed on the entrance rail 210 of the sawing device 200 for guiding the semiconductor strips, The puller 220, which is capable of pulling the semiconductor strip in the X-axis direction, transports the semiconductor strip to a position where the strip picker 230 picks up the semiconductor strip to be sawed by clamping the front end of the semiconductor strip.

A strip picker 230 is mounted on the guide frame 240 to transport the semiconductor strip S in the X-axis direction, wherein the guide frame 240 includes a driving unit and is mounted in the X direction.

A strip picker 230 that picks up the semiconductor strip to be sawed delivers the semiconductor strip S to the stage 250.

The table 250 is used to move to an arbitrary position in the XY plane and to rotate relative to the Z axis. The semiconductor strips drawn on the stage 250 are sawed into a plurality of semiconductor packages through at least one cutter 260. In the embodiment of Figure 1, at least one cutter 260 is shown to comprise two cutting blades. Further, in the embodiment of Fig. 1, a table 250 is shown, but Two or more work stations 250 can be used to increase the unit per hour (UPH) and the like.

The semiconductor strips drawn on the stage 250 are sawed into separate semiconductor packages while the at least one cutter 260 is displaced relative to the table 250, and the semiconductor package cut from the semiconductor strips is simultaneously picked up by the unit pickup 270 to be Transfer.

The unit pickup 270 picks up the semiconductor package by picking it up, and transports the semiconductor package to the cleaning device 280 and the drying device 300 (described below) to complete the cleaning process and the drying process. The cleaning device 280 includes a plurality of nozzles 281 that spray cleaning water or compressed air. A plurality of nozzles 281 are arranged along the width direction of the unit pickup 270.

A plurality of semiconductor packages picked up by the unit pickup 270 and cleaned by the cleaning device 280 are sucked onto the drying device 300 of the semiconductor package inspection unit 400.

As described above, in accordance with the form of the unloaded semiconductor package loaded in the tray, the semiconductor strip sawing apparatus is classified into a lower ball type (defined as a ball surface or a lead surface face down and a mold surface face up) or Upper ball type (defined as the surface of the ball or the surface of the lead is facing up and the surface of the die is facing down). The semiconductor strip to be sawed may be provided in an upper ball state or a lower ball state. In the embodiments (including the embodiment of Fig. 1) presented herein, for ease of explanation, it is assumed that the semiconductor strip to be sawed is provided in an upper ball state.

Therefore, it means that when the semiconductor strip provided by the above ball state is sawed, cleaned, dried, inspected and unloaded, the semiconductor package should be flipped (rotated) 180° at least once, and the semiconductor package is sawed, cleaned, dried and unloaded. Thus, the state of the ball under the semiconductor package is unloaded.

In detail, in the embodiment of FIG. 1, a semiconductor strip sawing device is provided 1000, a semiconductor strip for receiving the upper ball state and a semiconductor package for unloading the ball state.

The drying device 300 is used to dry the cleaned semiconductor package, and the semiconductor strip sawing apparatus 1000 of the first embodiment can flip the semiconductor package using the drying device 300 without any flipper.

In detail, by rotating the suction plate 310 of the drying device 300 by 180° with respect to the Y axis on the XY plane, and moving the dried semiconductor package sucked up on the suction plate 310 with respect to the Z axis, it is transferred to the first alignment stage 430a. In the loading slot 431a or the loading slot 431b of the second aligning stage 430b, the semiconductor package can be flipped upside down.

Generally, the heating device 300 is embedded with a heating wire to complete the heating process. The drying device 300 of the semiconductor strip sawing device 1000 of the embodiment of the present invention further has a flip function and a transfer function.

The semiconductor package inspection unit 400 includes a drying unit 300 that includes an electric heater (not shown) for drying the cleaned semiconductor package. The semiconductor package sawed by the semiconductor strip by the sawing device 200 is transmitted to the drying device 300 through the unit pickup 270.

The semiconductor package that is transferred to the drying device 300 is dried by an electric heater included in the drying device 300, and the like.

The semiconductor package inspection unit 400 performs semiconductor package inspection by photographing the image of the top surface (mold surface) and the bottom surface (the ball surface or the lead surface) of the semiconductor package to be sawed (from the semiconductor strip) and the semiconductor package to be cleaned.

Checking the top surface of the semiconductor package to inspect the top surface of the semiconductor package The mark inspection performed on the mold material of the semiconductor package, and the semiconductor package bottom surface inspection is a determination check of the distance between the balls or the leads of the semiconductor package or whether or not a defect inspection such as a short circuit occurs.

The top and bottom surfaces of the cleaned and dried semiconductor package can be inspected based on images of the top and bottom surfaces of the semiconductor package captured by the vision unit.

The semiconductor strip sawing apparatus 1000 of the embodiment of the present invention includes a semiconductor package inspection unit 400 for inspecting a semiconductor package on which a sawing process, a cleaning process, and a drying process are performed by capturing an image of a top surface and a bottom surface of the semiconductor package. The semiconductor package inspection unit 400 includes a first vision unit 410 for capturing an upward image of a top surface and a bottom surface of a semiconductor package, and a second vision unit 420 for capturing a top of the semiconductor package. A downward image of the surface and bottom surface. Additionally, the first vision unit 410 can be used to capture an image of one of the top and bottom surfaces of the semiconductor package, and the second vision unit 420 can be used to capture images of other surfaces.

Further, as shown in FIG. 1, the first vision unit 410 can be mounted to be transported in the semiconductor package inspection unit 400 in the Y-axis direction, and the second vision unit 420 can be installed to be in the semiconductor package inspection along the X-axis direction. Transferred in unit 400.

Each of the first visual unit 410 and the second visual unit 420 may be disposed in a visual driving unit each disposed in the X-axis direction or the Y-axis direction, such that a specific visual unit may be transmitted in the X-axis direction or the Y-axis direction.

However, since the drying device 300 and the like are mounted on the XY plane, when the first vision unit 410 and the second vision unit 420 are installed to be transported in the Y-axis direction (or the X-axis direction), or dried The device 300 picks up or sucks in order to The semiconductor package to be photographed, or an alignment stage (to be described later), is mounted to be transported in the X-axis direction (or the Y-axis direction).

Further, the semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 of the embodiment of the present invention includes at least one alignment stage that can be transported in parallel in the Y-axis direction and in the Z-axis.

In the embodiment of FIG. 1, the semiconductor package taken up by the drying device 300 and its captured upward image are transferred and loaded into at least one of the alignment stages, and the second vision is in a state in which the semiconductor package is loaded into the at least one alignment stage. Unit 420 captures a downward image of the semiconductor package.

If the semiconductor package is not completed in the flip (rotation) process, and the semiconductor package is cleaned, dried, and photographed, the mounting method of the semiconductor package cannot be changed.

Therefore, in the embodiment of Fig. 1, the semiconductor package picked up by the unit pickup 270 and sucked from the suction portion of the drying device 300 is inverted by the spin drying 300, conveyed in the X-axis direction, and loaded into at least one arrangement. Taichung.

The first suction portion and the second suction portion for sucking the semiconductor package are respectively placed on the top and bottom surfaces of the suction plate 310 of the drying device 300. The semiconductor packages transferred by the unit pickup 270 are sequentially distributed to the first suction portion and the second suction portion and are sucked thereon.

In this case, a portion of the semiconductor package transferred by the unit pickup 270 is sucked onto the first suction portion, and the other semiconductor packages sucked by the unit pickup 270 are sequentially assigned to the first through the Y-axis rotary suction plate 310. The second suction portion is sucked thereon. The unit pickup 270 includes first and second suction ports alternately placed, and the first suction port a first pneumatic line connected, a second air line connected to the second suction port and separated from the first air line, and selectively applying a vacuum pressure (suction pressure or negative pressure) to the first a vacuum unit for the air line and the second air line.

In particular, the unit pickup 270 may include the suction plate structure shown in Fig. 8(d), which will be described below.

A portion of the semiconductor package picked up by the unit pickup 270 is sucked onto the first suction portion disposed on the drying device 300, and the other semiconductor packages picked up by the unit pickup 270 are sucked and disposed on the drying device 300 after the rotary drying device 300 On the second suction part.

The drying device 300 includes a moving frame 320, an electric heater and a blower (not shown), the moving frame 320 is mounted to be movable along an axis, and the suction plate 310 is coupled thereto to be rotatable, and the electric heater is mounted on The semiconductor package is placed in the suction plate 310 to heat the semiconductor package, thereby drying the semiconductor package, and the blower blows gas onto the semiconductor package sucked up by the suction plate 310 for moving the top surface of the suction plate 310 or the top surface of the semiconductor package or Residual moisture on the side surface.

Since it takes a long time to dry the semiconductor package using only the electric heater, the blower is mounted above and/or below the drying device 300 (upward and/or downwardly) to move the top surface of the suction plate 310 with Moisture on the semiconductor package that is drawn on the bottom surface to minimize drying time.

When the drying device 300 has a rotatable structure, the air blower may be installed above, below or simultaneously with the drying device 300, and when the drying device 300 cannot rotate, the air blower may be mounted thereon The surface (top surface) of the drying device 300 having the semiconductor package is taken up.

A method in which a plurality of semiconductor packages transferred by the unit pickup 270 are sequentially distributed and supplied to the first suction portion and the second suction portion of the suction plate 310 will be described below.

The semiconductor package can be placed and sucked onto the drying device 300 and turned over, and then the semiconductor package is mounted on the at least one alignment stage, and the image of the top surface and the bottom surface of the semiconductor package can be transmitted through the first visual unit. 410 is taken, and an image of the other surface can be captured by the second visual unit 420.

That is, in the embodiment of Fig. 1, the semiconductor package is placed in the drying device 300 in a state where the surface of the mold is attracted to the drying device 300, and the first visual unit 410 can capture the surface of the ball or the surface of the lead of the semiconductor package. The image, and the semiconductor package are loaded and attracted in at least one of the alignment stages, with their ball surface facing down. Therefore, when the semiconductor package is loaded in at least one of the alignment stages, the second vision unit 420 checks the mold surface of the semiconductor package.

Further, in the embodiment of Fig. 1, the semiconductor strip is supplied from the loading portion 100 to the upper ball state, and the drying device 300 of the semiconductor package inspection unit 400 is loaded into at least one of the alignment stages in the lower ball state. Therefore, the semiconductor strip can be loaded in the unloading tray (described later) in the lower ball state.

Therefore, the semiconductor strip sawing apparatus 1000 of FIG. 1 is a lower ball type semiconductor strip sawing apparatus for sawing a semiconductor strip in an upper ball state into a plurality of semiconductor packages, and unloading the semiconductor package in the following ball state.

The structure and operation of the drying device 300 in the embodiment of Fig. 1 will be described below.

The semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 shown in Fig. 1 of the embodiment of the present invention includes a first array stage 430a and a second array stage 430b.

When the first array stage 430a and the second array stage 430b are not used and two loading areas are formed in one of the array stages, the subsequent processes (the inspection performed by the second vision unit 420, the loading of the semiconductor package in the tray, etc.) cannot be completed until The semiconductor package remaining even after the semiconductor package is loaded into the first loading region is loaded into the second loading region. To solve this problem, in the present embodiment, the semiconductor package inspection unit 400 includes two alignment stages 430a and 430b for independent operation to increase the hourly throughput of the equipment.

In the embodiment of Fig. 1, the suction portions (the first suction portion and the second suction portion disposed opposite to each other) may be formed on the top and bottom surfaces of the suction plate 310 of the drying device 300. The semiconductor package picked up by the unit pickup 270 can be distributed to the first suction portion and the second suction portion and sucked thereon. When the suction plate 310 is rotated, the semiconductor package sucked up on the first suction portion is loaded into one of the first alignment stage 430a and the second alignment stage 430b. The other semiconductor packages sucked up on the second pick-up portion may be loaded into the other array stage 430a or 430b.

Due to the above structure, when the first suction portion and the second suction portion of the suction plate 310 of the drying device 300 are in the upward position, the plurality of semiconductor packages picked up by the unit pickup 270 are distributed and supplied to the first In the array stage 430a and the second array stage 430b, the first suction unit and the second suction unit are rotated in the downward direction.

The suction plate 310 and the conveyance trajectories of the first alignment table 430a and the second alignment table 430b may be set to have different heights, such that during the rotation of the suction plate 310 or when the suction plate 310 and the first alignment table 430a and the second alignment table 430b Interference can be avoided when transferring semiconductor packages. The semiconductor package can be transferred by moving the first alignment stage 430a or the second alignment stage 430b upward by, for example, a movement in the Z-axis direction.

Korean Published Patent Application No. filed in the name of the applicant of the present invention. The structure and operation of the drying device 300 and the first arraying table 430a or the second arraying table 430b are disclosed in 2005-0058555 and No. 2007-0006639.

As described above, when the first suction portion and the second suction portion are rotated in the downward direction, the first vision unit 410 captures the semiconductor package sucked on the first and second suction portions of the suction plate 310 of the drying device 300. An image of the top or bottom surface. In the embodiment of FIG. 1, the semiconductor package is provided in an upper ball state, so the first vision unit 410 can capture the bottom surface (ball surface or lead surface) of the semiconductor package sucked on the first and second suction portions. image.

In the embodiment of Fig. 1, the semiconductor package inspection unit 400 includes a first alignment stage 430a or a second arrangement stage 430b that is transmitted in a predetermined direction parallel to the Y-axis direction and rotatable about the Z-axis. The first array stage 430a or the second array stage 430b may be respectively disposed in the first array stage driving unit 610 and the second array stage driving unit 620 installed in the Y-axis direction, so that the first arrangement is transmitted in the Y-axis direction. The stage 430a and the second array stage 430b.

The second visual unit 420 installed in the visual driving unit 425 placed along the X-axis direction can capture images of the top surface (mold surface) of the semiconductor package loaded in the first array stage 430a and the second array stage 430b, the first arrangement The stage driving unit 610 and the second array stage driving unit 620 independently transfer the first array stage 430a and the second array stage 430b in the Y-axis direction.

Therefore, the first vision unit 410 checks the ball-forming surface or the lead surface of the semiconductor package sucked up on the suction plate 310 in a state where the suction plate 310 of the drying device 300 is rotated by 180° with respect to the Y-axis on the XY plane. The semiconductor package whose ball surface or lead surface has been inspected is loaded to the loading groove 431a of the first alignment stage 430a or the loading groove 431b of the second alignment stage 430b. Then, the second vision unit 420 checks the first arrangement stage 430a or the second arrangement stage 430b The mold surface of the mounted semiconductor package.

In the semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 of FIG. 1, a unit pickup 270 for picking up the cleaned semiconductor package sequentially supplies the cleaned semiconductor package, and the first to face each other through use The suction portion 310 of the suction portion and the second suction portion is placed and sucked on the first suction portion and the second suction portion that face upward. Then, when the suction plate 310 is rotated such that the first suction portion and the second suction portion face downward, when the semiconductor package is placed in the first arrangement stage 430a and the second arrangement stage 430b, the first vision unit 410 The image of the bottom surface (ball surface or lead surface) of the semiconductor package is captured, and the second vision unit 420 captures an image of the top surface (mold surface) of the semiconductor package, thereby performing a drying process and an inspection process of the semiconductor package.

According to the inspection result of the semiconductor package, the semiconductor package loaded into the first arrangement stage 430a and the second arrangement stage 430b and whose image is captured by the second vision unit 420 is selectively picked up by the pair of sorting pickers 560 and 580, and then The first unloading tray 510 or the second unloading tray 530 of the sorting device 500 is unloaded, and the pair of sorting pickers 560 and 580 are arranged to be transported in the X-axis direction.

Although not shown in the drawings, the sorting device 500 includes at least one sorting pickup, a plurality of loading slots, and an unloading tray to be conveyed in one direction. At least one sorting pickup is used to individually pick up the semiconductor packages loaded in the first array stage 430a or the second array stage 430b, and sequentially sort and transfer the semiconductor packages in accordance with the inspection results. The semiconductor packages picked up by the at least one sorting picker are sorted according to the inspection result and then stored in a plurality of loading slots.

At least one sorting pickup picks up the semiconductor package loaded in the first array stage 430a or the second array stage 430b, and the first vision unit 410 checks one of each semiconductor package The surface is then sorted and transferred to the first or second unloading tray 510 or 530 according to the inspection result.

Further, the semiconductor package or inspection jig is moved to the first vision unit 410 by loading the semiconductor package or an inspection jig in at least two of the loading slots in the loading slot in the tray, and the semiconductor package or inspection jig is picked up by at least one sorting pickup. a state in which the first visual unit 410 is used to capture an image of the semiconductor package or an image of the inspection jig, and the pitch information of the input is compared with the actual moving distance to accurately determine the position value of the loading slot in the tray, thereby performing 3 Check the point.

By loading a semiconductor package or inspection jig in a loading slot at three corners of the four corners of the tray, picking up a semiconductor package or inspection jig, and inspecting the semiconductor package or inspection jig, a three-point inspection can be efficiently performed to determine the alignment state of the tray. The alignment state of the tray can be determined by accurately obtaining the position value of the tray based on the input information related to the tray, the number of the loading slots, the pitch information, and the like.

The plurality of pickup units 561 form a line in the X-axis direction in the sorting pickup 560, and the plurality of pickup units 581 form a line in the X-axis direction in the sorting pickup 580, thereby collectively picking up a plurality of semiconductor packages.

The pickup units 561 and 581 can be independently driven.

In the embodiment of Fig. 1, the first sort picker 560 and the second sort picker 580 are placed to be transported in parallel with each other. The first sorting pickup 560 and the second sorting pickup 580 may be installed in the first sorting pickup drive unit 650 and the second sorting pickup drive unit 660, respectively, to be conveyed in the X-axis direction.

In the embodiment of FIG. 1, when the semiconductor package is supplied from the pickup board 310 to When the stages 430a and 430b are arranged, the longitudinal direction of the alignment stages 430a and 430b is equal to the Y-axis direction. However, since the pickup unit 561 is placed in a line on the first sorting pickup 560 in the X-axis direction, the pickup unit 581 is placed in a line in the X-axis direction in the second sorting pickup 580, and the rotary array is arranged. 430a and 430b, such that the longitudinal direction is equal to the X-axis direction before the sorting pickups 560 and 580 pick up the semiconductor packages placed in the alignment stages 430a and 430b. Therefore, the area occupied by the semiconductor strip sawing apparatus 1000 can be minimized.

Therefore, the semiconductor strip sawing apparatus 1000 shown in FIG. 1 can saw the semiconductor strips provided in the above-described ball-forming state as a semiconductor package, clean, dry, photograph and inspect these semiconductor packages, and unload these semiconductor packages in the following ball state.

The sorting device 500 includes a first unloading tray 510 and a second unloading tray 530 for storing a normal semiconductor and a defective semiconductor, respectively.

The first unloading tray 510 and the second unloading tray 530 are used to store and unload normal semiconductors and defective semiconductors, respectively. The sorting device 500 further includes a tray picker 570 for unloading the first unloading tray 510 and the second unloading tray 530, and supplying a new tray when all of the semiconductor packages are loaded in the first unloading tray 510 and the second unloading tray 530.

2 is an assembly process of the drying apparatus 300 and the semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 of the first embodiment of the present invention. Fig. 3 shows a state in which the drying device 300 of the semiconductor strip sawing apparatus 1000 according to the embodiment of the present invention operates and is mounted on the semiconductor package inspection unit 400.

The sorting device 500 of the semiconductor strip sawing apparatus 1000 of Fig. 1 includes a tray picker 570 for transporting a tray in which a normal semiconductor is loaded or a tray in which a defective semiconductor is loaded. The tray pickup 570 is driven by a tray pickup placed on the guide frame 670 Unit 575 is transported in the X-axis direction.

Although the tray picker 570 and the drying device 300 are both transported in the X-axis direction, the tray picker 570 and the drying device 300 can be independently driven.

Therefore, when the board driving unit 330 for conveying the suction plate 310 of the drying device 300 and the tray pickup driving unit 575 are placed on the same guide frame, the board driving unit 330 and the tray pickup driving unit 575 may appear. interference. Therefore, the board driving unit 330 and the tray pickup driving unit 575 are installed at different positions to have different heights.

As described above, the drying device 300 can have the function of rotating and conveying the suction plate 310.

As shown in FIGS. 2 and 3, the suction plate 310 reciprocates in the X-axis direction due to the plate driving unit 330 placed on the side of the drying device 300.

As shown in FIG. 2, the plate driving unit 330 includes a motor (not shown), a ball screw 331, a ball screw nut 333, and the like, but is not limited thereto.

The first transfer track 360 is mounted on one side of the drying device 300, and the plate drive unit 330 placed on the other side of the drying device 300 can be housed in the second transfer track 340 to guide the drive and transfer process.

The first transfer rail 360 can be mounted to the bottom of the guide frame 670 by the mounting assembly 370 or the like.

Since the tray pickup drive unit 575 is mounted on the guide frame 670 to drive the tray pickup 570, and the guide frame 670 is used to guide the conveyance of the tray pickup 570 as described above, the first transfer track 360 is mounted on the guide. The reason for the bottom of block 670 is to minimize components Interference between the arrangement and avoidance of interference between the stage pickup 460 (refer to FIG. 4) and the drive unit of the stage pickup 460, the alignment stage pickup 460 is additionally mounted on the upper ball type semiconductor strip sawing device 1000 (described below) will be described in detail below.

The drying device 300 is moved back and forth in the X-axis direction by the plate driving unit 330. Since the drying device 300 includes the rotation driving unit 350, the drying device 300 can be rotated while being moved.

The drying device 300 includes a moving frame 320 for supporting the suction plate 310 to be rotated. Since the rotary drive unit 350 is placed on one side of the moving frame 320, the suction plate 310 can be rotated independently of the transfer of the drying device 300 in the X-axis direction.

As described above, the pickup plate 310 is conveyed in the X-axis direction while the suction plate 310 is rotatably driven during the transfer of the semiconductor package to the alignment stages 430a and 430b.

The structure and operation of the drying device 300 and the alignment stages 430a and 430b are disclosed in detail in Korean Laid-Open Patent Application No. 2005-0058555 and No. 2007-0006639, and thus will not be described herein.

4 is a schematic plan view of a semiconductor strip sawing apparatus 1000 according to another embodiment of the present invention. Fig. 5 is a perspective view showing a drying device 300 and a stage pickup 460 included in the semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 of Fig. 4 of the embodiment of the invention. The structure and operation of the elements of the semiconductor strip sawing apparatus 1000 which are the same as those shown in Figs. 1 to 3 will not be described here.

The semiconductor strip sawing apparatus 1000 provided by the embodiment of Fig. 1 is capable of sawing, cleaning, drying and inspecting the semiconductor strips provided in the above ball state, and unloading the semiconductor package in the following ball state. However, the embodiment of Fig. 1 can be applied to the opposite case. In addition, the first In the illustrated embodiment, the semiconductor strips can be sawed into individual semiconductor packages that are flipped at least once.

In contrast, the semiconductor strip sawing apparatus 1000 provided by the embodiment of FIG. 4 does not complete the inversion process. Therefore, the above-described ball state (or lower ball state) of the semiconductor strip is provided and sawn into a semiconductor package, and the above-described ball-forming state (or lower ball-forming state) of these semiconductor packages is unloaded.

Therefore, since the drying device 300 of the semiconductor strip sawing apparatus 1000 of Fig. 4 does not require the flipping function, the semiconductor package transferred by the unit pickup 270 is sucked on the drying device 300 and then dried.

In the case of the semiconductor strip sawing apparatus 1000 of Fig. 4, the top and bottom surfaces of the dried semiconductor package should also be inspected.

In the embodiment of FIG. 1, the image of the semiconductor package is captured by the first vision unit 410, the suction plate 310 on which the semiconductor package is sucked is inverted, and the drying device 300 is moved in the X-axis direction to At least one of the alignment stages transmits the semiconductor package. However, the semiconductor strip sawing apparatus 1000 of FIG. 4 may additionally include an alignment stage pickup 460 to transport the semiconductor package to the alignment stages 430a and 430b.

The alignment stage pickup 460 is configured to move in the X-axis direction, pick up the semiconductor package sucked by the suction plate 310 of the drying device 300, and load the loading slot of the semiconductor package to the loading groove 431a or the second alignment stage 430b in the first alignment stage 430a. In 431b. The alignment stage pickup 460 simultaneously picks up all the semiconductor packages sucked up on the pickup board 310, or divides the semiconductor package into two parts, and sequentially picks up the two parts, and then divides the semiconductor package into two parts and sequentially loads the parts to the first arrangement stage. 430a and second alignment stage 430b.

The alignment table pickup 460 or the suction plate 310 includes a first suction port and a second suction port which are alternately placed, a first communication line that communicates with the first suction port, communicates with the second suction port, and is separated from the first communication line. a second communication line, and a vacuum unit for selectively applying vacuum pressure to the first communication line and the second communication line. Here, the first communication line and the second communication line can be understood as flow channels for connecting the distribution component 313 (please refer to the 8th (a), 8th (b), 8th (c) and 8(d)) is taken in the distribution channel 314. In this case, since the semiconductor package is only sucked on one surface (for example, the top surface) of the suction plate 310, the other surface (for example, the bottom surface) of the suction plate 310 can be 8th (c) and 8th ( d) The barrier assembly 317 or the locking assembly 317' of the figure is blocked, for example, such that the air pressure applied from the two air passages can be applied only to the distribution passage on the suction assembly, thereby minimizing the loss of air pressure.

For example, a vacuum unit is provided to provide air pressure to the suction port, the vacuum unit can provide air pressure through the first air line, using the first communication line in communication with the first suction port, the first distribution component is allocated The air pressure can be changed to a vacuum. As described above, the vacuum pressure can be selectively applied to the first suction port or the second suction port as needed.

In particular, similar to the unit pickup 270 of Fig. 1, the stage pickup 460 or the suction plate 310 may include the suction plate structure shown in Fig. 8(d).

The semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 shown in FIG. 4 further includes at least one alignment stage and an alignment stage pickup 460, and at least one alignment stage is mounted to be transported in the Y-axis direction, and the stage pickup is arranged. 460 is used to pick up the dried semiconductor packages of the drying device 300 and to transport the semiconductor packages to at least one of the alignment stages. The first vision unit 410 captures an image of the top or bottom surface of the semiconductor package picked up by the alignment stage pickup 460, and then the semiconductor package is loaded into the alignment stage 430a or 430b.

In the embodiment of FIG. 4, in the entire sawing process of the semiconductor strip, the inversion process of the semiconductor package is not completed, so that during the transfer process of the dried semiconductor package, the first visual unit 410 can inspect the top surface of the semiconductor package. With the bottom surface.

In the embodiment of FIG. 4, after the semiconductor strip provided by the above ball state is sawn into a semiconductor package and dried, the first vision unit 410 inspects the mold surface of the semiconductor package, and is sucked on the drying device 300 in the above ball state. The semiconductor package is picked up by the alignment stage pickup 460, and the inspected semiconductor package can be transferred to the loading slot 431a of the first alignment stage 430a or the loading slot 431b of the second alignment stage 430b, and then the second vision unit 420 checks the first A ball-forming surface or a lead surface of a semiconductor package mounted in the alignment stage 430a or the second alignment stage 430b.

Otherwise, the first vision unit 410 checks the ball-forming surface or the lead surface of the semiconductor package sucked up on the suction plate 310, in a state where the suction plate 310 of the drying device 300 is rotated by 180° with respect to the Y-axis on the XY plane, and the suction plate 310 can be The Y axis on the XY plane is again rotated by 180°, the inspected semiconductor package is picked up by the alignment stage pickup 460, and the first vision unit 410 inspects the mold surface of the semiconductor package, and the inspected semiconductor package is aligned with the stage pickup 460. The status of the pick.

In this embodiment, the drying device 300 only performs the drying function, does not flip the semiconductor package, and the semiconductor package is loaded in the final tray in the ball state.

To this end, in the embodiment of Fig. 4, the drying apparatus 300 does not involve transporting the semiconductor package to at least one of the alignment stages, thus additionally including the stage pickup 460.

The alignment stage pickup 460 is mounted to be movable in the X-axis direction to transport the semiconductor package to the first alignment stage 430a and the second arrangement stage 430b.

The aligning table pickup 460 includes a guide frame 670 mounted in an axial direction, and an aligning table pickup driving unit 465 coupled to the top surface of the guide frame 670 to be detached from the guide frame 670 and used to move the aligning table pickup 460. One side of the drying device 300 is coupled to the first transfer track 360, and the other side of the drying device 300 is coupled to the second transfer track 340, thereby avoiding interference or collision between the stage pickup drive unit 465 and the plate drive unit 330, The first transfer track 360 is coupled to the lower portion of the guide frame 670.

The aligning table pickup driving unit 465 is for driving the aligning table pickup 460 in the X-axis direction, the aligning table pickup driving unit 465 is mounted on the guiding frame 670, and the tray pickup driving unit 575 for driving the tray pickup 570 is Installed on the guide frame 670.

In particular, a mounting method such as a ball screw, a motor, or the like is used in the guide frame 670.

The alignment stage pickup 460 transfers the semiconductor package from the pickup board 310 to the first alignment stage 430a and the second alignment stage 430b. Therefore, the transfer range of the semiconductor package completed by the alignment stage pickup 460 does not overlap with the transfer range of the semiconductor package completed by the tray pickup 570. Therefore, the aligning table pickup driving unit 465 and the tray pickup driving unit 575 can be attached to the guide frame 670 to independently drive the aligning table pickup driving unit 465 and the tray pickup driving unit 575.

Therefore, a semiconductor strip sawing apparatus can receive a semiconductor strip provided by the above ball state and a semiconductor package unloaded in a ball state, and the upper strip type semiconductor strip sawing device can receive the semiconductor strip provided by the above ball state and above Unloading the semiconductor package in a ball state, when the semiconductor strip sawing device is switched to the upper ball type semiconductor strip sawing device, the table picker 460 is arranged according to the type of the semiconductor strip or the user's request The pickup drive unit 465) can be mounted to the guide frame 670, and the drying device 300 can be simply For drying purposes.

If the gap between the drying device 300 and the aligning table pickup 460 is sufficiently sufficient, even if the interference between the two is not caused after the aligning table pickup 460 is installed, the lower ball type semiconductor strip sawing device can be used. The semiconductor strip in the upper ball state is sawed into a separate semiconductor package and the following state in which the semiconductor package is unloaded without disassembling or separating the stage pickup 460.

That is, in the embodiment of the present invention, the board driving unit 330 for driving the drying device 300 is placed in front of the device, and the aligning table pickup driving unit 465 is placed in the guiding frame 670, thereby avoiding the drying device 300 and the arranging table Interference between the pickers 460. Therefore, when the semiconductor strip sawing apparatus is switched to another type of semiconductor strip sawing apparatus, it is not necessary to perform an inconvenient replacement work such as a process of disassembling or separating a specific component.

Although not shown in the drawing, the stage pickup drive unit 465 is placed on the top surface or upper portion of the apparatus instead of the guide frame 670. Further, the drying device 300 can be placed on the lower end portion of the aligning table pickup 460, so that the drying device 300 and the aligning table pickup 460 can be driven without interfering with each other.

The process in which the semiconductor package is transferred from the drying device 300 to the at least one alignment stage by the alignment stage pickup 460 is the same as that of the semiconductor strip sawing apparatus 1000 of FIG. 1, and therefore will not be described herein.

FIG. 6 is a schematic plan view of a semiconductor strip sawing apparatus 1000 according to another embodiment of the present invention. The components of the semiconductor strip sawing apparatus 1000 of Fig. 6 are the same as those of the elements of Figs. 1 to 5 and will not be described here.

a half placed on the first suction portion and the second suction portion of the drying device 300 The top or bottom surface of the conductor package can be inspected by taking a picture of the first vision unit 410 by taking a picture thereof, in a state where the first or second suction portion is rotated to face the surface.

Unlike the embodiment before the first and fourth figures, in the embodiment of FIG. 6, the plurality of semiconductor packages picked up and cleaned by the unit pickup 270 can be distributed and placed in the first suction portion of the suction plate 310. On the second suction portion, the first vision unit 410 inspects the top and bottom surfaces of the semiconductor package and is dried on the suction plate 310. Then, the semiconductor package placed on the first suction portion and the second suction portion of the suction plate 310 can be transferred to the first alignment stage and the second alignment stage using the alignment stage pickup 460. Then, using the first vision unit 410 to check the top surface and the bottom surface of the semiconductor package again by taking a photograph, the semiconductor package placed on the first array stage 430a and the second array stage 430b passes through the first sorting picker 560 and the second sorting. The state in which the pickup 580 is picked up.

That is, in the embodiment of FIG. 6, the semiconductor strip in the upper ball state is sawed into a semiconductor package, and the above-described ball state of the semiconductor package is placed on the drying device 300, so that the surface of the mold is sucked onto the drying device 300, One half of the semiconductor package and the other semiconductor packages are respectively loaded onto the top and bottom surfaces of the suction plate 310, and the first vision unit 410 takes an image of the surface of the semiconductor package and the suction plate 310 is flipped to ensure sufficient drying time, and then The suction plate 310 is again flipped over to inspect the ball surface of other semiconductor packages. In this case, the first suction portion and the second suction portion are rotated 180° twice, that is, rotated 360°, to return to the initial state in which the semiconductor package is first sucked onto the suction plate 310. More specifically, the unit pickup 270 places some semiconductor packages on the first suction portion of the suction plate 310 and places other semiconductor packages on the second suction portion of the inverted suction plate 310, and the first vision unit 410 takes the first suction. An image of the surface of the ball that is placed on the semiconductor package to ensure these half Full drying time of the conductor package. After the other semiconductor packages are placed on the second pick-up, the pick-up plate 310 is again flipped over to dry other semiconductor packages and the first vision unit 410 is used to capture images of the ball-forming surfaces of other semiconductor packages. The image of the surface of the ball of the other semiconductor package sucked up on the second pick-up portion is captured, and the semiconductor package sucked up on the first pick-up portion is picked up by the array stage pickup 460 and transferred to the first array stage 430a or the second array stage 430b.

The first visual unit 410 transported in the Y-axis direction can be transmitted to the work areas of the sorting pickers 560 and 580, thereby completing the bottom surface inspection on the semiconductor package picked up by the sorting pickers 560 and 580 (balling or lead surface inspection) Or top surface inspection (mold surface inspection or marking inspection) or use the sort pickers 560 and 580 to complete the 3-point alignment inspection of the tray.

In this case, the package-shaped jig (or package) is loaded into at least three of the loading slots (better corners) of the tray, moved to the first visual unit 410, and picked up at the sorting pickers 560 and 580. The image of the jig is photographed after the jig, and the three-point alignment inspection of the tray is performed using the sorting pickers 560 and 580.

Through the image of the shooting fixture, the deviation values (X, Y, θ) of at least three loading slots and the central value of the tray can be calculated, and the matrix can be accurately calculated according to the input information related to the tray, the number of loading slots and the spacing information. The position value of the form of the loading slot. However, the 3-point alignment check of the tray is not limited to at least three loading slots, and the inspection area is not limited to the corners of the tray.

The moving range of the driving unit 415 installed to move the first visual unit 410 in the Y-axis direction is ensured to intersect with the moving range of the sorting pickers 560 and 580 or the sorting table picker 460 in the X-axis direction.

In short, when the movement range of the first vision unit 410 in the Y-axis direction crosses The above-described effects can be achieved by the moving range of the sorting pickers 560 and 580 in the X-axis direction on the XY plane or the moving range of the stage pickup 460.

In the semiconductor strip sawing apparatus 1000 shown in FIGS. 1 , 4 and 6 , when a plurality of sorting pickers (for example, two sorting pickers 560 and 580 ) are movable in parallel in the X-axis direction The range of movement of the first visual unit 410 in the Y-axis direction may be set such that the moving range of the plurality of sorting pickers in the X-axis direction crosses the XY plane.

As described above, the top surface of the semiconductor package is completed not only when the sorting pickers 560 and 580 are loaded with the semiconductor package in the tray, but also when the sorting stage pickup 460 is transferred to load the semiconductor package in the aligning stages 430a and 430b. Inspection of the bottom surface, which is done using the first vision unit 410 in a state in which the semiconductor package is picked up.

Although in the embodiment of Fig. 6, two sorting pickers, i.e., sorting pickers 560 and 580, are used, the number of sorting pickers may be set to be less than or greater than "2".

In the embodiment of Fig. 6, unlike the previous embodiment, the top and bottom surfaces of the semiconductor package can be completed without using the second vision unit 420.

Further, the first vision unit 410 inspects the top or bottom surface of the semiconductor package and the semiconductor package is dried, thereby minimizing waste of process time. Since the plurality of pickup units included in each of the sorting pickers 560 and 580 are independently driven, and the semiconductor package is in a state picked up by the sorting pickers 560 and 580, the first visual unit 410 checks the bottom surface or the top surface of the semiconductor package, According to the inspection result, the semiconductor package can be directly classified and placed in the unloading trays 510 and 530.

The seventh (a), seventh (b), and seventh (c) drawings show the suction plate 310 included in the semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 of the embodiment of the present invention. detailed FIG. 7(a) is a schematic cross-sectional view of the suction plate 310 of the semiconductor strip sawing apparatus 1000 shown in FIG. 1 or FIG. Fig. 7(b) is a plan view showing a suction unit 311a included in the suction plate 310 of Fig. 7(a). Fig. 7(c) is a plan view showing another suction member 311b included in the suction plate 310 of Fig. 7(a).

The suction plate 310 of Fig. 7(a) includes a centrally located basic assembly 315, a dispensing assembly for distributing air pressure to the outside, and suction assemblies 311a and 311b placed outside the dispensing assembly. The air pressure dispensed by the dispensing assembly is applied to the suction assemblies 311a and 311b, and the suction assemblies 311a and 311b contain a plurality of suction ports.

In the embodiment of FIG. 1 or FIG. 6, the pickup plate 310 applies some of the plurality of semiconductor packages picked up and cleaned by the unit pickup 270 to the first suction portion 311as, and the first suction portion 311as picks up the above. The surface of the suction plate 310 of the semiconductor package. The pickup plate 310 is rotated to supply the other semiconductor package second suction portions 311bs, and the second suction portions 311bs are the surfaces on which the semiconductor packages 310 are taken.

In particular, the suction plate 310 includes a base assembly 315, a first dispensing assembly 313a, and a second dispensing assembly 313b. The base assembly 315 includes a first air line 3153a and a second air line 3153b for selectively applying air pressure to the top and bottom surfaces of the suction plate 310. The first dispensing assembly 313a communicates with the top surface of the suction plate 310 and the first air line 3153a of the base assembly 315 to distribute air pressure. The second dispensing assembly 313b communicates with the bottom surface of the suction plate 310 and the second air line 3153b of the base assembly 315 to distribute air pressure.

Due to the suction pressure applied by the suction port 312a of the first suction portion 311as and the suction port 312b of the second suction portion 311bs, the semiconductor package placed on the first suction portion 311as and the second suction portion 311bs can be sucked and fixed to First suction portion 311as and second suction On the part 311bs. The suction plate 310 has the following structure, and the suction assembly 311a including the suction portion 311as and the suction assembly 311b including the suction portion 311bs are placed on the parallel side surfaces of the suction plate 310 facing each other.

The base assembly 315 is placed at the center of the suction plate 310. In the basic assembly 315, a handle hole 3151 is formed, and the rotary handle is inserted into the handle hole 3151 to rotate the suction plate 310 through the rotary drive unit 350 (refer to FIG. 2), and the pair of air lines 3153a and 3153b are placed as handles. The holes 3151 are parallel and symmetrical about the handle aperture 3151.

The air lines 3153a and 153b communicate with the distribution channel 314a of the distribution assembly 313a for distributing the air pressure and the distribution channel 314b of the distribution assembly 313b, respectively. Distribution channels 314a and 314b can communicate with suction ports 312a and 312b of suction assemblies 311a and 311b, respectively.

The base assembly 315 includes a communication passage 3154 and a communication passage 3155 that communicates with the distribution passages 314a and 314b of the distribution assemblies 313a and 313b.

When the suction portion or the suction assembly is placed on both surfaces of the suction plate 310 facing each other, the communication passages 3154 and 3155 branched from the respective air lines 3153a and 3153b can respectively communicate with the distribution passages of the distribution assemblies 313a and 313b. 314a and 314b.

In this case, it is considered that the communication passages 3154 and 3155 are symmetrical with respect to the air passages 3153a and 3153b, respectively. However, in the basic assembly 315 of the suction plate 310 of Fig. 7(a), the communication passages 3154b and 3155b are formed from one air passage 3153b toward the two suction portions 311as and 311bs, respectively.

That is, the communication passage 3155a is formed only from the first air passage 3153a toward the first suction assembly 311a, and the communication passages 3154b and 3155b are from the second air conduit. 3153b is formed in two directions of the first suction unit 311a and the second suction unit 311b.

In the embodiment of Fig. 7(a), the communication line 3155b formed in the direction of the first suction unit 311a of the two communication passages 3154b and 3155b branched from the second air line 3153b is blocked by the first distribution unit 313a, This does not allow air pressure to be applied by the second air line 3153b.

As shown in Figures 7(a), 7(b) and 7(c), the following will be combined with 8(a), 8(b), 8(c) and 8(d). The advantages described when the communication conduits are arranged to be asymmetric in the basic assembly 315 of the suction plate 310 are described.

The suction hopper 312a or 312b of the semiconductor package and the non-suction portion that does not suck the semiconductor package form the first and second suction portions 311as and 311bs to cross each other in the X-axis direction and the Y-axis direction, and the first and second suction portions 311as And 311bs are placed on the top and bottom surfaces of the suction plate 310. The first distribution unit 313a communicates with the suction port 312a formed on the first suction portion 311as, and the second distribution unit 313b communicates with the suction port 312b formed on the second suction portion 311bs.

The semiconductor packages picked up by the unit pickup 270 are arranged in a lattice form such that the semiconductor packages are placed adjacent to each other in the up, down, left, and right directions, in a state in which the semiconductor package is sawed. The semiconductor package picked up by the unit pickup 270 is divided and distributed to the first suction portion 311as and the second suction portion 311bs as the suction plate 310 rotates. Therefore, the positions of the suction ports included in the first and second suction members 311a and 311b may be different.

Specifically, a plurality of suction rafts are placed on each of the suction members 311a and 311b shown in Figs. 7(b) and 7(c). Although the suction enthalpy is formed into any lattice pattern or detection pattern, they may be continuously formed only in the diagonal direction, not in the up-and-down direction or the left-right direction. Adjacent. The suction pressure can be distributed and applied to the suction jaws 312a and 312b of the suction assemblies 311a and 311b by the dispensing passages of the dispensing assembly between the base assembly 315 and the suction assemblies 311a and 311b.

8(a), 8(b), 8(c), and 8(d) are suctions included in the semiconductor package inspection unit 400 of the semiconductor strip sawing apparatus 1000 according to another embodiment of the present invention. Board 310.

8(a) is a plan view of a suction assembly 311 of the suction plate 310 of the semiconductor strip sawing apparatus 1000. Figure 8(b) is a plan view of another suction assembly 311 of the suction plate 310 of the semiconductor strip sawing apparatus 1000. Fig. 8(c) is a schematic cross-sectional view of the suction plate 310 including the suction unit 311 of Fig. 8(a) on only one side surface thereof. Fig. 8(d) is a schematic cross-sectional view of the suction plate 310 including the suction assembly 311 of the eighth (b) on only one side surface thereof.

The suction hoppers of the semiconductor package are arranged in a matrix on the suction portion 311s along the X-axis direction and the Y-axis direction, and the suction portion 311s is formed on the top of the suction plate 310 of the drying device 300 of the semiconductor strip sawing apparatus 1000 of the embodiment of the present invention. On the surface, and a vacuum barrier unit or second distribution assembly 313b for blocking the second air line 3153b may be formed on the bottom surface of the suction plate 310.

In conjunction with the seventh (a), seventh (b), and seventh (c) drawings, as described above, the symmetrical air lines of the basic components 315, each of which is connected to the suction plate 310, are formed in communication with one of the distribution channels. The reason for the asymmetry is that when the suction plates 310 of the eighth (a), eighth (b), eighth (c), and eighth (d) are not inverted and only the drying function similar to that of the fourth figure is completed When the suction unit 311 is formed only on the one side surface of the suction plate 310 to form the suction portion 311s, the air pressure applied to the two air lines is concentrated on the distribution passage below the suction unit 311.

By concentrating the air pressure on a distribution channel, when the suction plate 310 of the semiconductor strip sawing apparatus 1000 of FIG. 4 is used, the suction plate should be simultaneously sucked and fixed in a dense lattice pattern and cut from the unit pickup 270. The semiconductor package is supplied to minimize the loss of air pressure.

Therefore, when the suction plate 310 of the semiconductor strip sawing apparatus 1000 does not need to be turned over and thus only a suction assembly needs to be formed on the suction plate 310, the suction assembly can be mounted above a distribution passage, and more in the air passage. The communication passage is connected to the distribution passage, and the mounting surface of the suction assembly opposite to the suction assembly is blocked by the blocking assembly 317 or the like shown in FIG. 8(c), thereby causing the air pressure exerted by the two air passages to concentrate or more uniformly Applied to the distribution channel below the suction assembly.

The pickup plate 310 of the semiconductor strip sawing apparatus 1000 of Fig. 1 uses the first suction portion and the second suction portion for transporting the semiconductor package to the alignment stages 430a and 430b. However, when the suction plate 310 uses only one suction portion, that is, when all the semiconductor packages picked up by the suction portion of the suction plate 310 are transferred to the array pickups 270 and transferred to the alignment stages 430a and 430b, as in the first As shown in FIG. 4, FIG. 6, or 7(a), 7(b) and 7(c), the loading grooves 431a and 431b in each of the array stages 430a and 430b may be formed as a crystal or The pattern is such that the grooves are placed adjacent to each other only in the diagonal direction, or formed as a detection pattern (i.e., a gull-type air channel pattern) rather than a dense lattice pattern. Therefore, in order to load the semiconductor package into the loading grooves 431a and 431b of the respective alignment stages 430a and 430b, the pickup plate 310 is reversed to have a lattice pattern adjacent to each other only in the diagonal direction or a detection pattern (gull type air passage pattern). The suction hopper is placed to correspond to the positions of the loading grooves 431a and 431b in the respective aligning stages 430a and 430b, the suction pressure of the suction grooves is removed, and the semiconductor package is loaded from the suction plate 310. It is carried into the desired loading grooves 431a and 431b in each of the array stages 430a and 430b.

In particular, Korean Patent No. 10-0604098 discloses a method of forming a distribution channel for distributing air pressure to a sawtooth pattern that does not intersect each other, and this method can be used to provide air pressure to a suction of the above-described lattice pattern or detection pattern. Component 311 either cancels the application of air pressure.

In this case, only one suction portion is formed on the suction plate 310. When the basic assembly 315 is used, the suction assembly can be placed in a predetermined direction in which more communication passages are formed in the air passage, and a suction assembly opposite to the suction assembly or The mounting surface of the dispensing assembly can be blocked by a vacuum barrier unit such as the blocking assembly 317 of Figure 8(c) or the blocking assembly 317' of Figure 8(d).

When using this method, the semiconductor package is aspirated by selectively applying a suction pressure to a suction port connecting the air lines, and the suction ports are arranged in a lattice form or a detection pattern to adjoin the suction assembly only in a diagonal direction or The applied suction pressure is canceled, and the semiconductor package is selectively mounted in the alignment stage 430 using the air pressure applied by the two air lines.

In the embodiments of FIGS. 8(b) and 8(d), the suction assembly 311 includes alternately placed first and second suction ports and a plurality of separate distribution channels 314 in a zigzag pattern. Or a gull-type pattern arrangement and each of the first and second suction ports. When the adjacent distribution channels 314 are set to communicate with different air lines, some of the aspirated semiconductor packages are first loaded into the first alignment stage, and then the other semiconductor packages are loaded into the second alignment stage.

The suction port or suction assembly of the suction plate of the semiconductor strip sawing apparatus of the embodiment of the present invention comprises alternately placed first and second suction ports and a vacuum unit, the vacuum The unit connects the first suction port and the second suction port. The vacuum unit causes vacuum pressure to be applied to the first dispensing assembly via the first air line. Therefore, the semiconductor package can be selectively loaded into the alignment stage.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

1000‧‧‧Semiconductor strip sawing equipment

M‧‧‧ card slot

S‧‧‧Semiconductor strip

100‧‧‧Loading Department

110‧‧‧ Pusher

200‧‧‧ sawing device

210‧‧‧ Entrance track

220‧‧‧ Puller

230‧‧‧With picker

240‧‧‧Guide frame

250‧‧‧Workbench

260‧‧‧Cutter

270‧‧‧unit picker

280‧‧‧cleaning device

281‧‧‧ nozzle

300‧‧‧Drying device

310‧‧‧ suction board

311‧‧‧Sucking components

320‧‧‧ moving box

330‧‧‧ board drive unit

331‧‧‧Rolling screw

333‧‧‧Ball screw nut

340‧‧‧Second transport track

350‧‧‧Rotary drive unit

360‧‧‧First transmission track

370‧‧‧Installation components

400‧‧‧Semiconductor package inspection unit

410‧‧‧First Vision Unit

415‧‧‧ drive unit

420‧‧‧Second Visual Unit

425‧‧ visual drive unit

430a, 430b‧‧‧

431a, 431b‧‧‧ loading slots

500‧‧‧Classification device

510‧‧‧First unloading tray

530‧‧‧Second unloading tray

560, 580‧‧‧ sorting pickers

561, 581‧‧‧ drive pickup unit

570‧‧‧Tray pickup

575‧‧‧Tray pickup drive unit

610‧‧‧First Stage Drive Unit

620‧‧‧Second stage drive unit

650‧‧‧First Category Pickup Drive Unit

660‧‧‧Second sort picker drive unit

670‧‧‧Guide frame

Claims (22)

A semiconductor strip sawing apparatus comprising: a loading portion for providing a semiconductor package in a state in which the semiconductor package is placed in a card slot; a pusher or a puller for removing the card slot Pulling the semiconductor package to the outside of the loading portion; an inlet track on which the semiconductor package pulled from the pusher or the puller is placed; and a tape picker for picking up the entrance track The semiconductor package, and the semiconductor package is transferred to a work surface in a state in which a mold surface of the semiconductor package is face down; a sawing device is configured to receive the semiconductor package from the strip pickup device, The semiconductor package is sawed into a plurality of semiconductor packages on the workbench, and the top surface of the semiconductor packages is cleaned with cleaning water; a unit pickup is used for simultaneously sucking and sawing by the sawing device and the top surface thereof has been cleaned The semiconductor packages, and the semiconductor packages that are taken up by a cleaning device to a drying device; the cleaning device for cleaning the semiconductors a bottom surface of the package in a state in which the semiconductor packages are sucked by the unit pickup; the drying device includes a suction plate for sucking the semiconductor packages cleaned by the cleaning device and transported by the unit pickup, Wherein the suction plate is movable in the XY plane along the X-axis direction or the Y-axis direction, and Rotating about the Y axis on the XY plane as needed; a first vision unit placed in a moving path of the suction plate of the drying device and used to move along a direction of movement of the suction plate in the XY plane Moving in a predetermined direction and inspecting the semiconductor packages; a first alignment stage and a second alignment stage, wherein a loading slot and a non-groove portion are alternately formed along the X-axis direction and the Y-axis direction, and the suction plate is sucked The semiconductor packages are loaded in the loading slots, the non-slot portions are not loaded with the semiconductor packages, and the first alignment stage and the second alignment stage are used for transferring and loading the loading slots. The semiconductor packages that are drawn on the board and are to be independently transported in the Y-axis direction; a second vision unit for inspecting the semiconductors loaded in the loading slots of the first and second arrays And a sorting device for transporting the semiconductor packages in the X direction and classifying and storing the semiconductor packages according to the inspection results of the semiconductor packages. The semiconductor strip sawing apparatus of claim 1, wherein the suction plate of the drying device is rotated by 180° with respect to a Y-axis on an XY plane to invert the semiconductor packages that are sucked and dried on the suction plate, The semiconductor package is turned upside down by moving the semiconductor packages in a direction relative to the Z-axis to be transferred into the loading slots in the first or second alignment stages. The semiconductor strip sawing apparatus of claim 2, wherein the suction plate comprises: a basic assembly comprising a first air line and a second air line for selectively applying air pressure to a top surface and a bottom surface of the suction plate; a first dispensing assembly for surface communication The top surface of the suction plate, and a distribution passage that communicates with the first air line of the basic assembly to distribute air pressure; and a second distribution assembly for communicating the bottom surface of the suction plate And including a distribution passage that communicates with the second air line of the base assembly to distribute air pressure. The semiconductor strip sawing device of claim 3, wherein a first suction portion and a second suction portion are respectively placed on the top surface and the bottom surface of the suction plate, wherein the suction port is used to suck the In the semiconductor package, the non-suction portion does not pick up the semiconductor packages, and the non-suction portions and the non-suction portions are formed on each of the first suction portion and the second suction portion to be along the X-axis direction and the Y-axis direction. Crossing each other, and the first dispensing assembly communicates with the suction ports formed on the first suction portion, and the second distribution assembly communicates with the suction ports formed on the second suction portion. The semiconductor strip sawing device of claim 4, wherein some of the semiconductor packages sucked by the unit pickup are loaded on the first pick-up portion, and the other semiconductor packages sucked by the unit pick-up pass through Y The shaft rotates the suction plate sequentially and is loaded onto the second suction portion to And the unit pickup comprises: first and second suction ports alternately placed; a first air line for connecting the first suction ports; and a second air line for connecting the first The second suction is separated from the first air line; and a vacuum unit is configured to selectively apply vacuum pressure to the first air line and the second air line. The semiconductor strip sawing device of claim 4, in order to agitate the gas onto the semiconductor packages sucked by the first pick-up portion and the second pick-up portion to remove moisture on the semiconductor packages, The utility model comprises: a downward blower installed in a direction of the first suction portion; and an upward blower installed in a direction of the second suction portion. The semiconductor strip sawing apparatus of claim 2, wherein the surface of the ball or the surface of the lead of the semiconductor package sucked by the pick-up plate is inspected through the first visual unit, the pick-up plate of the drying device is a state in which the Y axis on the XY plane is rotated by 180°, and the inspected semiconductor packages are transferred into the first alignment stage or the loading slots in the second alignment stage, the second vision unit checks the A mold surface of the semiconductor package loaded in the first alignment stage or the second alignment stage. The semiconductor strip sawing device according to claim 1, further comprising an array table a pickup movable in an X-axis direction or a Y-axis direction, and picking up the semiconductor packages sucked from the suction plate of the drying device and loading the semiconductor packages to the loading of the first or second alignment stage In the slot, wherein the array picker simultaneously picks up the semiconductor packages sucked on the pick-up board or divides the semiconductor packages into two parts and sequentially picks up the two parts, and sequentially loads the two parts to the first array stage With the second arrangement on the stage. The semiconductor strip sawing device of claim 8, wherein the alignment table pickup or the suction plate comprises: first and second suction ports alternately placed; a first air line for communicating Waiting for a first suction port; a second air line for connecting the second suction ports and separating from the first air line; and a vacuum unit for selectively applying air pressure to the first air a conduit and the second air conduit. The semiconductor strip sawing apparatus of claim 8, wherein the first visual unit inspects a mold surface of the semiconductor packages, in a state in which the array pickup picks up the semiconductor packages, and the inspected And the semiconductor package is transferred to the device slots of the first array or the second array, the second vision unit inspects a surface of the semiconductor package loaded in the first array or the second array Or lead surface. The semiconductor strip sawing apparatus of claim 8, wherein the first visual unit inspects a ball surface or a lead surface of the semiconductor package sucked by the suction plate, the suction plate of the drying device is on an XY plane When the Y-axis is rotated by 180°, when the pickup plate is rotated by 180° with respect to the Y-axis on the XY plane, the alignment table picker picks up the inspected semiconductor packages, and the first vision unit inspects the semiconductors. The surface of the packaged mold. The semiconductor strip sawing apparatus of claim 8, wherein the alignment table pickup comprises: a guide frame mounted along an axis; and an array table pickup drive unit coupled to a top surface of the guide frame Detachable from the guide frame and for moving the alignment table pickup, wherein one side of the drying device is coupled to a first transfer track, and the other side of the drying device is coupled to a second transfer track to avoid Interference or collision between the stage pickup drive unit and a dryer drive unit is engaged, the first transfer track being coupled to a lower portion of the guide frame. The semiconductor strip sawing device of claim 3, wherein a first suction portion is formed on a top surface of the suction plate, and the suction rafts of the semiconductor packages are sucked along the X-axis direction and the Y-axis direction at the first The suction portions are arranged in a matrix, and a vacuum blocking unit is formed on the bottom surface of the suction plate to block the second air conduit or the second distribution assembly. The semiconductor strip sawing device of claim 13, wherein the first suction portion comprises: first and second suction ports alternately placed; and a vacuum unit that connects the first suction ports and the like The second suction port selectively applies vacuum pressure to the first suction port and the second suction port, wherein the vacuum unit applies vacuum pressure to the first dispensing assembly by the first air line. The semiconductor strip sawing device of claim 13, wherein the vacuum barrier unit is a locking assembly or a plate blocking assembly. The semiconductor strip sawing apparatus of claim 1, wherein the drying device comprises: a moving frame mounted to be movable along an axis, the suction plate being rotatably coupled to the moving frame; a heater, Mounted in the suction plate, and drying the semiconductor packages sucked by the suction plate by heating the semiconductor packages; and a blower that blows gas through the semiconductor packages sucked onto the suction plate to remove The top surface of the suction plate or the moisture on the top or side surface of the semiconductor package. The semiconductor strip sawing apparatus of claim 1, wherein the first visual unit is an upwardly directed visual unit for inspecting a top surface or a bottom surface of the semiconductor package, and being placed in the semiconductor package Below Examining the semiconductor packages in the upstream direction, and the second visual unit is a downwardly directed visual unit for inspecting other top or bottom surfaces of the semiconductor packages, and the semiconductors placed in the alignment stage Above the package to inspect the semiconductor packages in the downstream direction. The semiconductor strip sawing apparatus of claim 1, wherein the sorting device comprises: at least one sorting picker for individually picking up the semiconductors loaded in the first array stage or the second array stage, and according to the The semiconductor package inspection results are sequentially classified and transferred, and a tray includes a plurality of loading slots, and the semiconductor packages that are picked up by the sorting pickup and classified according to the inspection results of the semiconductor packages are stored in In the loading slots, the loading slots are movable in a predetermined direction. The semiconductor strip sawing apparatus of claim 18, wherein the sorting picker picks up the first and second sorting stations and the semiconductor package loaded in the second sorting station, the first visual unit inspecting each of the semiconductor packages One surface, and the semiconductor packages are sorted according to the inspection results of the surface of each of the semiconductor packages, and then the semiconductor packages are stored on the tray. The semiconductor strip sawing apparatus of claim 18, wherein the semiconductor package or an inspection jig is loaded in at least two loading slots in the loading slot of the tray, moving the first visual unit when in classification Pick up Taking the state of the semiconductor package or the inspection fixture, the first vision unit captures an image of the semiconductor package or an image of the inspection fixture, and accurately calculates the distance by comparing the previously input pitch information with an actual moving distance. The position value of the load slot in the tray. The semiconductor strip sawing apparatus of claim 12, wherein the sorting device comprises: a tray comprising a plurality of loading slots, the semiconductor packages being sorted and stored therein according to inspection results of the semiconductor packages; A tray picker for picking up and unloading the tray, wherein a tray pickup drive unit and the array table pickup drive unit are mounted on the same guide frame. A semiconductor strip sawing apparatus comprising: a sawing device for providing a semiconductor strip, sawing the semiconductor strip as a plurality of semiconductor packages on a workbench, and cleaning the semiconductor packages with cleaning water a top surface; a unit pickup that simultaneously picks up the semiconductor packages that are sawed by the sawing device and whose top surface is cleaned, and transfers the semiconductor packages that are sucked through a cleaning device to a drying device; the drying a device for cleaning a bottom surface of the semiconductor package when the semiconductor package is in a state of being sucked by the unit pickup; the drying device includes a suction portion for cleaning the cleaning device The semiconductor package transported by the unit pickup, wherein the suction plate is movable in the XY plane along the X-axis direction or the Y-axis direction, and is rotatable about the Y-axis on the XY plane; a first vision unit is placed on the a moving path of the suction plate of the drying device, and a predetermined direction perpendicular to a moving direction of the suction plate, moving in the XY plane and inspecting the semiconductor packages; a sorting table picker for picking up the The semiconductor package sucked from the board and movable in the X direction or the Y direction; an array stage movable in the Y axis direction, wherein the array stage comprises: a first loading unit having a loading slot formed thereon The non-groove portions intersect with each other in the X-axis direction and the Y-axis direction, and the semiconductor package is sucked by the suction plate in the device slot, the semiconductor package is not loaded in the non-groove portion; and a second loading unit is formed For symmetry about the first loading unit; a second vision unit for inspecting the semiconductor packages loaded in the loading slots in the array; and a sorting device for the X direction Send these semiconductor package, and storage and classification of such semiconductor inspection result of the semiconductor package and the like, wherein the storage method of a semiconductor package in accordance with the rotation of the completion of the drying apparatus is lower than those inverted semiconductor package, Wherein, when the rotating function of the drying device is completed, the semiconductor packages sucked and dried on the suction plate are moved relative to the Z-axis direction to be loaded into the loading slots in the alignment table, at the drying device a state in which the suction plate is rotated by 180° with respect to the Y axis on the XY plane, and when the rotation function of the drying device is not completed, the semiconductor packages sucked and dried on the suction plate are picked up by the alignment table pickup, and Loaded into the loading slots in the alignment station.