TWI836770B - Sorting apparatus for semiconductor package and method thereof - Google Patents

Sorting apparatus for semiconductor package and method thereof Download PDF

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Publication number
TWI836770B
TWI836770B TW111146583A TW111146583A TWI836770B TW I836770 B TWI836770 B TW I836770B TW 111146583 A TW111146583 A TW 111146583A TW 111146583 A TW111146583 A TW 111146583A TW I836770 B TWI836770 B TW I836770B
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semiconductor package
flipper
semiconductor
adsorption
buffer
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TW111146583A
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TW202326831A (en
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金鎭洙
李龍玹
朴昶昱
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南韓商細美事有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
    • B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27—Means for performing other operations combined with cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Multimedia (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本發明提供作為一實施例的半導體封裝件分類裝置包括：切割部，將半導體條帶切割為半導體封裝件；單元拾取器，真空吸附並拾取該半導體封裝件，使其經過清洗部；清洗部，清洗被切割的該半導體封裝件；傳送台，安置該半導體封裝件；緩衝台，設置於該清洗部和該傳送台之間；翻轉器，包括旋轉部，真空吸附該半導體封裝件且以第一方向為中心旋轉、以及移動部，與該旋轉部連接且在該緩衝台的上部和該傳送台的上部之間向與該第一方向垂直的第二方向水平移動該旋轉部；以及檢查部，設置於該半導體封裝件的移動路徑上，以檢查該半導體封裝件。 The present invention provides as an embodiment a semiconductor package sorting device including: a cutting part, which cuts semiconductor strips into semiconductor packages; a unit pickup, which vacuum absorbs and picks up the semiconductor packages so that they pass through the cleaning part; the cleaning part, Clean the cut semiconductor package; a transfer station to place the semiconductor package; a buffer station arranged between the cleaning part and the transfer station; a flipper including a rotating part to vacuum the semiconductor package and use the first The direction is the center rotation, and the moving part is connected with the rotating part and horizontally moves the rotating part between the upper part of the buffer platform and the upper part of the transfer platform in a second direction perpendicular to the first direction; and an inspection part, It is arranged on the moving path of the semiconductor package to inspect the semiconductor package.

Description

半導體封裝件分類裝置及方法 Semiconductor package classification device and method

本發明涉及一種半導體封裝件分類裝置及方法。更具體地，本發明涉及一種用於切割由多個半導體封裝件組成的半導體條帶，將該半導體封裝件進行單片化，檢查該單片化的半導體封裝件，並根據結果對其進行分類的分類裝置及方法。 The invention relates to a semiconductor package classification device and method. More specifically, the present invention relates to a method for cutting a semiconductor strip composed of a plurality of semiconductor packages, singulating the semiconductor packages, inspecting the singulated semiconductor packages, and classifying them based on the results Classification devices and methods.

通常，半導體元件可以通過重複執行一系列製造工藝而形成於用作半導體基板的矽晶圓上，並且由此形成的半導體元件通過晶圓切割工藝和晶片接合工藝及模封工藝，可以製作成由多個半導體封裝件形成的半導體條帶。 Generally, semiconductor elements can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor elements thus formed can be manufactured into a semiconductor strip formed of multiple semiconductor packages through a wafer dicing process, a chip bonding process, and a molding process.

製作的半導體條帶通過切割及分類(Sawing & Sorting)工藝，單片化為多個半導體封裝件，根據良品或不良品的判斷來進行分類。例如，將該半導體條帶裝載到真空吸盤上後，使用切割刀片單片化為多個半導體封裝件，該被單片化的半導體封裝件被清洗並乾燥之後，通過視覺模塊進行檢查，根據該視覺模塊的檢查結果分類為良品和不良品。 The produced semiconductor strips are singulated into multiple semiconductor packages through the sawing & sorting process, and are classified according to the judgment of good or defective products. For example, after the semiconductor strip is loaded on a vacuum chuck, a cutting blade is used to singulate it into a plurality of semiconductor packages. After the singulated semiconductor packages are cleaned and dried, they are inspected by a vision module. According to the The inspection results of the vision module are classified into good products and defective products.

用於執行該切割和分類工藝的裝置可以包括用於傳送該半導體條帶的條帶拾取器、用於傳送該被單片化的半導體封裝件的單元拾取器。該半導體封裝件可以由該單元拾取器拾取後，由清洗模塊清洗，之後移動至傳送台上。 The device for performing the cutting and sorting process may include a strip picker for conveying the semiconductor strip and a unit picker for conveying the singulated semiconductor package. The semiconductor package may be picked up by the unit picker, cleaned by a cleaning module, and then moved to a conveying table.

另一方面，傳送至傳送台的過程中，需要轉換半導體封裝件的朝上或朝下時，添加從單元拾取器接收半導體封裝件並將其旋轉後將其傳遞至傳送台的旋轉台(翻轉器)。 On the other hand, when it is necessary to switch the semiconductor package upward or downward during transportation to the transfer table, a rotary table (turning table) that receives the semiconductor package from the unit picker, rotates it, and then transfers it to the transfer table is added. device).

然而，在現有技術中，需要轉換半導體封裝件的朝上或朝下時的設備與不需要轉換半導體封裝件的朝上或朝下時的設備結構不同，因此存在使用一種切割及分類裝置無法處理需要轉換朝上或朝下的封裝件和不需要轉換的封裝件或者生產性降低的問題。 However, in the prior art, the equipment for converting semiconductor packages facing up or down is different from the equipment for converting semiconductor packages facing up or down, so there is a problem that one cutting and sorting device cannot process packages that need to be converted facing up or down and packages that do not need to be converted, or productivity is reduced.

現有技術文獻： Existing technical documents:

(參考文獻1)：KR-10-1594965 B。 (Reference 1): KR-10-1594965 B.

本發明其目的在於提供一種半導體封裝件分類裝置及方法，其均可以處理轉換或維持半導體封裝件的朝上或朝下。 The object of the present invention is to provide a semiconductor package sorting device and method, which can handle switching or maintaining the upward or downward orientation of semiconductor packages.

本發明為了達到上述目的，提供如下的半導體封裝件分類裝置及方法。 In order to achieve the above object, the present invention provides the following semiconductor package classification device and method.

作為本發明的一實施例提供一半導體封裝件分類裝置，包括：一單元拾取器，用於真空吸附並拾取一半導體封裝件；一緩衝台，包括裝載該半導體封裝件的一盤；一傳送台，以該緩衝台為中心設置於該單元拾取器的相反側，且裝載並傳送該半導體封裝件；一翻轉器，包括一旋轉部，真空吸附該半導體封裝件且以一第一方向為中心旋轉，一移動部，與該旋轉部連接且在該緩衝台的上部和該傳送台的上部之間向與該第一方向垂直的第二方向水平移動該旋轉部；以及一檢查部，設置於該半導體封裝件的移動路徑上，以檢查該半導體封裝件。 As an embodiment of the present invention, a semiconductor package classification device is provided, comprising: a unit picker for vacuum adsorption and picking up semiconductor packages; a buffer platform, comprising a plate for loading the semiconductor packages; a conveyor, arranged on the opposite side of the unit picker with the buffer platform as the center, and loading and conveying the semiconductor packages; a flipper, comprising a rotating part, vacuum adsorbing the semiconductor packages and rotating with a first direction as the center, a moving part connected to the rotating part and horizontally moving the rotating part in a second direction perpendicular to the first direction between the upper part of the buffer platform and the upper part of the conveyor; and an inspection part, arranged on the moving path of the semiconductor packages to inspect the semiconductor packages.

本發明的一實施例中，該裝置還包括一切割部，將半導體條帶切割成半導體封裝件，及一清洗部，清洗被切割的該半導體封裝件，該單元拾取器在拾取該半導體封裝件的狀態下經過該清洗部，且該緩衝台可以設置在該清洗部和該傳送台之間。 In an embodiment of the present invention, the device further includes a cutting part for cutting the semiconductor strip into semiconductor packages, and a cleaning part for cleaning the cut semiconductor packages, and the unit pickup picks up the semiconductor packages. It passes through the cleaning part in a state where the buffer table can be disposed between the cleaning part and the transfer table.

本發明的一實施例中還包括一控制部，連接於該單元拾取器、該緩衝台、及該翻轉器，該控制部在裝置內維持該半導體封裝件的朝上或朝下時，通過該單元拾取器使該半導體封裝件裝載於緩衝台，並且使該翻轉器將裝載於該緩衝台的半導體封裝件傳送至傳送台。 One embodiment of the present invention further includes a control unit connected to the unit picker, the buffer, and the flipper. When the control unit maintains the semiconductor package facing up or down in the device, the semiconductor package is loaded on the buffer through the unit picker, and the flipper transfers the semiconductor package loaded on the buffer to the transfer platform.

作為本發明的一實施例，還提供一半導體封裝件分類方法，包括以下步驟：一傳送步驟，將半導體封裝件傳送至傳送台；一檢查步驟，檢查安置於該傳送台的該半導體封裝件；以及一分類步驟，根據該檢查步驟的結果對該半導體封裝件進行分類，該傳送步驟中該半導體封裝件的朝上或朝下會翻轉或維持，當對朝上或朝下進行翻轉時，該半導體封裝件由翻轉器對朝上或朝下進行翻轉並移動，當維持朝上或朝下時，該半導體封裝件通過該翻轉器移動。 As an embodiment of the present invention, a semiconductor package classification method is also provided, comprising the following steps: a conveying step, conveying the semiconductor package to a conveying platform; an inspection step, inspecting the semiconductor package placed on the conveying platform; and a classification step, classifying the semiconductor package according to the result of the inspection step, wherein the semiconductor package is flipped or maintained facing up or down in the conveying step, and when flipping the semiconductor package, the semiconductor package is flipped and moved by a flipper, and when maintaining the semiconductor package facing up or down, the semiconductor package moves through the flipper.

作為本發明的一實施例，還提供一半導體封裝件分類裝置，包括：一切割部將半導體條帶切割成該半導體封裝件；一清洗部，清洗被切割的該半導體封裝件；一單元拾取器，真空吸附並拾取該半導體封裝件，使其經過清洗部；一傳送台，轉載該半導體封裝件；一緩衝台，設置於該清洗部和該傳送台之間，且包括裝載該半導體封裝件的一盤；一翻轉器包括一旋轉部，真空吸附該半導體封裝件且以第一方向為中心旋轉、以及一移動部，連接於該旋轉部且在該緩衝台的上部和該傳送台的上部之間向與該第一方向垂直的第二方向水平移動該旋轉部；一第一檢查部，設置於傳送台的移動路徑上側；一晶片拾取器，移動已通過第一檢查部的該傳送台的半導體封裝件；一第二檢查部，設置於該晶片拾取器的移動路徑下部；多個托盤，根據該第一檢查部和第二檢查部的檢查結果放置該半導體封裝件；以及一控制部，至少連接於該單元拾取器、該緩衝台、該翻轉器，該控制部在裝置內維持該半導體封裝件的朝上或朝下時，通過該單元拾取器使該半導體封裝件裝載於緩衝台，並且使該翻轉器將裝載於該緩衝台的半導體封裝件傳送至傳送台。 As an embodiment of the present invention, a semiconductor package sorting device is also provided, including: a cutting part to cut semiconductor strips into semiconductor packages; a cleaning part to clean the cut semiconductor packages; and a unit pickup , vacuum adsorbing and picking up the semiconductor package, so that it passes through the cleaning part; a transfer station to transfer the semiconductor package; a buffer station, arranged between the cleaning part and the transfer station, and including a loader for loading the semiconductor package a tray; a flipper including a rotating part that vacuum-adsorbs the semiconductor package and rotates centered in the first direction, and a moving part connected to the rotating part and between the upper part of the buffer table and the upper part of the transfer table horizontally moving the rotating part in a second direction perpendicular to the first direction; a first inspection part disposed on the upper side of the movement path of the transfer table; a wafer pickup that moves the transfer table that has passed the first inspection part a semiconductor package; a second inspection part disposed under the moving path of the wafer picker; a plurality of trays to place the semiconductor package according to the inspection results of the first inspection part and the second inspection part; and a control part, At least connected to the unit picker, the buffer table, and the flipper, the control unit loads the semiconductor package on the buffer table through the unit picker when the semiconductor package is kept facing up or down in the device, And the flipper is used to transfer the semiconductor packages loaded on the buffer station to the transfer station.

本發明可以提供一種半導體封裝件分類設備和方法，其均可處理轉換或維持半導體封裝件的朝上或朝下的兩種情況。 The present invention can provide a semiconductor package classification device and method, which can handle the two situations of converting or maintaining the semiconductor package facing up or down.

10:半導體條帶 10: Semiconductor strips

20:半導體封裝件 20:Semiconductor packages

30:匣盒 30: Box

32:導軌 32: Guide rail

100:半導體條帶切割及分類裝置 100: Semiconductor strip cutting and sorting device

102:切割部 102: Cutting Department

104:切割主軸 104: Cutting spindle

110:條帶拾取器 110: Strip Picker

120:真空吸盤 120: Vacuum suction cup

122:吸盤台 122: Suction cup stand

130:單元拾取器 130:Unit Picker

140:清洗部 140: Cleaning Department

150:分類部 150: Classification Department

160:檢查部 160:Inspection Department

160a:第一檢查部 160a: First Inspection Department

160b:第二檢查部 160b:Second Inspection Department

170:托盤 170:Pallet

172:移動導軌 172:Moving rails

174:托盤供應單元 174: Pallet supply unit

180:容器 180: Container

190:晶片拾取器 190:wafer picker

200:傳送台 200: Transmission Station

210:緩衝台 210: Buffer station

250:翻轉器 250: Flipper

251:框架 251:Framework

252、253:旋轉軸 252, 253: Rotation axis

255:旋轉部 255:Rotation part

256、257、262:吸附管線 256, 257, 262: adsorption pipeline

258、259:吸附盤 258, 259: adsorption plate

269:移動部 269: Mobile Department

131、201、270:傳送導軌 131, 201, 270: Transmission guide rail

圖1為根據本發明一實施例的半導體封裝件分類裝置的示意結構圖；圖2為圖1的半導體封裝件分類裝置的翻轉器、緩衝台以及傳送台的示意側視圖； 圖3為圖1的半導體封裝件分類裝置的翻轉器以及緩衝台的示意立體圖；圖4為圖3的緩衝台的示意立體圖；圖5為在圖3的翻轉器和緩衝台中，翻轉半導體封裝件的朝上或朝下的狀態的示意側視圖；圖6及圖7為在圖3的翻轉器和緩衝台中，維持半導體封裝件的朝上或朝下的狀態的示意側視圖；圖8為根據本發明另一實施例的半導體封裝件分類裝置的示意結構圖；圖9為圖8的半導體封裝件分類裝置的翻轉器、緩衝台以及傳送台的示意側視圖；圖10為圖8的翻轉器的示意局部立體圖；圖11為圖8的翻轉器的示意俯視圖；圖12為圖8的翻轉器的局部截面圖；圖13為圖8的翻轉器的變形例的俯視圖；圖14為圖8的翻轉器的另一變形例的俯視圖；圖15至圖18為在圖8的翻轉器和緩衝台中，維持半導體封裝件的朝上或朝下的狀態的示意俯視圖；圖19為根據本發明的另一實施例的半導體封裝件分類裝置的示意結構圖；圖20為根據本發明的一實施例的半導體封裝件分類方法的示意流程圖。 Figure 1 is a schematic structural diagram of a semiconductor package sorting device according to an embodiment of the present invention; Figure 2 is a schematic side view of the flipper, buffer table and transfer table of the semiconductor package sorting device of Figure 1; Figure 3 is a schematic perspective view of the flipper and the buffering table of the semiconductor package sorting device of Figure 1; Figure 4 is a schematic perspective view of the buffering table of Figure 3; Figure 5 is a schematic diagram of flipping the semiconductor packages in the flipper and buffering table of Figure 3 Figures 6 and 7 are schematic side views of maintaining the upward or downward state of the semiconductor package in the flipper and buffer table of Figure 3; Figure 8 is a schematic side view according to A schematic structural diagram of a semiconductor package sorting device according to another embodiment of the present invention; Figure 9 is a schematic side view of the flipper, buffer table and transfer table of the semiconductor package sorting device of Figure 8; Figure 10 is a schematic side view of the flipper of Figure 8 Fig. 11 is a schematic top view of the flipper of Fig. 8; Fig. 12 is a partial cross-sectional view of the flipper of Fig. 8; Fig. 13 is a top view of a modification of the flipper of Fig. 8; Fig. 14 is a top view of the flipper of Fig. 8 A top view of another modified example of the flipper; Figures 15 to 18 are schematic top views of maintaining the upward or downward state of the semiconductor package in the flipper and buffer stage of Figure 8; Figure 19 is another modification according to the present invention. A schematic structural diagram of a semiconductor package classification device according to an embodiment; FIG. 20 is a schematic flow chart of a semiconductor package classification method according to an embodiment of the present invention.

在下文中，將詳細描述較佳實施例，以便發明所屬技術領域通常知識者可以參考附圖更容易地實施本發明。但是，在詳細描述本發明的較佳實施例時，如果判定相關已知配置或功能的詳細描述可能會混淆本發明的主旨，則將省略其詳細說明。此外，對於具有相似功能和作用的部件，在整個附 圖中使用相同的元件符號。此外，在本說明書中，“上”、“上部”、“上面”、“下”、“下部”、“下面”、“側面”等術語均以附圖為基礎，實際上，元件或構成要素可能因放置方向而異。 Hereinafter, preferred embodiments will be described in detail so that those of ordinary skill in the art to which the invention belongs can more easily implement the invention with reference to the accompanying drawings. However, in describing the preferred embodiments of the present invention in detail, if it is determined that the detailed description of related known configurations or functions may obscure the gist of the present invention, the detailed description will be omitted. In addition, for parts with similar functions and effects, throughout the attached The same component symbols are used in the figures. In addition, in this specification, terms such as "upper", "upper part", "top", "lower", "lower part", "below", "side" are based on the drawings. In fact, elements or constituent elements May vary depending on placement orientation.

此外，在整個說明書中，當一個部分與另一個部分“連接”時，它不僅是指“直接連接”的情況，還包括在中間間隔另一個元件“間接連接”的情況。此外，“包括”某個構成要素是指可以進一步包括其他構成要素，而不是排除其他構成要素，除非另有相反的記載。 Furthermore, throughout the specification, when one part is "connected" to another part, it refers not only to the case of "direct connection" but also to the case of "indirect connection" with another element interposed therebetween. In addition, "including" a certain constituent element means that other constituent elements can be further included, rather than excluding other constituent elements, unless otherwise stated to the contrary.

圖1為為了說明根據本發明的一實施例的半導體封裝件分類裝置的示意結構圖。 FIG1 is a schematic structural diagram for illustrating a semiconductor package classification device according to an embodiment of the present invention.

參見圖1，根據本發明的一實施例的半導體封裝件分類裝置100用於檢查被單片化的半導體封裝件20後根據其結果進行分類，其可以使用至通過切割由多個半導體封裝件20形成的半導體條帶10，以單片化該半導體封裝件20的切割。 Referring to FIG. 1 , a semiconductor package classification device 100 according to an embodiment of the present invention is used to inspect individualized semiconductor packages 20 and then classify them according to the results. It can be used to separate multiple semiconductor packages 20 by cutting. The semiconductor strips 10 are formed to singulate the semiconductor packages 20 by cutting.

根據本發明的一實施例的半導體封裝件分類裝置100包括檢查該半導體封裝件20後，根據檢查結果分類該半導體封裝件20的分類部150，且還可以包括為了單片化該半導體封裝件20而切割該半導體條帶10的切割部102。雖然切割部102可選擇地包含於分類裝置100，但是由於本實施例中包括切割部102，因此本實施例中的半導體封裝件分類裝置100也可以被稱為半導體條帶切割及分類裝置。 The semiconductor package classification device 100 according to an embodiment of the present invention includes a classification unit 150 that classifies the semiconductor package 20 according to the inspection results after inspecting the semiconductor package 20, and may also include a method for singulating the semiconductor package 20. The cutting portion 102 of the semiconductor strip 10 is cut. Although the cutting part 102 is optionally included in the sorting device 100, since the cutting part 102 is included in this embodiment, the semiconductor package sorting device 100 in this embodiment may also be called a semiconductor strip cutting and sorting device.

在該分類裝置100的一側可以設置容納有多個半導體條帶的匣盒30。雖然沒有詳細圖示，但是切割部102可以具有從該匣盒30引出該半導體條帶10的夾持器(圖未示)，從該匣盒30引出的半導體條帶10可以由導軌32引導。 A cassette 30 containing a plurality of semiconductor strips may be provided on one side of the sorting device 100 . Although not shown in detail, the cutting part 102 may have a holder (not shown) for drawing out the semiconductor strip 10 from the cassette 30 , and the semiconductor strip 10 drawn out from the cassette 30 may be guided by the guide rail 32 .

該半導體條帶10由條帶拾取器110拾取後可以傳送至真空吸盤120上。雖然沒有詳細圖示，但是該條帶拾取器110可以由條帶傳送單元移動，且為了調整該半導體條帶10的設置方向，可以配置為可旋轉。例如，該條帶拾取器110拾取從該匣盒30引出的半導體條帶10後，可以旋轉該半導體條帶10，接著可以將該被旋轉的半導體條帶10傳送至該真空吸盤120上。 The semiconductor strip 10 can be transferred to the vacuum chuck 120 after being picked up by the strip picker 110 . Although not shown in detail, the strip picker 110 can be moved by a strip transfer unit, and can be configured to be rotatable in order to adjust the arrangement direction of the semiconductor strip 10 . For example, after the strip picker 110 picks up the semiconductor strip 10 taken out of the cassette 30 , the semiconductor strip 10 can be rotated, and then the rotated semiconductor strip 10 can be transferred to the vacuum chuck 120 .

該真空吸盤120可以由吸盤台122支撐，該吸盤台122可以使該半導體條帶10移動至切割主軸104。該切割主軸104是用於切割該半導體條帶10的結構。該吸盤台122可以通過單獨的驅動部(圖未示)將該半導體條帶10移動至該切割主軸104的下方。由該切割部102單片化的半導體封裝件20可以通過單元拾取器130拾取並傳送。 The vacuum chuck 120 can be supported by a chuck table 122 that can move the semiconductor strip 10 to the cutting spindle 104 . The cutting spindle 104 is a structure used for cutting the semiconductor strip 10 . The suction cup stage 122 can move the semiconductor strip 10 below the cutting spindle 104 through a separate driving part (not shown). The semiconductor packages 20 singulated by the cutting part 102 can be picked up by the unit picker 130 and transported.

該條帶拾取器110和該單元拾取器130可以在沿X方向延伸的傳送導軌131上移動，引導該單元拾取器130的移動的傳送導軌131延伸至真空吸盤120、清洗部140及緩衝台210。 The strip picker 110 and the unit picker 130 can move on a conveying rail 131 extending along the X direction, and the conveying rail 131 guiding the movement of the unit picker 130 extends to the vacuum suction cup 120, the cleaning part 140 and the buffer stage 210.

該分類裝置100包括用於清洗被單片化的半導體封裝件20的清洗部140。該單元拾取器130拾取該半導體封裝件20後，可以沿著傳送導軌131移動至該清洗部140的上部。該清洗部140可以使用刷子和清洗液從該半導體封裝件20去除異物。即，該半導體封裝件20可以在被該單元拾取器130拾取的狀態下，通過該清洗部140被清洗。 The sorting device 100 includes a cleaning section 140 for cleaning the singulated semiconductor package 20. After the unit picker 130 picks up the semiconductor package 20, it can move to the upper part of the cleaning section 140 along the conveying guide 131. The cleaning section 140 can remove foreign matter from the semiconductor package 20 using a brush and a cleaning liquid. That is, the semiconductor package 20 can be cleaned by the cleaning section 140 while being picked up by the unit picker 130.

在完成對該半導體封裝件20的清洗後，該半導體封裝件20通過設置在清洗部140的一側的諸如氣刀的配置來乾燥，之後移動至傳送台200。 After the semiconductor package 20 is cleaned, the semiconductor package 20 is dried by a device such as an air knife disposed on one side of the cleaning section 140, and then moved to the transfer platform 200.

在向傳送台200移動時，半導體封裝件20可以變更或保持朝上或朝下。 While moving toward the transfer station 200, the semiconductor package 20 may change or remain facing up or down.

當對朝上或朝下進行變更時，半導體封裝件20從封裝件拾取器130傳遞至翻轉器250，之後通過翻轉器250的旋轉，朝上或朝下被翻轉，並裝載至傳送台200。 When changing the direction to upward or downward, the semiconductor package 20 is transferred from the package picker 130 to the flipper 250, and then flipped upward or downward by the rotation of the flipper 250 and loaded onto the transfer table 200.

相反地，在朝上或朝下不變的情況下，半導體封裝件20從封裝件拾取器130傳遞至緩衝台210，之後翻轉器250吸附緩衝台210的半導體封裝件20，沿著傳送導軌270移動並傳遞至傳送台200。半導體封裝件20通過清洗部140移動至傳送台200的過程和緩衝台210以及翻轉器250在後面參照圖2至圖7再次說明。 On the contrary, the semiconductor package 20 is transferred from the package picker 130 to the buffer stage 210 while facing upward or downward, and then the flipper 250 adsorbs the semiconductor package 20 of the buffer stage 210 along the transfer guide 270 Move and pass to teleporter 200. The process of moving the semiconductor package 20 to the transfer stage 200 through the cleaning unit 140, the buffer stage 210, and the flipper 250 will be described again later with reference to FIGS. 2 to 7 .

從該傳送台200移動的半導體封裝件20通過晶片拾取器190移動，該分類裝置100包括在移動到托盤170之前檢查半導體封裝件20的檢查部160。檢查部160可以包括設置於該傳送台200的移動路徑上部的第一檢查部160a和設置於晶片拾取器190的移動路徑下部的第二檢查部160b。 The semiconductor package 20 moved from the conveyor 200 is moved by the wafer picker 190, and the sorting device 100 includes an inspection unit 160 that inspects the semiconductor package 20 before moving to the tray 170. The inspection unit 160 may include a first inspection unit 160a disposed at an upper portion of a moving path of the conveyor 200 and a second inspection unit 160b disposed at a lower portion of a moving path of the wafer picker 190.

該裝置100可以包括用於容納由該檢查部160判定為良品的半導體封裝件20的托盤170、用於容納被判定為不良品的半導體封裝件20的容器180，使該托盤170沿著移動導軌172移動的托盤移動部(圖未示)、以及用於供應該托盤170的托盤供應單元174。 The apparatus 100 may include a tray 170 for accommodating the semiconductor package 20 judged to be a good product by the inspection unit 160, and a container 180 for accommodating the semiconductor package 20 judged to be a defective product, and the tray 170 may be moved along the moving guide rail. A pallet moving unit (not shown) that moves 172, and a pallet supply unit 174 for supplying the pallet 170.

此外，雖然沒有圖示，但該分類裝置100包括與該切割部102及分類部150的結構連接且控制裝置的控制部(未圖示)。 In addition, although not shown in the figure, the classification device 100 includes a control part (not shown) connected to the structure of the cutting part 102 and the classification part 150 and controlling the device.

圖2中示有圖1的半導體封裝件分類裝置100的翻轉器250、緩衝台210以及傳送台200的示意側視圖，圖3中示有圖1的半導體封裝件分類裝置100的翻轉器250及緩衝台210的示意立體圖，圖4中示有緩衝台210的示意立體圖。 FIG. 2 shows a schematic side view of the flipper 250 , the buffer table 210 and the transfer table 200 of the semiconductor package sorting device 100 of FIG. 1 . FIG. 3 shows the flipper 250 and the transfer table 200 of the semiconductor package sorting device 100 of FIG. 1 . A schematic three-dimensional view of the buffer platform 210 is shown in FIG. 4 .

引導單元拾取器130且在X方向上延伸的傳送導軌131經過該清洗部140延伸至該緩衝台210的上部，在相較於該傳送導軌131更低的位置連接該 翻轉器250的傳送導軌270向與引導該單元拾取器130的傳送導軌131相同的方向延伸。 The conveying guide rail 131 guiding the unit pickup 130 and extending in the X direction extends to the upper part of the buffer stage 210 through the cleaning section 140, and the conveying guide rail 270 connected to the flipper 250 at a lower position than the conveying guide rail 131 extends in the same direction as the conveying guide rail 131 guiding the unit pickup 130.

該傳送台200包括：包含吸附半導體封裝件20的吸附槽的盤202；連接於該盤202，以調節該盤202高度的高度調節部203；以及連接於該盤202並沿著向Y方向延伸的傳送導軌201移動該盤202的移動部205。 The conveying platform 200 includes: a plate 202 including an adsorption groove for adsorbing the semiconductor package 20; a height adjustment portion 203 connected to the plate 202 to adjust the height of the plate 202; and a moving portion 205 connected to the plate 202 and moving the plate 202 along a conveying guide rail 201 extending in the Y direction.

緩衝台210設置在該清洗部140和該傳送台200之間，且包括裝載該半導體封裝件20的盤211、以及連接於該盤211並調節該盤211高度的高度調節部213。 The buffer stage 210 is disposed between the cleaning section 140 and the conveying stage 200, and includes a tray 211 for loading the semiconductor package 20, and a height adjustment section 213 connected to the tray 211 and adjusting the height of the tray 211.

該盤211形成有連接於吸附管線的吸附孔211a，用於從單元拾取器130接收半導體封裝件20或者將接收到的半導體封裝件20傳遞至翻轉器250。 The plate 211 is formed with an adsorption hole 211a connected to the adsorption pipeline, which is used to receive the semiconductor package 20 from the unit picker 130 or transfer the received semiconductor package 20 to the flipper 250.

高度調節部213可以包括當從該單元拾取器130接收該半導體封裝件20或向該翻轉器250傳遞半導體封裝件20時，作為使該盤211上升或者下降的升降結構，其可以包括例如電動機、連接於該電動機的旋轉軸的螺桿、形成有對應於螺桿的螺紋且連接於該盤211的移動塊，但不限於此。 The height adjustment part 213 may include a lifting structure for raising or lowering the plate 211 when receiving the semiconductor package 20 from the unit picker 130 or delivering the semiconductor package 20 to the flipper 250, which may include, for example, a motor, a screw connected to the rotating shaft of the motor, and a moving block having threads corresponding to the screw and connected to the plate 211, but is not limited thereto.

另一方面，安置於該緩衝台210的盤211的半導體封裝件20也可以通過設置於緩衝台210或者緩衝台210周圍的諸如氣刀或加熱器的配置來進行乾燥。 On the other hand, the semiconductor package 20 placed on the tray 211 of the buffer stage 210 can also be dried by an arrangement such as an air knife or a heater provided on or around the buffer stage 210 .

翻轉器250包括：連接於從該緩衝台210的上部和該傳送台200的上部向X方向延伸的傳送導軌270，以使該翻轉器250可以在該緩衝台210的上部和該傳送台200的上部之間移動的移動部269；吸附從單元拾取器130或緩衝台210接收到的半導體封裝件20，以Y方向為中心旋轉的旋轉部255；以及圍繞該旋轉部255的框架251。 The flipper 250 includes: connected to the transmission guide rail 270 extending in the X direction from the upper part of the buffer platform 210 and the upper part of the transfer platform 200, so that the flipper 250 can move between the upper part of the buffer platform 210 and the upper part of the transfer platform 200. The moving part 269 that moves between the upper parts; the rotating part 255 that sucks the semiconductor package 20 received from the unit picker 130 or the buffer table 210 and rotates around the Y direction; and the frame 251 surrounding the rotating part 255.

翻轉器250的旋轉部255在該框架251的內側連接於一對旋轉軸252、253，且連接於該旋轉軸252、253中的驅動部(未示出)，以使該旋轉部255相對於該框架251旋轉。 The rotating part 255 of the flipper 250 is connected to a pair of rotating shafts 252 and 253 on the inner side of the frame 251, and is connected to a driving part (not shown) in the rotating shafts 252 and 253, so that the rotating part 255 rotates relative to the frame 251.

旋轉部255至少一面包括吸附盤258，且該吸附盤258具有連接於吸附管線的吸附孔，可以從該單元拾取器130或者緩衝台210吸附並接收半導體封裝件20，或者向該傳送台200傳遞半導體封裝件20。該吸附管線連接於吸附源，以提供吸附半導體封裝件20的吸附力。 At least one side of the rotating part 255 includes an adsorption plate 258, and the adsorption plate 258 has an adsorption hole connected to the adsorption pipeline, which can adsorb and receive the semiconductor package 20 from the unit picker 130 or the buffer stage 210, or transfer the semiconductor package 20 to the transfer stage 200. The adsorption pipeline is connected to the adsorption source to provide adsorption force for adsorbing the semiconductor package 20.

圖5至圖7為將在單元拾取器130中經過翻轉器250和緩衝台210向傳送台200傳遞半導體封裝件20的狀態以側視圖進行說明的圖，圖5為當翻轉半導體封裝件20的朝上或朝下時的側視圖，圖6和圖7為維持半導體封裝件20的朝上或朝下時的側視圖。朝上或朝下的維持和翻轉由控制部來控制。 Figures 5 to 7 are side views illustrating the state of transferring the semiconductor package 20 to the transfer platform 200 through the flipper 250 and the buffer platform 210 in the unit picker 130. Figure 5 is a side view when the semiconductor package 20 is flipped up or down, and Figures 6 and 7 are side views when the semiconductor package 20 is maintained up or down. The maintenance and flipping of the upward or downward direction are controlled by the control unit.

半導體封裝件20的朝上或朝下的翻轉指的是，半導體封裝件20以球朝上(ball up)或死蟲(dead bug)狀態進入到裝置中，通過裝置之後以球朝下(ball down)或活蟲(live bug)狀態從裝置中排出的情況，則反之亦然，維持朝上或朝下指的是，半導體封裝件20以死蟲(dead bug)或活蟲(live bug)狀態進入到裝置中，並以相同的狀態從裝置中排出。 The flipping of the semiconductor package 20 upward or downward means that the semiconductor package 20 enters the device in a ball up or dead bug state, and passes through the device in a ball down state. down) or live bug (live bug) state is discharged from the device, vice versa. Maintaining upward or downward means that the semiconductor package 20 is in a dead bug (dead bug) or live bug (live bug) state. State goes into the device and comes out of the device in the same state.

為了翻轉朝上或朝下，需要旋轉翻轉器250的旋轉部255，圖5中示出了這樣的情況。如圖5所示，單元拾取器130將半導體封裝件20傳遞到在該緩衝台210的上方等待的該翻轉器250，且該翻轉器250接收到該半導體封裝件20之後，向該傳送台200的上部移動並使旋轉部旋轉180度，向該傳送台200傳遞該半導體封裝件20。此時，由於翻轉器250的旋轉部255旋轉180度，所以半導體封裝件20的朝上或朝下被翻轉。 In order to flip up or down, the rotating part 255 of the flipper 250 needs to be rotated, and this is shown in FIG. 5 . As shown in FIG. 5 , the unit picker 130 transfers the semiconductor package 20 to the flipper 250 waiting above the buffer stage 210 , and after receiving the semiconductor package 20 , the flipper 250 transfers the semiconductor package 20 to the transfer stage 200 The upper part is moved and the rotating part is rotated 180 degrees to transfer the semiconductor package 20 to the transfer stage 200 . At this time, since the rotating portion 255 of the inverter 250 rotates 180 degrees, the semiconductor package 20 is turned upward or downward.

當對朝上或朝下進行翻轉時，半導體封裝件20的乾燥結構被設置在緩衝台210的周圍時，由於可以向緩衝台210傳遞半導體封裝件20並執行額 外的乾燥功能，因此，也可以在翻轉器250從單元拾取器130接收半導體封裝件20之後，為了額外的乾燥向緩衝台210傳遞半導體封裝件20後再退還。 When the semiconductor package 20 is turned upside down or downside down, the drying structure of the semiconductor package 20 is arranged around the buffer 210. Since the semiconductor package 20 can be delivered to the buffer 210 and perform an additional drying function, the semiconductor package 20 can be delivered to the buffer 210 for additional drying and then returned after the flipper 250 receives the semiconductor package 20 from the unit picker 130.

在本實施例中，本發明通過包括緩衝台210和翻轉器250，可以在一個裝置中實現對朝上或朝下的維持和對朝上或朝下的翻轉。由於翻轉器250不僅用於半導體封裝件20的翻轉和移動，還可以僅用於移動，因此，不需要用於半導體封裝件20的移動的單元拾取器附加結構，在不增加裝置體積的情況下，均可實現對朝上或朝下的維持和翻轉。 In this embodiment, the present invention can realize the maintenance of the upward or downward direction and the flipping of the upward or downward direction in one device by including the buffer stage 210 and the flipper 250. Since the flipper 250 is not only used for flipping and moving the semiconductor package 20, but can also be used only for moving, there is no need for an additional structure of a unit picker for moving the semiconductor package 20, and the maintenance and flipping of the upward or downward direction can be realized without increasing the volume of the device.

對於單元拾取器130，有必要將半導體封裝件20傳遞給翻轉器250或者接收翻轉器250的半導體封裝件20，因此需要位於相較於該翻轉器250上側的位置，並且當使用單元拾取器130向傳送台200傳遞半導體封裝件時，這樣的單元拾取器需要進入至傳送台200的上側。因此，當使用單元拾取器130向傳送台200傳遞半導體封裝件20時，其佔據傳送台200上部的空間，並產生用於避免額外組件之間干擾的結構的需求。 For the unit picker 130, it is necessary to transfer the semiconductor package 20 to the flipper 250 or to receive the semiconductor package 20 of the flipper 250, and therefore needs to be located at an upper side compared to the flipper 250, and when using the unit picker 130 When transferring semiconductor packages to the transfer station 200 , such a unit picker needs to enter the upper side of the transfer station 200 . Therefore, when the semiconductor package 20 is transferred to the transfer station 200 using the unit picker 130, it occupies the space above the transfer station 200 and creates a need for a structure to avoid interference between additional components.

然而，本發明的本實施例中，無論是否對朝上或朝下進行翻轉都會使用翻轉器250向傳送台200傳遞半導體封裝件20，因此，單元拾取器130沒有必要到達至傳送台200的上方，這樣可以確保傳送台200上方的空間，便於檢查部160或其他結構的應用和設計。 However, in this embodiment of the present invention, the semiconductor package 20 is transferred to the conveyor 200 using the flipper 250 regardless of whether it is turned up or down, so the unit picker 130 does not need to reach above the conveyor 200, which can ensure the space above the conveyor 200, facilitating the application and design of the inspection unit 160 or other structures.

進一步地，本實施例中，在高度方向上單元拾取器130和緩衝台210一邊以位於單元拾取器130和緩衝台210之間的翻轉器250為中心上下移動，一邊向翻轉器250傳遞半導體封裝件，因此，翻轉器250沒有上下移動，其X方向移動及旋轉較穩定，可以獲得節省傳遞半導體封裝件所需的時間並提高生產率的效果。 Furthermore, in this embodiment, the unit picker 130 and the buffer table 210 move up and down in the height direction with the flipper 250 located between the unit picker 130 and the buffer table 210 as the center, while transferring the semiconductor package to the flipper 250 Therefore, the flipper 250 does not move up and down, and its X-direction movement and rotation are relatively stable, which can save the time required to transfer semiconductor packages and improve productivity.

另外，緩衝台210的結構並不複雜，並且即便添加了緩衝台210的構成，也無需改變翻轉器250或傳送台200，可以通過簡單的結構一併實現對朝上或朝下的維持和翻轉。 In addition, the structure of the buffer platform 210 is not complicated, and even if the structure of the buffer platform 210 is added, there is no need to change the flipper 250 or the conveyor 200, and the upward or downward maintenance and flipping can be achieved through a simple structure.

圖8中示出了根據本發明的另一實施例的半導體封裝件分類裝置的示意結構圖。 FIG. 8 shows a schematic structural diagram of a semiconductor package sorting device according to another embodiment of the present invention.

圖8的根據實施例的半導體封裝件分類裝置100與圖1的實施例相同，都是用於通過切割由多個半導體封裝件200形成的半導體條帶10，單片化該半導體封裝件20，檢查該被單片化的半導體封裝件20之後，根據其結果進行分類。 The semiconductor package sorting device 100 according to the embodiment of FIG. 8 is the same as the embodiment of FIG. 1 and is used to singulate the semiconductor packages 20 by cutting the semiconductor strips 10 formed by the plurality of semiconductor packages 200. After the individualized semiconductor packages 20 are inspected, they are classified based on the results.

根據本發明的一實施例的半導體封裝件分類裝置100可以包括為了單片化該半導體封裝件20而切割該半導體條帶10的切割部102、及用於檢查該半導體封裝件20並根據檢查結果分類該半導體封裝件20的分類部150。 The semiconductor package sorting device 100 according to an embodiment of the present invention may include a cutting part 102 for cutting the semiconductor strip 10 in order to singulate the semiconductor package 20, and a cutting part 102 for inspecting the semiconductor package 20 and based on the inspection result. The classification unit 150 classifies the semiconductor packages 20 .

該分類裝置100的一側設置有容納多個半導體條帶的匣盒30，從該匣盒30引出的半導體條帶10由導軌32引導。 A cassette 30 for accommodating a plurality of semiconductor strips is provided on one side of the classification device 100, and the semiconductor strips 10 drawn out of the cassette 30 are guided by a guide rail 32.

該半導體條帶10由條帶拾取器110拾取後傳送至真空吸盤120上。該真空吸盤120可以通過吸盤台122支撐，並且該吸盤台122可以將該半導體條帶10移動至切割主軸104。被該切割部102單片化的半導體封裝件20由單元拾取器130拾取並傳送，引導該單元拾取器130的移動的傳送導軌131至少在真空吸盤120、清洗部140以及緩衝台210的上部延伸。 The semiconductor strip 10 is picked up by the strip picker 110 and transferred to the vacuum suction cup 120. The vacuum suction cup 120 can be supported by the suction cup platform 122, and the suction cup platform 122 can move the semiconductor strip 10 to the cutting spindle 104. The semiconductor package 20 singulated by the cutting part 102 is picked up and transferred by the unit picker 130, and the transfer guide 131 guiding the movement of the unit picker 130 extends at least above the vacuum suction cup 120, the cleaning part 140 and the buffer platform 210.

該分類裝置100包括用於清洗被單片化的半導體封裝件20的清洗部140，並且該單元拾取器130拾取該半導體封裝件20之後，移動到該清洗部140的上部，該清洗部140可以使用刷子和清洗液從該半導體封裝件20中去除異物。 The sorting device 100 includes a cleaning section 140 for cleaning the singulated semiconductor package 20, and after the unit picker 130 picks up the semiconductor package 20, it moves to the upper part of the cleaning section 140, and the cleaning section 140 can remove foreign matter from the semiconductor package 20 using a brush and a cleaning liquid.

完成對該半導體封裝件20的清洗後，該半導體封裝件20通過設置在清洗部140的一側的諸如氣刀的配置來乾燥，之後移動至傳送台200。本實施例中傳送台200包括第一傳送台200a和第二傳送台200b，並且當向傳送台200移動時，半導體封裝件20的朝上或朝下可以變更或維持。 After completing the cleaning of the semiconductor package 20 , the semiconductor package 20 is dried by a configuration such as an air knife provided on one side of the cleaning part 140 , and then moves to the transfer stage 200 . In this embodiment, the transfer station 200 includes a first transfer station 200a and a second transfer station 200b, and when moving to the transfer station 200, the upward or downward orientation of the semiconductor package 20 can be changed or maintained.

當對朝上或朝下進行變更的情況下，半導體封裝件20從封裝件拾取器130傳遞至翻轉器250，之後通過翻轉器250的旋轉，朝上或朝下被翻轉，並安置於傳送台200。相反的，在朝上或朝下不變的情況下，半導體封裝件20從封裝件拾取器130傳遞至緩衝台210，之後翻轉器250吸附緩衝台210的半導體封裝件20，使其移動至傳送台200。 When the orientation is changed upward or downward, the semiconductor package 20 is transferred from the package picker 130 to the flipper 250, and then flipped upward or downward by the rotation of the flipper 250 and placed on the conveying platform 200. On the contrary, when the orientation remains unchanged upward or downward, the semiconductor package 20 is transferred from the package picker 130 to the buffer platform 210, and then the flipper 250 absorbs the semiconductor package 20 on the buffer platform 210 and moves it to the conveying platform 200.

傳送至傳送台200的過程中，所有的半導體封裝件20可以傳送到第一傳送台200a和第二傳送台200b中的一個，但一部分也可以傳送到第一傳送台200a，其餘傳送至第二傳送台200b，並且為此翻轉器250的兩面可以具有第一吸附盤258和第二吸附盤259，該一部分可以吸附於第一吸附盤258，該其餘部分可以吸附於第二吸附盤259。 During the process of conveying to the conveying platform 200, all semiconductor packages 20 can be conveyed to one of the first conveying platform 200a and the second conveying platform 200b, but a part can also be conveyed to the first conveying platform 200a, and the rest can be conveyed to the second conveying platform 200b, and for this purpose, the two sides of the flipper 250 can have a first adsorption plate 258 and a second adsorption plate 259, and the part can be adsorbed on the first adsorption plate 258, and the rest can be adsorbed on the second adsorption plate 259.

移動至該傳送台200的半導體封裝件20通過晶片拾取器190移動至托盤170，該分類裝置100包括用於檢查移動至托盤170之前的半導體封裝件20的檢查部160。檢查部160可以包括設置於該傳送台200的移動路徑上部的第一檢查部160a、第二檢查部160b和設置於晶片拾取器190的移動路徑下部的第三檢查部160c。 The semiconductor package 20 moved to the conveyor 200 is moved to the tray 170 by the wafer picker 190, and the classification device 100 includes an inspection unit 160 for inspecting the semiconductor package 20 before being moved to the tray 170. The inspection unit 160 may include a first inspection unit 160a disposed on the upper portion of the moving path of the conveyor 200, a second inspection unit 160b, and a third inspection unit 160c disposed on the lower portion of the moving path of the wafer picker 190.

該分類部150可以包括用於容納由該檢查部160判定為良品的半導體封裝件20的托盤170、用於容納被判定為不良品的半導體封裝件20的容器180、使該托盤170沿著移動導軌172移動的托盤移動部、以及用於供應該托盤170的托盤供應單元174。 The classification section 150 may include a tray 170 for accommodating semiconductor packages 20 determined as good products by the inspection section 160, a container 180 for accommodating semiconductor packages 20 determined as defective products, a tray moving section for moving the tray 170 along a moving guide rail 172, and a tray supply unit 174 for supplying the tray 170.

此外，雖然沒有圖示，但該分類裝置100包括與該切割部102及分類部150的結構連接且控制裝置的控制部(圖未示)。 In addition, although not shown in the figure, the classification device 100 includes a control part (not shown) connected to the structure of the cutting part 102 and the classification part 150 and controlling the device.

圖9中示出了半導體封裝件分類裝置100的翻轉器250、緩衝台210以及傳送台200的示意側視圖。本實施例中傳送台200包括第一傳送台200a及第二傳送台200b，並且該第一傳送台200a和第二傳送台200b分別包括：安置有半導體封裝件20的第一盤202a和第二盤202b；連接於該盤202a、202b以調節高度的高度調節部203a、203b；以及連接於該盤202a、202b且沿著向Y方向延伸的傳送導軌201a、201b使盤移動的移動部205a、205b；並且還可以包括使該盤202a、202b以高度方向為中心旋轉的水平旋轉部(圖未示)。 FIG. 9 shows a schematic side view of the turner 250 , the buffer table 210 and the transfer table 200 of the semiconductor package sorting apparatus 100 . In this embodiment, the transfer station 200 includes a first transfer station 200a and a second transfer station 200b, and the first transfer station 200a and the second transfer station 200b respectively include: a first tray 202a and a second tray on which the semiconductor package 20 is placed. The tray 202b; the height adjustment portions 203a and 203b connected to the trays 202a and 202b to adjust the height; and the moving portions 205a and 205b; and may also include a horizontal rotation part (not shown) that rotates the disks 202a and 202b centered in the height direction.

圖10至圖12中示出了翻轉器250。具體的，圖10中示出了翻轉器250的局部立體圖，圖11中示出了翻轉器250的局部俯視圖，圖12示出了翻轉器250的局部截面圖。 The flipper 250 is shown in Figures 10-12. Specifically, FIG. 10 shows a partial perspective view of the flipper 250 , FIG. 11 shows a partial top view of the flipper 250 , and FIG. 12 shows a partial cross-sectional view of the flipper 250 .

另一方面，由於緩衝台210的構成與圖1的實施例沒有區別，因此省略對緩衝台210的說明。 On the other hand, since the structure of the buffer base 210 is no different from the embodiment of FIG. 1 , the description of the buffer base 210 is omitted.

翻轉器250包括框架251、被該框架251包圍的旋轉部255以及移動部269(參見圖9)，並且該框架251和該旋轉部255通過一對旋轉軸252、253可旋轉地連接。 The flipper 250 includes a frame 251, a rotating portion 255 surrounded by the frame 251, and a moving portion 269 (see FIG. 9 ), and the frame 251 and the rotating portion 255 are rotatably connected via a pair of rotating shafts 252 and 253.

旋轉部255包括位於一面的第一吸附盤258和位於該一面的反面的第二吸附盤259，該第一吸附盤258包括由多個吸附孔258a形成的第一吸附部，且該第二吸附盤259包括由多個吸附孔259a形成的第二吸附部。 The rotating part 255 includes a first adsorption disc 258 located on one side and a second adsorption disc 259 located on the opposite side of the one surface. The first adsorption disc 258 includes a first adsorption part formed by a plurality of adsorption holes 258a, and the second adsorption disc 259 is located on the opposite side of the one surface. The disk 259 includes a second adsorption portion formed of a plurality of adsorption holes 259a.

為了連接外部的吸附源和該吸附孔258a、259a，使得吸附半導體封裝件或者解除對半導體封裝件的吸附，而該旋轉部255包括：第一吸附管線256：位於該第一吸附盤258的內側，且連接於該第一吸附盤258和該第一吸附管線256的第一吸附腔260；與該第一吸附管線256分離的第二吸附管線257；位 於該第二吸附盤259內側，且連接於該第二吸附管線257和該第二吸附盤259的第二吸附腔261。第一吸附管線256和第二吸附管線257通過旋轉軸252、253進入該旋轉部255，即便圖11中示為分別進入不同旋轉軸252、253，但本發明不限於此，顯然也可以從一個軸進入。 In order to connect an external adsorption source and the adsorption holes 258a, 259a to adsorb or release the semiconductor package, the rotating part 255 includes: a first adsorption pipeline 256; a first adsorption chamber 260 located inside the first adsorption plate 258 and connected to the first adsorption plate 258 and the first adsorption pipeline 256; a second adsorption pipeline 257 separated from the first adsorption pipeline 256; and a second adsorption chamber 261 located inside the second adsorption plate 259 and connected to the second adsorption pipeline 257 and the second adsorption plate 259. The first adsorption pipeline 256 and the second adsorption pipeline 257 enter the rotating part 255 through the rotating shafts 252 and 253. Even though FIG. 11 shows that they enter different rotating shafts 252 and 253, the present invention is not limited to this and they can obviously enter from one shaft.

該第一吸附盤258包括用於吸附奇數行的奇數列和偶數行的偶數列的半導體封裝件的第一吸附部，該第二吸附盤259可以包括用於吸附奇數行的偶數列和偶數行的奇數列的半導體封裝件的第二吸附部，通過這樣的構成，可以使第一吸附盤258以之字形吸附半導體封裝件20，使第二吸附盤259以之字形吸附沒有被該第一吸附盤258吸附的其餘的半導體封裝件20。但是，吸附盤258、259、吸附管線256、257可以進行各種形變，圖13和圖14中示出了吸附盤和吸附管線的變形例。 The first suction disk 258 may include a first suction portion for suctioning semiconductor packages of odd-numbered rows, odd-numbered columns, and even-numbered columns. The second suction disk 259 may include a first suction portion for suctioning odd-numbered rows, even-numbered columns, and even-numbered rows. The second suction portion of the odd-numbered rows of semiconductor packages has such a structure that the first suction pad 258 can suction the semiconductor packages 20 in a zigzag shape, and the second suction pad 259 can suction the semiconductor packages 20 in a zigzag shape without being attracted by the first suction. The remaining semiconductor packages 20 are attracted to the disc 258 . However, the adsorption plates 258 and 259 and the adsorption lines 256 and 257 can be deformed in various ways, and modifications of the adsorption plates and the adsorption lines are shown in FIGS. 13 and 14 .

如圖13可以看出，第一吸附管線256、第二吸附管線257可以連接於吸附孔258a、259a，第一吸附管線256、第二吸附管線257可以形成為之字形線。此時第一吸附盤258可以配置有第一吸附部，第二吸附盤259可以配置有第二吸附部。 As can be seen in Figure 13, the first adsorption line 256 and the second adsorption line 257 can be connected to the adsorption holes 258a and 259a, and the first adsorption line 256 and the second adsorption line 257 can be formed as a zigzag line. At this time, the first adsorption plate 258 may be equipped with a first adsorption part, and the second adsorption plate 259 may be equipped with a second adsorption part.

另一方面，如圖14所示，在一側吸附盤，例如第一吸附盤258上全部配置第一吸附部和第二吸附部，在相反側第二吸附盤259上可以配置第二吸附部。為了使配置於第一吸附盤258的第一吸附部和第二吸附部彼此獨立地操作，其連接於不同的吸附管線。即，該第一吸附盤258的第一吸附部連接於第一吸附管線256，該第一吸附盤258的第二吸附部連接於第三吸附管線262，該第二吸附盤259的第二吸附部連接於第二吸附管線257。 On the other hand, as shown in FIG. 14 , the first adsorption part and the second adsorption part are all arranged on one side of the adsorption pad, for example, the first adsorption pad 258 , and the second adsorption part may be arranged on the second adsorption pad 259 on the opposite side. . In order for the first adsorption part and the second adsorption part arranged on the first adsorption plate 258 to operate independently of each other, they are connected to different adsorption lines. That is, the first adsorption part of the first adsorption plate 258 is connected to the first adsorption line 256, the second adsorption part of the first adsorption plate 258 is connected to the third adsorption line 262, and the second adsorption part of the second adsorption plate 259 is connected to the first adsorption line 256. is connected to the second adsorption line 257.

因此，旋轉部255的第一吸附盤258吸附整個半導體封裝件20，或者只能吸附一部分，第二吸附盤259可以吸附除上述一部分以外的其餘半導體封裝件20。 Therefore, the first suction disk 258 of the rotating part 255 can suction the entire semiconductor package 20 or only a part thereof, and the second suction disk 259 can suction the remaining semiconductor packages 20 except for the above part.

該第一吸附管線至第三吸附管線256、257、262可以從一個旋轉軸252、253進入旋轉部255，並且也可以分成兩個旋轉軸252、253進入。 The first to third adsorption lines 256, 257, 262 can enter the rotating part 255 from one rotating shaft 252, 253, or can also be divided into two rotating shafts 252, 253 to enter.

通過配置為一面可以吸附整個半導體封裝件20，可以在不改變分類裝置100的情況下，以各種方式進行分類工作，並且可以應對各種情況。 By configuring one side to absorb the entire semiconductor package 20, the classification work can be performed in various ways without changing the classification device 100, and various situations can be dealt with.

對於圖14的第一吸附盤258的結構，也可以應用於該單元拾取器130、該緩衝台210以及傳送台200，該單元拾取器130、該緩衝台210以及傳送台200在彼此之間或者與翻轉器250傳遞或接收半導體封裝件20時，可分為第一吸附部和第二吸附部進行對應。 The structure of the first suction plate 258 in FIG. 14 can also be applied to the unit pickup 130, the buffer stage 210 and the conveying platform 200. When the unit pickup 130, the buffer stage 210 and the conveying platform 200 transfer or receive the semiconductor package 20 between each other or with the flipper 250, they can be divided into a first suction part and a second suction part for corresponding purposes.

圖15至18示有單元拾取器130、緩衝台210、翻轉器250以及傳送台200的狀態的示意俯視圖，以此對半導體封裝件的朝上或朝下被維持時各個結構的操作進行說明。 Figures 15 to 18 show schematic top views of the states of the unit picker 130, the buffer stage 210, the flipper 250, and the transfer stage 200, to illustrate the operation of each structure when the semiconductor package is maintained facing up or down.

如圖15所示，單元拾取器130在吸附已通過清洗部140的半導體封裝件20的狀態下進入該緩衝台210，並且該翻轉器250到達至第二傳送台200b。在這種狀態下，單元拾取器130將半導體封裝件20傳遞到緩衝台210。如圖16所示，在半導體封裝件20被傳送到緩衝台210之後，翻轉器250移動到緩衝台210上側。由於翻轉器250的旋轉部255的兩面包括吸附盤258、259，因此，將一部分的半導體封裝件20吸附至吸附盤258、259中一個吸附盤的吸附部後旋轉，將其餘的半導體封裝件吸附於另一吸附盤258、259的吸附部。翻轉器250的旋轉部255在旋轉時，該緩衝台210暫時下降以避免干擾，然後在旋轉完成後再次上升以傳遞半導體封裝件20。 As shown in FIG. 15 , the unit picker 130 enters the buffer stage 210 while adsorbing the semiconductor package 20 that has passed through the cleaning part 140 , and the flipper 250 reaches the second transfer stage 200 b. In this state, the unit picker 130 transfers the semiconductor package 20 to the buffer stage 210 . As shown in FIG. 16 , after the semiconductor package 20 is transferred to the buffer stage 210 , the flipper 250 moves to the upper side of the buffer stage 210 . Since both sides of the rotating part 255 of the flipper 250 include suction pads 258 and 259, a part of the semiconductor packages 20 is suctioned to the suction part of one of the suction disks 258 and 259 and then rotated to suction the remaining semiconductor packages. At the adsorption part of the other adsorption pads 258 and 259. When the rotating part 255 of the flipper 250 is rotating, the buffer stage 210 is temporarily lowered to avoid interference, and then raised again after the rotation is completed to transfer the semiconductor package 20 .

如圖17和18所示，翻轉器250移動至第一傳送台200a以將吸附於第一吸附部的半導體封裝件20傳遞到第一傳送台200a，之後翻轉器250移動至第二傳送台200b，使旋轉部255旋轉以將吸附於第二吸附部的半導體封裝件20傳遞到第二傳送台200b。 As shown in Figures 17 and 18, the flipper 250 moves to the first conveying platform 200a to transfer the semiconductor package 20 adsorbed on the first adsorption part to the first conveying platform 200a, and then the flipper 250 moves to the second conveying platform 200b, so that the rotating part 255 rotates to transfer the semiconductor package 20 adsorbed on the second adsorption part to the second conveying platform 200b.

另一方面，當對朝上或朝下進行翻轉時，翻轉器250直接從單元拾取器130接收半導體封裝件20，並通過第一吸附盤258接收一部分，再通過第二吸附盤259接收其餘的部分，接著再一次傳遞到第一傳送台200a和第二傳送台200b。 On the other hand, when flipping the pair upward or downward, the flipper 250 receives the semiconductor package 20 directly from the unit picker 130, receives a part through the first suction pad 258, and then receives the rest through the second suction pad 259. The portion is then transferred to the first transfer station 200a and the second transfer station 200b again.

本實施例中，翻轉器250通過有效利用多個面且包括多個傳送台200a、200b，可以多樣地執行半導體封裝件20的運用，並且可以通過簡單的結構實現期望的對準和檢查。 In this embodiment, the flipper 250 effectively utilizes multiple surfaces and includes multiple transfer stages 200a and 200b, so that the semiconductor package 20 can be used in various ways, and desired alignment and inspection can be achieved with a simple structure.

圖19中示出了根據本發明另一實施例的半導體封裝件分類裝置的示意結構圖。 FIG. 19 shows a schematic structural diagram of a semiconductor package sorting device according to another embodiment of the present invention.

由於圖19的實施例的切割部102、清洗部140、緩衝台210與圖1的實施例相同，因此對於相同的部分以圖1的說明代替，僅對區別之處進行說明。 Since the cutting part 102, the cleaning part 140, and the buffer table 210 of the embodiment of FIG. 19 are the same as those of the embodiment of FIG. 1, the description of the same parts will be replaced by the description of FIG. 1, and only the differences will be described.

本實施例中，翻轉器250的基本結構與圖1的實施例相同，但是在圖19的實施例中，翻轉器250的一側連接第一檢查部160a，且翻轉器250一邊由向Y方向間隔的兩個傳送導軌270、271支撐，一邊向X方向移動。該傳送導軌270、271延伸至該第一檢查部160a可以檢查安置在傳送台200的半導體封裝件20的程度。 In this embodiment, the basic structure of the flipper 250 is the same as the embodiment of FIG. 1 , but in the embodiment of FIG. 19 , one side of the flipper 250 is connected to the first inspection part 160 a, and one side of the flipper 250 is directed in the Y direction. The two conveying guide rails 270 and 271 spaced apart support each other and move in the X direction. The transfer guide rails 270 and 271 extend to an extent that the first inspection part 160 a can inspect the semiconductor package 20 placed on the transfer station 200 .

本實施例中，檢查部160包括第一檢查部160a和第二檢查部160b，該第一檢查部160a連接於該翻轉器250的一側，並與該翻轉器250一起移動。第一檢查部160a包括視覺相機和使該視覺相機向Y方向移動的移動部161，並且與該翻轉器250一起向X方向移動，而且通過該移動部161向Y方向移動。該視覺相機設置為朝向下方，可以檢查位於翻轉器250下方的半導體封裝件20的上表面。 In this embodiment, the inspection unit 160 includes a first inspection unit 160a and a second inspection unit 160b. The first inspection unit 160a is connected to one side of the flipper 250 and moves with the flipper 250. The first inspection unit 160a includes a visual camera and a moving unit 161 that moves the visual camera in the Y direction, and moves in the X direction together with the flipper 250, and moves in the Y direction through the moving unit 161. The visual camera is set to face downward, and can inspect the upper surface of the semiconductor package 20 located below the flipper 250.

該第一檢查部160a拍攝安置在緩衝台210上的半導體封裝件或者安置在傳送台200上的半導體封裝件20。 The first inspection unit 160a photographs the semiconductor package placed on the buffer stage 210 or the semiconductor package 20 placed on the transfer stage 200.

另一方面，傳送台200(參見圖1)向Y方向移動，傳送台200上的半導體封裝件20在被晶片拾取器190吸附的狀態下，通過第二檢查部160b檢查下表面。根據檢查結果半導體封裝件20安置於托盤170。 On the other hand, the transfer table 200 (see FIG. 1 ) moves in the Y direction, and the lower surface of the semiconductor package 20 on the transfer table 200 is inspected by the second inspection part 160 b while being attracted by the wafer pickup 190 . The semiconductor package 20 is placed on the tray 170 according to the inspection results.

圖20示出了根據本發明一實施例的半導體封裝件分類方法的示意流程圖。 FIG20 shows a schematic flow chart of a semiconductor package classification method according to an embodiment of the present invention.

根據一實施例的半導體封裝件的分類方法包括：步驟S140、檢查對是否翻轉半導體封裝件的朝上或朝下的設定；翻轉器傳遞步驟S150、在需要翻轉的情況下執行且將被清洗的半導體封裝件傳遞到翻轉器；以及緩衝台傳遞步驟S200、在不需要翻轉的情況下執行且將被清洗的半導體封裝件傳遞至緩衝台。 A method of classifying semiconductor packages according to an embodiment includes: step S140, checking whether to flip the semiconductor package upward or downward; and flipper transfer step S150, which is performed when flipping is required and will be cleaned. The semiconductor package is transferred to the flipper; and the buffer stage transfer step S200 is performed without flipping and transfers the cleaned semiconductor package to the buffer stage.

另外，半導體封裝件分類方法還可以包括材料供應步驟S100、將半導體條帶供應到裝置內部；材料傳送步驟S110、將被供應的材料移動到切割部；切割步驟S120、將被傳送的半導體條帶切割成半導體封裝件；清洗步驟S130、利用清洗液清洗被切割的半導體封裝件。由於本實施例中半導體分類方法包括將半導體條帶切割成半導體封裝件的切割步驟S120，因此其也可以稱為半導體條帶切割及分類方法，另一方面，檢查對是否翻轉該半導體封裝件的朝上或朝下的設定的步驟在清洗步驟S130之後執行。 In addition, the semiconductor package classification method may also include a material supplying step S100, supplying a semiconductor strip to the inside of the device; a material conveying step S110, moving the supplied material to the cutting part; a cutting step S120, cutting the conveyed semiconductor strip into semiconductor packages; and a cleaning step S130, cleaning the cut semiconductor packages with a cleaning liquid. Since the semiconductor classification method in this embodiment includes the cutting step S120 of cutting the semiconductor strip into semiconductor packages, it can also be called a semiconductor strip cutting and classification method. On the other hand, the step of checking whether to flip the semiconductor package upward or downward is performed after the cleaning step S130.

另外，半導體封裝件分類方法還可以包括：翻轉及傳送台傳遞步驟S160、在翻轉器傳遞步驟S150之後連續地執行，且通過翻轉器變更半導體封裝件的朝上或朝下，並向傳送台傳遞；第一面檢查步驟S170、檢查安置於該傳送台的半導體封裝件的上表面；以及第二面檢查步驟S180、由晶片拾取器吸附的狀態下檢查半導體封裝件的下表面。 In addition, the semiconductor package classification method may further include: a flipping and conveyor transfer step S160, which is continuously executed after the flipper transfer step S150, and the semiconductor package is changed upward or downward through the flipper and transferred to the conveyor; a first surface inspection step S170, which inspects the upper surface of the semiconductor package placed on the conveyor; and a second surface inspection step S180, which inspects the lower surface of the semiconductor package in a state of being adsorbed by a wafer picker.

半導體封裝件分類方法還可以包括：傳送台傳遞步驟S210、在緩衝台傳遞步驟S200之後連續地執行，且通過翻轉器將被傳遞到緩衝台的半導體封裝件移動到傳送台；第二面檢查步驟S220、檢查安置於該傳送台的半導體封裝件的上表面；第一面檢查步驟S230、由晶片拾取器吸附的狀態下檢查半導體封裝件的下表面；和分類步驟S190、在該第二面檢查步驟S180或者該第一面檢查步驟S230之後執行，並且根據第一面和第二面檢查結果將半導體封裝件分類到多個托盤。 The semiconductor package classification method may further include: a conveyor transfer step S210, which is continuously executed after the buffer transfer step S200, and the semiconductor package transferred to the buffer is moved to the conveyor through the flipper; a second surface inspection step S220, which inspects the upper surface of the semiconductor package placed on the conveyor; a first surface inspection step S230, which inspects the lower surface of the semiconductor package in a state of being adsorbed by a wafer picker; and a classification step S190, which is executed after the second surface inspection step S180 or the first surface inspection step S230, and the semiconductor package is classified into a plurality of trays according to the first surface and second surface inspection results.

可以將清洗步驟S130之後到執行該第一面檢查或者第二面檢查步驟之前的多個步驟稱為傳送步驟，並且可以將該第一面檢查步驟S170、S230以及第二面檢查步驟S180、S220稱為檢查步驟。 The multiple steps after the cleaning step S130 and before the first surface inspection or the second surface inspection step can be referred to as the transfer step, and the first surface inspection steps S170, S230 and the second surface inspection steps S180, S220 can be referred to as the inspection step.

當以死蟲狀態進入且發生朝上或朝下的翻轉時，可以在第一面檢查步驟S170中執行標記檢查，並且可以在第二面檢查步驟S180中執行球檢查和對準檢查。 When entering in a dead bug state and flipping upward or downward occurs, a mark check may be performed in the first side inspection step S170, and a ball check and an alignment check may be performed in the second side inspection step S180.

當以死蟲狀態進入且未發生朝上或朝下的翻轉時，可以在第二面檢查步驟S220中執行球檢查，在第一面檢查步驟S230中執行標記檢查和對準檢查。 When entering in a dead bug state and not flipping upward or downward, a ball check can be performed in the second side check step S220, and a mark check and an alignment check can be performed in the first side check step S230.

本實施例的分類方法中，當半導體封裝件的朝上或朝下變更或者不變時，均通過翻轉器將半導體封裝件移動至傳送台，因此不需要額外的單元拾取器，或者不需要使單元拾取器移動至傳送台，進而可以簡化裝置的結構和操作。 In the classification method of this embodiment, when the semiconductor package changes its upward or downward orientation or remains unchanged, the semiconductor package is moved to the conveying platform by the flipper, so an additional unit picker is not required, or the unit picker does not need to be moved to the conveying platform, thereby simplifying the structure and operation of the device.

另一方面，當不需要半導體封裝件的翻轉而執行緩衝台傳遞步驟S200時，可以同時執行緩衝台在安置有半導體封裝件的狀態下乾燥該半導體封裝件的乾燥步驟。乾燥可以通過加熱半導體封裝件來執行，並且像這樣的乾 燥步驟是在安置於緩衝台的狀態下執行，因此半導體封裝件不需要為了乾燥而移動至其他結構。 On the other hand, when the buffer stage transfer step S200 is performed without turning over the semiconductor package, a drying step of drying the semiconductor package with the semiconductor package placed on the buffer stage can be performed simultaneously. Drying can be performed by heating the semiconductor package, and such a drying step is performed with the semiconductor package placed on the buffer stage, so the semiconductor package does not need to be moved to other structures for drying.

另外，該傳送台傳遞步驟包括：第一傳遞步驟，該緩衝台移動至上側，以將該半導體封裝件的一部分傳遞至該翻轉器；旋轉步驟，該緩衝台向下側移動，並且將該翻轉器的旋轉部旋轉180度；以及第二傳遞步驟，該緩衝台再次向上側移動，以將該半導體封裝件的其餘部分傳遞至該翻轉器。像這樣，由於該傳送台傳遞步驟包括多個步驟，因此利用緩衝台的情況下也可以將半導體封裝件傳遞至多個傳送台。 In addition, the transfer stage transfer step includes: a first transfer step, the buffer stage moves to the upper side to transfer a part of the semiconductor package to the flipper; a rotation step, the buffer stage moves to the lower side, and the flipper The rotating part of the device rotates 180 degrees; and in the second transfer step, the buffer stage moves upward again to transfer the remaining parts of the semiconductor package to the flipper. In this way, since the transfer step of the transfer station includes a plurality of steps, the semiconductor package can be transferred to a plurality of transfer stations even when a buffer station is used.

雖然上文以本發明實施例為中心進行說明，但本發明並不限於此，顯然可以進行各種變更以實施。 Although the above description is centered on the embodiments of the present invention, the present invention is not limited thereto and can obviously be implemented with various modifications.

10:半導體條帶 10: Semiconductor strip

20:半導體封裝件 20:Semiconductor packages

30:匣盒 30: Box

32:導軌 32:Guide rails

100:半導體條帶切割及分類裝置 100: Semiconductor strip cutting and sorting device

102:切割部 102: Cutting Department

104:切割主軸 104: Cutting spindle

110:條帶拾取器 110: Strip Picker

120:真空吸盤 120: Vacuum suction cup

122:吸盤台 122: Suction cup table

130:單元拾取器 130:Unit Picker

131、201、270:傳送導軌 131, 201, 270: Transmission guide rail

140:清洗部 140:Cleaning Department

150:分類部 150:Classification Department

160:檢查部 160:Inspection Department

160a:第一檢查部 160a: First Inspection Department

160b:第二檢查部 160b:Second Inspection Department

170:托盤 170:Tray

172:移動導軌 172:Mobile guide rail

174:托盤供應單元 174:Pallet supply unit

180:容器 180: Container

190:晶片拾取器 190:wafer picker

200:傳送台 200: Transmission Station

210:緩衝台 210: Buffer table

250:旋轉台 250: Rotary table

Claims (20)

一種半導體封裝件分類裝置，包括：一單元拾取器，用於真空吸附並拾取一半導體封裝件；一緩衝台，包括裝載該半導體封裝件的一盤；一傳送台，以該緩衝台為中心設置於該單元拾取器的相反側，且裝載並傳送該半導體封裝件；一翻轉器，包括一旋轉部，真空吸附該半導體封裝件且以一第一方向為中心旋轉，及一移動部，與該旋轉部連接且在該緩衝台的上部和該傳送台的上部之間向與該第一方向垂直的一第二方向水平移動該旋轉部；以及一檢查部，設置於該半導體封裝件的一移動路徑上，檢查該半導體封裝件。 A semiconductor package classification device includes: a unit picker for vacuum adsorption and picking up a semiconductor package; a buffer platform including a tray for loading the semiconductor package; a conveyor platform, which is arranged on the opposite side of the unit picker with the buffer platform as the center, and loads and conveys the semiconductor package; a flipper, which includes a rotating part, which vacuum adsorbs the semiconductor package and rotates with a first direction as the center, and a moving part, which is connected to the rotating part and horizontally moves the rotating part in a second direction perpendicular to the first direction between the upper part of the buffer platform and the upper part of the conveyor platform; and an inspection part, which is arranged on a moving path of the semiconductor package and inspects the semiconductor package. 如請求項1所述的半導體封裝件分類裝置，其中該半導體封裝件分類裝置還包括：一切割部，將一半導體條帶切割成該半導體封裝件；及一清洗部，清洗被切割的該半導體封裝件；其中該單元拾取器在拾取該半導體封裝件的狀態下經過該清洗部，且該緩衝台設置在該清洗部和該傳送台之間。 The semiconductor package classification device as described in claim 1, wherein the semiconductor package classification device further comprises: a cutting section for cutting a semiconductor strip into the semiconductor package; and a cleaning section for cleaning the cut semiconductor package; wherein the unit picker passes through the cleaning section while picking up the semiconductor package, and the buffer stage is arranged between the cleaning section and the conveying stage. 如請求項2所述的半導體封裝件分類裝置，其中該緩衝台還包括一高度調節部，用於調節該盤高度。 The semiconductor package sorting device according to claim 2, wherein the buffer platform further includes a height adjustment part for adjusting the height of the tray. 如請求項1所述的半導體封裝件分類裝置，其中該檢查部包括一第一檢查部，連接於該翻轉器的一側並與該翻轉器一起移動，且朝下方設置。 The semiconductor package sorting device according to claim 1, wherein the inspection part includes a first inspection part, which is connected to one side of the flipper and moves together with the flipper, and is arranged downward. 如請求項1所述的半導體封裝件分類裝置，其中該翻轉器還包括一框架，圍繞該旋轉部；及該旋轉部包括一第一吸附盤，設置於一面；及一第二吸附盤，設置於該第一吸附盤的相反面。 The semiconductor package sorting device according to claim 1, wherein the flipper further includes a frame surrounding the rotating part; and the rotating part includes a first suction disk disposed on one side; and a second suction disk disposed on the opposite side of the first adsorption disc. 如請求項5所述的半導體封裝件分類裝置，其中該旋轉部還包括：一第一吸附管線，連接於一吸附源；一第一吸附腔，位於該第一吸附盤的內側，且連接於該第一吸附盤及該第一吸附管線；一第二吸附管線，與該第一吸附管線分離；一第二吸附腔，位於該第二吸附盤的內側，且連接於該第二吸附管線及該第二吸附盤。 The semiconductor package classification device as described in claim 5, wherein the rotating part further includes: a first adsorption pipeline connected to an adsorption source; a first adsorption chamber located inside the first adsorption plate and connected to the first adsorption plate and the first adsorption pipeline; a second adsorption pipeline separated from the first adsorption pipeline; a second adsorption chamber located inside the second adsorption plate and connected to the second adsorption pipeline and the second adsorption plate. 如請求項5所述的半導體封裝件分類裝置，其中該第一吸附盤和該第二吸附盤被劃分為多個列和行；該第一吸附盤包括一第一吸附部，吸附奇數行的奇數列和偶數行的偶數列的半導體封裝件；及該第二吸附盤包括一第二吸附部，吸附奇數行的偶數列和偶數行的奇數列的半導體封裝件。 The semiconductor package sorting device according to claim 5, wherein the first suction disk and the second suction disk are divided into a plurality of columns and rows; the first suction disk includes a first suction part, which absorbs odd-numbered rows. Semiconductor packages in odd-numbered columns and even-numbered columns in even-numbered rows; and the second suction disk includes a second suction portion for sucking semiconductor packages in even-numbered columns in odd-numbered rows and odd-numbered columns in even-numbered rows. 如請求項7所述的半導體封裝件分類裝置，其中該第一吸附盤還包括第二吸附部；該旋轉部還包括：一第一吸附管線，連接於該第一吸附盤的第一吸附部；一第二吸附管線，連接於該第二吸附盤的第二吸附部；以及一第三吸附管線，連接於該第一吸附盤的第二吸附部。 The semiconductor package sorting device according to claim 7, wherein the first suction disk further includes a second suction part; the rotating part further includes: a first suction line connected to the first suction part of the first suction disk ; A second adsorption line, connected to the second adsorption part of the second adsorption disc; and a third adsorption line, connected to the second adsorption part of the first adsorption disc. 如請求項7所述的半導體封裝件分類裝置，其中該傳送台包括一第一傳送台和一第二傳送台； 該第一傳送台包括一第一盤，在上部接收附著於該翻轉器的該第一吸附部的半導體封裝件，一第一高度調節部，連接於該第一盤以調節高度以及一第一移動部，連接於該第一盤並向該第一方向移動該第一盤；該第二傳送台包括一第二盤，在上部接收附著於該翻轉器的第二吸附部的半導體封裝件，一第二高度調節部，連接於該第二盤以調節高度，以及一第二移動部，連接於該第二盤並向該第一方向移動該第二盤。 The semiconductor package classification device as described in claim 7, wherein the conveyor platform includes a first conveyor platform and a second conveyor platform; the first conveyor platform includes a first plate, which receives the semiconductor package attached to the first suction portion of the flipper at the upper portion, a first height adjustment portion connected to the first plate to adjust the height, and a first moving portion connected to the first plate and moves the first plate in the first direction; the second conveyor platform includes a second plate, which receives the semiconductor package attached to the second suction portion of the flipper at the upper portion, a second height adjustment portion connected to the second plate to adjust the height, and a second moving portion connected to the second plate and moves the second plate in the first direction. 如請求項9所述的半導體封裝件分類裝置，其中該半導體封裝件分類裝置還包括：一晶片拾取器，用於移動該第一傳送台及該第二傳送台的半導體封裝件；多個托盤，用於根據該檢查部的檢查結果放置半導體封裝件；該檢查部包括一第一檢查部，設置於該第一傳送台及第二傳送台的移動路徑上側，和一第二檢查部，設置於該晶片拾取器的移動路徑下部。 The semiconductor package sorting device of claim 9, wherein the semiconductor package sorting device further includes: a wafer picker for moving the semiconductor packages of the first transfer station and the second transfer station; a plurality of trays , used to place semiconductor packages according to the inspection results of the inspection unit; the inspection unit includes a first inspection unit disposed on the upper side of the movement path of the first transfer platform and the second transfer platform, and a second inspection unit disposed at the lower part of the moving path of the wafer picker. 如請求項2所述的半導體封裝件分類裝置，其中該單元拾取器沿著在該切割部和該緩衝台的上部向一第二方向延伸的一第一傳送導軌移動，該翻轉器沿著在相較於該第一傳送導軌更低的高度上向該第二方向延伸的一第二傳送導軌移動。 The semiconductor package sorting device of claim 2, wherein the unit picker moves along a first conveying guide extending in a second direction above the cutting part and the buffer table, and the flipper moves along the A second transmission rail extending toward the second direction moves at a lower height than the first transmission rail. 如請求項1所述的半導體封裝件分類裝置，其中該半導體封裝件分類裝置還包括：一控制部，連接於該單元拾取器、該緩衝台、及該翻轉器；該控制部在裝置內維持該半導體封裝件的朝上或朝下時，通過該單元拾取器使該半導體封裝件裝載於該緩衝台，並且使該翻轉器將裝載於該緩衝台的半導體封裝件傳送至該傳送台。 The semiconductor package classification device as described in claim 1, wherein the semiconductor package classification device further comprises: a control unit connected to the unit picker, the buffer, and the flipper; when the control unit maintains the semiconductor package facing up or down in the device, the semiconductor package is loaded on the buffer through the unit picker, and the flipper transfers the semiconductor package loaded on the buffer to the transfer platform. 如請求項1所述的半導體封裝件分類裝置，其中僅有該翻轉器將該半導體封裝件傳送至該傳送台。 The semiconductor package sorting device of claim 1, wherein only the flipper transfers the semiconductor package to the transfer station. 一種半導體封裝件分類方法，包括以下步驟： 一傳送步驟，將一半導體封裝件傳送至一傳送台；一檢查步驟，檢查安置於該傳送台的該半導體封裝件；以及一分類步驟，根據該檢查步驟的結果對該半導體封裝件進行分類；其中該傳送步驟中該半導體封裝件的朝上或朝下會翻轉或維持，當對朝上或朝下進行翻轉時，該半導體封裝件從一拾取器傳遞至一翻轉器，並由該翻轉器朝上或朝下進行翻轉並移動，當維持朝上或朝下時，該半導體封裝件從該拾取器被傳送至一緩衝台，並且該翻轉器在該緩衝台上移動該半導體封裝件。 A semiconductor package classification method includes the following steps: a conveying step, conveying a semiconductor package to a conveying platform; an inspection step, inspecting the semiconductor package placed on the conveying platform; and a classification step, classifying the semiconductor package according to the result of the inspection step; wherein the semiconductor package is flipped or maintained facing up or down in the conveying step, and when flipping up or down, the semiconductor package is transferred from a picker to a flipper, and flipped and moved up or down by the flipper, and when maintaining facing up or down, the semiconductor package is transferred from the picker to a buffer platform, and the flipper moves the semiconductor package on the buffer platform. 如請求項14所述的半導體封裝件分類方法，其中該半導體封裝件分類方法還包括：一切割步驟，將一半導體條帶切割成該半導體封裝件；以及一清洗步驟，清洗被切割的該半導體封裝件；其中該傳送步驟包括：一緩衝台傳遞步驟，在維持朝上或朝下時會執行，將已清洗的半導體封裝件裝載於一緩衝台；以及一傳送台傳遞步驟，用該翻轉器吸附裝載於該緩衝台上的半導體封裝件翻轉器，並傳送至該傳送台。 The semiconductor package classification method according to claim 14, wherein the semiconductor package classification method further includes: a cutting step to cut a semiconductor strip into the semiconductor package; and a cleaning step to clean the cut semiconductor. Package; wherein the transfer step includes: a buffer stage transfer step, which is performed when maintaining the upward or downward direction, loading the cleaned semiconductor package on a buffer stage; and a transfer stage transfer step, using the flipper The semiconductor package flipper loaded on the buffer table is adsorbed and transferred to the transfer table. 如請求項15所述的半導體封裝件分類方法，其中一乾燥步驟，與該緩衝台傳遞步驟一起實施以乾燥該半導體封裝件。 The method for classifying semiconductor packages as claimed in claim 15, wherein a drying step is performed together with the buffer stage transfer step to dry the semiconductor packages. 如請求項15所述的半導體封裝件分類方法，其中該傳送台傳遞步驟包括：一第一傳遞步驟，該緩衝台向上側移動，將該半導體封裝件的一部分傳遞至該翻轉器；一旋轉步驟，該緩衝台向下側移動，該翻轉器的一旋轉部180度旋轉；及 一第二傳遞步驟，該緩衝台再一次向上側移動，將其餘的該半導體封裝件傳遞至該翻轉器。 The semiconductor package sorting method according to claim 15, wherein the transfer step of the transfer station includes: a first transfer step, the buffer station moves upward to transfer a part of the semiconductor package to the flipper; a rotation step , the buffer table moves downward, and a rotating part of the flipper rotates 180 degrees; and In a second transfer step, the buffer stage moves upward again to transfer the remaining semiconductor packages to the flipper. 一種半導體封裝件分類裝置，包括：一切割部，將一半導體條帶切割成一半導體封裝件；一清洗部，清洗被切割的該半導體封裝件；一單元拾取器，真空吸附並拾取該半導體封裝件，使其經過該清洗部；一傳送台，裝載該半導體封裝件；一緩衝台，設置於該清洗部和該傳送台之間，且包括裝載有該半導體封裝件的一盤；一翻轉器，包括一旋轉部，真空吸附該半導體封裝件且以一第一方向為中心旋轉、以及一移動部，與該旋轉部連接且在該緩衝台的上部和該傳送台的上部之間向與該第一方向垂直的一第二方向水平移動該旋轉部；一第一檢查部，設置於該傳送台的一移動路徑上側；一晶片拾取器，使已通過該第一檢查部的該傳送台的半導體封裝件移動；一第二檢查部，設置於該晶片拾取器的移動路徑下部；多個托盤，根據該第一檢查部和該第二檢查部的檢查結果放置該半導體封裝件；以及一控制部，至少連接於該單元拾取器、該緩衝台、及該翻轉器；其中該控制部在裝置內維持該半導體封裝件的朝上或朝下時，通過該單元拾取器使該半導體封裝件裝載於該緩衝台，並且使該翻轉器將裝載於該緩衝台的半導體封裝件傳送至該傳送台。 A semiconductor package classification device includes: a cutting part, which cuts a semiconductor strip into semiconductor packages; a cleaning part, which cleans the cut semiconductor packages; a unit picker, which vacuum absorbs and picks up the semiconductor packages and passes them through the cleaning part; a conveyor, which carries the semiconductor packages; a buffer, which is arranged between the cleaning part and the conveyor and includes a tray carrying the semiconductor packages; a flipper, which includes a rotating part, which vacuum absorbs the semiconductor packages and rotates around a first direction, and a moving part, which is connected to the rotating part and horizontally moves the semiconductor packages between the upper part of the buffer and the upper part of the conveyor in a second direction perpendicular to the first direction. A rotating part; a first inspection part, arranged on the upper side of a moving path of the conveyor; a chip picker, which moves the semiconductor package of the conveyor that has passed the first inspection part; a second inspection part, which is arranged at the lower part of the moving path of the chip picker; a plurality of trays, which place the semiconductor package according to the inspection results of the first inspection part and the second inspection part; and a control part, which is at least connected to the unit picker, the buffer, and the flipper; wherein the control part loads the semiconductor package on the buffer through the unit picker when maintaining the semiconductor package facing up or down in the device, and causes the flipper to transfer the semiconductor package loaded on the buffer to the conveyor. 如請求項18所述的半導體封裝件分類裝置，其中該緩衝台包括一高度調節部，連接於該盤，以調節該盤高度。 A semiconductor package classification device as described in claim 18, wherein the buffer platform includes a height adjustment portion connected to the plate to adjust the height of the plate. 如請求項18所述的半導體封裝件分類裝置，其中該翻轉器還包括一框架，圍繞該旋轉部，該旋轉部包括：一對旋轉軸，與該框架連接；一第一吸附盤，設置於一面；一第二吸附盤，設置於該第一吸附盤的相反面；一第一吸附管線，通過該旋轉軸中的一個進入到該旋轉部且連接於該第一吸附盤，以及一第二吸附管線，通過該旋轉軸中的另一個進入到該旋轉部且連接於該第二吸附盤；其中該第一吸附管線和該第二吸附管線是獨立工作。 The semiconductor package classification device as described in claim 18, wherein the flipper further includes a frame surrounding the rotating part, and the rotating part includes: a pair of rotating shafts connected to the frame; a first adsorption plate disposed on one side; a second adsorption plate disposed on the opposite side of the first adsorption plate; a first adsorption pipeline entering the rotating part through one of the rotating shafts and connected to the first adsorption plate, and a second adsorption pipeline entering the rotating part through the other of the rotating shafts and connected to the second adsorption plate; wherein the first adsorption pipeline and the second adsorption pipeline work independently.
TW111146583A 2021-12-30 2022-12-05 Sorting apparatus for semiconductor package and method thereof TWI836770B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201448008A (en) * 2013-04-22 2014-12-16 Hanmi Semiconductor Co Ltd Semiconductor strip sawing apparatus
TW202101640A (en) * 2019-06-27 2021-01-01 南韓商韓美半導體有限公司 Semiconductor manufacturing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201448008A (en) * 2013-04-22 2014-12-16 Hanmi Semiconductor Co Ltd Semiconductor strip sawing apparatus
TW202101640A (en) * 2019-06-27 2021-01-01 南韓商韓美半導體有限公司 Semiconductor manufacturing apparatus

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