KR101124690B1 - Apparatus for inspecting LED device - Google Patents

Abstract

The present invention relates to an LED device inspection apparatus, and more particularly, to an LED device inspection apparatus for inspecting and classifying the emission level of the LED elements cut into individual chips in a wafer state, the wafer ring loaded with LED elements A loading unit for loading; An element inspection unit for receiving and inspecting the LED elements of the loading unit; A buffer unit including a buffer plate on which the LED elements inspected by the device inspecting unit are loaded; An unloading unit which classifies and unloads the LED elements loaded on the buffer plate into each sorting plate according to the inspection result of the device inspection unit; A first transfer tool for picking up and transferring the LED elements between the loading unit and the element inspection unit; A second transfer tool for picking up and transferring the LED elements between the element inspecting portion and the buffer portion; A third transfer tool for picking up and transferring the LED elements between the buffer unit and the unloading unit, wherein the buffer unit comprises: an element loading table for loading the LED elements inspected by the element inspecting unit onto the buffer plate; A device unloading table which receives the buffer plate from the device loading table and transfers the LED elements loaded on the buffer plate to the unloading unit; A first buffer plate transfer unit for transferring the buffer plate from the device loading table to the device unloading table; Disclosed is an LED device inspection apparatus comprising a second buffer plate transfer unit for loading a buffer plate into an element loading table and unloading a buffer plate from an element unloading table.

Description

LED device inspection device {Apparatus for inspecting LED device}

The present invention relates to an LED device inspection apparatus, and more particularly, to an LED device inspection device for inspecting and classifying the emission level of the LED elements cut into individual chips in the wafer state.

LED devices (Light Emitting Diode Device) is a kind of p-n junction diode, a semiconductor device using the electroluminescence (electroluminescence) is a phenomenon in which a short wavelength (monochromatic light) is emitted when a voltage is applied in the forward direction. In other words, when forward voltage is applied, electrons of n-layer and holes of p-layer are combined to emit energy corresponding to the height difference (energy gap) between conduction band and valence band. Energy is mainly emitted in the form of heat or light, and when it is emitted in the form of light, it becomes an LED element.

Such LED devices are produced as individual chips by cutting and forming electrodes on a wafer using semiconductor processes. The LED devices produced as individual chips are shipped to a manufacturer that performs subsequent processes such as packaging in a chip state, or are shipped to the market through packaging processes such as connection with a lead and molding or additionally through a module process.

On the other hand, in spite of defects such as defects of the device itself and failure to meet the standards, if subsequent processes such as a packaging process or a module process are performed, there is a problem in that the overall productivity and profitability are reduced as a result of performing unnecessary processes.

In addition, an LED device may have variations such as light emission characteristics depending on a position when performing a semiconductor process in a wafer state, and thus it is necessary to classify the devices according to the light emission characteristics inspected in a chip state.

Therefore, it is necessary to increase the productivity and profitability by inspecting the defects or emission characteristics before performing each process to perform the subsequent processes only for the good devices or by classifying the components according to the emission characteristics in advance.

SUMMARY OF THE INVENTION An object of the present invention is to provide an LED device inspection apparatus for recognizing the necessity as described above and inspecting an LED element, etc. in a chip state, and classifying the LED elements according to the inspection result.

It is another object of the present invention to provide an LED device inspection apparatus capable of performing a die bonding process of inspecting a light emitting class and the like in a chip state of an LED device and loading the LED elements in a lead frame for each grade according to the inspection result. have.

The present invention was created to achieve the object of the present invention as described above, the present invention includes a loading unit for loading the wafer ring loaded with LED elements; An element inspection unit receiving and inspecting the LED elements of the loading unit; A buffer unit including a buffer plate on which the LED elements inspected by the device inspecting unit are loaded; An unloading unit which classifies and unloads the LED elements loaded on the buffer plate into respective sorting plates according to the inspection result of the device inspection unit; A first transfer tool for picking up and transferring the LED elements between the loading portion and the element inspection portion; A second transfer tool for picking up and transferring the LED elements between the device inspecting unit and the buffer unit; A third transfer tool for picking up and transferring the LED elements between the buffer unit and the unloading unit, wherein the buffer unit comprises: an element loading table for loading the LED elements inspected by the element inspecting unit onto the buffer plate; A device unloading table which receives the buffer plate from the device loading table and transfers the LED elements loaded on the buffer plate to the unloading unit; A first buffer plate transfer unit for transferring a buffer plate from the device loading table to the device unloading table; Disclosed is an LED device inspection apparatus comprising a second buffer plate transfer unit for loading a buffer plate into the device loading table and unloading a buffer plate from the device unloading table.

The buffer plate and the adhesive tape having an adhesive on the surface to be attached to the LED elements; It may be configured to include a fixing member is fixed to the adhesive tape.

The first buffer plate transfer unit includes a plate seating unit on which a buffer plate is seated; A seating part moving part which moves the plate seating part along an arrangement direction of the device loading table and the device unloading table so as to receive a buffer plate from the device loading table to the plate seating part and transfer the buffer plate to the device unloading table; Can be configured.

The buffer unit includes a plate loading unit for loading a buffer plate loaded through the second buffer plate transfer unit to the device loading table; The device may further include a plate unloading unit configured to unload and load a buffer plate from the device unloading table through the second buffer plate transfer unit.

The second buffer plate transfer unit includes a plate seating unit on which a buffer plate is seated; Receiving the buffer plate from the plate loading part to the plate seating part and transferring the buffer plate to the device loading table, and receiving the buffer plate from the device unloading table to the plate seating part and transferring the buffer plate to the plate unloading part; It may be configured to include a seating portion driving unit for moving the plate seating portion along the arrangement direction of the device unloading table.

The plate seating part includes an adsorption part for adsorbing and fixing the buffer plate seated on the upper surface, and the second buffer plate transfer part is inverted so that the upper surface of the plate seating part is directed downward, and the buffer plate from the plate loading part is absorbed. The plate seating part is loaded by the upper surface of the plate seating portion by the suction or withdrawal, or the plate seating portion is loaded so that the upper surface of the plate seating portion faces downward while the buffer plate is sucked by the adsorption portion. An inverting unit for inverting up and down; Directly above the plate loading portion or the plate unloading portion and the element loading table or the element onion for exchange of buffer plates between the plate loading portion and the element loading table, between the element unloading table and the plate unloading portion. It may be configured to include a seat rotating portion for rotating the plate seating portion between a position adjacent to the loading table.

The device loading table and the device unloading table may be configured to move the loaded buffer plate in the X-Y direction or the X-Y-θ direction to facilitate the loading and unloading of the LED elements.

The unloading unit and a sorting magazine unit in which the sorting plate is loaded; A sorting plate input part for feeding the sorting plate to the unloading part; It may be configured to include a plate transfer robot for transferring the sorting plate of the sorting magazine portion to the sorting plate input portion.

The unloading unit may include a die bonding unit for loading the LED elements loaded on the buffer unit into the loading unit of each lead frame to which a classification level is assigned according to the inspection result of the device inspection unit.

The die bonding unit may include a die bonding table in which a plurality of lead frames are loaded and rotated to allow LED elements to be loaded in each lead frame.

The die bonding table carrying the lead frame may be configured to be movable in X-Y-direction movement.

The die bonding part may further include a bonding treatment part for coating an adhesive material or installing an adhesive member on the loading part so that the LED element may be attached to the loading part of the lead frame.

The die bonding unit includes: a lead frame magazine unit in which a plurality of lead frames having a classification grade according to the inspection result inspected by the device inspection unit is loaded; A bonding processing unit may be additionally installed to coat an adhesive material or install an adhesive member on the lead frame so that the lead frame loaded on the lead frame magazine unit may be pulled out so that the LED element may be adhered to the mounting portion of the lead frame. ..

The LED device inspecting apparatus according to the present invention includes a buffer unit for temporarily storing the LED elements after the test in the process of classifying according to the test and the test result for the LED element, saving the space occupied by the device and promptly inspecting and classifying the process. There is an advantage that can be done.

In addition, the LED device inspection apparatus according to the present invention in the configuration of the buffer unit for temporarily storing the LED elements after the test in the process of classifying according to the inspection and the test results for the LED element, the buffer plate for temporarily loading the LED elements By changing and moving more quickly there is an advantage that can significantly improve the processing speed of the LED inspection apparatus.

In addition, the LED device inspection apparatus according to the present invention by placing each module such as a loading unit, device inspection unit, buffer unit and the unloading unit in a straight line, easy access to each module, and easy access if necessary repair, replacement, etc. There is an advantage that can be maintained and repaired.

In addition, the LED device inspection apparatus according to the present invention to reduce the moving distance of the LED device and to reduce the installation space occupied by the device by allowing at least a portion of the device inspection unit and the top and bottom when the wafer ring and buffer plate is moved In addition to improving the processing speed, the space required by the device can be reduced, thereby reducing the cost of installing the device.

Hereinafter, the LED device inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view showing the configuration of the LED device inspection apparatus according to the present invention, Figure 2 is a side view of the LED device inspection device of Figure 1, Figures 3a and 3b is a wafer ring used in the LED device inspection device of Figure 1 4 is a plan view showing the configuration of a turntable of the device inspecting unit of the LED device inspecting apparatus of FIG. 1, and FIGS. 5A to 5C are examples of the buffer unit used in the LED device inspecting apparatus of FIG. 6A to 6E are conceptual views illustrating a process of exchanging a buffer plate of the buffer unit of FIG. 5A, FIG. 7 is a perspective view of the buffer plate of the buffer unit of FIG. 5A, and FIG. 8 is an LED device inspecting apparatus of FIG. 1. The drawing shows an example of the sorting plate used in the unloading portion of the.

1 and 2, the LED device inspection apparatus according to the present invention includes a loading unit (100) for loading the wafer ring 10 is loaded with LED elements (1); An element inspecting unit 200 receiving and inspecting at least one LED element 1 of the loading unit 100; A buffer unit 300 having a buffer plate 310 on which the LED elements 1 inspected by the device inspection unit 200 are temporarily loaded; An unloading unit 400 for classifying and unloading the LED elements 1 loaded on the buffer plate 310 into the sorting plates 40 according to the test result of the device inspecting unit 200; The first transfer tool 510 for picking up and transferring the LED elements 1 between the loading unit 100 and the element inspecting unit 200, and the LED element 1 between the element inspecting unit 200 and the buffer unit 300. And a second transfer tool 520 for picking up and transporting the plurality of carriers, and a third transfer tool 530 for transferring the LED elements 1 between the buffer unit 300 and the unloading unit 400.

The LED element 1 to be inspected by the LED element inspection apparatus may be a chip state element cut by a sawing process after completing a semiconductor process and an electrode forming process to perform an LED function in a wafer state.

The LED device 1 inspected by the LED device inspecting device is inspected and sorted, and then the LED device 1 is shipped in a chip state, or is shipped to the market through a subsequent process such as a packaging process or a module process.

The loading unit 100 receives one or more wafer rings 10 from the outside and transfers the LED elements 1 loaded on each wafer ring 10 to the device inspection unit 200. Various configurations are possible. In addition, the plurality of LED elements 1 may be loaded by the bonded wafer ring 10 so that the device inspecting unit 200 may inspect the LED elements 1.

The wafer ring 10 is a structure for transferring the attached LED elements 1 cut into individual chips in a wafer state, and various configurations are possible. As shown in FIGS. 3A and 3B, each element An adhesive tape 11 having adhesiveness to a surface so that the cut wafer is attached to an upper surface thereof; The adhesive tape 11 is deformed in the outer diameter direction by applying tension in the outer diameter direction to the first coupling ring 12 to which the adhesive tape 11 is coupled and the adhesive tape 11 coupled to the first coupling ring 12. It can be configured to include a second coupling ring 13 to finely space each LED element (1).

As shown in FIG. 1, the loading unit 100 moves the wafer ring 10 in the XY direction, and further, XY-θ so that the LED element 1 can be picked up by the first transfer tool 510 which will be described later. The wafer ring 10 to be taken out from the loading table 110 and the wafer ring magazine 20 in which the plurality of wafer rings 10 are loaded to be seated in the loading table 110. 10) may be configured to include a wafer ring transfer robot 140 for transferring.

The loading table 110 of the LED element 1 with respect to the first transfer tool 510 so that the first transfer tool 510 can pick up the LED element 1 with the wafer ring 10 seated thereon. Various configurations are possible as the configuration for moving to the relative position (P ₀ ).

On the other hand, the lower side of the loading table 110 may be further provided with a pressing pin 130 to move upward to facilitate the pickup of the LED element 1 to press the adhesive tape 11 of the wafer ring 10. .

The loading unit 100 includes a wafer ring 10 in which the LED elements 1 are emptied so as to smoothly exchange the wafer ring 10 between the wafer ring magazine unit 20 and the loading table 110. It may further include a wafer ring buffer portion (not shown) to be temporarily stored.

The wafer ring buffer part receives the wafer ring 10 from which the LED elements 1 are emptied from the loading table 110 and temporarily stores the wafer ring 10. Then, a new wafer ring 10 is loaded on the loading table 110 to load the table 110. After the) is moved, the temporarily stored wafer ring 10 is configured to be returned to the wafer ring magazine unit 20.

The wafer ring magazine unit 20 may be configured in a variety of configurations in which a plurality of wafer rings 10 are loaded.

The device inspection unit 200 is a configuration for inspecting the LED device 1, and can be configured in various ways, such as being driven in rotation, and various configurations are possible depending on inspection items such as luminance and emission color. 2 and 4, the plurality of device seating parts 220 in which the LED elements 1 of the loading part 100 are seated are disposed in the circumferential direction, and the device seating parts 220 may be loaded. Loading position P ₁ receiving the LED elements 1 of 100, an inspection position IP for inspecting the LED elements 1, and an unloading position for transferring the LED elements 1 to the buffer unit 300. A turntable 210 rotating step by step at a predetermined angle (P ₂ ); It may be configured to include an inspection unit 240 is installed at the inspection position (IP) to inspect the LED element 1 seated on the element seating portion 220.

The turntable 210 rotates the plurality of device mounting parts 220, and a loading position P ₁ for picking up and loading the LED elements 1 from the loading unit 100, and an inspection position for inspecting the LED elements 1. (IP) and a configuration for moving to the unloading position (P ₂ ) for transferring the LED elements 1 to the buffer unit 300, various configurations are possible, as shown in Figures 1, 2 and 4 Likewise, a plurality of device seating parts 220 are arranged at regular intervals in the circumferential direction, and a circular path in which a pressure hole 221 of each device seating part 220 and a pressure control device (not shown) are formed. It can be composed of a table.

The turntable 210 may be installed in various forms, such as configured to allow the rotation of the predetermined angle again after the rotation of the predetermined angle to facilitate the seating, withdrawal, and inspection of the LED element 1. As it is, it can be rotated by the rotary device 212 installed on the upper side in a supported state.

Here, when the device inspection unit 200, that is, the turntable 210 is supported and rotated upward, the turntable 210 may overlap with at least one of the wafer ring 10 and the buffer plate 310 downward. .

As described above, when the device inspection unit 200, that is, the turntable 210 overlaps the wafer ring 10 and the buffer plate 310, the movement of the first transfer tool 510 and the second transfer tool 520 is performed. In addition to reducing the distance, the processing speed can be increased, and the installation area occupied by the device can be reduced, thereby minimizing the cost for the installation of the device.

The device seating portion 220 is a configuration in which the LED element 1 is seated so as to enable inspection at the inspection position (IP) to be described later, the structure of the LED element 1, in particular the LED for the test of the LED element 1 It may be configured to have a configuration corresponding to the electrode structure of the LED element 1 to supply power to the electrode of the element (1).

On the other hand, the device seating portion 220 may be disposed in one or more, as shown in Figures 1 and 4, it may be disposed at a predetermined interval in the circumferential direction with respect to the rotation center of the turntable 210.

In particular, the device seating unit 220 is circulated to the loading position (P ₁ ), the inspection position (IP), the unloading position (P ₂ ), the loading position (P ₁ ) by the rotation of the turntable (210).

At this time, the loading position (P ₁ ), the inspection position (IP), the unloading position (P ₂ ) can be variously arranged on the basis of the rotation center of the turntable 210, each module, that is, the loading unit 100, The loading position P ₁ and the unloading position P _{2 are} arranged based on the rotation center of the turntable 210 so that the device inspection unit 200 and the buffer unit 300, and further, the unloading unit 400 are disposed in a straight line. Preferably, they are arranged opposite each other.

On the other hand, the turntable 210 is rejected to remove the LED element 1, which is determined to be unsuccessful or defective by the second transfer tool 520 after the element seating part 220 passes through the unloading position P ₂ . Position (RP), the cleaning position (CP) for removing foreign matter on the device mounting portion 220 may be added.

Here, the LED element 1 at the reject position RP may be removed by operation of a pressure control device described later, and at the cleaning position CP, the surface may be removed to remove contaminants on the surface of the device seat 220. A roller or the like having an adhesive property may be installed on the upper side of the turntable 210 to be in contact with the upper surface of the element seating part 220.

The number of device seating portions 220 is appropriately selected according to the processing speed of the LED device inspection apparatus according to the present invention, such as eight, sixteen.

Meanwhile, the device seat 220 includes a pressure hole 221 for seating or withdrawing LED elements, and the turntable 210 forms a vacuum pressure or supplies air to the pressure hole 221 to form a positive pressure. A pressure control device for controlling the back pressure may be installed.

Here, the vacuum pressure and the positive pressure delivered to the turntable 210 are rotatable and air for supplying a vacuum pressure generator (not shown) and air by means of a rotary joint (not shown) having a plurality of ports installed therein to transmit air pressure. A supply device (not shown) is connected primarily and the ports of the rotary joint are connected to the pressure control device.

The number of ports of the rotary joint may be the same as the number of device seating parts 220, and the pressure control device may be installed to be the same as the number of device seating parts 220.

The pressure control device is configured to control the vacuum pressure and the positive pressure by the vacuum pressure and the static pressure according to each working position, and the unloading position starting from when the LED element 1 is seated in the loading position P ₁ . Vacuum pressure is formed in the pressure hole 221 so as to maintain the seated state of the LED element 1 until it reaches (P ₂ ), the LED element 1 reaches the unloading position (P ₂ ) to the second The transfer tool 520 is configured to supply air to the pressure hole 221 to form a positive pressure when picking up.

On the other hand, between the loading position (P ₁ ) and the inspection position (IP), between the inspection position (IP) and the unloading position (P ₂ ) as the alignment position (AP ₁ , AP ₂ ), seated on the device seating portion 220 An element aligning unit (not shown) for aligning the LED elements 1 may be further installed.

In addition, the device alignment unit is a position corresponding to the alignment position (AP ₁ , AP ₂ ) so that the LED element 1 checks the seating state in the device seating portion 220, the device alignment unit can align the LED element 1, etc. It may be configured as a camera (253, 254) installed in.

The inspection unit 240 is a configuration for inspecting the light emission characteristics of the LED element 1, and can be variously configured according to the inspection object. For example, the inspection unit 240 emits light by applying power to the LED element 1 and emits light. It may be configured to check the light intensity, such as light intensity, luminance, and the like.

The buffer unit 300 receives the LED element 1 from the device inspecting unit 200 and temporarily loads the LED element 1 while unloading the unloading unit 400 to classify the LED element 1 according to a test result. As the configuration for transmitting the LED element 1 to the unit 400, various configurations are possible depending on the design and design.

The buffer unit 300 is characterized in that it comprises a buffer plate 310 for temporarily loading the LED elements (1) inspected in the device inspection unit 200, various configurations are possible, Figures 1, 2 and As shown in FIGS. 5A to 5C, the device loading table 340, the device unloading table 350, the first buffer plate transfer unit 360, and the second buffer plate transfer unit 370 may be configured. Can be.

The buffer plate 310 is a configuration for loading the LED element 1 to receive and load the LED elements (1) inspected by the device inspection unit 200, and then transferred to the unloading unit 300, Figure 7 As shown in the figure, an adhesive tape 311 having adhesiveness to a surface to which the LED elements 1 can be attached; The adhesive tape 311 is configured to include a fixing member 312 is fixed.

The adhesive tape 311 may be made of any material as long as the LED elements 1 are bonded to each other.

The fixing member 312 is a structure for maintaining the shape of the adhesive tape 311, or as shown in Figure 7, the adhesive tape 311 is bonded on the bottom surface and the adhesive surface on which the LED elements 1 are bonded An opening may be formed to open this.

The material of the fixing member 312 is to maintain the shape of the adhesive tape 311 may be used a variety of materials such as rigid plastic, metal.

The buffer plate 310 may have various shapes and sizes, and may have a rectangular shape for convenience of movement.

Meanwhile, the buffer plate 310 is loaded on the plate loading unit 320 and sequentially loaded into the device loading table 340 and sequentially unloaded from the device unloading table 350 into the plate unloading unit 330. Can be.

The plate loading unit 320 may have various configurations in which the buffer plates 310 are loaded so that the LED elements 1 may continuously load the buffer plates 310 to be loaded, as shown in FIG. 6A. Likewise, the buffer plate 310 may be configured to include a guide member 321 installed to be stacked and stacked.

In addition, the plate loading unit 320 further includes a lifting unit 322 for raising the buffer plate 310 upward so that the second buffer plate transfer unit 370 can easily withdraw the buffer plate 310. Can be.

The plate unloading unit 330 may be configured in a manner in which the buffer plates 310 from which the LED elements 1 are removed are unloaded, and similarly to the plate loading unit 320, as shown in FIG. 6A. The buffer plate 310 may be configured to include guide members 331 installed to be stacked and stacked.

The plate unloading unit 330 further includes a lifting unit 332 for lowering the buffer plate 310 downward so that the second buffer plate transfer unit 370 easily loads the buffer plate 310. Can be installed.

Meanwhile, the plate loading part 320 and the plate unloading part 330 are parallel to the direction in which the loading part 100 and the device inspecting part 200 are disposed, in particular, the device loading table 340 and the device unloading table (to be described later). It may be disposed parallel to the arrangement direction of the 350. And for the convenience of the additional supply of the buffer plate 310 on which the LED element 1 is to be loaded and the removal of the buffer plate 310 from which the LED element 1 is removed, the LED element 1 may be installed in one direction such as the front or the rear of the device. Can be.

The device loading table 340 is configured to move the buffer plate 310 by receiving the buffer plate 310 from the plate loading unit 320 so that the LED elements 1 can be loaded onto the buffer plate 310. Various configurations are possible, and as shown in FIGS. 1 and 2, 5a, and 6a, an LED device transferred by the second transfer tool 520 from the device inspection unit 200 at the device loading position P _{3 is} provided. It may be configured to move the buffer plate 310 in the XY direction or the XY-θ direction so that (1) is smoothly loaded on the buffer plate 310. Here, the camera 381 may be installed on the device loading table 340 at the device loading position P ₃ to confirm the loading state of the LED device 1.

The device loading table 340 may further include a guide member 341 for guiding the movement of the buffer plate 310.

The device unloading table 350 receives the buffer plate 310 from the device loading table 340 to transfer the LED elements 1 loaded on the buffer plate 310 to the unloading unit 400. Various configurations are possible with the configuration of moving the 310, and the buffer plate 310 to facilitate the withdrawal of the third transfer tool 530 for transfer from the device unloading position P ₄ to the device unloading unit 400. ) May be configured to move in the XY direction or the XY-θ direction. Here, the camera 382 is installed on the device unloading position P ₄ at the top of the device unloading table 350 so as to check the loading state of the LED device 1 and to rotate the LED device 1 to align it. Can be.

The lower plate of the device unloading table 350, as shown in Figure 5a, the buffer plate 310 so that the third transfer tool 530 is easy to pull out the LED element 1 loaded on the buffer plate 310 A pressing pin 353 may be additionally installed at the withdrawal position P _{4 of the} LED element 1 to push up each LED element 1 upward.

The pressing pin 353 is configured to push the adhesive tape 311 of the buffer plate 310 to which the LED element 1 is attached upwards so that the third transfer tool 530 facilitates the withdrawal. It has a configuration similar to the pressing pin 130 installed on the lower side of 110.

The first buffer plate transfer unit 360 is a configuration for transferring the buffer plate 310 from the device loading table 340 to the device unloading table 350, and various configurations are possible, and are illustrated in FIGS. 5A and 6A. As shown, the plate seating portion 361 on which the buffer plate 310 is seated; Arrangement directions of the device loading table 340 and the device unloading table 350 to receive the buffer plate 310 from the device loading table 340 to the plate seating portion 361 and to transfer the buffer plates 310 to the device unloading table 350. It may be configured to include a seating portion moving portion 362 to move the plate seating portion 361 along.

The plate seating portion 361 may be any configuration as long as the buffer plate 310 is seated, and a seating guide portion 361a may be installed to stably seat the buffer plate 310.

The seating part moving part 362 is configured to move the plate seating part 361 between the device loading table 340 and the device unloading table 350, and various configurations are possible. As shown, the plate seating part The support member 362b may be configured to support the 361 and move along the guide rail 362a.

Meanwhile, the first buffer plate transfer unit 360 may further include a press unit 363 for pushing the buffer plate 310 to the device unloading table 350 or the second buffer plate transfer unit 370. have.

The second buffer plate transfer unit 370 transfers the buffer plate 310 from the plate loading unit 320 to the device loading table 340 and buffers the device unloading table 350 from the plate unloading table 350. Various configurations are possible by the configuration of transmitting the plate 310.

As shown in the drawing, the second buffer plate transfer part 370 includes a plate seating part 371 in which the buffer plate 310 is seated; The buffer plate 310 is received from the plate loading part 320 to the plate seating part 371 and transferred to the device loading table 340, and is received from the device unloading table 350 to the plate seating part 371. It may be configured to include a seating unit driving portion 372 for moving the plate seating portion 371 along the arrangement direction of the device loading table 340 and the device unloading table 350 to be delivered to the unloading portion 330. have.

The plate seating part 371 may be any configuration as long as the buffer plate 310 is seated, and a seating guide part 371a may be installed to stably seat the buffer plate 310.

Since the plate seating part 371 needs to withdraw and load the buffer plate 310 from the plate loading part 320 and the plate unloading part 330, the plate seating part 360 of the first buffer plate transferring part 360 is required. It is preferable to have a structure different from the structure of).

In particular, the plate seating portion 371 may further include an adsorption part (not shown) for adsorbing and fixing the buffer plate 310 seated on the upper surface.

The adsorption unit is configured to adsorb the buffer plate 310 in order to maintain the state of being drawn out of the buffer plate 310 or seated on the plate seating unit 371, and various configurations are possible, and are connected to a vacuum generator (not shown). Thus, the vacuum plate may be selectively formed on the upper surface of the plate seating portion 371 through one or more suction holes 371b to absorb the buffer plate 310.

The seating part moving part 372 is configured to move the plate seating part 371 between the device loading table 340 and the device unloading table 350, and various configurations are possible. As shown, the plate seating part It may be configured to include a support member 362b that moves along the guide rail 372a while supporting the 371.

Meanwhile, the second buffer plate transfer unit 370 may additionally include a pressing unit 373 for pushing the buffer plate 310 to the device loading table 340 or the first buffer plate transfer unit 360. .

In addition, as shown in FIG. 6A, the second buffer plate transfer unit 370 is inverted so that the upper surface of the plate seating portion 371 faces downward, thereby adsorbing the buffer plate 310 from the plate loading unit 320. The upper surface of the plate seating portion 371 is inverted so that the upper surface of the plate seating portion 371 is directed to the lower side in the state in which the upper surface of the plate seating portion 371 is sucked out and drawn out or the buffer plate 310 is attracted by the adsorption portion. An inverting portion 374 for inverting the plate seating portion 371 up and down so as to load the buffer plate 310 into the upper and lower portions; In order to exchange the buffer plate 310 between the plate loading unit 320 and the device loading table 340, between the device unloading table 350 and the plate unloading unit 330 A seating part rotating part 375 may be further included to pivot the plate seating part 371 directly between the loading part 330 and a position adjacent to the device loading table 340 or the device unloading table 350. .

The inverting portion 374 may be any configuration as long as the plate seating portion 371 can be inverted, that is, rotated about the Y axis.

The seating part rotating part 375 may have any configuration as long as the seating part 371 rotates, that is, rotates about the Z axis.

The operation of the buffer unit 300 having the configuration and arrangement as described above will be described with reference to FIGS. 5A to 5C and 6A to 6E.

First, as shown in FIG. 5A, the second buffer plate transfer unit 370 withdraws the empty buffer plate 310 on which the LED element 1 is to be loaded from the plate loading unit 320 to the device loading table 340. Supply. When the empty buffer plate 310 is seated, the device loading table 340 positions the loading portion of the buffer plate 310 in the device loading position P ₃ so that the LED elements 1 may be loaded.

Here, the second buffer plate transfer unit 370 will be described in detail the process of withdrawing the empty buffer plate 310 on which the LED element 1 is loaded from the plate loading unit 320 to supply to the device loading table 340 Is the same as

As shown in FIG. 6A, the plate seating portion 371 of the second buffer plate transferring part 370 is inverted so that the upper surface is directed downward by the inverting portion 374 and then pivoted by the seating portion rotating part 375. Then, the buffer plate 310 is adsorbed to the upper side of the plate loading part 320.

The plate seating part 371 of the second buffer plate transfer part 370 is pivoted by the seating part rotating part 375, as shown in FIG. 6B after absorbing the buffer plate 310 and shown in FIG. 6C. As described above, the inversion part 374 is inverted so that the upper surface thereof faces downward.

As shown in FIG. 6D, the plate seating portion 371 of the second buffer plate transfer part 370 is pressed by the pressing part 373 to be moved to the device loading table 340 when the inversion is completed.

When the LED elements 1 are filled in the buffer plate 310, the buffer plate 310 is formed by the first buffer plate transfer unit 360 as shown in FIGS. 5B and 5C. Is passed).

Here, the buffer plate 310 on the device loading table 340 is pressed by the pressing portion 373 of the second buffer plate transfer portion 370 to the plate seating portion 361 of the first buffer plate transfer portion 360. Is moved.

The first buffer plate transfer unit 360 moves toward the device unloading table 350 to transfer the buffer plate 310.

The first buffer plate transfer unit 360 is pushed by the pressing unit 363 to transfer the buffer plate 310 to the device unloading table 350.

In addition, after the buffer plate 310 is transferred from the device loading table 340 to the device unloading table 350, the second buffer plate transfer unit 370 does not fill the LED element 1 with an empty buffer plate ( 310 is supplied from the plate loading part 320 to the device loading table 340.

Meanwhile, the device unloading table 350 moves the buffer plate 310 after the buffer plate 310 is seated so that the LED element 1 loaded on the buffer plate 310 moves to the device unloading position P ₄ . To be located.

When the buffer plates 310 seated on the device unloading table 350 are all delivered to the unloading unit 400 by the third transfer tool 530, the empty buffer plates 310 are empty. ) Is transferred to the plate unloading unit 330 and removed.

Here, the transfer process of the empty buffer plate 310 to the plate unloading unit 330 is as follows.

First, as shown in FIG. 6E, the empty buffer plate 310 is pressed by the pressing part 363 of the first buffer plate transferring part 360 to form a plate seating part of the second buffer plate transferring part 370. 371).

The buffer plate 310 transferred to the plate seating portion 371 of the second buffer plate transfer unit 370 is transferred to the plate unloading unit 330 through a process opposite to that of FIGS. 6A to 6D.

On the other hand, the unloading unit 400 is a configuration for classifying the LED elements 1 according to the inspection result inspected by the device inspection unit 200, various configurations are possible.

For example, the unloading unit 400 receives the LED element 1 from the buffer unit 300 by the third transfer tool 530 so as to correspond to the classification level so that the unloading unit 400 may have an appropriate loading position of the sorting plate 40. An LED element may be placed on the unloading table 420 for moving the sorting plate 40 in the XY direction, and further in the XY-θ direction so as to be loaded on the P ₅ ), and the sorting plate 40 corresponding to another classification class. 1) includes a sorting buffer unit 450 for temporarily loading the sorting plate 40 partially filled with the LED element 1 so as to be loaded, and a plate transfer robot 460 for transporting the sorting plate 40. Can be configured.

The unloading table 420 has an LED element 1 with respect to the third transfer tool 530 so that the third transfer tool 530 can load the LED element 1 while the sorting plate 40 is seated. Various configurations are possible as the configuration for moving the relative position of.

The sorting buffer portion 450 is a sorting plate 40 partially filled with the LED element 1 so that the LED element 1 corresponding to each classification class can be loaded on the sorting plate 40 to which the classification grade is pre-assigned. Various configurations are possible as the configuration for temporarily storing.

Here, the classification grade given to the sorting plate 40 is a standard given according to the inspection result by the element inspecting unit 200. The LED element 1 may be classified according to the luminance grade according to the inspection result.

The sorting plate 40 is configured to be suitable for shipping, or has a different configuration from the wafer ring 10, such as having a specification suitable for the packaging process so as to perform a subsequent process such as packaging.

In particular, the sorting plate 40 is configured to be loaded with a relatively small number of LED elements 1 and the wafer ring 10, the shape is also configured to have a rectangle.

Meanwhile, as shown in FIG. 8, the sorting plate 40 has an adhesive tape 41 similar to the wafer ring 10 described above, and a mark such as LOT number and classification grade while fixing the adhesive tape 41. It may be configured to include a support member (42).

On the other hand, the input and discharge of the sorting plate 40 in the unloading unit 400 is the sorting magazine unit 70 is loaded with the sorting plate 40 loaded with the LED elements (1); A sorting plate input unit 80 for inputting the sorting plate 40 on which the LED elements 1 are to be loaded into the unloading unit 400; The sorting plate 40 of the sorting magazine unit 70 is made through a plate transfer robot 460 for transferring to the sorting plate input unit 80.

Therefore, the sorting plate 40 may be continuously supplied to the unloading unit 400 by the plate transfer robot 460.

The unloading part 400 is discharged by the plate transfer robot 460 when the LED element 1 is completely filled in the sorting plate 40, and in particular, a sorting magazine part in which a plurality of sorting plates 40 may be loaded. May be discharged to 70.

On the other hand, the unloading unit 400 may be configured to load the LED element 1 into the lead frame, which is a die bonding process, for the packaging process instead of the sorting plate 40, and then other members after the inspection of the LED element 1. Any configuration can be used as long as the LED element 1 is mounted on the structure.

The first to third transfer tools 510, 520, and 530 are respectively located between the loading unit 100 and the device inspecting unit 200, between the device inspecting unit 200 and the buffer unit 300, the buffer unit 300, and the like. Various configurations are possible as a configuration for transferring one or more LED elements 1 between the unloading unit 400.

The first to the third transfer tool (510, 520, 530) is a configuration for transporting one or more LED elements 1, various configurations are possible, and a plurality of rotary arms to pick up the LED element (1) It can be configured to include a rotary drive device for rotating the rotary arms so that the rotary arms convey the LED elements (1).

In particular, the rotary arms may be arranged to have a constant angle, and the rotary driving device may be configured to rotate the rotary arms only in one direction or to reciprocally rotate the predetermined angle.

In addition, the first to third transfer tools 510, 520, and 530, in particular, the third transfer tool 530 may be configured as a swing arm that reciprocates only at a predetermined angle.

Meanwhile, the loading unit 100, the device inspection unit 200, the buffer unit 300, and the unloading unit 400 may be variously arranged, but are preferably arranged in a straight line.

In addition, in the LED device inspection apparatus, a vacuum generator for forming a vacuum pressure and an air supply device for supplying air are individually connected to each component, or connected by one vacuum pressure generator and an air supply device. Can be.

9A and 9B illustrate an example of a sorting plate used in the unloading part of the LED device inspecting apparatus of FIG. 1.

Meanwhile, the unloading unit 400 may be configured as a die bonding unit which directly die-bonds on a lead frame for a packaging process instead of being loaded on a sorting plate.

The unloading unit 400 is a configuration for loading the LED elements 1 loaded in the buffer unit 300 into the loading unit of each lead frame given a classification grade according to the inspection result of the element inspection unit 200. 9A and 9B, the die bonding table 410 is rotated so that a plurality of lead frames 2 are loaded and the LED elements 1 are loaded on each lead frame 2. It may be configured to include).

The lead frame 2 is configured to facilitate the transport or storage of the LED element 1 for a later process such as a packaging process, and can be configured in various ways, and a loading part for loading each LED element 1 is formed. do. Here, the mounting portion is preferably formed in a concave shape to facilitate the loading of the LED element (1). In addition, the lead frame 2 is combined with the LED element 1 to form a package through a subsequent process.

The die bonding table 410 rotates each lead frame 2 by rotating the plurality of lead frames 2 and loads the LED elements 1 to the corresponding lead frames 2 according to the classification level. Place it in the stowed position (P ₅ ).

Here, the die bonding table 410 is a swing capable of moving the Z-rotary (third transfer tool 530), so that when the XY-θ direction movement can be smoothly loaded to each loading portion of the lead frame (2) It can be composed of cancer.

Meanwhile, the unloading unit 400 may further include a bonding processing unit 470 for coating an adhesive material or installing an adhesive member so that the LED element 1 may be adhered to the loading unit of the lead frame 2. Can be.

The bonding processing unit 470 is configured to have adhesiveness to the loading part of the lead frame 2, and various configurations are possible. As shown in FIG. 9A, the bonding processing part 470 is supplied with an adhesive material such as epoxy It may include an adhesive material coating portion 471 to be applied to.

The bonding processing unit 470 may be configured in various ways according to a method of providing adhesiveness to the loading unit, and may be configured to install an adhesive member (not shown) on the loading unit.

Meanwhile, the lead frame 2 to which the adhesive material is applied by the bonding processing unit 470 may be applied while being mounted on the die bonding table 410, in consideration of the die bonding table 410 being rotated from time to time. The frame 2 may be loaded in the lead frame loading part 430 which is temporarily loaded.

The lead frame loading part 430 is a configuration in which the lead frame 2 is loaded so that the adhesive material is applied, and various configurations are possible, and the lead frame 2 is drawn out from the lead frame magazine 440 to be described later. The lead frame 2 coated with the adhesive material by the bonding processor 470 may be transferred to the die bonding table 410.

The unloading unit 400 may further include a lead frame magazine unit 440 loaded with a plurality of lead frames 2 having a classification grade according to the test result inspected by the device inspecting unit 200.

The lead frame magazine 440 is a configuration in which a plurality of lead frames 2 are stacked, and various configurations are possible.

The lead frame magazine unit 440 may be installed at a lower side of the die bonding table 410 as shown in FIG. 9A, and may be freely installed at an upper side or a side surface of the die bonding table 440. Can be.

Meanwhile, the LED elements 1 are classified into several classification classes according to the inspection result of the device inspection unit 200, and the LED elements 1 that have been inspected are loaded in the lead frame 2 having the classification classes.

Therefore, the lead frame magazine unit 440 may be loaded in a plurality of stages, or in a row, or in a plurality of stages and in a row according to the classification class.

In addition, the die bonding table 410 may not be loaded with lead frames 2 having all classification levels on the lead frame magazine unit 440, and thus, the die bonding table 410 may be configured according to the classification grades of the LED elements 1 to be loaded. The lead frame 2 on the 410 and the lead frame 2 on the lead frame magazine 440 may be replaced at any time.

Meanwhile, as illustrated in FIG. 9A, the transfer of the lead frame 2 between the die bonding table 410, the lead frame magazine 440, and the lead frame member 430 may be performed by one or more XY movements. Frame transfer unit 460 or the like.

Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

1 is a plan view showing the configuration of the LED device inspection apparatus according to the present invention.

2 is a side view of the LED device inspection apparatus of FIG.

3A and 3B are diagrams showing an example of a wafer ring used in the LED device inspection apparatus of FIG.

4 is a plan view illustrating a configuration of a turntable of the device inspecting unit of the LED device inspecting apparatus of FIG. 1.

5A to 5C are plan views illustrating an example and an operation process of a buffer unit used in the LED device inspecting apparatus of FIG. 1.

6A through 6C are conceptual views illustrating a process of exchanging a buffer plate of the buffer unit of FIG. 5A.

7 is a perspective view of a buffer plate of the buffer unit of FIG. 5A.

8 is a view showing an example of a sorting plate used in the unloading unit of the LED device inspection apparatus of FIG.

9A and 9B illustrate an example of a sorting plate used in the unloading part of the LED device inspecting apparatus of FIG. 1.

***** Explanation of symbols for main parts of drawing *****

100: loading unit 200: device inspection unit

300: buffer unit 310: buffer plate

400: unloading part

Claims (13)

A loading unit loading the wafer ring on which the LED elements are loaded; An element inspection unit receiving and inspecting the LED elements of the loading unit; A buffer unit including a buffer plate on which the LED elements inspected by the device inspecting unit are loaded; An unloading unit which classifies and unloads the LED elements loaded on the buffer plate into respective sorting plates according to the inspection result of the device inspection unit; A first transfer tool for picking up and transferring the LED elements between the loading portion and the element inspection portion; A second transfer tool for picking up and transferring the LED elements between the device inspecting unit and the buffer unit; And a third transfer tool for picking up and transferring the LED elements between the buffer unit and the unloading unit. The buffer unit An element loading table for loading the LED elements inspected by the element inspecting unit onto the buffer plate; A device unloading table which receives the buffer plate from the device loading table and transfers the LED elements loaded on the buffer plate to the unloading unit; A first buffer plate transfer unit for transferring a buffer plate from the device loading table to the device unloading table; And a second buffer plate transfer unit for loading the buffer plate into the device loading table and unloading the buffer plate from the device unloading table. The method according to claim 1, The buffer plate and the adhesive tape having an adhesive on the surface to be attached to the LED elements; LED device inspection device comprising a fixing member to which the adhesive tape is fixed. The method according to claim 1, The first buffer plate transfer unit A plate seating part on which the buffer plate is seated; And a seating part moving part configured to move the plate seating part along an arrangement direction of the device loading table and the device unloading table so as to receive a buffer plate from the device loading table to the plate seating part and transfer the buffer plate to the device unloading table. LED device inspection apparatus, characterized in that. The method according to claim 1, The buffer unit A plate loading unit for loading the buffer plate loaded through the second buffer plate transfer unit into the device loading table; And an unloading unit for unloading and loading the buffer plate from the device unloading table through the second buffer plate transfer unit. The method of claim 4, The second buffer plate transfer unit A plate seating part on which the buffer plate is seated; Receiving the buffer plate from the plate loading part to the plate seating part and transferring the buffer plate to the device loading table, and receiving the buffer plate from the device unloading table to the plate seating part and transferring the buffer plate to the plate unloading part; And a seating part driving part for moving the plate seating part along an arrangement direction of the device unloading table. The method according to claim 5, The plate seating portion includes an adsorption portion for adsorbing and fixing the buffer plate seated on the upper surface, The second buffer plate transfer unit The plate mounting part is inverted so that the upper surface of the plate seating part faces downward, and the buffer plate is sucked out from the plate loading part by the suction part to the upper surface of the plate seating part, and the plate seat is sucked by the adsorption part. An inverting portion for inverting the upper surface of the portion toward the lower side and inverting the plate seating portion up and down to load the buffer plate into the plate unloading portion; Directly above the plate loading portion or the plate unloading portion and the element loading table or the element onion for exchange of buffer plates between the plate loading portion and the element loading table, between the element unloading table and the plate unloading portion. LED element inspection device comprising a seat portion rotating portion for pivoting the plate seating portion between a position adjacent to the loading table. The method according to claim 1, And the device loading table and the device unloading table move the loaded buffer plate in the X-Y direction or the X-Y-θ direction to facilitate the loading and unloading of the LED elements. The method according to claim 1, The unloading unit and a sorting magazine unit in which the sorting plate is loaded; A sorting plate input part for feeding the sorting plate to the unloading part; And a plate transfer robot for transferring the sorting plate of the sorting magazine part to the sorting plate inserting part. The method according to claim 1, And said unloading unit denies die-bonding to load the LED elements loaded on the buffer unit into the loading units of each lead frame to which the classification grade is assigned according to the inspection result of the element inspection unit. The method of claim 9, The die bonding unit includes a plurality of lead frames are stacked and the LED device inspection device comprising a die bonding table is rotated so that the LED elements are loaded on each lead frame The method of claim 10, The die bonding table loaded with the lead frame is characterized in that the moveable to the X-Y-direction movement. The method of claim 9, The die bonding unit LED device inspection apparatus, characterized in that the bonding processing unit is further provided to coat the adhesive material or to install an adhesive member to the LED element attached to the mounting portion of the lead frame. The method of claim 9, The die bonding unit includes: a lead frame magazine unit in which a plurality of lead frames having a classification grade according to the inspection result inspected by the device inspection unit is loaded; And a bonding processing unit for coating an adhesive material or installing an adhesive member to the lead frame magazine to draw out the lead frame loaded on the lead frame magazine so that the LED element can be adhered to the mounting portion of the lead frame. LED device inspection device.

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