KR20110032667A - Transferring tool for device - Google Patents

Transferring tool for device Download PDF

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Publication number
KR20110032667A
KR20110032667A KR1020090090276A KR20090090276A KR20110032667A KR 20110032667 A KR20110032667 A KR 20110032667A KR 1020090090276 A KR1020090090276 A KR 1020090090276A KR 20090090276 A KR20090090276 A KR 20090090276A KR 20110032667 A KR20110032667 A KR 20110032667A
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KR
South Korea
Prior art keywords
support block
guide rail
transfer tool
picker
loading
Prior art date
Application number
KR1020090090276A
Other languages
Korean (ko)
Inventor
유홍준
이용식
Original Assignee
(주)제이티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)제이티 filed Critical (주)제이티
Priority to KR1020090090276A priority Critical patent/KR20110032667A/en
Publication of KR20110032667A publication Critical patent/KR20110032667A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to an element transfer tool, and more particularly, to an element transfer tool for transferring elements cut into individual chips in a wafer state, comprising: a picker for adsorbing an element at an extraction position and detaching the element from a loading position; A support block for supporting the picker; At least one X guide rail for guiding the support block in the X direction; At least one Z guide rail for guiding the support block in the Z direction; One end is fixed to the rotating shaft, and the other end is coupled to the support block to reciprocally rotate, thereby moving the support block in the X direction and the Z direction through the X guide rail and the Z guide rail to pull out the picker coupled to the support block. A rotating arm which reciprocates to a position and a loading position; Disclosed is an element transfer tool comprising the support member on which the X guide rail, the Z guide rail and the rotating shaft are installed.

Description

Device Transfer Tool {Transferring tool for device}

The present invention relates to an element transfer tool, and more particularly, to an element transfer tool for transferring the elements cut into individual chips in the wafer state.

LED device, or LED (Light Emitting Diode Device), is a kind of p-n junction diode, and is a semiconductor device using electroluminescence, which is a phenomenon in which a monochromatic light is emitted when a voltage is applied in a forward direction. In other words, when forward voltage is applied, electrons of n-layer and holes of p-layer are combined to emit energy corresponding to the height difference (energy gap) between conduction band and valence band. Energy is mainly emitted in the form of heat or light, and when it is emitted in the form of light, it becomes an LED element.

Such LED devices are produced as individual chips by cutting and then forming electrodes on a wafer during a semiconductor process. The LED devices produced as individual chips are shipped to a manufacturer that performs subsequent processes such as packaging in a chip state, or are shipped to the market through packaging processes such as connection with a lead and molding or additionally through a module process.

On the other hand, in spite of defective devices such as defects of LED elements and substandards, if subsequent processes such as a packaging process or a module process are performed, there is a problem in that overall productivity and profitability are reduced as a result of performing unnecessary processes.

Therefore, the LED elements may vary depending on their position when the semiconductor process is performed in the wafer state. The LED elements are classified by the LED element inspection device by the LED element inspection device. Inspection process is performed.

In addition, the LED device is subjected to a die bonding process is die-bonded on the lead frame by a die bonder for the packaging process after the inspection process.

Herein, in the LED device processing apparatus such as the LED device inspection device and the die bonder, the LED devices are transferred by a transfer tool using vacuum pressure and positive pressure for the inspection process or the die bonding process.

However, in the LED element processing device, the LED element is very small compared to other elements, and when the transfer tool does not operate smoothly, the LED element may be damaged or the overall processing speed of the LED element may be lowered, resulting in lowered yield. There is a problem.

In addition, conventional transfer tools using vacuum pressure and static pressure supply air to the picker's adsorption head and load them into a blue tape or lead frame, and the elements are so small that even the small air pressure makes the LED element unstable or the LED element unstable. There is a problem with scattering.

An object of the present invention is to provide a device transfer tool that can significantly increase the transfer speed of the device in order to solve the above problems.

Another object of the present invention is to provide an element transfer tool capable of stably transferring elements of small size.

Another object of the present invention is to provide a device transfer tool capable of stably loading small size devices to improve the overall yield.

The present invention was created in order to achieve the object of the present invention as described above, the present invention comprises a picker for adsorbing the element in the extraction position and detached from the loading position; A support block for supporting the picker; At least one X guide rail for guiding the support block in the X direction; At least one Z guide rail for guiding the support block in the Z direction; One end is fixed to the rotating shaft, and the other end is coupled to the support block to reciprocally rotate, thereby moving the support block in the X direction and the Z direction through the X guide rail and the Z guide rail to pull out the picker coupled to the support block. A rotating arm which reciprocates to a position and a loading position; Disclosed is an element transfer tool, characterized in that it comprises a support member on which the X guide rail, the Z guide rail and the rotating shaft are installed.

The support member may further drive the support block in the Z direction at the extraction position and the loading position of the device.

The picker may be configured to include an adsorption head connected to the vacuum generator to adsorb the device through the vacuum pressure.

A check valve may be additionally installed at the upper end of the adsorption head to maintain a closed state and open only when vacuum pressure is formed.

The picker coupled to the support block may reciprocate along an arc between the withdrawal position and the loading position of the device by reciprocating rotational driving of the pivot arm.

The element transfer tool according to the present invention is simple in construction and fixed by the picker to the support block moved by the X guide rail and the Z guide rail, and by driving the support block by a rotating device, which is a single driving device, to reduce the total weight. There is an advantage that the device can be transported reliably by minimizing.

In particular, the device transfer tool according to the present invention has the advantage that the device can be transferred at a high speed as the configuration is simple to minimize the weight.

In addition, the transfer tool according to the present invention has a check valve for opening the vacuum flow path only when the vacuum pressure is formed at the upper end of the suction head of the picker for picking up and transporting the element and closing the vacuum flow path when no vacuum pressure is formed. There is an advantage that the configuration can be simplified.

In particular, the conventional picker separates the device from the adsorption head by supplying air instead of sucking air through the vacuum flow path to form a vacuum pressure when the device is loaded at a predetermined position. On the contrary, since the picker of the transfer tool according to the present invention does not have to supply air to separate the device from the adsorption head by providing a check valve, there is an advantage that the problem as in the prior art can be solved.

Hereinafter, the element transfer tool according to the present invention will be described in detail with reference to the accompanying drawings.

1a to 1b is a side view showing the configuration and operation of the transfer tool according to the invention, Figure 2 is a cross-sectional view showing the structure of the picker of the transfer tool of Figure 1a, Figure 3 is another example of the transfer tool of Figure 1a The conceptual diagrams shown.

The element transfer tool 800 according to the present invention is an element transfer tool 800 for transferring the element 1 by reciprocating to the withdrawal position P p and the loading position P L of the element, as shown in FIGS. As shown in 1c, the picker 850 which adsorb | sucks the element 1 in the extraction position P p , and detach | desorbs in the loading position P L ; A support block 820 for supporting the picker 850; One or more X guide rails 811 for guiding the support block 820 in the X direction; One or more Z guide rails 812 for guiding the support block 820 in the Z direction; One end is fixed to the rotation shaft 841 and the other end is coupled to the support block 820 to reciprocate rotation, thereby supporting the support block 820 through the X guide rail 811 and Z guide rail 812 in the X direction and Z direction A pivoting arm 830 reciprocating the picker 850 coupled to the support block 820 to a withdrawal position P p and a loading position P L ; And a supporting member 860 on which an X guide rail 811, a Z guide rail 812, and a rotation shaft 841 are installed.

The element transfer tool is used in an element processing apparatus for processing an element such as inspection, classification, and the like of an element 1 such as an LED element, a semiconductor element, an LCD, and the like. Device inspection device that performs inspection process to inspect and classify emission class after cutting into individual chips, and packaging process after cutting wafer such as die bonder die-bonded to lead frame to perform packaging process This is a device that performs a predetermined process for the elements.

The withdrawal position P p and the loading position P L vary depending on the configuration of the device processing apparatus, and the withdrawal and loading of the device 1 is performed by attaching the devices 1 separated by individual chips using blue tape. Wafer ring to be transported by using, the transfer plate to be loaded and transported by loading the elements (1) using a blue tape, it can be made in the inspection unit for inspection of the device (1).

The X guide rail 811 and the Z guide rail 812 is a configuration for guiding the movement of the support block 820 moved by the rotational driving of the rotating device 840, the support block 820 in the Z direction Any configuration can be used as long as the configuration enables movement of.

The X guide rail 811 and the Z guide rail 812 may be fixedly installed on the support member 860 installed in the device processing apparatus, as shown in FIG. 1A. Here, the support member 860 is configured to support the X guide rail 811 and the Z guide rail 812 can be a variety of configurations, the rotation device 840 for rotating the support block 820 is also fixed together Can be.

On the other hand, the picker 850 needs to be moved in the X direction or the Z direction at the withdrawal position P p and the loading position P L to facilitate the withdrawal and loading of the device 1.

Therefore, the support member 860 may be installed in the element processing apparatus to be movable in the X direction or the Z direction by a driving device (not shown) as shown in FIG. 1A.

For example, the support member 860 may be installed to be moved by the driving device along one or more guide members 881 installed in the support bracket 880 installed in the device processing apparatus.

The rotating device 840 is configured to rotate the support block 830, an electric motor may be used, and the support block 830 by reciprocating the rotating arm 830 fixed to the rotation shaft 841. Rotate to drive.

The pivot arm 830 transmits the rotational force of the rotating device 840 to the support block 820 to drive the support block 820 where the movement is guided to the X guide rail 811 and the Z guide rail 812. Various configurations are possible with the configuration.

The support block 820 is configured to implement the movement of the fixed picker 850 by the rotational drive of the rotating device 840 and by the guide by the X guide rail 811 and Z guide rail 812. Various configurations are possible.

Here, the support block 820 is rotatably coupled with the pivot arm 830, and movable with any one of the X guide rail 811 and the Z guide rail 812, in particular the Z guide rail 810, that is, Slidably combined.

The picker 850 is fixedly coupled to the support block 820 to pick up the device 1 at the withdrawal position P p by the movement of the support block 820 and to the device 1 at the loading position P L. Various configurations are possible as a configuration for loading the apparatus, and as shown in FIG. 2A, the suction head 851 may be connected to a vacuum generator (not shown) to adsorb the element 1 through the vacuum pressure. have.

The picker 850 is moved between the withdrawal position P p and the loading position P L of the element 1 by a reciprocating rotational drive of the pivoting arm 830, in particular, reciprocating along an arc. Can be. Here, the movement track of the picker 850 is changed by changing the combination of the rotation arm 830 and the rotation shaft 841 by adding a cam according to the withdrawal position P p and the loading position P L of the device 1. Various settings are possible.

The picker 850 may be configured to load the device 1 by supplying air to the suction head 851 when the device 1 is loaded at the loading position P L.

However, as described above, the small device 1 may be scattered by the air supplied to the adsorption head 851. As shown in FIG. 2A, the picker 850 may be kept closed. A check valve 852 may be additionally installed which opens only when pneumatic is formed. Here, the suction head 851 may be configured to pick up the device 1 in various shapes.

Since the check valve 852 picks up the element 1 and forms a vacuum pressure until the element 1 is loaded at the loading position P L , as shown in FIG. 2A, the pneumatic flow path 853 is formed. It is configured to open to form a vacuum pressure at the adsorption head 851, and to close the pneumatic flow path 853 upon loading of the element 1 to release the vacuum pressure as shown in FIG. 2B.

The check valve 852 may be configured in various ways. As shown in FIG. 2A, the check valve 852 is installed at an upper end of the suction head 821 and forms a pneumatic flow path 853 from the suction head 821. And is supported by the elastic member 852c in the conduit 852a so that the suction of air through the pneumatic flow path 853, that is, the flow of air at the time of forming a vacuum pressure in the suction head 851, causes the elastic member 852c to It may be configured to include a valve member 852b for opening the conduit 852a by elastic deformation.

Here, when the suction of air, that is, the vacuum pressure is formed in the pneumatic flow path 853, as shown in Figure 2a, the air is sucked through the suction head 821, the valve member 852b is pressed upwards and the elastic member ( A flow path through the pneumatic flow path 853 from the suction head 851 opens with the deformation of the 852.

When the suction of air to the pneumatic flow path 853 is stopped, the valve member 852b is moved by the elastic force of the elastic member 852 to block the pneumatic flow path 853, and thus the inside of the suction head 821. The vacuum pressure is released and consequently the suction force on the element 1 is removed.

On the other hand, the picker 850 may be configured to be moved up and down for smooth pickup and loading of the device (1).

Referring to the operation of the transfer tool having the configuration as described above in detail.

As shown in FIGS. 1A-1C, the picker 850 reciprocates between the withdrawal position P p or the loading position P L. Here, the withdrawal position P p or the loading position P L are displayed for convenience and their positions may be interchanged.

Meanwhile, the reciprocating movement between the withdrawal position P p or the loading position P L shown in FIG. 1A is performed as follows.

The rotating arm 830 fixed to the rotating shaft 841 is rotated by the rotation of the rotating device 840, and the rotating arm 830 rotates the support block 820 coupled to one end.

At this time, the support block 820 rotated by the pivoting arm 830 is constrained by the X guide rail 811 and the Z guide rail 812 to move in the trajectory as shown in FIG. 1A.

The movement of the support block 820 as described above is realized by moving the picker 850 fixed to the support block 820 between the withdrawal position (P p ) or the loading position (P L ).

Meanwhile, the movement track ML of the picker 850 may be variously set by the rotation angle of the rotating device 840. As shown in FIG. 1A, the reciprocating rotation angle of the rotation arm 830 is 90 °. Or, as shown in Figure 3, the reciprocating rotation angle of the rotating arm 830 may be set to various, such as 180 °.

In addition, by changing the rotation section of the rotary device 840, the withdrawal position (P p ) or the loading position (P L ) is changed in the vertical direction, that is, the Z-axis direction, that is, the withdrawal position (P p ) or loading position (P L ) The heights of can be different or the same.

Meanwhile, the transfer tool according to the present invention having the above configuration may be applied to various device processing apparatuses.

4A to 4C are plan views showing examples of an element processing apparatus in which the transfer tool of FIG. 1 or 2 is used.

A device processing apparatus to which a transfer tool according to the present invention is applied includes: a loading unit (100) for loading elements (1); An element processing unit which receives the elements 1 of the loading unit 100 and performs a process for the element 1; It may include a loading unit 100 and one or more transfer tools (510, 520, 530) for transferring the device 1 in the device processing unit.

As an example of the device processing apparatus, the device may be configured to perform an inspection process of inspecting and unloading a brightness grade of the device 1, which is an LED device. As shown in FIG. 4A, the device processing unit may include a loading unit ( 100 may be configured to perform the device inspection process of receiving the devices 1 and performing the inspection on the device 1 and classifying and unloading the devices 1 according to the inspection results.

In this case, as shown in FIG. 4A, the device processing unit 200 receives the device 1 from the device inspection unit 200 and the device inspection unit 200 for device inspection and temporarily stores the elements 1. It may be configured to include an unloading unit 400 for receiving the device (1) from the unloading according to the inspection result of the device inspection unit 200.

In FIG. 4A, P 0 , P 2 , and P 4 indicate the extraction positions of the elements 1, respectively, and P 1 , P 3 , and P 5 indicate the loading positions of the elements 1, respectively.

Meanwhile, the device processing apparatus illustrated in FIG. 4A includes a first transfer tool 510 and a second transfer tool, which are cases where all of the transfer tools 510, 520, and 530 need to transfer the element 1 at high speed. 520 may be used as the transfer tool 800 according to the present invention.

As an example of the device processing apparatus, the device 1 may be configured to perform a die bonding process of receiving the device 1 from the loading unit 100 and loading the device 1 into the lead frame 3 for carrying out a packaging process.

At this time, as shown in FIG. 4B, the element processing unit includes a lead frame loading unit 610 in which the lead frame 3 is loaded, and a lead frame unloading in which the lead frame 3 in which the element 1 is loaded is unloaded. Unit 630; A guide part 640 for guiding the movement of the lead frame 3 from the lead frame loading part 610 to the lead frame unloading part 630; And a transfer tool 400 installed to withdraw the elements 1 from the wafer ring 10 of the loading unit 100 and to load the loading unit of the lead frame 3 which is moved along the guide unit 640. Can be.

Here, the transfer tool 400 may be used as the transfer tool 800 according to the present invention.

On the other hand, as an example of the device processing apparatus, it may be configured to perform the inspection process and the die bonding process at a time, the device processing unit as shown in Figure 4c, receiving at least one element 1 of the loading unit 100 is received An element inspection unit 200 for inspecting; A buffer unit 300 for temporarily receiving the inspected devices 1 from the device inspection unit 200 and temporarily loading the devices 1; A die bonding unit 400 for loading the elements 1 loaded on the buffer unit 300 into the loading units of each lead frame to which the classification grade is assigned according to the inspection result of the device inspection unit 200; A first transfer tool 510 for picking up and transferring the elements 1 between the loading unit 100 and the element inspection unit 200; A second transfer tool 520 which picks up and transfers the element 1 between the element inspection unit 200 and the buffer unit 300; It may be configured to include a third transfer tool 530 to pick up and transfer the element 1 between the buffer unit 300 and the die bonding unit 700.

In the device processing apparatus shown in FIG. 4C, a first transfer tool 510 and a second transfer tool 520 are required to transfer all of the transfer tools 510, 520, and 530 or the device 1 at high speed. ) Can be used as a transfer tool 800 according to the present invention.

Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

In particular, the embodiment of the present invention mainly described the device processing apparatus for processing the LED element, the device transfer tool according to the present invention can be applied to the field of high speed transfer of individual devices such as semiconductor, LCD, LED, etc. It can be widely applied to the field of transferring various elements of the general industrial field at high speed.

1a to 1b is a side view showing the configuration and operation of the transfer tool according to the present invention.

Figure 2 is a cross-sectional view showing the structure of the picker of the transfer tool of Figure 1a.

3 is a conceptual view showing another example of the transfer tool of Figure 1a.

4A to 4C are plan views showing examples of an element processing apparatus in which the transfer tool of FIG. 1 or 2 is used.

***** Explanation of symbols for main parts of drawing *****

800: transfer tool

811: X guide rail 812: Z guide rail

820: support block 830: pivotal rock

840: rotating device 850: picker

Claims (5)

A picker for adsorbing the element at the withdrawal position and detaching at the loading position; A support block for supporting the picker; At least one X guide rail for guiding the support block in the X direction; At least one Z guide rail for guiding the support block in the Z direction; One end is fixed to the rotating shaft, and the other end is coupled to the support block to reciprocally rotate, thereby moving the support block in the X direction and the Z direction through the X guide rail and the Z guide rail to pull out the picker coupled to the support block. A rotating arm which reciprocates to a position and a loading position; And a support member on which the X guide rail, the Z guide rail, and the rotating shaft are installed. The method according to claim 1, The support member is a device transfer tool, characterized in that for further driving the support block in the Z direction in the withdrawal position and the loading position of the device. The method according to claim 1, The picker is connected to a vacuum generator device transfer tool, characterized in that it comprises an adsorption head for adsorbing the device through the vacuum pressure. The method of claim 3, The device transfer tool, characterized in that the check valve is further installed on the upper end of the suction head is opened only when the vacuum pressure is formed. The method according to claim 1, The picker coupled to the support block is a device transfer tool, characterized in that for reciprocating movement along the arc between the withdrawal position and the loading position of the device by the reciprocating rotational drive of the pivot arm.
KR1020090090276A 2009-09-23 2009-09-23 Transferring tool for device KR20110032667A (en)

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KR1020090090276A KR20110032667A (en) 2009-09-23 2009-09-23 Transferring tool for device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101315200B1 (en) * 2010-04-12 2013-10-07 (주)제이티 Transferring tool for device
KR101351588B1 (en) * 2012-02-03 2014-01-24 (주)큐엠씨 Apparatus for transferring chip and method for transferring chip using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101315200B1 (en) * 2010-04-12 2013-10-07 (주)제이티 Transferring tool for device
KR101351588B1 (en) * 2012-02-03 2014-01-24 (주)큐엠씨 Apparatus for transferring chip and method for transferring chip using the same

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