KR101189176B1 - Handler for inspecting LED device - Google Patents

Abstract

The present invention relates to an LED handler, and more particularly, to an LED handler that performs inspection, classification, and the like, of an emission level of LED elements cut into individual chips in a wafer state.
The present invention provides a device handler for performing at least one of device inspection for a device and device classification for classifying devices according to the test results, the device handler comprising: one or more pickup heads for picking up the device; A rotation driving unit for rotating the pickup head; And at least one transfer tool including a linear driving unit for linearly driving a pickup head positioned at an element pick-up position, wherein the pickup head is installed to enable linear movement to a support coupled to the rotary driving unit. Start the handler.

Description

LED device handler {Handler for inspecting LED device}

The present invention relates to an LED handler, and more particularly, to an LED handler that performs inspection, classification, and the like, of an emission level of LED elements cut into individual chips in a wafer state.

LED Light Emitting Diode Device (LED) is a type of p-n junction diode, which is a semiconductor device using electroluminescence, which is a phenomenon in which monochromatic light is emitted when voltage is applied in the forward direction. That is, when the forward voltage is applied, electrons in the n-layer and holes in the p-layer are coupled to emit energy corresponding to the height difference (energy gap) between the conduction band and the valance band. Energy is emitted mainly in the form of heat or light, and when emitted in the form of light, becomes an LED element.

The above-described LED device is formed as an individual chip by forming electrodes on a wafer using semiconductor processes and then cutting the wafer. In addition, the LED devices manufactured as individual chips are shipped to manufacturers who carry out subsequent processes such as packaging in a chip state, are shipped to the market through packaging processes such as connection with leads, molding processes, or further through module processes.

On the other hand, if the subsequent processes such as the packaging process or the module process are performed despite the defects of the device itself and the defective devices such as the under-standard, there is a problem that the unnecessary process is performed and the overall productivity and profitability are lowered.

In addition, it is necessary to classify the LED devices according to the light emission characteristics, which are inspected in the chip state in which deviation occurs, for example, the light emitting characteristics vary depending on the position when the semiconductor process is performed in the wafer state.

Therefore, it is necessary to perform a subsequent process only on the elements of good products by checking the defects or the light emission characteristics before performing each process, or to improve the productivity and profitability by classifying them in advance according to the light emission characteristics.

On the other hand, the LED element handler as described above picks up the element from the wafer ring, plate, etc. to place the element on another plate.

In the pick-up and place process of the device as described above, the alignment state of the device is constantly placed by recognizing the alignment state of the device before pick-up, and then aligning the plate in place of the device according to the alignment state of the device.

In particular, the pickup head for picking up and place of the device transfers the device by a linear movement for the pickup and place of the element, a linear movement or a rotational movement from the pickup position to the loading position.

However, the pickup head as described above causes vibration during linear movement and rotational movement, especially when the movement is high speed and heavy, causing strong vibration, causing vibration to the whole device, reducing durability or acting as a cause of malfunction. Therefore, there is a problem of lowering the performance of the LED element handler.

SUMMARY OF THE INVENTION An object of the present invention is to provide an LED element handler capable of significantly increasing the processing speed for an element by enabling the element transfer at a high speed by minimizing the weight of the transfer tool for element transfer. have.

Still another object of the present invention is to provide an LED element handler which can prevent the damage of the element during the pickup of the device by additionally providing a pressing unit for applying a constant force to the pickup head.

The present invention was created in order to achieve the object of the present invention as described above, the present invention is a device handler that performs at least one of the device inspection for the device, the device classification to classify the device according to the test results, One or more pickup heads for picking up; A rotation driving unit for rotating the pickup head; And at least one transfer tool including a linear driving unit for linearly driving a pickup head positioned at an element pick-up position, wherein the pickup head is installed to enable linear movement to a support coupled to the rotary driving unit. Start the handler.

The support portion includes a body portion fixedly coupled to the support portion; A linear guide part including a cylinder part coupled to the body part to be linearly movable, one end of which is coupled to the pickup head, and the other end of which is coupled to the driving member of the linear driving part and linearly moved, may be installed.

The linear driving unit and the drive member in surface contact with the other end of the cylinder portion; It may include a drive for linearly moving the drive member.

The drive member may include a roller member that is rotated about a rotation axis parallel to the rotation axis of the pickup head.

The body portion is formed with a guide hole into which the cylinder portion is inserted, and a flange portion coupled to the support portion is formed on the outside thereof, and the cylinder portion has a rectangular pillar shape having at least a part of which has a rectangular cross section at a portion inserted into the guide hole. The coil spring may be installed between the other end of the cylinder portion and the body portion.

A pressing part for pressing the body part below a predetermined pressing force may be additionally installed between the driving member and the pickup head.

The pressing unit may be composed of a linear drive motor such as VCM.

Rotating terminal portion rotated together with the pressing portion to supply power to the pressing portion, a fixed terminal portion fixedly installed to connect power from the outside, and a slip ring electrically connecting the rotating terminal portion and the fixed terminal portion to be installed. Can be.

The support portion may include a plurality of pivot arms coupled to a rotation shaft of the rotation driver and to which the pickup head is coupled.

The pickup head may be linearly driven in parallel with the rotation axis of the rotation driver.

The pickup head may be linearly driven in a radial direction of the rotation axis of the rotation driver.

The present invention also includes a loading unit for loading a wafer ring loaded with LED elements; An element inspection unit receiving and inspecting the LED elements of the loading unit; A buffer unit including a buffer plate on which the LED elements inspected by the device inspecting unit are loaded; An unloading unit which classifies and unloads the LED elements loaded on the buffer plate into respective sorting plates according to the inspection result of the device inspection unit; A first transfer tool for picking up and transferring the LED elements between the loading portion and the element inspection portion; A second transfer tool for picking up and transferring the LED elements between the device inspecting unit and the buffer unit; And a third transfer tool for picking up and transferring the LED elements between the buffer unit and the unloading unit, wherein at least one of the first transfer tool and the third transfer tool discloses an element handler configured as the transfer tool. .

The loading unit is disposed adjacent to the device inspection unit so as to transfer the device to the device inspection unit, and a wafer ring table in which the wafer ring is vertically loaded with respect to the ground; A plurality of wafer rings may include a wafer ring transfer unit for extracting the wafer rings from the wafer ring magazine unit loaded in a horizontal state with respect to the ground and transferring the wafer rings to the wafer ring table.

The device inspecting unit may include a turntable including the transfer tool and inspect the device installed in the pickup head.

The present invention also includes a loading unit for loading a wafer ring loaded with LED elements; An element inspection unit receiving and inspecting the LED elements of the loading unit; An unloading unit which unloads the LED elements inspected by the device inspecting unit; A first transfer tool for picking up and transferring the LED elements between the loading portion and the element inspection portion; And a second transfer tool for picking up and transferring the LED elements between the device inspection unit and the unloading, wherein at least one of the first transfer tool and the second transfer tool is the transfer tool. It starts.

The loading unit is disposed adjacent to the device inspection unit so as to transfer the device to the device inspection unit, and a wafer ring table in which the wafer ring is vertically loaded with respect to the ground; A plurality of wafer rings may include a wafer ring transfer unit for extracting the wafer rings from the wafer ring magazine unit loaded in a horizontal state with respect to the ground and transferring the wafer rings to the wafer ring table.

The device handler may inspect the LED device and classify it according to the test result, or the device handler may classify the LED device according to the test result that has been inspected in advance.

In the LED element handler according to the present invention, in the linear driving and rotational driving of the pickup head picking up the element, by installing the linear driving of the pickup head outside, the weight of the rotating device for rotational movement is reduced while reducing its own weight. Vibration due to rotation can be minimized.

The present invention can also prevent movement in the linear movement direction and the vertical direction by configuring the guide portion for guiding the linear movement of the pickup head with a cylindrical portion having a rectangular cross section and a body portion with a guide hole into which the cylinder portion is inserted.

The present invention can also prevent damage to the device by providing a pressurizing portion to move the pick-up head in the opposite direction to the device when more pressure is required when the pick-up head approaches and contacts the device.

In particular, the pressurizing part is configured by the VCM, and the pressurizing part is installed by a simple configuration by supplying power to the pressurizing part using a slip ring, thereby preventing damage to the device.

1 is a plan view showing a schematic configuration of an LED element handler according to the present invention.
FIG. 2 is a schematic side view of the LED element handler of FIG. 1. FIG.
3A and 3B illustrate an example of wafer ring used in the LED device handler of FIG. 1.
4 is a plan view illustrating a configuration of a turntable of the device inspecting unit of the LED device handler of FIG. 1.
5 is a conceptual view illustrating a wafer ring magazine unit, a wafer ring transfer unit, and a wafer ring table of the LED element handler of FIG. 1.
6 is a perspective view illustrating a wafer ring table of the LED device handler of FIG. 1.
FIG. 7 is a perspective view illustrating a wafer ring transfer unit of the LED device handler of FIG. 1.
8A and 8D are conceptual views illustrating a configuration and an operation process of the first transfer tool in the LED device handler of FIG. 1.
FIG. 9 is a conceptual view illustrating a state in which the wafer ring transfer unit of the LED element handler of FIG. 1 pulls out or pulls in a wafer ring from the wafer ring magazine unit.
10A and 10B are conceptual views illustrating a process in which the wafer ring transfer unit of the LED device handler of FIG. 1 draws or draws wafer rings from the wafer ring table.
FIG. 11 is a view illustrating a schematic configuration and an operating state of a buffer unit of the LED element handler of FIG.
12 is a view showing an example of a sorting plate used in the unloading part of the LED element handler of FIG.
13A and 13B are views illustrating a schematic configuration and an operating state of the unloading unit of the LED device handler of FIG. 1.
FIG. 14A is a conceptual diagram illustrating a configuration and an operation process of a modified example of the first transfer tool of FIG. 8A, and FIG. 14B is a cross-sectional view taken along AA in FIG. 14A.
15A and 15B are conceptual views illustrating the configuration of the second transfer tool and the second transfer tool of the LED element handler of FIG. 1.

Hereinafter, the LED element handler according to the present invention will be described in detail with reference to the accompanying drawings.

LED device handler according to the present invention, as shown in Figure 1 and 2, the loading unit for loading the wafer ring 10 is loaded with the LED device (1); An element inspection unit 200 receiving and inspecting at least one LED element 1 of the loading unit; A buffer unit 300 including a buffer plate 310 on which the LED elements 1 inspected by the device inspection unit 200 are loaded; An unloading unit 400 for classifying and unloading the LED elements 1 loaded on the buffer plate 310 into the sorting plates 40 according to the test result of the device inspecting unit 200; The first transfer tool 510 for picking up and transferring the LED elements 1 between the loading unit and the device inspecting unit 200, and the LED elements 1 between the device inspecting unit 200 and the unloading unit 400. A second transfer tool 520 for picking up and transferring; And a third transfer tool 530 that picks up and transfers the LED elements 1 between the buffer unit 300 and the unloading unit 400.

The LED element 1 to be inspected by the LED element handler may be a chip state element cut by a sawing process after the semiconductor process and the electrode forming process to perform the LED function in the wafer state.

The LED element 1 inspected by the LED element handler is inspected and sorted, and then the LED element 1 is shipped in a chip state, or it is shipped to the market through a subsequent process such as a packaging process or a module process.

The loading unit receives one or more wafer rings 10 from the outside and transfers the LED elements 1 loaded on each wafer ring 10 to the device inspection unit 200, and various configurations are possible. The plurality of LED elements 1 are configured to be loaded by the bonded wafer ring 10 so that the 200 can inspect the LED element 1.

The wafer ring 10 is a structure for transferring the attached LED elements 1 cut into individual chips in a wafer state, and various configurations are possible. As shown in FIGS. 3A and 3B, each element An adhesive tape 11 having adhesiveness to a surface so that the cut wafer is attached to an upper surface thereof; The adhesive tape 11 is deformed in the outer diameter direction by applying tension in the outer diameter direction to the first coupling ring 12 to which the adhesive tape 11 is coupled and the adhesive tape 11 coupled to the first coupling ring 12. It can be configured to include a second coupling ring 13 to finely space each LED element (1).

1 and 5, the loading unit is installed adjacent to the device inspection unit 200 to deliver the device 1 to the device inspection unit 200, and the wafer ring 10 is perpendicular to the ground. A wafer ring table 700 loaded; Wafer ring transfer unit 900 for extracting the wafer ring 10 from the wafer ring magazine portion 800 loaded with a plurality of wafer rings 10 in a horizontal state with respect to the ground and transferring the wafer ring 10 to the wafer ring table 700. It is configured to include.

As shown in FIG. 6, the wafer ring table 700 transfers the device 1 to the device inspection unit 200 described later after the wafer ring 10 is vertically loaded with respect to the ground. A configuration for moving the wafer ring 10 in the YZ direction, and further YZ−, to move the relative position P ₀ of the LED element 1 with respect to the first transfer tool 510 so as to be picked up by 510. Any configuration can be used as long as it can be handled by moving in the? direction.

For example, the wafer ring table 700 includes a table portion 720 provided with a grip portion 710 for gripping the wafer ring 10; The table driving unit 730 may include a table driving unit 730 linearly driven in two axial directions.

The table portion 720 may be configured to move relative to the first transfer tool 510 in the Y-Z direction, and furthermore, the Y-Z-θ direction while the wafer ring 10 is fixed.

At this time, the lower side of the table portion 720 may be further provided with a pressing pin 180 to move upward to facilitate the pickup of the LED element 1 to press the adhesive tape 11 of the wafer ring 10. .

The grip part 710 is configured to maintain the wafer ring 10 fixed to the table part 720. Various configurations are possible, and the grip part 710 may be configured in one or more pairs for stable support of the wafer ring 10. Do.

The table driving unit 730 may be any configuration as long as the table driving unit 720 can be linearly driven, and may be configured by a screw jack.

The table driving unit 730 may further include a θ driving unit 723 for rotating the table unit 720 about a rotation axis (X axis) perpendicular to the upper surface of the table unit 720.

As shown in FIG. 6, the θ driving part 723 is provided with a rotating device 723a installed adjacent to the table part 720, a pulley (not shown) installed in the rotating device 723a, and a circular table part 720. Any configuration may be used as long as the table 720 is rotatable, for example, a driving belt 723b connecting the outer circumferential surface of the panel.

The wafer ring transfer unit 900 is configured to deliver the wafer ring 10 in a vertical state to the wafer ring table 700 by drawing the wafer ring 10 from the wafer ring magazine unit 800 loaded in a horizontal state. Any configuration is possible as well.

The wafer ring transfer part 900 includes a pickup part 910 for picking up the wafer ring 10 as shown in FIGS. 5 and 7; A linear driving unit 920 for linearly moving the pickup unit 910; A first rotation driving part 940 for rotating the pickup part 910 about a first rotation axis R ₁ having a Z axis direction perpendicular to the ground; A first rotational drive 940 is a second rotary shaft rotatably supported by the first rotation axis (R ₁₎ center can be set up and the pickup rotation 910 to a, and forming a first rotation axis (R ₁₎ and vertical (R a It may include a second rotary drive unit 950 for rotating around ₂ ).

The pick-up unit 910 transfers the wafer ring 10 loaded on the wafer ring magazine unit 800 to the wafer ring table 700, or withdraws the wafer ring 10 from the wafer ring table 700. Any configuration can be used as long as it can pick up the wafer ring 10 for delivery to the magazine unit 800.

The linear driving unit 920 linearly moves the pickup unit 910 so that the pickup unit 910 may move to the wafer ring magazine unit 800 or the wafer ring table 700 to pick up or load the wafer ring 10. Various configurations are possible as the configuration to make.

In particular, as shown in FIG. 7, the linear driving unit 920 may include a linear moving module including a linear moving block, a guide rail for guiding the linear moving block, and a linear driving device for driving the linear moving block. Linear moving module can be composed of a multi-layer (two-stage stroke, three-stage stroke, etc.), such as two layers, three layers so as to increase the moving section while having an installation space.

Meanwhile, the wafer ring magazine unit 920 may be configured in a variety of configurations in which a plurality of wafer rings 10 are stacked.

The first transfer tool 510 includes a pickup head 511 for picking up the element 1 from the wafer ring 10 by vacuum pressure, as shown in FIGS. 8A to 8D; A rotary drive unit for reciprocating rotation between the pick-up head 511 between the withdrawal position for drawing the device 1 from the wafer ring 10 located at the loading position and the loading position of the device inspection unit 200 in a horizontal state with respect to the ground ( 512).

The first transfer tool 510 has the pick-up head 511 when the pick-up element 1 in the wafer ring 10 and the pick-up head 511 is placed in the stacking position of the device inspection unit 200 It may include a linear driving unit (not shown) to enable a linear movement in the direction of the device when loading.

The device transfer process between the loading unit and the device inspection unit 200 having the above configuration will be described below.

As shown in FIG. 5, the pickup part 910 of the wafer ring transfer part 900 maintains a horizontal state with respect to the ground, such as the wafer ring 10 loaded in the wafer ring magazine part 700. 920 approaches the wafer ring magazine 700.

As shown in FIG. 9, the pick-up part 910 approaching the wafer-ring magazine part 700 picks up the wafer ring 10 and moves from the wafer-ring magazine part 700 by the linear driving part 920. Reverse

Here, when the pick-up unit 910 approaching the wafer ring magazine unit 700 picks up the wafer ring 10 after the device pick-up, the wafer ring 10 is loaded in an empty position of the wafer ring magazine unit 700, and then the wafer is loaded. Pick up ring 10.

In addition, the wafer ring magazine unit 700 and the pickup unit 910 may be configured to be relatively movable up and down with each other so that the wafer ring 10 may be easily taken out and stacked in the wafer ring magazine unit 700.

Meanwhile, as the pickup unit 910 picks up the wafer ring 10 and retreats, the linear driver 920, the first rotary driver 940, and the second rotary driver 950 are sequentially or linearly driven. At least two or more of the first rotation driver 940 and the second rotation driver 950 may be simultaneously driven.

The pick-up unit 910 is finally wafered in a state as shown in FIGS. 10A and 10B by driving the linear driver 920, the first rotary driver 940, and the second rotary driver 950. Is passed to 800.

At this time, the wafer ring 10 is perpendicular to the ground so that the wafer ring 10 can be loaded on the wafer ring table 800 in a horizontal state with respect to the ground.

The wafer ring 10 transferred by the pickup unit 910 of the wafer ring transfer unit 900 is fixed to the grip unit 710 of the wafer ring table 800 and seated on the table unit 720.

After the wafer ring 10 is seated on the wafer ring table 800, the wafer ring 10 is transferred to the device inspection unit 200 by the first transfer tool 510. The reverse operation is finally delivered to the wafer ring magazine 700.

That is, after the device pick-up is completed, the wafer ring 10 is drawn out by the wafer ring transfer part 900 and then driven by the linear driver 920, the first rotary driver 940, and the second rotary driver 950. The ring magazine unit 700 is delivered.

Meanwhile, the wafer ring transfer unit 900 repeats the above-described operation to exchange the wafer ring 10 between the wafer ring magazine unit 700 and the wafer ring table 800.

When the wafer ring 10 is seated on the wafer ring table 800, the first transfer tool 510 picks up the device 1 from the wafer ring 10 and places the device seat 220 of the device inspection unit 200. To be delivered sequentially.

The device inspecting unit 200 is a configuration for inspecting the LED device 1, and can be configured in various ways, such as being rotated, and can be configured in various ways according to inspection items such as luminance and emission level. 2 and 4, the plurality of device seating parts 220 on which the LED devices 1 of the loading part are seated are disposed in the circumferential direction, and the device seating parts 220 may be mounted on the LED device 1 of the loading part. ) The loading position (P ₁ ) receiving the transmission, the inspection position (IP) for inspecting the LED elements 1 and the unloading position (P ₂ ) for delivering the LED elements 1 to the buffer unit 300 by an angle A turntable 210 for rotating step by step; It may be configured to include an inspection unit 240 is installed at the inspection position (IP) to inspect the LED element 1 seated on the element seating portion 220.

The turntable 210 rotates the plurality of device mounting parts 220 to pick up and load the LED elements 1 in the loading unit, and a loading position P ₁ , and an inspection position IP for inspecting the LED elements 1. And as a configuration for moving to the unloading position (P ₂ ) for transferring the LED elements 1 to the buffer unit 300, various configurations are possible, as shown in Figures 1, 2 and 4, Element mounting parts 220 are arranged at regular intervals in the circumferential direction, and therein may be a table in which a flow path for connecting a pressure hole 221 of each device seating part 220 and a pressure control device (not shown) is formed. Can be.

The turntable 210 may be installed in various forms, such as configured to allow the rotation of the predetermined angle again after the rotation of the predetermined angle to facilitate the seating, withdrawal, and inspection of the LED element 1. As it is, it can be rotated by the rotary device 212 installed on the upper side in a supported state.

Here, when the device inspection unit 200, that is, the turntable 210 is supported and rotated upward, the turntable 210 may overlap with at least one of the wafer ring 10 and the buffer plate 310 downward.

As described above, when the device inspection unit 200, that is, the turntable 210 overlaps the wafer ring 10 and the buffer plate 310, the movement of the first transfer tool 510 and the second transfer tool 520 is performed. In addition to reducing the distance, the processing speed can be increased, and the installation area occupied by the device can be reduced, thereby minimizing the cost for the installation of the device.

The device seating unit 220 is a configuration in which the LED element 1 is seated so as to be inspected at an inspection position IP to be described later, and may have a configuration corresponding to the structure of the LED element 1.

On the other hand, the device seating portion 220 may be disposed in one or more, as shown in Figures 1 and 4, it may be disposed at a predetermined interval in the circumferential direction with respect to the rotation center of the turntable 210.

In particular, the device seating unit 220 is circulated to the loading position (P ₁ ), the inspection position (IP), the unloading position (P ₂ ), the loading position (P ₁ ) by the rotation of the turntable (210).

At this time, the loading position (P ₁ ), the inspection position (IP), the unloading position (P ₂ ) can be arranged in various ways on the basis of the rotation center of the turntable 210, each module, that is, loading unit, element inspection unit ( The loading position P ₁ and the unloading position P ₂ are opposed to each other on the basis of the rotation center of the turntable 210 so as to be disposed in a straight line up to the 200 and the buffer unit 300, and further, the unloading unit 400. Preferably arranged.

On the other hand, the turntable 210 is rejected to remove the LED element 1, which is determined to be unsuccessful or defective by the second transfer tool 520 after the element seating part 220 passes through the unloading position P ₂ . Position (RP), the cleaning position (CP) for removing foreign matter on the device mounting portion 220 may be added.

Here, the LED element 1 at the reject position RP may be removed by operation of a pressure control device described later, and at the cleaning position CP, the surface may be removed to remove contaminants on the surface of the device seat 220. A roller or the like having an adhesive property may be installed on the upper side of the turntable 210 to be in contact with the upper surface of the element seating part 220.

The number of device seating portions 220 is appropriately selected such as 8, 16, etc. according to the processing speed of the LED element handler according to the present invention.

Meanwhile, the device seat 220 includes a pressure hole 221 for seating or withdrawing LED elements, and the turntable 210 forms a vacuum pressure or supplies air to the pressure hole 221 to form a positive pressure. A pressure control device for controlling the back pressure may be installed.

Here, the vacuum pressure and the positive pressure delivered to the turntable 210 are rotatable and air for supplying a vacuum pressure generator (not shown) and air by means of a rotary joint (not shown) having a plurality of ports installed therein to transmit air pressure. A supply device (not shown) is connected primarily and the ports of the rotary joint are connected to the pressure control device.

The number of ports of the rotary joint may be the same as the number of device seating parts 220, and the pressure control device may be installed to be the same as the number of device seating parts 220.

The pressure control device is configured to control the vacuum pressure and the positive pressure by the vacuum pressure and the static pressure according to each working position, and the unloading position starting from when the LED element 1 is seated in the loading position P ₁ . Vacuum pressure is formed in the pressure hole 221 so as to maintain the seated state of the LED element 1 until it reaches (P ₂ ), the LED element 1 reaches the unloading position (P ₂ ) to the second The transfer tool 520 is configured to supply air to the pressure hole 221 to form a positive pressure when picking up.

On the other hand, between the loading position (P ₁ ) and the inspection position (IP), between the inspection position (IP) and the unloading position (P ₂ ) as the alignment position (AP ₁ , AP ₂ ), seated on the device seating portion 220 An element aligning unit 600 for aligning the LED elements 1 may be additionally installed.

In addition, the seating state of the device seating unit 220 of the LED device 1 is analyzed, and the photographed image is analyzed, and the alignment position of the device alignment unit 600 to align the LED device 1 according to the analysis result. Cameras 253 and 254 may be installed at positions corresponding to AP ₁ and AP ₂ .

The inspection unit 240 is a configuration for inspecting the light emission characteristics of the LED element 1, and can be variously configured according to the inspection object. For example, the inspection unit 240 emits light by applying power to the LED element 1 and emits light. It may be configured to check the light intensity, such as light intensity, luminance, and the like.

The buffer unit 300 receives the LED element 1 from the device inspecting unit 200 and temporarily loads the LED element 1 while unloading the unloading unit 400 to classify the LED element 1 according to a test result. As the configuration for transmitting the LED element 1 to the unit 400, various configurations are possible depending on the design and design.

Here, the buffer unit 300 is a configuration for temporarily loading an element so that the sorting in the unloading unit 400 to be described later is smoothly performed. In the case of loading without sorting, the configuration may be omitted.

As an example of the buffer unit 300, as shown in FIGS. 1 and 11, the buffer plate loading unit 320, the device loading table 340, the device unloading table 350, and the device loading table 340. Plate transfer table 360 for transferring the buffer plate 310 from the device unloading table 350 to the plate transfer table 360 via the element loading table 340 from the buffer plate loading unit 320. And a buffer plate transfer unit 370 for transferring the buffer plate 310 to the buffer plate loading unit 320 via the device transfer table 350 from the plate transfer table 360. .

The buffer plate loading unit 320 may have various configurations in which the buffer plates 310 are loaded so that the LED elements 1 may continuously load the buffer plates 310 to be loaded.

The device loading table 340 is configured to move the buffer plate 310 by receiving the buffer plate 310 from the buffer plate loading unit 320 so as to load the LED elements 1 on the buffer plate 310. Various configurations are possible.

The device unloading table 350 receives the buffer plate 310 from the device loading table 340 to transfer the LED elements 1 loaded on the buffer plate 310 to the unloading unit 400. Various configurations are possible with the configuration of moving 310.

The plate transfer table 360 may include a device loading table when the device loading table 340 and the device unloading table 350 are spaced apart from each other in a direction crossing the transfer direction of the buffer plate 310 by the buffer plate transfer unit 370. 340 and the device unloading table 350 may be installed to reciprocate along the first and second lines.

The buffer plate transfer unit 370 transfers the plate 310 from the buffer plate loading unit 320 to the plate transfer table 360 through the element loading table 340, and the element unloading table from the plate transfer table 360. Various configurations are possible as a configuration for transferring the plate 310 to the buffer plate loading part 320 via the 350.

The buffer plate transfer unit 370 may include, for example, a main shaft installed along the transport direction of the plate 310 and a plate transport tool for pulling or pushing the plate 310 while moving along the main axis.

On the other hand, the unloading unit 400 is a configuration for unloading the LED elements 1 into the sorting plate 40 according to the inspection result inspected by the element inspecting unit 200, and various configurations are possible.

Here, the classification grade given to the sorting plate 40 is a standard given according to the inspection result by the element inspecting unit 200. The LED element 1 may be classified according to the luminance grade according to the inspection result.

The sorting plate 40 is configured to be suitable for shipping, or has a different configuration from the wafer ring 10, such as having a specification suitable for the packaging process so as to perform a subsequent process such as packaging.

In particular, the sorting plate 40 is configured to be loaded with a relatively small number of LED elements 1 and the wafer ring 10, the shape is also configured to have a rectangle (plate used in the buffer unit 300) (310 is similar)).

Meanwhile, as shown in FIG. 12, the sorting plate 40 has an adhesive tape 41 similar to the wafer ring 10 described above, and a mark such as LOT number and classification grade while fixing the adhesive tape 41. It may be configured to include a support member (42).

As an example, as shown in FIGS. 1, 13A, and 13B, the unloading unit 400 receives the LED element 1 from the buffer unit 300 by the third transfer tool 530 and is classified. A sorting table 420 for moving the sorting plate 40 in the XY direction and further in the XY-θ direction so as to be loaded at an appropriate loading position P ₅ of the sorting plate 40 in correspondence thereto; The sorting plate buffer loading unit 80 to which the sorting plate 40 on which the LED elements 1 of the sorting table 420 are stacked is transferred, and the sorting of the LED elements 1 in the sorting table 420 according to the classification level. A sorting plate stacking unit 70 on which the plate 40 is loaded and the sorting plate 40 on which the LED elements 1 of the sorting plate buffer stacking unit 80 are loaded is loaded; It may be configured to include a sorting plate transfer unit 460 for transferring the sorting plate 40 between the sorting plate loading unit 70, the sorting table 420 and the sorting plate buffer loading unit 80.

The sorting plate loading unit 70 may provide a sorting plate 40 for each classification level, and may load a plurality of sorting plates 40 so that the sorting plate 40 loaded with the LED elements 1 may be loaded. , While moving along the up and down direction, it may be made of a cassette structure that can be provided, stacked sorting plate (40).

The sorting plate transfer unit 460 is configured to transfer the sorting plate 40 between the sorting plate stacking unit 70, the sorting table 420, and the sorting plate buffer stacking unit 80.

On the other hand, the unloading unit 400 may be configured to load the LED element 1 into the lead frame, which is a die bonding process, for the packaging process instead of the sorting plate 40, and then other members after the inspection of the LED element 1. Any configuration can be used as long as the LED element 1 is mounted on the structure.

The first to third transfer tools 510, 520, and 530 are respectively located between the loading unit and the device inspecting unit 200, between the device inspecting unit 200 and the buffer unit 300, the buffer unit 300 and the unloading unit. Various configurations are possible as configurations for transferring one or more LED elements 1 between the 400.

The first to the third transfer tool (510, 520, 530) is a configuration for transporting one or more LED elements 1, various configurations are possible, and a plurality of rotary arms to pick up the LED element (1) It can be configured to include a rotary drive device for rotating the rotary arms so that the rotary arms convey the LED elements (1).

In particular, the rotary arms may be arranged to have a constant angle, and the rotary driving device may be configured to rotate the rotary arms only in one direction or to reciprocally rotate the predetermined angle.

In addition, the first to third transfer tools 510, 520, and 530 may be configured as swing arms that reciprocate only at a predetermined angle.

On the other hand, the loading unit, the device inspection unit 200, the buffer unit 300 and the unloading unit 400 may be variously arranged, it is preferably arranged in a straight line.

In addition, in the LED element handler, the pressure control device for forming a vacuum pressure and the air supply device for supplying air may be individually connected to each component, or may be connected by one pressure control device and an air supply device.

Meanwhile, the transfer tools 510, 520, and 530 are provided with a linear driving device and a rotary moving device for driving the linear movement and the rotation movement since the linear movement and the rotation movement are required for the transfer of the device 1.

However, the linear driving device and the rotary moving device have a problem of increasing the self-weight of the transfer tools 510, 520, 530 and causing vibration during linear movement and rotational movement due to the increased self-weight, thereby adversely affecting the apparatus.

8A and 8D are conceptual views illustrating a configuration and an operation process of a first transfer tool in the LED device handler of FIG. 1, and FIGS. 14A and 14B are conceptual views illustrating a configuration and an operation process of a modification of the first transfer tool of FIG. 8A. 15A and 15B are conceptual views illustrating the configuration of the second transfer tool and the second transfer tool of the LED element handler of FIG. 1. The above drawings are given the same reference numerals for components having the same function, and parts of the drawings are exaggerated for convenience of description.

Hereinafter, a transfer tool that may be applied to the first to third transfer tools 510, 520, and 530 will be described in detail. Here, the overall configuration of the transfer tool has been appropriately referred to FIGS. 8A to 8D and FIGS. 14A to 15B.

At least one of the transfer tools 510, 520, 530 is one or more pickup heads for picking up the element 1, as shown in FIGS. 8A-8D, 14A-14B, 15A-15B. 610; A rotation driving unit 620 for rotating the pickup head 610; It may be configured to include a linear driving unit 630 for linearly driving the pickup head 610 located at the device pickup position toward the device (1). Here, the pickup head 610 is installed to enable a linear movement to the support portion 650 coupled to the rotary drive unit 620.

The pickup head 610 may be configured to pick up the device 1, and may be configured in various ways. The pickup head 610 may be connected to a pneumatic connection line (not shown) so as to be adsorbed by vacuum pressure, and at the end thereof, an impact upon contact with the device 1 may be obtained. A shock absorbing member may be additionally installed to prevent the damage.

In particular, the pickup head 610 is linearly driven parallel to the axis of rotation 621 of the rotary drive unit 620, as shown in Figures 8a to 8d, 14a to 14b, or shown in Figures 15a to 15b As described above, the linear drive may be linearly performed in the radial direction of the rotation shaft 621 of the rotation driving unit 620.

The rotation driving unit 620 may be configured to rotate the pickup head 610 in various configurations such as a rotating motor.

The support part 650 is coupled to the rotation shaft 621 of the rotation driving part 620 and coupled with one or more pickup heads 610 to rotate the pickup head 610 is possible in various configurations.

The support part 650 may be configured in various ways according to the coupling mode of the pickup head 610, and various configurations are possible as shown in FIGS. 8A to 8D and FIGS. 14A to 15B.

The support part 650 may be configured in various ways, and as illustrated in FIGS. 2 and 15A, the support part 650 is coupled to the rotation shaft 621 of the rotation driving part 620 and includes a plurality of pivot arms to which the pickup head 610 is coupled. can do.

Meanwhile, the support part 650 includes a body part 661 fixedly coupled to the support part 650; It includes a cylinder portion 662 coupled to the body portion 661 so as to allow a linear movement, one end is coupled to the pickup head 610 and the other end is coupled to the drive member 631 of the linear drive portion 630 and linearly moved. The linear guide part 660 may be additionally installed.

In this case, as shown in FIGS. 15A and 15B, the body part 661 includes a guide hole 663 into which the cylinder part 662 is inserted, and the flange part 664 coupled to the support part 650 is formed on the outside thereof. It is formed, the cylinder portion 662 has a rectangular pillar shape of at least a portion of the portion inserted into the guide hole 663 has a rectangular cross-section, between the other end of the cylinder portion 662 and the body portion 661 Coil spring 665 may be installed. The pickup head 610 may be directly coupled to the body portion 661 or may be coupled by a coupling member 666.

In addition, one or more roller bearings (not shown) may be additionally installed between the inner circumferential surface of the guide hole 663 and the outer circumferential surface of the cylinder portion 662 for smooth linear movement of the cylinder portion 662.

When the linear guide part 660 is configured as described above, there is an advantage of preventing movement in the linear movement direction and the vertical direction.

On the other hand, the linear drive unit 630 is a configuration for linearly driving the pickup head 610, a variety of configurations are possible, the drive member 631 is in surface contact with the other end of the cylinder portion (662); It may be configured to include a drive unit 632 for linearly moving the drive member 631.

In addition, the driving member 631 may include a roller member that is rotated about a rotation axis parallel to the rotation axis 621 of the pickup head 610 for smooth movement of the pickup head 610.

When the roller member is installed, the other end of the cylinder portion 662 which is in surface contact with the roller member may move smoothly.

On the other hand, if more than necessary pressure is applied between the driving member 631 and the body portion 661, that is, the pickup head 610, the element 1 may be damaged, and thus, the pressure may be less than or equal to a preset pressing force. A pressing unit 670 for pressing the furnace body portion 661 may be additionally installed on the support 650.

The pressurizing portion 670 moves the pickup head 610 in the opposite direction to the element 1 when more than necessary pressure is applied when the pickup head 610 approaches the element 1 and contacts the element 1. By making it possible, the damage of the element 1 is prevented.

The pressing unit 670 may have any configuration as long as the pressing unit 670 can press the body 661 below a predetermined pressing force.

As an example of the pressing unit 670, a linear driving motor such as a voice coil motor (VCM) may be included. The VCM can effectively control the pressing unit 670 by generating a pressing force for pressing the body part 661 in proportion to the applied voltage.

On the other hand, the pressurizing unit 670 is required to apply power, and the rotary terminal unit 671 rotated together with the pressing unit 670 to supply power to the pressing unit 670, and is fixedly installed to connect power from the outside. A fixed terminal portion 672 and a slip ring 673 may be provided to electrically connect the rotary terminal portion 671 and the fixed terminal portion 672.

The rotation terminal part 671 is supported and installed on the first support member 674 installed and supported by the support part 650, the pressing part 670, and the fixed terminal part 672 is a bracket for supporting the rotation driving part 630. It may be supported and installed on the back.

On the other hand, the configuration of the transfer tool as described above can be applied to the configuration of the turntable 200 including the device seating portion 220 which is received by the first transfer tool 510 to pick up the device (1).

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: loading unit 200: device inspection unit
300: buffer unit 310: buffer plate
400: unloading part
700: wafer ring table 800: wafer ring magazine portion
900: wafer ring transfer part

Claims (19)

At least one of the device inspection for the device, the device classification to classify the device according to the test result, and at least one transfer tool for picking up the device at the device pickup position and loading the device at the device loading position by rotation As a device handler,
The transfer tool,
One or more pickup heads for picking up elements from a wafer or plate on which a plurality of elements are loaded; A rotation driving unit for rotating the pickup head; It includes a linear driving unit for linearly driving the pickup head located in the device pickup position toward the device,
The pickup head is characterized in that the element handler is installed to enable a linear movement to the support coupled to the rotational drive. The method according to claim 1,
The support portion includes a body portion fixedly coupled to the support portion; And a linear guide part including a cylinder part coupled to the body part so as to be linearly movable, one end of which is coupled to the pickup head, and the other end of which is coupled to the driving member of the linear driving part and linearly moved. The method according to claim 2,
The body portion is formed with a guide hole into which the cylinder portion is inserted, the flange portion coupled to the support portion is formed on the outside,
The cylinder portion has a rectangular pillar shape at least a part of the portion inserted into the guide hole has a rectangular cross section,
A device handler, characterized in that a coil spring is installed between the other end of the cylinder portion and the body portion. The method according to claim 3,
The linear drive unit
The driving member in surface contact with the other end of the cylinder portion;
And a driving unit for linearly moving the driving member. The method of claim 4,
The driving member is a device handler, characterized in that it comprises a roller member rotated about a rotation axis parallel to the rotation axis of the pickup head. The method of claim 4,
A device handler, characterized in that the pressing portion for pressing the body portion below the predetermined pressing force between the drive member and the pickup head is further provided in the support portion. The method of claim 6,
The pressing unit is a device handler, characterized in that the linear drive motor. The method of claim 7,
The pressing unit is a device handler, characterized in that the VCM. The method according to claim 8,
Rotating terminal portion rotated together with the pressing portion to supply power to the pressing portion, a fixed terminal portion is fixedly installed to connect power from the outside, and a slip ring for electrically connecting the rotating terminal portion and the fixed terminal portion is installed. Element handler. The method according to claim 1,
The support portion is a device handler, characterized in that coupled to the rotary shaft of the rotary drive portion and the pickup head is coupled to the plurality of pivot arms. The method according to claim 1,
The pickup head is a device handler, characterized in that the linear drive parallel to the axis of rotation of the rotary drive unit. The method according to claim 1,
The pickup head is a device handler, characterized in that the linear drive in the radial direction of the rotation axis of the rotary drive unit. The method according to any one of claims 1 to 12,
A loading unit loading the wafer ring on which the LED elements are loaded; An element inspection unit receiving and inspecting the LED elements of the loading unit; A buffer unit including a buffer plate on which the LED elements inspected by the device inspecting unit are loaded; An unloading unit which classifies and unloads the LED elements loaded on the buffer plate into respective sorting plates according to the inspection result of the device inspection unit; A first transfer tool for picking up and transferring the LED elements between the loading portion and the element inspection portion; A second transfer tool for picking up and transferring the LED elements between the device inspecting unit and the buffer unit; And a third transfer tool for picking up and transferring the LED elements between the buffer unit and the unloading unit.
And at least one of the first transfer tool and the third transfer tool is the transfer tool. The method according to claim 13,
The loading unit is disposed adjacent to the device inspection unit so as to transfer the device to the device inspection unit, and a wafer ring table in which the wafer ring is vertically loaded with respect to the ground; And a wafer ring transfer portion for extracting a wafer ring from the wafer ring magazine portion loaded in a horizontal state with respect to the ground and transferring the wafer ring to the wafer ring table. The method according to claim 14,
The device inspection unit
And a turntable comprising the transfer tool. The method according to any one of claims 1 to 12,
A loading unit loading the wafer ring on which the LED elements are loaded; An element inspection unit receiving and inspecting the LED elements of the loading unit; An unloading unit which unloads the LED elements inspected by the device inspecting unit; A first transfer tool for picking up and transferring the LED elements between the loading portion and the element inspection portion; A second transfer tool configured to pick up and transfer the LED elements between the device inspection unit and the unloading unit,
And at least one of the first transfer tool and the second transfer tool is the transfer tool. 18. The method of claim 16,
The loading unit is disposed adjacent to the device inspection unit so as to transfer the device to the device inspection unit, and a wafer ring table in which the wafer ring is vertically loaded with respect to the ground; And a wafer ring transfer portion for extracting a wafer ring from the wafer ring magazine portion loaded in a horizontal state with respect to the ground and transferring the wafer ring to the wafer ring table. The method according to any one of claims 1 to 12,
And the device handler inspects an LED device and classifies the device according to the test result. The method according to any one of claims 1 to 12,
The device handler is a device handler, characterized in that to classify the LED elements in accordance with the inspection results in advance.

Images