KR20120106491A - Apparatus for handling device and device transferring method - Google Patents

Abstract

PURPOSE: A device handler and a device transferring method are provided to regularly load a plate regardless of an arrangement state by analyzing a device arrangement image and correcting a loaded plate. CONSTITUTION: A transfer tool(520,530) includes a pickup head(610) and a rotational driving unit(620). The pickup head places LED devices from a first loading member to a second loading member by picking up the LED devices. The rotational driving unit rotates the pickup head. An image obtaining unit(630) is installed on a moving path of the pickup head and obtains an image about the picked up LED device. A loading position is corrected in the second loading member of the device by calculating the arrangement state of the device from the obtained image. [Reference numerals] (AA) ΔX,ΔY,ΔΘ calculation; (BB) ΔX,ΔY,ΔΘ correction

Description

Device handler and device transferring method {Apparatus for handling device and device transferring method}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device handler, and more particularly, to a device for inspecting a device, a device handler such as a sorter sorted according to a test result, and a device transport method for the device handler.

LED Light Emitting Diode Device (LED) is a type of p-n junction diode, which is a semiconductor device using electroluminescence, which is a phenomenon in which monochromatic light is emitted when voltage is applied in the forward direction. That is, when the forward voltage is applied, electrons in the n-layer and holes in the p-layer are coupled to emit energy corresponding to the height difference (energy gap) between the conduction band and the valance band. Energy is emitted mainly in the form of heat or light, and when emitted in the form of light, becomes an LED element.

The above-described LED device is formed as an individual chip by forming electrodes on a wafer using semiconductor processes and then cutting the wafer. In addition, the LED devices manufactured as individual chips are shipped to manufacturers who carry out subsequent processes such as packaging in a chip state, are shipped to the market through packaging processes such as connection with leads, molding processes, or further through module processes.

On the other hand, if the subsequent processes such as the packaging process or the module process are performed despite the defects of the device itself and the defective devices such as the under-standard, there is a problem that the unnecessary process is performed and the overall productivity and profitability are lowered.

In addition, LED devices may be classified according to the emitted light characteristics by inspecting them in a chip state by an LED device handler such as an LED inspection device, which may cause variations such as light emission characteristics depending on a position when performing a semiconductor process in a wafer state. There is a need.

Therefore, it is necessary to perform a subsequent process only on the elements of good products by checking the defects or the light emission characteristics before performing each process, or to improve the productivity and profitability by classifying them in advance according to the light emission characteristics.

On the other hand, the LED element handler as described above picks up the element from the wafer ring, plate, etc. to place the element on another plate.

In the pick-up and place process of the device as described above, the alignment state of the device is constantly placed by recognizing the alignment state of the device before pick-up, and then aligning the plate in place of the device according to the alignment state of the device.

However, the alignment of the device may be changed by the pickup. However, the conventional LED device handler does not reflect the change of the alignment state after the pickup, so that the alignment state of the device is not uniform, which affects subsequent processes.

In particular, when the arrangement of the devices on the plate is uneven, the time and control for the device alignment is excessively taken before the device pickup, thereby degrading the performance of the LED device handler.

SUMMARY OF THE INVENTION An object of the present invention is to provide a device handler and a device transfer method in which the alignment state is good despite the change of the device alignment state after pick-up and place of the device by recognizing the necessity and problems described above.

The present invention was created in order to achieve the object of the present invention as described above, the present invention is a device handler for performing at least one of the device inspection for the device, the device classification to classify the device according to the test results, the device The handler includes one or more pickup heads for picking up the element to pick up the element from the first loading member on which the elements are loaded and to place the element onto the second loading member on which the elements are loaded, and a rotational drive for rotating the pickup head. A transfer tool; An image acquisition unit installed on a movement path of the pickup head to acquire an image of an element picked up by the pickup head, wherein the image acquisition unit is provided from the image acquired by the image acquisition unit when the element is placed by the pickup head. Disclosed is a device handler, characterized in that a stacking position of a second stacking member loaded on a device is corrected by calculating an alignment state of the device picked up in the pickup head.

The second loading member may be mounted on the X-Y-θ table, and the second loading member may be corrected by the X-Y-θ table.

The pickup head may be arranged in plural along the direction of rotation thereof.

The plurality of pickup heads may be arranged at the same angle along the rotation direction thereof.

Both the first loading member and the second loading member may maintain a horizontal state with respect to the ground, or the first loading member may maintain a vertical state with respect to the ground, and the second loading member may maintain a horizontal state with respect to the ground. .

The device may be an LED device, and the device handler may be configured to inspect the LED device and classify it according to the test result, or classify the LED device according to the test result that has been inspected in advance.

The present invention also provides an element transfer method of an element handler which performs at least one of element inspection for the element and element classification for classifying the element according to the inspection result. A movement step of picking up and moving the element to the second loading member on which the elements are loaded; The moving step Acquires an image of the element picked up in the pickup head, and calculates the alignment state of the element picked up in the pickup head from the image obtained by the image acquisition unit to load the second loading member loaded on the element A correction step of correcting the position; Disclosed is an element transfer method comprising an element loading step of loading an element picked up by the pickup head onto the second loading member.

The device handler and the device transfer method according to the present invention pick up by picking up the device by picking up the device and picking up the device after the pickup head picks up the device and analyzing the alignment of the picked up device. Depending on the state, even though the arrangement of the device changes, it can be loaded on the plate regularly.

Particularly, in the related art, there is a problem in that a device loading state on a plate is poor because a correction is not made in a device alignment state after pick-up, thereby affecting malfunctions, etc. in a subsequent process, but the present invention regularly arranges devices on a plate. By aligning, there is an advantage in that the process of transferring and loading devices such as an LED element is accurate and quick, thereby facilitating subsequent processes.

1 is a plan view showing a schematic configuration of a device handler according to the present invention.
FIG. 2 is a schematic side view of the device handler of FIG. 1.
3A and 3B illustrate an example of wafer ring used in the device handler of FIG. 1.
4 is a plan view illustrating a configuration of a turntable of the device inspecting unit of the device handler of FIG. 1.
FIG. 5 is a conceptual view illustrating a wafer ring magazine unit, a wafer ring transfer unit, and a wafer ring table of the device handler of FIG. 1.
6 is a perspective view illustrating a wafering table of the device handler of FIG. 1.
7 is a perspective view illustrating a wafer ring transfer unit of the device handler of FIG. 1.
8A and 8B are conceptual views illustrating an operation process of the first transfer tool in the device handler of FIG. 1.
FIG. 9 is a conceptual view illustrating a state in which a wafer ring transfer unit of the device handler of FIG. 1 pulls out or pulls in a wafer ring from a wafer ring magazine unit.
10A and 10B are conceptual views illustrating a process in which a wafer ring transfer unit of the device handler of FIG. 1 draws or draws a wafer ring from a wafer ring table.
FIG. 11 is a view illustrating a schematic configuration and an operating state of a buffer unit of the device handler of FIG. 1.
FIG. 12 is a view illustrating an example of a sorting plate used in the unloading part of the device handler of FIG. 1.
13A and 13B are views illustrating a schematic configuration and an operating state of an unloading part of the device handler of FIG. 1.
14 is a conceptual diagram illustrating an example of a transfer tool in the device handler of FIG. 1.

Hereinafter, a device handler according to the present invention will be described in detail with reference to the accompanying drawings.

Device handlers according to an embodiment of the present invention, as shown in Figure 1 and 2, the loading unit for loading the wafer ring 10 loaded with the LED elements (1); An element inspection unit 200 receiving and inspecting at least one LED element 1 of the loading unit; A buffer unit 300 including a buffer plate 310 on which the LED elements 1 inspected by the device inspection unit 200 are loaded; An unloading unit 400 for classifying and unloading the LED elements 1 loaded on the buffer plate 310 into the sorting plates 40 according to the test result of the device inspecting unit 200; The first transfer tool 510 for picking up and transferring the LED elements 1 between the loading unit and the device inspecting unit 200, and the LED elements 1 between the device inspecting unit 200 and the unloading unit 400. A second transfer tool 520 for picking up and transferring; And a third transfer tool 530 that picks up and transfers the LED elements 1 between the buffer unit 300 and the unloading unit 400.

The LED element 1 inspected by the device handler may be a chip state element cut by a sawing process after the semiconductor process and the electrode forming process so as to perform the LED function in the wafer state.

After the LED device 1 inspected by the device handler is inspected and classified, the LED device 1 is shipped in a chip state, or is shipped to the market through a subsequent process such as a packaging process or a module process.

The loading unit receives one or more wafer rings 10 from the outside and transfers the LED elements 1 loaded on each wafer ring 10 to the device inspection unit 200, and various configurations are possible. The plurality of LED elements 1 are configured to be loaded by the bonded wafer ring 10 so that the 200 can inspect the LED element 1.

The wafer ring 10 is a structure for transferring the attached LED elements 1 cut into individual chips in a wafer state, and various configurations are possible. As shown in FIGS. 3A and 3B, each element An adhesive tape 11 having adhesiveness to a surface so that the cut wafer is attached to an upper surface thereof; The adhesive tape 11 is deformed in the outer diameter direction by applying tension in the outer diameter direction to the first coupling ring 12 to which the adhesive tape 11 is coupled and the adhesive tape 11 coupled to the first coupling ring 12. It can be configured to include a second coupling ring 13 to finely space each LED element (1).

1 and 5, the loading unit is installed adjacent to the device inspection unit 200 to deliver the device 1 to the device inspection unit 200, and the wafer ring 10 is perpendicular to the ground. A wafer ring table 700 loaded; Wafer ring transfer unit 900 for extracting the wafer ring 10 from the wafer ring magazine portion 800 loaded with a plurality of wafer rings 10 in a horizontal state with respect to the ground and transferring the wafer ring 10 to the wafer ring table 700. It is configured to include.

As shown in FIG. 6, the wafer ring table 700 transfers the device 1 to the device inspection unit 200 described later after the wafer ring 10 is vertically loaded with respect to the ground. A configuration for moving the wafer ring 10 in the YZ direction, and further YZ−, to move the relative position P ₀ of the LED element 1 with respect to the first transfer tool 510 so as to be picked up by 510. Any configuration can be used as long as it can be handled by moving in the? direction.

For example, the wafer ring table 700 includes a table portion 720 provided with a grip portion 710 for gripping the wafer ring 10; The table driving unit 730 may include a table driving unit 730 linearly driven in two axial directions.

The table portion 720 may be configured to move relative to the first transfer tool 510 in the Y-Z direction, and furthermore, the Y-Z-θ direction while the wafer ring 10 is fixed.

At this time, the lower side of the table portion 720 may be further provided with a pressing pin 180 to move upward to facilitate the pickup of the LED element 1 to press the adhesive tape 11 of the wafer ring 10. .

The grip part 710 is configured to maintain the wafer ring 10 fixed to the table part 720. Various configurations are possible, and the grip part 710 may be configured in one or more pairs for stable support of the wafer ring 10. Do.

The table driving unit 730 may be any configuration as long as the table driving unit 720 can be linearly driven, and may be configured by a screw jack.

The table driving unit 730 may further include a θ driving unit 723 for rotating the table unit 720 about a rotation axis (X axis) perpendicular to the upper surface of the table unit 720.

As shown in FIG. 6, the θ driving part 723 is provided with a rotating device 723a installed adjacent to the table part 720, a pulley (not shown) installed in the rotating device 723a, and a circular table part 720. Any configuration may be used as long as the table 720 is rotatable, for example, a driving belt 723b connecting the outer circumferential surface of the panel.

The wafer ring transfer unit 900 is configured to deliver the wafer ring 10 in a vertical state to the wafer ring table 700 by drawing the wafer ring 10 from the wafer ring magazine unit 800 loaded in a horizontal state. Any configuration is possible as well.

The wafer ring transfer part 900 includes a pickup part 910 for picking up the wafer ring 10 as shown in FIGS. 5 and 7; A linear driving unit 920 for linearly moving the pickup unit 910; A first rotation driving part 940 for rotating the pickup part 910 about a first rotation axis R ₁ having a Z axis direction perpendicular to the ground; A first rotational drive 940 is a second rotary shaft rotatably supported by the first rotation axis (R ₁₎ center can be set up and the pickup rotation 910 to a, and forming a first rotation axis (R ₁₎ and vertical (R a It may include a second rotary drive unit 950 for rotating around ₂ ).

The pick-up unit 910 transfers the wafer ring 10 loaded on the wafer ring magazine unit 800 to the wafer ring table 700, or withdraws the wafer ring 10 from the wafer ring table 700. Any configuration can be used as long as it can pick up the wafer ring 10 for delivery to the magazine unit 800.

The linear driving unit 920 linearly moves the pickup unit 910 so that the pickup unit 910 may move to the wafer ring magazine unit 800 or the wafer ring table 700 to pick up or load the wafer ring 10. Various configurations are possible as the configuration to make.

In particular, as shown in FIG. 7, the linear driving unit 920 may include a linear moving module including a linear moving block, a guide rail for guiding the linear moving block, and a linear driving device for driving the linear moving block. Linear moving module can be composed of a multi-layer (two-stage stroke, three-stage stroke, etc.), such as two layers, three layers so as to increase the moving section while having an installation space.

Meanwhile, the wafer ring magazine unit 920 may be configured in a variety of configurations in which a plurality of wafer rings 10 are stacked.

The first transfer tool 510 includes a pickup head 511 for picking up the element 1 from the wafer ring 10 by vacuum pressure, as shown in FIGS. 8A and 8B; A rotary drive unit for reciprocating rotation between the pick-up head 511 between the withdrawal position for drawing the device 1 from the wafer ring 10 located at the loading position and the loading position of the device inspection unit 200 in a horizontal state with respect to the ground ( 512).

The first transfer tool 510 has the pick-up head 511 when the pick-up element 1 in the wafer ring 10 and the pick-up head 511 is placed in the stacking position of the device inspection unit 200 It may include a linear driving unit (not shown) to enable a linear movement in the direction of the device when loading.

The device transfer process between the loading unit and the device inspection unit 200 having the above configuration will be described below.

As shown in FIG. 5, the pickup part 910 of the wafer ring transfer part 900 maintains a horizontal state with respect to the ground, such as the wafer ring 10 loaded in the wafer ring magazine part 700. 920 approaches the wafer ring magazine 700.

As shown in FIG. 9, the pick-up part 910 approaching the wafer-ring magazine part 700 picks up the wafer ring 10 and moves from the wafer-ring magazine part 700 by the linear driving part 920. Reverse

Here, when the pick-up unit 910 approaching the wafer ring magazine unit 700 picks up the wafer ring 10 after the device pick-up, the wafer ring 10 is loaded in an empty position of the wafer ring magazine unit 700, and then the wafer is loaded. Pick up ring 10.

In addition, the wafer ring magazine unit 700 and the pickup unit 910 may be configured to be relatively movable up and down with each other so that the wafer ring 10 may be easily taken out and stacked in the wafer ring magazine unit 700.

Meanwhile, as the pickup unit 910 picks up the wafer ring 10 and retreats, the linear driver 920, the first rotary driver 940, and the second rotary driver 950 are sequentially or linearly driven. At least two or more of the first rotation driver 940 and the second rotation driver 950 may be simultaneously driven.

The pick-up unit 910 is finally wafered in a state as shown in FIGS. 10A and 10B by driving the linear driver 920, the first rotary driver 940, and the second rotary driver 950. Is passed to 800.

At this time, the wafer ring 10 is perpendicular to the ground so that the wafer ring 10 can be loaded on the wafer ring table 800 in a horizontal state with respect to the ground.

The wafer ring 10 transferred by the pickup unit 910 of the wafer ring transfer unit 900 is fixed to the grip unit 710 of the wafer ring table 800 and seated on the table unit 720.

After the wafer ring 10 is seated on the wafer ring table 800, the wafer ring 10 is transferred to the device inspection unit 200 by the first transfer tool 510. The reverse operation is finally delivered to the wafer ring magazine 700.

That is, after the device pick-up is completed, the wafer ring 10 is drawn out by the wafer ring transfer part 900 and then driven by the linear driver 920, the first rotary driver 940, and the second rotary driver 950. The ring magazine unit 700 is delivered.

Meanwhile, the wafer ring transfer unit 900 repeats the above-described operation to exchange the wafer ring 10 between the wafer ring magazine unit 700 and the wafer ring table 800.

When the wafer ring 10 is seated on the wafer ring table 800, the first transfer tool 510 picks up the device 1 from the wafer ring 10 and places the device seat 220 of the device inspection unit 200. To be delivered sequentially.

The device inspecting unit 200 is a configuration for inspecting the LED device 1, and can be configured in various ways, such as being rotated, and can be configured in various ways according to inspection items such as luminance and emission level. 2 and 4, the plurality of device seating parts 220 on which the LED devices 1 of the loading part are seated are disposed in the circumferential direction, and the device seating parts 220 may be mounted on the LED device 1 of the loading part. ) The loading position (P ₁ ) receiving the transmission, the inspection position (IP) for inspecting the LED elements 1 and the unloading position (P ₂ ) for delivering the LED elements 1 to the buffer unit 300 by an angle A turntable 210 for rotating step by step; It may be configured to include an inspection unit 240 is installed at the inspection position (IP) to inspect the LED element 1 seated on the element seating portion 220.

The turntable 210 rotates the plurality of device mounting parts 220 to pick up and load the LED elements 1 in the loading unit, and a loading position P ₁ , and an inspection position IP for inspecting the LED elements 1. And as a configuration for moving to the unloading position (P ₂ ) for transferring the LED elements 1 to the buffer unit 300, various configurations are possible, as shown in Figures 1, 2 and 4, Element mounting parts 220 are arranged at regular intervals in the circumferential direction, and therein may be a table in which a flow path for connecting a pressure hole 221 of each device seating part 220 and a pressure control device (not shown) is formed. Can be.

The turntable 210 may be installed in various forms, such as configured to allow the rotation of the predetermined angle again after the rotation of the predetermined angle to facilitate the seating, withdrawal, and inspection of the LED element 1. As it is, it can be rotated by the rotary device 212 installed on the upper side in a supported state.

Here, when the device inspection unit 200, that is, the turntable 210 is supported and rotated upward, the turntable 210 may overlap with at least one of the wafer ring 10 and the buffer plate 310 downward.

As described above, when the device inspection unit 200, that is, the turntable 210 overlaps the wafer ring 10 and the buffer plate 310, the movement of the first transfer tool 510 and the second transfer tool 520 is performed. In addition to reducing the distance, the processing speed can be increased, and the installation area occupied by the device can be reduced, thereby minimizing the cost for the installation of the device.

The device seating unit 220 is a configuration in which the LED element 1 is seated so as to be inspected at an inspection position IP to be described later, and may have a configuration corresponding to the structure of the LED element 1.

On the other hand, the device seating portion 220 may be disposed in one or more, as shown in Figures 1 and 4, it may be disposed at a predetermined interval in the circumferential direction with respect to the rotation center of the turntable 210.

In particular, the device seating unit 220 is circulated to the loading position (P ₁ ), the inspection position (IP), the unloading position (P ₂ ), the loading position (P ₁ ) by the rotation of the turntable (210).

At this time, the loading position (P ₁ ), the inspection position (IP), the unloading position (P ₂ ) can be arranged in various ways on the basis of the rotation center of the turntable 210, each module, that is, loading unit, element inspection unit ( The loading position P ₁ and the unloading position P ₂ are opposed to each other on the basis of the rotation center of the turntable 210 so as to be disposed in a straight line up to the 200 and the buffer unit 300, and further, the unloading unit 400. Preferably arranged.

On the other hand, the turntable 210 is rejected to remove the LED element 1, which is determined to be unsuccessful or defective by the second transfer tool 520 after the element seating part 220 passes through the unloading position P ₂ . Position (RP), the cleaning position (CP) for removing foreign matter on the device mounting portion 220 may be added.

Here, the LED element 1 at the reject position RP may be removed by operation of a pressure control device described later, and at the cleaning position CP, the surface may be removed to remove contaminants on the surface of the device seat 220. A roller or the like having an adhesive property may be installed on the upper side of the turntable 210 to be in contact with the upper surface of the element seating part 220.

The number of device seating portions 220 is appropriately selected such as 8, 16, etc. according to the processing speed of the device handler according to the present invention.

Meanwhile, the device seat 220 includes a pressure hole 221 for seating or withdrawing LED elements, and the turntable 210 forms a vacuum pressure or supplies air to the pressure hole 221 to form a positive pressure. A pressure control device for controlling the back pressure may be installed.

Here, the vacuum pressure and the positive pressure delivered to the turntable 210 are rotatable and air for supplying a vacuum pressure generator (not shown) and air by means of a rotary joint (not shown) having a plurality of ports installed therein to transmit air pressure. A supply device (not shown) is connected primarily and the ports of the rotary joint are connected to the pressure control device.

The number of ports of the rotary joint may be the same as the number of device seating parts 220, and the pressure control device may be installed to be the same as the number of device seating parts 220.

The pressure control device is configured to control the vacuum pressure and the positive pressure by the vacuum pressure and the static pressure according to each working position, and the unloading position starting from when the LED element 1 is seated in the loading position P ₁ . Vacuum pressure is formed in the pressure hole 221 so as to maintain the seated state of the LED element 1 until it reaches (P ₂ ), the LED element 1 reaches the unloading position (P ₂ ) to the second The transfer tool 520 is configured to supply air to the pressure hole 221 to form a positive pressure when picking up.

On the other hand, between the loading position (P ₁ ) and the inspection position (IP), between the inspection position (IP) and the unloading position (P ₂ ) as the alignment position (AP ₁ , AP ₂ ), seated on the device seating portion 220 An element aligning unit (not shown) for aligning the LED elements 1 may be further installed.

And determine fit of the in the element receiving portion 220 of the LED element 1, by analyzing the captured image alignment to align the elements aligned additional LED element 1 according to the analysis results position (AP _1, The cameras 253 and 254 may be installed at positions corresponding to the AP ₂ ).

The inspection unit 240 is a configuration for inspecting the light emission characteristics of the LED element 1, and can be variously configured according to the inspection object. For example, the inspection unit 240 emits light by applying power to the LED element 1 and emits light. It may be configured to check the light intensity, such as light intensity, luminance, and the like.

The buffer unit 300 receives the LED element 1 from the device inspecting unit 200 and temporarily loads the LED element 1 while unloading the unloading unit 400 to classify the LED element 1 according to a test result. As the configuration for transmitting the LED element 1 to the unit 400, various configurations are possible depending on the design and design.

Here, the buffer unit 300 is a configuration for temporarily loading an element so that the sorting in the unloading unit 400 to be described later is smoothly performed. In the case of loading without sorting, the configuration may be omitted.

As an example of the buffer unit 300, as shown in FIGS. 1 and 11, the buffer plate loading unit 320, the device loading table 340, the device unloading table 350, and the device loading table 340. Plate transfer table 360 for transferring the buffer plate 310 from the device unloading table 350 to the plate transfer table 360 via the element loading table 340 from the buffer plate loading unit 320. And a buffer plate transfer unit 370 for transferring the buffer plate 310 to the buffer plate loading unit 320 via the device transfer table 350 from the plate transfer table 360. .

The buffer plate loading unit 320 may have various configurations in which the buffer plates 310 are loaded so that the LED elements 1 may continuously load the buffer plates 310 to be loaded.

The device loading table 340 is configured to move the buffer plate 310 by receiving the buffer plate 310 from the buffer plate loading unit 320 so as to load the LED elements 1 on the buffer plate 310. Various configurations are possible.

The device unloading table 350 receives the buffer plate 310 from the device loading table 340 to transfer the LED elements 1 loaded on the buffer plate 310 to the unloading unit 400. Various configurations are possible with the configuration of moving 310.

The plate transfer table 360 may include a device loading table when the device loading table 340 and the device unloading table 350 are spaced apart from each other in a direction crossing the transfer direction of the buffer plate 310 by the buffer plate transfer unit 370. 340 and the device unloading table 350 may be installed to reciprocate along the first and second lines.

The buffer plate transfer unit 370 transfers the plate 310 from the buffer plate loading unit 320 to the plate transfer table 360 through the element loading table 340, and the element unloading table from the plate transfer table 360. Various configurations are possible as a configuration for transferring the plate 310 to the buffer plate loading part 320 via the 350.

The buffer plate transfer unit 370 may include, for example, a main shaft installed along the transport direction of the plate 310 and a plate transport tool for pulling or pushing the plate 310 while moving along the main axis.

On the other hand, the unloading unit 400 is a configuration for unloading the LED elements 1 into the sorting plate 40 according to the inspection result inspected by the element inspecting unit 200, and various configurations are possible.

Here, the classification grade given to the sorting plate 40 is a standard given according to the inspection result by the element inspecting unit 200. The LED element 1 may be classified according to the luminance grade according to the inspection result.

The sorting plate 40 is configured to be suitable for shipping, or has a different configuration from the wafer ring 10, such as having a specification suitable for the packaging process so as to perform a subsequent process such as packaging.

In particular, the sorting plate 40 is configured to be loaded with a relatively small number of LED elements 1 and the wafer ring 10, the shape is also configured to have a rectangle (plate used in the buffer unit 300) (310 is similar)).

Meanwhile, as shown in FIG. 12, the sorting plate 40 has an adhesive tape 41 similar to the wafer ring 10 described above, and a mark such as LOT number and classification grade while fixing the adhesive tape 41. It may be configured to include a support member (42).

As an example, as shown in FIGS. 1, 13A, and 13B, the unloading unit 400 receives the LED element 1 from the buffer unit 300 by the third transfer tool 530 and is classified. A sorting table 420 for moving the sorting plate 40 in the XY direction and further in the XY-θ direction so as to be loaded at an appropriate loading position P ₅ of the sorting plate 40 in correspondence thereto; The sorting plate buffer loading unit 80 to which the sorting plate 40 on which the LED elements 1 of the sorting table 420 are stacked is transferred, and the sorting of the LED elements 1 in the sorting table 420 according to the classification level. A sorting plate stacking unit 70 on which the plate 40 is loaded and the sorting plate 40 on which the LED elements 1 of the sorting plate buffer stacking unit 80 are loaded is loaded; It may be configured to include a sorting plate transfer unit 460 for transferring the sorting plate 40 between the sorting plate loading unit 70, the sorting table 420 and the sorting plate buffer loading unit 80.

The sorting plate loading unit 70 may provide a sorting plate 40 for each classification level, and may load a plurality of sorting plates 40 so that the sorting plate 40 loaded with the LED elements 1 may be loaded. , While moving along the up and down direction, it may be made of a cassette structure that can be provided, stacked sorting plate (40).

The sorting plate transfer unit 460 is configured to transfer the sorting plate 40 between the sorting plate stacking unit 70, the sorting table 420, and the sorting plate buffer stacking unit 80.

The sorting plate buffer stacking unit 80 is a configuration for temporarily storing the sorting plate 40, and as shown in FIG. 13B, the sorting plate 40 is sorted to transfer the sorting plate 40 to the sorting plate stacking unit 70. After the table 420 is moved, it may move to its place.

On the other hand, the unloading unit 400 may be configured to load the LED element 1 into the lead frame, which is a die bonding process, for the packaging process instead of the sorting plate 40, and then other members after the inspection of the LED element 1. Any configuration can be used as long as the LED element 1 is mounted on the structure.

The first to third transfer tools 510, 520, and 530 are respectively located between the loading unit and the device inspecting unit 200, between the device inspecting unit 200 and the buffer unit 300, the buffer unit 300 and the unloading unit. Various configurations are possible as configurations for transferring one or more LED elements 1 between the 400.

The first to the third transfer tool (510, 520, 530) is a configuration for transporting one or more LED elements 1, various configurations are possible, and a plurality of rotary arms to pick up the LED element (1) It can be configured to include a rotary drive device for rotating the rotary arms so that the rotary arms convey the LED elements (1).

In particular, the rotary arms may be arranged to have a constant angle, and the rotary driving device may be configured to rotate the rotary arms only in one direction or to reciprocally rotate the predetermined angle.

In addition, the first to third transfer tools 510, 520, and 530 may be configured as swing arms that reciprocate only at a predetermined angle.

On the other hand, the loading unit, the device inspection unit 200, the buffer unit 300 and the unloading unit 400 may be variously arranged, it is preferably arranged in a straight line.

In addition, the pressure control device for forming a vacuum pressure and the air supply device for supplying air in the element handler may be connected to each configuration individually configured, or may be connected by one pressure control device and the air supply device.

Meanwhile, the second to third transfer tools 520 and 530 are configured to pick up and load the LED element 1 from the first loading member such as the buffer plate and the sorting plate to the second loading member such as the buffer plate and the sorting plate. As a result, the following problems may occur when picking up and placing.

That is, after the element pickup, the alignment state of the LED element 1 picked up in the pickup head of the transfer tool 520, 530 may be different, which may affect the subsequent process, such as irregular loading of the element on the second loading member. have.

Therefore, when the second to third transfer tools 520 and 530 pick up and load the LED elements 1, the second loading member is arranged by checking the alignment state of the LED element 1 after being picked up to align the second loading member. It can be loaded on the member regularly.

That is, as shown in FIGS. 1, 2, and 14, the device inspection apparatus picks up the LED elements 1 from the first stacking member on which the LED elements 1 are loaded, thereby loading the LED elements 1. A transfer tool including at least one pickup head 610 for picking up the LED element 1 to place the LED element 1 as a second loading member, and a rotation driving part 620 for rotating the pickup head 610. 520, 530; It may include an image acquisition unit 630 is installed on the movement path of the pickup head 610 to obtain an image for the LED element (1) picked up by the pickup head 610.

Here, when the LED element 1 is placed by the pickup head 610, the LED is calculated by calculating the alignment state of the LED element 1 picked up to the pickup head 610 from the image acquired by the image acquisition unit 630. The loading position of the second loading member on which the device 1 is loaded is corrected

The transfer tool (520, 530) may be configured or similar to the transfer tool of the embodiment described above, and at least one pickup head (610) for picking up the LED element (1); Any configuration may be used as long as it includes a rotation driving unit 620 for rotating the pickup head 610.

The pickup head 610 may be configured to pick up the LED element 1 from the wafer ring 10 by vacuum pressure, and may be configured in various ways, and may be linear to easily pick up the element 1 when combined with the rotation driving unit 620. It may be installed to enable linear movement by a drive (not shown).

The pickup head 610 may be disposed in plural along the rotation direction thereof, and as illustrated in FIG. 14, the pickup head 610 may be disposed at the same angle along the rotation direction thereof.

The rotation driving unit 620 is a pickup position for picking up an element by rotating a plurality of pick-up heads 610 such as one or more, preferably two or four, to a loading position for placing (loading) the element. Various configurations are possible as the configuration of rotating the 610.

On the other hand, the first loading member and the second loading member is a configuration in which the LED elements (1) are loaded, the device seating portion 220 in the device inspection unit 200, as shown in Figure 3a and 3b to wafer ring Any configuration may be used as long as the device can be stacked, such as a plate or a plate as shown in FIG. 12.

Referring to FIGS. 1 and 2, between the device inspecting unit 200 and the buffer unit 300, the first loading member and the second loading member are the device loading unit 210 and the buffer plate 310, respectively. Between the buffer unit 300 and the unloading unit 400 may be the buffer plate 310 and the sorting plate 40, respectively.

Meanwhile, the first loading member and the second loading member may be relatively variously disposed, and both may be horizontal to the ground, or the first loading member may be perpendicular to the ground, and the second loading member may be ground. It can maintain the horizontal level with respect to.

When both the first loading member and the second loading member maintain the horizontal state, as illustrated in FIGS. 1, 2, and 14, the plurality of pickup heads 610 are horizontally disposed and rotated.

When the first loading member and the second loading member keep the first loading member perpendicular to the ground, and the second loading member maintains the horizontal position with respect to the ground, the plurality of pickup heads 610 may be The axis of rotation is arranged and rotated to form a normal to the plane perpendicular to the ground.

As shown in FIG. 14, the second loading member calculates an alignment state of the LED element 1 picked up to the pickup head 610 from the image acquired by the image acquisition unit 630, and then uses the LED element ( The stacking position of the second stacking member on which 1) is loaded may be loaded on the XY-θ table 650, and the stacking position of the second stacking member may be corrected by the XY-θ table 650. .

In addition, the second loading member may be corrected by turning to a rotation center located outside the table, not having the center of rotation in the table when the θ correction is performed.

On the other hand, when the LED element 1 is placed by the pickup head 610, the alignment state of the LED element 1 picked up to the pickup head 610 from the image acquired by the image acquisition unit 630 (ΔX, ΔY) , And the configuration in which the loading position of the second loading member on which the LED element 1 is loaded is corrected by calculating? It can be applied to other devices other than (1), and can be applied to all device handlers which perform at least one of the device inspection for the device and the device classification for classifying the LED device 1 according to the inspection result.

That is, the device handler may be an LED device inspecting apparatus for inspecting an LED element and classifying the LED element according to the inspection result, and an LED element sorter for classifying the LED element according to the inspection result previously inspected.

In summary, the device handler comprises: one or more pickup heads for picking up the device from the first stacking member on which the elements are loaded and for picking up the element onto the second stacking member on which the elements are loaded; A transfer tool including a rotation driving unit for rotating the pickup head; It may include an image acquisition unit is installed on the movement path of the pickup head to obtain an image for the element picked up in the pickup head.

When the device is placed by the pickup head, an alignment state of the device picked up by the pickup head is calculated from the image acquired by the image acquisition unit, and thus the loading position of the second loading member loaded with the device may be corrected. have.

An element handler having the above-described configuration is an element transfer method of an element handler which performs at least one of element inspection for an element and element classification for classifying the element according to the inspection result. A moving step of picking up the element by the head and moving the element to the second loading member on which the element is loaded; The moving step Acquires an image of the element picked up in the pickup head, and calculates the alignment state of the element picked up in the pickup head from the image obtained by the image acquisition unit to load the second loading member loaded on the element A correction step of correcting the position; An element transfer method may include an element loading step of loading an element picked up by the pickup head into the second loading member.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: loading unit 200: device inspection unit
300: buffer unit 310: buffer plate
400: unloading part
700: wafer ring table 800: wafer ring magazine portion
900: wafer ring transfer part

Claims (9)

A device handler that performs at least one of device inspection for devices and device classification for classifying devices according to the inspection results.
The element handler includes one or more pickup heads for picking up an element to pick up the element from the first loading member on which the elements are loaded and to place the element onto the second loading member on which the elements are loaded, and a rotation driving unit for rotating the pickup head. A transfer tool comprising; An image acquisition unit installed on a movement path of the pickup head to acquire an image of an element picked up by the pickup head,
When the element is placed by the pickup head, the position of the second loading member loaded on the element is corrected by calculating an alignment state of the element picked up on the pickup head from the image acquired by the image acquisition unit. Element handler. The method according to claim 1,
And the second loading member is mounted on the XY-θ table, and the second loading member is loaded on the XY-θ table. The method according to claim 1,
And a plurality of the pickup heads are arranged along the direction of rotation thereof. The method according to claim 3,
And the plurality of pickup heads are arranged at the same angle along the rotational direction thereof. The method according to claim 1,
Both the first loading member and the second loading member maintain a horizontal state with respect to the ground, or the first loading member maintains a vertical state with respect to the ground, and the second loading member maintains a horizontal state with respect to the ground. Element handler. The method according to claim 1,
And the device is an LED device. The method according to claim 1,
And the device handler inspects an LED device and classifies the device according to the test result. The method of claim 6,
The device handler is a device handler, characterized in that to classify the LED elements in accordance with the inspection results in advance. An element transfer method of an element handler which performs at least one of element inspection for an element and element classification for classifying elements according to the inspection result,
A moving step of picking up the element from the first loading member in which the elements are loaded by the pickup head and moving the element to the second loading member in which the elements are loaded;
The moving step Acquires an image of the element picked up in the pickup head, and calculates the alignment state of the element picked up in the pickup head from the image obtained by the image acquisition unit to load the second loading member loaded on the element A correction step of correcting the position;
And an element loading step of loading the element picked up by the pickup head into the second loading member.

Images