KR102391432B1 - Die transfer module and die bonding apparatus including the same - Google Patents

Abstract

A die bonding apparatus is disclosed. The apparatus includes: a wafer stage for supporting a wafer including a plurality of dies attached to a dicing tape and a mount frame on which the dicing tape is mounted; a bonding unit for bonding the dies onto a substrate; a die shuttle for transferring the dies from a first position adjacent to the stage to a second position adjacent to the bonding unit; and a die transfer module for picking up the dies one by one and transferring the dies to the die shuttle. The die transfer module includes: a picker for picking up the dies one by one from the wafer; and a flipper for receiving the finished die from the picker, inverting the received die, and placing it on the die shuttle.

Description

Die transfer module and die bonding apparatus including the same

Embodiments of the present invention relate to a die transfer module and a die bonding apparatus including the same. More particularly, it relates to a die transfer module for picking up a die from a wafer and transferring it to a die shuttle, and a die bonding apparatus for bonding the die onto a substrate.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. A wafer on which the semiconductor devices are formed may be divided into a plurality of dies through a dicing process, and individual dies through the dicing process may be bonded to a substrate such as a lead frame through a die bonding process. In particular, the dies may be directly bonded to another wafer on which semiconductor devices are formed in order to manufacture stacked semiconductor packages using a recent through silicon via (TSV) technology.

The die bonding apparatus for performing the die bonding process may include a die transfer unit for picking up and transferring a die from a wafer, and a die bonding unit for bonding the transferred die onto a substrate. The wafer may include a dicing tape to which a plurality of dies individualized by a dicing process are attached, and a mount frame having a substantially circular ring shape to which the dicing tape is mounted. The wafer may be supported on a wafer stage.

The die bonding apparatus may include a die shuttle for transferring the dies from a position adjacent to the wafer stage to a location adjacent to the die bonding unit.

Meanwhile, when it is necessary to invert the die picked up from the wafer, the die may be inverted using a flipper. As an example, Korean Patent Laid-Open Publication No. 10-2017-0042955 filed by the present applicant discloses a die bonding apparatus including a flipper for picking up and inverting a die, and a die transfer for transferring the inverted die to a die shuttle. has been

However, when inversion of the die is not required, a second flipper that is picked up by the flipper and re-inverts the inverted die is required. In this case, the size of the die transfer unit increases and the structure becomes very complicated.

Republic of Korea Patent Publication No. 10-2017-0042955 (published on April 20, 2017)

An object of the present invention is to provide a die transfer module having a simple structure and capable of transferring a die more quickly, and a die bonding apparatus including the same.

A die transfer module according to an aspect of the present invention for achieving the above object includes a picker for picking up a die attached on a dicing tape, and a picker driving unit for moving the picker to transfer the die to a preset place and a flipper for receiving the die from the picker, inverting the received die, and then placing it on the preset place.

According to embodiments of the present invention, the picker driving unit may include a first vertical driving unit for moving the picker in a vertical direction and a first horizontal driving unit for moving the picker in a horizontal direction, and the flipper is, a vacuum nozzle for vacuum adsorbing the die, a rotation driving unit for inverting the vacuum nozzle, and moving the vacuum nozzle in a vertical direction to put the die inverted by the rotation driving unit in the preset place It may include a second vertical driving unit.

According to embodiments of the present invention, the flipper may further include a second horizontal driving unit for moving the vacuum nozzle in a horizontal direction, and the first horizontal driving unit and the second horizontal driving unit are independently along the same axis. The picker and the vacuum nozzle may be moved, respectively.

According to embodiments of the present invention, when the picker directly puts the die at the preset location, the second horizontal driving unit moves the vacuum nozzle to the avoiding position in order to avoid interference between the vacuum nozzle and the picker. can be moved

A die bonding apparatus according to another aspect of the present invention for achieving the above object includes: a wafer stage supporting a wafer including a plurality of dies attached to a dicing tape and a mount frame on which the dicing tape is mounted; a bonding unit for bonding dies onto a substrate; a die shuttle for transferring the dies from a first position adjacent to the wafer stage to a second location adjacent to the bonding unit; and picking up the dies one by one to the die shuttle It may include a die transfer module for transferring. In this case, the die transfer module includes a picker for picking up the dies one by one from the wafer, and a picker driver for moving the picker in vertical and horizontal directions to transfer the die picked up by the picker to the die shuttle; and a flipper for receiving the picked-up die from the picker, inverting the received die, and then placing it on the die shuttle.

According to embodiments of the present invention, the picker driving unit may include a first vertical driving unit for moving the picker in a vertical direction and a first horizontal driving unit for moving the picker in a horizontal direction, and the flipper is a vacuum nozzle for vacuum adsorbing the die; 2 may include a vertical drive unit.

According to embodiments of the present invention, the flipper may further include a second horizontal driving unit for moving the vacuum nozzle in a horizontal direction, and the first horizontal driving unit and the second horizontal driving unit are independently along the same axis. The picker and the vacuum nozzle may be moved, respectively.

According to embodiments of the present invention, when the picker directly puts the picked-up die on the die shuttle, the second horizontal driving unit avoids the vacuum nozzle in order to avoid interference between the vacuum nozzle and the picker. can be moved to

According to embodiments of the present invention, the die bonding apparatus may further include a die supply unit for supplying a carrier tape having pockets in which second dies to be bonded on the substrate are accommodated, respectively, and the die transfer module may selectively transport one of the dies and the second dies.

According to embodiments of the present invention, the die transfer module includes a second picker for picking up the second dies one by one, and the second picker for transferring the second die picked up by the second picker to the die shuttle. 2 A second picker driving unit for moving the picker in vertical and horizontal directions, and a second flipper for receiving the second die from the second picker, inverting the received second picker, and placing it on the die shuttle. may include

According to embodiments of the present invention, the die bonding apparatus may further include a substrate stage for supporting the substrate, and a first stage driver for moving the substrate stage in a horizontal direction, wherein the bonding unit includes: , a bonding head for bonding the dies on the substrate, and a head driving unit for moving the bonding head in horizontal and vertical directions.

According to embodiments of the present disclosure, the die bonding apparatus may further include a cleaning unit disposed on the substrate stage and configured to suck and remove contaminants from the substrate stage or the substrate on the substrate stage. .

According to the embodiments of the present invention as described above, the die bonding apparatus includes a wafer stage supporting a wafer including a plurality of dies attached to a dicing tape and a mount frame on which the dicing tape is mounted; a bonding unit for bonding dies onto a substrate; a die shuttle for transferring the dies from a first position adjacent to the wafer stage to a second location adjacent to the bonding unit; and picking up the dies one by one to the die shuttle It may include a die transfer module for transferring.

In particular, the die transfer module includes a picker for picking up the dies one by one from the wafer, and a picker driver for moving the picker in vertical and horizontal directions to transfer the die picked up by the picker to the die shuttle; and a flipper for receiving the picked-up die from the picker, inverting the received die, and then placing it on the die shuttle. The die may be directly transferred to the die shuttle by the picker, or alternatively, may be transferred in an inverted state through the flipper. Accordingly, compared to the prior art, the structure of the die transfer module can be simplified, and faster die transfer is possible.

In addition, the die bonding apparatus may further include a die supply unit that provides a carrier tape for supplying the second dies, and the picker may selectively supply the dies and the second dies. In particular, since both the wafer and the carrier tape can be used, the utility of the die bonding apparatus can be greatly improved, and various bonding recipes can be responded to. In particular, since the second dies can be quickly supplied in large quantities using the carrier tape, the productivity of the die bonding apparatus can be greatly improved.

1 is a schematic configuration diagram for explaining a die bonding apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic diagram illustrating a wafer stage and a die transfer module illustrated in FIG. 1 .
3 and 4 are schematic diagrams for explaining the operation of the die transfer module shown in FIG.
5 is a schematic diagram for explaining another example of the die transfer module shown in FIG.
6 and 7 are schematic diagrams for explaining the operation of the die transfer module shown in FIG.
FIG. 8 is a schematic configuration diagram for explaining the carrier tape shown in FIG. 1 .
9 is a schematic configuration diagram for explaining the die supply unit shown in FIG.
FIG. 10 is a schematic diagram for explaining a bonding unit and a substrate stage illustrated in FIG. 1 .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as being limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to sufficiently convey the scope of the present invention to those skilled in the art, rather than being provided so that the present invention can be completely completed.

In embodiments of the present invention, when an element is described as being disposed or connected to another element, the element may be directly disposed or connected to the other element, and other elements may be interposed therebetween. it might be Conversely, when one element is described as being directly disposed on or connected to another element, there cannot be another element between them. Although the terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or portions, the items are not limited by these terms. will not

The terminology used in the embodiments of the present invention is only used for the purpose of describing specific embodiments, and is not intended to limit the present invention. Further, unless otherwise limited, all terms including technical and scientific terms have the same meaning as understood by one of ordinary skill in the art of the present invention. The above terms, such as those defined in ordinary dictionaries, shall be interpreted as having meanings consistent with their meanings in the context of the related art and description of the present invention, ideally or excessively outwardly intuitive, unless clearly defined. will not be interpreted.

Embodiments of the present invention are described with reference to schematic diagrams of ideal embodiments of the present invention. Accordingly, changes from the shapes of the diagrams, eg, changes in manufacturing methods and/or tolerances, are those that can be fully expected. Accordingly, the embodiments of the present invention are not to be described as being limited to the specific shapes of the areas described as diagrams, but rather to include deviations in the shapes, and the elements described in the drawings are purely schematic and their shapes It is not intended to describe the precise shape of the elements, nor is it intended to limit the scope of the present invention.

1 is a schematic configuration diagram for explaining a die bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 1 , a die bonding apparatus 100 according to an embodiment of the present invention may be used to bond dies on a substrate 10 . As an example, a wafer on which semiconductor devices are formed may be used as the substrate 10 . Specifically, the die bonding apparatus 100 may be used to bond dies on a wafer on which semiconductor devices are formed for manufacturing stacked semiconductor packages. However, the die bonding apparatus 100 may be deformed into an appropriate shape for bonding the dies on a substrate such as a lead frame.

According to an embodiment of the present invention, the die bonding apparatus 100 includes a wafer stage 110 for supporting a wafer 20 including a plurality of dies 22 , and the dies 22 . A bonding unit 120 for bonding on a substrate 10 , and a method for transferring the dies 22 from a first position adjacent to the wafer stage 110 to a second location adjacent to the bonding unit 120 . It may include a die shuttle 150 and a die transfer module 300 for picking up the dies 22 one by one and transferring them to the die shuttle 150 .

Also, the die bonding apparatus 100 may include a substrate stage 102 for supporting the substrate 10 , and the bonding unit 120 may be disposed on the substrate stage 102 . . In addition, the die bonding apparatus 100 includes a die supply unit 160 that supplies a carrier tape 30 having pockets 34 in which second dies 32 to be bonded on the substrate 10 are accommodated, respectively. ), and the die transfer module 300 may selectively transfer one of the dies 22 or the second dies 32 . That is, the dies 22 or the second dies 32 may be bonded to the substrate 10 by the bonding unit 120 . Also, unlike the above, both the dies 22 and the second dies 32 may be bonded on the substrate 10 .

FIG. 2 is a schematic diagram illustrating the wafer stage and the die transfer module illustrated in FIG. 1 , and FIGS. 3 and 4 are schematic diagrams illustrating the operation of the die transfer module illustrated in FIG. 2 .

2 to 4 , the wafer 20 has a dicing tape 24 to which the dies 22 are attached and a mount frame 26 having a substantially circular ring shape to which the dicing tape 24 is mounted. ) may be included.

On the wafer stage 110 , an expansion ring 112 for supporting the dicing tape 24 and the mount frame 26 are held between the dies 22 and the mount frame 26 , and downwardly A clamp 114 for moving may be provided. That is, the dicing tape 24 may be expanded by the descent of the clamp 114 , thereby extending the gap between the second dies 22 .

A die ejector 116 for selectively separating the dies 22 from the dicing tape 24 may be disposed under the wafer stage 110 . Although not shown in detail, the die ejector 116 may include an ejector member for pushing up the die 22 to be picked up, and at least from the dicing tape 24 by raising the ejector member. The partially separated die 22 may be transferred by the die transfer module 300 .

The wafer stage 110 may have an opening in which the die ejector 116 is disposed, in a horizontal direction by a first stage driver 118 (refer to FIG. 1 ) for selective pickup of the dies 22; For example, it may be moved in the X-axis direction and/or the Y-axis direction.

The die transfer module 300 is disposed on the wafer 20 and includes a picker 302 for picking up the dies 22 one by one, and transfers the dies 22 to the die shuttle 150 . a picker driving unit 304 for moving the picker 302 in vertical and horizontal directions to ) may include a flipper 310 for placing it on the die shuttle 150 after inverting.

The picker 302 can vacuum the die 22 using vacuum pressure, and the picker driving unit 304 includes a first vertical driving unit 306 for moving the picker 302 in a vertical direction and A first horizontal driving unit 308 for moving the picker 302 in a horizontal direction, for example, an X-axis direction may be included. As an example, the first vertical driving unit 306 and the first horizontal driving unit 308 may be configured using a linear motor.

The flipper 310 is inverted by a vacuum nozzle 312 for vacuum adsorbing the die 22 , a rotation driving unit 314 for inverting the vacuum nozzle 312 , and the rotation driving unit 314 . A second vertical driving unit 316 for vertically moving the vacuum nozzle 312 to place the die 22 on the die shuttle 150 may be included. Specifically, the die 22 picked up by the picker 302 may be transferred onto the vacuum nozzle 312 , and the vacuum nozzle 312 vacuum-sucks the die 22 using vacuum pressure. After this, the rotation driving unit 314 may invert the die 22 . After the die 22 is inverted, the second vertical driver 316 may lower the vacuum nozzle 312 to place the die 22 on the die shuttle 150 . In this case, the flipper 310 may be disposed such that the inverted die 22 is positioned on the die shuttle 150 .

Meanwhile, even when the picker 302 picks up the second die 32 from the die supply unit 160 , the same method as in the case of picking up the die 22 from the wafer 20 may be applied. . That is, the picker 302 may transfer the dies 22 and/or the second dies 32 to the die shuttle 150 according to a process recipe.

The above describes a case where the die 22 or the second die 32 is inverted and then put down on the die shuttle 150. However, when inversion is not required according to the process recipe, the picker 302 is The die 22 or the second die 32 may be picked up and placed directly on the die shuttle 150 without inversion.

5 is a schematic diagram for explaining another example of the die transfer module shown in FIG. 2 , and FIGS. 6 and 7 are schematic diagrams for explaining the operation of the die transfer module shown in FIG. 5 .

5 to 7 , the flipper 310 may include a second horizontal driving unit 318 for moving the vacuum nozzle 312 in a horizontal direction, for example, an X-axis direction. In particular, the first horizontal driving unit 308 and the second horizontal driving unit 318 may independently move the picker 302 and the vacuum nozzle 312 along the same axis, respectively. For example, as shown, the first horizontal driving unit 308 and the second horizontal driving unit 318 may use a guide rail extending in the X-axis direction in common, and the picker 302 using a linear motor ) and the vacuum nozzle 301 can be moved independently of each other.

The first vertical drive 306 and the first horizontal drive 308 may be used to pick up the die 22 and transfer it to the flipper 310 , the rotation drive 314 and the second vertical drive The driving unit 316 and the second horizontal driving unit 318 may be used to put the transferred die 22 down on the die shuttle 150 after inverting. In particular, the second horizontal driving unit 318 may adjust the position of the vacuum nozzle 312 so that the die 22 inverted by the rotation driving unit 314 is located above the die shuttle 150 .

On the other hand, when the die 22 is placed on the die shuttle 150 without inverting according to the process recipe, the second horizontal driving unit 318 operates the picker 302 and the vacuum nozzle as shown in FIG. 7 . In order to avoid interference between the 312 , the vacuum nozzle 312 may be moved to an avoiding position, for example, one side of the die shuttle 150 as shown.

In addition, although not shown, the die transfer module 300 includes a second picker (not shown) for picking up the second dies 32 one by one, and a second die picked up by the second picker ( 32) to the die shuttle 150, a second picker driving unit (not shown) for moving the second picker in vertical and horizontal directions, and transferring the second die 32 from the second picker It may further include a second flipper (not shown) for placing the received second die 32 on the die shuttle 150 after inverting the received second die 32 . Additionally, the second flipper may be configured to be movable in the same horizontal direction as the flipper 310 . For example, the picker 302 and the flipper 310 and the second picker and the second flipper may be configured to be independently movable along the same axis.

Referring back to FIG. 1 , the die bonding apparatus 100 is disposed adjacent to the die supply unit 160 and may include a second die supply unit 174 for supplying a second carrier tape 38 . there is. In particular, any one of the die supply unit 160 and the second die supply unit 174 may be selectively used. For example, after all of the second dies 32 accommodated in the carrier tape 30 are supplied, the second dies 32 accommodated in the second carrier tape 38 may be supplied. Also, different from the above, the die supply unit 160 and the second die supply unit 174 may supply different types of dies, respectively.

FIG. 8 is a schematic configuration diagram for explaining the carrier tape shown in FIG. 1 , and FIG. 9 is a schematic configuration diagram for explaining the die supply unit shown in FIG. 1 .

8 and 9 , the carrier tape 30 may have pockets 34 for receiving the second dies 32 , and a cover tape 36 on the carrier tape 30 . may be provided. The cover tape 36 may be used to protect the second dies 32 accommodated in the pockets 34 .

The die supply unit 160 includes a reel mounting unit 164 on which the supply reel 162 on which the carrier tape 30 is wound is rotatably mounted, and the pockets 34 of the carrier tape 30 die. A tape conveying unit 168 for conveying the carrier tape 30 so as to be sequentially provided to the supply area 166 , and a cover tape removing unit 170 for removing the cover tape 36 from the carrier tape 30 . may include

Although not shown in detail, a torque limiter (not shown) may be mounted on the reel mounting part 164 so that the supply reel 162 does not rotate freely, and the torque limiter supplies the supply only when a predetermined torque is applied. The reel 162 may be rotated. The tape transfer unit 168 may include a sprocket corresponding to the transfer holes (not shown) of the carrier tape 30 and a motor for rotating the sprocket.

The cover tape removal unit 170 includes a separator plate disposed on top of the transported carrier tape 30 and the cover tape 36 to remove the cover tape 36 before the die feed area 166 . It may include a first roller and a second roller for pulling and separating from the carrier tape 30 . The first roller and the second roller may be rotated in opposite directions while in close contact with each other, and the cover tape 36 separated by the separating plate may be discharged through between the first and second rollers. there is.

In addition, although not shown in detail, the die supply unit 160 is cut by a cutter 172 for cutting the carrier tape 30 passing through the die supply area 166 , and the cutter 172 . A container for accommodating the used carrier tape 30 may be provided. Additionally, the die supply unit 160 may include a container for accommodating the cover tape 36 discharged through the first roller and the second roller.

However, the configuration of the die supply unit 160 has been described as an example, and detailed configurations of the reel mounting unit 164 , the tape transfer unit 168 , and the cover tape removal unit 170 can be variously changed. Therefore, the scope of the present invention will not be limited thereby. Meanwhile, since the second die supply unit 174 may have substantially the same configuration as the die supply unit 160 , an additional detailed description thereof will be omitted.

Referring back to FIG. 1 , the die shuttle 150 is moved in a horizontal direction between a first position adjacent to the wafer stage 110 and a second position adjacent to the bonding unit 120 by a shuttle driver 152 , For example, it may be moved in the Y-axis direction as shown. As shown, two die shuttles 150 are provided, but the number of die shuttles 150 can be changed in various ways, so the scope of the present invention will not be limited thereby.

A load port 180 for supporting the cassette 40 in which the plurality of wafers 20 are accommodated may be provided on one side of the wafer stage 110 , and the cassette may be provided on one side of the load port 180 . A wafer transfer unit 190 for taking out the wafer 20 from 40 and transferring it onto the wafer stage 110 may be provided. Although not shown in detail, the wafer transfer unit 190 may include a gripper 192 for gripping the wafer 20 and a gripper driver 194 for horizontally moving the gripper 192 . .

FIG. 10 is a schematic diagram for explaining a bonding unit and a substrate stage illustrated in FIG. 1 .

Referring to FIG. 10 , the bonding unit 120 includes a bonding head 122 for bonding the dies 22 and/or the second dies 32 onto the substrate 10 ; A head driving unit 124 for moving the bonding head 122 in horizontal and vertical directions may be included. Although not shown in detail, a bonding tool having a size corresponding to the dies 22 and/or the second dies 32 may be mounted on the bonding head 122 .

The bonding unit 120 may pick up the die 22 or the second die 32 using vacuum pressure, and the bonding head 122 has the dies 22 and the second dies 32 . ) may be provided with a heater (not shown) for heating.

The substrate stage 102 may be moved in a horizontal direction by a second stage driver 146 (refer to FIG. 1 ). For example, the substrate stage 102 may be moved in the X-axis direction by the second stage driving unit 146 , and the bonding head 122 may be moved in the Y-axis direction by the head driving unit 124 . can be That is, the alignment between the bonding position on the substrate 10 and the bonding head 122 may be performed by the second stage driving unit 146 and the head driving unit 124 .

For example, the head driving unit 124 may move in the Y-axis direction on the first and second gantry structures 126 and 128 extending in parallel in the Y-axis direction, and the gantry structures 126 and 128 , in the Y-axis direction. a movable plate 130 configured to do so, a horizontal driving unit 132 (see FIG. 1 ) for moving the movable plate 130 in the Y-axis direction, and the bonding head 122 mounted on the movable plate 130 It may include a vertical driving unit 134 for moving in the vertical direction.

A first upper camera 136 for detecting bonding positions on the substrate 10 may be disposed on the substrate stage 102 . As an example, the first upper camera 136 may be configured to be movable by the first camera driver 138 in the Y-axis direction on the first gantry structure 126 , and the bonding positions and the bonding It can be used for alignment between heads 122 . That is, bonding positions on the substrate 10 may be detected by the first upper camera 136 , and the position of the bonding head 122 may be adjusted using position coordinates of the detected bonding positions. .

A first lower camera 140 (refer to FIG. 1 ) may be disposed between the first and second gantry structures 126 and 128 as shown, and the die 22 or the second die 32 is A vacuum adsorption state on the lower surface of the bonding tool may be observed by the first lower camera 140 . The first lower camera 140 may be used to correct the posture of the die 22 or the second die 32 adsorbed to the bonding tool.

A heater 104 for heating the substrate 10 may be built in the substrate stage 102 , and the substrate stage 102 and/or the substrate 10 are disposed above the substrate stage 102 . A cleaning unit 142 for removing contaminants may be disposed. For example, the cleaning unit 142 may be mounted on the third gantry structure 144 extending in the Y-axis direction, and use a vacuum to the upper surface of the substrate stage 102 and/or the substrate 10 . ) from the upper surface of the contaminants can be removed by suction. Although not shown in detail, the cleaning unit 142 includes a vacuum suction nozzle extending in the Y-axis direction and a plurality of air nozzles for spraying air onto the substrate stage 102 and/or the substrate 10 . can do. That is, the contaminants on the substrate stage 102 and/or the substrate 10 may be scattered by the air injected through the air nozzles, and then the contaminants may be suctioned and removed by the vacuum suction nozzle. . In addition, the substrate stage 102 and the substrate 10 may be moved in the X-axis direction by the second stage driver 146 , whereby the substrate stage 102 and/or the substrate 10 may be moved. This whole can be scanned by the cleaning unit 142 .

Referring back to FIG. 1 , on the upper portion of the wafer stage 110 , a second upper camera for detecting the position of one of the dies 22 on the dicing tape 24 , that is, the die 22 to be picked up 200 may be disposed, and a third upper camera 202 for detecting the position of the second die 32 may be disposed above the die supply units 160 . In addition, a fourth upper camera 204 for observing the die 22 or the second die 32 placed on the die shuttle 150 may be disposed above the die shuttle 150 . The second, third, and fourth upper cameras 200 , 202 , and 204 may be configured to be independently movable in a horizontal direction, for example, an X-axis direction by the second camera driving unit 206 . .

In addition, a second lower camera 210 for observing the die 22 or the second die 32 picked up by the picker 302 may be disposed under the transport path of the picker 302 . The second lower camera 210 may be used to correct the posture of the die 22 or the second die 32 picked up by the picker 302 .

According to the embodiments of the present invention as described above, the die bonding apparatus 100 includes a plurality of dies 22 attached to the dicing tape 24 and a mount frame on which the dicing tape 24 is mounted. A wafer stage 110 for supporting a wafer 20 including 26 , a bonding unit 120 for bonding the dies 22 onto a substrate 10 , and the wafer stage 110 , A die shuttle 150 for transferring the dies 22 from an adjacent first position to a second position adjacent to the bonding unit 120, and the die shuttle 150 by picking up the dies 22 one by one It may include a die transfer module 300 for transferring to the furnace.

In particular, the die transfer module 300 includes a picker 302 for picking up the dies 22 from the wafer 20 one by one, and transfers the die 22 picked up by the picker 302 to the die. A picker driving unit 304 for moving the picker 302 in vertical and horizontal directions in order to be transferred to the shuttle 150, and the received die 22 after receiving the picked-up die 22 from the picker 302 ) may include a flipper 310 for placing it on the die shuttle 150 after inverting. The die 22 may be directly transferred to the die shuttle 150 by the picker 302 , or alternatively may be transferred in an inverted state through the flipper 310 . Accordingly, compared to the prior art, the structure of the die transfer module 300 can be simplified, and faster die transfer is possible.

In addition, the die bonding apparatus 100 may further include a die supply unit 160 for providing a carrier tape 30 for supplying the second dies 32 , and the picker 302 is the die The dies 22 and the second dies 32 may be selectively supplied. In particular, since both the wafer 20 and the carrier tape 30 can be used, the utility of the die bonding apparatus 100 can be greatly improved, and various bonding recipes can be responded to. In particular, since the second dies 32 can be rapidly supplied in large quantities using the carrier tape 30 , the productivity of the die bonding apparatus 100 can be greatly improved.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the following claims. You will understand that there is

10: substrate 20: wafer
22: die 24: dicing tape
26: mount frame 30: carrier tape
32: second die 40: cassette
100: die bonding device 110: wafer stage
116: die ejector 118: first stage driving unit
120: bonding unit 122: bonding head
124: head driving unit 136: first upper camera
140: first lower camera 142: cleaning unit
150: die shuttle 160: die supply unit
174: second die supply unit 180: load port
190: wafer transfer unit 200: second upper camera
202: third upper camera 204: fourth upper camera
210: second lower camera 300: die transfer module
302: picker 304: picker driving unit
306: first vertical driving unit 308: first horizontal driving unit
310: flipper 312: vacuum nozzle
314: rotation driving unit 316: second vertical driving unit
318: second horizontal driving unit

Claims (13)

delete delete delete delete a wafer stage supporting a wafer including a plurality of dies attached to the dicing tape and a mount frame on which the dicing tape is mounted;
a die supply unit for supplying a carrier tape having pockets in which second dies are respectively accommodated;
a bonding unit for bonding the dies or the second dies onto a substrate;
a die shuttle for transferring the dies or the second dies from a first location adjacent the wafer stage and the die supply unit to a second location adjacent the bonding unit; and
a die transfer module for picking up the dies or the second dies one by one and transferring them to the die shuttle;
The die transfer module includes: a picker for picking up the dies one by one from the wafer; a picker driver for moving the picker in vertical and horizontal directions to transfer the die picked up by the picker to the die shuttle; a flipper for receiving the dies from the picker and placing them on the die shuttle after inverting the received dies; a second picker for picking up the second dies one by one; a second picker picked up by the second picker a second picker driving unit for moving the second picker in vertical and horizontal directions in order to transfer the die to the die shuttle; after receiving the second die from the second picker and inverting the received second die and a second flipper for placing on the die shuttle. The method of claim 5, wherein the picker driving unit,
a first vertical driving unit for moving the picker in a vertical direction; and
and a first horizontal driving unit for moving the picker in a horizontal direction,
The flipper is
a vacuum nozzle for vacuum adsorbing the die;
a rotation driving unit for inverting the vacuum nozzle; and
and a second vertical driving unit for vertically moving the vacuum nozzle in order to place the die inverted by the rotation driving unit on the die shuttle. The method of claim 6, wherein the flipper further comprises a second horizontal driving unit for moving the vacuum nozzle in a horizontal direction,
The first horizontal driving unit and the second horizontal driving unit independently move the picker and the vacuum nozzle along the same axis, respectively. 8. The method of claim 7, wherein the second horizontal driving unit moves the vacuum nozzle to an avoiding position to avoid interference between the vacuum nozzle and the picker when the picker places the picked up die directly on the die shuttle. Die bonding device, characterized in that. delete delete 6. The apparatus of claim 5, further comprising: a substrate stage for supporting the substrate; and
Further comprising a stage driving unit for moving the substrate stage in a horizontal direction,
The bonding unit is
a bonding head for bonding the dies onto the substrate; and
and a head driving unit for moving the bonding head in horizontal and vertical directions. 12. The die bonding apparatus of claim 11, further comprising a cleaning unit disposed on the substrate stage and configured to suck and remove contaminants from the substrate stage or the substrate on the substrate stage. The method of claim 11 , wherein the stage driver moves the substrate stage in a first horizontal direction,
The head drive unit,
first and second gantry structures extending parallel to each other in a second horizontal direction perpendicular to the first horizontal direction from an upper portion of the substrate stage;
a movable plate configured to be movable in the second horizontal direction on the first and second gantry structures;
a horizontal driving unit for moving the movable plate in the second horizontal direction;
and a vertical driving unit mounted on the movable plate to vertically move the bonding head.

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