CN111584403B - Semiconductor material processing method - Google Patents

Semiconductor material processing method Download PDF

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Publication number
CN111584403B
CN111584403B CN202010445688.XA CN202010445688A CN111584403B CN 111584403 B CN111584403 B CN 111584403B CN 202010445688 A CN202010445688 A CN 202010445688A CN 111584403 B CN111584403 B CN 111584403B
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Prior art keywords
feeding
blanking
longitudinal
processing
assembly
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CN111584403A (en
Inventor
宋婉贞
黄卫国
武震
张永昌
郑佳晶
陈国兴
田世伟
谭立杰
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Beijing Semiconductor Equipment Institute
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Beijing Semiconductor Equipment Institute
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Conveyors (AREA)

Abstract

The invention provides a semiconductor material processing method, and relates to the technical field of material processing. The semiconductor material processing method is applied to semiconductor material processing equipment, and the equipment comprises a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging position and a waste position. The feed mechanism is arranged on one side of the processing mechanism. The detection module is arranged at the processing mechanism and is connected with the control module. The control module is connected with the blanking mechanism, and the blanking mechanism is arranged on one side of the processing mechanism. The detection module is used for detecting the appearance of the processed material of the processing mechanism, the control module is used for judging whether the processed material is qualified or not, the blanking mechanism is controlled to convey the qualified material to the blanking position, and the unqualified material is conveyed to the waste position. The invention relieves the technical problem that the production efficiency is still lower because the waste is manually removed after the material processing failure in the material processing process of the semiconductor material processing equipment with automatic feeding and discharging in the prior art.

Description

Semiconductor material processing method
Technical Field
The invention relates to the technical field of material processing, in particular to a semiconductor material processing method.
Background
With the increasing development of the semiconductor industry, the production efficiency of the semiconductor material processing process in the industry is more and more required. Traditional semiconductor material processing equipment is by artifical material loading to processing bench and artifical material unloading of processing bench, leads to production efficiency low, consequently need propose the semiconductor material processing equipment of automatic feeding and unloading to promote production efficiency.
However, the existing automatic feeding and discharging semiconductor material processing equipment has the common problem that waste materials are required to be removed manually after material processing fails, and the production efficiency is still low.
Disclosure of Invention
The invention aims to provide a semiconductor material processing method, which aims to solve the technical problem that in the process of processing materials by the existing automatic feeding and discharging semiconductor material processing equipment in the prior art, waste materials are required to be manually removed after the material processing fails, so that the production efficiency is still lower.
The semiconductor processing equipment provided by the invention comprises a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging level and a waste level;
the feeding mechanism is arranged on one side of the processing mechanism and used for conveying materials to the processing mechanism, and the processing mechanism is used for processing the materials;
the detection module is arranged at the processing mechanism and is connected with the control module; the control module is connected with the blanking mechanism, the blanking mechanism is arranged on one side of the processing mechanism, and the blanking position and the waste position are respectively positioned on one side of the blanking mechanism;
the detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified according to the information detected by the detection module, and controlling the blanking mechanism to convey qualified materials to the blanking position when the material is qualified, and controlling the blanking mechanism to convey unqualified materials to the waste position when the material is unqualified.
Further, the detection module is a camera, and the control module is a programmable logic controller.
Further, the feeding mechanism comprises a first transverse moving driving assembly, a first longitudinal moving driving assembly and a first pickup assembly;
the first transverse moving driving assembly is positioned above the processing mechanism and connected with the first longitudinal moving driving assembly, and the first longitudinal moving driving assembly is connected with the first pickup assembly;
the first transverse moving driving assembly is used for driving the first longitudinal moving driving assembly and the first pickup assembly to move along the horizontal direction, and the first longitudinal moving driving assembly is used for driving the first pickup assembly to move along the vertical direction; the first pick-up assembly is used for picking up materials.
Further, the blanking mechanism comprises a second transverse moving driving assembly, a second longitudinal moving driving assembly and a second pickup assembly;
the second transverse moving driving assembly is positioned above the processing mechanism and connected with the second longitudinal moving driving assembly, and the second longitudinal moving driving assembly is connected with the second pickup assembly;
the second transverse moving driving assembly is used for driving the second longitudinal moving driving assembly and the second pickup assembly to move along the horizontal direction, and the second longitudinal moving driving assembly is used for driving the second pickup assembly to move along the vertical direction; the second pick-up assembly is used for picking up materials.
Further, the semiconductor material processing apparatus further includes a first material detecting member mounted on the first pickup assembly for detecting whether the first pickup assembly picks up the material.
Further, the semiconductor material processing apparatus further includes a second material detecting member mounted on the second pickup assembly for detecting whether the second pickup assembly picks up the material.
The semiconductor material processing method provided by the invention is applied to the semiconductor material processing equipment according to any one of the technical schemes, and comprises the following steps:
and (3) feeding: conveying the materials to a processing mechanism by using a feeding mechanism;
the processing process comprises the following steps: processing the material by using a processing mechanism;
and (3) blanking: taking out the processed material from the processing mechanism by using a blanking mechanism, and judging whether the processed material is qualified by using a detection module;
if the processed material is qualified, a control module and a blanking mechanism are used for conveying the qualified material to a blanking position;
if the processed material is unqualified, the control module and the blanking mechanism are used for conveying the unqualified material to a waste position.
Further, a feeding longitudinal lower limit, a feeding longitudinal upper position and a feeding transverse discharging position are sequentially arranged in a feeding path of the feeding mechanism; the feeding longitudinal lower limit is positioned below the feeding longitudinal upper limit; the feeding longitudinal upper position and the feeding transverse discharging position are positioned on the same horizontal plane; the feeding transverse discharging position is positioned above the processing mechanism;
the feeding process comprises the following steps:
and (3) feeding and longitudinal material taking processes: lifting the material from the lower limit of the feeding longitudinal direction to the upper limit of the feeding longitudinal direction by using a feeding mechanism;
and (3) feeding and transverse transmission processes: detecting whether a material exists on the upper longitudinal feeding position, and if the material exists on the upper longitudinal feeding position, horizontally conveying the material on the upper longitudinal feeding position to a transverse feeding position by using a feeding mechanism;
if no material exists on the upper longitudinal feeding position, repeating the longitudinal feeding process;
if the number of times of repeating the feeding longitudinal material taking process exceeds the set number of times, stopping the feeding process;
and (3) feeding and longitudinal discharging processes: and the material on the feeding transverse discharging position is downwards moved to the processing mechanism by using the feeding mechanism.
Further, a feeding longitudinal discharging position, a feeding transverse waste position, a feeding position and a waste position are sequentially arranged in a feeding path of the feeding mechanism; the blanking longitudinal discharging position is positioned above the processing mechanism; the horizontal discharging position, the longitudinal discharging position and the horizontal waste discharging position are all positioned on the same horizontal plane; the discharging position is positioned below the discharging transverse discharging position, and the waste material position is positioned below the discharging transverse waste material position;
the blanking process comprises the following steps:
and (3) a blanking longitudinal material taking process: lifting the processed material at the processing mechanism to a longitudinal discharging position of blanking by using a blanking mechanism, and judging whether the processed material is qualified by using a detection module;
and (3) a blanking transverse transmission process: if the processed material is qualified, horizontally conveying the qualified material on the longitudinal discharging position of the discharging to the transverse discharging position of the discharging by using a control module and a discharging mechanism;
if the processed material is unqualified, horizontally conveying the unqualified material on the vertical discharging position of the discharging to a horizontal discharging position of the discharging by using a control module and a discharging mechanism;
and (3) a blanking longitudinal blanking process: a blanking mechanism is used for downwards moving the materials on the blanking horizontal discharging position to the blanking position;
and (5) using a blanking mechanism to move the material on the blanking transverse waste material level downwards to the waste material level.
Further, after the longitudinal blanking process, calculating the preset height of the material on the blanking level, and detecting the actual height of the material on the blanking level;
judging whether the preset height of the material is consistent with the actual height;
if the preset height of the material is inconsistent with the actual height, stopping the longitudinal discharging process.
The processing method of the semiconductor material provided by the invention has the following beneficial effects:
the semiconductor processing equipment provided by the invention comprises a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging level and a waste level. The feeding mechanism is arranged on one side of the processing mechanism, the feeding mechanism is used for conveying materials to the processing mechanism, and the processing mechanism is used for processing the materials. The detection module is arranged at the processing mechanism and is connected with the control module. The control module is connected with the unloading mechanism, and unloading mechanism sets up in one side of processing mechanism, and unloading level and waste material position are located one side of unloading mechanism respectively. The detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified according to the information detected by the detection module, and controlling the blanking mechanism to convey qualified materials to the blanking position when the material is qualified, and controlling the blanking mechanism to convey unqualified materials to the waste position when the material is unqualified. The feeding mechanism in the semiconductor processing equipment provided by the invention can replace manual feeding, the discharging mechanism can replace manual discharging, and the detection module and the control module can be matched to work so as to automatically reject unqualified materials after processing, thereby improving the production efficiency.
Compared with the prior art, the feeding mechanism and the discharging mechanism in the semiconductor material processing equipment can realize the automatic feeding and discharging process, and the production efficiency is improved. In addition, the detection module, the control module and the blanking mechanism in the semiconductor material processing equipment can be matched with each other to remove unqualified materials in processed materials, so that the process of manually removing the unqualified materials is omitted, the production efficiency is further improved, and the production cost is saved.
The semiconductor material processing device is applied to the semiconductor material processing method, and the semiconductor material processing method comprises the following steps: and (3) feeding: conveying the materials to a processing mechanism by using a feeding mechanism; the processing process comprises the following steps: processing the material by using a processing mechanism; and (3) blanking: taking out the processed material from the processing mechanism by using a blanking mechanism, and judging whether the processed material is qualified by using a detection module; if the processed material is qualified, a control module and a blanking mechanism are used for conveying the qualified material to a blanking position; if the processed material is unqualified, the control module and the blanking mechanism are used for conveying the unqualified material to a waste position.
The semiconductor material processing equipment is applied to the semiconductor processing method provided by the invention, so that the semiconductor processing method provided by the invention has the same beneficial effects as the semiconductor material processing equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a semiconductor processing apparatus according to a first embodiment of the present invention;
fig. 2 is a front view of the semiconductor processing apparatus of fig. 1;
fig. 3 is a schematic structural diagram of the feeding mechanism in fig. 1;
fig. 4 is a schematic structural diagram of the blanking mechanism in fig. 1;
FIG. 5 is a schematic view of the first longitudinal movement driving assembly shown in FIG. 3;
fig. 6 is a schematic structural view of the second vertical movement driving assembly in fig. 4.
Icon: 1-a feeding mechanism; 10-a first traverse drive assembly; 11-a first longitudinal movement drive assembly; 12-a first pick-up assembly; 2-a blanking mechanism; 20-a second traverse drive assembly; 21-a second longitudinal movement drive assembly; 22-a second pick-up assembly; 3-an electric motor; 30-pulleys; 31-a conveyor belt; 4-a guide rail; 5-a first material detection part; a 6-buffer; 7-a second material detection member; 8-a bedplate; 9-connecting plates.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
as shown in fig. 1-2, the semiconductor material processing apparatus provided in this embodiment includes a feeding mechanism 1, a processing mechanism, a discharging mechanism 2, a detection module, a control module, a discharging level, and a waste level. The feeding mechanism 1 is arranged on one side of the processing mechanism, the feeding mechanism 1 is used for conveying materials to the processing mechanism, and the processing mechanism is used for processing the materials. The detection module is arranged at the processing mechanism and is connected with the control module; the control module is connected with the blanking mechanism 2, the blanking mechanism 2 is arranged on one side of the processing mechanism, and the blanking level and the waste material level are respectively positioned on one side of the blanking mechanism 2.
Wherein the material is a semiconductor material. The detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified according to the information detected by the detection module, the blanking mechanism 2 is controlled to convey qualified materials to the blanking position when the material is qualified, and the blanking mechanism 2 is controlled to convey unqualified materials to the waste position when the material is unqualified.
The feed mechanism 1 in the semiconductor processing equipment that this embodiment provided can replace artifical material loading, and feed mechanism 2 can replace artifical unloading, and detection module and control module cooperation work can reject out the unqualified material after the processing voluntarily, and then can improve production efficiency.
Compared with the prior art, the feeding mechanism 1 and the discharging mechanism 2 in the semiconductor material processing equipment provided by the embodiment can realize the automatic feeding and discharging process, and the production efficiency is improved. In addition, the detection module, the control module and the blanking mechanism 2 in the semiconductor material processing equipment can be matched with each other to remove unqualified materials in processed materials, so that the process of manually removing the unqualified materials is omitted, the production efficiency is further improved, and the production cost is saved.
It can be seen that the semiconductor material processing equipment provided by the embodiment relieves the technical problem that in the process of processing materials by the existing automatic feeding and discharging semiconductor material processing equipment in the prior art, waste materials are required to be manually removed after the material processing fails, so that the production efficiency is still lower.
The semiconductor material processing equipment that this embodiment provided still includes the feed box, and the feed box is located one side of feed mechanism 1, and feed mechanism 1 can carry the material in the feed box to the processing agency on.
The upper bin is used for storing semiconductor materials, the semiconductor materials are in a sheet shape, and when the semiconductor materials are stored in the upper bin, the semiconductor materials are horizontally stacked in the upper bin.
It can be seen that, when the semiconductor material processing apparatus provided in this embodiment processes semiconductor materials, the feeding mechanism 1 and the discharging mechanism 2 operate separately, without interfering with each other. The feeding mechanism 1 can convey stacked materials from the feeding box to the processing mechanism. The blanking mechanism 2 can convey processed materials to a blanking level or a waste level according to the processing effect under the action of the detection module and the control module.
Further, the detection module is a camera, and the control module is a programmable logic controller.
The processing mechanism can be various semiconductor processing mechanisms adopted in the existing semiconductor industry, and correspondingly, the qualification judgment of the semiconductor material processed by the processing mechanism has various conditions, such as whether the processed semiconductor material has cracks or not, and whether the shape and the size of the semiconductor material meet the requirements or not.
The camera can send the appearance information of the processed semiconductor material to the programmable logic controller, the appearance information of the qualified semiconductor material, such as the image information of the qualified semiconductor material, is recorded in the programmable logic controller, then the programmable logic controller can compare the processed semiconductor material with the qualified semiconductor material and judge whether cracks or defects are generated on the surface of the processed semiconductor material, and then whether the processed semiconductor material is qualified or not can be judged, and then the blanking mechanism 2 can be controlled to work according to the judging result.
As shown in fig. 1, 3 and 5, the feeding mechanism 1 includes a first traverse driving assembly 10, a first longitudinal movement driving assembly 11 and a first pickup assembly 12. The first traverse driving assembly 10 is located above the processing mechanism, the first traverse driving assembly 10 is connected with the first longitudinal moving driving assembly 11, and the first longitudinal moving driving assembly 11 is connected with the first pickup assembly 12. The first traverse driving assembly 10 is used for driving the first longitudinal movement driving assembly 11 and the first pickup assembly 12 to move along the horizontal direction, and the first longitudinal movement driving assembly 11 is used for driving the first pickup assembly 12 to move along the vertical direction; the first pick-up assembly 12 is for picking up material.
The first traverse driving assembly 10 can drive the first longitudinal movement driving assembly 11 and the first pickup assembly 12 which are positioned higher than the processing mechanism to move along the horizontal direction, so that the pickup assembly can be driven to be positioned right above the processing mechanism. And the first longitudinally moving drive assembly 11 may drive the first pick-up assembly 12 closer to or to the material on the processing machine.
The first traversing driving assembly 10 and the first longitudinal moving driving assembly 11 can flexibly adjust the position of the first picking assembly 12 when being matched, thereby being convenient for the first picking assembly 12 to accurately pick up materials.
Wherein the first traverse drive assembly 10 comprises a motor 3, a conveyor belt 31, a pulley 30 and a guide rail 4. The guide rail 4 is horizontally fixed at a position higher than the processing mechanism, the motors 3 are mounted at two ends of the guide rail 4, one belt wheel 30 is mounted on the output shaft of each motor 3, and the conveyor belt 31 is mounted on the two belt wheels 30. The first vertical movement driving assembly 11 is slidably connected to one side of the guide rail 4 and connected to the conveyor belt 31. The motor 3 is used for driving the conveyor belt 31 to rotate, and the conveyor belt 31 is used for driving the first longitudinal movement driving assembly 11 connected with the conveyor belt to move along the horizontal direction.
As shown in fig. 1, 4 and 6, the discharging mechanism 2 includes a second traverse driving assembly 20, a second longitudinal movement driving assembly 21 and a second pickup assembly 22. The second traverse driving assembly 20 is located above the processing mechanism, the second traverse driving assembly 20 is connected with the second longitudinal moving driving assembly 21, and the second longitudinal moving driving assembly 21 is connected with the second pickup assembly 22. The second traverse driving assembly 20 is used for driving the second longitudinal movement driving assembly 21 and the second pickup assembly 22 to move along the horizontal direction, and the second longitudinal movement driving assembly 21 is used for driving the second pickup assembly 22 to move along the vertical direction; the second pick-up assembly 22 is for picking up material.
The second traverse driving assembly 20 can drive the second longitudinal movement driving assembly 21 and the second pickup assembly 22 which are positioned higher than the processing mechanism to move along the horizontal direction, so that the pickup assembly can be driven to be positioned right above the processing mechanism. And the second longitudinally moving drive assembly 21 may drive the second pick-up assembly 22 toward or against the material on the processing machine.
The second traverse driving assembly 20 and the second longitudinal driving assembly 21 can flexibly adjust the position of the second pickup assembly 22 when being matched, thereby being convenient for the second pickup assembly 22 to accurately pick up materials.
The second traverse driving assembly 20 may have the same structure as the first traverse driving assembly 10, and the second traverse driving assembly 20 may include a motor 3, a conveyor belt 31, a pulley 30, and a guide rail 4. The guide rail 4 is horizontally fixed at a position higher than the processing mechanism, the motors 3 are mounted at two ends of the guide rail 4, one belt wheel 30 is mounted on the output shaft of each motor 3, and the conveyor belt 31 is mounted on the two belt wheels 30. The second longitudinal movement driving unit 21 is slidably connected to one side of the guide rail 4 and connected to the conveyor belt 31. The motor 3 is used for driving the conveyor belt 31 to rotate, and the conveyor belt 31 is used for driving the second longitudinal movement driving assembly 21 connected with the conveyor belt to move along the horizontal direction.
As shown in fig. 5, the semiconductor material processing apparatus provided in this embodiment further includes a first material detecting member 5, where the first material detecting member 5 is mounted on the first pickup assembly 12, and is configured to detect whether the first pickup assembly 12 picks up a material.
The first material detecting element 5 may be a photoelectric sensor, and the first material detecting element 5 is used for detecting whether the first pickup assembly 12 picks up a material, so that the material processing process can be smoothly performed.
As shown in fig. 5, the semiconductor material processing apparatus provided in this embodiment further includes a buffer 6, where the first pickup assembly 12 is a chuck, and the buffer 6 is installed between the first longitudinal movement driving assembly 11 and the first pickup assembly 12.
The buffer 6 is a buffer 6 which is common to the existing machining, and the buffer 6 is used for reducing vibration of the sucker, so that stability in the material machining process is facilitated, and materials are protected.
The suction cup facilitates stable removal of material from the loading magazine and reduces damage to the material, so this embodiment preferably provides the first pick-up assembly 12 as a suction cup.
Further, the first pickup assembly 12 may be a vacuum chuck.
As shown in fig. 6, the semiconductor material processing apparatus provided in this embodiment further includes a second material detecting member 7, where the second material detecting member 7 is mounted on the second pickup assembly 22, for detecting whether the second pickup assembly 22 picks up the material.
The second material detecting element 7 may also be a photoelectric sensor, where the second material detecting element 7 is used to detect whether the second pickup assembly 22 picks up the material, so as to facilitate smooth performance of the material processing process.
In this embodiment, the second pick-up assembly 22 is a suction cup.
Since the suction cup can not only stably pick up the material but also reduce damage to the material, the second pick-up assembly 22 is preferably a suction cup.
Further, the second pick-up assembly 22 may be a vacuum chuck.
As shown in fig. 1 to 4, the semiconductor material processing apparatus provided in this embodiment further includes a platen 8, and the feeding mechanism 1 and the discharging mechanism 2 are both mounted on the platen 8.
The bedplate 8 is used for supporting the feeding mechanism 1 and the discharging mechanism 2, and can be used for arranging the feeding mechanism 1 and the discharging mechanism 2 together in a machine, so that the occupied space of the semiconductor material processing equipment is reduced.
In this embodiment, the first longitudinal movement driving assembly 11 and the second longitudinal movement driving assembly 21 may each employ an existing linear module slider.
Further, as shown in fig. 5 and 6, the sliders in the linear module sliders may be connected to a connection board 9, where the connection board 9 is connected to the first pick-up assembly 12 or the second pick-up assembly 22.
Further, a bending part can be arranged on the connecting plate 9, and the distance between the first picking assembly 12 or the second picking assembly 22 and the linear module sliding block can be increased at the bending part on the connecting plate 9, so that the linear module sliding block can be prevented from affecting the process of picking up materials.
The working process of the semiconductor material processing device provided by the embodiment includes a material taking process before loading, a material loading process, a processing process, a material taking process before unloading and an unloading process, and the specific process is as follows:
the material taking process comprises the following steps: the first pickup assembly 12 is driven to hang right above the feeding box, and then the first longitudinal movement driving assembly 11 drives the first pickup assembly 12 to descend at a constant speed, and after the first pickup assembly 12 descends to a certain position, the first pickup assembly 12 stops moving. The first pick-up assembly 12 is then moved vertically at a slower speed a distance that ensures that the first pick-up assembly 12 is in sufficient contact with the material in the upper magazine. And then the first pickup assembly 12 is started to enable the first pickup assembly 12 to take out materials in the feeding box, and the first longitudinal movement driving assembly 11 is utilized to drive the first pickup assembly 12 to move upwards, so that the material taking process before feeding is completed. Wherein, during the material taking process, the first material detecting member 5 is kept working to judge whether the first picking assembly 12 is successfully taking material. If the first material detecting member 5 detects that the first pickup assembly 12 has material, the material taking is successful, and if the material is not detected, the material taking is proved to be failed, and at this time, the number of times of the material taking failure can be recorded, and the above actions can be repeated to re-take the material. During the re-picking process, the first picking assembly 12 may be moved a fixed distance to the distance (the fixed value may be set in advance). After the material is successfully taken, resetting the count of the material taking failure times, and if the continuous material taking failure times exceed a certain number, alarming and prompting, wherein the continuous material taking failure times can be set in advance.
And (3) feeding: the first pickup assembly 12 is moved above the processing mechanism by the first traverse driving assembly 10, and then the material on the first pickup assembly 12 is driven to approach the processing mechanism by the first longitudinal movement driving assembly 11, so that the material is loosened by the first pickup assembly 12, and the material is positioned on the processing mechanism.
The processing process comprises the following steps: after the material is located on the processing mechanism, the processing mechanism processes the material.
The material taking process before blanking: after the material is processed, the processing mechanism moves the material under the second pick-up assembly 22, and the second pick-up assembly 22 picks up the material. During the take out process, the second material detection member 7 remains operative to determine whether the second pick-up assembly 22 was successfully taking out. If the second material detecting member 7 detects that the second pickup assembly 22 has material, the material taking is successful, and if the material is not detected, the material taking is proved to be failed, and the material taking needs to be repeated.
And (3) blanking: the second longitudinal movement driving assembly 21 and the second transverse movement driving assembly 20 are matched, and the materials picked up by the second pickup assembly 22 are conveyed to a waste material position or a discharging position in combination with the control process of the control module.
Embodiment two:
the semiconductor material processing method provided in this embodiment is applied to the semiconductor material processing apparatus in the first embodiment, and the semiconductor material processing method includes a feeding process, a processing process and a discharging process.
Wherein, the material loading process: and conveying the materials to a processing mechanism by using a feeding mechanism. The processing process comprises the following steps: and processing the material by using a processing mechanism. And (3) blanking: taking out the processed material from the processing mechanism by using a blanking mechanism, and judging whether the processed material is qualified by using a detection module; if the processed material is qualified, a control module and a blanking mechanism are used for conveying the qualified material to a blanking position; if the processed material is unqualified, the control module and the blanking mechanism are used for conveying the unqualified material to a waste position.
The feeding path of the feeding mechanism is sequentially provided with a feeding longitudinal lower limit, a feeding longitudinal upper position and a feeding transverse discharging position. The feeding longitudinal lower limit is positioned below the feeding longitudinal upper limit. The feeding longitudinal upper position and the feeding transverse discharging position are positioned on the same horizontal plane. The horizontal discharging position of material loading is located the top of processing agency.
Further, the feeding process comprises a feeding longitudinal material taking process, a feeding transverse transmission process and a feeding longitudinal discharging process.
Wherein, the longitudinal material taking process of material loading: and the material is lifted from the lower limit of the feeding longitudinal direction to the upper limit of the feeding longitudinal direction by using the feeding mechanism.
And (3) feeding and transverse transmission processes: detecting whether a material exists on the upper longitudinal position of the feeding machine, and if the material exists on the upper longitudinal position of the feeding machine, horizontally conveying the material on the upper longitudinal position of the feeding machine to the transverse discharging position of the feeding machine by using the feeding mechanism. And if no material exists on the upper longitudinal feeding position, repeating the longitudinal feeding process. And if the number of times of repeating the feeding longitudinal material taking process exceeds the set number of times, stopping the feeding process.
And (3) feeding and longitudinal discharging processes: and the material on the feeding transverse discharging position is downwards moved to the processing mechanism by using the feeding mechanism.
When the semiconductor material processing device in the first embodiment and the semiconductor material processing method provided by the first embodiment are used for processing materials, the feeding box can be placed on the longitudinal lower limit of the feeding in the feeding process, the first pickup assembly is driven to be suspended above the feeding box, and then the first pickup assembly is driven by the first longitudinal movement driving assembly to descend at a constant speed, and after the first pickup assembly descends to a certain position, the first pickup assembly is stopped moving. The first pick-up assembly is then moved vertically at a slower speed a distance to ensure that the first pick-up assembly is able to make sufficient contact with the material in the loading magazine. And then opening the first pickup assembly to enable the first pickup assembly to take out the materials in the feeding box, and then driving the first pickup assembly to move upwards by utilizing the first longitudinal movement driving assembly to finish the material taking process before feeding.
In the material taking process, the first material detection part keeps working to judge whether the first pickup assembly successfully takes materials or not. If the first material detection part detects that the first pickup assembly has materials, the material taking is successful, and if the material is not detected, the material taking is proved to be failed, and at the moment, the material taking failure times can be recorded, and the actions can be repeated to re-take the materials. During the process of re-taking the material, when the first pick-up assembly moves a certain distance again, a fixed value (which may be set in advance) may be added to the certain distance. After the material is successfully taken, resetting the count of the material taking failure times, and if the continuous material taking failure times exceed a certain number, alarming and prompting, wherein the continuous material taking failure times can be set in advance.
The blanking path of the blanking mechanism is sequentially provided with a longitudinal blanking position, a transverse blanking position, a blanking position and a waste position. The vertical discharging position of unloading is located the processing agency top. The horizontal discharging position of the discharging, the vertical discharging position of the discharging and the horizontal waste position of the discharging are all positioned on the same horizontal plane. The discharging position is positioned below the discharging transverse discharging position, and the waste material position is positioned below the discharging transverse waste material position.
Further, the blanking process comprises a blanking longitudinal material taking process, a blanking transverse transmission process and a blanking longitudinal discharging process.
Wherein, the vertical extracting process of unloading: and lifting the processed material at the processing mechanism to a longitudinal discharging position of the blanking by using the blanking mechanism, and judging whether the processed material is qualified by using the detection module.
And (3) a blanking transverse transmission process: and if the processed material is qualified, horizontally conveying the qualified material on the longitudinal discharging position of the blanking to the transverse discharging position of the blanking by using a control module and a blanking mechanism. If the processed material is unqualified, the control module and the blanking mechanism are used for horizontally conveying the unqualified material on the blanking longitudinal discharging position to the blanking transverse waste position.
And (3) a blanking longitudinal blanking process: and (5) using a blanking mechanism to move the material on the blanking transverse discharging position downwards to the blanking position. And (5) using a blanking mechanism to move the material on the blanking transverse waste material level downwards to the waste material level.
When the semiconductor material processing device in the first embodiment and the semiconductor material processing method provided in this embodiment are used to process materials, the second material detecting element may also be used to determine whether the second pickup assembly successfully picks up materials during the blanking process. If the second material detection part detects that the second pickup assembly has materials, the material taking is successful, and if the materials are not detected, the material taking failure is proved, and the material needs to be taken again.
Further, after the blanking longitudinal blanking process, calculating a preset height of the material on the blanking level, and detecting an actual height of the material on the blanking level. And then judging whether the preset height of the material is consistent with the actual height of the material, and stopping the longitudinal discharging process if the preset height of the material is inconsistent with the actual height of the material.
If the preset height of the material is inconsistent with the actual height, fragments or the material is possibly not separated from the blanking mechanism, so that the blanking longitudinal blanking process can be stopped in time or the damaged material on the blanking level can be processed in time or the blanking mechanism still carries the material after the blanking process is processed in time by judging whether the preset height of the material is consistent with the actual height.
The preset height of the material on the blanking level can be calculated according to the formula (1):
D＝D 0 -(n-1)×Δd (1)
wherein D is the preset height of the material on the blanking level, D 0 For the height of the blanking level, n is the count of the blanking materials (n is more than or equal to 1), and Δd is the thickness of each material.
The semiconductor material processing device is used in the semiconductor processing method provided by the embodiment, so that the semiconductor material processing device and the semiconductor processing method provided by the embodiment can solve the same technical problems and achieve the same technical effects.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (4)

1. The semiconductor material processing method is characterized by applying semiconductor material processing equipment, wherein the semiconductor material processing equipment comprises a feeding mechanism, a processing mechanism, a discharging mechanism, a detection module, a control module, a discharging level and a waste level;
the feeding mechanism is arranged on one side of the processing mechanism and used for conveying materials to the processing mechanism, and the processing mechanism is used for processing the materials;
the detection module is arranged at the processing mechanism and is connected with the control module; the control module is connected with the blanking mechanism, the blanking mechanism is arranged on one side of the processing mechanism, and the blanking level and the waste material level are respectively positioned on one side of the blanking mechanism;
the detection module is used for detecting the appearance of the material processed by the processing mechanism, the control module is used for judging whether the material processed by the processing mechanism is qualified according to the information detected by the detection module, controlling the blanking mechanism to convey qualified material to the blanking position when the material is qualified, and controlling the blanking mechanism to convey unqualified material to the waste position when the material is unqualified;
the feeding mechanism comprises a first transverse moving driving assembly, a first longitudinal moving driving assembly and a first pickup assembly;
the first transverse moving driving assembly is positioned above the processing mechanism and connected with the first longitudinal moving driving assembly, and the first longitudinal moving driving assembly is connected with the first pickup assembly;
the first transverse moving driving assembly is used for driving the first longitudinal moving driving assembly and the first pickup assembly to move along the horizontal direction, and the first longitudinal moving driving assembly is used for driving the first pickup assembly to move along the vertical direction; the first pickup assembly is used for picking up materials;
the semiconductor material processing equipment further comprises a first material detection piece, wherein the first material detection piece is arranged on the first pickup assembly and is used for detecting whether the first pickup assembly picks up materials or not;
the semiconductor material processing method comprises the following steps:
and (3) feeding: conveying the material to the processing mechanism by using the feeding mechanism;
the processing process comprises the following steps: processing the material by using the processing mechanism;
and (3) blanking: taking out the processed material from the processing mechanism by using the blanking mechanism, and judging whether the processed material is qualified by using the detection module;
if the processed material is qualified, the control module and the blanking mechanism are used for conveying the qualified material to the blanking position;
if the processed material is unqualified, the control module and the blanking mechanism are used for conveying the unqualified material to the waste position;
a feeding longitudinal lower limit, a feeding longitudinal upper position and a feeding transverse discharging position are sequentially arranged in a feeding path of the feeding mechanism; the feeding longitudinal lower limit is positioned below the feeding longitudinal upper limit; the feeding longitudinal upper position and the feeding transverse discharging position are positioned on the same horizontal plane; the feeding transverse discharging position is positioned above the processing mechanism;
the feeding process comprises the following steps:
and (3) feeding and longitudinal material taking processes: lifting the material from the feeding longitudinal lower limit to the feeding longitudinal upper limit by using the feeding mechanism;
and (3) feeding and transverse transmission processes: detecting whether a material exists on the upper longitudinal feeding position, and if the material exists on the upper longitudinal feeding position, horizontally conveying the material on the upper longitudinal feeding position to the transverse feeding position by using the feeding mechanism;
if no material exists on the upper longitudinal feeding position, repeating the longitudinal feeding process;
if the number of times of repeating the feeding longitudinal material taking process exceeds the set number of times, stopping the feeding process;
and (3) feeding and longitudinal discharging processes: the feeding mechanism is used for downwards moving the materials on the feeding transverse discharging position to the processing mechanism;
a feeding longitudinal feeding position, a feeding transverse waste position, a feeding position and a waste position are sequentially arranged in a feeding path of the feeding mechanism; the blanking longitudinal discharging position is positioned above the processing mechanism; the horizontal discharging position, the longitudinal discharging position and the horizontal waste discharging position are all positioned on the same horizontal plane; the discharging position is positioned below the discharging transverse discharging position, and the waste material position is positioned below the discharging transverse waste material position;
the blanking process comprises the following steps:
and (3) a blanking longitudinal material taking process: lifting the processed material at the processing mechanism to the longitudinal discharging position of the blanking by using the blanking mechanism, and judging whether the processed material is qualified by using the detection module;
and (3) a blanking transverse transmission process: if the processed material is qualified, horizontally conveying the qualified material on the blanking longitudinal discharging position to the blanking transverse discharging position by using the control module and the blanking mechanism;
if the processed material is unqualified, horizontally conveying the unqualified material on the blanking longitudinal discharging position to the blanking transverse waste position by using the control module and the blanking mechanism;
and (3) a blanking longitudinal blanking process: using the blanking mechanism to move down the material on the blanking transverse discharging position to the blanking position;
using the blanking mechanism to move down the material on the blanking transverse waste position to the waste position;
in the material taking process, the first material detection part keeps working to judge whether the first pickup assembly successfully takes materials or not; if the first material detection part detects that the first pickup assembly is provided with the material, the material taking is successful, if the material is not detected, the material taking failure is proved, and the material taking failure times are recorded and the material is taken again; in the process of re-taking the materials, when the first pickup assembly moves for a certain distance again, a fixed value is added to the certain distance, after the materials are successfully taken, the count of the failure times of taking the materials is cleared, and if the failure times of continuous materials exceed the set times, an alarm prompt is given;
after a longitudinal blanking process, calculating a preset height of the material on the blanking level, and detecting an actual height of the material on the blanking level;
judging whether the preset height of the material is consistent with the actual height;
if the preset height of the material is inconsistent with the actual height, stopping the longitudinal discharging process.
2. The method of claim 1, wherein the detection module is a camera and the control module is a programmable logic controller.
3. The method of any of claims 1-2, wherein the blanking mechanism comprises a second traverse drive assembly, and a second pick-up assembly;
the second transverse moving driving assembly is positioned above the processing mechanism and connected with the second longitudinal moving driving assembly, and the second longitudinal moving driving assembly is connected with the second pickup assembly;
the second transverse moving driving assembly is used for driving the second longitudinal moving driving assembly and the second pickup assembly to move along the horizontal direction, and the second longitudinal moving driving assembly is used for driving the second pickup assembly to move along the vertical direction; the second pick-up assembly is used for picking up materials.
4. A method of processing semiconductor material according to claim 3, wherein the semiconductor material processing apparatus further comprises a second material detection member mounted on the second pick-up assembly for detecting whether the second pick-up assembly picks up material.
CN202010445688.XA 2020-05-22 2020-05-22 Semiconductor material processing method Active CN111584403B (en)

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