KR102041957B1 - Apparatus of Sawing and Array for Semiconductor Strip and Method thereof - Google Patents

Apparatus of Sawing and Array for Semiconductor Strip and Method thereof Download PDF

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KR102041957B1
KR102041957B1 KR1020150120937A KR20150120937A KR102041957B1 KR 102041957 B1 KR102041957 B1 KR 102041957B1 KR 1020150120937 A KR1020150120937 A KR 1020150120937A KR 20150120937 A KR20150120937 A KR 20150120937A KR 102041957 B1 KR102041957 B1 KR 102041957B1
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adsorption
semiconductor
unit
semiconductor package
semiconductor packages
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KR1020150120937A
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Korean (ko)
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KR20170026751A (en
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임재영
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한미반도체 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a semiconductor strip cutting and aligning apparatus having a predetermined shape and cutting semiconductor strips in which the semiconductor packages are arranged symmetrically in odd and even rows, and aligning the cut semiconductor packages. A cut portion for cutting into a semiconductor package, a unit picker for picking up the cut semiconductor package by vacuum suction, and transferring the vacuum-adsorbed semiconductor package to a drying unit through a washing unit, and the semiconductor package delivered by the unit picker. Adsorption and drying, but is provided so as to reciprocate in the X-axis, the adsorption plate for adsorbing the semiconductor package is provided with a drying unit rotatably provided on the Y axis on the XY plane, and receives the semiconductor package from the drying unit A semiconductor pad disposed on the odd-numbered rows A first alignment table for adsorbing and aligning the sheets and a second alignment table for receiving and absorbing semiconductor packages from the drying unit, and adsorbing and arranging semiconductor packages disposed in the even rows; The second alignment table may be provided to be rotated 180 degrees on the XY plane.

Figure R1020150120937

Description

Apparatus of Sawing and Array for Semiconductor Strip and Method

The present invention relates to an apparatus and method for cutting and aligning semiconductor strips. More specifically, the present invention relates to cutting and aligning a semiconductor strip for efficient handling when the semiconductor package is arranged in a symmetrical manner to maximize the number of semiconductor packages that can be accommodated in one strip when the semiconductor package has a special shape. It relates to an apparatus and a method thereof.

The semiconductor strip cutting and aligning device refers to a device for cutting a packaged semiconductor strip into a plurality of semiconductor packages.

In addition to simply cutting the semiconductor strip, the semiconductor strip cutting and aligning device performs cutting, cleaning, and drying processes, and then inspects the top and bottom of each semiconductor package by inspecting the quality and inspecting the quality. It is possible to provide a function of processing a series of processes for classifying semiconductors and defective semiconductors and taking them out to an export tray.

In recent years, in order to maximize the number of semiconductor packages that can be accommodated in a single semiconductor strip, in a case in which the semiconductor packages have a special shape ('-'), they are symmetrical with each other ('-', '-'). Arrayed semiconductor strips are being developed.

However, such a semiconductor strip is difficult to inspect because the direction and shape of the package are different from each other when vision inspection is performed on each semiconductor package after individualization to each semiconductor package and cleaning is completed.

In addition, after the inspection is completed, since the semiconductor package must be loaded in the tray in the same direction, a component such as a rotation means is additionally required, which may cause a problem that the volume of equipment is increased or the working time is delayed.

The present invention is to provide a semiconductor strip cutting and alignment apparatus that can perform a series of processes such as cutting, cleaning, inspection, and loading more efficiently when handling semiconductor packages arranged symmetrically with each other. do.

According to an aspect of the present invention, a semiconductor strip cutting and aligning apparatus for cutting a semiconductor strip having a predetermined shape, the semiconductor packages are arranged symmetrically arranged in odd rows and even rows, respectively, and aligns the cut semiconductor packages, Cutting portions for cutting the semiconductor strip into respective semiconductor packages; A unit picker for vacuum picking up the cut semiconductor package and transferring the picked up semiconductor package to a drying unit through a washing unit; The drying unit absorbs and dries the semiconductor package delivered by the unit picker, and is provided to be reciprocated in the X axis, and the absorption plate adsorbing the semiconductor package is rotatably provided on the XY plane with respect to the Y axis. ; A first alignment table that receives the semiconductor package from the drying unit and absorbs the semiconductor package, and absorbs and aligns the semiconductor packages disposed in the odd rows; And a second alignment table that receives the semiconductor package from the drying unit and adsorbs the semiconductor package, wherein the second alignment table adsorbs and arranges the semiconductor packages arranged in the even rows, wherein the first alignment table or the second alignment table is 180 on an XY plane. A semiconductor strip cutting and aligning device may be provided to be rotatable.

In addition, the semiconductor strip cutting and aligning apparatus may be provided, wherein the first alignment table or the second alignment table is rotated 180 degrees on the XY plane so that the semiconductor packages arranged on the respective alignment tables are aligned in the same shape. have.

The drying unit may include a first adsorption unit provided on one surface of the adsorption plate and capable of vacuum adsorption of semiconductor packages disposed in the odd row, and a side of the adsorption plate provided on the even row. A second adsorption unit capable of vacuum adsorption of the semiconductor packages to be arranged, a first pneumatic line for applying air pressure to the first adsorption unit, and a second pneumatic line for applying air pressure to the second adsorption unit, The first pneumatic line and the second pneumatic line can be provided with a semiconductor strip cutting and alignment device, characterized in that to apply the air pressure independently.

In addition, the first pneumatic line is provided with a plurality of lines extending along the row direction to communicate with the first adsorption units arranged in the same row, the second pneumatic line is in communication with the second adsorption units arranged in the same row The semiconductor strip cutting and aligning apparatus may be provided, which is provided with a plurality of lines extending along the row direction.

In addition, the first pneumatic line is provided in a continuous "W" shape, to connect the first adsorption units arranged in adjacent rows, the first adsorption units arranged in the same row are provided to skip one by one The second pneumatic line is provided in a continuous "W" shape, and connects the second adsorption units arranged in adjacent rows, and the second adsorption units arranged in the same row are provided to be skipped one by one. A semiconductor strip cutting and aligning device may be provided.

The drying unit may include a first adsorption unit provided on one surface of the adsorption plate and capable of vacuum adsorption of semiconductor packages disposed in the odd row, and the other side of the adsorption plate. A second adsorption unit capable of vacuum adsorption of the semiconductor packages to be arranged, a first pneumatic line for applying air pressure to the first adsorption unit, and a second pneumatic line for applying air pressure to the second adsorption unit, The first pneumatic line and the second pneumatic line may independently apply air pressure, and the drying unit rotates the semiconductor packages adsorbed on one surface of the adsorption plate to invert the upper and lower surfaces of the semiconductor package. And directly rotating the drying unit once more to invert the upper and lower surfaces of the semiconductor package adsorbed on the other surface of the adsorption plate. Wherein the state may be provided with a semiconductor strip cutting and sorting device characterized in that the directly transmitted to the second sorting table.

The unit picker may include a third adsorption unit capable of vacuum adsorption of semiconductor packages provided on one surface and disposed in the odd row, and vacuum adsorption of semiconductor packages provided on one surface and disposed in the even row. A third adsorption part connected to the fourth adsorption part and the third adsorption part, the third adsorption part being provided in a continuous " W " shape and arranged in an adjacent row, and arranged in the same row, The parts are connected to a third pneumatic line arranged to skip one by one, and the fourth adsorption unit is applied to the fourth adsorption unit, provided in a continuous "W" shape, arranged in the adjacent row, The fourth adsorption part disposed in the same row includes a fourth pneumatic line provided to be connected by skipping one by one, and the third pneumatic line and the fourth pneumatic line may independently apply pneumatic pressure. doing Semiconductor strip cutting and aligning devices may be provided.

The unit picker may include a third adsorption unit capable of vacuum adsorption of semiconductor packages provided on one surface and disposed in the odd row, and vacuum adsorption of semiconductor packages provided on one surface and disposed in the even row. A third pneumatic line having a fourth adsorption portion, a plurality of lines extending along the row direction to apply pneumatic pressure to the third adsorption portion, and to communicate with third adsorption portions arranged in the same row; A fourth pneumatic line having a plurality of lines extending along the row direction to apply air pressure to the adsorption unit and to communicate with the fourth adsorption units arranged in the same row, wherein the third pneumatic line and the fourth pneumatic line The semiconductor strip cutting and aligning apparatus can be provided, characterized in that can be applied independently pneumatic.

The apparatus may further include an alignment table picker configured to vacuum-pick up the semiconductor package delivered by the drying unit and transfer the picked up semiconductor package to the first alignment table and the second alignment table. Semiconductor strip cutting and aligning devices may be provided.

In addition, the alignment table picker may vacuum suction the third adsorption unit provided on one surface and capable of vacuum adsorption of the semiconductor packages arranged in the odd row, and the semiconductor packages provided on one surface and arranged in the even row. A third adsorption part connected to the fourth adsorption part and the third adsorption part, the third adsorption part being provided in a continuous " W " shape and arranged in an adjacent row, and arranged in the same row, The parts are connected to a third pneumatic line arranged to skip one by one, and the fourth adsorption unit is applied to the fourth adsorption unit, provided in a continuous "W" shape, arranged in the adjacent row, The fourth adsorption part disposed in the same row includes a fourth pneumatic line provided to be connected by skipping one by one, and the third pneumatic line and the fourth pneumatic line may independently apply pneumatic pressure. A semiconductor strip cutting and sorting apparatus can be provided.

In addition, the semiconductor package having a predetermined shape may be provided with a semiconductor strip cutting and alignment device, characterized in that the 'b' shape or 'b' shape is arranged in a manner (b) symmetric with each other. .

According to another aspect of the invention, the semiconductor strip cutting and alignment method for cutting a semiconductor strip having a predetermined shape, the semiconductor packages are arranged symmetrically arranged in odd rows and even rows, respectively, and aligns the cut semiconductor packages, Cutting the semiconductor strip into respective semiconductor packages; Picking up the cut semiconductor package with a unit picker to adsorb semiconductor packages disposed in odd rows on one surface of the drying unit, and adsorbing semiconductor packages disposed in even rows on the other surface of the drying unit; And rotating the semiconductor packages adsorbed on the drying unit about the y-axis on the xy plane to directly transfer the semiconductor packages disposed in the odd rows with the upper and lower surfaces of the semiconductor package inverted, onto the first alignment table. A semiconductor strip cutting and sorting method may be provided that includes directly rotating on the xy plane once more about the y axis and directly transferring the upper and lower surfaces of the semiconductor package adsorbed to the even rows of the drying unit onto the second alignment table. have.

According to another aspect of the present invention, in the semiconductor strip cutting and alignment method for cutting a semiconductor strip having a predetermined shape, the semiconductor packages are arranged symmetrically arranged in odd and even rows, respectively, Cutting the semiconductor strip into respective semiconductor packages; Picking up the cut semiconductor package with a unit picker and adsorbing the semiconductor package to a drying unit; And an alignment table picker picking up the semiconductor package adsorbed to the drying unit to align the odd-numbered semiconductor packages of the picked-up semiconductor packages to the first alignment table, and to arrange the even-numbered semiconductor packages of the semiconductor packages to the second alignment table. A method of cutting and aligning semiconductor strips may be provided that includes aligning to an alignment table.

In addition, after picking up the semiconductor package seated on the first alignment table and the second alignment table and performing a vision inspection, the semiconductor package having the vision inspection completed is loaded into a tray in the same direction and then taken out. Strip cutting and alignment methods may be provided.

According to the unit picker or the drying unit according to the present invention, only materials of the same shape are selected and stacked on each alignment table among semiconductor packages arranged to be symmetrical with each other, and one of them is rotated to change the direction of the materials. The inspection efficiency can be improved by allowing inspections to be matched with each other. In addition, since the trays can be loaded and unloaded in the same direction, the efficiency of the process is increased.

By sorting the semiconductor packages of the same shape into the alignment table and using the rotation function of the alignment table, it is possible to handle the semiconductor materials arranged symmetrically in an optimal manner without having to rotate the materials each time. It can be shortened.

In addition, the drying unit may be used for simple drying, or may be used for vision inspection and flipping by being rotatable as necessary.

In addition, since the ball-up method and the ball-down method can be accommodated by a simple change of the component, there is an effect that can be switched to various types of operation in one equipment as needed.

In addition, since the drying unit is movable, the semiconductor package is dried during the movement, so that a separate time for the drying operation is unnecessary, thereby reducing the process time.

In addition, the dried semiconductor package can be loaded on the alignment table by simply inverting the upper and lower surfaces of the semiconductor package by simply rotating the suction plate, so that an additional process for inverting the upper and lower surfaces of the semiconductor package is unnecessary and is controlled to rotate while moving. The time required to reverse the upper and lower surfaces of the semiconductor package can be shortened.

In addition, since the mold vision, the ball surface or the lead surface of the semiconductor package, and the tray may be aligned with the first vision unit, various inspections may be performed with one vision unit.

In addition, according to the present invention, all inspections on the upper and lower surfaces of the semiconductor package can be accommodated.

In addition, since the first vision unit is movable in the vertical direction and can be inspected, it is possible to selectively inspect the position of the vision in accordance with the specification change of the semiconductor package, thereby improving the overall package processing speed per unit time of the equipment. It has an effect.

1 is a plan view showing a semiconductor strip cutting and alignment apparatus according to an embodiment of the present invention.
2 is a view showing a semiconductor strip used in the semiconductor strip cutting and alignment apparatus according to an embodiment of the present invention.
3 is a plan view illustrating a semiconductor strip cutting and alignment apparatus according to another embodiment of the present invention.
4 is a perspective view showing an inspection unit according to an embodiment of the present invention.
5 is a plan view illustrating a drying unit mounted on a semiconductor package inspecting unit according to an exemplary embodiment of the present invention.
6 is an enlarged view illustrating a drying unit in FIG. 4.
7 is a view showing a pneumatic pipe of the drying unit according to the first embodiment of the present invention.
FIG. 8 is an enlarged view of region A in FIG. 7.
9 is a view showing a pneumatic pipe of the drying unit according to the second embodiment of the present invention.
FIG. 10 is an enlarged view of region B in FIG. 9.
FIG. 11 is a plan view illustrating a drying unit mounted on a semiconductor package inspecting unit according to another exemplary embodiment of the present inventive concept.
12 is a view showing one surface of a drying unit according to a third embodiment of the present invention.
13 is a view showing the other side of the drying unit according to the third embodiment of the present invention.
14 is a view showing a pneumatic pipe of the unit picker according to the first embodiment of the present invention.
FIG. 15 is an enlarged view of region C in FIG. 14.
16 is a view showing a pneumatic pipe of the unit picker according to the second embodiment of the present invention.
FIG. 17 is an enlarged view of region D in FIG. 16.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the present invention to those skilled in the art. Like numbers refer to like elements throughout.

1 is a plan view illustrating a semiconductor strip cutting and sorting apparatus 1000 according to an embodiment of the present invention.

The semiconductor strip cutting and sorting apparatus 1000 may be classified into a ball down type or a ball up type according to a tray stacking form of a semiconductor package that is generally inspected and taken out. Depending on the manufacturer, the semiconductor package may be loaded in a ball-up state or a ball-down state in the tray, since there may be a difference in a later process or handling and storage of the semiconductor package.

Although there may be a difference between whether the supplied semiconductor strip is supplied in a ball-up state or a ball-down state, it will be described below with the assumption that the cutting target semiconductor strip S is supplied in a ball-up state.

In the semiconductor strip cutting and aligning apparatus 1000 according to the present invention, the on-loader unit 100 provided with a semiconductor strip S inserted into a magazine, and the semiconductor strip S being turned on from the magazine M. The pusher 110 or the drawer 220 for discharging to the outside of the loader unit 100, the inlet rail 210 on which the semiconductor strip S drawn by the pusher 110 or the drawer 220 is seated, A strip picker 230 which vacuum-adsorbs the semiconductor strip S seated on the inlet rail 210 and transfers the semiconductor strip S to the chuck table 250 with the mold surface of the semiconductor strip S facing downward; A cutting unit 200 which supplies a semiconductor strip supplied by the strip picker 230, cuts the plurality of semiconductor packages on the chuck table 250, and washes the upper surfaces of the plurality of cut semiconductor packages with washing water. By the cutting unit 200 Unit vacuum picks up all of the plurality of semiconductor packages that have been cleaned on the top surface at once, and transfers the vacuum-adsorbed semiconductor packages to the drying unit 300 via the cleaning unit 280 and the unit picker ( A suction unit 280 for cleaning the lower surface of the semiconductor package in a vacuum adsorption state by 270, the adsorption to suck the semiconductor package delivered by the unit picker 270 after being washed in the cleaning unit 280 And a plate 310, wherein the adsorption plate 310 is movable along the X-axis direction or the Y-axis direction on the XY plane, and is rotatable as needed based on the Y-axis on the XY plane. The semiconductor package may be disposed in a movement path of the adsorption plate 310 of the drying unit 300, and may move in a vertical direction in an XY plane with respect to the movement direction of the adsorption plate 310. The first vision unit 410, the loading grooves 431a and 431b for loading the semiconductor package adsorbed on the suction plate 310, and the non-loading portion in which the semiconductor package is not loaded are alternately formed along the Y axis direction. The first and second alignment tables 430a and 430a may be transferred to the stacking grooves 431a and 431b by the semiconductor package adsorbed on the adsorption plate 310, and then transferred independently of each other along the Y axis direction. The second vision unit 420 and the semiconductor package of the semiconductor package loaded in the stacking grooves 431a and 431b of the alignment table 430b, the first alignment table 430a, and the second alignment table 430b. According to the test results, the semiconductor package may include a sorting apparatus 500 that transfers and sorts the semiconductor package in the X-axis direction.

The semiconductor strip cutting and aligning apparatus 1000 according to the exemplary embodiment of the present invention may use a semiconductor package having a special shape that is not square or rectangular. Special shapes include asymmetric shapes. The asymmetric shape means that the shapes of both sides are not symmetrical with respect to the center line of the semiconductor package. For example, at least one of the four corners of the semiconductor package may be a straight line that is provided to be inclined with the other corner even though the corner is not a straight line. For example, the semiconductor package may have a shape such as "L" or "a" or "b". That is, it may have a shape in which a part of one edge protrudes from the quadrangle. However, the shape of the semiconductor package may be provided in various ways.

2 is a view showing a semiconductor strip S used in the semiconductor strip cutting and aligning apparatus 1000 according to an embodiment of the present invention, and two embodiments are shown in (a) and (b), respectively.

The semiconductor strip S is cut into several cutting lines to provide a plurality of semiconductor packages. At this time, the cutting line includes a cutting line C1 that is not a straight line and a cutting line C2 that is a straight line.

The cutting line C1 that is not a straight line may use laser cutting because the shape of the cutting line is complicated. The straight cutting line C2 may use a cutter 260 or a blade capable of straight cutting. In the cutting order, the cutting line C1 may be cut using a laser, and then the cutting line C2 may be cut using the cutter 260. On the other hand, since the laser can be used for precise cutting, the thickness of the cutting line C1 using the laser may be thinner than the thickness of the cutting line C2 using the cutter 260.

Of course, the cutting operation may be divided into a laser, a cutter, or a blade depending on the shape to cut the cutting line, any one of these cutting means may be used, or a separate cutting means may be used.

Referring to FIGS. 2A and 2B, after a semiconductor strip S is cut, a semiconductor package disposed in a row L2 disposed adjacent to a semiconductor package disposed in one row L1 may be It is arranged to be symmetrical to each other. Here, symmetry means point symmetry, not line symmetry. By arranging the semiconductor packages in adjacent rows so as to be symmetrical with each other, the area discarded in the semiconductor strip S can be minimized.

In this case, the semiconductor packages arranged in the odd rows L1, L3,?, And L (2n-1) and the semiconductor packages arranged in the even rows L2, L4, ..., L (2n) are symmetrical with each other. In this case, all of the semiconductor packages arranged in one row may have the same layout shape.

In addition, the cutting line C2 which is a straight line includes an X-axis cutting line and a Y-axis cutting line. At this time, the strip cut by the cutting line C2 in the X-axis direction and the Y-axis direction includes two semiconductor packages arranged to be symmetrical with each other, and the two semiconductor packages are divided by the cutting line C1 rather than a straight line. .

On the other hand, the non-linear cut line C1 shown in FIG. 2A extends only in the X-axis and Y-axis directions, and the non-linear cut line C1 shown in FIG. There is a difference in that it includes a cutting line extending to be inclined in the axial and Y-axis directions.

Hereinafter, a semiconductor package having a shape shown in FIG. 2A will be described as an example. However, it is obvious that a semiconductor package having a shape shown in FIG. 2B or a semiconductor package provided in other shapes can be used.

Referring back to FIG. 1, the onloader unit 100 of the semiconductor strip cutting and aligning apparatus 1000 according to an embodiment of the present invention may include a plurality of semiconductor strips S that have been laser cut in a magazine M. FIG. It can mount and can supply these to the cutting part 200 sequentially.

3 is a plan view illustrating a semiconductor strip cutting and sorting apparatus 1001 according to another embodiment of the present invention.

Referring to FIG. 3, a laser cutting part 120 may be interposed between the onloader part 100 and the cutting part 200 of the semiconductor strip cutting and aligning device 1001 according to another embodiment of the present invention. The on-loader unit 100 may mount a plurality of semiconductor strips S1 in a non-cut state in the magazine M and sequentially supply them to the laser cutting unit 120.

And laser cutting is performed in the laser cutting device 121 of the laser cutting unit 120. The cutting line to be laser cut may refer to the cutting line C1 that is not a straight line of FIG. 2. Herein, the semiconductor strip S2 on which the laser cutting is completed is referred to as a semiconductor strip S to be cut.

The cutting target semiconductor strip S may move along the inlet rail 210 and may be supplied to the cutout 200 such that its length direction and the X axis are parallel to each other. The semiconductor strip S2 of the inlet rail 210 may be drawn out by the drawer 220 or picked up by the strip picker 230. The subsequent process is the same as the semiconductor strip cutting and aligning apparatus 1000 according to the embodiment shown in FIG. Therefore, it will be described below with reference to the embodiment shown in FIG.

Referring to FIG. 1, when the pusher 110 of the onloader unit 100 sequentially pushes the semiconductor strip S to be cut toward the cutting unit 200, the semiconductor strip S propelled in the X-axis direction is transferred. The drawer 220 may enter the inside of the inlet rail 210 provided to guide the semiconductor strip, and the drawer 220 may pull the tip of the semiconductor strip S into the X axis in the X-axis direction. The front end of the) grip and tow to allow the strip picker 230 to pick up the semiconductor strip S to be cut.

The strip picker 230 may be mounted on a guide frame 240 provided with driving means in the X-axis direction so that the cutting target semiconductor strip S may be transferred in the X-axis direction.

Next, the strip picker 230 picking up the semiconductor strip S to be cut carries the semiconductor strip to the chuck table 250. The semiconductor strip S mounted on the chuck table 250 may be a material in which a plurality of semiconductor packages are arranged in a matrix form along the X and Y axis directions. Cutting is completed by the cutter 260 or blades and divided into individual semiconductor packages. The cutting line cut at the chuck table 250 may refer to the cutting line C2 of FIG. 2.

The chuck table 250 may be configured to be transportable to any position on the XY plane and to be rotatable about a Z axis, and the semiconductor strip S adsorbed on the chuck table 250 may include at least one cutter ( 260 may be cut into individual semiconductor packages. 1 shows an example in which two cutters 260 are provided. In addition, although one chuck table 250 is illustrated in FIG. 1, two or more chuck tables 250 may be provided to improve work UPH.

The cutter 260 may be cut into individual semiconductor packages during the relative displacement of the chuck table 250, and the plurality of semiconductor packages that have been cut may be picked up and cleaned by the unit picker 270 at one time.

The unit picker 270 may vacuum pick up a plurality of semiconductor packages at a time, transfer them to the cleaning unit 280 and the drying unit 300 to be described later, and perform a cleaning process and a drying process. The washing unit 280 may be provided with a plurality of injection holes 281 for spraying a washing liquid or compressed air. The injection holes 281 may be provided in plural in the width direction (Y direction) of the unit picker 270.

The plurality of semiconductor packages picked up by the unit picker 270 and washed by the cleaning unit 280 may be adsorbed onto the drying unit 300 constituting the semiconductor package inspection unit 400.

Meanwhile, the semiconductor package handled by the semiconductor strip cutting and aligning apparatus 1000 has a ball down type according to the tray stacking form of the semiconductor package to be taken out, 'a ball or lead face faces downward, and a mold face faces upward. And a ball up type (a 'ball or lead face facing upward, a mold face facing downward').

Hereinafter, for convenience of description, the semiconductor strip cutting and aligning apparatus 1000 according to an embodiment of the present invention described in FIG. 1 receives a cutting target semiconductor strip S in a ball-up state, and cuts, cleans, and drys the sheet. And it is assumed that the inspected semiconductor package is taken out to a ball down state. However, the cutting target semiconductor strip S used in the embodiment of the present invention includes being supplied in a ball down state.

Meanwhile, in order to carry out the semiconductor package to the ball-down state from the semiconductor strip S supplied in the ball-up state, the semiconductor package is cut at least once 180 degrees in the process of cutting, cleaning, drying and inspecting the semiconductor strip S. It must be flipped.

The semiconductor strip cutting and aligning apparatus 1000 according to an exemplary embodiment of the present invention shown in FIG. 1 is a drying unit for drying the cleaned semiconductor package without using a separate flipper for vertically inverting the semiconductor package. 300 may be used to perform flipping.

The semiconductor package inspecting unit 400 includes a drying unit 300 having a heater (not shown) for drying the cleaned semiconductor package, and the semiconductor package cut and cleaned by the cutting unit 200 is the unit picker. 270 is carried to the drying unit 300. For example, the semiconductor package transported to the drying unit 300 may be dried by a heat transfer heater or a buried hot wire provided in the drying unit 300.

The drying unit 300 may further include a flipping function and a carrying function. Specifically, the semiconductor package is dried in the state in which the adsorption plate 310 constituting the drying unit 300 is rotated 180 degrees with respect to the Y axis on the XY plane adsorbed to the adsorption plate 310 with respect to the Z axis direction. The upper and lower surfaces of the semiconductor package may be reversed by being transferred to the loading grooves 431a and 431b of the first alignment table 430a or the second alignment table 430b through relative movement. At this time, the drying unit 300 may move in the Z-axis direction or the first alignment table 430a and the second alignment table 430b may move in the Z-axis direction.

The semiconductor package inspecting unit 400 may perform semiconductor package inspection by capturing an upper surface (mold surface) and a lower surface (ball surface or lead surface) of the cut and cleaned semiconductor package.

The semiconductor package upper surface inspection for inspecting the upper surface of the semiconductor package may be a marking inspection on the semiconductor package molding material, and the semiconductor package lower surface inspection may be an inspection for determining a defect such as a gap or a short of a ball or lead wire of the semiconductor package. .

Accordingly, the cut, cleaned and dried semiconductor packages may be inspected from the top and bottom through the captured images by the vision units 410 and 420, respectively.

Accordingly, a semiconductor package inspection unit 400 constituting the semiconductor strip cutting and alignment apparatus 1000 according to the present invention, in which the upper and lower surfaces of the semiconductor package are photographed and inspected to inspect the semiconductor package in which the cutting process, the cleaning process, and the drying process are completed. ) Includes a first vision unit 410 for up looking imaging of the semiconductor package and a second vision unit 420 for down looking imaging.

The first vision unit 410 may be configured to photograph one surface of the top and bottom surfaces of the semiconductor package, and the second vision unit 420 may be configured to photograph another surface of the top and bottom surfaces of the semiconductor package. In addition, the imaging order of the first vision unit 410 and the second vision unit 420 may be variously provided. That is, the second vision unit 420 captures one surface of the semiconductor package, and the first vision unit 410 captures the other surface of the semiconductor package.

As shown in FIG. 1, the first vision unit 410 is provided to be movable in the Y-axis direction by the driving means 415 disposed in the Y-axis direction, and the second vision unit 420 is It may be provided to be transportable in the X-axis direction by the driving means 425 disposed in the X-axis direction.

Each vision unit may be mounted on the vision driving means disposed in the X-axis or Y-axis direction, respectively, so that a specific vision unit can be transported in the X-axis or Y-axis direction.

However, since the semiconductor package adsorbed on the drying unit 300 or the like is disposed on the XY plane, when the first and second vision units are provided to be transportable in the Y axis (X axis) direction, the semiconductor package to be picked up or picked up is absorbed. The drying unit 300 or the alignment table to be described later may be provided to be transported in the X-axis (Y-axis) direction.

In addition, the semiconductor package inspection unit 400 of the semiconductor strip cutting and aligning apparatus 1000 according to the present invention may include at least one alignment table that can be transferred in parallel in the Y axis direction and that can be rotated about the Z axis.

The semiconductor package, which is transferred to the alignment tables 430a and 430b and is imaged downward by the second vision unit 420 while being loaded on the alignment table, is paired by a pair of sorting pickers 560 and 580. Upward imaging is completed by the first vision unit 410 mounted on the vision driving means 415 arranged in the Y-axis direction in the picked-up state.

Meanwhile, the first sorting picker 560 and the second sorting picker 580 may be provided to be able to be transported in parallel. Each of the first sorting picker 560 and the second sorting picker 580 may be mounted on the first sorting picker driving means 650 and the second sorting picker driving means 660 so as to be transportable in the X axis direction, respectively. .

On the other hand, the first vision unit 410 provided to be movable in the Y-axis direction is provided to be transported to the work area of the first and second sorting picker (560, 580) the first and second sorting picker (560) The first vision unit 410 may be inspected by a lower surface inspection (ball inspection or lead inspection), an upper surface inspection (mold inspection or marking inspection), or a three-point alignment inspection of the tray by a sorting picker. Can be done via:

At this time, the three-point alignment inspection of the tray by the first and second sorting pickers (560, 580) is to load the jig (or package) of the package shape in at least three points of the loading groove (preferably the corner) of the tray Afterwards, the first and second sorting pickers 560 and 580 may pick up the jig, and then move to a location where the first vision unit 410 is located to photograph.

Find the offset values (X, Y, θ) of the three points and the center of the tray by repeating multiple shots, and use the known tray information, the number of loading grooves, and the pitch information to determine the exact position of each loading groove of the matrix structure. It can be performed by the method of obtaining. However, the three point alignment inspection of the tray is not necessarily limited to three points, and the inspection area is not limited to the corner point.

Meanwhile, the conveying range of the driving means 415 provided to convey the first vision unit 410 in the Y axis direction is the first and second sorting pickers 560 and 580 or the alignment table picker 380. It is desirable to ensure that it can cross the X-axis feed range.

In summary, the Y-axis transfer range of the first vision unit 410 has an intersection point on the X-axis transfer range of the sorting picker or alignment table picker 380 on the XY plane to obtain the aforementioned effects. it means.

Here, when a plurality of (two) sorting pickers (560, 580) are provided so that the plurality of parallel transport in the X-axis direction, the Y-axis transfer range of the first vision unit 410 is a plurality of sorting It is preferable to set the transfer range such that the pickers 560 and 580 have a plurality of intersections on the X-axis transfer range and the XY plane, respectively.

As described above, the inspection of the first vision unit 410 in the state of picking up the package is performed not only by the first and second sorting pickers 560 and 580 in the process of loading the semiconductor package into the tray, It may include all that is performed before the alignment table picker 380 is placed in the package to the first and second alignment table (430a, 430b).

Meanwhile, although the sorting pickers 560 and 580 are shown as being provided in FIG. 1, the number may be increased or decreased.

In the semiconductor strip cutting and aligning apparatus 1000 according to the exemplary embodiment of the present invention, the semiconductor package may be loaded, unless the semiconductor package is flipped (rotated) during the cutting, cleaning, drying, and imaging of the semiconductor package. (Ball up stacking method or ball down stacking method) cannot be changed.

Therefore, in the embodiment shown in Figure 1, the washed semiconductor package is picked up by the unit picker 270 and flipped downward while being adsorbed to the adsorption unit of the drying unit 300 and transferred in the X-axis direction to the alignment The manner of loading on the table can be used.

The adsorption plate 310 constituting the drying unit 300 includes adsorption parts 311a and 311b on which one surface of the semiconductor package is adsorbed, and the semiconductor package carried by the unit picker 270 is the adsorption part. 311a, 311b.

In addition, the adsorption plate 310 may be provided on one surface of the drying unit 300 or on both surfaces. When the adsorption plate 310 is provided on both surfaces, the drying time of the semiconductor package can be lengthened.

The unit picker 270 supplies vacuum to the suction units arranged to correspond to the positions of the plurality of semiconductor packages seated on the chuck table 250, the pneumatic pipe passage communicating with the suction portions, and the pneumatic pipe passage. It may include a vacuum means for.

The drying unit 300 is installed to be movable along one direction axis, the moving frame 320 is rotatably coupled to the adsorption plate 310, is installed in the adsorption plate 310, the adsorption unit An electrothermal heater (not shown) that heats and heats the seated semiconductor package and blows gas into the semiconductor package adsorbed on the adsorption plate to be present on an upper surface or side surface of the adsorption plate 310 or the semiconductor package. It may include a blower (not shown) to remove the water.

As described above, the semiconductor package transported to the drying unit 300 may be dried by an electrothermal heater or the like provided in the drying unit 300. However, for faster drying, the drying unit 300 may blow dry gas to the semiconductor package adsorbed on the adsorption units 311a and 311b to remove water present in the semiconductor package.

When drying with only the heat transfer heater, the time required for drying may be longer, so that a blower for removing moisture of the semiconductor package adsorbed on the adsorption plate 310 may be provided in the upper and / or lower part of the drying unit 300 to minimize the drying time. It may be provided in.

If the drying unit 300 is used to rotate, the blower may be provided at any one or both of the upper and lower portions of the drying unit 300, but if the drying unit is not rotated. The blower may be provided only on the surface (upper part) on which the semiconductor package is adsorbed.

On the other hand, it is mounted on the drying unit 300 and then flipped to capture one surface of the upper and lower surfaces of the semiconductor package by the first vision unit 410, and is mounted on the alignment tables 430a and 430b. The second vision unit 420 may capture the other surface of the upper and lower surfaces of the semiconductor package.

However, as described above, the semiconductor strip S handled by the semiconductor strip cutting and alignment apparatus 1000 according to the exemplary embodiment of the present invention includes materials in which the materials cut in the cutting unit 200 are arranged to be symmetrical to each other. There is a bar. That is, among the materials adsorbed on the unit picker 270, the semiconductor package adsorbed in the odd row and the semiconductor package adsorbed in the even row are arranged and adsorbed so as to be symmetric with each other.

It may not be desirable to improve the inspection efficiency and accuracy by imaging and inspecting the semiconductor packages disposed differently together with the first vision unit 410. Therefore, the materials photographed upward by the first vision unit 410 need to be arranged in the same direction.

Therefore, the semiconductor packages adsorbed in the odd rows and the semiconductor packages adsorbed in the even rows are respectively arranged in each of the first sorting table 430a and the second sorting table 430b, and the sorting table of any one of the two sorting tables is arranged. It is necessary to rotate the material by 180 degrees about the Y axis on the XY plane to coincide with the placement direction of the material. The first vision unit 410 mounted on the vision driving means 415 disposed in the Y-axis direction is imaged upward after the picking pickers 560 and 580 are absorbed in the same direction. Can complete one-sided inspection.

According to the embodiment of FIG. 1, the semiconductor package adsorbed on the chuck table 250 and the drying unit 300 is flipped in a process in which a mold surface is adsorbed, placed in a ball-up state, and moved to the alignment tables 430a and 430b. Ping is adsorbed so that the ball surface is directed downward to the alignment table (430a, 430b) is mounted in a ball down state. Therefore, the second vision unit 420, which is imaged downward while being mounted on the alignment tables 430a and 430b, may image and inspect the mold surface of the semiconductor package. In addition, the first vision unit 410 picking up the picking pickers 560 and 580 in a state in which the mold surface of the semiconductor package is adsorbed may be imaged and inspected by the ball surface or the lead surface of the semiconductor package.

In addition, the embodiment shown in Figure 1 is provided with the semiconductor strip supplied from the on-loader unit 100 in the ball-up state, the alignment in the ball-down state by the drying unit 300 of the semiconductor package inspection unit 400 Since it is mounted on the table, the state mounted on the carrying out tray to be described later may be a ball down state.

Therefore, the semiconductor strip cutting and aligning apparatus 1000 illustrated in FIG. 1 may be referred to as a ball down type semiconductor strip cutting and aligning apparatus 1000 that cuts a semiconductor strip in a ball-up form and takes it out into a ball-down form.

In the embodiment shown in Figure 1, the description relating to the structure and operation of the drying unit 300 is postponed.

The semiconductor package inspection unit 400 of the semiconductor strip cutting and sorting apparatus 1000 according to the present invention illustrated in FIG. 1 includes a first alignment table 430a and a second alignment table 430b.

When the first sorting table 430a and the second sorting table 430b are not provided and two stacking areas are provided in one sorting table, the first sorting table 430a and the second sorting table 430b are provided in the second stacking area even after the semiconductor package is mounted in the first stacking area. Subsequent processes (inspection by the second vision unit, stacking of trays) cannot be performed until the remaining semiconductor packages are loaded, so that two alignment tables can be provided and operated independently of each other to improve the equipment's UPH. It was.

In the adsorption plate 310 of the drying unit 300, the first adsorption part 311a and the second adsorption part 311b formed to adsorb the semiconductor packages disposed opposite to each other alternately in rows. The semiconductor package picked up by the unit picker 270 is transferred to the first adsorption part 311a and the second adsorption part 311b and is adsorbed, and the adsorption plate 310 is rotated to form the first adsorption part ( The semiconductor package adsorbed on 311a may be loaded on the first alignment table 430a, and the semiconductor package adsorbed on the second adsorption portion 311b may be loaded on the second alignment table 430b.

The first adsorption part 311a and the second adsorption part 311b are provided on the same side of the adsorption plate 310, so that the first adsorption part 311a is vacuum-adsorbed the semiconductor packages disposed in the odd rows, and the second adsorption part 311a is provided. The unit 311b may vacuum-suck semiconductor packages disposed in even rows. It comprises a first pneumatic line for applying a pneumatic pressure to the first adsorption portion (311a) and a second pneumatic line for applying a pneumatic pressure to the second adsorption portion (311b) for this configuration, the first pneumatic line and the second pneumatic line Can independently apply pneumatic pressure.

Here, the first pneumatic line is provided in a continuous "W" shape, connecting the first adsorption portion (311a) disposed in the adjacent row, each one of the first adsorption portion (311a) arranged in the same row The second pneumatic line is provided so as to be skipped, and the second pneumatic line is provided in a continuous “W” shape and connects the second adsorption parts 311b arranged in adjacent rows, but is arranged in the same row. ) Are arranged to skip one by one.

Meanwhile, the first adsorption part 311a and the second adsorption part 311a may be provided on the upper and lower surfaces of the adsorption plate 310, respectively.

That is, the first adsorption part 311a may be provided on one surface of the adsorption plate 310, and may vacuum adsorb the semiconductor packages disposed in the odd row, and the second adsorption part 311b may be the adsorption plate 310. It is provided on the other side of the, can be vacuum suction the semiconductor packages arranged in even rows. It comprises a first pneumatic line for applying a pneumatic pressure to the first adsorption portion (311a) and a second pneumatic line for applying a pneumatic pressure to the second adsorption portion (311b) for this configuration, the first pneumatic line and the second pneumatic line Can independently apply pneumatic pressure.

In particular, a drying unit rotates the semiconductor packages adsorbed on one surface of the adsorption plate 310 to directly transfer the upper and lower surfaces of the semiconductor package onto the first alignment table, and rotates the drying unit once more to the It is possible to directly transfer the upper and lower surfaces of the semiconductor package adsorbed on the other surface of the suction plate 310 on the second alignment table.

The semiconductor package may be transferred to the adsorption unit when the odd and even row semiconductor packages are classified and loaded on the upper and lower surfaces of the first adsorption unit 311a and the second adsorption unit 311b of the adsorption plate 310 of the drying unit, respectively. The pneumatic line of the unit picker should also be constructed so that it can be picked up in an even or even row.

The unit picker may include a third adsorption unit provided on one surface and capable of vacuum adsorption of semiconductor packages disposed in the odd row, and a fourth adsorption unit capable of vacuum adsorption of semiconductor packages provided on one surface and disposed in the even row. Part and the third adsorption part are applied to the third adsorption part and provided in a continuous "W" shape and are connected to the third adsorption parts arranged in adjacent rows, and the third adsorption parts arranged in the same row are provided one by one. Connect the third pneumatic line provided to be connected to the skip and the fourth suction unit is applied to the fourth suction unit, the fourth suction unit is provided in a continuous "W" shape, arranged in an adjacent row, The fourth adsorption units disposed include a fourth pneumatic line provided to be connected to each other by skipping, and the third pneumatic line and the fourth pneumatic line are provided to independently apply pneumatic pressure.

In the meantime, the plurality of semiconductor packages picked up by the unit picker 270 after washing by the above configuration are the first adsorption part 311a and the second adsorption part of the adsorption plate 310 constituting the drying part 300. The semiconductor package is received when 311b faces upward. Thereafter, the first and second alignment tables 430a and 430b are respectively rotated while the adsorption plate 310 is rotated so that the first and second adsorption portions 311a and 311b are rotated downward. Each semiconductor package is supplied onto the substrate.

In addition, either the first alignment table 430a or the second alignment table 430b is rotated by 180 degrees about the Y axis on the XY plane so that the semiconductor package and the second alignment table disposed on the first alignment table 430a ( The semiconductor packages disposed on 430b may be disposed in the same direction and in the same shape.

Therefore, since both sides of the semiconductor package may be easily inspected by the first vision unit 410 and the second vision unit 420, and the inspection accuracy may be improved.

Since the adsorption plate 310 and the alignment tables 430a and 430b should be prevented from interfering with each other during the rotation process or the mutual transport process of the adsorption plate 310, the transport trajectory may have a predetermined height difference, and the process of transferring the semiconductor package. For example, a method in which the semiconductor package is transferred by lifting and aligning the alignment tables 430a and 430b through relative movement with respect to the Z axis direction may be used.

Details related to the structure and operation of the drying unit 300 and the alignment tables 430a and 430b have been described in detail in Korean Patent Publication No. 2005-0058555 and Korean Patent Publication No. 2007-0006639 of the same applicant.

The semiconductor package inspecting unit 400 may include two first alignment tables 430a and a second alignment table 430b that may be moved in parallel in the Y-axis direction and are rotatable about the Z-axis. Each of the first alignment table 430a and the second alignment table 430b is connected to the first alignment table driving means 610 and the second alignment table driving means 620 installed in the Y-axis direction to enable the Y-axis feed. Can be mounted.

In addition, only one alignment table of the first alignment table 430a and the second alignment table 430b may be provided to be rotatable.

The first alignment table driving means 610 and the second alignment table driving means 620 mounted on the first alignment table 430a and the second alignment table 430b capable of independent transfer in the Y-axis direction. An upper surface (mold surface) of the semiconductor package may be captured by the second vision unit 420 mounted to the vision driving means 425 disposed in the X-axis direction.

The first sorting picker provided with the semiconductor package mounted on the first alignment table 430a and the second alignment table 430b on which the imaging is completed by the second vision unit 420 is transportable in the X-axis direction. The first and second sorting pickers 560 and 580 are respectively picked up by the second sorting picker 580 and the first and second sorting pickers 560 and 580 are provided in the X-axis direction, respectively. Along the picker driving means 660 to the left of FIG. 1 to the position where the vision driving means 415 disposed in the Y-axis direction is provided, it can be captured by the first vision unit 410. The semiconductor package, in which the inspection of both surfaces is completed by the first vision unit 410 and the second vision unit 420, is carried out to the export tray 510 or 530 that selectively configures the sorting apparatus 500 according to the quality of the inspection result. Can be taken out.

The sorting apparatus 500 individually picks up the semiconductor packages loaded on the first sorting table 430a or the second sorting table 430b, and sorts and transfers the semiconductor packages sequentially according to the inspection results. The semiconductor packages picked up by the two sorting pickers 560 and 580 may include a plurality of loading grooves for sorting and accommodating the semiconductor packages according to the inspection results, and may include a transport tray that can be transported in one direction.

In addition, the semiconductor package or inspection jig is loaded in at least two of the loading grooves of the tray, and the first pick-up unit (eg, the picking picker picks up each of the semiconductor packages or the inspection jig). By moving the image to 410, a three-point inspection may be performed to determine the exact position value of each loading groove of the tray by comparing the input pitch information and the actual moving distance.

Preferably, the three-point inspection is more efficient to determine the alignment state of the tray by placing the semiconductor package or inspection jig in three of four corners of the tray, and picking them up with the picking picker respectively. The tray's alignment status can be obtained from the known tray tray information, the number of loading grooves, the pitch information, and the like.

The first and second sorting pickers 560 and 580 may include a plurality of pickup units 561 and 581 side by side in the X-axis direction so that the plurality of semiconductor packages may be picked up together.

The plurality of pickup units 561 and 581 may be configured to enable independent driving, respectively. Therefore, the semiconductor package may be selectively taken out to the export tray 510 or 530 according to the quality of the inspection result.

When each of the alignment tables 430a and 430b receives the semiconductor package from the suction plate 310, the length direction of the alignment tables 430a and 430b is in the Y-axis direction, but the first and second sorting pickers 560 may be used. , 580 is provided with a plurality of pickup units 561, 581 for picking up a plurality of semiconductor packages side by side in the X-axis direction, so that the semiconductor packages mounted on the alignment tables 430a, 430b are the first and The alignment tables 430a and 430b may be rotated before being picked up by the second sorting picker 560 and 580. In this way, the area occupied by the semiconductor strip cutting and aligning apparatus 1000 can be minimized.

Accordingly, the semiconductor strip cutting and aligning apparatus 1000 illustrated in FIG. 1 may take out a semiconductor strip supplied in a ball-up state into a semiconductor package in a ball-down state after cutting, washing, drying, imaging, and inspecting.

The sorting apparatus 500 may be provided with a first carrying out tray 510 and a second carrying out tray 530 for accommodating good and bad semiconductors, respectively.

Each of the first export tray 510 and the second export tray 530 may be provided for loading and unloading the good semiconductor and the defective semiconductor, respectively. A tray picker 570 may be provided for supplying a new tray.

The sorting apparatus 500 of the semiconductor strip cutting and sorting apparatus 1000 according to the present invention may include a tray picker 570 for transferring a tray on which good semiconductors are loaded or a tray on which defective semiconductors are loaded. The picker 570 may be transported in the X axis direction by the third transport rail 575 on the guide frame.

The tray picker 570 and the drying unit 300 are both transferred in the X-axis direction, but each is independently driven.

Therefore, providing the plate driving means 330 and the third transfer rail 575 in the same guide frame for transferring the adsorption plate 310 constituting the drying unit 300 may cause interference problems between the driving components. Therefore, each driving means may be provided at different positions and at different heights.

Next, the inspection unit 400 and the drying unit 300 according to an embodiment of the present invention will be described with reference to FIGS. 4 to 6.

4 is a perspective view showing the inspection unit 400 according to an embodiment of the present invention, Figure 5 is a plan view showing a state in which the drying unit 300 is mounted on the semiconductor package inspection unit 400 according to an embodiment of the present invention. to be. 6 is an enlarged view illustrating the drying unit 300 in FIG. 4.

The adsorption plate 310 of the drying unit 300 has a structure capable of reciprocating in the X-axis direction, etc. by the plate driving means 330 provided on one side of the drying unit 300.

The plate driving means 330 may include a driving means such as a motor (not shown), a ball screw and a ball screw nut, but the driving means is not limited thereto.

And one side of the drying unit 300 is provided with a first conveying rail 360, the plate driving means 330 provided on the other side of the drying unit 300 is accommodated in the second conveying rail 340 Can guide the driving and conveying process.

The first conveyance rail 360 may be formed at both sides of the guide frame 670.

By the plate driving means 330, the drying unit 300 may be provided with a rotary drive unit 350 to enable the reciprocating transfer in the X-axis direction and to have a rotation function.

The drying unit 300 may include a moving frame 320 rotatably supporting the adsorption plate 310, and the rotation driving unit 350 is provided at one side of the moving frame 320 to dry the drying unit 300. The adsorption plate 310 may be rotated independently of the X-axis transfer process of the part 300.

In this manner, the adsorption plate 310 may be rotated in the process of transferring the semiconductor package to each alignment table while being transferred in the X axis direction.

Descriptions related to the construction and operation of the drying unit 300 and the alignment table have been introduced in detail to Korean Patent Publication Nos. 2005-0058555 and 2007-0006639, and thus, detailed descriptions thereof will be omitted.

As described above, the semiconductor strip cutting and aligning apparatus 1000 according to the embodiment of the present invention has been described that the semiconductor package in the ball-up state is supplied and the semiconductor package is taken out in the ball-down state after cutting, cleaning, drying, and imaging inspection. Of course, in the opposite case, that is, even if the semiconductor strip in the ball-down state is supplied to the ball-up state is a natural embodiment of the invention can be applied.

The semiconductor strip cutting and aligning apparatus 1000 according to the embodiment of the present invention receives the semiconductor strip in the ball up state and delivers the semiconductor package from the unit picker 270 to the ball up state in order to carry out the semiconductor package in the ball down state. The received drying unit 300 may include a flipping process. Therefore, when the semiconductor package in the ball up state is transferred from the drying unit 300 to the first and second alignment tables 430a and 430b, the semiconductor package may be in a ball down state.

However, the semiconductor strip cutting and aligning apparatus 1000 according to the embodiment of the present invention may supply a semiconductor package in a ball up state by supplying a semiconductor strip in a ball up state, and supply a ball down by supplying a semiconductor strip in a ball down state. You can also export a package as it is.

In this case, since the flipping function of the drying unit 300 is not necessary, the semiconductor package picked up by the unit picker 270 is simply adsorbed onto the adsorption plate 310 of the drying unit 300 so that only a drying process may be performed. have.

The semiconductor strip cutting and sorting apparatus 1000 may include an alignment table picker 380 that picks up the semiconductor package of the drying unit 300 and transfers the semiconductor package to the first and second alignment tables 430a and 430b.

The alignment table picker 380 is provided to be movable along the X-axis and / or Y-axis directions, and picks up the semiconductor package adsorbed on the adsorption plate 310 of the drying unit to the first alignment table 430a or the first. 2 Place in the stacking grooves 431a and 431b of the alignment table 430b.

In addition, the alignment table picker 380 may be configured to pick up the entire semiconductor package adsorbed on the adsorption plate 310 at once or divide the pickup twice. In addition, the alignment table picker 380 may be configured to pick up the entire semiconductor package at one time and load the semiconductor package in the first alignment table 430a and the second alignment table 430b two times in sequence.

That is, the alignment table picker 380 may have the same structure as the unit picker 270 so that the alignment table picker 380 may be loaded twice in order to handle only semiconductor packages arranged in odd rows and semiconductor packages arranged in even rows.

That is, the alignment table picker 380 may also be provided on one surface of the alignment table picker 380 in the same manner as the unit picker 270, and may have a third adsorption unit capable of vacuum adsorption of the semiconductor packages arranged in the odd rows. And a fourth adsorption portion capable of vacuum adsorption of the semiconductor packages disposed on the substrate.

In addition, the pneumatic pressure is applied to the third adsorption unit, provided in a continuous "W" shape, connecting the third adsorption units arranged in the adjacent row, the third adsorption units arranged in the same row are skipped one by one A fourth pneumatic line provided to connect the fourth pneumatic part to the fourth adsorption part and provided with a continuous “W” shape and arranged in an adjacent row, and the fourth pneumatic part arranged in the same row; The adsorption parts may include a fourth pneumatic line provided to be connected one by one, and the third pneumatic line and the fourth pneumatic line may independently apply pneumatic pressure.

By such a configuration, the alignment table picker 380 may classify the semiconductor packages arranged in the odd rows and the semiconductor packages arranged in the even rows, and load only materials having the same shape in the first and second alignment tables. .

For reference, when the alignment table picker 380 is used, since the drying unit 300 performs only a drying function without flipping, the semiconductor package is loaded in the final tray in a ball-up state.

The alignment table picker 380 may be provided to be transported in the X-axis direction to transfer the semiconductor package to the first alignment table 430a and the second alignment table 430b, respectively.

The alignment table picker 380 may move along the first transport rail 360 installed in the guide frame 670 installed along one direction axis. In addition, a method of mounting a ball screw, a motor, or the like on the guide frame 670 may be used as a driving means of the alignment table picker 380.

The alignment table picker 380 transfers the semiconductor package from the suction plate 310 to the first alignment table 430a and the second alignment table 430b, so that the transfer range of the alignment table picker 380 is a tray picker. Since it does not overlap with the conveying range of 570, the alignment table picker 380 and the tray picker 570 are mounted by mounting the first conveying rail 360 and the third conveying rail 575 for each section in one guide frame 670. ) Can be driven independently.

And the plate driving means 330 which is the driving means of the drying unit 300 is disposed below the equipment in the drawing, the driving means of the alignment table picker 380 is provided in the guide frame 670 inside the drying unit 300 Since interference does not occur between the alignment table picker 380 and the semiconductor strip cutting and the switching of the type of the alignment device 1000, there is an effect that does not need to go through a cumbersome replacement work such as detachment or removal of a specific part.

In addition, the driving means of the alignment table picker 380 is not provided on the guide frame 670, although not shown, may be provided on the upper surface or the upper side of the equipment. In addition, the drying unit 300 may be disposed below the alignment table picker 380 so that the movement paths of the drying unit 300 and the alignment table picker 380 and the respective driving means may be driven without interference.

In addition, the plurality of pickup units 561 and 581 provided in the first and second sorting pickers 560 and 580 may be independently driven, respectively, and thus, the first and second sorting pickers 560 and 580. In the picked up state, the first vision unit 410 may be used to perform a lower surface or upper surface inspection of the semiconductor package, and the semiconductor packages may be classified and loaded into the export trays 510 and 530 immediately according to the inspection result.

Next, a method of transferring the semiconductor package to the first alignment table 430a and the second alignment table 430b by flipping the drying unit 300 will be described.

As described above, the semiconductor packages used in the embodiments of the present invention have been described in that odd-numbered and even-numbered semiconductor packages are arranged to be symmetrical with each other.

Referring to FIG. 6, the first adsorption part 311a and the second adsorption part 311b may be alternately provided on one surface of the adsorption plate 310 of the drying part 300 to adsorb the semiconductor package. . That is, the first adsorption portion 311a may adsorb the odd rows of semiconductor packages, and the second adsorption portion 311b may adsorb the even rows of semiconductor packages.

7 is a view showing a pneumatic pipe line 312 of the drying unit 300 according to the first embodiment of the present invention, Figure 8 is an enlarged view of region A in FIG.

The first and second adsorption parts 311a and 311b are connected to the pneumatic pipe line 312 and the suction hole 313 and adsorb the semiconductor package by the vacuum pressure formed in the pneumatic pipe path 312.

The pneumatic pipe passage 312 is a first pneumatic pipe passage 312a connected to the adsorption hole 313 of the first adsorption part 311a, and a second connection to the adsorption hole 313 of the second adsorption part 311b. Pneumatic pipe 312b is included.

The first pneumatic pipe 312a and the second pneumatic pipe 312b may be alternately arranged without intersecting with each other. That is, the first pneumatic pipe passage, the second pneumatic pipe passage, the first pneumatic pipe passage, the second pneumatic pipe passage, ... may be arranged along the rows in which the first adsorption portion and the second adsorption portion are arranged in sequence.

In addition, the first pneumatic pipe 312a and the second pneumatic pipe 312b may be arranged in a zigzag or chevron shape. Specifically, the first pneumatic pipe passage 312a is provided to connect the adsorption holes 313 of the first adsorption portion 311a in the adjacent row. The first pneumatic pipe 312a is alternately connected one by one among the first suction units 311a in the same row. Similarly, the second pneumatic pipe passage 312b is provided to connect the adsorption holes 313 of the second adsorption portion 311b in the adjacent row. The second pneumatic pipe 312b is alternately connected one by one among the second suction units 311b in the same row.

Referring to FIG. 8, the first pneumatic pipe 312a connected to the first adsorption part 311a and the adsorption hole 313 disposed first from the left of the first row is located at the second from the left of the third row. The first adsorption part 311a and the adsorption hole 313 arranged are connected to each other, and the first adsorption part 311a and the adsorption hole 313 disposed to the third from the left side of the first row are connected. Similarly, the second pneumatic pipe line 312b connected to the second adsorption part 311b and the adsorption hole 313 disposed at the left side of the second row is second from the left side of the fourth row. It is connected to the adsorption part 311b and the adsorption hole 313, and is further connected to the second adsorption part 311b and the adsorption hole 313 which are arranged in the third from the left side of the second row.

However, the two first pneumatic pipes 312a positioned at the top and bottom are only alternately connecting the first adsorption portion 311a positioned at the first row and the last row, respectively, and the second two located at the top and bottom. The pneumatic pipe 312b alternately connects the second adsorption portion 311b located in the first row and the last row, respectively.

9 is a view showing a pneumatic pipe line 312 of the drying unit 301 according to the second embodiment of the present invention, Figure 10 is an enlarged view of the region B in FIG.

The pneumatic pipe passage 312 is a first pneumatic pipe passage 312c connected to the adsorption hole 313 of the first adsorption part 311a, and a second connection to the adsorption hole 313 of the second adsorption part 311b. A pneumatic pipe line 312d.

The first pneumatic pipe 312c and the second pneumatic pipe 312d may be alternately arranged without intersecting with each other. That is, the first pneumatic pipe passage, the second pneumatic pipe passage, the first pneumatic pipe passage, the second pneumatic pipe passage, ... may be arranged along the rows in which the first adsorption portion and the second adsorption portion are arranged in sequence.

In addition, the first pneumatic pipe passage 312c is disposed to be connected to the first adsorption portion 311a disposed in the odd row in a continuous suction hole 313. Similarly, the second pneumatic pipe 312d is disposed to be connected to the adsorption holes 313 continuously with the second adsorption parts 311b arranged in even rows.

Next, the inspection unit 400 and the drying unit 302 according to another embodiment of the present invention will be described with reference to FIGS. 11 to 13.

11 is a plan view illustrating a state in which the drying unit 302 is mounted on the semiconductor package inspecting unit 400 according to another exemplary embodiment. 12 is a view showing one surface of the drying unit 302 according to the third embodiment of the present invention, and FIG. 13 is a view showing another surface of the drying unit 302 according to the third embodiment of the present invention.

When the drying unit 302 according to another embodiment of the present invention receives the semiconductor package from the unit picker 270-1, the drying unit 302 may receive only the semiconductor package disposed in any one of odd rows and even rows.

The drying unit 302 is rotatably provided, and may receive an odd row of semiconductor packages on one surface 310a of the suction plate and an even row of semiconductor packages on the other surface 310b of the suction plate.

In addition, the first adsorption part 311a provided on one surface 310a of the adsorption plate corresponds to the first loading groove 431a provided in the first alignment table 430a, and the other surface 310b of the adsorption plate. The second adsorption part 311b provided at the second side corresponds to the second loading groove 431b provided at the second alignment table 430b.

Referring to the operation, the first adsorption part 311a is provided on only one surface 310a of the adsorption plate facing upwards of only the semiconductor packages disposed in the odd rows among the semiconductor packages adsorbed on the unit picker 270-1. And the remaining semiconductor packages adsorbed on the unit picker 270-1, i.e., the even rows, after the adsorption plate 310 is rotated so that the other side 310b of the adsorption plate faces upward. The packages are delivered to the second adsorption part 311b provided on the other side 310b of the adsorption plate.

In addition, the drying unit 302 moves to the position where the first alignment table 430a is located and moves the semiconductor package of the first adsorption unit 311a provided on one surface 310a of the suction plate facing downward to the first alignment table. The first loading groove 431a of 430a is transferred to the first loading groove 431a, and the adsorption plate 310 is rotated so that the other side 310b of the adsorption plate faces downward, and is provided on the other side 310b of the adsorption plate. The semiconductor package of the second adsorption part 311b is transferred to the second mounting groove 431b of the second alignment table 430b.

As described above, when the semiconductor packages are delivered in the order of the unit picker 270-1, the drying unit 302, and the first and second alignment tables 430a and 430b, the direction in which the semiconductor packages are loaded is changed. That is, when the semiconductor packages picked up by the unit picker 270-1 in the ball up state are loaded on the first and second alignment tables 430a and 430b, the semiconductor packages are in the ball down state. This is because the drying unit 302 performs a flipping process.

Meanwhile, the semiconductor packages adsorbed on the drying unit 302 may be loaded on the first and second alignment tables 430a and 430b via the alignment table picker 380. In this case, the direction in which the semiconductor package is loaded is not changed. That is, the ball-up state is maintained even when the semiconductor packages picked up by the unit picker 270-1 in the ball-up state are loaded on the first and second alignment tables 430a and 430b. There is no flipping process.

FIG. 14 is a view showing a pneumatic pipe line 273 of the unit picker 270-1 according to the first embodiment of the present invention, and FIG. 15 is an enlarged view of region C in FIG.

The adsorption plate 271 constituting the unit picker 270-1 has an adsorption part 272 that sucks the semiconductor package on one surface, and the adsorption parts 272 are provided on the chuck table 250. It is arranged to correspond to the position of each of the three semiconductor packages. In addition, the unit picker 270-1 may include a pneumatic pipe line 273 for communicating the suction parts 272a and 272b and a vacuum means for supplying a vacuum to the pneumatic pipe line 273. In addition, the semiconductor packages mounted on the chuck table 250 may be transferred to the suction units 272.

The adsorption parts 272 include a first adsorption part 272a for sucking odd-numbered semiconductor packages and a second adsorption part 272b for sucking even-numbered semiconductor packages.

The pneumatic pipe line 273 is a first pneumatic pipe line 273a connected to the adsorption hole 274 of the first adsorption part 272a, and a second air connection to the adsorption hole 274 of the second adsorption part 272b. A pneumatic pipe line 273b.

The first pneumatic pipe 273a and the second pneumatic pipe 273b may be alternately arranged without intersecting with each other. That is, the first pneumatic pipe passage, the second pneumatic pipe passage, the first pneumatic pipe passage, the second pneumatic pipe passage, ... may be arranged along the rows in which the first adsorption portion and the second adsorption portion are arranged in sequence.

Not only the unit picker 270-1 but also the pneumatic pipe of the alignment table picker 380 is provided to correspond to the unit picker 270-1. That is, the first pneumatic pipe line 273a and the second pneumatic pipe line 273b of the unit picker 270-1 and the alignment table picker 380 may be arranged in a zigzag or chevron shape. Or extend into a continuous alphabet "W" shape. Specifically, the first pneumatic pipe passage 273a is provided to connect the adsorption holes 274 of the first adsorption portion 272a in the adjacent row. The first pneumatic pipe 273a is alternately connected one by one among the first adsorption parts 272a in the same row. Similarly, the second pneumatic pipe passage 273b is provided to connect the suction holes 274 of the second suction portions 272b in adjacent rows. The second pneumatic pipe 273b is alternately connected one by one among the second adsorption parts 272b in the same row.

Referring to FIG. 15, the first pneumatic pipe 273a connected to the first adsorption part 272a and the adsorption hole 274 disposed first from the left of the first row is located from the left to the second of the third row. The first adsorption part 272a and the adsorption hole 274 disposed are connected to each other, and the first adsorption part 272a and the adsorption hole 274 disposed third from the left side of the first row are connected. Similarly, the second pneumatic line 273b connected to the second adsorption part 272b and the adsorption hole 274 disposed first on the left side of the second row is the second on the left side of the fourth row. It is connected to the adsorption part 272b and the adsorption hole 274, and is further connected to the second adsorption part 272b and the adsorption hole 274 which are arranged in the third from the left side of the second row.

However, the two first pneumatic pipes 273a positioned at the top and the bottom thereof alternately connect the first adsorption part 272a positioned at the first row and the last row, respectively, and the second two located at the top and the bottom. The pneumatic pipe line 273b alternately connects the second adsorption portion 272b positioned in the first row and the last row, respectively.

As described above, the unit picker 270-1 and the alignment table picker 380 can be used to independently pick up only odd-numbered semiconductor packages and even-numbered semiconductor packages. According to the method can be used.

FIG. 16 is a view showing a pneumatic pipe line 273 of the unit picker 270-2 according to the second exemplary embodiment of the present invention, and FIG. 17 is an enlarged view of region D in FIG.

The pneumatic pipe line 273 is a first pneumatic pipe line 273c connected to the adsorption hole 274 of the first adsorption part 272a, and a second air connection to the adsorption hole 274 of the second adsorption part 272b. A pneumatic pipe line 273d.

The first pneumatic pipe 273c and the second pneumatic pipe 273d may be alternately arranged without intersecting with each other. That is, the first pneumatic pipe passage, the second pneumatic pipe passage, the first pneumatic pipe passage, the second pneumatic pipe passage, ... may be arranged along the rows in which the first adsorption portion and the second adsorption portion are arranged in sequence.

In addition, the first pneumatic pipe passage 273c is disposed to be connected to the adsorption holes 274 continuously with the first adsorption portions 272a disposed in the odd rows. Similarly, the second pneumatic pipe 273d is arranged to be connected to the adsorption holes 274 continuously with the second adsorption parts 272b arranged in even rows.

Although the present specification has been described with reference to preferred embodiments of the invention, those skilled in the art may variously modify and change the invention without departing from the spirit and scope of the invention as set forth in the claims set forth below. Could be done. Therefore, it should be seen that all modifications included in the technical scope of the present invention are basically included in the scope of the claims of the present invention.

100: on-loader section 110: pusher
120: laser cutting unit 200: cutting device
210: inlet rail 230: strip picker
250: chuck table 260: cutter
270: unit picker 280: cleaning unit
300: drying unit 310: adsorption plate
311: adsorption part 312: pneumatic pipe
320: moving frame 330: driving means
340: transfer rail 350: drive unit
360: first transfer rail 380: alignment table picker
400: semiconductor package inspection unit 410: first vision unit
420: second vision unit 430: alignment table
500: sorting device 510, 530: export tray
560, 580: shooting picker
1000: semiconductor strip cutting and sorting device

Claims (14)

A semiconductor strip cutting and aligning apparatus having a predetermined shape and cutting semiconductor strips in which odd and even rows of semiconductor packages are arranged symmetrically, and aligning the cut semiconductor packages.
Cutting portions for cutting the semiconductor strip into each semiconductor package;
A unit picker for vacuum picking up the cut semiconductor package and transferring the picked up semiconductor package to a drying unit through a washing unit;
The drying unit absorbs and dries the semiconductor package delivered by the unit picker, and is provided to be reciprocated in the X axis, and the absorption plate adsorbing the semiconductor package is rotatably provided on the XY plane with respect to the Y axis. ;
A first alignment table that receives the semiconductor package from the drying unit and absorbs the semiconductor package, and absorbs and aligns the semiconductor packages disposed in the odd rows; And
And a second alignment table that receives the semiconductor package from the drying unit and adsorbs the adsorbed semiconductor package and adsorbs and arranges the semiconductor packages arranged in the even row.
And the first alignment table or the second alignment table is rotatable 180 degrees on the XY plane. The method of claim 1,
And the first or second alignment table is rotated 180 degrees on the XY plane so that the semiconductor packages arranged on the respective alignment tables are aligned in the same shape. The method of claim 1,
The drying unit,
A first adsorption part provided on one surface of the adsorption plate and capable of vacuum adsorption of semiconductor packages disposed in the odd rows;
A second adsorption part provided on one surface of the adsorption plate and capable of vacuum adsorption of the semiconductor packages arranged in the even row;
A first pneumatic line for applying pneumatic pressure to the first suction part;
A second pneumatic line for applying pneumatic pressure to the second suction part,
And the first pneumatic line and the second pneumatic line can independently apply pneumatic pressure. The method of claim 3,
The first pneumatic line is provided with a plurality of lines extending along the row direction to communicate with the first adsorption portion disposed in the same row,
And the second pneumatic line is provided with a plurality of lines extending along the row direction to communicate with the second adsorption units arranged in the same row. The method of claim 3,
The first pneumatic line is provided in a continuous "W" shape, to connect the first adsorption units arranged in the adjacent row, the first adsorption units arranged in the same row are provided so as to skip one by one,
The second pneumatic line is provided in a continuous "W" shape, it is connected to the second adsorption unit disposed in the adjacent row, the second adsorption unit arranged in the same row is provided so as to skip one by one. Semiconductor strip cutting and sorting apparatus. The method of claim 1,
The drying unit,
A first adsorption part provided on one surface of the adsorption plate and capable of vacuum adsorption of semiconductor packages disposed in the odd rows;
A second adsorption part provided on the other side of the adsorption plate and capable of vacuum adsorption of the semiconductor packages arranged in the even row;
A first pneumatic line for applying pneumatic pressure to the first suction part;
A second pneumatic line for applying pneumatic pressure to the second suction part,
The first pneumatic line and the second pneumatic line can be independently applied pneumatic,
The drying unit rotates the semiconductor packages adsorbed on one surface of the adsorption plate to directly transfer the upper and lower surfaces of the semiconductor package onto the first alignment table, and rotates the drying unit once more to rotate the other surface of the adsorption plate. And directly transferring the upper and lower surfaces of the semiconductor package adsorbed onto the second sorting table. The method of claim 6,
The unit picker,
A third adsorption unit provided on one surface and capable of vacuum adsorption of the semiconductor packages disposed in the odd rows;
A fourth adsorption unit provided on one surface and capable of vacuum adsorption of the semiconductor packages arranged in the even row;
Applying air pressure to the third adsorption unit, provided in a continuous "W" shape, connecting the third adsorption units arranged in adjacent rows, the third adsorption units arranged in the same row are skipped one by one A third pneumatic line provided to
Applying air pressure to the fourth adsorption unit, provided in a continuous "W" shape, and connecting the fourth adsorption units arranged in adjacent rows, the fourth adsorption units arranged in the same row are skipped one by one A fourth pneumatic line provided to
And the third pneumatic line and the fourth pneumatic line can independently apply pneumatic pressure. The method of claim 6,
The unit picker,
A third adsorption unit provided on one surface and capable of vacuum adsorption of the semiconductor packages disposed in the odd rows;
A fourth adsorption unit provided on one surface and capable of vacuum adsorption of the semiconductor packages arranged in the even row;
A third pneumatic line applying a pneumatic pressure to the third suction part, the third pneumatic line having a plurality of lines extending along the row direction to communicate with the third suction parts arranged in the same row;
A fourth pneumatic line applied to the fourth adsorption unit, the fourth pneumatic line having a plurality of lines extending along the row direction so as to communicate with the fourth adsorption units arranged in the same row;
And the third pneumatic line and the fourth pneumatic line can independently apply pneumatic pressure. The method of claim 1,
And a sorting table picker for vacuum picking up the semiconductor package delivered by the drying unit and transferring the picked up semiconductor package to the first sorting table and the second sorting table. Cutting and sorting device. The method of claim 9,
The sort table picker
A third adsorption unit provided on one surface and capable of vacuum adsorption of the semiconductor packages disposed in the odd rows;
A fourth adsorption unit provided on one surface and capable of vacuum adsorption of the semiconductor packages arranged in the even row;
Applying air pressure to the third adsorption unit, provided in a continuous "W" shape, connecting the third adsorption units arranged in adjacent rows, the third adsorption units arranged in the same row are skipped one by one A third pneumatic line provided to
Applying air pressure to the fourth adsorption unit, provided in a continuous "W" shape, and connecting the fourth adsorption units arranged in adjacent rows, the fourth adsorption units arranged in the same row are skipped one by one A fourth pneumatic line provided to
And the third pneumatic line and the fourth pneumatic line can independently apply pneumatic pressure. The method of claim 1,
The semiconductor package having a predetermined shape has a 'b' shape or 'b' shape, and the semiconductor strip cutting and aligning apparatus, characterized in that arranged in a manner symmetrical with each other (b a). A semiconductor strip cutting and sorting method for cutting a semiconductor strip having a predetermined shape and having semiconductor packages arranged symmetrically in odd and even rows, respectively, and aligning the cut semiconductor packages.
Cutting the semiconductor strip into respective semiconductor packages;
Picking up the cut semiconductor package with a unit picker to adsorb semiconductor packages disposed in odd rows on one surface of the drying unit, and adsorbing semiconductor packages disposed in even rows on the other surface of the drying unit; And
The semiconductor packages adsorbed to the drying unit are rotated about the y-axis on the xy plane to directly transfer the semiconductor packages disposed in the odd rows with the upper and lower surfaces of the semiconductor package inverted on the first alignment table, and the drying unit is xy Rotating once more about the y-axis on a plane and directly transferring the upper and lower surfaces of the semiconductor package adsorbed in the even rows of the drying section onto the second alignment table. A semiconductor strip cutting and sorting method for cutting a semiconductor strip having a predetermined shape and having semiconductor packages arranged symmetrically in odd and even rows, respectively, and aligning the cut semiconductor packages.
Cutting the semiconductor strip into respective semiconductor packages;
Picking up the cut semiconductor package with a unit picker and adsorbing the semiconductor package to a drying unit; And
An alignment table picker picks up a semiconductor package adsorbed to the drying unit, and arranges odd-numbered semiconductor packages of the picked-up semiconductor packages to a first alignment table, and arranges even-numbered semiconductor packages of the semiconductor packages to a second alignment. A method of cutting and sorting semiconductor strips, the method comprising: aligning to a table. The method according to claim 12 or 13,
After picking up the semiconductor package seated on the first alignment table and the second alignment table and performing a vision inspection, cutting the semiconductor strip after loading the semiconductor package having completed the vision inspection in a tray in the same direction And sorting method.
KR1020150120937A 2015-08-27 2015-08-27 Apparatus of Sawing and Array for Semiconductor Strip and Method thereof KR102041957B1 (en)

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