JP2010539583A - Memory card processing equipment - Google Patents

Memory card processing equipment Download PDF

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Publication number
JP2010539583A
JP2010539583A JP2010524779A JP2010524779A JP2010539583A JP 2010539583 A JP2010539583 A JP 2010539583A JP 2010524779 A JP2010524779 A JP 2010524779A JP 2010524779 A JP2010524779 A JP 2010524779A JP 2010539583 A JP2010539583 A JP 2010539583A
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Japan
Prior art keywords
memory card
processing
strip
unit
outline
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JP2010524779A
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Japanese (ja)
Inventor
グォン チョン,ヒョン
キュン ナ,イク
Original Assignee
ハンミ セミコンダクター カンパニー リミテッド
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Priority to KR1020070093640A priority Critical patent/KR100871671B1/en
Priority to KR20070093639 priority
Priority to KR1020080063310A priority patent/KR20090028397A/en
Application filed by ハンミ セミコンダクター カンパニー リミテッド filed Critical ハンミ セミコンダクター カンパニー リミテッド
Priority to PCT/KR2008/005338 priority patent/WO2009035259A2/en
Publication of JP2010539583A publication Critical patent/JP2010539583A/en
Ceased legal-status Critical Current

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Abstract

  The present invention relates to a memory card processing apparatus capable of performing a general outline processing and a chamfer processing of a memory card having a non-linear section quickly and effectively with a single equipment. A memory card processing apparatus according to the present invention includes a strip loading unit to which strips in which a plurality of memory cards are arranged on one frame is supplied; a memory card on a strip conveyed from the strip loading unit, etc. An outline processing unit that cuts and separates along the outline; a strip transport picker that transports the strip from the strip loading unit to the outline processing unit; and an inclined side edge portion of the memory card transported from the outline processing unit A chamfered portion that processes the chamfered portion; a unit picker that conveys the outline processed memory card from the outline processed portion to the chamfered portion; and a chamfered memory card that is transferred from the chamfered portion On the tray Unloading unit that is housed; characterized in that it is constituted comprise; unloading picker and for transporting the memory card to the unloading unit from the chamfered portion.

Description

  The present invention relates to a processing apparatus that cuts a memory card into a desired shape, and more particularly, the entire outline processing and chamfer processing of a memory card having a non-linear section can be quickly performed with one equipment. The present invention also relates to a memory card processing apparatus {Apparatus for Cutting Processing Memory Card} that can be effectively performed.

  A memory card is a semiconductor package used as a data storage device for various digital electronic products such as a personal digital assistant (PDA), a digital camera, an mp3 player, and a PMP (Portable Multimedia Player).

  Unlike a general rectangular or square semiconductor package, such a memory card does not have a straight line on all four sides, but is provided with a recessed groove on one side edge or chamfered on one side corner. It has an outer shape with a non-linear section formed.

  Recently, as the types of memory cards are diversified, as shown in FIG. 1, the memory card (SD) has not only an outline having a non-linear section (NL) when viewed on a plane, but a side surface. As shown in FIG. 1, the one having a chamfered portion (C; chamfer) in which one side corner portion is inclined is developed. In the manufacturing process of the memory card having such a form, it is necessary to perform a chamfering process for forming a chamfered portion (C) together with an outline process for cutting along the outline of the memory card.

  However, since the memory card processing apparatus used in the past is designed to process only the outline of the memory card, an outline having a non-linear section (NL) and a chamfered portion (C) as shown in FIG. There is a problem that a memory card having both can not be processed.

The present invention has been made to solve the above-described problems, and an object of the present invention is to perform dicing (SINGULATION) processing by cutting along the outline of a memory card and individualizing with one equipment. It is an object of the present invention to provide a memory card processing apparatus capable of continuously performing chamfering processing of the edge portion and minimizing time and effort required for processing work and improving productivity.

  Another object of the present invention is to provide a memory card processing apparatus capable of clearly removing foreign substances such as dust attached to the memory card after chamfering.

  In order to achieve the above object, the present invention provides a strip loading unit to which strips in which a plurality of memory cards are arranged on one frame are supplied; and a strip transported from the strip loading unit. An outline processing unit for cutting and individualizing along the outline of a memory card, etc .; a strip transport picker for transporting a strip from the strip loading unit to the outline processing unit; and a memory card transported from the outline processing unit A chamfered portion for processing a chamfer inclined at the side edge portion; a unit picker for transferring an outline processed memory card from the outline processed portion to the chamfered portion; and a chamfer transferred from the chamfered portion. Processed memory cards Is provided with an unloading portion that is stored in a designated tray; and an unloading picker that conveys the memory card from the chamfering processing portion to the unloading portion.

  According to the present invention, the outline processing including the curved section processing of the memory card and the chamfering processing are sequentially and continuously performed in one apparatus, so that not only the manufacturing cost can be reduced, but also the cutting is performed. The processing time can be shortened, and the productivity is greatly improved.

  In addition, according to one aspect of the present invention, the memory card is completely separated from the strip by the outline processing of the memory card and dicing (SINGULATION), so that the working efficiency is further improved and the accuracy of the chamfering processing is improved. There is also an advantage that can be improved.

  Further, according to another aspect of the present invention, foreign substances such as dust attached to the memory card can be clearly removed by spraying water or air from the upper side and / or the lower side of the memory card after chamfering. Defects caused by things can be prevented and the reliability of the product can be improved.

It is the top view and side view which show the external shape of a common memory card. It is a schematic plan view which shows the structure of one Example of the memory card processing apparatus by this invention. It is a perspective view which shows the structure of the tool exchange part of the memory card processing apparatus of FIG. It is drawing which shows the effect | action of the tool state inspection sensor of the tool exchange part of FIG. It is drawing which shows the effect | action of the tool presence or absence detection sensor of the tool exchange part of FIG. It is a schematic plan view which shows the structure of the other Example of the memory card processing apparatus by this invention. It is a top view which shows the Example which deform | transformed the memory card processing apparatus of FIG. It is sectional drawing of the station block of the memory card processing apparatus of FIG. It is a schematic plan view which shows the structure of another Example of the memory card processing apparatus by this invention.

  Hereinafter, preferred embodiments of a memory card processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

  Referring to FIG. 2, the memory card processing apparatus according to the present invention includes a main body 1, a strip loading unit 10 disposed on one side of the main body 1, a memory card on a strip conveyed from the strip loading unit 10 and the like. An outline processing unit 20 for processing the outline of the strip, a strip transport picker 30 for transporting the strip from the strip loading unit 10 to the outline processing unit 20, and a side edge of the memory card transported from the outline processing unit 20 A chamfering unit 40 that processes a chamfered part (C: see FIG. 1), a unit picker 50 that conveys an outline processed memory card from the outline processing unit 20 to the chamfering unit 40, and a conveyance from the chamfering unit 40. Stored memory card in tray (T) And the first and second unloading pickers 71 and 72 for transporting the memory card while reciprocating horizontally between the chamfering processing unit 40 and the unloading unit 80 independently. Is done.

  The strip loading unit 10 is a part for supplying a plurality of strips in which a plurality of memory cards are arranged in a metric form on a rectangular frame in order. In this embodiment, the strip loading unit 10 is used for a strip to be worked. The magazine standby unit 11 on which the stacked magazines (M) arrive and wait, the inlet rails 12 for guiding both ends of the strip drawn from the magazine (M) of the magazine standby unit 11, and the magazine standby A strip pusher 13 which is installed on one side of the section 11 so as to move horizontally in the Y-axis direction and pulls out the strip from the magazine (M), and is installed on one side of the inlet rail 12 so as to move in the Y-axis direction. A strip pulled out of the magazine (M) by the strip pusher 13 Configured to include a strip grippers 14 moving on the inlet rail 12 by gripping the leading end portion of the flop.

  The magazine standby unit 11 includes an elevator (not shown) that moves the magazine (M) up and down to a desired position.

  The outline processing unit 20 is independently moved in the Y-axis direction by a known linear motion device on each of the first and second guide frames 22 and 23 arranged side by side and the first and second guide frames 22 and 23. The first and second strip chuck tables 24 and 25 installed so as to be able to cut the outline of each memory card by emitting a laser beam to the strips on the first strip chuck table 24 or the second strip chuck table 25. A laser processing head 27 for processing and dicing (SINGULATION) and a strip seated on the first and second strip chuck tables 24 and 25 are imaged to correct the processing position of the strip with respect to the laser processing head 27. And a vision camera 28 for position correction.

  The first and second guide frames 22 and 23 are fixed on an X-axis movable block 21 installed on the main body 1 so as to move horizontally in the X-axis direction. Move to. The X-axis movable block 21 is also moved horizontally in the X-axis direction by a known linear motion device (not shown).

  The first and second strip chuck tables 24 and 25 include a plurality of vacuum pads 26 so that the strips conveyed from the strip loading unit 10 can be seated and vacuum-sucked. The vacuum pad 26 is formed in the same metric array as the memory card of the strip so that the respective memory cards arranged on the strip can be vacuum-sucked individually.

  The position correcting vision camera 28 is configured to horizontally move in the X-axis direction along a second X-axis guide frame 28a installed on the upper side of the main body 1 so as to cross the X-axis direction.

  On the other hand, the strip transport picker 30 performs a function of vacuum-sucking the strip on the inlet rail 12 and transporting the strip onto the first and second strip chuck tables 24 and 25 of the outline processing unit 20. The strip transport picker 30 is configured to move horizontally in the X-axis direction along the first X-axis guide frame 91 installed so as to cross the X-axis direction above the main body 1. The strip conveying picker 30 is moved in the X-axis direction by a known linear motion device (not shown), for example, a linear motion device including a ball screw and a motor, a linear motor, or a belt and a pulley.

  The unit picker 50 also conveys the outline processed memory card to a preset process position while horizontally moving along the first X-axis guide frame 91 by a known linear motion device. On one side of the unit picker 50, a vision camera 51 for outline inspection for inspecting the processing state by taking a vision of the outline processed memory card on the first strip chuck table 24 or the second strip chuck table 25 is mounted. Has been.

  Between the outline processing unit 20 and the chamfering processing unit 40, there are a cleaning unit 61 for cleaning the memory card that has been subjected to outline processing and diced (SINGULATION), and a portion other than the memory card from the strip that has been subjected to the outline processing. A scrap collection box 62 for collecting scrap is configured. The cleaning unit 61 performs a work of brushing the memory card fixed to the unit picker 50 or spraying water or air to remove foreign substances attached to the memory card during the cutting process.

  The chamfered processing unit 40 includes a memory card chuck table 41 on which outline processed memory cards are seated and vacuum-sucked, and a memory card transported from the memory card chuck table 41 is seated and fixed. The first and second chamfering jigs 42 and 43 for chamfering, the chamfering head 44 for chamfering the memory card on the first and second chamfering jigs 42 and 43, and the chamfering process. A tool changer 48 for exchanging the end mill of the head 44 and a dust inhaler 49 for sucking dust generated during chamfering by the chamfering head 44 are configured. Here, the operation of picking up the memory card from the memory card chuck table 41 and transporting it to the chamfering jigs 42, 43 is performed by one of the first and second loading / unloading pickers 71, 72. It is.

  The memory card chuck table 41 is configured to horizontally move in the Y-axis direction by a linear motion device on a first Y-axis guide frame 45 extended to the main body 1 in the Y-axis direction. Then, on the upper surface of the memory card chuck table 41, two stacking portions 41a are configured so that the memory card conveyed by the unit picker 50 can be divided and seated in half twice. Although not shown in the figure, each stacking portion 41a has a vacuum suction groove for vacuum-sucking the memory card and a marginal space portion to which the memory card is not fixed arranged in a grid.

  The first chamfering jig 42 moves in the Y-axis direction along the first Y-axis guide frame 45, and the second chamfering jig 43 moves in the Y-axis direction along the second Y-axis guide frame 46. Configured to move to.

  The chamfering head 44 is configured to horizontally move in the X-axis direction along the X-axis guide frame 47. As shown in FIG. 3, the chamfering head 44 includes a spindle 44a that is rotated at a high speed by a motor (not shown), and an end mill 44b that is detachably coupled to a lower portion of the spindle 44a. In the end mill 44b, the midpoint of the tapered portion at the lower end thereof contacts the corner of one side edge of the memory card, and the contacted portion is cut, thereby performing chamfering.

  As described above, the end mill 44b contacts with one side edge of the memory card to perform chamfering, so that the end portion of the end mill 44b is worn with time and cutting is not smoothly performed. . In preparation for such a situation, the tool changer 48 is configured on one side of the chamfering part 40, so that the used end mill 44b and the unused end mill 44c are automatically exchanged.

  For this purpose, the tool changer 48 includes a tool change block 48a formed with a use tool storage hole 48b for storing a used end mill of the chamfering head 44, and a use tool storage hole 48b of the tool change block 48a. A tool state inspection sensor 48d for detecting the state of the unused end mill 44c waiting in a detachable state on one side, the state of the end mill 44b attached to the chamfering head 44, and the presence or absence of the unused end mill 44b are confirmed. And a tool presence / absence sensor 48e for setting the initial height of the end mill 44b.

  As shown in FIGS. 3 and 4, the tool condition inspection sensor 48d is installed with optical sensors comprising two light emitting portions and a light receiving portion spaced apart from each other at a predetermined interval, and the end mill 44b is connected to each of the end mills 44b. When positioned on the tool state inspection sensor 48d, the wear state of the end mill 44b is determined by measuring the position of the chamfering head 44 when no light is incident on the light receiving portion.

  As shown in FIG. 5, the tool presence / absence detection sensor 48e measures the position at which the end of the end mill 44b is sensed before the machining operation and immediately after the end mill 44b is replaced, thereby measuring the working height of the chamfering machining head 44. Set.

  Referring to FIG. 2 again, the first and second loading / unloading pickers 71 and 72 are horizontally moved independently along a pair of X-axis guide frames 73 arranged side by side on the upper side of the main body 1. Transport the memory card. Further, on one side of the second unloading picker 72, a vision for upper surface inspection that reads out the presence or absence of chamfering processing by performing vision imaging of the chamfered memory card on the first and second chamfering processing jigs 42 and 43 is provided. A camera 75 is installed.

  In the present embodiment, the first unloading picker 71 among the first and second loading / unloading pickers 71 and 72 vacuum-sucks the memory card of the memory card chuck table 41 from the chamfering processing section 40 to perform the first The second unloading picker 72 takes charge of the function of transporting to the two chamfering jigs 42 and 43, and the second unloading picker 72 unloads the memory cards that have been chamfered on the first and second chamfering jigs 42 and 43. It is programmed to take charge of the function of transporting to 80 and storing in the tray (T) for each inspection result.

  However, unlike this, the first and second loading / unloading pickers 71 and 72 carry the memory card of the memory card chuck table 41 to the first and second chamfering jigs 42 and 43, and the first , And the function of conveying the memory card on the two-chamfering jigs 42 and 43 to the unloading unit 80 may be programmed so as to be appropriately shared and performed together. In this case, the upper surface inspection vision camera 75 is preferably configured in both the first and second loading / unloading pickers 71 and 72.

  Then, a lower surface inspection vision for inspecting the presence / absence of a defect by performing vision imaging of the lower surface of the memory card conveyed by the second unloading picker 72 below the moving path of the first and second loading / unloading pickers 71, 72. A camera 76 is arranged.

  On the other hand, the unloading unit 80 moves the tray (T) to a desired position while horizontally moving along the Y-axis guide frame 81 and the Y-axis guide frame 81 extending in the Y-axis direction on the main body 1. First and second tray feeders 82 and 83 to be transported, an empty tray stacking section 84 on which empty trays (T) to be supplied to the first and second tray feeders 82 and 83 are loaded, and the Y-axis guide frames. 81. The non-defective product stacking unit 86 and the defective product stacking unit 87 on which the tray (T) in which all the memory cards are stored are stacked, and the first X-axis guide frame 91 are moved as described above. The tray transport picker 85 transports the tray (T) between the first and second tray feeders 82 and 83 and the empty tray stacking unit 84.

  In this embodiment, a memory card classified as a non-defective product is stored in the tray (T) of the first tray feeder 82, and a tray (T) of the second tray feeder 83 is classified as a defective product or a re-inspected product. The memory card is set to be stored, but the reverse is also possible, both of which are loaded with only good products, and a tray that completely stores only defective products on one side of the unloading unit 80 Or you may comprise a buffer.

  The memory card processing apparatus of the present invention configured as described above operates as follows.

  When the operator places the magazine in which the strip is stored on the magazine standby unit 11 of the strip loading unit 10 and operates the memory card processing device, the elevator (not shown) of the magazine standby unit 11 moves up and down to be the object to be pulled out. The strip is aligned at a position corresponding to the pusher 13. When the pusher 13 moves in the Y-axis direction and pulls the strip out of the magazine (M) by a predetermined distance, the strip gripper 14 moves in the Y-axis direction catching the end of the pulled-out strip and moves the strip to the inlet rail 12. Pull out above and sit down.

  Subsequently, the strip conveyance picker 30 vacuum-sucks the strip on the inlet rail 12 and conveys it onto the second strip chuck table 25 to be seated. Then, the second strip chuck table 25 moves in the Y-axis direction to align the strip below the position correction vision camera 28. The vision camera 28 for position correction photographs the reference mark of the strip on the second strip chuck table 25 to detect the position information of the strip, and transmits this position information to the controller of the laser processing head 27.

  The laser processing head 27 corrects the preset processing position value of the memory card based on the position information of the strip transmitted from the position correction vision camera 28, and then follows the outline of each memory card of the strip. The laser card is irradiated to process the outline of the memory card. By such outline processing, the memory card is diced (SINGULATION) with a desired outline.

  While the strip on the second strip chuck table 25 is being outlined, the strip transport picker 30 picks up a new strip from the strip loading unit 10 and places it on the first strip chuck table 24. The position correcting vision camera 28 detects the strip position information on the first strip chuck table 24.

  When the outline processing of the strip on the second strip chuck table 25 is completed, the X-axis movable block 21 moves in the X-axis direction by a predetermined distance so that the first strip chuck table 24 and the laser processing head 27 are on the same axis. Placed.

  Next, the unit picker 50 and the outline inspection vision camera 51 fixed to the unit picker 50 are moved onto the second strip chuck table 25. At this position, after the outline inspection vision camera 51 inspects the outline processing state of each memory card, the unit picker 50 removes the memory card and the like on the second strip chuck table 25 and the rest of the strip, that is, scraps. Vacuum adsorption at the same time.

  The unit picker 50 moves to the cleaning unit 61 and the scrap collection box 62 to remove foreign substances attached to the memory card, separates the scrap, and discharges it to the scrap collection box 62.

  Next, the unit picker 50 moves to the chamfering processing unit 40 and seats the memory card on the memory card chuck table 41.

  The memory card chuck table 41 on which the outline processed memory card is seated moves in the Y-axis direction along the first Y-axis guide frame 45 and is aligned below the first unloading picker 71.

  Then, the first unloading picker 71 picks up the memory card of the memory card chuck table 41 and places it on the first chamfering jig 42 or the second chamfering jig 43.

  The first chamfering jig 42 or the second chamfering jig 43 that has received the transmission of the memory card moves rearward and is aligned below the chamfering head 44. Next, the chamfering head 44 is lowered by a set level so that the middle portion of the tapered portion at the lower end of the end mill 44b (see FIG. 3) is brought into contact with the upper end corner of one side edge of the memory card, and the spindle 44a (FIG. 3). Chamfering by rotating (see).

  When the chamfering is completed, the first chamfering jig 42 or the second chamfering jig 43 moves forward in the Y-axis direction and is aligned below the second unloading picker 72.

  Subsequently, the second unloading picker 72 vacuum-sucks the chamfered memory card on the first chamfering jig 42 or the second chamfering jig 43. At this time, when the second unloading picker 72 picks up the memory card on the first chamfering jig 42 or the second chamfering jig 43, the upper surface inspection vision camera 75 is chamfered. Take a picture of the area and inspect for defects.

  The second unloading picker 72 that vacuum-sucks the memory card moves above and aligns with the lower-surface inspection vision camera 76, and the lower-surface inspection vision camera 76 photographs the lower surface of the memory card at this position to check for defects. Inspect.

  Next, the second unloading picker 72 moves to the unloading unit 80, and the memory card determined as a non-defective product based on the inspection result is stored in the tray (T) of the first tray feeder 82, so that it is defective or re-inspected. The memory card determined as is stored in the tray (T) of the second tray feeder 83. This completes a series of memory card processing steps.

  As described above, the memory card processing apparatus of the present invention performs laser processing along the outline of the memory card of the strip supplied to the outline processing unit 20 through the strip loading unit 10, whereby the memory card has the desired outline form. Then, the memory card having the desired final shape is obtained by chamfering the memory card that has been subjected to the outline processing by the chamfering processing unit 40, and then the inspection result of the processed memory card is obtained. Separately, each tray (T) of the unloading unit 80 is classified and stored. As described above, since the outline processing including the curved section processing of the memory card and the chamfering processing are continuously performed with one equipment, the processing time can be greatly shortened, and the manufacturing cost can be reduced.

  FIG. 6 shows another embodiment of the memory card processing apparatus according to the present invention. In the memory card processing apparatus according to the second embodiment, a strip loading unit 110 is disposed on one side of the main body 101, and the strip loading is performed. On one side of the unit 110, an outline processing unit 120 for processing and personalizing the outline of a memory card or the like on the strip is arranged. A chamfering unit 140 for chamfering an individualized memory card (MC) or the like is disposed on one side of the outline processing unit 120. Above the strip loading unit 110, the outline processing unit 120, and the chamfering processing unit 140, a strip transport picker 130 that transports the strip from the strip loading unit 110 to the outline processing unit 120, and the chamfering processing unit 140 from the outline processing unit 120. The first unit picker 151 for transporting the memory card is configured to reciprocate horizontally along the X-axis direction.

  A blower 161 for injecting compressed air for removing dust residue and moisture on the upper surface of the memory card (MC) after the chamfering process is configured on the upper side of the chamfering process part 140. A cleaning unit 162 that cleans the lower surface of a memory card (MC) or the like is configured on one side of the unit 140. A blower 163 for removing water by jetting compressed air onto the memory card on the second unit picker 152 that has been cleaned by the cleaning unit 162 is installed on the lower front side of the chamfering unit 140.

  A drying unit 190 for drying the cleaned memory card (MC) is disposed on the side adjacent to the cleaning unit 162. The memory card (MC) is placed on the tray (T) on one side of the drying unit 190. An unloading unit 180 for sorting and storing, and two unloading pickers 171 and 172 for conveying a memory card (MC) while horizontally reciprocating between the drying unit 190 and the unloading unit 180 are configured. The In addition, a second unit picker 152 that conveys the memory card from the chamfering processing unit 140 to the cleaning unit 162 and the drying unit 190 moves horizontally between the chamfering processing unit 140 and the drying unit 190 along the X-axis direction. Configured to do.

  Further, on the upper side of the drying unit 190, an upper surface inspection vision camera 175 for inspecting the processing state by photographing the upper surface of the dried memory card (MC) is installed. A vision camera 176 for bottom surface inspection is installed to inspect the processing state by photographing the bottom surface of the memory card (MC) adsorbed by the unloading pickers 171 and 172.

  The strip loading unit 110 includes a magazine standby unit 111, an inlet rail 112, a strip pusher 113, and a strip gripper 114, similarly to the strip loading unit 10 (see FIG. 2) of the above-described embodiment.

  The outline processing unit 120 includes four guide frames 122a to 122d extending in the Y-axis direction on the X-axis movable block 121, and strip chuck tables 123a to 123d (on which strips are seated on the guide frames 122a to 122d). In the drawing, the first, second, third, and fourth strip chuck tables) are configured to reciprocate horizontally in the Y-axis direction along the guide frames 122a to 122d. In addition, on the upper side of the outline processing unit 120, a position correction vision camera 128 is configured to be reciprocally movable horizontally along the X-axis guide frame 103, and two laser processing heads for performing outline processing of a memory card or the like on the strip. 127 is installed.

  The scrap collection box 155 for collecting scrap is installed on the adjacent side of the outline processing unit 120 as in the above-described embodiment.

  The chamfering section 140 has two chamfers on which a memory card chuck table 141 moving along the Y-axis guide frame 141a and a memory card (MC) conveyed from the memory card chuck table 141 are seated and fixed. Processing jigs 142, 143, two loading pickers 146, 147 that vacuum-suck a memory card from the memory card chuck table 141 and transport it to the chamfering processing jigs 142, 143, and the chamfering processing jig 142 , 143 and a chamfering head 144 for chamfering a memory card (MC) or the like.

  The chamfering jigs 142 and 143 are configured to be independently movable along two Y-axis guide frames 145 arranged side by side. The loading pickers 146 and 147 are also configured to horizontally move independently along the X-axis guide frame 105 arranged in parallel with each other above the chamfered portion 140. The loading pickers 146 and 147 are configured to be rotatable at an arbitrary angle such as 90 degrees, 180 degrees, or 270 degrees about a vertical axis, and the direction of the memory card picked up on the memory card chuck table 141 is determined. (Orientation) can be switched and the chamfering jigs 142 and 143 can be seated.

  The chamfering jigs 142 and 143 are slightly different from the chamfering jigs 142 and 143 (see FIG. 2) of the above-described embodiment, and memory cards (MC) are arranged in a plurality of rows (4 in this embodiment). The memory of each row where the chamfering jigs 142 and 143 are seated on the chamfering jigs 142 and 143 while moving in the Y-axis direction with respect to the chamfering head 144. Cards (MC) and the like are continuously chamfered.

  The chamfering head 144 is configured to be reciprocally movable horizontally along the X-axis guide frame 106. The chamfering head 144 includes a spindle 44a (see FIG. 3) that is rotated at a high speed by a motor as in the above-described embodiment, and an end mill 44b (see FIG. 3) that is detachably coupled to the lower step portion of the spindle 44a. However, unlike this, it may be composed of a circular blade type that rotates at a high speed. A nozzle 148 is formed on one side of the chamfering head 144 to inject a cleaning fluid such as water or air from the upper side toward the lower memory card for smooth processing during the chamfering process.

  On the other hand, as described above, the blower 161 configured on the upper side of the chamfering processing unit 140 injects compressed air onto the memory card (MC) on the chamfering jigs 142 and 143, and the memory card in the chamfering process. It functions to remove dust and moisture on the top surface of the. The cleaning unit 162 functions to remove dust attached to the memory card by spraying water or air onto the memory card adsorbed by the second unit picker 152 or performing ultrasonic cleaning.

  The drying unit 190 is configured such that two drive locks 191 and 192 on which a memory card (MC) is seated and dried are movable independently in the Y-axis direction. The drive locks 191 and 192 include a heater (not shown) therein, and transmit heat to the memory card (MC) seated on the upper surface of the drive locks 191 and 192 to dry the water. The drive locks 191 and 192 are formed with a plurality of vacuum holes 191a penetrating the upper surface for vacuum-sucking each memory card (MC). A blower 193 is formed on the upper rear side of the drying unit 190 to inject compressed air onto the memory card seated on the drive locks 191 and 192 to completely remove residual water.

  Similarly to the loading pickers 146 and 147, the unloading pickers 171 and 172 are configured so as to be able to rotate at an arbitrary angle such as 90 degrees, 180 degrees, 270 degrees, etc. These directions can be switched to be seated on the tray of the unloading unit 180.

  Since the unloading unit 180 is configured similarly to the unloading unit 80 (see FIG. 2) of the above-described embodiment, a detailed description thereof will be omitted.

  The memory card processing apparatus according to the second embodiment configured as described above operates as follows.

  When the strip to be processed is seated on the upper side of the inlet rail 112 of the strip loading section 110, the strip transport picker 130 vacuum-sucks the strip on the inlet rail 112 and transports it onto the first and third strip chuck tables 123a and 123c. And make them rest. The first and third strip chuck tables 123a and 123c are moved in the Y-axis direction to align the strip below the position correction vision camera 128. The position correction vision camera 128 includes the first and third strip chuck tables 123a and 123c. The position information of the strips on the strip chuck tables 123a and 123c is detected.

  When the detection of the position information by the position correction vision camera 128 is completed, the X-axis movable block 121 moves to the right in the X-axis direction, and the first and third strip chuck tables 123a and 123c are located below the laser processing head 127. Move to align. The laser processing head 127 emits a laser beam along the outline of each memory card of the strip on the first and third strip chuck tables 123a and 123c based on the position information of the strip transmitted from the vision camera 128 for position correction. Irradiation and outline processing. By such outline processing, the memory card has a desired outline shape and is diced (SINGULATION).

  While the strips on the first and third strip chuck tables 123a and 123c are being outlined, the strip transport picker 130 picks up a new strip from the strip loading unit 110 and picks up the second and fourth strip chuck tables. The second and fourth strip chuck tables 123b and 123d are moved to the lower side of the position correction vision camera 128, and strip position information is detected by the position correction vision camera 128.

  When the outline processing of the strips on the first and third strip chuck tables 123a and 123c is completed, the first and third strip chuck tables 123a and 123c move forward, and the first unit picker 151 includes the outline processing unit 120. And the vacuum suction of the memory card and the scrap on the first and third strip chuck tables 123a and 123c is performed, and then the scrap is moved to the scrap collection box 155, and the scrap is separated and moved to the chamfering section 140 and individually. The formed memory card is seated on the memory card chuck table 141.

  At this time, the X-axis movable block 121 moves again to the left in the X-axis direction by a predetermined distance, and the second and fourth strip chuck tables 123b and 123d and the laser processing head 127 are placed on the coaxial line, and the second and fourth The strip chuck tables 123b and 123d move to the lower side of the laser processing head 127 to resume the outline processing. During this process, the strip transport picker 130 picks up a new strip from the strip loading unit 110 and places it on the first and third strip chuck tables 123a and 123c. The strip position information is detected by moving downward. As described above, the outline processing unit 120 individualizes the memory cards on the strip by continuously repeating the above-described process.

  On the other hand, when the individual memory cards are seated on the memory card chuck table 141, the memory card chuck table 141 moves in the Y-axis direction and is aligned below the loading pickers 146 and 147. The loading pickers 146 and 147 vacuum-suck the memory card on the memory card chuck table 141. At this time, four of the memory cards are sequentially adsorbed, and when adsorbed to the loading pickers 146 and 147, the pitch between the memory cards is determined by the memory card seating portion (formed on the chamfering jigs 142 and 143). The pitch is the same as that shown in FIG. If necessary, the suction nozzles of the loading pickers 146 and 147 rotate at a predetermined angle about the vertical axis to switch the direction of the memory card or the like. Subsequently, the loading pickers 146 and 147 place the adsorbed memory card (MC) on the chamfering jigs 142 and 143.

  When all the memory cards (MC) are seated on the chamfering jigs 142 and 143, the chamfering jigs 142 and 143 move to the lower side of the chamfering head 144 and are aligned. Next, the chamfering head 144 is lowered by a set level, and the middle part of the tapered portion of the lower stage of the end mill 44b (see FIG. 3) is brought into contact with the upper end corner of one side edge of the memory card to bring the spindle 44a (see FIG. 3). The chamfering process is performed while jetting a cleaning fluid such as water or air through the nozzle 148 at the same time as rotating the nozzle. At this time, as described above, the chamfering jigs 142 and 143 move in the Y-axis direction with respect to the chamfering head 144, and the memory cards on the chamfering jigs 142 and 143 are sequentially arranged one by one. Continuously processed.

  When chamfering on the memory card (MC) on the chamfering jigs 142 and 143 is completed, the chamfering jigs 142 and 143 move forward in the Y-axis direction. Compressed air is injected from 161 to remove dust and water attached to the memory card on the chamfering jigs 142 and 143.

  When the chamfering jigs 142 and 143 move forward, the second unit picker 152 vacuum-sucks the memory card (MC) on the chamfering jigs 142 and 143 and conveys it to the cleaning unit 162. The cleaning unit 162 completely removes dust attached to the memory card by spraying water or air toward the memory card adsorbed by the second unit picker 152 or performing ultrasonic cleaning.

  When the cleaning is completed, the second unit picker 152 moves again to the chamfering processing unit 140 side, and compressed air is jetted through the blower 163, so that water such as a memory card is removed to some extent. Subsequently, the second unit picker 152 moves to the drying unit 190 and seats the memory card (MC) on one of the drive locks 191 and 192.

  The drive locks 191 and 192 transfer heat to the memory card (MC) to remove moisture, and move backward in the Y-axis direction to completely remove residual moisture remaining on the memory card (MC) by the blower 193. After that, it moves again to the lower side of the top-view inspection vision camera 175.

  When the vision inspection by the upper surface inspection vision camera 175 is completed, the drive locks 191 and 192 move in the Y-axis direction and are aligned below the unloading pickers 171 and 172. The unloading pickers 171 and 172 vacuum-suck the memory card on the drive locks 191 and 192 and move it to the upper side of the vision camera 176 for lower surface inspection. When the lower surface inspection is completed, the unloading pickers 171 and 172 move to the right side on the drawing. Separately, each tray of the unloading unit 180 is classified and stored.

  Thus, in the memory card processing apparatus according to the second embodiment, the memory cards (MC) are arranged and fixed in a plurality of rows by the chamfering processing jigs 142 and 143, so that a larger number of memory cards at a time. Can be processed continuously. Therefore, there is an advantage that the production amount per unit time (UPH) can be improved.

  In addition, the memory card processing apparatus of the second embodiment is attached to the memory card by injecting compressed air from the blower 161 after chamfering and injecting water or air in the cleaning unit 162 or performing ultrasonic cleaning. Dust can be removed cleanly.

  On the other hand, in the second embodiment described above, after the chamfering process for the memory card, after the primary cleaning is performed by the blower 161, the secondary cleaning is performed by the cleaning unit 162. Alternatively, if the cleaning effect of any one of the cleaning units 162 is sufficient and complete, only one of them may be configured without configuring both the cleaning unit 162 and the blower 161.

  In the memory card processing apparatus according to the second embodiment described above, when the drying is completed by the drive locks 191 and 192 of the drying unit 190 and the unloading pickers 171 and 172 pick up the memory card, the drive locks 191 and 192 are placed on the drive locks 191 and 192. As the number of remaining memory cards gradually decreases, the vacuum pressure applied to the drive locks 191 and 192 gradually decreases. However, since the upper surfaces of the drive locks 191 and 192 of the drying unit 190 are substantially flat, the unloading pickers 171 and 172 have a reduced vacuum pressure during the process of picking up the memory card of the drive locks 191 and 192. Due to this, the position of the memory card or the like may be displaced. In this case, when the unloading pickers 171 and 172 cannot correctly hold the memory card and store the memory card in the tray of the unloading unit 180, an error occurs because the unloading picker 171 or 172 cannot be properly stored in the tray pocket. , 172 may not be able to pick up the memory card.

  7 and 8 show a modified embodiment of the memory card processing apparatus for solving the problems that may occur in the drive locks 191 and 192. FIG. The basic configuration of the memory card processing apparatus of the third embodiment is almost the same as the memory card processing apparatus of the second embodiment described above. However, in the memory card processing apparatus of the third embodiment, a single drive lock 191 is provided, and a station block 195 that functions to align a memory card or the like on the adjacent side of the drive lock 191 without misalignment. The air blower 193 (see FIG. 6) is not installed on the upper side of the drying unit 190, and the air blower 196 is integrally fixed to the second unit picker 152 so as to move together with the second unit picker 152. There is a difference in that it is configured to inject air to the memory cards on the drive lock 191 while moving to. Above the drive lock 191 and the station block 195, a third unit picker 197 that vacuum-sucks the memory card from the drive lock 191 and seats it on the station block 195 moves horizontally along the X-axis guide frame 106. Installed freely. On one side of the third unit picker 197, a vision camera 175 for upper surface inspection is fixed, and a memory card seated on the drive lock 191 is imaged for inspection.

  As shown in FIG. 8, the station block 195 has a structure in which a plurality of pockets 195a for accommodating a memory card (MC) are provided on the upper surface at predetermined intervals. The pocket 195a has an inclined portion 195b, and when the memory card (MC) is inserted into the pocket 195a, the memory card (MC) is accurately received inside the pocket 195a while being guided by the inclined portion 195b. To be able to be. Each pocket 195a is provided with a vacuum hole 195c so that the memory card can be fixed by vacuum suction.

  In the memory card processing apparatus of the third embodiment configured as described above, when the drying of the memory card or the like is completed by the drive lock 191 of the drying unit 190, the vacuum pressure of the drive lock 191 is released and the above-mentioned The third unit picker 197 vacuums all the memory cards (MC) on the drive lock 191 at a time and moves them above the station block 195, and the memory card (MC) is seated in the pocket 195a of the station block 195. Let

  Next, the unloading pickers 171 and 172 pick up the memory card that has arrived at the station block 195 and convey it to the unloading unit 180. At this time, the memory card (MC) is inserted into the pocket 195a of the station block 195 and vacuum-sucked. Since the memory card (MC) is supported by the inclined portion 195b of the pocket 195a on the station block 195, the vacuum pressure increases as the unloading pickers 171 and 172 pick up and convey the memory card on the station block 195. Even if it becomes weaker, the movement of the memory card or the like is suppressed, and the position shift does not occur in other memory cards that are not picked up.

  Of course, immediately after the memory card is seated in the pocket 195a of the station block 195, even if no vacuum pressure is formed through the vacuum hole 195c, the memory card is supported by the inclined portion 195b in the pocket 195a. The position of the memory card or the like will not shift during the work by the unloading pickers 171 and 172.

  On the other hand, in the third embodiment, the drive lock 191 and the station block 195 exist independently, and after the drying operation is performed by the drive lock 191, the unloading operation is performed by the station block 195. Unlike this, a heater may be incorporated inside the station block 195 so that drying is performed in the station block without forming a drive lock.

  FIG. 9 shows a fourth embodiment of the memory card processing apparatus according to the present invention.

  The memory card processing apparatus of the above-described embodiment etc. performs outline processing of the memory card formed on the strip using the laser processing heads 27, 127, but the memory card processing according to the fourth embodiment. In the apparatus, a strip in which only a non-linear section (NL: see FIG. 1) such as a memory card is cut is inserted from the outside, and the outline processing unit 220 cuts each edge of the memory card or the like on the strip in a straight line. After completing the outline processing, after dicing the memory card (SINGULATION), it is configured to chamfer.

  More specifically, the memory card processing apparatus according to the fourth embodiment includes a strip loading unit 210 disposed on one side of the main body 201, and a memory card on the strip conveyed from the strip loading unit 210. An outline processing unit 220 that performs dicing (SINGULATION) processing, a strip transport picker 230 that transports strips from the strip loading unit 210 to the outline processing unit 220, and a cleaning unit 261 that cleans the memory card transported from the outline processing unit 220. And a drive lock 265 for drying the memory card cleaned by the cleaning unit 261, and a second memory card that carries a dicing (SINGULATION) processed memory from the outline processing unit 220 to the cleaning unit 261 and the drive lock 265. A one-unit picker 251, a chamfering unit 240 that processes a chamfered portion inclined to one side edge of the memory card conveyed from the drive lock 265, and a first unit that conveys the memory card from the drive lock 265 to the chamfering unit 240. A two-unit picker 255, an unloading unit 280 for storing the chamfered memory card conveyed from the chamfering unit 240 in the tray (T), and the chamfering unit 240 and the unloading unit 280 are independent. The first and second loading / unloading pickers 271 and 272 are configured to convey the memory card while reciprocating horizontally.

  The strip loading unit 210 is a part that sequentially supplies strips in a state where only a non-linear section (NL: see FIG. 1) such as a memory card is cut from an external laser processing apparatus or the like. The strip loading unit 210 guides the both ends of the magazine standby unit 211 on which the magazine (M) on which the work target strips are stacked rests and waits, and the strip drawn from the magazine (M) of the magazine standby unit 211. The inlet rail 212, the strip pusher 213 that pulls out the strip from the magazine (M), and the strip pusher 213 grips the leading end of the strip that is pulled out of the magazine (M) and onto the inlet rail 212. Strip gripper to move (not shown) Configured to include a. Also in the present embodiment, the magazine standby section 211 is configured with an elevator (not shown) that moves the magazine (M) up and down to a desired position.

  The outline processing unit 220 includes a turntable 221 on which a strip transported from the strip loading unit 210 by the strip transport picker 230 is vacuum-sucked and fixed, and each memory card of the strip fixed on the turntable 221. Two cutting blades 222 are formed by cutting the edges of the two in a straight line shape in the vertical direction and the horizontal direction and dicing (SINGULATION). These cutting blades 222 are configured to be movable in the X-axis direction.

  The turntable 221 is rotatable at a desired angle, and transports the strip to the position of the cutting blade 222 while horizontally moving in the Y-axis direction by a linear motion device (not shown).

  The turntable 221 includes a plurality of vacuum pads 221a on which the strip conveyed from the strip loading unit 210 is seated and vacuum-sucked.

  The strip conveyance picker 230 is configured to horizontally move in the X-axis direction by a known linear motion device on a first X-axis guide frame 291 installed to cross the X-axis direction above one side of the main body 201.

  The first unit picker 251 also transports a dicing (SINGULATION) processed memory card to a preset process position while horizontally moving along the first X-axis guide frame 291 by a known linear motion device. The second unit picker 255 is moved in the X-axis direction by a known linear motion device on a second X-axis guide frame 292 installed so as to cross the chamfering portion 240 and the unloading portion 280. ing.

  The cleaning unit 261 includes a cleaning unit 262 that sprays and cleans the memory card fixed to the unit picker 251 with water and air, and a brush that brushes the memory card to remove foreign substances attached to the memory card. 263.

  The drive lock 265 functions as a wet memory card conveyed from the cleaning unit 261, and dries the memory card by heating and / or blowing.

  On the other hand, on the upper side of the drive lock 265, an outline inspection vision camera 266 for inspecting the outline processing state of the memory card being dried is installed so as to move along the Y-axis guide frame 267 in the Y-axis direction. . The Y-axis guide frame 267 is integrally fixed to one side of the second unit picker 255. Accordingly, the vision inspection vision camera 266 moves in the X-axis direction along the second X-axis guide frame 292 together with the second unit picker 255 and moves in the Y-axis direction along the Y-axis guide frame 267. Move to any position.

  The construction and operation of the chamfering portion 240, the first and second loading / unloading pickers 271, 272, and the unloading portion 280 are the same as those of the chamfering portion 40 (see FIG. 1) of the first embodiment described above. / Since it is similar to the unloading pickers 71 and 72 (see FIG. 1) and the unloading unit 80 (see FIG. 1), detailed description is omitted. However, in the fourth embodiment, both the first and second loading / unloading pickers 271 and 272 carry the memory card from the memory card chuck table 241 to the chamfering processing unit 240 and the chamfering processing unit 240 unloads it. There is a difference in that the operation of transporting the memory card to the loading unit 280 is performed. In addition, a top inspection vision camera 275 is also provided on one side of the second loading / unloading picker 271 so that the bottom inspection vision camera 276 can be moved back and forth horizontally in the Y-axis direction. This is different from the example.

  Reference numerals 242 and 243 which are not described are first and second chamfering jigs, 244 is a chamfering head, 248 is a tool changer, and 249 sucks dust generated during chamfering by the chamfering head 244. A dust inhaler 249.

  The memory card processing apparatus according to the fourth embodiment configured as described above operates as follows.

  If the magazine in which the strip is stored in the non-linear section of each memory card in the previous process is placed in the magazine standby section 211 of the strip loading section 210 and the memory card dicing (SINGULATION) device is operated, The strip is pulled out of the magazine (M) by the operation of the pusher 213 and the strip gripper (not shown), and placed on the inlet rail 212.

  Next, the strip conveyance picker 230 vacuum-sucks the strip on the inlet rail 212 and conveys it onto the turntable 221 to be seated. Then, the turntable 221 moves in the Y-axis direction to position the strip below the cutting blade 222.

  If the strip is aligned with the lower side of the cutting blade 222, the two cutting blades 222 and the turntable 221 move together in the X-axis direction and the Y-axis direction, and the cutting blade 222 moves along the edge of each memory card or the like. Cut the memory card in a straight line in the horizontal and vertical directions and dicing the memory card.

  When dicing (SINGULATION) processing is completed, the turntable 221 moves again forward in the Y-axis direction, and the first unit picker 251 vacuum-sucks the memory card on the turntable 221 and transports it to the cleaning unit 61.

  When the cleaning is completed, the first unit picker 251 moves onto the drive lock 265 to seat the memory card on the drive lock 265 and returns to the outline processing unit 220 again.

  While the memory card and the like are being dried by the drive lock 265, the vision inspection vision camera 266 moves in the Y-axis direction along the Y-axis guide frame 267 and takes a picture of each memory card for dicing (SINGULATION ) Inspect for processing defects.

  When the memory card or the like is dried in the drive lock 265 and the vision inspection is completed, the second unit picker 255 vacuum-sucks the memory card on the drive lock 265 and moves it to the chamfer processing unit 240, and the memory card chuck table. Arrange on 241.

  Thereafter, the memory cards of the memory card chuck table 241 are transferred to the first and second chamfering jigs 242 and 243 by the first and second loading / unloading pickers 271 and 272, and after the chamfering process is performed, the memory card and the like again. The first and second loading / unloading pickers 271 and 272 are transported to the unloading unit 280 and stored in the tray.

  The present invention is applied to an arbitrary apparatus for manufacturing a semiconductor package such as a memory card.

Claims (21)

  1. A strip loading unit to which strips in which a plurality of memory cards are arranged on one frame are supplied;
    An outline processing unit for cutting and individualizing along an outline of a memory card or the like on the strip conveyed from the strip loading unit;
    A strip transport picker for transporting the strip from the strip loading section to the outline processing section;
    A chamfered portion for processing a chamfered portion (chamfer) inclined on one side edge portion of the memory card conveyed from the outline processing portion;
    A unit picker for transporting the outline processed memory card from the outline processing section to the chamfer processing section;
    An unloading section in which the chamfered memory cards conveyed from the chamfering section are stored in a designated tray;
    An unloading picker for conveying the memory card from the chamfering section to the unloading section;
  2.   The memory card processing apparatus according to claim 1, further comprising a vision inspection unit that is disposed on one side of the chamfering unit and inspects the outer shape of the chamfered memory card.
  3.   The memory card processing apparatus according to claim 1, further comprising a cleaning unit that cleans the memory card that has undergone outline processing in the outline processing unit.
  4.   2. The memory card processing apparatus according to claim 1, further comprising a scrap collection box for collecting scrap that is a portion other than the memory card from the outline-finished strip.
  5. The outline processing part
    A strip chuck table on which the strip conveyed from the strip loading section is seated and vacuum-sucked;
    2. A laser processing head which radiates a laser beam to the strip on the strip chuck table to perform cutting processing along the outline of each memory card and dicing (SINGULATION). The memory card processing apparatus according to any one of 1 to 4.
  6.   The outline processing unit further includes a vision camera for position correction that corrects a processing position of the strip with respect to the laser processing head by performing vision imaging of the strip seated on the strip chuck table. Item 6. The memory card processing apparatus according to Item 5.
  7.   6. The outline processing unit according to claim 5, further comprising a vision camera for outline inspection for inspecting a processing state by performing vision imaging of an outline processed memory card on the strip chuck table. Memory card processing equipment.
  8. The outline processing part
    A plurality of guide frames installed horizontally in the X-axis direction;
    A plurality of strip chuck tables which are installed independently on each of the guide frames so as to be movable in the Y-axis direction, and on which the strip conveyed from the strip loading section is seated and vacuum-sucked;
    A laser processing head that radiates a laser beam to each of the strip chuck tables, and cuts and dices along the outline of the memory card; and a strip that is seated on the strip chuck table. 5. The memory card processing according to claim 1, further comprising: a vision camera for position correction that corrects a processing position of the strip relative to the laser processing head by taking a vision. apparatus.
  9.   9. The outline processing unit according to claim 8, wherein the outline processing unit further includes a vision camera for outline inspection that inspects a processing state by performing vision imaging of an outline processed memory card on the strip chuck table. Memory card processing equipment.
  10.   The strip supplied to the strip loading section is in a state in which a non-linear section of each memory card or the like has been cut from the outside, and at least one cutting mechanism is connected to each memory card on the strip in the outline processing section. 5. The memory card processing apparatus according to claim 1, wherein edges of the same are cut into a straight line in the horizontal direction and the vertical direction to be individualized.
  11. The chamfered part is
    Memory card chuck table installed so that the outline processed memory card is seated and vacuum-sucked and moved horizontally in the Y-axis direction;
    A chamfering jig in which the memory card conveyed from the memory card chuck table is seated and fixed to be chamfered;
    A memory card loading picker for picking up a memory card from the memory card chuck table and transporting it to a chamfering jig; and chamfering by cutting a corner of one side edge of the memory card on the chamfering jig. 5. The memory card processing apparatus according to claim 1, further comprising a chamfering head.
  12.   The memory card loading picker of the chamfering section also serves as an unloading picker function of transporting the chamfered memory card on the chamfering jig to the unloading section. Memory card processing equipment.
  13.   The memory card processing apparatus according to claim 11, wherein the chamfering unit further includes a tool changing unit for exchanging an end mill of the chamfering head.
  14.   The tool changer includes a tool change block provided with a use tool storage hole in which a used end mill of the chamfering head is stored, and a detachable state at one side of the tool change hole of the tool change block. 14. The memory card processing apparatus according to claim 13, comprising an unused end mill that stands by, and a tool state inspection sensor that detects a state of the end mill mounted on the chamfering head.
  15.   12. The memory card processing apparatus according to claim 11, wherein the chamfering jig fixes a plurality of memory cards in a plurality of rows.
  16.   The memory according to claim 11, wherein the chamfering unit further includes a nozzle that is installed on one side of the chamfering head and injects a cleaning fluid toward the memory card during the chamfering process. Card processing device.
  17.   It further comprises a cleaning unit that removes foreign substances attached to the memory card by spraying water or air from the chamfered processing unit to the chamfered memory card or performing ultrasonic cleaning. The memory card processing apparatus according to claim 1.
  18.   18. The memory card processing apparatus according to claim 17, further comprising a blower that removes foreign matter and moisture on the memory card by jetting compressed air to the memory card.
  19.   18. The memory card according to claim 17, further comprising: a drive lock configured to seat the memory card that has been cleaned in the cleaning unit, and to remove moisture by applying heat to the seated memory card. Memory card processing equipment.
  20.   A station block provided on one side of the drive lock, in which a memory card conveyed from the drive lock is accommodated and a plurality of pockets having an inclined portion formed on the edge are arranged on the upper surface; And a third unit picker that vacuum-sucks all the memory cards at once and transports them to the station block for seating. The unloading picker vacuum-sucks the memory cards on the station block. 20. The memory card processing apparatus according to claim 19, wherein the memory card processing apparatus is adapted to be conveyed to an unloading unit.
  21.   21. The memory card processing apparatus according to claim 20, wherein the third unit picker is provided with a vision inspection unit that photographs and inspects the memory card seated on the drive lock.
JP2010524779A 2007-09-14 2008-09-10 Memory card processing equipment Ceased JP2010539583A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020070093640A KR100871671B1 (en) 2007-09-14 2007-09-14 Memory card singulation system
KR20070093639 2007-09-14
KR1020080063310A KR20090028397A (en) 2007-09-14 2008-07-01 Apparatus for cutting processing memory card
PCT/KR2008/005338 WO2009035259A2 (en) 2007-09-14 2008-09-10 Apparatus for cutting processing memory card

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CN106211594A (en) * 2016-08-31 2016-12-07 昆山倍驰自动化设备有限公司 PCB board cutting camera, motor synchronous device
KR102061652B1 (en) 2019-11-11 2020-01-02 주식회사 하늘컴플러스 An apparatus of press sealing

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