KR102634174B1 - Sawing Apparatus of Semiconductor Materials - Google Patents

Abstract

The present invention relates to a semiconductor material cutting device for cutting semiconductor materials into individual semiconductor packages. By spraying air into fiducial holes provided in an alignment block, water droplets formed on the fiducial holes by cutting water scattered when cutting semiconductor materials are removed. When cutting a material, air is sprayed into the fiducial hole to form an air curtain, which blocks the inflow of scattered cutting water and prevents water droplets from forming. This prevents inspection errors from occurring when inspecting the fiducial hole with material vision. It relates to a device for cutting semiconductor materials.

Description

Sawing Apparatus of Semiconductor Materials}

The present invention relates to a semiconductor material cutting device for cutting semiconductor materials into individual semiconductor packages.

A semiconductor material cutting device is equipment that cuts packaged semiconductor materials into individual semiconductor packages.

In addition to simply cutting semiconductor materials, this semiconductor material cutting device is a series of devices that classify semiconductor packages with manufacturing defects by inspecting the top and bottom of the cut semiconductor package after performing the cutting, cleaning, and drying process of the semiconductor material. It provides the function to process the process.

As a patent for such a semiconductor material cutting device, one described in Korean Patent Publication No. 10-2017-0026751 (hereinafter referred to as 'Patent Document 1') is known.

The semiconductor strip cutting and aligning device of Patent Document 1 includes an on-loader part provided with a semiconductor strip (semiconductor material) inserted into a magazine, an inlet rail on which the withdrawn semiconductor strip is seated, and the above-mentioned device seated on the inlet rail. A strip picker that vacuum-sucks the semiconductor strip and delivers it to the chuck table, a cutting part that supplies the semiconductor strip supplied by the strip picker and cuts it into a plurality of semiconductor packages on the chuck table, and a cleaning part that vacuum-sucks the plurality of semiconductor packages. A unit picker that delivers the semiconductor package to the drying section, a cleaning section that cleans the semiconductor package adsorbed on the unit picker, a drying section that dries the semiconductor package delivered by the unit picker, a vision unit that inspects the semiconductor package, and a It is configured to include a sorting device that sorts and stores semiconductor packages according to inspection results.

When cutting a semiconductor strip into a plurality of semiconductor packages with a blade from the cutting section, cutting water is sprayed toward the blade and the semiconductor strip to cool the blade and cool the frictional heat generated during cutting and to discharge scrap generated during the cutting process. It gets cut.

At this time, in order to reduce the frictional heat of the cutting blade to prevent overload of the cutting blade and to smoothly discharge the cutting scrap, the injection pressure of the cutting water increases and the amount of cutting water increases. As a result, the spray generated when cutting the semiconductor strip is blown onto the alignment table. If it scatters to the side, water droplets form around the fiducial hole provided on the alignment table.

In this way, when water droplets form around the fiducial hole, the material vision provided in the strip picker (material picker) does not recognize the fiducial hole, resulting in an inspection error or misrecognizing the center of the fiducial hole, resulting in a decrease in inspection precision. Because of this, misalignment of the semiconductor strip occurs.

Korean Patent Publication No. 10-2017-0026751

The present invention was devised to solve the above-described problem. By spraying air into the fiducial hole, water droplets formed on the fiducial hole by scattering of cutting water can be removed or water droplets can be prevented from forming and the fiducial hole can be detected with material vision. The purpose is to provide a semiconductor material cutting device that can prevent errors in vision inspection.

In addition, the present invention provides a semiconductor material cutting device that can prevent water droplets from forming in the fiducial hole by blocking the inflow of scattered cutting water by forming an air curtain by spraying air into the fiducial hole when cutting the material. The purpose.

A semiconductor material cutting device according to one aspect of the present invention includes a magazine in which a plurality of semiconductor materials are each stacked; a pair of inlet rails for guiding the semiconductor material drawn out from the magazine; a pair of alignment blocks respectively provided in the front-back direction inside the inlet rail and having one or more fiducial holes on the upper surface; It is capable of moving forward and backward by adsorbing the semiconductor material guided on the inlet rail, and is equipped with a material vision on one side to inspect the alignment of the semiconductor material by taking images of the semiconductor material and the fiducial hole provided in the alignment block. material picker; a chuck table to which the semiconductor material adsorbed on the material picker is transferred, is movable in the Y-axis direction, and is rotatable in the θ-axis direction; and a cutting unit for cutting the semiconductor material delivered to the chuck table into individual semiconductor packages, wherein at least one of the pair of alignment blocks has an air conduit formed therein, and the air conduit is formed inside the head. It is characterized in that it communicates with the fiducial hole and air is sprayed into the fiducial hole.

In addition, a plurality of fiducial holes provided in each alignment block are provided in the front-back direction parallel to the long side direction of the semiconductor material, and the air pipe communicates with each of the plurality of fiducial holes provided in the alignment block, and the material vision It is characterized in that one fiducial hole among the plurality of fiducial holes provided in the alignment block is selectively imaged according to the size of the semiconductor material.

In addition, the alignment block includes an air supply unit that supplies air to the air pipe; and

It further includes a valve connected to the air supply unit and operable to supply the air or block the supply of the air, the valve being opened while cutting the semiconductor material delivered to the chuck table into individual semiconductor packages. Alternatively, it may be opened before inspecting the alignment of the semiconductor material guided to the inlet rail using the material vision.

In addition, it further includes an alignment table disposed between the pair of alignment blocks inside the inlet rail and supporting a lower surface of the semiconductor material guided on the inlet rail, wherein the alignment block extends in the width direction of the alignment table. It is characterized by each being fixedly placed at the center as a standard.

In addition, the material vision inspects the alignment of the semiconductor material by imaging the semiconductor material and the fiducial hole together, and according to the inspection result, the material picker corrects the X-axis error value of the semiconductor material, and the chuck table A semiconductor material cutting device, characterized in that the Y-axis and θ-axis error values of the semiconductor material are corrected and the semiconductor material is mounted on the chuck table with the X-axis, Y-axis, and θ-axis aligned.

In addition, the material picker is rotatable, and the material vision inspects the alignment of the semiconductor material by taking images of the semiconductor material and the fiducial hole, and according to the inspection result, the material picker moves the semiconductor material along the X-axis. And the θ-axis error value is corrected, and the chuck table corrects the Y-axis error value of the semiconductor material and the semiconductor material is mounted on the chuck table with the X-axis, Y-axis, and θ-axis aligned. .

In addition, the pair of inlet rails are each provided to be transported in the Y-axis direction, the alignment table is provided to be rotatable in the θ-axis direction, and the material vision captures the semiconductor material and the fiducial hole together. The alignment of the semiconductor material is inspected, and according to the inspection results, the material picker corrects the X-axis error value of the semiconductor material, and the Y-axis and θ-axis error values of the semiconductor material are corrected by the alignment table and the inlet rail. It is characterized in that the semiconductor material is picked up in one state and placed on the chuck table with the X-axis, Y-axis, and θ-axis of the semiconductor material aligned.

In addition, one side of the material picker further includes an interlock pin that can be raised and lowered, and an interlock pin hole for inserting the interlock pin is provided at an upper part of the alignment block.

In addition, the alignment block consists of a first alignment block disposed in a direction toward the magazine and a second alignment block disposed in a direction toward the chuck table, and the air conduit is provided in the second alignment block. .

In addition, the alignment block consists of a first alignment block disposed in the magazine side direction and a second alignment block disposed in the chuck table side direction, and the Y-axis length is located at the lower portion between the second alignment block and the chuck table. It further includes an air curtain unit disposed in the direction and spraying air upward, wherein the air curtain unit forms an air curtain to prevent cutting water scattered when cutting the semiconductor material at the cutting unit from flowing into the second alignment block. do.

According to the semiconductor material cutting device of the present invention as described above, the following effects are achieved.

By spraying air directly through the fiducial hole, it is possible to eliminate water droplets forming in the fiducial hole due to the scattering of cutting water that occurs when performing the cutting process at the cutting part. This solves the problem of misrecognition of the material vision caused by water droplets. there is. Therefore, vision inspection errors can be prevented in the material alignment section and inspection precision can be improved.

In addition, instead of installing a separate air nozzle, an air conduit is formed inside the alignment block to blow air directly into the fiducial hole, eliminating the inconvenience of mechanical interference, angle adjustment, and setting due to installing a separate air nozzle. There is no

In addition, in order to remove moisture from the fiducial hole, an air nozzle is installed on one side of the material picker to remove moisture. After the material picker guides the semiconductor material to the inlet rail, it moves to the alignment block side to remove moisture and moves to the material vision. Although a sequence such as inspecting the fiducial hole must be added, the present invention sprays air directly into the fiducial hole, so there is no need to add a separate sequence or take time for air drying, so it does not affect UPH.

In addition, by spraying air into the fiducial hole while cutting the semiconductor material to form an air curtain, it is possible to prevent water droplets from flowing into the fiducial hole, and even if water droplets form around the fiducial hole, before inspecting the alignment of the semiconductor material. Vision inspection errors can be prevented because water droplets are completely removed by spraying air into the fiducial hole.

Additionally, by setting air to be constantly supplied to the fiducial hole while cutting semiconductor materials, it is possible to prevent water droplets from forming in the fiducial hole.

In addition, by using material vision to image the reference mark of the semiconductor material and the fiducial hole provided in the alignment block, external influences such as vibration can be excluded, increasing precision and reliability when inspecting the alignment of the material.

In addition, by forming a plurality of fiducial holes formed in the alignment block in the front-to-back direction, the material vision can selectively image any one fiducial located within the FOV of the material vision among the plurality of fiducial holes, regardless of the size of the semiconductor material. It has the effect of being able to inspect the reference mark and fiducial hole of semiconductor materials together within the FOV of the vision.

In addition, the alignment block with fiducial holes is fixedly placed in the center based on the direction of the short side of the semiconductor material seated on the alignment table, and the alignment table that absorbs the semiconductor material is used while inspecting the reference mark and fiducial hole of the semiconductor material. Since the semiconductor material is adsorbed, vision inspection is possible in a flat adsorbed state regardless of the warpage of the semiconductor material, improving inspection precision.

In addition, the alignment of the semiconductor material is inspected by imaging the fiducial hole of the semiconductor material and the alignment block, and the material picker corrects the X-axis or X-axis and θ-axis error values of the semiconductor material, and By correcting the Y-axis, or Y-axis and θ-axis error values, the semiconductor material can be placed on the chuck table with the X-axis, Y-axis, and θ-axis aligned.

In addition, an air curtain unit is provided to form an air curtain when air is sprayed from the bottom to the top, and the air curtain prevents cutting water scattered when cutting semiconductor materials from entering the alignment block, thereby preventing the fiducial hole provided in the alignment block. It can prevent water droplets from forming.

1 is a plan view of a semiconductor material cutting device of the present invention.
Figure 2 is a perspective view of the material sorting unit and material picker of Figure 1.
Figure 3 is a plan view of the material alignment part of Figure 2;
FIG. 4A is a cross-sectional view taken along line A-A' in FIG. 3.
Figure 4b is an enlarged view of the alignment block of Figure 4a.
FIG. 4C is a cross-sectional view taken along line B-B' in FIG. 4B.
Figure 5 is a plan view showing a state in which a semiconductor material is seated on the material alignment portion of Figure 3.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to invent various devices that embody the principles of the invention and are included in the concept and scope of the invention, although not clearly described or shown herein. In addition, all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of ensuring that the inventive concept is understood, and should be understood as not limiting to the embodiments and conditions specifically listed as such. .

The above-mentioned purpose, features and advantages will become clearer through the following detailed description in relation to the attached drawings, and accordingly, those skilled in the art in the technical field to which the invention pertains will be able to easily implement the technical idea of the invention. .

Embodiments described herein will be explained with reference to cross-sectional views and/or perspective views, which are ideal illustrations of the present invention. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in form produced according to the manufacturing process.

Before proceeding with the explanation, the following matters are defined.

The X-axis refers to the direction in which the material picker and unit picker move, and the Y-axis is a vertical axis on the

The X-axis refers to the same axis as the front-to-back direction, and the Y-axis refers to the same axis as the left-right direction.

The rear direction refers to the direction in which the semiconductor material is withdrawn from the magazine on the X-axis (right direction), and the front direction refers to the opposite direction of the rear direction (left direction).

The θ-axis direction refers to the direction of rotation clockwise or counterclockwise on the X-Y plane.

Hereinafter, the semiconductor material cutting device 100 of the present invention will be described with reference to the attached drawings.

FIG. 1 is a plan view of the semiconductor material cutting device of the present invention, FIG. 2 is a perspective view of the material alignment unit and the material picker of FIG. 1, FIG. 3 is a plan view of the material alignment portion of FIG. 2, and FIG. 4A is A- of FIG. 3. It is a cross-sectional view taken along line A', FIG. 4B is an enlarged view of the alignment block of FIG. 4A, FIG. 4C is a cross-sectional view taken along line B-B' of FIG. 4B, and FIG. 5 shows a state in which a semiconductor material is seated on the material alignment portion of FIG. 3. This is a floor plan.

1 to 5, the semiconductor material cutting device 100 according to a preferred embodiment of the present invention includes a magazine (not shown) in which a plurality of semiconductor materials (S) are stacked, and a magazine (not shown) drawn from the magazine. A pair of inlet rails (1500, 1600) for guiding the semiconductor material (S), respectively, are provided in the front-back direction inside the pair of inlet rails (1500, 1600), as long as one or more fiducial holes are provided on the upper surface. A pair of alignment blocks (1700, 1800) and the semiconductor material guided on the inlet rail can be moved forward and backward by adsorbing, and the semiconductor material (S) on one side and the fiducial hole provided in the alignment block are imaged together to form the semiconductor material. A material picker (2000) equipped with a material vision (2300) to inspect the alignment state, and the semiconductor material (S) adsorbed on the material picker (2000) is transferred and movable in the Y-axis direction, θ It includes a chuck table 3000 rotatable in the axial direction, a cutting unit 4000 for cutting the semiconductor material S delivered to the chuck table 3000 into individual semiconductor packages, and a pair of alignment blocks. At least one of the alignment blocks has an air conduit formed therein, and the air conduit communicates with the fiducial hole so that air is sprayed into the fiducial hole.

The semiconductor material cutting device of the present invention can be broadly classified into a material supply section (magazine), a material transfer section (material picker), a material alignment section (inlet rail, alignment block, alignment table), and a material cutting section (chuck table, cutting section).

The material supply unit may be a stacked magazine (not shown) to supply semiconductor materials.

The semiconductor material (S) is provided in a state of being introduced into a magazine, and a plurality of semiconductor materials are each stacked in the magazine. The semiconductor material stacked in the magazine is pulled out from the magazine through a separate pusher (not shown) or a gripper 2200 provided on one side of the material picker 2000 and delivered to the material alignment unit.

The material transfer unit performs the function of transporting and delivering the semiconductor material (S) to the material sorting unit or the material cutting unit, and may be a material picker (2000).

The material picker 2000 is installed to be movable in the A gripper 2200 is provided to withdraw the semiconductor material from the magazine and deliver it to the alignment unit to be guided to the inlet rail, and the material vision 2300 and the gripper 2200 may be provided to move together in the Y-axis direction.

Therefore, the gripper 2200 functions to extract one of the semiconductor materials stacked in the magazine and place it on the upper part of the inlet rail. Of course, if the material picker is not equipped with a gripper, the semiconductor material can be guided to the upper part of the inlet rail using a pusher or gripper provided separately on the magazine side.

Additionally, the material picker 2000 may perform a function of adsorbing the semiconductor material (S) guided on the inlet rails (1500, 1600) and transferring it to the chuck table (3000). In this case, the material picker 2000 picks up the semiconductor material (S) guided on the inlet rails (1500, 1600) by adsorption, and then delivers it to the chuck table (3000) of the material cutting unit.

The material picker 2000 is installed on the guide rail 2001 and can move in the X-axis direction (front-back direction) along the guide rail 2001. The material picker (2000) moves forward to retrieve semiconductor material from the magazine, moves backward to deliver the withdrawn material to the inlet rails (1500, 1600), and delivers the semiconductor material to the inlet rails (1500, 1600). Once the alignment status of (S) is completed, the semiconductor material can be adsorbed and moved backward to deliver the semiconductor material to the chuck table.

The material picker 2000 is equipped with a Z-axis driving unit 2500, and by driving the Z-axis driving unit 2500, the adsorption unit 2100 of the material picker 2000 moves in the Z-axis direction, that is, moves up and down. Descent is possible.

The material vision driving unit 2400 provided in the material picker 200 functions to move the material vision 2300 and the gripper 2200 in the Y-axis direction, and through this, the material vision 2300 moves the alignment table 1300. Inspect the positions of the first fiducial hole 1710 and the front reference mark M1 of the first alignment block 1700 provided in the front, or the second alignment block 1800 provided in the rear of the alignment table 1300. The positions of the second fiducial hole 1810 and the rear reference mark (M2) can be easily inspected.

The material picker 2000 is equipped with a Z-axis driving unit 2500, and by driving the Z-axis driving unit 2500, the adsorption unit 2100 of the material picker 2000 moves in the Z-axis direction, that is, moves up and down. Descent is possible.

The material picker 2000 may be configured to include an interlock pin 2600 that can be raised and lowered. These interlock pins 2600 are inserted into the interlock pin holes 1730, 1830 of the alignment blocks 1700, 1800 or the interlock pin holes of the chuck table to connect the alignment blocks 1700, 1800 and the material picker 2000, or the material picker and the chuck. It functions to align or set the position of the table.

The material alignment unit inspects the alignment of the semiconductor material (S) so that the semiconductor material aligned on the chuck table can be delivered, and as shown in FIGS. 2 to 4A, guides the semiconductor material (S) drawn from the magazine. It includes an inlet rail (1500, 1600) and alignment blocks (1700, 1800) provided inside the inlet rail in the front-back direction.

A pair of inlet rails 1500 and 1600 is provided to guide the semiconductor material withdrawn from the magazine.

A pair of inlet rails (1500, 1600) are arranged parallel to the long side direction of the semiconductor material and may consist of a first inlet rail (1500) and a second inlet rail (1600), and the first inlet rail (1500) The second inlet rails 1600 are each provided to be movable in the Y-axis direction so that the width can be adjusted according to the type or size of the semiconductor material.

The alignment blocks 1700 and 1800 are provided inside the first inlet rail 1500 and the second inlet rail 1600 in the front-back direction, respectively, and have one or more fiducial holes on their upper surfaces.

Here, the alignment block may be composed of a first alignment block 1700 disposed toward the magazine side and a second alignment block 1800 disposed toward the chuck table. At least one of the first alignment block 1700 and the second alignment block 1800 has an air conduit formed therein, and the air conduit communicates with a fiducial hole provided on the upper surface, so that air can be sprayed into the fiducial hole.

The material alignment unit of the present invention is disposed between a pair of alignment blocks (1700, 1800) inside the first inlet rail (1500) and the second inlet rail (1600) and is guided by the pair of inlet rails (1600, 1600). It may further include an alignment table 1300 that supports the lower surface of the semiconductor material. The alignment table 1300 may support the lower surface of the semiconductor material or may be fixed by adsorbing the lower surface of the semiconductor material.

If the alignment table is equipped to adsorb the lower surface of the semiconductor material, guide the semiconductor material to the upper part of the inlet rail and then place the alignment table in a state where the warpage of the semiconductor material is alleviated while the material picker presses the upper surface of the semiconductor material. It can also be adsorbed flatly.

In the case of providing the alignment table 1300, the first inlet rail 1500 is disposed on the left side of the alignment table 1300 and is movable to the left and right (or Y axis), and the second inlet rail 1600 is aligned. It may be disposed on the right side of the table 1300 and movable to the left and right (or Y axis). The first alignment block 1700 is provided in front of the alignment table 1300, and the second alignment block 1800 may be provided at the rear of the alignment table 1300.

The material alignment unit 1000 of the present invention will be described in more detail below.

The material cutting unit may include a chuck table to which the semiconductor material adsorbed to the material picker is transferred, and a cutting unit (blade) to cut the semiconductor material delivered to the chuck table into individual semiconductor packages.

The semiconductor material (S) adsorbed on the material picker (2000) is delivered to the chuck table (3000), and the It is delivered in sorted state. At this time, the semiconductor material delivered to the chuck table can be fixed through adsorption. The chuck table 3000 is provided to be movable in the Y-axis direction and may be installed to be rotatable in the θ-axis direction.

As the chuck table 3000 is installed to be movable in the Y-axis direction and rotatable in the θ-axis direction, when transferring the semiconductor material to the chuck table, the inspection results of the material vision are reflected and the Y-axis direction and the It may function to correct the θ-axis direction, and may function to correct the Y-axis direction and θ-axis direction of the semiconductor material (S) delivered on the chuck table 3000, and may function to correct the semiconductor material (S) through the cutting unit. It can be cut by moving it to the lower part of (4000), and the cutting direction of the semiconductor material (S) can also be changed.

The chuck table 3000 has a plurality of chuck table adsorption holes 3100 into which the semiconductor material (S) delivered through the material picker 2000 is adsorbed, and a chuck table 3000 formed to protect the chuck table 3000 from the cutting portion 4000. A cutting escape groove 3200 is provided.

The chuck table suction holes 3100 have the same number as the number of semiconductor packages, and each semiconductor package cut by the cutting unit 4000 is adsorbed to each chuck table suction hole 3100, so that the chuck table 3000 is Individualized semiconductor packages can be adsorbed and fixed without being misaligned.

The cutting escape groove 3200 is provided between the chuck table suction holes 3100 and can prevent the chuck table 3000 from being damaged when the cutting part 4000 cuts the semiconductor material S.

The unit picker 6000 is installed to be movable in the It has the function of delivering to the drying unit (not shown) via (not shown).

The unit picker 6000 is installed on the guide rail 2001. As a result, the unit picker 6000 moves along the guide rail 2001, allowing it to easily move in the X-axis direction.

The cleaning unit can remove foreign substances and cutting residues from the semiconductor package generated when cutting the semiconductor material, and is provided at the bottom of the moving path of the unit picker (6000) and can contact the lower surface of the semiconductor material adsorbed on the unit picker (6000) or use washing water. Cleaning can be performed while spraying.

The drying unit may be provided to dry the semiconductor package washed in the washing unit, and may be provided below the moving path of the unit picker 6000 to transfer the semiconductor material adsorbed on the unit picker 6000.

Hereinafter, the semiconductor material cutting device 100 of the present invention will be described in more detail with reference to examples.

In the present invention, in order to cut the semiconductor material into a semiconductor package, the semiconductor material is transferred to the chuck table 3000 and the semiconductor material is cut with a cutting part such as a blade. At this time, in order to accommodate the cutting line of the semiconductor material to be cut within the range of the cutting escape groove 3200 of the chuck table 3000, the chuck is positioned at a preset position, that is, with the X-axis, Y-axis, and θ-axis of the semiconductor material aligned. The alignment of semiconductor materials can be inspected and corrected in the material alignment department so that they can be delivered to the table.

In order to align semiconductor materials, the alignment of the semiconductor materials is inspected using the material vision provided on one side of the material picker. At this time, if only the reference mark formed on the semiconductor material is inspected, the reliability of the inspection results may be reduced due to the influence of vibrations generated inside and outside the equipment. Therefore, when inspecting the alignment of the semiconductor material, the reference target must be used to exclude external influences such as vibration. The alignment block on which the fiducial hole is formed is imaged together.

That is, the alignment state of the semiconductor material can be known by obtaining location information of the semiconductor material by capturing images of the fiducial hole of the alignment block and the reference mark formed on the semiconductor material. According to the alignment status test results, the position error value of the semiconductor material can be corrected and the semiconductor material can be transmitted to the chuck table in an aligned state.

For this purpose, the material alignment unit 1000 can correct the Y-axis direction of the semiconductor material by the inlet rails 1500 and 1600, and the alignment table 1300 is rotatable in the θ-axis direction to align the semiconductor material in the θ-axis direction. can be corrected.

A first inlet rail 1500 and a second inlet rail 1600 for guiding semiconductor materials are disposed on the left and right outer edges of the material alignment unit 1000.

The first inlet rail 1500 and the second inlet rail 1600 guide the semiconductor material pulled out from the magazine and are each provided to be transported in the Y-axis direction.

The first inlet rail 1500 is disposed on the left side of the alignment table 1300 and is movable to the left and right in the material alignment unit 1000, and the second inlet rail 1600 is disposed on the right side of the alignment table 1300. It is installed to be movable to the left and right in the material alignment unit 1000, and each of the inner surfaces of the first inlet rail 1500 and the second inlet rail 1600 contacts the left and right sides of the semiconductor material (S), It functions to guide and align (S).

The first inlet rail 1500 is installed on the first guide 1120 formed in the X-axis longitudinal direction on the left side of the center line C of the alignment table 1300. Therefore, by moving the first inlet rail 1500 along the first guide 1120, it is possible to move to the left and right in the material alignment unit 1000, that is, in the Y-axis direction.

The second inlet rail 1600 is installed on the second guide 1130 formed in the X-axis longitudinal direction on the right side with respect to the center line C of the alignment table 1300. Therefore, by moving the second inlet rail 1600 along the second guide 1130, it is possible to move left and right in the material alignment unit 1000, that is, in the Y-axis direction.

The first inlet rail 1500 and the second inlet rail 1600 each move in the direction of the alignment table 1300 along the first guide 1120 and the second guide 1130, that is, in the inner direction of the material alignment unit 1000. By moving to , it is possible to guide a small-sized semiconductor material (S).

In addition, the first inlet rail 1500 and the second inlet rail 1600 each move in the opposite direction of the alignment table 1300 along the first guide 1120 and the second guide 1130, that is, the alignment portion 1000. By moving in the outer direction, it is possible to guide semiconductor material (S) of medium or large size.

In other words, the first inlet rail 1500 and the second inlet rail 1600 are aligned to the left and right widths of the semiconductor material S by moving in a direction approaching the alignment table 1300 or moving away from the alignment table 1300. The distance between the 1st and 2nd inlet rails (1500, 1600) can be adjusted independently.

The upper surfaces of the first inlet rail 1500 and the second inlet rail 1600 are located at a higher position than the upper surface of the alignment table 1300. Therefore, when the first inlet rail 1500 and the second inlet rail 1600 are moved in the direction of the alignment table 1300, the first inlet rail 1500 and the second inlet rail 1600 are aligned with the alignment table 1300. It covers the upper surface.

An opening 1110 is formed in the center of the material alignment unit 1000, and an alignment table 1300 is disposed in this opening 1110.

A rotation unit 1301 is installed at the lower part of the alignment table 1300 to be rotatable in the θ-axis direction. When the position of the semiconductor material S is not in the preset position upon inspection using the material vision 2300, The Y-axis and θ-axis positional deviation of the semiconductor material (S) is corrected and aligned to the correct position.

A first guide 1120 is formed on the left side of the opening 1110 of the material alignment unit 1000, that is, on the left side of the alignment table 1300, and the first inlet rail 1500 is installed in the first guide 1120. It is installed to be movable in the axial direction, that is, in the left and right direction.

A second guide 1130 is formed on the right side of the opening 1110 of the material alignment unit 1000, that is, on the right side of the alignment table 1300, and the second inlet rail 1600 is installed in the second guide 1130. It is installed to be movable in the axial direction, that is, in the left and right direction.

An upward vision (not shown) for upward imaging inspection can be additionally installed in front of the material alignment unit 1000, and the upward vision can be used to check whether the supplied semiconductor material (S) has been turned over. there is.

The alignment table 1300 is provided inside a pair of inlet rails and can support the lower surface of the semiconductor material S drawn out from the magazine while it is guided to the upper part of the inlet rail.

The alignment table 1300 can support the lower surface of the semiconductor material (S) guided on the inlet rail to prevent the semiconductor material (S) from sagging, and can also perform the function of adsorbing and fixing the semiconductor material (S). there is.

The alignment blocks 1700 and 1800 are equipped with an alignment table ( 1300), and is fixedly placed at the center based on the short side direction (width direction) of the semiconductor material (S) mounted on the alignment table 1300 or the short side direction (width direction) of the alignment table.

That is, the alignment block can be placed on the center line (C) of the alignment table. Warpage may occur in the width direction of the semiconductor material (S), and when the semiconductor material (S) is adsorbed, material vision is performed by imaging the front and rear reference marks (M1, M2) at the point where the warpage effect is minimal. (2300) can improve imaging precision.

When the alignment blocks 1700 and 1800 are placed on the outside of the alignment table 1300 or on the outside of the semiconductor material, they may be in a position where detection is impossible depending on the size of the material or the state of the material (warpage, etc.). Therefore, the alignment block is centered based on the short side direction (width direction) of the semiconductor material (S) or the short side direction (width direction) of the alignment table so that it can be inspected with the reference mark of the semiconductor material regardless of the size or state of the semiconductor material. By being fixedly placed, it is possible to minimize the influence of the size of the semiconductor material or warpage (smile type, angry type).

In addition, a plurality of fiducial holes provided on the upper surfaces of the alignment blocks 1700 and 1800 are provided in the front-back direction parallel to the long side direction of the semiconductor material. This is to allow selection of the location of the fiducial hole that can be inspected according to the size of the semiconductor material. Depending on the size of the semiconductor material, the material vision selects which fiducial hole is simultaneously in the field of view of the material vision along with the reference mark of the semiconductor material. You can check the alignment status by selecting it.

At this time, a plurality of fiducial holes may be provided in a plurality of rows (X-axis direction) parallel to the long side direction of the semiconductor material. In order to inspect the alignment of the semiconductor material, it is advisable to select and view at least two or three reference marks located diagonally on the semiconductor material. For this purpose, the fiducial holes imaged together with the reference marks should be divided into at least two rows. It can be provided.

In more detail, the first alignment block 1700 is disposed at the front center of the alignment table 1300. A plurality of first fiducial holes 1710 corresponding to the front reference mark M1 of the semiconductor material S are provided on the upper surface of the first alignment block 1700 in the front-back direction.

A plurality of first fiducial holes 1710 provided in the front-back direction may be provided on the left and right sides parallel to the long side direction of the semiconductor material, and the plurality of fiducial holes may be provided symmetrically in the X-axis direction.

The second alignment block 1800 is disposed at the rear center of the alignment table 1300, and on the upper surface of the second alignment block 1800 is a second fiducial hole ( A plurality of fiducial holes 1810 may be provided in the front-back direction, and the second fiducial hole may be provided at a position corresponding to the first fiducial hole 1710 of the first alignment block 1700.

The first and second fiducial holes (1710, 1810) are of the material picker (2000) along with the front reference mark (M1) and the rear reference mark (M2) when the semiconductor material (S) is adsorbed and seated on the alignment table (1300). It can be a reference point for inspecting the alignment state of the semiconductor material (S) by the material vision 2300.

The first fiducial hole 1710 located at the front among the plurality of first fiducial holes 1710 is located ahead of the absorption area of the alignment table 1300, and the first fiducial hole 1710 located at the rearmost among the plurality of second fiducial holes 1810 The second fiducial hole 1810 is located behind the adsorption area of the alignment table 1300.

Due to the arrangement of the first and second fiducial holes (1710, 1810) located at the front and rear, as the size of the semiconductor material (S) changes, the distance between the first fiducial hole (1710) and the front reference mark (M1) It is possible to prevent the alignment state of the semiconductor material (S) from being inspected through the material vision (2300) as the distance between or the distance between the second fiducial hole (1810) and the rear reference mark (M2) increases.

After the semiconductor material (S) is adsorbed and seated on the alignment table (1300), the material vision (2300) of the material picker (2000) is guided to the first fiducial hole (1710), the front reference mark (M1), and the second fiducial hole ( 1810) and the rear reference mark (M2) are imaged to inspect the alignment of the semiconductor material (S). If the position of the semiconductor material (S) is not in the correct position, the inlet rail corrects the Y-axis direction error value. And the alignment table 1300 corrects the error value in the θ-axis direction and aligns the position of the semiconductor material (S) to the correct position.

The front reference mark (M1) and the back reference mark (M2) of the semiconductor material (S) are formed at the front and rear of the semiconductor material (S). As a result, when the size of the semiconductor material (S) changes, the front reference mark The positions of (M1) and the rear reference mark (M2) also change.

As the positions of the front reference mark (M1) and the rear reference mark (M2) change, the distance between the first fiducial hole (1710) and the front reference mark (M1) or the second fiducial hole (1810) and the rear reference mark If the distance between the marks M2 increases, the imaging precision of the material vision 2300 may decrease, resulting in a position error.

For example, the material vision 2300 simultaneously images the first fiducial hole 1710 formed in the first alignment block 1700 and the front reference mark M1 provided on the semiconductor material S formed adjacent thereto. To do this, FOV (Fields of View) is set so that the first fiducial hole 1710 and the front reference mark M1 can both be in the field of view of the material vision 2300. Simultaneous imaging is to prevent precision from being deteriorated due to vibration caused by external force or other external environment when the material vision (2300) captures the semiconductor material (S), and the alignment blocks (1700, 1800) are in fixed positions. By determining the coordinates of the reference mark of the semiconductor material (S) based on the fiducial holes (1710, 1810), the position of the semiconductor material (S) can be imaged with high precision even when an external force, etc. acts.

Here, if the size of the semiconductor material (S) changes, the FOV of the material vision (2300) can be changed. However, if the FOV is large, the imaging precision may decrease, so with the FOV optimized, semiconductor materials (S) of various sizes are placed on the alignment block. In order to be applicable, a plurality of fiducial holes (1710, 1810) are provided parallel to the long side direction of the semiconductor material (S), and the corresponding fiducial holes (1710, 1810) and the semiconductor material are connected regardless of the size of the semiconductor material (S). The reference mark (S) can be imaged simultaneously.

Therefore, as described above, by providing a plurality of first fiducial holes 1710 and second fiducial holes 1810 in the front-to-back direction, it is possible to respond to various sizes of the semiconductor material (S), and thus the material vision (2300) It has the advantage of being able to be used in common without adjusting the position of the alignment block or replacing the alignment block, as it is possible to image both the semiconductor material and the fiducial hole during imaging.

In particular, the position of the first fiducial hole 1710, which is located at the forefront among the plurality of first fiducial holes 1710, is positioned forward of the adsorption area of the alignment table 1300, and the position of the first fiducial hole 1710, which is located at the forefront among the plurality of first fiducial holes 1710, is positioned forward of the suction area of the alignment table 1300. By positioning the second fiducial hole 1810, which is located at the rearmost position, behind the adsorption area of the alignment table 1300, the front reference mark (M1) of the large-sized semiconductor material (S) with a front-to-back width larger than the adsorption area ) and the rear reference mark (M2) have the effect of matching the first fiducial hole 1710 and the second fiducial hole 1810.

For reference, the reference mark for a semiconductor material may be provided separately for the semiconductor material, but in the case of a semiconductor material for which no reference mark is provided, a specific area or a semiconductor package located at the outermost edge may be designated in advance as a reference mark.

In the present invention, air can be sprayed into a fiducial hole provided in any one or more of a pair of alignment blocks (1700, 1800).

In order to allow air to be sprayed into the fiducial hole provided in the alignment block, an air conduit 1920 is formed inside the alignment block.

As shown in FIGS. 1, 2, and 4A to 4C, the alignment block of the present invention is formed inside the alignment block and has an air conduit 1920 in communication with the fiducial hole 1810, and an air conduit 1920. It may be configured to include an air supply unit 1910 that supplies air, and a valve (not shown) that is connected to the air supply unit and can be opened and closed to supply air or block the supply of air.

The air pipe 1920 flows the air supplied from the air supply unit 1910, and is provided in communication with the fiducial hole 1810. Therefore, when air is supplied from the air supply unit 1910, air is sprayed into the fiducial hole 1810. It becomes possible.

As shown in FIGS. 2 and 4A to 4C, the alignment block of the present invention is an alignment block so that the air supply unit 1910 and the fiducial hole 1810 communicate when the air supply unit 1910 is provided on the side of the alignment block. An air conduit may be formed inside, but when the air supply unit 1910 is provided on the lower surface of the alignment block, the air conduit 1920 passes through the alignment block (a form that communicates a plurality of fiducial holes from the lower surface of the alignment block). It may also be provided as. This is only an example and can be changed in various ways as needed.

The valve can be opened while cutting the semiconductor material delivered to the chuck table into individual semiconductor packages, or before inspecting the alignment of the semiconductor material guided to the inlet rail by material vision.

Of course, if there is no effect even if air is sprayed during the process of delivering the material to the inlet rail or inspecting it with material vision, the configuration of the valve may be omitted.

However, in order to prevent air consumption and ensure that an appropriate amount of air is sprayed, a valve is provided so that air is sprayed only when necessary, and the degree of opening and closing of the valve can be adjusted as needed.

Preferably, before inspecting the alignment of the semiconductor material, air can be sprayed to completely remove moisture around the fiducial hole before inspection. In addition, while cutting a semiconductor package, cutting water scatters and forms water droplets on the alignment block, so during the cutting process, air is sprayed to create an air flow from the bottom to the top, forming an air curtain, which scatters into the fiducial hole of the alignment block. It can prevent water droplets from entering.

In the present invention, air may be sprayed on both of the pair of alignment blocks 1700 and 1800, but air may also be sprayed only on the second alignment block 1800 disposed on the side of the material cut portion.

Since the cutting part 4000 is located near the second alignment block 1800, scattered cutting water may flow into the second fiducial hole 1810 of the second alignment block 1800, but the first alignment block 1800 is relatively distant. This is because it is difficult for scattered cutting water to reach the first fiducial hole 1710 of the block 1700.

Therefore, it is desirable to allow air to be sprayed into the fiducial hole of the second alignment block 1800. In an embodiment of the present invention, air is sprayed into the second alignment block 1800 as an example, but this is only an example and is not limited thereto.

The air supply unit 1910 functions to supply air supplied from an external air source to the air pipe 1920. The air conduit 1920 is located below the plurality of second fiducial holes 1810 and is formed inside the alignment block to communicate with all of the plurality of second fiducial holes 1810. Accordingly, the air supplied through the air supply unit 1910 flows along the air pipe 1920 and is then injected to the outside through the plurality of second fiducial holes 1810.

As shown in FIG. 4A, when air is supplied from the air supply unit 1910, the air is directly injected through the plurality of second fiducial holes 1810, thereby forming the second fiducial holes 1810 of the second alignment block 1800. It can completely remove water droplets around it.

To explain in detail, when the cutting unit 4000 performs the process of cutting the semiconductor material S into a semiconductor package, cutting water is sprayed. When this cutting water scatters and flows into the second fiducial hole 1810, the cutting water is sprayed. Water droplets form in the second fiducial hole, causing an error in imaging of the second fiducial hole (1810) by the material vision (2300). However, as in the present invention, by spraying air directly through the second fiducial hole 1810, it is possible to remove water droplets or prevent water droplets from forming on the second alignment block 1800 and the fiducial hole 1810. Through this, the problem of misrecognition of the material vision 2300 caused by water droplets can be solved. Therefore, vision inspection errors can be prevented in the material alignment section and inspection precision can be improved.

In addition, in the case of the present invention, instead of installing a separate air nozzle, the air pipe is provided in the second alignment block 1800, so the inconvenience of mechanical interference, angle adjustment, and setting due to installing a separate air nozzle is eliminated. does not exist.

Of course, it is also possible to consider installing the air nozzle at the top of the second alignment block 1800, but if it is installed at the top, it interferes with the transport path of the material picker, making installation difficult, and installing the air nozzle on one side of the material picker is difficult. In this case, a process to remove moisture must be performed before the semiconductor material is supported on the inlet rail and placed on the upper surface of the fiducial block, so in addition to the material transfer of the material picker and the inspection of the material vision, a separate sequence for removing moisture is added to the equipment. UPH drops.

As air is sprayed from the bottom to the top through the second fiducial hole 1810, a kind of air curtain can be formed, and through this, cutting water can be prevented from flowing into the second alignment block during the cutting process.

It is provided on one side of the alignment blocks (1700, 1800) to prevent cutting water generated when cutting the semiconductor material (S) into individual semiconductor packages at the cutting unit (4000) from splashing into the fiducial holes (1710, 1810), and is directed upward. It may further include an air curtain unit 7000 that sprays air to form an air curtain.

The air curtain unit 7000 may be arranged to be located rearward of the second fiducial hole 1810 located in the rearmost position among the plurality of second fiducial holes 1810 of the second alignment block 1800, preferably. It may be disposed in the Y-axis longitudinal direction at the lower part between the second alignment block 1800 and the chuck table.

The air curtain unit 7000 is provided with a plurality of air injection ports 7100 on the upper surface of the air curtain unit 7000 that spray air from the lower direction to the upper direction. Therefore, when air is sprayed from the air injection port 7100 of the air curtain unit 7000, a kind of air curtain is formed, and the cutting water scattered through this air curtain is prevented from splashing on the alignment blocks 1700 and 1800, thereby It is possible to prevent water droplets from forming in the shell holes (1710, 1810).

Previously, the air conduit was shown as being provided in the second alignment block 1800, but the air conduit may also be provided in the first alignment block 1700. In this case, the first alignment block 1700 has an air supply unit 1910 that supplies air, the air supplied from the air supply unit 1910 flows, and is provided inside the first alignment block 1700, and the first alignment block 1700 It may be configured to include an air pipe 1920 that communicates with the fiducial hole 1710.

As shown in Figure 5, the semiconductor material (S) is provided with fiducial holes (1710, 1810) of the alignment blocks (1700, 1800) and a reference mark that is imaged by the material vision (2300). The reference mark may be composed of a front reference mark (M1) provided in front of the semiconductor material (S) and a rear reference mark (M2) provided in the rear of the semiconductor material (S).

The material vision (2300) can acquire the position information and alignment status of the semiconductor material (S) by imaging the fiducial holes (1710, 1810) of the alignment blocks (1700, 1800) and the reference mark of the semiconductor material (S). Through this, position correction can be performed to resolve alignment and alignment errors of the semiconductor material (S).

The material vision is configured according to the size of the semiconductor material so that the fiducial holes (1710, 1810) of the alignment blocks (1700, 1800) and the reference mark of the semiconductor material (S) can be imaged together within the field of view (FOV) of the material vision (2300). One fiducial hole among the plurality of fiducial holes provided in the alignment blocks 1700 and 1800 can be selectively imaged.

The alignment blocks (1700, 1800) of the present invention are provided at the center line (C) of the alignment table (1300) so that they can be inspected together regardless of the size of the semiconductor material (S), so that small-sized semiconductor materials and large-sized semiconductors can be inspected together. Vision inspection is possible for all materials.

In particular, in the present invention, the material vision (2300) inspects the reference mark of the semiconductor material (S) and the fiducial holes (1710, 1810) provided in the alignment blocks (1700, 1800) regardless of the size of the semiconductor material (S). To this end, a plurality of fiducial holes (1710, 1810) formed in the alignment blocks (1700, 1800) are provided in the front-back direction parallel to the long side direction of the semiconductor material (S), so that the fiducial holes (1710) are formed regardless of the size of the semiconductor material (S). , 1810) and the reference mark formed on the semiconductor material (S) can be imaged together.

The alignment blocks 1700 and 1800 align the materials with the first alignment block 1700 provided in front of the material alignment unit 1000 to be located in front of the alignment table 1300 and the first alignment block 1700 to be located in front of the alignment table 1300. It may be configured to include a second alignment block 1800 provided at the rear of the unit 1000.

The first alignment block 1700 and the second alignment block 1800 are also fixedly arranged at the center based on the short side direction of the semiconductor material (S) mounted on the alignment table 1300.

The fiducial holes 1710 and 1810 correspond to the front reference mark M1 of the semiconductor material S on the upper surface of the first alignment block 1700 and the second alignment block 1800. It may be configured to include a second fiducial hole 1810 corresponding to the rear reference mark (M2) of the semiconductor material (S) on the upper surface.

Interlock pin holes 1730 and 1830 may be provided at the top of the alignment block. The interlock pin holes 1730 and 1830 are holes into which an interlock pin provided on one side of the material picker is inserted and can be used for aligning or setting the material picker and the alignment block. At this time, the interlock pin may be provided to be raised and lowered on one side of the material picker so that the function of the interlock pin can be selectively used as needed.

If the interlock pin provided in the material picker is not provided to raise and lower, the alignment of the semiconductor material cannot be corrected due to the protruding interlock pin. Therefore, material alignment can be performed with the interlock pin raised.

Of course, the interlock pin of the material picker can be omitted, and when a material picker without an interlock pin is used, a plurality of fiducial holes can be provided on the upper surface of the alignment block without an interlock pin hole.

When the material picker is equipped with an interlock pin that can be raised and lowered, the interlock pin holes 1730 and 1830 are the first interlock pin hole 1730 provided on the upper surface of the first alignment block 1700 and the upper surface of the second alignment block 1800. It may be configured to include a second interlock pin hole 1830 provided in . A plurality of interlock pin holes 1730 and 1830 may be provided so that they can be selectively used at corresponding positions according to the size of the semiconductor material or the position of the interlock pin provided in the material picker.

A plurality of first fiducial holes 1710 may be provided on the upper surface of the first alignment block 1700 in the front-back direction, and a plurality of second fiducial holes 1810 may be provided on the upper surface of the second alignment block 1800 in the front-back direction. It can be.

Through the material vision 2300 provided in the material picker 2000, the front and rear reference marks (M1, M2) provided on the semiconductor material (S) and the first and second alignment blocks (1700, 1800) provided respectively. , the alignment of the two fiducial holes (1710, 1810) can be inspected and corrected if an alignment error occurs.

Correction of the semiconductor material in the semiconductor material cutting device of the present invention can be performed as follows.

The first case is a case in which the material picker can move in the X-axis direction and the chuck table can move in the Y-axis direction and rotate in the θ-axis direction.

Material Vision inspects the alignment of the semiconductor material by photographing the reference mark of the semiconductor material supported on the inlet rail and the fiducial hole of the alignment block, and calculates the X-axis, Y-axis, and θ-axis error values according to the inspection results. The X-axis error value is corrected by the material picker, and the Y-axis and θ-axis error values are corrected by the chuck table.

Therefore, after the material picker picks up the semiconductor material on the inlet rail and transfers it to the upper part of the chuck table, the material picker corrects the The X-axis, Y-axis, and θ-axis can be mounted in an aligned state.

In other words, the material alignment unit inspects the amount of positional deviation (X-axis, Y-axis, and θ-axis) of the semiconductor material and determines the error of the semiconductor material through the relative movement of the material picker and chuck table before transmitting it to the chuck table according to the inspection results. The value can be corrected.

The second case is a case where the material picker is movable in the

That is, in the material alignment unit, the inlet rails are each provided to be transported in the Y-axis direction, so that Y-axis correction can be performed, and if the alignment table placed inside the inlet rail is rotatable in the θ-axis direction, θ-axis correction is performed. can be performed.

Material Vision inspects the alignment of the semiconductor material by photographing the reference mark of the semiconductor material supported on the inlet rail and the fiducial hole of the alignment block, and calculates the X-axis, Y-axis, and θ-axis error values according to the inspection results. Afterwards, the material picker corrects the X-axis error value of the semiconductor material and picks up the semiconductor material with the Y-axis and θ-axis error values of the semiconductor material corrected by the alignment table and inlet rail.

Then, when the semiconductor material is moved to the chuck table and delivered to the chuck table, the semiconductor material can be placed on the chuck table with the X-axis, Y-axis, and θ-axis of the semiconductor material aligned.

Of course, when sorting materials, the Y-axis and θ-axis error values of the semiconductor material are corrected by the alignment table and inlet rail, and before the material picker picks up and delivers the semiconductor material to the chuck table, the material picker picks up the X-axis of the semiconductor material. Error values can also be corrected.

Lastly, this is the case where the material picker is capable of moving in the X-axis direction and rotatable in the θ-axis direction.

Material Vision inspects the alignment of semiconductor materials by photographing the reference mark of the semiconductor material supported on the inlet rail and the fiducial hole of the alignment block, and calculates the X-axis, Y-axis, and θ-axis error values of the semiconductor material according to the inspection results. Calculate The X-axis and θ-axis error values are reflected by the material picker, and the Y-axis error value is compensated by the chuck table. Therefore, the semiconductor material can be placed on the chuck table with the X-axis, Y-axis, and θ-axis aligned.

Of course, in the case where the material picker is movable in the The error value is corrected by the material picker, the inlet rail corrects the Y-axis error value, and the material alignment unit picks up the X-axis, Y-axis, and θ-axis error values of the semiconductor material while correcting them. Then, when the semiconductor material is moved to the chuck table and delivered to the chuck table, the semiconductor material can be placed on the chuck table with the X-axis, Y-axis, and θ-axis of the semiconductor material aligned.

Previously, we explained how to correct semiconductor materials depending on the movement direction and rotation of the material picker, inlet rail, material alignment unit, and chuck table, but this can be implemented in various embodiments depending on the movement direction and rotation of each component. .

Meanwhile, in the present invention, the reference mark of the semiconductor material (S) and the fiducial holes (1710, 1810) of the alignment blocks (1700, 1800) are imaged together within the field of view (FOV) of the material vision (2300) to capture the image of the semiconductor material (S). It is possible to obtain location information and check the alignment of the semiconductor material by comparing the obtained location information with the preset location information. At this time, if there is no reference mark on the semiconductor material (S), the alignment status of the semiconductor material (S) is located at the outermost location instead of the reference mark. It may be possible to inspect the specific package of the semiconductor material (S) and the fiducial holes (1710, 1810) together by replacing it with a specific package, such as a package.

The fiducial holes 1710 and 1810 provided in the aforementioned alignment blocks 1700 and 1800 may be provided in the form of fiducial marks.

Hereinafter, the operation of the material alignment unit 1000 when seating semiconductor materials (S) of various sizes using the material alignment unit 1000 having the above-described configuration will be described.

When a large-sized semiconductor material (S) is placed on the alignment unit 1000, the first inlet rail 1500 is moved to the left and the second inlet rail 1600 is moved to the right. In this case, the distance between the inner surfaces of the first and second inlet rails (1500, 1600) is such that the inner surfaces of the first and second inlet rails (1500, 1600) each touch the left and right sides of the large-sized semiconductor material (S). It is set up to support.

When a large-sized semiconductor material (S) is placed on the alignment table (1300), the front reference mark (M1) of the semiconductor material (S) is one of the plurality of first fiducial holes (1710) of the first alignment block (1700). It is located rearward than the first fiducial hole 1710 located at the forefront, and the rear reference mark M2 of the semiconductor material (S) is located rearmost among the plurality of second fiducial holes 1810 of the second alignment block 1340. It is located ahead of the second fiducial hole (1810).

Therefore, the material vision 2300 easily images the first fiducial hole 1710 and the front reference mark M1, and the second fiducial hole 1810 and the rear reference mark M2, so that the semiconductor material S is determined. You can check whether it is located in the location.

Through the configuration of the first and second inlet rails 1500 and 1600 of the alignment unit 1000, freedom of movement in the Y-axis direction, that is, movement in the left and right directions, of the first and second inlet rails 1500 and 1600 is guaranteed. As a result, the first and second inlet rails 1500 and 1600 can be moved to the inside of the area of the alignment table 1300.

Therefore, the function of the inlet rail to fix and/or align the semiconductor material (S) in response to the semiconductor material (S) of various sizes can be easily achieved.

As shown in FIG. 1, the semiconductor material cutting device 100 of the present invention allows cutting water generated when cutting the semiconductor material (S) into individual semiconductor packages at the cutting unit 4000 into the fiducial holes 1710 and 1810. It is provided on one side of the alignment blocks 1700 and 1800 to prevent splashing, and may further include an air curtain unit 7000 that sprays air in an upward direction to form an air curtain.

As described above, although the present invention has been described with reference to preferred embodiments, those skilled in the art may modify the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the following patent claims. Or, it can be carried out in modification.

100: Semiconductor material cutting device 1000: Material alignment unit
1110: opening 1120: first guide
1130: Second guide 1300: Alignment table
1301: Rotating unit 1500: First inlet rail
1600: Second inlet rail 1700: First alignment block
1710: 1st fiducial hole 1730: 1st interlock pin hole
1800: Second alignment block 1810: Second fiducial hall
1830: Second interlock pin hole 1910: Air supply unit
1920: Air Pipeline 2000: Material Picker
2100: Suction part 2200: Gripper
2300: Material vision 2400: Material vision driving unit
2500: Z-axis driving unit 2600: Interlock pin
3000: Chuck table 3100: Chuck table suction hole
3200: Cutting escape groove 4000: Cutting portion
6000: Unit picker 7000: Air curtain unit
7100: Air nozzle C: Centerline
S: semiconductor material

Claims (10)

A magazine in which a plurality of semiconductor materials are each stacked;
a pair of inlet rails for guiding the semiconductor material drawn out from the magazine;
a pair of alignment blocks respectively provided in the front-back direction inside the inlet rail and having one or more fiducial holes on the upper surface;
It is capable of moving forward and backward by adsorbing the semiconductor material guided on the inlet rail, and is equipped with a material vision on one side to inspect the alignment of the semiconductor material by taking images of the semiconductor material and the fiducial hole provided in the alignment block. material picker;
a chuck table to which the semiconductor material adsorbed on the material picker is transferred, is movable in the Y-axis direction, and is rotatable in the θ-axis direction; and
It includes a cutting unit for cutting the semiconductor material delivered to the chuck table into individual semiconductor packages,
At least one alignment block among the pair of alignment blocks is
An air supply unit that supplies air to the air pipe; and
It is connected to the air supply unit and further includes a valve that can be opened and closed to supply the air or block the supply of the air,
The valve is opened while cutting the semiconductor material delivered to the chuck table into individual semiconductor packages, or is opened before inspecting the alignment of the semiconductor material guided to the inlet rail by the material vision. Material cutting device. According to paragraph 1,
A plurality of fiducial holes provided in each alignment block are provided in the front-back direction parallel to the long side direction of the semiconductor material, and the air conduit communicates with each of the plurality of fiducial holes provided in the alignment block,
The material vision is a semiconductor material cutting device, wherein the material vision selectively images one of the plurality of fiducial holes provided in the alignment block according to the size of the semiconductor material. delete According to paragraph 1,
It further includes an alignment table disposed between the pair of alignment blocks inside the inlet rail and supporting a lower surface of the semiconductor material guided by the inlet rail,
A semiconductor material cutting device, wherein the alignment blocks are each fixedly arranged at a center based on the width direction of the alignment table. According to paragraph 1,
The material vision inspects the alignment of the semiconductor material by imaging the semiconductor material and the fiducial hole together. According to the inspection result, the material picker corrects the X-axis error value of the semiconductor material, and the chuck table A semiconductor material cutting device characterized in that the X-axis, Y-axis, and θ-axis of the semiconductor material are aligned on the chuck table by correcting the Y-axis and θ-axis error values of the material. According to paragraph 1,
The material picker is rotatable,
The material vision inspects the alignment of the semiconductor material by imaging the semiconductor material and the fiducial hole together, and according to the inspection results, the material picker corrects the X-axis and θ-axis error values of the semiconductor material and the chuck table A semiconductor material cutting device characterized in that the Y-axis error value of the semiconductor material is corrected and the semiconductor material is mounted on the chuck table with the X-axis, Y-axis, and θ-axis aligned. According to paragraph 4,
The pair of inlet rails are each provided to be transportable in the Y-axis direction,
The alignment table is rotatable in the θ-axis direction,
The material vision inspects the alignment of the semiconductor material by imaging the semiconductor material and the fiducial hole together, and according to the inspection result, the material picker corrects the X-axis error value of the semiconductor material, and the alignment table and the inlet A semiconductor material, characterized in that the semiconductor material is picked up with the Y-axis and θ-axis error values corrected by a rail and placed on the chuck table with the X-axis, Y-axis, and θ-axis of the semiconductor material aligned. Cutting device. According to paragraph 1,
One side of the material picker further includes an interlock pin that can be raised and lowered,
A semiconductor material cutting device, characterized in that an interlock pin hole for inserting the interlock pin is provided at an upper part of the alignment block. According to any one of claims 1, 2, 4 to 8,
The alignment block consists of a first alignment block disposed in the magazine side direction and a second alignment block disposed in the chuck table side direction,
A semiconductor material cutting device, characterized in that the air conduit is provided in the second alignment block. According to any one of claims 1, 2, 4 to 8,
The alignment block consists of a first alignment block disposed in the magazine side direction and a second alignment block disposed in the chuck table side direction,
It further includes an air curtain unit disposed in the Y-axis longitudinal direction at a lower portion between the second alignment block and the chuck table and spraying air upward,
The air curtain unit is a semiconductor material cutting device characterized in that it forms an air curtain to prevent cutting water scattered when cutting the semiconductor material from the cutting unit from flowing into the second alignment block.

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