KR102053480B1 - Semiconductor Package Drying Apparatus And Semiconductor Strip Cutting System - Google Patents

Semiconductor Package Drying Apparatus And Semiconductor Strip Cutting System Download PDF

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Publication number
KR102053480B1
KR102053480B1 KR1020150129573A KR20150129573A KR102053480B1 KR 102053480 B1 KR102053480 B1 KR 102053480B1 KR 1020150129573 A KR1020150129573 A KR 1020150129573A KR 20150129573 A KR20150129573 A KR 20150129573A KR 102053480 B1 KR102053480 B1 KR 102053480B1
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KR
South Korea
Prior art keywords
semiconductor package
semiconductor
adsorption
drying
washing water
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KR1020150129573A
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Korean (ko)
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KR20170031952A (en
Inventor
방효영
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한미반도체 주식회사
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Priority to KR1020150129573A priority Critical patent/KR102053480B1/en
Publication of KR20170031952A publication Critical patent/KR20170031952A/en
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Publication of KR102053480B1 publication Critical patent/KR102053480B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)

Abstract

The present invention simplifies the flow path of the drying block constituting the drying apparatus, and minimizes the stain caused by the washing water used in the semiconductor package cleaning process performed after the semiconductor strip cutting process, and the semiconductor package drying for efficiently removing or drying the washing water. An apparatus and a semiconductor strip cutting system having the same.

Description

Semiconductor Package Drying Apparatus and Semiconductor Strip Cutting System Having Same {Semiconductor Package Drying Apparatus And Semiconductor Strip Cutting System}

The present invention relates to a semiconductor package drying apparatus and a semiconductor strip cutting system having the same. More specifically, the present invention simplifies the flow path of the drying block constituting the drying apparatus, and minimizes the stains caused by the washing water used in the semiconductor package cleaning process performed after the semiconductor strip cutting process and efficiently removes or dries the washing water. The present invention relates to a semiconductor package drying apparatus and a semiconductor strip cutting system having the same.

In the semiconductor strip cutting system, it is not easy to completely remove the washing water remaining in the semiconductor package by loading the semiconductor package, which has been cut and cleaned, onto the drying apparatus, and heating the drying block constituting the drying apparatus. The air was blown by an air blower toward the semiconductor package loaded on the drying block. As a result, water is scattered to the periphery of the drying block. Due to the continuous washing operation, the vicinity of the drying apparatus is drastically wet by the scattered washing water. It also increased the risk of leakage.

In order to solve this problem, an absorbent (eg, suction hole) for absorbing the washing water is provided around the drying block in which the package is loaded in the block, and the washing water remaining on the drying block is sucked through the absorbing hole. In the case of small, it is not easy to form the absorption port on the dry block finely, nor is it easy to uniformly apply the negative pressure through the fine pipe.

In addition, when the type of the semiconductor strip or the semiconductor package to be cut is changed, the absorbent holes must also be changed, so that it is also inefficient to form the absorbent holes respectively sucking the washing water.

The present invention simplifies the flow path of the drying block constituting the drying apparatus, and minimizes the stain caused by the washing water used in the semiconductor package cleaning process performed after the semiconductor strip cutting process, and the semiconductor package drying for efficiently removing or drying the washing water. It is an object of the present invention to provide an apparatus and a semiconductor strip cutting system having the same.

In order to solve the above problems, the present invention comprises a semiconductor package cutting system for cutting a semiconductor strip to perform a cutting process into a plurality of individual semiconductor packages, in the drying apparatus for removing and drying the wash water remaining in the semiconductor package A plurality of adsorption ports for adsorbing the plurality of semiconductor packages by pneumatic pressure are formed, respectively, and an adsorption pad made of water-repellent silicon material, and the adsorption pad are seated, and absorb the residual washing water propelled in a predetermined direction by an air blower. A plurality of absorbent openings, a plurality of suction flow passages communicating with the suction openings of the adsorption pad, a drying block having a plurality of absorption flow passages communicating with the absorption opening, and the drying block mounted on an upper portion of the suction flow passage. Adsorption space and absorption in communication with the absorption port It is possible to provide a drying apparatus comprising a block base including a space.

In this case, the air blower may be provided with a plurality of spray nozzles in a column direction, and may be transferred in a direction perpendicular to the column direction of the spray nozzles and may propel the residual washing water on the adsorption pad toward an absorbent side formed in the drying block.

Here, the plurality of absorption ports may be formed spaced apart from the edge of the suction pad in a direction corresponding to the spray direction of the air blower.

In addition, the plurality of absorbent openings may be formed in a zigzag form along a direction parallel to the column direction of the injection nozzle.

In this case, the wash water remaining in the semiconductor package may be absorbed by the plurality of absorbing holes in the process of crossing the absorbent pad and transferred to the absorbent side, and the washing water may be accommodated in the absorbing space through an absorbing flow passage communicating with the absorbing hole. .

The adsorption space and the absorption space of the block base may be connected to a pneumatic line to which a negative pressure may be applied, respectively.

Here, the plurality of absorbent openings are formed in two columns, and each of the absorbent openings may be formed in a form arranged in different rows.

In addition, when the air blows to inject air while reciprocating movement, the plurality of absorbent openings may be formed on both side portions of the drying block.

In this case, a depression line for forming a shadow on the upper surface of the adsorption pad for vision inspection of the semiconductor package adsorbed on the adsorption pad may be provided.

The depression line may be formed along the edge of the suction pad or may be formed in a tiled manner.

Here, a plurality of semiconductor packages are adsorbed on the adsorption pad, and when each of the semiconductor packages is not arranged adjacently, a recessed line is formed around the periphery of the semiconductor package in a tiled manner to form a periphery around the periphery of the semiconductor package. Shading may be formed.

In addition, the adsorption pad is black, and when the vision inspection of the semiconductor package adsorbed on the adsorption pad, bright light is irradiated onto the upper surface of the semiconductor package, and the side region of the semiconductor package is imaged in a shaded state, thereby photographing the semiconductor. The inspection may be performed through an image in which the package is bright and the periphery of the semiconductor package is dark.

In addition, in order to solve the above problems, the present invention provides a cutting device for cutting a semiconductor strip into a plurality of semiconductor packages, a cleaning device for cleaning a semiconductor package individualized by the cutting device, and a semiconductor package washed in the cleaning device A semiconductor strip cutting system comprising the drying apparatus of any one of claims 1 to 11 for washing residual wash water can be provided.

According to the semiconductor package drying apparatus and the semiconductor strip cutting system having the same according to the present invention, the adsorption pad for adsorbing the semiconductor package on the drying block is made of a water-repellent silicone material, so that the washing water is easily collected or collected when blowing by an air blower. Can be promoted.

In addition, according to the semiconductor package drying apparatus and the semiconductor strip cutting system having the same according to the present invention, rather than forming the absorbing holes for absorbing the washing water by the negative pressure, respectively, in the vicinity of the loading position of the semiconductor package, the air blower is blown to dry the semiconductor package. It is formed at the end of the moving direction of the air blower can simplify the flow path structure inside the mold, such as drying block.

In addition, according to the semiconductor package drying apparatus and a semiconductor strip cutting system having the same according to the present invention, by pushing the washing water remaining on the adsorption pad with an air blower, the drying block equipped with the adsorption pad, not the semiconductor package loading position of the adsorption pad It can be absorbed by the absorbent hole formed in the edge area, so it is possible to replace the drying block with the adsorption pad mounted on the block base without changing the structure of the block base detachably fastened to the drying block. Can be done.

1 shows a plan view of one embodiment of a semiconductor strip cutting system according to the present invention.
Figure 2 shows an exploded perspective view of the drying apparatus according to the present invention.
3 shows a cross-sectional view of the drying apparatus shown in FIG. 2.
Figure 4 shows the process of removing the washing water in the drying apparatus according to the present invention.
Figure 5 shows a cross-sectional view of another embodiment of the drying apparatus according to the present invention and the process of removing the washing water.
6 shows another embodiment of a drying apparatus according to the invention.
7 shows another embodiment of a drying apparatus according to the invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the present invention to those skilled in the art. Like numbers refer to like elements throughout.

The semiconductor strip cutting system 1000 according to the present invention includes an on-loading unit for largely supplying a semiconductor strip, a cutting device for cutting the semiconductor strip into a plurality of semiconductor packages, a cleaning device for washing the cut semiconductor chip, and a cleaned semiconductor package. It may be configured to include a drying device for drying.

The semiconductor strip to be cut may be supplied from the onloading part 100. The semiconductor strip s to be cut may be a long rectangular material in which a plurality of semiconductor packages are arranged in a matrix form along the X-axis and Y-axis directions, and the cutting device 200 may be formed such that its length direction and the X-axis are parallel to each other. Can be supplied.

In addition, the on-loading unit 100 may be supplied with a plurality of cutting target semiconductor strips mounted in a magazine M, and the pusher 110 or the drawer 220 of the on-loading unit 100 may be sequentially semiconductor. When the strip is pushed toward the cutting device 200, the semiconductor package propagated in the X-axis direction enters into the inlet rail 210 of the cutting device 200, which is provided to guide the transferred semiconductor strip, and enters the semiconductor. A drawer 220 capable of pulling the front end of the package in the X-axis direction grips the front end of the semiconductor package and pulls the front end of the package so that the strip picker 230 may pick up the semiconductor strip to be cut.

The strip picker 230 may be mounted on a guide frame 240 installed in the X-axis direction provided with a driving means to transfer the strip in the X-axis direction.

The strip picker 230 picking up the semiconductor strip to be cut carries the semiconductor package to the chuck table 250.

The chuck table 250 may be configured to be transportable to any position on the XY plane and to be rotatable about a Z axis, and the semiconductor package adsorbed to the chuck table 250 may include at least one cutter 260. Can be cut into individual semiconductor packages. In the embodiment shown in FIG. 1, the cutter 260 shows an example in which two cutting blades are provided. In addition, although the chuck table 250 is illustrated as one in FIG. 1 and the exemplary embodiment of the present invention, two or more chuck tables 250 may be provided to improve work UPH.

The cutter 260 may be cut into individual semiconductor packages during the relative displacement of the chuck table 250, and the plurality of semiconductor packages that have been cut may be picked up and cleaned by the unit picker 270 at one time.

The unit picker 270 may vacuum pick up a plurality of semiconductor packages at once and transfer them to a brush 265, a cleaning device 280, and a drying device 300, which will be described later, and perform a cleaning process and a drying process. The cleaning device 280 may be provided with a plurality of injection holes (not shown) for spraying the cleaning liquid or compressed air. A plurality of injection holes may be provided in the width direction of the unit picker 270.

A plurality of semiconductor packages picked up by the unit picker 270 and cleaned by the cleaning device 280 may be adsorbed onto the drying device 300. Therefore, the semiconductor package supplied to the drying apparatus may be wetted by the washing water used in the washing process. In general, the drying apparatus 300 may perform a drying process by embedding a hot wire. When the washing water is dried by a hot wire or the like, many stains are left on the package or the adsorption pad constituting the drying apparatus. Such stains may act as noise affecting the inspection result during the vision inspection process, and thus the washing water is removed as much as possible. It should be dried. I'll explain more about this later.

The semiconductor package washed by the cutting device 200 is transported to the drying apparatus 300 by the unit picker 270, and then the upper surface of the semiconductor package in which the semiconductor package inspection unit 400 is cut, cleaned and dried. The semiconductor package inspection can be performed by imaging the surface) and the lower surface (ball surface or lead surface).

The semiconductor package upper surface inspection for inspecting the upper surface of the semiconductor package may be a marking inspection on the semiconductor package molding material, and the semiconductor package lower surface inspection may be an inspection for determining a defect such as a gap or a short of a ball or lead wire of the semiconductor package. .

Accordingly, the cut, cleaned and dried semiconductor packages may be inspected from the top and bottom through the captured images by the vision unit, respectively.

Accordingly, the semiconductor package inspection unit 400 constituting the semiconductor strip cutting system 1000 according to the present invention, in which the upper and lower surfaces of the semiconductor package are photographed and inspected for inspection of the semiconductor package in which the cutting process, the cleaning process, and the drying process are completed. The first vision unit 410 for down looking imaging and the second vision unit 420 for up looking imaging for imaging the upper and lower surfaces of the semiconductor package, and the first vision The unit 410 may photograph one surface of the top and bottom surfaces of the semiconductor package, and the second vision unit 420 may be configured to photograph the other surface of the top and bottom surfaces of the semiconductor package.

As shown in FIG. 1, the first vision unit 410 is provided to be transportable in the X and Y axis directions from the semiconductor package inspecting unit 400, and the second vision unit 420 is fixed. It may be provided in the form.

In addition, the semiconductor package inspection unit 400 of the semiconductor strip cutting system 1000 according to the present invention may be provided with at least one alignment table that can be transferred in parallel in the Y-axis direction and can be rotated about the Z-axis.

In the embodiment shown in FIG. 1, the semiconductor package absorbed by the drying apparatus 300 and completed with downward imaging is transferred to the alignment table, loaded on the alignment table, and then picked up by the sorting picker. Directional imaging inspection can be performed.

An air blower 900 may be disposed on the drying apparatus 300 to move along one direction axis and collect washing water remaining on an upper surface or a side surface of the semiconductor package to one side. The air blower may be provided with a plurality of injection nozzles 910 in a row (Y-axis direction).

Each of the picking pickers 560 and 580 may be provided with a plurality of pickup units 561 and 581 side by side in the X-axis direction so that a plurality of semiconductor packages may be picked up together.

The plurality of pickup units 561 and 581 may be configured to enable independent driving, respectively.

In the embodiment shown in FIG. 1, two first sorting pickers 560 and a second sorting picker 580 may be provided to be transported in parallel. Each of the first sorting picker 560 and the second sorting picker 580 may be mounted to the first sorting picker driving means 650 and the second sorting picker driving means 660 so as to be transportable in the X-axis direction, respectively. .

The sorting apparatus 500 may be provided with a first carrying out tray 510 and a second carrying out tray 530 for accommodating good and bad semiconductors, respectively.

Each of the first export tray 510 and the second export tray 530 may be provided for loading and unloading the good semiconductor and the defective semiconductor, respectively. And a tray picker 570 for supplying a new tray.

2 shows an exploded perspective view of the drying apparatus 300 according to the present invention, FIG. 3 shows a cross-sectional view of the drying apparatus 300 shown in FIG. 2, and FIG. 4 shows a drying apparatus 300 according to the present invention. Shows the process by which the washing water is removed.

Drying apparatus 300 according to the present invention shown in Figure 2 largely comprises a suction pad 310, a drying block 320 and a block base 330.

Drying apparatus 300 according to the present invention is a device for removing and drying the washing water sprayed on the semiconductor package in the cleaning process after cutting in the semiconductor package cutting device.

In general, the drying apparatus 300 for washing and drying a semiconductor package is heated and heated by an air blower in a state in which a semiconductor package is adsorbed onto a drying block made of a metal material in which a hot wire is embedded (see reference numeral 900 in FIG. 1). Blowing to remove residual wash water is used.

However, the conventional method is a method that blows water to the outside in the blowing process by the air blower, so the water is severe, there is a problem that the washing water still remains due to the blowing air.

The reason why the washing water is not removed well by blowing is because the water repellent performance of the drying block 320, which is made of metal, is poor, so that the washing water spreads widely on the surface of the drying block 320. There is a problem to leave.

And it is not easy to remove the residual washing water only by the driving force by the blowing.

Therefore, the drying apparatus 300 according to the present invention minimizes the spreading of the washing water by water-repellent coating the adsorption pad 310, the semiconductor package is mounted, the adsorption pad 310 is made of a water-repellent silicone material with good heat resistance to the heat of the heater Configured.

When the residual washing water is blown with an air blower while the water droplet is maintained in the form, it is easy to propel the residual washing water in the blowing direction.

In addition, the drying apparatus 300 according to the present invention is provided with a plurality of absorption ports 325 for absorbing the washing water by the negative pressure in the drying apparatus 300 to remove the residual washing water more efficiently to remove the residual washing water more efficiently. can do. Review more specifically.

In the drying apparatus 300 according to the present invention, an adsorption pad 310 having a plurality of adsorption ports 311 for adsorbing a plurality of semiconductor packages by pneumatic pressure, the adsorption pad 310 is seated, and is mounted on an air blower. A plurality of absorption ports 325 for suctioning the residual washing water propelled in a predetermined direction by the suction direction, a plurality of absorption passages 321 communicating with the suction holes 311 of the suction pad 310, and communicating with the absorption holes 325. A drying block 320 having a plurality of absorption passages 327 formed therein, and the drying block 320 mounted thereon, communicating with a plurality of the absorption passages 321, and being connected to an external pneumatic line b. It may include a block base 330 including an absorption space (337) in communication with the adsorption space (331, 335) and the absorption port 325 and connected to the pneumatic line (a).

The adsorption pad 310 may be made of a water-repellent silicone material as described above, and the adsorption port 311 is provided in a plurality of rows and a plurality of columns.

The suction hole 311 formed in the suction pad 310 is provided to fix the individualized semiconductor package, and a negative pressure is applied to the suction hole 311 by a pneumatic line (b) to be described later. Even when blown, the semiconductor package can remain in place.

In the suction pad 310 illustrated in FIG. 2, a shadow is formed around the semiconductor package disposed at the outermost edge of the semiconductor package arranged in a plurality of rows and columns during the inspection by the vision unit, thereby performing In order to increase the contrast of the semiconductor package from the periphery, a depression line for shading may be provided on the upper surface of the suction pad.

When the semiconductor packages are arranged in a lattice or tile manner, the recessed line 313 is a semiconductor package through shading caused by a thickness of the semiconductor package and a space between the semiconductor packages in the case of the semiconductor package disposed at the outermost edge. In the case of imaging inspection of each boundary region, the shadow generated by the depression line 313 may be used as a position error determination criterion. The depression line 313 may be formed along the edge of the suction pad 310.

That is, a plurality of semiconductor packages are adsorbed on the suction pad, and when each of the semiconductor packages is not arranged adjacent to each other, a recessed line 313 is formed around the periphery of the semiconductor package in a tiled or lattice manner. It can artificially shade around the periphery of the semiconductor package.

At this time, a variety of information can be obtained through vision inspection by the vision unit. For example, the size of the semiconductor package can be checked, and when the balls or leads are formed, the size and offset of the balls or leads can be inspected.

On the other hand, the suction pad 310 is mounted on the drying block 320.

The drying block 320 is formed with a plurality of absorbent holes 325 for absorbing the residual washing water being pushed in a predetermined direction by the air blower.

The absorption port 325 is a hole for absorbing the washing water at a negative pressure, and each of the absorption holes 325 may be applied with a negative pressure by a pneumatic line (a) to be described later.

In addition, the drying block 320 may have a plurality of adsorption passages 321 communicating with the adsorption port 311 of the adsorption pad 310, and a plurality of absorption passages 327 communicating with the absorption port 325. have.

As shown in Figure 2 and 3, the suction pad 310 is provided with a suction port 311 for adsorbing and fixing the semiconductor package, the residual propelled by the air blower at the edge of the drying block 320 An absorption port 325 is provided to absorb the wash water.

In addition, the drying block 320 on which the adsorption pad 310 is seated is provided with a plurality of adsorption passages 321 and a plurality of communication ports communicating with the adsorption port 311 of the adsorption pad 310. An absorption channel 327 may be formed.

The suction port 311 formed in the suction pad 310 and the suction flow path 321 formed in the drying block 320 are formed at a corresponding position so that the negative pressure applied from the suction flow path 321 is the suction port 311. Can be delivered.

In addition, the absorption port 325 may be formed on the upper surface of the drying block 320 and the absorption passage 327 may be formed in communication with the absorption hole 325 on the lower surface of the drying block 320.

As shown in FIG. 3, the diameter of the absorption channel 327 formed in the drying block 320 is larger than the diameter of the absorption port 325 to maximize the pressure applied to the absorption port 325. have.

In addition, the drying apparatus 300 according to the present invention has the drying block 320 mounted thereon, and is connected to the adsorption spaces 331 and 335 communicating with the plurality of the adsorption passages 321 and the absorption port 325. It may include a block base 330 including an absorption space (337).

As shown in FIGS. 2 and 3, the drying block 320 may be fixed to the block base 330 through fastening members such as bolts, and the adsorption may be performed when the type of the semiconductor package to be dried is changed. Replacing only the dry block 320 on which the pad 310 is mounted in the block base 330 may increase the utility of the equipment.

That is, according to the semiconductor package drying apparatus and the semiconductor strip cutting system having the same according to the present invention, instead of forming the absorbing ports for absorbing the washing water by the negative pressure, respectively, in the vicinity of the loading position of the semiconductor package on the suction pad, the semiconductor package is dried. In order to be formed at the end of the moving direction of the blower air blower to simplify the flow path structure inside the mold, such as drying blocks. This pushes the washing water remaining on the adsorption pad with an air blower so that it can be absorbed at the absorption port formed at the edge of the dry block where the adsorption pad is mounted, not the semiconductor package loading position of the adsorption pad, so as to be detachably fastened with the drying block. Without changing the structure of the base means that only the drying block mounted on the adsorption pad mounted on the top of the block base can dry the various semiconductor packages.

In addition, the adsorption spaces 331 and 335 and the absorption space 337 of the block base 330 may be connected to a pneumatic line, respectively, in which negative pressure may be impaired.

The adsorption spaces 331 and 335 are spaces in which the plurality of adsorption ports 311 and the adsorption flow passage 321 converge into one to distribute or share the negative pressure applied to the pneumatic line b.

That is, the plurality of adsorption ports 311 formed in a plurality of rows and columns and the adsorption passage 321 communicating with the adsorption ports 311 communicate with the adsorption spaces 331 and 335, and are illustrated in FIGS. 2 and 3. As described above, the suction spaces 331 and 335 may share a negative pressure applied by two pneumatic lines connected to positions spaced apart in the longitudinal direction of the suction space.

Similarly, the plurality of absorbent holes 325 communicate with the absorption channel 327 formed upward from the bottom of the drying block 320, and the absorption channel 327 is an absorption space 337 formed in the block base 330. It is connected to the absorption space 337, the negative pressure is applied by the pneumatic line (a) connected to the absorption space (337) separately from the pneumatic lines connected to the adsorption space (331, 335).

Therefore, in the drying apparatus 300 according to the present invention, the semiconductor package adsorbed to the adsorption port 311 in the process of drying is fixed to the absorption port 325 by the air blower. After being pushed toward the side, it may be absorbed into the absorbent hole 325 by a negative pressure. The specific drying process is as follows.

As shown in FIG. 1, the air blower 900 is provided with a plurality of spray nozzles 910 in a line, is transported in a direction perpendicular to the column direction of the spray nozzle, and promotes the washing water.

Specifically, the wind injected from the spray nozzle may propel the residual washing water on the adsorption pad 310 toward the absorption port 325 formed in the drying block 320.

As illustrated in FIG. 2, the plurality of absorbent holes 325 are formed to be spaced near the edge of the suction pad 310 in a direction perpendicular to the column direction (Y-axis direction in FIG. 1) of the injection nozzle.

As shown in the enlarged view of FIG. 2, the plurality of absorbent holes 325 are along the imaginary line l in a direction corresponding to the column direction (Y-axis direction in FIG. 1) of the injection nozzle, that is, in a parallel direction. Is formed.

As illustrated in the enlarged view of FIG. 2, the plurality of absorbent holes 325 may be formed in a zigzag form along a direction parallel to the column direction of the injection nozzle.

 That is, the plurality of absorbent holes may be formed in two columns, and each of the absorbent holes may be formed in a form arranged in different rows.

The reason why the plurality of absorbent holes 325 are formed in two rows instead of straight lines and arranged in different rows (zigzag shape) is that when the front absorbent holes 325 do not absorb the washing water during the propulsion of the residual washing water, In order to be able to absorb the washing water absorbing port 325 located in the rear by the zigzag form.

Since the wash water composed of water is cohesive, when the wash water in the form of droplets approaches the specific absorption port 325 and starts to absorb some of the water, the entire water droplet may be absorbed.

However, when more washing water approaches than the washing water that can be absorbed per hour in the specific absorption hole 325, the absorption hole 325 disposed at the rear absorbs the washing water that is not absorbed at the absorption hole 325 disposed at the front due to the zigzag shape. It can improve performance.

As shown in FIG. 4, the air blower crosses the adsorption pad 310 and the residual washing water remaining in the semiconductor package is transferred to the absorbent holes 325. The absorbed wash water may be discharged to the outside of the system via the absorption channel 327, the absorption space 337, and the pneumatic line (a) sequentially.

By such a structure, the wash water remaining in the semiconductor package is transferred to the absorbent side across the absorbent pad and then absorbed by the plurality of absorbents and received in the absorbing space 337 through an absorbing flow passage communicating with the absorbent. It can be discharged to the outside by the pneumatic line (a).

A pneumatic connection member 350 may be provided under the block base 330 as a medium for connecting each pneumatic line, the adsorption spaces 331 and 335, and the absorption space 337. The pneumatic connecting members may be provided with communication passages 355 and 357 for connecting the pneumatic lines a and b to the respective adsorption spaces 331 and 335 and the absorption space 337.

That is, since each pneumatic line will generally be configured in the form of a hose or pipe, the pneumatic connection to connect to the adsorption space (331, 335) and the absorption space 337 having a larger cross-sectional area through the pneumatic connection member Member 350 may be used.

The upper end of the communication line formed on the upper surface of the pneumatic connection member 350 and the lower end of the adsorption spaces 331 and 335 provided on the lower surface of the block base 330 have different cross-sectional areas, but are each sealed, Sound pressures applied in a, b) may be applied.

Figure 5 shows a cross-sectional view of another embodiment of the drying apparatus 300 according to the present invention and a process in which the washing water is removed. Specifically, Figure 5 (a) shows a cross-sectional view of another embodiment of the drying apparatus 300 according to the present invention, Figure 5 (b) shows a process in which the washing water is removed. Descriptions duplicated with those described with reference to FIGS. 1 through 4 will be omitted.

5 is provided on both sides of the drying block 320 unlike the embodiment shown in FIGS. 1 to 4.

Therefore, the air blower propels in only one direction and absorbs the washing water through the absorbing holes 325a and 325b provided on both sides of the drying block, rather than absorbing the washing water through the absorbing holes provided on one side. It can shorten the transfer time and increase the absorption effect.

6 shows another embodiment of a drying apparatus 300 according to the present invention. Descriptions duplicated with those described with reference to FIGS. 1 through 5 will be omitted.

In the adsorption pad 310 shown in FIG. 2, as described above, a clear image can be obtained during vision inspection of a semiconductor package disposed at an outermost edge among semiconductor packages arranged in a plurality of rows and columns during an inspection process by a vision unit. A depression line 313 may be provided on the upper surface of the suction pad.

When the semiconductor packages are arranged in a grid or tile pattern In the case of the semiconductor package disposed at the outermost edge, each boundary region of the semiconductor package is captured by the thickness of the semiconductor package and the shadow generated by the spaces between the semiconductor packages. Can be checked

However, when the semiconductor packages are arranged in a diagonal direction instead of lattice or tiling like the suction pad 310 of the drying apparatus 300 shown in FIG. Since no shadow is generated, it is difficult to determine the position error of the semiconductor package during the imaging inspection by the vision unit.

Therefore, the embodiment shown in Figure 6 is not formed only on the edge of the suction pad 310, the depression line 313 is formed in the form of a checker board, each semiconductor as a reference point for determining the semiconductor package position error is adsorbed in a diagonal direction It is also possible to use a recessed line 313 around the package.

On the other hand, the water-repellent silicon may be a dark color such as black, in order to take advantage of the brightness difference during the vision inspection of the semiconductor package adsorbed on the adsorption pad, in order to increase the contrast (contrast) of the captured image bright light on the upper surface of the semiconductor package Irradiated, the side region and the periphery of the semiconductor package are darkened, so that a captured image can be obtained in which the semiconductor package portion is bright and the periphery of the semiconductor package is dark.

Therefore, during vision inspection, bright light is irradiated on the upper surface of the semiconductor package, and the side region of the semiconductor package is imaged in a shaded state so that the semiconductor package is bright and the periphery of the semiconductor package is inspected through a dark image. The accuracy of the test can be improved.

In the vision inspection, the brightness of the light is adjusted during the top inspection and the side inspection, and the shading line with high contrast is formed through the recessed line formed to form a clear contrast with high contrast on the upper surface of the suction pad. It can increase.

Figure 7 shows another embodiment of a drying apparatus 300 according to the present invention. Descriptions duplicated with those described with reference to FIGS. 1 through 6 will be omitted.

In the drying apparatus 300 illustrated in FIG. 7, a converging groove 326 is propelled by the air blower along the trajectory in which the plurality of absorption holes 325 are formed and the washing water converges. Unlike the above-described embodiments, the converging groove 326 is formed, and if the absorbing hole 325 is formed inside the converging groove, the water condensed by the air blower can converge to stay in the vicinity of the absorbing hole 325. This may mean that the washing water removal efficiency is improved.

As described above, when the trajectory in which the absorber 325 is formed is zigzag in a direction perpendicular to the conveying direction of the air blower, the converging groove may also be formed in a zigzag shape, and the absorber 325 is zigzag. In addition to the above-described effects that can be obtained in the form of a form, additional effects of minimizing washing water departure can be obtained.

8 shows a plan view of a drying apparatus according to the invention. Specifically, FIG. 8 (a) shows an example of an image captured by the vision unit in a state in which illumination is placed after mounting the semiconductor package on the adsorption pad of the drying apparatus shown in FIG. 2, and FIG. 8 (b) 6 illustrates an image captured by the vision unit in a state in which illumination is placed after mounting a semiconductor package on a suction pad of the drying apparatus illustrated in FIG. 6.

As described above, in order to take advantage of the brightness difference in vision inspection of the semiconductor package adsorbed on the adsorption pad, if bright light is irradiated on the upper surface of the semiconductor package to increase the contrast of the captured image, the side region of the semiconductor package and The periphery becomes dark, so that the semiconductor package portion is bright and the periphery of the semiconductor package is dark.

Specifically, FIG. 8A illustrates that the semiconductor packages sp are disposed in a lattice shape on the suction pad 310, and the recessed line 313 is formed only at the edge of the suction pad. Therefore, when irradiating light to the upper surface of the suction pad during the vision inspection, the first shade (S1) formed by the depression line 313 is formed along the edge of the suction pad, the adsorption that the semiconductor packages are arranged adjacently in a tiled manner A second shade S2 may be formed at the center of the pad by the height and the distance of the semiconductor package.

Therefore, although the reason for the generation of the first shadow S1 and the second shadow S2 is different from each other, the contrast between the shadow and the boundary line of the upper surface of the semiconductor package becomes clear, and thus may be used as a reference point for determining the position of the semiconductor package during vision inspection.

On the other hand, in FIG. 8 (b), since the semiconductor packages are not arranged adjacently but arranged diagonally, shades such as first shades generated by boundary regions between the semiconductor packages as shown in FIG. 8 (a) are formed. Instead, only the second shade S2 due to the recessed line formed on the suction pad 310 may be artificially tiled.

As a result, both of the shades shown in FIGS. 8 (a) and 8 (b) may produce contrast differences sufficient to be used as reference points for position comparison with the upper edge of the semiconductor package during vision inspection, so that the accuracy of vision inspection is correct. Can improve.

Although the present specification has been described with reference to preferred embodiments of the invention, those skilled in the art may variously modify and change the invention without departing from the spirit and scope of the invention as set forth in the claims set forth below. Could be done. Therefore, it should be seen that all modifications included in the technical scope of the present invention are basically included in the scope of the claims of the present invention.

1000: Semiconductor Strip Cutting System
300: drying device
310: adsorption pad
311: suction hole
313: depression line
320: dry block
325: absorber
330 block base

Claims (13)

A semiconductor package cutting system for cutting a semiconductor strip and performing a cutting process into a plurality of individual semiconductor packages, the drying apparatus for removing and drying the washing water remaining in the semiconductor package,
An air blower provided with a plurality of injection nozzles for blowing air in one direction in order to collect the washing water remaining in the semiconductor package in one direction, and transferred in a direction perpendicular to the column direction of the injection nozzle;
A plurality of adsorption holes are formed for adsorbing the plurality of semiconductor packages by pneumatic pressure, respectively, and are made of water-repellent silicone material to propel the washing water remaining in the semiconductor package in the blowing direction of the air blower when blowing by the air blower. Adsorption pads;
The suction pad is seated, a plurality of absorption holes are formed to absorb the residual washing water pushed in the one direction by the air blower, and spaced near the edge of the suction pad in a direction corresponding to the blowing direction of the air blower A drying block having a plurality of adsorption passages communicating with the adsorption port of the adsorption pad and having a plurality of absorption passages communicating with the absorption port; And,
And a block base mounted on the drying block, the block base including an adsorption space communicating with a plurality of the adsorption passages and an absorption space in communication with the absorption port.
And a recessed line is formed on an upper surface of the edge of the suction pad so as to form a shadow during vision inspection of the semiconductor package disposed at the outermost edge of the semiconductor package absorbed by the suction pad. delete delete The method of claim 1,
And a plurality of the absorbers are formed in a zigzag form along a direction parallel to the column direction of the spray nozzle. The method of claim 4, wherein
The washing water remaining in the semiconductor package is absorbed by the plurality of absorbing holes in the process of being transported to the absorbent side through the absorbent pad, and the washing water is received in the absorbing space through an absorbing flow passage communicating with the absorbing hole. Device. The method of claim 1,
And the adsorption space and the absorption space of the block base are connected to a pneumatic line to which a negative pressure can be applied, respectively. The method of claim 1,
The plurality of absorbent openings are composed of two columns, each absorbing opening is formed in a form that is arranged in a different row. The method of claim 1,
And a plurality of absorbing ports are formed at both side portions of the drying block when the air blower ejects air while reciprocating. delete The method of claim 1,
The depression line is a drying device, characterized in that formed along the rim of the suction pad or formed in a tiled manner. The method of claim 1,
A plurality of semiconductor packages are adsorbed on the adsorption pad, and when each of the semiconductor packages is not arranged adjacently, a recessed line is formed around the periphery of the semiconductor package in a tiled manner, so that shadows are formed around the periphery of the semiconductor package. Drying apparatus, characterized in that formed. The method of claim 1,
The adsorption pad is black, and during vision inspection of the semiconductor package adsorbed on the adsorption pad, bright light is irradiated onto the upper surface of the semiconductor package, and the side region of the semiconductor package is imaged in a shaded state. Drying apparatus, characterized in that the inspection is performed through the image of the light and the dark portion of the semiconductor package. A cutting device for cutting the semiconductor strip into a plurality of semiconductor packages;
A cleaning device for cleaning the semiconductor package individualized by the semiconductor cutting device; And,
Claim 1, 4 to 8, and the drying apparatus according to any one of claims 10 to 12 for washing the residual wash water of the semiconductor package washed in the cleaning device; Strip cutting system.
KR1020150129573A 2015-09-14 2015-09-14 Semiconductor Package Drying Apparatus And Semiconductor Strip Cutting System KR102053480B1 (en)

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