200847310 九、發明說明： 【發明所屬之技術領域】 該算有關於—整合地架設了清潔器以移除附著至 ΙΜμ裝置的外表之粉塵或雜質之半導體裝置檢測設 的數目9，染物而被判定為有缺陷的半導體裝置 備之半導體=:::體裝置的一良率’以及使用其設 【先前技術】 + ^ltm^t^(seiniconductor integrated circuit) ί f體J =的一晶片之形式’係透過-系列的封 =處理，成為適於保護晶片免於外部震動之半導體封 二該等封裝製程後’半導體封裝在被供ΐ給 則’取後會接受一電氣功能測試（electri functionality test)。 …已經ϋ過了電氣功能測試的半導體封裝，會被移至標 記設備（marking equipment)，以便於半導體封裝上桿圮各 種資訊（半導體晶片類型、製造商、交易名稱等）。不° 般來S兒，即使是微小的外表缺陷和内部缺陷，都會 嚴重地影響此種半導體封裝的效能。所以，在上述電氣功 能測試外，必須使用影像照相機（vision_camera)對半導體 封裝進行外表檢測。 ^ 至於上述有關一半導體封裝的外表缺陷，特別是球狀 陣列（Ball Grid Arrays，BGAs)與引線（leads)的缺陷，可 能會在將半導體裝置組裝至印刷電路板（Printed Circu^ Board，PCB)的過程中發生。因此，對引線或球狀陣列以及 200847310 標記的檢測變得相當重要。 在韓國公開專利案編號2005-48584,由本發明的申請 人所提出之「半導體裝置檢測設備（Semiconductor device inspecting apparatus)」一案中揭示了用以檢測一半導體 封裝的外觀之傳統設備。 所揭不的傳統半導體裝置檢測設備如第九圖所示，包 括：一主體100，一用以載入承載要被檢測的半導體裝置 的托盤之載入器（loader)210, 一用以檢測半導體裝置之檢 測裝置（inspecting device)300 ; —緩衝器（buffer)220， 用以暫時地儲存一承載被檢測的半導體裝置之緩衝托盤； 載入承載了根據檢測結果被挑選為有缺陷的半導體裝置之 托盤之第一至第三廢品載體（reject carrier)230、240、 及250，被承載於個別廢品載體的托盤之有缺陷的半導體 裝置會根據缺陷類型而被挑選；一卸載器 (un-loader)260，用以載入承載了根據檢測結果被挑選為 立* ¥的早♦體裝1之托盤，複數條托盤傳送帶480係分別 連接至載入器210、緩衝器220、第一至第三廢品載體230、 240、與250，以及卸載器260，用以讓托盤在主體1〇〇的 向前與向後方向移動；安裝在主體1〇〇上端的傳送裝置5〇〇 可以水平往返地移動，以傳送介於載入器21〇、緩衝器 220、第一至第三廢品載體230、240、與250，以及卸載器 260的托盤傳送帶480之托盤；以及一被安裝用以在載入 器210、緩衝器220、第一至第三廢品載體230、240、與 250’以及卸載器260的托盤傳送帶480之間往返地移動之 挑選裝置600，該挑選裴置6〇〇係用來拾起被承載於托盤 上之有缺陷的半導體裝置，以傳送至卸載器260，並根據 8 200847310 、240、與250的任何一個，拍 ^ ==衝托盤的正常的半導體裝置，二 V體：真滿要被傳送至卸載器26〇的托盤之空的： k >則裝置300包括第一盘第—旦 31〇、320、，用以執行-影像檢測。第一 用來檢測被狀至載人^ 21G之減所承制、係 :ίί:Γ】ίΓ f『像__系用來檢測個: 傳統的檢測設備更包括一反轉裝置们二:二述 deV1Ce)700，其係介於第一影像照相機31〇與第二旦 相機320之間，用以顛倒翻轉承載半導體裝置的托盤。…、 口在第九圖之中，參考標號420代表空的拕盤，:考標 號410代表載入堆疊器（i〇ading stacker)，參考標號々π 代表設置空的托盤之饋線（feeder)，而參考標號43〇、 440、450、與460代表分別設置在第一、第二、與第三廢 品載體230、240、與250以及卸載器260的饋線。同樣地， 參考標號610代表一挑選器，用以挑選半導體裝置。 根據上述組態配置，當載入器210供應托盤，而托盤 沿著載入器210的托盤傳送帶480傳送時，被承載於托盤 上的個別半導體裝置的一個表面會透過第一影像照相機 310進行影像檢視，當完成影像檢視後，半導體裝置會被 反轉裝置7 0 0颠倒翻轉。 在此，反轉裝置700必須具有一個空的托盤，用以讓 被承載於載入器托盤上的半導體裝置在被顛倒翻轉時，能 200847310 夠重新被承载於空的托盤上，使得個別半導體裝置的另一 個表面會曝露出來。 承載被翻轉的半導體裝置之托盤會被傳送裝置500傳 送至在第二影像照相機320的一檢視區域内之托盤傳送帶 480的任何一個，傳送裝置5⑽會往返地在托盤傳送帶48〇 之間傳送托盤。在被顛倒翻轉後傳送至檢視區域的半導體 裝置，會接受第二影像照相機32〇的一影像檢測。 :、、〈、而’上述傳統的半導體裝置檢測設備有個問題是， 在傳送半導體裝置的過程中，粉塵可能會附著至半導體裝 外表。特別是，在引線類型的半導體裝置上，特定二 雜質像是錯，可能會留存在半導體裝置的外表。 一留存有粉塵或雜質之半導體裝置，儘管可能是正常的 半導體裝置，仍有極大的可能會因為影像㈣目機 产 測結果而被判定是有缺陷的。因此，會有檢測正確产^ 與低良率的問題。 又争低 =解決上述問題’傳統上是以人工方式吹氣 ^有缺陷的半導職置之上，或—個接—個地用」 以移除粉塵或雜質等等，接著執行—影像檢剛。‘ 、，工的清潔操作’大幅增加了檢測時間、造成產量 — 亚且因為多出的人工成本而提高了產品價格。 牛， 【發明内容】 因此，本發明是以上述問題作為出發 =的是提供-料導料置檢摩感，料有 =aireleaner)被提供於—影像照相機的最前端，二 自=移除留存在半導體裝置的外表上像是粉 ^物’藉此預防正常的半導料置會因為污染物而被= 10 200847310 誤地判定是有缺陷的，從而提升良率與檢測正確度，同時 並提供使用其之半導體装置檢測方法。 . 本發明的另—個目的是提供—種铸體裝置檢測設 備，其中刷子清潔器係於一承載有缺陷的半導體裝置的廢 品托盤被退回進行重新檢測時操作，在對半導體參置進行 影像檢測前，自動地移除留存在半導體裝置的外表上像是 粉塵或雜質等污染物’藉此預防正常的半導體裝置會因為 微小的表面缺陷而被錯誤地判定是有缺陷的，同時^提供 ，使用其之半導體裝置檢測方法。 ’、 根據本發明的一個型態，上述與其他目的可經由提供 一半導體裝置檢測設備來達成，其中被承載於一托^(tray) 上之半導體裝置之外表，會經由一影像檢測裝置（visi〇n inspecting device)拍攝，以根據被拍攝到的影像的分析 結果來挑選該等半導體裝置，區分為有缺陷的半導體裝置 (defective semiconductor device)與正常的半導體裝置 Cnurmal semi⑶nductordevice)，該等有缺陷的半導體裝 置會根據缺陷類型被挑選與傳送至複數個廢品載體 (reject carrier)，而該等正常的半導體裝置會被傳送至 一卸載為（un-loader) ’其中該半導體裝置檢測設備包括空 氣清潔器，以於利用該影像檢測裝置執行一影像檢測前， 自動地移除留在該等半導體裝置的外表之污染物。 該影像檢測裝置包括一第一影像照相機與一第二影 像照相機，以及該等空氣清潔器係分別被提供於該第一影 像照相機與該第二影像照相機的最前端。 每一該空氣清潔器可包括：一殼體，該殼體之一下表 面形成有一開口，而該殼體之一上表面形成有複數個孔 11 200847310 洞；複數根分別被安裝進該等孔洞之真空吸管（vacuum suction tube);以及一水平地置入該殼體的該下端開口之 排氣管（air discharge tube)，該排氣管於其下表面形成 有複數個以一預先決定的角度傾斜地形成之排氣孔。 較佳地，殼體具有一圓頂形狀，以確保順利地透過真 空吸管吸引雜質與粉塵。 一離子供應裝置（ion supply device)可被連接至該 排氣管，以供應離子來預防靜電荷，而該空氣清潔器更可 包括一流罝调整閥（f l〇w—rate ad just ing valve)與一壓力 調整閥，以根據半導體裝置的類型，自動地調整供應仏 排氣管的空氣之該流量與壓力。 ^ 每一該空氣清潔器更可包括一感測器，用以感測該等 半導體裝置是否已被正常地承載於該托盤上。 、 該半導體裝置檢測設備更可包含··一刷子清潔器，以 於利用該影像檢測裝置執行-f彡像檢測前，自動地移除 在該等半導體裝置的外表之污染物。 μ 該刷子清潔H在-被裝餘—_的廢品載體之托 盤被退回作4新檢測時，會進行操作，而制子清潔哭可 包括：-練餘料整合_彡奴射模組；—架^ 該刷子模組的Γ後端之殼體，—體之—下表面形成^ ，二^外ί之—上表面形成有複數個孔洞；複數根分 別被女衣進該纽社衫料；以及―水平 體的=端開=排氣管’用叫受供應至該排氣管 Γ 表面形成有複數_—減決定的角 度傾斜地形成之排氣孔。 又]月 較佳地，該刷子清潔器 可更包括 一被提供於該殼體的 12 200847310 該:端開Π之遮罩構件（shleld_ber)，該遮罩構件並被 配置用以降低一吸氣空間以增加-真空吸力。 爲Γ供應裳置更可連接至該刷子清潔器之該排氣 二J離子來預防靜電荷。該刷子清潔器更包括-張 力调U ’以與該等半導體聚置維持-適當的張力。 於、則=本，Γ的另—型態’本發明提供—種半導體裝置 ^測方法，包含將一承載了半導 置的第-表面朝上之托般從一# 于子千¥體衣 一馬傻於、目丨丨卩Θ 派 载入器（loader)傳送至一第 &像k測&域；對該等半導體裝置 一第一影像檢測；以及根攄兮笛 = 、執仃 等半導T康 影像檢測的結果，將該 裝置，其中該半導體袭置檢測方與2的半導體 送至該第-影像檢測區域前 .在將該托盤傳 半導體裝置執行一空氣清潔操作破承载於該托盤上的該等 該半導體裝置檢測方法可更 檢測之後，與根據該第—影像檢^在執行該第一影像 置挑選為有缺陷的半導體裝置與正^㈣該等半導體裝 將承載於該托盤的該等半導體#吊9半導體裝置之前， 導體裝置的第二表面朝上翻轉，使得該等半 表面執行-空氣清潔操作；將該承ν體裝置的該等第二 操作之該等半導體I置之托盤載已經通過了S氣清潔 域；以及對該等被^载於被傳至;'第二影像檢測區 該托盤之半導體裝置的該等第_ 弟一影像檢測區域的 測。 —表面執行一第二影像檢 該半導體裝置檢測方法可更包人·_ ^ 為有缺陷的半導體裝置之托盤退將一承载了被挑選 至该载入器，並對被承 13 200847310 回托盤之該等半導體裝置的該等第二表面執行 蔞辦壯=糸才呆作；將承載了通過該刷子清潔操作的該等半 【，置之該托盤顛倒翻轉’使得該等半導體裝置的^ 刷子清·’對該等半導體裝置的該等第一表面執行一 的1=、^，以及在將承載了已經通過該刷子清潔操作 _斜㈣裝置之該托賴人至該載人 外的影像檢測。 敬頟 【實施方式】 、下將^考附屬圖表样細說明本發明的實施例，以俾 熟悉倾藝者能夠輕易地理解與重製本發明。 弟一圖為根據本發明的一第一實施例所示之一半導 的透視圖。第二圖為第—圖的部分透視 圖弟一圖為弟二圖的平面圖。 抑供麥ir、—圖至第三圖，本發贿供—半導體裝置檢測 :半。壯載人器L所供應的載入器托盤 的外表’會被—影像檢測裝置1拍攝，以根 :本墓驊::影像的分析結果，將半導體裝置挑選為有缺陷 衣置與正常的半導體裝置，有缺陷的半導體裝置 S根據缺陷類型被挑選與傳送至複數個廢品載體（reject rrrf而料正常的半導體裝置會被傳送至一卸載器 田x料導體裝置檢測設備更包括钱m 3，以 =用影像檢測褒置i執行影像檢測前，自動地以空氣移 除^在半導體裝置的外表之污染物。 H •在圖中’茶考標號「2」代表一挑選裝置（sorting ΓΓ Λ以挑選半導體裝置’而參考標號％代表空 i。半導體裝置檢測設備的所有構成元件，除了空氣 14 200847310 清潔器3外，都與先前敘述的前案相同，因此相同構成元 件與其操作將略而不提。 影像檢測裝置1包括一第一影像照相機11，用以檢視 被承載於載入器托盤上的個別半導體裝置的一個表面，而 一第二影像照相機12用以檢視該半導體裝置的另一表 面。空氣清潔器3係分別位於第一與第二影像照相機11、 12的最前端。 被承載於由載入器L傳送來的托盤上的半導體裝置， 它們的下表面是朝上的，當它們通過第一影像照相機11 的最前端所提供的空氣清潔器3時，會於接受第一影像照 相機11的影像檢測前被清潔。 接著，半導體裝置會被反轉裝置（圖中未顯示）顛倒 翻轉，使得半導體裝置的上表面是朝上的。當承載半導體 裝置的托盤通過第二影像照相機12的最前端之空氣清潔 器3時，半導體裝置在接受第二影像照相機12的影像檢測 前被清潔。 如前述，藉由在影像檢測前吸引與移除像是雜質或粉 塵一類的污染物，本發明可預防正常的半導體裝置因為污 染物，而根據影像檢測的結果被錯誤地判定為有缺陷的。 第四圖為根據本發明的一示範實施例所示之一空氣 清潔器的前方透視圖，而第五圖為第四圖之底視圖。空氣 清潔器3包括一殼體31、複數根真空吸管（vacuum suction tube)32、一排氣管33、以及一供氣管（air supply tube)34 〇 殼體31係於其下表面形成有一開口，而殼體之一上 表面形成有複數個孔洞311。較佳地，殼體31具有一圓頂 15 200847310 t引以便讓空氣中所含的雜質與粉塵被真空吸管32順利 而不會累積在殼體31的角落。 31的孔洞空氣的真空吸官32係被分別安裝於殼體 吸管32倍/果只用一根真空吸管32，或者是複數根真空 的％質血if集在殼體31的一特別區域内，被吸引空氣内 合々八^ —塵可能會累積在殼體31的該特別區域内，而不200847310 IX. Description of the invention: [Technical field to which the invention pertains] The calculation is based on the number of detection devices of a semiconductor device in which a cleaner is erected to remove dust or impurities attached to the surface of the ΙΜμ device, and the dye is judged. A yield of a semiconductor =::: body device for a defective semiconductor device and a form of a wafer using its design [previous technique] + ^ltm^t^(seiniconductor integrated circuit) Through the series-sealing = processing, it becomes a semiconductor package suitable for protecting the wafer from external vibration. After the packaging process, the semiconductor package is subjected to an electr functional test. . ...the semiconductor package that has passed the electrical functional test will be moved to marking equipment to facilitate the information on the semiconductor package (semiconductor die type, manufacturer, trade name, etc.). Even if it is a small appearance defect and internal defects, it will seriously affect the performance of this semiconductor package. Therefore, in addition to the above electrical function test, the semiconductor package must be externally detected using a vision camera (vision_camera). ^ As for the above-mentioned defects in semiconductor packages, especially the defects of Ball Grid Arrays (BGAs) and leads, it is possible to assemble semiconductor devices to printed circuit boards (PCBs). The process takes place. Therefore, the detection of lead or ball arrays and the 200847310 mark becomes quite important. A conventional apparatus for detecting the appearance of a semiconductor package is disclosed in the Korean Patent Publication No. 2005-48584, the "Semiconductor device inspecting apparatus" proposed by the applicant of the present invention. The conventional semiconductor device detecting device disclosed in FIG. 9 includes: a main body 100, a loader 210 for loading a tray carrying a semiconductor device to be detected, and a semiconductor for detecting semiconductors. An inspecting device 300; a buffer 220 for temporarily storing a buffer tray carrying the detected semiconductor device; loading the semiconductor device selected to be defective according to the detection result The first to third reject carriers 230, 240, and 250 of the tray, the defective semiconductor device carried by the tray of the individual waste carrier is selected according to the type of defect; an unloader 260, for loading a tray carrying the early body pack 1 selected according to the detection result, the plurality of tray conveyor belts 480 are respectively connected to the loader 210, the buffer 220, and the first to third waste products. Carriers 230, 240, and 250, and an unloader 260 for moving the tray in the forward and backward directions of the main body 1; the conveying device 5 mounted on the upper end of the main body 1 can Horizontally moving to transfer the trays of the tray conveyor 480 between the loader 21〇, the buffer 220, the first to third waste carriers 230, 240, and 250, and the unloader 260; and one is installed to A sorting device 600 that moves back and forth between the loader 210, the buffer 220, the first to third waste carriers 230, 240, and the tray conveyor 480 of the unloader 260, the picking device 6 Used to pick up a defective semiconductor device carried on a tray for transfer to the unloader 260, and according to any of 8 200847310, 240, and 250, ^== normal semiconductor device for punching the tray, two V Body: The space that is to be delivered to the unloader 26〇: k > then the device 300 includes the first disk 31st, 320, for performing image detection. The first is used to detect the quilt to the manned ^ 21G minus the system, the system: ίί: Γ Γ Γ 『 『 『 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The deV1Ce) 700 is interposed between the first image camera 31A and the second camera 320 to invert the tray carrying the semiconductor device. ..., the mouth is in the ninth figure, reference numeral 420 represents an empty disk, the reference numeral 410 represents a load stacker (i〇ading stacker), and the reference numeral 々π represents a feeder for setting an empty tray, Reference numerals 43A, 440, 450, and 460 denote feed lines respectively disposed at the first, second, and third waste carriers 230, 240, and 250, and the unloader 260. Similarly, reference numeral 610 represents a picker for picking up a semiconductor device. According to the above configuration configuration, when the loader 210 supplies the tray and the tray is transported along the tray transport belt 480 of the loader 210, one surface of the individual semiconductor device carried on the tray transmits the image through the first image camera 310. When the image inspection is completed, the semiconductor device is reversed by the inverting device 700. Here, the inverting device 700 must have an empty tray for the semiconductor device carried on the loader tray to be reloaded on the empty tray when the semiconductor device is turned upside down, so that the individual semiconductor devices are The other surface will be exposed. The tray carrying the flipped semiconductor device is transferred by the transport device 500 to any of the tray transport belts 480 in a viewing area of the second image camera 320, and the transport device 5 (10) transports the trays between the tray transport belts 48A in a round-trip manner. The semiconductor device that is transferred to the viewing area after being turned upside down will receive an image detection by the second image camera 32. A problem with the above-described conventional semiconductor device detecting apparatus is that dust may adhere to the semiconductor package during the transfer of the semiconductor device. In particular, in a lead type semiconductor device, the specific two impurity images are wrong and may remain in the appearance of the semiconductor device. A semiconductor device in which dust or impurities are left, although it may be a normal semiconductor device, is highly likely to be judged to be defective due to the image (four) machine production result. Therefore, there will be problems in detecting correct production and low yield. Competing for low = solving the above problem 'traditionally by artificially blowing air ^ defective semi-conducting position, or - one by one to use" to remove dust or impurities, etc., then perform - image inspection just. ‘,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,牛牛, [Summary of the Invention] Therefore, the present invention is based on the above problems = the supply of material guides to detect the friction, the material has = aireleaner) is provided at the forefront of the image camera, two self = remove retention In the appearance of the semiconductor device, it is like a powder', thereby preventing the normal semiconductor material from being trapped due to contaminants. It is determined that the defect is defective, thereby improving the yield and the accuracy of the detection, and providing A semiconductor device detection method using the same. Another object of the present invention is to provide a casting apparatus detecting apparatus in which a brush cleaner is operated when a waste tray carrying a defective semiconductor device is returned for re-detection, and image detection is performed on the semiconductor component. Before, the contaminants such as dust or impurities remaining on the surface of the semiconductor device are automatically removed, thereby preventing the normal semiconductor device from being erroneously determined to be defective due to minute surface defects, and simultaneously providing and using A semiconductor device detection method thereof. According to one aspect of the present invention, the above and other objects are achieved by providing a semiconductor device detecting device, wherein a semiconductor device mounted on a tray is passed through an image detecting device (visi) Inn inspecting device) to select the semiconductor device according to the analysis result of the captured image, and distinguish it into a defective semiconductor device and a normal semiconductor device Cnurmal semi(3)nductor device, such defective The semiconductor device is selected and transferred to a plurality of reject carriers according to the type of defect, and the normal semiconductor devices are transferred to an un-loader 'where the semiconductor device detecting device includes an air cleaner In order to automatically remove the contaminants remaining on the surface of the semiconductor devices before performing image detection by the image detecting device. The image detecting device includes a first image camera and a second image camera, and the air cleaners are respectively provided at the forefronts of the first image camera and the second image camera. Each of the air cleaners may include: a casing having an opening formed on a lower surface thereof, and one of the upper surfaces of the casing is formed with a plurality of holes 11 200847310 holes; the plurality of roots are respectively installed into the holes a vacuum suction tube; and an air discharge tube horizontally inserted into the lower end of the housing, the exhaust tube being formed on the lower surface thereof at a plurality of angles inclined at a predetermined angle The vent hole is formed. Preferably, the housing has a dome shape to ensure smooth passage of impurities and dust through the vacuum pipette. An ion supply device may be connected to the exhaust pipe to supply ions to prevent static charge, and the air cleaner may further include a first-order just adjust valve (fl〇w-rate ad just ing valve) A pressure regulating valve automatically adjusts the flow rate and pressure of the air supplied to the exhaust pipe according to the type of the semiconductor device. ^ Each of the air cleaners further includes a sensor for sensing whether the semiconductor devices have been normally carried on the tray. The semiconductor device detecting device may further comprise a brush cleaner for automatically removing contaminants on the surface of the semiconductor devices before the image detecting device performs the -f image detection. μ The brush cleaning H will be operated when the tray of the waste carrier of the -refilled__ is returned for 4 new tests, and the cleaning of the machine can include: - integration of the remaining material _ 彡 slave module; The frame of the rear end of the brush module, the body-lower surface is formed with ^, and the upper surface of the body is formed with a plurality of holes; the plurality of roots are respectively fed into the New Jersey fabric by the women's clothing; And the "horizontal body = end opening = exhaust pipe" is a vent hole formed obliquely formed at an angle which is supplied to the surface of the exhaust pipe 形成 with a plurality of _-decreases. Further, preferably, the brush cleaner may further include a spring cover 12 200847310 provided with an open-ended mask member (shleld_ber) configured to reduce an inhalation Space to increase - vacuum suction. For the Γ supply, the venting can be connected to the venting of the brush cleaner to prevent static charge. The brush cleaner further includes a tension adjustment U' to maintain the appropriate tension with the semiconductors. The present invention provides a method for measuring a semiconductor device, comprising: placing a semi-conducting first-surface facing up from a #子子¥衣衣A stupid, witnessed loader is transferred to a & k-measure &field; a first image detection of the semiconductor device; and root flute =, stubborn As a result of the semi-conducting T-Kang image detection, the apparatus is configured to send the semiconductor-detecting side and the semiconductor of the second to the first image detecting area. The tray-transferring semiconductor device performs an air cleaning operation on the device. After the semiconductor device detecting method on the tray is further detected, and the semiconductor device selected to be defective according to the first image is selected to be defective, the semiconductor device will be carried on the semiconductor device. Prior to the semiconductor devices of the tray, the second surface of the conductor device is turned upside down such that the half surfaces perform an air cleaning operation; the semiconductors of the second operation of the semiconductor device The tray has passed The S gas cleaning domain; and the measurement of the first image-detection area of the semiconductor device that is carried to the semiconductor device of the second image detection area. - Performing a second image inspection on the surface The semiconductor device detecting method can be more inclusive. _ ^ For the defective semiconductor device, the tray is retracted and the carrier is selected to the loader, and the carrier is returned to the tray. The second surfaces of the semiconductor devices perform the operation; the semiconductors carrying the cleaning operation by the brush are turned over, and the wafers are turned upside down so that the semiconductor devices are cleaned 'The first surface of the semiconductor device performs 1 =, ^, and image detection of the Torah carrying the device that has passed the brush cleaning operation _ oblique (4) to the person.頟 [Embodiment] The embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily understand and reproduce the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a semi-conductor according to a first embodiment of the present invention. The second picture is a partial perspective of the first figure. The picture of the younger brother is a plan view of the second figure. For the supply of wheat ir, - to the third picture, this bribe - semiconductor device testing: half. The appearance of the loader tray supplied by the Z-loader L will be taken by the image detecting device 1, and the root: the tomb:: the analysis result of the image, the semiconductor device is selected as a defective device and a normal semiconductor The device, the defective semiconductor device S is selected and transmitted to a plurality of waste carriers according to the defect type (the semiconductor device is normally transferred to an unloader field, the material conductor device detecting device further includes money m 3 to = Before the image detection is performed by the image detection device i, the contaminants on the surface of the semiconductor device are automatically removed by air. H • In the figure, the tea test label "2" represents a sorting device (sorting ΓΓ Λ to select The semiconductor device 'and the reference numeral % represent the space i. All the constituent elements of the semiconductor device detecting device, except for the air 14 200847310 cleaner 3, are the same as the previously described prior case, and therefore the same constituent elements and their operation will not be mentioned. The image detecting device 1 includes a first image camera 11 for viewing a surface of an individual semiconductor device carried on a loader tray, and The second image camera 12 is used to view the other surface of the semiconductor device. The air cleaners 3 are respectively located at the foremost ends of the first and second image cameras 11, 12. They are carried on the tray conveyed by the loader L. The semiconductor devices have their lower surfaces facing upward, and when they pass through the air cleaner 3 provided at the foremost end of the first image camera 11, they are cleaned before being subjected to image detection by the first image camera 11. Next, The semiconductor device is turned upside down by the inverting device (not shown) such that the upper surface of the semiconductor device is upward. When the tray carrying the semiconductor device passes through the air cleaner 3 at the forefront of the second image camera 12, the semiconductor The device is cleaned before receiving image detection by the second image camera 12. As described above, the present invention can prevent normal semiconductor devices from being contaminated by contaminants by attracting and removing contaminants such as impurities or dust before image detection. The result of the image detection is erroneously determined to be defective. The fourth figure is one of the exemplary embodiments according to the present invention. The front view of the air cleaner, and the fifth view is the bottom view of the fourth figure. The air cleaner 3 includes a casing 31, a plurality of vacuum suction tubes 32, an exhaust pipe 33, and a supply The air supply tube 34 has an opening formed on the lower surface thereof, and an upper surface of the housing is formed with a plurality of holes 311. Preferably, the housing 31 has a dome 15 200847310 t The impurities and dust contained in the air are smoothly passed by the vacuum suction pipe 32 without accumulating in the corner of the casing 31. The vacuum suction 32 of the hole air of the 31 is separately attached to the casing suction pipe 32 times/fruit with only one vacuum The straw 32, or the % of the plurality of vacuums, is concentrated in a special area of the casing 31, and the air is attracted to the air, and may accumulate in the special area of the casing 31 without
^空吸31。純免此問題發生，較佳為該複數根 ^ 2係均勻地分佈於殼體31内，而非聚集在殼體 Μ的一特別區域内。 、1氣官33係水平地置入殼體31的下端開口。排氣管 33下表面形成有複數個排氣孔331，使得排氣孔331 以一預先決定的角度傾斜地形成。供氣管34係透過一形成 e &的一端之空氣埠332連接至排氣管33，以供 應空氣至排氣管33。 立七、應至排氣管33的空氣會透過排氣孔331被排放至 外:j移除附著於半導體裝置的雜質與粉塵等污染物。 真空吸官32係、用來透過真空吸力吸引被移除的污染物。 較j土地供氣管34係與一離子供應管（i〇n supply tube)35連接’而後者連接至一離子供應裝置（圖中未顯 示）以t、應、肖隹子來預防污染物的靜電吸附（electr〇static adsorption)。 一般來說’半導體裝置的表面會因為靜電吸附的粉塵 或雜貝而被污染，而用空氣很難將靜電吸附的粉塵或雜質 移除。 16 200847310 為此，在本發明中，較佳為將半導體裝置的靜電表面 透過離子供應管3 5所供應的離子加以中和，以便達到輕鬆 移除吸附至半導體裝置的粉塵或雜質的目的。 儘管未顯示於圖中，空氣清潔器3較佳地更包括一流 量調整閥（flow—rate adjusting valve)與一壓力調整閥 (pressure adjusting valve)，以根據半導體裝置的類型， 自動地調整供應給該排氣管的空氣之流量與壓力。流量調 整閥與壓力調整閥係連接至一個人電腦，以便進行流量調 整閥與壓力調整閥的自動遠端控制。 舉例來說，一般上要被檢測的物件，也就是個別的半 導體裝置，具有不同類型的元件，像是球狀引線或引線。 所以，如果在所有的情況下都應用同一氣壓，可能會損壞 架設於半導體裝置上的元件。因此，較佳為調整流^盥^ 氣壓力。 ' 一空氣清潔器3更包括一感测器36,用以感測半導體裝 置是否已被正常地承載於托盤上。 根據上述有關本發明的第—實施例，藉由使用位於影 像照相機的最前端之空氣清潔器以自祕移除像是粉^ 雜質等留在半導體裝置絲的污染物，本發明具有可預防 裝置因為污染物被錯誤地判定為有缺陷的半 導社置之錢，並因此劇更好的ι率與檢測正確度。 第六圖為根據本發明的-第二實施例所示之 的透視圖。以下對於與第-圖相同的構成元:將 參考第六圖，根據本發明的第二實施例 檢測設備更包括-刷子清_ 4，以於利㈣像檢測=) 200847310 執行一影像檢測前，自動地移除像是粉塵或雜質等留在半 導體裝置外表的污染物（見第一圖）。 較佳地，刷子清潔器4在一被裝載至廢品載體R之托 盤被退回作重新檢測時，會進行操作。 更特別地’ 一旦根據影像檢測的結果被判定為有缺陷 的半導體裝置被承載於廢品載體R的托盤上，該廢品托盤 會被退回以便重新檢測。在此情形下，在執行重新檢測前， 半導體裝置的上表面會先利用刷子清潔器4加以清潔。接 著，再利用反轉裝置（圖中未顯示）將半導體裝置顛倒翻 轉。 藉由反轉裝置（圖中未顯示）的操作，承載於托盤上 的半導體裝置的下表面是朝上的。一旦利用刷子清潔器4 將半導體裝置加以清潔後，托盤會被載入至載入器L，並 接受重新檢測。 較佳地，刷子清潔器4為防靜電刷，以預防和半導體 裝置接觸時產生靜電荷。 第七圖為第六圖中所示之一刷子清潔器的實施例之 前方透視圖，而第八圖為第六圖所示之刷子清潔器的後方 透視圖。刷子清潔器4包括一刷子模組41、一外蓋42、複 數根真空吸管43、以及一排氣管44。 刷子模組41係與複數根刷子411整合地形成。一對 張力調整器（tension adjustor)45係柄接至刷子模組41 的兩端。每一張力調整器45係置於一引導構件（guide member)46 内。 儘管上述的實施例是利用刷子411，藉由刷子411的 18 200847310 滑動來清潔半導體裝置的表面，應可了解的是，本發明的 另一實施例可採用旋轉刷子，利用一馬達的運作來旋轉。 同樣地，儘管在圖中未顯示，不過張力調整器45較 佳地可納入一張力構件（tension member)，像是彈簧於其 中，以於刷子模組以及半導體裝置之間維持適當的預負載。 當半導體裝置被承載於托盤中而被傳送時，它們可根 據半導體裝置的類型而具有不同的高度。所以，在無法調 整刷子模組41與半導體裝置的表面之間的預負載的情形 下，刷子411會被放置得過度接觸半導體裝置，造成半導 體裝置表面的刮痕，或者是造成像是BGAs脫離或引線損 壞。相反地，如果刷子411沒有跟半導體裝置近距離接觸， 會造成無法充分清潔半導體裝置。 因此’較佳為根據要被檢測的物件，也就是半導體封 裝’來選擇適當的張力調整器45。 夕較佳地，張力調整器45係藉由一滚筒（cyUnder)垂 直移動，而滾筒是因應由一個人電腦根據半導體裝置的類 ，所發出的控制訊號而移動，從而調整刷子模組^丨的^' 外蓋42係架設於刷子模組41的後端，外罢42之一 成有—開口，而外蓋42之一上表面形二複_ =々t旻數根用以吸引空氣之真空吸f 43係分別被安 衣進外盍42的孔洞421。 44係水平地置人外蓋42的下端開口，排氣管 孔1 形成有複數個排氣孔44卜使得複數個排氣 id—縣決定的歧傾斜地形成。如果空氣係透^ 礼吕44 一端的空氣琿442被送至排氣管料，則空氣可 19 200847310 透過排氣孔441被排放至外部。 ，佳地，空氣埠442係連接一提供離子之離子供鮮 置（圖中未齡）’用㈣免與半導财置靜電接觸。、 ㈣壯般來說，半導體裝置的表面在經由刷子清潔後，半 化的ί置的電子特性有可能會因為與刷子靜電接觸而有劣 此外’刷子清潔器與空氣清潔器會因為粉塵和 、、騎電吸附而附著至半導體裝置，無法㈣地移除。 ，此，在本發明中，較佳為離子供應裝置（圖中未 二刷子清潔㈣中提供離子，用以避免刷子與半導體 ^主間的靜電接觸，以達到較佳的電子可靠度，同時^ 至電表面，用以讓因為靜電吸附而附著 至牛V體1置之粉塵和雜質可被輕易地移除。 αΠΐ潔^ 4更包括—被提供於外蓋42的下端開口 之遮罩構件47。 遮罩構件47佔用了外蓋42的下端開口，以及更 料低排氣管44周_多餘空間。縮減空間具有 二V二吸官43的真空吸力的功效。因此，可確保遮罩構 率的則丨與移除制刷子411進行清潔操作時 所產生的雜質或粉塵。 卞π吋 根據上述有關本發明的第二實施例，於再一次 體裝置執行-影像檢測前，使用所提供的刷子哭白 ，地移除留存在半導體裝置的外表上的粉塵或雜質了使尸 本發明具有避免正常的轉财置因為為小的表面^ 被錯誤地判定為有缺陷的半導體裝置之功效。 、曰 接下來，將根據本發明，簡要地描述使用上述半導體 20 200847310 裝置檢測設備所進行之一半導體裝置檢測方法。 首先，將一承載了半導體裝置使得該等半導體裝置的 第一表面朝上之托盤，載入至載入器L。 接著，載入器L所負載的托盤會依序地被傳送至一影 像檢測區域。在此情形下，在將托盤傳送至一第一影像檢 測區域前，半導體裝置的第一表面會接受一清潔操作。 在利用第一影像照相機11對被承載於托盤上的半導 體裝置的第一表面執行一影像檢測後，托盤會被反轉裝置 (圖中未顯示）顛倒翻轉，使得半導體裝置的第二表面朝 上。 接著，承載了第二表面朝上的半導體裝置之托盤，會 被傳送至一第二影像檢測區域。在此情形下，在被傳送至 第二影像檢測區域前，半導體裝置的第二表面會以空氣清 潔器3進行一清潔操作。 在利用第二影像照相機12執行一影像檢測後，根據 影像檢測的結果，半導體裝置會被挑選為要被傳送至卸載 器U之正常的半導體裝置，以及要被傳送至廢品載體R之 有缺陷的半導體裝置。 同時，當承載於廢品載體R的廢品托盤上之有缺陷的 半導體裝置會被退回載入器，以便接受一影像檢測。 更特別地，當承載了第二表面朝上的半導體裝置之廢 品托盤被傳送至載入器時，半導體裝置的第二表面會被刷 子清潔器4加以清潔。 在此情形下’根據被判定為有缺陷的半導體裝置的缺 陷類型，廢品載體R可被分類為不同的廢品區域（reject 21 200847310 之 半導體裝置 口 P城P9 n 士〜田/、頁表面缺^的半導體裝置被承載於廢 σ口區域R2日守，刷子清潔器4係安裝於自廢品區域四延伸 出來的托盤傳送帶上，而承載於廢品區域R2上的廢品托盤 會被退回以準備進行刷子清潔操作。^ Empty suction 31. Purely avoiding this problem, it is preferable that the plurality of roots 2 are uniformly distributed in the casing 31 instead of being concentrated in a special region of the casing. The first air member 33 is horizontally placed in the lower end opening of the casing 31. A plurality of exhaust holes 331 are formed in the lower surface of the exhaust pipe 33 such that the exhaust holes 331 are formed obliquely at a predetermined angle. The air supply pipe 34 is connected to the exhaust pipe 33 through an air dam 332 forming one end of the e & to supply air to the exhaust pipe 33. The air to the exhaust pipe 33 is discharged to the outside through the exhaust hole 331: j removes impurities such as impurities and dust attached to the semiconductor device. The vacuum suction 32 series is used to attract the removed contaminants through vacuum suction. The j-ground gas supply pipe 34 is connected to an ion supply pipe 35 and the latter is connected to an ion supply device (not shown) to prevent static electricity of pollutants by using t, s, and scorpion. Adsorption (electr〇static adsorption). In general, the surface of a semiconductor device is contaminated by electrostatically adsorbed dust or scallops, and it is difficult to remove electrostatically adsorbed dust or impurities by air. 16 200847310 For this reason, in the present invention, it is preferable to neutralize the electrostatic surface of the semiconductor device through the ions supplied from the ion supply tube 35 in order to easily remove dust or impurities adsorbed to the semiconductor device. Although not shown in the drawings, the air cleaner 3 preferably further includes a flow-rate adjusting valve and a pressure adjusting valve to automatically adjust the supply to the type of the semiconductor device. The flow and pressure of the air in the exhaust pipe. The flow regulating valve and the pressure regulating valve are connected to a personal computer for automatic remote control of the flow regulating valve and the pressure regulating valve. For example, objects that are typically to be detected, that is, individual semiconductor devices, have different types of components, such as ball leads or leads. Therefore, if the same air pressure is applied in all cases, the components mounted on the semiconductor device may be damaged. Therefore, it is preferable to adjust the flow pressure of the flow. An air cleaner 3 further includes a sensor 36 for sensing whether the semiconductor device has been normally carried on the tray. According to the above-described first embodiment relating to the present invention, the present invention has a preventable device by using an air cleaner located at the forefront of the image camera to remove contaminants such as powders and impurities remaining on the semiconductor device wires. Because the contaminants are mistakenly determined to be defective by the semi-conducting agency, and therefore the better rate and detection accuracy. Fig. 6 is a perspective view showing a second embodiment according to the present invention. The following constituent elements are the same as those of the first figure: referring to the sixth figure, the detecting apparatus according to the second embodiment of the present invention further includes a brush clearing_4 for the purpose of performing image detection before (4) image detection =) 200847310 Contaminants such as dust or impurities that remain on the surface of the semiconductor device are automatically removed (see the first figure). Preferably, the brush cleaner 4 operates when a tray loaded to the reject carrier R is returned for re-detection. More specifically, once the semiconductor device judged to be defective based on the result of the image detection is carried on the tray of the waste carrier R, the waste tray is returned for re-detection. In this case, the upper surface of the semiconductor device is first cleaned by the brush cleaner 4 before the re-detection is performed. Next, the semiconductor device is turned upside down using an inverting device (not shown). The lower surface of the semiconductor device carried on the tray is upward by the operation of the inverting means (not shown). Once the semiconductor device is cleaned with the brush cleaner 4, the tray is loaded into the loader L and re-detected. Preferably, the brush cleaner 4 is an antistatic brush to prevent static charge from being generated upon contact with the semiconductor device. The seventh diagram is a front perspective view of an embodiment of the brush cleaner shown in the sixth figure, and the eighth diagram is a rear perspective view of the brush cleaner shown in the sixth diagram. The brush cleaner 4 includes a brush module 41, an outer cover 42, a plurality of vacuum suction tubes 43, and an exhaust pipe 44. The brush module 41 is formed integrally with the plurality of brushes 411. A pair of tension adjustor 45 ties are attached to both ends of the brush module 41. Each tension adjuster 45 is placed within a guide member 46. Although the above embodiment utilizes the brush 411 to slide the surface of the semiconductor device by sliding the 18 200847310 of the brush 411, it will be appreciated that another embodiment of the present invention can be rotated using the operation of a motor using a rotating brush. . Similarly, although not shown in the drawings, the tension adjuster 45 preferably incorporates a tension member, such as a spring, to maintain an appropriate preload between the brush module and the semiconductor device. When the semiconductor devices are carried in the tray, they may have different heights depending on the type of the semiconductor device. Therefore, in the case where the preload between the brush module 41 and the surface of the semiconductor device cannot be adjusted, the brush 411 is placed excessively in contact with the semiconductor device, causing scratches on the surface of the semiconductor device, or causing detachment of BGAs or The lead is damaged. Conversely, if the brush 411 is not in close contact with the semiconductor device, the semiconductor device may not be sufficiently cleaned. Therefore, it is preferable to select an appropriate tension adjuster 45 depending on the object to be detected, that is, the semiconductor package '. Preferably, the tension adjuster 45 is vertically moved by a cylinder (cyUnder), and the roller is moved by a control signal generated by a personal computer according to the type of the semiconductor device, thereby adjusting the brush module. The outer cover 42 is erected on the rear end of the brush module 41, and one of the outer covers 42 has an opening, and one of the upper surfaces of the outer cover 42 has a plurality of shapes _ = 々t 旻 for attracting the vacuum of the air. The f 43 is respectively inserted into the hole 421 of the outer casing 42. The 44 system horizontally places the lower end opening of the outer cover 42, and the exhaust pipe hole 1 is formed with a plurality of exhaust holes 44 so that a plurality of exhaust id-counter determined irregularities are formed obliquely. If the air 珲 442 at the end of the air system is sent to the exhaust pipe, the air can be discharged to the outside through the vent hole 441 at 19 200847310. , Jiadi, air 埠 442 is connected to provide ion ions for fresh (not shown in the picture) ' (4) to avoid electrostatic contact with semi-conducting. (4) Zhuang Zhuang, the surface of the semiconductor device is cleaned by the brush, and the electronic characteristics of the semi-finished device may be inferior to the electrostatic contact with the brush. In addition, the brush cleaner and the air cleaner may be dusty and It is attached to the semiconductor device by electric attraction and cannot be removed (4). Therefore, in the present invention, it is preferable to provide ions in the ion supply device (not in the brush cleaning (four) in the figure to avoid electrostatic contact between the brush and the semiconductor main body to achieve better electronic reliability, and at the same time ^ The electric surface is used to allow dust and impurities adhering to the bovine V body 1 due to electrostatic adsorption to be easily removed. The αΠΐ洁^4 further includes a mask member 47 provided to the lower end opening of the outer cover 42. The mask member 47 occupies the lower end opening of the outer cover 42, and more preferably the outer circumference of the exhaust pipe 44. The reduced space has the effect of vacuum suction of the two V two suction members 43. Therefore, the mask formation rate is ensured. And then removing the impurities or dust generated during the cleaning operation of the brush 411. 卞π吋 According to the second embodiment of the present invention described above, the brush provided is used before performing the image detection again. The white matter is removed to remove the dust or impurities remaining on the outer surface of the semiconductor device, so that the invention has the effect of avoiding the normal turning of the money because the semiconductor device is erroneously determined to be defective. Next, in accordance with the present invention, a semiconductor device detecting method performed using the above-described semiconductor 20 200847310 device detecting device will be briefly described. First, a tray carrying the semiconductor device such that the first surface of the semiconductor device faces upward , loaded to the loader L. Then, the tray loaded by the loader L is sequentially transferred to an image detection area. In this case, before the tray is transported to a first image detection area, the semiconductor The first surface of the device is subjected to a cleaning operation. After performing image detection on the first surface of the semiconductor device carried on the tray by the first image camera 11, the tray is reversed by the inverting device (not shown) Turning over so that the second surface of the semiconductor device faces upward. Next, the tray carrying the semiconductor device with the second surface facing upward is transferred to a second image detecting area. In this case, it is transferred to the second image. Before the detection area, the second surface of the semiconductor device performs a cleaning operation with the air cleaner 3. In the second image camera 12 After performing an image detection, based on the result of the image detection, the semiconductor device is selected as a normal semiconductor device to be transferred to the unloader U, and a defective semiconductor device to be transferred to the reject carrier R. The defective semiconductor device on the reject tray of the waste carrier R is returned to the loader for image inspection. More specifically, the waste tray carrying the second surface-facing semiconductor device is transferred to the load. At the time of the device, the second surface of the semiconductor device is cleaned by the brush cleaner 4. In this case, the waste carrier R can be classified into different scrap regions according to the type of defect of the semiconductor device determined to be defective (reject 21 The semiconductor device of the semiconductor device port P9 n 士~田/, the surface of the page is not supported by the waste σ port area R2, and the brush cleaner 4 is mounted on the tray conveyor extending from the scrap area 4, The waste tray carried on the scrap area R2 is returned for preparation for brush cleaning.
、儘官在本發明的實施例中所述之具有表面缺陷的半 導體裝置係經由挑選而被送至廢品區域R2，而刷子清潔哭 4係安裝於從廢品區域四延伸出來的㈣傳送帶上，但是 本發明並*在此限，*具有表面缺_半導體裝置的挑選 區域以及刷子^ g $的女裝位置，可以用本發明的其他 實施例的各種方式來達成。 〃 同時，在完成清潔半導體裝置的第二表面後，托盤會 藉由反轉裝置（圖中未顯示）被顛倒翻轉，使得半導 置的第一表面係朝上的。 接著，半導體裝置的第-表面會利用刷子清潔器4加 以清潔承載被清潔過的半導體裝置之托盤，會被 載入至載入器L。 、的托―”—影像檢測。 根據本發明的上述半導體裝置檢測方法，在對半導體 =?=一^二表面執行個別的影像檢測前進行空氣清 := 二避Γ為污染物所造成之任何影像檢測錯 块。同樣地’精由對以被判定為有缺陷的半導體裝 地執行刷子清潔㈣，有可能錢 測 前，先移除沒有被空氣清潔操作所移除的污染物 22 200847310 來可提升檢測正確度。 由先前的實施例說明可以知道，本發明可以提供以下 的數種功效： 首先，根據本發明，一空氣清潔器係被提供於每一影 像照相機的最前端，用以自動地移除留存在半導體裝置的 外表上像是粉塵或雜質等污染物，這具有預防正常的半導 體裝置會因為污染物而被錯誤地判定為有缺陷的半導體裴 置之功效，從而提升良率與檢測正確度。 其二，根據本發明，由於提供具有一刷子清潔器的一 廢品载體，在對半導體裝置進行—額外的影像檢測前，自 =地移除留存在半導體裝置的外表上像是粉塵或雜質等污 ，物、，這具有預防正常的半導體裝置會因為微小的表面缺 陷而被錯誤地判定為有缺陷的半導體裝置之功效。 其三，提供一連接至空氣清潔器與刷子清潔器之離子 =應裝置可避免在清潔操作中產生靜電荷，並因此而避免 ^體裝置的電子特性劣化。同樣地，供應離子可中和靜 笔力，輕㈣去_為靜電吸力_著在半導 面之粉塵與雜質。 衣 “儘管本發明已經透過較佳實施例加以說明，孰悉 蟄者應可了解，在不悖離町申請專利範_揭示之本發 ，的料與精神下’有可能有各種修改、添加與替代的方 式。 【圖式簡單說明】 本發明的上述與其他目的、特點和其他優點將可透過 以下的詳細說明與附屬圖表做更詳細的了解，其中·· 23 200847310 第一圖為根據本發明的一第一實施例所示之一半導 體裝置檢測設備的透視圖； 第二圖為第一圖的部分透視圖； 第三圖為第二圖的平面圖； 第四圖為根據本發明的一示範實施例所示之一空氣 清潔器的前方透視圖； 第五圖為第四圖之底視圖； 第六圖為根據本發明的一第二實施例所示之一半導 體裝置檢測設備的透視圖； 第七圖為第六圖中所示之一刷子清潔器的實施例之 如方透視圖， 第八圖為第六圖所示之刷子清潔器的後方透視圖；以 及 第九圖所示為一傳統的半導體裝置檢測設備。 【主要元件符號說明】 [本發明之實施例] I 影像檢測裝置 II 第一影像照相機 12 第二影像照相機 E 空的托盤 L 載入器 R 廢品載體 R1 廢品區域 R2 廢品區域 24 200847310 R3 廢品區域 B 廢品區域 U 卸載器 2 挑選裝置 3 空氣清潔器 31 殼體 311 孔洞 32 真空吸管 33 排氣管 331 排氣孔 332 空氣埠 34 供氣管 35 離子供應管 36 感測器 4 刷子清潔器 41 刷子模組 411 刷子 42 外蓋 421 孔洞 43 真空吸管 44 排氣管 441 排氣孔 442 空氣埠 45 張力調整器 25 200847310 46 引導構件 47 遮罩構件 [先前技術] 100 主體100 210 載入器210 220 緩衝器 230 第一廢品載體 240 第二廢品載體 250 第三廢品載體 260 卸載器 300 檢測裝置 310 第一影像照相機 320 第二影像照相機 410 載入堆疊器 420 空的托盤 430 饋線 440 饋線 450 饋線 460 饋線 470 饋線 480 托盤傳送帶 500 傳送裝置 600 挑選裝置 200847310 610 挑選器 反轉裝置 700The semiconductor device having the surface defect described in the embodiment of the present invention is sent to the scrap region R2 via selection, and the brush cleaning crying system is mounted on the (four) conveyor belt extending from the scrap region four, but The present invention, and to the extent that it has a surface missing area, and a woman's position of the brush, can be achieved in various ways in other embodiments of the present invention. Meanwhile, after the cleaning of the second surface of the semiconductor device is completed, the tray is inverted upside down by a reversing device (not shown) such that the first surface of the semi-guide is upward. Next, the first surface of the semiconductor device is cleaned by the brush cleaner 4 to clean the tray carrying the cleaned semiconductor device, and is loaded to the loader L. The image sensing method according to the present invention is characterized in that the air cleaning is performed before the individual image detection is performed on the surface of the semiconductor = ? = one surface: = any of the two obstacles caused by the pollutants Image detection is wrong. Similarly, the brush cleaning is performed on the semiconductor ground that is determined to be defective (4). It is possible to remove the contaminants 22 that were not removed by the air cleaning operation before the money test. The detection accuracy is improved. As can be seen from the description of the previous embodiments, the present invention can provide the following several functions: First, according to the present invention, an air cleaner is provided at the forefront of each image camera for automatically Removing contaminants such as dust or impurities left on the surface of the semiconductor device, which has the effect of preventing a normal semiconductor device from being erroneously determined to be defective by a contaminant, thereby improving yield and detection Secondly, according to the present invention, since a waste carrier having a brush cleaner is provided, the semiconductor device is operated - Before the external image is detected, the surface of the semiconductor device is removed from the surface, such as dust or impurities, which prevents the normal semiconductor device from being erroneously determined to be defective due to minute surface defects. The effect of the semiconductor device. Third, providing an ion-connecting device connected to the air cleaner and the brush cleaner can prevent static charges from being generated in the cleaning operation, and thus avoid deterioration of electronic characteristics of the device. The supply of ions can neutralize the static pen force, light (four) to _ is the electrostatic attraction _ dust and impurities on the semi-conductive surface. Clothing "Although the present invention has been explained by the preferred embodiment, it should be understood that the悖 町 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and other advantages of the present invention will become more fully understood from A perspective view of a semiconductor device detecting apparatus shown in the embodiment; a second perspective view of a first view; a third plan view of a second view; and a fourth view of an exemplary embodiment of the present invention a front perspective view of one of the air cleaners; a fifth view of the bottom view of the fourth embodiment; and a sixth perspective view of a semiconductor device detecting apparatus according to a second embodiment of the present invention; 6 is a perspective view of an embodiment of the brush cleaner, the eighth view is a rear perspective view of the brush cleaner shown in FIG. 6, and the ninth is a conventional semiconductor device. Testing Equipment. [Description of main component symbols] [Embodiment of the present invention] I Image detecting device II First image camera 12 Second image camera E Empty tray L Loader R Waste carrier R1 Waste area R2 Waste area 24 200847310 R3 Waste area B Waste area U Unloader 2 Selection device 3 Air cleaner 31 Housing 311 Hole 32 Vacuum suction pipe 33 Exhaust pipe 331 Exhaust hole 332 Air 埠 34 Air supply pipe 35 Ion supply pipe 36 Sensor 4 Brush cleaner 41 Brush module 411 Brush 42 Cover 421 Hole 43 Vacuum pipette 44 Exhaust pipe 441 Vent hole 442 Air 埠 45 Tension adjuster 25 200847310 46 Guide member 47 Mask member [Prior Art] 100 Body 100 210 Loader 210 220 Buffer 230 First waste carrier 240 second waste carrier 250 third waste carrier 260 unloader 300 detection device 310 first image camera 320 second image camera 410 loading stacker 420 empty tray 430 feeder 440 feeder 450 feeder 460 feeder 470 feeder 480 Pallet conveyor 500 conveyor 600 picking device 200 847310 610 picker reversing device 700