JP2016102024A - Method and device for aligning semiconductor chips - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment method which enables semiconductor chips to be aligned one by one when the semiconductor chips are aligned and prevents damage of the chips during alignment, and to provide an alignment device.SOLUTION: A semiconductor chip alignment method of the invention includes: a supply step where semiconductor chips are supplied while being laminated with each other; and an alignment step where the semiconductor chips are separated from each other so that overlapping portions are eliminated. The semiconductor chip alignment method further includes a moving step where positions of the semiconductor chips separated from each other are detected, the semiconductor chips are held on the basis of detected position data, and the held semiconductor chips are transferred aligned in a predetermined direction.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method and apparatus for aligning semiconductor chips, and more particularly to a method and apparatus for aligning semiconductor chips that are separated one by one in a manufacturing process of a semiconductor device.

As a method for aligning semiconductor chips, a conveying apparatus that conveys parts by applying vibration to a part deposit, that is, a parts feeder is known. Thus, the device can finally take out one by one while conveying the parts. For example, Patent Document 1 discloses a parts feeder in which the entire conveyance path is formed of a porous material. Thereby, parts, such as a chip component, can be conveyed while gently sucking ion-containing air from the porous body and removing static electricity.

JP 2010-168215 A

In general, in a parts feeder, semiconductor chip deposits move in a conveyance path by vibration. Further, the transport path is provided with a wall (frame) that serves as a guide.

However, according to the prior art, since the transport path is linear and the length is limited, it is good to transport in one direction, but the parts cannot be expanded and are not suitable for individual alignment. In addition, since the semiconductor chip collides with the wall of the transfer path, there is a problem that the semiconductor chip may be damaged such as a chip or a crack.

Accordingly, the present invention has been made to solve the above-described problems, and provides an alignment method and apparatus that aligns semiconductor chips one by one and does not cause chip breakage during alignment. Objective.

In order to solve the above-described problems, the present invention has the following configurations.
The semiconductor chip alignment method of the present invention is characterized by comprising a supplying step of supplying a plurality of semiconductor chips in a state of being deposited on each other, and an alignment step of separating the semiconductor chips so as not to overlap.
A moving step of detecting positions of the semiconductor chips separated from each other, holding the semiconductor chip based on the detected position data, and transferring the held semiconductor chips in a predetermined direction; It is characterized by providing.

The present invention can provide an alignment method and apparatus in which semiconductor chips are aligned one by one when the chips are aligned, and the chips are not damaged during alignment.

1 is a cross-sectional view illustrating a semiconductor chip alignment apparatus according to a first embodiment of the present invention. It is a top view which shows the alignment apparatus of the semiconductor chip based on Example 1 of this invention. It is the schematic which shows the manufacturing apparatus using the alignment apparatus of the semiconductor chip which concerns on Example 1 of this invention.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description.

A semiconductor chip alignment method according to Embodiment 1 of the present invention will be described. First, FIG. 1 and FIG. 2 are a cross-sectional view and a plan view showing a semiconductor chip alignment apparatus 1.

As shown in FIG. 1, the aligning device 1 includes a plate 3, a folder 4, and a vibrator 5.

The plate 3 is made of a porous material and is a porous precision adsorption plate (porous). Moreover, since it has a circular shape and is porous, air can be passed therethrough.

The folder 4 is made of a metal material and holds the plate 3. Further, the folder 4 includes a suction unit 6 and a blowing unit 7.

The vibrator 5 is a high-frequency vibration (ball feeder) in the rotation direction. Further, a circular motion is caused on the plate 3.

As a semiconductor chip alignment method, first, the semiconductor chip 2 is placed in a state of being deposited on the plate 3. For example, the semiconductor chip 2 is a mesa type semiconductor chip. The semiconductor chips 2 are scattered randomly, and the chips overlap each other. (Refer to Fig. 1 and Fig. 2 upper left)

The vibrator 5 generates high-frequency vibration in the rotational direction on the plate 3 to move the semiconductor chip 2. (See arrow in Fig. 2)

At this time, air is sucked from the suction portion 6 through the plate 3, and the semiconductor chip 2 in surface contact with the plate 3 stays in place. The overlapped semiconductor chip 2 moves on the semiconductor chip 2 that is in place by vibration. It moves onto the plate 3 from the overlap of the moving semiconductor chips 2 and is adsorbed and stays on the spot when it comes into surface contact. This process can be repeated to eliminate the overlap and make them all one by one.

At this time, in order to avoid the semiconductor chip 2 from colliding with the wall of the folder 4, air is blown out from the blowing portion 7 through the end surface portion (outer periphery) of the plate 3. Thereby, it can suppress that the semiconductor chip 2 approaches the wall surface of the folder 4, and can avoid colliding with a wall surface.

Moreover, as shown in FIG. 3, it can be set as the manufacturing apparatus further automated using the alignment apparatus 3. FIG.

The supply unit 11 supplies the semiconductor chip 2 onto the plate 3 of the alignment apparatus 1 (a hopper). An intermittent operation may be performed, and the operation timing can be automatically set by image recognition by a camera or timer setting.

The pickup unit 12 is a pick-and-place mechanism that takes out the semiconductor chips 2 that are no longer overlapped one by one. The pickup may be performed by checking the semiconductor chips 2 by image recognition using a camera and holding them one by one. At this time, the alignment apparatus may stop operating.

The alignment tray 13 is for inserting a semiconductor chip 2 by attaching a recess to a flat plate. For example, the recesses may be provided in a grid array of resin plates. The alignment tray 13 in which the semiconductor chips 2 are inserted can be moved to the next process and used in the assembly process.

Thus, the semiconductor chips are picked up in a state where the semiconductor chips are aligned one by one, and are arranged in another alignment tray. Since the chips do not overlap when gripped, the semiconductor chip is not damaged.

Next, effects of the semiconductor chip alignment method according to the first embodiment will be described.

In the semiconductor chip alignment method, a porous plate and a folder for holding the plate are provided, vibration is applied by a vibrator, and the deposited semiconductor chips are crushed and moved. The plate also includes an air suction part and a blow-out part. Air is sucked from the suction part, and the semiconductor chip is fixed to the plate surface through the plate. Semiconductor chips are aligned one by one. The blowing part blows out air from the end surface part of the plate. The semiconductor chip prevents the folder wall from colliding. Thereby, when aligning the semiconductor chips, the semiconductor chips are aligned one by one, and the chips are not damaged during the alignment.

Further, in the semiconductor chip alignment apparatus 1, the above-described alignment method can be performed using the apparatus.

As described above, the mode for carrying out the present invention has been described. From this disclosure, it should be apparent to those skilled in the art that various alternative embodiments and examples are possible.

The suction unit 6 and the blowing unit 7 may be provided at a plurality of locations. Thereby, the freedom degree of an air circuit can be increased.

In addition, a semiconductor chip inspection function for inspecting the gripped semiconductor chip and determining whether it is acceptable may be added to the pickup unit 12. Thereby, the defective chip can be removed.

Further, the pickup unit 12 may add a reversing mechanism by determining the front and back of the semiconductor chip in the camera. As a result, the front and back directions can be aligned and arranged on the alignment tray.

1, alignment device 2, semiconductor chip 3, plate
4, folder 5, vibrator 6, suction unit 7, blow-out unit 11, supply unit 12, pickup unit 13, alignment tray

Claims (4)

A semiconductor chip alignment method comprising: a supply step of supplying a plurality of semiconductor chips in a state of being deposited on each other; and an alignment step of separating the semiconductor chips so as not to overlap.
A moving step of detecting each position of the semiconductor chips separated from each other, holding the semiconductor chip based on the detected position data, and transferring the held semiconductor chip in a predetermined direction; The semiconductor chip alignment method according to claim 1, further comprising:
An apparatus for aligning semiconductor chips, comprising: supply means for supplying a plurality of semiconductor chips in a stacked state; and aligning means for separating the semiconductor chips so as not to overlap.
  The said alignment means is equipped with the porous plate, the folder which hold | maintains the said plate, and has a suction part and a blowing part, The vibrator which vibrates the said plate and the said folder, It is characterized by the above-mentioned. Semiconductor chip alignment device.

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