JP5827046B2 - Plate member support device and support method, and plate member transport device - Google Patents

Description

  The present invention relates to a plate-shaped member support device and a support method, and a plate-shaped member conveyance device.

2. Description of the Related Art Conventionally, a transport device that transports a thin plate member (plate member) typified by a semiconductor wafer, a flat display substrate, or the like is known (see, for example, Patent Document 1).
The transport device described in Patent Document 1 includes a pair of arms that place and support plate-like members, and a holding unit that holds the plate-like members by suction from suction holes provided on the placement surfaces of these arms. Each arm is supported so as to be rotatable about an axis along its longitudinal direction, and the mounting surface is urged to a predetermined inclination angle by the balancer. In such a conventional conveying device, the mounting surface of each arm is inclined with respect to the horizontal surface according to the warp of the plate-shaped member, and the mounting surface is plate-shaped by inserting each arm along the plate-shaped member. The plate is brought into surface contact with the member, and thereafter, the plate-like member is sucked and held by the holding means.

JP 2010-135381 A

  However, since the transport device described in Patent Document 1 is configured to hold and transport the plate-shaped member while being warped, for example, a device having a configuration in which a transport destination device sucks and holds the entire plate-shaped member. In this case, there arises a disadvantage that the transport destination device cannot reliably hold the plate-like member by suction. In addition, when the plate-like member is a semiconductor wafer, since the circuit surface is protected by an adhesive sheet, grinding is performed to around 50 μm from the opposite side of the circuit surface, so the semiconductor wafer to which the adhesive sheet is attached is There is a case where the sheet is greatly warped due to residual stress when the adhesive sheet is applied. Such warpage is not limited to a semiconductor wafer, and may occur depending on an atmosphere such as temperature and humidity even in a plate-like member having a multi-layer or single-layer structure.

  An object of the present invention is to provide a plate-like member support device and a support method, and a plate-like member transport device that can reliably support the plate-like member in a desired holding state.

  In order to achieve the above object, a plate-like member support device of the present invention includes a pair of support members that can be disposed opposite to one or the other surface of the plate-like member, and the plate-like member provided on each of the support members. 1st holding means and 2nd holding means which can hold | maintain a member, and angle change means which changes the angle of the said 1st holding means with respect to the said supporting member, The said 2nd holding means is the said plate shape of a predetermined attitude | position A member is provided so as to be able to hold, and the angle changing means is configured to be able to correct the posture of the plate-like member other than a predetermined posture to the predetermined posture.

At this time, in the plate-like member support device of the present invention, the first holding means sucks the plate-like member in a non-contact manner by ejecting gas toward the opposed surfaces of the plate-like member. It is preferable to have a means.
Further, the second holding means comes into contact with the opposing surface of the plate-like member and can adsorb the plate-like member, and the second holding means comes into contact with the outer edge of the plate-like member and relatively approaches each other. It is preferable that it is configured to have at least one of gripping means for gripping the shaped member.

On the other hand, a plate-like member conveying apparatus according to the present invention includes any one of the above-described supporting devices and a moving unit that moves the supporting device.
In this case, the plate-shaped member conveyance device of the present invention includes a detecting unit that detects a warping direction of the plate-shaped member, and the moving unit moves one of the plate-shaped members from a direction orthogonal to the detected warping direction. The support member is preferably guided along the other surface.
Further, the plate member support method of the present invention is a plate member support method for supporting the plate member using the first holding means and the second holding means provided in each of the pair of support members, The step of disposing the pair of support members opposite to one or the other surface of the plate-like member, and changing the angle of the first holding means with respect to the support member to change the plate-like member other than the predetermined posture to the first A step of holding by the holding unit, a step of changing the angle of the first holding unit to correct the plate-like member to a predetermined posture, and the plate-like member corrected to the predetermined posture are held by the second holding unit And a step of performing.

  According to the present invention as described above, the plate-like member in a warped state is held by the first holding means, and the angle of the first holding means is changed by the angle changing means so that the plate-like member is placed in a flat direction. The plate member can be supported in a desired state by correcting and holding the corrected plate member by the second holding means. Therefore, instead of supporting the warped plate-like member, by supporting the plate-like member in a flat state or a state close to flat, with respect to various processing for the plate-like member and delivery to other equipment, Inconvenience associated with warping can be eliminated. Further, since the corrected plate-like member is held by the second holding means, the second holding means having a relatively large holding force can be used, and the plate-like member is rotated, reversed, or vibrated during conveyance. Even if is added, it is possible to prevent the plate-like member from dropping or being displaced.

In addition, since the first holding means is configured to have the suction means capable of sucking the plate-like member in a non-contact manner, the gap between the two positions held when the warped plate-like member is corrected in the flat direction can be changed. Even if it occurs, it is possible to prevent damage to the surface of the plate-like member. Further, the second holding means is configured by having a suction means that can be brought into contact with the plate-like member and can be sucked and a gripping means that comes into contact with and grips the outer edge of the plate-like member so that the holding force can be easily increased and conveyed. It is possible to reliably prevent misalignment such as time. Here, if the second holding means is configured by having the gripping means, it is possible to reliably prevent the plate-like member from being damaged.
Further, by using the detection means in the transport device, the warping direction of the plate-like member can be determined, and the support member can be accurately guided with respect to the warping direction.

The perspective view of the conveying apparatus which concerns on embodiment of this invention. The partial top view of the conveying apparatus of FIG. Operation | movement explanatory drawing of the conveying apparatus of FIG. Operation | movement explanatory drawing of the conveying apparatus following FIG. The fragmentary top view of the conveying apparatus which concerns on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 and 2, the transfer apparatus 1 according to the present embodiment supports a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) W as a plate-like member, separates from a lifter L that sucks and supports the wafer W, and the like. The apparatus for transporting the wafer W to the wafer W and performing an appropriate process on the wafer W in a state of being lifted from the lifter L. Here, the wafer W is a disk-shaped thin plate, and, as shown in FIG. 3, the first passing through the center of the wafer W along the plane (horizontal plane) in a plan view in a state of being supported by the lifter L. It is assumed that it is warped in the direction of the axis (short axis) A, and is not warped in the second axis (major axis) B perpendicular to the first axis A, which is the warping direction, but the length in the direction of the first axis A. D1 is smaller than the diameter of the wafer W, and the length D2 in the second axis B direction is recognized as a substantially elliptical shape that is substantially the same as the diameter of the wafer W. The lifter L is formed in a cylindrical shape as a whole and is rotatably provided in a horizontal plane. The lifter L has a plurality of suction holes (not shown) on its upper surface, and sucks and holds the central portion of the lower surface W1, which is one surface of the wafer W. It is configured to be possible.

  The transfer apparatus 1 includes a support means 2 as a support apparatus for supporting the wafer W, a moving means 3 for moving the support means 2, a detection means 4 for detecting the warp direction of the wafer W, and a control means (not shown). It is prepared for. The support means 2 includes a base 5 attached to the moving means 3, a pair of arms 6 as support members supported by the base 5, and first holding means 7 and second holding means 8 provided on each arm 6. And is configured.

  The moving means 3 includes an articulated robot 31 as a driving device, and a chuck 32 that is provided on the articulated robot 31 and detachably supports the supporting means 2. Examples of the articulated robot 31 include a known 6-axis robot, and the orthogonal three axes of two orthogonal axes (X axis, Y axis) and vertical axis (Z axis) along the horizontal plane, and these orthogonal three axes. It is only necessary that the support means 2 is configured to be movable in any direction of the three rotation directions R1, R2, and R3 each having a direction as an axis.

  The detection means 4 includes an image pickup device 41 provided on the opposite side of the lifter L across the wafer W, and an image processing device (not shown) or the like is connected to the image pickup device 41. The imaging device 41 can be exemplified by a CCD camera, an optical sensor, or the like, as long as it captures the wafer W from the upper surface W2 side, which is the other surface of the wafer W, and outputs the captured image information to the image processing device or the like. Good. As shown in FIG. 3, the image processing apparatus receives image information captured by the image capturing apparatus 41 as image data P, and based on the received image data P, the first axis A of the wafer W from the lengths D <b> 1 and D <b> 2. And the second axis B is calculated, the warp direction along the first axis A and the angle θ of the first axis A with respect to the reference axis (X axis) are detected, and the detected warp direction and angle θ of the wafer W are illustrated. Output to the control means that does not.

  The base 5 of the support means 2 is an attachment support portion 51 that is engaged with and attached to the chuck 32 of the moving means 3, and a drive device that is fixed to the attachment support portion 51 and extends in the X-axis direction in the state of FIG. The arm 6 is fixed to a pair of sliders 52 </ b> A of the linear motor 52.

  The pair of arms 6 is composed of a long and prismatic member extending in parallel to each other, and is configured to be opposed to the lower surface W1 of the wafer W by driving the moving means 3, and by driving the linear motion motor 52, Each arm 6 is configured to be movable in the direction of separation and approach.

  The first holding means 7 is provided so as to protrude to the side of the arm 6 at approximately the center in the longitudinal direction of the arm 6. The first holding means 7 is a driving device (not shown) and is attached to each arm 6 by a rotation motor as an angle changing means. It is provided so as to be able to turn upward and to be opposed to the lower surface W1 of the wafer W along with the turning. The first holding means 7 is connected to the gas ejection portion 71 as a suction means capable of sucking the lower surface W1 of the wafer W in a non-contact manner by ejecting gas toward the lower surface W1. And a gas supply unit (not shown) for supplying gas. That is, the gas ejection part 71 is a so-called Bernoulli chuck that forms a negative pressure region with the lower surface W1 of the wafer W by ejecting gas outward from the annular opening. The two portions of the lower surface W1 are sucked and held by the gas ejection portions 71 of the pair of first holding means 7 provided on each arm 6 as described above.

  The second holding means 8 includes a linear motion motor 81 as a driving device provided on the base end side (base 5 side) of the arm 6 and a main chuck as a gripping means fixed to the output shaft 81A of the linear motion motor 81. 82 and a driven chuck 83 as gripping means provided on the distal end side of the arm 6 so as to be interlocked with the main driving chuck 82. The main chuck 82 is driven forward and backward along the longitudinal direction of the arm 6 by the linear motor 81, and the driven chuck 83 is guided by the guide groove 61 along the longitudinal direction of the arm 6 and is not shown inside the arm 6. It is connected to the main chuck 82 via the interlocking portion so as to be interlockable. The main chuck 82 and the driven chuck 83 are driven in directions in which their forward / backward movement directions are opposite, that is, in a direction in which they are relatively close to or relative to each other, so that the outer edge W3 of the wafer W can be gripped by being relatively close to each other. It has become. Accordingly, the wafer W is held and held at the four positions of the outer edge W3 by the main chuck 82 and the driven chuck 83 of the pair of second holding means 8 provided on each arm 6.

A procedure for transporting the wafer W by the transport apparatus 1 will be described.
First, when the wafer W sucked and held by the lifter L is picked up by the image pickup device 41 from above and the image data P is acquired as shown in FIG. 3, the image processing device takes the outer shape and center of the wafer W in the image data P. And detecting the first axis A in the warp direction and the second axis B in the warp orthogonal direction based on the short side direction length D1 and the long side direction length D2, and from the ratio of the lengths D1 and D2 The warp curvature of the wafer W is calculated by calculation, and the angle θ from the reference axis X to the first axis A and the warp curvature are output to the control means. The control means outputs a movement command to the moving means 3 based on the angle θ of the first axis A, and the moving means 3 drives the articulated robot 31 to move the support means 2 toward the rotation direction R3 by the angle θ. After the rotation, the support means 2 is advanced in parallel with the second axis B, and the arm 6 is inserted along the lower surface W1 of the wafer W. The movement of the support means 2 with respect to the wafer W in the entering direction is not limited to the rotation of the support means 2 by the articulated robot 31, and the wafer W may be rotated in a horizontal plane by the lifter L. Both wafers W may be rotated.

  Next, based on the warp curvature of the wafer W, the control means moves the linear motor 52 so that the distance between the lower surface W1 and the arm 6 and the first holding means 7 is optimal, and a rotation motor 53 (not shown). And a movement command based on the calculated movement amount is output to the support means 2. As shown in FIG. 4A, the support unit 2 drives a rotation motor (not shown) by the input rotation angle, and rotates the first holding unit 7 in the direction of the arrow A1 so as to be on the lower surface W1 of the wafer W. While rotating in the approaching direction, the linear motion motor 52 is driven by the input movement amount to move the pair of arms 6 in the direction of the arrow A2 approaching each other. At this time, the second holding means 8 retracts the main chuck 82 and the driven chuck 83 away from each other, that is, both ends of the arm 6 so as to be positioned outside the outer edge W3 of the wafer W.

  Next, as shown in FIG. 4B, the first holding means 7 sucks the lower surface W1 of the wafer W by jetting gas from the gas jetting portion 71, and holds the wafer W in a non-contact manner. In the state where the first holding means 7 holds the wafer W as described above, the support means 2 drives a rotation motor (not shown) to rotate the first holding means 7 in the direction of the arrow A3 as shown in FIG. Let Next, as shown in FIG. 4C, the linear motor 52 is driven to move the pair of arms 6 in the direction of an arrow A4 that is separated from each other. As a result, the wafer W is corrected to be flat or nearly flat (hereinafter simply referred to as “flat”). Here, whether or not the wafer W is flat is determined by imaging the wafer W again with the imaging device 41 and performing image processing, and the calculated short side direction length D1 approaches or becomes the same as the diameter of the wafer W. Can be determined. Further, the stop position of the arm 6 moved in the direction away from each other is set in advance according to the diameter of the wafer W, and the position where the first holding means 7 is as close as possible to the outer edge W3 of the wafer W is preferable.

  Next, as shown in FIGS. 1 and 2, the second holding means 8 drives the linear motion motor 81 to bring the main chuck 82 and the driven chuck 83 relatively close to each other and grip the outer edge W <b> 3 of the wafer W. When the wafer W is held by the first holding means 7 and the second holding means 8 as described above, the moving means 3 moves the articulated robot 31 after releasing the suction of the lifter L as shown in FIG. Driven to move the support means 2, transport the wafer W to an appropriate processing apparatus or the like in a flat state, release the holding of the first holding means 7 and the second holding means 8, and deliver the wafer W. Thereafter, the transfer device 1 returns the support means 2 to the initial position shown in FIG. 3 and then repeats the above-described operation for the wafer W supported by the lifter L.

According to this embodiment, there are the following effects.
That is, by transferring and delivering the wafer W corrected to a flat shape, it is possible to eliminate inconvenience associated with the warpage of the wafer W with respect to delivery to a transfer destination apparatus or the like. Further, when the wafer W is corrected to be flat, the pair of arms 6 are moved in the separation direction by the linear motor 52 while the lower surface W1 of the wafer W is sucked and held by the first holding means 7 without contact. Generation of local stress on the wafer W can be suppressed, and damage to the surface of the wafer W can be prevented. Furthermore, by holding the outer edge W3 of the wafer W with the second holding means 8 after correcting the wafer W to be flat, the holding force can be increased while preventing damage to the surface of the wafer W. It is possible to prevent misalignment and falling.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to particular embodiments, but with respect to the embodiments described above, such as shape and the like, without departing from the scope and spirit of the invention. In the detailed configuration, various modifications can be made by those skilled in the art. Moreover, since the description which limited the shape etc. which were disclosed above was illustrated in order to make an understanding of this invention easy, it does not limit this invention, Therefore The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, in the above-described embodiment, the transfer device 1 for the wafer W has been exemplified. However, the support device (support means 2) of the present invention is not limited to the one incorporated in the transfer device 1, and is provided independently. May be. Moreover, in the said embodiment, although the case where the plate-shaped member was the semiconductor wafer W was shown, the plate-shaped member is not limited to the semiconductor wafer W, and other glass plates, steel plates, resin plates, etc. Members can also be targeted, and examples of semiconductor wafers include silicon wafers and compound wafers.
In the above embodiment, the first holding unit 7 is exemplified as one that can be sucked in a non-contact manner by ejecting a gas toward the wafer W. However, the first holding unit 7 is not limited to this and contacts the surface of the wafer W. An adsorbing means capable of adsorbing and holding may be used. In this case, it is preferable to prevent damage to the surface of the wafer W by providing an elastic body at a contact portion with the surface of the wafer W.
In the embodiment, the procedure for correcting the wafer W to be flat by synchronizing the first holding means 7 and the linear motion motor 52 is exemplified. However, when the warpage of the wafer W is small, a pair by the linear motion motor 52 is used. The movement of the arm 6 in the separation approaching direction may be omitted, and the wafer W may be held and corrected in a flat direction simply by changing the angle of the first holding means 7.

Further, the second holding means 8 is not limited to the one holding the outer edge W3 of the wafer W by the pair of chucks 82 and 83, and the wafer W is not contacted by ejecting gas in the same manner as the first holding means 7. It may be that which can be sucked by the contact, or as shown in FIG.
In FIG. 5, the second holding means 8 </ b> A is configured to have a plurality of suction holes 84 opened on the upper surface of the arm 6, and the plurality of suction holes 84 are not shown through a chamber inside the arm 6. It is connected to a suction pump. In the second holding means 8A, as described above, the first holding means 7 and the linear motor 52 are synchronized to correct the wafer W to be flat, and the lower surface W1 of the wafer W approaches the upper surface of the arm 6. The lower surface W1 is sucked and held by sucking air from the plurality of suction holes 84.

Further, the moving means is not limited to the six-axis drive equipped with the multi-joint robot 31 as in the above-described embodiment, but can be used such as one that is linearly movable in one direction and one that is movable in two planes. Depending on the situation, an appropriate configuration can be used.
The detection means is not limited to the one provided with the imaging device 41 as in the above embodiment, but may be a contact sensor capable of recognizing the shape by contacting the outer edge of the plate-like member or the like. It may be an optical sensor capable of recognizing the shape of the plate member by reflection or transmission. Further, the method for detecting the warping direction of the plate-like member using the imaging data is not limited to image processing, and may be other appropriate automatic processing or manual processing by an operator.
Further, a wafer W that is not warped may be a target for support or transport.
In the above embodiment, the case where both sides of the wafer W warp in the Z-axis direction (upper in FIG. 4) has been described. However, when the center of the wafer W warps in the Z-axis direction (upper in FIG. 4). But it is possible.
Furthermore, in the above-described embodiment, an example in which the arm 6 is operated on the left and right sides has been described. However, depending on the shape of the wafer W and the state of warpage, the one arm 6 may not be moved or rotated. The amount of movement or rotation of the second arm 6 can be increased or decreased as compared with the other arm 6 so as to correspond to the left and right objects.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Conveyance apparatus 2 Support means (support apparatus)
3 Moving means 4 Detection means 6 Arm (supporting member)
7 First holding means 8, 8A Second holding means 71 Gas ejection part (suction means)
82 Main chuck (gripping means)
83 Followed chuck (gripping means)
W wafer (plate-like member)
W1 Bottom (one side)
W2 Top surface (the other surface)
W3 outer edge

Claims (6)

A pair of support members that can be disposed opposite to one or the other surface of the plate-like member;
A first holding means and a second holding means provided on each of the support members and capable of holding the plate-like member;
Angle changing means for changing the angle of the first holding means with respect to the support member,
The second holding means is provided so as to be able to hold the plate-like member in a predetermined posture,
The angle changing means is configured to be able to correct the posture of the plate-like member other than the predetermined posture to the predetermined posture.   The said 1st holding means has a suction means which can attract | suck the said plate-shaped member non-contactingly by ejecting gas toward the opposing surface in the said plate-shaped member. The support apparatus of the plate-shaped member of description.   The second holding means is configured to come into contact with the opposing surfaces of the plate-like member to adsorb the plate-like member, and the plate-like member by contacting the outer edge of the plate-like member and relatively approaching each other. The plate member support device according to claim 1, wherein the plate member support device is configured to include at least one of gripping means for gripping the gripping member.   A plate-shaped member conveying apparatus comprising: the supporting device according to any one of claims 1 to 3; and a moving unit that moves the supporting device. A detecting means for detecting a warping direction of the plate-like member;
5. The plate-shaped member conveying apparatus according to claim 4, wherein the moving unit guides the support member along one or the other surface of the plate-shaped member from a direction orthogonal to the detected warping direction. . A plate-like member support method for supporting a plate-like member using a first holding means and a second holding means provided in each of a pair of support members,
Placing the pair of support members opposite to one or the other surface of the plate-like member;
Changing the angle of the first holding means relative to the support member to hold the plate-like member other than a predetermined posture with the first holding means;
Changing the angle of the first holding means to correct the plate-like member to a predetermined posture;
And a step of holding the plate-like member corrected to a predetermined posture by the second holding means.

Images