TW201804558A - Electronic component conveying apparatus and electronic component inspecting apparatus capable of improving production efficiency by photographing the terminal surface after the electronic component is held - Google Patents

Abstract

An electronic component conveying apparatus and an electronic component inspecting apparatus capable of improving production efficiency are provided. The electronic component conveying apparatus includes a first carrying section (200) capable of carrying an electronic component (90) having a terminal section; a second carrying section (14) capable of carrying the electronic component (90); third carrying sections (24, 26) capable of carrying the electronic component (90); an electronic component holding part (13) capable of holding the electronic component (90); and a photographing part (28) capable of photographing a terminal surface on which the terminal part is disposed, the photographing part (28) photographing the terminal surface after the electronic component (90) is held from the first carrying section (200) by the electronic component holding part (13); the electronic component holding part (13), based on the photographed image, arranges the electronic component (90) at the second carrying section (14) or the third carrying sections (24, 26).

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

Generally, a test apparatus for electronic parts such as a semiconductor wafer includes a plurality of transfer robots for transferring electronic parts. In addition, the electronic parts before inspection are transferred to the inspection socket for measurement by a transfer robot, and are collected from the inspection socket after the inspection is completed. Specifically, for example, the electronic parts before inspection are sucked and held by the supply robot and released from the grooves arranged on the supply shuttle, and then transferred to the position where the measurement robot is sucked and held by the supply shuttle. The electronic parts before inspection are separated from the supply shuttle by the measuring robot and arranged in the inspection socket. After the inspection is completed, the inspection robot sucks and holds the inspection robot again and releases the grooves arranged in the recovery shuttle from the inspection socket. In addition, the electronic components after inspection are transported to the position of the recovery robot by the recovery shuttle, and the recovery robot is disengaged from the recovery tray corresponding to the test result. When the inspection socket or each groove is sequentially transferred by each robot, the electronic parts must be arranged at a specific position of the inspection socket or each groove. In particular, when the electronic component is arranged in the inspection socket, since the measurement terminal of the inspection socket and the terminal of the electronic component must be in good contact, it is desirable that the relative offset between the electronic component and the inspection socket is small. Moreover, when it is arranged in other grooves, it is also desirable that the relative deviation between each groove and the electronic component is small. For example, an electronic component testing device equipped with a camera that detects a grip position of an IC device is disclosed (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature] [Patent Literature 1] WO2003 / 075023

[Problems to be Solved by the Invention] However, in Patent Document 1, there is no disclosure for judging whether an IC device is good and classifying it. Among IC devices, those with poor appearance (scarring, defects, contamination, abnormal appearance, and adhered garbage) are still supplied to the IC processor. IC devices with poor appearance must be ruled out eventually, but if their electrical characteristics are checked, unnecessary inspection time will be generated. In addition, if an IC device with an abnormal shape or garbage is pushed into the inspection socket, the inspection socket may be damaged. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. [Application Example 1] The electronic component transporting device of this application example is characterized in that it includes: a first mounting section capable of mounting electronic components having a terminal section; and a second mounting section capable of mounting the electronic components described above; A third mounting portion that can mount the electronic component; an electronic component holding portion that can hold the electronic component; and an imaging portion that can image a terminal surface on which the terminal portion is disposed; and the imaging portion is on the electronic portion The component holding section images the terminal surface after the first mounting section holds the electronic component, and the electronic component holding section arranges the electronic component in the second mounting section or the third mounting section based on the imaged image. Home department. According to this application example, the subsequent processing can be branched based on the image of the terminal surface of the electronic component. Thereby, for example, before judging the electrical characteristics of the electronic part, it is judged that the electronic part is a poor appearance, and it can be avoided without inspection. Furthermore, the electronic component may be cleaned by, for example, providing a cleaning function to the third placing section. As a result, it is possible to eliminate useless inspections by removing defective electronic components before inspection, and improve productivity. [Application Example 2] The electronic component conveying device described in the above application example, wherein the appearance inspection of the electronic component is preferably performed based on the imaged image, and the appearance inspection is a failure to satisfy the preset of the electronic component. Defective benchmarks are checked for discrimination. According to this application example, it is possible to discriminate a defect (appearance defect) of an electronic component that does not satisfy a preset criterion. [Application Example 3] According to the electronic component transporting device described in the above application example, it is preferable that the appearance inspection is a comparison between a previously stored model image and the captured image. According to this application example, the visual inspection can be easily performed. [Application Example 4] The electronic component transfer device described in the above application example, preferably, an inspection section for inspecting the electrical characteristics of the electronic components may be provided, and the electronic component holding section is for inspecting the electrical characteristics. The electronic components are previously disposed on the second placement portion or the third placement portion. According to this application example, useless inspection can be omitted by removing the defective electronic parts before inspection. [Application Example 5] According to the electronic component transfer device described in the above application example, it is preferable that the electronic component holding section transfers the electronic component from the second placing section to the inspection section. According to this application example, the electronic component can be easily transferred to the inspection section. [Application Example 6] The electronic component transfer device described in the above application example, wherein the third mounting portion preferably has a mechanism for cleaning the electronic component. According to this application example, contamination of electronic parts can be easily cleaned. [Application Example 7] The electronic component inspection device of this application example is characterized in that it includes: a first mounting section capable of mounting electronic components having a terminal section; and a second mounting section capable of mounting the above-mentioned electronic components; A third mounting section that can mount the electronic component; an electronic component holding section that can hold the electronic component; an imaging section that can image a terminal surface on which the terminal section is arranged; and an inspection section that checks the electronic component And the imaging unit is located on the electronic component holding portion and images the terminal surface after the first mounting portion holds the electronic component, and the electronic component holding portion arranges the electronic component on the first portion based on the captured image. 2 mounting sections or the third mounting section. According to this application example, the subsequent processing can be branched based on the image of the terminal surface of the electronic component. Therefore, before the electrical characteristics of the electronic component are checked, it is judged that the electronic component is a poor appearance, and can be avoided without inspection. Furthermore, the electronic component may be cleaned by, for example, providing a cleaning function to the third placing section. As a result, it is possible to eliminate useless inspections by removing defective electronic components before inspection, and improve productivity.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the accompanying drawings. FIG. 1 is a schematic plan view showing an electronic component inspection apparatus according to this embodiment. In the following, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Further, a direction parallel to the X axis is also referred to as "X direction", a direction parallel to the Y axis is referred to as "Y direction", and a direction parallel to the Z axis is referred to as "Z direction". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, and includes a state inclined slightly (for example, less than about 5 °) with respect to the level as long as it does not hinder the transportation of electronic components. The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used for inspection, test (hereinafter referred to as "inspection") BGA (Ball grid array) package, or LGA (Land grid array: platform). Grid array) devices such as IC devices, LCD (Liquid Crystal Display), CIS (CMOS Image Sensor: CMOS image sensor) and other electronic components. In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component for inspection will be described as a representative, and it will be referred to as "IC device 90". The IC device 90 includes an electrode (electrode pattern) 40 (see FIG. 2) as a terminal portion. As shown in FIG. 1, the inspection device 1 is divided into a tray supply area A1, a device supply area (hereinafter referred to as the "supply area") A2, an inspection area A3, a device recovery area (hereinafter referred to as the "recycling area") A4, and Tray removal area A5. Each of these areas is separated from each other by a wall portion, a shutter, or the like, which is not shown. In addition, the supply area A2 becomes the first room R1 divided by the wall portion or the shutter, and the inspection area A3 becomes the second room R2 divided by the wall portion or the shutter. The recovery area A4 becomes the wall or The third room R3, such as the block. The first room R1 (supply area A2), the second room R2 (inspection area A3), and the third room R3 (recovery area A4) are each configured to ensure airtightness or thermal insulation. Thereby, the first room R1, the second room R2, and the third room R3 can maintain the humidity or temperature as much as possible, respectively. The first room R1 and the second room R2 are controlled to a specific humidity and a specific temperature, respectively. The IC device 90 passes through the above-mentioned areas sequentially from the tray supply area A1 to the tray removal area A5, and is inspected in the inspection area A3 in the middle. In this way, the inspection device 1 is formed to include the following: an electronic component transfer device that transports the IC device 90 in each area and has a control unit 80; an inspection unit 16 that performs an inspection in the inspection area A3; and an unillustrated one Check the control department. In addition, in the inspection device 1, an electronic component transfer device is configured by a configuration other than the inspection section 16 and the inspection control section. The tray supply area A1 is an area in which the tray 200 serving as the first mounting portion in which the plurality of IC devices 90 are arranged in an unchecked state is supplied. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3, respectively. A first tray transfer mechanism 11A and a second tray transfer mechanism 11B are provided so as to span the tray supply area A1 and the supply area A2. In the supply area A2, a temperature adjustment section 12 as an arrangement section (mounting section) for disposing the IC device 90, a first device transfer head 13, an electronic component holding section 13, a third tray transfer mechanism 15, and a third carrier are provided. The cleaning section 24 of the placement section and the retreat section 26 as the third placement section. The temperature adjustment unit 12 is a device that heats or cools a plurality of IC devices 90 and adjusts (controls) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment section 12 is a temperature control member that can arrange the IC device 90 and perform both heating and cooling of the IC device 90. In the configuration shown in FIG. 1, two temperature adjustment sections 12 are arranged in the Y direction and fixed. In addition, the IC device 90 on the tray 200 carried in (carried in) from the tray supply area A1 by the first tray transfer mechanism 11A is transferred to and placed on any one of the temperature adjustment sections 12. The cleaning unit 24 is configured with the IC device 90. The cleaning section 24 is a place where the IC device 90 is cleaned. The cleaning unit 24 includes a mechanism for cleaning the IC device 90. Thereby, the contamination of electronic parts can be easily cleaned. The cleaning unit 24 removes the contamination of the IC device 90 in a case where the IC device 90 is contaminated or is judged to be defective in appearance (defects that do not satisfy a preset criterion). Decontamination of the IC device 90 in the cleaning section 24 can be performed using air, an adhesive sheet, an abrasive sheet, or the like. The retreat section 26 is configured with an IC device 90. The retreat portion 26 is recovered in a case where the IC device 90 is abnormally shaped or the IC device 90 is also dirty after washing, and is recovered as being unable to be regenerated. The retreat portion 26 is preferably located in the supply area A2 or may be located in the recovery area A4. The retreat portion 26 is a place where the IC device 90 having a bad appearance is placed. The first device transfer head 13 holds the IC device 90. The first device transfer head 13 is configured to arrange the IC device 90 in the device supply section 14, the cleaning section 24, or the retreat section 26 based on the captured image. The first device transfer head 13 is movably supported in the supply area A2. With this, the first device transfer head 13 can perform the transfer of the IC device 90, the first camera 28, and the second camera 30 between the tray 200 carried in from the tray supply area A1 and the first camera 28 and the second camera 30 described later. The IC device 90 is transported to and from the temperature adjustment section 12, the cleaning section 24, the retreat section 26, and a device supply section 14 described later, and the IC device 90 is transported between the temperature adjustment section 12 and the device supply section 14. The first device transfer head 13 includes a plurality of suction handles 38 (see FIG. 2) that hold the IC device 90. Each suction handle 38 includes a suction nozzle 48 (see FIG. 7) and is held by the suction IC device 90. The inspection apparatus 1 includes an inspection unit 16 that inspects the electrical characteristics of the IC device 90. The first device transfer head 13 arranges the IC device 90 in the device supply section 14, the cleaning section 24, or the retreat section 26 before performing electrical property inspection. Thereby, useless inspection can be omitted by removing the IC device 90 having poor appearance before the inspection. The second device transfer head 17 transfers the IC device 90 from the device supply unit 14 to the inspection unit 16. Thereby, the IC device 90 can be easily transported to the inspection section 16. The third tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 in a state where all IC devices 90 are removed in the X direction. After this transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transfer mechanism 11B. FIG. 2 is a diagram showing an IC device 90 and a first camera 28 as an imaging unit in this embodiment. In the supply area A2, a first camera 28 and a second camera 30 are provided on both sides in the X direction of the cleaning unit 24, respectively. As shown in FIG. 2, the first camera 28 can photograph the upper part and the second camera 30 can photograph the lower part. The first and second cameras 28 and 30 are used to shoot the IC device 90 held by the first device transfer head 13 and output the photographic data. At the position directly below the first device transfer head 13, the camera can be photographed at one time. All (8) IC devices 90. The image data captured by the first and second cameras 28 and 30 is image processed. The first camera 28 images a terminal surface 32 on which the electrode 40 of the IC device 90 is arranged. The first camera 28 captures the imaging terminal surface 32 after the IC device 90 is held from the tray 200 by the first device transfer head 13. In this embodiment, the first and second cameras 28 and 30 are CCD (Charge Couple Device) cameras, but they are not limited to this. The inspection device 1 of this embodiment performs an appearance inspection to confirm the state of the IC device 90. The inspection device 1 is provided with a first camera directly under the IC device 90 and confirms the state of the terminal surface 32 of the IC device 90 from below the IC device 90. Thereby, the external shape and the electrode state can be confirmed at the same time. Furthermore, as described above, the external shape of the IC device 90 can be confirmed with the second camera 30. The inspection device 1 performs an appearance inspection of the IC device 90 based on the captured image. The visual inspection is an inspection to judge the defective appearance of the IC device 90 that does not satisfy the preset criteria. Thereby, the appearance of the IC device 90 which does not satisfy the preset criterion can be judged. In addition, the defective appearance of the IC device 90 that does not satisfy the preset criterion is, for example, a pattern deviation amount from an external shape, an abnormal size, an external shape defect, a dirt or a foreign body, an electrode defect or a bridge, or a poor puncture. The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, a device supply section (supply shuttle) 14, which is a second mounting section, where IC devices 90 are arranged and transported, are provided, and an inspection section 16, a second device transport head 17, and a device recovery for transporting IC devices 90 are provided.部 (RECOVERY SHUTTLE) 18. The device supply unit 14 is configured with an IC device 90. The device supply unit 14 includes a placement board (electronic parts placement board) 141 on which the IC device 90 is placed, and a device supply unit body 142 that can be moved (moved) in the X direction. The arrangement plate 141 is detachably provided in the device supply unit body 142. The device supply unit 14 is a device that transports the IC device 90 after temperature adjustment (temperature control) to the inspection unit 16 and is supported between the supply region A2 and the inspection region A3 in a movable manner in the X direction. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14 and placed. In addition, in the device supply section 14, the IC device 90 may be heated or cooled as in the temperature adjustment section 12, and the IC device 90 may be adjusted to a temperature suitable for inspection. The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, a holding portion that holds the IC device 90 when inspecting the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while maintaining the state of the IC device 90. In addition, the terminal of the IC device 90 is electrically connected (contacted) with the probe pin, and the inspection of the IC device 90 is performed through the probe pin. The inspection of the IC device 90 is performed based on a program stored in a memory section of an inspection control section provided in a tester (not shown) connected to the inspection section 16. In addition, in the inspection section 16, the IC device 90 may be heated or cooled in the same manner as the temperature adjustment section 12, and the IC device 90 may be adjusted to a temperature suitable for inspection. The second device transfer head 17 is movably supported in the inspection area A3. Accordingly, the second device transfer head 17 can transfer and arrange the IC devices 90 on the device supply section 14 carried in from the supply area A2 to the inspection section 16. When the IC device 90 is inspected, the second device transfer head 17 presses the IC device 90 toward the inspection section 16, and thereby the IC device 90 is brought into contact with the inspection section 16. Thereby, as described above, the terminal of the IC device 90 is electrically connected to the probe pin of the inspection section 16. The second device transfer head 17 includes a plurality of gripping portions (not shown) that grip the IC device 90. Each gripping portion is provided with a suction nozzle and is gripped by suctioning the IC device 90. In the second device transfer head 17, the IC device 90 can be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 can be adjusted to a temperature suitable for inspection. In the case where a retreat section 26 is provided in the recovery area A4 to be described later, the IC device 90 with poor appearance is transported to the inspection area A3, but the IC device 90 with poor appearance is preferably transported to the recovery area A4 without being inspected by the inspection section 16. . The device recovery unit 18 includes a placement board (electronic component placement board) 181 on which the IC device 90 is disposed, and a device recovery unit body 182 that can be moved (moved) in the X direction. The arrangement plate 181 is detachably provided in the device recovery unit body 182. The device recovery section 18 is a device that transports the IC device 90 after the inspection by the inspection section 16 to the recovery area A4, and is movably supported between the inspection area A3 and the recovery area A4 in the X direction. In the configuration shown in FIG. 1, the device recovery unit 18 is the same as the device supply unit 14. Two device recovery units 18 are arranged in the Y direction, and the IC devices 90 on the inspection unit 16 are transferred to either of the device recovery units. 18, and placed. This transfer is performed by the second device transfer head 17. The recovery area A4 is an area of the IC device 90 after the recovery inspection is completed. A collection tray 19, a third device transfer head 20, and a sixth tray transfer mechanism 21 are provided in the collection area A4. An empty tray 200 and a retreat section are also prepared in the collection area A4. The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. Then, the IC device 90 on the device recovery section 18 moved to the recovery area A4 is transported to and placed on any one of the recovery tray 19, the empty tray 200, and the retreat section 26. Thereby, the IC device 90 is collected and classified according to each inspection result. The third device transfer head 20 is movably supported in the recovery area A4. Thereby, the third device transfer head 20 can transfer the IC device 90 from the device collection unit 18 to the collection tray 19, the empty tray 200, or the retreat unit 26. The third device transfer head 20 includes a plurality of gripping portions (not shown) that grip the IC device 90. Each gripping portion includes a suction nozzle and grips the IC device 90 by suction. The sixth tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the X direction. In addition, after the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200 described above. The tray removal area A5 is an area in which the trays 200 in which the plurality of IC devices 90 in a checked state are arranged are recovered and removed. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, a fourth tray conveyance mechanism 22A and a fifth tray conveyance mechanism 22B are provided so as to span the recovery area A4 and the tray removal area A5. The fourth tray transfer mechanism 22A is a mechanism that transfers the tray 200 on which the IC devices 90 having been inspected are loaded from the recovery area A4 to the tray removal area A5. The fifth tray transfer mechanism 22B is a mechanism that transfers the empty tray 200 for recycling the IC devices 90 from the tray removal area A5 to the collection area A4. The inspection control unit of the inspection unit 16 performs, for example, inspection of the electrical characteristics of the IC device 90 arranged in the inspection unit 16 based on a program stored in a memory unit (not shown). The control unit 80 performs an appearance inspection of the IC device 90 based on the captured image. The visual inspection is an inspection for identifying a defective (bad) appearance of the IC device 90 that does not satisfy a preset criterion. Thereby, the appearance of the IC device 90 which does not satisfy the preset criterion can be judged. The control unit 80 judges whether the appearance inspection of the IC device 90 is good or not. The items for good or bad judgment are the pattern deviation from the shape, abnormal size, shape defects, dirt or foreign matter, electrode defects or bridges, and poor puncture. The methods of good or bad judgment are pattern matching (differential processing, feature amount detection, Fourier transform, histogram), calculation of the number of electrodes, and the like. In the appearance inspection, it is preferable to compare a model image previously stored in a memory section (not shown) and a captured image. Thereby, an external appearance inspection can be performed easily. The control unit 80 judges whether the appearance inspection of the IC device 90 is good or not, transports the IC device 90 to the cleaning unit 24, and removes the dirt of the IC device 90. Further, the IC device 90 is transported toward the retreat portion 26 as a place where the IC device 90 having a bad appearance is placed. The control unit 80 transports all the IC devices 90 that are judged to be defective in appearance to the cleaning unit 24, and then inspects them afterwards. If OK, the inspection is performed. If it is NG, it will be conveyed to the retreat part 26 as it cannot be reproduced. Next, a procedure for photographing the IC device 90 with the first camera 28 and arranging the IC device 90 in the device supply section 14 or the cleaning section 24 or the retreat section 26 based on the captured image will be described. Since the second camera 30 is the same as the first camera 28, its description is omitted. The control unit 80 moves the first device transfer head 13 to the pre-inspection transfer position, and causes the eight IC devices 90 before the inspection placed on the tray 200 to be held and raised by the first device transfer head 13. The control unit 80 moves the first device transfer head 13 and arranges each IC device 90 at the center above the first camera 28. The control unit 80 reciprocates the first device transfer head 13 in the Z direction when the first device transfer head 13 is arranged at the center above the first camera 28, so that the distance between the first camera 28 and each IC device 90 and the first camera The focal distance of 28 is the same. When the control unit 80 moves the IC devices 90 to the focal distance, the first camera 28 shoots all the IC devices 90 illuminated by the first illumination device 28s at a time. In addition to the continuous illumination, the first lighting device 28s may be intermittently strong (flashing) light, and may be any one as long as the exposure time can be controlled. The control unit 80 stores the photographed image data in an image memory unit (not shown), performs image processing by an image processor (not shown), and checks the appearance of each IC device 90 and the electrodes on the terminal surface 32 State of the pattern (electrode) 40. The control unit 80 judges the appearance of the IC device 90 and the electrode pattern (electrode) 40 of the terminal surface 32 by the image processing of an image processor (not shown), and stores the result of the good or bad in the memory unit (not shown). (Pictured). The control unit 80 moves the first device transfer head 13 and transfers the IC device 90 to the temperature adjustment unit 12 in a case where the result of the goodness in the memory unit is good. If not, the first device transfer head 13 is moved, and the IC device 90 is transferred to the cleaning unit 24. The control unit 80 repeats the above-mentioned inspection after cleaning the IC device 90 by the cleaning unit 24, and if it is not the case again, moves the first device transfer head 13 to carry the IC device 90 to the retreat unit 26. Thereafter, the control unit 80 determines whether the inspection of all the IC devices 90 is completed. According to this embodiment, the subsequent processing can be branched based on the image of the terminal surface 32 of the IC device 90. Therefore, before the electrical characteristics of the IC device 90 are inspected, it can be determined that the IC device 90 is defective, and can be avoided without inspection. The IC device 90 may be cleaned in the cleaning unit 24. As a result, it is possible to eliminate useless inspection by removing the IC device 90 having poor appearance before inspection, and improve productivity. Especially in the field where mass production is carried out, there is an example in which garbage is attached to the piping of an electronic component inspection device and is blackened, and it is more effective to decontaminate before inspection. At this time, it is more effective to confirm the IC device 90 before the inspection and transport it to the cleaning section 24 or the retreat section 26 instead of the socket 34. It is also effective to start the test after removing contamination by washing. Cleaning the IC device 90 before inspection can improve inspection accuracy and improve yield. By not conveying the IC device 90 with bad appearance to the socket 34, damage to the socket 34 can be prevented beforehand. In addition, when the shape of the substrate on which the electrode pattern 40 of the IC device 90 is formed is not correctly cut with respect to the electrode pattern 40, the resin mold of the IC device 90 that can be cut may be used as a reference. The center position is correctly held so that the center of the electrode pattern 40 of the IC device 90 contacts the center of the socket 34 correctly, and inspection can be performed. The embodiment is not limited to the above, and may be implemented in the following modes. (Modification 1) FIG. 3 is a diagram showing the offset between the center of the electrode pattern 40 and the center of the outer shape of the IC device 90 of this modification. Previously, among the IC devices 90, there was a shift between the center of the package (outer shape) and the center of the position of the electrode pattern 40. As shown in the right diagram of FIG. 3, the electrode pattern 40 on the terminal surface 32 of the IC device 90 and the pin 36 of the socket 34 of the inspection section 16 are offset. The left diagram of FIG. 3 shows a state in which the electrode pattern 40 of the terminal surface 32 of the IC device 90 and the pin 36 of the socket 34 of the inspection section 16 are less displaced. When the IC device 90 is manufactured, the electrode pattern (electrode) 40 of the terminal surface 32 of the IC device 90 is shifted from the center of the package and manufactured. The offset shape of the center of the package and the electrode pattern 40 is random, and there are various patterns. Previously, the electronic component inspection device was transported based on the external shape of the IC device 90. Therefore, in the state shown in the right diagram of FIG. Yu. In the case of such an IC device 90, if the external shape is used as a reference, the position of the electrode 40 and the position of the pin 36 of the socket 34 are inconsistent, and correct inspection cannot be performed. In order to solve such a problem, the position of the electrode 40 of the imaging IC device 90 is corrected and transported so that the position of the electrode 40 and the position of the pin 36 of the socket 34 match. FIG. 4 is a diagram showing an image of the terminal surface 32 of the IC device 90 of this modification. In this modified example, the first camera 28 is used to capture the terminal surface 32 of the IC device 90, and it is detected how much the center 54 of the electrode pattern 40 has shifted from the center 56 of the suction handle 38. As shown in FIG. 4, for example, the center 54 of the electrode pattern 40 of the terminal surface 32 of the IC device 90 is offset from the center 56 of the suction handle 38. FIG. 5 is a diagram showing the groove 42 and the IC device 90 of the device supply section 14 of this modification. FIG. 6 is a diagram showing the groove 42 and the previous groove of the device supply section 14 of the present modification. In this modified example, the detected amount of offset is added to the suction handle 38 and placed on the device supply unit 14. The center 56 of the groove 42 of the device supply portion 14 is aligned with the center 54 of the electrode pattern 40 so as to be offset. At this time, confirm the offset of each IC device 90. If they can be set at the same time, set them at the same time, if they cannot be set at the same time, set them individually. Satisfy X1-X2 <Xt (X1 is the offset in the X direction of the first IC device 90, X2 is the offset in the X direction of the second IC device 90, and Xt is the threshold value), and Y1- Y2 <Yt (Y1 is the offset in the Y direction of the first IC device 90, Y2 is the offset in the Y direction of the second IC device 90, and Yt is the threshold value), the first can be set at the same time With the second IC device 90. X3, X4, Y3, Y4 are also determined in the same way. As shown in FIG. 6, the device supply section 14 used in this modification example does not include a guide 44 in the groove 42. The bottom surface of the groove 42 is provided with a position shift preventing material (such as rubber) 46 or an adsorption mechanism. FIG. 7 is a diagram showing an adsorption nozzle 48 and an IC device 90 according to this modification. FIG. 8 is a diagram showing the suction nozzle 48, the IC device 90, and the pin 36 of the socket 34 in this modification. In this modification, as shown in FIG. 7, the second device transfer head 17 sucks the IC device 90 in a state shifted from the center of the suction nozzle 48. In addition, the suction section nozzle (suction section) 48 does not have a guide in the same manner as the device supply section 14. As shown in FIG. 8, the IC device 90 is brought into contact with the socket 34 and checked. In addition, the socket 34 does not have a guide in the same manner as the suction section nozzle (suction section) 48. After the inspection is completed, the IC device 90 is placed in the device recovery unit 18. (Modification 2) FIG. 9 is a diagram showing the groove 58 and the IC device 90 of the device recovery section 18 of this modification. In this modification, the third device transfer head 20 is a center 60 that adsorbs the outer shape of the IC device 90. The position of the center 60 of the external shape of the IC device 90 is memorized in advance the correction amount when the first device transfer head 13 is offset from the device supply unit 14 and is calculated inversely. When the correction amount at the time of supply is set to, for example, X mm (X direction) and Y mm (Y direction), the correction amount at the time of recovery is set to -X mm (X direction) and -Y mm (Y direction). Accordingly, the IC device 90 can be placed without being offset from the collection tray 19. At this time, confirm that the offset amount of each IC device 90 can be set at the same time if it can be set at the same time, and set separately if it can't be set at the same time. Satisfy X1-X2 <Xt (X1 is the offset in the X direction of the first IC device 90, X2 is the offset in the X direction of the second IC device 90, and Xt is the threshold value), and Y1- Y2 <Yt (Y1 is the offset in the Y direction of the first IC device 90, Y2 is the offset in the Y direction of the second IC device 90, and Yt is the threshold value), the first With the second IC device 90. X3, X4, Y3, Y4 are also determined in the same way. (Modification 3) FIG. 10 is a diagram showing the outer shape of the IC device 90 and the rotation offset of the electrode pattern 40 according to this modification. FIG. 11 is a diagram showing the IC device 90 on the rotary stage 52 according to this modification. In this modification, when the electrode pattern 40 is shifted from the IC device 90 in the rotation direction, the shift in the rotation direction is also corrected. When an image is captured, the rotation amount of the electrode pattern 40 is also detected, and the rotation is corrected using the rotation stage 52. For example, when the rotation offset amount of the IC device 90 shown in FIG. 10 is set to θ, as shown in FIG. 11, the rotation stage 52 of the IC device 90 is used to correct the rotation offset amount θ of the IC device 90. In addition, in the rotation stage 52, the IC devices 90 having the same rotation offset can be accessed simultaneously. (Modification 4) FIG. 12 is a flowchart showing a control operation of the inspection device 1 according to this modification. First, in step S10, the control unit 80 uses the first device transfer head 13 to suck a plurality of IC devices 90. Next, in step S20, the control unit 80 moves the first device transfer head 13 to a position above the first camera 28 and images the terminal surfaces 32 of one IC device 90 (the terminal surfaces 32 of all IC devices 90 can also be imaged) ). Next, in step S30, the control unit 80 calculates an offset amount of XYθ between the center of the first device transfer head 13 and the pattern position of the terminal surface 32. Next, in step S40, the control unit 80 determines whether the offset is equal to or greater than a predetermined value or is less than a predetermined value. In the case where the offset is greater than a predetermined value, the process proceeds to step S50. In the case where the offset is less than a predetermined value, the process proceeds to step S60. Next, in step S50, the control unit 80 sets the IC device 90 on the rotation stage 52 and corrects the rotation offset. After that, the control unit 80 re-adsorbs the IC device 90. Next, in step S60, the control unit 80 arranges the IC device 90 in the device supply unit 14. At this time, the offset amount of XY is corrected so that the center of the arrangement plate 141 and the center of the pattern of the terminal surface 32 coincide. Next, in step S70, the control unit 80 sucks the IC device 90 from the device supply unit 14 with the second device transfer head 17 and performs an inspection. After the inspection is completed, the control unit 80 arranges the IC device 90 in the device recovery unit 18. Next, in step S80, the control unit 80 sucks the IC device 90 at the center position of the external shape reference with the third device transfer head 20. Next, in step S90, the control unit 80 determines whether the offset amount is equal to or greater than a predetermined value or is less than a predetermined value. In the case where the offset is greater than a predetermined value, the process proceeds to step S100. In the case where the offset is less than a predetermined value, the process proceeds to step S110. Next, in step S100, the control unit 80 transports the IC device 90 to the rotation stage 52, and restores the rotation correction. Next, in step S110, the control unit 80 places the IC device 90 on the tray 200. Then, end the job. As described above, the electronic component transfer device and the electronic component inspection device of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part may be replaced with any configuration having the same function. Moreover, you may add another arbitrary structure. In addition, the present invention may be a combination of any two or more configurations (features) in each of the above embodiments.

1‧‧‧Inspection device (electronic parts inspection device)
11A‧‧‧The first pallet transfer mechanism
11B‧‧‧Second pallet transfer mechanism
12‧‧‧Temperature Adjustment Department
13‧‧‧The first device transfer head (electronic parts holding section)
14‧‧‧ Device supply section (supply shuttle) (second placement section)
15‧‧‧3rd pallet transfer mechanism
16‧‧‧ Inspection Department
17‧‧‧ 2nd device transfer head (electronic parts holding section)
18‧‧‧Device Recycling Department (Recycling Shuttle)
19‧‧‧Recycling tray
20‧‧‧ 3rd device transfer head
21‧‧‧The 6th pallet transfer mechanism
22A‧‧‧4th pallet transfer mechanism
22B‧‧‧5th pallet transfer mechanism
24‧‧‧Cleaning section (third placement section)
26‧‧‧Retreat section (third placement section)
28‧‧‧The first camera (camera section)
28s‧‧‧The first lighting device
30‧‧‧ 2nd camera
32‧‧‧Terminal surface
34‧‧‧Socket
36‧‧‧pin
38‧‧‧ Suction handle
40‧‧‧electrode pattern (electrode) (terminal section)
42‧‧‧Groove
44‧‧‧Guide
46‧‧‧Position shift prevention material
48‧‧‧ adsorption nozzle
52‧‧‧Rotating stage
54‧‧‧ Center
56‧‧‧ Center
58‧‧‧Groove
60‧‧‧ Center
80‧‧‧Control Department
90‧‧‧IC devices (electronic parts)
141‧‧‧Configuration board
142‧‧‧ Device Supply Department
181‧‧‧Configuration board
182‧‧‧ Device Recovery Department
200‧‧‧ Tray (1st mounting section)
A1‧‧‧Tray supply area
A2‧‧‧Device supply area (supply area)
A3‧‧‧ Inspection area
A4‧‧‧device recycling area (recycling area)
A5‧‧‧Tray removal area
R1‧‧‧Room 1
R2‧‧‧Room 2
R3‧‧‧Room 3
Steps S10 ～ S110‧‧‧‧
X‧‧‧axis
Y‧‧‧axis
Z‧‧‧axis θ‧‧‧rotation offset

FIG. 1 is a schematic plan view showing an electronic component inspection apparatus according to this embodiment. FIG. 2 is a diagram showing the IC device and the first camera of this embodiment. FIG. 3 is a diagram showing the shift between the center of the electrode pattern and the center of the outer shape of the IC device according to the modification 1. FIG. FIG. 4 is a diagram showing an image of a terminal surface of an IC device according to Modification 1. FIG. FIG. 5 is a diagram showing a groove and an IC device of a device supply section of a modification 1. FIG. FIG. 6 is a diagram showing a groove of a device supply section and a previous groove in a modification 1. FIG. FIG. 7 is a diagram showing an adsorption nozzle and an IC device according to a modification 1. FIG. FIG. 8 is a diagram showing pins of an adsorption nozzle, an IC device, and a socket of a modification 1. FIG. FIG. 9 is a diagram showing a groove and an IC device in a device recovery section of Modification 2. FIG. FIG. 10 is a diagram showing an external shape of an IC device and a rotation offset of an electrode pattern according to a modification 3. FIG. FIG. 11 is a diagram showing an IC device on a rotary stage according to Modification 3. FIG. FIG. 12 is a flowchart showing a control operation of the inspection device according to the modification 4. FIG.

1‧‧‧Inspection device (electronic parts inspection device)

11A‧‧‧The first pallet transfer mechanism

11B‧‧‧Second pallet transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧The first device transfer head (electronic parts holding section)

14‧‧‧ Device supply section (supply shuttle) (second placement section)

15‧‧‧3rd pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ 2nd device transfer head (electronic parts holding section)

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧ 3rd device transfer head

21‧‧‧The 6th pallet transfer mechanism

22A‧‧‧4th pallet transfer mechanism

22B‧‧‧5th pallet transfer mechanism

24‧‧‧Cleaning section (third placement section)

26‧‧‧Retreat section (third placement section)

28‧‧‧The first camera (camera section)

30‧‧‧ 2nd camera

80‧‧‧Control Department

90‧‧‧IC devices (electronic parts)

141‧‧‧Configuration board

142‧‧‧ Device Supply Department

181‧‧‧Configuration board

182‧‧‧ Device Recovery Department

200‧‧‧ Tray (1st mounting section)

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ Inspection area

A4‧‧‧device recycling area (recycling area)

A5‧‧‧Tray removal area

R1‧‧‧Room 1

R2‧‧‧Room 2

R3‧‧‧Room 3

X‧‧‧axis

Y‧‧‧axis

Z‧‧‧axis

Claims (7)

An electronic component conveying device includes: a first mounting portion capable of mounting electronic components having a terminal portion; a second mounting portion capable of mounting the above-mentioned electronic component; a third mounting portion capable of mounting The electronic part; an electronic part holding part that can hold the electronic part; and an imaging part that can take an image of a terminal surface on which the terminal part is disposed; and the imaging part is attached to the electronic part holding part from the first placing part The terminal surface is imaged after the electronic component is gripped; the electronic component holding portion is configured to arrange the electronic component on the second placement portion or the third placement portion based on the imaged image. For example, the electronic component transporting device of claim 1, wherein the appearance inspection of the electronic component is performed based on the imaged image; and the appearance inspection is an inspection for discriminating the failure of the electronic component that does not meet a preset standard. For example, the electronic component transfer device according to claim 2, wherein the appearance inspection is a comparison between a previously stored model image and the captured image. For example, the electronic component transfer device according to any one of claims 1 to 3 may be provided with an inspection section for inspecting the electrical characteristics of the electronic components; and the electronic component holding section is configured to carry out the electronic inspection before performing the electrical characteristics inspection. The components are arranged in the second mounting portion or the third mounting portion. The electronic component transfer device according to claim 4, wherein the electronic component holding unit transfers the electronic component from the second placement unit to the inspection unit. The electronic component transfer device according to any one of claims 1 to 5, wherein the third mounting section includes a mechanism for cleaning the electronic component. An electronic component inspection device includes: a first mounting portion capable of mounting an electronic component having a terminal portion; a second mounting portion capable of mounting the above-mentioned electronic component; a third mounting portion capable of mounting The electronic part; an electronic part holding part that can hold the electronic part; an imaging part that can image a terminal surface on which the terminal part is arranged; and an inspection part that inspects the electronic part; and the imaging part is attached to the electronic part The gripping section images the terminal surface after the first mounting section grips the electronic component; the electronic component gripping section disposes the electronic component on the second mounting section or the third mounting based on the imaged image. unit.