CN104785450A - Sorting machine for semiconductor element testing - Google Patents
Sorting machine for semiconductor element testing Download PDFInfo
- Publication number
- CN104785450A CN104785450A CN201410691161.XA CN201410691161A CN104785450A CN 104785450 A CN104785450 A CN 104785450A CN 201410691161 A CN201410691161 A CN 201410691161A CN 104785450 A CN104785450 A CN 104785450A
- Authority
- CN
- China
- Prior art keywords
- semiconductor element
- mentioned
- user tray
- cleaner
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
The invention relates to a sorting machine for semiconductor element testing. According to the sorting machine, a picking and placing device in the sorting machine is combined with cleaning device removing foreign substances from a user tray and other carrying elements. Through the mentioned composition, the sorting machine can clean the empty carrying element at a stop state, and the sorting machine has simple set and has the advantage of enabling a set space of the cleaner to be minimized.
Description
Technical field
The present invention relates to a kind of semiconductor element test separator (HANDLER FORSEMICONDUCTOR DEVICE TEST), particularly relate in order to measuring semiconductor element to after tester semiconductor supply element, the separator of the semiconductor element terminating to test of classifying according to grade.
Background technology
Separator is the equipment supporting that the semiconductor element manufactured by the manufacturing process through specifying can be tested by tester, it makes each semiconductor element being placed in user tray be loaded into test pallet and is placed in each semiconductor element of the state of test pallet to tester supply, and makes each semiconductor element terminating to test be offloaded to user tray from test pallet.
This separator possesses for carrying picking up of semiconductor element to put (Pick and place) device between user tray and test pallet and in the mutually different each mounting key element as aligner, buffer, pigeonholes or between arrangement key element, and pick and place device at least has a pick-and-place module.And pick-and-place module possesses to utilize vacuum power to carry out and adsorbs and grip semiconductor element or remove the multiple pick-ups of action gripped.
That pick and place device is named with multiple title according to use.In general, be called loader when the semiconductor element being positioned at user tray is loaded into the pick and place device of test pallet, and be called emptier when the semiconductor element being positioned at test pallet is offloaded to the pick and place device of user tray.
On the other hand, owing to loading semiconductor element in mounting key element, if thus there is various foreign matter in mounting part, then its mounting is bad or affect the quality of semiconductor element.Therefore, it is desirable that mounting key element waits for mounting semiconductor element under the state removing various foreign matter.
About the technology of foreign matter removing mounting key element, propose to have No. 10-0815131, the granted patent publication of Korea S (hereinafter referred to as ＇ at first technology 1 ＇), No. 10-2012-0027580, publication publication (hereinafter referred to as ' in first technology 2 '), the technology such as No. 10-0862638, granted patent publication (hereinafter referred to as ＇ at first technology 3 ＇).
User tray is rotated and from the technology of user tray separating semiconductor element in first technology 1.But, this in first technology 1 owing to occupying larger space and mechanism forms complicated, be thus difficult to the technology of converting as removing the foreign matter in mounting key element.
Introducing test cabinet or the technology of cleaning unit is set from the path that test cabinet is drawn in first technology 2.Therefore, cannot be applicable to remove the technology of foreign matter from the mounting key element be fixed or be in halted state in first technology 2.
The technology of the Superficial Foreign Body removing semiconductor element with air cleaner or fur brush cleaner in first technology 3.Generally multiple mounting portions of the depression that can load each semiconductor element are possessed in mounting key element.Thus, even if clean each mounting portion with air or hairbrush, the removal efficiency of foreign matter is not high yet, but also the situation that foreign matter is only movement between mutually different mounting portion occurs.Therefore, be adapted in first technology 3 the technical elements existing problems removing foreign matter from mounting key element.
Summary of the invention
Solve desired problem
The object of the present invention is to provide a kind of technology for removing foreign matter from the mounting key element being in halted state.
The scheme of dealing with problems
Be intended to achieve the above object according to semiconductor element test separator of the present invention, comprising: loader, semiconductor element is loaded into test pallet from user tray by it; Jockey, it makes each semiconductor element being finished the test pallet loaded by above-mentioned loader be electrically connected with tester; Emptier, if the test of its each semiconductor element be electrically connected with tester by above-mentioned jockey terminates, is then offloaded to user tray by semiconductor element from test pallet; And, cleaner, its for each semiconductor element by above-mentioned loader vacate after be in halted state user tray carry out foreign matter removal, or for semiconductor element by above-mentioned emptier load before be in halted state user tray carry out foreign matter removal.
Above-mentioned cleaner combines with above-mentioned loader or above-mentioned emptier and moves together with above-mentioned loader or above-mentioned emptier.
Above-mentioned cleaner comprises: from the vacuum suction part of user tray vacuum aspirated foreign body; And, the foreign matter free-falling sucked by above-mentioned vacuum suction part and the control of dust part collected.
Comprise further for making above-mentioned cleaner carry out the lifter be elevated relative to above-mentioned loader or above-mentioned emptier.
Above-mentioned separator comprises the element validator confirming whether remaining semiconductor element on the user tray being in halted state further, and above-mentioned cleaner works when confirming that user tray is vacated by said elements validator.
Invention effect
According to the present invention, there is following effect.
The first, key element can not only be loaded for the user tray etc. being in halted state to clean, and it is arranged simply.
The second, owing to being formed in the mode be combined with pick and place device, the installation space of cleaner thus can be made to minimize.
Accompanying drawing explanation
Fig. 1 is the conceptual top view for separator according to the present invention.
Fig. 2 is the general profile chart of the main portions for Fig. 1.
Fig. 3 is the upward view of the vacuum suction part of cleaner for the main portions being formed in Fig. 1.
Fig. 4 is the general profile chart of the semiconductor element mobile device for another way according to the present invention.
Symbol description
120 ＇-loader, 170-emptier, 180,180 ＇-cleaner, 181-vacuum suction part, 182-control of dust part, 190,190 ＇-element validator.
Detailed description of the invention
Illustrate according to the preferred embodiments of the present invention as above referring to accompanying drawing, be convenient to illustrate for purpose of brevity, omit or explanation mentioned in summary background technology as far as possible.
Fig. 1 is the conceptual top view for general semiconductor element test separator 100 (hereinafter referred to as ' separator ').
As shown in Figure 1, separator 100 is configured to comprise test pallet 110 (TEST TRAY), loader 120 (LOADER), all hot cell 130 (SOAK CHAMBER), test cabinet 140 (TEST CHAMBER), propulsion plant 150 (PUSHING APPARATUS), move back equal hot cell 160 (DESOAK CHAMBER), emptier 170 (UNLOADING APPARATUS), cleaner 180 (CLEANER), element validator 190 and lifter 210 etc.
Test pallet 110 is provided with the multiple inserts can installed and arrange semiconductor element, and is circulated along determined closed path C by multiple conveying device (not shown).
Loader 120 is the pick and place device making each semiconductor element that will test being placed in the user tray CT on loading plate lp be loaded into the test pallet 110 (LOADING) being positioned at " loaded " position LP (LOADING POSITION).
In order to by come from " loaded " position LP conveying, each semiconductor element of being loaded into test pallet 110 is provided with equal hot cell 130 according to test environment conditions preheating or precooling.
In order to test through after equal hot cell 130 preheating, precooling, be transported to test position TP (TESTPOSITION), each semiconductor element of being loaded into test pallet 110 and be provided with test cabinet 140.
As by be positioned at test cabinet 140, jockey that tester (TESTER) side that each semiconductor element of being loaded into test pallet 110 is pushed to be combined with test cabinet 140 side makes each semiconductor element be electrically connected with tester and be provided with propulsion plant 150.
In order to by carry from test cabinet 140, be loaded into test pallet 110, revert to normal temperature through each semiconductor element of heating or cooling and be provided with and move back equal hot cell 160.
Emptier 170 is delivered to unloading position UP (UNLOADINGPOSITION) by from moving back equal hot cell 160, is loaded into each semiconductor element of test pallet 110 and classifies according to test grade, and unloads (UNLOADING) pick and place device to the empty user tray CT unloaded on support plate up.
As a reference, the user tray CT on loading plate lp and the user tray CT unloaded on support plate up its construct or form all identical, why make symbol different, be only used to clear and definite " loaded " position and unloading position.
Cleaner 180, before semiconductor element is filled to user tray CT by emptier 170, removes the foreign matter of user tray CT from user tray CT vacuum aspirated foreign body.With regard to this cleaner 180, get involved emptier 170 side due to lifter 210 and combine, thus can move with the movement of emptier 170.Therefore, because cleaner 180 can move to the user tray CT as cleaning object, the cleaning of the user tray CT being in halted state can thus be carried out.Fig. 2 is the general profile chart of main portions Fig. 1 being comprised to emptier 170 and cleaner 180.With reference to Fig. 2, the cleaner 180 be combined with emptier 170 comprises vacuum suction part 181 and control of dust part 182.Certainly, can also be the example of the mode that cleaner is directly combined with emptier.
As shown in Figure 3, owing to being formed with multiple inlet hole h in the bottom surface of vacuum suction part 181, thus sucked the foreign matter on the user tray CT being positioned at downside by the vacuum pressure of vacuum suction part 181 inside.
Control of dust part 182 is arranged at the side of vacuum suction part 181, position, upside provides the movable passageway W of the air sucked by inlet hole h, position, downside provides chamber, and the foreign matter of movable passageway W free-falling because of deadweight of the air risen after inlet hole h lateral thrust comes together in described chamber.Here, the movable passageway of air finally can be connected with the vacuum pipeline of factory (TEST HOUSE) or be connected with the vavuum pump arranged separately.
Element validator 190 confirms stopping at the whether remaining semiconductor element of the user tray CT unloaded on support plate up.This element validator 190 can be formed with video camera.Thus, the work of cleaner 180 be when confirmed by element validator 190 user tray CT be in by vacate state carry out.
Lifter 210 is provided with in order to make cleaner 180 carry out being elevated relative to emptier 170.Therefore, must rise and do not hindering unloading operation by the situation down cleaner 180 that works of emptier 170, must to decline thus its cleaning work can not be affected by emptier 170 by the situation down cleaner 180 that works of cleaner 180.Can be with above-below direction the linear motion guide of length direction and cylinder to possess this lifter 210, or applicable motor and possess this lifter 210, this lifter 210 can substantially between emptier 170 and cleaner 180.
On the other hand, can be understood as Fig. 2 is structure for the new semiconductor element mobile device being combined with cleaner 180 and element validator 190 at the emptier 170 as pick and place device.Namely, according to the present invention, also possess cleaner and element validator owing to not only possessing pick and place device, therefore, point out a kind of semiconductor element mobile device of the new paragon that the cleaning of user tray and semiconductor element mobile operating can be carried out in the lump.
Therefore, as shown in Figure 4, specific implementation the present invention can also be carried out with the semiconductor element mobile device of the mode being combined with cleaner 180 ＇, element validator 190 ＇ and lifter 210 ＇ at loader 120 ＇.In this case, after stopping at the operation of the user tray CT on loading plate by loader 120 ＇ and being vacateed, foreign matter can be carried out by cleaner 180 ＇ and remove operation.
And then according to the present invention, because cleaner 180,180 ＇ can move to the upper side position of multiple mounting key element, as long as thus pick and place device can the position of movement, then not only can clean for user tray CT, and also can clean for the multiple mounting key element as test pallet, aligner, buffer and pigeonholes etc.
As mentioned above, according to the present invention, give mobility being combined with the mobility of pick and place device for cleaner 180,180 ＇, thus can not only specific implementation cleaning function also simplified design to greatest extent, and can clean for all mounting key elements.
As mentioned above, although the embodiment by referring to accompanying drawing has carried out illustrating for of the present invention, but the above embodiments just enumerate preferred example to describe the present invention, therefore, not should be understood to the present invention and be confined to the above embodiments, and should be understood to interest field of the present invention and determined by appending claims and equivalent concepts thereof.
Claims (5)
1. a semiconductor element test separator, is characterized in that, comprising:
Loader, semiconductor element is loaded into test pallet from user tray by it;
Jockey, it makes each semiconductor element being finished the test pallet loaded by above-mentioned loader be electrically connected with tester;
Emptier, if the test of its each semiconductor element be electrically connected with tester by above-mentioned jockey terminates, is then offloaded to user tray by semiconductor element from test pallet; And,
Cleaner, its for each semiconductor element by above-mentioned loader vacate after be in halted state user tray carry out foreign matter removal, or for semiconductor element by above-mentioned emptier load before be in halted state user tray carry out foreign matter removal.
2. semiconductor element test separator according to claim 1, is characterized in that,
Above-mentioned cleaner combines with above-mentioned loader or above-mentioned emptier and moves together with above-mentioned loader or above-mentioned emptier.
3. semiconductor element test separator according to claim 2, is characterized in that,
Comprise further for making above-mentioned cleaner carry out the lifter be elevated relative to above-mentioned loader or above-mentioned emptier.
4. semiconductor element test separator according to claim 1, is characterized in that,
Above-mentioned cleaner comprises:
From the vacuum suction part of user tray vacuum aspirated foreign body; And,
The foreign matter free-falling sucked by above-mentioned vacuum suction part and the control of dust part collected.
5. semiconductor element test separator according to claim 1, is characterized in that,
Comprise the element validator confirming whether remaining semiconductor element on the user tray being in halted state further,
Above-mentioned cleaner works when confirming that user tray is vacated by said elements validator.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0007186 | 2014-01-21 | ||
| KR1020140007186A KR102043633B1 (en) | 2014-01-21 | 2014-01-21 | Handler for semiconductor device test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104785450A true CN104785450A (en) | 2015-07-22 |
| CN104785450B CN104785450B (en) | 2017-05-31 |
Family
ID=53550903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410691161.XA Active CN104785450B (en) | 2014-01-21 | 2014-11-26 | Semiconductor element test separator |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102043633B1 (en) |
| CN (1) | CN104785450B (en) |
| TW (1) | TWI533003B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110653174A (en) * | 2016-03-18 | 2020-01-07 | 泰克元有限公司 | Sorter for testing electronic components |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020065026A1 (en) * | 2000-11-29 | 2002-05-30 | Tadashi Mitsui | IC handler and contact cleaning method |
| CN101013656A (en) * | 2005-12-15 | 2007-08-08 | 泰克元有限公司 | Test handler and operation method thereof |
| TW200847310A (en) * | 2007-03-13 | 2008-12-01 | Intekplus Co Ltd | Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same |
| CN101322971A (en) * | 2007-06-14 | 2008-12-17 | 鸿劲科技股份有限公司 | Memory body IC testing and sorting machine |
| CN201454870U (en) * | 2009-07-22 | 2010-05-12 | 咸阳文林机电设备制造有限公司 | Fully-automatic LED chip selector |
| CN202212360U (en) * | 2011-08-13 | 2012-05-09 | 张家港市金桥轻工机械有限公司 | Pole plate separator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2908820B2 (en) * | 1989-10-24 | 1999-06-21 | 株式会社日本マイクロニクス | IC carrier |
| JP3417528B2 (en) * | 1996-04-05 | 2003-06-16 | 株式会社アドバンテスト | IC test equipment |
| KR20120027580A (en) * | 2010-09-13 | 2012-03-22 | 삼성전자주식회사 | Test handler for semiconductor package and the test method using the same |
| KR101489373B1 (en) * | 2013-09-17 | 2015-02-12 | 주식회사 넥스트솔루션 | Cleaning apparatus for test handler |
-
2014
- 2014-01-21 KR KR1020140007186A patent/KR102043633B1/en active IP Right Grant
- 2014-11-26 CN CN201410691161.XA patent/CN104785450B/en active Active
- 2014-11-28 TW TW103141451A patent/TWI533003B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020065026A1 (en) * | 2000-11-29 | 2002-05-30 | Tadashi Mitsui | IC handler and contact cleaning method |
| CN101013656A (en) * | 2005-12-15 | 2007-08-08 | 泰克元有限公司 | Test handler and operation method thereof |
| TW200847310A (en) * | 2007-03-13 | 2008-12-01 | Intekplus Co Ltd | Semiconductor device inspecting apparatus and semiconductor device inspecting method using the same |
| CN101322971A (en) * | 2007-06-14 | 2008-12-17 | 鸿劲科技股份有限公司 | Memory body IC testing and sorting machine |
| CN201454870U (en) * | 2009-07-22 | 2010-05-12 | 咸阳文林机电设备制造有限公司 | Fully-automatic LED chip selector |
| CN202212360U (en) * | 2011-08-13 | 2012-05-09 | 张家港市金桥轻工机械有限公司 | Pole plate separator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110653174A (en) * | 2016-03-18 | 2020-01-07 | 泰克元有限公司 | Sorter for testing electronic components |
| CN110653174B (en) * | 2016-03-18 | 2022-04-12 | 泰克元有限公司 | Sorter for testing electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102043633B1 (en) | 2019-11-13 |
| KR20150086941A (en) | 2015-07-29 |
| TW201530165A (en) | 2015-08-01 |
| TWI533003B (en) | 2016-05-11 |
| CN104785450B (en) | 2017-05-31 |
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