CN216094906U - High-efficient wafer sorter of binary channels - Google Patents

Abstract

The utility model discloses a double-channel efficient wafer sorting machine which comprises a machine table and a sorting device arranged on the machine table, wherein the sorting device comprises a tray circulating mechanism, a wafer transferring mechanism and a wafer detecting mechanism, the tray circulating mechanism comprises a plurality of tray inlet rails and tray outlet rails which are arranged on the machine table in parallel and are equal in number, the wafer detecting mechanism comprises a wafer trolley mechanism and a crimping testing device matched with the wafer trolley mechanism, and the double-channel efficient wafer sorting machine has the advantages that the traditional two-section wafer sorting and transferring process is split into a three-section wafer transferring and sorting process, so that the travelling distance required by wafers during sorting operation is greatly shortened, the equipment length is effectively reduced, and the double-channel efficient wafer sorting machine is convenient to adapt to factory environments with different sizes and specifications.

Description

High-efficient wafer sorter of binary channels

Technical Field

The utility model relates to a group of wafer sorting machines, in particular to a double-channel efficient wafer sorting machine.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. In the wafer processing process, since the types and the qualities of the produced wafers are different due to external factors, the AOI test is usually performed in an automatic optical inspection machine, after the types and the qualities of the wafers are inspected, the wafers are sorted according to the differences of the types and the qualities, and the different wafers are separated.

At present, the sorting process of wafers mainly carries out sorting through manual work, sorting workers need to carefully inspect each wafer and then sort and place the wafer, the sorting efficiency is low, the labor intensity is high, the sorting cost is high, manual sorting cannot sort the substrate numbers, sorting errors are easily caused due to various subjective reasons such as carelessness of personnel operation in the sorting process, the wafers are easily scratched in the sorting process, direct scrapping or degradation treatment of the wafers can be caused, and the production quality and the product percent of pass of the wafers are directly influenced. Therefore, the development of the automatic wafer sorting machine has urgent research value and also has good economic benefit and industrial application potential.

Disclosure of Invention

The purpose of the utility model is as follows: the utility model aims to provide a double-channel efficient wafer sorting machine aiming at the defects of the prior art.

The technical scheme is as follows: the utility model discloses a double-channel efficient wafer sorting machine which comprises a machine table and a sorting device arranged on the machine table, wherein the sorting device comprises a tray circulating mechanism, a wafer transferring mechanism and a wafer detecting mechanism, the tray circulating mechanism comprises a plurality of tray inlet tracks and tray outlet tracks which are arranged on the machine table in parallel and are equal in number, and the wafer detecting mechanism comprises a wafer trolley mechanism and a compression joint testing device matched with the wafer trolley mechanism.

Preferably, the wafer trolley mechanism comprises a double-station wafer trolley, and the crimping test device comprises two groups of IC test sensors matched with the double-station wafer trolley and a double-station crimping head matched with the two groups of IC test sensors.

Preferably, a tray inlet stacking rack is arranged at the top end of the tray inlet rail, and a tray outlet stacking rack is arranged at the top end of the tray outlet rail.

Preferably, the wafer transfer mechanism includes a wafer transfer robot provided between the tray circulation mechanism and the wafer inspection mechanism.

Preferably, the wafer transfer robot includes a load side IC pick-and-place robot and an unload side IC pick-and-place robot.

Preferably, an IC preheating zone is further disposed on the machine.

Preferably, the disc inlet track and the disc outlet track are provided with three tracks.

Compared with the prior art, the utility model has the following beneficial effects: the splitting of the traditional two-section type wafer sorting and transferring process is divided into a three-section type wafer transferring and sorting process, so that the required travelling distance of the wafer is greatly shortened when the wafer is subjected to sorting operation, the length of equipment is effectively reduced, and the matching of the equipment and the factory environment with different sizes and specifications is facilitated.

Drawings

FIG. 1 is a schematic structural diagram of a dual-channel high-efficiency wafer sorter according to the present invention.

In the figure: 1. a machine platform; 2. a disc feeding track; 3. a disc discharge track; 4. a double-station wafer trolley; 5. an IC test sensor; 6. pressing the head part at double stations; 7. a loading side IC pick-and-place manipulator; 8. an unloading side IC pick-and-place manipulator; 9. an IC preheat zone.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the indicated orientations and positional relationships based on the drawings for convenience in describing and simplifying the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.

In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.

The utility model provides a high-efficient wafer separator of binary channels, includes board 1 and installs the sorting device on board 1, and the sorting device includes tray circulation mechanism, wafer transfer mechanism and wafer detection mechanism, and tray circulation mechanism includes a plurality of parallel mount on board 1 and the equal disk track 2 of advancing of quantity and play dish track 3, and wafer detection mechanism includes the crimping testing arrangement of wafer platform truck mechanism and cooperation wafer platform truck mechanism. The technical scheme has the advantages that the traditional two-section type wafer sorting and transferring process is split into the three-section type wafer transferring and sorting process, so that the required travelling distance of the wafer during sorting operation is greatly shortened, the length of equipment is effectively reduced, and the equipment is convenient to adapt to factory environments with different sizes and specifications.

In order to improve the sorting operation efficiency, in actual production, the wafer trolley mechanism comprises a double-station wafer trolley 4, the crimping test device comprises two groups of IC test sensors 5 matched with the double-station wafer trolley 4 and a double-station head pressing part 6 matched with the two groups of IC test sensors 5, and the two groups of IC test sensors 5 and the double-station head pressing part 6 are arranged, so that the double-channel efficient wafer sorting machine can simultaneously execute the sorting action of two batches of wafers in unit time, and the operation efficiency is improved by one time; the top end of the tray inlet rail 2 is provided with a tray inlet stacking rack, the top end of the tray outlet rail 3 is provided with a tray outlet stacking rack, and matched batch material moving manipulators can be additionally arranged at the tray inlet stacking rack and the tray outlet stacking rack, so that batch automatic feeding and discharging can be realized, and the production efficiency is obviously improved compared with the traditional manual operation feeding and discharging; secondly, the wafer transfer mechanism comprises a wafer transfer manipulator arranged between the tray circulating mechanism and the wafer detection mechanism, the wafer transfer manipulator comprises a loading side IC pick-and-place manipulator 7 and an unloading side IC pick-and-place manipulator 8, and the whole automatic production of the whole machine can be realized by matching the loading side IC pick-and-place manipulator 7 with the unloading side IC pick-and-place manipulator 8; an IC preheating area 9 is also arranged on the machine table 1; specifically, three tracks are arranged on the disc inlet track 2 and the disc outlet track 3.

In the present invention, unless otherwise explicitly specified or limited, the first feature "on" or "under" the second feature may be directly contacting the first feature and the second feature or indirectly contacting the first feature and the second feature through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lower level than the second feature. In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example.

Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (7)

1. The utility model provides a high-efficient wafer separator of binary channels, includes the board and installs the sorting device on the board, its characterized in that: the sorting device comprises a tray circulating mechanism, a wafer transferring mechanism and a wafer detecting mechanism, wherein the tray circulating mechanism comprises a plurality of tray inlet tracks and tray outlet tracks which are arranged on the machine platform in parallel and equal in quantity, and the wafer detecting mechanism comprises a wafer trolley mechanism and a crimping testing device matched with the wafer trolley mechanism.

2. The dual channel high efficiency wafer sorter of claim 1 wherein: the wafer trolley mechanism comprises a double-station wafer trolley, and the crimping test device comprises two groups of IC test sensors matched with the double-station wafer trolley and a double-station crimping head matched with the two groups of IC test sensors.

3. The dual channel high efficiency wafer sorter of claim 1 wherein: the top end of the tray inlet track is provided with a tray inlet stacking rack, and the top end of the tray outlet track is provided with a tray outlet stacking rack.

4. The dual channel high efficiency wafer sorter of claim 1 wherein: the wafer transfer mechanism comprises a wafer transfer manipulator arranged between the tray circulating mechanism and the wafer detection mechanism.

5. The dual channel high efficiency wafer sorter of claim 4 wherein: the wafer transfer robot comprises a loading side IC pick-and-place robot and an unloading side IC pick-and-place robot.

6. The dual channel high efficiency wafer sorter of claim 1 wherein: an IC preheating area is also arranged on the machine table.

7. The dual channel high efficiency wafer sorter of claim 1 wherein: the disc inlet track and the disc outlet track are provided with three tracks.

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