TWI518342B - Electronic component testing equipment and its detection method - Google Patents

Description

Electronic component detecting device and detecting method thereof

The invention relates to an electronic component detecting device and a detecting method thereof, in particular to a detecting device and a detecting method suitable for testing an integrated circuit.

With the booming demand in the semiconductor manufacturing industry, in addition to pursuing the productivity efficiency of manufacturing equipment, semiconductor test equipment manufacturers are also eager to develop toward the trend of improving test efficiency. However, semiconductor test equipment manufacturers are aiming to improve their test efficiency by including shortening test time, reducing idle time, and reducing the number of transfer times or transfer times of wafers.

Moreover, the only one of the many factors mentioned above is probably the length of the test, because the test time is related to the test project and the test process. However, once the test project and the test process have been determined, the test time is almost unadjustable. Therefore, semiconductor test equipment manufacturers are mostly improving toward reducing the idle time of the test device and reducing the number of transfer times or transfer times of the wafer.

For example, as stated in the case of the Republic of China Announcement No. I372135 "Testing Device for Electronic Component Testing and Sorting Machines", its main purpose is also to shorten the waiting time for the idleness of the test device. Among them, the hair Ming patents mainly rely on the electronic components with short test time, which reduces the standby time of the test station by increasing the number of each transfer, thereby increasing the machine capacity utilization rate.

However, when it is used for a test method with a long test time, such as SYSTEM LEVEL TEST, and the technical means contained in the above invention patents cannot be applied, once the above technology is employed, the wafer pick-and-place device will be caused, and The waiting time for the transfer device to be idle is too long, which seriously affects the capacity utilization rate.

Provided is an electronic component detecting device and a detecting method thereof, which are suitable for testing electronic components with a long time, and can significantly reduce the idle waiting time including the test device, the pick and place device, the main purpose of the present invention, and the transfer shuttle. In order to effectively improve production efficiency.

In order to achieve the above object, an electronic component detecting method of the present invention comprises the following steps: First, a transfer shuttle moves a feed receiving portion of a transfer shuttle in a feeding zone, and a feeding and receiving The device transports at least one electronic component to be tested to a feeding receiving portion of a transfer shuttle from a feeding carrier, and the discharging receiving portion of the moving shuttle is located in a test area, at least one of the loading arms Moving at least one of the electronic components on the detecting device to the discharging receiving portion; then, moving the shuttle to move the discharging receiving portion of the moving shuttle into a discharge area, and discharging The pick-and-place device carries out at least one electronic component to the discharge carrier from the discharge receiving portion; further, the transfer shuttle moves the feed bearing into the feeding zone, and the feeding and receiving device advances The material carrier tray carries at least one electronic component to be tested to fill the feeding receiving portion; then, the moving shuttle moves to move the discharging receiving portion into and out In the material area, the discharge pick-and-place device carries out at least one complete electronic component to empty the discharge receiving portion; and the feeding receiving portion is located in the test area, and at least one picking arm will feed all of the feeding portion The electronic component to be tested is transported to a testing device for testing.

Accordingly, the transfer shuttle of the present invention utilizes the feed, the discharge pick-and-place device for the time slot of each handling process, and the time slot for detecting on the detecting device, to and from the feeding zone, the test zone, and In the discharge section, multi-batch filling or emptying of electronic components can fully utilize and greatly reduce the idle waiting time of the feeding, discharging and pick-and-place devices, and the pick-and-place arm, thereby significantly improving the productivity of the test. In addition, the electronic component detecting method of the present invention can reduce the equipment requirement and reduce the equipment cost by carrying out the test or the completion of the electronic component in multiple batches in response to the detection condition requiring a long test time.

Preferably, the number of electronic components to be tested carried by the feeding bearing portion of the electronic component detecting method of the present invention and the number of electronic components to be tested carried by the discharging receiving portion can be respectively a feeding and picking device, And the multiple of the number of electronic components carried by the discharge pick-and-place device. In other words, the feeding and unloading device can carry the filling of the feeding and receiving part in batches, and the discharging and picking and placing device can carry out the emptying of the electronic components in the discharging and receiving part in batches, thereby reducing the equipment demand and reducing the equipment cost. .

In addition, an electronic component detecting method of the present invention may use a two pick and place arm, which may include a first pick and place arm and a second pick and place arm; wherein the first pick and place arm and the second pick and place arm are alternately executed. Carrying all the electronic components to be tested on the feeding receiving part to a detecting device for testing, and moving at least one completed electronic component on the detecting device to the discharging device Ministry. In addition, in the electronic component detecting method provided by the present invention, when the first pick-and-place arm performs the test of transporting all the electronic components to be tested on the feeding receiving portion to a detecting device, the second pick-and-place arm Performing to move at least one of the completed electronic components on the detecting device to the discharge receiving portion. Accordingly, the present invention can be provided with a plurality of pick and place arms to improve test efficiency and reduce the idle time of waiting for the transfer of electronic components.

An electronic component detecting device of the present invention mainly comprises a feeding zone, a discharging zone, a testing zone, and a transfer shuttle. Wherein, a feeding carrier tray and a feeding pick-and-place device are arranged in the feeding zone; a discharging carrier tray and an discharging pick-and-place device are arranged in the discharging zone; a detecting device is arranged in the testing zone, and at least A take-off arm; the transfer shuttle system moves between the feed zone, the discharge zone, and the test zone. Wherein, the test zone is located between the feed zone and the discharge zone; and the feed pick-and-place device is in the feed zone and is used to carry at least one electronic component to be tested between the feed carrier and the transfer shuttle The discharge pick-and-place device is attached to the discharge area and is used for carrying at least one electronic component to be tested between the discharge carrier and the transfer shuttle. In addition, at least one access arm is attached to the test area, and is configured to carry at least one electronic component to be tested and at least one electronic component to be tested between the detecting device and the transfer shuttle.

The transfer shuttle of the electronic component detecting device of the present invention may include a feeding receiving portion and a discharge receiving portion, and the feeding receiving portion moves between the feeding region and the testing zone, and the discharging receiving portion Move between the discharge area and the test area. In other words, the present invention can use a single transfer shuttle to and from the feeding zone, the discharge zone, and the test zone, thereby further improving the transfer efficiency and reducing the equipment cost. In addition, the feed bearing unit and the discharge receiving unit The number of electronic components to be tested and the number of electronic components to be tested carried by the department are respectively a multiple of the quantity that can be transported by the feeding and unloading device and the discharging device.

Moreover, in the electronic component detecting device of the present invention, the feeding pick-and-place device can carry at least one electronic component to be tested to the feeding receiving portion, and at least one picking arm transfers the entire completed electronic component on the detecting device. After the loading and unloading portion of the shuttle is transferred; the transfer shuttle moves and the discharge receiving portion moves into the discharge area, and the discharge pick-and-place device carries out at least one electronic component to the discharge carrier. Then, the transfer shuttle moves and the feed receiving portion can be moved into the feeding zone, and the feeding pick-and-place device carries at least one electronic component to be tested to fill the feeding receiving portion. Furthermore, the transfer shuttle moves and the discharge receiving portion moves into the discharge area, and the discharge pick-and-place device carries out at least one of the electronic components to be emptied to empty the discharge receiving portion, and at least one of the take-up arms will feed All the electronic components to be tested on the mounting part are transferred to the detecting device for testing.

Briefly, the electronic component detecting device of the present invention can utilize the detection time of the electronic component for a long time, and can utilize the neutral time of the detection time of each batch of electronic components, and the neutral of the feeding and discharging device in each handling process. The multi-batch loading and receiving unit and the multi-batch emptying and receiving unit are used to reduce the idle waiting time between the devices and greatly improve the detection efficiency.

Preferably, at least one of the pick and place arms of the electronic component detecting device of the present invention may include a first pick and place arm and a second pick and place arm, and the first pick and place arm and the second pick and place arm may be alternately The operation transfers all the electronic components to be tested on the feeding receiving part to the detecting device for testing, and transfers all the tested electronic components on the detecting device to the discharging of the transfer shuttle. Supporting department. Accordingly, the present invention can use the two pick-and-place arms to alternately transfer electronic components for testing, which can also significantly reduce the idle time of the detecting device and improve the testing efficiency. In addition, the feeding zone, the testing zone, and the discharging zone of the electronic component detecting device of the present invention are arranged substantially in a straight line, whereby the moving path of the transfer shuttle can be shortened and simplified to improve the detection efficiency.

[this creation]

2‧‧‧Transporting shuttle

21‧‧‧Feeding and Holding Department

22‧‧‧Disburring Department

3‧‧‧Feeding tray

4‧‧‧Feed pick and place device

5‧‧‧Output carrier tray

6‧‧‧Feed pick and place device

7‧‧‧Remove arm

71‧‧‧First take-off arm

72‧‧‧Second access arm

8‧‧‧Detection device

C1‧‧‧electronic components to be tested

C2‧‧‧Complete electronic components

Ia‧‧‧feeding area

Oa‧‧‧ discharge area

Ta‧‧ test area

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a top plan view of a device in accordance with a preferred embodiment of the present invention.

Figure 2 is a front elevational view of a device in accordance with a preferred embodiment of the present invention.

Figure 3 is a flow chart of a test of a preferred embodiment of the present invention.

Before the electronic component detecting device and the detecting method thereof of the present invention are described in detail in the present embodiment, it is to be noted that in the following description, like elements will be denoted by the same reference numerals.

Please refer to FIG. 1 and FIG. 2 simultaneously. FIG. 1 is a schematic plan view of a device according to a preferred embodiment of the electronic component detecting device of the present invention, and FIG. 2 is a front view of a device of a preferred embodiment of the electronic component detecting device of the present invention. See the schematic. As shown in the figure, the electronic component detecting device of the present embodiment mainly includes three regions, a feeding region Ia, a discharging area Oa, and a testing area Ta. The three areas of the embodiment are virtual layouts. The area has no physical separation. However, in other embodiments of the present invention, there may be areas where there is actual separation. For example, when performing high and low temperature tests, the three areas may be chambers having temperature regulation functions.

As shown in the figure, the feed zone Ia, the test zone Ta, and the discharge zone Oa are arranged substantially in a straight line on the machine table, and the test zone Ta is located. Between the feed zone Ia and the discharge zone Oa, the transfer path can be shortened and simplified to improve the detection efficiency. Furthermore, a feed carrier tray 3 and a feed pick-and-place device 4 are disposed in the feed zone Ia, and a discharge carrier tray 5 and a discharge pick-and-place device 6 are disposed in the discharge zone Oa, and the test is performed. A detecting device 8 and a second pick-and-place arm 7 are disposed in the area Ta.

In addition, a transfer shuttle 2 moves between the feeding zone Ia, the discharge zone Oa, and the test zone Ta, and the transfer shuttle 2 includes a feed receiving portion 21 and a discharge receiving portion 22 . In detail, the feed receiving portion 21 of the transfer shuttle 2 can be moved between the feeding zone Ia and the test zone Ta, and the discharge receiving section 22 can be moved between the discharge zone Oa and the test zone Ta. . That is, when the feed receiving portion 21 is located in the feeding zone Ia, the discharge receiving portion 22 is located in the testing zone Ta; on the other hand, when the feeding receiving portion 21 is located in the testing zone Ta, the discharging bearing The portion 22 is located in the discharge area Oa. Accordingly, in this embodiment, a single transfer shuttle 2 is used to travel between the feeding area Ia, the discharge area Oa, and the test area Ta, and each of the receiving parts only stops at the starting point and the ending point. Simplify the transfer method to improve transfer efficiency and save installation and maintenance costs on hardware devices.

Furthermore, as shown in FIG. 1 and FIG. 2, the feed pick-and-place device 4 carries the electronic component C1 to be tested between the feed carrier tray 3 and the transfer shuttle 2 in the feed zone Ia. The discharge pick-and-place device 6 transports the electronic component C2 between the discharge carrier 5 and the transfer shuttle 2 in the discharge area Oa. Moreover, the second pick-and-place arm 7 includes a first pick-and-place arm 71 and a second pick-and-place arm 72 for carrying the electronic component C1 to be tested and the electronic component C2 for testing in the test area Ta, respectively. Between shuttles 2 .

In this embodiment, the feeding and picking and placing device 4 can take four times at a time. The electronic component C1 to be tested is placed, and the discharge pick-and-place device 6 can also take four test electronic components C2. For example, the feeding receiving portion 21 and the discharging receiving portion 22 of the transfer shuttle 2 can respectively accommodate eight electronic components to be tested C1 and the electronic component C2 to be tested, and the first pick-and-place arm 71 and the second The pick-and-place arm 72 can also transfer eight electronic components each time, and the number of electronic components detectable per batch on the detecting device 8 is also eight.

In other words, the number of electronic components that can be detected in each batch on the detecting device 8 of the embodiment, and the number of electronic components respectively carried by the feeding and receiving portion 21 and the discharging and receiving portion 22 are the feeding and receiving devices. 4. Two times the amount that can be handled by the discharge pick-and-place device 6. However, the present invention is not limited to two times, and may be adjusted to increase or decrease its multiple according to actual conditions. However, the significance of this design is that the batch batching or emptying can effectively utilize the idle waiting time and reduce the need for hardware equipment setting, for example, the feeding pick-and-place device 4 and the discharging pick-and-place device can be reduced. 6 The number of pick-up heads.

Please refer to FIG. 3 together. FIG. 3 is a test flow chart of a preferred embodiment of the present invention. The entire inspection process is described in detail below. Specifically, the present embodiment is described by a certain cycle in a continuous test, that is, a batch of electronic components have been tested as a starting state.

First, the transfer shuttle 2 moves to place the feed receiving portion 21 in the feeding zone Ia, and the feeding pick-and-place device 4 carries four electronic components to be tested C1 to the transfer shuttle 2 from a feeding carrier 3 At the same time, the second pick-and-place arm 72 moves the eight electronic components C2 on the detecting device 8 to the discharge receiving portion 22, that is, step S100 in FIG. Among them, the first time The pick-and-place arm 71 carries the previous batch of electronic component C1 to be tested to the detecting device 8 for testing.

Then, the transfer shuttle 2 moves to move the discharge receiving portion 22 of the transfer shuttle 2 into the discharge area Oa, and the discharge pick-and-place device 6 first carries out four completed electronic components from the discharge receiving portion 22. The component C2 to the discharge carrier 5, that is, step S105 of Fig. 3. However, at this time, the second pick-and-place arm 72 stays in place for the next batch of electronic components C1 to be tested to arrive, and the electronic component C1 to be tested sucked on the first pick-and-place arm 71 is still tested on the detecting device 8. .

Furthermore, the transfer shuttle 2 moves to move the feed receiving portion 21 into the feed zone Ia again, and the feed pick-and-place device 4 carries the four electronic components to be tested C1 from the feed carrier 3 and fills it up. The material holding portion 21, that is, step S110 of Fig. 3 is used. Similarly, at this time, the second pick-and-place arm 72 remains in the same place waiting for the next batch of electronic components to be tested C1 to arrive, and the electronic component C1 to be tested sucked on the first pick-and-place arm 71 is still on the detecting device 8. carry out testing.

Next, the transfer shuttle 2 moves to move the discharge receiving portion 22 into the discharge area Oa, and the discharge pick-and-place device 6 carries out the remaining four remaining electronic components C2 to empty the discharge receiving portion 22. On the other hand, the feed receiving portion 21 is located in a test area Ta, and the second pick-and-place arm 72 carries all the electronic components C1 to be tested on the feed receiving portion 21 to the detecting device 8 for testing, that is, the first Step S115 of Figure 3. At this time, the first pick-and-place arm 71 carries the measurement electronic component C2 to the upper side of the transfer shuttle 2, and waits for the next step.

In view of the above, the present invention can utilize the detection time of the electronic components for a long time, and can utilize the neutral time of the detection time of each batch of electronic components, and the neutrals of the feeding and discharging devices 4 and 6 in each handling process. Multi-batch loading and receiving unit 21, and multiple batches of emptying and receiving The portion 22 reduces the waiting time for idle between devices and greatly improves the detection efficiency. In addition, because the batch batching or emptying of the present invention can also reduce the requirement of setting the hardware device, for example, the number of the suction heads on the feeding and receiving device 4 and the discharging device 6 can be reduced, so that it can be effective. Reduce equipment costs.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

2‧‧‧Transporting shuttle

21‧‧‧Feeding and Holding Department

22‧‧‧Disburring Department

3‧‧‧Feeding tray

4‧‧‧Feed pick and place device

5‧‧‧Output carrier tray

6‧‧‧Feed pick and place device

7‧‧‧Remove arm

71‧‧‧First take-off arm

72‧‧‧Second access arm

8‧‧‧Detection device

C1‧‧‧electronic components to be tested

C2‧‧‧Complete electronic components

Ia‧‧‧feeding area

Oa‧‧‧ discharge area

Ta‧‧ test area

Claims (9)

An electronic component detecting method comprises the following steps: (A) a feeding support part of a transfer shuttle is located in a feeding zone, and a feeding pick-and-place device carries at least one electronic device to be tested from a feeding carrier Disposing the component to the feeding bearing portion of the transfer shuttle; one of the loading shuttles of the transfer shuttle is located in a test zone, and at least one picking arm is at least one of the detecting devices in the test zone The electronic component is moved to the discharge receiving portion; (B) the transfer shuttle moves to move the discharge receiving portion into a discharge area, and a discharge pick-and-place device is driven from the discharge receiving device Moving the at least one electronic component to a discharge carrier; (C) moving the shuttle to move the feed bearing into the feeding zone, the feeding and receiving device from the feeding Carrying the at least one electronic component to be tested to fill the feeding receiving portion; and (D) moving the shuttle to move the discharging receiving portion into the discharging area, the discharging and picking device Unloading the at least one electronic component to empty the discharge receiving portion; the feeding receiving portion is located in the testing area, and the at least one picking arm feeds the feeding The opposing portion of the entire electronic device to be tested is transported to the detecting device for testing. The electronic component detecting method of claim 1, wherein the number of the electronic components to be tested carried by the feeding receiving portion and the number of the completed electronic components carried by the discharging receiving portion are respectively the feeding The pick-and-place device and the multiple of the number of electronic components carried by the discharge pick-and-place device. The electronic component detecting method of claim 1, which uses a second pick and place arm, which includes a first pick and place arm and a second pick and place arm; wherein the first A take-off arm and the second pick-and-place arm alternately perform the step (A) and the step (D). The electronic component detecting method of claim 3, wherein the second pick and place arm performs the step (D) when the first pick and place arm performs the step (A). An electronic component detecting device comprises: a feeding zone, which is provided with a feeding carrier tray and a feeding pick-and-place device; a discharging area, which is provided with a discharging carrier tray and a discharging device a test area having a detecting device and at least one picking arm disposed between the feeding zone and the discharging zone; and a transfer shuttle including a feeding carrier And a discharge receiving portion, the feeding receiving portion is moved between the feeding region and the testing zone, and the discharging receiving portion moves between the discharging zone and the testing zone; wherein The feeding and picking device is configured to carry at least one electronic component to be tested between the feeding carrier and the transfer shuttle in the feeding zone and fill the feeding receiving portion in batches; The material pick-and-place device is configured to carry at least one electronic component to be tested between the discharge carrier and the transfer shuttle in the discharge area, and empty the discharge receiving portion in batches; the at least one take-up arm Carrying the at least one electronic component to be tested and the at least one electronic component to be tested in the test area Between the shuttle car, the at least one pick and place arm of the transfer-based transfer each shuttle car and the detecting means of all the at least one electronic component under test, and measuring the at least one electronic component finished. The electronic component detecting device of claim 5, wherein the quantity of the electronic component to be tested and the number of the electronic component to be tested respectively carried by the feeding receiving portion and the discharging receiving portion are respectively the feeding The pick-and-place device and the multiple of the number of the pick-and-place device. The electronic component detecting device of claim 6, wherein the feeding and unloading device transports the at least one electronic component to be tested to the feeding receiving portion, and the at least one picking arm completely completes the detecting device After the electronic component is transferred to the discharge receiving portion of the transfer shuttle; the transfer shuttle moves and the discharge receiving portion moves into the discharge area, and the discharge pick-and-place device moves out of the at least one end Measuring the electronic component to the discharge carrier; the transfer shuttle moves and the feed bearing portion moves into the feed zone, and the feed pick-and-place device carries the at least one electronic component to be tested to fill the feed a loading portion; the transfer shuttle moves and the discharge receiving portion moves into the discharge area, and the discharge pick-and-place device carries out the at least one electronic component to empty the discharge receiving portion, and the at least A pick-and-place arm transfers all of the electronic components to be tested on the feed receiving portion to the detecting device for testing. The electronic component detecting device of claim 7, wherein the at least one picking arm comprises a first picking arm and a second picking arm, and the first picking arm and the second picking arm are alternately Ground operation of transferring all of the electronic components to be tested on the feed receiving portion to the detecting device for testing, and transferring all of the measured electronic components on the detecting device to the transfer trolley Material bearing department. The electronic component detecting device of claim 5, wherein the feed zone, the test zone, and the discharge zone are substantially in a straight line configuration.