KR102642099B1 - Package cutting and sorting system with air dryer - Google Patents

Abstract

A package cutting and sorting system having an air drying unit is disclosed, and the package cutting and sorting system having an air drying unit according to an embodiment of the present application includes an input module provided to supply a semiconductor strip, and the semiconductor strip into a plurality of packages. a cutting module for cutting, a washing module for cleaning the plurality of packages, a drying module including an air knife unit with a slit for discharging a dry air stream to dry the plurality of washed packages, and a space on which the plurality of dried packages are seated. A table, a first picker module for transferring the plurality of packages from the drying module to the table, a second picker module provided for gripping and transferring at least some of the plurality of packages seated on the table, and the plurality of packages. It may include a classification module having an inspection module that inspects and a receiving space in which each of the plurality of packages is accommodated according to an inspection result by the inspection module.

Description

Package cutting and sorting system with air dryer {PACKAGE CUTTING AND SORTING SYSTEM WITH AIR DRYER}

This application relates to a package cutting and sorting system equipped with an air dryer.

The package manufacturing system includes a cutting process of cutting strips on which a plurality of packages are formed into individual packages, a washing process of washing the packages cut in the cutting process, a drying process of drying the packages washed in the washing process, and defects in the dried packages. Semiconductor packages can be manufactured by sequentially performing a package inspection process to check for defects and an offload process to classify packages that passed the defect inspection and those that did not, depending on the inspection results.

However, in the conventional package manufacturing system, individual modules that perform the above essential processes are located sporadically, resulting in inefficiencies in the worker's work flow, reduced work throughput, and problems such as constant occurrence of work errors. Therefore, there is a need to develop a new package manufacturing system and singulation system to secure improved work efficiency while minimizing the work error rate.

The technology behind this application is disclosed in Korean Patent Publication No. 10-2185074.

The purpose of the present application is to solve the problems of the prior art described above, and to provide a package cutting and sorting system equipped with an air dryer that can minimize work errors and improve work efficiency.

However, the technical challenges sought to be achieved by the embodiments of the present application are not limited to the technical challenges described above, and other technical challenges may exist.

As a technical means for achieving the above-described technical problem, a package cutting and sorting system equipped with an air dryer according to an embodiment of the present application includes an input module provided to supply a semiconductor strip, and cutting the semiconductor strip into a plurality of packages. a cutting module that cleans the plurality of packages, a washing module that cleans the plurality of packages, a drying module that includes an air knife unit with a slit for discharging a dry air stream to dry the plurality of washed packages, a table on which the plurality of dried packages are placed, A first picker module that transfers the plurality of packages from the drying module to the table, a second picker module that is provided to grip and transfer at least some of the plurality of packages seated on the table, and inspect the plurality of packages. It may include an inspection module and a classification module having a receiving space in which each of the plurality of packages is accommodated according to an inspection result by the inspection module.

In addition, the drying module may include a loading portion on which the plurality of cleaned packages are mounted, and a flip portion disposed on an upper side of the loading portion and rotatably provided to hold the plurality of packages mounted on the loading portion. .

Additionally, the air knife unit may include a first air knife unit disposed relative to the loading unit to discharge the dry air stream, and a second air knife unit disposed relative to the flip unit to discharge the dry air stream.

Additionally, the first air knife unit may discharge the dry airflow toward the upward direction.

Additionally, the second air knife unit may discharge the dry air stream in a downward direction.

Meanwhile, the package cutting and sorting system according to an embodiment of the present application includes an input module provided to supply a semiconductor strip, a cutting module for cutting the semiconductor strip into a plurality of packages, a cleaning module for cleaning the plurality of packages, A drying module for drying a plurality of washed packages, a table on which the plurality of dried packages are placed, a first picker module for transferring the plurality of packages from the drying module to the table, and the plurality of packages placed on the table. a second picker module equipped to hold and transport at least a portion of the plurality of packages, an inspection module to inspect the plurality of packages, and a classification module including a receiving space in which each of the plurality of packages is accommodated according to an inspection result by the inspection module. It can be included.

Additionally, the second picker module may transfer each of the plurality of packages to the receiving space based on the inspection result.

Additionally, the inspection module may derive defect presence information for classifying each of the plurality of packages as a normal package or a defective package and classification type information for the defect type of the package classified as a defective package as the inspection result.

Additionally, the accommodation space provided in the classification module may include a plurality of accommodation spaces according to the defect presence information and the classification type information.

Additionally, at least a portion of the plurality of receiving spaces may be formed in a tray on which the sorted packages are placed.

In addition, the input module may include a strip recovery unit that determines whether the semiconductor strip needs to be recovered, and causes the semiconductor strip to be recovered or inputs the semiconductor strip into the cutting module according to the result of the determination as to whether the semiconductor strip needs to be recovered. You can.

In addition, the input module may include a smart alignment unit that transfers the semiconductor strip to the cutting module and aligns the transfer direction of the semiconductor strip according to the result of sensing the input position of the semiconductor strip.

In addition, the drying module includes a loading unit on which the plurality of washed packages are placed, a flip unit disposed on an upper side of the loading unit and rotatably provided to hold the plurality of packages mounted on the loading unit, and the loading unit. and an air knife part interposed between the flip part and having a slit for discharging a dry air stream.

Meanwhile, a package cutting and sorting system including a reject bin according to an embodiment of the present application includes an input module provided to supply a semiconductor strip, a cutting module for cutting the semiconductor strip into a plurality of packages, and the plurality of packages. A washing module for washing, a drying module for drying the plurality of washed packages, a table on which the plurality of dried packages are placed, a first picker module for transferring the plurality of packages from the drying module to the table, and a first picker module for transferring the plurality of packages from the drying module to the table. A second picker module provided to hold and transport at least a portion of the plurality of packages, an inspection module to inspect the plurality of packages, and a plurality of packages to receive each of the plurality of packages according to an inspection result by the inspection module. It may include a classification module including a reject bin that partitions the receiving space.

Additionally, the reject bin may partition the plurality of receiving spaces so that the defective packages are classified and placed according to the classification type information.

Additionally, the normal package may be accommodated in at least some of the plurality of accommodation spaces.

Additionally, the second picker module may transport the package held based on the inspection result so that it is seated in one of the plurality of receiving spaces.

Meanwhile, a package cutting and sorting system that provides a smart alignment function according to an embodiment of the present application includes a direction detection unit that senses the insertion position of the semiconductor strip in which the prepared semiconductor strip is loaded and taken out from the magazine, and the direction. An input module having a smart alignment unit including a strip adjustment unit that changes the transport direction of the semiconductor strip to match a preset reference insertion position according to the sensing result of the detection unit, a cutting module that cuts the semiconductor strip into a plurality of packages, A washing module for washing a plurality of packages, a drying module for drying the plurality of washed packages, a table on which the plurality of dried packages are placed, and a first picker module for transferring the plurality of packages from the drying module to the table. , a second picker module provided to grasp and transport at least some of the plurality of packages seated on the table, an inspection module to inspect the plurality of packages, and each of the plurality of packages according to the inspection result by the inspection module. It may include a classification module having an accommodating space.

Additionally, the strip adjusting unit may hold the semiconductor strip and rotate the held semiconductor strip according to the difference between the reference insertion position and the sensed insertion position.

Additionally, the reference insertion position may be set in advance in consideration of the cutting pattern of the cutting module for the semiconductor strip.

Additionally, the classification module may include a reject bin that divides a plurality of receiving spaces in which each of the plurality of packages is accommodated according to an inspection result by the inspection module.

Meanwhile, a package cutting and sorting system that provides a strip backward function according to an embodiment of the present application determines whether the semiconductor strip supplied from a magazine loaded with prepared semiconductor strips needs to be recovered, and determines whether the recovery is necessary. an input module having a strip recovery unit that selectively inputs the semiconductor strip according to a determination result, a cutting module that cuts the semiconductor strip into a plurality of packages, a cleaning module that cleans the plurality of packages, and a plurality of the washed packages. A drying module for drying, a table on which the plurality of dried packages are placed, a first picker module for transferring the plurality of packages from the drying module to the table, and holding at least some of the plurality of packages placed on the table. It may include a second picker module provided for transport, an inspection module for inspecting the plurality of packages, and a classification module having a receiving space in which each of the plurality of packages is accommodated according to an inspection result by the inspection module.

In addition, the strip recovery unit recovers the semiconductor strip so that abnormal strips among the semiconductor strips determined to be in need of recovery are accommodated in the magazine, and normal strips among the semiconductor strips determined to be unnecessary for recovery are input into the cutting module. can do.

In addition, the strip recovery unit may include a magazine seating module having a plurality of trays for loading a first magazine in which the semiconductor strip before the need for recovery is determined and a second magazine in which the abnormal strip is received. You can.

In addition, the strip recovery unit may include a magazine holding module that is provided to hold the first magazine or the second magazine and transfer the held magazine to one of the plurality of trays.

In addition, the strip recovery unit may include a strip inspection module in which the semiconductor strip taken out from the first magazine is seated and determines whether the recovery is necessary using identification information and shape information of the seated semiconductor strip. .

The above-described means of solving the problem are merely illustrative and should not be construed as intended to limit the present application. In addition to the exemplary embodiments described above, additional embodiments may be present in the drawings and detailed description of the invention.

According to the means for solving the problem of the present application described above, it is possible to provide a package cutting and sorting system equipped with an air dryer that can minimize work errors and improve work efficiency.

However, the effects that can be obtained herein are not limited to the effects described above, and other effects may exist.

1 is a schematic conceptual plan view of a package cutting and sorting system according to an embodiment of the present application.
Figure 2 is a block diagram for explaining the schematic operation flow of a package cutting and sorting system according to an embodiment of the present application.
Figure 3 is a perspective view showing a strip recovery unit of a package cutting and sorting system according to an embodiment of the present application.
Figure 4 is a perspective view of a strip recovery unit according to an embodiment of the present application to explain that the first clamp unit is located in the ready position.
Figure 5 is a perspective view showing the strip inspection module according to an embodiment of the present application, viewed obliquely from the inside.
Figure 6 is a perspective view of the strip recovery unit according to an embodiment of the present application, viewed obliquely from the outside.
Figure 7 is a perspective view with a portion of the strip recovery unit according to an embodiment of the present application removed.
8 and 9 are schematic conceptual diagrams for explaining the operation of the gripper of the strip recovery unit according to an embodiment of the present application.
Figure 10 is a perspective view showing a portion of the strip recovery unit according to an embodiment of the present application viewed obliquely from the outside.
Figure 11 is a perspective view showing the smart alignment part of the package cutting and sorting system according to an embodiment of the present application.
12 and 13 are diagrams for explaining the drying module of the package cutting and sorting system according to an embodiment of the present application.
14 and 15 are diagrams showing a reject bin of a classification module of a package cutting and sorting system according to an embodiment of the present application.
Figures 16 and 17 are diagrams for explaining a package loading method using a tray of a classification module of a package cutting and sorting system according to an embodiment of the present application.

Below, with reference to the attached drawings, embodiments of the present application will be described in detail so that those skilled in the art can easily implement them. However, the present application may be implemented in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present application in the drawings, parts that are not related to the description are omitted, and similar reference numerals are assigned to similar parts throughout the specification.

Throughout this specification, when a part is said to be “connected” to another part, this means not only “directly connected” but also “electrically connected” or “indirectly connected” with another element in between. "Includes cases where it is.

Throughout this specification, when a member is said to be located “on”, “above”, “at the top”, “below”, “at the bottom”, or “at the bottom” of another member, this means that a member is located on another member. This includes not only cases where they are in contact, but also cases where another member exists between two members.

Throughout the specification of the present application, when a part "includes" a certain component, this means that it may further include other components rather than excluding other components unless specifically stated to the contrary.

This application relates to a package cutting and sorting system equipped with an air dryer.

FIG. 1 is a schematic conceptual plan view of a package cutting and sorting system according to an embodiment of the present application, and FIG. 2 is a block diagram for explaining a schematic operational flow of the package cutting and sorting system according to an embodiment of the present application.

Referring to Figures 1 and 2, the package cutting and sorting system 1 (hereinafter referred to as 'this system 1') according to an embodiment of the present application includes an input module 10 and a cutting module 20. , it may include a washing module 30, a drying module 40, a first picker module 50, a table 60, a second picker module 70, an inspection module 80, and a classification module 90. .

First, the input module 10 of the system 1 may be equipped to supply a semiconductor strip. Specifically, the magazine loaded with the semiconductor strip may be loaded on the magazine seating module 111 of the input module 10, and the magazine loaded on the magazine seating module 111 may be held by the magazine gripping module 112 and placed in the ready position. The semiconductor strip moved to and unloaded from the magazine moved to the preparation position may be transferred to the strip inspection module 113. Additionally, the semiconductor strip transferred to the strip inspection module 113 may be transferred to the chuck table 13 by the smart alignment unit 12 equipped with a strip picker (not shown). For reference, among the semiconductor strips introduced into the system 1 by the input module 10, the recovery strip corresponding to the semiconductor strip judged to be defective or in need of additional processing before being transferred to the cutting module 20, which will be described later. Semiconductor strips that can be returned to the magazine seating module 111 and are not determined to be collection strips can be transferred to the cutting module 20 through the smart alignment unit 12.

Additionally, the system 1 may include a cutting module 20 that cuts the semiconductor strip into packages. The semiconductor strip transferred to the chuck table 13 by the smart alignment unit 12 may be transferred to the cutting module 20 and cut (separated) into individual packages in the cutting module 20.

Additionally, the system 1 may include a cleaning module 30 that cleans the cut package. That is, the package formed by cutting the semiconductor strip in the cutting module 20 can be transferred to the cleaning module 30 and cleaned.

Additionally, the system 1 may include a drying module 40 that dries the cleaned package. The package washed in the cleaning module 30 may be transferred to the drying module 40 and dried.

Additionally, the system 1 may include a table 60 on which the dried package is placed and a first picker module 50 that transfers the dried package from the drying module 40 to the table 60. The package dried in the drying module 40 may be transferred to the table 60 by the first picker module 50. For example, the first picker module 50 may be a grid picker.

Additionally, the second picker module 70 may be provided to grasp and transfer at least some of the plurality of packages seated on the table 60. In this regard, the table 60 on which a plurality of packages are placed is positioned between the position where the dried package is supplied from the first picker module 50 and the position where the second picker module 70 can hold the mounted package. It may be provided to enable reciprocating movement (for example, moving back and forth from the 12 o'clock direction to the 6 o'clock direction based on FIG. 1).

Additionally, the system 1 may include an inspection module 80 that inspects the package for defects. The package can be transferred to the inspection module 80 to determine whether it is defective.

In addition, the system 1 may include a classification module 90 having a receiving space in which each of a plurality of packages is accommodated according to the inspection result by the inspection module 80.

In addition, in relation to this, the second picker module 70 may operate to transfer each of a plurality of packages to one of a plurality of receiving spaces separately formed in the classification module 90 according to the inspection result of the inspection module 80. .

For example, the classification module 90 includes a tray 91 and a reject box that form a receiving space for receiving each package classified as a normal (good) package or an abnormal (defective) package by the inspection module 80. It may include at least one of the bins 92. For example, good packages may be loaded on some of the plurality of trays (91a, 91b, 91c), and packages classified as defective packages may be loaded on the remaining trays of the plurality of trays (91a, 91b, 91c). , It is not limited to this, and according to the operation method of the system 1, good quality packages are transferred to the tray 91 and loaded, and defective packages are transferred to the reject bin 92, which will be described later, and are placed in the reject bin 92. ) The defective packages may be divided and loaded into each of the plurality of receiving spaces formed in the package according to the type of defect determined.

Meanwhile, the tray unit (not shown) on which the tray 91 on which package loading is completed can be moved and loaded on one of the plurality of tray loading units 930a, 930b, and 930c, and a new tray can be placed in the tray unit. You can.

According to this system 1, since the package can be manufactured by one automated system, individual modules that perform the conventional manufacturing process are located sporadically, causing inefficiency in the worker's work flow or reducing work throughput. Compared to the package manufacturing system, where work errors consistently occur, the work error rate can be minimized and improved work efficiency can be secured.

Below, the structure and operation of each sub-module that makes up this system will be described in detail. First, the input module 10 will be described.

For reference, in relation to the description of the input module 10 below, terms related to direction or position (upper side, lower side, one side, other side, inside, outside, etc.) refer to the arrangement status of each component shown in FIGS. 3 to 11. It is set based on . For example, based on what is shown in Figure 3, the 12 o'clock direction is generally the upper side, the 6 o'clock direction is generally the lower side, the 4 o'clock direction is generally the one side, the 10 o'clock direction is the other side, and the overall 2 o'clock direction is the other side. The direction may be inward, and the overall 8 o'clock direction may be outward.

Hereinafter, the strip recovery unit 11 of the input module 10 will first be described with reference to FIGS. 3 to 10. In this regard, Figure 3 is a perspective view showing the strip recovery part of the package cutting and sorting system according to an embodiment of the present application, and Figure 4 is a perspective view showing the first clamp unit being located in the ready position according to an embodiment of the present application. It is a perspective view of the strip recovery unit, and Figure 5 is a perspective view showing the strip inspection module according to an embodiment of the present application viewed obliquely from the inside, and Figure 6 is a perspective view of the strip recovery unit according to an embodiment of the present application viewed obliquely from the outside. It is a perspective view, and FIG. 7 is a perspective view with a portion of the strip recovery unit according to an embodiment of the present application removed, and FIGS. 8 and 9 are schematic diagrams for explaining the operation of the gripper of the strip recovery unit according to an embodiment of the present application. It is a conceptual diagram, and Figure 10 is a perspective view showing a portion of the strip recovery unit according to an embodiment of the present application viewed obliquely from the outside.

Referring to Figures 3 and 4, the strip recovery unit 11 may include a magazine seating module 111. The magazine seating module 111 may include a first tray 11a. A magazine loaded with an input strip 110a (hereinafter referred to as 'first magazine 111a') is loaded (placed) on the first tray 11a. Additionally, the magazine seating module 111 may include a second tray 11b provided above the first tray 11a. An empty magazine 111b (i.e., a magazine in which no semiconductor strips are loaded) is loaded in the second tray 11b. Additionally, the magazine seating module 111 may include a third tray 11c provided above the second tray 11b. A magazine loaded with a return strip 110b (hereinafter referred to as 'second magazine 111c'), which will be described later, is loaded on the third tray 11c.

For reference, in the description of the embodiment of the present application, the input strip 110a is a strip before being seated on the seating portion 1131 of the input module 10 or a cutting module 20 after being loaded on the seating portion 1131. It may refer to a semiconductor strip to be transferred to . Separately, the return strip 110b may refer to a semiconductor strip that is seated on the seating portion 1131 of the input module 10 and then loaded into the empty magazine 111b or the second magazine 111c.

More specifically, the return strip 110b is determined to be recovered after being seated (loaded) in the seating portion 1131 and is not transferred to the cutting module 20 but is recovered to the empty magazine 111b or the second magazine 111c. It may refer to a semiconductor strip.

For example, if a semiconductor strip other than the semiconductor strip that should be placed on the seating unit 1131 is placed, the semiconductor strip may be subject to a recall decision. In this regard, whether a semiconductor strip other than the semiconductor strip to be inserted is seated can be determined by recognizing the identification code (barcode) written on each strip by the sensor unit on the insertion module 10. Additionally, if the seating position of the semiconductor strip with respect to the seating portion 1131 is misaligned, the semiconductor strip may be subject to a recall decision.

In this regard, the pickup unit (in other words, a transfer unit that transfers the semiconductor strip from the seating unit 1131 to the cutting module 20) due to incorrect seating position, bending, etc. of the semiconductor strip seated on the seating unit 1131. If it is not picked up, the semiconductor strip may be recalled.

In addition, a semiconductor strip that must be separately processed in a separate processing device after being seated on the seating portion 1131 and transferred to the cutting module 20 for initial processing may be included in the return strip 110b. For example, after being seated on the seating portion 1131 and transferred to the cutting module 20 for primary processing (e.g., half cutting), separate processing (e.g., gold plating) must be performed in a separate processing device. The semiconductor strip may be reloaded into the seating unit 1131 after primary processing and transferred from the seating unit 1131 to the empty magazine 111b or the second magazine 111c and loaded, and these semiconductor strips may be returned as return strips ( 110b).

Additionally, the strip recovery unit 11 may include a magazine holding module 112 provided on one side of the magazine seating module 111 in the longitudinal direction. The magazine gripping module 112 may include a first clamp unit 112a. Additionally, the magazine gripping module 112 may include a second clamp unit 112b. Additionally, the magazine gripping module 112 may include a driving rail unit 112c that drives the first clamp unit 112a and the second clamp unit 112b in the vertical direction.

The driving rail unit 112c includes a rail unit 115 including a first clamp unit 112a and a second clamp unit 112b in the vertical direction, and a first clamp unit 112a and a second clamp unit 112b. It may include a motor that provides power to move in the up and down direction along the rail unit 115. Additionally, the second clamp unit 112b may be provided with respect to the rail unit 115 to be located above the first clamp unit 112a.

Additionally, the strip recovery unit 11 may be provided with a strip inspection module 113. The strip inspection module 113 receives the input strip 110a from the first magazine 111a or provides the return strip 110b to the empty magazine 111b or the second magazine 111c. This is explained in detail below.

Referring to FIGS. 5 to 10 , the strip inspection module 113 may be provided with a seating portion 1131 on which the input strip 110a or the return strip 110b is loaded (seated) or unloaded (removed). For example, the input strip 110a may be transferred from the first magazine 111a and seated (loaded) on the seating portion 1131. Additionally, the input strip 110a seated on the seating unit 1131 may be removed (unloaded) from the seating unit 1131 and transferred to the cutting module 20 for subsequent processing. In addition, the seating portion 1131 includes a return strip 110b, such as a strip that has been judged to be recovered as described above, a strip that needs to be transferred to a separate processing device after being processed from the cutting module 20, and the like. ), and this return strip (110b) can be unloaded from the seating portion (1131) and transferred to the empty magazine (111b) or the second magazine (111c).

Hereinafter, the loading operation for the seating portion 1131 of the input strip 110a will be described.

The first clamp unit 112a may hold the first magazine 111a. For example, the first clamp unit 112a may hold the first magazine 111a loaded on the first tray 11a. Specifically, the first clamp unit 112a may move along the rail unit 115 and be located on one side of the first tray 11a, and the first magazine disposed on one side of the first tray 11a ( 111a) can be grasped. At this time, the first tray 11a may include a conveyor unit that moves the first magazine 111a to one side in the longitudinal direction. The first magazine 111a may be moved by the conveyor unit to a holding position held by the first clamp unit 112a within the first tray 11a.

In summary, the conveyor unit can transport the first magazine (111a) loaded on the first tray (11a) to the gripping position, and the first clamp unit (112a) located on one side of the first tray (11a) can perform the gripping position. The first magazine 111a located in the position can be held. When the first magazine 111a is removed from the gripping position by the first clamp unit 112a, the conveyor unit may move the magazine loaded with another semiconductor strip to the gripping position. Also, for reference, the first tray 11a may include a sensor that determines whether the magazine is placed in the gripping position.

Additionally, the first clamp unit 112a can hold the first magazine 111a and position it in the ready position. In the description of the embodiment of the present application, the preparation position refers to a position where the input strip 110a in the first magazine 111a held by the first clamp unit 112a can be pushed by the push unit 114 to be described later. can do.

In this regard, the strip recovery unit 11 may include a push unit 114 that pushes the input strip 110a from the first magazine 111a toward the seating unit 1131. When the first clamp unit 112a is located in the ready position, the push unit 114 pushes the input strip 110a in the first magazine 111a held by the first clamp unit 112a toward the seating portion 1131. can do. For example, the push unit 114 pushes so that at least a portion (e.g., 50% of the strip length) of the input strip 110a that it pushes flows into the interior of the device and is seated on the seating portion 1131. You can.

Additionally, the strip inspection module 113 may include a gripper 132 that loads the input strip 110a pushed toward the seating unit 1131 onto the seating unit 1131. When at least a portion of the input strip 110a is seated on the seating portion 1131 by the push of the push unit 114, the gripper 132 grips and pulls the pushed input strip 110a to secure the seating portion 1131. It can be loaded into .

For example, the gripper 132 may contact and grip the upper and lower surfaces of the semiconductor strip, respectively. For this purpose, the gripper 132 may include an upper member in contact with the upper surface of the semiconductor strip and a lower member in contact with the lower surface, and the gap (width) between the upper member and the lower member is used to grip and release the semiconductor strip. can be adjusted for To this end, the gripper 132 may move in an inward direction (in other words, a direction toward the push unit 114) to grip a portion of the semiconductor strip seated on the seating portion 1131, and in the gripped state, move to the outside. By moving in a direction (in other words, a direction away from the push unit 114), the input strip 110a can be completely seated on the seating portion 1131.

For reference, the strip inspection module 113 may include a guide rail portion 1321 that guides the movement of the gripper 132 in the inner and outer directions. The guide rail unit 1321 may include a rail and a motor extending in the inner and outer directions. The gripper 132 may be moved in an inward or outward direction along the rail, and a motor may provide a moving force to the gripper 132.

For reference, when the push unit 114 pushes one input strip 110a in the first magazine 111a and one input strip 110a is removed, the push unit 114 pushes one input strip 110a. Another input strip 110a located on the lower or upper side can be pushed. In this case, the first clamp unit 112a holding the first magazine 111a moves downward or upward to push the push unit 114. The height (position) of the other (next) input strip 110a to be pushed can be made to correspond to the height that the push unit 114 can push.

Additionally, the first clamp unit 112a may hold an empty magazine 111b. For example, when all of the input strips 110a in the first magazine 111a held by the first clamp unit 112a are removed, the first magazine 111a held by the first clamp unit 112a is It may be an empty magazine 111b.

Additionally, when the first magazine 111a held by the first clamp unit 112a becomes an empty magazine 111b, it can be introduced into the second tray 11b. For example, the first clamp unit 112a holds the first magazine 111a and positions it in the ready position so that the input strip 110a in the held first magazine 111a is provided to the seating portion 1131. You can. In addition, when all of the input strips 110a in the first magazine 111a held by the first crimp unit 112a are provided to the seating portion 1131, resulting in an empty magazine 111b without a loaded semiconductor strip, the corresponding magazine While maintaining the gripped state, it moves upward and moves toward the second tray 11b, and the empty magazine ( 111b) can be moved to a position where 111b) can be loaded, and an empty magazine 111b can be loaded (introduced) into the second tray 11b.

In addition, when the first clamp unit 112a holds the empty magazine 111b and waits at the standby position of the second tray 11b, the second tray 11b holds the empty magazine 111b held by the first clamp unit 112a. To ensure that the loading space of 111b is secured on one side in the longitudinal direction of the second tray 11b, the previously introduced empty magazine 111b can be moved to the other side in the longitudinal direction of the second tray 11b. In addition, the second tray 11b is set to a level that corresponds to the loading space on one side of the second tray 11b (more specifically, the width of the magazine) so that the loading space on one side of the second tray 11b is secured. The empty magazine (111b) can be transferred. In addition, the second clamp unit 112b holds the empty magazine 111b disposed in the loading space on one side of the second tray 11b for loading the return strip 110b, which will be described later, to secure the empty magazine 111b to the second tray 11b. It can be removed from the loading space on one side of the second tray (11b), and in the state where the empty magazine (111b) does not exist in the loading space on one side of the second tray (11b), the second clamp unit (112b) is additionally attached to another empty magazine ( When trying to grasp (secure) 111b), another empty magazine (111b) located on the other side of the loading space on one side of the second tray (11b) quickly moves to the loading space on one side of the second tray (11b) This may be provided to the second clamp unit 112b.

Here, the loading space is a second tray (11b) on which the empty magazine (111b) held by the first clamp unit (112a) can be placed when the first clamp unit (112a) is located in the waiting position of the second tray (11b). ), and in addition, while the first clamp unit 112a is located in the standby position of the second tray 11b, an empty magazine 111b that can be held from the second tray 11b is located. It can mean a space where Additionally, the second tray 11b may include a sensor that determines whether the empty magazine 111b is loaded (placed) in the loading space.

Hereinafter, unloading from the seating portion 1131 of the return strip 110b will be described.

The second clamp unit 112b may hold the empty magazine 111b or the second magazine 111c. When the second clamp unit 112b is not holding the magazine, it can move toward the second tray 11b and hold the empty magazine 111b loaded on the second tray 11b. Additionally, when the return strip 110b is loaded into the empty magazine 111b held by the second clamp unit 112b, the empty magazine 111b may become the second magazine 111c.

The second clamp unit (112b) grips the empty magazine (111b) or the second magazine (111c) partially loaded with the return strip (110b) so that the return strip (110b) from the seating portion (1131) is held by the empty magazine (111c) held by the second clamp unit (112b). 111b) or may be positioned in a ready position to be moved into the second magazine 111c. Specifically, when there is no magazine held, the second clamp unit 112b may move toward the second tray 11b and move to the ready position by holding the empty magazine 111b loaded on the second tray 11b. In addition, when the return strip 110b transferred from the seating part 1131 is loaded into the empty magazine 111b held by the second clamp unit 112b, the empty magazine 111b can become the second magazine 111c. And, the second clamp unit 112b can maintain the state of holding the magazine until it is impossible to load the return strip 110b into the held second magazine 111c.

In addition, when loading the return strip 110b into the held magazine (empty magazine 111b or the second magazine 111c) becomes difficult (in other words, the second clamp unit 112b clamps all of the return strips 110b with the return strip 110b). (filled state, etc.), the second magazine 111c being held can be introduced into the third tray 11c.

Also, for reference, if the second clamp unit 112b is to be moved to the ready position while the first clamp unit 112a is located in the ready position, the first clamp unit 112a must be moved to the lower side of the ready position. You can. The rail unit 115 may be extended lower than the first tray 11a so that the first clamp unit 112a can be positioned below when the second clamp unit 112b is in the ready position. . Accordingly, the first clamp unit 112a and the second clamp unit 112b, which share the same rail unit 115, can be positioned in the ready position when needed without mutual interference.

Additionally, the gripper 132 may push the return strip 110b seated on the seating portion 1131 toward the empty magazine 111b or the second magazine 111c. The return strip 110b seated on the seating portion 1131 by the push of the gripper 132 may be introduced into the empty magazine 111b or the second magazine 111c.

Referring to FIG. 7, the strip inspection module 113 is provided with an inner push unit 135 that further pushes the return strip 110b pushed by the gripper 132 toward the empty magazine 111b or the second magazine 111c. can do. For example, the return strip 110b seated on the seating portion 1131 is introduced into the empty magazine 111b or the second magazine 111c by the push of the gripper 132, and at least a portion of the empty magazine 111b is Alternatively, if the return strip 111c fails to flow into the second magazine 111c, the inner push unit 135 may additionally push the portion of the return strip 110b that has not flowed in, allowing the return strip 110b to completely flow into the magazine.

In summary, when the return strip 110b is seated on the seating portion 1131, the return strip 110b seated on the seating portion 1131 needs to be transferred into the empty magazine 111b or the second magazine 111c. In this case, the second clamp unit 112b is positioned in the ready position by gripping the empty magazine 111b or the second magazine 111c, and the gripper 132 holds the return strip seated on the seating portion 1131 ( 110b) can be pushed into the empty magazine (111b) or the second magazine (111c), and then the remaining portion of the pushed return strip (110b) that has not been pushed into the empty magazine (111b) or the second magazine (111c) is The inner push unit 135 may push additionally to completely insert (transfer) the empty magazine 111b or the second magazine 111c.

Additionally, the second clamp unit 112b can introduce the second magazine 111c into the third tray 11c. For example, when it is difficult to additionally load the return strip 110b onto the held second magazine 111c, the second clamp unit 112b moves the held second magazine 111c toward the third tray 11c. It can be moved. At this time, the second clamp unit 112b applies an external force in the other direction to the second magazine 111c introduced into the third tray 11c, so that the second magazine 111c flows into the third tray 11c, It can be moved to the other side of the third tray 11c.

Meanwhile, the seating portion 1131 may support at least a portion of the edge of the loaded input strip 110a or return strip 110b. For example, the seating portion 1131 may include a pair of supports 1311 and 1312 that are disposed at intervals in the width direction of the semiconductor strip and support each of one edge in the width direction and the other edge in the width direction of the semiconductor strip. there is.

Also, for reference, the pickup unit that transfers the input strip 110a seated on the seating unit 1131 to the cutting module 20 may pick up the input strip 110a loaded on the seating unit while contacting the upper surface of the input strip 110a.

In addition, the strip inspection module 113 is configured to detect the input strip 110a loaded on the seating unit 1131 when the pickup unit (not shown) contacts the upper surface of the input strip 110a loaded on the seating unit 1131. It may include a lift 134 that supports at least a portion of the portion excluding the edge from the lower side. For example, the lift 134 may be provided between a pair of supports 1311 and 1312, and may be arranged so that its upper surface faces at least a portion of the lower surface of the semiconductor strip seated on the seating portion 1131. Additionally, the lift 134 can move up and down and can optionally move upward to support the insertion strip 110a from the lower side. Accordingly, when the pickup unit contacts the upper surface of the semiconductor strip to proceed with the subsequent process, the lift 134 may move upward to contact and support the lower surface of the semiconductor strip. According to this, when the pickup unit contacts the semiconductor strip, each of the lower and upper surfaces of the semiconductor strip can be supported by contacting the lift 134 and the pickup unit, respectively, so that the semiconductor strip can be picked up by the pickup unit without being bent. To move the lift 134 up and down, the strip inspection module 113 may include a vertical moving cylinder structure in the lower part of the seating portion 1131 that moves the lift 134 up and down.

Additionally, the inner push unit 135 may be provided to move up and down and inward and outward for additional pushing as described above. Specifically, the inner push unit 135 may be located at a lower position compared to the strip seated on the seating portion 1131, and the gripper 132 pushes the return strip 110b to perform the primary movement of the return strip 110b. Once this is completed, the return strip 110b, which is moved and pushed upward and pushed, may be positioned inside (or behind) the first moved return strip 110b, and the return strip 110b, which is moved and pushed in the outward direction, may be pushed in the outward direction to form the return strip. (110b) can be introduced into the empty magazine (111b) or the second magazine (111c).

Additionally, the inner push unit 135 may be vertically driven by a vertically moving cylinder structure. The inner push unit 135 may move upward in conjunction with the upward movement of the lift 134 to push the return strip 110b. Specifically, the lift 134 and the inner push unit 135 may be connected to the vertically movable cylinder structure, and the lift 134 and the inner push unit 135 may be moved up and down in conjunction with the vertically movable cylinder structure.

In addition, the inner and outer drive of the inner push unit 135 may be performed by the cylinder portion 1351. For example, referring to FIG. 8, the inner push unit 135 is provided on the outer surface of the lift 134. The cylinder portion 1351 may be provided to extend inward from the lower portion of the inner push unit 135 at the lower side of the lift 134, and may be provided to be able to extend (increase) in length in the outward direction. Accordingly, when the cylinder portion 1351 extends in length in the outward direction, the inner push unit 135 connected to the outer portion of the cylinder portion 1351 may be moved in an outward direction relative to the lift 134.

Additionally, referring to FIG. 9 , when the inner push unit 135 is moved outward from the lift 134, the position point (level) of the upper end of the inner push unit 135 may become higher. For example, referring to FIG. 8, the inner push unit 135 may be provided at an angle with respect to the vertical direction so that the upper part is located outside its lower part on the outer surface of the lift 134 (initial state), and the lift ( When the contact with 134 is released, it can be extended in the vertical direction, and when the inner push unit 135 is moved outward from the lift 134, the position point (level) of the upper end of the inner push unit 135 is moved to the lift (134). 134) can be higher than the upper surface (state after movement). Accordingly, the upper end of the inner push unit 135 may be positioned higher than the strip seated on the lift 134 or the initially moved return strip 110b when the inner push unit 135 moves in the outward direction, It contacts the return strip 110b and can be moved outward.

For reference, the lower portion of the inner push unit 135 and the cylinder portion 1351 may be hinged so that the inner push unit 135 can rotate outward by a predetermined amount or more about the connected portion. In addition, the lower part of the inner push unit 135 other than the hinged part and the other part except the hinged part of the cylinder part 1351 may be connected by an elastic body, and the elastic body may be connected to the above-mentioned part of the inner push unit 135. It can act as an elastic force that limits rotation. Accordingly, when a separate external force (for example, an external force greater than the elastic force of the elastic body) does not act on the inner push unit 135, the inner push unit 135 extends straightly (for example, vertically) in the vertical direction. It may have the state after the above-mentioned movement, and the inner push unit 135 is in contact with the outer surface of the lift 134, so that a support force in the outward direction by the lift 134 is applied to the upper part of the inner push unit 135. The inner push unit 135 may have the initial state as described above.

In summary, in the initial state, the upper part of the inner push unit 135 is positioned outside its lower part due to the elastic force in the inner direction acting on the lower part and the supporting force in the outward direction of the lift 134 acting on the upper part. It may be provided at an angle so as to move outward as the length of the cylinder portion 1351 extends, and when the contact with the lift 134 is released and the state after movement is reached, the cylinder portion 1351 is moved up and down by an inward elastic force acting on the lower portion. By being extended and arranged, it can have a higher top height than in the initial state, and using this, it can be moved outward in contact with the strip.

Additionally, referring to Figure 10, the strip recovery unit 11 may be provided with a first sensor unit 155. The first sensor unit 155 can detect whether the return strip 110b pushed by the inner push unit 135 is completely inserted into the empty magazine 111b or the second magazine 111c, and the return strip 110b When it is determined that the empty magazine 111b or the second magazine 111c has been completely inserted, the inner movement of the inner push unit 135 can be controlled to stop.

Additionally, referring to FIG. 5, the strip recovery unit 11 may be provided with a second sensor unit 154. The second sensor unit 154 can detect whether the semiconductor strip is seated on the seating unit 1131. For example, the second sensor unit 154 may be provided on the lower side of the inner portion of the semiconductor strip seated on the seating unit 1131 between a pair of supports 1311 and 1312. Accordingly, the second sensor unit 154 can determine whether the semiconductor strip is seated on the seating unit 1131 by detecting whether there is an inner portion of the semiconductor strip on the upper side.

Additionally, referring to Figure 10, the strip recovery unit 11 may be provided with a third sensor unit 153. The third sensor unit 153 can detect whether the semiconductor strip is seated on the seating unit 1131. For example, the third sensor unit 153 may be provided on the lower side of the outer portion of the semiconductor strip seated on the seating unit 1131 between a pair of supports 1311 and 1312. Accordingly, the third sensor unit 153 can determine whether the semiconductor strip is seated on the seating unit 1131 by detecting whether the outer portion of the semiconductor strip is present on the upper side.

Additionally, referring to Figure 10, the strip recovery unit 11 may be provided with fourth sensor units 151 and 152. The fourth sensor units 151 and 152 can detect whether the semiconductor strip is seated on the seating unit 1131. For example, the fourth sensor units 151 and 152 may include sensor 1 (151) and sensor 2 (152), where sensor 1 (151) is provided on the upper side of the seating unit 1131 and sensor 2 ( 152) is provided on the lower side of the seating unit 1131, and may be provided so that a path 1511 (for example, an optical stream) of mutually transmitted and received signals passes between a pair of supports 1311 and 1312. For example, semiconductor strips may have different specifications depending on the type. If the length of the semiconductor strip is short, the accuracy of detection by the second sensor unit 154 or the third sensor unit 153 may be reduced. In contrast, the strip recovery unit 11 is provided with the fourth sensor units 151 and 152, so that it can accurately detect whether the semiconductor strip is seated, regardless of the standard of the semiconductor strip.

According to the above, the return strip 110b, such as a strip to be recovered, a strip to be transferred to a separate processing device, etc., is an empty magazine or return strip held by the second clamp unit 112b from the strip inspection module 113 ( 110b) can be transferred to the loaded magazine, and if the return strip 110b is received, the second clamp unit 112b transfers the empty magazine held by it or the magazine loaded with the recovered semiconductor strip to the third tray 11c. It can be brought in. Accordingly, the return strip 110b can be automatically recovered and placed separately on the third tray 11c.

In summary, the strip recovery unit 11 of the input module 10 of the present system 1 determines whether the semiconductor strip needs to be recovered, and collects each injected semiconductor strip according to the determination result of whether the semiconductor strip needs to be recovered. Alternatively, it may be operated to insert the semiconductor strip into the cutting module 20.

Hereinafter, the smart alignment unit 12 of the input module 10 will be described.

Figure 11 is a perspective view showing the smart alignment part of the package cutting and sorting system according to an embodiment of the present application.

Referring to FIG. 11, the input module 10 transfers the semiconductor strip that is not determined to be in need of recovery by the strip recovery unit 11 to the cutting module 20, and as a result of sensing the input position of the input semiconductor strip It may include a smart alignment unit 12 that aligns the transfer direction of the semiconductor strip according to.

Specifically, referring to FIG. 11, the smart alignment unit 12 includes a direction detection unit 121 and a direction detection unit 121 that senses the insertion position of the semiconductor strip that is inserted after being taken out from the magazine in which the prepared semiconductor strip is loaded. It may include a strip adjustment unit 122 that changes the transfer direction of the semiconductor strip to match a preset reference insertion position according to the sensing result.

Specifically, the strip adjusting unit 122 can grip the semiconductor strip and rotate the gripped semiconductor strip according to the difference between the preset reference insertion position and the actual insertion position sensed by the direction detection unit 121.

For example, the smart alignment unit 12 is a module in the form of a strip picker that can grasp and transfer semiconductor strips that are input after determining whether recovery is necessary by the strip recovery unit 11 and determining that recovery is unnecessary. , the input position of the semiconductor strip is adjusted to a direction suitable for strip cutting in the cutting module 20 and provided to the cutting module 20, or applied to the semiconductor strip when unloaded from the seating part 1131 of the strip recovery unit 11. This may be to correct the phenomenon in which the semiconductor strip behaves obliquely within the transfer area due to external forces, etc.

For example, the direction detection unit 121 may be disposed to view the injected semiconductor strip from above, and may include an image sensor (not shown) provided to take an image of the upper surface of the semiconductor strip, and the strip adjustment unit 122 ) is placed on the upper side of the semiconductor strip when an image sensor (not shown) photographs the upper surface of the semiconductor strip, and then moves to the lower side after the image is acquired through the image sensor (not shown) and the semiconductor strip is injected. It is operable to grip the strip.

Meanwhile, according to an embodiment of the present application, the reference insertion position preset for the semiconductor strip takes into account the cutting pattern of the cutting process performed in the cutting module 20 for cutting the semiconductor strip provided from the input module 10. It can be set as follows. For example, the strip adjusting unit 122 considers the cutting direction of the semiconductor strip of the cutting module 20 as shown in A of FIG. 11, so that the longitudinal direction of the held semiconductor strip is moved by the strip adjusting unit 122. The reference input position (hereinafter referred to as preset to be input into the cutting module 20) is adjusted to face a direction perpendicular to the direction of extension of the guide portion 123 (i.e., from 2 o'clock to 8 o'clock in FIG. 11) for guiding. , the length of the semiconductor strip, rotated based on the semiconductor strip (referred to as the first reference direction) or held in consideration of the cutting direction of the semiconductor strip of the cutting module 20 as shown in B of FIG. 11 After the direction is adjusted to face a direction parallel to the extension direction of the guide portion 123, the semiconductor strip is inserted into the cutting module 20 based on a preset reference insertion position (hereinafter referred to as the second reference direction). It may be rotating.

Meanwhile, according to an embodiment of the present application, the smart alignment unit 12 includes a first alignment module that rotates the semiconductor strip inputted according to the first reference direction and a second alignment module that rotates the semiconductor strip inputted according to the second reference direction. The alignment module may be provided separately (in other words, the alignment module shown in A in FIG. 11 and the alignment module shown in B in FIG. 11 are provided independently and driven individually), but is not limited to this. As another example, the smart alignment unit 12 is implemented so that a single alignment module including the direction detection unit 121 and the strip adjustment unit 122 variably rotates the semiconductor strip in response to the first reference direction or the second reference direction. (In other words, a single alignment module may be implemented to variably rotate the semiconductor strip in the direction shown in A of FIG. 11 or the direction shown in B of FIG. 11).

In addition, the cutting module 20 includes a cutting assembly having a blade mounting portion (not shown), and the cutting assembly can cut the package from the semiconductor strip provided from the input module 10 and divide it into a plurality of packages, and can be cleaned. The module 30 may perform a cleaning process on a plurality of packages cut by the cutting module 20.

Hereinafter, the drying module 40 will be described with reference to FIGS. 12 and 13.

12 and 13 are diagrams for explaining the drying module of the package cutting and sorting system according to an embodiment of the present application.

For reference, in relation to the description of the drying module 40 below, terms related to direction or location (top, bottom, front, rear, etc.) are set based on the arrangement status of each component shown in Figures 12 and 13. It was done. For example, based on what is shown in Figure 12, the 12 o'clock direction is generally the upper side, the 6 o'clock direction is generally the lower side, the 8 o'clock direction is generally the front, the 2 o'clock direction is generally the rear, and the 4 o'clock to 10 o'clock direction is the overall side. The visual direction may be the longitudinal direction, etc.

Referring to FIGS. 12 and 13 , the drying module 40 may include a loading unit 41 . The loading unit 41 can be in an accommodating state in which packages are loaded and in a dry state in which a dry airflow is formed in an upward direction. In other words, the loading unit 41 may have an accommodating state in which packages are loaded, or a dry state in which a dry airflow is formed in an upward direction. Here, the receiving state of the loading unit 41 may mean a state in which a package is loaded on the loading unit 41.

Specifically, the loading unit 41 may be capable of moving up and down while the package is loaded thereon. A plurality of packages loaded on the loading unit 41 may have gone through a cleaning process by the cleaning module 30. In other words, the package moved from the cleaning module 30 through a cleaning process may be loaded in the loading unit 41. Additionally, the package may be loaded on the loading unit 41 so that the upper surface is exposed upward. The loading unit 41 can vacuum-adsorb the package. For example, the package may be seated on the loading unit 41 so that its lower surface is in contact with the upper surface of the loading unit 41. For example, a plurality of packages may be arranged in the loading unit 41 in n rows x m columns.

Additionally, referring to FIGS. 12 and 13 , the drying module 40 may include a flip portion 42. The flip unit 42 moves on the loading unit 41 and forms a dry airflow in the downward direction, providing a drying mode for drying the upper surface of the package loaded on the loading unit 41 and picking up the package loaded on the loading unit 41. Thus, it can be provided to provide a pick-up mode that moves on the loading unit 41.

In addition, referring to FIGS. 12 and 13, the drying module 40 may include an air knife portion 43 interposed between the loading portion 41 and the flip portion 42 and having a slit for discharging a dry air stream. You can. Referring to FIGS. 12 and 13, the air knife unit 43 is disposed with respect to the loading unit 41 to discharge the dry air stream upward and the first air knife unit 431 is disposed to discharge the dry air stream towards the downward direction. It may include a second air knife part 432 disposed with respect to the flip part 42 to discharge. In this regard, the first air knife unit 431 may be referred to as a bottom air knife, and the second air knife unit 432 may be referred to as a top air knife.

In this regard, the dry state of the loading unit 41 may mean that the first air knife unit 431 disposed with respect to the loading unit 41 discharges gas in the upward direction to form a dry airflow. . For example, the upward direction may be an angular range including a direction inclined at a predetermined angle to the left from the vertical direction (approximately 10 o'clock to 11 o'clock direction). Accordingly, the dry airflow formed can be propagated (transmitted) not only in the upward direction but also in various directions within the space.

Specifically, the first air knife unit 431 disposed with respect to the loading unit 41 may form a dry airflow in the upward direction. For example, the first air knife unit 431 can form a dry airflow that propagates in various directions in space by discharging gas in an upward direction. As an example, the first air knife unit 431 may have a slit for discharging gas (dry air flow) formed along the longitudinal direction of the loading unit 41. In addition, the first air knife unit 431 has a slit formed along the longitudinal direction of the loading unit 41, so that a dry airflow can be formed corresponding to the longitudinal direction of the loading unit 41. In addition, according to an embodiment of the present application, the first air knife unit 431 may move up and down or rotate on the side of the loading unit 41 to form a dry airflow in various directions.

Specifically, the flip part 42 may include a pickup part 421 that is rotatable. For example, the pickup unit 415 may be rotated so that its upper surface faces downward, and the pickup unit 421 may be capable of moving in the forward and backward directions. This pickup unit 421 can pick up the package by adsorbing it. For example, the pickup unit 421 is rotated so that the upper surface on which the package is adsorbed faces downward, and then moves forward to reach the upper side of the loading unit 41. The package moved to and loaded on the loading unit 41 can be picked up by adsorption. Additionally, the pickup unit 421 may perform a pickup mode by moving forward and backward while picking up the package. Additionally, the forward and backward movement of the pickup unit 421 may be linked to the forward and backward movement of the second air knife unit 432. Additionally, the rotation of the pickup unit 421 may be performed independently from the second air knife unit 432. The flip unit 42 can rotate the pickup unit 421 so that the pickup unit 421 and the second air knife unit 432 are driven in this way, and the pickup unit 421 and the second air knife unit 432 ) may include a jig unit 422 capable of moving in the forward and backward directions.

More specifically, the pickup unit 421 may be located at the rear of the loading unit 41 so that its longitudinal direction corresponds to the longitudinal direction of the loading unit 41. Accordingly, the pickup unit 421 can move onto the loading unit 41 and pick up the package loaded on the loading unit 41 just by moving in the front-back direction without moving in the longitudinal direction. In other words, the pickup unit 421 is located at the rear of the loading unit 41 so that its longitudinal direction corresponds to the longitudinal direction of the loading unit 41, so that the movement line and movement moving to pick up the package on the loading unit 41 and The movement line in the forward and backward directions on the loading unit 41 can be simplified.

Additionally, the flip part 42 may include a second air knife part 432. The second air knife unit 432 is provided along the longitudinal direction of the pickup unit 421 between the pickup unit 421 and the loading unit 41 to form a dry airflow in the downward direction. For example, the lower direction may be an angle range including a direction inclined at a predetermined angle to the right from the lower vertical direction (about 5 o'clock). For example, the second air knife unit 432 can form a dry airflow that propagates in various directions in space by discharging gas in a downward direction. As an example, the second air knife part 432 may have a slit for discharging gas (dry air flow) formed along the longitudinal direction of the flip part 42. In addition, the second air knife part 432 has a slit formed along the longitudinal direction of the flip part 42, so that a dry airflow can be formed corresponding to the longitudinal direction of the flip part 42. In addition, according to an embodiment of the present application, the second air knife unit 432 may move up and down or rotate on the side of the flip unit 42 to form a dry airflow in various directions. Additionally, the second air knife unit 432 can move in the forward and backward directions. For example, the second air knife unit 432 may be connected to the pickup unit 421, and accordingly, the second air knife unit 432 is linked to the forward and backward movement of the pickup unit 421, so that it moves back and forth. You can move in any direction.

As such, according to an embodiment of the present application, when the package is loaded on the loading part 41, the second air knife part 432 of the flip part 42 moves on the loading part 41 and flows dry air in the downward direction. By forming, the portion including the upper surface of the package can be dried by an airflow, and is disposed relative to the loading portion 41 when the package is moved on the loading portion 41 in a state picked up by the flip portion 42. The first air knife unit 431 forms a drying airflow in the upward direction, so that the portion including the lower surface of the package can be dried by the airflow. Accordingly, not only the upper surface but also the lower surface of the package can be dried by a dry air stream, so unlike the prior art, which removes moisture from the package by heat, stains remaining on the package can be prevented. In addition, by drying both the upper and lower surfaces of the package, the best dry condition of the package can be maintained and the drying efficiency of the package can be increased.

Meanwhile, according to an embodiment of the present application, the drying module 40 provides distance information (for example, in the front-back direction) between the reference position set for the loading unit 41 and the reference position set for the flip unit 42. The first air knife unit 431 and/or the second air knife unit ( Controlling the first air knife unit 431 and/or the second air knife unit 432 to adjust the dry air flow discharge direction (in other words, the opening direction of the slit) of 432) toward the area where the package is located. An airflow direction adjustment means (not shown) may be provided.

According to the above, the drying module 40 can perform the drying process through the following process.

First, when the package delivered from the cleaning module 30 is loaded, the loading unit 41 and the first air knife unit 431 move downward and move to the pickup unit 421 and the second air knife unit for a first predetermined time. The package can be placed in an accommodating state by loading it at a position lower than 432, and the second air knife unit 432 forms a dry airflow in the downward direction on the loading unit 41 for a first predetermined period of time, back and forth. You can perform dry mode by moving in the direction. Accordingly, a portion including at least a portion of the upper surface of the package can be dried by airflow.

After the first predetermined time, the pickup unit 421 moves onto the loading unit 41 to pick up the package loaded on the loading unit 41, and in the state of picking up the package, the first air is applied for a second predetermined time. Pick-up mode can be performed by moving in the forward and backward directions on the knife unit 431. To this end, the pickup unit 421 may rotate so that its upper surface faces downward before picking up the package to pick up the package on the loading unit 41. According to this, the package can be reciprocated in the front-back direction on the first air knife unit 431 with its lower surface exposed downward. Additionally, the first air knife unit 431 may be in a dry state by forming a dry airflow in the upward direction during the second predetermined time. According to this, the package can be moved back and forth in the forward and backward directions on the dry air stream formed by the first air knife part 431 with the lower surface exposed downward during the second predetermined time, so that the portion including at least a portion of the lower surface of the package It can be dried by an air current.

After the second predetermined time, the pickup unit 421 may reposition (reload) the package it was holding onto the loading unit 41. The package repositioning process is also similar to the package adsorption process, when the pickup unit 421 is located on the loading unit 41, the loading unit 41 is moved upward or the pickup unit 4221 is moved downward. The process of moving to can be accomplished. For reference, the first predetermined time may mean the time during which the portion including at least a portion of the upper surface of the package can be dried by the drying air flow, and more preferably, the time during which the portion including the entire upper surface can be dried. It can be. In addition, the second predetermined time may refer to the time during which the portion including at least a portion of the lower surface of the package can be dried by the drying air flow, and more preferably, the second predetermined time may be the time during which the portion including the entire lower surface of the package can be dried. You can.

When the package is repositioned in the loading unit 41, the pickup unit 421 and the second air knife unit 432 connected to the pickup unit 421 are moved to the initial position, that is, in the loading unit 41 and the first air knife unit 432. It can be moved to the rear of the knife unit 431, and the loading unit 41 and the first air knife unit 431 connected to the loading unit 41 are moved upward to the initial position, that is, the loading unit 41. It can be returned to the same level (height) position as.

In this way, when the drying process for the package is completed, the package can be moved to the table 60 by the first picker module 50 for subsequent processing.

According to the above-mentioned, when the package is loaded on the loading part 41, the flip part 42 moves on the loading part 41 and forms a drying airflow in the downward direction, so that the part including the upper surface of the package is dried by the airflow. It may be that, when the package is moved on the loading unit 41 in a state picked up by the flip unit 42, the loading unit 41 forms a dry airflow in the upward direction, so that the portion including the lower surface of the package is exposed to the airflow. It can be dried by Accordingly, not only the upper surface but also the lower surface of the package can be dried by a dry air stream, thereby preventing stains from remaining on the package.

In addition, according to the above-mentioned, when the package is loaded on the loading part 41, the flip part 42 moves on the loading part 41 and forms a dry airflow in the downward direction, so that the part including the upper surface of the package is affected by the airflow. When the package is moved on the loading unit 41 in a state picked up by the flip unit 42, the loading unit 41 forms a dry airflow in the upward direction, thereby drying both the upper and lower surfaces of the package. By doing so, the optimal drying condition of the package can be maintained and the drying efficiency of the package can be increased.

Additionally, the table 60 will be described below.

For reference, this system (1) includes a cutting process of cutting a semiconductor strip in which a plurality of packages are formed into individual packages, a cleaning process of cleaning the package cut in the cutting process, a drying process of drying the package cleaned in the washing process, and drying. Individual packages that have been inspected are manufactured from semiconductor materials by sequentially performing the package inspection process to check whether the completed package is defective and the off-load process to classify the package that passed the defect inspection and the package that did not pass the inspection result. It can be. As described above, the table 60 according to an embodiment of the present application is a package manufacturing device that performs the work of cutting, washing, drying, inspecting, and sorting packages by package unit, and stably vacuum-adsorbs individually cut packages. It relates to a table 60 that can be fixed and seated, and a plurality of developed cut packages that have completed the drying process in a package manufacturing device are transferred to a grid picker and seated on the table 60 according to an embodiment of the present application. It can be.

In addition, the table 60 of this system is used as a table to return the package to the inspection position after the drying process, but is not limited to this, and is a drying table for drying individualized packages, and a table for performing predetermined processing on individual packages. It can be applied equally or similarly to all seating tables where it is temporarily seated.

According to an embodiment of the present application, the second picker module 70 can pick up an object (package) and place it at a specific location. For example, the object may be a chip of an electronic device, such as a semiconductor chip, or a package of an electronic device. Additionally, the second picker module 70 can separate the package from the film to which the package is attached. For example, in the process of manufacturing a semiconductor package, the semiconductor package needs to be separated (removed) from the film attached to the outer peripheral surface of the ring-shaped frame, and the second picker module 70 can be applied to this process. For reference, hereinafter, ring may refer to a ring-shaped frame to which a film is attached.

However, the objects that this picker picks up and places are not limited to the above, and this picker can be used to pick up and place a variety of objects.

The second picker module 70 may include at least one picker (not shown) capable of picking up a package. Additionally, in the second picker module 70, a plurality of pickers may be driven individually. Additionally, a plurality of vacuum generators (not shown) may be driven individually. For example, when one or more of the plurality of pickers is gripped, the other pickers may be in a state where they are not gripped. In this case, the vacuum generator (not shown) connected to the picker that is gripped may be in a grip state, and the vacuum generator (not shown) connected to the picker that is gripped may be in a state that is not gripped. The vacuum generator (not shown) connected to another picker in the state may have a grip release state, or may be neither in the grip state nor in the grip release state.

In addition, the classification module 90 will be described below. First, the package loading method using the reject bin 92 will be described with reference to FIGS. 14 and 15, and the tray 91 will be described with reference to FIGS. 16 and 17. ) will be explained about the package loading method using .

The classification module 90 disclosed herein may be provided with a receiving space in which each of a plurality of packages is accommodated according to the results of the inspection by the inspection module 80. In this regard, the second picker module 80 may transfer each of the plurality of packages held based on the inspection results by the inspection module 80 to the receiving space formed in the classification module 90.

Specifically, the inspection module 80 provides information on the presence or absence of defects that classifies each of the plurality of packages held by the second picker module 80 as a normal package or a defective package, and classification type information on the defect type of the package classified as a defective package. It can be derived as a test result. In other words, the inspection module 80 not only performs an inspection to classify each package as a normal package or a defective package, but also provides a function to determine the defect type of the package classified as a defective package. By way of example, the defect type information may include contamination, dimension (size) defect, ball attachment defect, etc., but is not limited thereto, and may be set to various types according to implementation examples of the present application, and disclosed herein The accommodation space provided in the classification module 90 may include a plurality of accommodation spaces according to defect presence information and classification type information for the detected defect.

14 and 15 are diagrams showing a reject bin of a classification module of a package cutting and sorting system according to an embodiment of the present application.

Referring to FIGS. 14 and 15 , the reject bin 92 may partition a plurality of accommodation spaces. 14 and 15 show a reject bin designed to partition four accommodation spaces 92a, 92b, 92c, and 92d, but the reception space formed in the reject bin 92 Of course, the number, specifications (area, height, etc.) and shape of each accommodation space can be set in various ways according to the implementation example of the present application.

Meanwhile, according to an embodiment of the present application, each of the plurality of accommodation spaces formed in the reject bin 92 may correspond to each defect type of the defective package, but is not limited thereto, and according to the embodiment of the present application, Of course, a form in which some of the plurality of accommodation spaces of the reject bin 92 are used as spaces for loading normal packages and the remaining accommodation spaces are used as loading spaces corresponding to each defect type can also be applied. . For example, among the four accommodation spaces shown in FIGS. 14 and 15, the fourth accommodation space 92d, which has the largest volume, is a loading space for loading normal packages, and the remaining three accommodation spaces with relatively small volumes ( 92a, 92b, 92c) Each may be operated to accept defective packages corresponding to individual defect types.

As another example, the classification module 90 ensures that normal packages are seated in the receiving space formed in the tray 91, which will be described later, and defective packages are placed in each partitioned receiving space of the reject bin 92 according to classification type information. It may be that they are stored separately.

Meanwhile, referring to FIG. 15, the reject bin 92 includes an individual separation portion 922 provided to selectively separate the housing forming each receiving space and a body collectively separating the housing forming the receiving space as a whole. It may include an entire separation portion 921. For example, the manager or operator of the system 1 empties defective packages loaded in each receiving space or the entire reject bin 92 using the entire separation unit 921 or the individual separation unit 922. Alternatively, a separate reject bin picker module (not shown) may grasp the entire separation unit 921 or the individual separation units 922 and transfer the defective package to a separate space.

Meanwhile, according to an embodiment of the present application, the second picker module 70 obtains defect information and classification type information for each of the plurality of grasped packages from the inspection module 80, and selects the reject bin 92. After moving to the upper area, according to the result of matching the grip position information of each gripped package and the seating position information of each partitioned receiving space forming the reject bin 92, information on the presence or absence of defects specified for the corresponding receiving space and By selectively releasing the gripping state for the package corresponding to the classification type information, each package can be loaded (settled) into a pre-designated receiving space according to the defect presence information and the classification type information.

In addition, according to an embodiment of the present application, the second picker module 70 selects each receiving space provided in the classification module 90 according to the defect information and classification type information determined for each of the plurality of packages held. You can decide the movement order.

For example, normal packages are loaded (seated) on the tray 91, which will be described later, and defective packages are loaded (seated) in each receiving space formed in the reject bin 92 according to the classification type information, so that the classification module ( In a state in which 90) is operated, if the inspection module 80 determines that all of the plurality of packages currently held by the second picker module 70 are normal packages, the second picker module 70 selects the tray 91 ) side only to load (settle) the entire package, and then move to the reject bin 92 side and move to grip the next packages again. As another example, the second picker module 70 preferentially moves to the tray 91 or the reject bin 92 depending on the size relationship between the number of packages classified as normal packages and the number of packages classified as defective. , In a state where a plurality of defective packages corresponding to different classification type information are held, the second picker module 70 is directed toward the accommodation space of the reject bin 92 corresponding to the relatively large number of classification type information held. The loading (seating) order for each package, such as preferential movement, can be varied and applied according to the implementation example of the present application.

Figures 16 and 17 are diagrams for explaining a package loading method using a tray of a classification module of a package cutting and sorting system according to an embodiment of the present application.

Referring to FIGS. 1, 16, and 17, the classification module 90 may be provided with a tray 91 on which inspected packages are loaded. Specifically, the trays 91 may be provided in plural numbers so that each tray can be stacked. Illustratively, the plurality of trays 91 may include a first tray 91a, a second tray 91b, and a third tray 91c. For example, a tray on which a package determined to be good may be placed on two of the first trays 91a to 91c, and a tray on which a package determined as defective may be placed on the other tray. there is. For example, a package determined to be a good product may be placed on a tray placed in the first tray 91a, a package determined to be a good product may be placed in a tray placed in the second tray 91b, and the third A package that has been determined to be defective may be placed on the tray 91c.

Additionally, the classification module 90 may include a tray transfer unit 900 that moves the tray 91 in the Y-axis direction.

Illustratively, the tray transfer unit 900 is arranged to extend in the Y-axis direction and may include a first rail 910a that guides the movement of the tray unit (first tray unit) including the first tray 91a. You can. In addition, the tray transfer unit 900 is arranged to extend in the Y-axis direction and is disposed on the other side of the first rail 910a in the X-axis direction to prevent the movement of the tray unit (second tray unit) including the second tray 91b. The guiding second rail 910b is extended in the Y-axis direction and is disposed on the other side of the second rail 910b in the X-axis direction to prevent the movement of the tray unit (third tray unit) including the third tray 91c. It may include a third rail 910c for guidance.

On one side of each of the first rails (910a) to the third rails (910c) in the Y-axis direction, there is a loading waiting area where package placing is performed for the trays seated on each of the first trays (91a) to the third trays (91c). An exchange waiting area is formed on the other side of each of the first rails (910a) to the third rails (910c) in the Y-axis direction, where trays for each of the first trays (91a) to the third trays (91c) are supplied and collected. This can be formed. For example, when the first tray 91a is located in the exchange waiting area, a new tray may be supplied (seated) in the first tray 91a, and the first tray 91a supplied with the new tray will be moved to the loading waiting area. Packages that have been moved and judged to be good can be transferred. In addition, when the package placing for the tray of the first tray 91a is finally completed, the first tray 91a can be moved to the exchange waiting area, and the tray on the first tray 91a can be recovered. , a new tray may be supplied to the first tray 91a. Since the driving of the second tray 91b is similar to the driving of the first tray 91a, detailed description is omitted. In addition, in the case of the third tray 91c, a new tray may be supplied (seated) in the third tray 91c when the exchange waiting area of the third tray 91c is located, and the third tray supplied with the new tray ( 91c) is moved to the loading waiting area and can receive the package that has been judged defective. In addition, when the package placing for the tray of the third tray 91c is finally completed, the third tray 91c can be moved to the exchange waiting area, and the tray on the third tray 91c can be recovered. , a new tray can be supplied to the third tray 91c. For reference, the loading standby area may be formed at a location where package placement on the tray 91 of the second picker module 70 is possible.

Meanwhile, according to the present system 1, before the placing of the package on the tray begins, the tray 91 can be moved from the exchange waiting area to the loading waiting area in an empty state and positioned in the loading waiting area. In addition, when the placing of the package on the tray begins, the package determined to be good can be placed on one of the first tray 91a and the second tray 91b, and the package determined to be defective can be placed in the third tray 91c. ), a package judged to be good can be placed on only one tray until loading on one of the first tray (91a) and the second tray (91b) is completed, and may be placed on either tray. Once loading is completed, packages judged to be good quality can begin to be loaded onto other trays, and the tray on which loading was completed first can be moved to the exchange waiting area, collected, and then supplied with a new tray and moved to the loading waiting area. For example, when placing of a package on a tray begins, a package that has been determined to be good may be loaded on the tray of the first tray 91a. At this time, the tray of the first tray 91a is in a full state. Until this happens, the package can be placed on the tray of the first tray 91a (at this time, the tray of the second tray 91b is in a standby state). Thereafter, when the tray of the first tray 91a is in a full state, the first tray 91a is moved to the exchange waiting area and placing of the package on the tray of the second tray 91b may begin, and the first tray 91a When the full tray loaded in the exchange waiting area is retrieved and a new tray is supplied, the tray of the tray 91a moves to the loading waiting area and can wait until the tray of the second tray 91b becomes full. And when the tray of the second tray (91b) is in a full state, the second tray (91b) can be moved to the exchange waiting area, and package placing for a new tray of the first tray (91a) can be started. .

In this way, in relation to the placing of good packages, which are loaded quickly because they are in large quantities compared to defective packages, when loading of the good packages on one of the two trays 91a and 91b is completed and the tray must be recovered, the tray must be recovered. Even in the process of tray recovery, good quality packages can be continuously loaded onto other trays, so package loading can be done without stopping operation when collecting trays and supplying new trays.

In addition, referring to FIG. 17, the classification module 90 is provided on the other side of the first rail 910a to the third rail 910c in the Y-axis direction and includes tray loading units 930a and 930b where supplied or recovered trays are loaded. , 930c) may be provided in plural numbers. For example, the plurality of tray stackers 930a, 930b, and 930c include a first tray stacker 930a on which a plurality of new trays are stacked, and a second tray on which a package determined as good is placed is stacked. It may include a tray loading unit 930b and a third tray loading unit 930c where a tray on which a package determined to be defective is placed is loaded. Accordingly, the tray that is moved to the exchange waiting area and recovered can be recovered to the second tray loading unit 930b, and the tray on which the package determined to be defective in the third tray 91c is placed is placed in the third tray loading unit ( It can be recovered to 930c), and a new tray can be supplied from the first tray loading unit 930a.

For reference, referring to FIG. 17 , the tray loading units 930a, 930b, and 930c may include sensors capable of detecting trays seated on two support members. The sensor can detect the presence or absence of a tray seated on the two support members and the position of the tray by transmitting and receiving sensor light (S) crossing the two support members.

In addition, referring to FIG. 1, supply and recovery of trays can be performed by the tray picker unit 940, which grasps and seats a new tray from the first tray loading unit 930a. Alternatively, the tray on which the package judged to be good is placed is held and placed in the second tray loading unit 930b, or the tray in which the package judged to be defective is placed is held and placed in the third tray loading unit 930c. You can.

Referring to FIG. 1, the tray picker unit 940 includes an It is provided to be movable along the X-axis rail unit 941 on the other side of the X-axis rail unit 941 in the It may include a tray picker unit 942 capable of holding a tray. Exactly, the .

The description of the present application described above is for illustrative purposes, and those skilled in the art will understand that the present application can be easily modified into other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. For example, each component described as unitary may be implemented in a distributed manner, and similarly, components described as distributed may also be implemented in a combined form.

The scope of the present application is indicated by the claims described below rather than the detailed description above, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present application.

1: Package cutting and sorting system
10: input module
11: Strip recovery unit
12: Smart alignment unit
20: cutting module
30: cleaning module
40: drying module
41: loading part
42: flip part
43: Air knife section
50: first picker module
60: table
70: Second picker module
80: Inspection module
90: Classification module
91: tray
92: Reject bin

Claims (6)

In a package cutting and sorting system equipped with an air dryer,
An input module provided to supply a semiconductor strip;
a cutting module that cuts the semiconductor strip into a plurality of packages;
a cleaning module that cleans the plurality of packages;
a drying module including an air knife unit with a slit for discharging a dry air stream to dry the plurality of cleaned packages;
a table on which the plurality of dried packages are placed;
a first picker module transferring the plurality of packages from the drying module to the table;
a second picker module provided to grasp and transport at least some of the plurality of packages seated on the table;
an inspection module that inspects the plurality of packages; and
a classification module having a receiving space in which each of the plurality of packages is accommodated according to an inspection result by the inspection module;
Including,
The drying module is,
a loading portion on which the plurality of washed packages are placed; and
A flip part disposed on an upper side of the loading unit and rotatably provided to hold a plurality of packages seated on the loading unit,
It further includes,
The air knife part,
a first air knife unit disposed relative to the loading unit to discharge the dry air current; and
A second air knife portion disposed relative to the flip portion to discharge the dry air stream,
Including,
The drying module is,
Based on the distance information between the reference position set for the loading unit and the reference position set for the flip unit and the rotation state information of the flip unit, at least one of the first air knife unit and the second air knife unit A system comprising air flow direction adjustment means for controlling at least one of the first air knife unit and the second air knife unit so that the opening direction of the formed slit is toward the area where the plurality of packages are located. delete According to paragraph 1,
The first air knife unit discharges the dry air stream in an upward direction,
The system is characterized in that the second air knife unit discharges the dry air stream in a downward direction. According to paragraph 1,
The classification module is,
A system comprising a reject bin that divides a plurality of receiving spaces in which each of the plurality of packages is accommodated according to an inspection result by the inspection module. According to paragraph 1,
The input module is,
A strip recovery unit that determines whether the semiconductor strip needs to be recovered and, depending on the result of the determination as to whether the semiconductor strip needs to be recovered, recovers the semiconductor strip or inserts the semiconductor strip into the cutting module,
A system that includes a. According to paragraph 1,
The input module is,
A smart alignment unit that transfers the semiconductor strip to the cutting module and aligns the transfer direction of the semiconductor strip according to the result of sensing the insertion position of the semiconductor strip,
A system that includes a.

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