KR101635113B1 - Semiconductor strip grinder - Google Patents
Semiconductor strip grinder Download PDFInfo
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- KR101635113B1 KR101635113B1 KR1020140162732A KR20140162732A KR101635113B1 KR 101635113 B1 KR101635113 B1 KR 101635113B1 KR 1020140162732 A KR1020140162732 A KR 1020140162732A KR 20140162732 A KR20140162732 A KR 20140162732A KR 101635113 B1 KR101635113 B1 KR 101635113B1
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- vacuum
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Abstract
A semiconductor strip grinder, comprising: a vacuum chuck unit for fixing and cleaning a semiconductor strip to remove a protective molding layer of a semiconductor strip; a first picker for sequentially loading a semiconductor strip onto the vacuum chuck unit; A drying unit for drying the semiconductor strip ground by the grinding unit and a second picker for loading the semiconductor strip ground in the grinding unit into the drying unit, And the molding layer formed on the unit substrate of the semiconductor strip is removed to obtain the effect that the entire thickness of the semiconductor strip can be reduced.
Description
The present invention relates to a semiconductor strip grinder, and more particularly, to a semiconductor strip grinder which comprises a semiconductor chip mounted on an upper surface of a base substrate and grinding a protective molding layer of a semiconductor strip on which a plurality of packaged unit substrates are arranged, To a semiconductor strip grinder.
In general, a semiconductor package is manufactured by manufacturing a semiconductor chip on which a highly integrated circuit such as a transistor and a capacitor is formed on a semiconductor substrate made of a silicon material, attaching the semiconductor chip to a strip material such as a lead frame or a printed circuit board, The strip materials are electrically connected to each other by wires or the like so as to be energized with each other, and then molded by epoxy resin in order to protect the semiconductor chip from the external environment.
These semiconductor packages are packaged in a matrix type arrangement on the strip material, and each package in the strip material is cut and individually separated, and the individually separated packages are sorted according to a preset quality standard, And sent to the next process.
The completed form of the molding process is called a semiconductor strip or semiconductor material, and the semiconductor strip includes a plurality of semiconductor packages. A cutting process is performed to separate each semiconductor package from a semiconductor strip or semiconductor material.
First, a semiconductor strip may be seated on a chuck table or a cutting table of the manufacturing apparatus. That is, the semiconductor strips before the plurality of semiconductor packages are separated can be seated through the strip picker.
The semiconductor strip is cut into a single package, i. E., A unit package, through a cutting device. Specifically, the semiconductor strip is cut into a semiconductor package through a relative movement between the cutting device and the vacuum chuck unit while being placed on the vacuum chuck unit.
After the cutting process, the plurality of semiconductor packages are moved through a unit picker or package picker for subsequent processing such as cleaning and drying.
The plurality of semiconductor packages, which have been cleaned and dried, are transferred to the turntable through the turntable picker. In the turn table, vision inspection of the semiconductor package can be performed, and the semiconductor package having been inspected can be classified through the sorting picker.
For example, Patent Document 1 and Patent Document 2 described below disclose a structure of a suction unit of a semiconductor strip and a semiconductor manufacturing apparatus.
Patent Document 1 discloses a semiconductor device having a plurality of unit substrates formed by partitioning a rectangular base substrate and a base substrate, a mold gate formed on a part of a plurality of unit substrates located at a long side of the base substrate, The dummy formed on both short sides of the substrate strip.
Patent document 2 includes a semiconductor strip or a body having an adsorption pad adapted to adsorb a plurality of semiconductor packages and an adsorption pad accommodating section for accommodating the adsorption pad. The adsorption pad is formed to correspond to the rim size of the adsorption pad accommodating section, A structure of a suction unit for a semiconductor manufacturing apparatus adhered to a housing portion is described.
However, in the conventional technology, the semiconductor strip is formed by forming a protective molding layer around the unit substrate in order to protect each unit substrate mounted on the base substrate, and the protective molding layer is formed not only on the right and left, The entire thickness of the strip becomes thick.
That is, in the prior art, there is no semiconductor strip grinder capable of grinding the protective molding layer of the semiconductor strip. Therefore, there has been a problem that the semiconductor strip having the thickened thickness due to the protective molding layer has to be used as it is.
In the conventional polishing of semiconductor strips or wafers, the wafer holding jig and the table are rotated, and then the holding jig or table is moved up and down to bring the semiconductor wafer and the polishing surface of the table into sliding contact with each other, There is a problem that it is difficult to precisely grind the semiconductor strip or wafer mounted on the table in accordance with the rotation of the table.
In order to process semiconductor strips of different thicknesses, it is not possible to adjust the working distance of the pickers, so that during the pickup process, the semiconductor strips There is a problem that breakage or damage occurs.
As a result, it is necessary to replace the entire picker when machining semiconductor strips having different thicknesses. As a result, the work is delayed and a dedicated picker for each semiconductor strip needs to be provided. As a result, the number of components increases and manufacturing and maintenance costs increase.
In addition, in the conventional semiconductor strip grinding process, it is difficult to supply cutting oil to the grindstones and the entire surface of the semiconductor strips due to the spraying of the cutting oil only on one side, shortening the life time of the grindstones, shortening the replacement period of the grindstones, There was a problem.
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor strip grinder capable of reducing a thickness of a semiconductor strip by removing a molding layer on a unit substrate of a semiconductor strip.
It is another object of the present invention to provide a semiconductor strip grinder capable of improving the layout structure of a semiconductor strip grinder so as to straighten the movement path during grinding of a semiconductor strip.
It is still another object of the present invention to provide a semiconductor strip grinder capable of stably picking up semiconductor strips of various thicknesses by setting a vacuum pressure during semiconductor strip pickup.
It is still another object of the present invention to provide a semiconductor strip grinder capable of improving a working speed in grinding a semiconductor strip.
In order to achieve the above object, a semiconductor strip grinder according to the present invention includes a vacuum chuck unit for fixing and cleaning a semiconductor strip to remove a protective molding layer of a semiconductor strip, A semiconductor chip having a first picker, a grinding unit for grinding and removing the protective molding layer of the semiconductor strip loaded on the vacuum chuck unit, a drying unit for drying the semiconductor strip ground by the grinding unit, And a second picker for loading into the drying unit, wherein a first stacking unit, a drying unit, an inspection module, and a second stacking unit are provided on both sides of the vacuum chuck unit, and the semiconductor strips are sequentially moved in a straight line, The operation is performed.
As described above, according to the semiconductor strip grinder of the present invention, the entire thickness of the semiconductor strip can be reduced by removing the molding layer formed on the unit substrate of the semiconductor strip.
According to the present invention, the first stacking unit, the drying unit, the inspection module, and the second stacking unit are provided on both sides of the vacuum chuck unit, and the semiconductor strips are stacked on one So that it is possible to improve the working speed by minimizing the moving distance of the entire working process of removing the protective molding layer of the semiconductor strip, So that the space utilization can be maximized.
In particular, according to the present invention, it is possible to further improve workability by providing a plurality of vacuum chuck units and sequentially performing grinding and cleaning operations.
According to the present invention, by moving the semiconductor strip in the feeding mode when supplying and stacking the semiconductor strip, it is possible to prevent damage or breakage of the semiconductor strip that may occur during the movement process.
Further, according to the present invention, the semiconductor strip is picked up at a predetermined vacuum pressure so as to prevent damage or breakage of the semiconductor strip caused by picking up by the picker, and only the vacuum pressure It is possible to easily grind and load the semiconductor strips having different thicknesses without changing the picker.
According to the present invention, since the spray nozzles are provided on both sides of the grindstone and the spray tubes are provided on the front and rear sides to spray the cutting oil toward the grindstone and the grinded surface of the semiconductor strip on each side of the grindstone and the semiconductor strip, By effectively lubrication between the grinding surfaces of the semiconductor strips, it is possible to reduce the abrasion of the grinding wheel during grinding, to cool the grinding wheel to extend the service life of the grinding wheel, and to improve the precision of the grinding operation .
According to the present invention, since the semiconductor strip is dried by rotating the semiconductor strip in the case of the drying unit, it is possible to prevent water or grinding dust from being scattered during the drying process, and the semiconductor strip can be firmly fixed By the rotation and drying, it is possible to prevent breakage or damage of the semiconductor strip in the course of drying.
Further, according to the present invention, the semiconductor strip can be quickly and completely dried within a short time, thereby improving the accuracy of the vision inspection performed in the next step.
1 is a perspective view of a semiconductor strip grinder according to a preferred embodiment of the present invention,
FIG. 2 is a plan view of the semiconductor strip grinder shown in FIG. 1 with the housing removed;
Figure 3 is a top view of the supply module,
Figure 4 is a side view of the supply module,
5 is a perspective view of the first and second pickers,
6 is an enlarged perspective view of the first picker with the front case removed,
7 is a perspective view of the grinding unit,
FIG. 8 is an illustration showing a state in which the wheel housing is opened to explain a grinding wheel changing method of the grinding unit shown in FIG. 7,
Figs. 9 and 10 are diagrams showing the operating state of the locking plate,
11 is a perspective view of the drying unit,
Fig. 12 is a perspective view of the drying unit shown in Fig. 11,
13 is an enlarged view of the fixed unit,
Figs. 14 and 15 are diagrams showing the operation state of the fixed unit according to the lifting operation of the seating plate,
16 is a process diagram for explaining steps of operating a semiconductor strip grinder according to a preferred embodiment of the present invention step by step,
Figs. 17 to 20 illustrate examples of the semiconductor strip before and after the grinding operation. Fig.
Hereinafter, a semiconductor strip grinder according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
In the following, the terms "upward", "downward", "forward" and "rearward" and other directional terms are defined with reference to the states shown in the drawings.
FIG. 1 is a perspective view of a semiconductor strip grinder according to a preferred embodiment of the present invention, and FIG. 2 is a plan view with the housing of the semiconductor strip grinder shown in FIG. 1 removed.
1 and 2, a
In addition, the
As described above, the present invention can be applied to each of the equipment for performing each process such as grinding, cleaning, drying, and inspection, and a
On the front surface of the
As described above, according to the present invention, the first stacking unit, the drying unit, the inspection module, and the second stacking unit are installed on both sides of the vacuum chuck unit, and the semiconductor strips are stacked on one And sequentially perform the respective processes while moving along the straight line.
Accordingly, the present invention minimizes the movement distance of the entire process of removing the protective molding layer of the semiconductor strip, thereby improving the operation speed and simplifying the structure of the entire device, thereby maximizing the space utilization.
In this embodiment, the direction in which the semiconductor strips sequentially move along one straight line (X-axis direction) is referred to as a 'semiconductor strip transport direction'.
Hereinafter, the configuration of each equipment provided in the semiconductor strip grinder will be described in detail in the order of the entire process.
The
For example, Figure 3 is a top view of the feed module, and Figure 4 is a side view of the feed module.
3 and 4, the
The conveying
A sensing sensor (not shown) for sensing the position of the semiconductor strip may be installed at a predetermined position in the conveying path of the semiconductor strip including the conveying
The sensing signal of the sensing sensor is transmitted to a control unit (not shown) that controls the operation of each device provided in the
The elevating
The conveying
The
2, the
The thickness inspection robot is installed on one side of the grinding
The
The
To this end, the
On the upper surface of the chuck table 21, there is provided a suction fixing part corresponding to the size and shape of the semiconductor strip, and a plurality of suction holes may be formed on the lower surface of the suction fixing part.
In this chuck table 21, the air charged in the space between the adsorption fixing unit and the semiconductor strip is discharged through the air suction hole by the driving of the vacuum pump, and suction force by vacuum is generated to stably adsorb and fix the semiconductor strip have.
Then, the chuck table 21 can clean the semiconductor strip which has been subjected to the grinding operation by using the washing water supplied by the driving of the washing water pump.
To this end, one end of the chuck table 21 may be connected to an intake pipe connected to a vacuum pump and a cleansing water supply pipe supplied with cleansing water.
The chuck table (21) may be provided with a cleaning unit (23) for cleaning the upper and lower surfaces of the semiconductor strips cleaned by the washing water.
The Y-
To this end, the Y-
On the other hand, in order to improve the semiconductor strip grinding operation speed in this embodiment, the
That is, the present invention can provide a plurality of vacuum chuck units, and simultaneously perform the grinding operation of the next semiconductor strip while performing the cleaning and thickness inspection operation after the grinding operation of one semiconductor strip is completed.
Accordingly, the present invention can improve the efficiency of the semiconductor strip grinding process by about 1.5 times or more by using a plurality of vacuum chuck units.
Further, the present invention can be modified to include a plurality of grinding units to correspond to a plurality of vacuum chuck units.
Accordingly, the present invention can further improve the working speed by simultaneously performing the grinding, cleaning, and thickness inspection operations on the plurality of vacuum chuck units.
The
In addition, the first and
For example, FIG. 5 is a perspective view of the first and second pickers, and FIG. 6 is an enlarged perspective view with the front case of the first picker removed.
5, the
Since the first and
The
The
A plurality of suction holes may be formed in the
The
The
On the other hand, a
The control unit sets the vacuum pressure for picking up the semiconductor strip in advance and controls the first and
As described above, according to the present invention, the semiconductor strip is picked up at a predetermined vacuum pressure to prevent damage or breakage of the semiconductor strip caused by picking up by the picker.
Further, according to the present invention, by changing only the vacuum pressure which has been established in the program for driving the picker, the semiconductor strip having different thickness can be easily loaded and ground without changing the picker.
The
The horizontal moving
The driving module provided in the vertical moving
A pair of
Next, the construction of the grinding unit will be described in detail with reference to Figs. 7 and 8. Fig.
FIG. 7 is a perspective view of the grinding unit, and FIG. 8 is an exemplary view showing a state in which the wheel housing is opened to explain a grinding wheel changing method of the grinding unit shown in FIG.
The grinding
7 and 8, the grinding
The grinding
The
The grinding
The
The rotational speed of the
The grinding
The
The
Accordingly, the control unit can control the driving of the X-axis and Z-
Here, the control unit can control the grinding operation to be performed by the sequential grinding method by the grinding
Meanwhile, in this embodiment, as shown in FIG. 8, the
The
The
A
The
The
The
Inside the lower end portions of the first and
Here, each of the
A supply pipe for supplying cutting oil is connected to one side of the
The pair of
As described above, according to the present invention, the injection nozzles are provided on both sides of the grindstone, and the spray pipes are provided on the front and rear sides, respectively, so that the cutting oil can be sprayed toward the grindstone of the grindstone and the grindstone of the semiconductor strip.
Accordingly, the present invention effectively lubes between the grinding surface of the grinding wheel and the semiconductor strip, thereby reducing the abrasion of the grinding wheel during the grinding operation, cooling the grinding wheel to extend the service life of the grinding wheel, Can be improved.
On the other hand, the
The locking
The locking
For example, Figs. 9 and 10 are operational state diagrams of the locking plate.
Fig. 9 shows a state in which the driving shaft is unlocked, and Fig. 10 shows a state in which the driving shaft is locked by moving the locking plate.
In order to replace the
Here, a fixing
As a result, the worker must rotate the fixed
In order to solve such a problem, in the present embodiment, the locking
Therefore, when the grinding
10, when the locking
Each of the locking
The engaging
A movable space is formed in the fixed
In addition, a
The
Therefore, the control unit determines the coupled state of the first and
As described above, according to the present invention, it is possible to easily separate and replace the fixed cap and the grindstone by locking the drive shaft using the locking plate.
According to another aspect of the present invention, there is provided a locking device for a vehicle, comprising a locking plate formed on a locking plate, and a sensing switch for sensing a coupled state of the first and second housings is provided on one side of the wheel housing, It is possible to prevent the drive shaft from being damaged or broken.
Next, the construction of the drying unit will be described in detail with reference to Figs. 11 and 12. Fig.
Fig. 11 is a perspective view of the drying unit, and Fig. 12 is a perspective view of the drying unit shown in Fig. 11, with the case removed.
11 and 12, the drying
The drying
The
A
For example, FIG. 13 is an enlarged view of the fixed unit.
13, the fixing
The fixing
That is, the fixing
At the upper end of the
One side of the
Meanwhile, the fixing
The
The
For example, Figs. 14 and 15 are operational state diagrams of the fixed unit according to the lifting operation of the seating plate.
Fig. 14 shows a state in which the semiconductor strip is released in the lifting operation of the seating plate, and Fig. 15 shows a state in which the semiconductor strip is fixed in the lifting operation of the seating plate.
14, the rotary bearing 83 presses the hooking
Thus, the fixing
15, the rotary bearing 83 is engaged with the
At this time, the fixing
The drying
The elevating
On the other hand, the drying
11, the
The moving
A position sensing sensor (not shown) for sensing the position of the moving
A pair of
As described above, according to the present invention, the semiconductor strip having been cleaned and dried after the grinding operation is supplied to the next process in a feeding manner by using the feeding robot, thereby preventing damage or breakage of the semiconductor strip that may occur during the supply process.
Next, a method of operating the semiconductor strip grinder according to the preferred embodiment of the present invention will be described in detail with reference to FIG.
16 is a process diagram for explaining a step-by-step operation method of a semiconductor strip grinder according to a preferred embodiment of the present invention.
16, the
Then, the pick-up
At this time, the
The
The
Then, the
In step S14, the controller controls the driving of the
For example, FIGS. 17 to 20 illustrate examples of semiconductor strips before and after a grinding operation.
17 and 18 are respectively a plan view and a sectional view of the semiconductor strip before the grinding operation, and Figs. 19 and 20 respectively show a plan view and a sectional view of the semiconductor strip after the grinding operation.
17 and 18, the
Thus, the grinding
At this time, since the
The grinding
Subsequently, the
Then, the second picker 30 'picks up the semiconductor strip using suction force by the vacuum pressure, cleans the lower surface of the semiconductor strip by using the
2, when a pair of
And, while the grinding operation of the loaded semiconductor strip is completed and the grinding operation is performed, the grinding
In step S16, the drying
More specifically, the elevating
At this time, the fixing
When the semiconductor strip is fixed, the control unit controls the driving of the
As described above, according to the present invention, since the semiconductor strip is dried by rotating the semiconductor strip in the case of the drying unit, water or grinding dust can be prevented from scattering during the drying process.
In addition, according to the present invention, the semiconductor strip can be prevented from being broken or damaged during the drying process by rotating and drying the semiconductor strip with the fixed unit firmly fixed.
Further, the present invention can quickly and completely dry the semiconductor strip in a short time, thereby improving the accuracy of the vision inspection performed in the next process.
When the drying operation is completed, the elevating
At this time, the holding
As described above, according to the present invention, by moving the semiconductor strip in the feeding manner and supplying it to the vision rail, it is possible to prevent the semiconductor strip from being damaged during the supply process.
In step S18, the
The control unit controls to repeat steps S10 to S20 until the grinding operation of the entire semiconductor strip to be ground is completed.
Through the above process, the present invention can sequentially perform the grinding, cleaning, drying, and inspecting process while moving the semiconductor strip along one straight line.
Although the invention made by the present inventors has been described concretely with reference to the above embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention.
In the above embodiment, a pair of vacuum chuck units are provided. However, the present invention is not limited thereto, and one or more vacuum chuck units may be provided to perform grinding, cleaning, . ≪ / RTI >
In the above embodiment, only one grinding unit has been described. However, in the case where a plurality of vacuum chuck units are provided, the present invention may be modified to provide a plurality of grinding units.
The present invention is applied to a semiconductor strip grinder technique for grinding and removing a molding layer on a unit substrate of a semiconductor strip.
10: semiconductor strip grinder 11: housing
12: base 13: guide frame
14: cable bear 15: guide rail
20: vacuum chuck unit 21: chuck table
22: Y-axis robot 23: Cleaning unit
24:
31: pickup part 311: bottom plate
312: intermediate plate 313: upper plate
32: rotation part 321:
322: rotating cylinder 33: vertical moving part
331: vertical guide 332: front case
34: horizontal moving part 341: horizontal guide
35: load cell 40: grinding unit
41: grinding wheel 411: driving wheel
412: Grinding portion 42: Housing portion
421: Wheel housing 422: Cover
423:
427: Fixing
45: Support plate 46: Distance detection sensor
47: drive shaft 471: fixed cap
472: fixed projecting portion 48: injection nozzle
481: Injection pipe 482: Injection pipe
50: drying unit 51: seating plate
511: Guide rib 52:
53: rotation motor 54:
55: upper plate 56: case
60: locking unit 61: locking plate
62: fixing plate 63: engaging hole
64: Fixing hole 65: Extension part
66: jaw 70: sensing unit
80: Fixing unit 81: Fixing member
82: Bracket 83: Rotary bearing
84: vertical part 85: horizontal part
86: fixed jaw 87: hook jaw
88: elastic member 89: mounting bracket
90: Feeding unit 91:
92: feeding member 93: moving plate
110: first loading section 111: magazine
112: Magazine moving robot 120: Supply module
121: Feeding rail 122: Feeding robot
123: lift unit 124: cylinder
125: lifting plate 126: moving member
127: Robot arm 130: Inspection module
131: Vision Rail 132: Vision Robot
140: Second loading section 141: Loading robot
Claims (10)
A vacuum chuck unit for fixing and cleaning the semiconductor strip to remove the protective molding layer of the semiconductor strip,
A supply module for sequentially supplying the semiconductor strips loaded on each magazine,
A first picker for sequentially loading the semiconductor strip supplied from the supply module to the vacuum chuck unit,
A grinding unit for grinding and removing the protective molding layer of the semiconductor strip loaded on the vacuum chuck unit,
A drying unit for drying the semiconductor strip ground by the grinding unit,
A second picker for loading the ground semiconductor strip in the grinding unit into the drying unit,
An inspection module for inspecting the accuracy of the semiconductor strip having completed the grinding operation, and
And a second stacking portion for stacking the tested semiconductor strips,
Wherein the first stacking unit, the supply module, and the first picker are disposed on one side of the vacuum chuck unit, the drying unit, the inspection module and the second stacking unit are disposed on the other side of the vacuum chuck unit, And each operation is performed while moving the semiconductor strip grinder sequentially.
A chuck table for forming a vacuum and fixing the semiconductor strip by an adsorption method,
A Y-axis robot for moving the chuck table in a direction perpendicular to the conveying direction of the semiconductor strip,
A vacuum pump connected to the chuck table and forming a vacuum to generate a suction force,
And a rinse water pump for supplying rinse water to the chuck table.
A pick-up section for picking up the semiconductor strip by a vacuum suction method,
A rotation part for rotating the pickup part in the left-right direction,
A vertical moving part connected to the upper part of the rotating part and moving the rotating part in the vertical direction,
And a horizontal moving unit for moving the vertical moving unit along the X-axis direction along a guide frame installed on one side of the base.
The first and second pickers are each provided with a load cell for sensing a vacuum pressure for picking up a semiconductor strip,
Wherein the first and second pickers change the vacuum pressure to pick up the semiconductor strips having different thicknesses according to the set pressure.
Wherein the magazine moving robot moves the magazine on which the semiconductor strip is loaded to a predetermined position and moves the magazine upward or downward in the first loading unit.
A feed rail for guiding the semiconductor strips loaded on the magazine to the grinding unit side,
A transfer robot for transferring the semiconductor strip from one side of the semiconductor strip along the transfer rail in a feeding manner;
And a lifting / lowering unit that lifts up the semiconductor strip moved to a predetermined position by the transfer robot.
The second loading unit is provided with a loading robot for moving the magazine upward or downward so as to load the semiconductor strip into the empty magazine to which the semiconductor strip is to be loaded and for moving the loaded magazine to the loading space A semiconductor strip grinder.
A plurality of vacuum chuck units are provided,
Wherein the plurality of vacuum chuck units clean the chuck table of the vacuum chuck unit while the grinding operation is performed in each of the different vacuum chuck units, and wait for the next semiconductor strip to be supplied.
Wherein the grinding unit is provided with a number equal to or less than the number of vacuum chuck units when a plurality of vacuum chuck units are provided.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140162732A KR101635113B1 (en) | 2014-11-20 | 2014-11-20 | Semiconductor strip grinder |
| TW104128602A TW201620063A (en) | 2014-11-20 | 2015-08-31 | Semiconductor strip grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140162732A KR101635113B1 (en) | 2014-11-20 | 2014-11-20 | Semiconductor strip grinder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160060423A KR20160060423A (en) | 2016-05-30 |
| KR101635113B1 true KR101635113B1 (en) | 2016-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140162732A KR101635113B1 (en) | 2014-11-20 | 2014-11-20 | Semiconductor strip grinder |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101635113B1 (en) |
| TW (1) | TW201620063A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101896269B1 (en) | 2017-05-18 | 2018-09-11 | 서우테크놀로지 주식회사 | Semiconductor strip grinder |
| KR20180119038A (en) | 2017-04-24 | 2018-11-01 | 서우테크놀로지 주식회사 | Semiconductor package grinder |
| KR20190121976A (en) | 2018-04-19 | 2019-10-29 | 서우테크놀로지 주식회사 | Grinding thickness control apparatus and method of semiconductor package grinder |
| KR102166782B1 (en) * | 2020-02-21 | 2020-10-16 | 제너셈(주) | Semiconductor strip grinder system |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101851383B1 (en) * | 2016-06-20 | 2018-06-07 | 서우테크놀로지 주식회사 | Semiconductor wafer grinder with the same |
| CN110176416B (en) * | 2019-05-08 | 2021-09-03 | 中义(杭州)医药科技有限公司 | Chip picking equipment with dust removal function |
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| JP2010506422A (en) * | 2006-10-09 | 2010-02-25 | ハンミ セミコンダクター カンパニー リミテッド | Processing apparatus and semiconductor strip processing system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100872129B1 (en) | 2007-07-04 | 2008-12-08 | 삼성전기주식회사 | Substrate strip |
| US8124471B2 (en) * | 2008-03-11 | 2012-02-28 | Intel Corporation | Method of post-mold grinding a semiconductor package |
| KR101411157B1 (en) * | 2012-07-31 | 2014-06-23 | 세메스 주식회사 | Apparatus for processing a substrate |
| KR101415162B1 (en) | 2012-08-20 | 2014-07-04 | 한미반도체 주식회사 | Suction unit for semiconductor manufacturing apparatus |
-
2014
- 2014-11-20 KR KR1020140162732A patent/KR101635113B1/en active IP Right Grant
-
2015
- 2015-08-31 TW TW104128602A patent/TW201620063A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010506422A (en) * | 2006-10-09 | 2010-02-25 | ハンミ セミコンダクター カンパニー リミテッド | Processing apparatus and semiconductor strip processing system |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180119038A (en) | 2017-04-24 | 2018-11-01 | 서우테크놀로지 주식회사 | Semiconductor package grinder |
| KR101896269B1 (en) | 2017-05-18 | 2018-09-11 | 서우테크놀로지 주식회사 | Semiconductor strip grinder |
| KR20190121976A (en) | 2018-04-19 | 2019-10-29 | 서우테크놀로지 주식회사 | Grinding thickness control apparatus and method of semiconductor package grinder |
| KR102166782B1 (en) * | 2020-02-21 | 2020-10-16 | 제너셈(주) | Semiconductor strip grinder system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201620063A (en) | 2016-06-01 |
| KR20160060423A (en) | 2016-05-30 |
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