TW200834785A - System for manufacturing semiconductor packages and method for manufacturing semiconductor packages - Google Patents

Abstract

A system for manufacturing semiconductor packages and a method for manufacturing semiconductor packages are disclosed. The semiconductor package manufacturing system includes a loading and unloading unit for loading semiconductor packages, a package fixing unit for fixing the semiconductor packages, loaded by the loading and unloading unit, to a jig so as to cut the semiconductor packages, a cutting unit for cutting the semiconductor packages, fixed to the jig, a first washing unit for washing one-side surfaces, i.e., the tops or bottoms, of the semiconductor packages, cut by the cutting unit, and a second washing unit for washing the other-side surfaces of the semiconductor packages. According to the present invention, the whole process is automatically carried out, and therefore, the total size of the semiconductor package manufacturing system is reduced. Consequently, the present invention has the effect of greatly reducing the manufacturing costs and time.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for manufacturing a semiconductor package, and more particularly to a semi-system capable of automatically manufacturing a target object, such as a semiconductor package, and a method of fabricating the same. [Coating] In recent years, semiconductor packages have been used in various ways. For example, if the material is to be sealed, it is necessary to manufacture it in a suitable shape. To this end, the strips (such as ρ) that have a plurality of swivel packages must correspond to the respective semi-conductors _= cut into complex numbers, and the 转 魄 贼 贼 制造 制造 制造 制造 制造 制造 制造 制造 制造 依照 依照 依照 依照 依照 依照 依照 依照 依照The user directly inserts the person--------------------------------------------------------------------------------------------------------

This method 'casts the shape for casting package manufacturing. 〇J However, the above conventional techniques have the following problems. Conventional semiconductor packaging processes are performed manually, resulting in long lengths and increased manufacturing costs.衣 间 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁 繁

And one or more problems caused by the shortcomings. σ A pertaining to other features and advantages of the present invention will be apparent from the following description, which will be apparent to those skilled in the art of the present invention. OBJECTS OF THE INVENTION The other advantages will be realized and obtained through the specific scope of the patent application and the designation of the drawings. Therefore, the manufacturing system for the semiconductor package disclosed by the present invention is included. a load-and-load unit, a package fixing unit, a cutting unit, a month/wash unit, and a second cleaning unit; wherein the loading and unloading unit is for loading a semiconductor package; the package fixing unit __ The semiconductor loading and unloading of the semiconductor county to m to the semiconductor domain; the ingenuity is used to cut the coffee to the fixture of the semiconductor package; the first - cleaning unit is the secret cleaning ^_ unit cutting semiconductor package - the side, such as the top or bottom; and the second cleaning unit, the cleaning is transferred to the other side. Preferably, the manufacturing of the swivel package includes a transmission unit, For transporting the semiconductor package loaded by the loading and unloading unit to the package fixing unit. Preferably, the manufacturing secret of the riding device further comprises a dry scale element, which is used for drying and cleaning by the first cleaning unit and the second cleaning unit. The semiconductor package. Preferably, the butterfly unit includes a position changing device for converting the reverse direction. '' Preferably, the manufacturing of the semiconductor package further includes an inspection unit for inspecting the cut semiconductor package. Whether there is a defect. '; Preferably, the package comprises a main body unit, a _th-propulsion component, a 9200834785 - a second pusher and a chain-moving unit, wherein the main body unit has a clamp holder for accommodating the clamp 'And contains - horizontal components and - vertical secrets, the horizontal components constitute the bottom of the main unit, the vertical components are vertical horizontal components. The first propulsion component is used for the Qin semiconductor package in the fixture, the first - the propulsion component can be along the axis Moving horizontally on the horizontal element in the direction of the γ-axis. The second propulsion component corresponds to the first, propulsion component setting 'for removing the semi-guide from the fixture The package is provided for the (4) clamp to protect the lungs, and then the semiconductor package (4) is embedded in the stomach and fixed to the clamp W. The rut ^ land 'di' propulsion assembly includes a main body portion, a seat block and a The first propulsion unit is a domain of the first propulsion unit. The support block is disposed at the top end of the main body, and the drunk conductor package is located at the top of the support block. The first propulsion unit is the same as the support block. The height of the swivel package is moved horizontally to encapsulate the body into the slit of the fixture.

Preferably, the second propulsion assembly comprises a main body portion and a second propulsion unit. The main body of the eighth middle body forms the main body of the second propulsion unit, and the second propulsion unit is horizontally movable along the blue body to remove the semiconductor package from the slit of the jig. In addition, the present invention provides a method for manufacturing a swivel package, which is a package order = step Lai Semiconductor County to "manufacturing money; fixing the semiconductor to the jig, cutting and fixing the semiconductor package to the jig; Package. The fabrics of enamel, enamel, and semiconductor are also included in the process of packaging the conductor. The step of cleaning and drying the cut semiconductor package includes: cleaning the top of the semiconductor package; cleaning the bottom of the semiconductor package; and drying the semiconductor package. The method of manufacturing the semiconductor package of the vehicle father's semiconductor package further includes the step of detecting whether the semiconductor package has been defective. Preferably, the method of fabricating the semiconductor package further includes the step of detecting and correcting the degree of deviation of the cut semiconductor package. It is to be understood that the following general description and the following detailed description are merely illustrative and illustrative of the invention DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, the same reference numerals will be used to refer to the same or similar elements throughout the drawings. Lu "Fig. 1" is a schematic structural view of a semiconductor package manufacturing system of the present invention. Hereinafter, the overall structure of the semiconductor package manufacturing system of the present invention will be outlined in the "Figure 1" of Mai Kao. The semiconductor county manufacturing system of the present invention comprises a loading unit, a transfer unit (10), a package fixing unit 3, a cutting early 5GG, a cleaning and drying unit, and an inspection unit. The #unit unloading unit is used to load an unmanufactured semiconductor package sp to a semiconductor package and to unload the fabricated semiconductor package SP from the manufacturing system. The semiconductor package 用于 used to load the loading and unloading unit 1 11 11 200834785 to - pre-granulation ‘the towel is to manufacture the semiconductor _ sp at this predetermined position. The package fixing unit is fixed to the swivel package SP that transports the transfer unit, so that the semiconductor package sp is cut. The cutting unit is used for cutting the semiconductor package sp fixed to the jig 3U), and the cleaning and drying unit 6 is used for cleaning the swivel package SP cut by the cutting unit 5〇〇. The inspection unit is used to inspect the cut semiconductor package SP to determine whether the semiconductor package SP to be cut is defective. In the following section, the details of the domain will be made by the conductors of the fat conductor. First, the description of the load carrying and unloading unit 1 will be described with reference to Fig. 1. The loading and unloading unit 1 is equipped with a plurality of tray boxes 1 〇 6 in which a tray 102 is placed on each tray box 106. Further, the loading and unloading unit 1A is also provided with a movable port 103 which is attached to the same day on the respective movable tables. Each movable platform 1〇3 structure is transported along a movable station and line 1〇4. The number of tray cassettes 106 can be several. For example, as shown in "i-fi", the number of spring trays I 106 is set to four. In this case, the four tray boxes 1〇6 are respectively determined to have the following positions, that is, the uncut tray on which the still-prepared semiconductor spp is placed, on which the semiconductor package which has been manufactured and which is a good product is placed. Sp ▲ I good tray, which is not (4) miscellaneous sp placed on the miscellaneous disc, and the reprocessing tray on which the semiconductor job sp is paid for defective products. Of course, those skilled in the art can also derive other combinations in accordance with the present invention. The number of movable stations 103 can be plural to increase the processing speed of the semiconductor package manufacturing system. For example, the number of texts on the event desk is three. One of the active stations 12 200834785 can be configured to move along the corresponding active read wheel line (4) while still being unmanufactured. The break (10) on this can be configured as: already manufactured and by the inspection unit 7. . Judging the pin-up SP-shirt on this __ on the defensive occupant, the corresponding mobile station transmission line 104 moves. 710 and Μ Μ 已 Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ At the same time as 〇3, it moves along the corresponding movable stage transmission line 104. = The movable table is transported smoothly so that the movable table can be accessed from each tray box 1〇6. The positional movement below the moving route of the transmission unit pickup 2G4 of the early 7C 200 is transmitted. On the other hand, the 'tray pickup passing line〗 is set above the movable transmission line 1〇4, and the tray pickup transmission line 11〇 Vertically to the active station transmission line. The tray picker transfer line 110 is equipped with a tray picker 112. The tray picker Μ] is used to pick up the tray 102' and transfer the tray 102 between the tray cassette 106 and the movable table 1〇3. Of course, a plurality of tray pickers 112 can be provided to increase the processing speed of the semiconductor package manufacturing system. As long as the dry tray picker 112 can pick up the tray 1〇2, the structure thereof is not particularly limited. Preferably, the consuming tray picker 112 includes a gripping member for gripping the tray 1 〇 2 and a carrying member for transporting the tray 1 〇 2 along the tray picker transfer line 11 . The tray picker 112 can be designed to pick up a tray 102, or can be designed to capture two of the mosquitoes. The #configuration 捡 picker 112 is used to capture two or more eve trays. The transmission capacity of the tray picker m is greatly increased. As shown in Figure 2A, the tray picker 12 can be designed to grab two trays 102. As shown in Fig. 2A, the tray picker '112 includes a main body portion ι4, two pairs of first holding units 116, and two pairs of second holding units 118. The main body portion 114 is formed into a structure of the top and bottom of the main body portion 114, and the first holding unit 116 is opposed to each other for gripping a tray 102. . Two pairs of second clamping units 118 are disposed on the main body portion m - side, and then the two clamping units m are mutually coupled for grasping another tray ι 2 . The size of the main body portion 114 corresponds to the size of the tray 1〇2. This is because when the main body portion m has a size corresponding to the size of the tray 1G2, the tray pickup is reduced by "four", "sub and two pairs of the first clamping unit μ and two pairs of the second clamping. Easy to touch the side of the tray 1〇2. For example, the 2β map shows that the two pairs of first clamping units 116 are disposed opposite each other, and the first pair of Γγ clips *70118 are also disposed opposite to each other. This is because, when the two pairs 116 are opposed to each other, the tray 102 can be secured on its opposite side "may also provide - providing the first clamp for the first clamping unit 116 and the second clamping surface for the second clamp Holding unit II6 and two pairs of second clamping early 118. Each of the brothers**70 116 includes a clamping jaw 116a, a rotating shaft 120 and a 143434785 driving element 116b, wherein the holder 116a is bent to 'n The shaft, the shaft i2 is formed on the curved portion of the holder 116a, and the holder 116& is rotatable. The driving member 116b is for driving the holder 116a. Similarly, each of the second holding units Mg includes a bending The v-shaped clamping ϋ ma is formed on the rotating shaft U0 of the curved portion of the holder 118a, and is further capable of rotating the holder chest and the driving element 118b for driving the missing device. For example, "2B" It is shown that each of the gripper wrists is provided with a positioning groove 116c, and the positioning groove 116e of the n 116a is opposite to the positioning groove 116c of the other holder. Similarly, each of the holders and legs is provided with a positioning groove·, and the positioning groove of one of the holders ma is opposed to the positioning groove me of the other holder. When the tray 1〇2 is picked up by the holders _ and _, the positioning groove is removed and the side is used to guide the side of the tray 1〇2, so that the tray can be firmly picked up. The mother clamps the edge of each of the 116° of the H 116a, and the front edge of the ground is equipped with a catching protrusion. Further, while the shank protrusions of the holder plate protrude toward each other, the kneading protrusion of one of the grippers is opposite to the aging protrusion (10) of the other holder. Similarly, each plum-edge of each device is preferably equipped with g) protrusions, and then, in the case of a (four) joint protrusion _ ^ = large _, one of the holders is invisible. The fish is another - the iron that holds the nma _ relative. When the tray (10) is located in the positioning groove 200834785 8C, the 'hobby fit' and the 118d are used for the bottom end of the tray 102, and the support is pushed in, and the tray can be lifted more stably. Each of the holders 116a is provided with an elastic member 122 opposite to the end on which the opposite slot plate is formed. Similarly, each of the holders Ma is provided with an elastic member h at the other end opposite to the end of the shape having the corresponding positioning groove 118c. The elastic member 122 is disposed between the main body portion 114 and the holder _ With the elastic support holder plate and the application, the holder plate and the uniform can be rotated in a predetermined direction. Preferably, the elastic correcting 122 is provided with an elastic force, =: one of the positioning grooves of the secret a and the middle of the clamping, the groove U8C can be oriented toward the other pair of grippers 116a respectively forming the pair of grippers The positioning groove U8e of the clamp groove 116e and the other scale||118a moves. The drive element 1 survey 118b can be disposed on each of the first gripping unit and the second gripping unit 118, respectively. Further, the drive component secret member can drive the gripper 116a and the drive separately. Alternatively, 'only one drive element is configured, and the other is a chain-moving element ("f 2B mesh" t not _), which is used to hold the grippers 116a and 118a. The driving element 116b and the system are disposed on the side of the main body portion 114 for pushing the portions of the holders 116a and 118a on which the positioning grooves 116c and mc are formed. In particular, the drive member 116b and the intestine are used to provide - the force of the arm, and the elastic member 122 provides the -elastic force, and thus the holder n6aA118a is rotatable in a direction opposite to the direction of rotation of the holders U6a and 118a. 16 200834785 At the same time, the clamping unit comprises a first clamping unit 116 and a second clamping unit 118. As shown in "2A®", the first clamping unit 116 is used to check the first tray purchase, and the first tray 102a is adjacent to the main body portion 114, and the second sacrificial unit 118 is used to pick up the first tray 10a2a. One of the second trays 1〇2b below. • The holder 116a of each first clamping unit U6 and the holder 118a of each second clamping unit .U8 may extend below the body portion 114 such that each of the second clamping units 118 The extension length of the holder 118a is one more than the extension of the length of the holder 116a of each first holding unit 116. However, the positioning groove i18c of the holder 118a can be configured to simultaneously receive the first tray leg located in the clamping groove 116C of the holder n6a and the second tray 102b in the holder, 118a and 'plurality of guide rods The 124 series is disposed on the side of the main body portion 114, as shown in "2C", the guide bar 124 is used to guide and fix the tray ι 2, and the tray φ % is sufficient by the first clamping unit 116 and the second clamping sheet It 118 is easily picked up below the main body portion 114. • Yahe, as shown in Figure 1, three tray pickers 112 can be configured to • and to be palletized. This is because the number of the movable tables 1〇3 is three, so the processing speed is increased during the loading and unloading of the tray picker 112. In other words, all the trays 1〇2 placed on the two movable tables 1〇3 can be doubled by the tray 4 gold picker 2, thereby increasing the processing speed. For example, one of the tray pickers 112 can be in the run mode and the other two tray pickers can be in the standby mode 17 200834785. This corresponds to the situation in which the tray picker 112 is able to pick up only one tray. When the three live 103 _ 捡 捡 下方 m m , , , , , , , , , , , , , , , , , , 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设 假设On the other hand, in accordance with the present invention, the tray picker 112 is configured such that the number of tray pickups H 112 corresponds to the number of the movable tables 1〇3. Therefore, it is not necessary to judge whether or not the tray 1〇2 placed on the movable table 1〇3 will be picked up. Therefore, the processing speed is increased to some extent. The rotating package SP manufactured by the entire processing of the conductor package manufacturing system is sent by the fresh element (4), and the Wei and domain unit 1〇1 is also used to unload the manufactured semiconductor package SP. Next, the unmanufactured semiconductor package SP moved by the loading and unloading unit 1 while being placed on the movable stage 1〇3 is moved by the transfer unit 2〇〇 to the package fixing unit 兀300. Of course, the above-described unmanufactured semiconductor package SP can also be directly transferred from the loading and unloading unit 1GG to the package ordering unit 3 (10) without being carried through the transport unit. • The transmission unit 200 has a transmission unit pickup transmission line 202, and the transmission unit pickup line 202 is relatively disposed above the movable stage transmission line 104, and the transmission unit pickup transmission line 202 is perpendicular to the movable stage transmission line 1〇4. That is, the transmission unit 捡 pick-up transmission line 202 is arranged in parallel pallet picker transfer line 11 。. A transmission unit pickup 204 is disposed on the transmission unit pickup transmission line 202, and the transmission unit pickup 2〇4 is disposed along the transmission unit pickup transmission line 2〇2

200834785 Mobile. The transfer unit pickup 204 is used to pick up the semiconductor package sp on the tray 102 and transfer the picked up semiconductor package SP to the package fixing unit 3A. In the same manner as the tray pick-up 112, each transport unit picker 2〇4 can include a pick-up element and a handling element. However, unlike the tray picker 112, the transfer unit pick-up unit is used to pick up the respective ribs sp. , f must set up a component to pick up a single semiconductor package SP. - In the embodiment of the present invention, as shown in "Fig. 3A" and "Fig. 3B", each of the transmission unit pickup assemblies includes a pickup assembly. The pickup assembly includes a suction member 208, a vertical movement member 21G, and a rotation member 22A. The suction element is tested for the conductor package sp, the vertical movement element 21 is used to vertically move the suction element 208, and the rotary element 22 is used for the rotary suction element measurement. The suction element 208 is used to draw the semiconductor package sp by vacuum. The top end of the suction element is equipped with a mouthpiece 2G9. A plurality of suction members 2G8 can also be configured as needed. On the fourth day of the "fourth", the number of 208 elements was collected. The set of telecontrol elements 210 is mounted to the pick-up element and includes a first drive element 212 and a first chain element. A drive element 212 is used to generate a driving force when a power source is supplied. The first wire chain motion read 214 is used to transmit the driving force generated by the first driving member 212 to the movement of the suction member. The member 208, in turn, the pick-up element 208 can be used. As long as the power supply to the first drive member 212 is provided, it is difficult for the drive force to be generated, and those skilled in the art can make the first drive element of any face. For example, the first drive element 212 can be a motor. The first-linking element 214 is used to transmit the driving force generated by the first driving element 212 to the suction element. The structure of the first chain moving element 214 is not particularly limited as long as it can transmit the drive generated by the first driving element 212 through the suction element and the suction element can be moved vertically.

For example, as shown in Fig. 3A, the first chain moving element 214 includes a pinion gear and a pinion 218' in which the pinion gear 216 is mounted to a rotating shaft of the motor, so that the pinion gear 216 can rotate with the motor. The rack 218 is threaded onto the suction member 208. Further, the rack 218 and the pinion gear are 216 years old, and the shifting pin and the rotational force are linearly reciprocated. The pickup assembly further includes a rotating member 220 for rotating the suction member 2〇8. The suspected member 22 can include a second drive member and a second key member 224' wherein the second chicken member 222 is used to generate a driving force when the power is supplied. The second chain moving element 224 is used to transmit the driving force generated by the second driving element 222 to the suction element 208, so that the suction element can be rotated. The fresh-driving element 212 is identical, as long as it is capable of generating a driving force when a power source is provided to the second driving element 222, a person skilled in the art of the invention may employ any type of second driving element. According to the invention, the second drive element can be a motor. 20 200834785 The structure of the second keying element 224 is not particularly limited as long as the second chain moving element 224 can transmit the driving force generated by the second driving element 222 to the suction element and the suction element can be rotated. Each transport unit picker 204 can include a plurality of picker assemblies 2〇6. In this case, the processing speed is increased during the transfer of the semiconductor package I, thus reducing the total processing time. According to the invention, as shown in the "figure", each transport unit picker tears contains eight pickup assemblies. Of course, the number of picker assemblies 206 that make up each of the transport unit pickers 204 can be varied as desired. When each of the pickup assemblies 206 is brought into the jig 31〇t, the respective pickup assemblies 206 of the transfer unit pickups 2〇4 are oriented in accordance with the cutting edge 5〇2 direction of the cutting unit 5〇〇 (described in detail below). The system has different embedding directions. At this time, as shown in Fig. 1, the semiconductor package package which needs to be picked up by the transfer unit pickup 2〇4 is arranged on the intermediate stage 302. In order to display the semiconductor package SP on the intermediate stage 3〇2 as shown in Fig. 1, the smear assembly 206 can be designed to have a structure in which a plurality of pickup unit applying suction members 208 are regularly rotated together. Of course, the sucking element 22 for rotating the picker assembly 206 can be configured to rotate the respective picking elements 208 of the picker assembly 206. On the other hand, the structure shown in Fig. 3B can be configured to reduce the number of components constituting the rotation of the cow 220. In particular, the pick-up elements 200834785 in the pick-up stomach assembly 2〇6 must include a second drive==Γ224 in each of the pick-up elements that must be rotated in pairs, wherein the second chain-moving element 224 is used to transport the second drive-off element View. The wire force is applied to the corresponding suction element, and then the suction can be moved - for example, as shown in the "3rd drawing", by the pickup assembly 2〇6 -= which and the third port component is picked up by half_ The sp must be clamped in the direction of the phase π. Therefore, it is possible to provide the first driving member m, the suction member bird and the third suction member e, and the rotational force of the reclining first driving member 222a can be transmitted through the conveyor belt: the second picking member 2〇8a and The third is to take the component. Of course, the pulley 228 can be provided at the first suction and/or three suction elements, and the rotational force can be tilted to the bottom of the tree. Similarly, the swivel job SP, which is picked up by the second pick-up element lion and the fourth pick-up element of the pick-up assembly 206, must be positioned in the _ direction. Therefore, it is possible to construct a second recording element to apply a bucking tree 2 (to make it possible to rotate together. Miscellaneous, (4) make a fifth recording component and a seventh suction component to fight, thereby making it money-up, Moreover, the sixth pick-up element can be fabricated and the eighth pick-up element 2_ can be made to make it (4)_complement. At the same time, the transmission structure is disposed on the first drive element 2, and the pinion gear is not shown in the figure (not shown in FIG. 3B). 'and the rotation axis of the first suction element thin & and the third suction element 208c is a rack (not shown in "Fig. 3B"), and further the 22 200834785 purlin is simultaneously with the first and the suction element The rotation axis of the third pick-up element is turned on, so that the first pick-up element and the second pick-up element of the pick-up assembly can be rotated. Therefore, the first pick-up element listens to the third pick-up element ▲08c simultaneously Rotating in pairs. • Also, the first suction element, the third, the suction element, the fifth suction element 208e, and the seventh suction element of the pickup assembly 206 can be designed: Through the above structure, set half The body package SP is applied by the first-absorbent element, the third suction element, the fifth suction element 2〇8e, and the seventh suction element 2 (% picked up and located on the intermediate stage 302 in the same direction. Of course, the second can also be designed second The suction element 2_, the fourth suction element 208d, the sixth suction element 208f, and the eighth suction element 2 can be co-rotated together. Further, the transmission unit pickup 2〇4 can be constructed so that it can not only pick up and transfer along the transmission unit The line 202 moves and is capable of vertical transmission unit pickups • transmission line 2〇2 movement. In other words, the 'transportable unit pickup' 2〇4 can be moved in the γ-axis direction of the semiconductor package manufacturing system. The transmission single pickup 204 moves The number of transmission unit pickup transmission lines 2〇2 along the number may be several to improve the processing efficiency of the semiconductor package manufacturing system. According to the present invention, two transmission unit pickup transmission lines 2〇2 are provided. Two transmission unit pickups The transmission line 202 includes a first transmission unit pickup transmission line 2〇2a and a second transmission unit pickup transmission line 202b. The first transmission The unit pickup transmission line 202a and the second transmission unit pickup transmission 23 200834785 lines are respectively provided in a first-transport unit pickup, 204a and a second transmission unit pickup. Each of the transmission unit pickups It is used for clamping a semiconductor package placed on the tray 1〇2 of the movable port 3, wherein the movable stage 1〇3 moves along the corresponding movable stage transmission line 104, and is transported along the corresponding transmission unit pickup transmission line 2〇2 The semiconductor package is sealed to a predetermined area, for example, the intermediate stage 3〇2 of the fixed single TO300. Of course, the transfer unit pickup 204 can pick up the printed semi-package SP' from the intermediate stage 3〇2 and correspondingly The transfer single-domain pickup transfer line has been transported to the tray of the movable table ι〇3. The sealing unit is provided with a semiconductor unit. The sealing SP is embedded in a jig 310. The jig is used to fix the semiconductor package 切割 during the cutting process. The package fixing unit 3 includes a clamp 31Q and a package fixing device 5, wherein the clamp 310 is used to fix the frame of the semiconductor package to be manufactured, and the LY garment is used to smother and fix the semiconductor package sp In the clamp 31〇. In addition, the package fixing unit 300 may further comprise a fixed unit pickup milk for transmitting the semiconductor package certificate in the package unit. , ... money, will detail the fixture as follows. The missing 31 is formed into a rectangular flat or flat body. A plurality of slits are formed inside the jig 31, wherein the plurality of slits 314 are arranged at predetermined intervals. The slit 314 is disposed such that the semiconductor package SP to be manufactured is fixedly embedded in the slit 314. 24 200834785 The slit 314 is formed by the jig 310, and therefore, the opposite side of the semiconductor package SP embedded in the slit can be manufactured. In particular, while the semiconductor package SP is embedded in the slit 314 of the implement 310, the semiconductor package sp that has not yet been fabricated is cut by the cutting unit 500. The cutting unit 500 will be described below. Further, as shown in Fig. 1, the cover fixing unit 3 is equipped with an intermediate stage 302' in which the semiconductor package SP is first transferred to the middle through the transfer unit 2

Station 302. The intermediate stage 302 is disposed such that it can move along the intermediate stage transmission line 3〇4 where the intermediate stage transmission line 3〇4 is perpendicular to the transmission unit pickup transmission line 2〇2. Each of the pick-up elements of the transfer unit is rotated 200, and the semiconductor package SP is placed on top of the intermediate stage 3〇2 as shown in the “Fig. 1”. That is, the semiconductor package SP is arranged on the intermediate stage as shown in "Fig. 1". When the semiconductor package SP is configured as described above, since the 'unit' indicates that the 'j edge 502 is designed to have a different structure (to be explained below with respect to the cutting blade)', it is possible to manufacture the two slit lines. One of the semiconductors is sealed with the top of the top portion of the semiconductor package Sp, and the slits 314 are arranged along the slit lines. Therefore, if the cutting unit is cut, the cutting edge is Designed as a _structure 'shame can be unnecessary. ° The number of intermediate station 302 and intermediate station transmission lines can be several. According to this April, there are two intermediate stations and two intermediate transmission lines. When the intermediate platform 3〇2 and the intermediate platform transmission line are two or more, the processing efficiency is changed. 25 200834785 As for the handling component, a fixed unit pickup transmission line 32A and a fixed unit pickup 322 are disposed above the respective intermediate transmission lines 3〇4 _ end. The fixed unit pickup, transmission line 320 is perpendicular to the intermediate stage transfer line 3〇4, and the fixed unit 322 is movable along the fixed unit pickup transfer line 32〇. • The solid state unit 322 is used to clamp the semiconductor package SP that has not been fabricated and placed on the intermediate stage 3 to place the clamped semiconductor package sp on the holder block 392 of the package fixture 350 and transmit The semiconductor package SP, which has been fabricated and placed on the column block 2, is attached to a cleaning station 616. As shown in "Big 4" and "4BII", the fixed unit pickup 322 is equipped with a pick-up device 324 that includes a suction member 326, a drive member 328, and a ugly unit 330. The pick-up member 326 The semiconductor package SP' driver 328 is used to generate the driving force required to move the pick-up element 326. The chain drive S 330 is used to transmit the driving force generated by the drive element 328 to the suction element 326.

I suction element 326 is used to vacuum the semiconductor package sp. The top end of each suction member 326 is provided with a suction nozzle 327. A plurality of suction nozzles 327' may be disposed, and the suction nozzles 327 may be arranged in a plurality of rows as needed. Preferably, the mouthpiece 327' is aligned to correspond to the shape of the holder block 392. According to the present invention, as shown in Fig. 4B, it is preferable that two suction nozzles 327 are arranged in one row, and two rows of suction nozzles 327 are disposed. Drive element 328 is provided for driving each of the suction nozzles 327, and drive unit 26 200834785 may be adapted from a variety of power sources. According to the invention, each of the drive elements is a motor. The chain unit 33G is for transmitting the driving force generated from the driving member 328 to the suction of the cow 3'6. According to the tree, since the driving member 328 is a motor, it is preferable to construct the chain moving unit so that the rotational motion generated by the driving member 328 can be converted into a linear motion of the suction member 326. • The I-key unit 33 includes a support rod 332, a guide rod 334, a rack 336, and a small u-wheel 338. The support rod 332 is for supporting the suction member 326, and the guide rod system is connected to the end of the support rod 332. The side portion 'to guide the movement of the suction element 326. A rack 336 is formed on each of the guide rods 334. The pinion gear is now on the shaft of the drive element, and the pinion 338 is said to be in line with the corresponding rack. The structure of the chain-moving unit 330 and the suction element 将 will be described in more detail. For example, Z County, her 27-series scaly _ branch 32, the inlet (four) take the nozzle, the crane 1 ΓΓ, the 336 on the Γ guiding rod 334 The system is accommodating to each of the small (five) wheels 338, whereby the == of the drive element 328 is converted into a vertical reciprocating motion. Of course, except for the coffee% and the small recording view, any mechanism that converts the rotary motion into a vertical reciprocating motion can be used together: a correction unit 340 is configured: the unit 340 includes a correction rod 342 " It is fixed to the example of the end of the support rod 332, and then the rod 342 is fixed, the battalion, the side port P, and the ferrule 334 are arranged. The elastic member 344 is used for the elastic branch 27 200834785: while the return wheel and the corresponding rack 336 are in harmony, when the small tooth is 小, the correction unit 340 is used to prevent the limitation between the respective racks. The gap of motion 2 caused by the occurrence of a misalignment (backlash). At the same time, the semiconductor package fixing device 35 is provided with a semiconductor package sp for fixing the transfer wheel via the fixed single pickup 322 to the jig. The semiconductor package fixing device 350 will be described in detail below with the combination of "Hyun" and "5A". The semiconductor package determining device 35G includes a main body unit, a first pusher assembly 390, a second pusher assembly 4A, and a keying unit. The main body unit has a jig holder 376 to accommodate the jig 310. The first advancement assembly 390 is used to plunge the semi-ample body seal SP into the jig 310, and the second advancement assembly 4 is used to remove the semiconductor seal sp攸 jig 310. The chain moving unit 37 is used to move the jig holder, and the half body package Sp can be easily lost in the jig 31, and removed. The body unit of the semiconductor package fixture 35 includes a horizontal element 362' to form the bottom of the body unit and a vertical element 364 that is perpendicular to the horizontal element. The chain drive unit 370 is disposed between the horizontal member 362 and the vertical member 364. The chaining unit 370 includes a horizontal chaining element 372 and a vertical chain element 374, wherein the horizontal chain element 372 is slidable along the horizontal element and the vertical chain element 374 is slidable along the vertical element 364. A clamp holder 376 is disposed between the horizontal chain link member 372 and the vertical chain link member 374, and the clamp holders 376 28 200834785 are used to receive the clamp 310. The clamp holder 376 - the end hinge is connected to the upper end of the vertical chain element 374, so that the clamp holder 376 can be hinged about the upper end of the vertical chain element 374 to maintain a hole 376 with a guide along each side thereof Slot 3 78. The opposite side of the horizontal chain traversing member 372 is provided with a side wall 373, and the branching fixture U76 is formed with a rotating shaft 38〇 at the upper end of the opposite side wall 373, wherein the rotating shaft is extended inwardly, and the rotating shaft is mutually extended relatively. As shown in Fig. 5A, Fig. 5B, Fig. 5C and Fig. 5D, the horizontal chain element milk rotation shaft 380 is moved along the corresponding guide groove of the jig holder 376. Also, each of the rotating shafts 380 may be provided with a roller to facilitate the movement of the rotating shaft along the corresponding guiding groove 378. Any structure can be applied between the horizontal member 尬 and the horizontal slewing member 372 as well as the vertical member 364 and the vertical slewing member 374 as long as the structure is ah.

between. For example, a guide groove may be formed on one side, and a guide protrusion may be formed on the other side. When m is reached, the second motor can be placed on the horizontal chain link member 372 of the horizontal chain link member 374 to slide the horizontal keying member 372 and the vertical chain link member 374. Further, as shown in Fig. 5C, when the jig holder 376 is erected, the jig holder fixing unit 384 can be configured to lock the jig holder, so that the jig holder 376 does not shake. /, the clamp holder fixing unit 384 is disposed on the lower side of the vertical key moving element, and has a main body 385 vertically protruding from the vertical chain moving element 374. The body 385 is provided with a recess 386 in which the recess is recessed downwardly. An elastic member 387, such as a spring, is provided in the recessed ground. In the elastic element such as the spring, the end wire has a protrusion, and the protrusion 388 can be slid along the groove, and the tip of the protrusion m is exposed to the outside. In particular, the projections are elastically supported by the elastic members, so that the tips of the projections 388 are exposed outward. In the same %, the lower end of the disarm retainer 376 is equipped with a fitting groove. As shown in the "figure map", when the jig holder 376 is erected, the indwelling groove corresponds to the missing piece holding unit 384. Preferably, the particle-compatible groove 389 is in contact with the tip of the protrusion 388 which is held by the clamp το 384. Therefore, the projection tear is stably sprayed in the salivation groove 389, whereby the jig holder 376 can be prevented from rattling. °, as shown in "Fig. 7A", a clamp positioning hole 382 is formed in the clamp to keep crying 376. The jig positioning hole 3δ2 is formed, which in turn corresponds to the shape of the jig 31〇. Only: The fixture positioning hole 382 is configured such that the clamp 31 is vacuum-absorbed, and the clamp is fixed in the clamp positioning hole 382. Those skilled in the art can differently contemplate the structure in which the above-described jig 310 is fixed in the jig positioning hole 382. As described above, the semiconductor package fixture 35A includes a first advancement assembly 390. The first-extinguishing assembly 390 is mounted to the horizontal member 362 such that the first advancement assembly 390 can slide independently of the horizontal linkage member 372. The first propulsion assembly can be configured such that the first propulsion assembly 390 can be moved along a base 391, wherein the base 39! is disposed parallel to the horizontal element along the X-axis direction and the γ-axis direction. A main body portion 393, a block 392 and a first propulsion unit 395 are included. The main body portion 393 forms a main body of the first propulsion assembly 390, and the support block 392 is disposed at the top end of the main body portion 393, and the semiconductor package sp is located at the top of the support block 392. The first propulsion unit 395 is horizontally movable at the same height as the abutment block 392. As shown in FIG. 8, the holder block 392 is used to position the semiconductor package sp thereon, and is used to guide the semiconductor package SP, so that the semiconductor package sp can be easily embedded in the narrowness of the device 310 by the first push portion 397. Sew 314. The holder block 392 is used to guide the semiconductor package sp, and thus the semiconductor package sp can be stably inserted into the slit 314 of the jig 310. However, if the semiconductor package sp can be stably guided into the slit 314 of the jig 310, the holder block 392 can be removed. The top of the holder block 392 is provided with a recessed positioning portion 394, and the semiconductor package SP is placed on the upper portion of the positioning portion 394. The positioning portion 394 is for guiding the semiconductor package sp, and thus the semiconductor package SP can be correctly embedded in the slit 314. And, as shown in Fig. 8, the support block 392 is designed as a stepped structure. In particular, the top of the support block 392 is constructed in a two-layer structure. Preferably, the first positioning port P 394a and the first clamping portion 394b are formed on the lower top and the upper top of the holder block 392, so that the two semiconductor packages SP can simultaneously enter the slit 314 of the jig 310. in. Of course, the support block 392 can be constructed as a one-layer structure or a multi-layer structure as needed. 200834785 In each of the first positioning portions 394a, a gas hole 396 is formed. Similarly, air holes 396 are formed in each of the second positioning portions 鸠. The air passing through the air holes 396 is evacuated to the vacuum source, and the +-conductor package SP can be correctly and stably placed on the positioning portion & and the second positioning portion 394b. . v The first propulsion unit 395 is disposed on the side of the abutment block 392, for example, at a position opposite the wire rib pair of the clamp holder 376. The first propulsion unit is configured to slide horizontally along the top of the main body portion 393. - The first propulsion single A 395 system, equipped with a slidable first propulsion portion tear, is moved parallel to the abutment block 392 while the first propulsion portion 397 is parallel to the abutment block 392. As shown in Fig. 6A, the top end of the first advancing portion 397 is designed to have a two-layer structure. The two ends of the first-pushing portion 397 allow the semiconductor package sp placed on the first positioning portion 394a and the second positioning portion 392 of the two-layer structure of the holder block 392 to be simultaneously inserted into the slit 314 of the jig 31 . The first propulsion unit το 395 further includes a drive unit for driving the first propulsion portion 397 ' and thus the first propulsion portion 397 is slidable along the top of the main body portion. As shown in Fig. 6A, the drive unit includes a motor (not shown in Fig. 6A), a first first pulley 398a, a second pulley 398b, and a conveyor belt 3. The motor is used to generate a driving force when energized, and the first pulley 3 is coupled to the rotating shaft of the motor, and the first pulley 398a can be rotated by the motor. The second pulley 3_ is spaced apart from the first pulley 398a by a predetermined distance, and the conveyor belt is operated around the first pulley 32 200834785 398a and the second pulley 398b. A fixed guiding device 398d may be disposed between the conveyor belt 398c and the first pushing portion 397. By fixing the guiding device 398d, the conveyor belt Deng% and the first pushing portion 397 can be A/, and the movement is "prepared," The structure in which a push portion 397 slides along the top of the blade portion of the main body portion 3 can be obtained by a person skilled in the art. On the other hand, as shown in "Fig. 6A", the first propulsion unit 395 can include a pair of propulsion units, for example The μΐ propulsion unit 395a and the U propulsion unit are difficult. In the case of this tree, the above sliding structure can be applied to the μι propulsion unit milk & and u propulsion unit 395b, and the 丨·1 propulsion unit 395a and the W propulsion unit 能够 can operate independently. In addition, as shown in Figure 7A, Figure 7B, Figure 7C, Figure 7 and Figure 7E, a sensing unit 399 is attached to the w-propelled unit and 1_2 The pushing unit (4) is used to prevent the first propulsion unit from malfunctioning due to interference between the narrow (four)* edge and the semiconductor package SP when the semiconductor package sp is inserted into or separated from the slit 3H of the jig. . As shown in detail in Fig. 6A, the first advancing portion 397 includes a pusher blade, a pusher guide bar, and a support guide bar. The pusher wishes to be placed at the top end, and the advancement blade 397a is brought into contact with the semiconductor package sp. The pusher guide bar 3 = is placed below the pusher blade for movably supporting the pusher blade to win. The support guide tearing system is disposed at the rear of the propeller and is used for the propulsion knife 397a. The sensing unit 399 can be disposed between the pusher blade and the support guide, and the sensor can include the i-component 399a to support the π(4) and the sensor including the amp, the pusher 397a or the support guide Wc. Hey. Of course, a guide rod 3"C can be provided to prevent the elastic member 399a from being separated from the support guide 397a and the support guide 397c. For example, the resilient element 399a can be, for example, a spring. The sensor pass can be a contact feeling. Therefore, when the 397a paste has an edge collision, the advancement blade 397a is not inserted into the slit 314 of the jig 31G, and then the blade is torn and then contacted with the guide bar 399c, and the sensor is 39% operated. The fault signal of the propeller 397a is pushed to a control unit (not shown in FIG. 6A), and the second propulsion unit 4 is disposed on the opposite side of the first propulsion unit 39, and then the second propulsion unit 4 〇〇 corresponds to the first propulsion assembly 39. As shown in Figure 6b, the second propulsion assembly 400 is constructed in the same structure as the first propulsion assembly 39. For example, the second propulsion assembly 4 can include a 2-1 propulsion unit 4〇1& and _ propulsion unit 4〇1b. Each of the propulsion units 4〇1a and 4〇1b may include a propulsion unit 402, a driving unit 403, and a sensing unit 404. In addition, the propulsion unit The 402 may include a propulsion blade 402a, a propulsion blade guide 402b, and a support guide rod 4〇2c. The drive unit 403 may include a first pulley 4〇3a, a second pulley 403b, a conveyor belt 403c, and a fixed guide rod. 403d. The sensing unit 404 can include a Element 404a and a sensor 404b. However, the second propulsion assembly 400 is moved from the right side to the left side of the figure to transmit the semiconductor package sp received in the slit 314 of the 200834785 transmission jig 310 to the support block view. Therefore, as shown in the "Fig. 6B", unlike the propelling blade tip of the first advancing portion 397, the advancing blade a of the second advancing portion 4G2 has a different length. This is because the amount is The distance deviation between the first positioning portion and the second positioning portion 392 of 392 can be compensated by the length between the advancement knife and the top end of the second advancement portion. In other words, the difference between the advancement knife 397a and her is It is compensated by the size of the first positioning portion 394a. In addition, referring to "5D", after the semiconductor guide 397 is inserted into the slit 314 of the jig 310 by the first pushing portion 397, the first pushing portion 397 is slit from the slit. Correcting the separation, and vertically moving the vertical key member 374 of the clamp holder 376 to perform an upward or downward movement, whereby the idle slit 3H is located on the movement path of the first advancement portion 397. Of course, even when the semiconductor package sp is Two propulsion parts are moved from the slit When the 314 is removed, the above operation is performed in the reverse order. Subsequently, the cutting unit 5 will be described in detail with reference to "Fig. 1", wherein the cutting unit is used for cutting and being fixed by the package fixing unit. The semiconductor package SP in the 310. The cutting unit 500 includes a cutting edge 502, a rotatable chuck table 5〇4, a chuck table transmission line 5〇6, and a position changing device S2〇. The cutting blade 5〇2 For cutting: Although the conductor SP, the rotatable chuck table is set with a fixture, the chuck table transmission line is used for the transmission chuck table 5〇4 to the cutting edge view, the position changing device 52 mussels ^ 35 200834785 Then, enter (four) with 31q Guanuan as the reverse direction. j unit 5GG further includes - cutting unit picker view and - cutting unit Zhuangcai mouth J line ^ line 5〇9. The cutting unit pick-up device is used to pick up the semiconductor unit to be placed along the cutting unit pickup line to move the milk to transfer the clamp 310 to the chuck table 504. The chuck table 5〇4 is arranged in the cutting device, the J unit picker, below the moving route, and the chuck table 5〇4 is set so that it can be rotated around its vertical axis. The deck transfer line of the transmission line $(10) moves to the cutting edge 502. The fixtures of the semiconductor package sp and the semiconductor package sp are located at the top of the chuck table. In the clamp, 310 j, for example, after the top of the clamp 31 is cut, it is necessary to cut the bottom of the clamp. At this time, in the same day temple of the fixed jig 3K), the position change is mounted to the level of the fine-twisting jig 31 〇, thereby reversing the top and bottom of the lost training. i. Fig. 9A and Fig. 9B, the position changing device of the present invention • 2 〇 3 package 3 is a cooling unit 530 and a rotating unit M0. The jig fixing unit 530 is for fixing the dislocation 310 in which the semiconductor package SP is embedded, and the rotating unit·secret transfer fixture fixing unit 530. The opposite end of the 'body package sp' must be spliced at the semiconductor package of the embedded fixture. Therefore, the position changing device 520 is used to rotate the jig 310. The jig fixing unit 53 is provided with a frame S32 which internally defines a predetermined space, such as a jig positioning space SS1, for fixing the jig 310 of the internal semiconductor package sp. Preferably, the jig positioning space 531 is formed in a rectangular frame shape with the shape of the jig 36 200834785. The shape of the frame 532 is also formed into a rectangular shape.立如弟10图"Display" _ Temporary fixing element 533 is arranged in the frame light vestibule for temporarily fixing the fixture positioning space H during the positioning of the clamp 31 (). The temporary fixing member 533 may include - a projection protrusion $ and a spring/, 533b spray projection 533a may be used in the predetermined space defined inside the frame 532 to "elastic" the yellow 533b for elastically supporting the associative projection 533a. The field outside the jig 310 is a fitting groove 3〇la, in which the fitting groove 3 is hooked with the indwelling protrusion of the temporary fixing member f3. In the above description, although the skilled artisan can conceive other possible configurations, the central training system is temporarily fixed in the jig positioning space 531 of the frame 532. The opposite end of the 532 is provided with a fixing unit 534 for fixing the jig wo, and thus, when the jig 31 is placed in the jig positioning space 531, it is not separated from the jig positioning space 531. The parent map unit 534 includes a _ element 537 and a moving member 538 is attached to one end of the frame 532, so that the fixed member 537 can move longitudinally of the dog finder frame 532. A fixing slit 536 is formed inside the fixing member 537 to fix one end of the jig 31. The moving element 538 is used to move the stationary element 537 longitudinally along the frame. A separate securing element 537 can be used as long as the clamp 310 is secured by a separate securing element 537 and cannot be separated from the dislocation positioning space. However, it is preferred to provide a pair of fixing members 537. The fixing element 537 can be constructed such that it can move toward or away from each other 37 200834785. Further, the fixing slits 536 form a shape corresponding to each corner of the jig 3i, and the corners of the jig 310 can be immersed in the fixed slit. At the same time, each moving element 538 can be mounted to the corresponding fixed element tear. When the moving element is cut in the form of a linear reciprocating motion, the 対 动 moving element 4^38 is not particularly limited. In accordance with the present invention, the moving element 538 can be a cylinder. Moreover, the telekinetic element 538 is mounted to the pair of stationary elements 537 such that each moving element 538 can be coupled to the interior of the corresponding fixed element 537. The above arrangement is arranged to stably move the fixing member 537 to the jig positioning space 531. The rotary unit 54G of the position changing device 520 includes a drive member 542 and a chain unit 544. The driving member 542 is attached to the side of the jig fixing unit 53, and the driving member 542 can be used as a spool. The chain solution means that the linear motion of the conversion drive element M2 is a rotary motion, and the fixture fixing unit can be rotated. Referring to "FIG. 9A", the drive element 542 is attached to the position change device 52A side. The drive element 542 can be an air cylinder that is capable of performing a reciprocating motion. The chain moving unit 544 is used to convert the linear motion of the driving member 542 into a rotational motion of the clamp fixing unit 530. The chain drive unit 544 includes a rack 546 that is coupled to the drive member 542 such that when the drive member 542 is moved in the form of a gas cylinder, the _ 546 can move linearly with the drive member 542. The chain drive unit 544 further includes a pinion 548, 38 200834785 pinion 548 is coupled to the rotating shaft of the clamp fixing unit 53A, and the pinion 548 is meshed with the rack 546, so that the pinion 548 can rotate. Therefore, by the operation of the rack 546 and the pinion 548, the linear motion of the driving member 542 is converted into the rotational motion of the clamp fixing unit 53. Although the rotating unit 540 includes a driving element 542 and a chaining unit 544, wherein the chaining unit 544 is used to convert the linear motion of the driving element (10) into a rotational motion. As described above, the 'transmission element' can be any type of rotating element as long as it can be changed into a spinning tau element. Alternatively, the motor, the wire gear, and the driven components can be placed. In this case, then S does not convert the linear motion into a rotational motion. The position changing means 52A may further comprise a moving unit 55g for moving the jig fixing unit τ 530 out of the position changing means 52. As shown in the "figure i", the position changing device 520 is disposed parallel to the chuck table transmission line 5〇6. Therefore, the moving unit 55 is smashed away from the chuck table 504 by a fixed distance, and the position changing device 52 is disabled. The moving unit 550 includes a _ drive motor (not shown in the "μ"), Sister and - conveyor belt fixing element 5 Μ. The drive motor Lin was employed when it was set up - the driving force' conveyor belt was used for the driving force of the transmission drive motor to fix the fixed unit 530, and the black culvert was transmitted - α, k▼ fixed 554 was fixed To the conveyor belt 552, to allow the driving force of the conveyor belt 552 to be transferred to the clamp fixing unit 53A. As shown in Figure 9A - "Wire, no, the drive motor is included in the position change device 520 39 200834785 two = the rotational force required to drive the conveyor belt 552. The conveyor belt 552 is designed to be operated by a pulley disposed on the opposite side of the position changing device 52. Further, the pair of transport belts 552 may be provided, and the conveyor belt M2 may be longitudinally inserted in the longitudinal direction, for example, the movement direction of the clamp fixing unit 53 is parallel to each other. The belt fixing member 554 is fixed to the side of the conveyor belt 552 - and is connected to the holder fixing member 530 and to the conveyor belt. Therefore, the driving force of the belt fixing member 554 scale conveyor belt is directly transmitted to the fixture fixing unit. The jig fixing unit disc rotating unit 2 can be constructed in a detachable manner. For example, the pinion 548 connected to the other rotating shaft of the gripper unit can be moved in the direction of movement of the rack 546 perpendicular to the rotating unit 54. In particular, the 'belt fixing member 554 may be included in the jig fixing unit, and the jig fixing unit 53 including only the pinion 548 may be detached from the rotating unit 540 and further transmitted through the belt 552, and the jig fixing unit can be The movement is separated from the position changing device 520. Turning back to the "secondary view", the cutting edge is disposed on the chuck table transmission line. The upper blade d-blade 502 is used to cut the sub-mount of the semiconductor package placed on the jig 31 to the shape desired by the user. The construction cutting blade 502 has two cutting forces 5 〇 2 arranged in parallel with each other, and the reason why the design cutting edges 502 are arranged in parallel with each other is because the semiconductor sealing sp is placed in two rows on the missing training. Also, the cutting edge view has a different shape. This is because the __ of the semiconductor package sp to be cut has no boots. Of course, if 200834785 requires the 'cutting edge 502', it can have the same shape. Alternatively, other different configurations may be applied to the cutting edge 502. For example, the cutting edges 502 may be disposed vertically, and thus the cutting edges 5〇2 are opposed to each other. In this case, the cutting edge 502 is disposed above and below the motion line of the jig 310 to simultaneously cut the top and bottom of the semiconductor package sp embedded in the slit 314 of the jig 310. At this time, the position converting means 520 described above is unnecessary. Please refer back to "Figure 1". The semiconductor_manufacturing system will be explained below. After the semiconductor package SP located in the jig 310 is cut by the cutting unit 500 including the position changing device 520, the cut swivel package is conveyed to the package fixing unit 300. After the past, the cut semiconductor package SP' is separated from the jig 31 and then moved to the holder block 392. Next, the cut semiconductor package SP is transferred to the cleaning and drying unit 600 through the fixed unit pickup and the milk. After the cutting process is completed, the cleaning and drying unit performs subsequent repairs. In accordance with the present invention, the cleaning and drying unit is preferably disposed on the transport unit pickup transport line 2G2, and the cleaning and drying unit_perpendicular to the transport unit pickup transport line 202. As shown in Figure 11A, Figure iiB, "llc" and "Graph", the "Cleaning and Money Unit" contains - the "cleaning unit" and a - cleaning early το 65G. The first cleaning unit _ is used to clean the top of the semiconductor package, and the second cleaning unit 65 is used to clean the bottom of the semiconductor package sp. When the d/th wash unit 610 and the second cleaning unit 65 are combined into a single unit 41 200834785, 0, as shown in FIG. 11A, the first cleaning unit 61 includes a cleaning container 612, a cleaning The stage 616 and a cleaning station handling unit 618. A cleaning space 614 is defined in the cleaning container 612, and the cleaning station 616 is disposed in the cleaning container 612 to allow the fabricated semiconductor package sp to be positioned thereon. The cleaning table transport unit 618 is for transporting the cleaning table 616 through the cleaning space 614. The cleaning container 612 is open to the side so that the suction nozzle 327 of the fixed unit pickup 322 can be introduced into the cleaning space 614 through the opening. The other side of the cleaning container 612 is also open so that a unit pickup 660 (described below) can be introduced into the cleaning space 614 through this opening. The top of the cleaning station 616 is flat so that the semiconductor package sp can be positioned on top of the cleaning station 616. As long as the cleaning station handling unit 618 is capable of transporting the cleaning station 616' through the cleaning space 614, those skilled in the art can employ any type of cleaning station handling unit. For example, the cleaning table transport unit 618 can be designed as a "UA map" display structure. The cleaning table handling unit 618 includes a motor 62〇, a first pulley, a second pulley 624, and a conveyor belt 626. The motor _ is activated to generate a driving force when the energy is released, and the first pulley 622 can be rotated by the motor. The two pulleys 624^-the pulleys 622 are separated by a predetermined distance, and the conveyor belts are operated around the first pulley milk and the second pulley 624. When it is, the washing station _ can be fixed to the side of the conveyor belt 42 200834785, and the washing table 6i6 can be moved along with the conveyor belt _. In the subsequent reading, each of the cleaning devices can be set. A structure for cleaning the semiconductor package SP, for example, a "first nozzle" of "the _"_ is disposed above the cleaning _ along the movement path of the cleaning table 616. The first nozzle 628 is used to spray the liquid onto the semiconductor package sp, and the spray liquid towel contains the silk dopant of the lining material block sp, thereby chemically cleaning the semiconductor package SP. Of course, the liquid that can be sprayed through the nozzle can contain more degreaser. In addition, different formulations can be added to the liquid as needed. Following a-nozzle 628 is a brush (four), preferably a brush 630 is provided, and when the cleaning station 616 is positioned below the brush (four), the top end of the brush (four) is accessible to the semiconductor package sp on the cleaning station (10). The brush (4) is used to physically clean the top of the semiconductor package SP. • After the seat 030 is followed by a second mouth 632, the second nozzle 632 is designed to view a liquid, such as water, to the wash station 616. The second nozzle 632 is used to spray water, and the semiconductor package SP can be washed by the sprayed water. .  Behind the second nozzle 632 is a third nozzle 634 which is also designed to spray air to the washing station 616. The third nozzle 634 is for ejecting air, and is capable of cleaning the semiconductor package SP by ejecting gas. The second cleaning unit 650 is disposed at one end of the first cleaning unit 61. As long as the first π-wash unit 650 is disposed at the rear of the first cleaning unit, the semiconductor package sp that has passed through the 43 200834785 first cleaning sheet S 610 to the second cleaning unit (four)/the second cleaning unit 650 can be transported. Specially fixed. According to the present invention, as shown in Fig. 1, the second cleaning unit 650 is disposed perpendicular to the first cleaning unit 61G. The second cleaning sheet 50 is used to clean the bottom of the semiconductor package sp that has been cleaned by the first cleaning unit 610. Like the first cleaning unit 61, the second cleaning unit 65 includes a plurality of nozzles 652 and a brush 654. The mouthpiece 652 may include a nozzle for spraying a cleaning agent, a nozzle for a sample such as water, and a mouth for air. The cleaning and drying unit 600 further includes various devices for cleaning the semiconductor package SP. For example, cleaning and drying materials can be equipped with ultrasonic cleaning. The w _ gen/month wash and dry unit 600 further includes a unit picker 060 and an early το捡 pick line 662. The unit picks up from the first cleaning unit 610 to the second cleaning unit (4), and along the detector read line 662, the unit pickup_ is transmitted. Unit Picker_System Material = The semiconductor package sp located on the alpha washstand 616, and the separately picked up half: the monthly seal I SP is placed on the -dry (10). About the drying station _ will be explained below. 2 yuan pick n _ can contain the general record tree, pick up a single semi-conducting γ I. The familiar art in this field can be as simple as various types of sucking Yuan shore = such as 'sucking components can be true" to take the tree. The number corresponds to the number of +-conductor packages SP. 44 200834785 The unit pick-up 660 picks up the semiconductor encapsulation on the cleaning station 616 and passes through a second cleaning unit 65 for cleaning the bottom of the semiconductor package sp. It is disposed below the side of the moving path of the unit pickup 66, and has a heater (not shown in FIG. 1) installed therein. When the semiconductor dream SP is located on the dry table 67, the heater is available. To completely remove the moisture on the semiconductor package SP passing through the first cleaning unit 610 and the second cleaning unit (4), and then to: dry the semiconductor package SP. 71 _ The stealing platform 670 is configured to be movable along a drying station transmission line 672. In accordance with the present invention, the drying station transmission line 672 is made perpendicular to the transmission unit pickup transmission line 2. Preferably, the drying station transmission line 672 is disposed adjacent to the intermediate stage transmission line 304, and the #化台 transmission line 672 is parallel to the intermediate stage transmission line 3〇4. The above arrangement prevents the size of the semiconductor package manufacturing system from increasing. The semiconductor package 8] cleaned and dried by the cleaning and drying unit 600 is transferred to the inspection unit 700, and then transferred by the transfer unit 200 to the loading and unloading unit 1A. As shown in Fig. 1, the inspection unit 700 includes a pair of inspection units, i.e., an inspection unit 71G and a second inspection unit 720, for respectively inspecting the semiconductor packages SP located at the top and bottom of the semiconductor package SP. A plurality of inspection units can also be provided. 720 〇 In the embodiment of the present invention, the structures of the first inspection unit 71 and the second inspection unit 72 are displayed as "1". Please refer to "Jth diagram", the first inspection unit is set to move along the unit pickup transmission line 662. The first inspection unit 71 uses 45 200834785 to determine whether the top of the manufactured semiconductor package sp located on the drying table 67G is defective. Of course, the first-inspection unit 71 can detect the position information of the body package SP located on the drying station (4), and transmit the detection position information of the semiconductor package sp to the control unit, wherein when the transmission unit picks up the semiconductor package ^ The unit performs correction according to the position information of the semiconductor package sp, and the semiconductor package: the SP can be placed in its correct position. For the ball-striker (BGA) type semiconductor package in the semi-guided riding sp, the correction process is further changed. Also, when the first-inspection unit 71 is along the unit pickup transmission line, the multi-motion-inspection unit 710 can judge whether or not the semiconductor package 位于 located on the tray 1〇2 deviates from its correct position or has been shifted. Among them, it is set on the movable table (10) which moves along the transmission line of the mobile station. By ^Check = Where the position information of the 710 system is input to the control of the semiconductor seal manufacturing system = Of course, even in the above case, the correction processing is still performed, and the touch device is transferred to the intermediate stage 3 SP Can be placed in its correct position. The transmissive package is the same as the % 苐 检查 2 inspection unit 720 is set at the value of one (four) * * 甘 宁 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 The second inspection unit 72 corrects the weight of the fuse; the joy-by-passer unit pickup 204 MM SP H, the semiconductor package certificate is 46 200834785 (10) as the h-th check, the claws 'the inspection unit no is also used to judge The semiconductor package sp from which the transfer unit is picked up deviates from its correct position. The second inspection unit 20 is the ‘positional information of the semiconductor package Sp picked up by the transmission unit pickup unit 2〇4 through the touch η2 attached to the top of the transfer unit pickup and the 2〇4 nozzle. When the semiconductor package SP is picked up by the nozzle of the pick-up element 208, the pad 722 serves as a reference point for determining the correct position of the semiconductor package SP. 4 inches of another J-mother joint 722 can be opened) to become a moment open. Each of the fixing pads is formed in a rectangular shape because the corresponding semiconductor package is formed into a polygon, so that the X-axis, the γ-axis, and the corner can be easily detected based on the apex thereof. That is to say, when the second inspection unit 72 looks at each semiconductor package SP under the semiconductor package sp, each semiconductor job SP is seen as shown in FIG. 12, so that the semiconductor package 81 can be accurately detected. position. The information of the semiconductor package sp detected by the second inspection unit 720 is stored in the control unit of the semi-body package manufacturing system. Therefore, even when the pad 722 of the transfer unit 204 is worn or replaced, the result is that the test point necessary for detecting the position of the semiconductor package is changed, and the pad is oppositely bonded according to the position stored in the control unit. The degree of deviation from 722. Therefore, the reference point of the semiconductor package SP can be newly established. At the same time, the position information of the semi-body package SP detected by the first inspection unit 710 and the second inspection unit 72 is input to the control package 47 200834785 of the semiconductor package manufacturing system, wherein the control unit has x-axis and γ. The axis and the θ angle are picked up by the repairing domain sp (4) Fresh element inspection ί In the early detection of the pickup 2 〇 4 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 : : 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体Thus, along Y 2:;: The degree of deviation of the seal SP. In addition, the movement should be moved along the movable 1 transmission line in the Y-axis direction to correct the degree of deviation of the semiconductor package sp along the γ-axis direction. By rotating the transfer unit pickup for picking up the semiconductor package sp, the e-direction correction of the + conductor seal SP can be performed, thereby correcting the degree of deviation of the semiconductor package SP in the θ direction. Although the structure of the inspection unit 700 is as shown in the "Picture 1", it is possible to provide an inspection unit that is installed in an increased number of non-operating positions, such as "Graph 13", "Grade", "15th" and " Figure 16 shows. First, in accordance with the structure shown in Fig. 13, a third check unit 730 is further provided. The second inspection unit 73 is designed to move along the tray picker transmission line. The first ball inspecting unit 730 is for checking whether or not the semiconductor package sp is properly positioned on the tray on the movable table 103. For example, it is checked whether the casting package sp has been turned to the reverse direction. Then, according to the structure shown in "Fig. 14", a third checklist IT 730 of "Fig. 13" is further provided. In this case, however, the third inspection unit 73 is designed to move along the unit pickup transport line 662. That is, the third inspection unit moves along the unit pickup transmission line 662 for the first checklist s. When the second second check box το 730 moves along the unit pickup transmission line 662, the third inspection unit 73G is used to check whether the semiconductor package sp located on the tray is correctly positioned, wherein the tray 1〇2 is disposed along The active station transmission line is located on the movable port of the mine. The mobile station transmission line 104 is placed under the unit pickup transmission line ship. In addition to the third checklist 兀 730 of "Fig. 14", a fourth inspection unit 74A is provided in accordance with the structure shown in Fig. 15. The fourth inspection unit 7 is configured to move along the unit pickup transfer line 662. In this case, however, the third checklist 70 730 is designed to check whether the semiconductor package located on the tray 102 of the left movable stage of the three movable stages 1〇3 is correctly positioned. In addition to the movable table 103 inspected by the third inspection unit 730, the fourth inspection unit 740 is further counted for checking whether the semiconductor package sp on the tray 2 of the remaining two movable tables 1 is correctly positioned. That is, the third inspection unit 73 or the fourth inspection unit can detect whether the semiconductor device sp is correctly positioned, and the fourth inspection unit 740 or the third inspection unit 73 can check the half-body. Whether the semiconductor package fabricated in the package manufacturing system and unloaded from the system is properly located on the tray 102 of the movable table 103. As shown in FIG. 16, the inspection unit 7 (10) of another embodiment has the following structure: The third inspection unit 730 is located below the movement path of the fixed unit pickup 322. In the case of the 2008 2008, the second inspection unit, the second inspection unit, checks whether the semiconductor package SP that is simultaneously transported by the fixed unit pickup unit 2 is correctly positioned. The loading and unloading unit 100, the transport unit, the packaged mosquito unit, the cut Dj unit 5υυβ乂 and the dry unit 600, and the inspection unit 7(8) are electrically connected to each other and controlled by a control unit (not shown). Hereinafter, the operation of the semiconductor package manufacturing system of the present invention having the above structure will be described in detail. First, as shown in "Fig. 1", any one of the trays 102 placed on the tray case 106 is moved to the corresponding movable table by the tray picker 112. The tray 1〇2 has a semiconductor package sp on which the module process has been completed. The tray picker 112 picks up the tray 102 from the corresponding tray cassette 1〇6 by the following steps. "Fig. 2B" shows a normal state in which the tray 1〇2 is not picked up by the tray picking 112. When the control unit of the semiconductor package manufacturing system transmits a signal for picking up the tray 1〇2 located on the corresponding tray benefit 106, the tray picker η] is lowered to the top of the tray cassette 106. By the continuous lowering of the tray picker 112, the inner surface of the guide bar 124 of the tray picker 112 surrounds the outer surface of the tray 1〇2 on the tray case 106. Although the outer surface of the tray 102 is surrounded by the guide bar 124, the drive members 116b and 118b of the tray pickup η are operated to move the pair of designed holders 116 & and 118a, whereby the holders n6a and 118a are away from each other. mobile. When the bottom of the main body portion 114 of the tray picker 112 contacts the tray 1〇2, the first 50 200834785 Nayuan U6 driving member ll6b is operated, and the first side of the tray 102a is gripped. When the younger-clamping unit m loses the opposite side of the first tray, the opposite side of the first tray _ is lost into the positioning slot of the first holder, and at the same time, the third holder maM is raised 116d Support the bottom of the _ tray hire & With the 8th guard, the tray picker 112 can pick up another tray, such as the second tray.

In particular, the tray picks up the 112 to move to the corresponding tray.

The second tray 102b is picked up. ..., T when the tray picker

112 when the yak is low, and the bottom portion of the main body portion HA of the tray pickup η] contacts the second tray leg, the driving member 118b of the second clamping unit 118 operates, so the second holder _ grips the second tray lion Opposite side. When the first holder 118a grips the opposite side of the second job, the opposite side of the second tray 102b is inserted into the positioning groove of the second holder, and at the same time, the second holder 118a is compatible. The projection 118d supports the bottom of the second tray. Thus, the tray picking 112 uses the first gripping unit 116 and the second gripping unit 118 to simultaneously pick up and transport the first tray #1〇2a and the second tray lion. That is, it is possible to pick up and transfer two tray jobs and withdraw b at the same time, thereby increasing the overall processing speed. Further, the tray 102a may be configured as a free tray, and the second tray i2b may be configured as a tray on which the semiconductor package sp is placed. At this time, the first tray 110a is disposed between the semiconductor packages sp placed above the second trays 1 and 2b, and 51 200834785 and the tray pick-up 112 serves as an insulator for preventing static electricity and adhesion. In other words, the first tray 1〇2& can be designed as a colored tray. For example, the first tray 102a may be red, yellow or blue to distinguish the trays placed on the respective tray boxes 106. In the reverse order of the above steps, the tray picked up by the tray picker 112 is placed on the corresponding movable table 103 or the corresponding tray case 1〇6. When the tray 102 is placed on the corresponding movable table 103, the movable table 1〇3 moves along the movable table transmission line 1〇4 to the lower side of the transmission unit pickup transmission line. After the movable table 1〇3 moves along the movable table transmission line, the transfer unit picker picks up a predetermined number of semiconductor packages SP placed on the tray, moves along the transfer unit pickup transfer line 2〇2, and is placed The semiconductor package sp is sandwiched on the counter 302. " In accordance with the present invention, the fresh-spotted scorpion wire and the transmission/M drunk conductor package SP. Of course, various conditions can be added to the control unit as needed, and the transmission unit pickup 204 can perform the gripping operation. It is important to place the direction in which the semiconductor package SP is placed on the intermediate stage 3〇2, which is changed in accordance with the shape of the cutting edge of the cutting unit. When the field knife 502 has the same shape, the semiconductor package SP embedded in the slit of the jig 310 can be positioned in the same direction. On the other hand, when the cutting dream "has a different shape", for example, where - the cutting blade system is configured to cut the semiconductor, the top of the garment 'is the opposite - the other is cut-to-cut the semiconductor package SP bottom 52 200834785 'This requires embedded semiconductor package The change in sp along the jig slit is as shown in "1".转 At this point, the swivel package sp in the slit 314 of the intercepting jig 31 must be yg in the opposite direction. U The suction element of the transmission single inspection device is finely rotated to conform to the direction of the slit 314. When the first driving element 222_"3b" is rotated: the tree is applied and the third element is applied. When the second driver drives 222e to rotate, the fifth suction member rotates when the second 〇8g is applied.仵... When the first-suction element 2〇8a, the third suction element position, the fifth suction element, and the seventh suction element·g rotate, the transmission unit picks up the gear: the skirt SP is as “第!图The display is arranged. The transfer unit pickup device places the semiconductor package SP on top of the intermediate stage 3G2. After placing the semiconductor package SP on the intermediate stage 3〇2, the semiconductor package卯

^ is sandwiched by two fixed unit pickups 322. Next, the fixed unit inspection moves along the fixed unit pickup transfer line 32, and then the swivel package is placed on the positioning portion 394 formed on the top of the holder block 392. The drive member 328 for adjusting the respective suction nozzle lines of the fixed unit pickup 322 is operated to move the support rod and the support rod. The support rod 332b is used to support the placement of the rotating body sp to the first positioning portion of the suction nozzle 327. The support rod 332b is used to support the placement of the semiconductor package π in the second positioning portion of the suction nozzle 327, and then support The lion system is used, which is lower than the support rod. 53 200834785 After the 疋 半导体 半导体 半导体 半导体 sp sp 于 sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp sp The air passing through the air holes 396 in the positioning portion 394 is evacuated, whereby the semiconductor package SP is correctly placed on the positioning portion. When the control unit judges that the semiconductor package sp has been correctly placed on the positioning portion through the air discharge through the illusion 9, the flat keying element 372 and the vertical chain moving element 374 are operated by the corresponding motor. The h-force level shifts to the vertical element 364 and the vertical key moves 374 upward. Therefore, such as "5a", "figure map", "redundancy ^ and "5D map" display", the clamp holder for the gripping jig is not upright. More specifically, 'as shown in FIG. 5C, the horizontal chain link element 372 is rotated while the rotary shaft 380 of the horizontal link member 372 is rotated and the clamp holder 376 is hingedly coupled to the vertical chain mover. The rotating shaft slides along the corresponding guiding groove 378 of the clamp holder 376. After the clamp keeps n fully erected, the control unit _ motor rotates the first-propulsion: member 390. Thereby, the first propulsion unit is slid until the first-thickness 39〇 approaches the clamp holder and the front portion of the m, as shown in the "5th drawing".

When the first propulsion assembly 390 is near the front of the clamp holder 376, the control unit drives the motor to drive the first propulsion unit 395. Thus, the first advancement unit milk pushes the semiconductor county sp placed on the holder block 392 until the semiconductor package is fully embedded in the slit 314 of the jig 310. 54 200834785 for driving the first propulsion unit 395 after the completion of the semiconductor package embedding is rotated, whereby the first propulsion single magic 95 is completely separated from the support "A this day, and the control jig holder 376 is vertically moved. The vertical chain moving element moves upward or downward, and the idle slit 314 of the clamp 31 is positioned in the moving direction of the first propulsion unit 395.

After the first advancing unit 395 is separated from the support block 392, the fixed unit picks up the f 322 to capture the semiconductor package SP on the two intermediate rows 302 of the two rows, and then places the clamped semiconductor package on the support block 392. Positioning unit 394. After the semiconductor package sp is placed on the branch wire 392, the above steps are sharpened, so that the idle slit SM of the jig 31 is filled with the semiconductor package sp. The same as the 苐 苐 苐 6A picture shows, the first propulsion unit Na yuan yuan. The sensing unit 3" is mounted on the first propulsion unit milk. When the first push sheet το 395 embeds the semiconductor package sp into the slit of the centerpiece (10), the swivel package sp may collide with the edge of the slit 314 of the clip (4), whereby the first push unit 395 malfunctions. For example, when the pusher blade of the pusher unit 395a pushes the semiconductor package placed on the positioning portion of the holder block 392 into the jig, it is pushed by the pusher of the W push unit 395b and is located in the stand block. The slit of the semiconductor singularity (10) is lightly stuck, and the button package can be embedded in the corresponding slit 314. Although the w-propulsion unit 395a moves into the slit 3M, the propulsion unit can be advanced early. 70 39 North does not move smoothly. Therefore, the propulsion knife of the 1-2 propulsion unit is pushed against the support 55 200834785 guide 397c against the elastic force exerted by the elastic member. Tian 1 2 pushes the push of the single squat to the propeller of the branch building, so the sensor is connected to the rear of the blade guide 397c, and the sensor passes through the miscellaneous w surface unit (4). Shout to the control unit of the swivel female manufacturing system. When the fault signal is received, the control unit controls the first propulsion assembly to move along the base in a direction perpendicular to the upright fixture 310. After the first propulsion assembly has moved, the control unit drives the motor to move the first propulsion unit 395 toward the clamp and 310 the slit 314 to move. /, Therefore, the slit 3U edge of the button 310 is hooked by the semiconductor clip without the embedded clip and the slit 314 is pushed by the first push unit milk, so the semiconductor package SP is stably embedded in the jig 31G. In the slit 314. After the semiconductor package is filled with the slit 314 of the refresher by the above method, the 'horizontal chain moving element 372 is moved to the left side of the figure, and the vertical keying element is moved downward'. Therefore, as shown in FIG. 5A The clamp holder and the 376 are horizontally positioned. • After the clamp holder 376 is horizontally positioned, the control unit drives the cutting unit to check the picker '508 to grip and transport the clamp above the chuck table 5〇4. When the misalignment is located above the chuck table 5〇4, the chuck table 5〇4 is rotated by 9 degrees and moved along the chuck table transmission line 506. At this time, the cutting edge 5〇2 rotates. Therefore, while the semiconductor package sp is moving along the chuck table transfer line 506, the surface of the semiconductor package sp ♦ which is placed on the jig 310 is cut by the surface of the wafer. After completing the side cutting step of the semiconductor package of the jig on the chuck table 5〇4, the chuck table 504 returns to the initial position along the chuck table transfer line 506, and the cutting unit threatens 1, and then: Get upset 310. The above steps are performed to rotate the tool 310, and then cut the other side of the semiconductor package sp fixed on the jig 310: • When the t-cut unit pickup is raised while lifting the jig 310, the jig fixing unit 530 of the position changing device 520 is slidably embedded in the space defined between the jig 31 and the chuck table. Specifically, as shown in the "8th figure", the jig fixing unit 530 is moved by the moving unit 55 of the position changing device 52. More specifically, when the driving motor of the moving unit 55 is operated, the belt 5S2 driven by the driving force of the driving motor is operated around the pulley 556 disposed at the opposite end of the position changing device (10) to move the belt fixing member 554. Book = the belt fixing member 554 is fixed to the jig fixing unit 53A. Therefore, the transfer Lu 疋疋 疋疋 554 moves together with the jig fixing unit MO. When the fixture is fixed, the 530 is positioned between the cutting unit and the chucking unit, and the cutting unit is picked up. The part is located in the fixture positioning space of the fixture fixing unit. The movement element 538 of the 7G 534 is operated so that the clamp is safely fixed in the fixture positioning space 531, so the fixed component milk moves toward the clamp. When the port reading 537 is moved toward the jig 3ω, the corners of the jig are inserted into the fixing slits 536 of the fixing member 537. When the corners of the clamp 310 are embedded in the fixed slit 536 of the fixing member 537, the 57 200834785 clamp 310 is completely fixed to the position changing device 52A. After the gripper blade is completely fixed to the position changing device 520, the reclining motor of the moving unit 55 is rotated in the opposite direction. Thus, the jig fixing unit connected to the belt fixing member 554 is moved to its starting position. The button changing device 530 is moved to its starting position. After that, the driving unit 542 of the rotating unit operates. As the drive member 542 operates, the clamp fixing unit 530 is rotated by the chain drive unit 544.别 别 别 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The fixing unit 53 is closed. When the field fixture is rotated by a single το 530, one of the semiconductor seals that has not yet been manufactured is erected upward, and the drive motor of the mobile unit 550 is operated again, whereby the clamp/port unit 530 is located at the pick-up unit pickup, Between the lion and the chuck. φ The moving element MS of the clamp fixture unit 53 is operated to move the fixed j 537 away from the clamp 31〇. When the fixing member 537 moves away from the jig (10), the cutting unit pickup rises while lifting the jig 31G. • After the jig 310 is removed from the lost fixing unit 530, the driving motor of the moving unit 55 is operated again, whereby the jig fixing unit 53 of the position changing device 520 is moved to its start as shown in the "figure diagram". position. ~ The cutting unit pick-up piece of the pick-up jig 310 is again dropped, and the missing tool is placed on the chuck table 5〇4. Next, the chuck table is torn (10) degrees and then moved along the card 58 200834785 disk transfer line 506 toward the cutting blade 5〇2. Therefore, the other side of the semiconductor package SP fixed to the jig 3i is cut. After the cutting process of the semiconductor package sp of the forming jig 310, the chuck table 传输 transmits the 'wire 汹 along the chuck table to its starting position. Then, rotate 9 degrees in the opposite direction. As the chuck table 504 rotates, the cutting unit picks up the gripper, and the gripping jig,

The line lion is moved along the cutting unit picker and the fixture is positioned in the fixture positioning hole 382 of the clamp holder 376. After the jig 310 is fully positioned and fixed in the jig holder, the horizontal chain moving member 372 is moved rightward and the vertical chain moving member 374 is moved upward, so that the two holders 376 are displayed upright as shown in Fig. 5B. As shown in Fig. 5c, although the clamp holder 376 is operated while standing upright, it is used to drive the first propulsion assembly. Therefore, the 'first-propulsion assembly slides until it approaches the clamp and the front of the holder 376, as shown in "Fig. 5D". Eight, standing and 'for driving the motor of the second propulsion portion 402. Therefore, the second push, the P 4 〇 2 攸 攸 〇 〇 〇 〇 〇 〇 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The apex of the ancient, the syllabus, the first-propulsion 402 is constructed as a two-layer structure, and its length is smaller than its lower tip length. Therefore, when the second advancing portion 402 pushes the semiconductor package Sp to be correctly positioned on the first positioning portion a and the second positioning portion 394b of the block 392 of the step structure. After the semiconductor package I SP is placed on the mosquito-receiving portion 394, the fixed unit pickup 59 200834785 2 is moved by the fixed-carrying pickup transmission line 32〇, and is located above the first positioning portion 394a and the first positioning portion. . After that, the solid & _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The W' support rods 332a and 332b are each driven by a 32% drive member in which the support rods are connected to the suction nozzles 327 on the unit pickup 322 in two rows. Therefore, the first positioning portion 3 placed on the holder block 392 and the semiconductor sealing portion on the second positioning portion 3 are easily gripped by the fixed unit pickup 322. . . The fixed unit pickup 322 that grips the semiconductor package SP moves along the fixed unit pickup transmission line 320 to transfer the captured semiconductor package to the cleaning and drying unit 600. After the fixed unit pickup 322 is moved toward the cleaning and drying unit _, the fixed unit picks up 1 322 and the semiconductor package sp is positioned on the cleaning stage 616 of the first cleaning unit 61. When the semiconductor package sp is on the cleaning station, the control unit drives the motor 620, and the cleaning station 616 can be moved along the conveyor belt 626. ^The cleaning station 6丨6 is first located below the first nozzle 628. When the cleaning station 616 is located below the first nozzle 628·, the first nozzle 628 sprinkles the liquid containing the surfactant onto the semiconductor package SP nozzle on the cleaning table 616, and further The semiconductor package SP is chemically cleaned. After the cleaning stage 616 passes the first nozzle 628, the semiconductor package sp is positioned below the brush 630. The top of the semiconductor seal sp is physically cleaned by a brush 63. After the cleaning of the 200834785 table 616 through the brush 630, the cleaning station 616 is positioned below the second nozzle 6. When the cleaning station 616 is positioned below the second nozzle 632, the second nozzle 632 is sprayed onto the semiconductor package SP on the cleaning station 616. For example, a liquid of water. Therefore, the impurities remaining on the semiconductor package SP and the cleaning agent sprayed from the first nozzle 628 are completely removed by the liquid sprayed by the second nozzle 632. After the cleaning station 616 passes the second nozzle 632, the cleaning station 616 is located at the third nozzle 634T. The third nozzle 634 is for blowing gas to the semiconductor seal SP on the cleaning station 616. Therefore, the moisture remaining on the semiconductor package on the cleaning stage 616 is substantially removed by the gas sprayed by the third nozzle 634. After the cleaning station 616 passes the third nozzle 634, the cleaning station 616 is located below the single picker's. The unit pickup 660 is lowered toward the cleaning station 616 to pick up the semiconductor package sp on the cleaning unit 616 and move to the second cleaning unit 65A. The unit picks up 11 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the same manner as the first cleaning unit _, the second cleaning unit 650 utilizes various nozzles 652 and brushes 654 to physically and chemically clean the bottom of the semi-dissolving sp. ^The semiconductor device sp is still left with moisture through the second cleaning unit (4) because the semiconductor package sp is completely dried, and the semiconductor package SP is positioned on the drying table 670. A heater is mounted in the drying station 670. Therefore, the heat generated by the heater in 2008, 2008, 785, thoroughly dried her semiconductor package sp on the drying station 67G. After the drying process of the drying station j semiconductor package SP, the first inspection unit 71 moves along the vehicle core pickup transmission line 662. (4) The ground-inspection unit 71 is located above the drying station_ to check whether there is a defect at the top of the half-body seal| In addition, the first check: 兀? 10Transfer the inspection result of the defect on the top of the semiconductor package to the control unit.

The sub-and-different inspection unit 71 checks whether the semiconductor package on the drying station (4) is placed in its correct position, for example, to what extent the semiconductor package sp deviates from the eight correct positions. The first-inspection unit transmits the checksum to the control unit. (4) After the tr check unit 71G finishes the New Check, the dry and private (four) pass along the drying station to pass the tender _ private fine 2 heart tear (four). Subsequently, Chuan: The early 4 picks up the semiconductor package sp located in the drying station. At this time, the sister-in-law corrected it to correct the position of the semiconductor package §1>. Above: ": Figure 23" shows that some semiconductor package SPs are located at 670 ^ on the drying station, but some semi-conductors are not on the dry port 670. Therefore, the position of the semiconductor package on the drying table 67 is m: this position is edited, sunny, and 71. Element: is supplied to the transport unit pickup 2〇4. Therefore, as shown in the "The gangster's mouth - Μ map", the relative movement between the 205 and the dry 670 is carried out through the transmission wheel, and the first repair is made! For example, through the transmission unit pickup 2〇4 The X-axis correction of the semiconductor package SP is performed by the operation of 62 200834785 moving in the predetermined range and the semiconductor package SP of the transfer unit pickup 204. The Y-axis correction of the semiconductor package SP is performed by the movement of the drying stage within a predetermined range in the γ-axis direction and the inspection of the transfer unit pickup 2〇4. The transmission unit pickup 204 for picking up the semiconductor package sp is rotated by a predetermined angle to perform the zero correction of the semiconductor package. The semiconductor package sp that has completed the first correction is torn by the transfer unit pickup and the transfer unit pickup is moved over the transfer unit to the second inspection unit 720. After the transport unit pickup 2〇4 is moved over the second inspection unit 72A, the second inspection unit checks whether or not there is a defect in the bottom of the semiconductor package SP picked up by the transfer single-chip assembly and transmitted. After the second inspection unit checks whether there is a defect in the bottom of the semiconductor package SP picked up by the transfer unit pickup, the second inspection unit (10) transmits the inspection result to the control unit. Further, the "second two inspection unit 72" also inspects the semiconductor miscellaneous SP deflected by the transmission unit pickup and the positive side. The second inspection unit 720 checks whether the position of the semiconductor package sp is due to structural and other environmental factors, for example, the semiconductor package SP which is first modified by the first inspection unit claw through the transmission unit pickup device. _ backlash, resistance to the semiconductor 63 200834785 package sp position change. And, the second checking unit 72 transmits the result of the check to the control unit. On the same day, the 塾 塾 722 system is placed at the lower end of the transmission unit pickup 2〇4. Therefore, as shown in Fig. 12, in consideration of the position of the pad 722 and the off position of the semiconductor package SP, for example, the x-axis, the γ-axis, and the corner of each semiconductor package sp can detect and measure the degree of the semiconductor county sp. Further, since the position of the semiconductor package Sp has been corrected by the first checklist 710, the degree of deviation of the semiconductor package π inspected by the first check unit no is corrected within a non-small error range. Therefore, when the control unit storing the inspection result of the second inspection unit sand determines that the semi-consistency SP and the difficulty 722 (4) are out of the standard deviation, the feedback is performed, wherein the material package sp and the connection The relative position inspection result between the pads 722 is performed by the second inspection unit 720. Therefore, the break 722 is incorrectly positioned, and the user is notified that the pick is not correct Γ' and thus the position of the interface 722 is re-adjusted by the user. ☆ After the second inspection unit 72〇 completes the inspection, it is checked along the transmission unit to the crying relay=〇2 when the delivery wheel is _____. The t^X axis correction system is transmitted through the transmission unit pickup 204, for example, by the mouth/port. "Early read pickup transmission line moves to perform SP's axis correction system through the movable table 1 〇 + ^ body pregnancy from the direction along the movable table transmission line 64 200834785 The package SP correction is performed by the transmission unit pickup 104 movement The rotation of the semiconductor 204 is performed. Alternatively, the transfer unit pickup 204 may be configured as follows, that is, the transfer single pick-up 2G4 can be moved in the half-steel direction, along the X-direction, the γ-axis 2, and the Θ direction. Furthermore, all the corrections are performed by the transmission unit pickup. In the case of H, when the transmission unit picks up and moves along the transmission unit pickup, the transmission unit pickup 204 can transmit the error of the control unit due to the backlash. Information, and the casting package sp is positioned on the movable table. A control unit can utilize the execution feedback of each of the pads 722 of the transmission unit pickups 2, 4, and then the transmission unit picks 2 〇 4 can be based on which Value (processing month b 'Number' operation, thereby minimizing the occurrence of faults. After the above correction is completed, the transfer unit pickup 204 places the semiconductor package SP on the tray 102 of the corresponding movable table 103. • When stored in the control unit about the semiconductor When the package SP t defect information is transmitted to the transmission unit pickup unit, the transmission unit pickup program judges that the semiconductor package Sp having the production port π is positioned at the movable table. The work tray and the placement are judged to be excellent. The rotating package sp of the quality product is on the good disk of the movable table. The semiconductor package movable port 103 on which the tray 102 including the semiconductor package sp is disposed is moved along the movable table transmission line 1〇4, and then positioned in the tray picker. Below the private route, the tray picks up the b 112捡^^ pallet and places the picked up tray 65 200834785 The tray 102 is in the predetermined tray box 106, so that the tray 102 can be unloaded. Moreover, the tray picking 112 is constructed simultaneously The two trays 1〇2 are picked up, whereby the unloading process is quickly performed. Alternatively, the plurality of tray pickers 112 can be arranged in parallel with each other to pick up at the same time. And placing the tray 102 on the corresponding movable table 1〇3.

Hereinafter, the semiconductor package manufacturing system using the position changing device according to the second embodiment of the present invention will be described in detail with reference to "19th" and "20A" to "20E". Unlike the position converting device 520 of the first embodiment of the present invention, in the semiconductor package manufacturing system of the first embodiment of the present invention, the position changing device 52 is disposed above the 1 ^ disk transfer line 5060. In other words, unlike the position changing device 52 of the first embodiment, the position changing device 5200 of the first embodiment is not provided with a moving unit. The structure of the position changing device 52A of the second embodiment will be described below. Like the position changing device 52A of the first embodiment, the position changing device 5200 of the second embodiment includes a clamp fixing unit (10) and a rotating unit "(10), wherein the lost fixing unit 5300 is used for fixing the embedded semiconductor package The j-clamp 31, the suspect unit 5400 is used to rotate the jig fixing unit 53. That is, the position of the second embodiment, the basic structure of the re-changing device 5200 is similar to the position changing device 52 of the first embodiment. However, the positional conversion device 5200 of the second embodiment is different from the structure of the position conversion device 520 of the first embodiment in detail as follows. 66 200834785 The fixture is pre-tested to include - the first fixed component measurement, the second fixed Yuan = (10) - Axis component Zheng Cai, the first - fixed component measurement system is used for: 疋 fixture - n solid technology 532_ the first - fixed tree sighs to set the fine rotation center of the shouting fixture The moving component is mounted on the first fixing component or the second fixing side for moving the first fixing component measuring member 5320 to the clamp 31. The right, the fixed-fixed 7L member 5310 is rotatably mounted on Bit The second fixed component 5320 is rotatably mounted on the other side of the position changing device 5200, and the second fixed component is measured on the first fixed component. Therefore, the first fixed component measures the first: _The measuring position is the position of the rotating shaft. The stern-fixed 7L member 5310 is equipped with a first support shaft and two or more convex shaft portions are formed on the first support shaft. The shaft portion, when the first support shaft 5312 rotates, transmits its rotational force through the convex shaft portion to the jig 31'' so that the jig 31 can be rotated. - The top end of the second fixing member 532G is equipped with a second support shaft The convex surface with the first support shaft 5312 _, _ or more can be formed at the top of the second branch shaft 5 322. However, when it is not necessary to transmit the rotational force generated by the motor to the mishandling, only the formation A convex shaft portion is at the top end of the second support shaft 5322. The position is changed to include the element, and the first support 67 200834785 is provided. The shaft 5312 moves toward or away from the clamp 31, and the necessary driving force. For example, moving toward or far Turn the second ritual axis 5322, therefore, the brother-support axis S 312 moves toward or away from the second axis, whereby the clamp is connected to the side of the weaving unit, or from the fixture unit. Of course, the moving element 533 can be mounted to the first support shaft or the second support The shaft 5322. Alternatively, the _shaft element side may be wired onto the first support shaft 5312 and the second support shaft 5322. The position of the misplaced lake includes a sleek element, the crane unit is mounted on the first fixing member 53 Η or the second The fixing member 532 is on one side for providing the necessary force for rotating the jig. The rotating unit 5 can be, for example, a motor. The position change is further included - on the unit side, the green unit is set in the fixture fixing unit 53 〇〇. The cleaning unit measures the nozzle, wherein the nozzle is directed to the fixture 3 fixed to the fixture unit. In addition, the cleaning unit 5500 has the following structure. The σ structure is as follows. When the cleaning unit % (8) is not driven, the nozzle direction is removed from the clamp, and when the cleaning unit measures the crane, the object is to the cool device 31. When the position changing device 5 is rotated while the field is being deleted, the cleaning 7L 5500 is used to remove impurities generated during the process of fixing the semiconductor package on the cutting jig 31, thereby cleaning the semiconductor package sp. Next, a purely readable turn-over reading using the position changing device of the second embodiment of the present invention having the above configuration will be described in detail. 68 200834785 First, the structure of a cutting unit 5000 is shown as "19th". When the chuck table 504CM stands under the - cutting unit pickup 5_, wherein the chuck is placed on the chuck table, the 3100 'clamp 31 has a semiconductor package SP ' having been fabricated on one side, so the cutting unit picks up at this time , 5_ pick up the fixture and increase it. Next, the cutting unit pickup 5080 is displayed along the 〇 movement of a cutting unit pickup transmission line 5 as shown in FIG. 20A, whereby the cutting unit pickup 5_ is positioned above the position changing device 5200 and the jig is located The position changing device is defined by the fixture positioning unit inside the fixture unit of the lake. When the field fixture 31 is positioned in the fixture positioning space, the first fixing member is moved to the side of the jig by the moving member. As the first fixing member 531 is moved toward the jig 3100', the jig 3100 is moved toward the second fixing member 532(). Therefore, the opposite end of the dislocation 3100 is connected to the first fixed component and the second fixed component 5320, as shown in "Fig. 2B". The second support vehicle of the first support shaft 5'' and the second support member 5320 of the first and second fixed members 531'' are connected to the opposite ends of the clamp by the 5322. After the jig 3 is fixed to the jig fixing unit, the rotating unit is operated to rotate the jig 31 旋转 by 180 degrees. For example, the clamp 3100 is rotated by 180 degrees by the rotating unit 5400, and the clamp 3 is turned to the reverse direction. The scale is ejected from the cleaning sheet mounted on the side of the jig fixing unit to remove the impurities leaking from the jig 3. After passing through the rotary element_clamp__, the cutting unit 69 200834785 picks up the handle to move over the clamp 31〇〇, and grips the clamp 3 to touch. Subsequently, through the telekinetic element 5330, the first fixing element 5310 and the second fixing element 532 are moved away from the clamp 3100, whereby the first bearing shaft 5312 and the second branch shaft are separated from the clamp 3100' and the cutting unit pickup 5〇8〇捡The clamp 31〇〇. After the cutting unit pickup 5_ picks up the jig 3100, the cutting unit pickup 5080 moves along the cutting unit pickup transfer line 5〇9〇 to the upper of the chuck table 5〇4〇, and then places the jig 3100 on the upper portion of the chuck table 5040. . The chuck table on which the jig 3100 is placed is moved to a cutting blade, and the other side of the semiconductor package sp is cut through the cutter 5020. The jig of the semiconductor package sp to which the cutting process has been completed will be subjected to the same processing as the above processing. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Patent Protection of the Invention This application is intended to cover the scales defined by the company. For example, although as described above, the semiconductor package manufacturing system of the present invention is configured such that the first pusher assembly slides in close proximity to the erecting of the fixture: element 364' but the present invention can also be constructed as follows 'The vertical member 364 is adjacent to the first advancement assembly. "As shown in Figure 21A", "21B", "21C" and "Plus", the 'fixture holder 376 may not be hinged to the vertical keying element 200834785 374, but may be rotated And slidingly connected to the vertical chain link element 374. Further, as shown in "21A", "21B", "2ic" and "21D", the first advancing portion 398 and the second advancing portion 402 can be constructed in a three-layer structure. Of course, when the first advancing portion 398 and the second advancing portion 402 are constructed in a three-layer structure, the abutting block 392 can be constructed in a three-layer structure. Further, as shown in Fig. 22, the position 'transformation means of the first embodiment described above can be constructed such that the - position changing means 520 is located above a chuck table transmission line 5〇6. Further, in the position changing device of the first embodiment described above, only the position converting means 520 may be provided, and the position changing means 52'' can be moved up or down along a guide bar G. Also, a rotation element can be configured for rotating a fixture fixing unit 530'. This rotating element can be a motor.

Specifically, when the chuck table 5〇4 on which the jig 310' is placed is moved along the chuck table transfer line 5〇6, the chuck table 504' is located below the position changing device 52A. The position change device 520, picks up the jig 310, and then rises along the guide bar G. At the position of the rotary unit 520 of the garment 520, after the rotation, the M vertical shifting device 52 is lowered along the guide rod G, and then the clamp 31 is placed on the chuck table 5〇4. A ^ Same day, as shown in Fig. 1, according to the directivity of the cutting edge 502, it is necessary to establish directivity to the semiconductor package sp to be embedded in the slit 314 of the jig 310. According to the structure of the first image of the skin, by designing the transfer unit pickup, 2〇4 can be rotated, the orientation is obtained. However, such directionality can be obtained before the semiconductor package is embedded in the slit 314. Therefore, as shown in Fig. 16, the fixed unit pickup 71 200834785 322 can be configured to be rotatable to obtain the directivity of the semiconductor package SP to be embedded in the slit 314 of the jig 310. Further, as shown in Fig. 17, the positioning portion of the holder block 392 can be configured to be rotatable. When the positioning portion 394 of the holder block 392 is rotated, the directivity of the material body W of the slit 314 which is to be inserted into the holder 31 is maintained. Thereby, the same effect as the structure of "Fig. 1" is exhibited.

In addition, in "18A", "18B" and "18C", the intermediate table can be rotated. For example, "Picture 18A" shows that in the semiconductor seals sp that will be positioned in the middle table 3〇2 through the transfer wheel, the first is located on the intermediate stage 3〇2, then the middle stage, and then the 'h body The package SP is arranged as shown in the "figure". For example, "Dimensional == Single: Pick up the coffee ^ 4 semiconductor package SP as shown in Figure 18c, maintain the directionality of the swivel package sp located in the middle (four) 2. Through the above bribes, the whole face Since the semiconductor package manufacturing system and its manufacturing method, the semiconductor package is made in a small amount. Therefore, the tree material has a large area and a small amount of silk and time [simple description of the figure] The first picture is The schematic diagram of the structure of the second semiconductor, the second diagram, and the package manufacturing system of the present invention; the C diagram and the 苐2D diagram show the arrangement of the trays that constitute the 72 200834785 map and the side view and the side view; And FIG. 3B is a perspective view and a cross-sectional view of the transmission unit pickup structure of the transmission unit of the upper μ, ^ 〜, , , /, , and Chengdi 1 diagrams; And FIG. 4 is a side view and a front view showing the solidification of the composition of the i-th diagram; FIGS. 5A, 5B, 5C, and 5D are side views showing the first work;

Figure 6 and Figure 6 are front and side views showing the structure of the first pusher assembly and the second pusher assembly of the package fixing unit constituting the Figure 1; Figure 7, Figure 7:6, Figure 7 (:: Figure 71, Fig. 7 and Fig. 7 are front views showing the structure and operation of the package fixing unit constituting Fig. 1; Fig. 8 is a perspective view showing the structure of the holder block constituting Fig. 5; FIG. 10 is a front elevational view showing the operation of the position changing device constituting the second drawing, and FIG. 10 is an exploded perspective view showing a temporary fixing structure in which a jig is temporarily fixed to FIG. 9 in the temporary fixing structure. The position conversion device; the 11th, 11th, 11th, 1st, and 11th are side views showing the operation of the cleaning unit constituting the first drawing; and the 12th drawing is the self-composition of the first drawing. The second inspection unit observes the state of the transmission unit pickup; FIG. 13 is a structural diagram of the semiconductor package manufacturing system according to another embodiment of the present invention. 73 200834785 is intended; FIG. 14 is a semiconductor package manufacturing system according to another embodiment of the present invention. Schematic diagram of the structure; 15 is a schematic structural view of a semiconductor package manufacturing system according to still another embodiment of the present invention; FIG. 16 is a schematic structural view of a semiconductor package manufacturing system according to another embodiment of the present invention; and FIG. 17 is a semiconductor according to still another embodiment of the present invention; FIG. 19 is a schematic plan view of a package fixing unit of a half &amp; body package manufacturing system according to another embodiment of the present invention; FIG. 19 is another embodiment of the present invention; a plan view of the cutting unit constituting the figure; 20A, 20B, 2c, 2D, and 2D are side views showing the operation of the position changing device constituting FIG. 19; 21A, 21B, 21C, and 21D are side views showing the operation of the package fixing unit of the first embodiment, and FIG. 22 is a view showing the composition of still another embodiment. A plan view of the cutting unit; and Figs. 23 and 24 are plan views showing the operation of the drying station and the transfer unit pickup constituting Fig. 1. [Description of main component symbols] 74 200834785 100 102 102a 102b 106 * 103 ^ 104 ❿ 110 112 114 116 116a 116b 116c _ 116d 118 ^ 118a ' 118b 118c 118d 120 Loading and unloading unit tray _ First tray Second tray tray box activity Station movable table transmission line tray pickup transmission line tray pickup main body first clamping unit clamping fast driving element positioning groove fitting protrusion second clamping unit lost holding driving element positioning groove meshing projection shaft 75 200834785

122 elastic element 124 guide bar 200 transmission unit 202 transmission unit pickup transmission line 204 transmission unit pickup 206 pickup assembly 208 suction element 210 vertical movement element 212 first drive element 214 first chain element 216 pinion 218 rack 209 nozzle 222 second driving element 220 rotating element 224 second chain moving element 202a first transmission unit pickup transmission line 202b second transmission unit pickup transmission line 204a first transmission unit pickup 204b second transmission unit pickup 222a first driving element 76 200834785 222c third drive element 228 pulley 208a first suction element 208b second suction element 208c third suction element ~ 208d fourth suction element ¥ 208e fifth suction element 208f sixth suction element 2 〇 8g seventh suction element 208h Eight suction element 300 Package fixing unit 302 Intermediate stage 304 Intermediate stage transmission line 310 Fixture® 310, Fixture 3100 Fixture ^ 314 Slit '336 Stupid strip 320 Fixed unit Pickup transfer line 322 Fixed unit Pickup 382 Fixture locating hole 77 200834785 SP semiconductor package 338 pinion 328 drive 7L piece 330 chain unit 334 guide rod 344 elastic element. 340 correction unit • 342 correction rod 326 suction element 332 support rod 327 suction nozzle 324 pick-up device 332a support rod 332b support rod 328a drive Element 328b Drive Element 350 Package Fixing Device 360 Body Unit 362 Horizontal Element 364 Vertical Element 370 Chain Unit 78 200834785

372 Horizontal chain element 373 Side wall 374 Vertical chain element 376 Clamp holder 378 Guide groove 380 Rotary shaft 384 Clamp holder fixing unit 385 Body 386 Groove 387 Elastic element 388 Protrusion 389 Engagement groove 390 First propulsion assembly 391 Base 395 first propulsion unit 397 first propulsion unit 397a propulsion blade 397b propulsion blade guide rod 397c support guide rod 398a first pulley 398b second pulley 79 200834785 398c conveyor belt 398d fixed guiding device 398 first propulsion portion 393 main body portion 394 positioning portion 394a First positioning portion 394b Second positioning portion 396 Air hole 392 Bearing block 399 Sensing unit 399a Elastic element 399b Sensor 399c Guide rod 395a 1-1 Propulsion unit 395b 1-2 Propulsion unit 400 Second propulsion unit 401a 2 -1 propulsion unit 401b 2-2 propulsion unit 402 propulsion portion 402a propulsion blade 402b propulsion blade guide 200834785 402c 403 403a 403b 403c ^ 403d ^ 404 • 404a 404b 500 502 502, 5020 504 • 504, 5040 • 506 ^ 506, 5060 508 5080 support guide drive unit first pulley second pulley conveyor fixed guide A sensor sensing unit elastic member cutting unit cutting edge of the cutting edge of the cutting edge chuck table chuck table chuck table chuck table chuck table of the transmission line of the transmission line of the transmission line chuck table cutting unit cutting unit pickup pickup 81,200,834,785

509 cutting unit pickup transfer line 5090 cutting unit pickup transfer line 520 position changing device 520, position changing device 5200 position changing device 5300 jig fixing unit 530, jig fixing unit 5310 first fixing member 5312 first support shaft 5320 second fixing member 5322 Second support shaft 5330 moving element 5400 rotation unit 540, rotation unit 55 (10) cleaning unit 530 clamp fixing unit 531 clamp positioning space 532 frame 533 temporary fixing member 533a ringing protrusion 533b spring 82 200834785 534 536 537 538 540 • 542 ' 544 • 546 548 550 552 554 556 600 _ 610 612 • 614 ^ 616 618 620 Fixing unit fixing slit fixing element moving element rotating unit driving element chain moving unit rack pinion moving unit conveyor belt conveyor belt fixing element pulley cleaning and drying unit first cleaning Unit cleaning container cleaning space cleaning station cleaning station handling unit motor first pulley 83 622 200834785 624 second pulley 626 conveyor belt 654 brush 652 650 670 660 634 632 nozzle second cleaning early drying table Unit picker third nozzle second nozzle 630 brush

628 672 662 700 710 720 722 730 740 G First nozzle Drying station transfer line Unit pickup transfer line Inspection unit First inspection unit Second inspection unit Pads Third inspection unit Fourth inspection unit Guide 84

Claims (1)

200834785 X. Patent Application Scope 1. A manufacturing system for a semiconductor package, comprising: a loading and unloading unit for loading a semiconductor package; and a package fixing unit for fixing and unloading the semiconductor package The disambiguation-clamping is so that the engraving conductor is packaged; a cutting unit is turned over to the inscription and the conductor is sealed; a younger-cleaning unit is glazed to clean one side of the semiconductor package from the paste unit , for example, a top or a bottom; and, a second cleaning unit for cleaning the other side of the half-package. 2. The manufacturing system of claim i, further comprising a transmission unit, = for transmission The semiconductor package is mounted by the loading and unloading unit. 3. The manufacturing system described in item i or item 2 of the patent scope further comprises - drying the remaining 7L side of the semiconductor package for drying the cleaning unit and the second cleaning unit. 9. The manufacturing system of claim i, wherein the cutting unit includes a position changing device for converting the jig to a reverse direction. 3. The manufacturing system of claim 1, further comprising an inspection unit for checking whether the cut semiconductor package is defective. Early 70, 6. If = please patent scope! The manufacturing system of the present invention, wherein the package fixing unit comprises: and the main unit has a secret thief missing - the retainer, 85 200834785 comprises - a horizontal element and a vertical element, the horizontal element constitutes the main unit a bottom member, the vertical member is perpendicular to the horizontal member; a first-pushing assembly, the side of the rotating body is packaged in the clip, and the first-propulsion assembly can be in the X-axis direction and the γ-direction to the horizontal member Moving up horizontally; a second propulsion assembly corresponding to the first advancement θ 雅 inverse, and the sigh of the component for removing the semiconductor package from the fixture; and the chain-linking unit The enchantment, _ _ conductor package can be easily embedded and fixed in the fixture. The manufacturing system described in claim 6 is directed to: - a body portion forming a body of the first propulsion assembly; - a support block disposed at a top end of the body portion Further, the semiconductor enclosure is located at the top of the support block; and the first and second propulsion units are the same as the two-dimensional horizontal sense of the semiconductor package on the support block. in. The manufacturing system of claim 6, wherein the second propulsion assembly comprises: - a body portion, the gem is the body of the second rail member; and - the second propulsion unit is along the body portion Moving horizontally removes the semiconductor package from the slit of the fixture. 86 200834785 9, a method of manufacturing a semiconductor package comprising the steps of: loading a semiconductor package to a manufacturing system; fixing the loaded semiconductor package to a missing device; cutting the semiconductor package fixed to the fixture; and manufacturing the package The semiconductor package is unloaded. 1〇· The application method described in the application of the ninth item further includes the step of cleaning the cut semiconductor package. ^ 11. The manufacturing method of claim 1, wherein the step of cutting the semiconductor package comprises: cleaning and drying the top of the semiconductor package; cleaning the bottom of the semiconductor package; and drying the semiconductor package. 12. If you apply for the special manufacturing method from item 9 to item f--the manufacturing method, it also includes the steps to detect whether the defective semiconductor is defective. 13. If you apply for the manufactured side of the special fiber _ 12, it also includes the side and the steps to correct the degree of deviation of the cut semiconductor package. 87