TWI637886B - Apparatus for packing semiconductor device with carrier tape - Google Patents

Apparatus for packing semiconductor device with carrier tape Download PDF

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Publication number
TWI637886B
TWI637886B TW105116674A TW105116674A TWI637886B TW I637886 B TWI637886 B TW I637886B TW 105116674 A TW105116674 A TW 105116674A TW 105116674 A TW105116674 A TW 105116674A TW I637886 B TWI637886 B TW I637886B
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TW
Taiwan
Prior art keywords
carrier tape
tape
winding
unit
reel
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Application number
TW105116674A
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Chinese (zh)
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TW201741209A (en
Inventor
高升奎
權大甲
安珠勳
朱柄權
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英泰克普拉斯有限公司
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Publication of TW201741209A publication Critical patent/TW201741209A/en
Application granted granted Critical
Publication of TWI637886B publication Critical patent/TWI637886B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B43/00—Forming, feeding, opening or setting-up containers or receptacles in association with packaging
    • B65B43/42—Feeding or positioning bags, boxes, or cartons in the distended, opened, or set-up state; Feeding preformed rigid containers, e.g. tins, capsules, glass tubes, glasses, to the packaging position; Locating containers or receptacles at the filling position; Supporting containers or receptacles during the filling operation
    • B65B43/44—Feeding or positioning bags, boxes, or cartons in the distended, opened, or set-up state; Feeding preformed rigid containers, e.g. tins, capsules, glass tubes, glasses, to the packaging position; Locating containers or receptacles at the filling position; Supporting containers or receptacles during the filling operation from supply magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B57/00—Automatic control, checking, warning, or safety devices
    • B65B57/02—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of binding or wrapping material, containers, or packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
    • B65B61/04—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages
    • B65B61/06—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B7/00—Closing containers or receptacles after filling
    • B65B7/16—Closing semi-rigid or rigid containers or receptacles not deformed by, or not taking-up shape of, contents, e.g. boxes or cartons
    • B65B7/162—Closing semi-rigid or rigid containers or receptacles not deformed by, or not taking-up shape of, contents, e.g. boxes or cartons by feeding web material to securing means
    • B65B7/164—Securing by heat-sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H16/00—Unwinding, paying-out webs
    • B65H16/10—Arrangements for effecting positive rotation of web roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/81—Packaging machines

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

本發明涉及一種利用載帶的半導體元件包裝裝置。載帶供給卷盤供給載帶。載帶輸送單元將從載帶供給卷盤供給的載帶沿一個方向輸送。蓋帶供給單元以將收納有向載帶輸送單元的收納區域供給的半導體元件的載帶的口袋覆蓋的方式供給蓋帶。密封單元使從蓋帶供給單元供給的蓋帶黏合在載帶上而密封載帶的口袋。載帶捲繞單元使空狀態的捲繞卷盤依次移動至捲繞被密封單元密封的載帶的位置，使載帶捲繞於分別移動至捲繞位置的捲繞卷盤。切割單元將從密封單元向載帶捲繞單元輸送的載帶以與分別要捲繞於各捲繞卷盤的長度對應地切割。附著單元使載帶的前端附著於捲繞卷盤，並使被切割單元切割的載帶的後端附著於載帶的被捲繞的部位。 The present invention relates to a semiconductor device packaging device using a carrier tape. The carrier tape supply reel supplies the carrier tape. The carrier tape transport unit transports the carrier tape supplied from the carrier tape supply reel in one direction. The cover tape supply unit supplies the cover tape so as to cover a pocket of a carrier tape containing semiconductor elements supplied to a storage area of the carrier tape conveying unit. The sealing unit adheres the cover tape supplied from the cover tape supply unit to the carrier tape to seal the pocket of the carrier tape. The carrier tape winding unit sequentially moves the empty winding reel to the position where the carrier tape sealed by the sealing unit is wound, and causes the carrier tape to be wound around the winding reels that are respectively moved to the winding position. The cutting unit cuts the carrier tape conveyed from the sealing unit to the carrier tape winding unit so as to correspond to the length to be wound on each winding reel, respectively. The attaching unit attaches the front end of the carrier tape to the winding reel, and attaches the rear end of the carrier tape cut by the cutting unit to the wound portion of the carrier tape.

Description

利用載帶的半導體元件包裝裝置 Semiconductor device packaging device using carrier tape

本發明涉及一種利用載帶的半導體元件包裝裝置，更詳細而言涉及一種將合格品半導體元件收納於載帶的口袋並由蓋帶密封的包裝裝置。 The present invention relates to a packaging device for a semiconductor element using a carrier tape, and more particularly to a packaging device for storing a qualified semiconductor device in a pocket of a carrier tape and sealing it with a cover tape.

半導體元件在通過半導體工序被製造後，在發貨前會經過檢查。即，對於半導體元件，不僅僅是用包裝品包裹的內部的不良，存在外觀缺陷時也會對性能產生致命影響。因此，對於半導體元件不僅進行電氣動作檢查，還進行包括外觀視覺檢查的各種檢查。 After a semiconductor element is manufactured through a semiconductor process, it is inspected before shipment. That is, the semiconductor device is not only defective inside the packaged product, but also has a fatal effect on performance when there are appearance defects. Therefore, not only the electrical operation inspection of semiconductor devices but also various inspections including visual inspection of appearance are performed.

經過這種檢查的是合格品半導體元件被裝在包裝容器中而向外部發貨。作為包裝容器可以使用託盤(tray)或者載帶等。一般而言，載帶中以一列排列有多個用於收納半導體元件的口袋(pocket)。載帶以將半導體元件收納於各口袋的狀態被蓋帶(cover tape)密封後被捲繞於捲繞卷盤。 After this inspection, qualified semiconductor devices are packed in packaging containers and shipped to the outside. As the packaging container, a tray or a carrier tape can be used. Generally, a plurality of pockets for storing semiconductor elements are arranged in a row in a carrier tape. The carrier tape is sealed with a cover tape in a state where the semiconductor element is stored in each pocket, and is wound around a winding reel.

另一方面，捲繞卷盤將載帶按照半導體元件的批次(LOT)區分而捲繞，在半導體元件的批次發生變更的情況下需要交換成新的捲繞卷盤。根據現有技術，交換捲繞卷盤的作業由手工作業實現的情況占大部分，因此存在包裝作業效率降低的問題。 On the other hand, a winding reel winds a carrier tape according to the lot (LOT) classification of a semiconductor element, and when the lot of a semiconductor element changes, it needs to be replaced with a new winding reel. According to the prior art, the operation of exchanging the winding reels is mostly performed by a manual operation, so there is a problem that the efficiency of the packaging operation is reduced.

本發明的課題在於，提供能夠提高將半導體元件包裝在載帶的作業效率的半導體元件包裝裝置。 An object of the present invention is to provide a semiconductor element packaging device capable of improving the work efficiency of packaging semiconductor elements on a carrier tape.

為了實現上述課題，根據本發明的利用載帶的半導體元件包裝裝置包括載帶供給卷盤、載帶輸送單元、蓋帶供給單元、密封單元、載帶捲繞單元、切割單元、以及附著單元。載帶供給卷盤供給載帶，在該載帶沿著長度方向以一列排列有多個用於收納半導體元件的口袋。載帶輸送單元將從載帶供給卷盤接收的載帶以口袋的各入口朝向上方的狀態向一個方向輸送。蓋帶供給單元在通超載帶輸送單元輸送載帶時供給蓋帶，以對收納有向載帶輸送單元的收納區域供給的半導體元件的載帶的口袋進行覆蓋。密封單元使從蓋帶供給單元供給的蓋帶黏合在載帶上而密封載帶的口袋。載帶捲繞單元使空狀態的各捲繞卷盤依次移動至捲繞被密封單元密封的載帶的位置，使載帶捲繞於分別移動至捲繞位置的各捲繞卷盤。切割單元將從密封單元向載帶捲繞單元輸送的載帶與分別要捲繞於各捲繞卷盤的長度對應地切割。附著單元在載帶捲繞於捲繞卷盤時，使載帶的前端附著於捲繞卷盤，使被切割單元切割的載帶的後端附著於載帶的被捲繞的部位。 In order to achieve the above-mentioned subject, a semiconductor element packaging device using a carrier tape according to the present invention includes a carrier tape supply reel, a carrier tape conveying unit, a cover tape supplying unit, a sealing unit, a carrier tape winding unit, a cutting unit, and an attachment unit. The carrier tape supply reel supplies carrier tapes, in which a plurality of pockets for accommodating semiconductor elements are arranged in a row along the longitudinal direction. The carrier tape conveying unit transports the carrier tape received from the carrier tape supply reel in one direction with each inlet of the pocket facing upward. The cover tape supply unit supplies the cover tape when the carrier tape is conveyed through the overload tape conveying unit to cover the pocket of the carrier tape containing the semiconductor element supplied to the storage area of the carrier tape conveying unit. The sealing unit adheres the cover tape supplied from the cover tape supply unit to the carrier tape to seal the pocket of the carrier tape. The carrier tape winding unit sequentially moves each winding reel in an empty state to a position where the carrier tape sealed by the sealing unit is wound, and causes the carrier tape to be wound around each winding reel that is moved to the winding position. The cutting unit cuts the carrier tape conveyed from the sealing unit to the carrier tape winding unit according to the length to be wound around each winding reel. When the carrier tape is wound on the winding reel, the front end of the carrier tape is attached to the winding reel, and the rear end of the carrier tape cut by the cutting unit is attached to the wound portion of the carrier tape.

根據本發明，實現半導體元件收納於載帶並密封而捲繞於捲繞卷盤的過程和交換捲繞卷盤的過程的自動化，因此能夠提高包裝作業效率。 According to the present invention, since the process of accommodating and sealing a semiconductor element on a carrier tape and winding it on a winding reel and the process of exchanging the winding reel are automated, the packaging work efficiency can be improved.

1‧‧‧載帶 1‧‧‧ Carrier tape

1’‧‧‧載帶 1’‧‧‧ carrier tape

1a‧‧‧口袋 1a‧‧‧pocket

1b‧‧‧輸送孔 1b‧‧‧conveying hole

2‧‧‧半導體元件 2‧‧‧Semiconductor

3‧‧‧蓋帶 3‧‧‧ cover tape

4‧‧‧黏合帶 4‧‧‧ Adhesive tape

4a‧‧‧黏合片 4a‧‧‧Adhesive sheet

4b‧‧‧離型紙 4b‧‧‧ release paper

5‧‧‧黏合帶 5‧‧‧ Adhesive tape

10‧‧‧本體 10‧‧‧ Ontology

21‧‧‧裝載部 21‧‧‧Loading Department

22‧‧‧空託盤部 22‧‧‧Empty Tray Department

23‧‧‧殘次品儲存部 23‧‧‧ Defective goods storage department

24‧‧‧卸載部 24‧‧‧Unloading Department

25‧‧‧空託盤儲存部 25‧‧‧empty tray storage

26‧‧‧緩衝部 26‧‧‧Buffer Department

30‧‧‧檢查部 30‧‧‧ Inspection Department

31‧‧‧第一照相機 31‧‧‧ first camera

32‧‧‧第二照相機 32‧‧‧Second camera

41、42、43、44、45‧‧‧送料機 41,42,43,44,45‧‧‧Feeders

46‧‧‧軌道 46‧‧‧ track

50‧‧‧轉換器 50‧‧‧ converter

60‧‧‧分類部 60‧‧‧Classification Department

61‧‧‧拾取器 61‧‧‧Pickup

80‧‧‧翻轉部 80‧‧‧ Flip

90‧‧‧標記部 90‧‧‧Marking Department

100‧‧‧半導體元件包裝裝置 100‧‧‧Semiconductor component packaging device

101‧‧‧底架 101‧‧‧ Underframe

110‧‧‧載帶供給卷盤 110‧‧‧ Carrier supply reel

111‧‧‧引導部 111‧‧‧Guide

120‧‧‧載帶輸送單元 120‧‧‧ Carrier Conveyor Unit

121‧‧‧輸送台 121‧‧‧ Conveyor

121a‧‧‧第一輸送台 121a‧‧‧First Conveyor

121b‧‧‧第二輸送台 121b‧‧‧Second Conveyor

122‧‧‧鏈輪 122‧‧‧Sprocket

122a‧‧‧鋸齒 122a‧‧‧Sawtooth

123‧‧‧鏈輪旋轉機構 123‧‧‧Sprocket rotation mechanism

124‧‧‧輸送軌道 124‧‧‧Conveyor track

125‧‧‧間隔調節機構 125‧‧‧ interval adjustment mechanism

130‧‧‧蓋帶供給單元 130‧‧‧ Cover tape supply unit

130a‧‧‧供給卷盤支承台 130a‧‧‧Supply reel support table

131‧‧‧蓋帶供給卷盤 131‧‧‧ Cover tape supply reel

132‧‧‧帶供給卷盤旋轉機構 132‧‧‧Tape reel rotation mechanism

133‧‧‧蓋帶引導輥 133‧‧‧ Cover tape guide roller

134‧‧‧蓋帶張力引導部 134‧‧‧ Cover tape tension guide

134a‧‧‧可動輥 134a‧‧‧movable roller

134b‧‧‧線性致動器 134b‧‧‧ Linear Actuator

140‧‧‧密封單元 140‧‧‧sealed unit

141‧‧‧熱黏合機構 141‧‧‧Heat bonding mechanism

142‧‧‧葉片 142‧‧‧ Blade

143‧‧‧加熱器 143‧‧‧heater

144‧‧‧葉片安裝塊 144‧‧‧ Blade mounting block

145‧‧‧安裝塊支承台 145‧‧‧Mounting block support table

146‧‧‧安裝塊驅動機構 146‧‧‧Mounting block drive mechanism

147‧‧‧氣缸支承台 147‧‧‧cylinder support table

148‧‧‧間隔調節機構 148‧‧‧ interval adjustment mechanism

150‧‧‧載帶捲繞單元 150‧‧‧Tape winding unit

151‧‧‧捲繞卷盤 151‧‧‧ Winding reel

152‧‧‧捲繞卷盤旋轉機構 152‧‧‧ Winding reel rotation mechanism

152a‧‧‧軸 152a‧‧‧axis

152b‧‧‧旋轉馬達 152b‧‧‧rotary motor

152c‧‧‧軸支承台 152c‧‧‧shaft support

153‧‧‧捲繞卷盤線性移動機構 153‧‧‧Reel linear movement mechanism

153a‧‧‧水準支承台 153a‧‧‧level support platform

153b‧‧‧水準移動用線性引導部 153b‧‧‧ Linear guide for level movement

153c‧‧‧水準移動用線性致動器 153c‧‧‧ Linear actuator for level movement

154‧‧‧捲繞卷盤升降機構 154‧‧‧Winding reel lifting mechanism

154a‧‧‧垂直支承台 154a‧‧‧Vertical support

154b‧‧‧升降用線性引導部 154b‧‧‧ Linear Guide for Lifting

154c‧‧‧升降用線性致動器 154c‧‧‧ Linear actuator for lifting

155‧‧‧傳感機構 155‧‧‧Sensor mechanism

155a‧‧‧傳感杆 155a‧‧‧ sensor lever

155b‧‧‧輥 155b‧‧‧roller

155c‧‧‧傳感杆引導部 155c‧‧‧Sensor rod guide

155d‧‧‧彈性部件 155d‧‧‧Elastic parts

155e‧‧‧位置感測器 155e‧‧‧Position Sensor

160‧‧‧切割單元 160‧‧‧ cutting unit

161‧‧‧切斷台 161‧‧‧cut-off table

162‧‧‧切割器 162‧‧‧Cutter

163‧‧‧切割器線性移動機構 163‧‧‧Cutter linear movement mechanism

164‧‧‧切割器支承台 164‧‧‧Cutter support table

170‧‧‧附著單元 170‧‧‧ Attachment Unit

170a‧‧‧卷盤支承台 170a‧‧‧ Reel support table

171‧‧‧黏合帶供給卷盤 171‧‧‧ Adhesive tape supply reel

172‧‧‧黏合帶供給卷盤旋轉機構 172‧‧‧ Adhesive tape supply reel rotation mechanism

173‧‧‧剝離器 173‧‧‧ Stripper

173a‧‧‧突出部 173a‧‧‧ protrusion

174‧‧‧黏合片加壓機構 174‧‧‧Adhesive sheet pressing mechanism

174a‧‧‧加壓杆 174a‧‧‧Pressure lever

174b‧‧‧輥 174b‧‧‧roller

174c‧‧‧加壓杆引導部 174c‧‧‧Pressure rod guide

174d‧‧‧加壓杆升降機構 174d‧‧‧Pressure rod lifting mechanism

175‧‧‧離型紙回收卷盤 175‧‧‧Release paper reel

176‧‧‧離型紙回收卷盤旋轉機構 176‧‧‧Releasing paper reel rotating mechanism

177‧‧‧黏合帶張力引導部 177‧‧‧Adhesive tape tension guide

178‧‧‧離型紙輸送機構 178‧‧‧Release paper conveying mechanism

181‧‧‧第一視覺檢查器 181‧‧‧The first visual checker

182‧‧‧第二視覺檢查器 182‧‧‧Second Visual Inspector

圖1是適用根據本發明一實施例的半導體元件包裝裝置的、半導 體元件檢查裝備的一例的結構圖。 FIG. 1 is a semiconductor device to which a semiconductor device packaging device according to an embodiment of the present invention is applied. A block diagram of an example of a body element inspection equipment.

圖2是根據本發明的一實施例的半導體元件包裝裝置的立體圖。 FIG. 2 is a perspective view of a semiconductor device packaging device according to an embodiment of the present invention.

圖3是圖2的主視圖。 FIG. 3 is a front view of FIG. 2.

圖4用於說明半導體元件收納於載帶並被蓋帶密封的過程的圖。 FIG. 4 is a diagram for explaining a process in which a semiconductor element is stored in a carrier tape and sealed by a cover tape.

圖5是表示圖2中的載帶輸送單元的立體圖。 Fig. 5 is a perspective view showing a carrier tape conveying unit in Fig. 2.

圖6是表示圖2中的蓋帶供給單元的立體圖。 FIG. 6 is a perspective view showing the cover tape supply unit in FIG. 2.

圖7是表示圖2中的密封單元的側視圖。 FIG. 7 is a side view showing the sealing unit in FIG. 2.

圖8是表示圖2中的載帶捲繞單元的立體圖。 FIG. 8 is a perspective view showing a carrier tape winding unit in FIG. 2.

圖9是用於說明圖8中的傳感機構的作用例的圖。 FIG. 9 is a diagram for explaining an operation example of the sensing mechanism in FIG. 8.

圖10是表示圖2中的切割單元的側視圖。 FIG. 10 is a side view showing the cutting unit in FIG. 2.

圖11是表示圖2中的附著單元的主視圖。 FIG. 11 is a front view showing an attachment unit in FIG. 2.

圖12以及圖13是用於說明圖11中的剝離器的作用的圖。 12 and 13 are diagrams for explaining the operation of the peeler in FIG. 11.

下面，參照附圖對本發明進行詳細說明。在此，對於相同的結構使用相同附圖標記，並省略重複說明和對於不必要地使本發明的主旨不明確的公知功能及結構的詳細說明。本發明的實施方式是為了對本領域中具備平均知識的人更完整地說明本發明而提供的。因此，附圖中的要素的形狀及大小等可以為了進行更加明確的說明而被放大。 Hereinafter, the present invention will be described in detail with reference to the drawings. Here, the same reference numerals are used for the same configurations, and redundant descriptions are omitted and detailed descriptions of well-known functions and configurations that unnecessarily obscure the gist of the present invention are omitted. Embodiments of the present invention are provided to more fully explain the present invention to persons having average knowledge in the art. Therefore, the shapes, sizes, and the like of the elements in the drawings may be exaggerated for a clearer explanation.

圖1是適用根據本發明一實施例的半導體元件包裝裝置的、半導體元件檢查裝備的一例的結構圖。 FIG. 1 is a configuration diagram of an example of a semiconductor element inspection equipment to which a semiconductor element packaging device according to an embodiment of the present invention is applied.

圖1中示出的半導體元件檢查裝備包括本體10、裝載部21、檢查部30、緩衝部26、殘次品儲存部23、卸載部24、託盤輸送部40、轉換器(transfer)50、以及分類部60。 The semiconductor device inspection equipment shown in FIG. 1 includes a main body 10, a loading section 21, an inspection section 30, a buffer section 26, a defective storage section 23, an unloading section 24, a tray conveying section 40, a transfer 50, and Classification Department 60.

裝載部21裝載收納有要檢查的半導體元件的託盤。檢查部30檢查半導體元件。檢查部30為了對半導體元件的外觀進行視覺檢查，可以包括第一、第二照相機31、32而構成。第一照相機31設置於裝載部21的一側，對收納於裝載部21的託盤的狀態下的半導體元件的一面進行檢查。第二照相機32對收納於裝載部21的託盤的狀態下的半導體元件的另一面進行檢查。第二照相機32配置於託盤被供給至分類部60之前的位置。第二照相機被設置成在託盤輸送部40之間能夠進行往復。 The loading section 21 loads a tray in which semiconductor elements to be inspected are stored. The inspection unit 30 inspects the semiconductor element. The inspection unit 30 may include first and second cameras 31 and 32 for visual inspection of the appearance of the semiconductor element. The first camera 31 is provided on one side of the loading section 21 and inspects one side of the semiconductor element in a state of being stored in a tray of the loading section 21. The second camera 32 inspects the other surface of the semiconductor element in a state of being stored in a tray of the loading section 21. The second camera 32 is disposed before the tray is supplied to the sorting unit 60. The second camera is provided so as to be capable of reciprocating between the tray conveyance sections 40.

在第一照相機31和第二照相機32之間配置有發揮將半導體元件的一面和另一面相互翻轉的功能的翻轉部80。翻轉部80配置於第一照相機31的後端，以在初次視覺檢查結束後立刻將半導體元件翻轉。標記部90設置於翻轉部80和第二照相機32之間，從而能夠在半導體元件的包裝品的上部表面標記識別編號。 Between the first camera 31 and the second camera 32, a reversing section 80 that functions to reverse one side and the other side of the semiconductor element is arranged. The inverting unit 80 is disposed at the rear end of the first camera 31 to invert the semiconductor element immediately after the first visual inspection is completed. The marking portion 90 is provided between the reversing portion 80 and the second camera 32 so that the identification number can be marked on the upper surface of the packaged product of the semiconductor element.

緩衝部26將收納有完成檢查的半導體元件的緩衝部託盤T3暫時保管。殘次品儲存部23供收納有經檢查被分類為殘次品的半導體元件的託盤裝載。為了向與殘次品儲存部23連結的託盤輸送部40供給新的託盤，可以準備將空託盤裝載並保管的空託盤部22。在緩衝部26的前面具備空託盤儲存部25，從而能夠裝載半導體元件被完全分類而消耗的緩衝部託盤。 The buffer section 26 temporarily stores the buffer section tray T3 in which the semiconductor elements having been inspected are stored. The defective storage unit 23 is a tray for storing the semiconductor elements classified as defective by inspection. In order to supply a new tray to the tray conveyance unit 40 connected to the defective product storage unit 23, an empty tray unit 22 that loads and stores an empty tray may be prepared. The empty tray storage section 25 is provided on the front surface of the buffer section 26, so that a buffer section tray in which semiconductor components are completely sorted and consumed can be loaded.

卸載部24裝載收納有經檢查被分類為合格品的半導體元件的託盤。託盤輸送部40與裝載部21、緩衝部26、殘次品儲存部23、以及卸載部24分別連結，能夠使被裝載的託盤沿前後方向移動。託盤輸送部40可以由放置託盤的送料機(feeder)41、42、43、44、45、和將送料機41、42、43、44、45沿本體10的前後方向輸送的軌道46構成。轉換器50在本體10的上側被設置為能夠水準地進行往復輸送，從而在裝載部21、緩衝部26、殘次品儲存部23、以及卸載部24的託盤輸送部40之間輸送託盤。 The unloading unit 24 loads a tray in which semiconductor elements that have been inspected and classified as qualified products are stored. The tray conveyance unit 40 is connected to the loading unit 21, the buffer unit 26, the defective product storage unit 23, and the unloading unit 24, respectively, and can move the loaded tray in the front-rear direction. The tray conveyance unit 40 may be composed of feeders 41, 42, 43, 44, 45 that place a tray, and a rail 46 that conveys the feeders 41, 42, 43, 44, 45 in the front-back direction of the main body 10. The changer 50 is provided on the upper side of the main body 10 so as to be capable of reciprocating conveyance in a horizontal manner, and conveys a tray between the loading section 21, the buffer section 26, the defective storage section 23, and the tray conveying section 40 of the unloading section 24.

分類部60在收納於向卸載部24輸送的卸載託盤T2中的半導體元件中將殘次品拾取而移至殘次品託盤T1，並在收納於緩衝部託盤T3中的半導體元件中將合格品拾取而填補殘次品被抽走的空位置。在分類部60中設置有能夠沿水準方向進行往復輸送的拾取器61，從而執行將半導體元件拾取並輸送的作業。通過分類部60，在收納於緩衝部託盤T3中的半導體元件中，合格品被拾取器61拾取，從而向根據本發明的一實施例的半導體元件包裝裝置100輸送而供給。 The sorting unit 60 picks up defective products among the semiconductor elements stored in the unloading tray T2 conveyed to the unloading unit 24 and moves them to the defective product tray T1, and passes the qualified products among the semiconductor elements stored in the buffer unit tray T3. Pick up and fill the empty place where the defective products are drawn away. The sorting unit 60 is provided with a pickup 61 capable of reciprocating conveyance in a horizontal direction, thereby performing a job of picking up and conveying a semiconductor element. Among the semiconductor components stored in the buffer portion tray T3 by the sorting unit 60, a good product is picked up by the picker 61, and is conveyed and supplied to the semiconductor element packaging device 100 according to an embodiment of the present invention.

圖2是根據本發明的一實施例的半導體元件包裝裝置的立體圖。圖3是圖2的主視圖。圖4是用於說明半導體元件收納於載帶並被蓋帶密封的過程的圖。 FIG. 2 is a perspective view of a semiconductor device packaging device according to an embodiment of the present invention. FIG. 3 is a front view of FIG. 2. FIG. 4 is a diagram for explaining a process in which a semiconductor element is stored in a carrier tape and sealed with a cover tape.

參照圖2至圖4，半導體元件包裝裝置100包括載帶供給卷盤110、載帶輸送單元120、蓋帶供給單元130、密封單元140、載帶捲繞單元150、切割單元160、以及附著單元170。 2 to 4, the semiconductor element packaging device 100 includes a carrier tape supply reel 110, a carrier tape conveyance unit 120, a cover tape supply unit 130, a sealing unit 140, a carrier tape winding unit 150, a cutting unit 160, and an attachment unit. 170.

載帶供給卷盤110供給載帶1。在此，載帶1中，用於收納半導體元件2的口袋1a沿著長度方向以一列排列多個而形成。另外，載帶1中，可以在一側邊緣部分沿著長度方向排列而形成輸送孔1b。 The carrier tape supply reel 110 supplies the carrier tape 1. Here, in the carrier tape 1, a plurality of pockets 1a for accommodating the semiconductor element 2 are formed in a row in a row along the longitudinal direction. In addition, in the carrier tape 1, the conveyance holes 1b may be formed by aligning one edge portion along the longitudinal direction.

載帶供給卷盤110能夠通過旋轉將載帶1從捲繞的狀態解開而向載帶輸送單元120供給。此時，載帶供給卷盤110能夠接受通超載帶輸送單元120輸送載帶1的力而旋轉，由此解開載帶1。 The carrier tape supply reel 110 can supply the carrier tape 1 to the carrier tape conveyance unit 120 by unwinding the carrier tape 1 from the wound state. At this time, the carrier tape supply reel 110 can be rotated by receiving the force of the carrier tape 1 conveyed by the overload tape conveying unit 120, thereby releasing the carrier tape 1.

載帶供給卷盤110配置於載帶輸送單元120的輸送台121的下側，並以能夠旋轉的方式設置於底架101。從載帶供給卷盤110供給的載帶1能夠通過供給引導部111被引導至輸送台121的上側。供給引導部111可以由朝向載帶供給卷盤110的入口比朝向輸送台121的出口寬的形狀的管部件構成。 The carrier tape supply reel 110 is disposed below the transport table 121 of the carrier tape transport unit 120 and is rotatably installed on the chassis 101. The carrier tape 1 supplied from the carrier tape supply reel 110 can be guided to the upper side of the transport table 121 by the supply guide 111. The supply guide 111 may be formed of a tube member having a shape in which the entrance to the carrier tape supply reel 110 is wider than the exit to the transport table 121.

載帶輸送單元120將從載帶供給卷盤110接收的載帶1以口袋1a的 各入口朝向上方的狀態向一個方向輸送。載帶輸送單元120具備收納區域DZ，該收納區域DZ從半導體檢查裝備的拾取器61接收合格品半導體元件2而將其收納於載帶1的口袋1a。 The carrier tape conveying unit 120 holds the carrier tape 1 received from the carrier tape supply reel 110 in a pocket 1a. Each inlet is conveyed in one direction with the upward direction. The carrier tape conveying unit 120 includes a storage area DZ that receives a good-quality semiconductor element 2 from a pickup 61 of a semiconductor inspection equipment and stores the semiconductor device 2 in a pocket 1 a of the carrier tape 1.

蓋帶供給單元130在載帶1通超載帶輸送單元120被輸送時供給蓋帶3，以將收納有向載帶輸送單元120的收納區域DZ供給的半導體元件2的載帶1的口袋1a覆蓋。 The cover tape supply unit 130 supplies the cover tape 3 when the carrier tape 1 is conveyed through the overload tape conveyance unit 120 to cover the pocket 1 a of the carrier tape 1 containing the semiconductor element 2 supplied to the storage area DZ of the carrier tape conveyance unit 120. .

密封單元140使從蓋帶供給單元130供給的蓋帶3黏合在載帶1上而密封載帶1的口袋1a。 The sealing unit 140 adheres the cover tape 3 supplied from the cover tape supply unit 130 to the carrier tape 1 to seal the pocket 1 a of the carrier tape 1.

載帶捲繞單元150使空狀態的捲繞卷盤151依次移動至捲繞被密封單元140密封的載帶1’的位置，使載帶1’捲繞於分別移動至捲繞位置的捲繞卷盤151。 The carrier tape winding unit 150 sequentially moves the empty winding reel 151 to the position where the carrier tape 1 ′ sealed by the sealing unit 140 is wound, and the carrier tape 1 ′ is wound around the windings respectively moved to the winding position. Reel 151.

切割單元160將從密封單元140向載帶捲繞單元150輸送的載帶1’與分別要捲繞於捲繞卷盤151的長度對應地切割。即，捲繞卷盤151能夠將載帶1’按照半導體元件2的批次區分而捲繞。此時，切割單元160能夠將載帶1’按照半導體元件2的批次切割。 The cutting unit 160 cuts the carrier tape 1 'conveyed from the sealing unit 140 to the carrier tape winding unit 150 according to the length to be wound on the winding reel 151, respectively. That is, the winding reel 151 is capable of winding the carrier tape 1 'according to the lot type of the semiconductor element 2. At this time, the dicing unit 160 can cut the carrier tape 1 'in batches of the semiconductor elements 2.

附著單元170在載帶1’捲繞於捲繞卷盤151時，使載帶1’的前端附著於捲繞卷盤151，並使被切割單元160切割的載帶1’的後端附著於載帶1’的被捲繞的部位。 When the carrier tape 1 'is wound on the winding reel 151, the attaching unit 170 attaches the leading end of the carrier tape 1' to the winding reel 151, and attaches the rear end of the carrier tape 1 'cut by the cutting unit 160 to The wound portion of the carrier tape 1 '.

另一方面，半導體元件包裝裝置100可以包括第一視覺檢查器181以及第二視覺檢查器182。第一視覺檢查器181配置於載帶輸送單元120的收納區域DZ和蓋帶供給單元130之間，以檢查收納有半導體元件2的載帶1的狀態。第一視覺檢查器181可以配置於輸送台121的上側。第一視覺檢查器181拍攝收納有半導體元件2的載帶1的上部，基於拍攝的圖像，能夠檢查收納於口袋1a內的半導體元件2的翻轉與否、是否為空口袋1a、口袋1a的傾 斜與否等。 On the other hand, the semiconductor element packaging device 100 may include a first visual inspector 181 and a second visual inspector 182. The first visual inspector 181 is disposed between the storage area DZ of the carrier tape conveyance unit 120 and the cover tape supply unit 130 to check the state of the carrier tape 1 in which the semiconductor element 2 is housed. The first visual inspection device 181 may be disposed above the conveyance table 121. The first visual inspection unit 181 captures the upper portion of the carrier tape 1 containing the semiconductor element 2 and can check whether the semiconductor element 2 stored in the pocket 1a is turned over, whether it is empty, or not, based on the captured image. pour Oblique or not, etc.

第二視覺檢查器182配置於密封單元140和切割單元160之間，以檢查被密封單元140密封的載帶1’的狀態。第二視覺檢查器182可以配置於輸送台121的上側。第二視覺檢查器182拍攝被密封的載帶1’，基於拍攝的圖像，能夠檢查載帶1’的密封狀態。 The second visual inspector 182 is disposed between the sealing unit 140 and the cutting unit 160 to check the state of the carrier tape 1 'sealed by the sealing unit 140. The second visual inspection device 182 may be disposed above the conveyance table 121. The second visual inspector 182 captures the sealed carrier tape 1 ', and can check the sealing state of the carrier tape 1' based on the captured image.

第二視覺檢查器182可以由OTI(Over Tape Inspection，覆蓋帶檢查)構成。該情況下，第二視覺檢查器182能夠獲取被密封的載帶1’的斷層圖像而檢查載帶1’的密封狀態。第二視覺檢查器182能夠在載帶1’的下表面被背光燈(back light)照明的狀態下拍攝載帶1’。將基於第一、第二視覺檢查器181、182的檢查結果通知給操作者，操作者根據檢查結果來採取適當的措施。 The second visual inspection device 182 may be composed of an OTI (Over Tape Inspection). In this case, the second visual inspection device 182 can acquire a tomographic image of the sealed carrier tape 1 'and check the sealing state of the carrier tape 1'. The second visual inspection unit 182 can capture the carrier tape 1 'in a state where the lower surface of the carrier tape 1' is illuminated by a backlight. The operator is notified of the inspection results by the first and second visual inspectors 181 and 182, and the operator takes appropriate measures based on the inspection results.

作為一例，參照圖5，載帶輸送單元120可以包括輸送台121、鏈輪122、鏈輪旋轉機構123、以及輸送軌道124。 As an example, referring to FIG. 5, the carrier tape conveying unit 120 may include a conveying table 121, a sprocket 122, a sprocket rotating mechanism 123, and a conveying track 124.

輸送台121從載帶供給卷盤110接收載帶1。輸送台121可以以上表面水準的方式配置。輸送台121可以被支承在底架101上。在輸送台121的上側可以設置有防止被輸送的載帶1浮起的輸送引導輥。輸送台121可以被分割為第一、第二輸送台121a、121b。第一、第二輸送台121a、121b沿載帶1的寬度方向隔開間隔配置。 The transport table 121 receives the carrier tape 1 from the carrier tape supply reel 110. The conveyance table 121 can be arrange | positioned so that it may become above a surface level. The conveyance table 121 may be supported on the chassis 101. A conveyance guide roller that prevents the conveyed carrier tape 1 from floating may be provided on the upper side of the conveyance table 121. The transfer table 121 may be divided into first and second transfer tables 121a and 121b. The first and second conveying tables 121 a and 121 b are arranged at intervals in the width direction of the carrier tape 1.

在載帶1的寬度發生變更的情況下，第一輸送台121a和第二輸送台121b的間隔能夠與載帶1的變更寬度對應地通過間隔調節機構125改變。間隔調節機構125可以包括使第一、第二輸送台121a、121b沿與載帶1的寬度方向平行的方向進行線性移動的線性致動器、以及引導第一、第二輸送台121a、121b的線性移動的線性引導部。線性致動器可以包括旋轉馬達和用於將旋轉馬達的旋轉運動轉換成直線運動的滾珠螺杆而構成，或者包括 線性馬達或者氣缸而構成。 When the width of the carrier tape 1 is changed, the interval between the first conveyor table 121 a and the second conveyor table 121 b can be changed by the interval adjustment mechanism 125 in accordance with the changed width of the carrier tape 1. The interval adjustment mechanism 125 may include a linear actuator that linearly moves the first and second conveying tables 121 a and 121 b in a direction parallel to the width direction of the carrier tape 1, and a linear actuator that guides the first and second conveying tables 121 a and 121 b. Linear guide for linear movement. The linear actuator may include a rotary motor and a ball screw for converting a rotary motion of the rotary motor into a linear motion, or may include It consists of a linear motor or a cylinder.

鏈輪122通過以將各鋸齒122a插入於向輸送台121上供給的載帶1、1’的輸送孔1b的狀態旋轉而輸送載帶1。鏈輪122以能夠以與載帶1的寬度方向平行的水準軸為中心進行旋轉的方式設置於輸送台121。鏈輪122沿輸送台121的長度方向排列。鏈輪122中的一個可以配置於供給引導部111和第一視覺檢查器181之間，另一個可以配置於密封單元140和第二視覺檢查器182之間。 The sprocket 122 conveys the carrier tape 1 while rotating with the saw teeth 122a inserted in the carrier holes 1b of the carrier tapes 1 and 1 'supplied to the transport table 121. The sprocket 122 is installed on the conveyance table 121 so that it may rotate about a horizontal axis parallel to the width direction of the carrier tape 1. The sprocket 122 is aligned along the longitudinal direction of the conveyance table 121. One of the sprocket 122 may be disposed between the supply guide 111 and the first visual inspection unit 181, and the other may be disposed between the sealing unit 140 and the second visual inspection unit 182.

鏈輪旋轉機構123使鏈輪122旋轉。鏈輪旋轉機構123能夠使鏈輪122獨立地旋轉。鏈輪旋轉機構123可以包括使鏈輪122旋轉的旋轉馬達等而構成。 The sprocket rotation mechanism 123 rotates the sprocket 122. The sprocket rotation mechanism 123 can rotate the sprocket 122 independently. The sprocket rotation mechanism 123 may include a rotation motor or the like that rotates the sprocket 122.

操作者將載帶1插入於鏈輪122中離供給引導部111最近的鏈輪122後，若使鏈輪旋轉機構123工作，則鏈輪旋轉機構123能夠被控制成使載帶1向載帶輸送單元120的收納區域DZ、第一視覺檢查器181、密封單元140、第二視覺檢查器182、載帶捲繞單元150間歇性地輸送。鏈輪旋轉機構123能夠被控制半導體包裝裝置100整體的控制部(未圖示)控制。 After the operator inserts the carrier tape 1 into the sprocket 122 closest to the supply guide 111 in the sprocket 122 and operates the sprocket rotation mechanism 123, the sprocket rotation mechanism 123 can be controlled so that the carrier tape 1 is directed toward the carrier tape. The storage area DZ of the transport unit 120, the first visual inspection unit 181, the sealing unit 140, the second visual inspection unit 182, and the carrier tape winding unit 150 are intermittently transported. The sprocket rotation mechanism 123 can be controlled by a control unit (not shown) that controls the entire semiconductor packaging device 100.

輸送軌道124以在與輸送台121之間引導載帶1、1’的輸送的方式安裝於輸送台121的上側。輸送軌道124沿載帶1的寬度方向隔開間隔配置，並將載帶1、1’的兩側邊緣部分分別插入於輸送軌道124與輸送台121之間而引導載帶1、1’的輸送。輸送軌道124的間隔能夠根據第一、第二輸送台121a、121b的間隔調節來調節。 The conveyance track 124 is attached to the upper side of the conveyance table 121 so as to guide conveyance of the carrier tapes 1 and 1 'between the conveyance table 121 and the conveyance table 121. The transport tracks 124 are arranged at intervals along the width direction of the carrier tape 1, and the edge portions of both sides of the carrier tape 1, 1 'are inserted between the transport track 124 and the transport table 121 to guide the transport of the carrier tapes 1, 1', respectively. . The interval of the conveyance rail 124 can be adjusted according to the interval adjustment of the first and second conveyance tables 121a and 121b.

作為一例，參照圖6，蓋帶供給單元130可以包括蓋帶供給卷盤131、蓋帶供給卷盤旋轉機構132、蓋帶引導輥133、以及蓋帶張力引導部134。 As an example, referring to FIG. 6, the cover tape supply unit 130 may include a cover tape supply reel 131, a cover tape supply reel rotation mechanism 132, a cover tape guide roller 133, and a cover tape tension guide 134.

蓋帶供給卷盤131通過旋轉將蓋帶3從捲繞的狀態解開而進行供給。蓋帶供給卷盤131以能夠旋轉的方式設置於輸送台121上的供給卷盤支 承台130a。蓋帶供給卷盤旋轉機構132使蓋帶供給卷盤131旋轉，可以包括轉矩馬達等那樣的旋轉馬達而構成。蓋帶引導輥133將從蓋帶供給卷盤131供給的蓋帶3向收納有半導體元件2的載帶1上的輸送進行引導。 The cover tape supply reel 131 rotates to release the cover tape 3 from the wound state, and supplies the cover tape 3. Cover tape supply reel 131 A supply reel support rotatably provided on the conveying table 121 Cap 130a. The cover tape supply reel rotating mechanism 132 rotates the cover tape supply reel 131 and may be configured to include a rotation motor such as a torque motor. The cover tape guide roller 133 guides the conveyance of the cover tape 3 supplied from the cover tape supply reel 131 to the carrier tape 1 in which the semiconductor element 2 is stored.

蓋帶張力引導部134對從蓋帶供給卷盤131解開出來的蓋帶3賦予設定張力。蓋帶張力引導部134包括在蓋帶3的輸送路徑上線性移動的可動輥134a、和隨著可動輥134a的線性往復而將蓋帶3拉拽或鬆開的線性致動器134b，由此能夠對蓋帶3賦予設定張力。 The cover tape tension guide 134 applies a set tension to the cover tape 3 which is released from the cover tape supply reel 131. The cover tape tension guide 134 includes a movable roller 134a that linearly moves on the conveyance path of the cover tape 3, and a linear actuator 134b that pulls or releases the cover tape 3 as the movable roller 134a linearly reciprocates. A set tension can be applied to the cover tape 3.

作為一例，參照圖7，密封單元140可以包括使蓋帶3的兩側邊緣部分熱黏合在載帶1上的一對熱黏合機構141。 As an example, referring to FIG. 7, the sealing unit 140 may include a pair of thermal bonding mechanisms 141 for thermally bonding both side edge portions of the cover tape 3 to the carrier tape 1.

各個熱黏合機構141可以包括葉片142、加熱器143、葉片安裝塊144、安裝塊支承台145、以及安裝塊驅動機構146。葉片142與蓋帶3的邊緣部分對置地配置。加熱器143對葉片142進行加熱。加熱器143可以安裝於葉片142和葉片安裝塊144之間。加熱器143可以由盒(cartridge)式加熱器構成。葉片安裝塊144安裝葉片142。 Each of the thermal bonding mechanisms 141 may include a blade 142, a heater 143, a blade mounting block 144, a mounting block support base 145, and a mounting block driving mechanism 146. The blade 142 is disposed to face the edge portion of the cover tape 3. The heater 143 heats the blade 142. The heater 143 may be installed between the blade 142 and the blade mounting block 144. The heater 143 may be constituted by a cartridge heater. The blade mounting block 144 mounts the blade 142.

安裝塊支承台145以葉片142與蓋帶3的邊緣部分接觸或者分離的方式支承葉片安裝塊144的擺動(pivot)動作。因此，葉片142以被加熱器143加熱的狀態下降而與蓋帶3的邊緣部分接觸，由此能夠使蓋帶3與載帶1熱黏合。安裝塊驅動機構146使葉片安裝塊144進行擺動動作。安裝塊驅動機構146可以包括氣缸而構成。氣缸的氣缸主體與氣缸支承台147鉸接，氣缸杆與葉片安裝塊144鉸接，由此氣缸杆能夠通過伸縮動作使葉片安裝塊144進行擺動動作。 The mounting block support base 145 supports the pivoting operation of the blade mounting block 144 such that the blade 142 contacts or separates from the edge portion of the cover tape 3. Therefore, the blade 142 is lowered while being heated by the heater 143 and comes into contact with the edge portion of the cover tape 3, whereby the cover tape 3 and the carrier tape 1 can be thermally bonded. The mounting block driving mechanism 146 swings the blade mounting block 144. The mounting block driving mechanism 146 may include a cylinder. The cylinder main body of the air cylinder is hinged to the cylinder support base 147, and the cylinder rod is hinged to the blade mounting block 144, whereby the cylinder rod can swing the blade mounting block 144 by a telescopic action.

在載帶1的寬度發生變更的情況下，熱黏合機構141的間隔能夠與載帶1的變更寬度對應地通過間隔調節機構148改變。間隔調節機構148可以包括使熱黏合機構141沿與載帶1的寬度方向平行的方向進行線性移動 的線性致動器、以及引導熱黏合機構141的線性移動的線性引導部。線性致動器可以包括旋轉馬達和用於將旋轉馬達的旋轉運動轉換成直線運動的滾珠螺杆而構成，或者包括線性馬達或氣缸而構成。 When the width of the carrier tape 1 is changed, the interval of the thermal bonding mechanism 141 can be changed by the interval adjustment mechanism 148 in accordance with the changed width of the carrier tape 1. The interval adjustment mechanism 148 may include linearly moving the thermal bonding mechanism 141 in a direction parallel to the width direction of the carrier tape 1. And a linear guide that guides the linear movement of the thermal bonding mechanism 141. The linear actuator may include a rotary motor and a ball screw for converting a rotary motion of the rotary motor into a linear motion, or may include a linear motor or a cylinder.

作為一例，參照圖8，載帶捲繞單元150可以包括捲繞卷盤旋轉機構152、捲繞卷盤線性移動機構153、以及捲繞卷盤升降機構154。 As an example, referring to FIG. 8, the carrier tape winding unit 150 may include a winding reel rotation mechanism 152, a winding reel linear movement mechanism 153, and a winding reel lifting mechanism 154.

捲繞卷盤旋轉機構152通過使捲繞卷盤151在沿與要捲繞的載帶1’的寬度方向平行的方向排列被安裝的狀態下以各中心軸為中心旋轉，使載帶1’捲繞於捲繞位置的捲繞卷盤151。捲繞卷盤旋轉機構152可以包括軸152a和旋轉馬達152b。軸152a以能夠旋轉的方式被軸支承台152c支承。軸152a插入於各個捲繞卷盤151的中央而使捲繞卷盤151排成一列。軸152a可以以在旋轉時使捲繞卷盤151一起旋轉的方式插入結合於捲繞卷盤151。旋轉馬達152b通過帶輪和帶向軸152a提供旋轉力。 The take-up reel rotation mechanism 152 rotates the take-up reel 151 around each central axis in a state where the take-up reel 151 is aligned and mounted in a direction parallel to the width direction of the carrier tape 1 'to be wound, thereby rotating the carrier tape 1'. A winding reel 151 wound at a winding position. The winding reel rotation mechanism 152 may include a shaft 152a and a rotation motor 152b. The shaft 152a is rotatably supported by a shaft support base 152c. The shaft 152a is inserted in the center of each winding reel 151, and the winding reels 151 are aligned in a row. The shaft 152a may be inserted into the winding reel 151 so as to rotate the winding reel 151 together when rotating. The rotation motor 152b provides a rotational force to the shaft 152a through a pulley and a belt.

捲繞卷盤線性移動機構153通過使捲繞卷盤旋轉機構152沿與捲繞卷盤151的排列方向平行的方向進行線性移動，使捲繞卷盤151與捲繞位置對應地依次移動。即，若載帶1’在位於捲繞位置的前頭的空捲繞卷盤151的捲繞完成，則捲繞卷盤線性移動機構153能夠使後續的空捲繞卷盤151與捲繞位置對應地移動。因此，捲繞卷盤151的交換能夠以自動方式實現。 The winding reel linear movement mechanism 153 linearly moves the winding reel rotating mechanism 152 in a direction parallel to the arrangement direction of the winding reel 151, so that the winding reel 151 is sequentially moved in accordance with the winding position. That is, if the winding of the carrier tape 1 ′ at the empty winding reel 151 located at the front of the winding position is completed, the winding reel linear movement mechanism 153 can make the subsequent empty winding reel 151 correspond to the winding position. To move. Therefore, the exchange of the winding reel 151 can be realized in an automatic manner.

捲繞卷盤線性移動機構153可以包括水準支承台153a1、水準移動用線性引導部153b、以及水準移動用線性致動器153c。水準移動用線性引導部153b以使捲繞卷盤旋轉機構152沿水準方向進行線性移動的方式引導。水準移動用線性引導部153b包括安裝於水準支承台153a的軌道、和安裝於捲繞卷盤旋轉機構152的軸支承台152c而以能夠進行線性移動的方式與軌道結合的滑動器。水準移動用線性致動器153c可以包括旋轉馬達和用於將旋轉馬達的旋轉運動轉換成直線運動的滾珠螺杆而構成，或者包括線 性馬達或氣缸而構成。 The winding reel linear movement mechanism 153 may include a horizontal support base 153a1, a linear guide 153b for horizontal movement, and a linear actuator 153c for horizontal movement. The horizontal movement linear guide 153b guides the winding reel rotation mechanism 152 to linearly move in the horizontal direction. The linear guide 153b for level movement includes a rail mounted on the level support base 153a, and a slider mounted on the shaft support base 152c of the winding reel rotation mechanism 152 and coupled to the rail in a linearly movable manner. The linear actuator for horizontal movement 153c may include a rotary motor and a ball screw for converting the rotary motion of the rotary motor into a linear motion, or may include a wire Motor or air cylinder.

捲繞卷盤升降機構154通過使捲繞卷盤線性移動機構153進行升降而使捲繞卷盤151進行升降。捲繞卷盤升降機構154使空狀態的捲繞卷盤151與捲繞位置的高度對應地上升。在該狀態下，隨著載帶1’捲繞於捲繞卷盤151而捲繞於捲繞卷盤151的半徑增加時，捲繞卷盤升降機構154能夠使捲繞卷盤151以載帶1’的捲繞半徑增加幅度下降。因此，載帶1’能夠以相對於捲繞卷盤151的捲繞開始高度固定的方式被調節。 The winding reel raising and lowering mechanism 154 raises and lowers the winding reel 151 by raising and lowering the winding reel linear moving mechanism 153. The winding reel lifting mechanism 154 raises the empty winding reel 151 in accordance with the height of the winding position. In this state, as the carrier tape 1 ′ is wound on the winding reel 151 and the radius of the winding on the winding reel 151 increases, the winding reel lifting mechanism 154 can cause the winding reel 151 to carry the tape. The increase in the winding radius at 1 'decreases. Therefore, the carrier tape 1 'can be adjusted in such a manner that the height of the carrier tape 1' relative to the winding start of the winding reel 151 is fixed.

捲繞卷盤升降機構154可以包括垂直支承台154a、升降用線性引導部154b、以及升降用線性致動器154c。垂直支承台154a被底架101支承。升降用線性引導部154b引導捲繞卷盤線性移動機構153的升降。升降用線性引導部154b包括安裝於垂直支承台154a的軌道、和安裝於捲繞卷盤線性移動機構153的水準支承台153a而以能夠進行線性移動的方式與軌道結合的滑動器。升降用線性致動器154c可以包括旋轉馬達和用於將旋轉馬達的旋轉運動轉換成直線運動的滾珠螺杆而構成，或者包括線性馬達或氣缸而構成。 The winding reel lifting mechanism 154 may include a vertical support table 154a, a linear guide 154b for lifting, and a linear actuator 154c for lifting. The vertical support base 154 a is supported by the chassis 101. The lifting and lowering linear guide 154b guides the lifting and lowering of the winding reel linear moving mechanism 153. The elevating linear guide 154b includes a rail mounted on the vertical support table 154a and a slider mounted on the level support table 153a of the winding reel linear movement mechanism 153 and coupled to the rail in a linearly movable manner. The linear actuator for lift 154c may be constituted by a rotary motor and a ball screw for converting a rotary motion of the rotary motor into a linear motion, or may be configured by a linear motor or an air cylinder.

另一方面，如圖9所示，載帶1’的捲繞半徑能夠通過傳感機構155檢測。捲繞卷盤升降機構154能夠被控制成基於由傳感機構155檢測的資訊使捲繞卷盤151下降。傳感機構155可以包括傳感杆155a、傳感杆引導部155c、彈性部件155d、以及位置感測器155e。 On the other hand, as shown in FIG. 9, the winding radius of the carrier tape 1 'can be detected by the sensing mechanism 155. The winding reel lifting mechanism 154 can be controlled to lower the winding reel 151 based on the information detected by the sensing mechanism 155. The sensing mechanism 155 may include a sensing lever 155a, a sensing lever guide 155c, an elastic member 155d, and a position sensor 155e.

傳感杆155a能夠通過安裝於下端的輥155b與捲繞卷盤151內的載帶1’接觸。傳感杆引導部155c沿傳感杆155a與捲繞卷盤151內的載帶1’接近或者分隔的方向引導傳感杆155a的線性移動。傳感杆引導部155c能夠被附著單元170的卷盤支承台170a支承。彈性部件155d能夠通過對傳感杆155a施加彈性力來維持傳感杆155a的輥155b與捲繞卷盤151內的載帶1’接觸的 狀態。位置感測器155e檢測傳感杆155a的位置。若載帶1’的捲繞半徑增加，則傳感杆155a的位置發生變動。此時，位置感測器155e能夠通過檢測傳感杆155a的位置，檢測載帶1’的捲繞半徑。 The sensor lever 155a can be brought into contact with the carrier tape 1 'in the winding reel 151 by a roller 155b attached to the lower end. The sensor lever guide 155c guides the linear movement of the sensor lever 155a in a direction in which the sensor lever 155a approaches or separates from the carrier tape 1 'in the winding reel 151. The sensor lever guide 155c can be supported by the reel support base 170a of the attachment unit 170. The elastic member 155d can maintain the contact between the roller 155b of the sensor lever 155a and the carrier tape 1 'in the winding reel 151 by applying an elastic force to the sensor lever 155a. status. The position sensor 155e detects the position of the sensing lever 155a. As the winding radius of the carrier tape 1 'increases, the position of the sensor lever 155a changes. At this time, the position sensor 155e can detect the winding radius of the carrier tape 1 'by detecting the position of the sensor lever 155a.

作為一例，參照圖10，切割單元160可以包括切斷台161、切割器162、以及切割器線性移動機構163。 As an example, referring to FIG. 10, the cutting unit 160 may include a cutting table 161, a cutter 162, and a cutter linear moving mechanism 163.

切斷台161可以安裝於與載帶捲繞單元150相鄰的輸送台121的端部。切割器162以使載帶1’經過與切斷台161分隔的間隙的方式配置，並通過與切斷台161交叉地進行線性移動而切斷載帶1’。切割器線性移動機構163使切割器162進行線性移動。 The cutting table 161 may be attached to an end of the conveying table 121 adjacent to the carrier tape winding unit 150. The cutter 162 is arranged so that the carrier tape 1 'passes through a gap separated from the cutting table 161, and cuts the carrier tape 1' by linearly moving across the cutting table 161. The cutter linear movement mechanism 163 linearly moves the cutter 162.

切割器162配置於切斷台161的下側，切割器線性移動機構163能夠使切割器162進行升降。因此，切割器162在切割器線性移動機構163的作用下上升而與切斷台161交叉，從而能夠切斷載帶1’。切割器162能夠被切割器支承台164引導升降。切割器線性移動機構163可以包括氣缸等而構成。 The cutter 162 is disposed below the cutting table 161, and the cutter linear moving mechanism 163 can raise and lower the cutter 162. Therefore, the cutter 162 is raised by the cutter linear moving mechanism 163 and intersects the cutting table 161, so that the carrier tape 1 'can be cut. The cutter 162 can be guided up and down by the cutter support table 164. The cutter linear movement mechanism 163 may be configured to include an air cylinder or the like.

作為一例，參照圖11至圖13，附著單元170可以包括黏合帶供給卷盤171、黏合帶供給卷盤旋轉機構172、剝離器173、黏合帶加壓機構174、離型紙回收卷盤175、以及離型紙回收卷盤旋轉機構176。 As an example, referring to FIGS. 11 to 13, the attachment unit 170 may include an adhesive tape supply reel 171, an adhesive tape supply reel rotation mechanism 172, a peeler 173, an adhesive tape pressure mechanism 174, a release paper recovery reel 175, and Release paper recovery reel rotation mechanism 176.

黏合帶供給卷盤171通過旋轉將黏合帶4從捲繞的狀態解開而進行供給。在此，黏合帶4以黏合片4a在離型紙4b的一側表面排成一列而附著的方式構成。黏合帶供給卷盤171以能夠旋轉的方式設置於卷盤支承台170a。黏合帶供給卷盤旋轉機構172使黏合帶供給卷盤171旋轉，可以包括轉矩馬達等旋轉馬達而構成。 The adhesive tape supply reel 171 is rotated to release the adhesive tape 4 from the wound state, and is supplied. Here, the adhesive tape 4 is comprised so that the adhesive sheet 4a may be attached in a line on one side surface of the release paper 4b. The adhesive tape supply reel 171 is rotatably provided on the reel support base 170a. The adhesive tape supply reel rotating mechanism 172 rotates the adhesive tape supply reel 171 and may be configured to include a rotation motor such as a torque motor.

剝離器173在從黏合帶供給卷盤171供給的黏合帶4中將黏合片4a從離型紙4b剝離，從而使黏合片4a跨越捲繞卷盤151的內側周面和載帶1’的前端附著，或者跨越載帶1’的後端和載帶1’的被捲繞的部位附著。通 過使黏合片4a跨越捲繞卷盤151的內側周面和載帶1’的前端附著，載帶1’能夠以其前端固定於捲繞卷盤151的狀態被捲繞。另外，通過使黏合片4a跨越載帶1’的後端和載帶1’的被捲繞的部位附著，載帶1’能夠被固定成不會從在捲繞卷盤151的捲繞完成的狀態解開。 The peeler 173 peels the adhesive sheet 4a from the release paper 4b in the adhesive tape 4 supplied from the adhesive tape supply reel 171, so that the adhesive sheet 4a is attached across the inner peripheral surface of the winding reel 151 and the front end of the carrier tape 1 '. Or attached across the rear end of the carrier tape 1 'and the wound portion of the carrier tape 1'. through By adhering the adhesive sheet 4a across the inner peripheral surface of the winding reel 151 and the leading end of the carrier tape 1 ', the carrier tape 1' can be wound while the leading end is fixed to the winding reel 151. In addition, by adhering the adhesive sheet 4 a across the rear end of the carrier tape 1 ′ and the wound portion of the carrier tape 1 ′, the carrier tape 1 ′ can be fixed so as not to be wound from the winding on the winding reel 151. The state is unlocked.

剝離器173具備尖尖的突出部(nose)173a。在黏合帶4從黏合帶供給卷盤171經過剝離器173的突出部173a時，能夠將黏合片4a從離型紙4b一個個剝離而向捲繞卷盤151側供給。 The peeler 173 includes a sharp nose 173a. When the adhesive tape 4 passes from the adhesive tape supply reel 171 through the protrusion 173a of the peeler 173, the adhesive sheet 4a can be peeled from the release paper 4b one by one to be supplied to the winding reel 151 side.

黏合片加壓機構174對跨越捲繞卷盤151的內側周面和載帶1’的前端附著的黏合片4a進行加壓，或者對跨越載帶1’的後端和載帶1’的被捲繞的部位附著的黏合片4a進行加壓。黏合片加壓機構174可以包括加壓杆174a、加壓杆引導部174c、以及加壓杆升降機構174d。 The adhesive sheet pressing mechanism 174 presses the adhesive sheet 4a attached across the inner peripheral surface of the winding reel 151 and the front end of the carrier tape 1 ', or presses the adhesive tape 4a across the rear end of the carrier tape 1' and the carrier tape 1 '. The pressure-sensitive adhesive sheet 4a attached to the wound portion is pressed. The adhesive sheet pressure mechanism 174 may include a pressure lever 174a, a pressure lever guide portion 174c, and a pressure lever elevating mechanism 174d.

加壓杆174a能夠通過安裝於其下端的輥174b與黏合片4a接觸。加壓杆174a可以以其下端朝向捲繞卷盤151的中央的方式配置。加壓杆引導部174c引導加壓杆174a的升降。加壓杆引導部174c支承於卷盤支承台170a。加壓杆升降機構174d使加壓杆174a進行升降。因此，能夠使加壓杆174a通過加壓杆升降機構174d下降，從而通過輥174b將黏合片4a向載帶1’處加壓。加壓杆升降機構174d可以包括氣缸等而構成。 The pressure lever 174a can be brought into contact with the adhesive sheet 4a by a roller 174b attached to the lower end thereof. The pressure lever 174 a may be disposed so that the lower end thereof faces the center of the winding reel 151. The pressure lever guide 174c guides the elevation of the pressure lever 174a. The pressure lever guide 174c is supported by the reel support base 170a. The pressure lever lifting mechanism 174d raises and lowers the pressure lever 174a. Therefore, the pressure lever 174a can be lowered by the pressure lever lifting mechanism 174d, and the pressure-sensitive adhesive sheet 4a can be pressed toward the carrier tape 1 'by the roller 174b. The pressure lever raising and lowering mechanism 174d may be configured to include an air cylinder or the like.

離型紙回收卷盤175捲繞黏合片4a被剝離的離型紙4b。離型紙回收卷盤175以能夠旋轉的方式設置於卷盤支承台170a。離型紙回收卷盤旋轉機構176使離型紙回收卷盤175旋轉，可以包括轉矩馬達等旋轉馬達而構成。 The release paper recovery roll 175 winds the release paper 4b from which the adhesive sheet 4a is peeled. The release paper recovery reel 175 is rotatably provided on the reel support base 170a. The release paper recovery reel rotation mechanism 176 rotates the release paper recovery reel 175 and may be configured to include a rotation motor such as a torque motor.

而且，黏合帶張力引導部177設置於黏合帶供給卷盤171和剝離器173之間，從而能夠對黏合帶4賦予設定張力。黏合帶張力引導部177可以以與蓋帶張力引導部134相同或類似的方式構成。離型紙輸送機構178設置於剝離器173和離型紙回收卷盤175之間，從而能夠輸送離型紙4b。離型紙 輸送機構178可以包括輸送輥和使輸送輥旋轉的旋轉馬達而構成。 Further, the adhesive tape tension guide 177 is provided between the adhesive tape supply reel 171 and the peeler 173, so that a set tension can be applied to the adhesive tape 4. The adhesive tape tension guide 177 may be configured in the same or similar manner as the cover tape tension guide 134. The release paper conveying mechanism 178 is provided between the peeler 173 and the release paper recovery roll 175, so that the release paper 4b can be conveyed. Release paper The conveyance mechanism 178 may include a conveyance roller and a rotary motor which rotates the conveyance roller.

下面，對前述的半導體元件包裝裝置100的作用例進行說明。 Next, an operation example of the aforementioned semiconductor element packaging device 100 will be described.

首先，操作者將載帶1從載帶供給卷盤110解開而運向載帶輸送單元120後，將鏈輪122中離載帶1的前端最近的鏈輪122的鋸齒122a插入於載帶1前端的輸送孔1b。此時，載帶1在輸送台121上以口袋1a的入口朝向上方的方式設置。 First, the operator releases the carrier tape 1 from the carrier tape supply reel 110 and transports the carrier tape 1 to the carrier tape conveying unit 120, and then inserts the serration 122a of the sprocket 122 of the sprocket 122 closest to the front end of the carrier tape 1 into the carrier tape. 1 Front-end conveying hole 1b. At this time, the carrier tape 1 is installed on the conveyance table 121 so that the entrance of the pocket 1a may face upward.

之後，操作者使半導體元件包裝裝置100工作。這樣，載帶輸送單元120將載帶1向收納區域DZ輸送。拾取器61將合格品半導體元件2從半導體檢查裝備拾取而向收納區域DZ輸送後，分別收納於載帶1的口袋1a。 After that, the operator operates the semiconductor element packaging apparatus 100. In this way, the carrier tape transport unit 120 transports the carrier tape 1 to the storage area DZ. The picker 61 picks up a good-quality semiconductor element 2 from the semiconductor inspection equipment and conveys it to the storage area DZ, and then stores it in the pockets 1 a of the carrier tape 1.

接下來，載帶輸送單元120將收納有半導體元件2的載帶1向第一視覺檢查器181輸送，第一視覺檢查器181檢查收納有半導體元件2的載帶1。接下來，載帶輸送單元120將經過第一視覺檢查器181而完成檢查的載帶1向密封單元140輸送。此時，蓋帶供給單元130將蓋帶3以覆蓋載帶1的口袋1a的方式供給。這樣，密封單元140使蓋帶3黏合在載帶1上而密封載帶1的口袋1a。 Next, the carrier tape transport unit 120 transports the carrier tape 1 in which the semiconductor element 2 is stored to the first visual inspection unit 181, and the first visual inspector 181 inspects the carrier tape 1 in which the semiconductor element 2 is stored. Next, the carrier tape transport unit 120 transports the carrier tape 1 that has been inspected by the first visual inspection device 181 to the sealing unit 140. At this time, the cover tape supply unit 130 supplies the cover tape 3 so as to cover the pocket 1 a of the carrier tape 1. In this way, the sealing unit 140 adheres the cover tape 3 to the carrier tape 1 and seals the pocket 1 a of the carrier tape 1.

接下來，載帶輸送單元120將密封的載帶1’向第二視覺檢查器182輸送，第二視覺檢查器182檢查被密封的載帶1’。接下來，載帶輸送單元120將經過第二視覺檢查器182而完成檢查的密封狀態的載帶1’向捲繞位置的捲繞卷盤151輸送。這樣，附著單元170使密封狀態的載帶1’的前端通過黏合片4a附著於捲繞卷盤151的內側周面。 Next, the carrier tape conveying unit 120 conveys the sealed carrier tape 1 'to the second visual inspector 182, and the second visual inspector 182 inspects the sealed carrier tape 1'. Next, the carrier tape transport unit 120 transports the carrier tape 1 'in the sealed state, which has been inspected by the second visual inspection device 182, to the winding reel 151 at the winding position. In this way, the attaching unit 170 attaches the leading end of the carrier tape 1 'in a sealed state to the inner peripheral surface of the winding reel 151 through the adhesive sheet 4a.

接下來，捲繞卷盤旋轉機構152使捲繞卷盤151旋轉而將密封狀態的載帶1’捲繞於捲繞卷盤151。與此同時，捲繞卷盤升降機構154使捲繞卷盤151以密封狀態的載帶1’的捲繞半徑增加幅度下降。 Next, the winding reel rotating mechanism 152 rotates the winding reel 151 to wind the carrier tape 1 'in a sealed state on the winding reel 151. At the same time, the winding reel raising and lowering mechanism 154 decreases the increase in the winding radius of the carrier tape 1 'in the sealed state of the winding reel 151.

接下來，切割單元150與要捲繞於捲繞卷盤151的半導體元件2的 批次對應地切割密封狀態的載帶1’。接下來，附著單元170將密封狀態的載帶1’的後端通過黏合片4a附著於載帶1’的被捲繞的部位，由此能夠防止載帶1’解開。 Next, the cutting unit 150 and the semiconductor element 2 to be wound on the winding reel 151 The carrier tape 1 'in a sealed state is cut correspondingly in batches. Next, the attaching unit 170 attaches the rear end of the sealed carrier tape 1 'to the wound portion of the carrier tape 1' through the adhesive sheet 4a, thereby preventing the carrier tape 1 'from being unraveled.

之後，捲繞卷盤線性移動機構153使後續的空捲繞卷盤151與捲繞位置對應地移動，捲繞卷盤升降機構154使後續的空捲繞卷盤151上升至捲繞位置。之後，在已交換的空捲繞卷盤151捲繞密封狀態的載帶1’的過程，能夠以與前述的過程相同的方式實現。 Thereafter, the winding reel linear movement mechanism 153 moves the subsequent empty winding reel 151 corresponding to the winding position, and the winding reel lifting mechanism 154 raises the subsequent empty winding reel 151 to the winding position. Thereafter, the process of winding the sealed carrier tape 1 'on the exchanged empty winding reel 151 can be performed in the same manner as the aforementioned process.

如上所述，載帶1通過操作者從載帶供給卷盤110向載帶輸送單元120進行初始供給之後，半導體元件2收納於載帶1並密封、並將密封的載帶1’捲繞於捲繞卷盤151的過程、交換捲繞卷盤151的過程被實現自動化，因此能夠提高半導體元件2的包裝作業效率。 As described above, after the carrier tape 1 is initially supplied from the carrier tape supply reel 110 to the carrier tape conveyance unit 120 by the operator, the semiconductor element 2 is stored in the carrier tape 1 and sealed, and the sealed carrier tape 1 'is wound around Since the process of winding the reel 151 and the process of exchanging the winding reel 151 are automated, the packaging operation efficiency of the semiconductor element 2 can be improved.

本發明參照附圖示出的一實施例進行了說明，但這僅僅是例示性的，若為該技術領域中具備常規知識的人則能夠理解能夠實施由此進行多種變形及等同的其它實施例。因此，本發明的真正的保護範圍應當僅通過隨附的申請專利範圍來限定。 The present invention has been described with reference to an embodiment shown in the accompanying drawings, but this is only exemplary. If it is a person with ordinary knowledge in the technical field, he can understand that other embodiments can be implemented with various modifications and equivalents. . Therefore, the true scope of protection of the present invention should be limited only by the scope of the accompanying patent application.

Claims (6)

一種利用載帶的半導體元件包裝裝置，其特徵在於，包括：一載帶供給卷盤，其是供給載帶，在該載帶沿著長度方向以一列排列有多個用於收納半導體元件的口袋；一載帶輸送單元，其將從所述載帶供給卷盤接收的載帶以所述口袋的各入口朝向上方的狀態向一個方向輸送；一蓋帶供給單元，其在通過所述載帶輸送單元輸送載帶時供給蓋帶，以對收納有向所述載帶輸送單元的收納區域供給的半導體元件的載帶的口袋進行覆蓋；一密封單元，其使從所述蓋帶供給單元接收的蓋帶黏合在載帶上而密封載帶的口袋；一載帶捲繞單元，其使空狀態的捲繞卷盤依次向捲繞被所述密封單元密封的載帶的捲繞位置移動，並使載帶捲繞於分別移動至所述捲繞位置的捲繞卷盤；所述載帶捲繞單元包括：一捲繞卷盤旋轉機構，其是通過使所述捲繞卷盤在沿與要捲繞的載帶的寬度方向平行的方向排列而被安裝的狀態下以各中心軸為中心旋轉，使載帶捲繞於捲繞位置的捲繞卷盤；一捲繞卷盤線性移動機構，其是通過使所述捲繞卷盤旋轉機構沿與所述捲繞卷盤的排列方向平行的方向進行線性移動，使所述捲繞卷盤與捲繞位置對應地依次移動；以及一捲繞卷盤升降機構，其是通過使所述捲繞卷盤線性移動機構進行升降，使所述捲繞卷盤進行升降；一切割單元，其將從所述密封單元向所述載帶捲繞單元輸送的載帶，與要捲繞於所述捲繞卷盤的長度對應地切割；以及一附著單元，其在載帶捲繞於所述捲繞卷盤時，使載帶的前端附著於所述捲繞卷盤，並且使被所述切割單元切割的載帶的後端附著於載帶的被捲繞的部位；所述附著單元包括：一黏合帶供給卷盤，其是通過旋轉而將在離型紙的一側表面排成一列地附著有黏合片的黏合帶從捲繞的狀態解開而進行供給；一黏合帶供給卷盤旋轉機構，其使所述黏合帶供給卷盤旋轉；一剝離器，其在從所述黏合帶供給卷盤供給的黏合帶中將黏合片從所述離型紙剝離出，而使黏合片跨越所述捲繞卷盤的內側周面和載帶的前端附著，或跨越載帶的後端和載帶的被捲繞的部位附著；一黏合片加壓機構，其對跨越所述捲繞卷盤的內側周面和載帶的前端附著的黏合片進行加壓，或對跨越載帶的後端和載帶的被捲繞的部位附著的黏合片進行加壓；一離型紙回收卷盤，其供所述黏合片被剝離的離型紙捲繞；以及一離型紙回收卷盤旋轉機構，其使所述離型紙回收卷盤旋轉。A semiconductor element packaging device using a carrier tape, comprising: a carrier tape supply reel, which is a supply carrier tape, in which a plurality of pockets for storing semiconductor elements are arranged in a row along the length direction A carrier tape conveying unit that conveys the carrier tape received from the carrier tape supply reel in one direction with the inlets of the pockets facing upwards; a cover tape feeding unit that passes the carrier tape A cover tape is supplied when the conveyance unit conveys the carrier tape to cover a pocket of the carrier tape containing the semiconductor element supplied to the storage area of the carrier tape conveyance unit; a sealing unit that receives the tape from the cover tape supply unit A cover tape is adhered to the carrier tape to seal the pocket of the carrier tape; a carrier tape winding unit moves an empty winding reel in sequence to a winding position where the carrier tape sealed by the sealing unit is wound, The carrier tape is wound on winding reels which are respectively moved to the winding position; the carrier tape winding unit includes: a winding reel rotating mechanism, which makes the winding reel pass along the winding With the carrier tape to be wound A winding reel that rotates around each central axis in a state where the width directions are aligned and installed, and the carrier tape is wound at a winding position; a winding reel linear moving mechanism is provided by The winding reel rotating mechanism linearly moves in a direction parallel to the arrangement direction of the winding reels, so that the winding reels are sequentially moved corresponding to the winding position; and a winding reel lifting mechanism, which Is to raise and lower the winding reel by raising and lowering the linear movement mechanism of the winding reel; a cutting unit that carries a carrier tape to be conveyed from the sealing unit to the carrier tape winding unit, and The length to be wound on the winding reel is cut correspondingly; and an attaching unit that attaches the leading end of the carrier tape to the winding reel when the carrier tape is wound on the winding reel, And the rear end of the carrier tape cut by the cutting unit is attached to the wound portion of the carrier tape; the attachment unit includes: an adhesive tape supply reel, which is rotated on one side of the release paper Adhesive sheets are attached to the surface in a row The tape is unwound from the wound state to be supplied; an adhesive tape supply reel rotation mechanism that rotates the adhesive tape supply reel; and a peeler that supplies the adhesive tape supplied from the adhesive tape supply reel The adhesive sheet is peeled from the release paper, and the adhesive sheet is attached across the inner peripheral surface of the winding reel and the front end of the carrier tape, or across the rear end of the carrier tape and the wound portion of the carrier tape Attachment; an adhesive sheet pressing mechanism for pressing the adhesive sheet attached across the inner peripheral surface of the winding reel and the front end of the carrier tape, or winding the rear end of the carrier tape and the carrier tape being wound. The adhesive sheet attached to the part is pressed; a release paper recovery reel for winding the release sheet on which the adhesive sheet is peeled off; and a release paper recovery reel rotating mechanism that makes the release paper recovery reel Spin. 如申請專利範圍第1項所述的利用載帶的半導體元件包裝裝置，其特徵在於，包括：一第一視覺檢查器，其配置於所述載帶輸送單元的收納區域和所述蓋帶供給單元之間，以檢查收納有半導體元件的載帶的狀態；以及一第二視覺檢查器，其配置於所述密封單元和所述切割單元之間，以檢查被所述密封單元密封的載帶的狀態。The semiconductor device packaging device using a carrier tape according to item 1 of the scope of patent application, comprising: a first visual inspector arranged in a storage area of the carrier tape conveying unit and the cover tape supply Between the units to check the state of the carrier tape containing the semiconductor elements; and a second visual inspector arranged between the sealing unit and the cutting unit to inspect the carrier tape sealed by the sealing unit status. 如申請專利範圍第1項所述的利用載帶的半導體元件包裝裝置，其特徵在於，所述密封單元包括使蓋帶的兩側邊緣部分熱黏合在載帶上的一對熱黏合機構，各所述熱黏合機構包括：一葉片，其與蓋帶的邊緣部分對置地配置；一加熱器，其對所述葉片進行加熱；一葉片安裝塊，其安裝所述葉片；一安裝塊支承台，其支承所述葉片安裝塊的擺動動作，以使所述葉片與蓋帶的邊緣部分接觸或分離；以及一安裝塊驅動機構，其使所述葉片安裝塊進行擺動動作。The semiconductor device packaging device using a carrier tape according to item 1 of the scope of application for a patent, wherein the sealing unit includes a pair of thermal bonding mechanisms for thermally adhering both side edge portions of the cover tape to the carrier tape. The thermal bonding mechanism includes: a blade disposed opposite to an edge portion of the cover tape; a heater for heating the blade; a blade mounting block for mounting the blade; a mounting block support table, It supports the swinging motion of the blade mounting block to make the blade contact or separate from the edge portion of the cover tape; and a mounting block driving mechanism that makes the blade mounting block perform a swinging motion. 如申請專利範圍第1項所述的利用載帶的半導體元件包裝裝置，其特徵在於，所述載帶輸送單元包括：一輸送台，其從所述載帶供給卷盤接收載帶；一鏈輪，其藉由將各鋸齒插入向所述輸送臺上供給載帶的輸送孔進行旋轉，藉以輸送載帶；一鏈輪旋轉機構，其使所述鏈輪旋轉；以及一輸送軌道，其安裝於所述輸送台的上側，以向該輸送軌道與所述輸送台之間引導載帶的輸送。The semiconductor element packaging device using a carrier tape according to item 1 of the scope of application for a patent, wherein the carrier tape conveying unit includes: a transport table that receives a carrier tape from the carrier tape supply reel; a chain A wheel which rotates by inserting each saw tooth into a conveying hole for supplying a carrier tape on the conveying table, thereby conveying the carrier tape; a sprocket rotation mechanism which rotates the sprocket; and a conveying track, which is installed On the upper side of the conveying table, the conveyance of the carrier tape is guided between the conveying track and the conveying table. 如申請專利範圍第1項所述的利用載帶的半導體元件包裝裝置，其特徵在於，所述蓋帶供給單元包括：一蓋帶供給卷盤，其通過旋轉將蓋帶從捲繞的狀態解開而進行供給，一蓋帶供給卷盤旋轉機構，其使所述蓋帶供給卷盤旋轉；一蓋帶引導輥，其對從所述蓋帶供給卷盤供給的蓋帶向收納有半導體元件的載帶上的輸送進行引導；以及一蓋帶張力引導部，其對從所述蓋帶供給卷盤解開出來的蓋帶賦予設定張力。The semiconductor device packaging device using a carrier tape according to item 1 of the scope of patent application, wherein the cover tape supply unit includes a cover tape supply reel that unwinds the cover tape from a wound state by rotating. A cover tape supply reel rotating mechanism rotates the cover tape supply reel, and a cover tape guide roller stores semiconductor elements toward the cover tape supplied from the cover tape supply reel. Conveying on the carrier tape is guided; and a cover tape tension guide portion that imparts a set tension to the cover tape unwound from the cover tape supply reel. 如申請專利範圍第1項所述的利用載帶的半導體元件包裝裝置，其特徵在於，所述切割單元包括：一切斷台；一切割器，其配置成使載帶經過該切割器與所述切斷台分隔出的間隙，並通過與所述切斷台交叉地進行線性移動而切斷載帶；以及一切割器線性移動機構，其使所述切割器進行線性移動。The semiconductor element packaging device using a carrier tape according to item 1 of the scope of patent application, wherein the cutting unit includes: a cutting table; and a cutter configured to pass the carrier tape through the cutter and the A gap separated by a cutting table, and cutting a carrier tape by performing a linear movement crossing the cutting table; and a cutter linear movement mechanism that linearly moves the cutter.
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