WO2023179149A1

WO2023179149A1 - Chip detection and packaging device

Info

Publication number: WO2023179149A1
Application number: PCT/CN2022/142831
Authority: WO
Inventors: 刘中海; 马学超; 曾晓春; 吕绍林
Original assignee: 博众精工科技股份有限公司
Priority date: 2022-03-25
Filing date: 2022-12-28
Publication date: 2023-09-28
Also published as: CN114653606A; CN114653606B

Abstract

A chip detection and packaging device, comprising a machine platform (100); multiple conveying tracks (200), which are arranged on the machine platform in parallel along the Y-axis direction and sequentially comprise a feeding track (210), classifying tracks (220) and a packaging track (230), the classifying tracks comprising a good product track (221) and multiple defective product tracks (222), each conveying track comprising a conveying guide track (240) and at least two conveying mechanisms (250), each conveying mechanism being connected to a material tray vehicle (260), and the material tray vehicles being slidably connected to the conveying guide tracks; multiple detection stations, which are respectively located at at least one of the following positions: being disposed on a workbench on one side of the feeding track, being supported above the conveying track, and multiple detection stations reciprocating along the X-axis direction; a carrying module (400), which is located on the workbench and reciprocates between the multiple conveying tracks; a classifying module (500), which is configured to reciprocate between the classifying tracks; and a packaging module (700), which is provided on one side of the packaging track and which, by means of carrier tape, packages qualified products picked up from the packaging track by a pick-up module (600). The described chip detection and packaging device has high working efficiency and a compact structure.

Description

Chip inspection and packaging equipment

This application claims priority to the Chinese patent application with application number 202210302522.1, which was submitted to the China Patent Office on March 25, 2022. The entire content of this application is incorporated into this application by reference.

Technical field

This application relates to the technical field of automation equipment, such as a chip detection and packaging equipment.

Background technique

During the manufacturing process of semiconductor chips, defects such as scratches or cracks may occur, which will affect the performance of the chip. Therefore, it is necessary to conduct various appearance defect detection on the chip, and then sort out good products and defective products, and block the defective chips from continuing to be packaged. , thereby improving product quality.

In related technology, semiconductor chips are placed in a tray. The detection equipment usually detects one tray of chips before testing the next tray. During the process of replacing the tray, the detection components are in an idle state, and the equipment rhythm is not full, which is easy to This causes discontinuity in the supply of good chips to the packaging device. At the same time, when there are many types of chip defects, if all types of sorting are implemented, the equipment will become larger and the cost will increase.

Contents of the invention

Embodiments of the present application provide a device with a compact structure that can quickly and effectively detect and package chips, which can avoid the situation in related technologies that the equipment rhythm is not full and the equipment is large in size.

This application provides a chip detection and packaging equipment, including a machine, and:

A plurality of conveyor rails are arranged parallel to the machine platform along the Y-axis direction, and are in sequence a feeding rail, a classification rail and a packaging rail. The classification rail includes a good product rail and several defective product rails. The conveyor rails It includes a conveying guide rail and at least two conveying mechanisms, each conveying mechanism is connected to a material tray cart, and the material tray cart is slidingly connected to the conveying guide rail;

A plurality of detection stations, which are respectively arranged on the workbench on the side of the loading track and/or supported above the conveyor track and reciprocate along the X-axis direction;

A transportation module is located on the workbench and reciprocates between multiple conveyor tracks;

a classification module configured to reciprocate between said classification tracks;

The packaging module is arranged on one side of the packaging track, and uses braiding to package the qualified products picked up from the packaging track by the picking module.

Description of the drawings

Figure 1 is a schematic diagram of the overall structure of an embodiment of the present application;

Figure 2 is a schematic diagram of the conveyor track of this application;

Figure 3 is an enlarged schematic diagram of the material tray truck of the present application;

Figure 4 is a schematic diagram of the pickup module and the third detection station of this application;

Figure 5 is a schematic diagram of the transfer and transportation module of this application;

Figure 6 is a schematic structural diagram of the packaging module of the present application;

Figure 7 is a schematic diagram of the overall structure of another embodiment of the present application.

Description of the figures in the manual: 100. Machine;

200. Conveyor track; 210. Feeding track; 220. Classification track; 221. Good product track; 222. Defective product track; 230. Packaging track; 240. Conveyor guide rail; 250. Conveyor mechanism; 251. Driving wheel; 252. From Moving wheel; 253. Drive motor; 254. Transmission belt; 260. Tray cart; 261. Connecting block; 262. Slider; 263. Support plate; 264. First stopper; 265. Second stopper; 266. Adjustment cylinder;

310. First detection station; 311. Lower surface detector; 312. First transfer mechanism; 320. Second detection station; 321. Upper surface detector; 330. Third detection station; 331. Peripheral detection device; 332, second transfer mechanism;

400. Transport module;

500. Classification module;

600. Picking module; 610. Picking up suction head; 611. Adjustable distance suction head; 612. Fixed suction head; 620. Rotating mechanism; 630. Lifting mechanism;

700. Packaging module; 710. Carrier tape reel; 720. Carrier tape pulling component; 730. Pressing tape reel; 740. Heat pressing component; 750. Carrier tape rewinding reel; 760. Switching mechanism; 761. Packaging platform; 762, switching cylinder; 763, switching guide rail; 770, fourth detection station; 771, appearance detector.

Detailed ways

Refer to FIG. 1 , which is a schematic diagram of the overall structure of an embodiment of a chip testing and packaging device according to the present application. Refer to Figure 2, which is a schematic diagram of the conveyor track of the present application. Refer to Figure 5, which is a schematic diagram of the transfer and pickup module of the present application. The testing and packaging equipment of this application includes a machine 100, and:

A plurality of conveyor rails 200 are arranged parallel to the machine 100 along the Y-axis direction, including a feeding rail 210, a classification rail 220 and a packaging rail 230. The classification rail 220 includes a good product rail 221 and several items. Product track 222. The conveyor track 200 includes a conveyor guide rail 240 and at least two conveyor mechanisms 250. Each conveyor mechanism 250 is connected to a material tray cart 260, and the material tray cart 260 is slidingly connected to the conveyor guide rail 240;

A plurality of detection stations are respectively provided on the workbench on the side of the loading track 210 and/or supported above the conveyor track 200, and the multiple detection stations reciprocate along the X-axis direction;

The transportation module 400 is located on the workbench and reciprocates between the plurality of conveyor rails 200;

A classification module 500 configured to reciprocate between the classification tracks 220;

The packaging module 700 is disposed on one side of the packaging rail 230 and packages the qualified products picked up by the picking module 600 from the packaging rail 230 through braiding.

This embodiment is described by taking the conveyor track 200 provided with two conveyor mechanisms 250 as an example. In this case, each conveyor track 200 includes two pallet trucks 260 . Since the conveying direction of each conveying track 200 is different, the conveying direction of the loading track 210 is used as a reference in this application, and the feeding end and the discharging end referred to below are the feeding end direction and the discharging end of the loading track 210 direction.

During operation, the material tray loaded with chips is placed on the first material tray truck 260 close to the feeding end of the loading track 210, and the conveying mechanism 250 drives the material tray truck 260 to move to the detection station located on the side of the loading track 210. . According to the specific position of the detection station, the material tray is placed on the first material tray truck 260 or is transported to the second material tray truck 260 . Pick up the chips in the tray at the position corresponding to the inspection station for visual inspection. When there is only one detection station on the side of the loading track 210, the material tray is transported from the first material tray car 260 to the second material tray car 260, and then the corresponding conveying mechanism 250 of the second material tray car 260 no longer operates. The position of the second tray cart 260 is fixed to perform chip detection, while the first tray cart 260 returns to carry the next tray. While one material tray is being inspected, another material tray is loaded, thereby saving the round trip time of the material tray truck 260 and improving the inspection efficiency.

When all the chips in the first tray are tested, the transport module 400 transports the tray to a tray truck 260 on the quality track 221 . Then, the inspection station located above the sorting track 220 detects the chips in the tray again to obtain a conclusion as to whether the chips are good products and what kind of defects there are in the chips. At this time, there is one material tray on the two tray cars 260 of the good product track 221, and a corresponding number of empty material trays are placed on the material tray cars 260 of the other defective product tracks 222 according to the types of defective products that need to be distinguished. The classification module 500 places the good products in the trays on the good product track 221 according to the obtained detection results, and the defective products are placed in different trays on the defective product track 222 according to different types of defects. Since the chips in the first tray are separated, the first tray is no longer full. As the classification proceeds, the chip in the second tray on the loading track 210 completes the detection, and the second tray is transported by the transport module 400 to the tray truck 260 on the good product track 221. The classification module 500 classifies the chips in the second tray again, sorting the good products into the first tray, and sorting the defective products into different trays according to the type of defects. When the first material tray is full, the good products in the second material tray are retained in the second material tray, and the first material tray moves below the transportation module 400 , and the transportation module 400 transports the material tray to the packaging track 230 The material tray truck is within 260. If the previous material tray is not full and the material tray being sorted is empty, the empty material tray will be sent out directly from the end of the conveyor track 200 . When the material tray carrying defective products is full, the defective product track 222 directly sends the material tray out from the loading end of the loading track 210 . In this embodiment, in order to improve the detection efficiency and prevent interference of multiple modules, the material tray is transported from the discharge end of the loading rail 210 to the classification rail 220. Therefore, the transportation module 400 and one of the detection stations are arranged at the outlet. On the same straight line of the material end, there is no need for the material tray to move to the position of the detection station. At the same time, the classification module 500 is disposed close to the feeding end of the feeding track 210, and the movement of the classification module 500 will not interfere with the transportation mechanism, achieving synchronous operation of the two. Therefore, when unloading materials, the material tray carrying good products is sent out from the discharging end, and the material tray carrying defective products is sent out from the feeding end, ensuring that the material tray carrying defective products will not interact with the handling module 400 and the inspection station when it is sent out. put one's oar in. Since each good product track 221 and defective product track 222 are provided with at least two pallet trucks 260 , enough pallets carrying defective products can be provided without increasing the number of conveyor rails 200 , so that the chips can be sorted at one time. Picking, and the chips that have been detected at the same time can be continuously sent to the classification track 220 for classification, and the classification efficiency is high.

For the first time, the separated good products are transported from the good product track 221 to the tray cart 260 on the packaging track 230 near the feeding end by the transport module 400. The picking module 600 picks up the chips from the tray and puts the chips into the package. Module 700, the chip is packaged through the packaging module 700. As the second material tray is transported to the packaging module 700, the second material tray is placed on the material tray cart 260 near the discharge end. When the chips in the first tray are emptied, the first tray flows out toward the feed end, and the transport module 400 transports the second tray on the discharge end pallet 260 to the feed end pallet. 260, the next plate of good products is placed again on the material tray car 260 near the discharging end. This cycle ensures that the material will not be cut off during the packaging process.

Referring to FIGS. 2 and 3 , as an example embodiment of the present application, the conveying mechanism 250 is installed on the side of the conveying guide rail 240 , and the conveying mechanisms 250 are arranged side by side along the Z-axis direction. The width of the conveyor track 200 itself is narrow. Arranging the conveyor mechanisms 250 up and down along the Z-axis direction greatly saves space. At the same time, guidance through the track can ensure the stability of the material tray truck 260 during operation. For example, in order to achieve the transmission effect of the conveying mechanism 250, the conveying mechanism 250 includes a driving wheel 251 and a driven wheel 252. The driving wheel 251 is connected to a driving motor 253. The driving wheel 251 and the driven wheel 252 are connected through a transmission belt 254. , the material tray car 260 is fixed on the transmission belt 254 on one side of the driving wheel 251 and the driven wheel 252. The transmission belt 254 is suitable for long transportation distances and takes up little space. If the conveying distance is short, transmission forms such as cylinders and screws can also be used.

In this embodiment, the conveyor track 200 includes support frames disposed on both sides, and the conveyor guide rail 240 is disposed between the two support frames. Since the size of the material tray cart 260 is small, if the material tray is not supported on both sides, it will The material tray is prone to shaking during the discharging process, causing the position of the chips in the material tray to be inaccurate. After the material tray is placed on the material tray cart 260, the driving motor 253 is started to drive the driving wheel 251 to rotate. The transmission belt 254 is displaced due to the rotation of the driving wheel 251, thereby realizing the movement of the material tray cart 260 connected to the transmission belt 254.

As an example embodiment of the present application, in order to position the material tray, the material tray car 260 includes a connecting block 261, a sliding block 262 and a support plate 263. The connecting block 261 is connected to the conveying mechanism 250. In this embodiment In this example, it is connected to the transmission belt 254 . The slider 262 is connected to the conveyor guide rail 240, and the slider 262 is slidingly connected to the conveyor guide rail 240. The support plate 263 connects the connecting block 261 and the slider 262, so that the support plate 263 can be driven while ensuring movement. Stablize. A first stopper 264 and a second stopper 265 are respectively provided at both ends of the support plate 263. The second stopper 265 is driven close to or away from the first stopper 264 by an adjusting cylinder 266. When the material tray is placed, the adjusting cylinder 266 drives the second stopper 265 away from the first stopper 264 so that the material tray can be placed between the two stops. After the material tray is placed, the adjusting cylinder 266 drives the second stopper 265 close to the first stopper 264, clamping the material tray between the first stopper 264 and the second stopper 265, and the material tray is fixed, so that during transportation The position of the material tray will not shift during the process.

Referring to Figure 1, Figure 4 and Figure 5, as an example embodiment of the present application, the detection station includes:

The first detection station 310 is provided with a lower surface detector 311 and a first transfer mechanism 312. The lower surface detector 311 is located on one side of the loading rail 210. The first transfer mechanism 312 is configured to Reciprocating between the loading track 210 and the lower surface detector 311;

The second detection station 320 is provided with an upper surface detector 321 , and the upper surface detector 321 is arranged above the workbench to reciprocate between the classification rails 220 .

The first inspection station 310 is configured to detect defects on the lower surface of the chip. The loading track 210 transports the material tray to the position of the first detection station 310, and then the first transfer mechanism 312 picks up the chips from the material tray and moves them above the lower surface detector 311, which detects the lower surface of the chip. Defects are detected. After the inspection is completed, the transport module 400 transports the material tray to the classification track 220 . The second inspection station 320 above the classification track 220 moves above the material tray according to the position where it is transported to detect defects on the upper surface of the chip. In this process, the position of the material tray is transferred, and the steps for detecting defects on the upper surface are simplified. There is no need to remove the chip from the material tray for inspection, and there is no need to set up an additional detection position on the machine 100, which saves time. space.

Referring to Figure 1, Figure 4 and Figure 5, for example, in order to achieve comprehensive detection of the chip, the detection station also includes a third detection station 330, which is provided with a peripheral detector 331 and a second transfer mechanism 332. The peripheral detector 331 and the lower surface detection station are arranged on one side of the loading track 210 in sequence or side by side, and the second transfer mechanism 332 is arranged between the loading track 210 and the peripheral detector 331 back and forth between. In order to save space, the peripheral detector 331 and the lower surface detector 311 can be arranged on one side of the loading track 210 , and both are arranged along the conveying direction of the loading track 210 . At this time, the tray truck 260 at the feeding end of the loading track 210 first transports the tray to the position corresponding to the peripheral detector 331. The second transplanting mechanism picks up the chips from the tray and places them above the peripheral detector 331. Defects around the chip are detected. The transport module 400 then transports the material tray to the material tray truck 260 at the discharge end for upper surface inspection, and the material tray truck 260 at the feed end returns to support the material tray again. In other embodiments of the present application, the first detection station 310 and the third detection station 330 are arranged on one side of the loading rail 210 in a direction perpendicular to the conveyor rail 200 . At this time, the first transfer mechanism 312 and the second transplant mechanism are arranged oppositely.

Referring to FIG. 4 , as an example embodiment of the present application, the picking module 600 includes a lifting mechanism 630 and a plurality of picking suction heads 610 , and the plurality of picking suction heads 610 are connected to the lifting mechanism 630 through a rotating mechanism 620 connected. The lifting mechanism 630 controls the pickup head 610 to descend to pick up chips from the material tray. Since the direction in which the chip is transported on the transport track 200 is different from the direction in which it needs to be packaged, a rotation mechanism 620 is provided so that the chip can rotate at a certain angle to match the direction of the packaging module 700 . For example, since the spacing between pockets on the carrier tape for placing chips in the packaging module 700 is different from the spacing between chips in the tray, multiple distance-adjustable suction heads 611 are provided. At the same time, in order to take out defective products while placing the chip into the carrier tape, a fixed suction head 612 is also provided in the pick-up suction head 610 .

Referring to Figure 6, as an example embodiment of the present application, in order to implement chip packaging, the packaging module 700 includes: a carrier tape reel 710, a carrier tape pulling assembly 720, a pressure tape reel 730, and a thermal pressing assembly. 740 and carrier tape take-up reel 750. The carrier tape reel 710 and the pressure tape reel 730 are respectively provided below and above the carrier tape pulling assembly 720 to supply the carrier tape and the pressure tape to clamp the chip. Holding between the two, the thermal pressing assembly 740 is installed on the carrier tape pulling assembly 720 to press the carrier tape and the pressure tape around the chip. The carrier tape rewinding disc 750 is disposed on the The discharge end of the carrier tape pulling assembly 720 is used to wind up the packaged carrier tape. During operation, the leader of the carrier tape is pulled out from the carrier tape reel 710 , so that the carrier tape bypasses the carrier tape pulling assembly 720 , and the leader of the carrier tape is fixed to the carrier tape take-up reel 750 . For example, the carrier tape pulling assembly 720 is composed of a mounting frame, a transmission wheel, a synchronous wheel, a synchronous motor, a pressure roller, and a synchronous belt. The mounting frame is fixed on the machine 100. The two ends of the mounting frame are respectively connected to the transmission wheels for rotation. A shaft is fixed on each transmission wheel, and a synchronous motor is fixed on the mounting frame. The output shaft of the synchronous motor is fixed on the shaft end of one transmission wheel. Synchronous wheels are fixed on the shafts of the two transmission wheels. Both synchronous wheels are fixed on the shaft. It is meshed with a synchronous belt, and the two ends of the mounting frame are respectively connected with pressure rollers for pressing the carrier tape. As the carrier tape is unrolled, the chip is placed in the pocket of the carrier tape, the pressure tape reel 730 is unrolled, the pressure tape covers the carrier tape, and the pressure tape and the carrier tape hold the chip through the thermal compression assembly 740, The heat sealing assembly 740 heat-seals the pockets of the pressure tape and the carrier tape to achieve sealed packaging of the chip.

Referring to FIG. 1 , which is an embodiment of the present application, a group of packaging modules 700 is provided, and the packaging modules 700 are arranged on the machine 100 parallel to the packaging rail 230 . In this arrangement, the width of the package module 700 is narrow, and the length matches the size of the machine 100, so it takes up little space. And the packaging module 700 is arranged at one end of the machine 100 to facilitate maintenance of the packaging module 700.

Referring to FIG. 7 , for example, when the carrier tape or pressure tape in the packaging module 700 is used up and the carrier tape or pressure tape needs to be replaced, the equipment needs to be shut down to prevent material accumulation. This form affects work efficiency. Therefore, in another embodiment of the present application, the packaging module 700 is provided with two groups. When one group of packaging modules 700 is working, the carrier tape and pressure tape can be replaced on the other group of packaging modules 700 . operate. When the carrier tapes of one group of packaging modules 700 are used up, they can be directly switched to another group to continue packaging without stopping the machine. If both sets of package modules 700 are arranged parallel to the conveyor track 200, the package modules 700 located inside are difficult to maintain. Therefore, in this embodiment, two sets of the packaging modules 700 are installed on the side of the machine 100 through a packaging platform 761. The packaging platform 761 and the workbench are connected through a switching mechanism 760. The switching mechanism 760 The two groups of packaging modules 700 are pushed to cooperate with the pickup modules 600 respectively. For example, the switching mechanism 760 includes a switching cylinder 762. The switching cylinder 762 is installed on the side of the machine 100 along the Y-axis direction. Switching guide rails 763 are provided on the upper and lower sides of the switching cylinder 762. The switching cylinder 762 is connected to The packaging platform 761 is slidably connected to the switching guide rail 763, and the two packaging modules 700 are installed on the packaging platform 761. During operation, the first packaging module 700 cooperates with the picking module 600. The picking module 600 takes out the chips from the tray on the packaging track 230 and puts them into the carrier tape at the end of the first packaging module 700. When the carrier tape of the first packaging module 700 is used up, the push rod of the switching cylinder 762 is connected to the packaging table 761. The push rod is pushed out, and the packaging table 761 is displaced, causing the first packaging module 700 to leave the position matching the pickup module 600. , the second packaging module 700 cooperates with the pickup module 600. For example, when the chip is placed in the pocket of the carrier tape, it may still be damaged due to bumps, etc. Therefore, a fourth detection station 770 is also included to detect the chip placed in the carrier tape, which is equipped with an appearance detector. 771. Since there are two groups of packaging modules 700, in order to save costs, the appearance detector 771 is arranged above the packaging stage 761 to move back and forth between the two packaging modules 700. Therefore, one appearance detector 771 can detect two package modules 700.

The detection and packaging equipment described in this application has multiple conveying mechanisms in the conveying track, which improves the conveying efficiency and saves the time of tray transfer during the inspection process. Multiple inspections and transfers can be carried out at the same time, which greatly improves the efficiency. , and makes the equipment compact and saves space.

Claims

A chip testing and packaging equipment, including a machine and:

A plurality of conveyor rails, which are arranged parallel to the machine platform along the Y-axis direction, are in order a loading track, a classification track and a packaging track. The classification track includes a good product track and a plurality of defective product tracks. , each conveyor track includes a conveyor guide rail and at least two conveyor mechanisms, each conveyor mechanism is connected to a material trolley, and the material trolley is slidingly connected to the conveyor guide rail;

A plurality of detection stations, each of which is located at at least one of the following positions: a workbench on the side of the loading rail, supported above the multiple conveyor rails, the plurality of The detection station reciprocates along the X-axis direction;

A transportation module, which is located on the workbench and reciprocates between the plurality of conveyor rails;

a classification module, the classification module being configured to reciprocate between the classification tracks;

The packaging module is arranged on one side of the packaging track, and uses braiding to package the qualified products picked up by the picking module from the packaging track.
The equipment according to claim 1, wherein the at least two conveying mechanisms are installed on the side of the conveying guide rail, and the at least two conveying mechanisms are arranged side by side along the Z-axis direction.
The equipment according to claim 2, wherein each conveying mechanism includes a driving wheel and a driven wheel, the driving wheel is connected to a driving motor, the driving wheel and the driven wheel are connected through a transmission belt, and the material tray car is fixed on On the drive belt on one side of the driving wheel and the driven wheel.
The equipment according to claim 1, wherein the material tray cart includes a connecting block, a sliding block and a support plate, the connecting block is connected to the corresponding conveying mechanism, the sliding block is connected to the conveying guide rail, and the The support plate connects the connecting block and the slider. The two ends of the support plate are respectively provided with first and second stoppers. The second stopper is driven close to or away from the first stop by an adjusting cylinder. piece.
The device according to claim 1, wherein the detection station includes:

A first detection station. The first detection station is provided with a lower surface detector and a first transfer mechanism. The lower surface detector is located on one side of the loading rail. The first transfer mechanism is configured to Reciprocate between the loading track and the lower surface detector;

A second detection station is provided with an upper surface detector, and the upper surface detector is arranged above the workbench to reciprocate between the classification rails.
The equipment according to claim 5, wherein the detection station further includes a third detection station, the third detection station is provided with a peripheral detector and a second transfer mechanism, the peripheral detector is connected to the The lower surface detection stations are arranged on one side of the loading track in sequence or side by side, and the second transfer mechanism is configured to reciprocate between the loading track and the peripheral detector.
The device according to claim 1, wherein the picking module includes a lifting mechanism and a plurality of picking suction heads, and the plurality of picking suction heads are connected to the lifting mechanism through a rotating mechanism.
The apparatus of claim 7, wherein the pick-up suction head includes a fixed suction head and a plurality of adjustable-distance suction heads.
The equipment according to claim 1, wherein the packaging module includes: a carrier tape reel, a carrier tape pulling assembly, a pressure tape reel, a thermal pressing assembly and a carrier tape take-up reel, the carrier tape reel and the pressure tape reel are respectively disposed below and above the carrier tape pulling assembly, and are configured to supply the carrier tape and the pressure tape to clamp the chip between the carrier tape and the pressure tape, and the thermal pressure sealing assembly Installed on the carrier tape pulling assembly, it is configured to press the carrier tape and the pressure tape around the chip. The carrier tape rewinding disk is installed on the discharge end of the carrier tape pulling assembly, and is configured to seal the package. The final carrier tape is rolled up.
The device according to claim 1, wherein a group of the packaging modules is provided, and the packaging modules are arranged on the machine platform parallel to the packaging track.
The equipment according to claim 1, wherein the packaging module is provided with two groups, and the two groups of packaging modules are installed on the side of the machine through a packaging platform, between the packaging platform and the workbench. They are connected through a switching mechanism, and the switching mechanism is configured to push the two sets of packaging modules to cooperate with the pickup modules respectively.
The equipment according to claim 11, wherein the switching mechanism includes a switching cylinder, the switching cylinder is installed on the side of the machine platform along the Y-axis direction, and the upper and lower sides of the switching cylinder are respectively provided with switching guide rails. , the switching cylinder is connected to the packaging platform, the packaging platform is slidingly connected to the switching guide rail, and the two sets of packaging modules are installed on the packaging platform.
The equipment according to claim 11, wherein the detection station further includes a fourth detection station, the fourth detection station is provided with an appearance detector, and the appearance detector is arranged above the packaging table. To move back and forth between the two sets of packaging modules.