CN212597213U - Full-automatic PL detection device - Google Patents
Full-automatic PL detection device Download PDFInfo
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- CN212597213U CN212597213U CN202021855345.2U CN202021855345U CN212597213U CN 212597213 U CN212597213 U CN 212597213U CN 202021855345 U CN202021855345 U CN 202021855345U CN 212597213 U CN212597213 U CN 212597213U
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Abstract
The utility model discloses a full-automatic PL detection device relates to PL and detects technical field. The silicon wafer automatic feeding device comprises a feeding mechanism, a silicon wafer transmission rail, a detection mechanism, a defective wafer removing mechanism, a defective wafer transmission mechanism, a qualified wafer discharging mechanism and the like. The workpiece basket is used as a carrier for bearing the silicon wafers, so that the product defects caused by dirt of hands on the silicon wafers and friction between the silicon wafers are avoided. The silicon chip is transmitted in a stepping mode, and rapid and accurate detection can be achieved. The PL test image adopts image analysis software to automatically judge the defect type, avoids the subjective judgment error of manual sorting, and can realize the standardization of the test. The test defective sheet is conveyed to the special defective product conveying rail, can be collected into the workpiece basket which is the same as the battery sheet, cannot cause secondary pollution to the defective sheet, and is convenient for manual secondary sorting. And the bad film box and the qualified film conveying track are both provided with a buffer mechanism, so that the time for halt due to faults can be reduced.
Description
Technical Field
The utility model belongs to the technical field of solar cell produces, especially, relate to a full-automatic solar wafer PL detection device.
Background
Photoluminescence (PL) refers to a process in which a substance absorbs photons (or electromagnetic waves) and then re-emits the photons (or electromagnetic waves). Photoluminescence can be applied to: band gap detection, impurity grade and defect detection, recombination mechanism and material quality identification. The photoluminescence test system utilizes the application principle of photoluminescence to realize the on-line non-contact measurement of various technical indexes of silicon chips and battery plates, such as minority carrier lifetime values, series resistance, subfissure, lattice defects, I-V curves and the like.
PL detection device on the existing market is mostly manual formula, has and detects fastly lowly, and degree of automation is not high shortcoming, needs artifical according to experience to judge bad piece, easily receives different testers 'subjective judgement influence, can't provide standard, objective judgement, to the bad piece of discovery in the testing process, adopts the mode of piling up to place together, easily causes mutual friction between the battery piece when secondary reinspects and damages the battery piece surface, easily leads to bad piece directly to scrap.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a full-automatic solar wafer PL detection device can realize full-automatic material loading, unloading and testing process, will test the defective work and reject alone, places at special carrier, solves the problem that above-mentioned PL detection device exists.
The utility model discloses a realize through following technical scheme:
a full-automatic online PL detection device comprises a feeding mechanism, a silicon wafer transmission rail, a detection mechanism, a defective wafer removing mechanism, a defective wafer transmission mechanism, a qualified wafer discharging mechanism and the like.
The feeding mechanism comprises a basket pressing cylinder 0, a feeding basket feeding rail 1, a feeding basket discharging rail 2, a feeding tray 3, a feeding lifting module 4 and a feeding telescopic module 5;
the feeding basket rail 1 and the feeding basket rail 2 are arranged on the side surface of the feeding lifting module 4, the feeding basket rail 1 is arranged above the feeding basket rail 2, the feeding tray 3 is arranged on the feeding lifting module 4, three working positions of the feeding tray 3 respectively correspond to the feeding basket rail 1, the feeding basket rail 2 and the feeding telescopic module 5, and the feeding telescopic module 5 is arranged on the other side surface of the feeding lifting module 4;
the telescopic module 5 comprises a first sensor 501, a linear guide rail 502, a telescopic plate 503, a capacitance sensor 504, a rodless cylinder 505, an induction iron sheet 506, a silicon wafer conveying belt 507, a driving wheel 508, a driving belt 509 and a stepping motor 510;
the rodless cylinder 505 passes through the linear guide rail 502, the expansion plate 503, the sensor 501 and the silicon wafer conveying belt 507 and is arranged on the expansion plate 503, the sensor 501, the capacitance sensor 504 and the induction iron sheet 506 are respectively used for monitoring the position of the expansion plate 503, whether a silicon wafer is arranged on the silicon wafer conveying belt 507 and the number of the silicon wafers, and the stepping motor 510 drives the silicon wafer conveying belt 507 to run through a transmission belt;
the working process of the feeding mechanism is as follows: during feeding, a work material basket loaded with multiple layers of silicon wafers is placed on the feeding basket rail 1, a driving motor drives a belt to transmit the work material basket to a feeding tray 3 of a feeding lifting module 4, a basket pressing cylinder 0 extends out to fix the work material basket, then the feeding tray 3 moves upwards to a first wafer taking position under the driving of the feeding lifting module 4 driven by a servo motor, a feeding telescopic module 5 on the other side extends out a material taking telescopic plate 9 to the lower side of a silicon wafer to be taken, the feeding tray 3 descends one cell to enable the first layer of silicon wafers to fall onto a silicon wafer transmission belt 507, the silicon wafer transmission belt 507 operates to take the first layer of silicon wafers out of the work material basket, the material taking telescopic plate 9 is matched with the silicon wafer transmission belt 507 to gradually transfer the silicon wafers onto a silicon wafer transmission rail 6, then the work material basket descends one cell by one cell, and all the silicon wafers in the work material basket are taken out. Treat that the whole backs of taking out of silicon chip in the work material basket, get the withdrawal of material expansion plate 9, material loading tray 3 descends to and expects basket ejection of compact track levelly and punishment, presses the withdrawal of basket cylinder 0, and the reverse operation of tray belt of material loading lifting module 4 conveys empty work material basket to material loading play basket track 2, and material loading play basket track 2 operates under driving motor's drive, conveys work material basket to ejection of compact track end.
The silicon wafer transmission rail comprises a first silicon wafer transmission rail 6 and a second silicon wafer transmission rail 8;
the silicon wafer transmission rail 6 is provided with a second sensor 601 and a third sensor 602 for monitoring the position and the number of the silicon wafers on the transmission rail;
the detection mechanism is arranged above the middle of the first silicon wafer conveying track 6 and the second silicon wafer conveying track 8;
the detection mechanism includes a pair of excitation light sources, a first excitation light source 701 and a second excitation light source 704, and a camera 702, the camera 702 being disposed between the first excitation light source 701 and the second excitation light source 704;
the working process of the detection mechanism is as follows: when the silicon wafer is conveyed to the PL detection station, the first excitation light source 701 and the second excitation light source 704 irradiate the surface of the silicon wafer to enable the silicon wafer to emit fluorescence with a certain wavelength, the high-sensitivity high-resolution camera 702 is used for sensitization, then the image is analyzed through image recognition software, and the image is compared with a preset quality standard to judge whether the defect type of the silicon wafer is qualified or not. And feeding back the test result to a PLC of the automatic system.
Qualified piece unloading mechanism includes qualified piece unloading basket track 22, qualified piece unloading play basket track 21, qualified piece unloading tray 23, qualified piece unloading lift module 20, the flexible module 19 of qualified piece unloading, the theory of operation of qualified piece unloading mechanism is the same with feed mechanism, and the working procedure is opposite.
The qualified piece blanking mechanism works: the silicon wafers qualified in the test are continuously conveyed backwards along the silicon wafer conveying track 8 and are conveyed into the qualified workpiece basket one by the qualified wafer blanking telescopic module 19. When the workpiece basket is full, the workpiece basket rises to the height flush with the workpiece basket discharging rail, and the workpiece basket filled with qualified silicon wafers is discharged from the qualified wafer discharging rail 21.
The defective piece removing mechanism comprises a defective piece taking mechanism 11 and a defective product conveying mechanism;
the bad piece taking mechanism 11 comprises a Bernoulli sucker capable of moving up and down and a linear module driven by a servo motor, and the sucker is arranged on the linear module.
The bad piece conveying mechanism comprises a bad piece blanking telescopic module 14, a bad piece blanking lifting membrane group 15, a bad piece blanking basket outlet rail 16, a bad piece blanking basket inlet rail 17 and a bad piece blanking tray 18.
The defective wafer removing mechanism is arranged above the second silicon wafer conveying rail 8, and the defective wafer conveying mechanism is arranged on the side surface of the second silicon wafer conveying rail 8.
The defective piece removing mechanism works in the following process: after the unqualified silicon wafer is tested and is transmitted to a defective wafer taking position, the sucker moves to the position above the silicon wafer conveying rail, the Bernoulli sucker sucks up the silicon wafer, then the silicon wafer is moved to a defective wafer conveying rail, the defective wafer is placed on the defective wafer conveying rail and is conveyed into a defective wafer workpiece basket.
Qualified product caching mechanism 10 and bad wafer caching module 13 are arranged on the qualified wafer and bad wafer conveying tracks, and if the rear conveying track fails or the workpiece basket is replaced, the silicon wafers which are not conveyed backwards can be temporarily stored in the caching box in the future, so that the forward test can be continuously carried out.
The utility model discloses following beneficial effect has:
1. the workpiece basket is used as a carrier for bearing the silicon wafer, so that no contact exists between an operator and the silicon wafer in the test process, the silicon wafer cannot be manually contacted, and the product defects caused by dirt of the silicon wafer and friction between the silicon wafers by hands are avoided.
2. The silicon chip is transmitted in a stepping mode, the testing speed is high, the testing time is less than 1S, and the rapid and accurate detection can be achieved.
3. The PL test image adopts image analysis software to automatically judge the defect type, avoids subjective judgment error of manual sorting, is accurate and rapid in test, can analyze and count the test result, is convenient for rapidly determining the process procedure causing the product to be bad, rapidly eliminates the reason causing the product to be bad, and improves the process yield.
4. The bad piece of test conveys to special defective products transfer orbit, conveys to special bad piece and places the basket in, can not cause secondary pollution to bad piece, is convenient for the manual work and carries out the secondary and select separately.
5. All install buffer memory mechanism on defective products box and the certified products transfer orbit, keep in the battery, can keep the testing process to go on in succession, can not be because of reasons such as unloading work piece basket is full or rear transfer orbit trouble lamp interrupt test process, but maximize test equipment's productivity reduces the time of shutting down because of the trouble.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a first silicon wafer conveying track and a testing system of the present invention;
fig. 3 is a schematic view of the feeding mechanism of the present invention;
fig. 4 and 5 are a top view and a perspective view of the feeding expansion module of the present invention, respectively;
in the figure:
0-basket pressing cylinder, 1-feeding basket feeding rail, 2-feeding basket discharging rail, 3-feeding tray, 4-feeding lifting module, 5-feeding telescopic module, 501-first sensor, 502-linear guide rail, 503-telescopic plate, 504-capacitance sensor, 505-rodless cylinder, 506-induction iron sheet, 507-silicon wafer conveying belt, 508-driving wheel, 509-driving belt, 510-stepping motor, 6-first silicon wafer conveying rail, 601-second sensor, 602-third sensor, 7-test system, 701-first laser light source, 702-camera, 703-camera fixing bracket, 704-second laser light source, 705 second laser light source fixing bracket, 706 first laser light source fixing bracket, 8-a second silicon wafer conveying track, 9-a first silicon wafer correcting module, 10-a qualified piece caching module, 11-a bad piece taking mechanism, 12-a second silicon wafer correcting module, 13-a bad piece caching module, 14-a bad piece blanking telescopic module, 15-a bad piece blanking lifting module, 16-a bad piece blanking basket outlet track, 17-a bad piece blanking basket inlet track, 18-a bad piece blanking tray, 19-a qualified piece blanking telescopic module, 20-a qualified piece blanking lifting module, 21-a qualified piece blanking basket outlet track, 22-a qualified piece blanking basket inlet track and 23-a qualified piece blanking tray;
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
The utility model relates to a full-automatic online PL detection device, including feed mechanism, silicon chip transmission track, detection mechanism, not the piece article reject mechanism, bad piece transmission mechanism, parts such as qualified piece unloading mechanism constitute.
The feeding mechanism comprises a basket pressing cylinder 0, a feeding basket feeding rail 1, a feeding basket discharging rail 2, a feeding tray 3, a feeding lifting module 4 and a feeding telescopic module 5;
the feeding basket rail 1 and the feeding basket rail 2 are arranged on the side surface of the feeding lifting module 4, the feeding basket rail 1 is arranged above the feeding basket rail 2, the feeding tray 3 is arranged on the feeding lifting module 4, three working positions of the feeding tray 3 respectively correspond to the feeding basket rail 1, the feeding basket rail 2 and the feeding telescopic module 5, and the feeding telescopic module 5 is arranged on the other side surface of the feeding lifting module 4;
the telescopic module 5 comprises a first sensor 501, a linear guide rail 502, a telescopic plate 503, a capacitance sensor 504, a rodless cylinder 505, an induction iron sheet 506, a silicon wafer conveying belt 507, a driving wheel 508, a driving belt 509 and a stepping motor 510;
the rodless cylinder 505 passes through the linear guide rail 502 and the expansion plate 503, the sensor 501 and the silicon wafer conveying belt 507 are arranged on the expansion plate 503, the sensor 501, the capacitance sensor 504 and the induction iron sheet 506 are respectively used for monitoring the position of the expansion plate 503, whether a silicon wafer is arranged on the silicon wafer conveying belt 507 and the number of the silicon wafers, and the stepping motor 510 drives the silicon wafer conveying belt 507 to run through a transmission belt;
the silicon wafer transmission rail comprises a first silicon wafer transmission rail 6 and a second silicon wafer transmission rail 8;
the silicon wafer transmission rail 6 is provided with a second sensor 601 and a third sensor 602 for monitoring the position and the number of the silicon wafers on the transmission rail;
the detection mechanism is arranged above the middle of the first silicon wafer conveying track 6 and the second silicon wafer conveying track 8;
the detection mechanism includes first and second excitation light sources 701 and 704 and a camera 702, the camera 702 being disposed in between the pair of excitation light sources 701 and 704;
qualified piece unloading mechanism includes qualified piece unloading basket track 22, qualified piece unloading play basket track 21, qualified piece unloading tray 23, qualified piece unloading lift module 20, the flexible module 19 of qualified piece unloading, the theory of operation of qualified piece unloading mechanism is the same with feed mechanism, and the working procedure is opposite.
The defective piece removing mechanism comprises a defective piece taking mechanism 11 and a defective product conveying mechanism;
the bad piece taking mechanism 11 comprises a Bernoulli sucker capable of moving up and down and a linear module driven by a servo motor, and the sucker is arranged on the linear module.
The defective product conveying mechanism comprises a defective piece blanking telescopic module 14, a defective piece blanking lifting module 15, a defective piece blanking basket outlet rail 16, a defective piece blanking basket inlet rail 17 and a defective piece blanking tray 18.
The defective wafer removing mechanism is arranged above the second silicon wafer conveying rail 8, and the defective product conveying mechanism is arranged on the side surface of the second silicon wafer conveying rail 8.
Qualified product caching mechanism 10 and bad wafer caching module 13 are arranged on the qualified wafer and bad wafer conveying tracks, and if the rear conveying track fails or the blanking workpiece basket is replaced, the silicon wafers which are not conveyed backwards can be temporarily stored in the caching box in the future, so that the forward test can be continuously carried out.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (2)
1. A full-automatic PL detection device is characterized by comprising a feeding mechanism, a silicon wafer transmission rail, a detection mechanism, a defective wafer removing mechanism, a defective wafer transmission mechanism and a qualified wafer discharging mechanism;
the feeding mechanism comprises a basket pressing cylinder (0), a feeding basket feeding track (1), a feeding basket discharging track (2), a feeding tray (3), a feeding lifting module (4) and a feeding telescopic module (5);
the feeding basket rail (1) and the feeding basket rail (2) are arranged on the side face of the feeding lifting module (4), the feeding basket rail (1) is arranged above the feeding basket rail (2), the feeding tray (3) is arranged on the feeding lifting module (4), three working positions of the feeding tray (3) correspond to the feeding basket rail (1), the feeding basket rail (2) and the feeding telescopic module (5) respectively, and the feeding telescopic module (5) is arranged on the other side face of the feeding lifting module (4);
the telescopic module (5) comprises a first sensor (501), a linear guide rail (502), a telescopic plate (503), a capacitance sensor (504), a rodless cylinder (505), an induction iron sheet (506), a silicon wafer conveying belt (507), a transmission wheel (508), a transmission belt (509) and a stepping motor (510);
the rodless cylinder (505) passes through the linear guide rail (502) and the expansion plate (503), the sensor (501) and the silicon wafer conveying belt (507) are arranged on the expansion plate (503), the sensor (501), the capacitance sensor (504) and the induction iron sheet (506) are respectively used for monitoring the position of the expansion plate (503), whether a silicon wafer is arranged on the silicon wafer conveying belt (507) or not and the number of the silicon wafers, and the stepping motor (510) drives the silicon wafer conveying belt (507) to operate through a transmission belt;
the silicon wafer conveying track comprises a first silicon wafer conveying track (6) and a second silicon wafer conveying track (8);
the first silicon wafer conveying track (6) is provided with a second sensor (601) and a third sensor (602) for monitoring the position and the number of the silicon wafers on the conveying track;
the detection mechanism is arranged above the middle of the first silicon wafer conveying track (6) and the second silicon wafer conveying track (8);
the detection mechanism comprises a pair of excitation light sources (701) and (704) and a camera (702), the camera (702) being disposed intermediate the pair of excitation light sources (701) and (704);
the qualified slice blanking mechanism comprises a qualified slice blanking basket inlet rail (22), a qualified slice blanking basket outlet rail (21), a qualified slice blanking tray (23), a qualified slice blanking lifting module (20) and a qualified slice blanking telescopic module (19);
the defective piece removing mechanism comprises a defective piece taking mechanism (11) and a defective product conveying mechanism;
the bad piece taking mechanism (11) comprises a Bernoulli sucker capable of moving up and down and a linear module driven by a servo motor, and the sucker is arranged on the linear module;
the defective piece conveying mechanism comprises a defective piece blanking telescopic module (14), a defective piece blanking lifting module (15), a defective piece blanking basket outlet rail (16), a defective piece blanking basket inlet rail (17) and a defective piece blanking tray (18);
the defective wafer removing mechanism is arranged above the second silicon wafer conveying rail (8), and the defective wafer conveying mechanism is arranged on the side face of the second silicon wafer conveying rail (8).
2. The apparatus according to claim 1, wherein a good buffer means (10) and a bad piece buffer module (13) are provided on the tracks for transporting the good pieces and the bad pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021855345.2U CN212597213U (en) | 2020-08-31 | 2020-08-31 | Full-automatic PL detection device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021855345.2U CN212597213U (en) | 2020-08-31 | 2020-08-31 | Full-automatic PL detection device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111957586A (en) * | 2020-08-31 | 2020-11-20 | 常州科瑞尔科技有限公司 | Full-automatic PL detection device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111957586A (en) * | 2020-08-31 | 2020-11-20 | 常州科瑞尔科技有限公司 | Full-automatic PL detection device |
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